Fixture

Abstract

To provide a fixture capable of easily mounting a plate on a cooling plate provided in a plasma device.SOLUTION: A fixture 80 for fixing a plate to a cooling plate provided in a plasma device includes a ring member 82 that can accommodate the plate and the cooling plate, and a fixing unit 88 that fixes the plate accommodated in the ring member 82 and the cooling plate in contact with each other. The ring member 82 includes a plate accommodation portion in which the plate is accommodated, an annular support surface 84e that supports the outer peripheral portion of the plate accommodated in the plate accommodation portion, a cooling plate accommodation portion provided on the side opposite to the support surface 84e of the plate accommodation portion so as to overlap with the plate accommodation portion and accommodate the cooling plate, and an annular recess 86d provided on the outer peripheral surface side of the ring member 82, and the fixing unit 88 includes a plurality of frames 90 and a connection member 94 that connects the plurality of frames 90.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a fixture for fixing plates such as a holding plate and an electrode plate to a cooling plate provided in a plasma device.

Background Art

[0002] In the manufacturing process of device chips, a wafer in which devices are formed in a plurality of regions partitioned by a plurality of streets (division planned lines) arranged in a grid pattern is used. By dividing this wafer along the streets, a plurality of device chips each having a device can be obtained. The device chips are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] For wafer dicing, a cutting device that cuts a workpiece with an annular cutting blade, a laser processing device that performs laser processing by irradiating a laser beam on the workpiece, etc. are used. In recent years, with the miniaturization of electronic devices, thin device chips have been demanded. Therefore, a process of thinning the wafer may be performed before dicing the wafer. For the wafer thinning process, a grinding device that grinds a workpiece with a grinding wheel including a plurality of grinding wheels, a polishing device that polishes a workpiece with a disk-shaped polishing pad, etc. are used.

[0004] When processing a wafer with the above various processing devices, processing defects such as chipping, scratches, and warping may occur in the processed area of the wafer. And when the wafer is divided to manufacture device chips with processing defects remaining, the processing defects also remain in the device chips. As a result, problems such as a decrease in the flexural strength (bending strength) of the device chips occur, and the quality of the device chips deteriorates.

[0005] Therefore, a process may be carried out in which plasma etching is performed on the processed wafer to remove processing defects remaining on the wafer. For example, Patent Document 1 discloses a grinding apparatus provided with a plasma apparatus (dry etching means) that performs dry etching using plasma on a wafer after grinding to remove distortion remaining on the wafer. By dividing the wafer after removing such processing defects, high-quality device chips can be obtained.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] A plasma apparatus for performing plasma etching on a workpiece such as a wafer includes a chamber that constitutes a processing chamber where plasma etching is performed. Inside the chamber, a chuck table for holding the workpiece, a pair of electrode plates arranged substantially parallel to each other, etc. are accommodated.

[0008] When performing plasma etching on the workpiece, the workpiece is placed between a pair of electrode plates, and the inside of the chamber is depressurized. In this state, when a high-frequency voltage is applied to the pair of electrode plates while supplying an etching gas to the chamber, plasma containing ions and radicals is generated between the pair of electrode plates. By supplying this plasma to the workpiece, plasma etching is performed on the workpiece.

[0009] During plasma etching, the electrode plate to which a high-frequency voltage is applied generates heat and becomes hot. Therefore, a cooling plate for cooling the object is installed in the chamber, and the electrode plate is fixed with fastening bolts so as to be in contact with the cooling plate. As a result, the electrode plate is integrated with the cooling plate, and the heat generation of the electrode plate is suppressed by the cooling plate.

[0010] However, if the fastening bolts are inserted and fastened from the exposed surface side of the electrode plate toward the cooling plate side, the head of the fastening bolt is positioned between the pair of electrode plates. As a result, abnormal discharge is likely to occur around the fastening bolt during plasma generation, which may inhibit plasma generation and etching of the workpiece. Therefore, the fastening bolts are inserted and fastened from the cooling plate side located on the opposite side of the exposed surface of the electrode plate toward the electrode plate side.

[0011] However, on the cooling plate side in the chamber, there are often provided supports, pipes, wirings, etc. for supporting the cooling plate, and sufficient space is not secured. Therefore, it is difficult to perform the operation of attaching the electrode plate to the cooling plate, and there is a risk of accidentally dropping the electrode plate or the fastening bolts during the operation. In addition, the electrode plate needs to be cleaned regularly, and the attachment and detachment of the electrode plate are frequently performed. Therefore, if the workability of attaching and detaching the electrode plate is poor, the attachment and detachment work takes time and effort, and imposes a burden on the operator.

[0012] Furthermore, the chuck table installed in the chamber includes a holding plate for holding the workpiece. And, in order to suppress heat generation during plasma etching, the holding plate is also fixed to the cooling plate. Therefore, similar to the attachment and detachment operation of the electrode plate, the attachment and detachment operation of the holding plate also takes time and effort.

[0013] The present invention has been made in view of such problems, and an object thereof is to provide a fixture capable of easily attaching plates such as an electrode plate and a holding plate to a cooling plate provided in a plasma device.

Means for Solving the Problem

[0014] According to one aspect of the present invention, there is provided a fixture for fixing a plate to a cooling plate provided in a plasma device, including a ring member capable of accommodating the plate and the cooling plate, and a fixing unit for fixing the plate and the cooling plate accommodated in the ring member in contact with each other. The ring member includes a plate accommodating portion for accommodating the plate, an annular support surface for supporting the outer peripheral portion of the plate accommodated in the plate accommodating portion, a cooling plate accommodating portion provided on the side opposite to the support surface of the plate accommodating portion so as to overlap the plate accommodating portion for accommodating the cooling plate, and an annular recess provided on the outer peripheral surface side of the ring member. The fixing unit includes a plurality of frame bodies and a connecting member for connecting the plurality of frame bodies. The frame body includes a convex portion formed toward the inside of the frame body and fitted into the recess of the ring member, a pressing portion formed toward the inside of the frame body for pressing the outer peripheral portion of the cooling plate accommodated in the ring member, a connecting portion provided on the outer peripheral surface side of the frame body into which the connecting member is fitted, and a screw hole formed along a direction intersecting the thickness direction of the frame body and exposed at the connecting portion. The connecting member includes an insertion hole connected to the screw hole. By fastening a fastening bolt from the outer peripheral surface side of the frame body through the insertion hole to the screw hole with the connecting member fitted into the connecting portion, a fixture for fixing the plate to the cooling plate is provided.

[0015] Preferably, the connecting member is formed such that the contour of the connecting member follows the contour of the connecting portion. When the connecting member is fitted into the connecting portion or the fastening bolt is fastened to the screw hole, a force for approaching the plurality of frame bodies to each other acts on the plurality of frame bodies.

