Pickup device and mounting device

Abstract

To provide a pickup device capable of positioning an electronic component while picking it up with no contact and a mounting device.SOLUTION: The present invention relates to a pickup device 20 comprising a pickup collet 200 and a direction change section 23. The pickup collet 200 includes a porous member 201 which has gas permeability and ejects a gas supplied inside through pores of an opposite surface 201a opposed to an electronic component 2 in a planar shape. In the porous member 201a, an opening 201d is included in the opposite surface 201a, a suction hole 201c is provided for sucking in the electronic component 2 with a negative pressure, and a guide part 203 is disposed along an outer edge of the electronic component 2 and provided for regulating movements of the electronic component 2 held on the opposite surface 201a. The direction change section 23 includes: a rotation portion 231 for rotating the pickup collet 200 in such a manner that the opposite surface 201a is inverted from a pickup position of the electronic component 2; and an angle change portion 232 for changing the angle of the pickup collet 200 along a surface in parallel with the opposite surface 201a.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a pickup device and a mounting device. [Background technology]

[0002] When mounting electronic components, such as logic, memory, image sensors, and other semiconductor elements, on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips, and these chips are then picked up one by one and transferred to the substrate for mounting.

[0003] One side of the chip, the front side, is a functional surface on which fine circuits are formed. When picking up this chip from the wafer, if the pick-up member comes into direct contact with the functional surface, there is a risk of damaging the circuits, etc., so there is a demand to avoid such contact.

[0004] In addition, the connection terminals on the surface of the chip and the connection terminals on the substrate are also bonded to each other by facing each other. In this case, in order to ensure and improve the bondability between the connection terminals, the surface of the chip may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the condition of the surface of the chip that has been treated in this way, there is a demand to avoid direct contact of the member to be picked up with the surface of the chip.

[0005] In order to meet the requirement that no parts come into contact with the surface of the chip, conventionally, in a collet, which is a part used to pick up the chip, the surface that holds the chip is made tapered, and the chip is held by suction from the center, with only the peripheral edge, not the surface, in contact with the tapered surface of the collet (see Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Utility Model Application Publication No. 63-124746 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the conventional technology described above, the collet contacts only the periphery of the chip, and the chip is sucked from the center. This makes the chip prone to distortion, which may lead to chipping or cracking. In addition, the collet contacts the edge of the chip periphery and supports the chip being sucked at the contact portion, so stress is concentrated on the periphery, which makes chipping and cracking more likely. Furthermore, since the holding position of the chip is fixed while it is held by suction, if there is any misalignment or tilt when it is held by suction, it cannot be corrected when it is transferred to the mounting device.

[0008] An embodiment of the present invention has been made to solve the above-mentioned problems, and its object is to provide a pickup device and a mounting device that can pick up and position electronic components in a non-contact manner. [Means for solving the problem]

[0009] An embodiment of the present invention is a pickup device that picks up an electronic component having a rectangular outer edge, the pickup device comprising: a pickup collet that sucks and holds the electronic component; and a direction change unit that changes the orientation of the pickup collet, the pickup collet having breathability and a porous member that ejects gas supplied to the inside in a planar manner through pores in an opposing surface that faces the electronic component, the porous member having an opening in the opposing surface and a suction hole that sucks in the electronic component by negative pressure, and a guide unit that is arranged along the outer edge of the electronic component and restricts movement of the electronic component held on the opposing surface, the direction change unit comprising: a rotation unit that rotates the pickup collet so that the opposing surface is inverted from the pickup position of the electronic component; and an angle change unit that changes the angle of the pickup collet along a plane parallel to the opposing surface.

[0010] In addition, the mounting apparatus of an embodiment of the present invention has a bonding head that is movable relative to the pickup collet and receives the electronic component from the pickup collet, and a mounting section that transfers the electronic component held by the bonding head to a substrate and mounts it thereon. Effect of the Invention

[0011] According to the pickup device and mounting device of the embodiment of the present invention, it is possible to pick up and position electronic components in a non-contact manner. [Brief description of the drawings]

[0012] [Figure 1] FIG. 2 is a front view showing a transfer device and a mounting device according to the embodiment. [Diagram 2] FIG. 2 is a plan view showing a transfer device and a mounting device according to the embodiment. [Diagram 3] 1A is a schematic cross-sectional view showing the principle of holding an electronic component by a pickup collet, and FIG. 1B is a bottom perspective view showing the base. [Figure 4] FIG. 4 is a bottom perspective view showing the pickup collet and the attachment / detachment portion. [Diagram 5] FIG. 2 is a top perspective view showing a pickup collet and a detachable portion. [Figure 6] FIG. 4 is a perspective view showing a direction changing portion. [Figure 7] 11 is an explanatory diagram showing the positioning operation of an electronic component by changing the orientation of a pickup collet, the left side being a side view and the right side being a bottom view of the pickup collet. FIG. [Figure 8] 11 is an explanatory diagram showing another mode of the positioning operation of an electronic component by changing the orientation of the pickup collet, the left side being a side view and the right side being a bottom view of the pickup collet. FIG. [Figure 9] FIG. 4 is a block diagram showing a control device of the transfer device and the mounting device. [Figure 10] 10 is a flowchart showing a procedure of a pick-up operation according to the embodiment. [Figure 11]FIG. 11 is an explanatory diagram showing a pick-up operation according to the embodiment. [Figure 12] 13 is an explanatory diagram showing another example of the positioning operation of an electronic component by changing the orientation of the pickup collet, in which the left side is a side view and the right side is a bottom view of the pickup collet. FIG. [Figure 13] FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having an ejection port is provided. [Figure 14] 1 is a schematic bottom view illustrating the principle of positioning of an electronic component by ejecting gas. [Figure 15] FIG. 13 is a schematic cross-sectional view showing another modified example in which a guide portion having an ejection port is provided. [Figure 16] FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having a suction port is provided. [Figure 17] FIG. 13 is a schematic cross-sectional view showing a modified example in which a guide portion having a guiding porous member is provided. [Figure 18] FIG. 13 is a schematic cross-sectional view showing another modified example in which a guide portion having a guiding porous member is provided. [Figure 19] 13 is a bottom view showing a modified example of the arrangement of the guide portion. FIG. [Figure 20] 13A is a bottom perspective view showing a modified example of the pickup collet, and FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] An embodiment of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, ratio, and the like of each part include parts that are exaggerated for ease of understanding. As shown in Figs. 1 and 2, a pickup collet 200 of this embodiment is used in a transfer device 1 for electronic components 2. The transfer device 1 includes a pickup device 20, a mounting device 30, and a control device 50, and is a device that transfers the electronic components 2 to the mounting device 30 by the pickup device 20.

[0014] The electronic component 2 is, for example, a rectangular thin piece component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. The semiconductor chip has a functional surface that functions as a semiconductor element on one of the front and back surfaces. The mounting apparatus 100 is an apparatus that mounts the electronic component 2 supplied from the supply device 10 onto a substrate via transfer by the transfer device 1. That is, in addition to the configuration of the transfer device 1, the mounting apparatus 100 includes the supply device 10 and a substrate stage 60 that supports the substrate.

[0015] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic component 2 to be picked up to a pickup position P1. The pickup position P1 is a position where the pickup device 20 picks up the electronic component 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage movement mechanism 13 that moves the supply stage 12. The stage movement mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0016] The sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown) in this example. The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged in a face-up state with their functional surfaces exposed upward.

[0017] The supply stage 12 is a platform that horizontally supports the wafer ring to which the sheet 11 is attached. In other words, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage movement mechanism 13. Since the sheet 11 is supported horizontally by the stage movement mechanism 13 together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0018] 1, the horizontal direction in which the supply device 10 and the mounting device 30 are aligned is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. The direction perpendicular to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction toward the side on which the electronic components 2 are placed, with the plane of the sheet 11 as the boundary, and the downward direction is the direction toward the side on which the electronic components 2 are not placed, with the plane of the sheet 11 as the boundary. The θz direction is the direction of rotation on a plane parallel to the XY plane, and the θx direction is the direction of rotation on a plane parallel to the ZY plane.

[0019] [Pickup device] The pickup device 20 is a device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup collet 200, a collet movement mechanism 22, a direction change unit 23, and a push-up pin 24.

[0020] 3 to 5, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the sucked and held electronic component 2. The pickup collet 200 has a porous member 201, a base 202, and a guide portion 203.

