Work cutting method, slicing apparatus, and slicing base

Abstract

To provide a cutting method of a workpiece capable of cooling an ingot efficiently, a slice device, and a slice base.SOLUTION: According to a cutting method of a workpiece for cutting a workpiece into a wafer shape, a wire column is formed by winding a wire around a plurality of rollers with grooves, and the workpiece held by workpiece holding means is relatively abutted to the wire column and cut in and fed via a slice base to which an upper part of the workpiece is adhered while reciprocally traveling the wire in an axial direction. A space is provided between the workpiece and the slice base, and the workpiece is cut while supplying the space with coolant.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for cutting a workpiece such as a semiconductor ingot, a slicing apparatus, and a slicing base.

Background Art

[0002] Conventionally, a semiconductor ingot such as silicon is formed, and this semiconductor ingot is adhered to a slicing base made of glass, carbon material, or resin with an adhesive such as an epoxy resin. Then, it is cut into a plurality of sheets to a predetermined thickness to form a semiconductor substrate.

[0003] As a method of cutting in this way, a cutting method using a wire saw is common. In a commonly used wire saw apparatus, a semiconductor ingot adhered to a slicing base is installed, and a wire is wound around a number of grooves at regular intervals and arranged parallel to each other. Then, while moving a plurality of wires stretched between two main rollers at high speed, the semiconductor ingot is gradually lowered toward the wire and pressed against the wire to cut the semiconductor ingot and produce a semiconductor substrate.

[0004] In the cutting method using a wire saw, while the wire is running at high speed and pressed against the semiconductor ingot, when the semiconductor ingot is cut, frictional heat is generated at the cutting portion, and when the cutting portion of the semiconductor ingot becomes high temperature due to the frictional heat, there are problems such as deterioration of cutting accuracy and generation of microcracks in the formed semiconductor substrate.

[0005] Therefore, in Patent Document 1, as a method for manufacturing a semiconductor substrate capable of absorbing frictional heat generated when cutting a semiconductor ingot and suppressing deterioration of cutting accuracy, surface roughness, and generation of microcracks, while supplying a coolant liquid for cooling to the top side of the semiconductor ingot, and the inlet side and the outlet side where the wire cuts into the semiconductor ingot, a technique of cutting is described.

[0006] In Patent Document 2, as a wire saw that can suppress warping, undulation, and thickness variation of a cut wafer and cut a wafer with a uniform thickness, improvements have been made to the work plate that holds the workpiece via a slice base. That is, a machining fluid supply unit that supplies machining fluid to the upper surface of the work plate, a machining fluid supply port provided on the upper surface, a through-flow path that communicates with this machining fluid supply port and penetrates the work plate to supply machining fluid to the workpiece, and a rectifying plate for uniformly supplying the machining fluid supplied from this through-flow path to the workpiece are disclosed.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0008] In the inventions described in these patent documents, the workpiece (work) is adhered to a slice base (which may also be referred to as a bonding member, beam, backing plate, resin part, etc.) formed of resin, ceramic, etc., and the workpiece (work) is held by the work holding part via this slice base.

[0009] In the prior art, since coolant or machining fluid is supplied to the top side or side surface of the workpiece, although the heat generation near the cutting position can be efficiently cooled, the cooling effect is insufficient in the slice base part. It has been found that the conventional coolant or machining fluid supply method and cooling method are affected by heat accumulation in the slice base part. In particular, the heat behavior such as the temperature difference between the part where the slice base is attached and the part where it is not attached is likely to vary, and there are problems such as deterioration of the shape near the end of cutting and easy occurrence of cracks.

[0010] In particular, in slicing with fixed abrasive grains, deterioration of the warp of the sliced workpiece (wafer) due to thermal expansion of the workpiece (ingot) during cutting, or cracking of the sliced workpiece (wafer) due to the difference in thermal expansion between the workpiece (ingot) and the resin occurs easily in the slice base adhered to the workpiece (ingot).

[0011] The present invention has been made to solve the above problems, and for the purpose of suppressing the thermal expansion of the ingot, it aims to enhance the cooling ability of the ingot, and provides a workpiece cutting method, a slicing apparatus, and a slice base that enable efficient cooling of the ingot, with the aim of preventing stable wafer shapes and cracking.

