Electronic component transfer device, electronic component mounting device, and electronic component mounting method

Abstract

To provide a transfer device for an electronic component capable of performing positioning at a mounting position while picking up an electronic component with no contact, a mounting device for the electronic component and a mounting method for the electronic component.SOLUTION: A transfer device 7 for an electronic component C in a mounting device 1 comprises: a mounting head 31 for mounting the electronic component C on a substrate S at a mounting position OA; a pickup collet 700 including a porous member, which holds the electronic component C with no contact by ejecting a gas and with a negative pressure of a suction hole, and a guide section for regulating movements of the electronic component C, and configured to pick up the electronic component C and deliver it to the mounting head 31; an inverting drive unit for inverting the pickup collet 700; a transfer mechanism 73 for the mounting head 31; a component side imaging unit 5 for imaging a contour of the inverted electronic component C; and a substrate support mechanism 2 including a positioning mechanism which performs positioning based on the contour of the electronic component C and positions the mounting head 31 at the mounting position OA after the electronic component C is delivered to the mounting head 31.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic component transfer device, an electronic component mounting device, and an electronic component mounting method. [Background technology]

[0002] When mounting electronic components, such as logic, memory, image sensors, and other semiconductor elements, on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips, and these chips are then picked up one by one and transferred to the substrate for mounting.

[0003] One side of the chip, the front side, is a functional surface on which fine circuits are formed. When picking up this chip from the wafer, if the pick-up member comes into direct contact with the functional surface, there is a risk of damaging the circuits, etc., so there is a demand to avoid such contact.

[0004] In addition, the connection terminals on the surface of the chip and the connection terminals on the substrate are also bonded to each other by facing each other. In this case, in order to ensure and improve the bondability between the connection terminals, the surface of the chip may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the condition of the surface of the chip that has been treated in this way, there is a demand to avoid direct contact of the member to be picked up with the surface of the chip.

[0005] In order to meet the requirement that no parts come into contact with the surface of the chip, conventionally, in a collet, which is a part that picks up the chip, the surface that holds the chip is made tapered, and the chip is held by suction from the center, with only the peripheral part, not the surface, in contact with the tapered surface of the collet (see Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Utility Model Application Publication No. 63-124746 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the conventional technology described above, the collet contacts only the periphery of the chip, and the chip is sucked from the center. This makes the chip prone to distortion, which may lead to chipping or cracking. In addition, the collet contacts the edge of the chip periphery and supports the chip being sucked at the contact portion, so stress is concentrated on the periphery, which makes chipping and cracking more likely. Furthermore, since the position of the chip is fixed while it is held by suction, if there is any misalignment or tilt when it is held by suction, it cannot be corrected when it is transferred to the mounting device.

[0008] The embodiments of the present invention have been proposed to solve the problems described above, and an object of the present invention is to provide an electronic component transfer device, an electronic component mounting device, and an electronic component mounting method that can pick up electronic components in a non-contact manner and position them at the mounting position. [Means for solving the problem]

[0009] An electronic component transfer device according to an embodiment of the present invention has a mounting head which mounts electronic components on a substrate at a mounting position, a porous member which holds the electronic components non-contact by negative pressure of suction holes while spraying gas from pores, and a guide section which regulates movement of the held electronic components, and has a pickup collet which picks up electronic components from a supply section which supplies the electronic components and passes them to the mounting head, an inversion drive section which inverts the pickup collet from the pickup position, a transfer mechanism which transfers the pickup collet between the supply section and the mounting head, a component-side imaging section which images the outline of the electronic component held by the inverted pickup collet, and a positioning mechanism which positions the mounting head to the electronic component held by the pickup collet based on the outline of the electronic component imaged by the component-side imaging section, and positions the mounting head at the mounting position after the electronic component is transferred from the pickup collet to the mounting head.

[0010] An electronic component mounting apparatus according to an embodiment of the present invention has an electronic component transfer device, and a mounting mechanism that mounts the electronic component positioned by the positioning mechanism onto the board at the mounting position.

[0011] In an embodiment of the electronic component mounting method of the present invention, a substrate and an electronic component are positioned and mounted on the substrate, and a pickup collet having a porous member that holds the electronic component in a non-contact manner by negative pressure of suction holes while blowing gas from pores, and a guide portion that regulates movement of the held electronic component, picks up the electronic component from an electronic component supply portion, an inversion drive portion inverts the pickup collet that has picked up the electronic component, a transport mechanism transports the pickup collet that has picked up the electronic component to a mounting head that mounts the electronic component on a substrate, a component-side imaging portion images an outline of the electronic component held by the inverted pickup collet, and a positioning mechanism determines the outline of the electronic component held by the pickup collet based on the outline of the electronic component imaged by the component-side imaging portion. the mounting head is positioned on the electronic component held by the pickup collet, and the electronic component is transferred from the pickup collet to the mounting head by relative movement between the pickup collet and the mounting head, the positioning mechanism positions the mounting head which has received and held the electronic component at a mounting position where the electronic component will be mounted on the board, the board-side imaging unit images a mark on the electronic component held by the mounting head while the board is retracted from the mounting position by a board support mechanism, the component-side imaging unit images an image of the mark on the board positioned at the mounting position by the board support mechanism, and the positioning mechanism positions the board and the electronic component based on the positions of the board and the electronic component determined from the images of the marks captured by the component-side imaging unit and the board-side imaging unit. Effect of the Invention

[0012] The embodiments of the present invention can provide an electronic component transfer device, an electronic component mounting device, and an electronic component mounting method that can pick up electronic components in a non-contact manner and position them at a mounting position. [Brief description of the drawings]

[0013] [Figure 1] 1 is a front view showing a schematic configuration of a mounting device according to an embodiment; [Diagram 2] FIG. 2 is a plan view showing an electronic component and a substrate. [Diagram 3] 1A is a plan view of the mounting device, and FIG. 1B is an enlarged plan view of a mounting location. [Figure 4] 1A is a schematic cross-sectional view showing the principle of holding an electronic component by a pickup collet, and FIG. 1B is a bottom perspective view showing the base. [Diagram 5] FIG. 4 is a bottom perspective view showing the pickup collet and the attachment / detachment portion. [Figure 6] FIG. 2 is a top perspective view showing a pickup collet and a detachable portion. [Figure 7] 1A and 1B are enlarged views showing a flipping operation of an electronic component, the left side being a front view and the right side being a plan view. [Figure 8] FIG. 11 is an explanatory diagram showing an operation of picking up an electronic component. [Figure 9] FIG. 11 is an explanatory diagram showing an electronic component delivery operation. [Figure 10] 1A is an explanatory diagram showing an image of an electronic component when the mounting head receives the electronic component (A), a diagram showing the positioning of the mounting head to the electronic component (B), and a diagram showing the positioning of the mounting head to a mounting position (C). [Figure 11] FIG. 4 is an explanatory diagram showing a mounting operation of the mounting device. [Figure 12] 10 is a flowchart showing a procedure of an electronic component pick-up operation and a delivery operation. [Figure 13] 1 is a flowchart showing a mounting procedure for electronic components. [Figure 14] 13 is a bottom view showing a modified example of the arrangement of the guide portion. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1 and Fig. 2, this embodiment is a mounting device 1 that mounts an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of the mounting device 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, and relative size ratios of each part may differ from the actual ones.

[0015] [Electronic components] First, the electronic component C to be mounted in this embodiment can be, for example, a semiconductor element such as an IC or an LSI. In this embodiment, as shown in Fig. 2, a rectangular parallelepiped semiconductor chip is used as the electronic component C. Each semiconductor chip is a bare chip obtained by dicing a semiconductor wafer into individual pieces. The bare chip has bump or bumpless electrodes on its surface, and is mounted by flip-chip connection in which it is bonded to an electrode pad on a substrate S.

