Configuration method of continuous cleaning device and continuous cleaning device

Abstract

To provide a new technology capable of flexibly responding to various specifications required for cleaning devices.SOLUTION: A method for configuring a continuous cleaning device 50 by arranging in any order a plurality of cleaning devices 1 through 3 arbitrarily selected from a plurality of cleaning devices including conveyance units 13, 23, 33 that are capable of conveying a wafer 10 between adjacent cleaning devices 1 through 3, the plurality of cleaning devices capable of performing a different type of cleaning for an object to be cleaned (wafer 10).SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a technique for configuring a continuous cleaning device from a plurality of cleaning devices.

Background Art

[0002] Conventionally, for example, in the manufacturing process of semiconductor devices, various processes such as back grinding, blade cutting, and laser processing are performed on a wafer as a workpiece, and after the processing, it is cleaned to remove the processing debris generated during the processing.

[0003] As cleaning methods, there are various cleaning methods such as high-pressure cleaning with high-pressure fluid, two-fluid cleaning using a mixed fluid of water and air, ultrasonic cleaning, and cleaning with various organic solvents. Depending on the type of workpiece, multiple cleanings are performed (see, for example, Patent Documents 1 to 3).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] As described above, there are various cleaning methods, and the required cleaning level also varies depending on the type of object to be cleaned and the type of processing. Also, the specifications vary depending on the design of the manufacturing line of the factory to be installed and the requirements of the customer.

[0006] Therefore, conventionally, it has been necessary to make a dedicated design to individually meet various requirements. There are problems such as not only the man-hours for the design, but also the low versatility and poor productivity of the dedicatedly designed device. In addition, the lead time from the order of the device to its delivery is prolonged, making it difficult to respond to the requirement for short-term installation.

[0007] Therefore, in view of the above problems, the present invention proposes a novel technology capable of flexibly responding to various specifications required for a cleaning device.

Means for Solving the Problems

[0008] The problems to be solved by the present invention are as described above. Next, the means for solving these problems will be described.

[0009] According to one aspect of the present invention, a continuous cleaning device configuration method is provided by arranging a plurality of cleaning devices arbitrarily selected from a plurality of cleaning devices each including a transport unit capable of transporting an object to be cleaned between adjacent cleaning devices and capable of performing different types of cleaning on the object to be cleaned in an arbitrary order.

[0010] Also, according to one aspect of the present invention, the transport unit is configured to be capable of transporting the object to be cleaned from the cleaning device adjacent upstream to the cleaning device in which the transport unit is provided, and to be capable of transporting the object to be cleaned from the cleaning device in which the transport unit is provided to the cleaning device adjacent downstream.

[0011] Also, according to one aspect of the present invention, the transport unit is configured to include a carry-out unit that carries out the object to be cleaned to the cleaning device adjacent downstream, and a carry-in unit that receives the object to be cleaned from the carry-out unit of the cleaning device adjacent upstream.

[0012] Also, according to one aspect of the present invention, the object to be cleaned is cleaned in a state where it is adhered to a tape and the outer periphery of the tape is fixed to an annular frame, and the transport unit holds the annular frame.

[0013] Further, according to one aspect of the present invention, there is provided a continuous cleaning apparatus including a plurality of cleaning apparatuses each having a conveying unit capable of performing different types of cleaning on an object to be cleaned and conveying the object to be cleaned between adjacent cleaning apparatuses, and each cleaning apparatus is configured to be arranged in an arbitrary order, and is a continuous cleaning apparatus.

Effects of the Invention

[0014] As effects of the present invention, the following effects are achieved.

[0015] That is, according to one aspect of the present invention, a plurality of cleaning apparatuses corresponding to different types of cleaning methods are prepared in advance, the cleaning method and the cleaning order are selected according to the type of the object to be cleaned, and the cleaning apparatuses prepared according to the selected cleaning method and order are connected to constitute a continuous cleaning apparatus. Thereby, a plurality of cleaning steps of different types can be combined in an arbitrary order to constitute one continuous cleaning apparatus, and it is possible to flexibly respond to various specifications required for the cleaning apparatus. In addition, each cleaning apparatus is unitized to achieve commonality of parts, so that versatility and productivity can be increased, and the requirement for installation with a short delivery period can also be met.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0018] FIG. 1 shows a wafer 10 after dicing, which is an example of an object to be cleaned. The wafer 10 is a silicon wafer or the like, and is diced along a dicing line 10s set in a grid pattern and separated into chips 10c. Devices 10d such as ICs and LSIs are formed on the surface of each chip 10c.