[0016] Also preferably, the plate is an electrode plate to which a voltage for generating plasma is applied. Also preferably, the plate is a holding plate for holding a workpiece.

Advantages of the Invention

[0017] The fixture according to one aspect of the present invention includes a cooling plate and a ring member capable of accommodating the plate, and a fixing unit that fixes the cooling plate and the plate accommodated in the ring member in contact with each other. The fixing unit includes a plurality of frames and connecting members. Then, by fitting the connecting members into the connecting portions of the plurality of frames and fastening the fastening bolts from the outer peripheral surface side of the plurality of frames through the insertion holes of the connecting members to the screw holes, the plate can be fixed to the cooling plate. As a result, the operation of screwing the fastening bolts from the cooling plate side toward the plate side becomes unnecessary, and the attachment / detachment operation of the plate can be easily performed.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments according to an aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a plasma device in which the fixture according to the present embodiment can be used will be described. FIG. 1 is a partial cross-sectional front view showing a plasma device (etching device) 2 that performs plasma etching on a workpiece 11.

[0020] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as silicon, and has a front surface and a back surface that are generally parallel to each other. The workpiece 11 is partitioned into a plurality of rectangular regions by a plurality of streets (division planned lines) arranged in a grid pattern so as to intersect each other.

[0021] In each of the plurality of regions partitioned by the streets of the workpiece 11, devices such as IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) devices are formed. By dividing the workpiece 11 along the streets, a plurality of device chips each having a device are manufactured.

[0022] However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass (quartz glass, borosilicate glass, etc.), resin, ceramics, metal, etc. Also, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the devices, and the workpiece 11 may not have devices formed thereon.

[0023] Furthermore, the workpiece 11 may be a resin package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, a resin package substrate is formed by encapsulating a plurality of device chips mounted on a base substrate with a resin layer (mold resin). By dividing the resin package substrate into individual pieces, a plurality of package devices each including a plurality of packaged device chips are manufactured.

[0024] Various processes are performed on the workpiece 11. For example, for dividing the workpiece 11, a cutting device that cuts the workpiece 11 with an annular cutting blade, a laser processing device that irradiates the workpiece 11 with a laser beam to perform laser processing, and the like are used. Also, before dividing the workpiece 11, a process of thinning the workpiece 11 may be performed. For the thinning process of the workpiece 11, a grinding device that grinds the workpiece with a grinding wheel including a plurality of grinding stones, a polishing device that polishes the workpiece with a disk-shaped polishing pad, and the like are used.

[0025] When the workpiece 11 is processed, processing defects such as chipping, scratches, and distortion may occur in the processed area of the workpiece 11. Therefore, the workpiece 11 after processing is subjected to plasma etching by the plasma device 2. Thereby, the processing defects remaining in the workpiece 11 are removed.

[0026] The plasma device 2 includes a rectangular parallelepiped chamber 4. The chamber 4 has a bottom wall 4a, an upper wall 4b, a first side wall 4c, a second side wall 4d, a third side wall 4e, and a fourth side wall (not shown). The inside of the chamber 4 corresponds to a processing space 6 where plasma processing is performed.

[0027] An opening 8 that connects the inside and outside of the chamber 4 is provided in the second side wall 4d. The opening 8 corresponds to an entrance and exit for loading and unloading the workpiece 11. Also, outside the opening 8, a gate (opening and closing door) 10 that opens and closes the opening 8 is provided.

[0028] A moving mechanism 12 for moving (lifting and lowering) the gate 10 along the vertical direction (up and down direction) is connected to the gate 10. For example, the moving mechanism 12 is constituted by an air cylinder 14 provided with a piston rod 16. The air cylinder 14 is fixed to the bottom wall 4a of the chamber 4 via a bracket 18. And the tip of the piston rod 16 is fixed to the gate 10.

[0029] By lowering the gate 10 by the moving mechanism 12 to expose the opening 8, it becomes possible to carry the workpiece 11 into the processing space 6 and carry it out from the processing space 6 of the workpiece 11. Further, by raising the gate 10 by the moving mechanism 12 to close the opening 8, the processing space 6 is sealed.

[0030] An exhaust passage 20 connecting the inside and the outside of the chamber 4 is provided in the bottom wall 4a of the chamber 4. An exhaust mechanism 22 such as a vacuum pump for exhausting the gas existing in the chamber 4 and decompressing the processing space 6 is connected to the exhaust passage 20.

[0031] Also, in the processing space 6, a lower electrode (chuck table) 24 made of a conductive material and an upper electrode (gas supply part) 40 are arranged so as to face each other. The lower electrode 24 has a function as an electrode to which a voltage for generating plasma is applied and a function as a chuck table for holding the workpiece 11. On the other hand, the upper electrode 40 has a function as an electrode to which a voltage for generating plasma is applied and a function as a gas supply part for supplying an etching gas to the processing space 6.

[0032] The lower electrode 24 includes a columnar holding part 26 and a columnar support part (support shaft) 28 connected to the holding part 26. The diameter of the support part 28 is smaller than the diameter of the holding part 26, and the support part 28 is formed so as to protrude downward from the central part of the lower surface of the holding part 26. That is, the lower electrode 24 is formed in a T shape when viewed from the front.

[0033] The bottom wall 4a of the chamber 4 is provided with an opening 30 that connects the inside and the outside of the chamber 4. And the support portion 28 is inserted into the opening 30. An annular insulating member 32 is provided inside the opening 30. The insulating member 32 is provided between the inner wall of the opening 30 and the support portion 28 so as to surround the support portion 28, and insulates the chamber 4 and the lower electrode 24. Further, a high-frequency power source 34 provided outside the chamber 4 is connected to the lower electrode 24.

[0034] The upper surface of the lower electrode 24 constitutes a holding surface 24a for holding the workpiece 11. The holding surface 24a is connected to a suction source 36 such as an ejector via a flow path (not shown) formed inside the lower electrode 24. Further, a refrigerant circulation mechanism 38 is connected to the lower electrode 24. The refrigerant circulation mechanism 38 cools the lower electrode 24 by circulating a refrigerant inside the lower electrode 24. As the refrigerant, for example, a liquid such as water is used.

[0035] The upper electrode 40 includes a columnar gas supply portion 42 and a columnar support portion (support shaft) 44 connected to the gas supply portion 42. The diameter of the support portion 44 is smaller than the diameter of the gas supply portion 42, and the support portion 44 is formed so as to protrude upward from the central portion of the upper surface of the gas supply portion 42. That is, the upper electrode 40 is formed in a T shape when viewed from the front.

