Processing device

Abstract

To provide a processing device that can suppress cleaning of the inside of a processing chamber.SOLUTION: A processing device 1 comprises: a chuck table 10 that holds a work-piece 200; a processing unit 20 that has a spindle 21 on which a polishing pad 25 is mounted through a mounter 24 fixed to a lower end thereof, and that polishes the work-piece 200 held on the chuck table 10; a processing chamber 40 that stores the chuck table 10 and a part of the processing unit 20 including the mounter 24; and a washing nozzle 60 that washes the processing chamber 40. A feather part 50 is formed on an outer peripheral surface 241 exposed to the processing chamber 40 of the mounter 24. The washing nozzle 60 jets washing water 62 toward the feather part 50 of the mounter 24 while rotating the spindle 21, so that the washing water 62 bouncing back from the feather part 50 washes the inside of the processing chamber 40.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a processing apparatus that processes while generating processing chips with a processing tool attached to a spindle such as a grinding apparatus or a polishing apparatus.

Background Art

[0002] Grinding apparatuses and polishing apparatuses process various plate-shaped workpieces such as semiconductor device wafers, resin substrates, and ceramic substrates with a rotating grinding wheel, polishing pad, etc. (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described processing apparatus, a large amount of processing chips are generated by cutting the workpiece during processing. During processing, by supplying grinding fluid to the workpiece, it is possible to suppress the grinding chips from adhering to the workpiece and remaining as residues. However, a large amount of processing chips adhere to the inside of the apparatus, such as the circumferential surface of the grinding wheel and the wall surface of the processing chamber. If the solidified processing chips fall onto the workpiece and get caught between the processing tool and the workpiece, it will cause scratches on the workpiece, which requires regular cleaning of the inside of the processing chamber.

[0005] An object of the present invention is to provide a processing apparatus capable of suppressing cleaning inside the processing chamber.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, a processing apparatus according to the present invention includes a chuck table that holds a workpiece, and a spindle to which a processing tool is attached via a mount fixed to the tip, and the processing unit grinds or polishes the workpiece held by the chuck table, a processing chamber that houses the chuck table and a part of the processing unit including the mount, and a cleaning nozzle that cleans the processing chamber. , the processing tool includes a wheel base mounted on the mounter and a polishing pad or grinding wheel disposed on the lower surface of the wheel base. A processing apparatus, wherein a fin portion is formed on a surface of the mount or the processing tool that is exposed to the processing chamber, and the cleaning nozzle sprays cleaning water toward the fin portion while the spindle is rotating, and the processing chamber is cleaned by the cleaning water rebounding from the fin portion. of the wheel base The surface of the mount or the processing tool that is exposed to the processing chamber has a fin portion formed thereon, and the cleaning nozzle sprays cleaning water toward the fin portion while the spindle is rotating, and the processing chamber is cleaned by the cleaning water rebounding from the fin portion. formed on the wheel base characterized in that. In the processing apparatus, the blade portion may include a plurality of blade-shaped members formed on the mounter or the wheel base and arranged at intervals in the circumferential direction.

Advantages of the Invention

[0007] The present invention has the effect of suppressing cleaning in the processing chamber.

Brief Description of the Drawings

[0008] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a processing apparatus according to Embodiment 1. [Figure 2] FIG. 2 is a side view showing a main part of the processing apparatus shown in FIG. 1 in a partial cross section. [Figure 3] FIG. 3 is a side view showing a main part of a processing apparatus according to Embodiment 2 in a partial cross section. [Figure 4] FIG. 4 is a side view showing a main part of a processing apparatus according to Embodiment 3 in a partial cross section. [Figure 5] FIG. 5 is a side view showing a main part of a processing apparatus according to Embodiment 4 in a partial cross section.

Modes for Carrying Out the Invention

[0009] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the content described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially identical ones. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0010] [Embodiment 1] The processing apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing apparatus according to Embodiment 1. FIG. 2 is a side view showing a partial cross-section of the main part of the processing apparatus shown in FIG. 1.

[0011] (Workpiece) The processing apparatus 1 shown in FIG. 1 according to Embodiment 1 is a polishing apparatus for polishing a workpiece 200. The workpiece 200 to be processed by the processing apparatus 1 shown in FIG. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer based on a substrate such as silicon, sapphire, or gallium. Devices are formed in each region of the workpiece 200 partitioned by division planned lines set in a grid pattern on the surface 201 of the substrate.

[0012] The devices are, for example, integrated circuits such as IC (Integrated Circuit) or LSI (Large Scale Integration), image sensors such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), or MEMS (Micro Electro Mechanical Systems).