[0019] The wafer 10 is disposed inside an annular frame F and is integrally supported by the annular frame F via a tape T to constitute a wafer unit U.

[0020] The tape T is a so-called dicing tape, and a tape having an adhesive layer formed on one side of a base material is used. Examples of the base material include synthetic resin sheets such as polyvinyl chloride, polypropylene, polyethylene, polyethylene terephthalate, and polyolefin. In addition, as the adhesive material for forming the adhesive layer, an ultraviolet curable resin that cures by receiving ultraviolet irradiation is used in addition to pressure-sensitive paste, and the tape T is configured as a pressure-sensitive type or ultraviolet curable type adhesive tape.

[0021] Regarding the dicing process, in the example of FIG. 1, it shows a wafer that has been cut to form a starting point for division. However, in addition to this, other methods such as ablation processing by laser processing or SD processing that forms a modified layer inside the wafer may also be used. Further, the wafer may have been subjected to grinding. Also, as the object to be cleaned, in addition to silicon wafers, glass, resin, ceramics, LT / LN substrates, etc. may also be used. Moreover, the wafer may be handled as a single unit without being fixed to an annular frame.

[0022] FIG. 2 is a schematic plan view showing an example of configuring a continuous cleaning device 50 by combining a plurality of cleaning devices. As shown in FIG. 2, the present invention can perform different types of cleaning on the wafer 10, which is the object to be cleaned, and includes transfer units 13, 23, 33 capable of transferring the wafer 10 between adjacent cleaning devices 1 to 3. The present invention implements a method of configuring a continuous cleaning device 50 by arbitrarily arranging a plurality of cleaning devices 1 to 3 arbitrarily selected from a plurality of cleaning devices.

[0023] In the example of FIG. 2, a continuous cleaning device 50 is configured by combining three cleaning devices: a first cleaning device 1, a second cleaning device 2, and a third cleaning device 3. As shown in FIG. 3, the wafer unit U is transferred in the order of the first cleaning device 1, the second cleaning device 2, and the third cleaning device 3, and is configured to go through a plurality of cleaning steps. Note that the number of cleaning devices is not particularly limited, and the present invention can be implemented by combining at least two cleaning devices.

[0024] As shown in FIG. 2, different cleaning operations are performed in each of the cleaning devices 1 to 3. Examples of the types of cleaning include two-fluid cleaning with a two-fluid mixture of pure water and dry air, high-pressure cleaning, alkaline cleaning, pad cleaning, pure water ultrasonic cleaning, etc.

[0025] FIG. 2 is a schematic plan view of each of the cleaning apparatuses 1 to 3 as seen from above. In the cleaning spaces 11a, 21a, and 31a formed in the housings 11, 21, and 31 of the respective cleaning apparatuses 1 to 3, holding tables 12, 22, and 32 for holding the wafer unit U and rotating it in the horizontal plane are provided respectively. The holding tables 12, 22, and 32 hold the wafer unit U from below to expose the wafer 10 upward, enabling the upper surface of the wafer 10 to be cleaned. In addition to this, as another form of holding the wafer, a form in which the wafer unit U is held so as to be suspended and the wafer 10 is exposed downward for reverse cleaning may also be adopted.

[0026] Each of the cleaning apparatuses 1 to 3 is provided with transfer units 13 to 33 for loading and unloading the wafer unit U with respect to the holding tables 12, 22, and 32 respectively. The transfer unit 13 includes a first turning arm 13a whose base end is supported by the housing 11 so as to be movable up and down and rotatable, a second turning arm 13b connected to the tip of the first turning arm 13a, and a frame holding mechanism 13c suspended from the tip of the second turning arm 13b. Each component is driven by a motor (not shown) to perform angle change and lifting operations. The other transfer units 23 and 33 are configured in the same manner as the transfer unit 13.

[0027] The frame holding mechanism 13c is configured to have suction pads 13e at the tips of four locations of a substantially H-shaped bracket 13d. The suction pads 13e suction-hold the annular frame F of the wafer unit U.

