Expanding Device

Abstract

This expansion device (100) comprises an expansion maintaining ring (113) that, when shrinking a sheet member (220) by using a heat shrink part (10), makes contact in a circumferential manner with the periphery of a wafer (210) on a surface on the other side of the sheet member, and holds the sheet member in a sandwiched manner together with an expansion ring (64), thereby maintaining the expansion of the sheet member at the portion where the wafer is disposed. The expansion maintaining ring also includes a sticking suppressing part (113c) that is provided to a contact portion that contacts the sheet member and suppresses sticking to the sheet member.

Description

[Technical Field]

[0001] The present invention relates to an expanding device, and more particularly to an expanding device having an expanding section that expands a heat-shrinkable sheet member having elasticity and to which a wafer is attached. [Background technology]

[0002] Conventionally, there has been known an expanding device that includes an expanding section that expands a heat-shrinkable sheet member having elasticity and to which a divisible wafer is attached along a dividing line, thereby dividing the wafer along the dividing line. Such an expanding device is disclosed, for example, in Japanese Patent No. 5013148.

[0003] The above-mentioned Japanese Patent Publication No. 5013148 discloses an expanding device including an expanding unit that expands a heat-shrinkable, stretchable sheet member to which a wafer is attached, and a heat-shrink unit that heats and shrinks slack in the portion of the sheet member surrounding the wafer caused by expansion by the expanding unit. This expanding device includes a wafer cover that contacts the upper side of the sheet member around the wafer to cover the wafer when the sheet member is contracted by the heat-shrink unit. The wafer cover is configured to contact the sheet member from above at a portion where an adhesive layer for adhering the wafer is provided on the sheet member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5013148 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the expanding device of Japanese Patent No. 5013148, when the sheet member is shrunk by the heat-shrink unit, the wafer cover is configured to abut the adhesive layer of the sheet member from above to cover the wafer. Therefore, when the wafer cover is separated from the sheet member after the sheet member is shrunk by the heat-shrink unit, it is thought that the wafer cover may adhere to the adhesive layer of the sheet member and lift the sheet member. In this case, the sheet member adheres to the wafer cover and is lifted, and then the sheet member peels off from the wafer cover, causing vibrations in the sheet member. As a result, the wafer placed on the sheet member may peel off or become displaced due to vibrations. Therefore, it is desirable to prevent the wafer placed on the sheet member from peeling off or becoming displaced due to vibrations of the sheet member when a member abutting the sheet member is separated from the sheet member after heating by the heat-shrink unit.

[0006] This invention has been made to solve the above-mentioned problems, and one object of this invention is to provide an expanding device that can prevent a wafer placed on a sheet member from peeling off or shifting position due to vibration of the sheet member when a member abutting the sheet member is separated from the sheet member after heating by a heat shrink section. [Means for solving the problem]

[0007] An expanding device according to one aspect of the present invention includes a support ring that circumferentially contacts and supports the periphery of the wafer on one side of a heat-shrinkable, stretchable sheet member to which a divisible wafer is attached along a dividing line, and the expanding device is equipped with an expanding section that expands the sheet member while keeping the sheet member in contact with the support ring to divide the wafer along the dividing line, a heat shrink section that heats and shrinks any slack in the portion of the sheet member around the wafer that occurs due to expansion by the expanding section, and an expansion maintaining ring that circumferentially contacts the periphery of the wafer on the other side of the sheet member to sandwich and hold the sheet member together with the support ring when the sheet member is shrunk by the heat shrink section, thereby maintaining the expansion of the portion of the sheet member where the wafer is placed, and the expansion maintaining ring includes a sticking prevention section that is provided at the contacting portion that contacts the sheet member and prevents sticking to the sheet member. The expansion maintaining ring is formed so that the cross section of the contact portion that contacts the sheet member has a round shape, and the support ring is formed so that the cross section of the contact portion that contacts the sheet member has a round shape, and the expansion maintaining ring and the support ring are configured to sandwich and hold the sheet member between the inner peripheral portion of the expansion maintaining ring and the outer peripheral portion of the support ring. .

[0008] In one aspect of the expanding device of the present invention, as described above, the expansion maintaining ring, which maintains the expansion of the portion of the sheet member where the wafer is placed, is provided with a sticking prevention portion disposed at the contact portion that contacts the sheet member and prevents the expansion maintaining ring from sticking to the sheet member. This prevents the expansion maintaining ring from sticking to the sheet member when the expansion maintaining ring is separated from the sheet member after the sheet member is contracted by the heat shrink unit. As a result, vibration of the sheet member can be prevented when a member that contacts the sheet member after heating by the heat shrink unit is separated from the sheet member. This prevents the wafer placed on the sheet member from peeling off or shifting position due to vibration of the sheet member when a member that contacts the sheet member is separated from the sheet member after heating by the heat shrink unit.

[0009] In the expanding device according to the above aspect, the sticking prevention portion of the expansion-maintaining ring preferably has a coating layer that coats the contact portion that contacts the sheet member. With this configuration, the sticking prevention portion can be formed by the coating layer at the contact portion of the expansion-maintaining ring that contacts the sheet member, making it easy to provide the sticking prevention portion at the contact portion of the expansion-maintaining ring.

[0010] In this case, the coating layer of the sticking prevention portion preferably has a fluorine coating on the contact portion, so that the fluorine-coated sticking prevention portion can effectively prevent the expansion-retaining ring from sticking to the sheet member.

[0011] The expanding device according to the above aspect So, The expansion maintaining ring is formed so that the cross section of the contact portion that contacts the seat member has a round shape. This Compared to when the contact portion of the expansion maintaining ring is flat, the area of ​​the contact portion of the expansion maintaining ring with the sheet member can be made smaller, which effectively prevents the expansion maintaining ring from sticking to the sheet member. Also, by making the cross section of the contact portion of the expansion maintaining ring that contacts the sheet member round, it is possible to prevent the sheet member from being scratched, unlike when an angular contact portion is made with the sheet member.

[0012] The expanding device according to the above aspect So, The support ring is formed so that the cross section of the portion that abuts against the seat member has a round shape. This Unlike when the cross section of the part of the support ring that abuts against the sheet member is formed in an angular shape, a rounded surface can be abutted against the sheet member, thereby preventing the sheet member from being scratched by the abutment of the support ring.