[0021] The porous member 201 is a member that has air permeability and supplies gas supplied to the inside through pores in the facing surface 201a facing the electronic component 2 (note that in the following description, the gas supplied toward the electronic component 2 is illustrated with the symbol G). The porous member 201 of this embodiment has a rectangular parallelepiped plate shape, and fine spaces that communicate as a whole are densely and uniformly formed. The porous member 201 has air permeability due to this structure, but its conductance is very small. One of the faces of the porous member 201 becomes the facing surface 201a, and when gas is supplied to the inside from the back surface 201b opposite to the facing surface 201a, the gas is ejected from the dense and uniformly present pores in the facing surface 201a. This ejection is substantially planar, spreading over the entire surface of the facing surface 201a from which the gas is ejected. This ejection is extremely gentle, so to speak, it feels like it is oozing out, and you can feel a slight air flow by bringing your finger close to it. The pores on the surfaces other than the opposing surface 201a and the rear surface 201b may be blocked.

[0022] As described above, the porous member 201 is a continuous structure in which the pores, which are minute spaces inside, are interconnected and gas can pass between the pores. Sintered metal, ceramic, resin, etc. can be used as the porous member 201. From the viewpoint that the particles inside are unlikely to separate and flow out, it is preferable to use sintered metal.

[0023] 3 and 4, the porous member 201 has an opening 201d on the opposing surface 201a, and is provided with a suction hole 201c which is a through hole that sucks the electronic component 2 by negative pressure. The suction hole 201c in this embodiment linearly penetrates from the center of the back surface 201b to the center of the opposing surface 201a.

[0024] The base 202 is a member that covers the surfaces of the porous member 201 other than the opposing surface 201a. In this embodiment, the base 202 is a rectangular box that is open at the bottom. The outer shape of the base 202 defines the rectangular outer edge of the pickup collet 200. The porous member 201 is inserted from the opening of the base 202 so that the bottom surface is exposed as the opposing surface 201a, and is assembled and fixed inside the base 202.

[0025] As shown in FIG. 3 and FIG. 5, the top surface of the base 202 is provided with an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed at a position close to the outer edge of the base 202 for a pipe connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating negative pressure in the opening 201d through the suction hole 201c. The exhaust hole 202b extends downward and is formed to match the suction hole 201c of the porous member 201. A space for gas accumulation is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. The exhaust hole 202b may penetrate the suction hole 201c and reach the opposing surface 201a. In this case, suction hole 201c and opening 201d of porous member 201 are provided so as to be in close contact with the outside of exhaust hole 202b that reaches opposing surface 201a of porous member 201. Mounting holes 202c are a pair of recessed holes for preventing misalignment when connecting with collet moving mechanism 22.

[0026] The air supply hole 202a is connected to a gas supply circuit via a pipe (not shown). The supply circuit includes a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 via the air supply hole 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit including a vacuum pump, a valve, etc. via a pipe (not shown).

[0027] The guide portion 203 is a member that is disposed along the outer edge of the electronic component 2 and restricts the movement of the electronic component 2 held on the facing surface 201a. "Along the outer edge of the electronic component 2" means that the guide portion 203 is disposed in a direction along the outer edge, and does not necessarily contact the electronic component 2. The guide portion 203 of this embodiment is disposed along the four sides of the rectangular base 202. The guide portion 203 is, for example, a plurality of plate-like bodies provided along the four side surfaces of the base 202, that is, along the four sides of the rectangular facing surface 201a, as shown in FIG. 3, FIG. 4, and FIG. 5. The guide portion 203 of this embodiment is provided on each side of the facing surface 201a, but is not limited thereto.

[0028] Each guide portion 203 has a protruding portion protruding from the facing surface 201a. The distance (protruding amount) of the guide portion 203 protruding from the facing surface 201a may be sufficient to restrict the movement of the electronic component 2 held on the facing surface 201a through the gas layer, and may be at least the extent to which the guide portion 203 extends from the facing surface 201a to the electronic component 2 held through the gas layer. However, if the protruding portion of the guide portion 203 protrudes beyond the electronic component 2 held on the facing surface 201a through the gas layer, it is necessary to take care not to contact the electronic components 2 around the electronic component 2 to be picked up when picking it up from the wafer. Therefore, it is preferable that the distance by which the protruding portion of the guide portion 203 protrudes from the facing surface 201a is within the side surface of the electronic component 2 held on the facing surface 201a through the gas layer. However, as described later, by controlling the push-up pin 24 at the time of picking up, it is possible to avoid contact with the surrounding electronic components 2 in response to various protruding amounts.

[0029] In the following description, one of the orthogonal guide parts 203 will be referred to as 203K and 203L, and the other orthogonal guide part 203 will be referred to as 203M and 203N, and when there is no need to distinguish between them, they will be described as guide parts 203. Here, orthogonal includes a case where two guide parts 203 on adjacent sides are in contact or continuous with each other to form a right angle, and a case where there are multiple guide parts 203 on one side, the guide parts 203 are separated, and the straight lines (planes) along which the two parts run are orthogonal (see FIG. 19).

[0030] The collet moving mechanism 22 is a mechanism for moving the pick-up head 21, to which the pick-up collet 200 is attached, back and forth between the pick-up position P1 and the transfer position P2, and also for raising and lowering the pick-up head 21 at the pick-up position P1 and the transfer position P2. The transfer position P2 is a position where the pick-up device 20 passes the electronic component 2 picked up at the pick-up position P1 to the bonding head 31, which functions as a receiving unit described later. The pick-up position P1 and the transfer position P2 mainly refer to positions in the XY directions, and do not necessarily refer to positions in the Z axis direction.

[0031] Even when referring to the position (height) in the Z-axis direction, the height is assumed to have a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance the electronic component 2 is pushed up, the distance at which the electronic component 2 can be picked up, and the like when transferring the electronic component 2. In particular, when referring to the position (height) in the Z-axis direction, at the pickup position P1, the height at the approach position is assumed to be H1, and the height at the peeling position is assumed to be H2 (see FIG. 11).

[0032] The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and moves the pickup collet 200 attached to the pickup head 21 by moving the arm 222a. The tip of the pickup head 21 is provided with a removable part 222b, which has a magnet inside and attracts and holds the base 202 of the pickup collet 200 by the magnetic attraction. As shown in Figs. 4 and 5, a pair of pins 222c are provided on the contact surface of the removable part 222b with the base 202. The pins 222c fit into the mounting holes 202c provided in the base 202, thereby preventing the pickup collet 200 from shifting relative to the removable part 222b. Although not shown, the pipe connected to the exhaust hole 202b passes through the removable part 222b, and the pipe connected to the air supply hole 202a is supported by the removable part 222b.

[0033] The collet moving mechanism 22 includes a slide mechanism 221 and an elevation mechanism 222. The slide mechanism 221 moves the arm 222a to which the pickup head 21 is attached, thereby reciprocating the pickup collet 200 between the pickup position P1 and the delivery position P2. Here, the slide mechanism 221 extends parallel to the X-axis direction and has a rail 221b fixed to a support frame 221a, and a slider 221c that runs on the rail 221b.

[0034] The lifting mechanism 222 moves the pickup collet 200 in the up-down direction by moving the arm 222a to which the pickup head 21 is attached. Specifically, the lifting mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, the pickup collet 200 is raised and lowered along the Z-axis direction by driving the servo motor. The pickup collet 200 is elastically supported by the pickup head 21 via the attachment / detachment part 222b, and is provided so as to be slidable up and down in the Z-axis direction relative to the pickup head 21. The pickup head 21 has a sensor that detects this sliding movement.

[0035] The direction change unit 23 changes the orientation of the pickup collet 200. The orientation of the pickup collet 200 includes the direction from the base 202 toward the facing surface 201a and the angle along a plane parallel to the facing surface 201a. As shown in Fig. 6, the direction change unit 23 has a rotation unit 231 and an angle change unit 232. The rotation unit 231 rotates the pickup collet 200 so that the facing surface 201a is reversed from the position where the electronic component 2 is picked up from the sheet 11.

[0036] The rotating unit 231 has a driving source 231a. The driving source 231a is, for example, a motor provided in the lifting mechanism 222, and rotates the arm 222a connected to the rotating shaft about the X axis to rotate the pickup head 21 in the θx direction. This allows the rotating unit 231 to invert the pickup collet 200 supported by the pickup head 21.

[0037] The angle changer 232 changes the angle of the pickup collet 200 along a plane parallel to the facing surface 201a. The angle changed by the angle changer 232 is an angle at which the electronic component 2 moves toward the corner of the facing surface 201a due to reversal, as described later. The angle changer 232 changes the angle at any timing after the electronic component 2 is picked up, but returns the angle to the original angle (the angle at the time of picking up) after the facing surface 201a stops at the reversed position. The angle changer 232 has a driving source 232a and a transmission unit (not shown). The driving source 232a is, for example, a motor provided in the pickup head 21 and has a rotating shaft in the Z-axis direction. The transmission unit rotates the pickup head 21 around the Z-axis by transmitting the power of the driving source 232a to the attachment / detachment unit 222b. The transmission unit is, for example, a belt drive mechanism built into the pickup head 21. This allows the angle changer 232 to rotate the pickup collet 200 supported by the pickup head 21 in the θz direction.