[0028] Each cleaning apparatus is unitized and configured to be able to transfer the wafer unit even when arranged in an arbitrary order. Also, by using common components for the various parts constituting each cleaning apparatus, versatility and productivity can be increased. For example, the housing, transfer unit, holding table, etc. can have a common configuration for each cleaning apparatus, and a configuration considering parts procurement, manufacturing, and maintenance is realized. Further, in order to physically connect and align adjacent cleaning apparatuses, it may be possible to provide an engaging portion for connection and an anchor for positioning on the housing.

[0029] In the above configuration, the wafer unit U is transported as follows. The wafer unit U before cleaning is transported to the holding table 12 by the transport unit 13 of the cleaning device 1. After being cleaned by the cleaning device 1, the wafer unit U is transported from the holding table 12 of the cleaning device 1 to the holding table 22 of the cleaning device 2 by the transport unit 23 of the adjacent cleaning device 2. Similarly, after being cleaned by the cleaning device 2, the wafer unit U is transported from the holding table 22 of the cleaning device 2 to the holding table 32 of the cleaning device 3 by the transport unit 33 of the adjacent cleaning device 3. Similarly, after being cleaned by the cleaning device 3, the wafer unit U is carried out from the holding table 32 of the cleaning device 3 by the transport unit 33 of the cleaning device 3.

[0030] Thus, in the configuration example shown in FIG. 2, for example, the transport unit 23 is configured to be able to transport the object to be cleaned from the cleaning device 1 adjacent upstream to the cleaning device 2 in which the transport unit 23 is provided, and to be able to transport the object to be cleaned from the cleaning device 2 in which the transport unit 23 is provided to the cleaning device 3 adjacent downstream.

[0031] Alternatively, instead of the above, the wafer unit U can also be transported as follows. The wafer unit U before cleaning is transported to the holding table 12 by the transport unit 13 of the cleaning device 1. After being cleaned by the cleaning device 1, the wafer unit U is transported from the holding table 12 of the cleaning device 1 to the holding table 22 of the cleaning device 2 by the transport unit 13 of the cleaning device 1. Similarly, after being cleaned by the cleaning device 2, the wafer unit U is transported from the holding table 22 of the cleaning device 2 to the holding table 32 of the cleaning device 3 by the transport unit 23 of the cleaning device 2. Similarly, after being cleaned by the cleaning device 3, the wafer unit U is carried out from the holding table 32 of the cleaning device 3 by the transport unit 33 of the cleaning device 3. Note that the wafer unit U may be manually carried into the holding table 12 where the first cleaning is performed by an operator.

[0032] FIG. 4 is a diagram showing an example of configuring a continuous cleaning apparatus 50A by combining cleaning apparatuses 1A to 3A provided with temporary placement tables 15, 25, and 35 for temporarily placing a wafer unit U.

[0033] In this example, for each of the cleaning apparatuses 1A to 3A, temporary placement tables 15, 25, and 35 for temporarily placing the wafer unit U are provided, and when moving between the cleaning apparatuses, the wafer unit U is temporarily placed and the wafer unit U is transferred between the cleaning apparatuses.

[0034] The cleaning apparatus 1A is provided with a loading unit 13A for loading and an unloading unit 13B for unloading. The loading unit 13A includes a first turning arm 13Aa, a second turning arm 13Ab connected to the tip of the first turning arm 13Aa, and a frame holding mechanism 13Ac suspended from the tip of the second turning arm 13Ab for sucking and holding the annular frame F. The other loading units 23A and 33A are configured in the same manner as the loading unit 13A.

[0035] The unloading unit 13B includes a first turning arm 13Ba, a second turning arm 13Bb connected to the tip of the first turning arm 13Ba, and a frame holding mechanism 13Bc suspended from the tip of the second turning arm 13Bb for sucking and holding the annular frame F. The other unloading units 23B and 33B are configured in the same manner as the unloading unit 13B.

[0036] In the above configuration, the wafer unit U is transported as follows. The pre - cleaning wafer unit U carried into the temporary table 15 is conveyed to the holding table 12A by the loading unit 13A of the cleaning device 1A. After being cleaned by the cleaning device 1A, the wafer unit U is carried out to the temporary table 25 of the adjacent cleaning device 2A by the unloading unit 13B of the cleaning device 1A. Similarly, it is conveyed to the holding table 22A by the loading unit 23A of the cleaning device 2A. After being cleaned by the cleaning device 2A, the wafer unit U is carried out to the temporary table 35 of the adjacent cleaning device 3A by the unloading unit 33B of the cleaning device 2A. Similarly, it is conveyed to the holding table 32A by the loading unit 33A of the cleaning device 3A. After being cleaned by the cleaning device 3A, the wafer unit U is carried out from the holding table 32A of the cleaning device 3A by the unloading unit 33B of the cleaning device 3A.

