Inspection device

Abstract

To appropriately inspect a push-up device that pushes up an arbitrary die of a die assembly from below.SOLUTION: An inspection device inspects a push-up device that pushes up an arbitrary die of a die assembly from below while the lower surface of the die assembly formed by dicing a wafer with a dicing sheet stuck thereto is sucked by a negative pressure, and measures the negative pressure of the push-up device at predetermined time intervals.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to an inspection apparatus for inspecting a lifting device that lifts any die of a die assembly from below.

Background Art

[0002] A die assembly is formed by dicing a wafer with a dicing sheet attached thereto, and the following patent documents describe a lifting device that lifts any die of the die assembly from below.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] This specification aims to appropriately inspect a lifting device that lifts any die of a die assembly from below.

Means for Solving the Problems

[0005] To solve the above problems, this specification provides an inspection apparatus for inspecting a lifting device that lifts any die of a die assembly formed by dicing a wafer with a dicing sheet attached thereto, Wafer sheet wherein the bottom surface of the die assembly is sucked by negative pressure, and the inspection apparatus measures the negative pressure of the lifting device at predetermined time intervals. The lifting device includes a lid, a plurality of suction holes provided on the upper surface of the lid, a suction path communicating with the suction holes, a suction pump connected to the suction path, a pressure sensor disposed in the suction path, and a lifting pin provided so as to be protrudable from the upper surface of the lid. The upper surface of the lid is brought into contact with the lower surface of the wafer sheet, and the suction pump is operated to suck under negative pressure of the lifting device inside the suction path negative pressure , from when the lifting device contacts the lower surface of the wafer sheet by the pressure sensor until after the lifting pin is raised to push up an arbitrary die from below and then the lifting pin is lowered is measured at predetermined time intervals.

Effects of the Invention

[0006] According to the present disclosure, by measuring the negative pressure of the pick-up device at predetermined time intervals, the pick-up device can be appropriately inspected.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0008] Hereinafter, as embodiments for carrying out the present invention, examples of the present invention will be described in detail with reference to the drawings.

[0009] FIGS. 1 and 2 show an electronic component mounting machine 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the electronic component mounting machine 10, and FIG. 2 is a view showing the electronic component mounting machine 10 with the cover 12 and the like removed from a top view. The electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as "moving device") 22, a mounting head 24, and a die supply device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction. It is a working machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as "moving device") 22, a mounting head 24, and a die supply device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

[0010] The conveying device 20 includes two conveyor devices 40 and 42. These two conveyor devices 40 and 42 are arranged on the base 46 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit board in the X-axis direction by the drive of an electromagnetic motor (see FIG. 5) 47. Also, the circuit board is fixedly held by a board holding device (see FIG. 5) 48 at a predetermined position.

[0011] The moving device 22 has a pair of Y-axis guide rails 50 extending in the Y-axis direction and an X-axis guide rail 52 extending in the X-axis direction. The X-axis guide rail 52 is mounted on the pair of Y-axis guide rails 50. And the X-axis guide rail 52 moves to an arbitrary position in the Y-axis direction by the drive of an electromagnetic motor (see FIG. 5) 53. Also, the X-axis guide rail 52 holds a slider 54 movably along its axis. This slider 54 moves to an arbitrary position in the X-axis direction by the drive of an electromagnetic motor (see FIG. 5) 55. A mounting head 24 is attached to the slider 54. With such a structure, the mounting head 24 moves to an arbitrary position on the base 46.

[0012] The mounting head 24 mounts electronic components on the circuit board. The mounting head 24 has a suction nozzle 60 provided on the lower end surface. The suction nozzle 60 communicates with a positive and negative pressure supply device (see FIG. 5) 62 via a negative pressure air and positive pressure air passage. The suction nozzle 60 sucks and holds the electronic component by negative pressure and releases the held electronic component by positive pressure. Also, the mounting head 24 has a nozzle lifting device (see FIG. 5) 64 for lifting and lowering the suction nozzle 60. By the nozzle lifting device 64, the mounting head 24 changes the vertical position of the electronic component to be held. Note that the suction nozzle 60 is detachable from the mounting head 24.

[0013] The die supply device 30 is provided at one end of the base 46 in the Y-axis direction. Specifically, a recessed storage portion 86 is formed at the edge of the base 46, and a part of the die supply device 30 is stored in the storage portion 86. As shown in FIG. 3, the die supply device 30 supplies the die 92 from the die assembly 90. The die assembly 90 is formed by dicing a wafer with a dicing sheet attached thereto. Note that the die assembly 90 may simply be referred to as a "wafer", and the die 92 may also be referred to as a "chip".

[0014] The die supply device 30 includes a main frame 100, a die assembly storage device 102, a die assembly holding device 104, a pickup head 106, a pickup head moving device (hereinafter sometimes abbreviated as "moving device") 108, a die pushing-up unit (see FIG. 4) 110, and an inspection device (see FIG. 4) 111.

[0015] The upper surface of the main frame 100 is generally rectangular, and the die assembly holding device 104, the pickup head 106, and the moving device 108 are disposed on the upper surface thereof. Then, the main frame 100 is stored in the storage portion 86, whereby the die supply device 30 is attached to the base 46.

[0016] The die assembly storage device 102 is connected to an end of the main frame 100 in the Y-axis direction and includes a rack 112 and a lifting table 113. The rack 112 is disposed on the lifting table 113, and a plurality of die assemblies 90 are stored inside the rack 112 in a stacked state. The plurality of die assemblies 90 move up and down as the lifting table 113 is lifted and lowered by a table lifting mechanism (see FIG. 5) 115. Then, the die assembly 90 located at a predetermined height is pulled out onto the die assembly holding device 104. Note that the die assembly 90 includes die assemblies 90 of various sizes such as 6-inch size and 8-inch size, and it is possible to store the die assemblies 90 of these various sizes in the rack 112.

