Connection structure of device board to heating chamber, electronic device testing apparatus and heating chamber

Abstract

To distribute a large air quantity of cooling air into a device board, and can prevent the cooling air from being leaked to a periphery of the device board.SOLUTION: A burn-in device includes: a device board 12 having a substrate 35 having a board side connector 35a provided on one end and an air passage 41 for distributing cooling air; a heating tank having a storage space for storing the device board 12 formed therein, and having a tank side connector 27 bonded to the board side connector 35a and a tank side flow channel 29 for distributing the cooling air between the air passage 41 and the tank side flow channel 29; and a packing 45 which is positioned between the air passage 41 and the tank side flow channel 29 in a state in which the connectors are connected to each other, and airtightly connects the air passage 41 and the tank side flow channel 29. The air passage 41 is opened to the end face of one end side in the device board 12.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a connection structure of a device board to a heating tank, an electronic device test apparatus, and a heating tank.

Background Art

[0002] Conventionally, electronic device test apparatuses such as burn-in apparatuses that perform tests for applying electrical stress (power supply voltage, signals, etc.) to electronic devices in a high-temperature environment, such as burn-in, screening, and electronic measurement, are known. In this type of test apparatus, a device board having a substrate on which an electronic device is mounted is used. As the operating speed of electronic devices has increased, processors for driving electronic devices have been provided on the substrate. Therefore, as disclosed in Patent Documents 1 and 2 below, the device board is formed in a hollow shape so that cooling air for cooling the processor can flow through.

[0003] As shown in FIG. 6, the device board 81 of the burn-in apparatus of Patent Document 1 has a substrate 83 to which an electronic device 82 is attached and a hollow protective cover 84 that covers the substrate 83. A supply pipe 85 for introducing cooling air penetrates one side surface of the protective cover 84, and an exhaust pipe 86 for exhausting cooling air penetrates the other side surface of the protective cover 84. In this configuration, since the supply pipe 85 and the exhaust pipe 86 that penetrate the side surface of the protective cover 84 are used, it is difficult to send a large amount of cooling air into the device board 81, and there is a limit to the cooling capacity of the processor.

[0004] On the other hand, in the burn-in device disclosed in Patent Document 2, as shown in FIG. 7, the cooling air can flow in the device board 91 without providing a supply pipe and an exhaust pipe. Specifically, in the burn-in device of Patent Document 2, one end surface of the device board 91 is open, and the cooling air is sent into this opening 92. With this configuration, it is possible to send a large amount of cooling air into the device board 91. And the other end surface of the device board 91 is open as an exhaust port 93, and the cooling air is exhausted outside the heating tank 94 through this exhaust port 93.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the burn-in device of the above Patent Document 2, no consideration is given to the leakage of the cooling air around the device board 91. That is, there is a gap between the end of the device board 91 on the exhaust port 93 side and the outer wall of the heating tank 94, but no countermeasures for this point are considered.

[0007] Therefore, the present invention has been made in view of the above prior art, and the object thereof is to be able to circulate a large amount of cooling air in the device board and to suppress the leakage of the cooling air around the device board.

Means for Solving the Problems

[0008] The connection structure according to the present invention is a connection structure for a device board to a heating bath. The device board has a substrate with a board-side connector at one end and an air passage through which cooling air flows to cool a drive unit or a control unit of an electronic device mounted on the substrate. The heating bath has a bath-side connector configured to be connectable to the board-side connector and a bath-side passage through which cooling air flows between the heating bath and the air passage. A duct is formed on the side wall of the heating tank. The air passage is formed so as to open to an end face of the device board on the one end side. Device Board and the tank side flow path The duct forming and a packing that connects the air passage and the tank-side flow path in an airtight manner, the packing forming a relay flow path that connects the air passage and the tank-side flow path, and an upper support that supports from below an upper part of the packing that is located above the relay flow path. the upper support fixed to the duct so as to extend from the duct; It also has:

[0009] In the connection structure according to the present invention, the air passage of the device board opens on an end face of one end of the device board, and cooling air flows through this opening between the air passage and the chamber-side flow path of the heating chamber. Therefore, a large volume of cooling air can flow through the air passage of the device board. Furthermore, a packing is positioned between the air passage of the device board and the chamber-side flow path of the heating chamber, airtightly connecting the air passage and the chamber-side flow path. Therefore, for example, when cooling air is sent from the chamber-side flow path to the air passage of the device board, leakage of the cooling air to the outside of the device board can be suppressed. Furthermore, for example, when cooling air flows from the air passage of the device board to the chamber-side flow path, leakage of the cooling air to the outside of the device board can be suppressed. Therefore, since the flow of cooling air around the device board is suppressed, testing can be performed at the desired test temperature without disturbing the ambient environment of the electronic device mounted on the device board. The upper support also holds the packing in place even when the device board is not fixed to the heating tank. Furthermore, if the length of the upper part of the packing between the surface facing the air passage and the surface facing the tank-side flow path is greater than the thickness, the upper part can be held in place without sagging.

