Grinding device

Abstract

To provide a grinding device that can reduce consumptions of grinding fluid while suppressing poor processing from occurring.SOLUTION: A grinding device, which grinds a work-piece, comprises: a chuck table having a holding surface for holding the work-piece; a grinding unit having a spindle to a tip part of which a grinding wheel including a grinding stone is attached; a moving mechanism that moves the chuck table and grinding unit relatively along a direction perpendicular to a rotary shaft of the spindle; a grinding fluid supply unit that supplies grinding fluid to a processing area where the work-piece contacts the grinding stone, from the outside of the grinding wheel; and a fluid supply unit that supplies fluid for blocking scattering of the grinding fluid contacting the rotating grinding wheel.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a grinding apparatus for grinding a workpiece.

Background Art

[0002] In the manufacturing process of device chips, a wafer in which devices are formed in a plurality of regions partitioned by a plurality of streets (lines to be divided) intersecting each other is used. By dividing this wafer along the streets, a plurality of device chips each having a device can be obtained. The device chips are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] In recent years, with the miniaturization of electronic devices, there has been a demand for thinning of device chips. Therefore, a process of grinding and thinning the wafer before division may be performed using a grinding apparatus. The grinding apparatus includes a chuck table including a holding surface for holding a workpiece, and a grinding unit for grinding the workpiece. The grinding unit includes a spindle, and a grinding wheel including a plurality of grinding wheels is mounted on the tip of the spindle.

[0004] When grinding a workpiece such as a wafer using a grinding apparatus, the positional relationship between the chuck table and the grinding unit is adjusted so that the center of the workpiece held by the chuck table overlaps the orbit of the grinding wheel. Then, while rotating the chuck table and the grinding wheel respectively, the grinding wheel is lowered along the machining feed direction (vertical direction) parallel to the rotation axis of the spindle. As a result, the lower surface of the grinding wheel contacts the upper surface side of the workpiece, and the workpiece is ground. Such a grinding method is called infeed grinding.

[0005] On the other hand, a grinding method called creep feed grinding may be used for grinding the workpiece. In creep feed grinding, the positional relationship between the chuck table and the grinding unit is adjusted so that the grinding wheel is positioned outside the workpiece and the lower surface of the grinding wheel is positioned below the upper surface of the workpiece. Then, while rotating the grinding wheel, the chuck table is moved along the machining feed direction (horizontal direction) perpendicular to the rotation axis of the spindle. As a result, the side surface of the grinding wheel comes into contact with the upper surface side of the workpiece, and the workpiece is ground (see Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] When grinding a workpiece with a grinding apparatus, a liquid (grinding fluid) such as pure water is supplied to the region (machining region) where the workpiece and the grinding wheel come into contact. For example, in creep feed grinding, since the side surface of the grinding wheel facing the outside of the grinding wheel comes into contact with the workpiece, the grinding fluid is supplied from the outside of the grinding wheel toward the machining region. As a result, the workpiece and the grinding wheel are cooled, and the chips (machining chips) generated by the grinding process are washed away.

[0008] However, during the grinding of the workpiece, the grinding wheel rotates at a high speed, and the grinding fluid in contact with the grinding wheel is repelled toward the outside of the grinding wheel. Therefore, most of the grinding fluid supplied toward the machining region scatters before reaching the machining region. As a result, there is a shortage of the grinding fluid that contributes to the cooling of the workpiece and the grinding wheel and the removal of the machining chips, and machining defects are likely to occur. On the other hand, if the supply amount of the grinding fluid is set so that sufficient grinding fluid is supplied to the machining region even when the grinding fluid scatters, a large amount of grinding fluid is consumed in the grinding process, and the cost increases.

[0009] The present invention has been made in view of such problems, and an object thereof is to provide a grinding apparatus capable of reducing the consumption amount of grinding fluid while suppressing the occurrence of defective processing.

