Cooling Method and Apparatus for Diamond Dresser

Abstract

To provide a cooling device of a diamond dresser which can suppress heat degradation and abrasion of a longitudinal diamond without reducing holding force of the longitudinal diamond.SOLUTION: A cooling device of a diamond dresser comprises: a dresser holder 24 which is attached via a heat insulation material 22 to a dresser anchor block 20 of a grinder 10 and holds a metallic support body 40 in a buried state; and a cooling module 26 which includes an endothermic part brought into close contact with the metallic support body 40 and directly cools the metallic support body 40 during dressing. Since a longitudinal diamond 38 is cooled by cooling the metallic support body 40 of the diamond dresser 18 with the cooling module 26 during dressing, holding force of the longitudinal diamond 38 whose base end is buried in the metallic support body 40 is not reduced and heat degradation and abrasion of the longitudinal diamond 38 are suppressed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a cooling method and apparatus for cooling a diamond dresser during dressing of a grinding wheel.

Background Art

[0002] In a dressing operation for dressing or shape correction of a grinding surface of a grinding wheel or a grinding wheel using a diamond dresser, thermal degradation and wear of the diamond may be promoted due to generation of high heat by frictional heat.

[0003] In contrast, a diamond dresser having a side surface of a longitudinal diamond that functions as a diamond grinding piece exposed so that a coolant can be directly supplied to the diamond grinding piece has been proposed. For example, the diamond dressers described in Patent Document 1 and Patent Document 2 are such.

[0004] Such a diamond dresser having the entire side surface of the diamond grinding piece exposed has an advantage that the cooling effect of the longitudinal diamond is promoted because the area of the diamond grinding piece in contact with the coolant is increased, and deterioration of the longitudinal diamond due to insufficient cooling is suppressed.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the conventional diamond dresser described above, the side surface of the diamond abrasive grain is exposed, and the other three side surfaces hold the diamond abrasive grain by a support body via a metal bond layer at the embedded portion. Therefore, sufficient holding force for the diamond dresser cannot be obtained, and there is a possibility that the diamond abrasive grain may fall off.

[0007] The present invention has been made in view of the above circumstances, and an object thereof is to provide a cooling method and apparatus for a diamond dresser that can suppress thermal deterioration and wear of diamond abrasive grains without reducing the holding force of the diamond abrasive grains.

Means for Solving the Problems

[0008] As a result of various studies by the present inventors in view of the above circumstances, paying attention to the fact that diamond has a thermal conductivity several times higher than that of metals, when the support body that supports the diamond is cooled, the temperature of the diamond during grinding preferably decreases without exposing the side surface of the diamond and reducing its holding force. The present invention has been made based on such findings.

[0009] That is, the gist of the first invention is a cooling method for a diamond dresser including: (a) a diamond abrasive grain and a metal support body that supports the elongated diamond in a state where a part of the diamond abrasive grain is exposed and the other part is embedded, and that dresses the grinding surface of a grinding wheel, the method including: (b) a support body holding step of holding the metal support body in a dresser holder attached to a dresser fixing base of a grinding machine in a heat-insulated state; and (c) a support body cooling step of cooling the metal support body by bringing a heat-absorbing portion of a cooling device into close contact with the metal support body during the dressing.

[0010] The gist of the second invention is as follows: (a) a diamond dressing tool for dressing the grinding surface of a grinding wheel, comprising a diamond grinding grain and a metal support for supporting the diamond grinding grain in a state where a part of the diamond grinding grain is exposed and the other part is embedded; (b) a dresser holder mounted on a dresser fixing base of a grinding machine via a heat insulating material for holding the metal support; and (c) a cooling module having a heat absorbing portion in close contact with the metal support for directly cooling the metal support during dressing.

[0011] The gist of the third invention is that, in the second invention, the cooling module is a plate-shaped Peltier module including a Peltier element including a p-type semiconductor and an n-type semiconductor connected by a metal conductor, the heat absorbing portion formed at a portion where a direct current flows from the n-type semiconductor to the p-type semiconductor, and a heat radiating portion formed at a portion where the direct current flows from the p-type semiconductor to the n-type semiconductor and located on the back surface of the heat absorbing portion.

[0012] The gist of the fourth invention is that, in the third invention, a heat exchanger through which a refrigerant is circulated is mounted in close contact with the heat radiating portion of the plate-shaped Peltier module.