[0036] The upper wall 4b of the chamber 4 is provided with an opening 46 that connects the inside and the outside of the chamber 4. And the support portion 44 is inserted into the opening 46. An annular insulating member 48 is provided inside the opening 46. The insulating member 48 is provided between the inner wall of the opening 46 and the support portion 44 so as to surround the support portion 44, and insulates the chamber 4 and the upper electrode 40. Further, a high-frequency power source 50 provided outside the chamber 4 is connected to the upper electrode 40.

[0037] The upper end side of the support part 44 is connected to the tip of a support arm 52 provided outside the chamber 4. Further, the base end part of the support arm 52 is connected to a lifting mechanism 54 that raises and lowers the support arm 52. By raising and lowering the support arm 52 with the lifting mechanism 54, the upper electrode 40 moves (lifts and lowers) along the vertical direction (up and down direction), and the distance between the lower electrode 24 and the upper electrode 40 is adjusted.

[0038] Also, a gas supply source 56 for supplying etching gas is connected to the upper electrode 40. The gas supplied from the gas supply source 56 reaches the gas supply part 42 through a flow path (not shown) formed inside the upper electrode, and is supplied to the processing space 6 from the lower surface side of the gas supply part 42. Further, a refrigerant circulation mechanism 58 is connected to the upper electrode 40. The refrigerant circulation mechanism 58 cools the upper electrode 40 by circulating refrigerant inside the upper electrode 40. As the refrigerant, for example, a liquid such as water is used.

[0039] Furthermore, the plasma device 2 includes a control unit (control unit, control device) 60 that controls the plasma device 2. The control unit 60 is installed inside or outside the plasma device 2 and is connected to each component of the plasma device 2 (transfer mechanism 12, exhaust mechanism 22, high-frequency power source 34, suction source 36, refrigerant circulation mechanism 38, high-frequency power source 50, lifting mechanism 54, gas supply source 56, refrigerant circulation mechanism 58, etc.). The control unit 60 controls the operation of each component by outputting a control signal to the components of the plasma device 2, and operates the plasma device 2.

[0040] For example, the control unit 60 is constituted by a computer and includes an arithmetic unit that performs calculations necessary for the operation of the plasma device 2, and a storage unit that stores various information (data, programs, etc.) used for the operation of the plasma device 2. The arithmetic unit is constituted including a processor such as a CPU (Central Processing Unit). Also, the storage unit is constituted including memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory) that function as a main storage device, an auxiliary storage device, etc.

[0041] FIG. 2 is a cross-sectional view showing the lower electrode 24 and the upper electrode 40 of the plasma device 2. The lower electrode 24 includes a cooling plate 62 that cools the object and a holding plate 64 that is fixed to the cooling plate 62 and holds the workpiece 11. The upper electrode 40 includes a cooling plate 66 that cools the object and an electrode plate 68 that is fixed to the cooling plate 66 and to which a voltage for generating plasma is applied.

[0042] The cooling plate 62 of the lower electrode 24 is a disk-shaped member made of a conductive metal and is fixed to the upper end of the support portion 28. The cooling plate 62 is connected to the refrigerant circulation mechanism 38 and the high-frequency power supply 34 (see FIG. 1) via the support portion 28, and in addition to the function as a cooling plate for cooling the holding plate 64, it has the function as an electrode plate to which a voltage for generating plasma is applied.

[0043] Inside the support portion 28, a refrigerant introduction passage 28a and a refrigerant discharge passage 28b connected to the refrigerant circulation mechanism 38 are formed. Inside the cooling plate 62, a refrigerant circulation passage 62a having one end connected to the refrigerant introduction passage 28a and the other end connected to the refrigerant discharge passage 28b is formed.

[0044] When the refrigerant circulation mechanism 38 is operated, the refrigerant supplied from the refrigerant circulation mechanism 38 flows in sequence through the refrigerant introduction passage 28a, the refrigerant circulation passage 62a, and the refrigerant discharge passage 28b and flows into the refrigerant circulation mechanism 38. Thereby, the refrigerant circulates inside the support portion 28 and the cooling plate 62, and the support portion 28 and the cooling plate 62 are cooled.

[0045] The holding plate 64 is fixed to the upper surface side of the cooling plate 62. The holding plate 64 is a disk-shaped member made of glass, ceramics, or the like and is arranged to contact the cooling plate 62. The upper surface 64a of the holding plate 64 corresponds to the holding surface 24a (see FIG. 1) that holds the workpiece 11.

[0046] Inside the support part 28, a suction passage 28c connected to the suction source 36 is formed. Also, inside the holding plate 64, a plurality of suction passages 64b that open at the upper surface 64a of the holding plate 64 are formed. Each of the plurality of suction passages 64b is connected to the suction source 36 via a suction passage (not shown) formed inside the cooling plate 62 and the suction passage 28c. When the suction source 36 is operated, the suction force (negative pressure) of the suction source 36 acts on the upper surface 64a of the holding plate 64.

[0047] The cooling plate 66 of the upper electrode 40 is a disc-shaped member made of a conductive metal and is fixed to the lower end of the support part 44. The cooling plate 66 is connected to the refrigerant circulation mechanism 58 and the high-frequency power supply 50 (see FIG. 1) via the support part 44, and in addition to the function as a cooling plate for cooling the electrode plate 68, it has the function as an electrode plate to which a voltage for generating plasma is applied.

[0048] Inside the support part 44, a refrigerant introduction passage 44a and a refrigerant discharge passage 44b connected to the refrigerant circulation mechanism 58 are formed. Also, inside the cooling plate 66, a refrigerant circulation passage 66a with one end connected to the refrigerant introduction passage 44a and the other end connected to the refrigerant discharge passage 44b is formed.

[0049] When the refrigerant circulation mechanism 58 is operated, the refrigerant supplied from the refrigerant circulation mechanism 58 flows in order through the refrigerant introduction passage 44a, the refrigerant circulation passage 66a, and the refrigerant discharge passage 44b and flows into the refrigerant circulation mechanism 58. Thereby, the refrigerant circulates inside the support part 44 and the cooling plate 66, and the support part 44 and the cooling plate 66 are cooled.

[0050] The electrode plate 68 is fixed to the lower surface side of the cooling plate 66. The electrode plate 68 is a disc-shaped member made of a conductive metal and is arranged so as to be in contact with the cooling plate 66. For example, the electrode plate 68 is made of the same metal as the cooling plate 66, and in addition to the function as an electrode plate for generating plasma, it has the function as a gas supply part for supplying an etching gas to the processing space 6 (see FIG. 1) inside the chamber 4.