Means for Solving the Problems

[0012] The present invention has been made to achieve the above object, forms a wire row by winding a wire around a plurality of grooved rollers, and while reciprocating the wire in the axial direction, presses and feeds the workpiece held by a workpiece holding means through a slice base to which the upper part of the workpiece is adhered against the wire row relatively, and a workpiece cutting method for cutting the workpiece into a wafer shape, wherein a space is provided between the workpiece and the slice base, and the workpiece is cut while supplying a coolant to the space.

[0013] According to such a workpiece cutting method, a coolant is supplied to the upper part of the workpiece separately from the supply of a normal processing liquid (slurry) or coolant to the side surface of the ingot processing, and by cooling particularly the slice base part, the workpiece can be cut while efficiently cooling the workpiece. As a result, the shape of the workpiece is stabilized, and problems such as cracking can be prevented.

[0014] At this time, as the wire, a fixed abrasive grain wire having abrasive grains fixed on the surface of the wire can be used as a workpiece cutting method.

[0015] The present invention is particularly effective in a method for cutting a workpiece using such a fixed abrasive wire.

[0016] The present invention also provides a slicing apparatus comprising a wire row formed by winding a wire around a plurality of grooved rollers, a slice base to which the upper part of a workpiece is adhered, and workpiece holding means for holding the workpiece via the slice base. While reciprocating the wire in the axial direction, the workpiece held by the workpiece holding means is pressed against the wire row relatively and fed by cutting, thereby simultaneously cutting the workpiece at a plurality of locations arranged in the axial direction. The slice base is provided with a recess on the adhesion surface with the workpiece, which forms a space between the workpiece and the slice base when the workpiece is adhered, and is provided with a coolant supply unit for supplying coolant to the space.

[0017] According to such a slicing apparatus, by supplying coolant to the upper part of the workpiece separately from the supply of normal processing fluid (slurry) or coolant to the side surface of the ingot processing part, and particularly cooling the slice base part, it is possible to cut the workpiece while efficiently cooling the workpiece. And the shape of the workpiece is stabilized, and problems such as cracking can be prevented.

[0018] At this time, the wire can be a fixed abrasive wire with abrasive grains fixed on the surface of the wire.

[0019] The present invention is particularly effective in an apparatus using such a fixed abrasive wire.

[0020] The present invention also provides a slicing base used in a slicing apparatus for slicing a workpiece, which forms a wire row by winding a wire around a plurality of grooved rollers, and while reciprocating the wire in the axial direction, presses and feeds the workpiece held by a workpiece holding means via a slice base to which the upper part of the workpiece is adhered against the wire row relatively, and slices the workpiece into a wafer shape. The slice base is provided with a recess on the adhesion surface with the workpiece, which forms a space for flowing a coolant between the workpiece and the slice base when the workpiece is adhered.

[0021] According to such a slice base, it becomes possible to supply a coolant to the upper part of the workpiece separately from the supply of a normal processing fluid (slurry) or coolant to the side surface of the ingot processing, and to efficiently cool the workpiece. And the shape of the workpiece is stabilized, and problems such as cracking can be prevented.

Effect of the Invention

[0022] As described above, according to the workpiece cutting method of the present invention, it is possible to supply a coolant to the upper part of the workpiece, and particularly to cool the slice base part, so that the workpiece can be cut while efficiently cooling the workpiece. Further, according to the slicing apparatus of the present invention, it becomes possible to cut the workpiece while efficiently cooling the workpiece. According to the slice base of the present invention, it becomes possible to efficiently cool the workpiece. As a result, the shape of the cut workpiece (wafer) is stabilized, and the occurrence of problems such as cracking can be suppressed.

Brief Description of the Drawings

[0023]

Figure 1

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Figure 11

Embodiments for Carrying Out the Invention

[0024] Hereinafter, the present invention will be described in detail, but the present invention is not limited thereto.

[0025] As described above, there has been a demand for a method for cutting a work, a slicing device, and a slice base that enable efficient cooling of an ingot.

[0026] As a result of intensive studies on the above problems, the inventors of the present invention have formed a wire row by winding a wire around a plurality of grooved rollers, and while reciprocating the wire in the axial direction, the work held by the work holding means via a slice base to which the upper part of the work is adhered is pressed against the wire row relatively and fed by cutting, thereby cutting the work into wafers. In this work cutting method, a space is provided between the work and the slice base, and the work is cut while supplying a coolant to the space. By supplying a coolant to the upper part of the work separately from the supply of a normal processing liquid (slurry) or coolant to the side surface of the ingot processing, especially by cooling the slice base part, it has been found that the work can be cut while efficiently cooling the work, and thus the present invention has been completed.