[0017] As shown in FIGS. 2 and 3, the die assembly holding device 104 has a pair of guide rails 116 and a holding frame 117. The pair of guide rails 116 are arranged on the main frame 100 so as to extend in the Y-axis direction, and support the holding frame 117 so as to be movable in the Y-axis direction. Then, the holding frame 117 is moved in the Y-axis direction along the guide rails 116 by a frame moving mechanism (see FIG. 5) 118. On the holding frame 117, the die assembly 90 drawn out from the die assembly housing device 102 is placed. Further, a fixing mechanism 119 is arranged on the holding frame 117. The fixing mechanism 119 fixes the die assembly 90 at two opposing sides of the die assembly 90 and positions it on the upper surface of the holding frame 117.

[0018] The pickup head 106 picks up the die 92 from the die assembly 90, and a plurality of suction nozzles 120 are mounted on the lower surface. Each suction nozzle 120 communicates with a positive / negative pressure supply device (see FIG. 5) 121. The suction nozzle 120 sucks and holds the die 92 by negative pressure, and releases the held die 92 by positive pressure. Further, the pickup head 106 can be inverted in the vertical direction so that the nozzle port of the suction nozzle 120 faces upward. Thereby, the die 92 sucked and held by the suction nozzle 120 is supplied above the pickup head 106. Further, the pickup head 106 has a lifting device (see FIG. 5) 122, and each suction nozzle 120 moves up and down by the operation of the lifting device 122.

[0019] The moving device 108 has a pair of Y-axis guide rails 123 extending in the Y-axis direction and an X-axis guide rail 124 extending in the X-axis direction. The X-axis guide rail 124 is mounted on the pair of Y-axis guide rails 123. And the X-axis guide rail 124 moves to an arbitrary position in the Y-axis direction by the drive of an electromagnetic motor (see FIG. 5) 125. Further, the X-axis guide rail 124 holds a slider 126 movably along its axis. This slider 126 moves to an arbitrary position in the X-axis direction by the drive of an electromagnetic motor (see FIG. 5) 127. A pickup head 106 is attached to the slider 126. With such a structure, the pickup head 106 moves to an arbitrary position on the main frame 100.

[0020] Also, a clamp 129 is attached to the back surface of the X-axis guide rail 124 of the moving device 108. The clamp 129 grips the die assembly 90 housed in the rack 112 of the die assembly housing device 102. And by moving the X-axis guide rail 124 in the Y-axis direction, the die assembly 90 gripped by the clamp 129 moves in the Y-axis direction. Thereby, the die assembly 90 housed in the rack 112 is pulled out onto the holding frame 117.

[0021] The die lifting unit 110 is disposed below the holding frame 117 of the die assembly holding device 104 and has a lifting device 130, a moving device 132, a lifting device (see FIG. 5) 134, and a rotating device (see FIG. 5) 135 as shown in FIG. 4. The lifting device 130 includes a housing 136, a lid 138, a rod holder 140, a lifting rod 142, a lifting pin 144, and a pin holder 146. The housing 136 generally has a cylindrical shape and is disposed below the holding frame 117 in an erected state. The lid 138 generally has a covered cylindrical shape and covers the opening at the upper end of the housing 136. Note that a through hole 148 is formed in the center of the lid portion of the lid 138, and a plurality of suction holes 150 are also formed in the lid portion in addition to the through hole 148. A through hole 148 is formed, and a plurality of suction holes 150 are also formed in the lid portion other than the through hole 148.

[0022] Further, the rod holder 140 has a cylindrical shape and is fixed in a standing state inside the housing 136. The lifting rod 142 is held inside the rod holder 140 so as to be movable in the vertical direction, and is lifted and lowered by the drive of an electromagnetic motor (see FIG. 5) 152. The upper end of the lifting rod 142 extends from the upper end of the rod holder 140, and a protruding pin 144 is fixed to the upper end of the lifting rod 142 coaxially with the lifting rod 142. Therefore, as the lifting rod 142 moves up and down, the protruding pin 144 also moves up and down.

[0023] Further, the pin holder 146 generally has a short cylindrical shape and is fixed coaxially with the rod holder 140 to the upper end of the rod holder 140. Inside the pin holder 146, the protruding pin 144 is held so as to be movable in the vertical direction. The upper end of the protruding pin 144 held by the pin holder 146 extends upward from the upper end surface of the pin holder 146, and the upper end of the protruding pin 144 is inserted into the through hole 148 of the lid body 138. In a state where the lifting rod 142 is lowered to the maximum extent, the upper end surface of the protruding pin 144 coincides with the upper end surface of the lid body 138 in the vertical direction. That is, the upper end surface of the protruding pin 144 and the upper end surface of the lid body 138 are flush. As the lifting rod 142 rises, the upper end of the protruding pin 144 protrudes from the upper end surface of the lid body 138. Further, the inside of the housing 136 functions as an air flow path 156 penetrating in the vertical direction, and the lower end of the air flow path 156 opens to the lower end surface of the housing 136. On the other hand, the upper end of the air flow path 156 opens at a plurality of suction holes 150 formed in the lid body 138.