[0013] In the expanding device according to the above aspect, preferably, both the expansion maintaining ring and the support ring have an annular shape, and the expansion maintaining ring has a larger radius at the center of its wall thickness than the support ring at the center of its wall thickness. With this configuration, the expansion maintaining ring can be abutted against the sheet member outside the support ring. Therefore, even if slight vibrations occur when the expansion maintaining ring is separated from the sheet member, the support ring remains in abutment against the sheet member inside the expansion maintaining ring, preventing the vibrations from being transmitted to the inner portion of the sheet member where the wafer is placed. This effectively prevents the wafer placed on the sheet member from peeling off or shifting out of position.

[0014] The expanding device according to the above aspect So, The expansion maintenance ring is formed so that the cross section of the contact portion that contacts the sheet member has a round shape, and the support ring is formed so that the cross section of the contact portion that contacts the sheet member has a round shape, and the expansion maintenance ring and the support ring are configured to sandwich and hold the sheet member between the inner peripheral portion of the expansion maintenance ring and the outer peripheral portion of the support ring. This The sheet member is sandwiched and held between the inner peripheral portion of the expansion maintaining ring, which has a round cross section, and the outer peripheral portion of the support ring, which also has a round cross section, so that the sheet member can be securely held and the expansion of the portion of the sheet member where the wafer is placed can be reliably maintained. Furthermore, even if slight vibrations occur when the expansion maintaining ring, which is sandwiched from the outside, is separated from the sheet member, the vibrations can be prevented from being transmitted to the inner portion of the sheet member where the wafer is placed.

[0015] In the expanding device according to the above aspect, the heat shrink unit preferably includes a heating ring that heats the entire periphery of the wafer of the sheet member. This configuration allows the entire periphery of the wafer of the sheet member to be heated simultaneously, thereby allowing the entire periphery of the wafer of the sheet member to shrink simultaneously. This reduces the occurrence of uneven shrinkage compared to when the periphery of the wafer of the sheet member is only partially shrunk.

[0016] In this case, the heat shrink unit preferably includes a suction ring that sucks air around the entire circumference of the sheet member heated by the heating ring. With this configuration, even if gas is generated from the sheet member due to heating by the heating ring, the generated gas can be sucked around the entire circumference by the suction ring, thereby preventing the generated gas from reaching the wafer and preventing the gas from accumulating within the device.

[0017] In the expanding device in which the heat shrink section includes an air suction ring, the air suction ring is preferably configured to suck air around the entire circumference near the sheet member heated by the heating ring when the sheet member is heated by the heating ring, and to suck air around the entire circumference near the sheet member heated by the heating ring when heating by the heating ring is stopped and the sheet member is cooled. With this configuration, the air suction ring can suck air around the entire circumference when the sheet member is cooled, allowing the sheet member to be cooled quickly.

[0018] In the expanding device in which the heat shrink section includes an air intake ring, the air intake ring is preferably disposed adjacent to the inner periphery of the heating ring. This configuration allows air to be drawn into the heating ring at a position adjacent to the inner periphery, thereby creating an airflow from the outside to the inside of the sheet member when air is drawn into the air intake ring from the sheet member heated by the heating ring. This prevents warm air from accumulating on the sheet member, thereby enabling the sheet member to be cooled evenly and efficiently.

[0019] In the expanding device in which the heat shrink portion includes an intake ring, the intake ring preferably includes a plurality of intake ports arranged circumferentially around the entire circumference. This configuration allows the plurality of intake ports arranged circumferentially around the entire circumference to draw warm air evenly from the sheet material heated by the heating ring, thereby preventing warm air from accumulating on the sheet material. This allows the sheet material to be cooled evenly and efficiently. [Effects of the Invention]

[0020] According to the present invention, as described above, when a member abutting the sheet member is separated from the sheet member after heating by the heat shrink section, it is possible to prevent the wafer placed on the sheet member from peeling off or shifting out of position due to vibration of the sheet member. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 2 is a plan view of an expanding device according to one embodiment. [Figure 2] FIG. 2 is a side view of an expanding device according to one embodiment. [Figure 3] FIG. 1 is a plan view of a wafer ring structure of an expanding apparatus according to one embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line 101-101 in FIG. 3. [Figure 5] FIG. 10 is a bottom view of a debris cleaner of an expanding device according to one embodiment. [Figure 6] FIG. 10 is a bottom view of the heat shrink portion of the expanding device according to one embodiment. [Figure 7] FIG. 2 is a block diagram showing a control configuration of an expanding device according to one embodiment. [Figure 8] 10 is a flowchart illustrating a semiconductor chip manufacturing process of an expanding device according to an embodiment. [Figure 9] FIG. 10 is a side view showing a state before the wafer ring structure of the expanding device according to the embodiment is clamped. [Figure 10] FIG. 10 is a side view showing a state in which the wafer ring structure of the expanding device according to the embodiment is clamped. [Figure 11] FIG. 2 is a side view showing a state in which the sheet member of the expanding device according to the embodiment is expanded. [Figure 12] FIG. 1 is a side view illustrating a wafer ring structure, debris cleaner, and expansion ring of an expanding apparatus according to one embodiment. [Figure 13] FIG. 2 is a side view showing a state before heat shrinking of a sheet member of an expanding device according to one embodiment. [Figure 14] FIG. 10 is a side view showing a state in which a sheet member of an expanding device according to one embodiment is heat-shrunk. [Figure 15] FIG. 1 is a perspective view showing an expansion maintaining ring of an expanding device according to one embodiment. [Figure 16] FIG. 10 is a side view showing an expansion maintaining ring of an expanding device according to one embodiment. [Figure 17] FIG. 1 is a side view showing an expansion maintaining ring and an expanding ring of an expanding device according to one embodiment. [Figure 18] 10A and 10B are diagrams for explaining the suction of air by the intake ring. [Figure 19] FIG. 10 is a diagram for explaining the suction of air from a plurality of air intake ports. [Figure 20]10 is a flowchart showing a removal process of the expanding device according to one embodiment. [Figure 21] 10 is a flowchart showing a transfer process of an expanding device according to one embodiment. [Figure 22] 10 is a flowchart showing an expanding process of the expanding device according to one embodiment. [Figure 23] This is a continuation of the flowchart in FIG. 22. [Figure 24] 1 is a flowchart showing a heat shrink process of an expanding device according to an embodiment. [Figure 25] This is a continuation of the flowchart in FIG. 24. [Figure 26] 10 is a flowchart showing a process of storing an expanding device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0023] The configuration of an expanding device 100 according to one embodiment of the present invention will be described with reference to FIGS.