[0027] The inventors of the present invention have also provided a wire row formed by winding a wire around a plurality of grooved rollers, a slice base to which the upper part of the work is adhered, and work holding means for holding the work via the slice base. While reciprocating the wire in the axial direction, the work held by the work holding means is pressed against the wire row relatively and fed by cutting, thereby simultaneously cutting the work at a plurality of locations arranged in the axial direction. In this slicing apparatus, the slice base has a recess on the adhesion surface with the work that forms a space between the work when the work is adhered, and is provided with a coolant supply unit for supplying a coolant to the space. By supplying a coolant to the upper part of the work separately from the supply of a normal processing liquid (slurry) or coolant to the side surface of the ingot processing, especially by cooling the slice base part, it has been found that the work can be cut while efficiently cooling the work, and thus the present invention has been completed.

[0028] The inventors of the present invention also form a wire array by winding a wire around a plurality of grooved rollers, and while reciprocating the wire in the axial direction, the work held by the work holding means via a slice base to which the upper part of the work is adhered is pressed against the wire array relatively and fed by cutting, and a slice base used in a slicing apparatus for slicing a work into wafers, wherein the slice base is provided with a recess on the adhesion surface with the work to form a space for flowing a coolant between the work and the work when the work is adhered. By using this slice base, it has been found that coolant can be supplied to the upper part of the work separately from the supply of normal processing liquid (slurry) or coolant to the side surface of the ingot processing, and the work can be efficiently cooled, thus completing the present invention.

[0029] Hereinafter, description will be made with reference to the drawings.

[0030] [Slicing apparatus] First, the slicing apparatus will be described. FIG. 9 shows an example of a general slicing apparatus (wire saw). As shown in FIG. 9, this slicing apparatus (wire saw) 201 includes a wire 202 (high-tensile steel wire) for cutting an ingot-shaped work W, a grooved roller 103 around which the wire 202 is wound, mechanisms 104, 104' for adjusting the tension of the wire 202, a mechanism 105 for feeding the work W to be cut downward, and a mechanism 206 for supplying slurry during cutting.

[0031] The wire 202 is drawn out from one wire reel 107, wound around the grooved roller 103 about 300 to 500 times through the traverser 108, the tension adjusting mechanism 104, and the pulley 109 to form a wire array, and then wound around the wire reel 107' through the other pulley 109', the tension adjusting mechanism 104', and the traverser 108'.

[0032] The grooved roller 103 is a roller in which, for example, polyurethane resin is press-fitted around a steel cylinder and grooves are cut on its surface at a substantially constant pitch, and the wound wire 202 can be reciprocally driven in the axial direction by a grooved roller drive motor 110 in one direction or at a predetermined period.

[0033] The wire reels 107, 107' are rotationally driven by wire reel drive motors 111, 111', and the tension applied to the wire 202 can be adjusted by controlling the speeds of the grooved roller drive motor 110 and the wire reel drive motors 111, 111' respectively.

[0034] Also, the mechanism 105 for sending out the workpiece W shown in FIG. 9 has workpiece holding means 114 composed of a workpiece holding portion 112 and a workpiece plate 113. The workpiece W is held on the workpiece plate 113 via a slice base 120 attached to the workpiece W. The slice base 120 is a member formed of, for example, resin, carbon, glass, ceramics, or the like. FIG. 11 shows an application example (cross-sectional view) of the conventional slice base according to a conventional example with the conventional slice base 120, workpiece plate 113, and workpiece W enlarged.

[0035] When cutting the workpiece W, the workpiece W held by the workpiece holding means 114 is pressed against the wire row relatively and fed in for cutting to cut the ingot-shaped workpiece into a wafer-shaped workpiece. For example, the workpiece W is held and pushed down by the mechanism 105 for sending out the workpiece W downward, and is sent out with respect to the wire row composed of the wire 202 wound around the grooved roller 103.

[0036] Using such a wire saw 201, applying an appropriate tension to the wire 202 using the tension applying mechanisms 104 and 104', while reciprocating the wire 202 in the axial direction of the wire 202 by the wire reel drive motors 111 and 111', supplying the slurry supplied from the slurry supply mechanism 206, and cutting the work W in a feed direction by the work feed mechanism 105 that feeds the work downward, the ingot-shaped work W is simultaneously cut at a plurality of locations arranged in the axial direction of the work W.

