Recovery Support System

Abstract

To support the recovery of a substrate work device.SOLUTION: A recovery support system includes a database 30 and a data management device 20 communicably connected to the database 30. The database 20 stores past repair data 31 of a substrate work device 12. The data management device 20 causes the database 30 to search for repair data 31 based on the search conditions entered by an administrator, and presents the repair data 31 that matches the search conditions to the administrator.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] The present invention relates to a technology for assisting in the recovery of a production line stopped due to a failure.

Background Art

[0002] A production line for producing circuit boards is composed of a substrate working device such as a component mounting device. When a trouble occurs in the substrate working device and the production line stops, if the cause of the failure and the repair method are unknown, the user inquires the manufacturer of the substrate working device about the countermeasure method and performs the recovery work of the production line according to the instruction from the manufacturer.

[0003] The following Patent Document 1 discloses a technology for easily and objectively confirming the influence of the implementation of maintenance work on a manufacturing device on the operation and quality of a production line.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Even when there has been a similar trouble in the past, the administrator of the production line has been inquiring the manufacturer each time an error occurs. When the information about the trouble is insufficient, since there are multiple exchanges with the manufacturer, it takes time to recover and there are cases where production cannot be restarted easily.

Means for Solving the Problems

[0006] The recovery support system is a system for supporting the recovery of a substrate working device used for the production of circuit boards.

[0007] The recovery support system includes a database and a data management device communicably connected to the database.

[0008] The database stores past repair data of the substrate working device.

[0009] The database causes the repair data to be searched in the database based on search conditions input by an administrator, and presents the repair data that matches the search conditions to the administrator.

Advantages of the Invention

[0010] According to the present invention, since past repair data is managed in a database and the repair data is presented according to the request of the administrator, the time required for communication with the manufacturer can be reduced. Therefore, the time required for the recovery work can be shortened, contributing to the early resumption of production.

Brief Description of the Drawings

[0011]

Figure 1

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Figure 9

Figure 10

Figure 11

Modes for Carrying Out the Invention

[0012] <Embodiment 1> 1. Overall Configuration of Recovery Support System S FIG. 1 is a system configuration diagram of the recovery support system S and the production line 10. The recovery support system S is a system that supports the recovery of the production line 10, and is composed of a data management device 20 and a database 30.

[0013] The production line 10 consists of a printing machine 11, a mounting device 12, and an inspection device 13. These devices are connected by a conveyor, and the substrate P that has completed the work is sequentially conveyed from the device on the upstream side (the left side in FIG. 1) to the device on the downstream side (the right side in FIG. 1). The substrate P is an example of a "circuit board".

[0014] The printing machine 11 is a device that screen-prints solder paste onto the pattern of the substrate P. The mounting device 12 is a device that mounts the component W on the substrate P after the printing process.

[0015] The inspection device 13 is a device that inspects the mounting state of the component W on the substrate P. As a result of the inspection, if there is no abnormality in the mounting state of the component W, the substrate P proceeds to the reflow process. If there is an abnormality, the substrate P is treated as a defective substrate separately from the normal substrates. The printing machine 11, the mounting device 12, and the inspection device 13 are examples of "substrate working devices".

[0016] The data management device 20 is a so-called personal computer, and includes an input unit 21 such as a mouse and a keyboard, a display unit 22 such as a liquid crystal panel and a touch panel, and a CPU and a memory.

[0017] The database 30 is a storage device that stores repair data 31 to be described later. The database 30 has a control unit. The control unit searches, edits, adds, and deletes the repair data 31 according to a request from the data management device 20.

[0018] The database 30 is installed, for example, in a data center managed by the manufacturer that is the manufacturer of the mounting device 12.

[0019] The production line 10, the data management device 20, and the database 30 are communicably connected via a wired or wireless communication network 14, and can transmit and receive data to and from each other among the three.

[0020] In this embodiment, three production lines 10 are connected to one database 30 via the communication network 14. The three production lines 10 may be production lines managed by one administrator, or may be production lines managed by separate administrators. The number of production lines 10 connected to one database 30 may be one or more than one.

[0021] 2. Configuration of the mounting device 12 As shown in FIGS. 2 and 3, the mounting device 12 includes a base 40, four component supply devices 41, a conveyor 42, a head unit 43, an X beam 51, a Y beam 52, a head moving unit 44, a substrate camera 45, two component cameras 46, a side camera 47, etc.