Means for Solving the Problems

[0010] According to one aspect of the present invention, there is provided a grinding apparatus for grinding a workpiece, including a chuck table having a holding surface for holding the workpiece, a grinding unit having a spindle to which a grinding wheel including a grinding stone is attached at a tip portion, a moving mechanism for relatively moving the chuck table and the grinding unit along a direction perpendicular to the rotation axis of the spindle, and a grinding fluid supply unit for supplying grinding fluid from the outside of the grinding wheel to a processing region where the workpiece and the grinding stone come into contact. flow through a plurality of strip-shaped regions located outside the grinding wheel and intersecting the holding surface Blocking the scattering of the grinding fluid in contact with the rotating grinding wheel First Supplying a fluid First A fluid supply unit, a second fluid supply unit that supplies a second fluid for capturing the grinding fluid that has come into contact with the rotating grinding wheel and passed between the plurality of regions A grinding apparatus including the above is provided.

[0011] Preferably, The second fluid supply unit is disposed below the grinding fluid supply unit and in front of the first fluid supply unit . Further preferably, the plurality of regions are arranged along the outer peripheral edge of the grinding wheel so as to be separated from each other.

[0012] Further preferably, the First fluid supply unit supplies gas as the First fluid. Further preferably, the First fluid supply unit supplies liquid as the First fluid. Further preferably, the liquid is the same liquid as the grinding fluid. Also, preferably, the grinding apparatus can thin the workpiece by grinding the workpiece held by the holding surface from one end side to the other end side with the grinding wheel

Effects of the Invention

[0013] In a grinding apparatus according to an aspect of the present invention, grinding fluid that is bounced off by contacting a rotating grinding wheel is captured by the fluid supplied from a fluid supply unit. As a result, the grinding fluid is likely to stay on the workpiece without scattering outside the workpiece. As a result, the grinding fluid is efficiently supplied to the machining area, the occurrence of machining defects is suppressed, and the consumption amount of the grinding fluid is reduced.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments according to an aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of the grinding apparatus according to the present embodiment will be described. FIG. 1 is a perspective view showing a grinding apparatus 2. In FIG. 1, the X-axis direction (machining feed direction, first horizontal direction, front-rear direction) and the Y-axis direction (second horizontal direction, left-right direction) are perpendicular to each other. The Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0016] The grinding device 2 includes a base 4 that supports or houses each component that constitutes the grinding device 2. On the upper surface side of the base 4, a rectangular parallelepiped-shaped opening 4a is provided such that its longitudinal direction is along the X-axis direction. Further, at the rear end portion on the upper surface side of the base 4, a rectangular parallelepiped-shaped support structure 6 is provided along the Z-axis direction.

[0017] Inside the opening 4a, a chuck table (holding table) 8 for holding a workpiece, which is an object to be processed by the grinding device 2, is provided. The upper surface of the chuck table 8 is a flat surface that is generally parallel to the horizontal plane (XY plane), and constitutes a holding surface 8a for holding the workpiece. Further, a moving mechanism (moving unit) 10 for moving the chuck table 8 along the machining feed direction (X-axis direction) is connected to the chuck table 8.

[0018] FIG. 2 is a partial cross-sectional side view showing the grinding device 2. Note that in FIG. 2, illustration of some components of the grinding device 2 is omitted. As shown in FIG. 2, the moving mechanism 10 is provided inside the opening 4a of the base 4.

[0019] The moving mechanism 10 includes a flat moving plate 12 that supports the chuck table 8. A nut portion 14 is provided on the back surface side (lower surface side) of the moving plate 12. A ball screw 16 arranged along the X-axis direction is screwed into the nut portion 14. Further, a pulse motor 18 for rotating the ball screw 16 is connected to an end portion of the ball screw 16. And the chuck table 8 is mounted on the front surface side (upper surface side) of the moving plate 12. When the ball screw 16 is rotated by the pulse motor 18, the chuck table 8 and the moving plate 12 move along the X-axis direction.