[0024] Further, the moving device 132 moves the stage 158 to an arbitrary position in the X-axis direction and the Y-axis direction below the die assembly holding device 104. On the upper surface of the stage 158, a short cylindrical holder 160 is disposed so as to be rotatable about its axis. Further, a concave portion 162 corresponding to the shape of the lower end of the punching device 130 is formed on the upper surface of the holder 160. The lower end of the punching device 130 is fitted in the concave portion 162 in a positioned state, and the punching device 130 is disposed on the upper surface of the stage 158 via the holder 160 in a posture extending in the vertical direction. Note that the punching device 130 is detachably attached to the holder 160.

[0025] Further, a through hole 164 penetrating in the vertical direction is formed in the bottom surface of the concave portion 162 of the holder 160. When the lower end of the punching device 130 is attached to the concave portion 162, the lower end of the air flow path 156 of the punching device 130 communicates with the upper end of the through hole 164. A through hole 166 penetrating in the vertical direction is also formed in the stage 158, and the upper end of the through hole 166 communicates with the lower end of the through hole 164 formed in the holder 160. One end of a pipe 168 is connected to the lower end of the through hole 166, and a suction pump 170 is connected to the other end of the pipe 168. Thus, when the suction pump 170 operates, negative pressure is supplied to the pipe 168, the through holes 164 and 166, and the air flow path 156, and air is sucked through the plurality of suction holes 150 on the upper surface of the lid 138 of the punching device 130.

[0026] Further, the elevating device 134 moves the stage 158 in the vertical direction. Thereby, the punching device 130 is controllably elevated. The rotating device 135 rotates the holder 160. Thereby, the punching device 130 is controllably rotated.

[0027] Further, the inspection device 111 includes a plurality of side laser displacement meters 180, an upper laser displacement meter (see FIG. 2) 182, and a pressure sensor 184. The side laser displacement meter 180 and the upper laser displacement meter 182 irradiate a laser toward an object and receive the laser reflected by the object, and measure the distance to the object based on the phase difference of the laser or the like. Then, a pole 188 is erected on the upper surface of the stage 158 so as to face the protruding device 130 mounted on the holder 160. The pole 188 is erected so as to extend in the vertical direction, and a plurality of lateral laser displacement gauges 180 are fixed to the pole 188 at different heights. Each of the plurality of lateral laser displacement gauges 180 is fixed to the pole 188 so as to irradiate a laser toward the side surface of the housing 136 of the protruding device 130, and measures the distance to the side surface of the housing 136.

[0028] Also, as shown in FIG. 2, the upper laser displacement gauge 182 is attached to the lower end surface of the slider 126 of the moving device 108 in a downward-facing state and irradiates a laser downward. As a result, when the upper laser displacement gauge 182 moves above the protruding device 130 by the operation of the moving device 108 and irradiates a laser toward the upper end surface of the protruding device 130, the distance to the upper end surface of the protruding device 130 is measured. Further, as shown in FIG. 4, the pressure sensor 184 is disposed inside the through hole 166 of the stage 158. Thereby, the pressure sensor 184 measures the negative pressure supplied to the through hole 166 when air is sucked from the plurality of suction holes 150 on the upper end surface of the protruding device 130 by the operation of the suction pump 170.

[0029] Further, as shown in FIG. 5, the electronic component mounter 10 includes a control device 190. The control device 190 includes a controller 192, a plurality of drive circuits 194, and a memory 196. The plurality of drive circuits 194 are connected to the electromagnetic motors 47, 53, 55, 125, 127, 152, the substrate holding device 48, the positive and negative pressure supply devices 62, 121, the nozzle lifting device 64, the table lifting mechanism 115, the frame moving mechanism 118, the lifting devices 122, 134, the moving device 132, the rotating device 135, and the suction pump 170. The controller 192 includes a CPU, a ROM, a RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 194. Thereby, the operations of the conveying device 20, the moving device 22, etc. are controlled by the controller 192. Further, the controller 192 is also connected to the side laser displacement meter 180, the upper laser displacement meter 182, and the pressure sensor 184. Thereby, the controller 192 acquires various measurement values from the side laser displacement meter 180, the upper laser displacement meter 182, and the pressure sensor 184. Furthermore, the controller 192 is also connected to the memory 196. Thereby, the controller 192 acquires various information from the memory 196 and stores various information in the memory 196.

[0030] With the above-described configuration, in the electronic component mounter 10, a mounting operation of mounting the die 92 on the circuit board is performed. Specifically, according to the command of the controller 192 of the control device 190, the circuit board is conveyed to the working position, and the circuit board is fixedly held at that position. Further, the die supply device 30 supplies the die 92 using the pickup head 106.

[0031] Specifically, in response to a command from the controller 192, the lifting table 113 is lifted or lowered, and any die assembly 90 among the plurality of die assemblies 90 housed in the rack 112 is moved to a position facing the clamp 129. Then, the die assembly 90 is gripped by the clamp 129, and the X-axis direction guide rail 124 is moved in the Y-axis direction. As a result, the die assembly 90 gripped by the clamp 129 is pulled out onto the holding frame 117. Note that the die assembly 90 pulled out from the rack 112 is positioned on the holding frame 117 shown by the solid line in FIG. 2. Further, the die assembly 90 pulled out onto the holding frame 117 is fixed by the fixing mechanism 119. Next, the pickup head 106 moves above the die 92 to be picked up, and the die 92 is sucked and held by the suction nozzle 120.

