Carrier tray and method for manufacturing the carrier tray

Abstract

To provide a conveying tray capable of obtaining useful information for a user using the conveying tray such as a marker for the location where a chip is to be placed and the chip which is accommodated.SOLUTION: A conveying tray 1 has an adhesive layer 3 arranged to temporarily fix a device chip 203. The adhesive layer 3 is formed transparent or translucent, which transmits through visible light. On the bottom surface of the adhesive layer 3, an information display part 4 is arranged to display information 9 that is visible to a user using the conveying tray 1.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a transport tray for temporarily fixing and transporting chips and a method for manufacturing the transport tray.

Background Art

[0002] In the semiconductor device manufacturing process, devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in a large number of regions arranged in a grid pattern on the surface of a wafer, and the wafer is divided along a dicing scheduled line that divides each region to manufacture individual devices. The devices divided in this way are made into package substrates with a metal frame or resin, and are further divided into individual packaged device chips, which are widely used in electrical devices such as mobile phones and personal computers.

[0003] When dividing the package substrate, it is directly fixed to the chuck table of a cutting device. After dividing it into individual packaged device chips, when accommodating, transporting, and storing the chips, they are accommodated in a transport tray. The transport tray usually has partitions according to the size of the chips, and a transport tray according to the size of each chip is prepared. However, a transport tray with an adhesive layer having an adhesive force and tack force capable of temporarily fixing the chips is laid on the bottom surface of the tray, and a transport tray regardless of the size of the chips has been developed (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, since this transport tray has no partition, there is a risk that the user may be confused when using it because there is no mark for the position where the chip is to be placed. Also, by not limiting the size of the chip, there is a new problem that it is impossible to tell which chip is accommodated in the transport tray.

[0006] The present invention has been made in view of such problems, and its object is to provide a transport tray and a method for manufacturing the transport tray that can obtain useful information for a user using the transport tray, such as a mark for the position where the chip is to be placed and which chip is accommodated.

Means for Solving the Problems

[0007] In order to solve the above-described problems and achieve the object, the transport tray of the present invention is a transport tray in which an adhesive layer for temporarily fixing a chip is disposed, and the adhesive layer is formed to be transparent or translucent and transmit visible light. On the lower surface of the adhesive layer on the side an information display unit for displaying information visible to the user using the transport tray is disposed. and the information display unit is the screen of the mobile terminal is.

[0008] The information display unit may display mark information indicating the fixing position of the chip to be temporarily fixed, manufacturing information indicating information related to the manufacturing process of the chip, type information of the chip, or advertisement information.

[0009] The information display unit may display the information in color, characters, or codes.

[0010] The information display unit may be capable of rewriting the information by an external stimulus.

[0012] Also, in order to solve the above-described problems and achieve the object, the method for manufacturing a transport tray of the present invention is a method for manufacturing a transport tray, including a tray preparation step of preparing a tray for accommodating a chip, an information display unit arrangement step of arranging an information display unit for displaying information on the bottom surface of the tray, and a resin layer coating step of coating the upper surface of the information display unit with a resin layer having adhesiveness and transmitting visible light. and the information display unit is the screen of the mobile terminal is. [Effect of the Invention]

[0013] The present invention can acquire useful information for a user using a transport tray. [Brief Description of the Drawings]

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

[0015] Modes for carrying out the present invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited by the content described in the following embodiments. Also, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same ones. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0016] 〔Embodiment 1〕 The transport tray 1 and the method for manufacturing the transport tray according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the transport tray 1 according to Embodiment 1. FIG. 2 is a cross-sectional view showing the transport tray 1 of FIG. 1. As shown in FIGS. 1 and 2, the transport tray 1 accommodates and transports a device chip (corresponding to a package device chip and the chip described in the claims), and includes a tray body 2 (corresponding to the tray described in the claims), an adhesive layer 3, and an information display portion 4.

[0017] As shown in FIG. 1, the tray body 2 is formed in a flat plate shape with a rectangular planar shape, and includes a device support portion 6 formed of a recess having a size capable of accommodating a workpiece 200 (see FIG. 3), and a frame body 7 formed surrounding the outer periphery of the device support portion 6.

