Component Crimping Device and Component Crimping Method

Abstract

To provide component crimping system and the like capable of suppressing the decrease in mounting accuracy.SOLUTION: A component crimping system 100 includes: a component supply unit 31 that supplies component 220 having a pair of alignment marks 230 spaced apart from each other along the first direction; and a crimping unit 30 that holds the component 220 supplied from the component supply unit 31 held on a component adsorption surface 160 by an adsorption mechanism 170 and crimps the held component 220 to a board 200 while heating the same with a heating mechanism 85. The component adsorption surface 160 has a central area where a first adsorption force acts and an outer area located outside the central region in the second direction where a second adsorption force is smaller than the first adsorption force acts. The control unit 120 is configured to control the component adsorption surface 160 to hold the component 220 so that the midpoint of the pair of alignment marks 230 overlaps the central region and the first direction and the second direction are parallel based on the imaging data of the component 220 picked up by the imaging unit 150.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a component crimping device and a component crimping method for thermally crimping components onto a substrate.

Background Art

[0002] Conventionally, there has been a component crimping device for crimping components such as a drive circuit onto a substrate (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a component crimping device, for example, a component is adsorbed and held by a crimping head heated by a heater or the like. The position of the component held by the crimping head is confirmed by being imaged by a camera, and the component is crimped onto the substrate while being heated.

[0005] Here, when the component to be crimped onto the substrate is a film component such as a TCP (Tape Carrier Package) or an FPC (Flexible Printed Circuits), the component may thermally expand while being adsorbed by the heated crimping head. If the component thermally expands after being imaged by the camera, the mounting accuracy may decrease.

[0006] The present invention provides a component crimping device and the like that can suppress a decrease in mounting accuracy.

Means for Solving the Problems

[0007] A component crimping device according to an aspect of the present invention includes a placement portion on which a substrate is placed, a component supply portion that supplies a component having a pair of alignment marks arranged apart from each other along a first direction, an imaging portion that images the component supplied from the component supply portion, a heating mechanism, a suction mechanism, and a component suction surface. The component supplied from the component supply portion is held by the suction mechanism on the component suction surface, and the held component is crimped to the substrate while being heated by the heating mechanism. The component suction surface has a central region on which a first suction force acts and an outer region that is located outside the central region in a second direction and on which a second suction force smaller than the first suction force acts. The control portion causes the component to be held on the component suction surface such that the midpoint of the pair of alignment marks overlaps with the central region and the first direction and the second direction are parallel based on the imaging data of the component imaged by the imaging portion.

[0008] A component crimping method according to an aspect of the present invention includes a component supply step of supplying a component having a pair of alignment marks arranged apart from each other along a first direction, an imaging step of imaging the component supplied in the component supply step, and a crimping step of holding the component supplied in the component supply step on a component suction surface of a crimping portion and crimping the held component to a substrate placed on the placement portion while heating the held component with a heating mechanism of the crimping portion. The component suction surface has a central region on which a first suction force acts and an outer region that is located outside the central region in a second direction and on which a second suction force smaller than the first suction force acts. In the crimping step, based on the imaging data of the component imaged in the imaging step, the component is held on the component suction surface such that the midpoint of the pair of alignment marks overlaps with the central region and the first direction and the second direction are parallel.

[0009] Note that these general or specific aspects may be implemented in a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or may be implemented in any combination of a system, method, integrated circuit, computer program, and recording medium.

Advantages of the Invention

[0010] According to the present invention, it is possible to provide a component crimping device or the like that can suppress a decrease in mounting accuracy.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that all the embodiments described below are specific examples of the present invention. Therefore, the numerical values, shapes, materials, components, arrangements and connection forms of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Thus, among the components in the following embodiments, the components not described in the independent claims indicating the highest-level concept of the present invention are described as optional components.

[0013] Also, each figure is a schematic diagram and is not necessarily drawn precisely. In each figure, the same reference numerals are assigned to the same constituent members.

[0014] In addition, in this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The X-axis and Y-axis are orthogonal to each other and both are orthogonal to the Z-axis. Also, in the following embodiments, there may be cases where the positive direction of the Z-axis is described as upward and the negative direction of the Z-axis is described as downward.

[0015] (Embodiment) [Configuration] First, the configuration of the component crimping device according to the embodiment will be described.

[0016] FIG. 1 is a schematic side view of a component crimping device 100 according to the embodiment. FIG. 2 is a block diagram showing the functional configuration of the component crimping device 100 according to the embodiment.

[0017] Note that in FIG. 1, the computer 110, the component standby stage moving mechanism 71, the pickup head moving mechanism 73, the camera moving mechanism 76, and the crimping head moving mechanism 81 are shown as functional blocks.

[0018] The component crimping device 100 is a device that crimps components 220 onto a substrate 200. Specifically, the component crimping device 100 adsorbs and holds the component 220 with a crimping head 80, and thermally crimps the component 220 onto the substrate 200 while heating it. Each device such as the component standby stage moving mechanism 71, the pickup head moving mechanism 73, the camera moving mechanism 76, and the crimping head moving mechanism 81 included in the component crimping device 100 is connected by a computer 110 and control lines (not shown), and executes a predetermined operation for each device under the control of the computer 110.