[0051] Inside the support section 44, a supply path 44c connected to the gas supply source 56 is formed. Further, inside the electrode plate 68, a plurality of supply paths 68b that open at the lower surface 68a of the electrode plate 68 are formed. Each of the plurality of supply paths 68b is connected to the gas supply source 56 via a suction path (not shown) and a supply path 44c formed inside the cooling plate 66.

[0052] When performing plasma etching on the workpiece 11 with the plasma device 2 shown in FIG. 1, first, the gate 10 of the plasma device 2 is lowered by the moving mechanism 12 to expose the opening 8. Then, the workpiece 11 is carried into the processing space 6 of the chamber 4 through the opening 8 by a conveying mechanism (not shown), and the workpiece 11 is placed on the holding surface 24a of the lower electrode 24.

[0053] When the workpiece 11 is carried in, it is preferable to raise the upper electrode 40 by the elevating mechanism 54 to widen the distance between the lower electrode 24 and the upper electrode 40. Then, with the workpiece 11 placed on the holding surface 24a, the suction force of the suction source 36 is applied to the holding surface 24a, thereby sucking and holding the workpiece 11 by the lower electrode 24.

[0054] Next, the gate 10 is raised by the moving mechanism 12 to close the opening 8 and seal the processing space 6. Also, the height position of the upper electrode 40 is adjusted by the elevating mechanism 54 so that the lower electrode 24 and the upper electrode 40 are arranged at an interval suitable for plasma etching. Then, the exhaust mechanism 22 is operated to exhaust the processing space 6, and the inside of the chamber 4 is brought into a reduced pressure state (for example, 50 Pa or more and 300 Pa or less).

[0055] When it becomes difficult to suck and hold the workpiece 11 by the suction force of the suction source 36 due to the reduced pressure of the processing space 6, the workpiece 11 may be adsorbed to the holding surface 24a by an electrical force such as electrostatic attraction. For example, a plurality of electrodes (not shown) are embedded inside the holding plate 64 (see FIG. 2) of the lower electrode 24.

[0056] By applying a predetermined voltage to a plurality of electrodes embedded in the holding plate 64, a Coulomb force is applied between the holding surface 24a and the workpiece 11, and the workpiece 11 can be adsorbed and held by the lower electrode 24. In this case, the lower electrode 24 functions as an electrostatic chuck table.

[0057] Also, the refrigerant circulation mechanism 38 is operated to circulate the refrigerant inside the lower electrode 24. Thereby, the cooling plate 62 (see FIG. 2) of the lower electrode 24 and the holding plate 64 (see FIG. 2) in contact with the cooling plate 62 are cooled. Similarly, the refrigerant circulation mechanism 58 is operated to circulate the refrigerant inside the upper electrode 40. Thereby, the cooling plate 66 (see FIG. 2) of the upper electrode 40 and the electrode plate 68 (see FIG. 2) in contact with the cooling plate 66 are cooled.

[0058] Next, an etching gas is supplied between the lower electrode 24 and the upper electrode 40 from the gas supply source 56 via the supply path 44c (see FIG. 2), a supply path (not shown) provided in the cooling plate 66, and a plurality of supply paths 68b (see FIG. 2). The gas component is appropriately selected according to the material of the workpiece 11 and the like. For example, when the workpiece 11 is a silicon wafer, a fluorine-based gas such as CF4 or SF6 can be used.

[0059] Also, high-frequency power (for example, 1000 W or more and 3000 W or less) is supplied from the high-frequency power supplies 34 and 50, and a voltage for generating plasma is applied to the lower electrode 24 (cooling plate 62) and the upper electrode 40 (cooling plate 66 and electrode plate 68). Thereby, the gas existing between the lower electrode 24 and the upper electrode 40 becomes a plasma state containing ions and radicals. Then, the generated plasma is supplied to the workpiece 11, and the workpiece 11 is subjected to plasma etching.

[0060] Note that, as shown in FIG. 2, when machining the workpiece 11 with the plasma device, the holding plate 64 is fixed to the cooling plate 62, and the electrode plate 68 is fixed to the cooling plate 66. Further, when cleaning or replacing the holding plate 64 and the electrode plate 68, the holding plate 64 is removed from the cooling plate 62, and the electrode plate 68 is removed from the cooling plate 66. In the present embodiment, the fixture 80 is used for attaching and detaching the holding plate 64 and the electrode plate 68.

[0061] FIG. 3 is an exploded perspective view showing the fixture 80, and FIG. 4 is a cross-sectional view showing the fixture 80. The fixture 80 includes an annular ring member 82 capable of accommodating two plates (the cooling plate 62 and the holding plate 64, or the cooling plate 66 and the electrode plate 68), and a fixing unit (fixing member) 88 that fixes the two plates accommodated in the ring member 82 in contact with each other.

[0062] The ring member 82 includes an annular support portion (first accommodating member) 84 and an annular protruding portion (second accommodating member) 86 connected to the support portion 84. Further, an opening 82a penetrating the ring member 82 in the thickness direction is provided at the central portion of the ring member 82.

[0063] The support portion 84 includes a first surface (front surface) 84a and a second surface (back surface) 84b that are substantially parallel to each other. A columnar opening 84c penetrating the support portion 84 in the thickness direction is provided at the central portion of the support portion 84. Note that the diameter of the opening 84c is smaller than the diameter of the support portion 84, and the opening 84c is formed concentrically with the support portion 84.

[0064] On the second surface 84b side inside the opening 84c, a protruding portion 84d protruding from the inner wall of the support portion 84 toward the center of the support portion 84 is provided. The protruding portion 84d is formed in an annular shape with a predetermined width along the inner wall of the opening 84c. The upper surface of the protruding portion 84d is a flat surface substantially parallel to the first surface 84a and the second surface 84b, and constitutes an annular support surface 84e that supports the outer peripheral portion of a plate 102 (see FIG. 5) described later.

[0065] On the first surface 84a side of the support portion 84, an annular protrusion 86 is provided so as to protrude upward from the first surface 84a. The diameter of the protrusion 86 is smaller than the diameter of the support portion 84, and the protrusion 86 is formed concentrically with the support portion 84. The surface 86a of the protrusion 86 is formed substantially parallel to the first surface 84a of the support portion 84.

[0066] At the central portion of the protrusion 86, a cylindrical opening 86b penetrating the protrusion 86 in the thickness direction is provided. The diameter of the opening 86b is smaller than the diameter of the protrusion 86, and the opening 86b is formed concentrically with the protrusion 86. Further, the diameter of the opening 86b is equal to or larger than the diameter of the opening 84c of the support portion 84, and the opening 86b is formed concentrically with the opening 84c.