[0020] Further, a rotation drive source such as a motor (not shown) for rotating the chuck table 8 around a rotation axis (a rotation axis generally parallel to the Z-axis direction) that is generally perpendicular to the holding surface 8a is connected to the chuck table 8. That is, the rotation axis of the chuck table 8 is set along a direction perpendicular to the holding surface 8a.

[0021] As shown in FIG. 1, a table cover 20 surrounding the chuck table 8 is provided around the chuck table 8. Further, bellows-shaped dust and splash covers 22 that can expand and contract along the X-axis direction are provided in front of and behind the table cover 20. The table cover 20 and the dust and splash covers 22 cover the components of the moving mechanism 10 provided inside the opening 4a.

[0022] A moving mechanism (moving unit) 24 is provided on the front side of the support structure 6. The moving mechanism 24 includes a pair of guide rails 26 arranged along the Z-axis direction. A flat plate-shaped moving plate 28 is slidably mounted on the pair of guide rails 26 along the guide rails 26.

[0023] A nut portion (not shown) is provided on the back surface side (rear surface side) of the moving plate 28. A ball screw 30 arranged along the Z-axis direction is screwed into the nut portion between the pair of guide rails 26. Further, a pulse motor 32 for rotating the ball screw 30 is connected to an end portion of the ball screw 30. When the ball screw 30 is rotated by the pulse motor 32, the moving plate 28 moves (moves up and down) in the Z-axis direction along the guide rails 26.

[0024] A support member 34 protruding forward from the surface (front surface) of the moving plate 28 is fixed to the moving plate 28. The support member 34 supports a grinding unit 36 that performs grinding on the workpiece 11. The grinding unit 36 includes a columnar housing 38 supported by the support member 34. A columnar spindle 40 arranged along the Z-axis direction is accommodated in the housing 38.

[0025] The tip end portion (lower end portion) of the spindle 40 protrudes downward from the lower surface of the housing 38. A disk-shaped mount 42 made of metal or the like is fixed to the tip end portion of the spindle 40. A rotary drive source (not shown) such as a motor for rotating the spindle 40 is connected to the base end portion (upper end portion) of the spindle 40.

[0026] On the lower surface side of the mount 42, an annular grinding wheel 44 for grinding the workpiece 11 is mounted. For example, the grinding wheel 44 is fixed to the mount 42 by a fixture (not shown) such as a bolt. Thereby, the grinding wheel 44 is mounted on the tip of the spindle 40 via the mount 42.

[0027] The grinding wheel 44 includes an annular wheel base 46 and a plurality of grinding wheels 48 fixed to the wheel base 46. The wheel base 46 is made of a metal such as stainless steel or aluminum, or a resin, and is formed to have approximately the same diameter as the mount 42. And on the lower surface side of the wheel base 46, a plurality of grinding wheels 48 formed in a rectangular parallelepiped shape, for example, are arranged at substantially equal intervals along the outer peripheral edge of the wheel base 46.

[0028] The grinding wheel 48 includes abrasive grains made of diamond, cBN (cubic Boron Nitride), etc., and a binder (bonding material) for fixing the abrasive grains. As the binder, a metal bond, a resin bond, a vitrified bond, etc. can be used. However, there are no restrictions on the material, shape, structure, size, etc. of the grinding wheel 48, and the number of grinding wheels 48 fixed to the wheel base 46 can also be arbitrarily set.

[0029] The grinding wheel 44 rotates around a rotation axis substantially parallel to the Z-axis direction by the power transmitted from the rotation drive source via the spindle 40 and the mount 42. That is, the rotation axis of the grinding wheel 44 is set along a direction parallel to the rotation axis of the spindle 40.

[0030] In front of the grinding unit 36, a columnar grinding fluid supply unit 50 for supplying a liquid (grinding fluid) such as pure water to the grinding unit 36 is provided. The grinding fluid supply unit 50 is arranged above the opening 4a of the base 4 so as to overlap the movement path of the chuck table 8. For example, the grinding fluid supply unit 50 is composed of a pipe, a tube, etc. whose length is equal to or greater than the diameter of the holding surface 8a of the chuck table 8, and is arranged along the width direction (Y-axis direction) of the opening 4a.