[0016] The electronic component C is provided with a plurality of marks m for positioning. In this embodiment, two marks m are provided, one at each of a pair of diagonal corners of the rectangular electronic component C. The marks m are provided on a surface of the electronic component C on which electrodes are formed, that is, on the face. This embodiment is an example of an apparatus for face-down mounting in which the face side faces the board S for mounting.

[0017] [substrate] In this embodiment, the substrate S on which the electronic component C is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed, as shown in Fig. 2. The substrate S is provided with a mounting area B in which the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In this embodiment, two marks M are provided at positions outside the mounting area B and corresponding to the marks m of the electronic component C.

[0018] [Mounting equipment] The mounting apparatus 1 of this embodiment is capable of realizing mounting with high accuracy, for example, with a mounting accuracy of ±0.2 μm or less, and as shown in Figures 1 and 3, has a board support mechanism 2, a mounting mechanism 3, a board side imaging unit 4, a component side imaging unit 5, a supply unit 6, a transport device 7, and a control device 8. Figure 3(A) is a plan view of the mounting apparatus 1, and Figure 3(B) is a plan view showing a mark M transmitted through a mounting head 31 described later.

[0019] In the following description, the direction in which the mounting mechanism 3 moves the electronic component C to mount it on the substrate S is referred to as the Z axis, and the two axes perpendicular to each other in a plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as the downward direction, and the direction against gravity is referred to as the upward direction, and the position on the Z axis is referred to as the height. In addition, the X axis and the Y axis are on a horizontal plane, and when viewed from the front side of FIG. 1, the X axis is the left-right direction, and the Y axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as the upper side and the opposite side is referred to as the lower side with respect to the substrate S or the substrate support mechanism 2.

[0020] The substrate support mechanism 2 is a mechanism for supporting a substrate S on which an electronic component C is to be mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmitting portion that allows a mark M on the substrate S facing the electronic component C to be recognized through transmission while holding the electronic component C.

[0021] The board-side imaging unit 4 is disposed below the board support mechanism 2 at a mounting position OA where the mounting head 31 mounts the electronic component C on the board S, and captures an image of the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, i.e., from below, when the board S is retracted from the mounting position OA by the board support mechanism 2. The mounting position OA is the position where the electronic component C is mounted on the board S, and is indicated in the figure by a dashed line in the direction along the Z axis passing through a point (e.g., a center point) on the XY coordinate system within the area of ​​the electronic component C to be mounted. The mounting position OA coincides with the optical axis of the cameras of the board-side imaging unit 4 and the component-side imaging unit 5, as will be described later.

[0022] The component-side imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and images the mark M on the board S through the transparent portion of the mounting head 31 (hereinafter, this will be referred to as "imaging through the mounting head 31"). Based on the image thus captured, it becomes possible to detect the marks m and M, that is, to recognize the marks m and M. The component-side imaging unit 5 also images, through the mounting head 31, the outline of the electronic component C held by a pickup collet 700 of a transfer head 71, which will be described later.

[0023] The board support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the mounting head 31 with respect to the electronic component C held by the pickup collet 700 based on the outer shape of the electronic component C imaged by the component-side imaging unit 5. The positioning mechanism also positions the board S and the electronic component C held by the mounting head 31 based on the positions of the board S and the electronic component C determined from the images of the marks m and M imaged by the board-side imaging unit 4 and the component-side imaging unit 5. Each of the above-mentioned components of the mounting device 1 is mounted on a support stand 11 installed on an installation surface. The top surface of the support stand 11 is a horizontal plane.

[0024] The supply unit 6 supplies electronic components C. The transfer device 7 transfers the electronic components C from the supply unit 6 to the mounting position OA. The transfer device 7 has a transfer head 71 and a transfer mechanism 73. The transfer head 71 picks up the electronic components C from the supply unit 6, inverts them, and passes them to the mounting head 31. The transfer mechanism 73 moves the transfer head 71 into the space created by the board support mechanism 2 retracting the board S from the mounting position OA, and positions it at the mounting position OA.

[0025] The control device 8 controls the operation of the mounting device 1. The control device 8 is configured, for example, by an electronic circuit or a computer that operates according to a predetermined program. That is, the control device 8 is a processing device such as a PLC or a CPU that reads out programs and data from a storage device and controls the mounting device 1. Each part will be described in detail below.

[0026] (Substrate support mechanism) As shown in Fig. 1 and Fig. 3(A), the substrate support mechanism 2 is disposed on the support base 11, and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 is, for example, a two-axis movement mechanism having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and moves the stage 21 in a horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. This drive mechanism 22 functions as a positioning mechanism that positions the substrate S. Although not shown, the drive mechanism 22 includes a θ drive mechanism that rotates and moves the stage 21 in a horizontal plane.

[0027] The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the board side imaging unit 4 can image the electronic component C.

[0028] Although not shown, a loader / unloader that supplies / stores the substrate S to / from the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right side in the figure). With the stage 21 moved to the moving end, the substrate support mechanism 2 receives the substrate S from the loader and passes the substrate S to the unloader.

[0029] (Mounting mechanism) The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is roughly cuboid-shaped, and includes a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through-hole formed with the Z-axis direction as its axis. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to cover the opening of the hollow portion 31a on the side facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.

[0030] As shown in FIG. 3B, the suction area D for suctioning and holding the electronic component C is provided at the center of the holding portion 31b. In the figure, the suction area D and its center line are indicated by a two-dot chain line. This suction area D is the holding position of the electronic component C by the holding portion 31b. Although not shown, the suction area D has a suction hole formed therein. A flow path for connecting the suction hole to a negative pressure source is formed inside the holding portion 31b, and the electronic component C can be suctioned and held by generating negative pressure in the suction hole. The suction area D of the holding portion 31b and its surroundings are transparent areas T that can transmit and image the electronic component C held by the pickup collet 700. Even when the suction area D has suctioned the electronic component C, the transparent areas T around the suction area D allow the mark M of the board S to be transmitted and imaged. In other words, the mounting head 31 has a transparent portion so that the component-side imaging unit 5 can image the outline of the electronic component C and the mark M of the board S. The holding surface (suction surface) of the holding portion 31b that holds the electronic component C is referred to as a lower end surface.

[0031] The driving mechanism 32 includes movable bodies 33, 34, and 35, and is a mechanism for driving the mounting head 31. The movable body 33 is provided movably along a Y-axis guide rail 33a provided on the support base 11. The movable body 34 is provided movably along an X-axis guide rail 34a provided on the top surface of the movable body 33. The movable body 35 is provided movably along a Z-axis guide rail 35a provided on the front surface of the movable body 34. The movable body 35 is formed in a generally concave shape in a plan view. These movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like, which uses a motor as a drive source.

[0032] The mounting head 31 is provided under a movable body 35 that moves in the Z-axis direction. Therefore, the movable body 35 performs an operation for mounting the electronic component C held by the holding portion 31b of the mounting head 31 onto the board S. Furthermore, the movable body 35 on which the mounting head 31 is provided moves in the X-axis direction and the Y-axis direction by the movement of the movable bodies 33 and 34. Therefore, the driving mechanism 32 functions as a positioning mechanism that positions the electronic component C held by the mounting head 31. Although not shown, the driving mechanism 32 includes a θ driving mechanism that rotates and moves the mounting head 31 in a horizontal plane.

[0033] In this embodiment, it is preferable to set the movement amount in the X-axis direction, the Y-axis direction, and the Z-axis direction by the driving mechanism 32 as short as possible in order to prevent movement errors. For example, the movement amount in the X-axis direction and the Y-axis direction by the moving bodies 33 and 34 is set to several mm to several tens of mm, respectively. The movement amount in the Z-axis direction by the moving body 35 is also set to about several mm to several tens of mm. That is, the mounting head 31 receives the electronic component C and captures an image of the mark m of the received electronic component C at a height position where the lower end surface of the holding part 31b is spaced apart from the upper surface of the board S placed on the stage 21 by a facing distance (vertical separation distance) of several mm, for example, 1 to 2 mm. Therefore, with regard to the movement amount in the Z-axis direction of the moving body 35, it is sufficient to ensure at least a movement amount that can mount the electronic component C held by the holding part 31b on the board S by applying a predetermined pressure force from this height position.

