Wiring structure and touch sensor using same

The flexible wiring board with detection terminals addresses terminal disconnection issues in touch sensors, allowing for pre-shipment detection and maintaining narrow frame designs.

JP7738263B2Active Publication Date: 2025-09-12PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2022007640
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-01-21
Publication Date
2025-09-12
Estimated Expiration
2042-01-21

AI Technical Summary

Technical Problem

Touch sensors face issues with wiring terminal disconnection due to shear stress during manufacturing, leading to potential malfunctions and difficulty in achieving narrow frame sizes without detectable damage.

Method used

A flexible wiring board with detection terminal portions forms an electrical conduction path to detect breaks in wiring terminals, allowing for pre-shipment detection of disconnections.

Benefits of technology

Enables detection of wiring terminal damage before shipment, ensuring functional integrity and enabling narrow frame designs in touch sensors.

✦ Generated by Eureka AI based on patent content.

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Abstract

To appropriately detect the presence or absence of disconnection in a wiring terminal portion.SOLUTION: A wiring structure includes one wiring terminal portion 31 for detection having a detected region, a first detection terminal portion 36, and a second detection terminal portion 38, and the detected region includes a first region 33 and a second region 34. A conductive path 39 formed by the first and second detection terminal portions 36 and 38 and the detected region is configured to detect the presence or absence of disconnection in the first region 33 in the range from the tip of the first detection terminal portion 36 to the tip of the second detection terminal portion 38.SELECTED DRAWING: Figure 6
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Description

[Technical Field]

[0001] The present disclosure relates to a wiring structure and a touch sensor using the same. [Background technology]

[0002] For example, in the technical field of touch sensors, a configuration such as that shown in Patent Document 1 has been conventionally known.

[0003] Patent Document 1 discloses a touch sensor including a substrate. The substrate is provided with a plurality of sensor electrodes (transparent conductive patterns), a plurality of wiring portions (extraction conductive patterns) each having one end electrically connected to each sensor electrode, and a plurality of wiring terminal portions formed on the other end side of each wiring portion. The plurality of wiring terminal portions are arranged in a non-sensor region (non-display region) of the substrate that is located outside a sensor region (display region) in which the plurality of sensor electrodes are located. The plurality of wiring terminal portions are arranged near the outer edge of the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5168377 Summary of the Invention [Problem to be solved by the invention]

[0005] In the technical field of touch sensors, for example, a typical manufacturing process for a substrate used in a touch sensor involves punching (machining) a base material from which the substrate is made using, for example, a Thomson blade. Typically, the base material has a plurality of sensor electrodes, a plurality of wiring portions, and a plurality of wiring terminal portions pre-formed. By punching the base material, a substrate having a predetermined shape (for example, a rectangular shape) is obtained.

[0006] The outer edge of the substrate obtained by the punching process corresponds to the position cut by the Thomson blade. That is, deformation is likely to occur near the outer edge of the substrate due to the shear stress of the Thomson blade when the punching process is performed.

[0007] Meanwhile, in the technical field of touch sensors, for example, there has been a recent demand for narrower frame sizes for touch sensors in order to improve product appeal. For example, the touch sensor of Patent Document 1 is configured so that multiple wiring terminals are located near the outer edge of the substrate. This configuration narrows the non-sensor area (non-display area), contributing to a narrower frame size for the touch sensor.

[0008] However, during the punching process, multiple wiring terminals located near the outer edge of the substrate are susceptible to the shear stress of the Thomson blade. Specifically, after the punching process, damage such as cracks may occur in the wiring terminals in a direction approximately parallel to the cutting direction of the Thomson blade (i.e., the direction along the outer edge of the substrate). When such damage occurs, the wiring terminals may become disconnected, which may result in poor electrical continuity.

[0009] In contrast, the touch sensor of Patent Document 1 is not configured to be able to detect the presence or absence of wire breakage, even if the wire terminals are broken due to the punching process, for example, before shipping the product. As a result, there is a risk that the touch sensor will malfunction before the end of its original design life in the market.

[0010] On the other hand, in order to avoid the above-mentioned disconnection, it is conceivable to arrange the wiring terminals at positions away from the outer edge of the substrate. However, in the technical field of touch sensors, for example, a configuration in which the wiring terminals are arranged at positions away from the outer edge of the substrate inevitably makes it difficult to achieve the above-mentioned narrow frame. As a result, the product appeal of the touch sensor is reduced.

