Die holding device

Abstract

To properly retain a die from a die assembly.SOLUTION: A die holding device includes a holder used to hold a die from a die assembly formed by dicing a wafer with a dicing sheet attached thereto, a storage device that stores the position of the die in the die assembly when the die cannot be held using the holder, and a control device that controls the operation of the holder so as to hold the die in a first area set on the basis of the positions of the dies in the die assembly stored in the storage device according to a first holding condition, and hold the die in the second area other than the first area according to a second holding condition different from the first holding condition.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a die holding device that holds a die from a die assembly formed by dicing a wafer to which a dicing sheet is attached.

Background Art

[0002] As described in the following patent documents, in various work machines, various parts are held by a holder.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to appropriately hold a die from a die assembly.

Means for Solving the Problems

[0005] To solve the above problems, this specification provides a holder used when holding a die from a die assembly formed by dicing a wafer to which a dicing sheet is attached, a storage device that stores the position of the die in the die assembly when the die cannot be held using the holder, and based on the position of the die in the die assembly stored in the storage device as a region where it is difficult to hold the die in the region before holding the die from the die assembly A die holding device is disclosed that includes a control device that controls the operation of the holder so as to hold the dies in a first region set according to a first holding condition and hold the dies in a second region other than the first region according to a second holding condition different from the first holding condition.

Effects of the Invention

[0006] In the present disclosure, when a die cannot be held using a holder, the position of the die in the die assembly is memorized, and the die in the first region set based on the memorized position of the die is held according to the first holding condition, and the die in the second region other than the first region is held according to the second holding condition. Thereby, the die can be appropriately held from the die assembly.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0008] Hereinafter, as embodiments for carrying out the present invention, examples of the present invention will be described in detail with reference to the drawings.

[0009] An electronic component mounting machine 10 is shown in FIGS. 1 and 2. FIG. 1 is a perspective view of the electronic component mounting machine 10, and FIG. 2 is a view showing the electronic component mounting machine 10 with the cover 12 and the like removed from a viewpoint from above. The electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board. There is. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as "moving device") 22, a mounting head 24, a parts camera 28, and a die supply device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

[0010] The transfer device 20 includes two conveyor devices 40 and 42. These two conveyor devices 40 and 42 are arranged on the base 46 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit board in the X-axis direction by the drive of an electromagnetic motor (see FIG. 4) 47. Also, the circuit board is fixedly held by a board holding device (see FIG. 4) 48 at a predetermined position.

[0011] The moving device 22 has a pair of Y-axis guide rails 50 extending in the Y-axis direction and an X-axis guide rail 52 extending in the X-axis direction. The X-axis guide rail 52 is mounted on the pair of Y-axis guide rails 50. And the X-axis guide rail 52 moves to an arbitrary position in the Y-axis direction by the drive of an electromagnetic motor (see FIG. 4) 53. Also, the X-axis guide rail 52 holds a slider 54 movably along its axis. This slider 54 moves to an arbitrary position in the X-axis direction by the drive of an electromagnetic motor (see FIG. 4) 55. A mounting head 24 is attached to the slider 54. With such a structure, the mounting head 24 moves to an arbitrary position on the base 46.

[0012] The mounting head 24 mounts electronic components on the circuit board. The mounting head 24 has a suction nozzle 60 provided on its lower end surface. The suction nozzle 60 communicates with a positive and negative pressure supply device (see FIG. 4) 62 via a negative pressure air and positive pressure air passage. The suction nozzle 60 sucks and holds the electronic component by negative pressure and releases the held electronic component by positive pressure. Also, the mounting head 24 has a nozzle lifting device (see FIG. 4) 64 for lifting and lowering the suction nozzle 60. By the nozzle lifting device 64, the mounting head 24 changes the vertical position of the electronic component to be held.

[0013] The parts camera 28 is arranged adjacent to the conveyor device 42. The parts camera 28 is arranged facing upward and images the electronic component held by the suction nozzle 60 of the mounting head 24.