[0024] (Configuration of the expanding device) As shown in FIGS. 1 and 2, the expanding apparatus 100 is configured to divide a wafer 210 to form a plurality of semiconductor chips. The expanding apparatus 100 is also configured to form sufficient gaps between the plurality of semiconductor chips. Here, a modified layer is formed in advance on the wafer 210 by irradiating the wafer 210 with a laser having a wavelength that is transparent to the wafer 210 along the dividing lines (streets). The modified layer refers to cracks, voids, etc. formed inside the wafer 210 by the laser. This method of forming a modified layer on the wafer 210 is called stealth dicing.

[0025] Therefore, in the expanding apparatus 100, the wafer 210 is divided along the modified layer by expanding the sheet member 220. In addition, in the expanding apparatus 100, by expanding the sheet member 220, the gaps between the multiple semiconductor chips formed by division are widened.

[0026] The expansion device 100 includes a base plate 1, a cassette section 2, a lift-up hand section 3, a suction hand section 4, a base 5, an expansion section 6, a cold air supply section 7, a cooling unit 8, a debris cleaner 9, a heat shrink section 10, and an ultraviolet irradiation section 11.

[0027] Here, the horizontal direction in which the cassette unit 2 and the heat shrink unit 10 are aligned is referred to as the X direction, the X direction toward the cassette unit 2 is referred to as the X1 direction, and the X direction toward the heat shrink unit 10 is referred to as the X2 direction. The horizontal direction perpendicular to the X direction is referred to as the Y direction, the Y direction toward the cassette unit 2 is referred to as the Y1 direction, and the direction opposite to the Y1 direction is referred to as the Y2 direction. The vertical direction is referred to as the Z direction, with the upward direction referred to as the Z1 direction and the downward direction referred to as the Z2 direction.

[0028] <Base plate> The base plate 1 is a base on which the cassette unit 2 and the suction hand unit 4 are placed. In plan view, the base plate 1 has a rectangular shape that is long in the Y direction.

[0029] <Cassette section> The cassette unit 2 is configured to be able to accommodate a plurality (five) of wafer ring structures 200. Here, as shown in FIGS. 3 and 4, the wafer ring structure 200 has a wafer 210, a sheet member 220, and a ring-shaped member 230.

[0030] The wafer 210 is a circular, thin plate made of crystals of a semiconductor material that is used to make semiconductor integrated circuits. As described above, a modified layer that modifies the interior of the wafer 210 is formed along the division lines. That is, the wafer 210 is configured to be divisible along the division lines. The sheet member 220 is a stretchable adhesive tape. An adhesive layer is provided on the upper surface 220a of the sheet member 220. The wafer 210 is attached to the adhesive layer of the sheet member 220. The ring-shaped member 230 is a metal frame that is ring-shaped in a plan view. A notch 240 and a notch 250 are formed on the outer surface 230a of the ring-shaped member 230. The ring-shaped member 230 is attached to the adhesive layer of the sheet member 220 while surrounding the wafer 210.

[0031] As shown in FIGS. 1 and 2, the cassette unit 2 includes a Z-direction movement mechanism 21, a wafer cassette 22, and a pair of mounting portions 23. The Z-direction movement mechanism 21 is configured to move the wafer cassette 22 in the Z direction using a motor 21a as a drive source. The Z-direction movement mechanism 21 also has a mounting table 21b that supports the wafer cassette 22 from below. The wafer cassette 22 is manually supplied and mounted on the mounting table 21b. The wafer cassette 22 has a storage space that can accommodate multiple wafer ring structures 200. A plurality (five) of the pair of mounting portions 23 are arranged inside the wafer cassette 22. The ring-shaped members 230 of the wafer ring structure 200 are mounted on the pair of mounting portions 23 from the Z1 direction side. One of the pair of mounting portions 23 protrudes in the X2 direction from the inner surface of the wafer cassette 22 on the X1 direction side. The other of the pair of mounting portions 23 protrudes from the inner surface of the wafer cassette 22 on the X2 side toward the X1 side.

[0032] <Lift-up hand part> The lift-up hand unit 3 is configured to be able to remove the wafer ring structure 200 from the cassette unit 2. The lift-up hand unit 3 is also configured to be able to store the wafer ring structure 200 in the cassette unit 2.

[0033] Specifically, the lift-up hand unit 3 includes a Y-direction movement mechanism 31 and a lift-up hand 32. The Y-direction movement mechanism 31 is configured to move the lift-up hand 32 in the Y direction using a motor 31a as a drive source. The lift-up hand 32 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z2 direction side.

[0034] <Suction hand section> The suction hand section 4 is configured to suck the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.

[0035] Specifically, the suction hand section 4 includes an X-direction movement mechanism 41, a Z-direction movement mechanism 42, and a suction hand 43. The X-direction movement mechanism 41 is configured to move the suction hand 43 in the X direction using a motor 41a as a drive source. The Z-direction movement mechanism 42 is configured to move the suction hand 43 in the Z direction using a motor 42a as a drive source. The suction hand 43 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.

[0036] <base> The base 5 is a base on which the expanding section 6, the cooling unit 8, and the ultraviolet irradiation section 11 are installed. The base 5 has a rectangular shape that is long in the Y direction in a plan view.

[0037] <Expanding section> The expanding section 6 is configured to expand the sheet member 220 of the wafer ring structure 200 to divide the wafer 210 along the dividing line.

[0038] Specifically, the expanding unit 6 includes a Z-direction moving mechanism 61, a Y-direction moving mechanism 62, a clamping unit 63, and an expanding ring 64. The Z-direction moving mechanism 61 is configured to move the clamping unit 63 in the Z direction using a motor 61a as a driving source. The Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamping unit 63, and the expanding ring 64 in the Y direction using a motor 62a as a driving source. The expanding ring 64 is an example of a "support ring" in the claims.

[0039] The clamping portion 63 is configured to grip the ring-shaped member 230 of the wafer ring structure 200. The clamping portion 63 has a lower gripping portion 63a and an upper gripping portion 63b. The lower gripping portion 63a supports the ring-shaped member 230 from the Z2 direction. The upper gripping portion 63b presses the ring-shaped member 230 supported by the lower gripping portion 63a from the Z1 direction. In this manner, the ring-shaped member 230 is gripped by the lower gripping portion 63a and the upper gripping portion 63b.