[0010] The packing may have a shape in which the length dimension between the surface facing the air passage and the surface facing the tank side passage is larger than the wall thickness dimension.

[0011] In this aspect, since the length dimension of the packing (the length dimension in the direction in which the air passage and the tank side passage face each other) is larger than the wall thickness dimension, the amount of deformation of the packing when the board side connector is connected to the tank side connector can be increased. Therefore, the airtightness between the air passage and the tank side passage can be enhanced.

[0012] When the packing is pressed by the device board and the heating tank due to the connection of the connectors, the packing may be positioned between the air passage and the tank side passage in a compression-deformed state.

[0013] In this aspect, in the state where the packing is compression-deformed, the airtightness between the air passage and the tank side passage is ensured by the shape of the deformed packing. Therefore, it is possible to ensure the airtightness between the air passage and the tank side passage while increasing the amount of deformation of the packing between the surface facing the air passage and the surface facing the tank side passage.

[0014] before The tank side connector may be located above the packing. In this case, the upper portion of the packing may be sandwiched between the tank side connector and the upper portion support in a state where the connectors are connected.

[0015] In this aspect , tank side By utilizing the fact that the connector is located above the packing, the deformation of the upper portion of the packing can be restricted. 。

[0016] The connection structure according to the present invention is a connection structure for a device board to a heating bath. The device board has a substrate with a board-side connector at one end and an air passage through which cooling air flows to cool a drive unit or a control unit of an electronic device mounted on the substrate. The heating bath has a bath-side connector configured to be connectable to the board-side connector and a bath-side passage through which cooling air flows between the heating bath and the air passage. A duct is formed on the side wall of the heating tank. The air passage is formed so as to open to an end face of the device board on the one end side. Device Board and the tank side flow path The duct forming and a packing that connects the air passage and the tank-side flow path in an airtight manner, the packing forming a relay flow path that connects the air passage and the tank-side flow path, and a lower portion support that supports from below a lower portion of the packing that is located below the relay flow path. a fixing member fixed to the side wall and supporting the lower support; It also has:

[0017] In the connection structure according to the present invention, the air passage of the device board opens on an end face of one end of the device board, and cooling air flows through this opening between the air passage and the chamber-side flow path of the heating chamber. Therefore, a large volume of cooling air can flow through the air passage of the device board. Furthermore, a packing is positioned between the air passage of the device board and the chamber-side flow path of the heating chamber, airtightly connecting the air passage and the chamber-side flow path. Therefore, for example, when cooling air is sent from the chamber-side flow path to the air passage of the device board, leakage of the cooling air to the outside of the device board can be suppressed. Furthermore, for example, when cooling air flows from the air passage of the device board to the chamber-side flow path, leakage of the cooling air to the outside of the device board can be suppressed. Therefore, since the flow of cooling air around the device board is suppressed, testing can be performed at the desired test temperature without disturbing the ambient environment of the electronic device mounted on the device board. Also , Lower support is provided, The packing can be held in place even when the device board is not fixed to the heating tank. Also, if the lower part of the packing has a shape in which the length dimension between the surface facing the air passage and the surface facing the tank-side flow path is greater than the thickness dimension, the lower part can be held in place without sagging.

[0018] The electronic device test apparatus according to the present invention includes a device board having a substrate provided with a board-side connector at one end and an air passage through which cooling air for cooling a drive processor of an electronic device mounted on the substrate flows, and a heating tank in which an accommodation space for accommodating the device board is formed, the heating tank having a tank-side connector configured to be connectable to the board-side connector and a tank-side flow path through which cooling air flows between the air passage, and a packing positioned between the air passage and the tank-side flow path with the connectors connected to each other to airtightly connect the air passage and the tank-side flow path. The packing forms a relay flow path connecting the air passage and the tank-side flow path. The electronic device testing apparatus includes at least one of an upper support that supports from below an upper portion of the packing that is located above the relay flow path, and a lower support that supports from below a lower portion of the packing that is located below the relay flow path. The air passage opens at an end face on the one-end side of the device board.