[0013] The gist of the fifth invention is that, in the fourth invention, a refrigerant circulation device for supplying the refrigerant to the heat exchanger is provided.

[0014] The gist of the sixth invention is that, in the third invention, the diamond dressing tool is provided with a temperature sensor for detecting the temperature of the diamond grinding grain, and a temperature control device for controlling the direct current supplied to the Peltier element so that the temperature of the diamond dressing tool becomes equal to or lower than a preset temperature.

Advantages of the Invention

[0015] According to the cooling device method of the diamond dresser of the first invention, in the support holding step, the metal support of the diamond dresser is held by a dresser holder mounted in a heat-insulated state on the dresser fixing base of the grinding wheel. In the support cooling step, during dressing, the heat absorption part of the cooling module is brought into close contact with the metal support. As a result, during dressing, the metal support of the diamond dresser is cooled by the cooling module, so that the diamond grinding pieces are cooled. Therefore, the heat deterioration and wear of the diamond grinding pieces are suppressed without reducing the holding force of the diamond grinding pieces.

[0016] According to the cooling device of the diamond dresser of the second invention, it includes a dresser holder mounted on the dresser fixing base of the grinding wheel via a heat insulating material and holding the metal support, and a cooling module having a heat absorption part brought into close contact with the metal support and directly cooling the metal support during dressing. As a result, during dressing, the metal support of the diamond dresser is cooled by the cooling module, so that the diamond grinding pieces are cooled. Therefore, the heat deterioration and wear of the diamond grinding pieces are suppressed without reducing the holding force of the diamond grinding pieces.

[0017] According to the cooling device of the diamond dresser of the third invention, the cooling module is a plate-shaped Peltier module including a Peltier element including a p-type semiconductor and an n-type semiconductor connected by a metal conductor, a heat absorption part formed at a portion where a direct current flows from the n-type semiconductor to the p-type semiconductor, and a heat dissipation part formed at a portion where the direct current flows from the p-type semiconductor to the n-type semiconductor and located on the back surface of the heat absorption part. As a result, when a direct current is supplied to the cooling module, the metal support of the diamond dresser is cooled by the cooling module.

[0018] According to the cooling device of the diamond dresser of the fourth invention, a heat exchanger through which a refrigerant circulates is mounted in close contact with the heat dissipation part of the plate-shaped Peltier module. As a result, since the heat dissipation part of the plate-shaped Peltier module is cooled by the refrigerant of the heat exchanger, heat absorption at the heat absorption part of the plate-shaped Peltier module is continuously performed.

[0019] According to the cooling device of the diamond dresser of the fifth invention, since a refrigerant circulation device for supplying a refrigerant to the heat exchanger is provided, the refrigerant is continuously supplied to the heat exchanger.

[0020] According to the cooling device of the diamond dresser of the sixth invention, the diamond dresser is provided with a temperature sensor for detecting the temperature of the diamond abrasive grains, and a temperature control device for controlling the direct current supplied to the Peltier element so that the temperature of the diamond dresser becomes equal to or lower than a preset temperature. As a result, since the temperature of the diamond dresser is maintained at or below the preset temperature, the dressing performance by the diamond dresser is stabilized.

Brief Description of the Drawings

[0021]

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BEST MODE FOR CARRYING OUT THE INVENTION

[0022] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following embodiments, the drawings illustrate the main parts related to the invention, and dimensions, shapes, etc. are not necessarily drawn accurately.

EXAMPLE

[0023] In FIG. 1, the grinding machine 10 includes a circular grinding wheel 12 that is rotationally driven about a horizontal rotation center line CL by a motor (not shown), and a cooling device 16 for a diamond dresser 18. The outer peripheral surface 14 of the grinding wheel 12 functions as a grinding surface for grinding a workpiece (not shown), and the cooling device 16 for the diamond dresser 18 cools the diamond dresser 18 during dressing for truing or shape correction of the outer peripheral surface 14 of the grinding wheel 12.

[0024] The grinding machine 10 includes a dresser fixing base 20 for fixing the diamond dresser 18 on an x-axis moving table (not shown) that moves in a direction parallel to the rotation center line CL.