[0031] The grinding fluid supply unit 50 is connected to a liquid supply source 52 via a valve (not shown) or the like. The liquid supply source 52 is, for example, factory equipment (liquid supply equipment) installed in the factory where the grinding apparatus 2 is installed, and supplies a liquid such as pure water used as the grinding fluid to the grinding fluid supply unit 50.

[0032] In front of the grinding unit 36, a fluid supply unit 54 that supplies a fluid for blocking the scattering of the grinding fluid in contact with the rotating grinding wheel 44 is provided. The fluid supply unit 54 is disposed above the opening 4a of the base 4 so as to overlap the movement path of the chuck table 8.

[0033] Note that the fluid supply unit 54 is positioned between the grinding wheel 44 and the grinding fluid supply unit 50 in a plan view. For example, the fluid supply unit 54 is constituted by a pipe, a tube, or the like, and is installed so as to be slightly separated from the front end portion of the grinding wheel 44. FIG. 1 shows, as an example, a fluid supply unit 54 that curves along the outer peripheral edge of the front end portion of the grinding wheel 44.

[0034] The fluid supply unit 54 is connected to a fluid supply source 56 via a valve (not shown) or the like. The fluid supply source 56 is, for example, factory equipment (fluid supply equipment) installed in the factory where the grinding apparatus 2 is installed, and supplies a liquid such as pure water and a gas such as air to the fluid supply unit 54. Note that the fluid supply unit 54 may be connected to the liquid supply source 52. In this case, a liquid such as pure water that can be used as the grinding fluid is supplied from the liquid supply source 52 to the fluid supply unit 54.

[0035] There is no limitation on the installation method of the grinding fluid supply unit 50 and the fluid supply unit 54. For example, the grinding fluid supply unit 50 and the fluid supply unit 54 are fixed to the upper surface of the base 4 or the grinding unit 36 via a predetermined connecting member (not shown). Details of the grinding fluid supply unit 50 and the fluid supply unit 54 will be described later.

[0036] Further, the grinding device 2 includes a control unit (control section, control device) 58 connected to each component of the grinding device 2 (chuck table 8, moving mechanism 10, moving mechanism 24, grinding unit 36, grinding fluid supply unit 50, fluid supply unit 54, etc.). The control unit 58 generates a control signal for controlling the operation of the components of the grinding device 2.

[0037] For example, the control unit 58 is constituted by a computer and includes an arithmetic unit that performs operations for operating the grinding device 2 and a storage unit that stores various types of information (data, programs, etc.) used for operating the grinding device 2. The arithmetic unit is configured to include a processor such as a CPU (Central Processing Unit). Further, the storage unit is configured to include memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0038] Next, a specific example of a method for grinding a workpiece using the grinding device 2 will be described. Hereinafter, as an example, creep feed grinding will be described in which the chuck table 8 and the grinding wheel 44 are relatively moved along a direction (X-axis direction) perpendicular to the rotation axis of the spindle 40 to machine the workpiece.

[0039] First, the workpiece 11 is held by the chuck table 8 (holding step). FIG. 3(A) is a side view showing the chuck table 8 and the grinding unit 36 in the holding step.

[0040] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as silicon, and includes surfaces (first surface) 11a and a back surface (second surface) 11b that are generally parallel to each other. The workpiece 11 is partitioned into a plurality of rectangular regions by a plurality of streets (division planned lines) arranged in a grid pattern so as to intersect each other. Further, on the surface 11a side of the plurality of regions partitioned by the streets, devices (not shown) such as IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) devices are formed respectively.

[0041] By dividing the workpiece 11 along the streets by cutting, laser processing, or the like, a plurality of device chips each including a device are manufactured. Further, if the workpiece 11 is ground and thinned by the grinding device 2 before dividing the workpiece 11, thinned device chips can be obtained.