[0022] The substrate P is conveyed from the upstream side (the left side in FIG. 2) by the conveyor 42, and is conveyed to the downstream side (the right side in FIG. 2) when the mounting of the component W is completed at the working position 48.

[0023] A plurality of feeders 49 are attached to the component supply device 41. Each feeder 49 supplies the component W to be mounted on the substrate P.

[0024] The head unit 43 supports a plurality of mounting heads 50 so as to be movable up and down and rotatable around an axis.

[0025] The X beam 51 supports the head unit 43 so as to be reciprocally movable in the X-axis direction. The Y beam 52 supports the X beam 51 so as to be reciprocally movable in the Y-axis direction.

[0026] The head moving unit 44 includes an X-axis motor 44X that moves the head unit 43 in the X-axis direction with respect to the X beam 51, and a Y-axis motor 44Y that moves the X beam 51 in the Y direction with respect to the Y beam 52.

[0027] The head unit 43 can move to any position on the base 40 by driving the X-axis motor 44X and the Y-axis motor 44Y.

[0028] As shown in FIG. 3, the mounting head 50 includes a shaft-shaped head shaft 55 and a suction nozzle 56. The head shaft 55 has a hollow shape, and an air supply path is provided in the axial center portion. The suction nozzle 56 is detachably attached to the tip (lower end) of the head shaft 55.

[0029] Negative pressure or positive pressure is supplied to the suction nozzle 56 from an air supply device (not shown) via the head shaft 55. The mounting head 50 sucks the component W using the suction nozzle 56 by supplying negative pressure, and releases the sucked component W by supplying positive pressure.

[0030] The substrate camera 45 is attached to the side surface of the head unit 43, and has an imaging element such as an image sensor, illumination such as an LED, and an optical system that forms an image of the light reflected by the imaging object on the light receiving surface of the imaging element. The component camera 46 and the side camera 47 have the same configuration.

[0031] The substrate camera 45 has its imaging surface facing downward and photographs the substrate P from above. The position of the substrate P and the position of the land where the component W is to be mounted can be confirmed by the substrate camera 45.

[0032] The component camera 46 photographs the component W adsorbed by the mounting head 50 from below. The side camera 47 photographs the component W adsorbed by the mounting head 50 from the side. The adsorption state (adsorption position, adsorption angle, and success or failure of adsorption) of the component W adsorbed by the mounting head 50 can be confirmed by the component camera 46 and the side camera 47.

[0033] FIG. 4 is a block diagram showing the electrical configuration of the mounting apparatus 12. The controller 60 is the control device of the mounting apparatus 12. The controller 60 has a CPU 61 and a memory 63.

[0034] The controller 60 is connected to various devices such as the conveyor 42, the motor control unit 65, the board camera 45, the component camera 46, the side camera 47, and the operation panel 64.

[0035] The memory 63 stores a mounting program for executing the mounting operation of the component W on the board P and a conveyance program for the board P.

[0036] After the start of production of the board P, the controller 60 controls the conveyor 42 and the head unit 43 according to the conveyance program and the mounting program. The conveyor 42 sends the board P to the working position 48 at the center of the base, and the head unit 43 performs the mounting operation of the component W on the board P. Note that production means manufacturing a board P with components mounted thereon by mounting the component W on the board P on which no components are mounted.

[0037] When an error occurs during the mounting operation of the component W and the mounting apparatus 12 stops, the controller 60 collects information regarding the state of the mounting apparatus 12 at the time of the error from the motor control unit 65, the cameras 45 to 47, and the conveyor 42. The collected information is stored in the memory 63 as an error log to be described later.

[0038] 3. Explanation of the repair data 31 The repair data 31 is data in which the contents and results of past repairs are recorded. When the manufacturer's repair personnel repair the mounting apparatus 12, they record the contents and results of the repairs performed as new repair data 31 in the database 30. The recording of the repair data 31 is not limited to the manufacturer's repair personnel and may also be performed by the administrator of the mounting apparatus 12 using the input unit 21 of the data management apparatus 20. For example, when the administrator performs the repair work without requesting the manufacturer for repair, the administrator may record the repair data 31 in the database 30.