[0025] As shown in the front view of FIG. 2 and the plan view of FIG. 3, the cooling device 16 for the diamond dresser 18 includes the diamond dresser 18, a dresser holder 24 that is fixed to the dresser fixing base 20 of the grinding machine 10 via a heat insulating material 22 and supports the diamond dresser 18, a flat cooling module 26 that is brought into close contact with the diamond dresser 18, a heat exchanger 28 that is brought into close contact with the side of the cooling module 26 opposite to the diamond dresser 18, a pressing plate 32 that sandwiches the diamond dresser 18, the cooling module 26, and the heat exchanger 28 between the pressing plate 32 and the dresser holder 24 using three fastening bolts 30 screwed into the dresser holder 24, and a refrigerant circulation device 36 that is connected to the heat exchanger 28 via a pipeline 34 and continuously supplies a refrigerant 48 such as cold water.

[0026] The heat insulating material 22 is made of a material having high heat insulation and relatively high rigidity, such as a high-density wooden board, a resin board, or a sintered metal with a high porosity.

[0027] As shown in FIGS. 4 and 5, the diamond dresser 18 is a so-called single crystal dresser, and includes a longitudinal diamond 38 having a longitudinal shape as a diamond abrasive grain, and a longitudinal and columnar metal support 40 that supports the base end portion of the longitudinal diamond 38 in an embedded state with the tip end portion of the longitudinal diamond 38 protruding in an exposed state. And a longitudinal close contact surface 42 in which the side portion of the metal support 40 is flatly cut out for close contact with the cooling module 26, and a pair of screw holes 46 into which a pair of dresser fixing bolts 44 are screwed through the dresser holder 24. The longitudinal diamond 38 of the present embodiment is a single crystal or polycrystalline columnar diamond having a rectangular or polygonal cross section. The metal support 40 is made of an iron-based material such as tool steel, for example.

[0028] As shown in FIG. 5, the diamond dresser 18 is provided with a temperature sensor 50 for detecting the temperature of the longitudinal diamond 38. The temperature sensor 50 includes a thermocouple 52 whose tip contacts the base end portion of the longitudinal diamond 38, and a temperature detection circuit 54 that detects the temperature of the portion where the tip of the thermocouple 52 contacts and outputs a temperature signal ST in accordance with the electromotive force of the thermocouple 52.

[0029] The longitudinal diamond 38 is fixed to the metal support 40 by a metal bond made of, for example, an active brazing material in a mounting hole formed in the tip surface of the diamond dresser 18. This active brazing material is composed of an Ag—Cu—Ti system, an Au—Ni—Cr system, or an Ag—Cu—Ti—In system. Preferably, a thermal stress relaxation layer in which the boundary between the metal bond and the longitudinal diamond 38 and metal elements contained in the active brazing material that form carbides with the longitudinal diamond 38 are concentrated is provided.

[0030] As shown in FIG. 6, the cooling module 26 includes a flat box-shaped case 56, a pair of ceramic substrates 58 and 60, and a Peltier element 68 including a p-type semiconductor 64 and an n-type semiconductor 66 that are serially connected by conductor films 62 that function as metal conductors formed on the surfaces of the pair of ceramic substrates 58 and 60, respectively. The Peltier module is a plate-shaped module including an endothermic portion (ceramic substrate 58) configured in a portion where the direct current ID flows from the n-type semiconductor 66 to the p-type semiconductor 64, and a heat dissipation portion (ceramic substrate 60) configured in a portion where the direct current ID flows from the p-type semiconductor 64 to the n-type semiconductor 66 and located on the back surface of the endothermic portion.

[0031] As shown in FIG. 7, the heat exchanger 28 includes a main body 69 made of metal such as an aluminum alloy or a copper alloy, and a refrigerant passage 70 formed in the main body 69 and connected to the refrigerant circulation device 36 via a pipeline 34, and the refrigerant 48 is circulated by being sent from the refrigerant circulation device 36. The refrigerant circulation device 36 is provided with a temperature control device 72 that controls the direct current ID supplied to the Peltier element 68 so that the temperature of the diamond dresser 18, specifically the temperature of the longitudinal diamond 38, becomes equal to or lower than a preset temperature. The temperature control device 72 controls the temperature and / or flow rate of the refrigerant 48 based on the temperature signal ST from the temperature control temperature sensor 50 so that the temperature of the longitudinal diamond 38 becomes equal to or lower than the preset temperature. The preset temperature is, for example, 25°C, preferably 5°C.