[0019] The component crimping device 100 is, for example, a part of a component mounting system for producing a display panel or the like. In the component mounting system, for example, an anisotropic conductive member such as an ACF (Anisotropic Conductive Film) is adhered to an electrode portion provided on the substrate 200, and the substrate 200 and the component 220 are thermally crimped via the anisotropic conductive member. The component crimping device 100 thermally crimps (for example, temporarily crimps) the component 220 onto the substrate 200 via the anisotropic conductive member from an upstream device by, for example, a substrate transfer device (not shown). The substrate 200 onto which the component 220 is thermally crimped is transported to a downstream device by, for example, the substrate transfer device.

[0020] Examples of the substrate 200 include a display panel using a glass substrate or the like.

[0021] Examples of the component 220 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits).

[0022] As shown in FIG. 2, the component crimping device 100 includes a mounting portion 140, a component supply portion 31, a crimping portion 30, an imaging portion 150, a control portion 120, and a storage portion 130.

[0023] The placement unit 140 is a stage on which the substrate 200 is placed. For example, the substrate 200 conveyed by the above-described substrate transfer device is placed on the placement unit 140. In the present embodiment, the placement unit 140 is the substrate stage 83 shown in FIG. 1. The substrate 200 is placed on the substrate stage 83 in a state where the outer edge portion of the substrate 200 protrudes from the substrate stage 83. The outer edge portion is supported by the backup stage 86.

[0024] The backup stage 86 is a stage for supporting, from the back side (lower side) of the substrate 200, the portion of the substrate 200 where the component 220 is to be pressure-bonded, that is, the outer edge portion of the substrate 200 that protrudes from the substrate stage 83, when the pressure-bonding head 80 pressure-bonds the component 220 to the substrate 200.

[0025] The substrate stage 83 is provided movably by a substrate stage moving mechanism 84.

[0026] The substrate stage moving mechanism 84 is a moving mechanism that moves the substrate stage 83 to a position where the substrate 200 can be placed on the substrate stage 83 by the above-described substrate transfer device. Further, the substrate stage moving mechanism 84 moves the substrate 200 to a position where the pressure-bonding head 80 can pressure-bond the component 220 to the substrate 200.

[0027] The substrate stage moving mechanism 84 is, for example, a conveyor configured to be capable of arbitrarily moving the substrate stage 83 in the XY plane and capable of moving up and down in the Z-axis direction.

[0028] The component supply unit 31 is a device that supplies the components 220 to be pressure-bonded (mounted) on the substrate 200. More specifically, the component supply unit 31 is a device that supplies the component 220 by picking up one component 220 from the component standby stage 70 on which the components 220 to be mounted on the substrate 200 are placed and placing it on the component stage 90.

[0029] The component supply unit 31 is realized, for example, by a component standby stage 70 shown in FIG. 1, a component standby stage moving mechanism 71, a pickup head 72, a pickup head moving mechanism 73, a component stage 90, and a component stage moving mechanism 91.

[0030] The component standby stage 70 is a stage on which the component 220 is placed. A plurality of components 220 may be placed on the component standby stage 70, for example. In this case, the plurality of components 220 are placed on the component standby stage 70 in a state of being arranged in a tray in a predetermined array, for example.

[0031] Note that the supply form of the component 220 to the component standby stage 70 is not limited to this. For example, the plurality of components 220 may be supplied to the component standby stage 70 by pulling out a carrier tape from a supply reel around which the carrier tape holding the plurality of components 220 is wound, and punching out the component 220 from the pulled-out carrier tape with a mold.

[0032] The component standby stage moving mechanism 71 is a moving mechanism for moving the component 220 placed on the component standby stage 70 to a position where the pickup head 72 can pick it up. The component standby stage moving mechanism 71 is, for example, a conveyor configured to be able to move the component standby stage 70 arbitrarily in the XY plane.

[0033] The pickup head 72 is a device for picking up the component 220 placed on the component standby stage 70 and supplying the component 220 to the component stage 90. Specifically, the pickup head 72 picks up the component 220 placed on the component standby stage 70 and places the picked-up component 220 on the component stage 90 by releasing the picked-up component 220 at the component stage 90. The pickup head 72 is provided with a suction nozzle capable of sucking and holding the component 220.

[0034] The method of holding the component 220 by the pickup head 72 is not particularly limited, but in the case of this embodiment, a method of holding the component 220 by vacuum suction is adopted.

[0035] The pickup head moving mechanism 73 is a moving mechanism for moving the pickup head 72. The pickup head moving mechanism 73 is constituted by, for example, a linear guide and a linear motor for reciprocating the pickup head 72 in the Z-axis direction.

[0036] The component stage 90 is a stage on which the component 220 supplied by the pickup head 72 is placed.

[0037] The component stage moving mechanism 91 is a moving mechanism for moving the component stage 90 to a position where the pickup head 72 can supply the component 220. Further, the component stage moving mechanism 91 moves the component stage 90 to a position where the camera 74 can image the component 220 placed on the component stage 90. In this embodiment, the component stage moving mechanism 91 moves the component stage 90 to a position below the camera 74 with the component 220 placed on the component stage 90. Further, the component stage moving mechanism 91 moves the component stage 90 to a position where the component 220 placed on the component stage 90 can be received by the crimping head 80, that is, a position where it can be picked up.