[0039] FIG. 5 shows the repair data 31 in the case where a machine crash (an error in which structures collide with each other and are damaged inside the mounting apparatus) has occurred among the repair data 31 recorded in the database 30.

[0040] The repair data 31 is divided into three items: error information 32, repair work information 33, and post-recovery production information 34.

[0041] The error information 32 is information regarding the errors that occurred in the mounting device 12. The error information 32 is information included in the error log or information based on the results of the administrator's investigation of the damaged state of the mounting device 12. The error log is data recorded by the mounting device 12 itself regarding the state of the mounting device 12 at the time when an error occurred. The error log includes, in addition to the model of the mounting device 12, the timing of the error occurrence (such as at machine startup, setup, production, etc.), the error No., the stop position information of the X-axis and Y-axis in the head movement unit 44, the log information of the current and voltage of the motors 44X and 44Y, the stop position information of the head shaft 55, and the like.

[0042] The error No. is a number that corresponds one-to-one to the type of error that occurred.

[0043] The error information 32 includes information on the model of the mounting device 12, the occurrence timing, the error No., and the location of the failure.

[0044] The repair work information 33 is information regarding the specific repair work actually performed on the mounting device 12 after the occurrence of an error. The repair work information 33 includes information such as the repair type 33A and the required time 33B.

[0045] The repair type 33A is a type divided based on the repair form. The repair forms include a first repair form and a second repair form.

[0046] The first repair form is a form in which the administrator of the production line 10 requests the manufacturer to perform repairs. In the first repair form, according to the repair manual or the like, all the failed parts and damaged parts are replaced with new parts (hereinafter referred to as manufacturer repair). Manufacturer repair is usually a complete repair that completely repairs the mounting device 12. After the manufacturer repair, the mounting device 12 can resume production at its maximum production capacity.

[0047] The second repair mode is a mode in which the administrator of the production line 10 repairs it himself / herself without requesting the manufacturer for repair. In the second repair mode, there are cases where all the failed parts and damaged parts are replaced with new parts, and cases where only some of them are replaced and emergency measures are taken, and a complete repair and a provisional repair can be selected (hereinafter referred to as user repair).

[0048] Provisional repair refers to a repair that, when some of the components constituting the mounting device 12 become unusable due to a failure or the like, partially restricts the function of the mounting device 12 so that the substrate P can be produced without using the failed components. For example, when some of a plurality of shafts (head shafts 55) are damaged, changing the program so as not to use the damaged shafts and only use the undamaged shafts is included in the provisional repair. Also, when some of a plurality of nozzles (suction nozzles 56) are damaged, changing the program so as not to use the damaged nozzles and the shafts to which the damaged nozzles are attached and only use the undamaged nozzles is also included in the provisional repair. Although the production capacity is restricted by the provisional repair, production can be restarted earlier compared to a complete repair.

[0049] The required time 33B is the time required from the start of preparation for the repair work until the repair work is completed and the production line 10 can resume production. The required time 33B is the sum of the time required for preparation until the work starts ("work preparation" in FIG. 5) and the time taken for the actual repair work ("work time" in FIG. 5).

[0050] Data No. 001 in FIG. 5 is repair data 31 when a shaft bend occurs due to a machine crash and the repair work performed is the replacement of the shaft. When replacing the shaft, it is necessary to prepare a new shaft before starting the repair work. If the delivery time of the shaft is 7 days and the shaft replacement work takes 1 day, the required time 33B is 7 days + 1 day = 8 days. Note that the shaft replacement is a manufacturer repair performed by the manufacturer's repair staff.

[0051] In user repair, before starting the repair work, it is necessary for the administrator to check the damage status. For example, in the case of data No. 002, a detailed check of the damage status takes 4 hours, the repair work takes 6 hours, and the total time required 33B is 4 hours + 6 hours = 10 hours.

[0052] The post-recovery production information 34 is information regarding the production capacity of the recovered mounting device 12. The post-recovery production information 34 includes information such as the "recovery rate 34A".

[0053] The recovery rate 34A is a numerical value representing the ratio of the production capacity after repair to the production capacity in the normal state. When manufacturer repair (complete repair) is performed, the recovery rate 34A is 100%.

