Processing system

Abstract

To support operation of processing of workpieces while considering an environment.SOLUTION: A processing system 1 comprises: a holding table 6 for holding a workpiece; a processing unit 20 for processing the workpiece held on the holding table 6; and a control unit 40. The control unit 40 comprises: a processing condition storage section 410 that stores a plurality of processing conditions; a power calculation section 41 that calculates the usage of power in processing the workpiece for each processing condition; a fluid calculation section 42 that calculates the usage of fluid in processing the workpiece for each processing condition; and a CO2 calculation section 43 that, on the basis of values calculated by the power calculation section 41 and the fluid calculation section 42, calculates the amount of discharge of CO2 to be discharged in processing the workpiece for each processing condition.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a processing system.

Background Art

[0002] When a processing unit for processing a workpiece is operated, it consumes power and fluids such as air and water, and thus discharges carbon dioxide. For example, Patent Document 1 discloses a management device that obtains the power consumption of electrical equipment used in a semiconductor manufacturing apparatus, displays the total amount thereof in a display means in terms of heat quantity, and obtains and displays the amount of carbon dioxide generated by multiplying the power consumption by a crude oil conversion coefficient.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventional industrial machines perform processing using a plurality of different processing conditions, so it has been difficult to accurately determine the amount of carbon dioxide emissions generated during processing. However, in recent years, environmentally conscious operation has been required for industrial machines, so there is a need to accurately grasp the amount of carbon dioxide emissions from conventional industrial machines and achieve environmentally conscious operation.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a processing system capable of supporting environmentally conscious operation of processing workpieces.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, a processing system according to the present invention includes a holding table for holding a workpiece, a processing unit for processing the workpiece held on the holding table, and a control unit, and the control unit includes a processing condition storage unit for storing a plurality of processing conditions, a power calculation unit for calculating the amount of power used in processing the workpiece for each of the processing conditions, a fluid calculation unit for calculating the amount of fluid used in processing the workpiece for each of the processing conditions, and a CO 2 emission amount calculation unit for calculating the amount of CO 2 emitted in processing the workpiece for each of the processing conditions, and is characterized by including the same.

[0007] In the processing system, for each of the processing conditions, a display unit for displaying the amount of CO 2 emitted calculated by the CO 2 emission amount calculation unit may be further provided.

[0008] In the processing system, the control unit further includes a status storage unit for storing the execution time for each status including at least during processing in which the workpiece is continuously processed, during maintenance in which a unit including the processing unit is maintained in a state where the workpiece is not being processed, and during idling in which the processing unit is driven while supplying fluid to the processing unit in a state where the workpiece is not being processed, and the CO 2 emission amount calculation unit may calculate the amount of CO 2 emitted according to the status.

Effect of the Invention

[0009] The processing system of the present invention has an effect that it can support the operation of processing a workpiece in consideration of the environment.

Brief Description of the Drawings

[0010]

Figure 1

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Figure 8

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the content described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0012] In the embodiments described below, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. One direction in the horizontal plane is the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction is the Z-axis direction. The XY plane including the X-axis and the Y-axis is parallel to the horizontal plane. The Z-axis direction orthogonal to the XY plane is the vertical direction.

[0013] [Embodiment] A processing system according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing system according to the embodiment. As shown in FIG. 1, the processing system 1 grinds a region corresponding to the device region on the back surface of the workpiece 200 to form the thickness of the device region into a predetermined thickness, and leaves the outer peripheral surplus region on the back surface of the workpiece 200 to form a ring-shaped reinforcing portion.

[0014] In FIG. 1, the workpiece 200, which is the object to be processed by the processing system 1, includes, for example, a substrate 201. The substrate 201 is, for example, disk-shaped silicon, such as a disk-shaped semiconductor wafer or an optical device wafer. Devices may be formed in regions partitioned by a plurality of division planned lines formed in a grid pattern on either surface. An adhesive tape 205 is attached to one surface of the workpiece 200.

[0015] The processing system 1 includes, for example, a housing 2, a first processing means 3, a second processing means 4, for example, three holding tables 6 installed on a turntable 5, cassettes 7 and 8, an alignment means 9, a loading unit 10, an unloading unit 11, a cleaning unit 12, a loading / unloading unit 13, and a control unit 40.

[0016] The turntable 5 is a disk-shaped one provided on the upper surface of the housing 2, is rotatably provided in the horizontal plane, and is rotationally driven at an appropriate timing. On this turntable 5, for example, three holding tables 6 are arranged at equal intervals at a phase angle of, for example, 120 degrees. These holding tables 6 are of a chuck table structure having a vacuum chuck on the upper surface, and vacuum-adsorb and hold the workpiece 200 placed on the flat holding surface. These holding tables 6 are rotationally driven in the horizontal plane about the rotation axis φ0 perpendicular to the holding surface by a rotation drive mechanism (not shown) during grinding. Such a holding table 6 is relatively moved between the loading / unloading position 101, the rough grinding position 102 facing the first processing means 3, and the finish grinding position 103 facing the second processing means 4 by the rotation of the turntable 5.