[0038] The component stage moving mechanism 91 is, for example, a conveyor configured to be able to reciprocate the component stage 90 in the Y-axis direction.

[0039] The crimping unit 30 is a device that picks up the component 220 supplied to the component stage 90 by the component supply unit 31 and crimps it to the substrate 200.

[0040] As shown in FIG. 2, the crimping unit 30 includes a crimping head 80, a heating mechanism 85, and a suction mechanism 170.

[0041] The crimping head 80 is a head for receiving the component 220 from the component supply unit 31 and attaching it to the substrate 200 placed on the substrate stage 83. The crimping head 80 includes, for example, a suction nozzle provided with a component suction surface 160 capable of sucking and holding the component 220 placed on the component stage 90. The crimping head 80 holds the component 220 supplied from the component supply unit 31 on the component suction surface 160. The crimping head 80 brings the component 220 placed on the component stage 90 into contact with the component suction surface 160 provided on the crimping head 80 to suck it, and crimps the sucked component 220 to the substrate 200.

[0042] FIG. 3 is a diagram showing the crimping head 80 according to the embodiment. Specifically, FIG. 3(a) is a diagram for explaining the suction mechanism 170 connected to the crimping head 80, FIG. 3(b) is a cross-sectional view schematically showing the internal structure of the crimping head 80, and FIG. 3(c) is a bottom view of the crimping head 80.

[0043] As shown in FIG. 3(b), the crimping head 80 is provided with a plurality of holes. The plurality of holes include a first suction hole 240 provided in the central region and a second suction hole 250 provided in the outer region.

[0044] The central region is a region located at the center in the second direction on the component suction surface 160. On the other hand, the outer region is a region located on the outer side in the second direction on the component suction surface 160. The central region is, for example, about 1 / 3 of the length of the component suction surface 160 in the second direction.

[0045] In the present embodiment, the second direction is a direction parallel to the X-axis direction.

[0046] In the central region, the component 220 is adsorbed by the first adsorption force. On the other hand, in the outer region, the component 220 is adsorbed by a second adsorption force smaller than the first adsorption force. That is, the component adsorption surface 160 has a central region where the first adsorption force acts (having the first adsorption force) and an outer region located outside the central region where a second adsorption force smaller than the first adsorption force acts (having the second adsorption force). In the present embodiment, since it is vacuum adsorption by the vacuum pump 180, the adsorption force is the force that pulls the component 220 through the first adsorption holes 240 and the second adsorption holes 250, and is (the area of the holes) × (vacuum pressure (gauge pressure)), and depends on the area of the holes. That is, when the adsorption force acts, it is the force that pulls the component 220 toward the component adsorption surface 160 side on the component adsorption surface 160.

[0047] Also, in the present embodiment, the area of the first adsorption holes 240 is larger than the area of the second adsorption holes 250. Thereby, the aperture ratio in the central region (the area of the first adsorption holes 240 with respect to the area of the entire region) is made larger than the aperture ratio in the outer region, so that the first adsorption force in the central region is larger than the second adsorption force in the outer region.

[0048] Note that the number of the first adsorption holes 240 and the second adsorption holes 250 formed in the pressure head 80 is not limited respectively. In the present embodiment, the number of the first adsorption holes 240 is one, and the number of the second adsorption holes 250 is eight.

[0049] The pressure head 80 is provided movably by a pressure head moving mechanism 81.

[0050] The pressure head moving mechanism 81 is a moving mechanism for moving the pressure head 80. The pressure head moving mechanism 81 is composed of, for example, a linear guide and a linear motor for reciprocating the pressure head 80 in the Z-axis direction.

[0051] The method of holding the component 220 by the pressure head 80 is not particularly limited, but in the case of the present embodiment, a method of holding the component 220 by vacuum adsorption is adopted.

[0052] The heating mechanism 85 is a heater having a heating wire, a Peltier element, etc. for heating the component 220 held on the component suction surface 160 provided on the crimping head 80 by heating the crimping head 80. The heating mechanism 85 is built into the crimping head 80, for example. By the heating mechanism 85, the component 220 held by the crimping head 80 is heated to a predetermined temperature before being crimped to the substrate 200. The crimping head 80 presses the component 220 against the substrate 200 while heating the component 220 on the substrate 200 in a state heated by the heating mechanism 85, thereby crimping the component 220 to the substrate 200. Thus, the crimping unit 30 holds the component 220 supplied from the component supply unit 31 on the component suction surface 160, and crimps the held component 220 to the substrate 200 while heating it with the heating mechanism 85.

[0053] The suction mechanism 170 is a mechanism for sucking the component 220 to the crimping head 80. As shown in Fig. 3(a), the suction mechanism 170 is realized by, for example, a vacuum pump 180 and a vacuum pipe 190.

[0054] The vacuum pump 180 is a pump for the crimping head 80 to suck the component 220.

[0055] The vacuum pipe 190 is a pipe connecting the vacuum pump 180 and the crimping head 80. Specifically, the vacuum pump 180 is connected to the first suction hole 240 and the second suction hole 250 formed in the crimping head 80 via the vacuum pipe 190. The crimping head 80 sucks the component 220 through the first suction hole 240 and the second suction hole 250 when the vacuum pump 180 operates.