[0054] The recovery rate 34A is calculated based on the production performance data (cycle time and number of mounted components per unit time) obtained by actually operating the mounting device 12 after the repair of the mounting device 12 is completed and the production line 10 is restarted. For example, if the measured value of the number of component mounts of the mounting device 12 before the failure is at most 10,000 per hour, and the measured value of the number of component mounts after user repair is at most 8,000 per hour, the recovery rate 34A after user repair is 80%.

[0055] The recovery rate 34A can be estimated not only from the production performance but also from the mounting status of the components. For example, when the number of shafts used in production decreases from 5 to 3 before and after the repair, the recovery rate 34A can be estimated as 3 / 5, that is, 60%.

[0056] Data Nos. 001 to 003 in FIG. 5 are repair data 31 when dealing with the same error by repairs with different contents. Even when dealing with the same error, depending on the content of the repair work, the required time 33B and the recovery rate 34A differ significantly. The required times 33B for Data Nos. 001 to 003 are 8 days, 10 hours, and 1 hour respectively. Also, the recovery rates 34A for Data Nos. 001 to 003 are 100%, 60%, and 30% respectively. The higher the recovery rate 34A of the repair work, the longer the required time 33B until resumption of production tends to be, and the two are in a trade-off relationship.

[0057] 4. Regarding the search of the database When the administrator inputs search conditions into the data management device 20, the data management device 20 sends the search conditions to the database 30 to request a search. The database 30 executes a search with the received search conditions and sends the search results to the data management device 20. The data management device 20 presents the search results to the administrator.

[0058] The individual search keys constituting the search conditions are as follows (A) to (F). Among the six search keys (A) to (F), the three search keys from (A) to (C) are keys essential for executing the search, and the administrator needs to input all three. On the other hand, the three search keys from (D) to (F) are optional inputs, and the administrator only needs to input at least one key. The search keys not input by the administrator are not included in the search conditions.

[0059] (A) Model of the mounting device (B) Occurrence timing (C) Error No. (D) Repair type (E) Required time (F) Recovery rate

[0060] The search key (A) is the model of the mounting device 12. Although the production line 10 may include mounting devices 12 of multiple models, in this embodiment, for simplicity of explanation, all are assumed to be model "A".

[0061] The search key (B) is the operating state of the mounting device 12 at the time when an error occurred (such as at the time of machine startup, setup, production, etc.). Both the search keys (A) and (B) are information included in the error log recorded in the memory 63 by the mounting device 12 when the error occurred.

[0062] The search key (C) is a number corresponding to the type of error that occurred in the mounting device 12. The administrator investigates the damaged state of the mounting device 12 to determine the type of error and identify the error No.

[0063] The search key (D) is the repair type. The administrator selects and inputs it from "manufacturer repair" and "user repair".

[0064] The search key (E) is the time required until the repair is completed. For example, the administrator inputs the upper limit value of the required time that can be tolerated, such as "within 8 days" or "within 12 hours".

[0065] The search key (F) is the recovery rate after the repair is completed. For example, the administrator inputs the lower limit value of the recovery rate that can be tolerated, such as "50% or more" or "70% or more".

[0066] When inputting the search keys (D) to (F), the administrator may consider the production plan of the substrate P that was in production at the time when the error occurred.

[0067] Specifically, when there is a margin in the production plan (delivery date) of the substrate P, the administrator inputs "manufacturer repair" to the search key (D) and executes the search. FIG. 6 shows a list (search conditions) of search keys and search results when manufacturer repair is selected.

[0068] In this example, the search result that matches the search conditions is data No. 001.

[0069] The data management device 20 displays the content of data No. 001 on the display unit 22 and presents it to the administrator. Since No. 001 is the repair data 31 for manufacturer repair, the administrator requests manufacturer repair from the manufacturer. The recovery rate 34A after manufacturer repair is 100%, and the administrator can resume production with the mounting device 12 having no failure location.

[0070] Also, the administrator can search for the repair data 31 for which the repair is completed within the input time by inputting an arbitrary required time to the search key (E).

[0071] FIG. 7 shows the search conditions and search results when "2 hours or less" is input to the search key (E).

[0072] The search result that matches the search conditions is data No. 003. The data management device 20 displays the content of data No. 003 on the display unit 22 as the search result and presents it to the administrator. The administrator performs the repair with reference to the presented repair data 31. Since the required time 33B for the repair work of No. 003 is 60 minutes, the administrator can complete the repair within 2 hours and resume production. The input of the search key (E) is effective when it is desired to prioritize the early resumption of production.