[0019] The heating tank according to the present invention is a heating tank to which a device board having a substrate provided with a board-side connector at one end and an air passage through which cooling air for cooling a drive unit or a control unit of an electronic device mounted on the substrate flows and opening at an end face on the one-end side can be connected, the heating tank having a tank-side connector configured to be connectable to the board-side connector, a tank-side flow path through which cooling air flows between the air passage, and a packing positioned between the air passage of the device board and the tank-side flow path when the device board is connected to airtightly connect the air passage and the tank-side flow path. The heating tank includes at least one of an upper support that supports from below an upper portion of the packing that is located above the relay flow path, and a lower support that supports from below a lower portion of the packing that is located below the relay flow path. The packing forms a relay flow path connecting the air passage and the tank-side flow path.

Advantages of the Invention

[0020] As described above, according to the present invention, it is possible to circulate a large amount of cooling air into the device board, and it is possible to suppress the leakage of the cooling air to the periphery of the device board.

Brief Description of the Drawings

[0021] [Figure 1] It is a diagram schematically showing a burn-in apparatus according to an embodiment. [Figure 2]FIG. 2 is a diagram schematically illustrating the interior of the burn-in device as viewed from above. [Figure 3] 3(a) and 3(b) are diagrams showing a device board used in the burn-in device. [Figure 4] 10A and 10B are diagrams for explaining a connection structure between a device board and a rear side wall. [Figure 5] FIG. 10 shows the packing and lower support. [Figure 6] FIG. 1 is a diagram showing a conventional burn-in device. [Figure 7] FIG. 1 is a diagram showing a conventional burn-in device. DETAILED DESCRIPTION OF THE INVENTION

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0023] The burn-in apparatus 10 shown in FIG. 1 is a burn-in apparatus for testing a large number of electronic devices 14 (see FIG. 3( a 1 shows a burn-in apparatus 10 for screening electronic devices 14, but instead of the burn-in apparatus 10, the electronic device testing apparatus may be configured as an apparatus for performing an operation test of the electronic devices 14 in a high-temperature environment.

[0024] The burn-in device 10 includes a chamber body 16a that defines a space for accommodating a large number of device boards 12, and a chamber body 16b that defines a space for accommodating a large number of device boards 12. Do-out The heating tank 16 has a door 16b for opening and closing the inlet. The tank body 16a and the door 16b are each made of a heat insulating panel.

[0025] The storage space is provided with a heater 18 for heating the air in the storage space and a fan 19 for circulating the air within the storage space. Within the storage space, a large number of device boards 12 are arranged at intervals in the vertical direction. Although not shown, the heating tank 16 is provided with a guide for the device boards 12 so that each device board 12 can be placed in a predetermined position.

[0026] As shown in FIG. 2, a rear chamber 21 is adjacent to the rear side of the heating bath 16. The rear chamber 21 houses a large number of driver boards 23 provided corresponding to each device board 12. A corresponding relay board 25 is connected to each driver board 23. Each relay board 25 penetrates the rear side wall 16c of the bath body 16a and is supported by the rear side wall 16c. A bath-side connector 27 (see FIG. 4) is provided at the tip of each relay board 25 on the bath body 16a side, which can be connected to a board-side connector 35a (described later) provided on the corresponding device board 12. That is, the heating bath 16 has a bath-side connector 27 configured to be connectable to the board-side connector 35a (described later).

[0027] The heating tank 16 has a duct 31 as a flow path forming portion that forms tank-side flow paths 29 (supply flow paths 29a and exhaust flow paths 29b) for circulating cooling air between the heating tank 16 and the device board 12. The duct 31 includes a supply duct 31a that forms the supply flow path 29a through which the cooling air flows toward the device board 12, and an exhaust duct 31b that forms the exhaust flow path 29b through which the cooling air flowing out from the device board 12 flows.

[0028] The supply duct 31a is provided so that the supply flow path 29a (tank-side flow path 29) penetrates the rear sidewall 16c of the tank body 16a, and has a supply port 31a1 that opens into the rear chamber 21 and an outlet 31a2 that opens into the heating tank 16. The outlet 31a2 protrudes slightly into the heating tank 16 from the rear sidewall 16c. The exhaust duct 31b is provided so that the exhaust flow path 29b (tank-side flow path 29) penetrates the rear sidewall 16c. The exhaust duct 31b has an inlet 31b1 that opens into the heating tank 16 and an outlet 31b2 that opens into the rear chamber 21. The inlet 31b1 of the exhaust duct 31b protrudes slightly into the heating tank 16 from the rear sidewall 16c of the tank body 16a.