[0014] The die supply device 30 is provided at one end of the base 46 in the Y-axis direction. Specifically, a recessed storage portion 86 is formed at the edge of the base 46, and a part of the die supply device 30 is stored in the storage portion 86. As shown in FIG. 3, the die supply device 30 supplies the die 92 from the die assembly 90. The die assembly 90 is formed by dicing a wafer with a dicing sheet attached thereto. Note that the die assembly 90 may simply be referred to as a "wafer", and the die 92 may also be referred to as a "chip".

[0015] The die supply device 30 includes a main frame 100, a die assembly storage device 102, a die assembly holding device 104, a pickup head 106, a pickup head moving device (hereinafter sometimes abbreviated as "moving device") 108, and a die pushing-up device (see FIG. 4) 110.

[0016] The upper surface of the main frame 100 is generally rectangular, and the die assembly holding device 104, the pickup head 106, and the moving device 108 are disposed on the upper surface thereof. Then, by housing the main frame 100 in the storage portion 86, the die supply device 30 is attached to the base 46.

[0017] The die assembly storage device 102 is connected to the end of the main frame 100 in the Y-axis direction and includes a rack 111 and a lifting table 112. The rack 111 is disposed on the lifting table 112, and a plurality of die assemblies 90 are stored inside the rack 111 in a stacked state. The plurality of die assemblies 90 move in the vertical direction when the lifting table 112 is lifted or lowered by a table lifting mechanism (see FIG. 4) 115. Then, the die assembly 90 located at a predetermined height is pulled out onto the die assembly holding device 104. Note that the die assembly 90 includes die assemblies 90 of various sizes such as 6-inch size and 8-inch size, and it is possible to store die assemblies 90 of these various sizes in the rack 111.

[0018] As shown in FIGS. 2 and 3, the die assembly holding device 104 has a pair of guide rails 116 and a holding frame 117. The pair of guide rails 116 are arranged on the main frame 100 so as to extend in the Y-axis direction, and support the holding frame 117 so as to be movable in the Y-axis direction. Then, the holding frame 117 is moved in the Y-axis direction along the guide rails 116 by a frame moving mechanism (see FIG. 4) 118. On the holding frame 117, the die assembly 90 drawn out from the die assembly accommodating device 102 is placed. Further, a fixing mechanism 119 is arranged on the holding frame 117. The fixing mechanism 119 fixes the die assembly 90 at two opposing sides of the die assembly 90 and positions it on the upper surface of the holding frame 117.

[0019] The pickup head 106 picks up the die 92 from the die assembly 90, and a plurality of suction nozzles 120 are attached to the lower surface. Each suction nozzle 120 communicates with a positive and negative pressure supply device (see FIG. 4) 121. The suction nozzle 120 sucks and holds the die 92 by negative pressure, and releases the held die 92 by positive pressure. Further, the pickup head 106 can be inverted in the vertical direction so that the nozzle port of the suction nozzle 120 faces upward. Thereby, the die 92 sucked and held by the suction nozzle 120 is supplied above the pickup head 106. Further, the pickup head 106 has a lifting device (see FIG. 4) 122, and each suction nozzle 120 moves up and down by the operation of the lifting device 122.

[0020] The moving device 108 has a pair of Y-axis guide rails 123 extending in the Y-axis direction and an X-axis guide rail 124 extending in the X-axis direction. The X-axis guide rail 124 is mounted on the pair of Y-axis guide rails 123. And the X-axis guide rail 124 moves to an arbitrary position in the Y-axis direction by the drive of an electromagnetic motor (see FIG. 4) 125. Further, the X-axis guide rail 124 holds a slider 126 movably along its axis. This slider 126 moves to an arbitrary position in the X-axis direction by the drive of an electromagnetic motor (see FIG. 4) 127. A pickup head 106 is attached to the slider 126. With such a structure, the pickup head 106 moves to an arbitrary position on the main frame 100.