[0018] The device support portion 6 is a recessed portion recessed from the upper surface of the transport tray 1, and in Embodiment 1, is formed in a rectangular shape larger than the planar shape of the workpiece 200. The device support portion 6 has a bottom surface 6-1 that supports a plurality of device chips 203 via the adhesive layer 3 and the information display portion 4. The bottom surface 6-1 is formed flat. The bottom surface 6-1 of the device support portion 6 is set to be able to accommodate a plurality of device chips 203 separated from the workpiece 200 at one time. The frame body 7 surrounds the outer periphery of the bottom surface 6-1 of the device support portion 6 and is formed convex upward from the bottom surface 6-1.

[0019] As shown in FIG. 2, the information display portion 4 is disposed on the bottom surface 6-1 of the device support portion 6 of the tray body 2. The adhesive layer 3 is disposed over the entire bottom surface 6-1 of the device support portion 6 and the information display portion 4 so as to cover the upper sides of the bottom surface 6-1 of the device support portion 6 and the information display portion 4. The adhesive layer 3 is exposed on the device support portion 6, and the exposed surface on the device support portion 6 is formed flat. That is, the information display portion 4 is disposed between the bottom surface 6-1 of the device support portion 6 and the lower surface of the adhesive layer 3.

[0020] The adhesive layer 3 has an adhesive force for temporarily fixing a plurality of device chips 203 by sticking them. Here, temporarily fixing the device chip 203 means that the device chip 203 does not move even when a certain impact is applied or the carrier tray 1 is tilted at an angle equal to or less than a predetermined angle, and moreover, the device chip 203 can be easily removed and moved by the user using the carrier tray 1. The adhesive layer 3 is made of a material that transmits visible light, that is, a material that is transparent or translucent to visible light. Therefore, the adhesive layer 3 enables the user using the carrier tray 1 to visually observe the information 9 displayed on the information display unit 4 through the adhesive layer 3. In the first embodiment, the adhesive layer 3 can be composed of, for example, a resin layer containing one or more resins selected from acrylic resins, urethane resins, silicone resins, ethylene-unsaturated carboxylic acid copolymer resins, ethylene-vinyl acetate copolymer resins, ionomers, ethylene-vinyl acetate-maleic anhydride terpolymer resins, saponified ethylene-vinyl acetate copolymer resins, and ethylene-vinyl alcohol copolymer resins, etc.

[0021] The information display unit 4 is arranged such that the side for displaying the information 9 faces the upper surface side of the carrier tray 1, and displays the information 9 that can be visually observed by the user using the carrier tray 1 from the upper surface side of the carrier tray 1. In the first embodiment, the information display unit 4 can be composed of a thin medium extending in the horizontal direction, for example, paper, a card, a sheet, a thin plate, etc. that display the information 9 toward the upper surface side of the carrier tray 1. Note that the information display unit 4 for displaying the information 9 is not limited to this in the present invention, and it may be the bottom surface 6-1 of the device support unit 6 that directly displays the information 9.

[0022] The information 9 displayed on the information display unit 4 is useful information for the user who uses the transport tray 1, for example. In the first embodiment, as shown in FIG. 1, it is the mark information 9-1 indicating the fixing position of the temporarily fixed device chip 203. In the example shown in FIG. 1, the mark information 9-1 is a boundary line indicated by a dashed line between the fixing positions of adjacent device chips 203. However, the present invention is not limited to this, and any form may be used as long as it serves as a mark when the user fixes the device chip 203. For example, it may be a rectangular frame line corresponding to the outer periphery of the device chip 203, or a spot formed at the center of the fixing position of the device chip 203.

[0023] In the present invention, the information 9 is not limited to the mark information 9-1. For example, it may be manufacturing information indicating information related to the manufacture of the device chip 203, type information of the device chip 203, advertisement information related to the device chip 203 or the user, and the like. The manufacturing information of the device chip 203 includes process information indicating information on the manufacturing process of the device chip 203, factory information indicating information on the factory that manufactures the device chip 203, quality information indicating information related to quality control such as limit samples of the device chip 203, input information indicating information that needs to be input to a predetermined device in the manufacture of the device chip 203, and the like. In addition, the manufacturing information of the device chip 203 also includes instruction information related to the work for the user who uses the transport tray 1. The instruction information is, for example, an instruction to the effect that the transport tray 1 is used for transportation between two predetermined processing devices in the manufacturing process of the device chip 203, an instruction indicating the destination of shipment of the device chip 203, and the like. The advertisement information related to the device chip 203 or the user is, for example, advertisement information for promoting newly developed products such as devices, equipment, and replacement members required for the manufacture of the device chip 203, products of the manufacturer of the processing device 100, or new products of the transport tray 1.