[0073] The administrator can also perform a search by inputting two or more of the three search keys (D) to (F). For example, when production must be resumed within 12 hours with a recovery rate of 50% or more, the administrator inputs "12 hours or less" to the search key (E) and "50% or more" to the search key (F) and executes the search. FIG. 8 shows the search conditions and search results.

[0074] The search result that matches the search conditions is data No. 002. The data management device 20 displays the repair data 31 of No. 002 on the display unit 22 and presents it to the administrator. The administrator repairs the mounting device 12 with reference to the data of No. 002.

[0075] The required time 33B for the repair work of No.002 is 10 hours, and the recovery rate 34A is 60%. The administrator can resume production with the required time 33B and recovery rate 34A that meet the requirements.

[0076] 5. Explanation of the flowchart The recovery support process will be described with reference to the flowchart of FIG. 9.

[0077] When the production of the substrate P starts, the mounting device 12 adsorbs, recognizes, and mounts the component W on the substrate P. If an error occurs in the mounting device 12 during the production of the substrate P, the production line 10 stops (S10).

[0078] When the production line 10 stops, the mounting device 12 creates an error log recording the state of the mounting device 12 at the time of the error and saves it in the memory 63.

[0079] The administrator of the production line 10 refers to the error log and reads out the model, occurrence timing, and error No. of the mounting device 12 included in the error log respectively. The error No. may be determined by the administrator after checking the state of the mounting device 12. The administrator inputs the read information into the data management device 20 as search keys (A) to (C) (S20).

[0080] The data management device 20 sends the search keys (A) to (C) to the database 30, and the database 30 executes the search (S30). The database 30 sends the search result to the data management device 20.

[0081] Next, the data management device 20 determines the presence or absence of the repair data 31 that hits the search (S40).

[0082] If there is no hit repair data 31 (S40: NO), there is no past case of dealing with the same error as the error that occurred this time, and the administrator cannot perform user repair by referring to the past repair data 31. Therefore, the data management device 20 requests the manufacturer to perform manufacturer repair by the repair person. The repair person of the manufacturer who received the request performs the repair of the mounting device 12. After the repair, the administrator resumes the production of the substrate P by the production line 10 (S110).

[0083] If one or more repair data 31 are hit (S40: YES), the data management device 20 requests the administrator for the search keys (D) to (F) necessary for the narrowing-down search.

[0084] The administrator inputs the conditions (repair type, required time, recovery rate) required for the mounting device 12 after repair as the search keys (D) to (F) to the data management device 20 (S45).

[0085] The data management device 20 transmits the search keys (D) to (F) to the database 30, and the database 30 performs a narrowing-down search on the search result of S30 (S50). The database 30 transmits the search result of the narrowing-down search to the data management device 20.

[0086] The data management device 20 determines the presence or absence of the repair data 31 hit by the narrowing-down search (S60). If there is no hit repair data 31 (S60: NO), the administrator changes the search keys (D) to (F) and inputs them to the data management device 20 (S100). The data management device 20 performs a narrowing-down search on the search result obtained in S30 based on the changed search keys (D) to (F) (S50).

[0087] Changing the search key means changing the repair type in the search key (D) or changing the numerical values included in the search keys (E) and (F).

[0088] For example, in the search key (E), change the required time "4 hours or less" to "10 hours or less", and in the search key (F), change the recovery rate "60% or more" to "30% or more".

[0089] As a result of performing the narrowed-down search, when repair data 31 that satisfies the search keys (D) to (F) is hit (S60: YES), the data management device 20 displays the hit repair data 31 on the display unit 22 and presents it to the administrator. When a plurality of repair data 31 is hit, the administrator selects one repair data 31 from the plurality of presented repair data 31 (S70).

[0090] When the repair data 31 to be referred to is determined (S70), the administrator repairs the mounting device 12 with reference to the repair work information 33 included in the repair data 31. When the repair work is completed, the administrator resumes the production of the substrate P by the production line 10 (S80).

[0091] After resuming production, the administrator calculates the recovery rate 34A based on the production results of the mounting device 12. The administrator inputs each item of the repair data 31 including the actual required time 33B and the recovery rate 34A for the performed repair into the data management device 20. The data management device 20 registers the input information as new repair data 31 in the database 30 (S90). The newly registered repair data 31 becomes the target of search in subsequent searches.