[0040] The expand ring 64 is configured to support the sheet member 220 from the Z2 direction side, thereby expanding (expanding) the sheet member 220. The expand ring 64 has a ring shape in a plan view.

[0041] <Cold air supply section> The cool air supply unit 7 is configured to supply cool air to the sheet member 220 from the Z1 direction side when the expanding unit 6 expands the sheet member 220.

[0042] Specifically, the cold air supply unit 7 has a plurality of nozzles 71. Each nozzle 71 has a cold air supply port 71a (see FIG. 5) through which cold air supplied from a cold air supply source (not shown) flows out. The nozzles 71 are attached to the debris cleaner 9. The cold air supply source is a cooling device for generating cold air. The cold air supply source supplies air cooled by, for example, a cooling device equipped with a heat pump or the like. Such a cold air supply source is installed in the base 5. The cold air supply source and each of the plurality of nozzles 71 are connected by hoses (not shown).

[0043] <Cooling unit> The cooling unit 8 is configured to cool the sheet member 220 from the Z2 direction side when the expanding section 6 expands the sheet member 220.

[0044] Specifically, the cooling unit 8 includes a cooling member 81 having a cooling body 81a and a Peltier element 81b, and a cylinder 82. The cooling body 81a is made of a material with a large heat capacity and high thermal conductivity. The cooling body 81a is made of a metal such as aluminum. The Peltier element 81b is configured to cool the cooling body 81a. Note that the cooling body 81a is not limited to aluminum, and may be made of another material with a large heat capacity and high thermal conductivity.

[0045] The cooling unit 8 is configured to be movable in the Z direction by a cylinder 82. This allows the cooling unit 8 to move to a position in contact with the sheet member 220 and to a position spaced apart from the sheet member 220.

[0046] Debris Cleaner The fragment cleaner 9 is configured to suck up fragments of the wafer 210 when the sheet member 220 is expanded by the expanding section 6.

[0047] 5, the debris cleaner 9 includes a ring-shaped member 91 and a plurality of suction ports 92. The ring-shaped member 91 is a member having a ring shape when viewed from the Z1 direction side. The plurality of suction ports 92 are openings for sucking debris of the wafer 210. The plurality of suction ports 92 are formed on the lower surface of the ring-shaped member 91 on the Z2 direction side.

[0048] 2, the debris cleaner 9 is configured to be movable in the Z direction by a cylinder (not shown), which allows the debris cleaner 9 to move to a position close to the wafer 210 and to a position where it can avoid the suction hand 43 that moves in the X direction.

[0049] <Heat shrink section> The heat shrink unit 10 is configured to shrink the sheet member 220 expanded by the expanding unit 6 by heating while maintaining the gaps between the plurality of semiconductor chips.

[0050] 1, the heat shrink unit 10 includes a Z-direction movement mechanism 110, a heating ring 111, an air suction ring 112, and an expansion maintaining ring 113. The Z-direction movement mechanism 110 is configured to move the heating ring 111 and the air suction ring 112 in the Z direction using a motor 110a as a drive source.

[0051] As shown in Figure 6, the heating ring 111 has a ring shape in a plan view. The heating ring 111 also has a sheath heater that heats the sheet member 220. The suction ring 112 is integrally formed with the heating ring 111. The suction ring 112 has a ring shape in a plan view. A plurality of suction ports 112a are formed on the underside of the suction ring 112 on the Z2 direction side. The expansion maintaining ring 113 is configured to press the sheet member 220 from the Z1 direction side to prevent the sheet member 220 near the wafer 210 from shrinking due to heating by the heating ring 111.

[0052] The expansion maintaining ring 113 has a ring shape in a plan view. The expansion maintaining ring 113 is configured to be movable in the Z direction by a cylinder (not shown). This allows the expansion maintaining ring 113 to move to a position where it presses the sheet member 220 and to a position away from the sheet member 220.

[0053] <Ultraviolet irradiation section> The ultraviolet ray irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays in order to reduce the adhesive strength of the adhesive layer of the sheet member 220. Specifically, the ultraviolet ray irradiation unit 11 has an ultraviolet ray illuminator.

[0054] (Control configuration of the expansion device) As shown in Figure 7, the expanding device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expansion control calculation unit 17, a handling control calculation unit 18, and a memory unit 19.

[0055] The first control unit 12 is configured to control the heat shrink unit 10. The first control unit 12 includes a central processing unit (CPU) and a storage unit having a read-only memory (ROM) and a random access memory (RAM). The first control unit 12 may also include a hard disk drive (HDD) as the storage unit, which retains stored information even after the voltage is cut off. The HDD may also be shared by the first control unit 12, the second control unit 13, the third control unit 14, the fourth control unit 15, and the fifth control unit 16.

[0056] The second control unit 13 is configured to control the cold air supply unit 7, the cooling unit 8, and the debris cleaner 9. The second control unit 13 includes a CPU and a storage unit having a ROM, RAM, etc. The third control unit 14 is configured to control the expander 6. The third control unit 14 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the second control unit 13 and the third control unit 14 may each include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0057] The fourth control unit 15 is configured to control the cassette unit 2 and the lift-up hand unit 3. The fourth control unit 15 includes a CPU and a storage unit having a ROM, RAM, etc. The fifth control unit 16 is configured to control the suction hand unit 4. The fifth control unit 16 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the fourth control unit 15 and the fifth control unit 16 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0058] The expansion control calculation unit 17 is configured to perform calculations related to the expansion process of the sheet member 220 based on the processing results of the first control unit 12, the second control unit 13, and the third control unit 14. The expansion control calculation unit 17 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0059] The handling control calculation unit 18 is configured to perform calculations related to the movement process of the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16. The handling control calculation unit 18 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0060] The storage unit 19 stores a program for operating the expanding device 100. The storage unit 19 includes a ROM, a RAM, and the like.

[0061] (Semiconductor chip manufacturing process using expanding equipment) The overall operation of the expanding device 100 will now be described.