[0056] Note that the method of sucking the component 220 by the suction mechanism 170 is not particularly limited to vacuum suction using the vacuum pump 180.

[0057] The imaging unit 150 is an imaging device for imaging the component 220 supplied from the component supply unit 31. The imaging unit 150 is realized by, for example, the camera 74 and the camera moving mechanism 76 shown in Fig. 1.

[0058] The camera moving mechanism 76 is a moving mechanism for moving the camera 74 to a position where the camera 74 can image the component 220. The camera moving mechanism 76 is composed of, for example, a linear guide and a linear motor for reciprocating the camera 74 in the Z-axis direction.

[0059] Note that the camera moving mechanism 76 may be configured to be able to freely move the camera 74 in the XY plane. In this case, the camera moving mechanism 76 is composed of, for example, a guide and a linear motor for moving the camera 74 within the XY plane.

[0060] The control unit 120 is a processing unit that controls the operations of each device included in the component crimping device 100, such as the component supply unit 31, the crimping unit 30, and the imaging unit 150, and the timing of such operations.

[0061] For example, the control unit 120 controls the pickup head 72 and the pickup head moving mechanism 73 to move the component 220 placed on the component standby stage 70 to the component stage 90. Next, the control unit 120 controls the camera moving mechanism 76 to move the camera 74 to an appropriate position, and then confirms the position of the component 220 based on the image data (also referred to as imaging data) generated by imaging the component 220 with the camera 74. Next, the control unit 120 controls the crimping unit 30 (specifically, the suction mechanism 170, the heating mechanism 85, and the crimping head moving mechanism 81) based on the confirmation result, so that the crimping head 80 picks up (suctions and holds) the component 220 placed on the component stage 90 on the component suction surface 160.

[0062] FIG. 4 is a plan view showing the component 220 according to the embodiment. Specifically, FIG. 4(a) shows the component 220 before being adsorbed by the crimping head 80, that is, in a state where it has not been heated by the heating mechanism 85. FIG. 4(b) shows the component 220 in a state after the component 220 in the state shown in FIG. 4(a) has been adsorbed by the crimping head 80 and heated by the heating mechanism 85. In the example shown in FIG. 4, the adsorption force in the outer region is smaller than the adsorption force in the central region.

[0063] The component 220 includes a pair of alignment marks 230 that are spaced apart from each other along the first direction. The pair of alignment marks 230 are respectively provided at the end on one end side and the end on the other end side of the component 220 in the first direction. The first direction is a direction parallel to the arrangement direction of a pair of alignment marks 230 (for example, refer to FIG. 4) provided on the component 220 which will be described later.

[0064] The control unit 120 controls the imaging unit 150 to image the component 220. Note that the imaging unit 150 may include two cameras, one for imaging one of the pair of alignment marks 230 provided on the component 220 and the other for imaging the other. The control unit 120 calculates the midpoint of the pair of alignment marks 230 based on the image data obtained from the imaging unit 150. When the image data includes the pair of alignment marks 230, the control unit 120 can calculate the midpoint of the pair of alignment marks 230 from the image data. Also, when the image data includes the outer shape (outline) of the component 220, the control unit 120 can calculate the midpoint of the pair of alignment marks 230 based on the outer shape (outline) of the component 220 grasped from the design data regarding the arrangement of the alignment marks 230 of the component 220 and the image data.

[0065] FIG. 5 is a diagram showing a state in which the crimping head 80 according to the embodiment is adsorbing the component 220. Specifically, FIG. 5(a) is a diagram for explaining the suction mechanism 170 connected to the crimping head 80, FIG. 5(b) is a cross-sectional view schematically showing the internal structure of the crimping head 80, and FIG. 5(c) is a bottom view of the crimping head 80. In FIG. 5(b), only the crimping head 80 is shown in cross-section, and the side surface of the component 220 is shown.

[0066] As shown in FIG. 5(c), the control unit 120 causes the component suction surface 160 to hold the component 220 such that the midpoint of the pair of alignment marks 230 (the center position shown in FIG. 5(c)) overlaps the central region and the first direction and the second direction are parallel, based on the imaging data of the component 220 imaged by the imaging unit 150.

[0067] Next, the control unit 120 confirms the position of the component 220 based on the image data generated by causing the component 220 held by the crimping head 80 to be imaged by the camera 75. Next, the control unit 120 controls the crimping unit 30 based on the confirmation result to crimp the component 220 held by the crimping head 80 to the substrate 200. The control unit 120 crimps the component 220 to the substrate 200 based on, for example, the position of the midpoint of the calculated pair of alignment marks 230.

[0068] Here, the component 220 held by the component suction surface 160 continues to be heated by the heating mechanism 85. Therefore, when the component 220 is a film component such as a TCP or an FPC, for example, it may thermally expand while being adsorbed by the heated crimping head 80. Therefore, depending on the adsorption state of the component 220 by the crimping head 80, the position of the midpoint of the alignment mark 230 may shift.