[0092] 6. Effect Explanation The database 30 stores past repair data 31 performed on the mounting device 12. The data management device 20 causes the database 30 to search for repair data 31 based on the search conditions (search keys (A) to (F)) input by the administrator, and presents the repair data 31 that matches the search conditions to the administrator.

[0093] Since the manager can perform the repair of the failed mounting device 12 by referring to the presented repair data 31, it is not necessary to communicate with the manufacturer about the damage status and repair details of the mounting device 12. As a result, the time to recovery can be shortened and the production of the substrate P can be restarted earlier.

[0094] In this embodiment, the search conditions include at least one of the repair type 33A, the required time 33B, and the recovery rate 34A. By doing so, the data management device 20 can present to the manager the repair data 31 in the past repair data 31 stored in the database 30 that is close to the search conditions set by the manager.

[0095] In this embodiment, when the repair of the mounting device 12 is performed, the data management device 20 stores the data related to the performed repair as new repair data 31 in the database 30. By doing so, the number of repair data 31 to be searched increases and can be used to deal with errors in the future.

[0096] When there is no repair data 31 that matches the search conditions, the data management device 20 requests the manufacturer to repair the mounting device 12. By doing so, the manufacturer repair can be started without waiting for the manager to judge the search result, and the response to the error can be speeded up.

[0097] <Embodiment 2> In the recovery support system S of Embodiment 1, the manager refers to the error log to read the error information 32 (model, occurrence timing, error No.), and inputs these error information 32 as search keys (A) to (C) into the data management device 20 (S20 in FIG. 9).

[0098] The flowchart of Embodiment 2 is shown in FIG. 10. The part surrounded by the broken line in FIG. 10 is the difference from Embodiment 1, and the other parts are the same as Embodiment 1.

[0099] In Embodiment 2, when an error occurs in the mounting device 12 and the production line 10 stops (S10), the mounting device 12 self-diagnoses the failure situation (S21). Specifically, the CPU 61 diagnoses the type of error based on the information included in the error log, and outputs the error No. (search key (C)) corresponding to the type of error as a diagnosis result. The mounting device 12 transmits the search keys (A), (B) included in the error log and the search key (C) output by the CPU 61 to the database 30. The subsequent flow is the same as that in Embodiment 1.

[0100] With this configuration, the mounting device 12 self-diagnoses the failure situation and transmits the search keys (A) to (C) to the database 30 based on the diagnosis result. It becomes unnecessary for the administrator to confirm the failure situation and judge the type of error, reducing the burden on the administrator.

[0101] <Embodiment 3> In the recovery support system S of Embodiment 1, the data management device 20 presents the repair data 31 output by the database 30 as a search result to the administrator (S70). In contrast, in the recovery support system S of Embodiment 3, the data management device 20 determines whether the repair type 33A of the output repair data 31 is manufacturer repair or user repair.

[0102] The flowchart of Embodiment 3 is shown in FIG. 11. The part surrounded by the broken line in FIG. 11 is the difference from Embodiment 1. The other parts are the same as those in Embodiment 1.

[0103] S71 is executed when there is repair data 31 that hits the narrowed-down search (S60: YES). When the repair type 33A of the hit repair data 31 is manufacturer repair (S71: YES), the data management device 20 instructs the manufacturer to repair the mounting device 12 (S73). Specifically, the hit repair data 31 and the error log are transmitted to the manufacturer via the communication network 14, and a visit from the manufacturer's repair staff is requested.

[0104] Based on the received repair data 31 and the like, the manufacturer starts preparations for repair, such as arranging the parts necessary for repair. Once the preparations are complete, the repair personnel visit the user to perform the repair (manufacturer repair), and when the repair is completed, production resumes (S80).

[0105] When the repair type 33A of the hit repair data 31 is user repair (S71: NO), the data management device 20 instructs the administrator to repair the mounting device 12 (S72). Specifically, not only the hit repair data 31 is presented, but also the confirmation locations of the mounting device 12, the method of arranging the parts necessary for repair, the content and detailed procedures of the repair work, etc. are displayed on the display unit 22. The administrator performs the repair according to the instructions of the data management device 20, and when the repair is completed, production resumes (S80).