[0017] The first processing means 3 includes a first grinding wheel 3-1 having a first grinding surface facing the holding surface of the holding table 6 located at the rough grinding position 102, a first spindle portion 3-2 that rotatably supports the first grinding wheel 3-1 with the vertical axis perpendicular to the first grinding surface as the first rotation axis φ1, and a first slide portion 3-3 that supports the first spindle portion 3-2 so as to be movable forward and backward in the axial direction of the first rotation axis φ1. Here, as the first grinding wheel, a rough grinding wheel with large abrasive grains is used. That is, while rotating the first grinding wheel 3-1 having the first grinding surface detachably attached to the lower end of the first spindle portion 3-2 about the first rotation axis φ1 by the motor 3-4, the first slide portion 3-3 presses and contacts the upper surface of the workpiece 200 held on the holding surface of the holding table 6 located at the rough grinding position 102, so as to perform a predetermined rough grinding process on the upper surface of the workpiece 200 as described below.

[0018] The second processing means 4 includes a second grinding wheel 4-1 having a second grinding surface facing the holding surface of the holding table 6 located at the finish grinding position 103, a second spindle portion 4-2 that rotatably supports the second grinding wheel 4-1 with a vertical axis perpendicular to the second grinding surface as the second rotation axis φ2, and a second slide portion 4-3 that supports the second spindle portion 4-2 so as to be movable forward and backward in the axial direction of the second rotation axis φ2. Here, as the second grinding wheel, a finish grinding wheel with fine abrasive grain size is used. That is, while rotating the second grinding wheel 4-1 having a second grinding surface detachably attached to the lower end of the second spindle portion 4-2 about the second rotation axis φ2 by a motor 4-4, the second slide portion 4-3 presses and contacts the upper surface of the workpiece 200 held on the holding surface of the holding table 6 located at the finish grinding position 103, so as to perform a predetermined finish grinding process on the upper surface of the workpiece 200 as described later. Such a second processing means 4, although not shown, has a mechanism for setting the second rotation axis φ2 to be inclined with respect to the rotation axis φ0, similar to the above-described first processing means 3.

[0019] Also, the first slide portion 3-3 of the first processing means 3 and the second slide portion 4-3 of the second processing means 4 are respectively provided so as to be vertically movable by the vertical feed means 15 and 16, and are configured to be capable of grinding feed with respect to the upper surface of the workpiece 200 on the holding table 6 for the first grinding wheel 3-1 and the second grinding wheel 4-1. These vertical feed means 15 and 16 are mounted on the movable blocks 17 and 18 provided on the upper surface of the housing 2. The movable blocks 17 and 18 are movably provided with respect to the housing 2 by a movement mechanism (not shown) so that the first grinding wheel 3-1 and the second grinding wheel 4-1 move forward and backward in the radial direction of the turntable 5 with respect to the holding table 6 located at the rough grinding position 102 and the finish grinding position 103.

[0020] The cassettes 7 and 8 are containers for the workpiece 200 having a plurality of slots. One cassette 7 accommodates the workpiece 200 before grinding, and the other cassette 8 accommodates the workpiece 200 after grinding. Note that the workpiece 200 is not particularly limited, and examples include semiconductor wafers such as silicon wafers and GaAs, ceramics, glass, sapphire (Al 2 O 3 )-based inorganic material substrates, ductile materials such as plate-shaped metals and resins, and various processing materials that require a flatness in the plane order from the micron order to the submicron order (TTV: Total Thickness Variation: the difference between the maximum value and the minimum value over the entire surface of the workpiece 200 of the height measured in the thickness direction with the ground surface of the workpiece 200 as the reference surface).

[0021] Also, the alignment means 9 is a table for temporarily placing the workpiece 200 taken out from the cassette 7 and performing centering alignment thereon. The loading unit 10 includes a loading arm having a suction pad and driven to rotate in the horizontal plane, and sucks and holds the workpiece 200 before grinding aligned by the alignment means 9 and loads it onto the holding table 6 located at the loading / unloading position 101. The unloading unit 11 includes a loading arm having a suction pad and driven to rotate in the horizontal plane, and sucks and holds the workpiece 200 after grinding held on the holding table 6 located at the loading / unloading position 101 and unloads it to the cleaning unit 12. Further, the loading / unloading unit 13 is, for example, a robot pick having a U-shaped hand, and sucks and holds the workpiece 200 with the U-shaped hand and loads it. Specifically, the loading / unloading unit 13 unloads the workpiece 200 before grinding from the cassette 7 to the alignment means 9 and loads the workpiece 200 after grinding from the cleaning unit 12 to the cassette 8. The cleaning unit 12 cleans the workpiece 200 after grinding and removes contaminants such as grinding debris adhering to the ground processing surface.