[0069] FIG. 6 is a plan view showing the component 220 according to the comparative example. Specifically, FIG. 6(a) is a view showing the component 220 before being adsorbed by the crimping head 80, that is, in a state not heated by the heating mechanism 85, and FIG. 6(b) is a view showing the component 220 in a state after the component 220 in the state shown in FIG. 6(a) is adsorbed by the crimping head 80 and heated by the heating mechanism 85, showing a case where the shift of the central position of the component 220 in the first direction due to heating is large. In the example shown in FIG. 6, the adsorption force of the central region and the adsorption force of the outer region are the same adsorption force.

[0070] As shown in FIG. 6, for example, when the component 220 is heated and deformed from the state shown in FIG. 6(a), the position of the midpoint of the pair of alignment marks 230 with respect to the component suction surface 160 is shifted as shown in FIG. 6(b). When the component 220 is deformed in this way, the center position of the component 220 is shifted, so that the component 220 is not pressure-bonded to an appropriate position on the substrate 200.

[0071] Therefore, in the component pressure-bonding device 100, the first suction force in the central region is higher than the second suction force in the outer region. Therefore, it is difficult for the component 220 to move with respect to the component suction surface 160 due to thermal expansion in the vicinity of the center position of the component 220, and for example, as shown in FIG. 4, it is likely to expand evenly in the left-right direction of the paper surface of FIG. 4 along the first direction with the center position as a reference. In this way, the amount of displacement in the first direction due to thermal expansion at the position corresponding to the outer region in the component 220 held by the component suction surface 160 is larger than the amount of displacement in the first direction due to thermal expansion at the position corresponding to the central region. In other words, the control unit 120 holds the component 220 on the component suction surface 160 so that the amount of displacement in the first direction due to thermal expansion at the position corresponding to the outer region in the component 220 held by the component suction surface 160 is larger than the amount of displacement in the first direction due to thermal expansion at the position corresponding to the central region. That is, the first suction force and the second suction force are set so that the amount of displacement in the first direction due to thermal expansion at the position corresponding to the outer region is larger than the amount of displacement in the first direction due to thermal expansion at the position corresponding to the central region.

[0072] As described above, the control unit 120 holds the component 220 on the pressure-bonding head 80 so that the amount of displacement in the first direction due to thermal expansion at the position corresponding to the outer region of the component 220 is larger than the amount of displacement at the position corresponding to the central region.

[0073] As a result, as shown in FIG. 4, for example, even if the component 220 is heated and deformed from the state shown in FIG. 4(a), as shown in FIG. 4(b), displacement of the midpoint of the pair of alignment marks 230 with respect to the component suction surface 160 is less likely to occur. That is, since the center position of the component 220 is less likely to shift, the component 220 can be pressure-bonded to an appropriate position on the substrate 200.

[0074] The control unit 120 is realized by, for example, a computer 110 shown in FIG. 1 having a communication interface for communicating with each device included in the component pressure-bonding device 100, a processor, and a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory). For example, the control unit 120 is realized by a control program stored in the memory included in the computer 110 for controlling each device included in the component pressure-bonding device 100 and a processor such as a CPU (Central Processing Unit) included in the computer 110 that executes the control program.

[0075] The storage unit 130 stores various data necessary for the component pressure-bonding process, such as the size of the substrate 200, the type of the component 220 to be mounted on the substrate 200, the mounting position, the mounting direction, the operations of each device, the timing of the operations, and the timing of transporting the substrate 200, and a control program executed by the control unit 120.

[0076] The storage unit 130 is realized by, for example, a memory such as a ROM and a RAM included in the computer 110.

[0077] The camera 75 is an imaging device for detecting the positions of a pair of alignment marks 230 of the component 220 held by, i.e., picked up by, the crimping head 80 and a pair of alignment marks of the substrate 200 placed on the placement portion 140. Further, the camera 75 may detect defects of the component 220 held by the crimping head 80. The camera 75 is provided, for example, below the backup stage 86, and images the lower surface side of the component 220 held by the crimping head 80 by imaging upward through a window portion (not shown) provided in the backup stage 86. The window portion is, for example, a member having translucency or a through hole formed in the backup stage 86.

[0078] For example, the control unit 120 calculates the positions of a pair of alignment marks provided on the component 220 held by the crimping head 80 based on the image data generated by imaging the component 220 with the camera 75. Further, for example, in a top view, the substrate 200 is placed on the substrate stage 83 such that the outer edge of the substrate 200 slightly protrudes in the positive Y-axis direction from the outer edge of the substrate stage 83. The camera 75 images the outer edge of the substrate 200 in order to detect the position of the outer edge of the substrate 200 protruding from the outer edge of the substrate stage 83 in a bottom view. The control unit 120 calculates the positions of a pair of alignment marks provided on the substrate 200 placed on the placement portion 140 based on the image data including the substrate 200 generated by the camera 75 imaging. Then, the control unit 120 controls the crimping head moving mechanism 81 and the substrate stage moving mechanism 84 so that the calculated midpoints coincide with each other, and crimps the component 220 held on the component suction surface 160 to the substrate 200 placed on the placement portion 140 while heating the component 220 with the heating mechanism 85 of the crimping portion 30.