[0037] In addition, in the configuration shown in FIG. 2, it may be configured to provide a temporary table. That is, temporary tables are provided in the most upstream cleaning device 1 and the most downstream cleaning device 3, and there is no temporary table in the intermediate cleaning device 2. The object to be cleaned (wafer unit U) supplied to the continuous cleaning device 50 is carried in through the temporary table of the most upstream cleaning device 1, and the object to be cleaned (wafer unit U) cleaned by the continuous cleaning device 50 may be carried out to the temporary table of the most downstream cleaning device 3. Alternatively, also in the configuration shown in FIG. 4, temporary tables may be provided in the most upstream cleaning device 1 and the most downstream cleaning device 3, and there may be no temporary table in the intermediate cleaning device 2. In this case, the unloading unit 13B of the cleaning device 1A and the loading unit 23A of the cleaning device 2A are configured to enable the transfer of the object to be cleaned (wafer unit U).

[0038] FIG. 5 is a diagram showing a combined cleaning device 50B applied when the wafer 10 is handled individually.

[0039] The cleaning device 1B includes a loading unit 13C having a Bernoulli pad 13v for non - contact holding of the upper surface side of the wafer 10, and an unloading unit 13D having a suction arm 13w for holding the lower surface of the wafer 10. The loading unit 13C and the unloading unit 13D are each configured to be movable up and down and rotatable. The cleaning devices 2B and 3B are similarly configured.

[0040] The holding table 12B of the cleaning device 1B is configured to have a diameter smaller than that of the wafer 10. By inserting the U - shaped tip of the suction arm 13w into the support shaft of the holding table 12B from below and moving it upward, the wafer 10 held on the holding table 12B can be lifted and held by the unloading unit 13D.

[0041] The wafer 10 placed on the suction arm 13w is adsorbed and held by the loading unit 23C of the adjacent cleaning device 2B and transferred. Thus, in the configuration of FIG. 4, between adjacent cleaning devices, the wafer 10 is transferred by the unloading unit 13D and the loading unit 23C.

[0042] Thus, in the configuration example shown in FIG. 5, for example, in the cleaning device 2B, the transfer unit includes an unloading unit 23D that unloads the object to be cleaned to the adjacent downstream cleaning device 3B, and a loading unit 23C that receives the object to be cleaned from the unloading unit 13D of the adjacent upstream cleaning device 1B.

[0043] As described above, by sequentially combining a plurality of cleaning devices, a single continuous cleaning device 50 as shown in FIG. 1 is configured. In the example of FIG. 1, four types of cleaning devices for performing different cleanings are prepared, and three types of cleaning devices 1 - 3 for performing the necessary cleaning are selected from them to configure a single continuous cleaning device 50.

[0044] In the example of FIG. 3, cleaning devices 1 - 3 are selected, and pad cleaning, alkaline cleaning, and two - fluid cleaning are performed in sequence. Each cleaning will be described below.

[0045] Figures 6(A) and 6(B) are diagrams for explaining the pad cleaning by the cleaning device 1. This pad cleaning is performed by the first cleaning device 1 shown in FIG. 3. First, the configuration of the cleaning device 1 will be described. Inside the housing 11, a cleaning receiving container 61 with an open upper side is provided, and a holding table 12 is rotatably provided inside the cleaning receiving container 61. The holding table 12 is fixed to the upper end of the output shaft 64 of the electric motor 62 and rotates at a predetermined rotational speed.

[0046] The upper surface of the holding table 12 is configured as a suction surface to which a suction source (not shown) is connected to generate a negative pressure, and the wafer 10 is suction-held via the tape T. Note that the wafer 10 shows a state where dicing processing has been performed.

[0047] Clamps 12a are provided at equal intervals in the circumferential direction at the peripheral edge of the holding table 12. Due to the centrifugal force generated by the rotation of the holding table 12, the clamps 12a are tilted, and the annular frame F of the wafer unit U is fixed by the clamps 12a.

[0048] Inside the cleaning receiving container 61 and outside the holding table 12, a slurry supply nozzle 71 for supplying a slurry 71a containing abrasive grains to the upper surface of the wafer 10, such as hydrogen peroxide water, organic acid, and preservative, is provided.