[0013] In Embodiment 1, the workpiece 200 has a protective tape 210 of the same diameter attached to the surface 201, and the back surface 202 is polished by the processing apparatus 1. After being polished, the workpiece 200 is divided into individual devices along the division planned lines.

[0014] (Processing Device) Next, the processing device 1 will be described. The processing device 1 is a polishing device that polishes the back surface 202 of the workpiece 200. As shown in FIG. 1, the processing device 1 includes a device main body 2, a chuck table 10, a processing unit 20, a processing feed unit 30, a processing chamber 40, and a control unit 100.

[0015] The chuck table 10 has the surface 201 of the workpiece 200 placed on the holding surface 11 via the protective tape 210, and sucks and holds the workpiece 200 placed on the holding surface 11. The chuck table 10 has a disk shape in which the holding surface 11 is formed of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown).

[0016] The chuck table 10 has the holding surface 11 sucked by the vacuum suction source, and sucks and holds the workpiece 200 placed on the holding surface 11 via the protective tape 210. The chuck table 10 is provided so as to be movable in the X-axis direction parallel to the horizontal direction by a chuck table moving unit (not shown), and is rotated around an axis parallel to the vertical direction (Z-axis direction) by a rotational moving unit (not shown). The chuck table 10 is moved in the X-axis direction between the processing position below the processing unit 20 and the loading / unloading position where the workpiece 200 is loaded and unloaded after retreating from the processing position below the processing unit 20.

[0017] The processing unit 20 has a spindle 21 (shown in FIG. 2) that rotates around an axis parallel to the Z-axis direction, and polishes the back surface 202 of the workpiece 200 held by the chuck table 10. As shown in FIG. 2, the processing unit 20 includes a spindle 21 to which a polishing pad 25, which is a processing tool for polishing the back surface 202 of the workpiece 200, is attached, a spindle housing 22 that rotatably supports the spindle 21 around the axis, and a spindle motor 23 (shown in FIG. 1) that rotates the spindle 21 around the axis.

[0018] The spindle 21 is formed in a columnar shape, and a disk-shaped mount 24 with a polishing pad 25 attached to the lower end which is the tip is fixed. That is, the polishing pad 25 is attached to the spindle 21 via the mount 24 fixed to the tip. The polishing pad 25 includes a disk-shaped wheel base 26 attached to the mount 24, and a disk-shaped polishing pad 27 attached to the lower surface of the wheel base 26 for polishing the back surface 202 of the workpiece 200.

[0019] The processing unit 20 polishes the back surface 202 of the workpiece 200 by rotating the spindle 21 and the polishing pad 25 around the axis by the spindle motor 23 and bringing the polishing pad 27 closer to the chuck table 10 at the processing position at a predetermined feed rate by the processing feed unit 30.

[0020] The processing feed unit 30 moves the processing unit 20 in the Z-axis direction to separate and approach the processing unit 20 from and to the chuck table 10 at the processing position. In Embodiment 1, the processing feed unit 30 is provided on a standing wall 3 erected from one end of the apparatus main body 2 in the X-axis direction. The processing feed unit 30 includes a well-known ball screw 31 rotatably provided around the axis, a well-known motor 32 for rotating the ball screw 31 around the axis, a nut fixed to the processing unit 20 screwed to the ball screw 31, and a well-known guide rail 33 for movably supporting the spindle housing 22 of the processing unit 20 in the Z-axis direction.

[0021] In addition, in Embodiment 1, the processing unit 20 is formed such that the outer diameter of the polishing pad 25 is larger than the outer diameter of the chuck table 10, and the axis that is the rotation center of the polishing pad 25 and the axis that is the rotation center of the chuck table 10 are arranged parallel to each other with a horizontal interval therebetween, and the entire back surface 202 of the workpiece 200 held by the chuck table 10 is covered by the polishing pad 25. When the processing unit 20 polishes the back surface 202 of the workpiece 200 with the polishing pad 27 of the polishing pad 25, processing chips are generated.

[0022] The processing chamber 40 is located below the processing unit 20 and is formed in a box shape that accommodates the chuck table 10 at the processing position and the lower end of a part of the processing unit 20 including the mounter 24 and the polishing pad 25. Further, as shown in FIG. 1, the processing chamber 40 is formed in a flat box shape with an opening provided downward as a whole, and includes a plurality of side walls 41 erected in the Z-axis direction from the apparatus main body 2 and an upper wall 42 continuous with the upper ends of these plurality of side walls 41. Further, as shown in FIG. 1, the upper wall 42 of the processing chamber 40 is provided with a spindle through hole 43 through which the spindle 21 of the processing unit 20 passes and an opening 44 continuous with the spindle through hole 43.