[0011] The present disclosure has been made in consideration of such points, and its purpose is to make it possible to properly detect whether or not a wiring terminal portion is broken, for example, before the product is shipped, even if the wiring terminal portion is broken due to the punching process. [Means for solving the problem]

[0012] To achieve the above object, a wiring structure according to an embodiment of the present disclosure includes a substrate and a flexible wiring board attachable to the substrate. The substrate is provided with at least one wiring terminal portion for detection having a detection area. The detection area includes a first area and a second area extending from the first area toward the outer edge of the substrate located nearest thereto. The second area is configured so that its width in a direction parallel to the outer edge of the substrate located nearest thereto is smaller than the width of the first area. The flexible wiring board includes first and second detection terminal portions arranged substantially parallel to each other so as to be electrically independent from each other and facing the wiring terminal portion for detection on the substrate. The tip end of the first detection terminal portion is arranged near the outer edge of the flexible wiring board. The tip end of the second detection terminal portion is arranged at a position farther from the outer edge of the flexible wiring board than the tip end of the first detection terminal portion. When the flexible wiring board is attached to the substrate, the first detection terminal overlaps the first region and the second detection terminal overlaps the second region, and an electrical conduction path is formed by the first and second detection terminals and the detected region. The conduction path is configured to enable detection of a break in the first region in the range from the tip of the first detection terminal to the tip of the second detection terminal. [Effects of the Invention]

[0013] According to the present disclosure, it is possible to appropriately detect whether or not a wire is broken in a wiring terminal portion. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is an overall perspective view of a touch sensor according to an embodiment of the present disclosure. [Figure 2]FIG. 2 is a perspective view that schematically shows the state in which the first substrate and the second substrate are stacked, as viewed from the front side of the touch sensor. [Figure 3] FIG. 3 is a plan view schematically illustrating each component provided on the first substrate as viewed from the front side of the touch sensor. [Figure 4] FIG. 4 is a plan view schematically illustrating each component provided on the second substrate as viewed from the front side of the touch sensor. [Figure 5] FIG. 5 is a partially enlarged view schematically showing the lower right side of the page of FIG. 2 before the flexible wiring board is attached to the substrate (the front side of the second substrate). [Figure 6] FIG. 6 is a partially enlarged view schematically showing the lower right side of the page of FIG. 2 in a state where the flexible wiring board is attached to the substrate (the front side of the second substrate). DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following description of the embodiments is merely exemplary in nature and is not intended to limit the present disclosure, its applications, or its uses.

[0016] 1 shows an entire touch sensor 1 according to an embodiment of the present disclosure. The touch sensor 1 is a capacitive sensor-type input device that can be operated by touch. The touch sensor 1 is used as an input device for, for example, in-vehicle devices such as car navigation systems, display devices for personal computers, mobile phones, personal digital assistants, portable game machines, copy machines, ticket machines, automated teller machines, watches, and the like.

[0017] In the following description, the side on which an operation surface 4 (described later) is located is referred to as the "front side" of the touch sensor 1, and the opposite side is referred to as the "back side" of the touch sensor 1, and the positional relationship of each element constituting the touch sensor 1 is defined accordingly. In addition, in this embodiment, for the sake of convenience of description, the direction from the left to the right on the paper surface of each figure is defined as the X direction, and the direction from the bottom to the top on the paper surface of each figure is defined as the Y direction.

[0018] (Cover member) 1, the touch sensor 1 includes a light-transmitting cover member 2. The cover member 2 is made of, for example, a cover glass or a plastic cover lens. The cover member 2 is formed in the shape of, for example, a rectangular plate in a plan view.

[0019] A substantially frame-shaped decorative portion 3 is formed on the periphery of the rear surface of the cover member 2 by screen printing or the like and is dark in color, such as black. The rectangular area inside surrounded by this decorative portion 3 is a light-transmitting sensor area S1 (see FIGS. 2 to 4). A user can obtain visual information from a display panel (not shown) arranged on the rear side of the touch sensor 1 through the sensor area S1. The area on the surface of the cover member 2 corresponding to the sensor area S1 is configured as an operation surface 4 that comes into contact with the user's fingers or the like when performing a touch operation. The area located outside the sensor area S1 (the area where the decorative portion 3 is located) is a non-sensor area S2.

[0020] (substrate) As shown in Fig. 2, the touch sensor 1 includes a substrate 5. As shown in Fig. 3 and Fig. 4, the substrate 5 is composed of a first substrate 6 and a second substrate 7. Each of the first and second substrates 6 and 7 has a substantially rectangular shape in a plan view.

[0021] Each of the first substrate 6 and the second substrate 7 is made of a transparent resin material. Examples of transparent resin materials include PET (polyethylene terephthalate), polycarbonate, COP (cycloolefin polymer), and COC (cycloolefin copolymer).

[0022] The first substrate 6 is stacked such that the surface of the first substrate 6 faces the back surface of the second substrate 7 via an adhesive layer (not shown). The second substrate 7 is stacked such that the surface of the second substrate 7 faces the back surface of the cover member 2 via an adhesive layer (not shown). The adhesive layer is an optically transparent adhesive (OCA: Optical Clear Adhesive). The thickness of the adhesive layer is preferably 25 μm to 250 μm.