[0062] In step S1, the wafer ring structure 200 is removed from the cassette unit 2. That is, after the wafer ring structure 200 housed in the cassette unit 2 is supported by the lift-up hand 32, the Y-direction movement mechanism 31 moves the lift-up hand 32 in the Y2 direction, thereby removing the wafer ring structure 200 from the cassette unit 2. In step S2, the wafer ring structure 200 is transferred to the expanding unit 6 by the suction hand 43. That is, the wafer ring structure 200 removed from the cassette unit 2 is moved in the X2 direction by the X-direction movement mechanism 41 while being sucked by the suction hand 43. Then, the wafer ring structure 200 moved in the X2 direction is transferred from the suction hand 43 to the clamp unit 63, and then gripped by the clamp unit 63.

[0063] In step S3, the sheet member 220 is expanded by the expanding section 6. At this time, the sheet member 220 of the wafer ring structure 200 held by the clamping section 63 is cooled by the cooling unit 8. If necessary, the sheet member 220 is cooled by the cold air supplying section 7. The wafer ring structure 200, cooled to a predetermined temperature, is lowered by the Z-direction moving mechanism 61 while being held by the clamping section 63. Then, the sheet member 220 is expanded by the expanding ring 64, and the wafer 210 is divided along the division line. At this time, the wafer 210 is divided while the fragments are sucked by the fragment cleaner 9.

[0064] In step S4, the expanding unit 6 is moved in the Z2 direction of the heat shrink unit 10 while maintaining the expanded state of the sheet member 220. That is, after the wafer 210 is divided, the wafer ring structure 200 with the expanded sheet member 220 is moved in the Y1 direction by the Y-direction moving mechanism 62. In step S5, the heat shrink unit 10 heats and shrinks the sheet member 220. At this time, the wafer ring structure 200 moved in the Y1 direction is heated by the heating ring 111 while being sandwiched between the expansion maintaining ring 113 and the expansion ring 64. At this time, air is drawn in by the suction ring 112, and ultraviolet light is irradiated by the ultraviolet irradiation unit 11.

[0065] In step S6, the expanding unit 6 is returned to its original position. That is, the wafer ring structure 200, with the sheet member 220 deflated, is moved in the Y2 direction by the Y-direction movement mechanism 31. In step S7, the wafer ring structure 200 is transferred from the expanding unit 6 to the lift-up hand unit 3 by the suction hand 43, and then moved in the X1 direction by the X-direction movement mechanism 41 and handed over to the lift-up hand 32. In step S8, the wafer ring structure 200 is accommodated in the cassette unit 2. Then, the wafer ring structure 200 supported by the lift-up hand 32 is moved in the Y1 direction by the Y-direction movement mechanism 31, and the wafer ring structure 200 is accommodated in the cassette unit 2. This completes the processing performed on one wafer ring structure 200.

[0066] (Expand and heat shrink configuration) The configuration relating to the expanding and heat shrinking will be described in detail with reference to Figs. 1 and 9 to 14.

[0067] 1 and 9 to 14, the expanding unit 6 is configured to expand a stretchable, heat-shrinkable sheet member 220 at a first position P1. The Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamping unit 63, and the expanding ring 64 of the expanding unit 6 in the horizontal direction (Y1 direction) from the first position P1 to a second position P2 that is spaced apart from the first position P1 in the horizontal direction (Y1 direction) in a plan view, while the sheet member 220 is expanded by the expanding unit 6. The heat shrink unit 10 is configured to heat and shrink (heat shrink) slack in a portion 220b of the sheet member 220 around the wafer 210, which is generated by expansion by the expanding unit 6, at the second position P2.

[0068] <Configuration related to expansion> As shown in FIGS. 9 to 11, the expanding unit 6 is configured to grip the ring-shaped member 230 in the vertical direction (Z direction) using the clamping unit 63 when expanding the sheet member 220. Specifically, the upper gripping portion 63b of the clamping unit 63 is composed of multiple (four) slide movers 63ba arranged to surround the wafer ring structure 200. The multiple slide movers 63ba are configured to slide in the horizontal direction toward the wafer 210 when gripping the ring-shaped member 230. Furthermore, the lower gripping portion 63a of the clamping unit 63 is configured to rise in the Z1 direction toward the upper gripping portion 63b (the multiple slide movers 63ba) that has slid toward the wafer 210 by the driving force of a cylinder such as an air cylinder. As a result, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a of the clamping unit 63.

[0069] Furthermore, the clamp unit 63 is configured to move downward in the Z2 direction toward the expand ring 64 by the driving force of the motor 61a of the Z-direction movement mechanism 61 while holding the ring-shaped member 230 between the upper holding portion 63b and the lower holding portion 63a. As a result, the sheet member 220 is pressed against the expand ring 64, and the sheet member 220 is expanded. The expand ring 64 is disposed on the Z2 direction side of the sheet member 220. The expand ring 64 is disposed between the wafer 210 and the ring-shaped member 230 in the horizontal direction. The expand ring 64 is formed in a circular annular shape so as to surround the wafer 210.

[0070] At the first position P1, which is the expansion position, a debris cleaner 9 is disposed on the Z1 direction side of the wafer ring structure 200 to suck up and remove debris generated from the wafer ring structure 200 due to the expansion of the sheet member 220. The debris may be, for example, debris from the wafer 210. If a die attach film is present between the wafer 210 and the sheet member 220, the die attach film may also become debris. Furthermore, since the debris of the wafer 210 near the outer edge 210a of the wafer 210 (see FIG. 12) is small, its position becomes unstable during the expansion of the sheet member 220, making it more likely to become debris. The debris cleaner 9 is configured to suck up and remove debris using negative pressure supplied from a negative pressure generator.

[0071] 5 and 12, the suction port 92 of the debris cleaner 9 is formed in a circular ring shape so as to face the outer edge 210a of the circular annular wafer 210 when sucking up scattered debris (fragments of the wafer 210, fragments of the die attach film, etc.). Specifically, the circular annular suction port 92 is made up of a plurality of suction ports 92 arranged in a circular ring at predetermined intervals. The debris cleaner 9 is configured to suck up scattered debris in a direction away from the center of the wafer 210 using the circular annular suction ports 92.

[0072] As shown in FIGS. 9 to 11, the debris cleaner 9 is configured to be movable in the vertical direction (Z direction) between a lower position where it sucks up scattered debris and an upper position where it does not suck up scattered debris at the first position P1, which is the expansion position, by the driving force of a cylinder such as an air cylinder. The lower position is a position near the wafer 210. The upper position is a retreat position where it can avoid the suction hand 43 moving in the X direction. The debris cleaner 9 is configured to move down in the Z2 direction from the upper position to the lower position when expanding the sheet member 220. The debris cleaner 9 is configured to start a suction operation before pressing the sheet member 220 against the expand ring 64, and to continue the suction operation at least until pressing the sheet member 220 against the expand ring 64 is completed.