[0067] The opening 84c and the opening 86b are connected to each other and constitute an opening 82a penetrating the ring member 82. Further, inside the opening 86b, a part of the first surface 84a of the support portion 84 is exposed, and a step is formed by the exposed portion of the first surface 84a and the inner wall of the support portion 84.

[0068] An annular recess 86d is provided on the outer peripheral surface (side surface) 86c side of the protrusion 86 (see FIG. 4). The recess 86d corresponds to a notch portion formed from the outer peripheral surface 86c of the protrusion 86 toward the opening 86b side, and is formed annularly along the outer peripheral surface 86c of the protrusion 86. For example, the recess 86d is formed at the lower end portion of the protrusion 86 and has a flat inclined surface 86e inclined with respect to the first surface 84a of the support portion 84.

[0069] The space inside the opening 84c of the support portion 84 corresponds to a plate accommodation portion 84f (see FIG. 4) in which a plate 102 (see FIG. 5) described later is accommodated. Further, the space inside the opening 86b of the protrusion 86 corresponds to a cooling plate accommodation portion 86f (see FIG. 4) in which a cooling plate 100 (see FIG. 5) described later is accommodated. The cooling plate accommodation portion 86f is provided above the plate accommodation portion 84f (on the side opposite to the support surface 84e) so as to overlap the plate accommodation portion 84f.

[0070] A fixing unit 88 is mounted on the ring member 82. The fixing unit 88 includes a pair of arc-shaped frames 90, 92. For example, the frames 90, 92 are semi-circular arc-shaped members formed by bisecting an annular member.

[0071] The frame 90 has a first surface (front surface) 90a and a second surface (rear surface) 90b that are generally parallel to each other. The frame 90 also has an outer peripheral surface (first side surface) 90c and an inner peripheral surface (second side surface) 90d that are connected to the first surface 90a and the second surface 90b and are generally parallel to each other.

[0072] On the first surface 90a side of the frame 90, an annular pressing portion (projection) 90e is provided that is formed to project radially inward (toward the center) of the frame 90 from the inner peripheral surface 90d. For example, the pressing portion 90e is formed in a rectangular shape in a cross-sectional view such that its longitudinal direction is along the radial direction of the frame 90 (see FIG. 4). The upper surface and the lower surface of the pressing portion 90e constitute flat surfaces that are generally parallel to the first surface 90a and the second surface 90b.

[0073] On the second surface 90b side of the frame 90, an annular convex portion (projection) 90f is provided that is formed to project radially inward (toward the center) of the frame 90 from the inner peripheral surface 90d. The convex portion 90f is formed to correspond to the concave portion 86d (see FIG. 4) of the ring member 82. For example, the convex portion 90f is formed such that the contour of the convex portion 90f generally coincides with the contour of the concave portion 86d, and has a flat inclined surface 90g corresponding to the inclined surface 86e of the concave portion 86d. Therefore, the convex portion 90f can be fitted into the concave portion 86d.

[0074] The frame 92 has a first surface (front surface) 92a and a second surface (rear surface) 92b that are generally parallel to each other. The frame 92 also has an outer peripheral surface (first side surface) 92c and an inner peripheral surface (second side surface) 92d (see FIG. 4) that are connected to the first surface 92a and the second surface 92b and are generally parallel to each other.

[0075] On the side of the first surface 92a of the frame body 92, an annular pressing portion (projection) 92e is provided so as to project from the inner peripheral surface 92d toward the radially inner side (center side) of the frame body 92. For example, the pressing portion 92e is formed in a rectangular shape in a cross-sectional view such that the longitudinal direction thereof is along the radial direction of the frame body 92 (see FIG. 4). The upper surface and the lower surface of the pressing portion 92e constitute flat surfaces that are substantially parallel to the first surface 92a and the second surface 92b.

[0076] On the side of the second surface 92b of the frame body 92, an annular convex portion (projection) 92f is provided so as to project from the inner peripheral surface 92d toward the radially inner side (center side) of the frame body 92. The convex portion 92f is formed so as to correspond to the concave portion 86d of the ring member 82 (see FIG. 4). For example, the convex portion 92f is formed such that the contour of the convex portion 92f substantially coincides with the contour of the concave portion 86d, and has a flat inclined surface 92g corresponding to the inclined surface 86e of the concave portion 86d. Therefore, the convex portion 92f can be fitted into the concave portion 86d.

[0077] Also, as shown in FIG. 3, the fixing unit 88 includes a pair of connecting members 94 that connect the frame body 90 and the frame body 92. For example, the connecting member 94 is an arc-shaped member made of the same material as the frame body 90 and the frame body 92. The connecting members 94 are respectively fitted into the frame body 90 and the frame body 92, and fix and integrate the frame body 90 and the frame body 92.

[0078] Specifically, on the outer peripheral surface 90c side of both ends of the frame body 90, a connecting portion (groove) 90h into which one end side of the connecting member 94 is fitted is provided. For example, the connecting portion 90h is a notch provided at a corner portion on the first surface 90a side of the frame body 90, and its contour corresponds to the contour of one end side of the connecting member 94.

[0079] The connecting portion 90h is provided with a screw hole 90i formed along a direction intersecting the thickness direction of the frame body 90. For example, the screw hole 90i is formed along a direction parallel to the first surface 90a and the second surface 90b, and is exposed at the connecting portion 90h. More specifically, the screw hole 90i can be formed along the radial direction of the frame body 90 so as to reach the pressing portion 90e from the connecting portion 90h.

[0080] On one hand, on the outer peripheral surface 92c side of both ends of the frame body 92, a connecting portion (groove) 92h into which the other end side of the connecting member 94 is fitted is provided. For example, the connecting portion 92h is a notch provided at the corner on the first surface 92a side of the frame body 92, and its contour corresponds to the contour of the other end side of the connecting member 94.

[0081] The connecting portion 92h is provided with a screw hole 92i formed along a direction intersecting the thickness direction of the frame body 92. For example, the screw hole 92i is formed along a direction parallel to the first surface 92a and the second surface 92b and is exposed at the connecting portion 92h. More specifically, the screw hole 92i can be formed along the radial direction of the frame body 92 so as to reach from the connecting portion 92h to the pressing portion 92e.

[0082] The connecting member 94 is fitted into the connecting portion 90h of the frame body 90 and the connecting portion 92h of the frame body 92. Note that the connecting member 94 is formed such that the contour of one end side follows the contour of the connecting portion 90h and the contour of the other end side follows the contour of the connecting portion 92h. Therefore, the shape of the connecting member 94 generally matches the shape of the connecting portions 90h, 92h connected to each other.