[0023] As shown in Fig. 4, an opening 8 is formed in the peripheral edge of the second substrate 7, recessed from the side located on the lower side of the paper surface of Fig. 4 toward the Y-axis direction. This opening 8 is configured so that a plurality of first wiring portions 13 (described later) formed on the first substrate 6 are exposed on the front side of the touch sensor 1 when the first substrate 6 and the second substrate 7 are stacked.

[0024] (sensor electrode) As shown in Figures 2 to 4, the touch sensor 1 includes a plurality of capacitance-type sensor electrodes 10. The plurality of sensor electrodes 10 are composed of a plurality of transmitting electrodes 11 and a plurality of receiving electrodes 12. In Figures 2 to 4, each sensor electrode 10 is hatched with dots to clearly indicate it.

[0025] The transmitting electrode 11 and the receiving electrode 12 are made of a transparent material (transparent conductive film) having optical transparency, such as indium tin oxide or tin oxide. Alternatively, the transmitting electrode 11 and the receiving electrode 12 may be formed as a mesh pattern in which thin wires made of a conductive metal material such as copper or a conductive resin material are arranged in a mesh shape.

[0026] The plurality of transmitting electrodes 11 and the plurality of receiving electrodes 12 are arranged in the sensor area S1. The touch sensor 1 is capable of detecting a touch operation by a user's finger (detection target) that touches the operation surface 4 through the plurality of transmitting electrodes 11 and the plurality of receiving electrodes 12 located in the sensor area S1.

[0027] The plurality of transmitting electrodes 11 are arranged on the surface of the first substrate 6 (see FIG. 3). On the other hand, the plurality of receiving electrodes 12 are arranged on the surface of the second substrate 7 (see FIG. 4). The plurality of transmitting electrodes 11 and the plurality of receiving electrodes 12 are insulated from each other via the second substrate 7 when the first substrate 6 and the second substrate 7 are stacked.

[0028] Each transmitter electrode 11 is connected to a drive circuit (not shown) via a flexible wiring board 20 (described later). Each transmitter electrode 11 is configured to radiate an electric field to the surroundings by the drive circuit. As shown in FIG. 3, each transmitter electrode 11 has a substantially rectangular shape in plan view. Specifically, each transmitter electrode 11 extends in a substantially strip-like shape so that its width in the X direction is constant along the Y direction in plan view. Furthermore, the multiple transmitter electrodes 11 are arranged side by side in the X direction.

[0029] Each receiving electrode 12 is connected to a detection circuit (not shown) via a flexible wiring board 20 (described later). Each receiving electrode 12 is configured to receive an electric field radiated from each transmitting electrode 11. As shown in FIG. 4, each receiving electrode 12 extends along the X direction. Specifically, each receiving electrode 12 has a substantially rectangular shape in a plan view. The multiple receiving electrodes 12 are arranged side by side at intervals in the Y direction.

[0030] In this embodiment, each receiving electrode 12 is configured to be thinner than each transmitting electrode 11, but the present invention is not limited to such a configuration. For example, the width of each receiving electrode 12 and the width of each transmitting electrode 11 may be the same size.

[0031] (Wiring section) 2 to 4, the touch sensor 1 includes a plurality of first wiring portions 13 and a plurality of second wiring portions 14. The plurality of first wiring portions 13 and the plurality of second wiring portions 14 are elements for electrically connecting the plurality of sensor electrodes 10 to an external circuit (not shown).

[0032] The first wiring portions 13 and the second wiring portions 14 are made of a transparent material (transparent conductive film) having optical transparency, such as indium tin oxide or tin oxide. Alternatively, the first wiring portions 13 and the second wiring portions 14 may be formed as a mesh pattern in which thin wires made of a conductive metal material such as copper or a conductive resin material are arranged in a mesh shape.

[0033] The plurality of first wiring portions 13 are formed on the surface of the first substrate 6 (see FIG. 3), and the plurality of second wiring portions 14 are formed on the surface of the second substrate 7 (see FIG. 4).

[0034] The plurality of first wiring portions 13 and the plurality of second wiring portions 14 are arranged in the non-sensor region S2. Specifically, the plurality of first wiring portions 13 and the plurality of second wiring portions 14 are arranged at positions overlapping with the decorative portion 3 (see FIG. 1) in a plan view seen from the operation surface 4 side. In other words, the decorative portion 3 prevents the plurality of first wiring portions 13 and the plurality of second wiring portions 14 from being seen from the operation surface 4 side (the front side of the touch sensor 1).