[0022] The control unit 40 is composed of a microcomputer and is for controlling the operations of the respective parts of the processing system 1 in order to perform a desired grinding process on the workpiece 200. A configuration example of the control unit 40 will be described later.

[0023] The control unit 40 adjusts the first processing means 3 and the second processing means 4 so as to correspond to the processing conditions of the workpiece 200. The control unit 40 rotates the turntable 5 to sequentially transfer the workpiece 200 to the rough grinding position and the finish grinding position. At each transferred grinding position, the control unit 40 grinds the workpiece 200 by the first processing means 3 and the second processing means 4. The control unit 40 rotates the turntable 5 to transfer the ground workpiece 200 to the loading / unloading position 101.

[0024] The control unit 40 causes the workpiece 200 carried onto the holding table 6 positioned at the loading / unloading position 101 to be held by the holding table 6 such that the processing surface of the workpiece 200 is exposed. The control unit 40 rotates the turntable 5 to move the holding table 6 holding the workpiece 200 from the loading / unloading position 101 to the rough grinding position 102, and then causes the workpiece 200 held by the holding table 6 positioned at the rough grinding position 102 to be rough ground by the first processing means 3 from the processing surface side.

[0025] The control unit 40 rotates the turntable 5 to move the holding table 6 holding the workpiece 200 that has been rough ground from the rough grinding position 102 to the finish grinding position 103, and then causes the workpiece 200 held by the holding table 6 positioned at the finish grinding position 103 to be finish ground by the second processing means 4 from the processing surface side. The control unit 40 rotates the turntable 5 to move the workpiece 200 on the holding table 6 positioned at the finish grinding position 103 to the loading / unloading position. The control unit 40 accommodates the processed workpiece 200 in the cassette 8.

[0026] In this embodiment, the processing system 1 will be described for the case of grinding (processing) the workpiece 200 using three holding tables 6, but it is not limited thereto. For example, the processing system 1 may be configured to grind the workpiece 200 using one or four or more holding tables 6.

[0027] (Functional Configuration of Processing System) FIG. 2 is a diagram schematically showing an example of the functional configuration of the processing system 1 according to the embodiment. As shown in FIG. 2, the processing system 1 further includes a holding table 6, a drive unit 14, a processing unit 20, a valve 30, a display unit 50, and an imaging unit 60. The control unit 40 is electrically connected to the holding table 6, the carry-out unit 11, the cleaning unit 12, the carry-in / carry-out unit 13, the drive unit 14, the processing unit 20, the valve 30, the display unit 50, and the imaging unit 60.

[0028] The drive unit 14 drives each unit, the holding table 6, the turntable 5, etc. under the control of the control unit 40. The drive unit 14 has, for example, a ball screw, a nut, a motor, etc., and is configured to be able to move or rotate an object by driving the motor.

[0029] The processing unit 20 has the first processing means 3 and the second processing means 4 described above. The processing unit 20 is configured to be able to process the workpiece 200 based on processing conditions under the control of the control unit 40. The processing conditions include, for example, conditions related to processing such as the rotation speed of the motor, the moving speed of the axis of the processing unit 20, the usage amount of the fluid, and the usage time of the fluid.

[0030] The valve 30 is provided in a supply path for supplying a fluid such as water or air to the processing unit 20, and is configured such that the flow rate of the fluid passing through the inside of the supply path can be controlled by the control unit 40. The control unit 40 has a function of calculating the usage amount of the fluid based on the ON time of the valve 30.

[0031] The display unit 50 has a display device capable of displaying various information such as processing conditions and images of the processing system 1. The display unit 50 displays various information under the control of the control unit 40. The display unit 50 is provided on the housing 2 of the processing system 1 so that it can be visually observed by the operator. The display unit 50 has a touch screen that detects the input position and coordinates on the display surface of the display device. The display unit 50 supplies information that can identify operations on the display device to the control unit 40. The display unit 50 may be realized by providing a communication device in the processing system 1 and an external electronic device of the housing 2 that can communicate with the communication device. The electronic device includes, for example, a smartphone, a tablet terminal, a wearable device, a computer, etc.

[0032] The imaging unit 60 is an electron microscope equipped with an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging unit 60 supplies imaging information obtained by imaging the surface of the workpiece 200 held on the holding surface of the holding table 6 to the control unit 40. The imaging unit 60 may include, for example, a light source that irradiates illumination light onto the surface of the workpiece 200. This light source can be composed of an epi-illumination light source that illuminates the workpiece 200 from directly above and an oblique light source that illuminates it from an oblique direction.