[0042] However, there are no restrictions on the type, material, size, shape, structure, etc. of the workpiece 11. For example, the workpiece 11 may be a disk-shaped wafer (substrate) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, or the like. Further, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the devices, and devices may not be formed on the workpiece 11.

[0043] For example, the workpiece 11 is arranged on the chuck table 8 such that the surface 11a side faces the holding surface 8a and the back surface 11b side is exposed upward. Further, the holding surface 8a of the chuck table 8 is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the chuck table 8. When the suction force (negative pressure) of the suction source is applied to the holding surface 8a, the workpiece 11 is suction-held by the chuck table 8.

[0044] Note that by attaching a protective member to the surface 11a side of the workpiece 11, a device or the like formed on the surface 11a side of the workpiece 11 may be protected. In this case, the workpiece 11 is held by the chuck table 8 via the protective member.

[0045] For example, as the protective member, a tape (protective tape) formed in a circular shape having substantially the same diameter as the workpiece 11 is used. The protective tape includes a film-like base material and an adhesive layer (paste layer) provided on the base material. The base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate. Further, the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive or the like. Note that an ultraviolet curable resin that cures by irradiation with ultraviolet rays can also be used for the adhesive layer.

[0046] Next, the workpiece 11 is ground with the grinding wheel 48 of the grinding wheel 44 (grinding step). In the grinding step, first, the workpiece 11 held by the chuck table 8 and the grinding wheel 48 are separated from each other in the machining feed direction (X-axis direction), and the lower surface of the grinding wheel 48 is positioned a predetermined distance below the upper surface (back surface 11b) of the workpiece 11. The positional relationship between the chuck table 8 and the grinding unit 36 is adjusted.

[0047] Specifically, the position of the chuck table 8 in the X-axis direction is adjusted by the moving mechanism 10 (see FIGS. 1 and 2) so that the workpiece 11 is not overlapped with the grinding wheel 44 and is disposed in front of the grinding wheel 44 (the left side of the paper surface in FIG. 3(A)). Further, the position of the grinding unit 36 in the Z-axis direction is adjusted by the moving mechanism 24 (see FIG. 1) so that the lower surface of the grinding wheel 48 is positioned below the upper surface of the workpiece 11. The difference ΔH in the height position (position in the Z-axis direction) between the upper surface of the workpiece 11 and the lower surface of the grinding wheel 48 at this time corresponds to the target value of the grinding amount of the workpiece 11 (the difference in the thickness of the workpiece 11 before and after grinding).

[0048] Next, while rotating the grinding wheel 44, the chuck table 8 and the grinding unit 36 are relatively moved along the machining feed direction (X-axis direction), and the workpiece 11 is ground from one end side to the other end side by the grinding wheel 48. Specifically, first, by rotating the spindle 40, the grinding wheel 44 is rotated around the rotation axis of the spindle 40. As a result, the plurality of grinding wheels 48 rotate along an annular orbit (moving path), respectively. Note that the rotational speed of the grinding wheel 44 is set, for example, to be 1000 rpm or more and 3000 rpm or less.

[0049] Then, with the grinding wheel 44 rotating and the chuck table 8 not rotating, the chuck table 8 is moved in the X-axis direction at a predetermined speed by the moving mechanism 10 (see FIGS. 1 and 2). As a result, the chuck table 8 and the grinding wheel 44 relatively move at a predetermined machining feed speed along the machining feed direction perpendicular to the rotation axis of the spindle 40 and approach each other. Note that the moving speed (machining feed speed) of the chuck table 8 is set, for example, to be 1 mm / s or more and 20 mm / s or less.

[0050] FIG. 3(B) is a side view showing the chuck table 8 and the grinding unit 36 in the grinding step. When the chuck table 8 moves and one end portion of the workpiece 11 (the front end portion in the moving direction of the workpiece 11, the right end portion of the paper surface in FIG. 3(B)) reaches the orbit of the grinding wheel 48, one end portion of the workpiece 11 is cut off by the grinding wheel 48. Then, as the machining feed progresses, the central portion of the workpiece 11 reaches the orbit of the grinding wheel 48 and is cut off by the grinding wheel 48.