[0032] Next, in order to confirm the cooling effect of the longitudinal diamond 38, the results of grinding tests 1 and 2 conducted by the inventors under the following grinding test conditions will be described. (Grinding Conditions for Grinding Test 1) Grinding wheel: WA60K8V Machine: Surface grinder Dressing method: Dry traverse Peripheral speed of grinding wheel: 30 m / s Dresser: 0.6 mm square column diamond single crystal dresser Dressing lead: 0.1 mm / rev. Dressing depth of cut: 10 μm / pass Coolant set temperature: 5°C Thermocouple: K-type thermocouple Sampling period: 100 ms

[0033] Figure 8 shows the measured temperature changes of the longitudinal diamond 38 during dressing for the case without cooling by the cooling module 26 and the case with cooling by the cooling module 26, respectively, along the time axis of dressing. Compared with the case without cooling by the cooling module 26, the temperature is lower in the case with cooling by the cooling module 26.

[0034] Figure 9 is a bar graph showing the measured temperatures of the longitudinal diamond 38 at the end of dressing for the case without cooling by the cooling module 26 and the case with cooling by the cooling module 26, respectively, for comparison. Compared with the case without cooling by the cooling module 26, a result 53°C lower was obtained in the case with cooling by the cooling module 26.

[0035] Figure 10 shows the cross-sectional shape of the outer peripheral surface (grinding surface) 14 of the grinding wheel 12 after dressing for the case without cooling by the cooling module 26, and Figure 11 shows the cross-sectional shape of the outer peripheral surface 14 of the grinding wheel 12 after dressing for the case with cooling by the cooling module 26. In the case without cooling by the cooling module 26 in Figure 10, the waviness was 0.0024 mm, whereas in the case with cooling by the cooling module 26 in Figure 11, the waviness was 0.0015 mm, and the waviness decreased by 37% compared to the case of Figure 10. That is, the cooling of the diamond dresser 18 by the cooling module 26 stabilized the dressing performance.

[0036] (Grinding conditions for grinding test 2) Grinding wheel: WA60J8V Machine: Surface grinding machine Dressing method: Dry traverse Peripheral speed of grinding wheel: 30 m / s Dresser: 0.6 mm Square Prism Monocrystalline Diamond Dresser Dressing Feed: 0.1 mm / rev. Dressing Depth of Cut: 10 μm / pass Coolant Set Temperature: 23°C Thermocouple: K-Type Thermocouple Sampling Period: 100 ms

[0037] The grinding conditions for grinding test 2 are different from those for grinding test 1 in that the bond strength (hardness) of the grinding wheel changed from K to J, which is harder than K, and the coolant set temperature changed from 5°C to 23°C, while the others are the same.

[0038] Figure 12 is a bar graph showing a comparison of the measured temperatures of the longitudinal diamond 38 at the end of dressing for the case without cooling by the cooling module 26 and the case with cooling by the cooling module 26. A result that was 13.8°C lower was obtained at the end of dressing in the case with cooling by the cooling module 26 compared to the case without cooling by the cooling module 26.

[0039] Figure 13 shows the cross-sectional shape of the outer peripheral surface (grinding surface) 14 of the grinding wheel 12 after dressing in the case without cooling by the cooling module 26, and Figure 14 shows the cross-sectional shape of the outer peripheral surface 14 of the grinding wheel 12 after dressing in the case with cooling by the cooling module 26. In the case without cooling by the cooling module 26 in Figure 13, there was a warp of 0.0007 mm on the positive side and 0.0020 mm on the negative side, whereas in the case with cooling by the cooling module 26 in Figure 14, there was a warp of 0.0010 mm on the positive side and 0.000 mm on the negative side. In the case with cooling by the cooling module 26 in Figure 14, the amplitude of the warp was 0.0010 mm, and the amplitude of the warp decreased by 67% compared to the case in Figure 13. That is, the dressing performance was stabilized by cooling the diamond dresser 18 with the cooling module 26.

[0040] As described above, according to the cooling device 16 of the diamond dresser 18 of the present embodiment, in the support holding step, the metal support 40 of the diamond dresser 18 is held by the dresser holder 24 mounted in a heat-insulated state with respect to the dresser fixing base 20 of the grinding wheel 10. In the support cooling step, during dressing, the heat absorption part of the cooling module 26 is brought into close contact with the metal support 40. As a result, during dressing, the metal support 40 of the diamond dresser 18 is cooled by the cooling module 26, so that the longitudinal diamond 38 is cooled. Therefore, the longitudinal diamond 38 with the base end portion embedded in the metal support 40 does not have its holding force reduced, and thermal deterioration and wear of the longitudinal diamond 38 are suppressed.