[0024] In Embodiment 1, the information display unit 4 displays the information 9 with a dashed line. However, the present invention is not limited to this, and the information 9 may be displayed using, for example, one or more selected from figures including dashed lines, colors, photos, characters, and codes. Here, as the figure for displaying the information 9, for example, a figure that allows the user using the transport tray 1 to visually and sensuously understand the information 9, such as the mark information 9-1, is used. Also, as the color for displaying the information 9, a more prominent color is used for a color that is more useful for the user using the transport tray 1. The usefulness for the user using the transport tray 1 is, for example, the relevance to the work performed on the device chip 203 accommodated in the transport tray 1. Also, as the photo for displaying the information 9, for example, a photo that clearly shows a sample of the information 9 to be understood by the user using the transport tray 1 is used. The photo for displaying the information 9 may be an unprocessed photo as taken, or a processed photo (image) appropriately processed to clearly show the information 9. Also, as the characters for displaying the information 9, for example, characters that concisely express the key points of the information 9 to be understood by the user using the transport tray 1 are used. Also, the code may be a symbol, and includes two-dimensional codes such as barcodes and QR codes (registered trademarks) that can read the information 9 by being read by a predetermined reader. The symbol included in the code may be a symbol that allows the user using the transport tray 1 to visually and sensuously understand the information 9, similar to the above figure, or a symbol that concisely expresses the key points of the information 9 to be understood by the user using the transport tray 1, similar to the above characters.

[0025] The information display unit 4 may have a so-called rewrite function that can rewrite the information 9 by physical external stimuli such as heating or cooling, application of magnetism, irradiation with ultraviolet rays, and contact. In such a case, the information display unit 4 has the previously displayed information 9 erased and new information 9 printed by applying an external stimulus corresponding to the information 9 to be erased and printed through the device support unit 6 or through the adhesive layer 3 by a predetermined information rewriting device, whereby the information 9 is rewritten.

[0026] Next, this specification will describe the device chip 203 accommodated in the transport tray 1 according to Embodiment 1. FIG. 3 is a perspective view showing a processing apparatus 100 for manufacturing the device chip 203 accommodated in the transport tray 1 of FIG. 1. As shown in FIG. 3, the processing apparatus 100 is an apparatus for processing a workpiece 200 to manufacture the device chip 203, and includes a holding table 110, a processing unit 120, an imaging unit 130, an X-axis direction moving unit 141, a Y-axis direction moving unit 142, a Z-axis direction moving unit 143, and a control unit 150.

[0027] The workpiece 200 to be processed into the device chip 203 accommodated in the transport tray 1 according to Embodiment 1 by the processing apparatus 100 is formed in a flat plate shape with a rectangular planar shape as shown in FIG. 3. In Embodiment 1, the workpiece 200 is a so-called package substrate formed by encapsulating a plurality of semiconductor chips with resin, such as a CSP (Chip Size Package) or a QFN (Quad Flat Non-leaded Package) as shown in FIG. 3. A plurality of division planned lines 202 are formed in a grid pattern on the surface 201 of the workpiece 200, and semiconductor chips are mounted in each region partitioned by the division planned lines 202. The workpiece 200 is divided into individual device chips 203 by cutting the division planned lines 202 by the processing apparatus 100 shown in FIG. 3.

[0028] The holding table 110 is formed in a rectangular shape and includes a holding surface 111 for holding the workpiece 200. The holding surface 111 is provided with a suction port 112 for sucking the workpiece 200 and the device chip 203, and a relief groove 113 for allowing the cutting blade 21 to pass through. The suction port 112 is provided at a position overlapping the device chip 203 and opens on the holding surface 111. The relief groove 113 is provided at a position corresponding to the division planned line 202 and is formed recessed from the holding surface 111.

[0029] The holding table 110 is connected to a vacuum suction source (not shown) at the suction port 112. When the suction port 112 is suctioned by the vacuum suction source, the workpiece 200 is suctioned and held on the holding surface 111. Further, the holding table 110 is movable in the X-axis direction, which is the processing feed direction, by the X-axis direction movement unit 141, and is rotatably provided about an axis parallel to the Z-axis direction by a rotation drive source (not shown).