[0079] Further, for example, the control unit 120 determines whether the component 220 is a defective product based on the image data generated by imaging the component 220 with the camera 75. When the control unit 120 determines that the component 220 is a defective product, for example, the control unit 120 discards the component 220. For example, when the control unit 120 determines that the component 220 is a defective product, the control unit 120 controls the crimping head 80 and the crimping head moving mechanism 81 to move the defective product to a pre-installed collection box (not shown) or the like for discarding the defective product.

[0080] Note that in this embodiment, the camera 75 is fixed in position, but it may be configured to be movable.

[0081] [Processing Procedure] Subsequently, the processing procedure of the component crimping device 100 according to the embodiment will be described.

[0082] FIG. 7 is a flowchart for explaining the processing procedure of the component crimping device 100 according to the embodiment.

[0083] First, the component supply unit 31 supplies a component 220 including a pair of alignment marks 230 arranged apart from each other along the first direction (S101). For example, the control unit 120 controls the component supply unit 31 to pick up the component 220 placed on the component standby stage 70 with the pickup head 72 and place it on the component stage 90, thereby supplying the component 220.

[0084] Next, the imaging unit 150 images the component 220 supplied in step S101 (S102). Specifically, the control unit 120 causes the imaging unit 150 to image the component 220 to generate and acquire imaging data including a pair of alignment marks 230 or the outer shape (outline) provided on the component 220.

[0085] Next, the control unit 120 controls the crimping unit 30 so that, based on the imaging data of the component 220 imaged by the imaging unit 150 in step S102, the midpoint of the pair of alignment marks 230 overlaps the central region and the first direction and the second direction are parallel, and the component 220 is held on the component suction surface 160 of the crimping unit 30 (more specifically, the crimping head 80) (S103). As a result, on the component suction surface 160, the first suction force acts in the central region, and in the outer region located outside the central region in the second direction, the second suction force smaller than the first suction force acts. That is, the component 220 is adsorbed by the first suction force at the position facing the central region and is adsorbed by the second suction force at the position facing the outer region. The component 220 held on the component suction surface 160 thermally expands when heated by the heating mechanism 85 of the crimping unit 30.

[0086] Next, the control unit 120 images the pair of alignment marks 230 of the component 220 held by the crimping head 80 and the pair of alignment marks of the substrate 200 placed on the placement unit 140 with the camera 75, corrects the position so that the respective midpoints calculated from the imaging data match, and then crimps the component 220 held on the component suction surface 160 to the substrate 200 placed on the placement unit 140 while heating it with the heating mechanism 85 of the crimping unit 30 (S104).

[0087] [Effects, etc.] As described above, the component crimping device 100 according to the embodiment includes a mounting portion 140 on which the substrate 200 is mounted, a component supply portion 31 that supplies a component 220 including a pair of alignment marks 230 arranged apart from each other along a first direction, an imaging portion 150 that images the component 220 supplied from the component supply portion 31, a heating mechanism 85, a suction mechanism 170, and a component suction surface 160. The component 220 supplied from the component supply portion 31 is held by the suction mechanism 170 on the component suction surface 160, and the held component 220 is crimped to the substrate 200 while being heated by the heating mechanism 85. The component crimping device 100 further includes a control portion 120 that controls the crimping portion 30. The component suction surface 160 has a central region on which a first suction force acts and an outer region that is located outside the central region in a second direction and on which a second suction force smaller than the first suction force acts. Based on the imaging data of the component 220 imaged by the imaging portion 150, the control portion 120 causes the component 220 to be held on the component suction surface 160 such that the midpoint of the pair of alignment marks 230 overlaps with the central region and the first direction and the second direction are parallel to each other.

[0088] The component 220 is crimped to the substrate 200, for example, based on the center positions of the pair of alignment marks 230. Therefore, if the component 220 thermally expands due to heat and the center position changes, the component 220 will not be crimped to the appropriate position on the substrate 200. Here, according to the component crimping device 100, when the component 220 is in a state of being adsorbed by the component suction surface 160 (that is, in a heated state), the movement of the component 220 relative to the component suction surface 160 due to thermal expansion is less likely to occur at the position facing the central region than at the position facing the outer region. Therefore, the component 220 adsorbed by the component suction surface 160 is more likely to thermally expand outward rather than toward the central region at the position facing the outer region. As a result, the component 220 is more likely to thermally expand from the central region to the outside, in other words, in the positive direction and the negative direction in the first direction from the central region of the component 220. Therefore, the change in the center positions of the pair of alignment marks 230 before thermal expansion and after thermal expansion is less likely to occur. Thereby, according to the component crimping device 100, it is possible to suppress a decrease in the mounting accuracy of mounting the component 220 on the substrate 200.

[0089] Also, for example, the component adsorption surface 160 has a first adsorption hole 240 formed in the central region and a second adsorption hole 250 formed in the outer region. For example, the area of the first adsorption hole 240 is larger than the area of the second adsorption hole 250.

[0090] According to this, for example, like the vacuum adsorption employed in the component pressing device 100, if the force for attracting the component 220 by the first adsorption hole 240 and the second adsorption hole 250 per unit area is the same, the adsorption force is proportional to the area of the hole. Therefore, by making the area of the first adsorption hole 240 larger than the area of the second adsorption hole 250, it is easier to make the first adsorption force larger than the second adsorption force.