[0034] (Board side imaging section) The board-side imaging unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is fixed to the accommodation hole 11a provided in the support base 11. The board-side imaging unit 4 is arranged in a direction in which the optical axis of the camera can image the mark m of the electronic component C held by the mounting head 31. Specifically, it is arranged so that the optical axis is vertical. In this embodiment, the board-side imaging unit 4 is arranged facing upward in the accommodation hole 11a of the support base 11, which is a position below the board support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. The board-side imaging unit 4 is fixed to the support base 11 so that the electronic component C fits within the imaging field of view when the pickup collet 700 faces the mounting head 31 to transfer the electronic component C. In addition, the imaging magnification of the board-side imaging unit 4 is set so that the accuracy of imaging the mark m of the electronic component C held by the mounting head 31 and recognizing the position is the required accuracy. Of course, it has a field of view range that is large enough to image the mark m. This field of view range is also set taking into consideration variations in the positions at which electronic components C are held by the mounting head 31, i.e., the holding position accuracy. Furthermore, when capturing images of multiple marks m to recognize the positions of electronic components C held by the mounting head 31, the field of view range can be set so that multiple marks m can be captured simultaneously. Such magnification and field of view range are appropriately determined based on the required positioning accuracy.

[0035] (Part side imaging section) The component-side imaging unit 5 has a camera, a lens, a lens barrel, a light source, etc., and is supported by a frame (not shown) at a position above the support stand 11, more specifically, above the mounting head 31. The component-side imaging unit 5 is arranged in a direction in which the optical axis of the camera can pass through the holding portion 31b of the mounting head 31 and image the marks M around the mounting area B of the board S. That is, in this embodiment, the component-side imaging unit 5 is arranged directly above the mounting head 31, facing downward with the optical axis of the camera aligned with the mounting position OA. The component-side imaging unit 5 is set to an imaging magnification so that the accuracy of imaging and recognizing the position of the mark M attached to the mounting area B of the board S placed on the stage 21 is required. At the same time, the imaging field of view of the component-side imaging unit 5 is set so as to include the two marks M attached diagonally to the mounting area B of the board S. Furthermore, the range of this imaging field of view is set in consideration of the variation in the position at which the board S is placed on the stage 21, i.e., the placement position accuracy.

[0036] In addition, the component-side imaging unit 5 is configured to be able to image the external shape of the electronic component C when the pickup collet 700 faces the mounting head 31 to deliver the electronic component C. Therefore, the imaging field of the component-side imaging unit 5 is set in consideration of the maximum range in which the electronic component C held by the pickup collet 700 can move. At this time, the area formed by the two marks M attached diagonally to the mounting area B of the board S is larger than the external size of the electronic component C, so it is easy to image the two marks M and the external shape of the electronic component C with the same component-side imaging unit 5. However, when the imaging magnification and imaging field of view for the recognition accuracy required for the board S are significantly different from the imaging magnification and imaging field of view for the recognition accuracy of the external shape of the electronic component C, the magnification and imaging field of view can be appropriately determined using, for example, a zoom lens. In addition, if necessary for this purpose, a focus adjustment mechanism such as a lens movement mechanism or a lens barrel movement mechanism can be provided to adjust the focus position that moves with the change in magnification. When the component-side imaging unit 5 images the outer shape of the electronic component C, it is preferable that the height position of the surface of the electronic component C is the same as the height position of the surface of the board S on which the mark M is formed. This eliminates the need to adjust the focal position when imaging the outer shape of the electronic component C.

[0037] (Supply Department) The supply unit 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports the wafer sheet WS to which the electronic components C are attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. In the supply unit 6, the surface (area) on which the electronic components C are mounted is called the placement surface F. In this embodiment, the electronic components C are obtained by dividing a wafer attached to the wafer sheet WS into individual pieces by dicing. Therefore, the surface of the wafer sheet WS to which the electronic components C are attached (the surface of the wafer) is the placement surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a to which the wafer ring is attached. In other words, the surface of the support mechanism 61 that supports the wafer sheet WS can also be called the placement surface F.

[0038] Although not shown, a loader / unloader that supplies / stores wafer rings in the ring holder 61a is provided at one of the moving ends in the Y-axis direction of the support mechanism 61 (specifically, the moving end on the front side in the figure). When the support mechanism 61 is moved to the moving end, it receives wafer rings from the loader and passes the wafer rings to the unloader.

[0039] Although not shown, the support mechanism 61 has an expanding mechanism that stretches the wafer sheet WS to create gaps between the electronic components C, and a push-up mechanism that sandwiches the stretched wafer sheet WS and pushes up the electronic components C individually to separate them. Furthermore, the support mechanism 61 has a θ drive mechanism that rotates and moves the ring holder 61a in a horizontal plane. The push-up mechanism is fixedly disposed on the support base 11, and the transfer device 7 receives the electronic components C from the supply unit 6, that is, picks them up, at this position (pick-up position).

[0040] The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and is a mechanism that moves the support mechanism 61 in the X-axis and Y-axis directions in a horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. The drive mechanism 62 functions as a positioning mechanism that positions the electronic component C with respect to the transfer head 71. The drive mechanism 62 is disposed at a position lower than the height position L (see FIG. 5) of the placement surface F.

[0041] (transfer device) The transfer device 7 transfers the electronic component C to the mounting device 1. The transfer device 7 has a transfer head 71, an arm unit 72, and a transfer mechanism 73. As shown in FIG. 3(A), the transfer head 71 has a pickup collet 700 and an inversion drive unit 710. As shown in FIGS. 4 to 6, the pickup collet 700 is a member that sucks and holds the electronic component C and releases the suction hold to release the electronic component C. The pickup collet 700 has a porous member 701, a base 702, and a guide unit 703. In this embodiment, the transfer device 7 moves the pickup collet 700 to deliver the electronic component C to the mounting head 31. However, the movement for delivery may be relative, and either or both of the pickup collet 700 and the mounting head 31 may move.

[0042] The porous member 701 is a member that has air permeability and supplies gas supplied to the inside through pores in the facing surface 701a facing the electronic component C (note that in the following description, the gas supplied toward the electronic component C is illustrated with the symbol G). The porous member 701 of this embodiment has a rectangular parallelepiped plate shape, and fine spaces that communicate as a whole are densely and uniformly formed. The porous member 701 has air permeability due to this structure, but its conductance is very small. The porous member 701 has one of its faces as the facing surface 701a, and when gas is supplied to the inside from the back surface 701b opposite to the facing surface 701a, the gas is ejected from the dense and uniformly present pores in the facing surface 701a. This ejection is substantially planar, spreading over the entire surface of the facing surface 701a from which the gas is ejected. This ejection is extremely gentle, and feels like it is oozing out, and you can feel a slight air flow by placing your finger close to it. The pores on the surfaces other than the opposing surface 701a and the rear surface 701b may be blocked.

[0043] As described above, the porous member 701 is a continuous structure in which the pores, which are minute spaces inside, are interconnected and gas can pass between the pores. Sintered metal, ceramic, resin, etc. can be used as the porous member 701. From the viewpoint that the particles inside are unlikely to separate and flow out, it is preferable to use sintered metal.

[0044] 4 and 5, the porous member 701 has an opening 701d on the opposing surface 701a, and is provided with a suction hole 701c which is a through hole that sucks in the electronic component C by negative pressure. The suction hole 701c in this embodiment linearly penetrates from the center of the back surface 701b to the center of the opposing surface 701a.

[0045] The base 702 is a member that covers the surfaces of the porous member 701 other than the opposing surface 701a. The base 702 in this embodiment is a rectangular parallelepiped box that is open at the bottom. The porous member 701 is inserted from the opening of the base 702 so that the bottom surface is exposed as the opposing surface 701a, and is assembled and fixed inside the base 702.