[0029] The rear chamber 21 also accommodates a signal generator 33 (FIG. 1) that controls the driver board 23, a fan (not shown) that sends cooling air into the supply duct 31a, and the like.

[0030] The device board 12 is shown in Figs. b ), the electronic device 14 includes a board 35 configured to be able to mount a large number of electronic devices 14, and a cover 36 that covers the board 35.

[0031] The substrate 35 is formed in a rectangular shape, and has an upper surface provided with a large number of sockets (not shown) for mounting a large number of electronic devices 14, and a lower surface provided with drive units or control units (not shown) for the electronic devices 14, positioned directly below each electronic device 14. The drive units are, for example, power supplies, switching components, etc. for the electronic devices 14, and the control units are, for example, control circuits for the electronic devices 14 (control circuits such as drive processors for the electronic devices 14), etc.

[0032] Three board-side connectors 35a are provided on the substrate 35 along one side of the rectangle. That is, the board-side connectors 35a are provided at one end of the substrate 35. The board-side connectors 35a are electrically connected to the drive processor via unillustrated conductive parts formed on the substrate 35. Note that the number of board-side connectors 35a provided is not limited to three.

[0033] Cover 36 is , base The lower cover 39 disposed on the lower surface side of the board 35 9 has . under The side cover 39 is made of a material having heat insulation properties 。

[0034] The lower cover 39 As shown in Figure 4, covers the lower side of the board where the drive processor is disposed, while being configured to form an air passage 41 between the board 35. And the lower cover 39 allows the cooling air to flow between the air passage 41 and the supply flow path 29a and the exhaust flow path 29b on the heating tank 16 side, Back of heating tank 16 The side surfaces on the side are open. That is, the air passage 41 opens at the end surface on the one - end side where the board - side connector 35a in the device board 12 is provided. On the other hand, As shown in Figure 3(b), The lower cover 39 is provided with three side surfaces so as to partition the air passage 41.

[0035] Specifically, As shown in Figure 3(a)(b), The lower cover 39 has a rectangular bottom surface portion 39a, a first lower side surface portion 39b provided along one side of the bottom surface portion 39a on the side opposite to the board - side connector 35a, a second lower side surface portion 39c provided along one side of the bottom surface portion 39a at a position adjacent to one side of the side where the first lower side surface portion 39b is provided, and a third lower side surface portion 39d provided along one side of the bottom surface portion 39a at a position adjacent to the other side of the side where the first lower side surface portion 39b is provided. In the lower cover 39, Back of heating tank 16 Since the side surfaces on the side are open, this portion serves as the inlet 41a and the outlet 41b of the cooling air in the air passage 41. That is, in the present embodiment, the inlet 41a and the outlet 41b of the cooling air are located on the same side surface of the cover 36.

[0036] On the upper surface (or inner surface) of the bottom surface portion 39a of the lower cover 39, a partition wall 39e extending from the open side surface toward the opposite side surface (the first lower side surface portion 39b) is formed. The partition wall 39e extends to the vicinity of the first lower side surface portion 39b, but a gap is formed between the partition wall 39e and the first lower side surface portion 39b. Therefore, the cooling air flowing through the space located on one side with respect to the partition wall 39e and communicating with the inlet 41a can flow into the space located on the other side with respect to the partition wall 39e and communicating with the outlet 41b through this gap.

[0037] Note that the inlet 41a and the outlet 41b of the cooling air may be formed on the side surfaces of the lower cover 39 that are opposite to each other. For example, the inlet 41a may be formed on the open side surface, and the outlet 41b may be arranged at the position of the first lower side surface portion 39b. In this case, the first lower side surface portion 39b located on the side opposite to the board side connector 35a is open. On the other hand, the outlet 41b may be formed on the open side surface, and the inlet 41a may be arranged at the position of the first lower side surface portion 39b. In these cases, the partition wall 39e can be omitted.

[0038] As shown in FIG. 4, between the duct 31 provided on the rear side wall 16c and the lower cover 39 of the device board 12, a packing 45 for airtightly connecting the air passage 41 and the tank side flow path 29 is disposed. The packing 45 is located between the air passage 41 and the tank side flow path 29 in a state where the board side connector 35a is connected to the tank side connector 27.