[0021] A clamp 128 is attached to the back surface of the X-axis guide rail 124 of the moving device 108. The clamp 128 grips the die assembly 90 housed in the rack 111 of the die assembly housing device 102. And by moving the X-axis guide rail 124 in the Y-axis direction, the die assembly 90 gripped by the clamp 128 moves in the Y-axis direction. Thereby, the die assembly 90 housed in the rack 111 is pulled out onto the holding frame 117.

[0022] The die lifting device 110 is disposed below the holding frame 117 of the die assembly holding device 104 and has a lifter (not shown), a lifter lifting device (see FIG. 4) 150, and a lifter moving device (see FIG. 4) 152. The lifter pushes up the die 92 of the die assembly 90 held by the holding frame 117 from the back surface. The lifter lifting device 150 moves the lifter up and down It is lifted up and down in a certain direction. The lifter moving device 152 moves the lifter to any position below the die assembly 90. Thereby, the die lifting device 110 supports the pickup of the die 92 by the pickup head 106. Specifically, the lifter is moved below the die 92 picked up by the pickup head 106, and at that position, the lifter is lifted. Thereby, the die 92 is lifted, and the lifted die 92 is adsorbed and held by the adsorption nozzle 120 of the pickup head 106.

[0023] Also, as shown in FIG. 4, the electronic component mounter 10 includes a control device 160. The control device 160 includes a controller 162, a plurality of drive circuits 164, and a memory 166. The plurality of drive circuits 164 are connected to the electromagnetic motors 47, 53, 55, 125, 127, the substrate holding device 48, the positive and negative pressure supply devices 62, 121, the nozzle lifting device 64, the table lifting mechanism 115, the frame moving mechanism 118, the lifting device 122, the lifter lifting device 150, and the lifter moving device 152. The controller 162 includes a CPU, a ROM, a RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 164. Thereby, the operations of the transfer device 20, the moving device 22, etc. are controlled by the controller 162. Also, the controller 162 is connected to the memory 166. Thereby, the controller 162 can acquire the information stored in the memory 166 and store various information in the memory 166. Furthermore, the controller 162 is connected to the image processing device 168. The image processing device 168 is a device for processing the imaging data captured by the parts camera 28. Thereby, the controller 162 acquires various information from the imaging data.

[0024] With the above-described configuration, in the electronic component mounter 10, a mounting operation of mounting the die 92 on the circuit board is performed. Specifically, according to the command of the controller 162 of the control device 160, the circuit board is transported to the working position, and the circuit board is fixedly held at that position. Also, in the die supply device 30, the die 92 is supplied using the pickup head 106.

[0025] Specifically, in response to a command from the controller 162, the lifting table 112 moves up and down, and any die assembly 90 among the plurality of die assemblies 90 accommodated in the rack 111 moves to a position facing the clamp 128. Then, the die assembly 90 is gripped by the clamp 128, and the X-axis direction guide rail 124 moves in the Y-axis direction. As a result, the die assembly 90 gripped by the clamp 128 is pulled out onto the holding frame 117. Note that the die assembly 90 pulled out from the rack 111 is located on the holding frame 117 shown by the solid line in FIG. 2. Further, the die assembly 90 pulled out onto the holding frame 117 is fixed by the fixing mechanism 119. Next, the pickup head 106 moves above the die 92 to be picked up, and the die 92 is sucked and held by the suction nozzle 120.

