Telecommunications equipment parts

Abstract

To provide a part for a communication device which is excellent in low dielectric characteristics, plating property and strength.SOLUTION: A part for a communication device contains a resin composition, wherein the resin composition contains, with respect to 100 pts.mass of the total amount of the resin composition, component (a) to component (e) in the following mass ratios. (a) 10 pts.mass or more and less than 50 pts.mass of a polyphenylene ether-based resin, (b) 15 pts.mass or more and less than 70 pts.mass of a polystyrene-based resin, (c) 1 pt.mass or more and less than 25 pts.mass of a polyethylene-based resin, (d) 1 pt.mass or more and less than 25 pts.mass of a thermoplastic elastomer, and (e) 5 pts.mass or more and less than 20 pts.mass of a metal oxide.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a component for a communication device. [Background technology]

[0002] In recent years, MID (molded interconnect device) technology, which directly attaches antennas to resin molded bodies, has been used as communication antennas for mobile devices such as smartphones. Among these, LDS (laser direct structuring), a type of MID technology, has attracted particular attention as a technique that can easily create circuits on the surface of resin molded bodies using laser irradiation technology. This technique involves adding a specific metal oxide to the material in advance, activating the metal oxide by irradiating the parts of the molded body where you want to create circuits with a laser, and then plating the metal only on the parts that were irradiated with the laser.

[0003] As a substrate material for the LDS method, in order to avoid a decrease in communication efficiency, a technology has been reported that uses a cyclic polyolefin consisting of a hydrogenated block copolymer containing specific structural units and a laser direct structuring additive as the substrate material (Patent Document 1).

[0004] Similarly, a technology has been reported in which a glass filler and a metal oxide having a spinel structure are added to a hydrogenated crystalline cyclic olefin ring-opening polymer having a specific structure in order to improve plating properties and low dielectric properties of substrate materials used in the LDS method (Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-14549 [Patent Document 2] Patent No. 640260 Summary of the Invention [Problem to be solved by the invention]

[0006] However, with communication standards from 5G onwards, communication frequencies are becoming increasingly higher, requiring materials with even lower dielectric properties than those currently used.In addition to low dielectric properties, these materials also require good plating properties and strength.

[0007] An object of the present invention is to provide a communication device part that has low dielectric properties, excellent plating properties, and excellent strength. [Means for solving the problem]

[0008] As a result of extensive research, the present inventors discovered that by mixing polyphenylene ether resin, polystyrene resin, and polyethylene resin in specific proportions, and further selecting a resin composition containing a thermoplastic elastomer and a metal oxide in specific proportions as the material for communication device parts, it is possible to simultaneously achieve low dielectric properties, good plating properties, and high strength, and arrived at the present invention.

[0009] That is, the present invention is as follows. [1] A communication device part comprising a resin composition, A part for a communication device, wherein the resin composition contains components (a) to (e) in the following mass ratios relative to 100 parts by mass of the total amount of the resin composition: (a) Polyphenylene ether resin: 10 parts by mass or more and less than 50 parts by mass (b) Polystyrene resin: 15 parts by mass or more and less than 70 parts by mass (c) Polyethylene resin: 1 part by mass or more and less than 25 parts by mass (d) Thermoplastic elastomer: 1 part by mass or more and less than 25 parts by mass (e) Metal oxide: 5 parts by mass or more and less than 20 parts by mass [2] The communication device part according to [1], wherein the resin composition further contains (f) 5 parts by mass or more and less than 30 parts by mass of an inorganic filler per 100 parts by mass of the resin composition. [3] The communication device part according to [1] or [2], wherein the (b) polystyrene-based resin is at least one selected from the group consisting of atactic polystyrene, rubber-reinforced polystyrene, and syndiotactic polystyrene. [4] The communication device part according to any one of [1] to [3], wherein the (c) polyethylene-based resin is at least one selected from the group consisting of high-density polyethylene resin, low-density polyethylene resin, linear low-density polyethylene resin, very-low-density polyethylene resin, and ultra-high-molecular-weight polyethylene resin. [5] The communication device part according to any one of [1] to [4], wherein the (d) thermoplastic elastomer is a block copolymer containing at least one block mainly composed of aromatic vinyl monomer units and at least one block mainly composed of conjugated diene monomer units, and / or a hydrogenated product of the block copolymer. [6] The communication device part according to any one of [1] to [5], wherein the (e) metal oxide is a copper-containing metal oxide and / or a manganese-containing metal oxide having a spinel structure. [7] The communication device part according to any one of [1] to [6], wherein the resin composition has a dielectric constant of 3 or less and a dielectric loss tangent of 0.004 or less at a measurement frequency of 10 GHz. [8] The Charpy impact strength of the resin composition measured at 23°C according to ISO 179 standard is 15 kJ / m 2 The communication device component according to any one of [1] to [7] above. [9] The communication device component according to any one of [1] to [8], having a circuit formed by electroless copper plating. [Effects of the Invention]

[0010] The present invention can provide a communication device component that has low dielectric properties, excellent plating properties, and excellent strength. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, a mode for carrying out the present invention (hereinafter referred to as "the present embodiment") will be described in detail. The following present embodiment is an example for explaining the present invention, and the present invention is not limited to only this present embodiment, and the present invention can be carried out by appropriately modifying it within the scope of its gist.