[0039] The packing 45 is made of a material that undergoes compressive deformation when the connectors 35a and 27 are connected and pressed by the device board 12 and the heating tank 16, but has a hardness that generates a repulsive force sufficient to prevent the connectors 35a and 27 from coming off at this time. Note that the packing 45 is arranged such that the upper portion 45a described later is located immediately below the board side connector 35a and the tank side connector 27.

[0040] As shown in Fig. 5, the packing 45 is formed in a rectangular tube shape that forms a rectangular cross-sectional space, and a through-hole is formed across a pair of opposite surfaces. As will be described later, the through-hole forms a relay flow path 50 that connects the air passage 41 and the tank-side flow path 29. That is, the packing 45 is arranged in a posture in which one end of the through-hole (relay flow path 50) opens toward the air passage 41 and the other end of the through-hole (relay flow path 50) opens toward the tank-side flow path 29.

[0041] The packing 45 has a predetermined length in the through direction of the through-hole, and the length dimension L in the through direction of the through-hole is shorter than the length dimension W1 in the direction along the substrate 35 (the left-right direction in Fig. 5) among the directions orthogonal to the through direction. Also, the packing 45 has a shape in which the length dimension L in the through direction of the through-hole is larger than the length dimension W2 in the direction orthogonal to the substrate 35 among the directions orthogonal to the through direction. That is, the packing 45 has a predetermined length in the pressing direction, and the length dimension L in the pressing direction of the packing 45 is larger than the length dimension W2 of the shortest side among the sides (vertical and horizontal) in the direction orthogonal to the pressing direction. Note that the dimension W2 in the direction orthogonal to the substrate 35 (the up-down direction in Fig. 5) among the directions orthogonal to the through direction (or pressing direction) is formed shorter than the dimension W1 in the direction along the substrate 35, but it is not limited to this.

[0042] As described above, the packing 45 has a predetermined length in the through direction of the through-hole (the air flow direction or the pressing direction). The reason why the packing 45 has a predetermined length in the through direction is as follows.

[0043] While the slot-side connector 27 is disposed at a position away from the inside of the accommodation space of the device board 12 from the vertical portion 51a of the fixing member 51 described later, the board-side connector 35a is disposed at a position away from the outside of the cover 36 of the device board 12. For this reason, in a state where the connectors 27 and 35a are connected to each other, the outlet 31a2 and the discharge port 31b2 of the duct 31 and the inlet 41a and the outlet 41b of the air passage 41 are separated from each other. In order to block the space between the duct 31 and the air passage 41 that are separated from each other, the packing 45 has a predetermined length in the penetrating direction of the through-hole.

[0044] The packing 45 integrally includes a flat upper portion 45a, a flat lower portion 45b disposed in parallel with the upper portion 45a at a position away from the upper portion 45a downward, a flat one-side portion 45c connecting one end of the upper portion 45a and one end of the lower portion 45b, and a flat other-side portion 45d connecting the other end of the upper portion 45a and the other end of the lower portion 45b.

[0045] The packing 45 has a shape in which the length dimension L between the surface facing the air passage 41 of the device board 12 and the surface facing the tank-side flow path 29 of the heating tank 16 is larger than the wall thickness dimension t. Here, the wall thickness dimension t refers to the wall thickness dimension of the upper portion 45a or the wall thickness dimension of the lower portion 45b. Further, the packing 45 has a length dimension L in the penetrating direction of the through-hole that is larger than the wall thickness dimensions of the respective portions in the direction perpendicular to the penetrating direction.

[0046] As described above, the packing 45 is formed in a rectangular tube shape, and the space (through-hole) inside the packing 45 opens to the surfaces of the packing 45 that face opposite sides of each other. As shown in FIG. 4, the packing 45 is arranged such that one of the surfaces where the space opens faces the lower cover 39 of the device board 12, and the other surface faces the duct 31 of the rear side wall 16c of the tank body 16a. Therefore, the space inside the packing 45 functions as a relay flow path 50 that connects the air passage 41 and the tank side flow path 29. The upper portion 45a is located above the relay flow path 50 and partitions the upper end of the relay flow path 50. The lower portion 45b is located below the relay flow path 50 and partitions the lower end of the relay flow path 50. One side portion 45c and the other side portion 45d partition the left and right ends of the relay flow path 50.