[0026] At this time, the die lifting device 110 moves below the die 92 sucked and held by the suction nozzle 120 of the pickup head 106, and at that position, the lifter ascends. As a result, the die 92 is lifted, and by being peeled off from the dicing sheet, the pickup of the die 92 by the suction nozzle 120 is supported. Specifically, below the die 92 to be picked up, the lifter moves by the operation of the lifter moving device 152. Then, the tip of the lifter contacts the lower surface of the die 92 to be picked up, and the lifter ascends by the operation of the lifter lifting device 150 until the die 92 is slightly lifted. Then, the suction nozzle 120 descends toward the die 92 slightly lifted by the lifter, and the die 92 is sucked and held by the suction nozzle 120. In this way, the die 92 lifted by the lifting pin 146 is sucked and held by the suction nozzle 120, and thus is peeled off from the dicing sheet. Then, by ascending the suction nozzle 120, the die 92 is picked up by the suction nozzle 120. As a result, the die 92 adhered to the dicing sheet can be appropriately picked up by the suction nozzle 120.

[0027] Subsequently, when the die 92 is picked up by the suction nozzle 120, the pickup head 106 flips in the vertical direction. As a result, the die 92 held by suction on the suction nozzle 120 is supplied above the pickup head 106. Then, when the die 92 is supplied above the pickup head 106, the mounting head 24 moves above the pickup head 106, and the suction nozzle 60 holds the die 92 by suction. That is, the die 92 is transferred from the suction nozzle 120 of the pickup head 106 to the suction nozzle 60 of the mounting head 24. Next, when the suction nozzle 60 of the mounting head 24 holds the die 92 by suction, the mounting head 24 moves above the parts camera 28, and the suction nozzle 60 is imaged. At this time, the imaging data is analyzed by the controller 162, and the posture of the die 92 held by the suction nozzle 60 is calculated. Then, the mounting head 24 moves onto the circuit board, the posture of the die 92 held by the suction nozzle 60 is corrected, and the die 92 is mounted on the circuit board.

[0028] Also, in the die supply device 30, the die 92 can be directly supplied from the die supply device 30 without using the pickup head 106. Specifically, after the die assembly 90 is pulled out from the rack 111 onto the holding frame 117, the holding frame 117 is moved in the Y-axis direction. As a result, the die assembly 90 is positioned on the holding frame 117 shown by the dotted line in FIG. 2. Then, the mounting head 24 moves above the die assembly 90, and the die 92 is picked up by the suction nozzle 60 holding the die 92 by suction. When the die 92 is picked up by the suction nozzle 60, the die 92 is pushed up by the die lifting device 110 in the same manner as when the die 92 is picked up by the suction nozzle 120. Then, the die 92 picked up by the suction nozzle 60 is mounted on the circuit board.

[0029] However, when the die 92 is held by the suction nozzles 60 and 120, the die 92 is pushed up by the die lifting device 110 to support the pickup of the die 92 by the suction nozzles 60 and 120. However, it may be difficult to hold the die 92 by the suction nozzles 60 and 120 in a specific region of the die assembly 90. Specifically, before the die assembly 90 is set in the die supply device 30, that is, before the die assembly 90 is housed in the die assembly housing device 102, an expand process is executed. The expand process is a process of stretching the dicing sheet to make it easier to peel the die 92 from the dicing sheet. When this process is executed, the dicing sheet may not be stretched uniformly, and the elongation of a specific region of the dicing sheet may be insufficient. In such a case, the die 92 in the specific region of the dicing sheet becomes difficult to be peeled from the dicing sheet, and there is a possibility that it is difficult to hold the die 92 in the specific region of the dicing sheet by the suction nozzles 60 and 120.

[0030] Therefore, in each of a specific region of the dicing sheet, that is, a region difficult to hold by the suction nozzle (hereinafter referred to as "first region"), and a region other than the first region (hereinafter referred to as "second region"), the holding operation of the die 92 by the suction nozzle is executed according to different holding conditions. That is, in the first region, the holding operation of the die 92 by the suction nozzle is executed according to the first holding condition, and in the second region, the holding operation of the die 92 by the suction nozzle is executed according to the second holding condition different from the first holding condition.