[0012] The communication device part of this embodiment includes a resin composition, and the resin composition includes components (a) to (e) in the following mass proportions relative to 100 parts by mass of the total amount of the resin composition. (a) Polyphenylene ether resin: 10 parts by mass or more and less than 50 parts by mass (b) Polystyrene resin: 15 parts by mass or more and less than 70 parts by mass (c) Polyethylene resin: 1 part by mass or more but less than 25 parts by mass (d) Thermoplastic elastomer: 1 part by mass or more but less than 25 parts by mass (e) Metal oxide: 5 parts by mass or more but less than 20 parts by mass

[0013] <Resin composition> ((a) Polyphenylene ether resin) Specific examples of (a) polyphenylene ether resins (hereinafter sometimes simply referred to as "component (a)") include poly(2,6-dimethyl-1,4-phenylene ether), poly(2-methyl-6-ethyl-1,4-phenylene ether), poly(2-methyl-6-phenyl-1,4-phenylene ether), poly(2,6-dichloro-1,4-phenylene ether), and the like, as well as polyphenylene ether copolymers such as copolymers of 2,6-dimethylphenol with other phenols (for example, copolymers with 2,3,6-trimethylphenol and copolymers with 2-methyl-6-butylphenol as described in Japanese Patent Publication No. 17880 / 1977). Among these, particularly preferred polyphenylene ether resins are poly(2,6-dimethyl-1,4-phenylene ether), a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, or a mixture thereof.

[0014] Examples of the component (a) include a homopolymer having a repeating unit structure represented by the following formula (1) and a copolymer having a repeating unit structure represented by the following formula (1). The component (a) may be used alone or in combination of two or more. [ka] In the above formula (1), R 1 , R 2 , R 3 , and R 4 are each independently a monovalent group selected from the group consisting of a hydrogen atom, a halogen atom, a primary alkyl group having 1 to 7 carbon atoms, a secondary alkyl group having 1 to 7 carbon atoms, a phenyl group, a haloalkyl group, an aminoalkyl group, a hydrocarbonoxy group, and a halohydrocarbonoxy group in which at least two carbon atoms separate the halogen atom from the oxygen atom.

[0015] (a) The method for producing the polyphenylene ether resin is not particularly limited as long as it is a known method. Examples of the method include the method described in U.S. Pat. No. 3,306,874, in which a complex of a cuprous salt and an amine is used as a catalyst to oxidatively polymerize 2,6-xylenol, and the production methods described in U.S. Pat. Nos. 3,306,875, 3,257,357, and 3,257,358, JP-A Nos. 50-51197, JP-B Nos. 52-17880 and 63-152628, etc.

[0016] The reduced viscosity of the (a) polyphenylene ether resin (measured in a 0.5 g / dL chloroform solution at 30°C using an Ubbelohde viscometer) is preferably in the range of 0.30 to 0.80 dL / g, more preferably 0.35 to 0.75 dL / g, and most preferably 0.38 to 0.55 dL / g. When the (a) polyphenylene ether resin has a reduced viscosity in this range, it is preferable because it has excellent properties such as impact resistance and heat resistance. (a) In the polyphenylene ether resin, a blend of two or more polyphenylene ethers having different reduced viscosities can also be preferably used.

[0017] The component (a) may be a modified polyphenylene ether obtained by reacting the homopolymer and / or copolymer with a styrene-based monomer or a derivative thereof, and / or an α,β-unsaturated carboxylic acid or a derivative thereof, wherein the graft or addition amount of the styrene-based monomer or a derivative thereof and / or the α,β-unsaturated carboxylic acid or a derivative thereof is preferably 0.01 to 10% by mass relative to 100% by mass of the component (a). Examples of methods for producing the modified polyphenylene ether include a method in which the modified polyphenylene ether is reacted in the presence or absence of a radical generator in a molten state, solution state or slurry state at a temperature of 80 to 350°C.

[0018] As the polyphenylene ether, a mixture of the homopolymer and / or copolymer and the modified polyphenylene ether in any ratio may be used.

[0019] Various known stabilizers can be suitably used to stabilize the (a) polyphenylene ether resin. Examples of stabilizers include metal stabilizers such as zinc oxide and zinc sulfide, and organic stabilizers such as hindered phenol stabilizers, phosphorus stabilizers, and hindered amine stabilizers. The preferred amount of these stabilizers is less than 5 parts by mass per 100 parts by mass of the (a) polyphenylene ether resin. Furthermore, known additives that can be added to (a) polyphenylene ether-based resin may be added in an amount of less than 10 parts by mass per 100 parts by mass of (a) polyphenylene ether-based resin. The stabilizer and known additives mixed with the polyphenylene ether resin are components other than (a) the polyphenylene ether resin, and correspond to the other components described below.