[0035] 3, one end of each first wiring portion 13 is electrically connected to an end (the end located on the lower side of the paper in FIG. 3) of each transmitting electrode 11. The multiple first wiring portions 13 are arranged so that the other end of each converges at approximately the center of the side of the first substrate 6 corresponding to the position where a flexible wiring board 20 (described later) is attached (the side located on the lower side of the paper in FIG. 3).

[0036] 4, one end of each second wiring portion 14 is electrically connected to an end (an end located on the right or left side of the paper surface of FIG. 4) of each receiving electrode 12. The second wiring portions 14 are arranged such that the other end of each converges near the opening 8 on a side of the second substrate 7 corresponding to a position where a flexible wiring board 20 (described later) is attached (a side located on the lower side of the paper surface of FIG. 4).

[0037] The other end of first wiring portion 13 is configured as wiring terminal portion 13a for electrically connecting to each signal terminal portion 25 of flexible wiring board 20, which will be described later. The other end of second wiring portion 14 is configured as wiring terminal portion 14a for electrically connecting to each signal terminal portion 25 of flexible wiring board 20, which will be described later.

[0038] (ground pattern) As shown in FIGS. 2 to 4, the touch sensor 1 includes a first ground pattern 15 and a second ground pattern 16. The first ground pattern 15 and the second ground pattern 16 are electrically disconnected from the plurality of sensor electrodes 10, the plurality of first wiring portions 13, and the plurality of second wiring portions 14. The first ground pattern 15 and the second ground pattern 16 are arranged in the non-sensor area S2. The first ground pattern 15 and the second ground pattern 16 prevent at least one of noise and static electricity from entering from the outside of the touch sensor 1 toward the sensor area S1.

[0039] The first ground pattern 15 and the second ground pattern 16 are made of a transparent material (transparent conductive film) having optical transparency, such as indium tin oxide or tin oxide, etc. Alternatively, the first ground pattern 15 and the second ground pattern 16 may be formed as a mesh pattern in which thin wires made of a conductive metal material such as copper or a conductive resin material are arranged in a mesh shape.

[0040] As shown in FIG. 3, the first ground pattern 15 is disposed on the surface of the first substrate 6. The first ground pattern 15 is disposed so as to surround the periphery of the sensor region S1 in a plan view. Specifically, the first ground pattern 15 is disposed so as to be located outside the plurality of second wiring portions 14 when the first substrate 6 and the second substrate 7 are stacked (see FIG. 2). Both ends of the first ground pattern 15 (indicated by reference numerals 31, 31 in FIG. 3) are located on sides of the first substrate 6 corresponding to positions where a flexible wiring board 20 (described later) is attached (sides located on the lower side of the paper surface in FIG. 3). In addition, both ends of the first ground pattern 15 are disposed so as to be adjacent to the other ends of the plurality of first wiring portions 13 (indicated by reference numeral 13a in FIG. 3) in the X direction.

[0041] As shown in FIG. 4, the second ground pattern 16 is provided on the surface of the second substrate 7. The second ground pattern 16 is arranged to surround the periphery of the sensor region S1 in a plan view. Specifically, when the first substrate 6 and the second substrate 7 are stacked, the second ground pattern 16 is arranged to surround the first ground pattern 15 from the outside (see FIG. 2). Both ends of the second ground pattern 16 (indicated by reference numerals 31 and 31 in FIG. 3) are located on sides of the second substrate 7 corresponding to positions where a flexible wiring board 20 (described later) is attached (sides located on the lower side of the paper in FIG. 4). In addition, both ends of the second ground pattern 16 are arranged adjacent to the other ends of the multiple second wiring portions 14 (indicated by reference numeral 14a in FIG. 4) in the X direction.

[0042] (flexible wiring board) 1, the touch sensor 1 includes a flexible wiring board 20. The flexible wiring board 20 is flexible and configured so that its electrical characteristics do not change even when it is deformed.

[0043] 2, flexible wiring board 20 has main body portion 22 and connecting portion 23. Main body portion 22 and connecting portion 23 are integrally formed. The width of connecting portion 23 in the X direction is greater than the width of main body portion 22. Connecting portion 23 is fixed to the peripheral edge portion of substrate 5 (first and second substrates 6, 7) by, for example, an anisotropic conductive adhesive (not shown).

[0044] 5 and 6, flexible wiring board 20 includes film substrate 21. Film substrate 21 is insulating and flexible. Film substrate 21 is made of, for example, a flexible insulating film. Suitable materials for the insulating film include, for example, polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

[0045] Flexible wiring board 20 has a plurality of signal lines 24. Signal lines 24 are made of, for example, a conductive film formed on the rear surface of film substrate 21. The end of each signal line 24 located at connection portion 23 is configured as signal terminal portion 25 for electrical connection with wiring terminal portions 13a, 14a. Note that in FIGS. 5 and 6, each signal line 24 is hatched with dots to clearly indicate each signal line 24.