[0032] At this time, the lifting device 130 moves below the die 92 sucked and held by the suction nozzle 120 of the pickup head 106, and at that position, the lifting rod 142 rises while the die assembly 90 is sucked and held by the lifting device 130. As a result, the die 92 is lifted and peeled off from the dicing sheet, thereby supporting the pickup of the die 92 by the suction nozzle 120. Specifically, below the die 92 to be picked up, the lifting device 130 moves by the operation of the moving device 132. Then, the lifting device 130 rises by the operation of the lifting device 134 until the upper end surface of the lid 138 of the lifting device 130 contacts the lower surface of the die assembly 90 held by the holding frame 117. Subsequently, by the operation of the suction pump 170, negative pressure is supplied to the air flow path 156 through the pipe 168 and the through holes 164 and 166. As a result, air is sucked from the plurality of suction holes 150 formed in the lid 138 of the lifting device 130, and the lower surface of the die assembly 90 is held by the lifting device 130. With the lower surface of the die assembly 90 held by the lifting device 130 and the die 92 adsorbed by the suction nozzle 120 from above the die assembly 90, the lifting rod 142 rises. Thereby, the die 92 in the state of being adsorbed by the suction nozzle 120 is lifted by the lifting pin 144 from the die assembly 90 held by the lifting device 130, and the die 92 is peeled off from the dicing sheet. Then, when the suction nozzle 120 rises, the die 92 is picked up by the suction nozzle 120.

[0033] As a result, the die 92 attached to the dicing sheet can be appropriately picked up by the suction nozzle 120. That is, with the lower surface of the die assembly 90 held by the lifting device 130, the die 92 to be held is lifted by the lifting pin 144, so that the die 92 is peeled off from the dicing sheet and appropriately picked up by the suction nozzle 120. When the lifting rod 142 ascends, that is, when the lifting pin 144 lifts the die 92, the suction nozzle 120 ascends by an amount corresponding to the ascending amount of the lifting rod 142. Thereby, the load applied to the die 92 sandwiched between the lifting pin 144 and the suction nozzle 120 is suppressed. After the die 92 is picked up by the suction nozzle 120, the operation of the suction pump 170 stops and the lifting rod 142 descends. That is, after the die 92 is picked up by the suction nozzle 120, the suction of air from the plurality of suction holes 150 of the lifting device 130 stops, and the lifting pin descends and the tip of the lifting pin 144 retracts into the through hole 148.

[0034] Next, when the die 92 is picked up by the suction nozzle 120, the pickup head 106 is inverted in the vertical direction. As a result, the die 92 adsorbed and held by the suction nozzle 120 is supplied above the pickup head 106. When the die 92 is supplied above the pickup head 106, the mounting head 24 moves above the pickup head 106, and the suction nozzle 60 adsorbs and holds the die 92. That is, the die 92 is transferred from the suction nozzle 120 of the pickup head 106 to the suction nozzle 60 of the mounting head 24. Then, the mounting head 24 moves onto the circuit board, and the die 92 is mounted on the circuit board.

[0035] Also, in the die supply device 30, it is possible to directly supply the die 92 from the die supply device 30 without using the pickup head 106. Specifically, after the die assembly 90 is pulled out from the rack 112 onto the holding frame 117, the holding frame 117 is moved in the Y-axis direction. As a result, the die assembly 90 is positioned on the holding frame 117 shown by the dotted line in FIG. 2. Then, the mounting head 24 moves above the die assembly 90, and the die 92 is picked up by adsorbing and holding the die 92 with the suction nozzle 60. When the die 92 is picked up by the suction nozzle 60, similar to the case of picking up the die 92 by the suction nozzle 120, the die assembly 90 is sucked by the popping-up device 130 and the die 92 is popped up. Then, the die 92 picked up by the suction nozzle 60 is mounted on the circuit board.

[0036] In this way, in the die supply device 30, when the die 92 is picked up from the die assembly 90 by the suction nozzle, with the die assembly 90 being sucked and held by the popping-up device 130, By pushing up the die 92, the pickup of the die 92 by the suction nozzle is supported. However, since the pushing-up device 130 holds the die assembly 90 by air suction, if the air suction force is low, there is a risk that the pushing-up device 130 may not be able to properly hold the die assembly 90. Also, when the lower surface of the die assembly 90 is not flat, etc., a gap is generated between the lower surface of the die assembly 90 and the upper surface of the lid 138 of the pushing-up device 130, and air leaks from that gap, so there is a risk that the pushing-up device 130 may not be able to properly hold the die assembly 90. On the other hand, even when the upper surface of the lid 138 of the pushing-up device 130 is inclined, a gap is generated between the lower surface of the die assembly 90 and the upper surface of the lid 138 of the pushing-up device 130, and air leaks from that gap, so there is a risk that the pushing-up device 130 may not be able to properly hold the die assembly 90. Furthermore, generally speaking, the pushing-up device 130 has a cylindrical shape and is mounted on the holder 160 in a posture extending in the vertical direction. However, even when the pushing-up device 130 is inclined with respect to the vertical direction, the upper surface of the lid 138 of the pushing-up device 130 is inclined. For this reason, even when the pushing-up device 130 is inclined with respect to the vertical direction, a gap is generated between the lower surface of the die assembly 90 and the upper surface of the lid 138 of the pushing-up device 130, and air leaks from that gap, so there is a risk that the pushing-up device 130 may not be able to properly hold the die assembly 90. And when the pushing-up device 130 cannot properly hold the die assembly 90, when the die 92 to be held is pushed up by the push-up pin 144, the die assembly 90 may also be lifted together with the die 92, and there is a risk that the die cannot be peeled off from the dicing sheet. Also, even when the die assembly 90 is properly held by the pushing-up device 130, if the pushing-up amount of the push-up pin 144 of the pushing-up device 130 is small, there is a risk that the die cannot be peeled off from the dicing sheet. Thus, when the die cannot be peeled off from the dicing sheet, the die cannot be held by the suction nozzle, that is, the suction of the die by the suction nozzle fails, and the die that has failed in suction is discarded. Also, when the suction of the die fails, it is necessary to re-execute the die suction operation, so profit decreases and losses occur due to tact delay.