[0051] As the machining feed further progresses, the other end portion of the workpiece 11 (the rear end portion in the moving direction of the workpiece 11, the left end portion of the paper surface in FIG. 3(B)) reaches the orbit of the grinding wheel 48 and is cut off by the grinding wheel 48. In this way, the workpiece 11 is ground from one end side to the other end side by the grinding wheel 48, and the whole of the workpiece 11 is thinned.

[0052] Then, grinding of the workpiece 11 is repeated until the thickness of the workpiece 11 reaches the target value of the final thickness (finished thickness). Note that the number of times of creep feed grinding (the number of times of grinding steps) can be appropriately set according to the material of the workpiece 11, the amount of grinding, etc.

[0053] During grinding of the workpiece 11, a grinding fluid 50a such as pure water is supplied from the grinding fluid supply unit 50 to the workpiece 11 and the grinding wheel 48. The grinding fluid supply unit 50 is provided such that its length direction is along the Y-axis direction (see FIG. 1), and includes a grinding fluid supply port (not shown) that opens toward the front end of the grinding wheel 44.

[0054] For example, the grinding fluid supply unit 50 includes a slit-shaped grinding fluid supply port formed along the length direction of the grinding fluid supply unit 50, or a plurality of circular grinding fluid supply ports arranged at predetermined intervals along the length direction of the grinding fluid supply unit 50. Then, the grinding fluid 50a supplied from the liquid supply source 52 (see FIG. 1) to the grinding fluid supply unit 50 is jetted in a band shape or a column shape from the grinding fluid supply port toward the front end of the grinding wheel 44. Thereby, the grinding fluid 50a is supplied to the region (processing region) where the workpiece 11 and the grinding wheel 48 come into contact with each other from the outside of the grinding wheel 44, the workpiece 11 and the grinding wheel 48 are cooled, and the chips (processing chips) generated by the grinding process are washed away.

[0055] Also, during grinding of the workpiece 11, a fluid 54a is supplied from the fluid supply unit 54. The fluid supply unit 54 supplies the fluid 54a that flows through a plurality of strip-shaped regions 60 located outside the grinding wheel 44 and intersecting the holding surface 8a of the chuck table 8.

[0056] For example, on the lower surface side of the fluid supply unit 54, a plurality of fluid supply ports (not shown) are provided at predetermined intervals. Then, the fluid 54a supplied from the liquid supply source 52 (see FIG. 1) or the fluid supply source 56 (see FIG. 1) to the fluid supply unit 54 is jetted in a band shape from the plurality of fluid supply ports toward the chuck table 8. Note that there is no limitation on the type of the fluid 54a, and a liquid such as pure water or a gas such as air is supplied as the fluid 54a.

[0057] FIG. 4(A) is a plan view showing the fluid 54a flowing in the band-shaped region 60. For example, the fluid 54a is supplied from the fluid supply unit 54 toward the chuck table 8 at a predetermined flow rate so as to flow in a plurality of band-shaped regions 60 extending along the direction (Z-axis direction) perpendicular to the holding surface 8a of the chuck table 8. As a result, a band-shaped wall formed by the fluid 54a is formed so as to reach from the fluid supply unit 54 to the chuck table 8 or the workpiece 11.

[0058] For example, the plurality of regions 60 are arranged at predetermined intervals along the outer peripheral edge of the front end portion of the grinding wheel 44 so as to be separated from each other. Also, each of the regions 60 is set such that its width direction (longitudinal direction in plan view) is along the radial direction of the grinding wheel 44. However, the shape, dimensions, number, and arrangement of the regions 60 can be changed as appropriate.