[0046] As shown in FIG. 4 and FIG. 6, the top surface of the base 702 is provided with an air supply hole 702a, an exhaust hole 702b, and a mounting hole 702c. The air supply hole 702a is a through hole for supplying air to the porous member 701. The air supply hole 702a is formed at a position close to the outer edge of the base 702 for piping connected to the air supply hole 702a. The exhaust hole 702b is a through hole for generating negative pressure in the opening 701d through the suction hole 701c. The exhaust hole 702b extends downward and is formed to match the suction hole 701c of the porous member 701. A space for gas accumulation is formed between the inner surface of the base 702 and the porous member 701 around the exhaust hole 702b. The exhaust hole 702b may penetrate the suction hole 701c and reach the opposing surface 701a. In this case, the suction holes 701c and the openings 701d of the porous member 701 are provided so as to be in close contact with the outside of the exhaust holes 702b that reach the opposing surface 701a of the porous member 701. The mounting holes 702c are a pair of recessed holes for preventing misalignment when connecting with the detachable part 704 described later.

[0047] The air supply hole 702a is connected to a gas supply circuit via a pipe (not shown). The supply circuit includes a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 701 via the air supply hole 702a is an inert gas. The exhaust hole 702b is connected to a negative pressure generating circuit including a vacuum pump, a valve, etc. via a pipe (not shown).

[0048] The guide portion 703 is a member that is arranged along the four sides of the rectangular base 702 and restricts the movement of the electronic component C held on the opposing surface 701a. The guide portion 703 is, for example, a plurality of plate-like bodies provided along the four side surfaces of the base 702, that is, along the four sides of the rectangular opposing surface 701a, as shown in Figs. 4, 5, and 6. The guide portion 703 in this embodiment is provided on each side of the opposing surface 701a, but is not limited to this. In addition, the outer edge of the pickup collet 700 formed by the base 702 is not limited to a rectangular shape. The guide portion 703 is only required to be arranged in a direction along the outer edge of the electronic component C so as to restrict the movement of the electronic component C, and is not limited to being arranged along the side surface of the base 702.

[0049] Each guide portion 703 has a protruding portion protruding from the facing surface 701a. The distance (protruding amount) of the guide portion 703 protruding from the facing surface 701a may be sufficient to restrict the movement of the electronic component C held on the facing surface 701a through the gas layer, and may be at least the extent to which the guide portion 703 extends from the facing surface 701a to the electronic component C held through the gas layer. However, if the protruding portion of the guide portion 703 protrudes beyond the electronic component C held on the facing surface 701a through the gas layer, it is necessary to take care not to contact the electronic components C around the electronic component C to be picked up when picking it up from the wafer. Therefore, it is preferable that the distance by which the protruding portion of the guide portion 703 protrudes from the facing surface 701a is within the side surface of the electronic component C held on the facing surface 701a through the gas layer. However, by individually pushing up the electronic components C through the wafer sheet WS using the above-mentioned pushing mechanism before the pickup collet 700 approaches the wafer sheet WS for pickup, it is possible to avoid contact with the surrounding electronic components C according to various amounts of protrusion.

[0050] In the following description, one of the orthogonal guide portions 703 will be referred to as 703K and 703L, and the other orthogonal guide portion 703 will be referred to as 703M and 703N, and when there is no need to distinguish between them, they will be described as guide portions 703. Here, orthogonal includes cases where two guide portions 703 on adjacent sides are in contact or continuous to form a right angle, and cases where there are multiple guide portions 703 on one side, the guide portions 703 are separated, and the straight lines (planes) along which the two portions run are orthogonal (see FIG. 14).

[0051] 7(A) and (B), the inversion drive unit 710 inverts the electronic component C picked up by the pickup collet 700 in the up-down direction. That is, the pickup collet 700 is provided so as to be rotatable between a direction facing the wafer sheet WS and a direction facing the mounting head 31 by the inversion drive unit 710. The inversion drive unit 710 is, for example, a motor.

[0052] The pickup collet 700 is attached to the inversion drive unit 710 via the rotating body 720 and the detachable part 704. The rotating body 720 is connected to the inversion drive unit 710 and is provided so as to be rotatable around an axis in the Y direction. The detachable part 704 is attached to the rotating body 720 and is provided so as to be rotatable together with the rotating body 720. The detachable part 704 has a magnet inside and attracts and holds the base 702 of the pickup collet 700 by the magnetic attraction. As shown in FIG. 5 and FIG. 6, a pair of pins 704a are provided on the contact surface of the detachable part 704 with the base 702. The pins 704a fit into the mounting holes 702c provided in the base 702, thereby preventing the pickup collet 700 from being displaced relative to the detachable part 704. Although not shown, the pipe connected to the exhaust hole 702b passes through the detachable part 704, and the pipe connected to the air supply hole 702a is supported by the detachable part 704.

[0053] Although not shown, the transfer head 71 drives the pickup collet 700 in the vertical direction and has a buffer member that applies an appropriate load and absorbs excessive load when the tip of the pickup collet 700 comes into contact with the electronic component C. As the buffer member, for example, a voice coil motor is used.

[0054] The arm 72 is a member having a transfer head 71 at one end. As shown in FIG. 3A, the arm 72 has an extension 72a and a base 72b. The extension 72a is an L-shaped member formed by a rectangular parallelepiped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped member extending linearly in the X-axis direction toward the mounting mechanism 3. At one end of the extension 72a toward the mounting mechanism 3, a reversal drive unit 710 is provided with a rotation axis in the Y-axis direction. The pickup collet 700 is attached to the rotation axis of the reversal drive unit 710, so that the pickup collet 700 is rotatably provided. The base 72b is a plate-like body parallel to the X-axis direction, and is fixed to the other end of the extension 72a (see FIG. 8).

[0055] A tube for supplying negative pressure connected to pickup collet 700, inversion drive unit 710, and a cable for electrical connection connected to the buffer member are built into arm unit 72. Built-in means that they are not exposed to the outside because they are covered by the exterior of arm unit 72. In this embodiment, the tube and cable are inserted into a hollow portion formed inside arm unit 72.

[0056] The transfer mechanism 73 drives the arm portion 72 to move the transfer head 71 between the supply unit 6 and the mounting position OA. The transfer mechanism 73 has a sliding part SL provided at a position that does not overlap with the placement surface F in a plan view. In other words, the sliding part SL of the transfer mechanism 73 is provided outside the movement range of the support mechanism 61. The transfer mechanism 73 drives the arm portion 72 according to the sliding of the sliding part SL. The sliding part SL here refers to a component part in which members move while contacting each other. Such a sliding part SL is a source of dust generation. As shown in FIG. 5, the sliding part SL of this embodiment is configured to include a first sliding part 732b and a second sliding part 734b described later. The first sliding part 732b and the second sliding part 734b are provided at a position lower (lower) than the height position L of the placement surface F.

[0057] 8, the transfer mechanism 73 has a fixed body 731, a first driving unit 732, a moving body 733, and a second driving unit 734. The fixed body 731 is a rectangular parallelepiped member fixed to the support base 11 (see FIG. 3(A)) and extending in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA.

[0058] The first driving unit 732 drives the arm unit 72 in the X-axis direction. The first driving unit 732 has a first driving source 732a and a first sliding portion 732b. The first driving source 732a is a linear motor extending in the X-axis direction, and is provided along the upper surface of the fixed body 731 (a surface parallel to the XY plane). The first sliding portion 732b is a linear guide extending in the X-axis direction, and is provided on the front surface of the fixed body 731 (a surface parallel to the XZ plane). Note that, since the linear motor moves the mover without contacting the stator, the first driving source 732a does not have a sliding portion SL.