[0046] (Wiring structure) As a characteristic configuration of the present disclosure, the touch sensor 1 has a wiring structure that includes one wiring terminal portion 31 for detection, a first detection terminal portion 36, and a second detection terminal portion 38.

[0047] (Wiring terminal for detection) As shown in FIGS. 2 to 4, the substrate 5 is provided with a wiring terminal portion 31 for detection. Each end of the first and second ground patterns 15, 16 is configured as a wiring terminal portion 31 for detection. That is, in this embodiment, a plurality of wiring terminal portions 31 for detection are provided. Like the first and second ground patterns 15, 16, the wiring terminal portion 31 for detection is made of a transparent material (transparent conductive film) having optical transparency, such as indium tin oxide or tin oxide.

[0048] The wiring terminal portion 31 for detection has a detection area. As shown in Figures 5 and 6, the detection area is made up of a first area 33 and a second area 34. In Figures 5 and 6, the detection area (first area 33 and second area 34) is hatched with dots to clearly indicate the detection area.

[0049] A cutout portion 32 is formed in the detection area. The cutout portion 32 is configured so that a part of the detection area is cut out in the Y direction from the side where the outer edge 7a of the second substrate 7 (substrate 5) is located. The length of the cutout portion 32 in the X direction corresponds to dimension A shown in FIG. 5. The length of the cutout portion 32 in the Y direction corresponds to dimension D shown in FIG. 5.

[0050] The first region 33 extends in a generally strip-like shape in the direction opposite to the Y direction toward the outer edge 7a of the second substrate 7. The first region 33 is disposed closer to the sensor region S1 than the cutout portion 32 in the Y direction. That is, the first region 33 is disposed at a position farther from the outer edge 7a of the second substrate 7 than the second region 34 in the direction opposite to the Y direction. Here, the length of the first region 33 in the X direction corresponds to the sum of the dimensions A and B shown in FIG. 5. The length of the first region 33 in the Y direction corresponds to the dimension C shown in FIG. 5.

[0051] The second region 34 extends in a generally strip-like shape in the direction opposite to the Y direction from the first region 33 toward the outer edge 7a of the second substrate 7 located nearest thereto. The tip end 34a of the second region 34 is located closer to the outer edge 7a of the second substrate 7 than the first region 33.

[0052] The second region 34 is disposed to the right of the cutout portion 32 in the X direction in the plane of the drawing in FIG. 5. The second region 34 is configured so that its width in the X direction is smaller than the width of the first region 33 in the X direction. That is, the second region 34 is configured so that its width in a direction parallel to the outer edge 7a of the second substrate 7 located closest to the second region 34 is smaller than the width of the first region 33. Here, the length of the second region 34 in the X direction corresponds to dimension B shown in FIG. 5. The length of the second region 34 in the Y direction corresponds to dimension D shown in FIG. 5.

[0053] (First and second detection terminals) 5 and 6, the flexible wiring board 20 has first and second detection signal lines 35, 37. The first and second detection signal lines 35, 37 are spaced apart in the X direction. The first and second detection signal lines 35, 37 are made of, for example, a conductive film formed on the back surface of the film substrate 21. In FIGS. 5 and 6, the first and second detection signal lines 35, 37 are hatched with dots to clearly indicate them.

[0054] The end of the first detection signal line 35 located at the connection portion 23 is configured as a first detection terminal portion 36. The end of the second detection signal line 37 located at the connection portion 23 is configured as a second detection terminal portion 38. The first and second detection terminal portions 36, 38 are arranged substantially parallel to each other so as to be electrically independent from each other. The first and second detection terminal portions 36, 38 are arranged so as to face the wiring terminal portion 31 for detection in the Y direction.

[0055] The first detection terminal 36 extends in a generally strip-like shape in the Y direction toward the outer edge 21a of the film substrate 21. The first detection terminal 36 is configured to include an area that overlaps with the first area 33 when the flexible wiring board 20 is attached to the substrate 5. The tip of the first detection terminal 36 is located near the outer edge 21a of the film substrate 21. In this embodiment, the tip of the first detection terminal 36 coincides with the position of the outer edge 21a.

[0056] The second detection terminal portion 38 extends in a generally strip-like shape toward the outer edge 21a of the film substrate 21 in the Y direction. The second detection terminal portion 38 is configured to include a region that overlaps with the second region 34 when the flexible wiring board 20 is attached to the substrate 5. The tip of the second detection terminal portion 38 is located farther from the outer edge 21a than the tip of the first detection terminal portion 36. Specifically, the tip of the second detection terminal portion 38 is located in a direction opposite to the Y direction, away from the outer edge 21a (i.e., the position corresponding to the tip of the first detection terminal portion 36) by a dimension E (see FIGS. 5 and 6). In this embodiment, the dimension E is set to be the same length as the dimension C.