[0037] In view of such a situation, the inspection device 111 inspects the pushing-up device 130. Specifically, when the die supply operation of the die 92 is being executed in the die supply device 30, in order to inspect whether the pushing-up device 130 appropriately holds the die assembly 90, the negative pressure supplied to the air suction path is measured every predetermined time using the pressure sensor 184 of the inspection device 111. That is, the pressure sensor 184 disposed in the through hole 166, which is the air suction path, measures the pressure inside the through hole 166 every 10 msec. During the die supply operation, the die is pushed up by the pushing-up pins while the die assembly 90 is being sucked by the pushing-up device 130. Therefore, the measurement of the negative pressure by the pressure sensor 184 is performed after the pushing-up device 130 is raised so that the upper end surface of the pushing-up device 130 contacts the lower surface of the die assembly 90 to suck the lower surface of the die assembly 90, then the pushing-up pins are raised to push up an arbitrary die from below, and then the pushing-up pins are lowered. Then, the measurement value by the pressure sensor 184 is analyzed by the controller 192, and it is determined whether the pushing-up device 130 appropriately holds the die assembly 90.

[0038] Specifically, the controller 192 determines whether the negative pressure measured every 10 msec (hereinafter referred to as "measured negative pressure") reaches a preset negative pressure (hereinafter referred to as "set negative pressure"), and when the measured negative pressure reaches the set negative pressure, calculates the time until the measured negative pressure reaches the set negative pressure. Further, the controller 192 determines whether there is a decrease in the measured negative pressure every 10 msec, and when the measured negative pressure decreases, calculates the amount of negative pressure decrease every 10 msec. Then, when the measured negative pressure does not reach the set negative pressure, the controller 192 stops the operation of the die supply device 30 and issues an error notification. That is, when the negative pressure in the air suction path does not reach the set negative pressure, it is determined that the suction force of the pushing-up device 130 is low, so that the pushing-up device 130 cannot appropriately hold the die assembly 90, and the operation of the die supply device 30 is stopped and an error notification is issued. Further, even when the measured negative pressure reaches the set negative pressure, if the time until the measured negative pressure reaches the set negative pressure exceeds the set time, the controller 192 stops the operation of the die supply device 30 Cause an error notification to be issued. That is, since the responsiveness of the negative pressure during air suction is low, it is determined that the die assembly 90 cannot be properly held by the lifting device 130, and the operation of the die supply device 30 is stopped and an error notification is issued. Further, even when the measured negative pressure decreases and the amount of the decreased negative pressure per 10 msec is greater than the set negative pressure amount, the controller 192 stops the operation of the die supply device 30 and issues an error notification. That is, due to an instantaneous decrease in the negative pressure, it is determined that the die assembly 90 cannot be properly held by the lifting device 130, and the operation of the die supply device 30 is stopped and an error notification is issued. In this way, by stopping the operation of the die supply device 30 and issuing an error notification, the operator can recognize the possibility that the die assembly 90 cannot be properly held by the lifting device 130, and can perform inspection, repair, etc. of the lifting device 130 at an early stage. As a result, it becomes possible to reduce the suction error of the die by the suction nozzle, and to suppress the waste of the die 92, the decrease in profit due to tact delay, and the occurrence of losses.

[0039] Also, in the above description, during the die supply operation, the negative pressure supplied to the air suction path is measured while the lifting device 130 is sucking the die assembly 90. Therefore, when determining the suitability of holding the die assembly by the lifting device 130 based on the measured value, not only when there is a problem with the suction pump 170 or the state of the air suction path, but also when there is a gap between the upper end surface of the lifting device and the lower surface of the die assembly 90, etc., it is determined that the die assembly cannot be properly held by the lifting device 130. Therefore, in order to determine the state of the suction pump 170 and the air suction path, the negative pressure is measured using the dedicated measuring device 200 shown in FIG. 6 instead of the lifting device 130. Specifically, the dedicated measuring device 200 has the same configuration as the lifting device 130 except for the lid body 202. The lid body 202 has the same shape as the lid body 138 of the lifting device 130, but through holes 148 and a plurality of suction holes 150 are not formed on the upper end surface of the lid body 202 like the lid body 138 of the lifting device 130. That is, the dedicated measuring device 200 is such that the through holes 148 and the plurality of suction holes of the lifting device 130 are blocked by members different from the die assembly 90. For this reason, the upper end portion of the dedicated measuring device 200 is sealed by the lid body 202. And the dedicated measuring device 200 is mounted on the holder 160. In the die supply device 30, since a plurality of stages 158 are arranged, the lifting device 130 is mounted on the holder 160 of one of the plurality of stages, and the dedicated measuring device 200 is mounted on the holder 160 of a stage different from that stage.

[0040] When negative pressure is supplied to the air suction path of the dedicated measuring device 200, the negative pressure is measured by the pressure sensor 184 every predetermined time (every 10 msec). Since no suction holes are formed in the lid 202 of the dedicated measuring device 200, it is of course impossible to perform the die supply operation using the dedicated measuring device 200. For this reason, in the lifting device 130, negative pressure measurement was performed until the lifting pins were lowered after the upper end surface of the lifting device 130 came into contact with the lower surface of the die assembly 90. However, in the dedicated measuring device 200, negative pressure measurement is performed for a preset time. Then, the measurement value by the pressure sensor 184 is analyzed by the controller 192, and the state of the suction pump 170 and the air suction path is determined.