[0047] A partition wall 45e is provided in the packing 45 so as to connect the upper portion 45a and the lower portion 45b. The partition wall 45e is parallel to the one side portion 45c and the other side portion 45d, and extends in a direction connecting the surface facing the air passage 41 of the device board 12 and the surface facing the tank side flow path 29 of the heating tank 16. Thereby, the space (relay flow path 50) inside the packing 45 is partitioned into an inflow side relay flow path 50a that connects the air passage 41 and the supply flow path 29a, and an outflow side relay flow path 50b that connects the air passage 41 and the exhaust flow path 29b. The inflow side relay flow path 50a is located between the outlet 31a2 of the supply duct 31a and the inlet 41a of the air passage 41, and connects the supply flow path 29a and the air passage 41. The outflow side relay flow path 50b is located between the outlet 41b of the air passage 41 and the inlet 31b1 of the exhaust duct 31b, and connects the air passage 41 and the exhaust flow path 29b. When the inlet 41a and the outlet 41b of the cooling air are formed on the side surfaces of the lower cover 39 that are opposite to each other in the device board 12, the partition wall 45e is omitted, and one relay flow path 50 is formed.

[0048] The packing 45 is supported by the upper portion support 47 and the lower portion support 49.

[0049] The upper side support 47 is constituted by a flat plate-like member fixed to the upper surface portion of the duct 31 so as to extend from the upper surface portion of the duct 31. The upper side portion 45a of the packing 45 is placed on the upper side support 47, and the upper side support 47 supports the upper side portion 45a from below. On the other hand, immediately above the upper side portion 45a of the packing 45, the board side connector 35a and the tank side connector 27 are located. That is, in a state where the connectors 35a and 27 are connected to each other, the upper side portion 45a is sandwiched between the connectors 35a and 27 and the upper side support 47. For this reason, when the board side connector 35a is connected to the tank side connector 27 and the upper side portion 45a is pressed by the device board 12 and the duct 31 (heating tank 16), the upper side portion 45a is in a state of being compressed and deformed without bending. Note that the upper side portion 45a is not fixed to the board side connector 35a and the tank side connector 27, nor is it fixed to the upper side support 47.

[0050] The lower side support 49 is supported by a fixing member 51 fixed to the rear side wall 16c of the tank body 16a. The fixing member 51 is a sheet metal member having a size extending across a large number of device boards 12 arranged in the vertical direction, and has a vertical portion 51a extending in the vertical direction. The lower side support 49 is held by the vertical portion 51a of the fixing member 51. Further, in the vertical portion 51a of the fixing member 51, the duct 31 constituting the tank side flow path 29 is in close contact with the surface on the side opposite to the lower side support 49.

[0051] As also shown in FIG. 5, the lower side support 49 is constituted by a member having an L-shaped cross section, and integrally has a mounting portion 49a for mounting the lower side portion 45b of the packing 45, and a hanging portion 49b extending downward from an end of the mounting portion 49a. The lower side portion 45b of the packing 45 is fixed to the mounting portion 49a in a state of being placed on the mounting portion 49a. On the other hand, an insertion hole for a screw 54 is formed in the hanging portion 49b, and the hanging portion 49b is fixed to the fixing member 51 by the screw 54.

[0052] The lower portion 45b is configured to undergo compressive deformation without bending when the board-side connector 35a is connected to the tank-side connector 27 and the lower portion 45b is pressed by the device board 12 and the duct 31 (heating tank 16). That is, even when the lower portion 45b is compressed in the axial direction, the lower portion 45b does not bend, and similarly, the upper portion 45a, the one side portion 45c, and the other side portion 45d also undergo compressive deformation without bending. Therefore, even when the packing 45 is deformed by a force in the axial direction (the penetration direction of the through-hole), the airtightness between the air passage 41 and the tank-side flow path 29 is maintained. Here, "bending" means that when the lower portion 45b and the upper portion 45a are compressed in the axial direction of the packing 45, the lower portion 45b and the upper portion 45a are bent at a middle portion in the axial direction so that one end face and the other end face in the axial direction are shifted in a direction perpendicular to the axial direction (shifted in the vertical direction in Figure 5) to an extent that they do not overlap when viewed in the axial direction.

[0053] Although the lower portion 45b is formed to be thicker than the upper portion 45a, it may be formed to be the same thickness as the upper portion 45a, or thinner than the upper portion 45a.