[0038] For example, as shown in Fig. 7(A), the pickup collet 200 with the opposing surface 201a facing the supply stage 12 sucks and holds the electronic component 2 at the pickup position P1. As shown in Figs. 7(C) and (D), the rotation unit 231 of the direction change unit 23 changes the orientation of the pickup collet 200 from the pickup position P1 so that the opposing surface 201a faces upward. In other words, the electronic component 2 held by the pickup collet 200 is inverted from the direction in which the opposing surface 201a faces downward to the direction in which it faces upward. At this time, the rotation angle around the X-axis from the pickup position P1 is 180°.

[0039] Also, for example, as shown in Fig. 7(B), the angle change unit 232 rotates the pickup collet 200 at the pickup position P1 by 45° (indicated by α in the figure) around the Z axis. This rotation may be performed immediately after the electronic component 2 is picked up, or during the rotation by the rotation unit 231. However, it is preferable that the angle change by the angle change unit 232 is performed before the rotation angle by the rotation unit 231 reaches 180°. Then, as shown in Fig. 7(E), after the electronic component 2 is turned over by the 180° rotation, the angle change unit 232 rotates the pickup collet 200 by 45° to return it to the original angle.

[0040] 1, the push-up pin 24 is provided below the sheet 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a sharp tip. The push-up pin 24 is provided inside the backup body 241 so that its length direction is parallel to the Z-axis direction.

[0041] The backup body 241 has a drive mechanism for advancing or retreating the thrust pin 24 from or to the inside of the backup body 241. The advancement or retreat is performed in the vertical direction. The drive mechanism is driven by, for example, an air cylinder or a cam mechanism.

[0042] [Onboard equipment] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to a mounting position P3 and mounts it on a board. The mounting position P3 is a position where the electronic component 2 is mounted on the board. The mounting device 30 has a bonding head 31 and a head moving mechanism 32.

[0043] The bonding head 31 functions as a receiving unit that receives the electronic component 2 from the pickup collet 200 at the delivery position P2, and is also a device that mounts the electronic component 2 on a board at the mounting position P3. The bonding head 31 holds the electronic component 2, and after mounting, releases the held state to release the electronic component 2.

[0044] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the held state to release the electronic component 2. The nozzle 31a includes a nozzle hole. The nozzle hole opens to a suction surface at the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and the circuit generates negative pressure to suction and hold the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, the held state of the electronic component 2 is released from the suction surface by releasing the negative pressure.

[0045] The head moving mechanism 32 is a mechanism for moving the bonding head 31 back and forth between the delivery position P2 and the mounting position P3, and also for raising and lowering the bonding head 31 at the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

[0046] The slide mechanism 321 reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to a support frame 321a, and a slider 321c that runs on the rails 321b.

[0047] Although not shown, the slide mechanism 321 has a slide mechanism that slides the bonding head 31 in the Y-axis direction. This slide mechanism can also be configured with a rail in the Y-axis direction and a slider that runs on the rail. The lift mechanism 322 moves the bonding head 31 in the up and down direction. Specifically, the lift mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the bonding head 31 is lifted and lowered along the Z-axis direction by driving the servo motor.

[0048] The substrate stage 60 is a platform that supports a substrate on which the electronic component 2 is to be mounted. The substrate stage 60 is provided on a stage movement mechanism 61. The stage movement mechanism 61 is a movement mechanism that slides and moves the substrate stage 60 on the XY plane, and aligns the planned mounting position of the electronic component 2 on the substrate with the mounting position P3. The stage movement mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0049] The mounting device 30 has an imaging device, an image processing device, and a position recognition device, none of which are shown. The imaging device captures images of the electronic component 2 held by the bonding head 31 and the board supported by the board stage 60, and the position recognition device recognizes the positional relationship between them based on the images processed by the image processing device. Based on this positional relationship, the mounting device 30 mounts the electronic component 2 on the board. The imaging device may be a top-bottom dual-view camera that is inserted between the electronic component 2 and the board and can capture images of both simultaneously, or a camera that captures images of both separately.

[0050] [Control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. In other words, the control device 50 is a control device for the transfer device 1 and the mounting device 100. The control device 50 can be realized, for example, by a dedicated electronic circuit or a computer that operates with a predetermined program. An input device through which an operator inputs instructions and information required for control, and an output device for checking the status of the device are connected to the control device 50. The input device can be a switch, a touch panel, a keyboard, a mouse, etc. The output device can be a display unit such as a liquid crystal or an organic electroluminescence (EL).

[0051] Fig. 9 is a functional block diagram of the control device 50. As shown in Fig. 9, the control device 50 has a supply device control unit 51, a push-up pin control unit 52, a pickup control unit 53, a bonding head control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0052] The supply device control unit 51 controls the movement of the supply stage 12. In other words, it controls the movement of the electronic components 2 to be picked up that are placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pins 24, that is, the operation of the backup body 241.

[0053] The pickup control unit 53 controls the movement of the pickup collet 200. That is, the pickup control unit 53 controls the operation of the collet movement mechanism 22 and the direction change unit 23. For example, the pickup control unit 53 controls a supply circuit communicating with the air supply hole 202a, a negative pressure generating circuit communicating with the exhaust hole 202b, a drive source 231a of the rotation unit 231, and a drive source 232a of the angle change unit 232. In this way, the pickup control unit 53 controls the holding, inversion, positioning, and release of the electronic component 2, as described below.

[0054] The bonding head control unit 54 controls the movement of the bonding head 31, i.e., the operation of the head moving mechanism 32. The bonding head control unit 54 also controls a negative pressure generating circuit that is in communication with the nozzle hole of the bonding head 31, and controls the holding and release of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage moving mechanism 61.

[0055] The storage unit 57 is a recording medium including various memories, HDD, SSD, etc. The storage unit 57 prestores data and programs necessary for the operation of the transfer device 1, and also stores data necessary for the operation of the transfer device 1. This necessary data is, for example, the amount of gas supply, exhaust pressure, position coordinates of the pickup position P1, the delivery position P2, and the mounting position P3, and position coordinates of each moving mechanism. Each of the above-mentioned moving mechanisms controls the movement of each component based on these coordinates.

[0056] [Principle of suction and holding by pickup collet] Next, the principle by which the pickup collet 200 as described above can suck and hold the electronic component 2 will be described. As shown in FIG. 3(A), the gas supplied from the air supply hole 202a is ejected in a planar manner from the pores of the facing surface 201a, forming a gas layer between the electronic component 2. This layer is, for example, 2 to 10 μm. Then, the electronic component 2 is sucked and held by bringing the facing surface 201a close to the electronic component 2 while applying negative pressure to the suction hole 201c by the negative pressure generating circuit. At this time, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a and the electronic component 2 are maintained in a non-contact state. Furthermore, by releasing the negative pressure by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 201c, and the electronic component 2 is released from the pickup collet 200.

[0057] [Principle of positioning of electronic components in a pickup collet] Furthermore, the principle by which the above-described pickup collet 200 can position the electronic component 2 will be described with reference to FIG. 7. The dotted circle on the left side of FIG. 7(A)-(E) and the dotted line on the right side of FIG. 7(E) indicate a part of the rotation locus RT of the pickup collet 200. As shown in FIG. 7(A), when the pickup collet 200 sucks and holds the electronic component 2, the pair of opposing guide parts 203K, 203M are parallel to the rotation locus RT. As shown in FIG. 7(B), after the electronic component 2 is picked up, the angle of the pickup collet 200 is changed by 45° by the angle change part 232. At this point, the pair of opposing guide parts 203K, 203M are inclined by 45° with respect to the rotation locus RT.

[0058] Then, as shown in FIG. 7C, when the rotation of the pickup collet 200 by the rotating part 231 starts, the electronic component 2 sucked and held on the facing surface 201a moves toward the corner of the facing surface 201a along which the orthogonal guide parts 203K, 203L are aligned, due to inertial force and gravity. As described above, the electronic component 2 is held by the pickup collet 200 in a non-contact state with the facing surface 201a via a gas layer, and is easily movable in a direction parallel to the facing surface 201a. As a result, one of the two orthogonal side surfaces of the electronic component 2 is positioned so as to contact the guide parts 203K, 203L. In other words, the electronic component 2 is positioned toward one corner of the pickup collet 200.