[0030] The processing unit 120 is for machining the workpiece 200, and includes a spindle 122 that mounts a cutting blade 121 for cutting the workpiece 200 held on the holding table 110. The cutting blade 121 is an extremely thin cutting grindstone having a substantially ring shape. The spindle 122 cuts the workpiece 200 by rotating the cutting blade 121. The axes of the spindle 122 and the cutting blade 121 of the processing unit 120 are set parallel to the Y-axis direction. As shown in FIG. 3, the processing apparatus 100 includes two processing units 120, that is, a so-called facing dual type cutting apparatus with two spindles.

[0031] The processing unit 120 is movably provided in the Y-axis direction, which is the indexing feed direction, with respect to the workpiece 200 held on the holding table 110 by the Y-axis direction movement unit 142, and is movably provided in the Z-axis direction, which is the cutting feed direction, by the Z-axis direction movement unit 143. The processing unit 120 can position the cutting blade 121 at any position on the holding surface 111 of the holding table 110 by the Y-axis direction movement unit 142 and the Z-axis direction movement unit 143. The processing unit 120 cuts the workpiece 200 held on the holding table 110 that is moved in the X-axis direction by the X-axis direction movement unit 141 along the division planned line 202 by being moved in the Y-axis direction and the Z-axis direction by the Y-axis direction movement unit 142 and the Z-axis direction movement unit 143, thereby dividing the workpiece 200 into a plurality of device chips 203.

[0032] In Embodiment 1, the imaging unit 130 is attached to one of the processing units 120 and moves integrally with the one processing unit 120. The imaging unit 130 includes an image sensor that images the workpiece 200 before and after processing held on the holding table 110. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit 130 images the workpiece 200 held on the holding table 110 to obtain an image for performing alignment to align the workpiece 200 with the cutting blade 121, and outputs the obtained image to the control unit 150. The imaging unit 130 images the workpiece 200 held on the holding table 110 to obtain an image for performing a kerf check to confirm the quality of a processing mark such as a cutting groove formed in the workpiece 200, and outputs the obtained image to the control unit 150.

[0033] The control unit 150 controls the operations of the components of the processing apparatus 100 to cause the processing apparatus 100 to perform various processes for cutting the workpiece 200 to manufacture a plurality of device chips 203. In Embodiment 1, the control unit 150 includes a computer system. The computer system included in the control unit 150 has an arithmetic processing unit having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing unit of the control unit 150 performs arithmetic processing according to a computer program stored in the storage device of the control unit 150, and outputs a control signal for controlling the processing apparatus 100 to each component of the processing apparatus 100 via the input / output interface device of the control unit 150.

[0034] The user who uses the transfer tray 1 takes out the device chip 203 manufactured by cutting the workpiece 200 with the processing device 100 from the processing device 100, and attaches it to the adhesive layer 3 on the device support portion 6 of the transfer tray 1, thereby temporarily fixing the device chip 203 on the adhesive layer 3 of the transfer tray 1. Note that the user who uses the transfer tray 1 may attach the surface 201 side of the device chip 203 to the adhesive layer 3, or may attach the back surface 204 side opposite to the surface 201 of the device chip 203 to the adhesive layer 3. When the user who uses the transfer tray 1 temporarily fixes the device chip 203 on the adhesive layer 3 of the transfer tray 1 in this way, the user visually acquires the information 9 displayed on the information display portion 4 of the transfer tray 1 through the adhesive layer 3. In Embodiment 1, since the transfer tray 1 has the mark information 9-1 indicating the fixing position of the device chip 203 to be temporarily fixed to the transfer tray 1 displayed on the information display portion 4, the user who uses the transfer tray 1 can temporarily fix the device chip 203 at an accurate position on the adhesive layer 3 of the transfer tray 1 while visually confirming the mark information 9-1.

[0035] Next, this specification will describe an example of the processing of the manufacturing method of the transfer tray according to Embodiment 1 with reference to the drawings. FIG. 4 is a flowchart showing an example of the processing procedure of the manufacturing method of the transfer tray according to Embodiment 1. The manufacturing method of the transfer tray according to Embodiment 1 is a method for manufacturing the transfer tray 1 according to Embodiment 1, and as shown in FIG. 4, it includes a tray preparation step 1001, an information display portion arrangement step 1002, and a resin layer coating step 1003.