[0041] At this time, the controller 192 analyzes the negative pressure measured using the dedicated measuring device 200 by the same method as the negative pressure measured using the lifting device 130. That is, the controller 192 determines whether the measured negative pressure reaches the set negative pressure, and when the measured negative pressure reaches the set negative pressure, calculates the time until the measured negative pressure reaches the set negative pressure. Further, the controller 192 determines whether there is a decrease in the measured negative pressure every 10 msec, and when the measured negative pressure decreases, calculates the amount of negative pressure decrease every 10 msec. Then, when the measured negative pressure does not reach the set negative pressure, when the time until the measured negative pressure reaches the set negative pressure exceeds the set time, or when the amount of negative pressure decrease every 10 msec is larger than the set negative pressure amount, the controller 192 issues an error notification. As a result, the operator can recognize that the state of the suction pump 170 and the air suction path has deteriorated, and can promptly inspect, repair, etc. the suction pump 170 and the air suction path.

[0042] Also, in the die supply device 30, the presence or absence of inclination of the upper end surface of the pushing-up device 130 is inspected using the upper laser displacement meter 182 of the inspection device 111. Specifically, as described above, the upper laser displacement meter 182 irradiates a laser toward the upper end surface of the pushing-up device 130, thereby making it possible to measure the distance between the upper laser displacement meter 182 and the upper end surface of the pushing-up device 130 (hereinafter referred to as "upper end surface distance"). For this reason, the upper laser displacement meter 182 measures the upper end surface distances at a plurality of locations on the upper end surface of the pushing-up device 130. Then, in the controller 192, based on those upper end surface distances at the plurality of locations, the inclination angle of the upper end surface of the pushing-up device 130 with respect to the horizontal plane is calculated, and it is determined whether the calculated inclination angle is equal to or greater than the set angle. At this time, when the calculated inclination angle is equal to or greater than the set angle, the controller 192 issues an error notification. As a result, the operator can recognize that the upper end surface of the pushing-up device 130 is inclined, and can promptly perform inspection, repair, etc. of the upper end surface of the pushing-up device 130, that is, the lid body 202.

[0043] Further, the upper laser displacement meter 182 can measure the distance between the upper laser displacement meter 182 and the tip of the protruding pin 144 (hereinafter referred to as the "tip distance") by irradiating a laser toward the tip of the protruding pin 144 that protrudes from the upper end surface of the protruding device 130. For this reason, the controller 192 controls the operation of the electromagnetic motor 152 to raise the protruding pin 144 by a predetermined amount, and measures the tip distance with the upper laser displacement meter 182. At this time, normally, the protruding pin 144 protrudes from the upper end surface of the protruding device 130 by a predetermined amount. However, since the predetermined amount is the target protruding amount of the protruding pin (hereinafter referred to as the "target protruding amount"), the actual protruding amount of the protruding pin (hereinafter referred to as the "actual protruding amount") may differ from the target protruding amount due to a defect in the electromagnetic motor 152, damage to the tip of the protruding pin, etc. Therefore, the controller 192 calculates the actual protruding amount based on the tip distance measured by the upper laser displacement meter 182, and compares the actual protruding amount with the target protruding amount. Then, the controller 192 determines whether the difference between the actual protruding amount and the target protruding amount is equal to or greater than a threshold value. At this time, when the difference between the actual protruding amount and the target protruding amount is equal to or greater than the threshold value, the controller 192 issues an error notification. As a result, the operator can recognize that the tip of the protruding pin has not risen to the target position, and can promptly inspect and repair the protruding pin, the electromagnetic motor 152, etc. When there is a die assembly 90 between the upper laser displacement meter 182 and the protruding device 130, the measurement by the upper laser displacement meter 182 cannot be performed. For this reason, the measurement by the upper laser displacement meter 182 is executed when the die supply operation by the die supply device 30 is not being performed.

[0044] Furthermore, in the die supply device 30, the presence or absence of inclination of the pushing-up device 130 is inspected using the side laser displacement meter 180 of the inspection device 111. Specifically, as described above, the side laser displacement meter 180 irradiates a laser toward the side surface of the housing 136 of the pushing-up device 130, thereby making it possible to measure the distance between the side laser displacement meter 180 and the side surface of the housing 136 (hereinafter referred to as "side surface distance"). Therefore, while the pushing-up device 130 is rotated by the rotating device 135, the side laser displacement meter 180 measures the side surface distances at a plurality of locations on the side surface of the housing 136. Then, in the controller 192, based on those side surface distances at the plurality of locations, the inclination angle of the housing 136 with respect to the vertical direction is calculated, and it is determined whether the calculated inclination angle is equal to or greater than the set angle. At this time, when the calculated inclination angle is equal to or greater than the set angle, the controller 192 gives an error notification. Thereby, the operator can recognize that the pushing-up device 130 is inclined, and can promptly inspect the mounting state of the pushing-up device 130 on the holder 160, repair the holder 160, etc. Since a plurality of side laser displacement meters 180 are arranged, the presence or absence of inclination of the pushing-up device 130 is determined based on the detection values of each of the plurality of side laser displacement meters 180. Also, as described above, the measurement by the side laser displacement meter 180 is performed while rotating the pushing-up device 130. On the other hand, when a die is supplied in the die supply device 30, of course, the pushing-up device 130 cannot be rotated. For this reason, the measurement by the side laser displacement meter 180 is performed when the supply operation of the die by the die supply device 30 is not being executed. is executed when the supply operation of the die is not being performed.