[0059] 7(D), before the opposing surface 201a reaches the inversion position, the rotating part 231 decelerates, and then reaches the inversion position and stops. At this time, inertia acts on the electronic component 2 to continue moving, but as described below, the electronic component 2 is prevented from coming off the guide parts 203K and 203L.

[0060] First, since the pickup collet 200 rotates around the horizontal X-axis, a centrifugal force, a gravity force, and an inertial force act on the electronic component 2 during rotation. Therefore, when the rotation stops, a force acts on the electronic component 2 due to the centrifugal force and the inertial force, which moves the electronic component 2 away from one of the orthogonal guide parts 203K, 203L. Also, due to the inertial force at this time, in the inverted state, the electronic component 2 acts to press the pickup collet 200 in the vertical direction together with gravity (see FIG. 7(D)). The electronic component 2 is held by the pickup collet 200 via a gas layer, but when such a force acts in the vertical direction, it becomes difficult to move in the horizontal direction. In other words, a force acts on the electronic component 2, which moves the electronic component 2 away from one of the orthogonal guide parts 203K, 203L.

[0061] Here, the reverse rotation of the pickup collet 200 does not stop suddenly, but gradually decelerates and stops as described above. Therefore, the centrifugal force gradually decreases toward the stop and ceases to act when the pickup collet 200 stops. When the pickup collet 200 stops, inertia due to the deceleration acts. Therefore, the deceleration is set to a degree that the electronic component 2 does not move out of the guide parts 203K, 203L. In this way, the electronic component 2 is prevented from moving out of the guide parts 203K, 203L. The electronic component 2 is positioned at a fixed position at the corner of the opposing surface 201a along which the guide parts 203K, 203L are aligned at the reversed position.

[0062] When the inversion is completed, the electronic component 2 is positioned at one corner of the facing surface 201a, so that the positional deviation of the electronic component 2 caused by the pick-up and inversion operation can be corrected. Even if the electronic component 2 moves on the facing surface 201a, the facing surface 201a and the electronic component 2 are maintained in a non-contact state as described above, so the surface of the electronic component 2 on the facing surface 201a side is not damaged. Moreover, since the accelerating speed is still slow at the beginning of the inversion operation, the impact when it is brought close to the guide parts 203K and 203L is small. Therefore, there is almost no risk of chipping or damage. There is also no risk of collision with the opposing guide parts 203M and N.

[0063] In the above embodiment, the deceleration at the time of stopping the inversion is set to such an extent that the electronic component 2 does not move out of the guide parts 203K and 203L, but it may be set to such an extent that the electronic component 2 moves out of the guide parts 203K and 203L. That is, as shown in FIG. 8(D), it is also possible to set the deceleration to such an extent that the electronic component 2 sucked and held by the facing surface 201a moves to the corner of the facing surface 201a along the other orthogonal guide parts 203M and 203N by inertial force and gravity when stopped at the inversion position (FIGS. 8(A) to (C) are the same as the above-mentioned FIGS. 7(A) to (C)). As a result, one of the two orthogonal side surfaces of the electronic component 2 is positioned to contact the guide parts 203M and 203N. Thereafter, as shown in FIG. 8(E), after the electronic component 2 is inverted by rotating 180°, the angle changer 232 rotates the pickup collet 200 by 45° to return to the original angle.

[0064] When the electronic component 2 is positioned on the guide parts 203M and 203N, the deceleration of the rotation by the rotating part 231 is increased when the reverse rotation is stopped. Then, even if the electronic component 2 is not moved beyond the reverse position and then returned to the reverse position as described later, if the electronic component 2 is stopped at the reverse position, the electronic component 2 can move to the corner of the opposing surface 201a along which the guide parts 203M and 203N are aligned by inertia. This shortens the time required for the reverse rotation, and the productivity can be improved by suppressing the effect on the tact time caused by changing the angle of the pickup collet 200. However, there is a possibility that the electronic component 2 may be affected by contacting the guide parts 203M and 203N. Therefore, the deceleration of the rotating part 231 is set to a level that allows the electronic component 2 to move while allowing the effect on the electronic component 2 due to the contact to be tolerated.

[0065] It is not necessary for the electronic component 2 to be positioned in complete contact with the guide portion 203. It is sufficient for the electronic component 2 to be within the recognition range while being brought close to the guide portion 203, and it is not necessary for the electronic component 2 to be positioned at a fixed position as long as it is within the recognition range.

[0066] [Operation] In the transfer device 1 as described above, the operation of picking up an electronic component 2 from the supply device 10 by the pickup device 20 and transferring the electronic component 2 to the mounting device 30 will be described below with reference to the flowchart in FIG. 10 and the explanatory diagram in FIG. 11 in addition to FIGS. 1 to 8.

[0067] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the pickup position P1 where the push-up pin 24 is located, and the opposing surface 201a of the pickup collet 200 and the push-up pin 24 are opposed to each other (step S01). At this time, pressurized gas is supplied to the porous member 201 through the air supply hole 202a, and the gas is blown out from the opposing surface 201a. At this time, no exhaust is being performed from the exhaust hole 202b, and no suction is being performed from the opening 201d.

[0068] On the other hand, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the pick-up position P1 as shown in Fig. 11(A) (step S02). After that, the pickup collet 200, to which gas is supplied on the surface of the facing surface 201a, descends together with the pickup head 21 and approaches the electronic component 2. At this time, as shown in Fig. 11(B), in order to prevent the guide portion 203 from hitting the surrounding electronic components 2, the push-up pin 24 rises and pushes up the electronic component 2 to be picked up as the pickup collet 200 starts to descend, depending on the amount of protrusion of the guide portion 203 from the facing surface 201a, thereby raising the electronic component 2 to be picked up to a height at which the guide portion 203 does not hit the surrounding electronic components 2.

[0069] When the descended pickup collet 200 approaches the electronic component 2, the gas supplied to the surface of the facing surface 201a is sandwiched between the facing surface 201a and the electronic component 2 to form a gas layer. The sandwiched gas layer at this time is considered to be a viscous flow layer. Then, the pickup collet 200 stops descending relative to the electronic component 2 due to the gas layer not being compressed any further (step S03). As described above, the electronic component 2 to be picked up is higher than the surrounding electronic components 2, so the guide portion 203 does not come into contact with the surrounding electronic components 2 on the sheet 11 to be picked up.

[0070] Here, when the pickup collet 200 comes into contact with the electronic component 2 through the gas layer, the pickup collet 200 itself stops. However, since the pickup collet 200 is elastically supported by the pickup head 21, even if the pickup collet 200 stops, the pickup head 21 continues to descend and slides relative to the pickup collet 200. When this sliding is detected by the sensor, the pickup control unit 53 recognizes that the pickup collet 200 has come into contact with the electronic component 2 and stops the descent of the pickup head 21. At this time, the pickup collet 200 is not in direct contact with the electronic component 2. However, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a cannot get any closer to the electronic component 2 and stops. The height position of the pickup collet 200 at this time is the approach position H1. In other words, the approach position H1 is not set as a specific stop position in advance.

[0071] In this manner, with the pickup collet 200 stopped via the gas layer and the pickup head 21 also stopped, suction is started via the suction hole 201c by exhausting air from the exhaust hole 202b (step S04). That is, as shown in Fig. 11(C), suction is started in a state where the pickup collet 200 presses the electronic component 2 against the sheet 11 supported by the backup body 241 via the gas layer, that is, in a state where the sheet 11 and the electronic component 2 are sandwiched between the pickup collet 200 and the backup body 241.

[0072] In this state, the pickup collet 200 rises, and in synchronization therewith, the push-up pins 24 rise further and stop when they have risen a preset amount (step S05). Then, as shown in Fig. 11(D) , the pickup collet 200 further rises, and the electronic component 2 that has been sucked into the pickup collet 200 by negative pressure while maintaining a gap created by the gas layer is peeled off from the sheet 11 and picked up (step S06). In this way, the height position at which the electronic component 2 is completely peeled off is the peeling position H2, but this is not set in advance as a specific stopping position.

[0073] The angle change unit 232 of the direction change unit 23 changes the angle of the pickup collet 200 as shown in Fig. 7(B) (step S07). Then, the rotation unit 231 of the direction change unit 23 inverts the pickup collet 200 (step S08). That is, the orientation of the pickup collet 200 is rotated 180° in the vertical direction so that the opposing surface 201a of the pickup collet 200 faces upward. Note that the inversion operation in step S07 is performed immediately after the electronic component 2 is picked up, but may be performed at any point between the pickup position P1 and the transfer position P2.