[0083] For example, a protrusion 94a formed to correspond to the contour of the connecting portion 90h is provided on one end side of the connecting member 94. On the other hand, a protrusion 94b formed to correspond to the contour of the connecting portion 92h is provided on the other end side of the connecting member 94. Then, the connecting member 94 is mounted such that the protrusion 94a is fitted into the connecting portion 90h and the protrusion 94b is fitted into the connecting portion 92h.

[0084] Also, the connecting member 94 has a pair of insertion holes (through holes) 94c formed along a direction intersecting the thickness direction of the connecting member 94 and penetrating the connecting member 94. When the connecting member 94 is fitted into the connecting portions 90h, 92h, the pair of insertion holes 94c are respectively connected to the screw holes 90i, 92i.

[0085] Then, with the connecting member 94 fitted into the connecting portions 90h and 92h, when a pair of fastening bolts 96 are inserted through the insertion holes 94c and screwed into the screw holes 90i and 92i to be tightened, the connecting member 94 is fixed to the frame body 90 and the frame body 92. Thereby, the frame body 90 and the frame body 92 are connected via the connecting member 94.

[0086] Next, with reference to FIGS. 5 to 10, a method for fixing two plates using the fixture 80 will be described. FIG. 5 is an exploded perspective view showing the fixture 80 for fixing the cooling plate 100 and the plate 102. Hereinafter, as an example, the case where the plate 102 is fixed to the lower surface side of the cooling plate 100 will be described.

[0087] The cooling plate 100 is a disk-shaped plate installed in the chamber 4 (see FIG. 1) of the plasma device 2 to cool the object. Specifically, the cooling plate 100 corresponds to the cooling plate 62 of the lower electrode 24 or the cooling plate 66 of the upper electrode 40 shown in FIG. 2.

[0088] Also, the plate 102 is a disk-shaped plate installed in the chamber 4 (see FIG. 1) of the plasma device 2 and fixed to the cooling plate 100. Specifically, the plate 102 corresponds to the holding plate 64 of the lower electrode 24 or the electrode plate 68 of the upper electrode 40 shown in FIG. 2.

[0089] Note that in FIGS. 5 to 10, the illustration of the flow paths (such as the refrigerant circulation paths 62a and 66a, see FIG. 2) formed inside the cooling plate 100 and the flow paths (such as the suction path 64b and the supply path 68b, see FIG. 2) formed inside the plate 102 are omitted. However, the cooling plate 100 and the plate 102 can each freely form flow paths.

[0090] When the plate 102 is housed in the ring member 82 and the ring member 82 is attached to the cooling plate 100 by the fixing unit 88, the plate 102 is fixed in a state of being in contact with the cooling plate 100. Further, by removing the fixing unit 88 from the ring member 82, the plate 102 is separated from the cooling plate 100. Thereby, attachment of the plate 102 to the cooling plate 100 and removal of the plate 102 from the cooling plate 100 can be carried out.

[0091] When attaching the plate 102 to the cooling plate 100, first, the plate 102 is housed in the ring member 82. FIG. 6(A) is a cross-sectional view showing the fixture 80 in a state where the plate 102 is housed in the ring member 82.

[0092] The plate 102 is inserted into the opening 82a of the ring member 82. Here, the diameter of the opening 84c of the support portion 84 is set to be equal to or larger than the diameter of the plate 102, and the inner diameter of the protrusion 84d is set to be equal to or smaller than the diameter of the plate 102. Therefore, the plate 102 is fitted into the opening 84c and housed in the plate housing portion 84f. Further, the lower surface side of the outer peripheral portion of the plate 102 is supported by the upper surface (support surface 84e, see FIG. 7) of the protrusion 84d, and the central portion of the lower surface of the plate 102 is exposed inside the protrusion 84d.

[0093] Note that the height difference between the first surface 84a (the upper end of the opening 84c) of the support portion 84 and the upper surface (support surface 84e) of the protrusion 84d is set to be equal to or smaller than the thickness of the plate 102. Therefore, when the plate 102 is housed in the plate housing portion 84f, the upper surface of the plate 102 is disposed substantially on the same plane as the first surface 84a of the support portion 84 or above the first surface 84a of the support portion 84.

[0094] Next, the ring member 82 housing the plate 102 is attached to the cooling plate 100. FIG. 6(B) is a cross-sectional view showing the fixture 80 in a state where the ring member 82 is attached to the cooling plate 100.

[0095] The ring member 82 that houses the plate 102 is positioned such that the cooling plate 100 is inserted into the opening 82a of the ring member 82. Here, the diameter of the opening 86b of the protruding portion 86 is set to be equal to or greater than the diameter of the cooling plate 100. Therefore, the cooling plate 100 is fitted into the opening 86b and housed in the cooling plate housing portion 86f. Then, the cooling plate 100 and the plate 102 come into contact with each other inside the ring member 82.

[0096] Next, a pair of frame bodies 90, 92 are attached to the ring member 82. FIG. 6(C) is a cross-sectional view showing the fixture 80 in a state where the pair of frame bodies 90, 92 are attached to the ring member 82.

[0097] The pair of frame bodies 90, 92 are attached so as to sandwich the ring member 82 from both sides. As a result, the convex portion 90f of the frame body 90 is fitted into the concave portion 86d of the ring member 82, and the outer peripheral surface 86c side of the protruding portion 86 of the ring member 82 is sandwiched between the pressing portion 90e and the convex portion 90f. Similarly, the convex portion 92f of the frame body 92 is fitted into the concave portion 86d of the ring member 82, and the outer peripheral surface 86c side of the protruding portion 86 of the ring member 82 is sandwiched between the pressing portion 92e and the convex portion 92f.

[0098] FIG. 7 is an enlarged cross-sectional view showing the outer peripheral portion of the fixture 80. When the convex portion 90f of the frame body 90 and the convex portion 92f of the frame body 92 are fitted into the concave portion 86d of the ring member 82, the inclined surface 86e of the concave portion 86d is pressed by the inclined surface 90g of the convex portion 90f and the inclined surface 92g of the convex portion 92f, and the ring member 82 and the plate 102 are lifted toward the cooling plate 100 side.

[0099] Also, the tip of the pressing portion 90e of the frame body 90 and the tip of the pressing portion 92e of the frame body 92 press and support the upper surface side of the outer peripheral portion of the cooling plate 100. As a result, the ring member 82 is attached to the cooling plate 100 and integrated with the cooling plate 100, and the plate 102 is fixed in a state of contacting the lower surface of the cooling plate 100.

[0100] Next, the frame body 90 and the frame body 92 are connected by a connecting member 94. FIG. 8 is a plan view showing the fixture 80 when the pair of frame bodies 90 and 92 are connected by the connecting member 94.

[0101] When the frame bodies 90 and 92 are attached to the ring member 82, the connecting portion 90h of the frame body 90 and the connecting portion 92h of the frame body 92 are connected. Then, the pair of connecting members 94 are respectively fitted into the connecting portions 90h and 92h.