[0041] According to the cooling device 16 of the diamond dresser 18 of the present embodiment, there are included a dresser holder 24 that is mounted via a heat insulating material 22 with respect to the dresser fixing base 20 of the grinding wheel 10 and holds the metal support 40 in an embedded state, and a cooling module 26 that has a heat absorption part brought into close contact with the metal support 40 and directly cools the metal support 40 during dressing. As a result, during dressing, the metal support 40 of the diamond dresser 18 is cooled by the cooling module 26, so that the longitudinal diamond 38 is cooled. Therefore, the longitudinal diamond 38 with the base end portion embedded in the metal support 40 does not have its holding force reduced, and thermal deterioration and wear of the longitudinal diamond 38 are suppressed.

[0042] According to the cooling device 16 of the diamond dresser 18 of the present embodiment, the cooling module 26 is a plate-shaped Peltier module including a Peltier element 68 including a p-type semiconductor 64 and an n-type semiconductor 66 connected in series by a conductor film (metal conductor) 62, a heat absorption part (ceramics substrate 58) configured in a part where the direct current ID goes from the n-type semiconductor 66 to the p-type semiconductor 64, and a heat radiation part (ceramics substrate 60) configured in a part where the direct current ID goes from the p-type semiconductor 64 to the n-type semiconductor 66 and located on the back surface of the heat absorption part. As a result, by supplying a direct current to the cooling module 26, the metal support 40 of the diamond dresser 18 is cooled by the cooling module 26

[0043] According to the cooling device 16 of the diamond dresser 18 of this embodiment, a heat exchanger 28 through which a refrigerant 48 is circulated is mounted in close contact with a heat radiation part of a plate-shaped cooling module (Peltier module) 26. Thereby, since the heat radiation part of the plate-shaped cooling module 26 is cooled by the refrigerant 48 of the heat exchanger 29, heat absorption at the heat absorption part of the plate-shaped cooling module 26 is continuously performed.

[0044] According to the cooling device 16 of the diamond dresser 18 of this embodiment, since a refrigerant circulation device 36 for supplying the refrigerant 48 to the heat exchanger 28 is provided, the refrigerant is continuously supplied to the heat exchanger 28.

[0045] According to the cooling device 16 of the diamond dresser 18 of this embodiment, the diamond dresser 18 is provided with a temperature sensor 50 for detecting the temperature of the longitudinal diamond 38, and a temperature control device 70 for controlling a direct current supplied to the Peltier element so that the temperature of the diamond dresser 18 becomes a preset temperature or lower than that temperature. Thereby, since the temperature of the diamond dresser 18 is maintained at a preset temperature or lower, the dressing performance by the diamond dresser 18 is stabilized.

[0046] FIG. 15 shows a diamond dresser 78 of another example. The diamond dresser 78 of this embodiment is different in that a metal support 40 includes a core material 80 such as a copper alloy or an aluminum alloy having a thermal conductivity about 5 times higher than that of tool steel, and the rest is the same. The core material 80 is exposed on the adhesion surface 42 and is adapted to be in close contact with the cooling module 26. Further, the core material 80 has an overall length longer than the adhesion surface 42, and its upper end surface is adapted to contact or be close to the longitudinal diamond 38. According to this embodiment, a high cooling effect can be obtained for the longitudinal diamond 38. Incidentally, the thermal conductivity of the longitudinal diamond 38 is about 10 times that of tool steel.

[0047] As described above, one embodiment of the present invention has been described with reference to the drawings, but the present invention is also applicable to other aspects.

[0048] For example, the diamond dresser 18 in the above-described embodiment dresses the outer peripheral surface 14 of the grinding wheel 12 that rotates around the horizontal first rotation center line CL1, but it may also dress the flat end face of the grinding wheel 12.

[0049] Further, the diamond dresser 18 in the above-described embodiment is a single-stone dresser in which one longitudinal diamond 38 is embedded in the end portion of the metal support 40, but it may be a blade-type multi-stone dresser in which a plurality of longitudinal diamonds 38 are embedded in the end portion of the metal support 40 in a parallel state.