[0020] The mass proportion of component (a) relative to 100 parts by mass of the resin composition is 10 parts by mass or more but less than 50 parts by mass, and from the viewpoint of obtaining a component with a low dielectric tangent in a wide temperature environment, it is preferably 17 to 45 parts by mass, and more preferably 20 to 40 parts by mass.

[0021] ((b) Polystyrene resin) Examples of the polystyrene resin include atactic polystyrene (GPPS), rubber-reinforced polystyrene (high impact polystyrene, HIPS), syndiotactic polystyrene (SPS), styrene-acrylonitrile copolymer (SAN) having a styrene content of 50% by mass or more, and ABS resin in which the styrene-acrylonitrile copolymer is rubber-reinforced, and atactic polystyrene and / or high impact polystyrene are preferred. The polystyrene resins may be used singly or in combination of two or more.

[0022] The mass proportion of (b) polystyrene resin relative to 100 parts by mass of the above resin composition is 15 parts by mass or more but less than 70 parts by mass, and from the viewpoint of the balance between the heat resistance and the dielectric tangent of the resin composition, it is preferably 17 to 65 parts by mass, and more preferably 20 to 60 parts by mass. The mass proportion of the (b) polystyrene resin relative to 100 parts by mass of the resin composition may be 5 to 80 parts by mass, 10 to 75 parts by mass, or 15 to 70 parts by mass.

[0023] ((c) Polyethylene resin) (c) The polyethylene resin is a homopolymer or copolymer of ethylene, and examples thereof include polyethylenes such as very low density polyethylene (VLDPE), low density polyethylene (LDPE), linear low density polyethylene (L-LDPE), high density polyethylene (HDPE), and ultra-high molecular weight polyethylene (UHMWPE); ethylene-α-olefin copolymers such as ethylene-propylene copolymer, ethylene-butene copolymer, and ethylene-octene copolymer; and ethylene-(meth)acrylic acid ester copolymers such as ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, and ethylene-ethyl acrylate-methyl methacrylate copolymer. The polyethylene resins may be used singly or in combination of two or more. Among these, high density polyethylene is preferred from the viewpoint of improving impact resistance and dielectric properties. High density polyethylene is preferred because of its high crystallinity.

[0024] The mass proportion of (c) polyethylene resin relative to 100 parts by mass of the above resin composition is 1 part by mass or more but less than 25 parts by mass, and from the viewpoint of the balance between impact resistance and dielectric loss tangent, it is preferably 2 to 20 parts by mass, and more preferably 3 to 15 parts by mass. The mass proportion of the (c) polyethylene resin relative to 100 parts by mass of the resin composition may be 1 to 35 parts by mass, 1 to 30 parts by mass, or 1 to 25 parts by mass.

[0025] ((d) Thermoplastic elastomer) The resin composition includes (d) a thermoplastic elastomer. (d) The thermoplastic elastomer refers to a block copolymer containing at least one aromatic vinyl polymer block mainly composed of aromatic vinyl monomer units and at least one conjugated diene polymer block mainly composed of conjugated diene monomer units, and / or a hydrogenated product of the block copolymer. The block copolymer is preferably a non-hydrogenated block copolymer. With regard to the aromatic vinyl polymer block, the phrase "mainly composed of aromatic vinyl monomer units" refers to a block in which aromatic vinyl monomer units account for 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and most preferably 90% by mass or more. Similarly, the term "mainly composed of conjugated diene monomer units" in the above conjugated diene polymer block refers to a block in which 50% by mass or more of conjugated diene monomer units are more preferably 70% by mass or more, even more preferably 80% by mass or more, and most preferably 90% by mass or more of conjugated diene monomer units. The aromatic vinyl polymer block may be, for example, a copolymer block in which a small amount of a conjugated diene compound is randomly bonded to an aromatic vinyl polymer block. Similarly, the conjugated diene polymer block may be, for example, a copolymer block in which a small amount of an aromatic vinyl compound is randomly bonded to a conjugated diene polymer block.

[0026] The aromatic vinyl compound used to form the aromatic vinyl monomer unit is not particularly limited, and examples thereof include styrene, α-methylstyrene, vinyltoluene, etc., and one or more compounds selected from these can be used, with styrene being particularly preferred.

[0027] The conjugated diene compound used to form the conjugated diene polymer block is not particularly limited, and examples thereof include butadiene, isoprene, piperylene, 1,3-pentadiene, etc., and one or more compounds selected from these can be used. Among these, butadiene, isoprene, and combinations thereof are preferred.

[0028] The microstructure of the conjugated diene polymer block portion of the block copolymer preferably has a 1,2-vinyl content or the total amount of the 1,2-vinyl content and the 3,4-vinyl content (total vinyl bond amount) of 5 to 85%, more preferably 10 to 80%. The total vinyl bond amount can be measured using an infrared spectrophotometer.