[0102] FIG. 9(A) is a plan view showing the connecting member 94 fitted into the connecting portions 90h and 92h. The connecting member 94 is attached to the frame bodies 90 and 92 such that the protrusion 94a is fitted into the connecting portion 90h and the protrusion 94b is fitted into the connecting portion 92h. When the connecting portions 90h and 92h are arranged apart from each other when the connecting member 94 is attached, by fitting the connecting member 94 into the connecting portions 90h and 92h, a force that brings the frame bodies 90 and 92 closer to each other acts on the frame bodies 90 and 92.

[0103] FIG. 9(B) is a plan view showing the connecting member 94 fixed to the frame bodies 90 and 92 by a pair of fastening bolts 96. One fastening bolt 96 is screwed into the screw hole 90i through the insertion hole 94c of the connecting member 94 and fastened. The other fastening bolt 96 is screwed into the screw hole 92i through the insertion hole 94c of the connecting member 94 and fastened. As a result, the connecting member 94 is fixed to the frame body 90 and the frame body 92, and the frame body 90 and the frame body 92 are connected via the connecting member 94.

[0104] When the connecting member 94 is not in close contact with the connecting portions 90h and 92h when the connecting member 94 is fitted into the connecting portions 90h and 92h, there may be a slight gap between the frame body 90 and the frame body 92. In this case, by screwing the pair of fastening bolts 96 into the screw holes 90i and 92i to bring the connecting member 94 into close contact with the connecting portions 90h and 92h, a force that brings the frame bodies 90 and 92 closer to each other acts on the frame bodies 90 and 92. As a result, the frame body 90 and the frame body 92 are in close contact and firmly fixed.

[0105] FIG. 10 is a perspective view showing a fixture 80 attached to a cooling plate 100. As described above, by attaching a ring member 82 containing a plate 102 to the cooling plate 100 with a fixing unit 88, the plate 102 is fixed in a state of being in contact with the cooling plate 100 (see FIGS. 6(C) and 7).

[0106] When removing the plate 102 from the cooling plate 100, loosen the fastening bolt 96 and remove the connecting member 94 from the connecting portions 90h, 92h. Thereafter, by separating the ring member 82 from the cooling plate 100, the plate 102 is separated from the cooling plate 100.

[0107] Using the above-described fixture 80, for example, an electrode plate 68 is attached to a cooling plate 66 provided in the upper electrode 40 of the plasma device 2 (see FIG. 2). Thereby, the electrode plate 68 is fixed in a state of being in contact with the cooling plate 66. In this case, the cooling plate 100 and the plate 102 shown in FIG. 5 correspond to the cooling plate 66 and the electrode plate 68, respectively.

[0108] Also, when attaching a holding plate 64 to a cooling plate 62 provided in the lower electrode 24 of the plasma device 2, the fixture 80 can be used. In this case, with the cooling plate 62 and the holding plate 64 accommodated in the ring member 82, the fixing unit 88 is attached to the ring member 82.

[0109] Specifically, first, the holding plate 64 is disposed on the cooling plate 62. Next, the ring member 82 covers the cooling plate 62 and the holding plate 64 such that the holding plate 64 and the cooling plate 62 are respectively accommodated in the plate accommodating portion 84f and the cooling plate accommodating portion 86f (see FIG. 4 etc.) of the ring member 82. Thereafter, by attaching the fixing unit 88 to the ring member 82, the holding plate 64 is fixed in a state of being in contact with the cooling plate 62.

[0110] Then, with the holding plate 64 and the electrode plate 68 respectively mounted on the cooling plate 62 and the cooling plate 66 by a pair of fixtures 80, a high-frequency voltage is applied to the lower electrode 24 and the upper electrode 40, and the gas existing between the lower electrode 24 and the upper electrode 40 is turned into plasma. Then, the generated plasma is supplied to the workpiece 11, and the workpiece 11 is subjected to plasma etching.

[0111] Incidentally, when a high-frequency voltage is applied to the lower electrode 24 and the upper electrode 40, the lower electrode 24 and the upper electrode 40 generate heat. However, the cooling plate 62 and the holding plate 64 in contact with the cooling plate 62 are cooled by the refrigerant supplied from the refrigerant circulation mechanism 38. Similarly, the cooling plate 66 and the electrode plate 68 in contact with the cooling plate 66 are cooled by the refrigerant supplied from the refrigerant circulation mechanism 58. Thereby, it is possible to prevent the lower electrode 24 and the upper electrode 40 from becoming high temperature during plasma etching.

[0112] Also, when fixing the holding plate 64 and the electrode plate 68 to the cooling plate 62 and the cooling plate 66 respectively, as shown in FIGS. 9(A) and 9(B), the fastening bolt 96 is fastened to the screw holes 90i, 92i through the insertion hole 94c of the connecting member 94 from the outer peripheral surface 90c side of the frame body 90 and the outer peripheral surface 92c side of the frame body 92. That is, the fastening bolt 96 is inserted along a direction intersecting the thickness direction of the frame bodies 90 and 92.

[0113] When the fastening bolt 96 is fastened as described above, the head of the fastening bolt 96 is positioned on the outer peripheral surface 90c side of the frame body 90 and the outer peripheral surface 92c side of the frame body 92, and is not disposed between the holding plate 64 and the electrode plate 68 (see FIG. 2). Thereby, abnormal discharge is less likely to occur between the lower electrode 24 and the upper electrode 40 during plasma generation.

[0114] Furthermore, since the fastening bolt 96 is fastened from the outer peripheral surface 90c side of the frame body 90 and the outer peripheral surface 92c side of the frame body 92, when mounting the holding plate 64, the operation of screwing the fastening bolt 96 from the cooling plate 62 side toward the holding plate 64 side, and when mounting the electrode plate 68, the operation of screwing the fastening bolt 96 from the cooling plate 66 side toward the electrode plate 68 side become unnecessary. As a result, even if there are obstacles such as the support portions 28 and 44, piping, and wiring on the cooling plate 62 side of the lower electrode 24 and the cooling plate 66 side of the upper electrode 40, the fastening of the fastening bolt 96 is not hindered, and the attachment and detachment of the holding plate 64 and the electrode plate 68 can be easily and smoothly performed.

[0115] In addition, in the present embodiment, the case where the fixing unit 88 includes a pair of frame bodies 90 and 92 has been described (see FIG. 5 and the like). However, there is no limitation on the number of frame bodies included in the fixing unit 88. That is, the fixing unit 88 may include three or more frame bodies formed in an arc shape. In this case, both end portions of each frame body are connected to other frame bodies by the same number of connecting members 94 as the number of frame bodies.