[0045] In addition, the negative pressure measured at predetermined time intervals, the inclination angle of the upper end surface of the lifting device 130, the actual protruding amount of the lifting pin, the inclination angle of the lifting device 130, etc. are stored in the memory 196 in association with the identification information (e.g., device ID) of the lifting device 130. Then, maintenance of the lifting device 130 is performed using the negative pressure, inclination angle, etc. stored in the memory 196. That is, the negative pressure, inclination angle, etc. stored in the memory 196 are managed, and when their values decrease, inspection, repair, etc. of the lifting device 130 are performed. Thereby, the lifespan of the lifting device 130 can be extended. Also, it becomes possible to operate the lifting device 130 stably, and it is also possible to prevent a decrease in production quality. Furthermore, since the lifting device 130 is detachable, the error frequency associated with the attachment and detachment of the lifting device 130 can also be reduced.

[0046] Note that as shown in FIG. 5, the controller 192 of the control device 190 has a determination unit 210. The determination unit 210 is a functional unit for determining the suitability of holding the die assembly 90 by the lifting device 130, the presence or absence of inclination of the upper end surface of the lifting device 130, the suitability of the protruding amount of the lifting pin, the presence or absence of inclination of the lifting device 130, etc. That is, the determination unit 210 is a functional unit for determining the presence or absence of abnormalities in the lifting device.

[0047] Further, in the above-described embodiment, the inspection device 111 is disposed in the die supply device 30, and the lifting device 130 is inspected in the die supply device 30. However, the inspection device 111 may be disposed in an inspection unit separate from the die supply device 30, and the lifting device 130 may be inspected in the inspection unit. Specifically, as shown in FIG. 7, the inspection unit 220 includes a housing 230, an inspection device 111, a stage 158, a holder 160, a pipe 168, and a suction pump 170, and is disposed outside the electronic component mounting machine 10. Note that the inspection device 111, the stage 158, the holder 160, the pipe 168, and the suction pump 170 of the inspection unit 220 have substantially the same configuration as the inspection device 111, the stage 158, the holder 160, the pipe 168, and the suction pump 170 of the die supply device 30, and thus the same reference numerals are used and the description thereof is omitted. However, the stage 158 of the inspection unit 220 is fixed to the bottom surface inside the housing 230. Further, the inspection device 111 of the inspection unit 220 includes a plurality of upper laser displacement meters 182, and the plurality of upper laser displacement meters 182 are fixed in a state of facing downward on the upper surface inside the housing 230 above the holder 160. Further, the inspection unit 220 includes a controller (not shown) and a memory (not shown) having substantially the same configuration as the controller 192 and the memory 196.

[0048] Then, the lifting device 130 is removed from the holder 160 of the die supply device 30 and mounted on the holder 160 of the inspection unit 220. Then, the inspection device 111 of the inspection unit 220 performs the same inspection as the inspection device 111 of the die supply device 30. That is, in the inspection unit 220, the side distance is measured by the side laser displacement meter 180, and the inclination angle of the housing 136 with respect to the vertical direction is calculated by the controller. Then, when the calculated inclination angle is equal to or greater than the set angle, the controller issues an error notification.

[0049] Also, in the inspection unit 220, the upper end surface distance is measured by the upper laser displacement meter 182, and the inclination angle of the upper end surface of the pushing-up device 130 is calculated by the controller. When the calculated inclination angle is equal to or greater than the set angle, the controller issues an error notification. Note that the upper laser displacement meter 182 of the die supply device 30 was disposed on the slider 126 that can be moved to an arbitrary position, but the upper laser displacement meter 182 of the inspection unit 220 is disposed on the upper surface of the non-movable housing 230. Therefore, in the inspection unit 220, a plurality of upper laser displacement meters 182 are disposed. As a result, also in the inspection unit 220, the upper end surface distances at a plurality of locations on the upper end surface of the pushing-up device 130 can be measured by the plurality of upper laser displacement meters 182. Further, in the inspection unit 220, the upper laser displacement meter 182 measures the distance to the tip of the pushing-up pin, and the actual protruding amount of the pushing-up pin is calculated by the controller. When the difference between the actual protruding amount and the target protruding amount is equal to or greater than the threshold value, the controller issues an error notification.

[0050] Also, in the inspection unit 220, a negative pressure is supplied to the air suction path by the operation of the suction pump 170, and the negative pressure supplied to the suction path is measured by the pressure sensor 184 at predetermined time intervals. However, in the die supply device 30, the negative pressure is measured by the pressure sensor 184 while the lifting device 130 is sucking the die assembly 90. On the other hand, in the inspection unit 220, of course, there is no die supply device 30. Therefore, as shown in FIG. 8, the negative pressure is measured by the pressure sensor 184 with the plate member 250 placed on the upper end surface of the lifting device 130. That is, the negative pressure is measured by the pressure sensor 184 with the plurality of suction holes 150 formed on the upper end surface of the lifting device 130 blocked by the plate member 250. Also, in the inspection unit 220, the negative pressure is measured at a preset time. Then, the controller analyzes the negative pressure measured at predetermined time intervals. That is, the controller determines whether the measured negative pressure reaches the set negative pressure, and if the measured negative pressure reaches the set negative pressure, calculates the time until the measured negative pressure reaches the set negative pressure. Also, the controller determines whether there is a decrease in the measured negative pressure at predetermined time intervals, and if the measured negative pressure has decreased, calculates the amount of negative pressure decrease at predetermined time intervals. Then, the controller gives an error notification when the measured negative pressure does not reach the set negative pressure, when the time until the measured negative pressure reaches the set negative pressure exceeds the set time, or when the amount of negative pressure decrease at predetermined time intervals is greater than the set negative pressure amount.