[0033] The control unit 40 has a power calculation unit 41, a fluid calculation unit 42, and a CO 2 calculation unit 43, a display control unit 44, and a storage device 400. By executing a program, the control unit 40 realizes the functional units of the power calculation unit 41, the fluid calculation unit 42, the CO 2 calculation unit 43, and the display control unit 44.

[0034] The storage device 400 stores programs for implementing functions such as various processes executed by the control unit 40, and data used in the processes according to such programs. The storage device 400 stores processing conditions, rated power consumption (W) of each unit, start-up time of each unit, ON time of the valve 30, operation history, CO 2 CO used to calculate (carbon dioxide) 2 It is possible to store various data such as coefficients. The data stored in the storage device 400 is updated as appropriate by the control unit 40 in accordance with the processing operation of the machining system 1. The storage device 400 has a machining condition storage section 410 and a status storage section 420.

[0035] The machining condition storage unit 410 stores a plurality of machining conditions that can be used in the machining system 1. The plurality of machining conditions include, for example, data indicating machining conditions, machine settings, and the like for various workpieces 200. The machining conditions include, for example, data indicating machining conditions input and set by an operator. The machining condition storage unit 410 can store machining condition data that can identify machining conditions corresponding to the machining system 1 from machining preparation to machining completion. The machining condition data includes, for example, data that can identify machining conditions for the workpiece 200, such as the motor rotation speed of the machining unit 20, the axis movement speed, the amount of fluid used, and the duration of fluid use.

[0036] The status storage unit 420 stores data that can identify the implementation time for each of a plurality of different statuses in the machining system 1. The plurality of statuses include, for example, at least, during machining, during maintenance, during idling, and the like. During machining, the workpiece 200 is continuously machined. During maintenance, the workpiece 200 is not machined, and each unit of the machining system 1, including the machining unit 20, is maintained. During idling, the machining unit 20 is driven while supplying fluid to the machining unit 20, and the workpiece 20 is not machined. For the plurality of statuses, for example, the operating conditions required for analyzing the operating efficiency of the entire system in the machining system 1 can be appropriately set as the status.

[0037] The memory device 400 stores, for example, data such as the actual time and the number of processed sheets consumed by the processing system 1 for each status in association with the status. The control unit 40 calculates the measured value for each status and stores the data including the measured value in the memory device 400 in association with the status. For example, when the status is full-automation processing, the control unit 40 calculates the actual time from the operation of the full-automation start button until the processing of the set number of sheets is completed. For example, when the status is warm-up, the control unit 40 calculates the actual time from when the warm-up screen is displayed until a different operation from the warm-up is started. For example, when the status is maintenance, the control unit 40 calculates the actual time from when the maintenance screen is displayed until a different operation from the maintenance work is detected, or until a predetermined time has elapsed. The control unit 40 stores the data including the calculation result calculated for each status in the memory device 400. Note that the status may be provided with a status of non-operation where no signal input to the processing system 1 or operation by the operator is detected for a predetermined time or more. The processing system 1 may further provide more detailed statuses and select any status to compare the CO 2 emission amount for each status.

[0038] The power calculation unit 41 calculates the power consumption associated with the processing of the workpiece 200 for each processing condition. The power calculation unit 41 calculates the power consumption (Wh) based on the rated consumption (W) and the start-up time (h) in the processing system 1. The rated consumption means the usage limit under the conditions specified for the equipment. The power calculation unit 41 can provide a function of obtaining the start-up time for each constituent device that uses power in the processing system 1 and calculating the power consumption by multiplying the start-up time by the rated consumption. The rated consumption includes the usage limit under the conditions specified for the constituent device. The power calculation unit 41 calculates the power consumption (Wh) for each constituent device that uses power using the following formula (1) under any processing condition. Power consumption (Wh) = Rated consumption (W) × Start-up time (h) ··· Formula (1)

[0039] FIG. 3 is a diagram for explaining an example of the power consumption calculated by the power calculation unit 41. In the example shown in FIG. 3, the power calculation unit 41 calculates the power consumption when processing 1000 workpieces 200 under arbitrary processing conditions. The power calculation unit 41 has a function of calculating the power consumption of each constituent device that uses power and the total power consumption of a plurality of constituent devices. The constituent devices include, for example, the control unit 40, lighting, the first motor, the second motor, the third motor, and the like. The power calculation unit 41 calculates the startup time for each constituent device based on the actual control result of the constituent device, and multiplies the startup time by the rated consumption to calculate the power consumption of each constituent device. Note that the startup time for each constituent device may be a predicted startup time using, for example, a processing schedule, machine learning, etc., instead of an actually measured value. The power calculation unit 41 stores the calculated power consumption in the storage device 400 in association with the processing conditions.