[0049] Inside the cleaning receiving container 61 and outside the holding table 12, a plurality of turning shafts 65a and 65b are provided, and motors 66a and 66b for rotating the respective turning shafts 65a and 65b are provided at the lower part of the cleaning receiving container 61.

[0050] As shown in FIG. 6(A), a turning arm 72 is fixed to the upper end of the turning shaft 65a so as to extend horizontally, and a pad 72a made of non-woven fabric or foamed urethane that contacts the upper surface of the wafer 10 is provided at the tip of the turning arm 72. Note that the turning shaft 65a may be configured to be vertically movable and may be configured to be able to change the contact pressure of the pad 72a against the upper surface of the wafer 10.

[0051] As shown in FIG. 6(B), a turning arm 73 is fixed to the upper end of the turning shaft 65b so as to extend in the horizontal direction, and a pure water supply nozzle 73a for supplying pure water 73b to the upper surface of the wafer 10 is provided at the tip of the turning arm 73.

[0052] With the above configuration, first, as shown in FIG. 6(A), the tape T of the wafer unit U is sucked and held by the holding table 12, and by rotating the holding table 12, the annular frame F is fixed by the clamp 12a. Next, while supplying the slurry 71a from the slurry supply nozzle 71, the turning arm 72 is turned while pressing the pad 72a against the upper surface of the wafer 10, so that the upper surface of the wafer 10 is cleaned by the pad 72a.

[0053] After cleaning with the pad 72a, as shown in FIG. 6(B), while supplying pure water 73b from the pure water supply nozzle 73a to the upper surface of the wafer 10, the turning arm 73 is turned, so that the upper surface of the wafer 10 is cleaned with the pure water 73b.

[0054] After the pad cleaning is performed, as shown in FIG. 3, it is conveyed to the cleaning device 2 and alkali cleaning is performed. FIG. 7 is a diagram for explaining the alkali cleaning by the cleaning device 2. This alkali cleaning is performed by the second cleaning device 2 shown in FIG. 3.

[0055] In the cleaning device 2, a turning arm 74 is fixed to the upper end of the turning shaft 65c so as to extend in the horizontal direction, and a sponge 74a that contacts the upper surface of the wafer 10 is provided at the tip of the turning arm 74. A supply path for the alkaline water 74b is provided inside the turning arm 74, and the alkaline water 74b is configured to be discharged from the inside of the sponge 74a. Since the other configurations are substantially the same as those in FIG. 6(A), the description thereof is omitted.

[0056] With the above configuration, the tape T of the wafer unit U is sucked and held by the holding table 12, and by rotating the holding table 12, the annular frame F is fixed by the clamp 12a. Next, while supplying alkaline water from the center of the sponge 74a, the turning arm 74 is turned while pressing the sponge 74a against the upper surface of the wafer 10, so that the upper surface of the wafer 10 is washed with the alkaline water 74b.

[0057] After the alkaline cleaning is performed, as shown in FIG. 3, it is transported to the cleaning device 3 and two-fluid cleaning is performed. FIG. 8 is a diagram for explaining two-fluid cleaning by the cleaning device 3. This two-fluid cleaning is performed by the third cleaning device 3 shown in FIG. 3.

[0058] In the cleaning device 3, a turning arm 75 is fixed to the upper end of the turning shaft 65d so as to extend in the horizontal direction, and a two-fluid supply nozzle 75a for supplying two fluids to the upper surface of the wafer 10 is provided at the tip of the turning arm 75. A supply path for the two fluids 75b is provided in the turning arm 75, and the two fluids 75b are configured to be ejected from the two-fluid supply nozzle 75a. The two fluids 75b are a mixture of air and cleaning water (for example, pure water) by merging the cleaning water into the air flow. Since the other configurations are substantially the same as those in FIG. 6(A), the description thereof is omitted.

[0059] In the configuration described above, for example, a continuous cleaning device can be configured as follows. As shown in FIG. 1, a preparation step of preparing a plurality of cleaning devices for performing different types of cleaning on the object to be cleaned, two or more types of cleaning to be performed on the workpiece, and a selection step of selecting the order of each cleaning, and an assembly step of arranging the cleaning devices so that the workpiece is transported based on the selection step to configure a continuous cleaning device composed of a plurality of cleaning devices are implemented.