[0029] The non-hydrogenated block copolymer used to produce the hydrogenated product of the block copolymer (hydrogenated block copolymer) is preferably a block copolymer in which the aromatic vinyl polymer block (A) and the conjugated diene polymer block (B) have a bonding type selected from AB, ABA, and ABAB. Among these, block copolymers having different bonding types may be used in combination. Among these, a bonding type selected from ABA and ABAB is more preferred, and an ABA bonding type is even more preferred.

[0030] Component (d) is preferably a partially hydrogenated block copolymer (partially hydrogenated block copolymer). The partially hydrogenated block copolymer is a block copolymer obtained by subjecting the above-mentioned unhydrogenated block copolymer to a hydrogenation treatment, thereby controlling the aliphatic double bonds in the conjugated diene polymer block to a range of more than 0% and less than 100%. The hydrogenation rate of the partially hydrogenated block copolymer is preferably 50% or more and less than 100%, more preferably 80% or more and less than 100%, and most preferably 98% or more and less than 100%.

[0031] Component (d) preferably has a number average molecular weight of at least 30,000 but less than 300,000. When the molecular weight is within this range, a composition with excellent flowability, impact strength, and flame retardancy can be obtained. The method for evaluating the number-average molecular weight of component (d) is as follows. Component (d) is separated using a solvent that is soluble in component (d) but poorly soluble in (a) polyphenylene ether resin, (b) polystyrene resin, and (c) polyethylene resin, such as chloroform. This is measured using a gel permeation chromatography (GPC) system 21 (Showa Denko K.K.) and an ultraviolet spectrophotometer (UV-41 (Showa Denko K.K.)), and the number-average molecular weight is calculated using standard polystyrene. The measurement conditions may be as follows: solvent: chloroform, temperature: 40°C, columns: sample side (KG, K-800RL, K-800R), reference side (K-805L x 2), flow rate: 10 mL / min, measurement wavelength: 254 nm, pressure: 15 to 17 kg / cm 2 )]. Furthermore, when measuring the number average molecular weight, low molecular weight components may be detected due to catalyst deactivation during polymerization. In such cases, these low molecular weight components are not included in the molecular weight calculation. The low molecular weight components refer to components with a molecular weight of 3,000 or less. The calculated correct molecular weight distribution (weight average molecular weight / number average molecular weight) is usually within the range of 1.0 to 1.1.

[0032] As these block copolymers as component (d), as long as it does not deviate from the spirit of this embodiment, two or more types of block copolymers having different bonding forms, different aromatic vinyl compound types, different conjugated diene compound types, different 1,2-vinyl bond contents or different 1,2-vinyl bond contents and 3,4-vinyl bond contents, different aromatic vinyl compound component contents, different hydrogenation rates, etc. may be mixed and used.

[0033] These block copolymers as component (d) may be block copolymers that have been completely or partially modified. The modified block copolymer referred to here refers to a block copolymer modified with at least one modifying compound having at least one carbon-carbon double bond or triple bond and at least one carboxylic acid group, acid anhydride group, amino group, hydroxyl group, or glycidyl group in its molecular structure.

[0034] The modified block copolymer can be produced, in the presence or absence of a radical initiator, by (1) melt-kneading and reacting with a modifying compound in a temperature range of not less than the softening point of the block copolymer but not more than 250°C, (2) reacting the block copolymer with a modifying compound in a solution at a temperature not more than the softening point of the block copolymer, or (3) reacting the block copolymer with a modifying compound at a temperature not more than the softening point of the block copolymer without melting them. Although any of these methods may be used, method (1) is preferred, and among method (1), the method carried out in the presence of a radical initiator is most preferred. The "at least one modified compound having at least one carbon-carbon double bond or triple bond and at least one carboxylic acid group, acid anhydride group, amino group, hydroxyl group or glycidyl group in the molecular structure" used here can be the same modified compound as described for the modified polyphenylene ether.

[0035] The mass proportion of the (d) thermoplastic elastomer relative to 100 parts by mass of the above resin composition is 1 part by mass or more but less than 25 parts by mass, and from the viewpoint of the balance between impact resistance and dielectric tangent, it is preferably 2 to 20 parts by mass, and more preferably 3 to 15 parts by mass. The mass proportion of the (d) thermoplastic elastomer relative to 100 parts by mass of the resin composition may be 1 to 35 parts by mass, 1 to 30 parts by mass, or 1 to 25 parts by mass.

[0036] (e) Metal oxides The metal oxide (e) is a metal oxide capable of forming elemental metal nuclei upon irradiation with electromagnetic radiation, and is a metal-containing compound that liberates the metal in elemental form in a chemical reaction as a result of absorbing electromagnetic radiation. Rather than allowing the metal-containing compound to directly absorb the electromagnetic radiation, it is also possible for the electromagnetic radiation to be absorbed by another substance that subsequently transfers the absorbed energy to the metal-containing compound, thereby liberating the elemental metal. The electromagnetic radiation is preferably laser light to release heavy metal nuclei, and its wavelength can be selected from a variety of wavelengths as described in paragraph 0017 of JP-A-2004-534408.