[0036] The tray preparation step 1001 is a step of preparing the tray body 2 for accommodating the device chip 203. The information display portion arrangement step 1002 is a step of arranging the information display portion 4 for displaying the information 9 on the bottom surface 6-1 of the device support portion 6 of the tray body 2 prepared in the tray preparation step 1001, with the side on which the information 9 is displayed facing upward on the side opposite to the bottom surface 6-1.

[0037] The resin layer coating step 1003 is a step of forming an adhesive layer 3 composed of a resin layer by coating an upper surface on the side where the information 9 of the information display unit 4 arranged in the information display unit arrangement step 1002 is displayed, with a plurality of device chips 203 adhered and temporarily fixed, and further coating a resin layer that transmits visible light. In the resin layer coating step 1003, the adhesive layer 3 is formed so as to cover the upper part of the bottom surface 6-1 of the device support part 6 and the information display unit 4, and the exposed surface is flat.

[0038] In the transport tray 1 and the manufacturing method of the transport tray according to Embodiment 1 having the above configuration, useful information 9 for the user using the transport tray 1 is visibly displayed on the information display unit 4 through the adhesive layer 3 that temporarily fixes the device chip 203 of the transport tray 1. Therefore, the transport tray 1 and the manufacturing method of the transport tray according to Embodiment 1 have the effect that the user using the transport tray 1 can acquire useful information 9 for the user when using the transport tray 1. Further, in the transport tray 1 and the manufacturing method of the transport tray, the adhesive layer 3 of the transport tray 1 is exposed on the device support part 6, and the exposed surface on the device support part 6 is formed flat, so that the operation of fixing the device chip 203 to the transport tray 1 is not hindered by the information display unit 4.

[0039] Further, in the transport tray 1 and the manufacturing method of the transport tray according to Embodiment 1, the information display unit 4 displays mark information 9-1 indicating the fixing position of the temporarily fixed device chip 203. Therefore, the transport tray 1 and the manufacturing method of the transport tray according to Embodiment 1 have the effect that the user using the transport tray 1 can temporarily fix the device chip 203 at an accurate position on the adhesive layer 3 of the transport tray 1 while visually confirming the mark information 9-1.

[0040] In addition, in the transport tray 1 and the method for manufacturing the transport tray according to Embodiment 1, the information display unit 4 may display the information 9 in the form of graphics, colors, photographs, characters, codes, etc. For this reason, the transport tray 1 and the method for manufacturing the transport tray according to Embodiment 1 have the effect that the user using the transport tray 1 can easily and sensibly understand the information 9 at a glance, more surely acquire more useful information 9 for the user, or easily read more detailed information 9 with a predetermined reader.

[0041] In addition, in the transport tray 1 and the method for manufacturing the transport tray according to Embodiment 1, the information display unit 4 may be able to rewrite the information 9 by an external stimulus. For this reason, the transport tray 1 and the method for manufacturing the transport tray according to Embodiment 1 can increase the degree of freedom in using the transport tray 1 without partitions on the device support portion 6 capable of accommodating various types of device chips 203 by changing the information 9 according to the type of the device chip 203 accommodating the transport tray 1 and the process related to the device chip 203.

[0042] 〔Embodiment 2〕 The transport tray 1-2 according to Embodiment 2 of the present invention will be described. FIG. 5 is a perspective view showing a configuration example of the transport tray 1-2 according to Embodiment 2. In FIG. 5, the same parts as those in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted.

[0043] The transport tray 1-2 according to Embodiment 2 is obtained by changing the information 9 displayed on the information display unit 4 from the mark information 9-1 to the manufacturing information 9-2 of the device chip 203 in the transport tray 1 according to Embodiment 1, and the other configurations are the same as those of the transport tray 1 according to Embodiment 1. In the example shown in FIG. 5, the manufacturing information 9-2 is process information that simply shows the main points of the current manufacturing process of the device chip 203 to be accommodated in the transport tray 1-2, the next manufacturing process, and instruction information indicating that the user should perform an operation between both processes, in the form of a character string.