[0031] Specifically, as the second holding condition, a general holding condition is set by a user operation. For example, the pushing-up amount of the pusher of the die lifting device 110 when the die 92 is held by the suction nozzles 60 and 120 is set to 0.1 mm. Also, the lowering position when the suction nozzles 60 and 120 lower toward the die 92 pushed up by the pusher is, for example, 0.1 m from the tip of the pusher in the pushed-up state by a distance corresponding to the thickness dimension of the die 92. The added distance m is set at an upper position. Further, after the suction nozzles 60 and 120 have descended to the lowered position, suction of the die 92 by negative pressure is performed, and the time from when the suction nozzles 60 and 120 start to rise, that is, the time required for suction and holding, is set at, for example, 0.1 second.

[0032] On the other hand, as a first holding condition, a condition in which the probability of holding the die 92 is higher than that of the second holding condition is set by a user operation. For example, as the first holding condition, the amount of upward pushing of the pusher is set at 0.2 mm, which is higher than 0.1 mm of the second holding condition. Further, for example, as the first holding condition, the lowered position of the suction nozzles 60 and 120 is set at a position 0.05 mm below the lowered position of the second holding condition. Further, for example, as the first holding condition, the time required for suction and holding is set at 0.2 second, which is longer than 0.1 second of the second holding condition.

[0033] When the mounting operation of the die 92 is performed in the electronic component mounter 10, first, the die 92 is held from the die assembly 90 by the suction nozzles 60 and 120 according to the second holding condition. That is, the suction nozzle 120 of the pickup head 106 in the die supply device 30 sucks and holds the die 92 from the die assembly 90 according to the second holding condition. Then, the die 92 is transferred from the suction nozzle 120 of the pickup head 106 to the suction nozzle 60 of the mounting head 24. After the suction nozzle 60 of the mounting head holds the die 92, the suction nozzle 60 of the mounting head is imaged by the parts camera 28. Also, after the suction nozzle 60 of the mounting head 24 in the die supply device 30 sucks and holds the die 92 from the die assembly 90 according to the second holding condition, the suction nozzle 60 is imaged by the parts camera 28. Then, based on the imaging data, the posture of the die 92 held by the suction nozzle 60 is calculated. However, in this case, it may be determined that the die 92 is not held by the suction nozzle 60. Thus, as a reason that the die 92 is not held by the suction nozzle 60, it is considered that a major factor is that the die 92 cannot be held from the die assembly 90 by the suction nozzles 60 and 120 in the die supply device 30. That is, since the die 92 is difficult to be peeled off from the dicing sheet, it is considered that the holding of the die 92 by the suction nozzles 60 and 120 has failed. For this reason, the coordinate positions of the die 92 that could not be held by the suction nozzles 60 and 120 are stored in the memory 166.

[0034] That is, when the die 92 is held from the die assembly 90 in the die supply device 30, the controller 162 naturally recognizes the coordinate position of the die 92 in the die assembly 90 to be held. Therefore, when it is determined based on the imaging data that the die 92 to be held is not held by the suction nozzle 60, the controller 162 associates the coordinate position of the die 92 to be held with the information indicating that the holding of the die 92 to be held has failed and stores it in the memory 166. Also, when it is determined based on the imaging data that the die 92 to be held is held by the suction nozzle 60, the controller 162 associates the coordinate position of the die 92 to be held with the information indicating that the holding of the die 92 to be held has succeeded and stores it in the memory 166. Then, every time it is determined based on the imaging data whether the die 92 is held by the suction nozzle 60, the controller 162 associates the determined coordinate position of the die 92 with the information indicating the success or failure of the holding of that die 92 and stores it in the memory 166.