[0037] Preferred examples of the metal oxide (e) include heavy metal composite oxide spinels such as copper chromium oxide (CuCr2O4), copper salts such as copper hydroxide phosphate, copper phosphate, copper sulfate, and copper thiocyanate, and antimony-containing tin oxides such as antimony-doped tin oxide. Of these, copper chromium oxide or antimony-containing tin oxide is more preferred.

[0038] The average particle size of the metal oxide (e) is preferably 0.01 to 50 μm, more preferably 0.05 to 30 μm. By adjusting the particle size to such an extent, the uniformity of the plating surface state when plating is applied tends to be improved. The average particle size of the metal oxide (e) can be measured and analyzed by dispersing the particulate inorganic filler in water using a laser diffraction particle size analyzer (e.g., Shimadzu Corporation, product name: SALD-2000). The particulate inorganic filler can be dispersed in water by adding water and the particulate inorganic filler to a stirring tank equipped with an ultrasonic diffuser and / or a stirrer. This dispersion is pumped into the measurement cell of the laser diffraction particle size analyzer, and the particle size is measured by laser diffraction. The number-average particle size can be calculated from the frequency distribution of particle size and particle number obtained by the measurement.

[0039] The mass proportion of the (e) metal oxide relative to 100 parts by mass of the resin composition is 5 parts by mass or more but less than 20 parts by mass, and from the viewpoints of high plating formability and low dielectric constant and dielectric loss tangent, it is preferably 6 to 17 parts by mass, more preferably 7 to 15 parts by mass. The mass proportion of the (e) metal oxide relative to 100 parts by mass of the resin composition may be 3 to 25 parts by mass, 4 to 23 parts by mass, or 5 to 20 parts by mass.

[0040] ((f) inorganic filler) In addition to the components described above, an inorganic filler can be added to the thermoplastic resin composition of the present embodiment at any stage as needed. Adding an inorganic filler improves rigidity and suppresses dimensional changes. The inorganic filler is a component other than the above-mentioned components.

[0041] Examples of inorganic fillers include fibrous, granular, plate-like, or needle-like inorganic reinforcing materials such as glass fiber, potassium titanate fiber, gypsum fiber, brass fiber, ceramic fiber, boron whisker fiber, mica, talc, silica, calcium carbonate, kaolin, calcined kaolin, wollastonite, xonotlite, apatite, glass beads, glass flakes, and titanium oxide. These inorganic fillers can be used in combination of two or more. Among these, glass fiber, glass flakes, and glass beads are more preferred. Furthermore, inorganic fillers that have been surface-treated by a known method using a surface treatment agent such as a silane coupling agent may also be used. However, natural mineral fillers often contain trace amounts of iron, so they must be purified to remove the iron.

[0042] The mass proportion of the (f) inorganic filler relative to 100 parts by mass of the resin composition is preferably 5 parts by mass or more but less than 30 parts by mass, more preferably 7 to 25 parts by mass, and even more preferably 10 to 20 parts by mass, from the viewpoint of improving rigidity and dimensional properties and preventing deterioration of dielectric properties. The mass ratio of the (f) inorganic filler to 100 parts by mass of the resin composition may be 3 to 40 parts by mass, 4 to 35 parts by mass, or 5 to 30 parts by mass.

[0043] (Other ingredients) In addition to the components described above, the resin composition may contain other ingredients such as colorants, flame retardants, plasticizers (low-molecular-weight polyolefins, polyethylene glycol, fatty acid esters, etc.), antistatic agents, nucleating agents, flow improvers, reinforcing agents, various peroxides, spreading agents, organic stabilizers such as stabilizers (hindered phenol stabilizers, phosphorus-based stabilizers, hindered amine stabilizers, etc.), antioxidants, ultraviolet absorbers, light stabilizers, release agents, antiblocking agents, lubricants such as ethylene bisstearamide, and modifiers such as maleic anhydride. The total amount of the other components added is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, when the total amount of the resin composition is 100% by mass. In the resin composition, it is preferred that the total of components (a), (b), (c), (d), (e), optional component (f), and other components be 100% by mass.

[0044] -Coloring agent- As the colorant, one or more colorants selected from known organic dyes and pigments and inorganic pigments can be used.

[0045] Examples of organic dyes and pigments include azo pigments such as azo lake pigments, benzimidazolone pigments, diarylide pigments, and condensed azo pigments; phthalocyanine pigments such as phthalocyanine blue and phthalocyanine green; condensed polycyclic pigments such as isoindolinone pigments, quinophthalone pigments, quinacridone pigments, perylene pigments, anthraquinone pigments, perinone pigments, and dioxazine violet; azine pigments; and carbon black. Among these, the carbon black should have a dibutyl phthalate (DBP) absorption of less than 250 mL / 100 g, preferably less than 150 mL / 100 g, and a nitrogen adsorption specific surface area of 900 m 2 / g, more preferably less than 400m 2 When these are in this range, a composition that is particularly excellent in colorability, mechanical strength, and flame retardancy can be obtained. The DBP absorption amount and nitrogen adsorption specific surface area referred to here are values measured by the methods specified in ASTM D2414 and JIS K6217, respectively. Examples of azine dyes include Solvent Black 5 (CI 50415, CAS No. 11099-03-9), Solvent Black 7 (CI 50415:1, CAS No. 8005-20-5 / 101357-15-7), and Acid Black 2 (CI 50420, CAS No. 8005-03-6 / 68510-98-5) in the Color Index. Examples of inorganic pigments include composite metal oxides such as titanium yellow, cobalt blue, and ultramarine.