[0037] There is also known a method and apparatus for cutting a work using a fixed abrasive wire in which diamond abrasives or the like are fixed to the surface of the wire as the wire 202 without using a slurry containing abrasives as shown in FIG. 9. In cutting with this fixed abrasive wire, instead of the wire 202 in the general wire saw 201 shown in FIG. 9, a fixed abrasive wire is mounted. Further, a wire saw including a mechanism for supplying a coolant is used, in which the slurry supplied in the general wire saw 201 shown in FIG. 9 is changed to a coolant such as cooling water not containing abrasives. Thus, in cutting with this fixed abrasive wire, a general wire saw can be used as it is.

[0038] (Slice base) The inventor focused on the shape of this slice base and came up with the idea of newly providing a coolant supply mechanism for supplying a coolant between this slice base and the work (ingot).

[0039] Therefore, in the slice base of the present invention, the conventional shape is changed to a structure in which a space is provided between the upper part of the ingot and the slice base. The slice base of the present invention is provided with a recess (groove) on the adhesion surface with the work for forming a space for flowing a coolant between the work and the work when the work is adhered. It has been found that by supplying a coolant to this space, it becomes possible to efficiently cool the ingot.

[0040] As an example of the slice-based shape, as shown in FIGS. 1 and 2, a concave portion (groove) 300 is provided on the adhesion surface (contact surface) with the workpiece (ingot), and the shape is such that a space is formed between the workpiece (ingot) W and the slice base 120. In the examples of FIGS. 1 and 2, the shape of the concave portion (groove) 300 is substantially square in a cross section perpendicular to the direction in which the concave portion extends (a cross section parallel to the cutting surface of the workpiece. Hereinafter, when simply referred to as "cross section", this cross section is meant).

[0041] The space width B is preferably 30 mm or more, more preferably 50 mm or more. The upper limit is set as appropriate considering the diameter of the workpiece and the type of the slice base, etc. since the larger the space, the greater the cooling effect. For example, the ratio of the space width B to the slice base width L may be set within a range of 20% or more and 70% or less. The slice base width L is not particularly limited and can be set as appropriate considering the strength of the slice base and the adhesion strength between the workpiece and the slice base, etc. For example, in the cutting of a 300 mm ingot, the slice base width L can be set to about 80 mm to 160 mm.

[0042] In the examples of FIGS. 1 and 2, the concave portion (groove) 300 forms a space with a substantially square cross-sectional shape, but it is not particularly limited thereto. As shown in FIG. 3(A), the cross-sectional shape of the concave portion may be semi-elliptical, and the same effect can be obtained even if a plurality (two) of the concave portions shown in FIG. 3(A) are formed as shown in FIG. 3(B). Design it so that the concave portion 300 can be easily formed, and the contact area is such that sufficient adhesion strength can be obtained when the slice base and the workpiece are adhered. Note that the adhesion surface of the slice base 120 with the workpiece (ingot) has a shape corresponding to the outer shape of the workpiece (ingot). For example, when the workpiece (ingot) is cylindrical, the cross-sectional shape is an arc shape corresponding to the diameter of the workpiece cross section.

[0043] For example, as shown in FIG. 4, there may be a plurality of spaces having a substantially square cross-sectional shape. Although it also depends on the strength of the slice base and the adhesive strength between the workpiece and the slice base, each adhesive width (A1, A2, A3, A4...) between the workpiece and the slice base is preferably 10 mm or more. The upper limit of the adhesive width is not particularly limited, but it is preferably set to a width of 20 mm or less for efficient cooling in the vicinity of the slice base. The sum of each adhesive width depends on the diameter of the ingot, the type and width of the slice base, but it is preferably set such that the ratio of the total adhesive width (adhesive area) to the slice base width L is 30% or more and 80% or less. Also, the sum of the space widths (B1, B2, B3...) is preferably 30 mm or more. The larger the space, the greater the cooling effect, but it is appropriately set in consideration of the diameter of the workpiece, the type and width of the slice base, etc. For example, the ratio of the space width to the slice base width L may be set to a width of 20% or more and 70% or less.

[0044] In particular, considering the weight of the ingot, the adhesive strength of the adhesive, etc., the shape of the slice base can be designed to achieve an optimal contact area.