[0044] The transport tray 1-2 according to Embodiment 2 having the above-described configuration and the method for manufacturing the transport tray for manufacturing the transport tray 1-2 exhibit the same operational effects as those of Embodiment 1, except that the information 9 is the mark information 9-1. Further, in the transport tray 1-2 according to Embodiment 2 and the method for manufacturing the transport tray for manufacturing the transport tray 1-2, since the information display unit 4 displays the process information of the manufacturing information 9-2 of the device chip 203, the user using the transport tray 1-2 can visually confirm the manufacturing information 9-2, so that the user can accurately understand the position in the manufacturing process of the device chip 203 accommodated and handled in the transport tray 1-2 and the work content to be executed by the user after the current process. Thereby, the transport tray 1-2 according to Embodiment 2 and the method for manufacturing the transport tray for manufacturing the transport tray 1-2 have the operational effect of reducing the work mistakes in the process of the user using the transport tray 1-2 and improving the work efficiency.

[0045] 〔Embodiment 3〕 The transport tray 1-3 according to Embodiment 3 of the present invention will be described. FIG. 6 is a perspective view showing a configuration example of the transport tray 1-3 according to Embodiment 3. In FIG. 6, the same parts as those in Embodiments 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

[0046] The transport tray 1-3 according to Embodiment 3 is obtained by changing the information 9 displayed on the information display unit 4 from the mark information 9-1 to the manufacturing information 9-3 of the device chip 203 in the transport tray 1 according to Embodiment 1, and the other configurations are the same as those of the transport tray 1 according to Embodiment 1. In the example shown in FIG. 6, the manufacturing information 9-3 is factory information showing a map of the factory for manufacturing the device chip 203 to be accommodated in the transport tray 1-3 by combining graphics and characters as seen from the upper surface of the factory.

[0047] The transport tray 1-3 according to Embodiment 3 having the above configuration and the method for manufacturing the transport tray for manufacturing the transport tray 1-3 have the same effects as those of Embodiment 1, except that the information 9 is the mark information 9-1. Further, in the transport tray 1-3 according to Embodiment 3 and the method for manufacturing the transport tray for manufacturing the transport tray 1-3, since the information display unit 4 displays the factory information of the manufacturing information 9-3 of the device chip 203, the user using the transport tray 1-3 can visually confirm the manufacturing information 9-3, so that the user can accurately understand the layout information of the devices for performing each process in the factory where the device chip 203 accommodated and handled in the transport tray 1-3 is manufactured, and the shelves for storing work-in-progress and products. As a result, the transport tray 1-3 according to Embodiment 3 and the method for manufacturing the transport tray for manufacturing the transport tray 1-3 have the effect of reducing the movement errors in the factory of the user using the transport tray 1-3 and improving the movement efficiency.

[0048] [Embodiment 4] The transport tray 1-4 according to Embodiment 4 of the present invention will be described. FIG. 7 is a perspective view showing a configuration example of the transport tray 1-4 according to Embodiment 4. In FIG. 7, the same parts as those in Embodiments 1 to 3 are denoted by the same reference numerals, and the description thereof will be omitted.

[0049] The transport tray 1-4 according to Embodiment 4 is obtained by changing the information 9 displayed on the information display unit 4 from the mark information 9-1 to the manufacturing information 9-4 of the device chip 203 in the transport tray 1 according to Embodiment 1, and the other configurations are the same as those of the transport tray 1 according to Embodiment 1. In the example shown in FIG. 7, the manufacturing information 9-4 is quality information showing a limit sample of the device chip 203 to be accommodated in the transport tray 1-4 by combining a photograph (image) and characters. In the example shown in FIG. 7, the manufacturing information 9-4 shows a limit sample of chipping generated when the device chip 203 is machined by cutting.

[0050] The transport tray 1-4 according to Embodiment 4 having the above-described configuration and the method for manufacturing the transport tray for manufacturing the transport tray 1-4 exhibit the same operational effects as those of Embodiment 1, except that the information 9 is the mark information 9-1. Further, in the transport tray 1-4 according to Embodiment 4 and the method for manufacturing the transport tray for manufacturing the transport tray 1-4, since the information display unit 4 displays the quality information of the manufacturing information 9-4 of the device chip 203, the user using the transport tray 1-4 can visually confirm the manufacturing information 9-4 to determine whether the device chip 203 accommodated and handled in the transport tray 1-4 meets the quality standard based on the limit sample. Thereby, the transport tray 1-4 according to Embodiment 4 and the method for manufacturing the transport tray for manufacturing the transport tray 1-4 enable the user using the transport tray 1-4 to efficiently determine whether the quality of the device chip 203 is qualified. For example, when separating and accommodating defective products of the device chip 203 in a specific area of the transport tray 1-4, they can be appropriately separated and accommodated, and when it is necessary to remove them before performing the subsequent process, they can be appropriately removed.