[0046] -Flame retardant- As the flame retardant, one or more known flame retardants and flame retardant auxiliaries can be used. Examples of flame retardants include phosphate esters, phosphinates, alkaline earth metal hydroxides such as magnesium hydroxide, aluminum hydroxide, alkali metal hydroxides, zinc borate compounds, and zinc stannate compounds, with phosphate esters being preferred. Examples of phosphate ester-based flame retardants include triphenyl phosphate, trisnonylphenyl phosphate, resorcinol bis(diphenyl phosphate), resorcinol bis[di(2,6-dimethylphenyl)phosphate], 2,2-bis{4-[bis(phenoxy)phosphoryloxy]phenyl}propane, and 2,2-bis{4-[bis(methylphenoxy)phosphoryloxy]phenyl}propane. In addition to the above, for example, phosphate ester flame retardants such as trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, tricresyl phosphate, cresyl phenyl phosphate, octyl diphenyl phosphate, and diisopropyl phenyl phosphate; diphenyl-4-hydroxy-2,3,5,6-tetrabromobenzyl phosphonate, dimethyl-4-hydroxy-3,5-dibromobenzyl phosphonate, and diphenyl-4-hydroxy-3,5-dibromobenzyl Examples of the monophosphate ester compounds include monophosphate ester compounds such as phosphate, tris(chloroethyl)phosphate, tris(dichloropropyl)phosphate, tris(chloropropyl)phosphate, bis(2,3-dibromopropyl)-2,3-dichloropropylphosphate, tris(2,3-dibromopropyl)phosphate, bis(chloropropyl)monoctylphosphate hydroquinonyldiphenylphosphate, phenylnonylphenylhydroquinonylphosphate, and phenyldinonylphenylphosphate; and aromatic condensed phosphate ester compounds. Among these, aromatic condensed phosphate ester compounds are preferred because they generate less gas during processing and have excellent thermal stability.

[0047] (Method of producing resin composition) The resin composition can be produced by melt-kneading the components (a) to (e), and, if necessary, the inorganic filler (f) and other components.

[0048] The melt kneader used for melt kneading is not limited to, but includes, for example, a single-screw extruder, a multi-screw extruder including a twin-screw extruder, a roll, a kneader, a Brabender Plastograph, a Banbury mixer, etc., and from the viewpoint of kneading properties, a twin-screw extruder is particularly preferred. Specific examples include the ZSK series manufactured by Werner & Pfleiderer, the TEM series manufactured by Toshiba Machine Co., Ltd., and the TEX series manufactured by The Japan Steel Works, Ltd.

[0049] The melt-kneading temperature at this time can be selected so that the amorphous resins such as (a) polyphenylene ether resin and (b) polystyrene resin can be heated to melt and processed without difficulty, and can usually be selected from the range of 200 to 370°C.

[0050] A preferred production method using an extruder is described below.

[0051] The L / D (effective barrel length / inner barrel diameter) of the extruder is preferably 20 or more and 60 or less, and more preferably 30 or more and 50 or less.

[0052] The melt-kneading temperature and screw rotation speed in the melt-kneading step of the resin composition are not particularly limited, but can be selected so that the resin can be heated and melted without difficulty and processed at a temperature equal to or higher than the melting point of the crystalline resin for the crystalline resin, or at a temperature equal to or higher than the glass transition temperature of the amorphous resin for the amorphous resin. Typically, the temperature is selected arbitrarily from 200 to 370°C, and the screw rotation speed is 100 to 1200 rpm.

[0053] Furthermore, to reduce the generation of crosslinked or charred resins due to thermal history in the presence of oxygen, it is preferable to maintain the oxygen concentration of each raw material in the process line of the extruder at less than 1.0% by volume. The above-mentioned addition route is not particularly limited, but a specific example may include, in order from a stock tank, piping, a gravimetric feeder with a refill tank, piping, a supply hopper, and a twin-screw extruder. A method for maintaining such a low oxygen concentration is not particularly limited, but an effective method is to introduce an inert gas into each process line with increased airtightness. Usually, it is preferable to introduce nitrogen gas to maintain the oxygen concentration at less than 1.0% by volume.

[0054] The above-described method for producing a resin composition has the effect of further reducing residues in the screws of a twin-screw extruder when the thermoplastic resin in the components contains a powdery component (having a volume average particle size of less than 10 μm) when the resin composition is produced using a twin-screw extruder, and further has the effect of reducing the occurrence of black spots, carbonized matter, and the like in the resin composition obtained by the above-described production method.