[0074] When the electronic component 2 is moved to the delivery position P2 after being inverted, the forces acting on the electronic component 2 due to the inversion and horizontal movement are dispersed, reducing the risk of the electronic component 2 falling off the pickup collet 200. When the electronic component 2 is moved while being inverted, the forces of the inversion and horizontal movement act together, increasing the possibility of the electronic component 2 falling off, but the takt time can be shortened and productivity improved. The possibility of the electronic component 2 falling off varies depending on the size (size, thickness, etc.) of the electronic component 2, so it is preferable to select the appropriate operation depending on the electronic component 2.

[0075] During this reversal process, as shown in Fig. 7(C), the electronic component 2 moves to the corner of the opposing surface 201a along which the guide portions 203K, 203L are aligned. Then, the pickup collet 200 decelerates just before the reversal position and stops rotating at the reversal position. As shown in Fig. 7(D), the electronic component 2 maintains its position at the corner of the opposing surface 201a along which the guide portions 203K, 203L are aligned. Furthermore, as shown in Fig. 7(E), the direction changer 23 returns the pickup collet 200 to its original angle (see Fig. 7(A)) (step S09).

[0076] Next, the pickup device 20 moves the picked up electronic component 2 to the transfer position P2 by the collet moving mechanism 22 (step S10). At the transfer position P2, the bonding head 31 of the mounting device 30 is on standby and faces the opposing surface 201a of the pickup collet 200 with the electronic component 2 interposed therebetween.

[0077] The bonding head 31 is lowered toward the pickup collet 200 positioned at the transfer position P2, and after the bonding head 31 holds the electronic component 2, the pickup collet 200 releases the negative pressure, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S11). After this, the bonding head 31 rises away from the pickup collet 200, moves to the mounting position P3, and mounts the electronic component 2 on the board.

[0078] [effect] (1) This embodiment is a pickup device 20 that picks up an electronic component 2 having a rectangular outer edge by suction and holds it, and has a pickup collet 200 that suction holds the electronic component 2, and a direction changing unit 23 that changes the orientation of the pickup collet 200.

[0079] The pickup collet 200 has a porous member 201 that is breathable and that ejects gas supplied to the inside in a planar manner through pores in an opposing surface 201a that faces the electronic component 2. The porous member 201 has an opening 201d in the opposing surface 201a and is provided with suction holes 201c that suck in the electronic component 2 by negative pressure. The porous member 201 is also provided with a guide portion 203 that is arranged along the outer edge of the electronic component 2 and restricts movement of the electronic component 2 held on the opposing surface 201a.

[0080] The direction change unit 23 has a rotation unit 231 that rotates the pickup collet 200 so that the opposing surface 201a is inverted from the pickup position P1 of the electronic component 2, and an angle change unit 232 that changes the angle of the pickup collet 200 along a plane parallel to the opposing surface 201a.

[0081] Furthermore, the pickup collet 200 of this embodiment delivers the picked up and inverted electronic component 2 to the mounting device 100, which mounts the electronic component 2 on a board.

[0082] Furthermore, the mounting apparatus 100 of this embodiment has a pickup device 20, a bonding head 31 that is movable relative to the pickup collet 200 and receives the electronic component 2 from the tip of the pickup collet 200, and a mounting section that transfers the electronic component 2 held by the bonding head 31 to a substrate and mounts it thereon.

[0083] Therefore, when picking up the electronic component 2 by suction through the suction holes 201c, the layer of gas discharged from the pores of the porous member 201 can keep the electronic component 2 and the facing surface 201a out of contact with each other, thereby suppressing damage to the electronic component 2. Also, when the electronic component 2 is transferred, the electronic component 2 can be held to prevent it from falling, while reducing the possibility of the electronic component 2 being damaged by contact with the facing surface 201a.

[0084] Furthermore, even if the inertial force accompanying the movement of the electronic component 2 during inversion or the like causes the electronic component 2 to move horizontally on the opposing surface 201a held via a gas layer, the guide portion 203 can prevent the electronic component 2 from coming off the pickup collet 200.

[0085] Furthermore, when inverting, the angle of the pickup collet 200 can be changed by the angle changer 232 to position the electronic component 2 at a corner formed by the plane along which the orthogonal guide parts 203K and 203L or the orthogonal guide parts 203M and N are aligned. In other words, the position on the XY plane is determined by two orthogonal sides. Therefore, even if the position, angle, etc. of the electronic component 2 held on the facing surface 201a varies in the planar position, angle, etc., of the electronic component 2 when it is picked up, the electronic component 2 can be delivered to the bonding head 31 at a fixed position (including a tolerance range to be described later), and deviations during mounting can be reduced. Furthermore, when positioned, the electronic component 2 moves in a direction parallel to the facing surface 201a, but as described above, the electronic component 2 is not in contact with the facing surface 201a, and therefore the electronic component 2 is prevented from being scratched by rubbing. Even if the position of the electronic component 2 shifts within the area surrounded by the guide portion 203, as long as the suction by the opening 201d is within the projection plane of the electronic component 2, the electronic component 2 can be sucked and held regardless of the position of the opening 201d. If the angle of the pickup collet 200 is not changed, the electronic component 2 may move toward one side of the pickup collet 200 due to inversion. However, since it is highly likely that only the position in one direction on the XY plane can be determined, it may take time to recognize the position of the delivered electronic component 2, or the amount of correction may be large, resulting in increased errors.

[0086] In addition, when the electronic component 2 is first moved to a corner of the opposing surface 201a along which the guide portions 203K and 203L are aligned, and then positioned by the guide portions 203M and 203N, the electronic component 2 is positioned in two steps after the posture of the electronic component 2 is once determined, so that the electronic component 2 can be positioned more reliably. In particular, the electronic component 2 only needs to move diagonally when stopped, which improves the positioning accuracy.

[0087] Here, the reason why the above-mentioned guide portion 203 and positioning are effective in the case of the pickup collet 200 that holds the electronic component 2 in a non-contact manner as in this embodiment will be described in more detail. That is, the pickup collet 200 holds the electronic component 2 through a gas layer, so that the electronic component 2 can be easily moved in the horizontal direction. Therefore, the electronic component 2 may move on the opposing surface 201a of the pickup collet 200 due to the inertial force acting on the electronic component 2 caused by the movement of the pickup collet 200 to the transfer position P2 or the inversion operation. Even if such a movement occurs, the guide portion 203 restricts the movement of the electronic component 2 to a predetermined area, so that the electronic component 2 is prevented from falling off the pickup collet 200.

[0088] Incidentally, the distance between the guide parts 203 must be set larger than the size of the electronic component 2 in order to avoid contact with the electronic component 2 when it is picked up from the sheet 11. Therefore, a gap is provided between the electronic component 2 sucked and held by the pickup collet 200 and the guide parts 203. For this reason, when the electronic component 2 moves as described above, the holding posture of the position and angle of the electronic component 2 may move within the range of this gap. Such a holding posture state has a large variation. If there is such a variation in the holding posture, the holding posture of the electronic component 2 delivered to the bonding head 31 will also vary with respect to the reference position (fixed position) that is the reference for positioning, and when the holding position of the electronic component 2 is recognized by capturing an image of the electronic component 2 with an imaging device (not shown) or the like, it takes time or the amount of correction of the position is large, resulting in a large movement error during correction. In this embodiment, as described above, the electronic component 2 can always be positioned at a fixed position with respect to the facing surface 201a, so that the variation in the holding posture can be suppressed and the amount of correction of the position and the movement error during correction can be reduced.

[0089] The fixed position is a holding posture in which the electronic component 2 is held by the pickup collet 200 and handed over to the bonding head 31 almost as is, and also corresponds to a reference position for mounting the electronic component 2 on a board. Even if the holding posture of the electronic component 2 varies with respect to the reference position when the electronic component 2 is photographed and its position recognized by a camera, the fixed position includes the variation in the holding posture within an allowable range as long as it is within an allowable recognition time and a movement error in the correction movement.

[0090] Also, consider a case where the electronic component 2 is held by a Bernoulli chuck that generates a suction force by using a negative pressure generated by a large amount of airflow by flowing gas discharged from the space between the electronic component 2 and the surface facing the electronic component 2. In this case, even if the suction force is very weak and the electronic component 2 can be held at a certain distance from the collet, it is not possible to obtain an adhesion force that can peel off the electronic component 2 adhered to the sheet 11. In addition, in order to obtain the Bernoulli effect, it is necessary to make the flow rate of the gas per unit time very large, so that it is very difficult to adjust the suction force for holding while maintaining non-contact. Furthermore, there is a risk of particles being generated by blowing a large amount of gas around the pick-up location.