[0073] At the first position P1, which is the expansion position, a cold air supply unit 7 and a cooling unit 8 are disposed to cool the sheet member 220 when the sheet member 220 is expanded by the expansion unit 6. The cold air supply unit 7 is provided integrally with the debris cleaner 9 on the Z1 side of the wafer ring structure 200. Therefore, at the first position P1, the cold air supply unit 7 is configured to be movable vertically (in the Z direction) integrally with the debris cleaner 9 between a lower position where cold air is supplied and an upper position where cold air is not supplied. The cold air supply unit 7 is configured to descend in the Z2 direction from the upper position to the lower position when the sheet member 220 is expanded. The cold air supply unit 7 is configured to start supplying cold air before the sheet member 220 is pressed against the expansion ring 64 and to continue supplying cold air at least until the sheet member 220 is completely pressed against the expansion ring 64.

[0074] The cooling unit 8 is disposed on the Z2 direction side with respect to the wafer ring structure 200. The cooling unit 8 is configured to be movable in the vertical direction (Z direction) at the first position P1 between an upper position where the sheet member 220 is cooled and a lower position where the sheet member 220 is not cooled by the driving force of a cylinder 82 such as an air cylinder. The cooling unit 8 is configured to rise in the Z1 direction from the lower position to the upper position when expanding the sheet member 220. The cooling unit 8 is configured to start and complete the cooling operation before pressing the sheet member 220 against the expand ring 64. The cooling unit 8 is configured to retreat to the lower position before pressing the sheet member 220 against the expand ring 64.

[0075] Furthermore, when the expansion of the sheet member 220 by the expansion unit 6 (pressing the sheet member 220 against the expansion ring 64) is completed, the Y-direction movement mechanism 62 is configured to move the expansion unit 6 (Z-direction movement mechanism 61, clamp unit 63, and expansion ring 64) in the Y1 direction from a first position P1 where the expansion of the sheet member 220 was performed to a second position P2 where heat shrinking of the sheet member 220 is performed, while maintaining the state in which the sheet member 220 is expanded by the expansion unit 6. At this time, the Y-direction movement mechanism 62 is configured to move the expansion unit 6 in the Y1 direction from the first position P1 to the second position P2 independently of the debris cleaner 9, the cold air supply unit 7, and the cooling unit 8, without moving the debris cleaner 9, the cold air supply unit 7, and the cooling unit 8 from the first position P1. At this time, the debris cleaner 9 and the cold air supply unit 7 are retracted to the upper position, and the cooling unit 8 is retracted to the lower position.

[0076] The Y-direction movement mechanism 62 further includes a motor 62a, a mounting portion 62b, and a rail portion 62c. The mounting portion 62b is configured so that the Z-direction movement mechanism 61, the clamp portion 63, and the expand ring 64 are mounted on the upper surface thereof. The mounting portion 62b is formed in a substantially rectangular plate shape in a plan view. The mounting portion 62b is movably mounted on the rail portion 62c. A pair of rail portions 62c are provided spaced apart in the X-direction. The pair of rail portions 62c are provided to extend in the Y-direction between a first position P1 and a second position P2. The Y-direction movement mechanism 62 is configured so that the mounting portion 62b can move in the Y-direction between the first position P1 and the second position P2 along the pair of rail portions 62c using the driving force of the motor 62a.

[0077] The mounting portion 62b is provided with a hole 62ba that penetrates the mounting portion 62b in the up-down direction (Z direction). The hole 62ba is circular in plan view. The hole 62ba is large enough to allow the cooling unit 8 to pass through it at the first position P1. This allows the cooling unit 8 to move between an upper position and a lower position via the hole 62ba. The hole 62ba is large enough to allow the ultraviolet ray irradiation unit 11 to pass through it at the second position P2. This allows the ultraviolet ray irradiation unit 11 to move between an upper position and a lower position via the hole 62ba. The hole 62ba is provided inside the expand ring 64. The cooling unit 8 and the ultraviolet ray irradiation unit 11 are configured to move inside the expand ring 64 via the hole 62ba.

[0078] <Configuration regarding heat shrink> As shown in FIGS. 13 and 14 , the heat-shrink unit 10 is positioned at the second position P2, which is the heat-shrink position, on the Z1 side of the expanding unit 6, which has been moved by the Y-direction movement mechanism 62. The heating ring 111 and suction ring 112 of the heat-shrink unit 10 are configured to be movable in the vertical direction (Z direction) between an upper position where the sheet member 220 is not heated and a lower position where the sheet member 220 is heated, by the driving force of the motor 110a of the Z-direction movement mechanism 110. The expansion maintaining ring 113 of the heat-shrink unit 10 is configured to be movable in the vertical direction between an upper position where the sheet member 220 is not pressed and a lower position where the sheet member 220 is pressed, by the driving force of a cylinder such as an air cylinder. The upper position is a retracted position that can avoid the expanding unit 6 and wafer ring structure 200 moving in the Y1 direction. The lower position is a position near the sheet member 220.

[0079] Furthermore, the heat shrink unit 10 (heating ring 111, suction ring 112, and expansion maintaining ring 113) is configured to move down in the Z2 direction from an upper position to a lower position when heat-shrinking the sheet member 220. The vertical movement mechanism (Z-direction movement mechanism 110) for the heating ring 111 and suction ring 112 and the vertical movement mechanism (cylinder) for the expansion maintaining ring 113 are separate mechanisms. Therefore, the heating ring 111, suction ring 112, and the expansion maintaining ring 113 can move up and down independently of each other. The expansion maintaining ring 113 is configured to sandwich the sheet member 220 in the vertical direction (Z direction) between itself and the expand ring 64. As a result, the expansion maintaining ring 113 is configured to maintain the expanded state of the portion of the sheet member 220 corresponding to the wafer 210. The heating ring 111 is configured to heat a portion 220b (a portion outside the expansion maintaining ring 113) of the sheet member 220 around the wafer 210 using a sheath heater, which is a heating mechanism, while the expanded state of the sheet member 220 is maintained by the expansion maintaining ring 113. The suction ring 112 is configured to suction gas generated from the sheet member 220 due to heating while the sheet member 220 is being heated by the heating ring 111.