[0035] In this way, every time the coordinate position of the die 92 and the information indicating the success or failure of the holding of that die 92 are sequentially stored in the memory 166, the controller 162 determines whether the number of dies 92 that have failed to be held has reached a predetermined number per unit area. Specifically, for example, when a 10×10 area is set as the unit area and 5 is set as the predetermined number, it is determined whether the number of dies 92 that have failed to be held in the 10×10 area has reached 5. And when the number of dies 92 that have failed to be held reaches the predetermined number per unit area the controller 162 stops the operation of the electronic component mounting machine 10. Also, the controller 162 displays the image 200 shown in FIG. 5 on the monitor (see FIG. 1) 210 based on the information stored in the memory 166.

[0036] In the image 200, a die assembly image 212 simulating the die assembly 90 is displayed. In the die assembly image 212, the dies 92 that failed in holding and the dies 92 that succeeded in holding are displayed at the position coordinates associated with each die 92. Further, in the die assembly image 212, not only the dies 92 that failed in holding and the dies 92 that succeeded in holding, but also the dies 92 for which the holding operation by the suction nozzles 60, 120 has not been performed, that is, the dies 92 before the holding operation, are displayed. Then, by checking the die assembly image 212, the operator can estimate the region where it is difficult to hold the die 92 by the suction nozzle in the die assembly 90 based on the position of the die 92 that failed in holding in the die assembly image 212. Therefore, the operator sets, in the die assembly image 212, the region where it is difficult to hold the die 92 by the suction nozzle, that is, the first region.

[0037] Specifically, as shown in FIG. 5, the dies 92 that failed in holding are concentrated in the lower left part of the die assembly image 212. Therefore, it can be estimated that the region including the lower left part of the die assembly image 212 is the region where it is difficult to hold the die 92 by the suction nozzle. Therefore, as shown in FIG. 6, the operator sets, at the display position of the die 92 before the holding operation in the die assembly image 212, the region where it is difficult to hold the die by the suction nozzle, that is, the first region, with the partition line 220. Note that the range of the partition line 220 can be arbitrarily set by the operator based on the estimation. Also, if the monitor 210 is a touch panel, the setting of the first region by the partition line 220 is performed by an operation on the touch panel. Also, the setting of the first region by the partition line 220 may be performed using an input device such as a mouse or a keyboard.

[0038] Then, in the die assembly image 212, the first region is set by the partition line 220, and when the OK button 222 displayed next to the die assembly image 212 is operated, the mounting operation by the electronic component mounter 10 resumes. At this time, the holding operation of the die 92 within the range set in the first region is executed according to the first holding condition. That is, the holding operation of the die 92 in the region estimated to be difficult to hold by the suction nozzle is executed according to the holding condition with a higher probability of holding the die 92 than the second holding condition that has been executed previously. As a result, even for the die 92 in the region where it is difficult to peel the die 92 from the dicing sheet, it can be held by the suction nozzles 60 and 120.

[0039] On the other hand, the holding operation of the die 92 in the region other than the first region, that is, the second region, is executed according to the second holding condition. That is, the holding operation of the die 92 in the region not estimated to be difficult to hold by the suction nozzle is executed according to the second holding condition that has been executed previously. The die 92 in the second region is assumed to be easily peeled from the dicing sheet, similar to the die 92 that has been successfully held by the suction nozzles 60 and 120 according to the second holding condition previously. Therefore, even for the holding operation according to the second holding condition, that is, the general holding condition, the die 92 in the second region can be appropriately held by the suction nozzles 60 and 120. In this way, by executing the holding operation of the die 92 in the first region according to the first holding condition and the holding operation of the die 92 in the second region according to the second holding condition, the holding probability of the die by the suction nozzle increases, and the production efficiency also increases. That is, it is possible to minimize the decrease in production efficiency caused by the failure of holding the die by the suction nozzle.

[0040] In the above embodiment, the electronic component mounter 10 is an example of a die holding device. The suction nozzle 60 is an example of a holder. The die assembly 90 is an example of a die assembly. The die 92 is an example of a die. The die lifting device 110 is an example of a holder. The suction nozzle 120 is an example of a holder. The control device 160 is an example of a control device. The memory 166 is an example of a memory device. The monitor 210 is an example of a display device.