[0054] As described above, in the connection structure of the device board 12 to the heating tank 16 of the present embodiment, the air passage 41 of the device board 12 opens to the end face on one end side of the device board 12, and cooling air flows between the air passage 41 in the device board 12 and the tank side flow path 29 of the heating tank 16 through this opening. Therefore, a large amount of cooling air can be flowed into the air passage 41 of the device board 12. Moreover, the packing 45 is located between the air passage 41 of the device board 12 and the tank side flow path 29 of the heating tank 16, and the air passage 41 and the tank side flow path 29 are connected in an airtight manner. For this reason, when the cooling air is sent from the tank side flow path 29 to the air passage 41 of the device board 12, it is possible to suppress the leakage of the cooling air to the outside of the device board 12. Also, when the cooling air flows from the air passage 41 of the device board 12 to the tank side flow path 29, it is possible to suppress the leakage of the cooling air to the outside of the device board 12. Therefore, since the flow of the cooling air around the device board 12 is suppressed, it is possible to perform a test at a desired test temperature without disturbing the ambient environment around the electronic device 14 provided on the device board 12.

[0055] Further, in the present embodiment, when the board side connector 35a is coupled to the tank side connector 27, the device board 12 is in close contact with the duct 31 via the packing 45 and the fixing member 51, and airtightness between the device board 12 and the duct 31 is ensured.

[0056] Also, in the present embodiment, since the length dimension L of the packing 45 in the through direction of the through hole is larger than the wall thickness dimension t, the amount of deformation of the packing 45 when the board side connector 35a is connected to the tank side connector 27 can be increased. Therefore, the airtightness between the air passage 41 and the tank side flow path 29 can be enhanced.

[0057] Also, in the present embodiment, since the packing 45 is maintained in a state of being compressed and deformed when the connectors are connected, not only can the amount of deformation of the packing 45 between the surface facing the air passage 41 and the surface facing the tank side flow path 29 be increased as much as possible, but also the airtightness between the air passage 41 and the tank side flow path 29 can be ensured even after the shape of the packing 45 has changed.

[0058] Also, in the present embodiment, since the upper portion 45a of the packing 45 is supported by the upper portion support 47, the packing 45 can be held at a predetermined position even when the device board 12 is not fixed to the heating tank 16. Further, by utilizing the fact that the connectors 35a and 27 are located above the packing 45, deformation of the upper portion 45a of the packing 45 can be restricted. Also, although the length dimension L of the upper portion 45a of the packing 45 in the through-hole penetration direction has a shape larger than the wall thickness dimension t, the packing 45 can be held so that the upper portion 45a does not drop. Therefore, the shape of the relay flow path 50 can be maintained.

[0059] Also, in the present embodiment, since the lower portion 45b of the packing 45 is supported by the lower portion support 49, the packing 45 can be held so that the lower portion 45b does not sag even though the length dimension L of the lower portion 45b of the packing 45 in the through-hole penetration direction has a shape larger than the wall thickness dimension t.

[0060] It should be noted that the embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The present invention is not limited to the above-described embodiments, and various changes, improvements, etc. are possible without departing from the gist thereof. For example, in the above-described embodiment, the electronic device 14 is attached to the upper surface of the substrate 35 and the drive processor is provided on the lower surface of the substrate 35, but it is not limited thereto. The electronic device 14 may be attached to the lower surface of the substrate 35 and the drive processor may be provided on the upper surface of the substrate 35. In this case, Equivalent to lower cover 39 Cover and a space between the substrate 35 is formed as the air passage 41. Therefore, the packing 45 is Equivalent to lower cover 39 Cover and arranged between the duct 31. And the lower portion 45b of the packing 45 is supported by the connectors 35a and 27. In this case, it is possible to omit the lower cover 39.

[0061] In the packing 45 of the above-described embodiment, the length dimension L in the penetrating direction of the through-hole is formed to be larger than the wall thickness dimension t, but the present invention is not limited to this. The length dimension L may be approximately the same as the wall thickness dimension t.

[0062] In the packing 45 of the above-described embodiment, the upper portion 45a and the lower portion 45b are compressed and deformed without being bent when the connector is connected, but the present invention is not limited to this. That is, even if the upper portion 45a and the lower portion 45b are slightly bent, as long as the airtightness between the air passage 41 and the tank-side flow path 29 is ensured, the upper portion 45a and the lower portion 45b are allowed to be slightly bent.

[0063] In the above-described embodiment, the upper portion support 47 that supports the upper portion 45a from below is provided. However, if the shape is maintained by the hardness of the upper portion 45a itself, the upper portion support 47 can be omitted.

[0064] In the above-described embodiment, the lower portion support 49 that supports the lower portion 45b from below is provided. However, if the shape is maintained by the hardness of the lower portion 45b itself, the lower portion support 49 can be omitted.