[0080] 6, the heating ring 111 is configured to heat the entire periphery of the portion of the sheet member 220 surrounding the wafer 210. The suction ring 112 is configured to suck in air around the entire periphery of the sheet member 220 heated by the heating ring 111.

[0081] Furthermore, the suction ring 112 is configured to suck in air around the entire circumference of the sheet member 220 heated by the heating ring 111 when the sheet member 220 is heated by the heating ring 111, and to suck in air around the entire circumference of the sheet member 220 heated by the heating ring 111 when the heating ring 111 stops heating and the sheet member 220 is cooled. In other words, the suction ring 112 is configured to continue suctioning air while the heat shrink unit 10 is shrinking the sheet member 220.

[0082] When the heat shrink unit 10 shrinks the sheet member 220, the sheet member is heated by the heating ring 111 for a predetermined time, and then the heating of the heating ring 111 is stopped to cool the sheet member 220. At this time, the clamp unit 63 is moved upward. As a result, the ring-shaped member 230 of the wafer ring structure 200 gripped by the clamp unit 63 moves upward, and the sheet member 220 held by the ring-shaped member shrinks in a stretched state (tensioned state). Thereafter, heating is resumed and stopped after a predetermined time, and this operation is repeated.

[0083] 6, the intake ring 112 is disposed close to the inner periphery of the heating ring 111. The intake ring 112 includes a plurality of intake ports 112a arranged circumferentially around the entire circumference.

[0084] As shown in Figure 18(A), by arranging the intake ring 112 close to the inner periphery of the heating ring 111, it is possible to prevent the formation of warm air pockets by the flow along the surface of the heated sheet member 220, and to suck in the warm air without leaving any remaining warm air. Note that, as shown in Figure 18(B), if the intake ring 112 is arranged at the same radial position as the heating ring 111, warm air pockets tend to remain on the sheet member 220 on the inner periphery side of the heating ring 111. Furthermore, as shown in Figure 18(C), if the intake ring 112 is arranged on the outer periphery side of the heating ring 111, warm air pockets tend to remain on the sheet member 220 on the inner periphery side of the heating ring 111.

[0085] 19(A), by arranging multiple intake ports 112a circumferentially around the entire circumference of the intake ring 112, it is possible to evenly suck in warm air above the sheet member 220. In other words, if the intake ports 112a are arranged at a distance as shown in FIG. 19(B), point suction occurs, and warm air pools tend to remain between the intake ports 112a. On the other hand, by arranging multiple intake ports 112a closely together as shown in FIG. 19(A), air flows like linear suction, making it possible to prevent warm air pools from occurring.

[0086] As shown in Figure 14, an ultraviolet ray irradiation unit 11 is disposed at the second position P2, which is the heat shrink position, for irradiating ultraviolet rays onto the sheet member 220 when the heat shrink unit 10 heat-shrinks the sheet member 220. The ultraviolet ray irradiation unit 11 is disposed on the Z2 side of the wafer ring structure 200. At the second position P2, the ultraviolet ray irradiation unit 11 is configured to be movable in the vertical direction (Z direction) between an upper position where ultraviolet rays are irradiated and a lower position where ultraviolet rays are not irradiated by the driving force of a cylinder 121, such as an air cylinder. The ultraviolet ray irradiation unit 11 is configured to rise in the Z1 direction from the lower position to the upper position when the sheet member 220 is heat-shrinked.

[0087] Furthermore, once the heat-shrinking of the sheet member 220 by the heat-shrink unit 10 is completed, the Y-direction movement mechanism 62 is configured to move the expanding unit 6 (Z-direction movement mechanism 61, clamp unit 63, and expanding ring 64) in the Y2 direction from the second position P2 where the heat-shrinking was performed to the first position P1 where the expansion was performed. At this time, the Y-direction movement mechanism 62 is configured to move the expanding unit 6 in the Y2 direction from the second position P2 to the first position P1 independently of the heat-shrink unit 10 and the ultraviolet irradiator 11, without moving the heat-shrink unit 10 and the ultraviolet irradiator 11 from the second position P2. At this time, the heat-shrink unit 10 is retracted to an upper position, and the ultraviolet irradiator 11 is retracted to a lower position.

[0088] Here, in this embodiment, when the sheet member 220 is contracted by the heat shrink section 10, the expansion maintaining ring 113 contacts the periphery of the wafer 210 on the other side (Z1 direction side) of the sheet member 220 in a circumferential manner, and together with the expand ring 64, holds the sheet member 220 by sandwiching it, thereby maintaining the expansion of the sheet member 220 in the portion where the wafer 210 is placed.

[0089] 15, the expansion maintaining ring 113 includes a bottom surface portion 113a, a side surface portion 113b, and an adhesion prevention portion 113c. The bottom surface portion 113a is disposed so as to cover the upper side (Z1 direction side). The side surface portion 113b is formed in an annular shape so as to surround the wafer 210 of the sheet member 220. The bottom surface portion 113a is connected to the side surface portion 113b on the opposite side (Z1 direction side) from the sheet member 220. The bottom surface portion 113a is formed in a circular shape.

[0090] In this embodiment, the sticking prevention portion 113c is provided at the contact portion that contacts the sheet member 220, and is configured to prevent sticking to the sheet member 220.

[0091] Specifically, the sticking prevention portion 113c of the expansion-retaining ring 113 has a coating layer that coats the contact portion that contacts the sheet member 220. For example, the coating layer of the sticking prevention portion 113c coats the contact portion with fluorine. In other words, the coating layer of the sticking prevention portion 113c is formed from a fluorine resin. The coating layer of the sticking prevention portion 113c may coat the contact portion with a silicone material. The sticking prevention portion 113c may also be embossed to form irregularities.

[0092] As shown in FIG. 16, the expansion and maintenance ring 113 is formed such that the cross section of the contact portion contacting the sheet member 220 has a circular shape. That is, the expansion and maintenance ring 113 has a circular shape with no corners in the cross section of the lower end portion (the end portion on the Z2 direction side). Further, the expand ring 64 is formed such that the cross section of the portion contacting the sheet member 220 has a circular shape. That is, the expand ring 64 has a circular shape with no corners in the cross section of the upper end portion (the end portion on the Z1 direction side).