[0059] The movable body 733 is a rectangular parallelepiped block to which a movable element of the first driving source 732a and a slider of the first sliding portion 732b are attached, so that the movable body 733 is slidably movable in the X-axis direction in accordance with the operation of the first driving source 732a.

[0060] The second driving unit 734 drives the arm unit 72 in the Z-axis direction. The second driving unit 734 has a second driving source 734a and a second sliding unit 734b. The second driving source 734a is a linear motor extending in the Z-axis direction, and is provided on the moving body 733. The second sliding unit 734b is a linear guide extending in the Z-axis direction, and is provided on the moving body 733.

[0061] The base portion 72b of the arm portion 72 is provided so as to be slidable in the Z-axis direction by mounting the movable element of the second driving source 734a and the slider of the second sliding portion 734b. Thus, the sliding portion SL of this embodiment has the first sliding portion 732b and the second sliding portion 734b that slide linearly along two orthogonal axes. The first sliding portion 732b and the second sliding portion 734b are disposed in a positional relationship in which they overlap in the height direction on two side surfaces facing each other on the front and back of a common moving body 733. In other words, the positions of the two orthogonal axes are close to each other. In addition, it is preferable that the distance between the two side surfaces of the moving body 733 is short, that is, the moving body 733 is thin.

[0062] (Relationship between the Opposing Distance between the Substrate on the Stage and the Mounting Head and the Dimensions of the Transfer Head) In this embodiment, as shown in FIG. 1, in order for the transfer head 71 to move to the mounting position OA, the opposing distance between the substrate S at the mounting position OA and the mounting head 31 is set so that the substrate S needs to be retracted. In other words, in order for the transfer head 71 to move to the mounting position OA, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set closer to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2 to the extent that the substrate S needs to be retracted. More specifically, the distance h when the lower end surface of the mounting head 31 when receiving the electronic component C faces the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA is shorter than the height direction dimension H of the transfer head 71 at the tip of the arm portion 72 (h < H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several millimeters.

[0063] (Dimensions of the Arm Portion) As shown in FIGS. 1, 3(A), and 7(A), the extending portion 72a of the arm portion 72 has a width w of a member linearly extending in the Y-axis direction and a width d of a member linearly extending in the X-axis direction, both of which are longer than the thickness t in the Z-axis direction (w > t, d > t). Thereby, while suppressing the expansion of the height direction dimension of the arm portion 72, the rigidity of the relatively long arm portion 72 can be ensured, and the position of the electronic component C transferred by the transfer head 71 can be stabilized. By suppressing the expansion of the height direction dimension of the arm portion 72, it becomes unnecessary to raise the receiving position of the mounting head 31.

[0064] (Control Device) The control device 8 controls the positioning mechanism so that the suction area D is positioned at the position of the outline of the electronic component C imaged by the component-side imaging unit 5. The control device 8 also controls the positioning mechanism so that the electronic component C held in the suction area D is positioned at the mounting position OA. The control device 8 also controls the positioning mechanism so that the board S and the electronic component C are positioned based on the marks m and M imaged by the board-side imaging unit 4 and the component-side imaging unit 5. That is, the control device 8 stores in the storage device the position of the outline of the electronic component C on the design (corresponding to the suction area D when the mounting head 31 is at the mounting position OA, i.e., the holding position), the position of the mark m of the electronic component C on the XY coordinate system on the design, and the position of the mark M of the board S on the XY coordinate system on the design, as their respective reference positions, in correspondence with the position where the electronic component C should be accurately mounted.

[0065] This reference position may not be a design position, but may be the position of the outline of the electronic component C and the positions of the marks m and M when the electronic component C is accurately mounted as a result of a trial of mounting the electronic component C on the board S in advance. The control device 8 determines the deviation between the outline position of the electronic component C imaged by the component-side imaging unit 5 and the reference position, and controls the positioning mechanism (drive mechanism 32) so that the mounting head 31 moves in a direction and by a movement amount that corrects the deviation. The control device 8 also determines the deviation between the mark m imaged by the board-side imaging unit 4, the mark M imaged by the component-side imaging unit 5, and the reference position, and controls the positioning mechanism (drive mechanism 22 and drive mechanism 32) so that the electronic component C and the board S move in a direction and by a movement amount that corrects the deviation.

[0066] Furthermore, the control device 8 controls the transfer mechanism 73 of the transfer device 7 and the drive mechanism 62 of the supply unit 6 based on map information indicating the position coordinates of the electronic components C on the wafer sheet WS, thereby sequentially positioning the electronic components C to be picked up at the pick-up position. Note that the term "pick-up" used here refers to removing and receiving the electronic components C from the member on which the electronic components C are placed, such as the wafer sheet WS. Furthermore, the control device 8 controls the holding of the electronic components C by the pickup collet 700 of the transfer head 71, the inversion of the pickup collet 700 by the inversion drive unit 710, the movement of the transfer head 71 by the transfer mechanism 73 to the mounting position OA where the mounting head 31 waits, the delivery of the electronic components C from the pickup collet 700 to the mounting head 31, etc.

[0067] [Principle of suction and holding by pickup collet] Next, the principle by which the pickup collet 700 as described above can suck and hold the electronic component C will be described. As shown in FIG. 4(A), the gas supplied from the air supply hole 702a is ejected in a planar manner from the pores of the facing surface 701a, forming a gas layer between the electronic component C and the pickup collet 700. This layer is, for example, 2 to 10 μm. Then, in a state in which a negative pressure is applied to the suction hole 701c by the negative pressure generating circuit, the facing surface 701a is brought close to the electronic component C, and the electronic component C is sucked and held. At this time, since a gas layer is formed between the facing surface 701a and the electronic component C, the facing surface 701a and the electronic component C are maintained in a non-contact state. In addition, by releasing the negative pressure by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 701c, and the electronic component C is released from the pickup collet 700.

[0068] [Operation] The operation of this embodiment as described above will be described with reference to the explanatory diagrams of Figures 7 to 11 and the flow charts of Figures 12 and 13 in addition to Figures 1 to 6. Note that in the initial state, the substrate S is handed over from the loader to the stage 21 of the substrate support mechanism 2, but is retreated together with the stage 21 from the position facing the mounting head 31, that is, from the mounting position OA.

[0069] [Transportation of electronic parts] The transfer operation of the electronic components C will be described with reference to the explanatory diagrams of Figs. 7 to 9 and the flow chart of Fig. 12. A wafer ring with a wafer sheet WS attached thereto is attached by an autoloader to a ring holder 61a of a support mechanism 61 in the supply unit 6 (see Fig. 3). Electronic components C separated into individual pieces by dicing are attached to this wafer sheet WS. Note that in Fig. 8, only the electronic components C to be picked up are shown.

[0070] 8(A) and 3(A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pick-up position. Also, by moving the arm unit 72 in the X-axis direction, the tip of the pick-up collet 700 of the transfer head 71 is positioned directly above the electronic component C to be mounted, that is, at the pick-up position (step S101).

[0071] At this time, the movement of the wafer sheet WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm unit 72 in the X-axis direction is performed by the movement of the movable body 733 along the first sliding portion 732b as a result of the first drive source 732a of the first drive unit 732 being operated.

[0072] As shown in FIG. 8B, a push-up mechanism (not shown) pushes up the electronic component C to be mounted. Then, the pickup collet 700 of the transfer head 71 picks up the electronic component C (step S102). That is, pressurized gas is supplied to the porous member 701 of the pickup collet 700 through the air supply hole 702a, and the gas is blown out from the facing surface 701a. At this time, the gas is not exhausted from the exhaust hole 702b, and the gas is not sucked from the opening 701d. In this way, the pickup collet 700 to which the gas is supplied from the facing surface 701a descends and approaches the electronic component C. When the pickup collet 700 approaches the electronic component C, the gas on the facing surface 701a is sandwiched between the facing surface 701a and the electronic component C to form a gas layer. The sandwiched gas layer at this time is considered to be a viscous flow layer. Then, the pickup collet 700 stops descending toward the electronic component C due to the gas layer that is not compressed any more. In this manner, with the pickup collet 700 stopped via the gas layer, suction through the suction hole 701c is started by exhausting air from the exhaust hole 702b, so that the electronic component C is sucked and held on the facing surface 701a.