[0057] 6, when flexible wiring board 20 is attached to substrate 5 (the front side of the second substrate), first and second detection terminals 36, 38 and wiring terminal 31 for detection are pressed together via, for example, an anisotropic conductive adhesive. This electrically connects first and second detection terminals 36, 38 and wiring terminal 31 for detection. That is, first and second detection signal lines 35, 37 are electrically connected to second ground pattern 16.

[0058] (conduction path) 6, when flexible wiring board 20 is attached to substrate 5 (the front side of second substrate 7), first detection terminal portion 36 overlaps first region 33, while second detection terminal portion 38 overlaps second region 34. Specifically, first detection terminal portion 36 overlaps the left portion of first region 33, while second detection terminal portion 38 overlaps the entire second region 34.

[0059] When flexible wiring board 20 is attached to substrate 5, first and second detection terminals 36, 38 and the detected region form a single electrical conduction path 39. Specifically, when flexible wiring board 20 is attached to substrate 5, conduction path 39 is made up of first detection terminal 36 and second detection terminal 38, and a part of first region 33 (the right-hand portion of first region 33 shown in FIG. 6) that does not overlap with either first or second detection terminals 36, 38 in the range from the tip of first detection terminal 36 to the tip of second detection terminal 38 (dimension E shown in FIG. 6). Note that in this embodiment, when flexible wiring board 20 is attached to substrate 5, the tip of second detection terminal 38 is located at the boundary between first region 33 and second region 34.

[0060] The conductive path 39 is configured to enable detection of the presence or absence of a disconnection in the first region 33 in a range (dimension E) extending from the tip of the first detection terminal 36 to the tip of the second detection terminal 38. Specifically, an electrical resistance measuring device ER having a general configuration is connected to the first detection terminal 36 and the second detection terminal 38, and electrical resistance is measured for the conductive path 39 using loop wiring. This makes it possible to detect the presence or absence of a disconnection in the first region 33 in the range of dimension E shown in FIG. 6. If the resistance value increases as a result of the electrical resistance measurement, it is expected that there is a disconnection in part of the first region 33.

[0061] [Previous issues] Generally, in the technical field of touch sensors, a manufacturing process for a substrate used in a touch sensor conventionally involves punching (machining) a base material that serves as the substrate, for example, with a Thomson blade. Typically, a plurality of sensor electrodes, a plurality of wiring portions, and a plurality of wiring terminal portions are formed in advance on the base material. By punching the base material, a substrate having a predetermined shape (for example, a rectangular shape) is obtained.

[0062] The outer edge of the substrate obtained by the punching process corresponds to the position cut by the Thomson blade. That is, deformation is likely to occur near the outer edge of the substrate due to the shear stress of the Thomson blade when the punching process is performed.

[0063] On the other hand, in the technical field of touch sensors, there has been a recent demand for narrower frame sizes for touch sensors in order to improve product appeal. Specifically, in order to narrow the non-sensor area, there is a trend to arrange multiple wiring terminals located in the non-sensor area near the outer edges of the substrate.

[0064] Therefore, during the punching process, the multiple wiring terminals located near the outer edge of the substrate are susceptible to the shear stress of the Thomson blade. Specifically, after the punching process, the multiple wiring terminals may suffer damage such as cracks in a direction substantially parallel to the cutting direction of the Thomson blade (i.e., the direction along the outer edge of the substrate). If such damage occurs, the wiring terminals may be broken, which may result in poor electrical continuity. If the presence or absence of such breaks cannot be detected, for example, before product shipment, there is a risk that the touch sensor will malfunction in the market before its original design life.

[0065] On the other hand, in order to avoid the above-mentioned disconnection, it is conceivable to arrange the wiring terminals at positions away from the outer edge of the substrate. However, in a configuration in which the wiring terminals are arranged at positions away from the outer edge of the substrate, it is inevitably difficult to achieve the above-mentioned narrow frame.

[0066] [Effects of the embodiment] To solve these problems, the touch sensor 1 according to the embodiment of the present disclosure includes a wiring structure as shown in FIGS. 5 and 6. The wiring structure is configured to form the aforementioned single electrical conduction path 39. This conduction path 39 is configured to enable detection of the presence or absence of a disconnection in the first region 33 in the range extending from the tip of the first detection terminal 36 to the tip of the second detection terminal 38 (the range corresponding to the dimension E shown in FIGS. 5 and 6). With this configuration, by measuring the electrical resistance of the conduction path 39 as described above, the presence or absence of a disconnection (a damaged area such as a crack) in the first region 33 can be appropriately detected, for example, before product shipment. As a result, it is possible to provide touch sensors 1 on the market that achieve a narrow frame while ensuring the original design life of the touch sensor 1.