[0055] (Characteristics of resin composition) The properties of the resin composition will be described below.

[0056] -Dielectric constant, dielectric loss tangent- The resin composition preferably has a dielectric constant of 3 or less and a dielectric loss tangent of 0.004 or less at a measurement frequency of 10 GHz. When the resin composition further contains (f) an inorganic filler, it is preferable that the dielectric constant at a measurement frequency of 10 GHz is 3 or less and the dielectric loss tangent is 0.005 or less. The dielectric constant and dielectric loss tangent can be measured by the method described in the examples below.

[0057] -Charpy strength- The Charpy impact strength of the resin composition in this embodiment is 15 kJ / m when measured at 23°C according to ISO 179 standard. 2 It is preferable that this is equal to or greater than this. The Charpy strength can be measured by the method described in the Examples below.

[0058] [Communication equipment parts] The communication device part of the present embodiment contains the resin composition. Among these, a part in which a metal is plated on a portion of the surface of an article molded from the resin composition is preferred. In this case, the communication device part of this embodiment consists only of an article molded from the resin composition and the metal used for plating. The communication device part preferably has a circuit formed by electroless copper plating. For example, an article molded from the resin composition may have a circuit formed by electroless copper plating on a portion of the surface. A method for manufacturing a communication device part of this embodiment includes, for example, irradiating a laser onto the surface of a molded article of the resin composition to activate (e) a metal oxide, and then metal plating the activated metal oxide. The communication device component of this embodiment can be used, for example, as communication antennas for mobile communication devices such as smartphones and mobile game devices; antennas for communication base stations and the like; communication antenna components for Bluetooth, Wi-Fi, and the like for home appliances, wireless headphones, wireless earphones, and the like; antenna components for radio-controlled devices such as drones; antenna components for communication devices such as millimeter-wave radar, ETC, and DCM mounted on vehicles; and antenna components for various industrial sensors. [Example]

[0059] The present embodiment will be described in more detail below with reference to examples and comparative examples, but the present embodiment is not limited to these examples.

[0060] The raw materials and evaluation methods used in the examples and comparative examples are shown below.

[0061] [raw materials] (a) Polyphenylene ether resin (a-1) Polyphenylene ether resin obtained by oxidative polymerization of 2,6-xylenol The reduced viscosity of the polyphenylene ether resin (0.5 g / dL, chloroform solution, measured at 30° C.) was 0.52 dL / g. (a-2) Polyphenylene ether resin obtained by oxidative polymerization of 2,6-xylenol The reduced viscosity of the polyphenylene ether resin (0.5 g / dL, chloroform solution, measured at 30° C.) was 0.40 dL / g. (a-3) Polyphenylene ether resin obtained by oxidative polymerization of 2,6-xylenol The reduced viscosity of the polyphenylene ether resin (0.5 g / dL, chloroform solution, measured at 30° C.) was 0.32 dL / g. (b) Polystyrene resin (b-1) Polystyrene ("GPPS685" manufactured by PS Japan Co., Ltd.) (b-2) High impact polystyrene (HIPS "CT-60" manufactured by Petrochemicals Co., Ltd.) (c) Polyethylene resin (c-1) High-density polyethylene resin ("Suntech-HD B161" manufactured by Asahi Kasei Corporation) (c-1) High-density polyethylene resin ("Suntech-HD J320" manufactured by Asahi Kasei Corporation) (c-1) High-density polyethylene resin ("Creolex T701A" manufactured by Asahi Kasei Corporation) (d) Thermoplastic elastomer (d-1) Hydrogenated block copolymer (Tuftec H1051 manufactured by Asahi Kasei Corporation) (d-2) Hydrogenated block copolymer (Tuftec H1272 manufactured by Asahi Kasei Corporation) (e) Metal oxides (e-1) Copper chromium oxide ("LD14" manufactured by Shepherd Color Japan Inc.) (f) inorganic fillers (f-1) Glass fiber (Nippon Electric Glass Co., Ltd. ECS03-T249) (f-2) Glass flakes (MEG160FY M06, manufactured by Nippon Sheet Glass)

[0062] [Evaluation method] The evaluation tests carried out in the examples and comparative examples were carried out as follows.