[0040] Returning to FIG. 2, the fluid calculation unit 42 calculates the amount of fluid used in the processing of the workpiece 200 for each processing condition. The fluid calculation unit 42 calculates the fluid usage amount (L) based on the flow rate (L / min) for each type of liquid in the processing system 1 and the ON time (h) of the valve 30. Since the control unit 40 controls the ON / OFF of the valve 30 disposed in the supply path, the fluid calculation unit 42 calculates the ON time of the valve 30 based on the control state. The fluid calculation unit 42 obtains the flow rate from a flow meter provided in the supply path or calculates the flow rate from the set value of the supply path. The fluid calculation unit 42 can provide a function of calculating the fluid usage amount for each fluid based on the flow rate for each type of fluid and the ON time of the valve 30. The fluid calculation unit 42 calculates the fluid usage amount (L) for each constituent device using the following formula (2) under arbitrary processing conditions. Fluid usage amount (L) = Flow rate (L / min) × Time during which the fluid is supplied (ON time of the valve 30) ··· Formula (2)

[0041] FIG. 4 is a diagram for explaining an example of the fluid usage amount calculated by the fluid calculation unit 42. In the example shown in FIG. 4, the fluid calculation unit 42 calculates the fluid usage amount when processing 1000 workpieces 200 under arbitrary processing conditions. The fluid calculation unit 42 has a function of calculating the fluid usage amount for each type of a plurality of fluids and the total fluid usage amount of the plurality of fluids. The types of the plurality of fluids include, for example, first processing water, second processing water, first cooling water, second cooling water, first cleaning water, second cleaning water, and the like. The fluid calculation unit 42 acquires the actual ON time of the valve 30 for each constituent device, and multiplies the flow rate of the constituent device by the ON time of the valve 30 to calculate the fluid usage amount for each constituent device. Note that the flow rate for each type of fluid may be, for example, a predicted flow rate using a processing schedule, machine learning, or the like. The fluid calculation unit 42 stores the calculated fluid usage amount in association with the processing conditions in the storage device 400.

[0042] FIG. 5 is a diagram for explaining another example of the fluid usage amount calculated by the fluid calculation unit 42. In the example shown in FIG. 5, the fluid calculation unit 42 calculates the fluid usage amount when processing 1000 workpieces 200 under arbitrary processing conditions. The fluid calculation unit 42 has a function of calculating the fluid usage amount for each control target of the control unit 40 and the total fluid usage amount of the plurality of control targets. In the example shown in FIG. 5, the plurality of control targets include, for example, a first motor, a second motor, drying air, a chuck table, a spinner table, and the like. The spinner table sucks and holds the workpiece 200 in a cylindrical cleaning space in the cleaning unit 12. The fluid calculation unit 42 acquires the ON time of the valve 30 for each control target, and multiplies the flow rate of the control target by the ON time of the valve 30 to calculate the fluid usage amount for each control target. Note that the flow rate for each control target may be a predicted flow rate using a processing schedule, machine learning, or the like instead of an actual measured value. The fluid calculation unit 42 stores the calculated fluid usage amount for the control target and the whole in association with the processing conditions in the storage device 400.

[0043] Note that when the processing system 1 includes a cylinder, the fluid calculation unit 42 may have a function of calculating the fluid usage amount by multiplying the volume (L) of the cylinder by the number of reciprocations of the piston (the number of times the cylinder is operated).

[0044] Return to FIG. 2, and for CO 2 Based on the values calculated by the power calculation unit 41 and the fluid calculation unit 42, the calculation unit 43 calculates the amount of CO 2 emitted during the processing of the workpiece 200 for each processing condition. For CO 2 The calculation unit 43 calculates the amount of CO 2 emitted using the power consumption calculated by the power calculation unit 41 and the CO 2 coefficient. In this case, for CO 2 coefficient, a known CO 2 emission coefficient of electricity, a coefficient arbitrarily set according to the conversion efficiency of the equipment set in the processing system 1, etc. can be used. In this embodiment, the CO 2 coefficient corresponding to electricity includes, for example, 0.462 kg-CO 2 / kWh.

[0045] For CO 2 The calculation unit 43 calculates the amount of CO 2 emitted using the fluid consumption calculated by the fluid calculation unit 42 and the CO 2 coefficient. In this case, for CO 2 coefficient, a known CO 2 emission coefficient of water and air, a coefficient arbitrarily set according to the conversion efficiency of the equipment set in the processing system 1, etc. can be used. In this embodiment, the CO 2 coefficient corresponding to water includes, for example, 5.5 kg-CO 2 / m 3 . The CO 2 coefficient corresponding to air includes, for example, 0.0034 kg-CO 2 / m 3 .

[0046] For CO 2 The calculation unit 43 stores the calculated amount of CO 2 emission in the storage device 400 in association with the processing conditions. For CO 2 The calculation unit 43 stores, for example, the status of the processing system 1 and the amount of CO 2 emission in association with each other in the storage device 400 for each processing condition. For CO 2The calculation unit 43 associates processing information related to processing, such as startup time, processing time, and number of processed sheets, in the status with the CO 2 emission amount and stores it in the storage device 400.