[0067] Furthermore, when flexible wiring board 20 is attached to substrate 5, the tip of second detection terminal 38 is located at the boundary between first region 33 and second region 34. That is, in this embodiment, second detection terminal 38 is configured so as not to overlap first region 33. This makes it possible to maximize the detection range of first region 33 (i.e., the range corresponding to dimension E) when measuring the electrical resistance. As a result, the presence or absence of a disconnection in first region 33 can be appropriately detected.

[0068] [Other embodiments] In the above embodiment, a capacitance type sensor input device is shown as the touch sensor 1, but the present invention is not limited to this. For example, the touch sensor 1 may be a resistive type sensor input device.

[0069] In the above embodiment, the sensor area S1 has a substantially rectangular shape, but is not limited to this. The sensor area S1 may have, for example, a substantially circular shape or a polygonal shape such as a pentagonal shape in plan view.

[0070] In the above embodiment, the multiple transmitting electrodes 11, the multiple first wiring portions 13, and the first ground pattern 15 are arranged on the front surface of the first substrate 6, and the multiple receiving electrodes 12, the multiple second wiring portions 14, and the second ground pattern 16 are arranged on the front surface of the second substrate 7. However, this is not limiting. For example, the multiple transmitting electrodes 11, the multiple first wiring portions 13, and the first ground pattern 15 may be arranged on the rear surface of the first substrate 6, and the multiple receiving electrodes 12, the multiple second wiring portions 14, and the second ground pattern 16 may be arranged on the rear surface of the second substrate 7. Alternatively, the multiple transmitting electrodes 11, the multiple first wiring portions 13, and the first ground pattern 15 may be arranged on the front surface of the second substrate 7, and the multiple receiving electrodes 12, the multiple second wiring portions 14, and the second ground pattern 16 may be arranged on the front surface of the first substrate 6.

[0071] In the above embodiment, the first and second substrates 6 and 7 are used, but the present invention is not limited to this. For example, a configuration using only one substrate, the first substrate 6, may be used. In this configuration, for example, the plurality of transmitting electrodes 11, the plurality of first wiring portions 13, and the first ground pattern 15 may be arranged on the front surface of the first substrate 6, while the plurality of receiving electrodes 12, the plurality of second wiring portions 14, and the second ground pattern 16 may be arranged on the back surface of the first substrate 6. Alternatively, the plurality of transmitting electrodes 11, the plurality of receiving electrodes 12, the plurality of first wiring portions 13, the plurality of second wiring portions 14, the first ground pattern 15, and the second ground pattern 16 may be arranged on the same surface, either the front surface or the back surface of the first substrate 6, and the plurality of transmitting electrodes 11 and the plurality of receiving electrodes 12 may be insulated from each other in the sensor region S1.

[0072] In the above embodiment, the transmitter electrodes 11 extend along the Y direction, while the receiver electrodes 12 extend along the X direction, but this is not limiting. That is, the transmitter electrodes 11 may extend along the X direction, while the receiver electrodes 12 may extend along the Y direction.

[0073] In the above embodiment, touch sensor 1 (see FIG. 1 ) is shown in a state in which cover member 2, adhesive layer (not shown), and flexible wiring board 20 are attached to first and second substrates 6 and 7, but is not limited to this form. That is, the concept of touch sensor 1 according to the present disclosure includes a state before cover member 2, adhesive layer, flexible wiring board 20, etc. are attached to first and second substrates 6 and 7. Furthermore, the concept of touch sensor 1 according to the present disclosure also includes a configuration in which a plurality of sensor electrodes 10 (a plurality of transmitting electrodes 11, a plurality of receiving electrodes 12), a plurality of wiring portions (a plurality of first wiring portions 13, a plurality of second wiring portions 14), and ground patterns (a first ground pattern 15, a second ground pattern 16) are formed on a long base material (e.g., a long hoop-shaped member not shown) before first and second substrates 6 and 7 are individually formed.

[0074] In the above embodiment, the details of the wiring structure are explained by focusing on the wiring terminal portion 31 for detection located on the lower left side of the paper in Figures 5 and 6, but the wiring terminal portion 31 for detection located in other positions may also be configured in the same way as the wiring structure described above.

[0075] In the above embodiment, a configuration in which a plurality of wiring terminal portions 31 for detection are provided is shown, but the present invention is not limited to this configuration. That is, it is sufficient that at least one wiring terminal portion 31 for detection is provided.