[0063] (1) Dielectric constant and dielectric loss tangent The obtained resin composition pellets were fed into a small injection molding machine (product name: EC75-SXII, manufactured by Toshiba Machine Co., Ltd.) with a cylinder temperature set to 280 to 320°C, and a 55 mm x 55 mm x 0.9 mm flat plate was produced under the conditions of a mold temperature of 80°C, an injection pressure of 100 MPa, an injection time of 15 seconds, and a cooling time of 20 seconds, and measured under the conditions below. The test pieces were left to stand in an atmosphere of 23°C and 50% RH for at least 24 hours, and then the dielectric constant (Dk) and dielectric loss tangent (Df) were measured under the following conditions using a network analyzer (model: N5224B, Keysight Technologies) in an atmosphere of 23°C and 50% RH. The dielectric constant and dielectric loss tangent were calculated from the average values of three test pieces, and the lower these values were considered to be the better the dielectric properties. Resonator: Split-post dielectric resonator (model: N1501AE10, Keysight Technologies) Frequency: 10GHz

[0064] (2) Charpy impact strength The resulting resin composition pellets were fed into a small injection molding machine (product name: EC75-SXII, manufactured by Toshiba Machine Co., Ltd.) with a cylinder temperature set to 280-320°C, and ISO-A dumbbells for evaluation were produced under the following conditions: mold temperature 80°C, injection pressure 100 MPa, injection time 15 seconds, and cooling time 25 seconds. The ISO dumbbells were also cut to produce test pieces for Charpy impact testing. Using the above Charpy impact test piece, impact strength (ISO 179) (unit: kJ / m) was measured under an environment of 23°C x 50% RH. 2 The larger the value, the better the impact resistance was judged to be.

[0065] (3) LDS plating The resulting resin composition pellets were fed into a compact injection molding machine (product name: EC75-SXII, manufactured by Toshiba Machine Co., Ltd.) with a cylinder temperature set to 280-320°C. A 60mm x 60mm x 2.0mm plate was fabricated under the following conditions: mold temperature 80°C, injection pressure 100MPa, injection time 15 seconds, and cooling time 20 seconds. The plate was activated using a laser irradiator (product name "Micro Line 3D16 0", manufactured by LPKF). It was then plated in an electroless copper plating bath (product name "MID copper 100B1", manufactured by McDermid) at 57°C for 45 minutes. Plating performance was evaluated visually by the thickness of the plated copper, according to the following criteria: ◎ (Excellent): The copper color is deep and the plating is thick. 〇 (Good): Plating is on but a little thin × (bad): No plating at all

[0066] [Examples 1 to 9, Comparative Examples 1 to 5] The resin compositions were compounded according to the formulations shown in Table 1 and produced using a twin-screw extruder ZSK-40 (manufactured by COPERION WERNER & PFLEIDERER, Germany). In this twin-screw extruder, a first raw material supply port was provided upstream of the raw material flow direction, a first vacuum vent was provided downstream of this, and a second vacuum vent was provided further downstream of that. Using the extruder set up as described above, each component was added according to the composition shown in Table 1, and melt-kneaded under conditions of an extrusion temperature of 250 to 320°C, a screw rotation speed of 300 rpm, and a discharge rate of 100 kg / hour to produce pellets. The resin composition pellets thus obtained were subjected to the above-mentioned evaluations. The evaluation results are shown in Table 1.

[0067] [Table 1] [Industrial Applicability]

[0068] The communication device part of the present invention, which is an LDS molded product, can be suitably used in mobile terminal devices such as smartphones, antennas for communication base stations, etc., and has industrial applicability.

Claims

1. A communication device part comprising a resin composition, The resin composition contains components (a) to (e) in the following mass ratios relative to 100 parts by mass of the total amount of the resin composition, the (d) thermoplastic elastomer is a block copolymer containing at least one block mainly composed of aromatic vinyl monomer units and at least one block mainly composed of conjugated diene monomer units, and / or a hydrogenated product of the block copolymer; The (e) metal oxide is a copper-containing metal oxide having a spinel structure. A communication device part characterized by: (a) Polyphenylene ether resin: 10 parts by mass or more and less than 50 parts by mass (b) Polystyrene resin: 15 parts by mass or more and less than 70 parts by mass (c) Polyethylene resin: 1 part by mass or more and less than 25 parts by mass (d) Thermoplastic elastomer: 1 part by mass or more and less than 25 parts by mass (e) Metal oxide: 5 parts by mass or more and less than 20 parts by mass

2. The communication device part according to claim 1 , wherein the resin composition further comprises (f) 5 parts by mass or more and less than 30 parts by mass of an inorganic filler per 100 parts by mass of the resin composition.

3. 3. The communication device part according to claim 1, wherein the polystyrene resin (b) is at least one selected from the group consisting of atactic polystyrene, rubber-reinforced polystyrene, and syndiotactic polystyrene.

4. 4. The communication device part according to claim 1, wherein the (c) polyethylene-based resin is at least one selected from the group consisting of high-density polyethylene resin, low-density polyethylene resin, linear low-density polyethylene resin, very-low-density polyethylene resin, and ultra-high-molecular-weight polyethylene resin.

5. 5. The communication device part according to claim 1, wherein the resin composition has a dielectric constant of 3 or less and a dielectric loss tangent of 0.004 or less at a measurement frequency of 10 GHz.

6. The Charpy impact strength of the resin composition measured at 23°C according to ISO 179 standard is 15 kJ / m ２ The communication device component according to any one of claims 1 to 5.

7. 7. The communication device component according to claim 1, further comprising a circuit formed by electroless copper plating.

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