[0091] Also, for example, the control unit 120 causes the component adsorption surface 160 to hold the component 220 such that the amount of displacement in the first direction due to thermal expansion at a position corresponding to the outer region in the component 220 held by the component adsorption surface 160 is larger than the amount of displacement in the first direction due to thermal expansion at a position corresponding to the central region.

[0092] By setting the first adsorption amount and the second adsorption amount such that the amount of displacement is different between the central region and the outer region in this way, it becomes easier for the component 220 to thermally expand in both the positive direction and the negative direction in the first direction from the position facing the central region at the position facing the outer region of the component 220.

[0093] Further, the component crimping method according to the present embodiment includes a component supply step (S101) of supplying a component 220 provided with a pair of alignment marks 230 spaced apart from each other along a first direction, an imaging step (S102) of imaging the component 220 supplied in the component supply step, a holding step (S103) of holding the component 220 supplied in the component supply step on a component adsorption surface 160 of a crimping unit 30, and a crimping step (S104) of crimping the held component 220 onto a substrate 200 placed on a placement unit 140 while heating the held component 220 with a heating mechanism 85 of the crimping unit 30. The component adsorption surface 160 has a central region where a first adsorption force acts and an outer region located outside the central region in a second direction where a second adsorption force smaller than the first adsorption force acts. In the crimping step, based on the imaging data of the component 220 imaged in the imaging step, the component 220 is held on the component adsorption surface 160 such that the midpoint of the pair of alignment marks 230 overlaps with the central region and the first direction and the second direction are parallel to each other.

[0094] According to this, the same effect as that of the component crimping device 100 is achieved.

[0095] (Modification example) Subsequently, a modification example of the component crimping device according to the present embodiment will be described. In the modification example described below, the description will focus on the differences from the component crimping device according to the above-described embodiment, and the description of the same configuration may be omitted or simplified.

[0096] [Modification example 1] FIG. 8 is a diagram showing a crimping head 80a according to Modification example 1. Note that FIG. 8 corresponds to FIG. 3.

[0097] As shown in FIGS. 8(b) and 8(c), the crimping head 80a is different from the crimping head 80 in that first adsorption holes 241 formed in the central region are different.

[0098] In this modification example, the number of the first suction holes 241 per unit area is larger than the number of the second suction holes 250. Also, the area of the first suction holes 241 and the area of the second suction holes 250 are the same. Thus, the total area of the first suction holes 241 per unit area is larger than the total area of the second suction holes 250. Thereby, the aperture ratio in the central region is made larger than the aperture ratio in the outer region, so that the first suction force in the central region is larger than the second suction force in the outer region.

[0099] According to this, the component 220 adsorbed on the component adsorption surface 160 is more likely to thermally expand outward rather than toward the central region at the position facing the outer region.

[0100] In this modification example, the number of the first suction holes 241 is six, but it only needs to be more than the number of the second suction holes 250 per unit area and is not particularly limited. Also, the unit area may be any arbitrarily determined area.

[0101] [Modification Example 2] FIG. 9 is a diagram showing a pressure bonding head 80b according to Modification Example 2. Note that FIG. 9 is a diagram corresponding to FIG. 3.

[0102] As shown in FIGS. 9(b) and 9(c), the first suction holes 242 formed in the central region of the pressure bonding head 80b are different from those of the pressure bonding head 80. In this modification example, the number of the first suction holes 242 and the number of the second suction holes 250 per unit area are the same. Also, the area of the first suction holes 241 and the area of the second suction holes 250 are the same. That is, the aperture ratio in the central region and the aperture ratio in the outer region are the same.

[0103] Also, in this modification example, as shown in FIG. 9(a), the configuration of the suction mechanism 171 connected to the pressure bonding head 80b is different from that of the suction mechanism 170.

[0104] The suction mechanism 171 includes a vacuum pump 180, a vacuum pipe (first vacuum pipe) 191, a vacuum pipe (second vacuum pipe) 192, and a pressure adjustment unit 260.

[0105] The vacuum pipe 191 is a pipe connected to the crimping head 80b so as to communicate with the first suction hole 242.

[0106] The vacuum pipe 192 is a pipe connected to the crimping head 80b so as to communicate with the second suction hole 250.

[0107] The pressure adjustment unit 260 is an adjustment device for adjusting (changing) the internal pressure of the vacuum pipes 191 and 192. The pressure adjustment unit 260 includes a first pressure adjustment unit 270 and a second pressure adjustment unit 280.

[0108] The first pressure adjustment unit 270 is an adjustment device for adjusting the pressure (internal pressure) of the vacuum pipe 191.

[0109] The second pressure adjustment unit 280 is an adjustment device for adjusting the pressure (internal pressure) of the vacuum pipe 192.

[0110] The control unit 120 adjusts the internal pressure of the vacuum pipe 191, for example, by controlling the pressure adjustment unit 260, and adsorbs the component 220 to the crimping head 80b with the first adsorption force in the central region and adsorbs the component 220 to the crimping head 80b with the second adsorption force in the outer region.

[0111] According to this, the component 220 adsorbed on the component adsorption surface 160 is more likely to thermally expand outward rather than toward the central region at the position facing the outer region.