[0041] Moreover, the present invention is not limited to the above embodiments, and can be implemented in various forms with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, the amount of upward pushing of the pusher, the descending positions of the suction nozzles 60 and 120, and the time required for suction holding are set as the first holding condition and the second holding condition, but other conditions may be set. For example, the setting of the holding position of the die 92 by the suction nozzle, the ascending / descending speed of the suction nozzle, etc. may be set as the first holding condition and the second holding condition.

[0042] Also, in the above embodiments, the first holding condition and the second holding condition are set by user operation, but they may be automatically set by the controller 162. For example, when the holding position of the die 92 by the suction nozzle is set by user operation as the second holding condition, and when the holding operation of the die 92 by the suction nozzle is successful according to the second holding condition, the die 92 in the state held by the suction nozzle is imaged. Then, in the controller 162, the amount of deviation of the holding position of the die 92 is calculated based on the imaging data. Also, in the controller 162, a new holding position of the die 92 corrected based on the amount of deviation of the holding position is set as the first holding condition. In this way, the first holding condition may be automatically set by the controller 162.

[0043] Also, in the above embodiment, the first region, i.e., the region where it is difficult to hold the die by the suction nozzle, is set by a user operation on the die assembly image 212, but it may be automatically set by the controller 162. For example, the size of the first region is set in advance, and the controller 162 may set the position of the first region so as to be near the coordinate position of the die 92 that has failed to be held. Further, the controller 162 may automatically set the size of the first region according to the occurrence ratio of the die 92 that has failed to be held. Thus, when the first region is set by the controller 162, it may not be necessary to display the die assembly image 212 on the monitor 210. On the other hand, the die assembly image 212 may be displayed on the monitor 210, and the operator may manually correct the first region set by the controller 162.

[0044] Also, in the above embodiment, the present invention is applied when the die 92 is held by the suction nozzles 60 and 120, but the present invention may also be applied when the die 92 is held by a component gripper that grips the component with a plurality of claws such as a chuck.

Description of Reference Numerals

[0045] 10: Electronic component mounting machine (substrate working system) 60: Suction nozzle (holder) 90: Die assembly 92: Die 110: Die lifting device (holder) 120: Suction nozzle (holder) 160: Control device 166: Memory (storage device) 210: Monitor (display device)

Claims

1. A holder used for holding dies from a die aggregate formed by dicing a wafer with a dicing sheet attached thereto, a storage device that stores the position of a die in the die aggregate when the die cannot be held using the holder, a control device that controls the operation of the holder so as to hold dies in a first region set as a region where it is difficult to hold dies in a region before holding the dies from the die aggregate according to a first holding condition based on the position of the die in the die aggregate stored in the storage device, and hold dies in a second region other than the first region according to a second holding condition different from the first holding condition, A die holding device comprising the above.

2. The die holding device according to claim 1, wherein the first region is set based on a region where the positions of the dies in the die aggregate stored in the storage device are concentrated.

3. The die holding device according to claim 2, wherein the first region is set in a vicinity region of a region where the positions of the dies in the die aggregate stored in the storage device are concentrated.

4. The die holding device according to any one of claims 1 to 3, further comprising a display device that displays the position of the die in the die aggregate stored in the storage device.

5. The die holding device according to claim 4, further comprising the control device that controls the operation of the holder so as to hold dies in the first region set by an operator through a user operation according to the first holding condition based on the position of the die in the die aggregate displayed on the display device, and hold dies in the second region according to the second holding condition.

6. a computing device that computes the amount of deviation of the holding position of a die based on the imaging data of the die when the die can be held using the holder, a setting device that sets the holding position of the die by the holder as the second holding condition based on the amount of deviation of the holding position of the die computed by the computing device, The die holding device according to any one of claims 1 to 5, comprising the above.

Images