[0065] In the above-described embodiment, the tank-side flow path 29 is formed by the duct 31, but the present invention is not limited to this configuration. For example, the tank-side flow path 29 may be formed by a through-hole formed in the rear side wall 16c of the tank body 16a. In this case, one end opening of the tank-side flow path 29 does not protrude from the rear side wall 16c. Therefore, the packing 45 is provided so as to abut against the rear side wall 16c.

Explanation of Reference Numerals

[0066] 10: Burn-in device 12: Device board 14: Electronic device 16: Heating tank 27: Tank-side connector 29: Tank-side flow path 35: Substrate 35a: Board-side connector 41: Air passage 45: Packing L: Length dimension t: Wall thickness dimension

Claims

1. A connection structure of a device board to a heating tank, comprising: The device board includes a substrate provided with a board-side connector at one end, and an air passage for circulating cooling air for cooling a driving part or a control part of an electronic device mounted on the substrate; The heating tank includes a tank-side connector configured to be connectable to the board-side connector, and a duct formed on a side wall of the heating tank for forming a tank-side flow path for circulating cooling air between the air passage; The air passage is formed to open at an end face on the one-end side of the device board; The connection structure includes a packing located between the device board and the duct forming the tank-side flow path with the connectors connected to each other, for hermetically connecting the air passage and the tank-side flow path; The packing forms a relay flow path connecting the air passage and the tank-side flow path; The connection structure further includes an upper support for supporting an upper part located above the relay flow path in the packing from below, the upper support being fixed to the duct so as to extend from the duct.

2. The tank-side connector is located above the packing; The upper part of the packing is sandwiched between the tank-side connector and the upper support with the connectors connected to each other. The connection structure according to Claim 1.

3. A connection structure of a device board to a heating tank, comprising: The device board includes a substrate provided with a board-side connector at one end, and an air passage for circulating cooling air for cooling a driving part or a control part of an electronic device mounted on the substrate; The heating tank includes a tank-side connector configured to be connectable to the board-side connector, and a duct formed on a side wall of the heating tank for forming a tank-side flow path for circulating cooling air between the air passage; The air passage is formed to open at an end face on the one-end side of the device board; The connection structure includes a packing located between the device board and the duct forming the tank-side flow path with the connectors connected to each other, for hermetically connecting the air passage and the tank-side flow path; The packing forms a relay flow path connecting the air passage and the tank-side flow path; A connection structure further comprising a lower portion support that supports from below a lower portion of the packing located below the relay passage, and a fixing member fixed to the side wall that supports the lower portion support.

4. The packing has a shape in which a length dimension between a surface facing the air passage and a surface facing the tank side passage is larger than a wall thickness dimension, according to any one of claims 1 to 3. The connection structure described.

5. When the packing is pressed by the device board and the heating tank by connecting the connectors, the packing is located between the air passage and the tank side passage in a compressed and deformed state, according to any one of claims 1 to 4. The connection structure described.

6. A device board having a substrate provided with a board side connector at one end, and an air passage through which cooling air for cooling a driving portion or a control portion of an electronic device mounted on the substrate flows. A heating tank in which an accommodation space for accommodating the device board is formed, the heating tank having a tank side connector configured to be connectable to the board side connector, and a tank side passage through which cooling air flows between the air passage. A packing located between the air passage and the tank side passage in a state where the connectors are connected to each other, and connecting the air passage and the tank side passage in an airtight manner. The packing forms a relay passage connecting the air passage and the tank side passage. At least one of an upper portion support that supports from below an upper portion of the packing located above the relay passage and a lower portion support that supports from below a lower portion of the packing located below the relay passage. The air passage opens at an end face on the one end side of the device board, an electronic device test apparatus.

7. A heating tank to which a device board having a substrate provided with a board side connector at one end and an air passage through which cooling air for cooling a driving portion or a control portion of an electronic device mounted on the substrate flows and opening at an end face on the one end side can be connected. A tank side connector configured to be connectable to the board side connector. A tank side passage through which cooling air flows between the air passage. A packing located between the air passage of the device board and the tank side passage when the device board is connected, and connecting the air passage and the tank side passage in an airtight manner. The packing forms a relay flow path that connects the air passage and the tank side flow path. A heating tank including at least one of an upper part support that supports an upper part located above the relay flow path in the packing from below and a lower part support that supports a lower part located below the relay flow path in the packing from below.

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