[0023] The opening 44 is a hole penetrating the upper wall 42 and is for an operator of the processing apparatus 1 or the like to access the chuck table 10 and the polishing pad 25 of the processing unit 20 accommodated in the processing chamber 40 from the outside of the processing chamber 40. The opening 44 is opened and closed by an opening / closing door 46 rotatably provided around a hinge 45. Further, an entrance / exit 47 for allowing the chuck table 10 to freely enter and exit the processing chamber 40 is provided in one side wall 41 near the loading / unloading position of the processing chamber 40.

[0024] The control unit 100 controls each of the above-described constituent units constituting the processing apparatus 1. That is, the control unit 100 causes the processing apparatus 1 to execute a processing operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device.

[0025] The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in a storage device, and outputs a control signal for controlling the processing device 1 to the above-described components of the processing device 1 via an input / output interface device. Further, the control unit 100 is connected to a display unit constituted by a liquid crystal display device or the like that displays the state and image of the processing operation, an input unit used when an operator registers processing content information and the like, and a notification unit that notifies the operator. The input unit is constituted by at least one of a touch panel provided on the display unit and a keyboard or the like. The notification unit notifies the operator by emitting at least one of sound, light, and a message on the touch panel.

[0026] Further, as shown in FIG. 2, in the processing device 1, blade portions 50 are formed on an outer peripheral surface 241 which is a surface exposed in the processing chamber 40 of the mounter 24. The blade portions 50 are attached to the outer peripheral surface 241 of the mounter 24, extend in the outer peripheral direction from the outer peripheral surface 241 of the mounter 24, and include a plurality of blade-shaped members 51 arranged at intervals in the circumferential direction of the mounter 24.

[0027] Further, as shown in FIG. 2, the processing device 1 includes a cleaning nozzle 60. The cleaning nozzle 60 is disposed in the processing chamber 40, supplies cleaning water supplied from a cleaning water supply source (not shown) into the processing chamber 40, removes processing chips and the like from the inner surface of the processing chamber 40, and cleans the inner surface of the processing chamber 40. In the first embodiment, the base end of the cleaning nozzle 60 is attached to the apparatus main body 2, and an injection port 61 for injecting cleaning water faces the blade portions 50 of the mounter 24. The cleaning nozzle 60 injects cleaning water 62 from the injection port 61 toward the blade portions 50 of the mounter 24 with the spindle 21 of the processing unit 20 rotating around its axis, and cleans the inside of the processing chamber 40 with the cleaning water 62 rebounding from the blade portions 50. Note that the blade portions 50 have the same blade-shaped members 51 arranged at equal intervals along the circumferential direction of the outer periphery of the mounter 24 so as not to disrupt the rotational balance of the spindle 21.

[0028] Next, the processing operation of the processing apparatus 1 according to Embodiment 1 will be described. First, the processing apparatus 1 receives and registers the processing conditions input by the operator of the control unit 100 from the input unit or the like, and the workpiece 200 is placed on the holding surface 11 of the chuck table 10 at the loading / unloading position via the protective tape 210. When the control unit 100 of the processing apparatus 1 receives an instruction to start the processing operation from the operator, the processing apparatus 1 starts the processing operation.

[0029] In the processing operation, the processing apparatus 1 causes the control unit 100 to suck and hold the workpiece 200 on the holding surface 11 of the chuck table 10. The processing apparatus 1 causes the control unit 100 to control the spindle motor 23 to rotate the polishing pad 25 around the axis, and to eject the cleaning water 62 from the cleaning nozzle 60 toward the blade portion 50 of the mounter 24.

[0030] In the processing operation, the processing apparatus 1 causes the control unit 100 to control the chuck table moving unit to move the chuck table 10 toward the processing position, to insert each workpiece 200 held by the chuck table 10 into the processing chamber 40, and to position it below the processing unit 20. Then, the control unit 100 causes the control unit 100 to control the rotational movement unit to rotate the chuck table 10 around the axis and rotate the polishing pad 25 around the axis by the spindle motor 23, and to feed the processing unit 20 by the processing feed unit 30 while rotating the polishing pad 27 against the back surface 202 of the workpiece 200 to polish the back surface 202 of the workpiece 200. At this time, the cleaning water 62 rebounding from the blade portion 50 and the mist generated from the cleaning water 62 adhere to the inner surface of the processing chamber 40, preventing the processing chips from sticking, and the inside of the processing chamber 40 is cleaned by the cleaning water 62 rebounding from the blade portion 50 and the mist generated from the cleaning water 62.