[0091] Furthermore, even if gas outlet holes of the same size as the suction holes, rather than pores like those in the porous member 201, are provided on the surface of the collet facing the electronic component 2, and gas is sprayed toward the electronic component 2 to levitate it, and then the electronic component 2 is sucked up through the suction holes against the levitation force of the electronic component 2 caused by this spray, it is extremely difficult to adjust the suction force to hold the electronic component 2 while maintaining non-contact (levitation) as described above, and there is a risk of particles being generated due to a large amount of gas being blown out around the pick-up location.

[0092] In contrast, in this embodiment, the flow rate of the gas blown out from the entire opposing surface 201a in a planar manner through the fine holes in the opposing surface 201a is extremely small. Therefore, there is no risk of generating particles. The blown out from the opposing surface 201a does not actively suspend the electronic component 2, but forms a layer of viscous gas when the opposing surface 201a and the electronic component 2 come close to each other. Therefore, the stronger the suction force, the easier it is to keep the opposing surface 201a and the electronic component 2 in a non-contact state. Even if the suction force due to the negative pressure from the suction holes 201c is sufficient to peel the electronic component 2 off the sheet 11, the layer of gas between the opposing surface 201a and the electronic component 2 can prevent contact, so that it is easy to obtain a strong suction force and to adjust the suction force.

[0093] For example, under the following conditions, the pickup collet 200 can suck and hold the electronic component 2 while maintaining non-contact with it. The porous member 201 used has an air permeability of, for example, about 0.7 L / min of gas flowing out of the porous member 201 when the supply pressure is 0.3 MPa. The pressure of the gas (nitrogen gas) supplied to the porous member 201 may be in the range of about 0.1 to 0.7 MPa, and the flow rate of the gas flowing through the porous member 201 is in the range of about 0.3 to 1.5 L / min, so that the pickup collet 200 and the electronic component 2 can be reliably maintained non-contact with each other. In addition, the suction pressure is in the range of -10 to -90 kPa, so that the electronic component 2 can be reliably picked up from the sheet 11. At this time, the pressure in the gas layer between the electronic component 2 and the facing surface 201a is 0.1 to 0.5 MPa.

[0094] (2) The angle change by the angle changer 232 is an angle at which the electronic component 2 moves toward the corner of the facing surface 201a upon reversal. As a result, when the electronic component 2 is reversed after being picked up, the electronic component 2 is positioned at the corner of the facing surface 201a.

[0095] (3) The rotating unit 231 starts rotating from the position where the electronic component 2 is picked up, and stops at the position where the opposing surface 201a is inverted. Therefore, if the angle changer 232 has changed the angle, the inertia of the electronic component 2 as it continues to move allows it to be positioned at the corner of the opposing surface 201a along which the orthogonal guide portions 203K and 203L are aligned, or at the corner of the opposing surface 201a along which the orthogonal guide portions 203M and 203N are aligned, by the inertia of the electronic component 2. Therefore, there is no need to provide a separate mechanism for moving the electronic component 2, and a low-cost device can be configured with a simple configuration that is less prone to malfunction.

[0096] [Variations] The present invention is not limited to the above-described embodiment. The following modified examples are also applicable, provided that the basic configuration is similar to that of the above-described embodiment.

[0097] (1) The angle of the pickup collet 200 changed by the angle changer 232 may be an angle at which the electronic component 2 moves toward the corner of the facing surface 201a by inversion, as described above. However, if the change angle of one of the pair of orthogonal guide parts 203 becomes too large, it becomes difficult to move along the guide part 203. For this reason, if both are set to about 45°, the angles of the pair of orthogonal guide parts 203 with respect to the rotation trajectory RT are equal and there is no bias, and the operation of moving the electronic component 2 toward the corner can be performed smoothly. However, if the guide part 203 is inclined with respect to the rotation trajectory RT, the positioning as described above is possible. For this reason, for example, the change angle can be set in the range of 10° to 80°. The angle at which the electronic component 2 is easily moved varies depending on the size of the electronic component 2, the ratio of the length and width of the electronic component 2, and so it is preferable to select the change angle appropriately according to the electronic component 2. If necessary, it may be obtained by experiment, etc.

[0098] (2) When the rotating unit 231 reverses the pickup collet 200, it is not necessary to stop the rotation when the rotation angle reaches 180° from the start of the rotation. For example, the rotating unit 231 may start the rotation from the position where the electronic component 2 is picked up, and after the facing surface 201a passes the reverse position (rotation angle 180°), return to the reversed position and stop. That is, as shown in Figs. 12(A) to (C), the rotating unit 231 starts the reverse operation in the same way as in Figs. 7(A) to (C), and then stops the rotation at a position exceeding 180° as shown in Fig. 12(D). Then, the electronic component 2 is brought to the corner of the facing surface 201a along the guide portions 203M and 203N by gravity in addition to the inertial force. As shown in Fig. 12(E), the rotating unit 231 returns the pickup collet 200 to the reverse position from this state at a speed slower than that during the reverse operation and stops it. Then, as shown in FIG. 12(F), the angle changer 232 rotates the pickup collet 200 so as to return it to its original angle.

[0099] Here, if the pickup collet 200 stops when the rotation angle reaches 180° from the start of rotation, the electronic component 2 may move out of the guide parts 203K and 203L, and the positioning state may be lost. In addition, if the electronic component 2 is actively moved so as to be positioned by the guide parts 203M and 203N, when the side surface of the electronic component 2 comes into contact with the guide parts 203M and 203N, the electronic component 2 may bounce back, or the movement amount of the electronic component 2 may be too small to reach the guide parts 203M and 203N, and the electronic component 2 may not be positioned at the corner. However, in this embodiment, by rotating beyond the inverted position, the electronic component 2 can be moved to the corner of the opposing surface 201a by gravity in addition to the inertial force, so that the possibility of positioning can be increased. In the embodiment shown in FIG. 12, the electronic component 2 is positioned by the guide parts 203M and 203N. Furthermore, as described above, when the pickup collet 200 is returned from a position beyond the reversal position, the acceleration / deceleration of the return movement is reduced, thereby preventing the electronic component 2 from moving out of the corner due to inertia as the pickup collet 200 is returned and stopped.

[0100] In the above case, the tact time will be long if the overhang time beyond the reversal position, the time to return to the reversal position, and moreover the acceleration / deceleration is reduced to return slowly. Therefore, by returning the changed angle while returning from the overhang, the tact time that is long due to the angle change can be suppressed. In this case, if the angle change is also returned slowly, the occurrence of misalignment of the electronic component 2 due to the return of the changed angle can also be suppressed.

[0101] Furthermore, in the case where the rotation angle is 180°, when the rotation stops, the electronic component 2 is in a horizontal state, so the inertial force acting on the electronic component 2 is divided into horizontal and vertical forces. Therefore, the horizontal force acting toward the guide portions 203M, 203N is weakened. Furthermore, the inertial force acting in the vertical direction becomes resistance to movement in the horizontal direction. Therefore, the inertial force acting in the horizontal direction is further weakened. For this reason, the possibility that the electronic component 2 will not reach the guide portions 203M, 203N should be considered rather than the possibility that the electronic component 2 will hit the guide portions 203M, 203N and bounce back.

[0102] On the other hand, if the electronic component 2 overhangs and stops, the centrifugal force and the component of gravity are also added, which compensates for the force that moves the electronic component 2. In addition, the angle at which the component of the resultant force of the inertial force and gravity acts on the collet surface becomes smaller, so the resistance component is also weakened. This increases the possibility of positioning.

[0103] (3) The timing of the angle change and the start of the reverse rotation of the pickup collet 200 is not limited to the above embodiment. For example, in the embodiment of Fig. 7 and Fig. 12, the angle is changed before the reverse rotation starts, but the angle change may be performed after the reverse rotation starts. In this way, the time for the angle change and the time for the reverse rotation can be overlapped, thereby suppressing an increase in the tact time.

[0104] When the angle of the pickup collet 200 is changed, a force is generated that rotates the electronic component 2 in a direction parallel to the facing surface 201a. That is, when the electronic component 2 is picked up, it is positioned approximately in the center between the guide parts 203. However, when the angle of the pickup collet 200 is changed, the electronic component 2 tries to maintain its position, but the guide parts 203 rotate. Therefore, there is a possibility that the electronic component 2 hits the guide parts 203.

[0105] Moreover, when rotation is started for reversing, the electronic component 2 similarly hits the guide portion 203. During this process, the electronic component 2 approaches the guide portions 203K and 203L.