[0073] In this manner, the arm portion 72 moves in a direction approaching the wafer sheet WS, and the pickup collet 700 adsorbs and holds the electronic component C, and then moves in a direction away from the wafer sheet WS, thereby detaching the electronic component C from the wafer sheet WS, as shown in FIG. 8(C).

[0074] At this time, the movement of the arm portion 72 is performed by operating the second drive source 734a of the second drive portion 734 to move the base portion 72b along the second sliding portion 734b. Then, as shown in Figures 7(A), (B), 8(C) and (D), the inversion drive portion 710 rotates the pickup collet 700 by 180 degrees to invert the electronic component C (step S103).

[0075] Next, as shown in FIGS. 9A and 9B, the arm unit 72 moves in the X-axis direction to position the transfer head 71 at the mounting position OA (step S104). That is, the pickup collet 700 of the transfer head 71 comes to a position facing the holding unit 31b of the mounting head 31 in the mounting mechanism 3. The movement of the arm unit 72 in the X-axis direction at this time is performed by the first driving source 732a of the first driving unit 732 operating to move the moving body 733 along the first sliding unit 732b from the pickup position to the mounting position OA. At this time, the mounting head 31 waits at a height position where the facing distance between the lower end surface of the holding unit 31b and the upper surface of the board S is a few mm. This height position is maintained until the positioning of the electronic component C and the board S is completed and the mounting head 31 is driven toward the board S, as described later.

[0076] As shown in FIG. 10(A), the component-side imaging unit 5 captures an image of the outline of the electronic component C seen through the transparent region T through the mounting head 31 (step S105). In the example of FIG. 10(A), the electronic component C is shifted to the upper left and tilted to the right with respect to the suction region D and its center indicated by the two-dot chain line. The control device 8 obtains the amount of deviation (XY direction and θ direction) between the outline of the electronic component C captured by the component-side imaging unit 5 and a reference position, and operates the driving mechanism 32 so as to eliminate the amount of deviation, as shown in FIG. 10(B), thereby positioning the mounting head 31 on the electronic component C (step S106). In the example of FIG. 10(B), the mounting head 31 moves to the upper left and rotates to the right to align the suction region D with the electronic component C. Note that the movement to the upper left is indicated by an arrow at the lower right outside the dotted line indicating the holding unit 31b. Rotation to the right is indicated by an arrow on the inside upper right corner of the solid circle indicating hollow portion 31a.

[0077] As shown in Fig. 9(C), the arm portion 72 moves in a direction approaching the holding portion 31b and presses the electronic component C against the holding portion 31b. As shown in Fig. 9(D), the holding portion 31b of the mounting head 31 adsorbs and holds the electronic component C by negative pressure and receives it (step S107). At the same time, the pickup collet 700 releases the negative pressure and the arm portion 72 moves in a direction away from the holding portion 31b, thereby releasing the electronic component C. The movement of the arm portion 72 at this time is performed by the second driving source 734a of the second driving portion 734 being operated to move the base portion 72b along the second sliding portion 734b.

[0078] Then, as shown in Fig. 10(C), the control device 8 operates the drive mechanism 32 to return the electronic component C held by the mounting head 31 to the original mounting position OA (step S108). In the example of Fig. 10(C), the mounting head 31 moves to the lower right in the figure and rotates to the left to return to the mounting position OA. Note that in the figure, the movement to the lower right is indicated by an arrow at the upper left outside the dotted line indicating the holding portion 31b. Also, the rotation to the left is indicated by an arrow at the upper right inside the solid circle indicating the hollow portion 31a.

[0079] 9(E), the arm unit 72 moves toward the supply unit 6, causing the transfer head 71 to retreat from directly below the holder 31b. The movement of the arm unit 72 at this time is performed by the first drive source 732a of the first drive unit 732 being actuated to move the movable body 733 in the X-axis direction along the first sliding portion 732b. Note that the transfer device 7 delivers the electronic component C to the holder 31b at the mounting position OA, and therefore the stage 21 remains retracted during the delivery to avoid interference with the transfer mechanism 73.

[0080] [Electronic component mounting] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagram of Fig. 11 and the flowchart of Fig. 13. Here, as shown in Fig. 11(A), the holding portion 31b of the mounting head 31 holding the electronic component C as described above is located directly below the component-side imaging unit 5. The board-side imaging unit 4 captures an image of the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 determines the amount of deviation between the position of the mark m captured by the board-side imaging unit 4 and a reference position, and positions the electronic component C by operating the drive mechanism 32 so as to eliminate the amount of deviation (step S202).

[0081] 11(B), the board support mechanism 2 moves the stage 21 so that the mounting area B of the board S (the mounting area B where the electronic component C is to be mounted this time) faces the electronic component C held by the mounting head 31, that is, so that the center of the mounting area B is at the mounting position OA (step S203). Then, as shown in FIG. 3(B), the component-side imaging unit 5 images the mark M of the board S visible in the transparent area T around the electronic component C through the mounting head 31 (step S204).

[0082] The control device 8 determines the amount of deviation between the position of the mark M imaged by the component-side imaging unit 5 and the reference position, and operates the driving mechanism 22 to position the board S so as to eliminate the amount of deviation (step S205). Furthermore, as shown in Fig. 11(C), the driving mechanism 32 drives the mounting head 31 toward the board S, and the electronic component C held by the mounting head 31 is mounted on the board S (step S206).

[0083] In this manner, by repeating the operations of transferring the electronic components C from the wafer sheet WS, handing over the electronic components C to the mounting head 31, positioning the electronic components C and the board S, and mounting, the electronic components C are sequentially mounted in each mounting area B of the board S. The board S on which a predetermined number of electronic components C have been mounted is transported by the board support mechanism 2 and stored in the unloader.

[0084] [Effects] (1) The transfer device 7 for electronic components C in this embodiment includes a mounting head 31 that mounts electronic components C on a substrate S at a mounting position OA, a porous member 701 that holds the electronic components C in a non-contact manner by negative pressure of suction holes 701c while ejecting gas from fine holes, and a guide portion 703 that restricts movement of the held electronic components C. The transfer device 7 includes a pickup collet 700 that picks up electronic components C from a supply portion 6 that supplies electronic components C and passes them to the mounting head 31, and an inversion drive portion 702 that inverts the pickup collet 700 from the pickup position. 10, a transport mechanism 73 which transports the pickup collet 700 between the supply unit 6 and the mounting head 31, a component-side imaging unit 5 which captures an image of the outer shape of the electronic component C held by the inverted pickup collet 700, and a positioning mechanism which positions the mounting head 31 to the electronic component C held by the pickup collet 700 based on the outer shape of the electronic component C captured by the component-side imaging unit 5, and after the pickup collet 700 delivers the electronic component C to the mounting head 31, positions the mounting head 31 at the mounting position OA.

[0085] Moreover, the mounting apparatus 1 for mounting an electronic component C of this embodiment has a mounting mechanism 3 that mounts the electronic component C, which has been positioned by the positioning mechanism, on the board S at the mounting position OA by the mounting head 31.