[0076] In the above embodiment, the end portions of the first and second ground patterns 15, 16 are configured as the wiring terminal portion 31 for detection, but this is not limiting. For example, the wiring terminal portion 13a of the first wiring portion 13 may be configured as the wiring terminal portion 31 for detection. Alternatively, the wiring terminal portion 14a of the second wiring portion 14 may be configured as the wiring terminal portion 31 for detection. Furthermore, each of the wiring terminal portion 13a and the wiring terminal portion 14a may be configured as the wiring terminal portion 31 for detection.

[0077] In the above embodiment, the first region 33 and the second region 34 have a generally strip-like shape, but this is not limiting. That is, each of the first region 33 and the second region 34 may have a shape other than a generally strip-like shape.

[0078] In the above embodiment, the tip of the second detection terminal 38 is located at the boundary between the first region 33 and the second region 34, but this is not limiting. For example, the tip of the second detection terminal 38 may be slightly offset from the boundary between the first region 33 and the second region 34. In other words, as long as the tip of the second detection terminal 38 is located near the boundary between the first region 33 and the second region 34, it is possible to appropriately detect the presence or absence of a disconnection in the first region 33, as in the above embodiment.

[0079] In the above embodiment, the tip of the first detection terminal 36 coincides with the position of the outer edge 21a of the film substrate 21, but this is not limiting. That is, the tip of the first detection terminal 36 does not have to coincide with the position of the outer edge 21a. In short, it is sufficient that the tip of the first detection terminal 36 is disposed near the outer edge 21a so that the first detection terminal 36 overlaps with the first region 33.

[0080] In the above embodiment, the touch sensor 1 to which the wiring structure of the present disclosure is applied has been illustrated, but the present disclosure is not limited thereto. That is, the wiring structure of the present disclosure can be widely applied to technical fields other than touch sensors (for example, various technical fields such as liquid crystal display devices, organic electroluminescence display devices (OLEDs), micro LED display devices, solar cell devices, heater devices, and antenna devices).

[0081] Furthermore, although the touch sensor 1 according to the above embodiment is shown combined with a display panel (not shown), this is not limiting. For example, the touch sensor 1 may be configured as a touch sensor (not shown) for low-transmittance applications that is not combined with the display panel. In this touch sensor for low-transmittance applications, instead of the multiple sensor electrodes 10 (multiple transmitting electrodes 11 and multiple receiving electrodes 12) shown in FIGS. 2 to 4, a sensor group consisting of multiple electrostatic switches (not shown) is formed on a substrate. Each electrostatic switch is made of, for example, a conductive resin material. The wiring portion and the wiring terminal portion 31 for detection, exemplified in the above embodiment, may be electrically connected to the electrostatic switch. In other words, the wiring structure exemplified in the above embodiment can be applied even to the touch sensor for low-transmittance applications.

[0082] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the present disclosure. [Industrial Applicability]

[0083] The present disclosure is industrially applicable to a wiring structure and a touch sensor including the same. [Explanation of symbols]

[0084] 1: Touch sensor 5: Circuit board 6: First board 7: Second board 10: Sensor electrode 11: Transmitting electrode 12: Receiving electrode 13: 1st wiring section 14:Second wiring section 15: First Grand Pattern 16: Second Grand Pattern 20: Flexible wiring board 21: Film substrate 24: Signal line 25: Signal terminal section 31: Wiring terminal for detection 32: Notch 33:First area 34:Second area 35: First detection signal line 36: First detection terminal 37: Second detection signal line 38: Second detection terminal 39: Conduction path

Claims

1. A substrate; a flexible wiring board that can be attached to the substrate, the substrate is provided with at least one wiring terminal portion for detection having a detection area; The detection area is A first region; a second region extending from the first region toward a nearest outer edge of the substrate; the second region is configured so that a width in a direction parallel to an outer edge of the substrate located closest thereto is smaller than a width of the first region; the flexible wiring board includes first and second detection terminal portions arranged substantially parallel to each other so as to be electrically independent from each other and arranged so as to face the wiring terminal portion for detection, a tip end of the first detection terminal portion is disposed near an outer edge of the flexible wiring board, a tip end of the second detection terminal portion is disposed at a position farther from an outer edge of the flexible wiring board than a tip end of the first detection terminal portion; When the flexible wiring board is attached to the substrate, the first detection terminal portion overlaps the first region and the second detection terminal portion overlaps the second region, a single electrical conduction path is formed by the first and second detection terminal portions and the detection area; a wiring structure in which the conductive path is configured to be able to detect the presence or absence of a break in the first region in a range from the tip of the first detection terminal portion to the tip of the second detection terminal portion.

2. 2. The wiring structure according to claim 1, A wiring structure in which, when the flexible wiring board is attached to the substrate, a tip of the second detection terminal portion is located at the boundary between the first region and the second region.

3. A touch sensor comprising the wiring structure according to claim 1 or 2.

Citation Information

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