[0047] The display control unit 44 causes the display unit 50 to display various information related to the processing system 1. The display control unit 44 performs control to cause the display unit 50 to display a screen capable of identifying the relationship between the processing conditions of the processing system 1 and the CO 2 emission amount. The screen is, for example, a screen displayed on the display unit 50 based on HTML tags included in information in HTML (Hyper Text Markup Language) format.

[0048] FIG. 6 is a diagram showing an example of a screen displayed by the processing system 1 according to the embodiment. FIG. 7 is a diagram showing another example of a screen displayed by the processing system 1 according to the embodiment. The display control unit 44 causes the display unit 50 to display the screen 510 shown in FIG. 6 and the screen 520 shown in FIG. 7. The display control unit 44 causes the display unit 50 to display the screen 510 associated with the processing conditions and the screen 520 associated with the status, with the CO 2 emission amount calculated by the calculation unit 43. 2 emission amount.

[0049] As shown in FIG. 6, the screen 510 is a screen capable of displaying the CO 2 emission amount for each processing condition. The screen 510 has a processing condition area 511, a processing time area 512, a number of processed sheets area 513, and a CO 2 emission amount area 514. The processing condition area 511 is an area for displaying a plurality of different processing conditions 600-1, 600-2, 600-3. Hereinafter, when the processing conditions 600-1, 600-2, 600-3 are not distinguished, they will be referred to as processing condition 600 as appropriate. The processing time area 512 displays the processing time corresponding to the processing condition 600 in the processing condition area 511. The number of processed sheets area 513 displays the number of processed sheets of the workpiece 200 corresponding to the processing condition 600 in the processing condition area 511. The CO 2 emission amount area 514 is the CO corresponding to the processing condition 600 in the processing condition area 5112 Displays the discharge amount. By causing the display unit 50 to display the screen 510, the processing system 1 can allow the relationship between the processing time, the number of processed sheets, and the CO 2 discharge amount to be confirmed for each processing condition 600.

[0050] As shown in FIG. 7, the screen 520 corresponds to the desired processing condition selected by the operator and can display the relationship between the status and the CO 2 discharge amount. The screen 520 has a status area 521, a time area 522, a CO 2 discharge amount area 523, and a graph area 524. The status area 521 is an area for displaying the status of the processing system 1 corresponding to any processing condition 600. The time area 522 displays the time corresponding to the status of the status area 521. The time corresponding to the status includes the time from the start of the status to the end. For example, when the status is full automation processing, the time is the time from the operation of the full automation start button until the processing of the set number of sheets is completed. For example, when the status is warm-up, the time is the time from the display of the warm-up screen until the start of an operation different from the warm-up. For example, when the status is maintenance, the time is the time from the display of the maintenance screen until the detection of an operation different from the maintenance work or until a predetermined time has elapsed. CO 2 The discharge amount area 523 displays the CO 2 discharge amount corresponding to the status of the status area 521. The graph area 524 displays a graph showing the ratio of the CO 2 discharge amount corresponding to the status of the status area 521. By causing the display unit 50 to display the screen 520, the processing system 1 can allow the relationship between the time and the CO 2 discharge amount to be confirmed for each status of the processing condition 600. In this way, the display control unit 44 can cause the display unit 50 to display a plurality of screens 520 corresponding to each of the plurality of processing conditions.

[0051] The configuration example of the processing system 1 according to the present embodiment has been described above. Note that the above configuration described with reference to FIGS. 1 to 7 is merely an example, and the configuration of the processing system 1 according to the present embodiment is not limited to such an example. The functional configuration of the processing system 1 according to the present embodiment can be flexibly modified according to specifications and operations.

[0052] (Control Example of Processing System) FIG. 8 is a flowchart showing an example of a processing procedure executed by the processing system 1 according to the embodiment. The processing procedure shown in FIG. 8 is realized by the control unit 40 of the processing system 1 executing a program. The processing procedure shown in FIG. 8 is executed by the control unit 40 at an arbitrary timing. The arbitrary timing includes, for example, the timing when a display is instructed by an operator, the timing when preset execution conditions are satisfied, and the like.

[0053] As shown in FIG. 8, the control unit 40 of the processing system 1 acquires information regarding processing conditions (step 1001). For example, the control unit 40 acquires various data such as a plurality of processing conditions used for the workpiece 200, the processing conditions to be displayed, the rated power consumption (W) of each unit, the startup time of each unit, the ON time of the valve 30, and the CO 2 coefficient from the storage device 400. When the processing in step 1001 is completed, the control unit 40 proceeds to step 1002.