[0106] However, if the rotation for inversion is performed while changing the angle, the resultant force from the movement of both will cause the guide parts 203K and 203L to hit the electronic component 2, which may increase the impact at the time of the hit. This will also increase the risk of chipping, damage, and falling off. However, since such risks depend on the size and weight of the electronic component 2, whether or not to perform the angle change and inversion at the same time can be determined appropriately for the electronic component 2. Note that, as will be described later, if the collision can be avoided by blowing gas from the guide part 203, etc., overlapping the operations will shorten the takt time.

[0107] (4) The angle change unit 232 may change the angle of the picked up electronic component 2, and may return the changed angle when the facing surface 201a is inverted. In other words, the angle may be returned during the inversion rotation operation regardless of whether overhanging is performed or not. In this way, the return time is made to overlap with the rotation operation, and it is possible to prevent the tact time from being extended by changing the angle of the pickup collet 200. In the case of overhanging, if the angle is also returned during the rotation period returning to the inversion position, the force acting on the electronic component 2 is small, and deviation from the corner or its vicinity is prevented.

[0108] If there is no overhang, the angle is returned during the period of deceleration leading to a stop. If there is no overhang and the vehicle is stopped at the corner where it was approached due to acceleration when reversing, the angle is returned while it is decelerating. If there is no overhang and the vehicle is stopped at the opposite corner from the corner where it was approached due to acceleration when reversing due to inertia force caused by deceleration when stopping, the angle is returned after it has approached the opposite corner.

[0109] (5) The above-mentioned operation of overhanging the pickup collet 200 and then returning it may be repeated multiple times. In other words, after the pickup collet 200 reaches the reversing position, the rotating part 231 of the direction changing part 23 may be driven so that the pickup collet 200 reciprocates between a position beyond the reversing position and a position just before the reversing position, with the reversing position as the center. By swinging the pickup collet 200 back and forth, the pickup collet 200 tilts vertically, and the electronic component 2 is brought closer to the corner of the pickup collet 200 by applying inertial force and gravity to the electronic component 2. In this case, the electronic component 2 can be brought closer to the corner by gradually slowing down the swing speed. In addition, the swing width may be gradually reduced. Even if the electronic component 2 does not come close to the corner of the pickup collet 200 in the reversing operation or the overhanging operation, that is, if it does not come into contact with the orthogonal guide part 203, the electronic component 2 can be more reliably positioned by further moving it closer.

[0110] (6) The angle change portion 232 may be provided so that the angle can be changed vertically, and the electronic component 2 may be brought closer to the corner of the opposing surface 201a by tilting the pickup collet 200 vertically. For example, the electronic component 2 can be positioned by tilting it vertically rather than overhanging it at the inverted position. Even if the electronic component 2 does not fully approach the corner of the pickup collet 200 by the inverting operation, the electronic component 2 can be positioned more reliably by moving it further closer. Of course, this can be done in conjunction with overhanging. Also, tilting it vertically may be repeated multiple times.

[0111] (7) In the embodiment described above, after picking up the electronic component 2, the angle of the pickup collet 200 is changed by the angle change unit 232. However, it is also possible for the angle change unit 232 to pick up the electronic component 2 at an inclined horizontal angle and then return the angle to its original position before handing it over to the bonding head 31.

[0112] (8) As shown in Figs. 13 and 14, the ventilation part 203a may be provided on one of the two opposing guide parts 203 among the four guide parts 203. The guide parts 203 on which the ventilation part 203a is provided are provided on two adjacent sides of the opposing surface 201a. As described later, the ventilation part 203a can blow gas toward the opposing guide part 203. That is, as shown in Figs. 13(A) and 14(A), the ventilation part 203a may be provided at one of the four corners, which makes the side of the orthogonal guide parts 203M, 203N (hidden at the back in Fig. 13) relatively more positive than the other orthogonal guide parts 203K, 203L at the diagonal corner. The ventilation part 203a is connected to a gas supply circuit via a pipe (not shown) and is controlled by the control device 50. By applying a relatively positive pressure to the guide portions 203M, 203N on one side relative to the guide portions 203K, 203L on the other side, the electronic components 2 moved toward the guide portions 203K, 203L can be held on the guide portions 203K, 203L side and prevented from moving toward the guide portions 203M, 203N due to the inertial force when the rotation stops. This allows the deceleration when the rotation stops to be increased, shortening the time and preventing the electronic components 2 from bouncing back due to collision.

[0113] 13B and 14B, a ventilation section 203a may be provided that makes the side of one of the orthogonal guide sections 203K, 203L (hidden at the back in FIG. 13) perpendicular to one of the four corners relatively more positive than the side of the other orthogonal guide sections 203M, 203N at the diagonal corner. By making the side of one of the orthogonal guide sections 203K, 203L relatively more positive than the side of the other orthogonal guide sections 203M, 203N, in addition to the centrifugal force, inertial force, and gravity when the pickup collet 200 stops reversing, the electronic component 2 is more reliably brought to the side of the other orthogonal guide sections 203M, 203N, which is relatively negative pressure, and the electronic component 2 can be positioned at the corner of the opposing surface 201a along which the other orthogonal guide sections 203M, 203N are aligned.

[0114] The ventilation section 203a is provided inside the guide section 203 so as to communicate between the outside and the periphery of the electronic component 2 held on the facing surface 201a. The ventilation section 203a is connected to a gas supply circuit via a pipe (not shown). An end of the ventilation section 203a is an outlet 203b facing one of two side surfaces of the electronic component 2. Therefore, gas can be ejected from the outlet 203b toward the side surfaces of the electronic component 2.

[0115] 14(A) and 14(B), when the pickup collet 200 is inverted, gas is ejected from the ventilation section 203a of one of the orthogonal guide sections 203 through the ejection port 203b toward one of the two orthogonal side surfaces of the electronic component 2 held on the opposing surface 201a as described above. Then, the other two orthogonal side surfaces of the electronic component 2 are pressed against the inner wall of the other orthogonal guide section 203. This prevents the electronic component 2 once positioned from moving, or prevents the electronic component 2 from moving insufficiently or bouncing back when inverted, and allows the electronic component 2 to be positioned at a corner of the opposing surface 201a.

[0116] 15(A), gas is ejected toward the other two orthogonal side surfaces of the electronic component 2 from the ejection port 203b communicating with the ventilation portion 203a of the other orthogonal guide portion 203M, 203N in addition to the one orthogonal guide portion 203K, 203L, thereby preventing the electronic component 2 from shifting or coming off and contacting the electronic component 2 during movement or inversion. The ventilation portion 203a is also connected to a gas supply circuit via a pipe not shown, and is controlled by the control device 50. In this case, too, at the time of positioning, as shown in FIG. 15(B), gas ejection from the other orthogonal guide portion 203M, 203L is stopped, and gas is ejected only from the one orthogonal guide portion 203K, 203L, so that the one orthogonal guide portion 203K, 203L side is relatively positively pressured, and positioning can be performed. In this case, it is possible to select whether to perform positioning by applying positive pressure to the guide portions 203K and 203L or to the guide portions 203M and 203N.

[0117] (9) As shown in FIG. 16, the ventilation section 203a can be provided so as to be able to suck gas from the other two orthogonal sides of the guide section 203. For example, the ventilation section 203a is provided inside the other orthogonal guide sections 203M and 203N so as to communicate between the outside and the periphery of the electronic component 2 held on the opposing surface 201a. The ventilation section 203a is connected to a gas exhaust circuit (negative pressure generating circuit) via a pipe not shown, and the exhaust circuit is controlled by the control device 50. The end of the ventilation section 203a is a suction port 203d that faces the other two side surfaces of the electronic component 2. Therefore, the side surfaces of the electronic component 2 can be sucked from the suction port 203d. As a result, the side of the one orthogonal guide sections 203K and 203L is relatively more positive than the side of the other orthogonal guide sections 203M and 203N, so that the electronic component 2 is positioned at the corner of the fixed position as described above. In this case, the ventilation part 203a may or may not be provided on one of the orthogonal guide parts 203K, 203L. Also, the ventilation part 203a for suction may be provided on one of the orthogonal guide parts 203K, 203L, and may be configured to be positioned in the opposite direction to the above.

[0118] (10) As described above, when the electronic component 2 comes into contact with one of the orthogonal guide parts 203K, 203L and the other orthogonal guide parts 203M, 203N, the electronic component 2 may be affected. Therefore, by making the guide parts 203K, 203L, 203M, 203N eject gas to prevent contact with the electronic component 2, the electronic component 2 is positioned while being prevented from departing from the pickup collet 200, and damage to the electronic component 2 caused by contact with the guide parts 203K, 203L, 203M, 203N can be eliminated. In this case, too, the electronic component 2 can be positioned to one side by applying positive pressure to the guide parts 203K, 203L or to the guide parts 203M, 203N.