[0086] Furthermore, in the mounting method of the present embodiment, the pickup collet 700 has a porous member 701 that holds the electronic component C in a non-contact manner by the negative pressure of the suction holes 701c while blowing gas from the pores, and a guide portion 703 that regulates the movement of the held electronic component C, picks up the electronic component C from the supply portion 6 of the electronic component C, the inversion drive portion 710 inverts the pickup collet 700 that has picked up the electronic component C, the transport mechanism 73 transports the pickup collet 700 that has picked up the electronic component C to the mounting head 31 that mounts the electronic component C on the board S, the component-side imaging portion 5 images the outer shape of the electronic component C held by the inverted pickup collet 700, and the positioning mechanism determines the outer shape of the electronic component C held by the pickup collet 700 based on the outer shape of the electronic component C imaged by the component-side imaging portion 5. The mounting head 31 is positioned on the picked-up electronic component C, and the electronic component C is transferred from the pickup collet 700 to the mounting head 31 by relative movement between the pickup collet 700 and the mounting head 31. The positioning mechanism positions the mounting head 31, which has received and held the electronic component C, at a mounting position OA where the electronic component C is mounted on the board S. The board-side imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 while the board S is retracted from the mounting position OA by the board support mechanism 2. The component-side imaging unit 5 images an image of the mark M of the board S positioned at the mounting position OA by the board support mechanism 2. The positioning mechanism positions the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks m and M captured by the component-side imaging unit 5 and the board-side imaging unit 4.

[0087] Therefore, in this embodiment, the electronic component C can be picked up by the pickup collet 700 in a non-contact manner and positioned when it is handed over to the mounting head 31. Here, when the electronic component C is picked up in a non-contact manner by suction through the suction holes 701c while gas is being ejected from the porous member 701, the electronic component C is easily moved within the area surrounded by the guide portion 703. However, in this embodiment, the mounting head 31 receives the electronic component C after positioning it with respect to the misaligned electronic component C, and mounts it after returning to the reference position. Therefore, the holding position of the electronic component C by the mounting head 31 is kept constant, and it is possible to suppress time-consuming and increased errors in position recognition by imaging the mark m of the electronic component C and subsequent correction movement. In addition, it is possible to reduce positional deviations during mounting.

[0088] (2) The mounting head 31 has a transparent portion that allows the electronic component C held by the pickup collet 700 to be recognized through the transparent portion, and the component-side imaging unit 5 is disposed above the mounting head 31 so as to be able to image the outer shape of the electronic component C through the transparent portion. This allows the position where the electronic component C is transferred from the pickup collet 700 to the mounting head 31 to be approximately the same as the imaging position, thereby preventing time being taken and errors from increasing in position recognition by imaging the mark m of the electronic component C and in the subsequent correction movement.

[0089] (3) The positioning mechanism includes a board support mechanism 2 that supports the board S and moves the board S between the mounting position OA and a position retracted from the mounting position OA, and a board-side imaging unit 4 that is positioned lower than the board support mechanism 2 at the mounting position OA and images a mark m of an electronic component C held by a mounting head 31 positioned at the mounting position OA when the board S is retracted from the mounting position OA. The positioning mechanism positions the board S and the electronic component C based on the image of the mark M of the board S supported by the stage 21 positioned at the mounting position OA captured by the component-side imaging unit 5 and the positions of the board S and the electronic component C determined from the image of the mark m of the electronic component C captured by the board-side imaging unit 4.

[0090] According to this embodiment, the electronic component C held by the mounting head 31 is imaged by the board-side imaging unit 4 arranged below the board support mechanism 2 at the mounting position OA, with the board S retracted from the mounting position OA, and the board S supported by the board support mechanism 2 is imaged through the transparent portion of the mounting head 31 by the component-side imaging unit 5 arranged above the mounting head 31 at the mounting position OA, so that it is possible to image the mark m of the electronic component C and the mark M of the board S with the electronic component C and the board S as close together as possible.

[0091] Therefore, the movement amount of the electronic component C (mounting head 31) and the board S (board support mechanism 2) when capturing the marks m and M, and the relative movement amount of the electronic component C (mounting head 31) and the board S (board support mechanism 2) after capturing the marks m and M can be shortened as much as possible. Therefore, the increase in error caused by moving the mounting head 31 and the board support mechanism 2 over a long distance can be suppressed. In addition, the longer the movement distance of the mechanism, the more dust is generated. However, in this embodiment, the movement distance can be suppressed, so that it is possible to prevent the cleanliness from decreasing due to dust and the occurrence of poor bonding. Furthermore, as described above, by holding the electronic component C in a non-contact manner, it is possible to reduce the positional deviation from the holding position (suction area D) when the mounting head 31 receives the electronic component C from the pickup collet 700, where the electronic component C is likely to move. Therefore, when capturing the mark m by the board-side imaging unit 4, the amount of deviation can be reduced in advance, and it is possible to suppress the time required for position recognition by capturing the mark m of the electronic component C and the increase in error in the subsequent correction movement.

[0092] In this embodiment, after the images of the marks m and M are captured, the moving distance of the electronic component C and the board S can be reduced, so that positional deviation, reduction in productivity, and amount of dust generation can all be reduced.

[0093] (4) The transmission section has a transparent plate-like member. This allows the transmission section to capture an image of the external shape of the electronic component C through the transmission section, the electronic component C being held, and the mark M of the board S through the transmission section. This allows the transmission section to capture an image of the external shape of the electronic component C at a very close distance just before the electronic component C is held by the transmission section, so that the amount of deviation when the transmission section receives the electronic component C can be reduced, and the electronic component C can be delivered more reliably in accordance with the holding position (suction area D) of the mounting head 31. This allows the mounting head 31 to hold the electronic component C in a posture close to a specified posture, so that the time required for position recognition by the board-side imaging section 4 by capturing an image of the mark m of the electronic component C held by the mounting head 31 and the subsequent correction movement can be reduced.

[0094] (5) The board-side imaging unit 4 and the component-side imaging unit 5 are fixed relative to the mounting position OA. This prevents misalignment between the imaging areas of the board-side imaging unit 4 and the component-side imaging unit 5, and also prevents dust generation due to movement.

[0095] [Variations] (1) The guide portion 703 of the pickup collet 700 may be provided along the outer edge of the facing surface 701a so as to restrict the movement of the electronic component C. In other words, it is sufficient to restrict the movement of the electronic component C to such an extent that the electronic component C falls off the pickup collet 700 due to the movement or inversion of the pickup collet 700. For this reason, the guide portion 703 may be provided on the four sides of the facing surface 701a, and may be provided around the entire circumference of the facing surface 701a or on a part of each side. For example, the guide portion 703 may be disposed on either side of a corner as shown in FIG. 14(A), or may be disposed continuously along a corner as shown in FIG. 14(B). Note that, as shown in FIG. 14(B), one orthogonal guide portion 703 and the other orthogonal guide portion 703 may be continuous.

[0096] (2) The number and size of the suction holes 701c and the openings 701d are not limited to the above. On the opposing surface 701a of the porous member 701, the suction-holding state and the non-contact state can be maintained by balancing the area of ​​the electronic component C supported by the gas layer and the total area of ​​the openings 701d.

[0097] (3) The positions and shapes of the suction holes 701c and the openings 701d are not limited to the above. For example, the shape of the openings 701d may be a circle, a rectangle, or other shapes such as an ellipse, a polygon, a polygon with rounded corners, or a star.

[0098] (4) By making the pickup collet 700 replaceable, it can be replaced depending on the shape and size of the electronic component C. A simple structure for making it replaceable is one that can be attracted and held by a magnet, which also makes the replacement process easy. However, any structure that allows the pickup collet 700 to be replaceable will suffice. For example, it may be one that can be attracted and held by using negative pressure, or it may be one that can be held mechanically.

[0099] (5) The supply unit 6 is not limited to a device that supplies electronic components C attached to a wafer sheet WS. For example, the supply unit 6 may be a device that supplies electronic components C arranged on a tray. The transfer mechanism 73 may be configured to pick up and transfer electronic components C individually from the supply unit 6. For this reason, the arm unit 72 may be configured to move in the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

[0100] (6) In the transfer mechanism 73, the driving unit that drives the arm unit 72 is not limited to a mechanism using a linear motor as a driving source. It may be a mechanism using a ball screw or a belt using a motor with a rotating shaft as a driving source. In the case of such a mechanism, since the sliding unit SL is included, it is preferable to provide the sliding unit SL at a position that does not overlap with the mounting surface F in a planar view. Furthermore, it is preferable to provide the sliding unit SL at a position lower than the height position of the mounting surface F. Note that, when there are multiple sliding units SL, some of the sliding units SL may not be provided at a position that does not overlap with the mounting surface F in a planar view. Also, some of the sliding units SL may not be provided at a position that does not overlap with the mounting surface F. In such a case, it is preferable to provide a shield such as an exterior, a wall, or another component between the sliding unit SL and the mounting surface F. It is also preferable to increase the distance between the sliding unit SL and the mounting surface F.