[0059] When the grinding fluid 50a is jetted from the grinding fluid supply unit 50, the grinding fluid 50a passes between the fluids 54a flowing in two adjacent regions 60 and proceeds toward the machining region. At this time, a part of the grinding fluid 50a contacts the grinding wheel 44 rotating at high speed and is bounced outward of the grinding wheel 44, but is received by the fluid 54a flowing in the region 60. Thereby, the grinding fluid 50a is captured and taken in by the fluid 54a, and the scattering of the grinding fluid 50a is blocked.

[0060] The grinding fluid 50a that reaches the region 60 is caught up in the fluid 54a and flows downward, and adheres to the upper surface of the workpiece 11. This makes it easier for the grinding fluid 50a that is blown off by the grinding wheel 44 to remain on the workpiece 11 without scattering outside the workpiece 11. As a result, the grinding fluid 50a is efficiently supplied to the processing region. If the same liquid as the grinding fluid 50a (pure water, etc.) is used as the fluid 54a, the grinding fluid is more easily supplied to the processing region.

[0061] The shape of the region through which the fluid 62a flows can be freely set by changing the shape of a fluid supply port provided in the fluid supply unit 54. For example, the fluid 62a may be supplied so as to flow through a columnar (cylindrical, polygonal columnar, etc.) or pyramidal (conical, polygonal pyramidal, etc.) region. The fluid 62a may also flow through a belt-like region that is curved according to the rotation direction of the grinding wheel 44.

[0062] 4(B) is a plan view showing the fluid 54a flowing in the curved band-shaped region 60A. The region 60A is a band-shaped region curved convexly in the rotation direction of the grinding wheel 44, and is formed in a semicircular arc shape in a plan view. The multiple regions 60A are arranged at predetermined intervals along the outer periphery of the front end portion of the grinding wheel 44. The fluid 54a flows through the multiple regions 60A from the fluid supply unit 54 (see FIG. 3(B)) toward the chuck table 8.

[0063] The grinding fluid 50a that comes into contact with the rotating grinding wheel 44 and is thrown away enters the inside (concave) of the curved region 60A and is received by the fluid 54a. In this way, when the region 60A is curved in the rotation direction of the grinding wheel 44, the grinding fluid 50a that is thrown away by the grinding wheel 44 is easily captured by the fluid 54a.

[0064] As described above, in the grinding apparatus 2 according to the present embodiment, the grinding fluid 50a that is bounced off by contacting the rotating grinding wheel 44 is captured by the fluid 54a supplied from the fluid supply unit 54. As a result, the grinding fluid 50a is less likely to scatter outside the workpiece 11 and is likely to stay on the workpiece 11. As a result, the grinding fluid 50a is efficiently supplied to the machining area, the occurrence of machining defects is suppressed, and the consumption amount of the grinding fluid 50a is reduced.

[0065] In the above embodiment, an example in which the scattering of the grinding fluid 50a is blocked only by the fluid 54a supplied from the fluid supply unit 54 has been described. However, the grinding apparatus 2 may include a plurality of fluid supply units that supply a fluid that blocks the scattering of the grinding fluid 50a.

[0066] FIG. 5 is a side view showing a grinding apparatus 2 including a fluid supply unit 54 (first fluid supply unit) and a fluid supply unit 62 (second fluid supply unit). The fluid supply unit 62 is provided above the opening 4a (see FIG. 1) of the base 4 so as to overlap the movement path of the chuck table 8. For example, the fluid supply unit 62 is composed of an arc-shaped pipe, a tube, etc., and is connected to the liquid supply source 52 or the fluid supply source 56 (see FIG. 1).

[0067] The fluid supply unit 62 supplies a fluid 62a (liquid or gas) toward the chuck table 8. For example, on the lower surface side of the fluid supply unit 62, a slit-shaped grinding fluid supply port (not shown) that curves along the length direction of the fluid supply unit 62 is provided, and the fluid 62a is jetted in a band shape from the grinding fluid supply port.

[0068] Note that the fluid supply unit 62 is disposed below the grinding fluid supply unit 50 and in front of the fluid supply unit 54. Therefore, the progress of the grinding fluid 50a supplied from the grinding fluid supply unit 50 and the fluid 54a supplied from the fluid supply unit 54 is not obstructed by the fluid 62a.