[0045] (Coolant supply section) Next, the mechanism for supplying coolant to the slicing apparatus, particularly to the space between the slice base and the workpiece, will be described. For the slicing apparatus itself, a conventionally used slicing apparatus may be employed. For example, as shown in FIG. 5, a coolant supply unit 301 for supplying coolant to the space newly formed between the slice base and the workpiece is provided using a conventional apparatus. The coolant supply unit 301 is installed at the opening of the space on one side of the concave portion (space) of the slice base, and coolant is supplied from this coolant supply unit 301 and discharged from the opening of the space on the other side. Note that FIG. 5(A) is a view of FIG. 5(B) seen from the right direction. The coolant is not particularly limited as long as it has a cooling effect. For example, in slicing using a slurry containing abrasive grains, the slurry used for this cutting, and in slicing using a fixed abrasive grain wire, cooling water containing no abrasive grains, etc. may be supplied to this portion (that is, it is sufficient to use the conventionally used slurry or coolant and supply it between the slice base and the workpiece via another pipe).

Example

[0046] Hereinafter, the present invention will be specifically described with reference to experimental examples and examples, but this does not limit the present invention.

[0047] A slice base having a substantially square cross-sectional groove as shown in FIG. 1 was prepared. The slice base was made of synthetic resin.

[0048] First, an ingot with a diameter of 300 mm was adhered to the slice base using an adhesive. Thereafter, the ingot was held on the work plate via the slice base. Then, the work plate holding this ingot was set in the slicing apparatus of the present invention. After setting, a coolant supply unit for supplying coolant to the slice base was set, and cutting was performed in the same manner as conventionally while flowing coolant through this portion.

[0049] First, the effects of the present invention, and preferable flow rates and groove widths were investigated.

[0050] [Experimental Example 1] The slice base width L was fixed at 90 mm, the space width B of the slice base was fixed at 50 mm, and the bonding width was 40 mm (20 mm at both ends) (the ratio of the space width B to the slice base width L was approximately 56%, and the ratio of the bonding area was approximately 44%). As an example, the coolant flowing into the recess (space) 300 was supplied at a flow rate of 20 L / min to 120 L / min, and the Warp shape of the wafer-shaped workpiece after cutting was confirmed. As a reference example, cutting was also performed under the condition where no coolant was flowed (0 L / min). As a comparative example, cutting was performed using a conventional slice base without grooves (see Fig. 11).

[0051] Note that the shape of the wafer-shaped workpiece after cutting was evaluated relatively with the Warp value when processed using a conventional slice base without grooves being set as 1.0. The results are shown in Fig. 6.

[0052] As shown in Fig. 6, by flowing the coolant into the recess (space) 300 of the slice base, a tendency for improvement in the Warp value was observed. In this confirmation, in particular, by supplying the coolant at 40 L / min or more, the Warp value was more stably reduced.

[0053] [Experimental Example 2] The flow rate of the coolant supplied to the recess (space) 300 of the slice base was fixed at 40 L / min, and the space width B was cut at levels from 0 to 100 mm. Note that B = 0 mm refers to a conventional slice base without grooves (comparative example). Also, the slice base width L was 140 mm. That is, the ratio of the space width B to the slice base width L was cut from 0 to 71%, and the bonding width was from 140 mm to 40 mm (the ratio of the contact area to the slice base width L was from 100 to 29%).

[0054] The shape of the wafer-shaped workpiece after cutting was evaluated relatively with the Warp value when processed using a conventional slice base without grooves being set as 1.0. The results are shown in Fig. 7.

[0055] As shown in Fig. 7, an improvement tendency is observed by providing a space portion. In the confirmation of this experimental example, particularly when the space width B is 30 mm or more (the ratio of the space width B to the slice base width L: about 20% or more), preferably 50 mm or more (the ratio of the space width B to the slice base width L: 36% or more), by making the space (forming a cooling region), Warp was more stably reduced. Thus, supplying the coolant over a certain area or more can make the cooling effect more stable.