[0101] (7) The mounting head 31 may be configured such that the component-side imaging unit 5 can image the outer shape of the electronic component C and the mark M of the board S. Therefore, even if the transparent portion of the mounting head 31 is not made of a transparent material, a through hole may be formed at a location corresponding to the outer shape of the electronic component C or the mark M. More specifically, the holding portion 31b may be made of an opaque material and a through hole may be formed at a location corresponding to the outer shape of the electronic component C or the mark M, or the hollow portion 31a may not exist and the holding portion 31b may be made of an opaque material and a through hole may be formed at a location of the mounting head 31 and the holding portion 31b corresponding to the outer shape of the electronic component C or the mark M. In other words, such a through hole is also a transparent portion of the mounting head 31. When the outer shape of the electronic component C is imaged, a part of the outer shape of the electronic component C is imaged. Therefore, it is preferable that the two adjacent sides of the electronic component C can be imaged. In this case, the part to be imaged may be a corner of the electronic component C. The posture (position and inclination in the horizontal plane) of electronic component C can be recognized by an image that includes two adjacent sides.

[0102] (8) The board-side imaging unit 4 and the component-side imaging unit 5 may be provided so as to be movable relative to the position (mounting position OA) where the electronic component C is mounted. In other words, when it is not possible to simultaneously image the marks m of the electronic component C or the marks M of the board S, the board-side imaging unit 4 and the component-side imaging unit 5 may be configured to move between the marks m or between the marks M to image them. In other words, the board-side imaging unit 4 may be provided with a moving device for moving between the marks m, and the component-side imaging unit 5 may be provided with a moving device for moving between the marks M. Even in this case, the moving distance is short and remains within the range of the size of the mounting area B of the electronic component C or the board S, so that errors and dust generation can be suppressed. Since the imaging magnification can be selected according to the required mounting accuracy, the position recognition accuracy can be improved.

[0103] (9) In the above embodiment, the position of the mark m of the electronic component C and the position of the mark M in the mounting area B of the substrate S are aligned to the reference position (mounting position OA), but this is not limited thereto, and the position of the mounting area B may be aligned to the position of the electronic component C, or the position of the electronic component C may be aligned to the position of the mounting area B. In short, it is sufficient to be able to align the position of the mounting area B of the substrate S with the position of the electronic component C. When aligning the substrate S with the electronic component C without moving the stage 21 by a correction amount for alignment, there is no need to move the relatively large and heavy stage 21 for aligning each mounting area B, so that it is possible to further improve mounting accuracy while shortening the time required for position correction.

[0104] (10) The transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S may be retracted from the mounting position OA before the substrate side imaging unit 4 captures an image of the mark m of the electronic component C.

[0105] [Other embodiments] Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims. [Explanation of symbols]

[0106] 1 Mounting equipment 2 Board support mechanism 3. Mounting mechanism 4. Board side imaging section 5. Part side imaging section 6 Supply section 7 Transfer device 8 Control device 11 Support stand 11a Receiving hole 21 Stage 22 Drive mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b Guide rails 23 Moving Board 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 32 Drive mechanism 33, 34, 35 Mobile 61 Support mechanism 61a Ring holder 62 Drive mechanism 71 Transfer Head 73 Transfer mechanism 71a Suction nozzle 71b Reverse drive unit 72 Arm section 72a Extension 72b Base part 73 Transfer mechanism 700 Pickup Collet 701 Porous materials 701a Opposite side 701b back 701c Suction hole 701d aperture 702 Base 702a Air supply hole 702b Exhaust hole 702c mounting hole 703 Guide part 704 Detachable part 704a Pin 731 Fixed body 732 First Drive 732a First driving source 732b First sliding part 733 Mobile 734 Second Drive 734a Secondary driving source 734b Second sliding part

Claims

1. a mounting head that mounts electronic components on a board at a mounting position; a pickup collet including a porous member that holds electronic components in a non-contact manner by negative pressure of suction holes while blowing gas from pores, and a guide portion that restricts movement of the held electronic components, the pickup collet picking up the electronic components from a supply portion that supplies the electronic components, and delivering the electronic components to the mounting head; A reversing drive unit that reverses the pickup collet from a pickup position; a transfer mechanism that transfers the pickup collet between the supply unit and the mounting head; a component side imaging unit that images an external shape of the electronic component held by the inverted pickup collet; a positioning mechanism that positions the mounting head to the electronic component held by the pickup collet based on an outer shape of the electronic component imaged by the component-side imaging unit, and positions the mounting head at the mounting position after the electronic component is transferred from the pickup collet to the mounting head; 1. An electronic component transfer device comprising:

2. a substrate support mechanism that supports the substrate and moves the substrate between the mounting position and a position retracted from the mounting position; a board-side imaging unit that is disposed below the board support mechanism at the mounting position and that images a mark of the electronic component that is held by the mounting head and positioned at the mounting position when the board is retracted from the mounting position by the board support mechanism; a control device that controls the component side imaging unit, the positioning mechanism, the board support mechanism, and the board side imaging unit; having The control device includes: causing the component-side imaging unit to image, at the mounting position, a mark of the board positioned at the mounting position in a state in which the board is positioned at the mounting position by the board support mechanism; 2. The electronic component transfer device according to claim 1, characterized in that the positioning mechanism positions the board and the electronic component based on positions of the board and the electronic component determined from an image of a mark of the board positioned at the mounting position captured by the component-side imaging unit and an image of the mark of the electronic component captured by the board-side imaging unit.

3. the mounting head has a transparent portion that allows the electronic component held by the pickup collet to be recognized through a transparent portion, 3. The electronic component transfer device according to claim 1, wherein the component-side imaging section is disposed above the mounting head so as to be able to image the external shape of the electronic component through the transmission section.

4. A transfer device according to any one of claims 1 to 3, an electronic component mounting apparatus comprising: a mounting mechanism for mounting the electronic component positioned by the positioning mechanism onto the board at the mounting position;

5. In a mounting method for positioning and mounting electronic components on a substrate, a pickup collet having a porous member that holds the electronic component in a non-contact manner by negative pressure of suction holes while blowing gas from pores, and a guide portion that restricts movement of the held electronic component, picks up the electronic component from the electronic component supply portion; a reversal drive unit reversing the pickup collet that has picked up the electronic component; a transport mechanism transports the pickup collet that has picked up the electronic component to a mounting head that mounts the electronic component on a substrate; a component-side imaging unit imaging an outer shape of the electronic component held by the inverted pickup collet; a positioning mechanism for positioning the mounting head relative to the electronic component held by the pickup collet based on an outer shape of the electronic component imaged by the component-side imaging unit; the electronic component is transferred from the pickup collet to the mounting head by a relative movement between the pickup collet and the mounting head; the positioning mechanism positions the mounting head, which has received and held the electronic component, at a mounting position where the electronic component is mounted on the substrate; a board-side imaging unit images a mark of the electronic component held by the mounting head in a state in which the board is retracted from the mounting position by a board support mechanism; the component-side imaging unit captures an image of a mark on the board positioned at the mounting position by the board support mechanism; the positioning mechanism performs positioning of the board and the electronic component based on positions of the board and the electronic component determined from images of marks captured by the component-side imaging unit and the board-side imaging unit.

1. A method for mounting electronic components comprising the steps of:

Images