[0116] Also, one end portion of the frame body 90 and one end portion of the frame body 92 may be connected by a hinge. In this case, the other end portion of the frame body 90 and the other end portion of the frame body 92 are connected by the connecting member 94. Thereby, the number of locations where the operation of fixing the connecting member 94 with the fastening bolt 96 is required can be reduced, and the mounting operation of the frame bodies 90 and 92 is simplified.

[0117] As described above, the fixture 80 according to the present embodiment includes a ring member 82 capable of accommodating the cooling plate 100 and the plate 102, and a fixing unit 88 that fixes the cooling plate 100 and the plate 102 accommodated in the ring member 82 in a state of being in contact with each other. The fixing unit 88 includes frame bodies 90 and 92 and a connecting member 94.

[0118] When using the fixture 80 described above, with the connecting member 94 fitted into the connecting portions 90h, 92h of the frames 90, 92, the fastening bolt 96 is fastened from the outer peripheral surface 90c side of the frame 90 and the outer peripheral surface 92c side of the frame 92 through the insertion hole 94c of the connecting member 94 into the screw holes 90i, 92i, thereby fixing the plate 102 to the cooling plate 100. As a result, the operation of screwing the fastening bolt 96 from the cooling plate 100 side toward the plate 102 side becomes unnecessary, and the attachment / detachment operation of the plate 102 can be easily performed.

[0119] Note that the material of the components constituting the fixture 80 is not limited as long as the plate 102 can be fixed to the cooling plate 100. However, since the temperatures of the cooling plate 100 and the plate 102 change during plasma etching, the ring member 82 that houses the cooling plate 100 and the plate 102 is preferably made of a material with high resistance to thermal shock. For example, a member made of quartz can be used as the ring member 82.

[0120] Also, when attaching the fixing unit 88 to the ring member 82, the frames 90, 92 and the connecting member 94 each come into contact with and slide on other members. Therefore, the frames 90, 92 and the connecting member 94 are preferably made of a material with high heat resistance, high mechanical strength, and high slipperiness. For example, members made of super engineering plastics such as polyetheretherketone (PEEK) can be used as the frames 90, 92 and the connecting member 94.

[0121] In addition, the structure, method, etc. according to the above embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

Explanation of Reference Numerals

[0122] 11 Workpiece 2 Plasma apparatus (etching apparatus) 4 Chamber 4a Bottom wall 4b Top wall 4c First side wall 4d Second side wall 4e Third side wall 6 Processing space 8 Opening 10 Gate (opening / closing door) 12 Moving mechanism 14 Air cylinder 16 Piston rod 18 Bracket 20 Exhaust passage 22 Exhaust mechanism 24 Lower electrode (chuck table) 24a Holding surface 26 Holding part 28 Support part (support shaft) 28a Refrigerant introduction passage 28b Refrigerant discharge passage 28c Suction passage 30 Opening 32 Insulating member 34 High-frequency power supply 36 Suction source 38 Refrigerant circulation mechanism 40 Upper electrode (gas supply part) 42 Gas supply part 44 Support part (support shaft) 44a Refrigerant introduction passage 44b Refrigerant discharge passage 44c Supply passage 46 Opening 48 Insulating member 50 High-frequency power supply 52 Support arm 54 Lifting mechanism 56 Gas supply source 58 Refrigerant circulation mechanism 60 Control part (control unit, control device) 62 Cooling plate 62a Refrigerant circulation path 64 Holding plate 64a Upper surface 64b Suction passage 66 Cooling plate 66a Refrigerant circulation path 68 Electrode plate 68a Lower surface 68b Supply passage 80 Fixture 82 Ring member 82a Opening 84 Support part (first housing member) 84a First surface (front surface) 84b Second surface (back surface) 84c Opening 84d Protrusion 84e Support surface 84f Plate housing part 86 Protruding part (second housing member) 86a Surface 86b Opening 86c Outer peripheral surface (side surface) 86d Recess 86e Inclined surface 86f Cooling plate housing part 88 Fixing unit (fixing member) 90 Frame body 90a First surface (front surface) 90b Second surface (back surface) 90c Outer peripheral surface (first side surface) 90d Inner peripheral surface (second side surface) 90e Pressing part (protrusion) 90f Convex part (protrusion) 90g Inclined surface 90h Connecting part (groove) 90i Screw hole 92 Frame body 92a First surface (front surface) 92b Second surface (back surface) 92c Outer peripheral surface (first side surface) 92d Inner peripheral surface (second side surface) 92e Pressing part (protrusion) 92f Convex part (protrusion) 92g Inclined surface 92h Connecting part (groove) 92i Screw hole 94 Connecting member 94a, 94b Protrusion 94c Insertion hole (through hole) 96 Fastening bolt 100 Cooling plate 102 Plate

Claims

1. A fixture for fixing a plate to a cooling plate provided in a plasma device, comprising: a ring member capable of accommodating the plate and the cooling plate; a fixing unit that fixes the plate and the cooling plate accommodated in the ring member in contact with each other; The ring member includes: a plate accommodating portion for accommodating the plate; an annular support surface for supporting an outer peripheral portion of the plate accommodated in the plate accommodating portion; a cooling plate accommodating portion provided on the side opposite to the support surface of the plate accommodating portion so as to overlap with the plate accommodating portion, for accommodating the cooling plate; an annular recess provided on the outer peripheral surface side of the ring member; The fixing unit includes: a plurality of frames; a connecting member for connecting the plurality of frames; Each frame includes: a convex portion formed toward the inside of the frame and fitted into the recess of the ring member; a pressing portion formed toward the inside of the frame for pressing an outer peripheral portion of the cooling plate accommodated in the ring member; a connecting portion provided on the outer peripheral surface side of the frame, into which the connecting member is fitted; a screw hole formed along a direction intersecting the thickness direction of the frame and exposed at the connecting portion; The connecting member includes: an insertion hole connected to the screw hole; The fixture is characterized in that the plate is fixed to the cooling plate by fastening a fastening bolt from the outer peripheral surface side of the frame through the insertion hole to the screw hole with the connecting member fitted into the connecting portion.

2. The connecting member is formed such that the contour of the connecting member follows the contour of the connecting portion. The fixture according to claim 1, wherein when the connecting member is fitted into the connecting portion or the fastening bolt is fastened to the screw hole, a force for bringing the plurality of frames closer to each other acts on the plurality of frames.

3. The fixture according to claim 1 or 2, wherein the plate is an electrode plate to which a voltage for generating plasma is applied.

4. The fixture according to claim 1 or 2, wherein the plate is a holding plate for holding a workpiece.

Images