[0050] Further, in the diamond dresser 18 of the above-described embodiment, the tip of the longitudinal diamond 38 protrudes from the end of the metal support 40 and the tip of the longitudinal diamond 38 is embedded in the end of the metal support 40, but the entire longitudinal diamond 38 may be embedded in the end of the metal support 40 and the end face of the longitudinal diamond 38 may be flush with the end of the metal support 40 and exposed.

[0051] Further, the diamond dresser 18 in the above-described embodiment includes the longitudinal diamond 38 that functions as a diamond grinding piece for roughening or shaping the outer peripheral surface 14 of the grinding wheel 12 using diamond, but instead of the longitudinal diamond 38, rice-grain-shaped diamonds may be used. Also, diamond grinding pieces used for an AD forming dresser composed of natural diamonds with one end formed into a polygon, diamond grinding pieces used for a grid dresser in which a large number of diamond particles are bonded by a metal bond, and diamond grinding pieces used for an in-process dresser in which diamond powder of #50 to #400 is dispersed in a metal bond may be used.

[0052] In the above-described embodiment, the heat exchanger 28 through which the refrigerant 48 is circulated was closely attached to the heat radiation side of the cooling module 26. However, instead of the heat exchanger 28, a heat sink, a heat pipe, a cooling fan, etc. may be provided.

[0053] Also, grease or the like for enhancing heat conductivity may be applied between the contact surface 42 of the cooling module 26 and the diamond dresser 18 and / or between the heat exchanger 28 in the above-described embodiment.

[0054] Note that what has been described above is merely an embodiment of the present invention, and various modifications can be made to the present invention without departing from the gist thereof.

Explanation of Reference Numerals

[0055] 10: Grinding machine 12: Grinding wheel 14: Outer peripheral surface 18, 78: Diamond dresser 20: Dresser fixing base 22: Heat insulating material 24: Dresser holder 26: Cooling module 28: Heat exchanger 36: Refrigerant circulation device 38: Longitudinal diamond (diamond grinding piece) 40: Metal support 42: Contact surface 48: Refrigerant 50: Temperature sensor 58: Ceramic substrate (heat absorption part) 60: Ceramic substrate (heat radiation part) 62: Conductor film (metal conductor) 64: p-type semiconductor 66: n-type semiconductor 68: Peltier element 72: Temperature control device

Claims

1. A cooling method for a diamond dresser comprising a diamond grinding segment and a metal support for supporting the diamond grinding segment in a state where a part of the diamond grinding segment is exposed and the other part is embedded, and for dressing the grinding surface of a grinding wheel, the method comprising: a support holding step of holding the metal support by a dresser holder mounted in a heat-insulated state on a dresser fixing base of a grinding machine; a support cooling step of cooling the metal support by bringing a heat absorption part of a cooling device into close contact with the metal support during the dressing. A cooling method for a diamond dresser, characterized by the above.

2. A cooling device for a diamond dresser comprising a diamond grinding segment and a metal support for supporting the diamond grinding segment in a state where a part of the diamond grinding segment is exposed and the other part is embedded, and for dressing the grinding surface of a grinding wheel, the device comprising: a dresser holder mounted on a dresser fixing base of a grinding machine via a heat insulating material and holding the metal support; a cooling module having a heat absorption part brought into close contact with the metal support and directly cooling the metal support during the dressing. A cooling device for a diamond dresser, characterized by the above.

3. The cooling module is: a plate-shaped Peltier module including a Peltier element including a p-type semiconductor and an n-type semiconductor connected by a metal conductor, a heat absorption part formed at a portion where a direct current flows from the n-type semiconductor to the p-type semiconductor, and a heat dissipation part formed at a portion where the direct current flows from the p-type semiconductor to the n-type semiconductor and located on the back surface of the heat absorption part. A cooling device for a diamond dresser according to Claim 2, characterized by the above.

4. A heat exchanger through which a refrigerant is circulated is mounted in close contact with the heat dissipation part of the plate-shaped Peltier module. A cooling device for a diamond dresser according to Claim 3, characterized by the above.

5. A refrigerant circulation device for supplying the refrigerant to the heat exchanger is provided. A cooling device for a diamond dresser according to Claim 4, characterized by the above.

6. The diamond dresser is provided with a temperature sensor for detecting the temperature of the diamond grinding segment, and a temperature control device for controlling the direct current supplied to the Peltier element so that the temperature of the diamond dresser becomes equal to or lower than a preset temperature. The cooling device for the diamond dresser according to claim 3, characterized by the above.

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