[0054] The control unit 40 calculates the power consumption associated with the processing of the workpiece 200 for each processing condition (step 1002). For example, the control unit 40 calculates the power consumption for each processing condition based on the rated usage amount and startup time in the processing system 1 using the above-described formula (1). When the calculated power consumption is stored in the storage device 400 in association with the processing conditions, the control unit 40 proceeds to step 1003.

[0055] The control unit 40 calculates the amount of fluid used in the machining of the workpiece 200 for each machining condition (step 1003). For example, the control unit 40 calculates the fluid usage based on the flow rate for each type of liquid in the machining system 1 and the ON time of the valve 30 for each machining condition using the above-described formula (2). When the control unit 40 stores the calculated fluid usage in the storage device 400 in association with the machining condition, the process proceeds to step 1004.

[0056] The control unit 40 calculates the amount of CO 2 emissions discharged during the machining of the workpiece 200 for each machining condition (step 1004). For example, the control unit 40 calculates the amount of CO 2 emissions discharged due to the use of electricity using the electricity consumption calculated in step 1002 and the CO 2 coefficient. The control unit 40 calculates the amount of CO 2 emissions discharged due to the use of fluid using the fluid usage calculated in step 1003 and the CO 2 coefficient. When the control unit 40 stores the calculated amount of CO 2 emissions in the storage device 400 in association with the identifiable information of the electricity or fluid used for the calculation, the process proceeds to step 1005.

[0057] The control unit 40 creates screen data for displaying the amount of CO 2 emissions (step 1005). For example, the control unit 40 creates screen data for displaying a screen 510 that can identify the relationship between the machining time, the number of machined workpieces, and the amount of CO 2 emissions for each machining condition 600. The control unit 40 creates screen data for displaying a screen 520 that can identify the relationship between the status according to during machining, during maintenance, and during idling, the time, and the amount of CO 2 emissions for each machining condition 600. When the process of step 1005 is completed, the control unit 40 proceeds to step 1006.

[0058] The control unit 40 2Control the display of the screen data indicating the discharge amount (step 1006). For example, the control unit 40 controls the display unit 50 to display the screen data. Thereby, the display unit 50 displays the screens 510, 520, etc. based on the screen data. When the control unit 40 detects an operator's operation on the display unit 50, it executes a process corresponding to the operation. For example, when the control unit 40 causes the display unit 50 to display the screen 510 and detects a selection operation for the processing condition 600 of the screen 510, it controls the display unit 50 to display the screen 520 corresponding to the processing condition 600. When the control unit 40 detects the end of the display of the screen data, it ends the processing procedure shown in FIG. 8.

[0059] As described above, based on the amounts of power and fluid used in the processing of the workpiece 200, the processing system 1 discharges CO 2 during the processing of the workpiece 200 for each processing condition 600. Thereby, the processing system 1 can calculate the discharge amount. 2 As a result, the processing system 1 can assist in comparing the CO 2 discharge amounts for each processing condition 600, and can cause the processing condition 600 with a smaller CO 2 discharge amount to be selected. For example, when a plurality of processing conditions 600 satisfy the desired processing quality, the processing system 1 can cause the processing condition 600 with a smaller CO

[0060] discharge amount to be selected. As a result, the processing system 1 can assist in operating the processing of the workpiece 200 while considering the environment. 2 The processing system 1 can display the CO 2 discharge amount for each processing condition 600 on the display unit 50. Thereby, the processing system 1 can easily cause the display unit 50 to confirm the relationship between the plurality of processing conditions 600 and the CO

[0061] discharge amount, and can easily select the processing condition 600 suitable for the environment from the plurality of processing conditions 600. 2By calculating the emission amount, it is possible to grasp the CO emission amount for each status under processing condition 600. As a result, the processing system 1 can provide a machine that makes it possible to improve the efficiency of maintenance or to check whether the idling time is excessive. Note that the time corresponding to each status such as during processing, during maintenance, and during idling may be a time predicted using, for example, a processing schedule, machine learning, etc., instead of an actually measured value, or may be arbitrarily set by an operator, and the CO emission amount generated according to the time set by the operator may be used for the purpose of confirmation. 2 Note that the present invention is not limited to the above-described embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention. 2 In the above embodiment, the case where the control unit 40 that controls the processing unit 20 and the like of the processing system 1 has functional units of the power calculation unit 41, the fluid calculation unit 42, and the CO calculation unit 43 has been described, but the present invention is not limited to this. The processing system 1 may be realized by dispersing the control unit 40 among a plurality of devices. For example, the processing system 1 can realize the control unit 40 with two control units, a processing device and a management device capable of communicating with the processing device. In this case, the processing system 1 may be configured such that the control unit of the processing device includes the power calculation unit 41 and the fluid calculation unit 42 and provides the usage amounts of power and fluid to the management device. Then, the processing system 1 may be configured to include the CO calculation unit 43 that calculates the emission amount based on the usage amounts of power and fluid provided by the processing device to the management device. That is, the processing system 1 may be realized as a system including a plurality of processing devices and a server device that executes the function of the CO calculation unit 43, and providing the calculation result of the server device to the processing device or an electronic device carried by the operator.