[0106] In this way, the manufacturer or the administrator can quickly respond to the occurrence of a failure, so that the period during which the production line 10 is stopped can be shortened and production can be resumed earlier.

[0107] <Other Embodiments> (1) In the above embodiment, the mounting device 12 is exemplified as the substrate working device, but the substrate working device is not limited to the mounting device 12. It may be a printing machine 11 or an inspection device 13 included in the production line 10. Any device included in the production line 10 that performs some operation on the substrate P is included in the substrate working device.

[0108] (2) In the above embodiment, the case where the database 30 is installed in the data center managed by the manufacturer is exemplified, but the database 30 may be located elsewhere. For example, it may be installed in the data center managed by the administrator.

[0109] (3) In the above embodiment, the production line 10 has two mounting devices 12, but the number of mounting devices 12 included in the production line 10 may be one or three or more.

[0110] (4) In the above embodiment, the time required for work preparation, the working time, and the required time 33B may be expressed as a "range" combining a lower limit value and an upper limit value. For example, if the work preparation takes 5 to 7 days and the working time is 1 to 2 days, the required time 33B is at least 5 days + 1 day = 6 days and at most 7 days + 2 days = 9 days, and can be expressed as 6 to 9 days.

[0111] (5) In the above embodiment, the search for the repair data 31 in the case where an error of shaft bending due to machine crash occurs has been described, but the errors that occur are not limited to this. Specifically, many types of errors can occur, such as dirt on the tip of the suction nozzle 56, failure of the camera (such as the board camera 45, etc.). When dirt occurs on the tip of the suction nozzle 56, the user performs nozzle cleaning or replacement (user repair). When a camera failure occurs, the manufacturer's repair personnel visit the user to perform the repair (manufacturer repair).

[0112] Also, gears constituting the head moving unit 44, belts constituting the conveyor 42, cables, etc. may wear and cause errors. For example, when the belt for board conveyance wears and an error related to board conveyance occurs, a temporary repair is performed by changing the program to lower the conveyance speed.

[0113] Even when these errors occur, as in the above embodiment, a search for past repair data 31 stored in the database 30 is performed.

[0114] (6) In the above embodiment, when there is no repair data 31 that hits the search, the data management device 20 requests manufacturer repair from the manufacturer (S110). The data management device 20 may notify the administrator that there is no repair data 31 that hits the search, and the administrator may contact the manufacturer to request manufacturer repair.

Explanation of Reference Numerals

[0115] 10 Production line 12 Mounting device 20 Data management device 30 Database 31 Repair data 32 Error information 33 Repair work information 33A Repair type 33B Required time 34 Post-restoration production information 34A Restoration rate 30 Database S Restoration support system

Claims

1. A recovery support system for a substrate working device used in the production of a circuit board, comprising: a database; a data management device communicably connected to the database, wherein the database stores past repair data of the substrate working device, and the data management device causes the database to search for the repair data based on search conditions input by an administrator, and when there is repair data that matches the search conditions including a recovery rate, presents the repair data that matches the search conditions to the administrator.

2. The recovery support system for a substrate working device according to claim 1, wherein the search conditions include a repair type, a required time, and the recovery rate for the repair of the substrate working device.

3. The recovery support system for a substrate working device according to claim 2, wherein the repair type includes at least one of manufacturer repair and user repair.

4. The recovery support system for a substrate working device according to any one of claims 1 to 3, wherein when the substrate working device stops due to a failure, the substrate working device transmits a diagnosis result of self-diagnosing the failure situation to the data management device, and the data management device causes the database to search for the repair data based on the search conditions including the diagnosis result.

5. The recovery support system for a substrate working device according to any one of claims 1 to 4, wherein when the repair of the substrate working device is performed, the data management device stores the performed repair data as new repair data in the database.

6. The recovery support system for a substrate working device according to any one of claims 1 to 5, wherein the data management device when the repair type of the repair data presented to the administrator is manufacturer repair, instructs the manufacturer to repair the substrate working device, when the repair type of the repair data presented to the administrator is user repair, instructs the administrator to repair the substrate working device.

7. The recovery support system for a substrate working device according to any one of claims 1 to 6, wherein when there is no repair data that matches the search conditions, the data management device requests the manufacturer to repair the substrate working device.

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