[0056] [Experimental Example 3] The slice base width L was 110 mm, the total space width B of the slice base was 70 mm (the ratio of the space width B to the slice base width L: about 64%), and the flow rate supplied to the recess (space) 300 of the slice base was fixed at 60 L / min. As shown in Fig. 8, the level of the number of recesses (spaces) 300 was varied from 1 to 3, that is, when there was 1, each adhesion width (at 2 locations) was 20 mm for each adhesion width, and the space width was 70 mm, when there were 2, each adhesion width (at 3 locations) was 13 mm for each adhesion width, and each space width was 35 mm, when there were 3, each adhesion width (at 4 locations) was 10 mm for each adhesion width, and each space width was 23 mm, and it was set and cut. The Warp shape of the wafer-shaped workpiece after cutting was confirmed.

[0057] As a result, regardless of the number of recesses (spaces) 300, by enabling the supply of coolant to the recess (space) 300 of the slice base, there was an improvement effect of approximately the same degree. That is, it can be seen that the cooling of this part is an important factor.

[0058] From the results of this time, in the case of processing a 300 mm diameter ingot, it was confirmed that when the space width B was 30 mm or more and the flow rate of the coolant flowing through the recess (space) 300 was 40 L / min or more, cooling could be performed more efficiently. Also, it was found that the same effect can be obtained even when the recess (space) 300 is divided into a plurality. No warping, etc. of the wafer-shaped workpiece after cutting was observed.

[0059] As described above, according to the embodiments of the present invention, by providing a recess (space) in the slice base of the present invention and supplying a coolant to that portion to enhance the cooling effect, variations in thermal behavior such as the temperature difference between the portion where the slice base is attached and the portion where it is not attached are improved, the stability of the shape near the end of slicing is improved, and the occurrence of cracks in the wafer-shaped workpiece can be prevented.

[0060] Note that the present invention is not limited to the above-described embodiments. The above-described embodiments are examples, and any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits the same operational effects is included in the technical scope of the present invention.

Explanation of Reference Numerals

[0061] 103... Grooved roller, 104, 104’... Mechanism for adjusting the tension of the wire, 105... Mechanism for feeding the workpiece downward, 107, 107’... Wire reels, 108, 108’... Traversers, 109, 109’... Pulleys, 110... Grooved roller drive motor, 111, 111’... Wire reel drive motors, 112... Work holding portion, 113... Work plate, 114... Work holding means, 120... Slice base (bonding member, beam, backing plate, resin portion), 201... Slicing device (wire saw), 202... Wire (high-tensile steel wire), 206... Mechanism for supplying slurry, 300... Recess (space, groove), 301... Coolant supply portion. A1, A2, A3, A4... Bonding width, B, B1, B2, B3... Space width, L... Slice base width, W... Workpiece.

Claims

1. A method for cutting a workpiece, comprising: forming a wire row by winding a wire around a plurality of grooved rollers; while reciprocating the wire in the axial direction, pressing and cutting the workpiece held by a workpiece holding means via a slice base to which the upper part of the workpiece is adhered relative to the wire row, and cutting the workpiece into wafers, wherein a space is provided between the workpiece and the slice base, and the workpiece is cut while supplying a coolant from the outside of the space into the space.

2. The method for cutting a workpiece according to claim 1, wherein a fixed abrasive grain wire having abrasive grains fixed to the surface of the wire is used as the wire.

3. A slicing apparatus, comprising: a wire row formed by winding a wire around a plurality of grooved rollers; a slice base to which the upper part of the workpiece is adhered; a workpiece holding means for holding the workpiece via the slice base; and while reciprocating the wire in the axial direction, pressing and cutting the workpiece held by the workpiece holding means relative to the wire row to simultaneously cut the workpiece at a plurality of locations arranged in the axial direction, wherein the slice base has a recess on the adhesion surface with the workpiece, which forms a space between the workpiece and the slice base when the workpiece is adhered; the slicing apparatus is characterized in that it comprises a coolant supply unit for supplying a coolant into the space.

4. The slicing apparatus according to claim 3, wherein the wire is a fixed abrasive grain wire having abrasive grains fixed to the surface of the wire.

5. A slice base for use in a slicing apparatus for cutting a workpiece, the slicing apparatus forming a wire row by winding a wire around a plurality of grooved rollers, reciprocating the wire in the axial direction, pressing and cutting the workpiece held by a workpiece holding means via a slice base to which the upper part of the workpiece is adhered relative to the wire row, and cutting the workpiece into wafers, wherein the slice base has a recess on the adhesion surface with the workpiece, which forms a space for flowing a coolant between the workpiece and the slice base when the workpiece is adhered; the adhesion surface has an arc-shaped cross-sectional shape corresponding to the diameter of the cross-section of the workpiece.

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