[0060] In this way, a plurality of cleaning devices corresponding to different types of cleaning methods are prepared in advance. According to the type of the object to be cleaned, the cleaning method and the cleaning order are selected, and the cleaning devices prepared in advance are connected according to the selected cleaning method and order, thereby constituting a continuous cleaning device. As a result, a plurality of cleaning steps of different types can be combined in an arbitrary order to constitute a single continuous cleaning device, and it becomes possible to flexibly respond to various specifications required for the cleaning device. In addition, by unitizing each cleaning device and achieving commonality of parts, versatility and productivity can also be increased, and the requirement for installation with a short delivery period can also be met.

Explanation of Signs

[0061] 1 First cleaning device 2 Second cleaning device 3 Third cleaning device 10 Wafer 10c Chip 11 Housing 1 2 Holding table 13 Conveying unit 13a First turning arm 13b Second turning arm 13c Frame holding mechanism 13d Bracket 13e Suction pad 13v Suction pad 13w Suction arm 15 Temporary table 22 Holding table 23 Conveying unit 25 Temporary table 32 Holding table 33 Conveying unit 35 Temporary table 50 Cleaning device 61 Cleaning receiving container 62 Electric motor 64 Output shaft 65a Swivel shaft 65b Swivel shaft 65c Swivel shaft 65d Swivel shaft 66a Motor 66b motor 71 slurry supply nozzle 71a slurry 72 swivel arm 72a pad 73 swivel arm 73a pure water supply nozzle 73b pure water 74 swivel arm 74a sponge 74b alkaline water 75 swivel arm 75a fluid supply nozzle 75b two-fluid T tape U wafer unit

Claims

1. A method for configuring a continuous cleaning apparatus, comprising arranging a plurality of cleaning apparatuses arbitrarily selected from a plurality of cleaning apparatuses each capable of performing different types of cleaning on an object to be cleaned and having a transfer unit capable of transferring the object to be cleaned between adjacent cleaning apparatuses in an arbitrary order, wherein each transfer unit is provided in each cleaning apparatus and operates individually to enable transfer of the object to be cleaned between adjacent cleaning apparatuses.

2. The transfer unit is configured such that it is possible to transfer the object to be cleaned from a cleaning apparatus adjacent upstream to the cleaning apparatus in which the transfer unit is provided, and it is possible to transfer the object to be cleaned from the cleaning apparatus in which the transfer unit is provided to a cleaning apparatus adjacent downstream. The method for configuring a continuous cleaning apparatus according to claim 1, characterized in that.

3. The transfer unit comprises a carry-out unit that holds and carries out the object to be cleaned to a cleaning apparatus adjacent downstream, and a carry-in unit that receives the object to be cleaned from the carry-out unit of a cleaning apparatus adjacent upstream and holds the object to be cleaned. The method for configuring a continuous cleaning apparatus according to claim 1, characterized in that it is configured to have. The method for configuring a continuous cleaning apparatus according to claim 1, characterized in that.

4. The object to be cleaned is cleaned in a state where it is adhered to a tape and the outer periphery of the tape is fixed to an annular frame, and the transfer unit holds the annular frame. The method for configuring a continuous cleaning apparatus according to any one of claims 1 to 3, characterized in that.

5. A continuous cleaning apparatus comprising a plurality of cleaning apparatuses each capable of performing different types of cleaning on an object to be cleaned and having a transfer unit capable of transferring the object to be cleaned between adjacent cleaning apparatuses, wherein each cleaning apparatus is configured to be arranged in an arbitrary order, and the transfer unit operates individually to enable transfer of the object to be cleaned between adjacent cleaning apparatuses.

6. The transfer unit is configured such that it is possible to transfer the object to be cleaned from a cleaning apparatus adjacent upstream to the cleaning apparatus in which the transfer unit is provided, and it is possible to transfer the object to be cleaned from the cleaning apparatus in which the transfer unit is provided to a cleaning apparatus adjacent downstream. The continuous cleaning apparatus according to claim 5, characterized in that.

7. The transfer unit comprises a carry-out unit that holds and carries out the object to be cleaned to a cleaning apparatus adjacent downstream, and A carrying-in unit that receives the object to be cleaned from the carrying-out unit of the cleaning device adjacent to the upstream side and holds the object to be cleaned; Comprising; The continuous cleaning device according to claim 6, characterized in that.

8. The object to be cleaned is adhered to a tape and cleaned in a state where the outer periphery of the tape is fixed to an annular frame; The conveying unit holds the annular frame; The continuous cleaning device according to any one of claims 5 to 7, characterized in that.

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