[0119] (11) For example, as shown in Fig. 17, the ventilation portion 203a may be provided so that gas can be ejected from the other orthogonal guide portion 203M, 203N through the guide porous member 203c. That is, the guide porous member 203c is provided at a position facing the side surface of the electronic component 2 of the protruding portion of the other orthogonal guide portion 203M, 203N. The ventilation portion 203a that communicates the guide porous member 203c with the outside is provided inside the guide portions 203M, 203N. The ventilation portion 203a is connected to a gas supply circuit through a pipe (not shown) and is controlled by the control device 50.

[0120] The guide parts 203M and 203N blow out gas through the guide porous member 203c. As a result, a gas layer is formed along the side surface of the guide parts 203M and 203N, so that when the electronic component 2 moves to the other orthogonal guide part 203M or 203N side for positioning, the electronic component 2 can be kept out of contact with the guide parts 203M and 203N. Therefore, the electronic component 2 is positioned through the gas layer, and chipping and cracking of the electronic component 2 are reduced, and the generation of particles due to contact can also be suppressed. Since the amount of gas blown out is small, the generation of particles due to airflow can also be suppressed. Furthermore, the displacement and falling of the electronic component 2 during transfer can also be reduced. As shown in FIG. 18, the guide parts 203M and 203N may also be provided so that gas can be blown out through the guide porous member 203c. As a result, even if the electronic component 2 moves toward the guide portions 203M, 203N due to gravity during rotation for inversion, the side of the electronic component 2 can be kept out of contact with the guide portions 203M, 203N, thereby reducing the impact on the electronic component 2.

[0121] (12) The guide portion 203 as described above may be provided along the outer edge of the facing surface 201a so as to restrict the movement of the electronic component 2. For this reason, the guide portion 203 may be provided along the entire circumference of the facing surface 201a or along a part of the circumference. For example, the guide portions 203 may be arranged to sandwich a corner as shown in FIG. 19(A) or continuously along a corner as shown in FIG. 19(B), and the electronic component 2 may be positioned by applying a relatively positive pressure to one of the orthogonal guide portions 203. Note that, as shown in FIG. 19(B), one orthogonal guide portion 203 and the other orthogonal guide portion 203 may be continuous with each other.

[0122] (13) The number and size of the suction holes 201c, the openings 201d, the ejection ports 203b, and the suction ports 203d are not limited to the above embodiment. The suction-holding state and the non-contact state can be maintained by balancing the area of ​​the electronic component 2 supported by the gas layer and the total area of ​​the openings 201d on the opposing surface 201a of the porous member 201. Also, the number and size of the ejection ports 203b or the suction ports 203d may be determined so that the electronic component 2 can be positioned on the other orthogonal guide portion 203.

[0123] (14) The positions and shapes of the suction holes 201c, the openings 201d, the nozzles 203b, and the suction ports 203d are not limited to the above. For example, the shape of the openings 201d may be circular or rectangular as described above, or may be other shapes such as an ellipse, a polygon, a polygon with rounded corners, or a star.

[0124] (15) The pickup collet 200 can be replaced depending on the shape and size of the electronic component 2 by making it replaceable. A simple structure for making the pickup collet 200 replaceable is one that can be attracted and held by a magnet, which also makes the replacement process easy. However, any structure that allows the pickup collet 200 to be replaceable will suffice. For example, it may be held by suction using negative pressure, or it may be held mechanically.

[0125] (16) The outer edge of the pickup collet 200 is not limited to a rectangle. In addition, the guide portion 203 may be arranged along the outer edge of the electronic component 2, and does not have to be provided on the outer edge of the pickup collet 200 as described above. For example, as shown in FIG. 20, the pickup collet 200 may have a base 202 with a curved outer edge, such as a cylindrical shape, and the guide portion 203 may be arranged on the bottom surface. In addition, the opposing surface 201a is not limited to a rectangle either.

[0126] [Other embodiments] The present invention is not limited to the above-described embodiment, but also includes other embodiments described below. The present invention also includes a combination of all or any of the above-described embodiment and the other embodiments described below. Furthermore, these embodiments can be omitted, replaced, or modified in various ways without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0127] 1 Transfer device 2. Electronic Components 10 Feeding device 11 sheets 12 Supply Stage 13 Stage movement mechanism 20 Pick-up device 21 Pickup Head 22 Collet movement mechanism 23 Direction change section 24 Push-up pin 30 Onboard Equipment 31 Bonding Head 31a Nozzle 32 Head movement mechanism 50 Control device 51 Supply device control section 52 Push-up pin control section 53 Pickup control section 54 Bonding head control unit 56 Substrate stage control unit 57 Memory section 60 Substrate Stage 61 Stage movement mechanism 100 Mounting device 200 Pickup collet 201 Porous Materials 201a Opposite side 201b back 201c Suction hole 201d aperture 202 Base 202a Air supply hole 202b Exhaust hole 202c Mounting hole 203, 203K~203N Guide section 203a Ventilation section 203b spout 203c Porous material for guide 203d Suction port 221 Slide mechanism 221a Support frame 221b Rail 221c slider 222 Lifting mechanism 222a Arm 222b Detachable part 222c Pin 231 Rotating Part 231a Driving source 232 Angle change section 232a Driving source 241 Backup body 321 Slide mechanism 321a Support frame 321b Rail 321c slider 322 Lifting mechanism

Claims

1. A pickup device for picking up an electronic component having a rectangular outer edge, comprising: A pickup collet that sucks and holds the electronic component; a direction changing unit that changes the orientation of the pickup collet; having The pickup collet is a porous member having air permeability and configured to eject gas supplied therein in a planar manner through pores on a surface facing the electronic component; the porous member has an opening on the opposing surface, and a suction hole is provided for sucking the electronic component by negative pressure; a guide portion is provided, the guide portion being disposed along an outer edge of the electronic component and configured to restrict movement of the electronic component held on the facing surface; The direction change unit is a rotating unit that rotates the pickup collet so that the facing surface is inverted from the pickup position of the electronic component; an angle changing unit that changes the angle of the pickup collet along a plane parallel to the opposing surface; A pickup device comprising:

2. 2. The pickup device according to claim 1, wherein the angle changed by the angle changer is an angle at which the electronic component moves toward a corner of the facing surface due to reversal.

3. 3. The pickup device according to claim 1, wherein the rotating section starts rotating from a position where the electronic component is picked up, and stops at a position where the facing surface is inverted.

4. 4. The pickup device according to claim 1, wherein the rotating portion returns to the inverted position after the opposing surface passes the inverted position before stopping at the inverted position.

5. 5. The pickup device according to claim 1, wherein the angle changer changes the angle after picking up the electronic component, and returns the angle after the electronic component stops at a position where the facing surface is inverted.

6. 5. The pickup device according to claim 1, wherein the angle changer changes the angle of the picked-up electronic component, and returns the changed angle when the facing surface is inverted.

7. 7. The pickup device according to claim 1, further comprising a ventilation section for making one of the guide sections perpendicular to the guide section relatively more positively pressured than the other of the guide sections perpendicular to the guide section.

8. 8. The pickup device according to claim 7, wherein the ventilation section is provided so as to be able to blow out gas from one of the guide sections perpendicular to the guide section.

9. 9. The pickup device according to claim 7, wherein the ventilation section is provided so as to be able to suck in gas from the other of the guide sections, which is perpendicular to the ventilation section.

10. 10. The pickup device according to claim 1, wherein the pickup collet is provided so as to be able to eject gas from at least one of the orthogonal guide portions via a porous guide member.

11. A pickup device as described in any one of claims 1 to 10, characterized in that it has a collet moving mechanism that moves the pickup collet close to a position where the electronic component on the sheet to which the electronic component is attached can be suction-held, and that peels the suction-held electronic component off the sheet and enables it to be transported.

12. A control device is provided. The control device includes: The electronic component is sucked and held by the pickup collet, causing the angle changing unit to change the angle of the pickup collet that suction-holds the electronic component; The pickup collet that sucks and holds the electronic component is rotated to be inverted by the rotating unit.

12. The pickup device according to claim 1, wherein the first and second electrodes are arranged in a first direction.

13. A pickup device according to any one of claims 1 to 12, a bonding head that is provided so as to be movable relative to the pickup collet and that receives the electronic component from the pickup collet; a mounting section that transfers the electronic component held by the bonding head to a substrate and mounts the electronic component on the substrate; A mounting device comprising:

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