[0031] When the polishing of the back surface 202 of the workpiece 200 is completed, the processing apparatus 1 stops the rotation of the chuck table 10 around its axis by the control unit 100. After separating the processing unit 20 from the workpiece 200 by the processing feed unit 30, the chuck table moving unit moves the chuck table 10 toward the loading / unloading position. Then, when the chuck table 10 reaches the loading / unloading position, the processing apparatus 1 stops the movement of the chuck table 10 by the chuck table moving unit by the control unit 100 and stops the suction holding of the workpiece 200 on the chuck table 10. When the polished workpiece 200 and the unpolished workpiece 200 are exchanged, the processing apparatus 1 polishes the back surface of the workpiece 200 in the same manner as the above-described process. During the polishing of the workpiece 200, the opening / closing door 46 closes the opening 44.

[0032] As described above, in the processing apparatus 1 according to the first embodiment, since the blade portion 50 is provided on the rotating mounter 24 and the cleaning nozzle 60 that jets the cleaning water 62 toward the blade portion 50 is provided, the cleaning water 62 and mist rebounding from the blade portion 50 do not adhere to the inner surface of the processing chamber 40, and the processing chips are prevented from sticking to the inner surface of the processing chamber 40 and are washed away. As a result, the processing apparatus 1 according to the first embodiment can significantly reduce the man-hours for cleaning the inside of the processing chamber 40 and has the effect of suppressing the cleaning of the inside of the processing chamber 40.

[0033] 〔Second Embodiment〕 The processing apparatus according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a side view showing a main part of the processing apparatus according to the second embodiment in a partial cross section. In FIG. 3, the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof is omitted. The processing apparatus 1 according to the second embodiment is the same as that of the first embodiment except that the position where the blade portion 50 is formed and the position where the cleaning nozzle 60 is disposed are different.

[0034] As shown in Fig. 3, the processing apparatus 1 according to Embodiment 2 is formed at the outer edge of the upper surface 242 which is the surface where each feather-shaped member 51 of the feather portion 50 is exposed in the processing chamber 40 of the mounter 24. It extends upward from the upper surface 242 of the mounter 24 and is arranged at intervals in the circumferential direction of the mounter 24. Further, as shown in Fig. 3, in the processing apparatus 1 according to Embodiment 2, the base end of the cleaning nozzle 60 is attached to the lower surface of the upper wall 42 of the processing chamber 40, and the injection port 61 faces the feather portion 50 attached to the upper surface 242 of the mounter 24. Similar to Embodiment 1, the cleaning nozzle 60 injects cleaning water 62 from the injection port 61 toward the feather portion 50 of the mounter 24 with the spindle 21 of the processing unit 20 rotating around its axis, and the inside of the processing chamber 40 is cleaned by the cleaning water 62 rebounding from the feather portion 50.

[0035] The processing apparatus 1 according to Embodiment 2 is provided with a feather portion 50 on the rotating mounter 24 and a cleaning nozzle 60 that jets cleaning water 62 toward the feather portion 50. Therefore, the cleaning water 62 and mist rebounding from the feather portion 50 adhere to the inner surface of the processing chamber 40, preventing the processing chips from sticking to the inner surface of the processing chamber 40 and having a flushing effect. Similar to Embodiment 1, it has the effect of suppressing the cleaning inside the processing chamber 40.

[0036] 〔Embodiment 3〕 The processing apparatus according to Embodiment 3 of the present invention will be described with reference to the drawings. Fig. 4 is a side view showing a main part of the processing apparatus according to Embodiment 3 in a partial cross section. In Fig. 4, the same parts as those in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted. The processing apparatus 1 according to Embodiment 3 is the same as Embodiment 1 except that the position where the feather portion 50 is formed is different.

[0037] As shown in Fig. 4, the processing apparatus 1 according to Embodiment 3 is formed on the outer peripheral surface 261 of the wheel base 26, which is the surface where each feather-shaped member 51 of the feather portion 50 is exposed in the processing chamber 40 of the polishing pad 25. It extends in the outer peripheral direction from the outer peripheral surface 261 of the wheel base 26 of the polishing pad 25 and is arranged at intervals in the circumferential direction of the wheel base 26 of the polishing pad 25. Further, as shown in Fig. 4, in the processing apparatus 1 according to Embodiment 3, the base end of the cleaning nozzle 60 is attached to the apparatus main body 2, and the injection port 61 faces the feather portion 50 attached to the outer peripheral surface 261 of the wheel base 26 of the polishing pad 25. Similar to Embodiment 1, the cleaning nozzle 60 injects the cleaning water 62 from the injection port 61 toward the feather portion 50 with the spindle 21 of the processing unit 20 rotating around the axis, and the inside of the processing chamber 40 is cleaned by the cleaning water 62 rebounding from the feather portion 50.