[0069] FIG. 6 is a plan view showing a fluid 54a flowing through a strip-shaped region 60 and a fluid 62a flowing through an arc-shaped region 64. For example, the fluid 62a is supplied from a fluid supply unit 62 toward the chuck table 8 at a predetermined flow rate so as to flow through a strip-shaped region 64 that curves convexly toward the side opposite to the grinding wheel 44. As a result, a curved strip-shaped wall formed by the fluid 62a is formed from the fluid supply unit 62 (see FIG. 5) to the chuck table 8 or the workpiece 11.

[0070] When the fluid 62a flowing through the region 64 is supplied during the grinding of the workpiece 11, the grinding fluid 50a that has bounced back toward the grinding fluid supply unit 50 without being captured by the fluid 54a after contacting the grinding wheel 44 is received by the fluid 62a. Then, the grinding fluid 50a captured by the fluid 62a is entrained by the fluid 62a and flows downward, adhering to the upper surface of the workpiece 11. As a result, the grinding fluid 50a that has been ejected from the grinding wheel 44 is more likely to remain on the workpiece 11.

[0071] In addition, the structure, method, etc. according to the above embodiment can be appropriately changed and implemented without departing from the scope of the object of the present invention.

Explanation of Reference Numerals

[0072] 11 Workpiece 11a Surface (first surface) 11b Back surface (second surface) 2 Grinding apparatus 4 Base 4a Opening 6 Support structure 8 Chuck table (holding table) 8a Holding surface 10 Moving mechanism (moving unit) 12 Moving plate 14 Nut portion 16 Ball screw 18 Pulse motor 20 Table cover 22 Dust and splash cover 24 Moving mechanism (moving unit) 26 Guide rail 28 Moving plate 30 Ball screw 32 Pulse motor 34 Support member 36 Grinding unit 38 Housing 40 Spindle 42 Mount 44 Grinding wheel 46 Wheel base 48 Grinding stone 50 Grinding fluid supply unit 50a Grinding fluid 52 Liquid supply source 54 Fluid supply unit 54a Fluid 56 Fluid supply source 58 Control unit (control section, control device) 60, 60A Area 62 Fluid supply unit 62a Fluid 64 Area

Claims

1. A grinding device for grinding a workpiece, comprising: a chuck table having a holding surface for holding the workpiece; a grinding unit having a spindle with a grinding wheel including a grinding stone attached to its tip; a moving mechanism for relatively moving the chuck table and the grinding unit in a direction perpendicular to a rotation axis of the spindle; a grinding fluid supply unit that supplies a grinding fluid from the outside of the grinding wheel to a processing area where the workpiece and the grinding stone come into contact with each other; a first fluid supply unit that supplies a first fluid that flows through a plurality of band-shaped regions that are located outside the grinding wheel and intersect with the holding surface and that prevents the grinding fluid from splashing when the grinding fluid comes into contact with the rotating grinding wheel; a second fluid supply unit that supplies a second fluid for contacting the rotating grinding wheel and capturing the grinding fluid that has passed between the multiple regions.

2. A grinding apparatus as described in claim 1, characterized in that the second fluid supply unit is arranged below the grinding fluid supply unit and in front of the first fluid supply unit.

3. 3. The grinding apparatus according to claim 1, wherein the plurality of regions are arranged along the outer circumferential edge of the grinding wheel so as to be spaced apart from one another.

4. 4. The grinding apparatus according to claim 1, wherein the first fluid supply unit supplies a gas as the first fluid.

5. 4. The grinding apparatus according to claim 1, wherein the first fluid supply unit supplies a liquid as the first fluid.

6. 6. The grinding apparatus according to claim 5, wherein the liquid is the same as the grinding fluid.

7. A grinding device as described in any one of claims 1 to 6, capable of thinning the workpiece by grinding the workpiece held on the holding surface from one end side to the other end side with the grinding wheel.

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