[0051] 〔Embodiment 5〕 The transport tray 1-5 according to Embodiment 5 of the present invention will be described. FIG. 8 is a perspective view showing a configuration example of the transport tray 1-5 according to Embodiment 5. In FIG. 8, the same parts as those in Embodiments 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.

[0052] The transport tray 1-5 according to Embodiment 5 is obtained by changing the information 9 displayed on the information display unit 4 from the mark information 9-1 to the manufacturing information 9-5 of the device chip 203 in the transport tray 1 according to Embodiment 1, and the other configurations are the same as those of the transport tray 1 according to Embodiment 1. In the example shown in FIG. 8, the manufacturing information 9-5 is input information indicating, in a two-dimensional code, the information that needs to be input to a predetermined device in the manufacturing of the device chip 203 to be accommodated in the transport tray 1-5.

[0053] The transport tray 1-5 according to Embodiment 5 having the above configuration and the manufacturing method of the transport tray for manufacturing the transport tray 1-5 have the same operational effects as those of Embodiment 1, except that the information 9 is the mark information 9-1. Further, in the transport tray 1-5 according to Embodiment 5 and the manufacturing method of the transport tray for manufacturing the transport tray 1-5, since the information display unit 4 displays the input information of the manufacturing information 9-5 of the device chip 203, a user using the transport tray 1-5 can easily and efficiently input the manufacturing information 9-5 that needs to be input into a predetermined device in the manufacturing of the device chip 203 accommodated and handled in the transport tray 1-5 by performing an operation of reading the manufacturing information 9-5 with a predetermined reader.

[0054] Also, in Embodiments 1 to 5, an example in which the information 9 displayed on the information display unit 4 of the transport trays 1 to 1-5 is the mark information 9-1 and the manufacturing information 9-2 to 9-5 has been described, but the present invention is not limited to this. For example, when the information 9 displayed on the information display unit 4 of the transport tray 1 is a model number indicating the specifications and size of the device chip 203, a manufacturing lot number, or type information such as the pass / fail of quality, this transport tray 1 and the manufacturing method of the transport tray for manufacturing this transport tray 1 enable a user using this transport tray 1 to easily confirm the specifications of the device chip 203 accommodated and handled in this transport tray 1 by visually checking the type information, and for example, can easily confirm whether a process corresponding to the specifications of the device chip 203 is being carried out. Further, when the information 9 displayed on the information display unit 4 of the transport tray 1 is advertisement information regarding the device chip 203 or the user, this transport tray 1 and the manufacturing method of the transport tray for manufacturing this transport tray 1 have the effect that a user using this transport tray 1 can easily visually confirm the advertisement information.

[0055] 〔Embodiment 6〕 The transport tray 1-6 according to Embodiment 6 of the present invention will be described. FIG. 9 is a cross-sectional view showing a configuration example of the transport tray 1-6 according to Embodiment 6. In FIG. 9, the same parts as those in Embodiments 1 to 5 are denoted by the same reference numerals and the description thereof is omitted.

[0056] The transport tray 1-6 according to Embodiment 6 is obtained by changing the information display unit 4 in the transport tray 1 according to Embodiment 1 to a mobile terminal 10, and other configurations are the same as those of the transport tray 1 according to Embodiment 1.

[0057] As shown in FIG. 9, the mobile terminal 10 is disposed between the bottom surface 6-1 of the device support portion 6 and the lower surface of the adhesive layer 3, similar to the information display unit 4 of Embodiments 1 to 5. The mobile terminal 10 includes a screen 4-6 and a control unit 15, as shown in FIG. 9. Similar to the information display unit 4 of Embodiments 1 to 5, the screen 4-6 for displaying information 9 of the mobile terminal 10 is disposed facing the upper surface side of the transport tray 1-6. The screen 4-6 displays the same information 9 as in Embodiments 1 to 5 according to the control from the control unit 15. Thus, the screen 4-6 of the mobile terminal 10 realizes the same function as the information display unit 4 of Embodiments 1 to 5.