[0062] Note that the present invention is not limited to the above-described embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention.

[0063] In the above embodiment, the case where the control unit 40 that controls the processing unit 20 and the like of the processing system 1 has functional units of the power calculation unit 41, the fluid calculation unit 42, and the CO calculation unit 43 has been described, but the present invention is not limited to this. The processing system 1 may be realized by dispersing the control unit 40 among a plurality of devices. For example, the processing system 1 can realize the control unit 40 with two control units, a processing device and a management device capable of communicating with the processing device. In this case, the processing system 1 may be configured such that the control unit of the processing device includes the power calculation unit 41 and the fluid calculation unit 42 and provides the usage amounts of power and fluid to the management device. Then, the processing system 1 may be configured to include the CO calculation unit 43 that calculates the emission amount based on the usage amounts of power and fluid provided by the processing device to the management device. That is, the processing system 1 may be realized as a system including a plurality of processing devices and a server device that executes the function of the CO calculation unit 43, and providing the calculation result of the server device to the processing device or an electronic device carried by the operator. 2 In the above embodiment, the case where the control unit 40 that controls the processing unit 20 and the like of the processing system 1 has functional units of the power calculation unit 41, the fluid calculation unit 42, and the CO calculation unit 43 has been described, but the present invention is not limited to this. The processing system 1 may be realized by dispersing the control unit 40 among a plurality of devices. For example, the processing system 1 can realize the control unit 40 with two control units, a processing device and a management device capable of communicating with the processing device. In this case, the processing system 1 may be configured such that the control unit of the processing device includes the power calculation unit 41 and the fluid calculation unit 42 and provides the usage amounts of power and fluid to the management device. Then, the processing system 1 may be configured to include the CO calculation unit 43 that calculates the emission amount based on the usage amounts of power and fluid provided by the processing device to the management device. That is, the processing system 1 may be realized as a system including a plurality of processing devices and a server device that executes the function of the CO calculation unit 43, and providing the calculation result of the server device to the processing device or an electronic device carried by the operator. 2 emission amount calculation 2 calculation unit 43, and is configured to provide the calculation result of the server device to the processing device or an electronic device carried by the operator. 2 That is, the processing system 1 may be realized as a system including a plurality of processing devices and a server device that executes the function of the CO calculation unit 43, and providing the calculation result of the server device to the processing device or an electronic device carried by the operator.

[0064] In the above-described embodiment, the processing system 1 has been described when realized by a grinding apparatus that grinds the workpiece 200, but the present invention is not limited thereto. For example, the processing system 1 may be realized by a processing apparatus such as a cutting apparatus, a polishing apparatus, a plasma etching apparatus, a laser beam irradiation apparatus, or a tool cutting apparatus.

Explanation of Signs

[0065] 1 Processing system 3 First processing means 4 Second processing means 6 Holding table 11 Unloading unit 12 Cleaning unit 13 Loading / unloading unit 14 Driving unit 20 Processing unit 30 Valve 40 Control unit 41 Power calculation unit 42 Fluid calculation unit 43 CO 2 Calculation unit 44 Display control unit 50 Display unit 60 Imaging unit 200 Workpiece 400 Storage device 410 Processing condition storage unit 420 Status storage unit 510 Screen 520 Screen 600 Processing conditions

Claims

1. A holding table for holding a workpiece, a processing unit for processing the workpiece held on the holding table, a control unit, and a processing system comprising: wherein the control unit comprises a processing condition storage unit for storing a plurality of processing conditions, a power calculation unit for calculating the amount of power used in processing the workpiece for each of the processing conditions, and a fluid calculation unit for calculating the amount of fluid used in processing the workpiece for each of the processing conditions, Based on the values calculated by the power calculation unit and the fluid calculation unit, the CO ２ emission amount discharged during the processing of the workpiece for each processing condition is calculated by the CO ２ calculation unit, and characterized in that it comprises the above.

2. For each of the processing conditions, the CO ２ The processing system according to claim 1, further comprising a display unit that displays the CO emission amount calculated by the calculation unit. ２ emission amount calculated by the calculation unit.

3. The control unit is in a processing state where the workpiece is being continuously processed, is in a maintenance state where the unit including the processing unit is being maintained with the workpiece not being processed, is in an idling state where the processing unit is being driven while supplying fluid to the processing unit with the workpiece not being processed, and further comprises a status storage unit for storing the execution time for each status including at least the above. The CO ２ calculation unit calculates the CO ２ emission amount according to the status, and the processing system according to claim 1 or 2 is characterized in that.

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