[0038] Since the processing apparatus 1 according to Embodiment 3 is provided with the cleaning nozzle 60 that jets the cleaning water 62 toward the feather portion 50, the cleaning water 62 and mist rebounding from the feather portion 50 adhere to the inner surface of the processing chamber 40, preventing the processing chips from sticking to the inner surface of the processing chamber 40 and having a flushing effect. Thus, similar to Embodiment 1, it has the effect of suppressing the cleaning inside the processing chamber 40.

[0039] 〔Embodiment 4〕 The processing apparatus according to Embodiment 4 of the present invention will be described with reference to the drawings. Fig. 5 is a side view showing a main part of the processing apparatus according to Embodiment 4 in a partial cross section. In Fig. 5, the same parts as those in Embodiment 1 are denoted by the same reference numerals, and the description thereof is omitted.

[0040] As shown in Fig. 5, the processing apparatus 1 according to Embodiment 4 is the same as Embodiment 1 except that the spindle 21 is equipped with a grinding wheel 70 as a processing tool via the mount 24, and the processing unit 20 is a grinding apparatus for grinding the back surface 202 of the workpiece 200. The grinding wheel 70 includes a ring-shaped wheel base 71 mounted on the mount 24 and a plurality of grinding wheels 72 annularly arranged at the outer edge of the lower surface of the wheel base 71.

[0041] Further, in the processing apparatus 1 shown in FIG. 5, similar to Embodiment 1, the blade portion 50 is formed on the outer peripheral surface 241 of the mount 24. However, in the present invention, the blade portion 50 may be formed in the same manner as in Embodiment 2 or Embodiment 3. In Embodiment 4, the processing unit 20 is configured such that the outer diameter of the grinding wheel 70 is formed to be larger than the outer diameter of the chuck table 10, and the axis that is the rotation center of the grinding wheel 70 and the axis that is the rotation center of the chuck table 10 are arranged in parallel with a horizontal interval therebetween, and the outer edge portion of the grinding wheel 72 passes over the center of the back surface 202 of the workpiece 200 held by the chuck table 10. When the processing unit 20 grinds the back surface 202 of the workpiece 200 with the grinding wheel 72 of the grinding wheel 70, machining chips are generated.

[0042] The processing apparatus 1 according to Embodiment 4 is provided with the blade portion 50 on the rotating mount 24 and includes the cleaning nozzle 60 that jets the cleaning water 62 toward the blade portion 50. Therefore, the cleaning water 62 and mist rebounding from the blade portion 50 do not adhere to the inner surface of the processing chamber 40, and the machining chips are prevented from sticking to the inner surface of the processing chamber 40 and are washed away. Thus, similar to Embodiment 1, the effect of suppressing the cleaning inside the processing chamber 40 can be achieved.

[0043] Note that the present invention is not limited to the above-described embodiments. That is, various modifications can be made and implemented without departing from the gist of the present invention.

Explanation of Reference Numerals

[0044] 1 Processing apparatus 10 Chuck table 20 Processing unit 21 Spindle 24 Mount 25 Polishing pad (processing tool) 40 Processing chamber 50 Blade portion 60 Cleaning nozzle 62 Cleaning water 70 Grinding wheel (processing tool) 200 Workpiece 241 Outer peripheral surface (exposed surface) 242 Upper surface (exposed surface) 261 Outer peripheral surface (exposed surface)

Claims

1. A processing unit that has a chuck table for holding a workpiece and a spindle to which a processing tool is attached via a mount fixed to the tip, and grinds or polishes the workpiece held on the chuck table, a processing chamber that houses the chuck table and a part of the processing unit including the mount, and a cleaning nozzle for cleaning the processing chamber. The processing tool is a processing device that includes a wheel base attached to the mount and a polishing pad or grinding wheel disposed on the lower surface of the wheel base. A fin portion is formed on the surface of the mount or the wheel base of the processing tool that is exposed to the processing chamber. The cleaning nozzle is a processing device that sprays cleaning water toward the fin portion formed on the mount or the wheel base of the processing tool with the spindle rotating, and the inside of the processing chamber is cleaned by the cleaning water rebounding from the fin portion.

2. The processing device according to Claim 1, wherein the fin portion includes a plurality of fin-shaped members formed on the mount or the wheel base and arranged at intervals in the circumferential direction.

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