[0058] Similar to the information display unit 4 of Embodiments 1 to 5, the mobile terminal 10 has a thin shape extending in the horizontal direction, such as paper, a card, a sheet, a thin plate, etc. Examples of the mobile terminal 10 include mobile phones including high-function mobile phones (so-called smartphones) and tablet terminals. The control unit 15 of the mobile terminal 10 includes a computer system similar to the control unit 150 of the processing device 100, and has an arithmetic processing device having a microprocessor such as a CPU, a storage device having a memory such as a ROM or a RAM, and an input / output interface device. The arithmetic processing device of the control unit 15 performs arithmetic processing according to a computer program stored in the storage device of the control unit 15, and outputs a control signal for controlling the mobile terminal 10 to each component of the mobile terminal 10 via the input / output interface device of the control unit 15.

[0059] The mobile terminal 10 is wirelessly connected to an external device (not shown) so as to enable information communication. The control unit 15 of the mobile terminal 10 can receive information 9 from this external device and display it on the screen 4-6. The transport trays 1-6 can, for example, have the information 9 displayed on the screen 4-6 rewritten by the administrator of the factory where the device chip 203 including the processing device 100 inputs the information 9 into the external device, and then the control unit 15 of the mobile terminal 10 receives the information 9 and displays it on the screen 4-6. The transport trays 1-6 can also enable the information 9 to be remotely transmitted to the users who use the transport trays 1-6 through the transport trays 1-6 by having the information 9 displayed on the screen 4-6 when the factory administrator inputs the information 9 into the external device.

[0060] Also, the mobile terminal 10 is wirelessly connected to a GPS (Global Positioning System) so as to enable information communication, and can use the GPS to obtain the position information of the mobile terminal 10 and transmit it to an external device (not shown). The transport trays 1-6 can, for example, have the position information of the transport trays 1-6 obtained and managed and recorded by the factory administrator of the device chip 203 including the processing device 100 obtaining the position information of the mobile terminal 10 from the external device. For this reason, it is possible to confirm the position within the process or track the position of the transport trays 1-6 that contain and ship the device chips 203.

[0061] In the transport tray 1-6 according to Embodiment 6 having the above-described configuration and the manufacturing method of the transport tray for manufacturing the transport tray 1-6, in the transport tray 1 according to Embodiment 1, since the information display unit 4 is changed to the screen 4-6 of the mobile terminal 10, by inputting the information 9 into the mobile terminal 10 through the external device, it is possible to more easily rewrite the information 9, remotely transmit the information 9, and obtain the position information of the transport trays 1-6, achieving the operational effects.

[0062] Note that the present invention is not limited to the above-described embodiments. That is, various modifications can be made and implemented without departing from the gist of the present invention.

Explanation of Symbols

[0063] 1,1-2,1-3,1-4,1-5,1-6 Conveyor Tray 3 Adhesive Layer 4 Information Display Section 4-6 Screen 9 Information 9-1 Marking Information 9-2,9-3,9-4,9-5 Manufacturing Information 10 Mobile Terminal 203 Device Chip

Claims

1. A transport tray having an adhesive layer for temporarily fixing a chip, wherein the adhesive layer is formed to be transparent or translucent and transmits visible light, and an information display section for displaying information visible to a user using the transport tray is disposed on the lower surface side of the adhesive layer, and the information display section is the screen of a mobile terminal as the transport tray.

2. The transport tray according to claim 1, wherein the information display section displays mark information indicating the fixing position of the chip to be temporarily fixed, manufacturing information indicating information related to the manufacturing process of the chip, type information of the chip, or advertisement information.

3. The transport tray according to claim 1 or 2, wherein the information display section displays the information in colors, characters, or codes.

4. The transport tray according to claim 1, 2, or 3, wherein the information display section can rewrite the information by an external stimulus.

5. A method for manufacturing a transport tray, comprising: a tray preparation step of preparing a tray for accommodating a chip; an information display section arrangement step of arranging an information display section for displaying information on the bottom surface of the tray; and a resin layer coating step of coating a resin layer having adhesiveness and transmitting visible light on the upper surface of the information display section, wherein the information display section is the screen of a mobile terminal as the transport tray.

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