[0051] Also, in the inspection unit 220 as well, the negative pressure measured at predetermined time intervals, the inclination angle of the upper end surface of the lifting device 130, the actual protruding amount of the lifting pin, the inclination angle of the lifting device 130, etc. are stored in the memory in association with the identification information (for example, device ID) of the lifting device 130. In this way, by giving an error notification based on the inspection result of the inspection device 111 in the inspection unit 220 and storing the inspection result in the memory, the same effect as when the inspection device 111 is arranged in the die supply device 30 can be obtained.

[0052] Also, when the inspection device 111 is disposed in the die supply device 30, the measurements by the side laser displacement meter 180 and the upper laser displacement meter 182 are performed when the die supply operation by the die supply device 30 is not being executed. On the other hand, since the inspection unit 220 is separate from the die supply device 30 and is disposed outside the electronic component mounting machine 10, the inspection by the inspection unit 220 can be performed regardless of the die supply operation by the die supply device 30. As a result, it becomes possible to perform the die supply operation by the die supply device 30 and the inspection operation of the pushing-up device 130 by the inspection unit 220 in parallel, and each operation can be performed efficiently.

[0053] Incidentally, in the above embodiment, the die assembly 90 is an example of a die assembly. The die 92 is an example of a die. The inspection device 111 is an example of an inspection device. The pushing-up device 130 is an example of a pushing-up device. The housing 136 is an example of a housing. The pushing-up pin 144 is an example of a pushing-up pin. The determination unit 210 is an example of a determination device. The plate member 250 is an example of a member.

[0054] Note that the present invention is not limited to the above embodiment, and can be implemented in various forms with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, a plurality of stages are disposed in the die supply device 30, the pushing-up device 130 is mounted on the holder 160 of one of the plurality of stages, and the dedicated measuring device 200 is mounted on the holder 160 of a stage different from that stage. Thereby, it is possible to automatically perform the inspection using the pushing-up device 130 and the inspection using the dedicated measuring device 200. However, one of the plurality of stages performs the die supply operation Since it will be occupied by the dedicated measuring device 200 and cannot be used otherwise, there is a risk of reduced work efficiency. Therefore, the lifting device 130 may be removed from the holder 160 to which it is attached, and the dedicated measuring device 200 may be attached to the holder 160 instead. Then, after the inspection using the dedicated measuring device 200 is completed, the dedicated measuring device 200 may be removed from the holder 160 and the lifting device 130 may be attached to the holder 160. In this way, by swapping the lifting device 130 and the dedicated measuring device 200 in one holder 160, the dedicated measuring device 200 will no longer occupy the holder 160, and a decrease in work efficiency can be prevented. However, the work of swapping the lifting device 130 and the dedicated measuring device 200 in one holder 160 will increase.

[0055] Also, in the above embodiment, a laser displacement meter is employed as the sensor for measuring the upper end face distance, side face distance, etc. However, as long as it is a sensor capable of detecting distance, various sensors such as contact sensors can be employed.

[0056] Also, in the above embodiment, the inclination angle of the upper end face of the lifting device 130 etc. is calculated based on the upper end face distance etc., and the presence or absence of inclination of the upper end face of the lifting device 130 etc. is determined based on the inclination angle. However, the presence or absence of inclination of the upper end face of the lifting device 130 etc. may be determined based on the upper end face distance etc. That is, for example, when a plurality of upper end face distances are measured and the difference between the maximum value and the minimum value among the measured plurality of upper end face distances is equal to or greater than the threshold value, it may be determined that the upper end face of the lifting device 130 is inclined.

[0057] Also, in the above embodiment, the responsiveness of the negative pressure is inspected based on the time until the measured negative pressure reaches the set negative pressure. However, as long as it is an indicator of the responsiveness of the negative pressure, the responsiveness of the negative pressure may be inspected based on various indicator values. Specifically, for example, the responsiveness of the negative pressure may be inspected based on the increase amount per unit time of the measured negative pressure, that is, the rate of increase of the measured negative pressure.

[0058] Further, in the above embodiment, in the controller, the negative pressure, the upper end surface distance, etc. measured by the inspection device 111 are analyzed to determine the presence or absence of an abnormality in the punching device. However, the operator may analyze the negative pressure, the upper end surface distance, etc. measured by the inspection device 111 to determine the presence or absence of an abnormality in the punching device.

Explanation of Signs

[0059] 90: Die assembly 92: Die 111: Inspection device 130: Punching device 136: Housing 144: Punching pin 210: Determination unit (determination device) 250: Plate member (member)

Claims

1. An inspection device for inspecting a pushing-up device that pushes up any die of a die assembly from below while sucking the lower surface of the wafer sheet of the die assembly formed by dicing a wafer with a dicing sheet attached thereto under negative pressure, The pushing-up device includes a lid, a plurality of suction holes provided on the upper surface of the lid, a suction path communicating with the suction holes, a suction pump connected to the suction path, a pressure sensor disposed in the suction path, and a pushing-up pin provided so as to be protrudable from the upper surface of the lid. An inspection device that measures the negative pressure in the suction path of the pushing-up device at predetermined time intervals after contacting the upper surface of the lid with the lower surface of the wafer sheet, operating the suction pump to suck under negative pressure, and after the pushing-up device contacts the lower surface of the wafer sheet, raising the pushing-up pin to push up any die from below and then lowering the pushing-up pin.

2. The pushing-up device is generally formed of a cylindrical housing as a whole. The inspection device according to claim 1, which measures not only the negative pressure of the pushing-up device but also the inclination of the housing with respect to the vertical direction.

3. The inspection device according to claim 1 or claim 2, further comprising a determination device that determines an abnormality of the pushing-up device based on the negative pressure of the pushing-up device measured at predetermined time intervals.

Images