[0112] The pressure adjustment unit 260 is a pressure adjustment valve such as a pressure reducing valve, for example.

[0113] Note that the pressure adjustment unit 260 may have a configuration capable of adjusting at least one of the pressure of the vacuum pipe 191 and the pressure of the vacuum pipe 192.

[0114] According to this, the first adsorption force by the first adsorption hole 242 can be made larger than the second adsorption force by the second adsorption hole 250 by the pressure adjustment unit 260.

[0115] (Other Embodiments) As described above, the component crimping device and the like according to the present embodiment have been described based on the above embodiments and modification examples. However, the present invention is not limited to the above embodiments and modification examples.

[0116] For example, the above embodiments and each modification example may be arbitrarily combined and configured. For example, the component crimping device may include a crimping portion having a component crimping surface provided with a first suction hole formed in a central region and a second suction hole formed in an outer region, the area of the first suction hole being larger than the area of the second suction hole, and the number of the first suction holes per unit area being larger than the number of the second suction holes. Further, for example, the component crimping device may include a crimping portion having a component crimping surface provided with such suction holes and a pressure adjusting portion shown in Modification Example 2.

[0117] Also, for example, in the above embodiment, all or part of the components of the computer 110 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory.

[0118] Also, the components of the computer 110 may be configured by one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0119] One or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated on one chip or on a plurality of chips. Here, although it is called an IC or LSI, the name may change depending on the degree of integration, and it may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Also, an FPGA (Field Programmable Gate Array) programmed after the manufacture of the LSI can be used for the same purpose.

[0120] In addition, forms obtained by applying various modifications that can be conceived by those skilled in the art to each embodiment, and forms realized by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention are also included in the present invention.

Industrial Applicability

[0121] The component crimping device according to the present invention can be used in a crimping device that crimps components to a substrate.

Explanation of Signs

[0122] 30 Crimping part 31 Component supply part 70 Component standby stage 71 Component standby stage moving mechanism 72 Pickup head 73 Pickup head moving mechanism 74, 75 Camera 76 Camera moving mechanism 80, 80a, 80b Crimping head 81 Crimping head moving mechanism 83 Substrate stage 84 Substrate stage moving mechanism 85 Heating mechanism 86 Backup stage 90 Component stage 91 Component stage moving mechanism 100 Component crimping device 110 Computer 120 Control unit 130 Memory unit 140 Placement unit 150 Imaging unit 160 Component suction surface 170, 171 Suction mechanism 180 Vacuum pump 190, 191, 192 Vacuum piping 200 Substrate 220 Component 230 Alignment mark 240, 241, 242 First suction hole 250 Second suction hole 260 Pressure adjustment unit 270 First pressure adjustment unit 280 Second pressure adjustment unit

Claims

1. A mounting portion on which a substrate is mounted, A component supply unit that supplies a component having a pair of alignment marks arranged apart from each other along a first direction, An imaging unit that images the component supplied from the component supply unit, A crimping unit having a heating mechanism, a suction mechanism, and a component suction surface, holding the component supplied from the component supply unit on the component suction surface by the suction mechanism, and crimping the held component to the substrate while heating it with the heating mechanism of the crimping unit, A control unit that controls the crimping unit, and The component suction surface has a central region on which a first suction force acts and an outer region that is located outside the central region in a second direction and on which a second suction force smaller than the first suction force acts, Based on the imaging data of the component imaged by the imaging unit, the control unit holds the component on the component suction surface such that the midpoint of the pair of alignment marks overlaps with the central region and the first direction and the second direction are parallel, The component suction surface has one or more first suction holes formed in the central region and one or more second suction holes formed in the outer region, Per unit area, the total area of the one or more first suction holes is larger than the total area of the one or more second suction holes, A component crimping device.

2. The suction mechanism A first vacuum pipe communicating with the one or more first suction holes, A second vacuum pipe communicating with the one or more second suction holes, And a pressure adjustment unit that adjusts at least one of the pressure in the first vacuum pipe and the pressure in the second vacuum pipe. The component crimping device according to claim 1.

3. The control unit holds the component on the component suction surface such that the amount of displacement in the first direction due to thermal expansion at a position corresponding to the outer region in the component held on the component suction surface is larger than the amount of displacement in the first direction due to thermal expansion at a position corresponding to the central region. The component crimping device according to claim 1 or 2.

4. A component supply step of supplying a component having a pair of alignment marks arranged apart from each other along a first direction, An imaging step of imaging the component supplied in the component supply step, A crimping step of holding the component supplied in the component supply step on a component suction surface of a crimping unit and crimping the held component to a substrate placed on a mounting portion while heating it with a heating mechanism of the crimping unit. The component suction surface has a central region on which a first suction force acts and an outer region on which a second suction force smaller than the first suction force acts outside the central region in the second direction. The component suction surface has one or more first suction holes formed in the central region and one or more second suction holes formed in the outer region. The total area of the one or more first suction holes per unit area is larger than the total area of the one or more second suction holes. In the crimping step, based on the imaging data of the component imaged in the imaging step, the component is held on the component suction surface such that the midpoint of the pair of alignment marks overlaps with the central region and the first direction and the second direction are parallel. Component crimping method.

Images