[0093] Further, the expansion and maintenance ring 113 is formed to have an inner diameter of diameter D11 and an outer diameter of diameter D12. Also, the expansion and maintenance ring 113 is formed such that the diameter of the central portion in the wall thickness of the ring (side surface portion 113b) is diameter D13. The expand ring 64 is formed to have an inner diameter of diameter D21 (where D21 < D11) and an outer diameter of diameter D22. Also, the expand ring 64 is formed such that the diameter of the central portion in the wall thickness of the ring is diameter D23 (where D23 < D13). That is, the radius of the central portion in the wall thickness of the expansion and maintenance ring 113 is formed larger than the radius of the central portion in the wall thickness of the expand ring 64.

[0094] Also, as shown in FIGS. 16 and 17, the expansion and maintenance ring 113 and the expand ring 64 are configured to sandwich and hold the sheet member 220 between the inner peripheral portion of the expansion and maintenance ring 113 and the outer peripheral portion of the expand ring 64. Also, as shown in FIG. 17, after the sheet member 220 is shrunk by the heat shrink portion 10, the expansion and maintenance ring 113 rises and thus is separated from the sheet member 220.

[0095] <Configuration Regarding the Cassette Portion and the Lift-up Hand Portion> As shown in FIG. 1, the cassette unit 2 is disposed at a position different from the first position P1 and the second position P2 in a plan view. The lift-up hand unit 3 is disposed at a position different from the first position P1 and the second position P2 in a plan view. The direction (Y2 direction) in which the lift-up hand unit 3 removes the wafer ring structure 200 from the cassette unit 2 is substantially parallel to the direction (Y1 direction) in which the Y-direction movement mechanism 62 moves the expander unit 6. That is, the insertion / removal direction (Y direction) of the wafer ring structure 200 by the lift-up hand unit 3 and the movement direction (Y direction) of the expander unit 6 by the Y-direction movement mechanism 62 are substantially parallel to each other. The cassette unit 2 is disposed adjacent to the second position P2, which is a heat shrink position, in the X direction. The removal position of the wafer ring structure 200 by the lift-up hand unit 3 is disposed adjacent to the first position P1, which is an expander position, in the X direction.

[0096] (Removal process) The removal process in the expanding apparatus 100 will be described with reference to Fig. 20. The removal process is a process carried out in step S1 in the semiconductor chip manufacturing process.

[0097] 20, in step S101, it is determined whether the lift-up hand 32 of the lift-up hand unit 3 is free. If the lift-up hand 32 is not free, the removal process is ended. If the lift-up hand 32 is free, the process proceeds to step S102.

[0098] Then, in step S102, it is determined whether or not the lift-up hand 32 is present in the wafer cassette 22 of the cassette unit 2. If the lift-up hand 32 is not present in the wafer cassette 22, the process proceeds to step S104. If the lift-up hand 32 is present in the wafer cassette 22, the process proceeds to step S103.

[0099] Then, in step S103, the lift-up hand 32 is moved by the Y-direction movement mechanism 31 from inside the wafer cassette 22 to outside the wafer cassette 22 in the Y2 direction.

[0100] Then, in step S104, the wafer cassette 22 is moved in the Z direction by the Z-direction movement mechanism 21 so that the wafer ring structure 200 to be removed from the wafer cassette 22 can be removed by the lift-up hand 32. Specifically, in step S104, the wafer cassette 22 is moved in the Z direction by the Z-direction movement mechanism 21 so that the upper surface of the lift-up hand 32 is positioned at a height slightly toward the Z2 direction from the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be removed from the wafer cassette 22.

[0101] Then, in step S105, the lift-up hand 32 is moved in the Y1 direction by the Y-direction movement mechanism 31 so as to be positioned directly below the ring-shaped member 230 of the wafer ring structure 200 to be removed from the wafer cassette 22.

[0102] Then, in step S106, the wafer ring structure 200 to be removed from the wafer cassette 22 is transferred to the lift-up hand 32. Specifically, in step S106, the wafer cassette 22 is moved in the Z2 direction by the Z-direction movement mechanism 21 so that the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be removed from the wafer cassette 22 is slightly lifted by the lift-up hand 32 from the upper surfaces of the pair of mounting portions 23.

[0103] Then, in step S107, with the upper surface of the lift-up hand 32 supporting the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be removed, the lift-up hand 32 is moved in the Y2 direction by the Y-direction movement mechanism 31. As a result, the wafer ring structure 200 to be removed is removed from the wafer cassette 22 by the lift-up hand 32. Then, the removal process is completed.

[0104] (Transfer processing) The transfer processing in the expanding apparatus 100 will be described with reference to Fig. 21. The transfer processing is processing carried out in step S2 or S7 in the semiconductor chip manufacturing process.

[0105] As shown in FIG. 21, in step S201, the suction hand 43 of the suction hand unit 4 is raised by the Z-direction movement mechanism .

[0106] Then, in step S202, the suction hand 43 is moved above the wafer ring structure 200 by the X-direction movement mechanism 41. Specifically, in step S2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the wafer ring structure 200 supported by the lift-up hand 32. Also, in step S7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the wafer ring structure 200 supported by the expanding section 6.

[0107] Then, in step S203, the suction hand 43 is lowered toward the wafer ring structure 200 by the Z-direction movement mechanism .

[0108] Then, in step S204, the suction hand 43 sucks the ring-shaped member 230 of the wafer ring structure 200 by using the negative pressure supplied from the negative pressure generator.

[0109] Then, in step S205, the suction hand 43 is raised by the Z-direction movement mechanism .

[0110] Then, in step S206, the suction hand 43 is moved above the transfer destination by the X-direction movement mechanism 41. Specifically, in step S2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the expanding section 6 at the first position P1. Also, in step S7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the lift-up hand 32.

[0111] Then, in step S207, the suction hand 43 is lowered by the Z-direction movement mechanism 42 toward the transfer destination (the expanding section 6 or the lift-up hand 32).

[0112] Then, in step S208, the suction of ring-shaped member 230 of wafer ring structure 200 by suction hand 43 is released, thereby completing transfer of wafer ring structure 200 to the transfer destination, and the transfer process is then terminated.

[0113] (Expanding process) 22 and 23, the expanding process in the expanding device 100 will be described. The expanding process is a process carried out in step S3 in the semiconductor chip manufacturing process. The expanding process is carried out at the first position P1.

[0114] 22, in step S301, the suction hand 43 is raised by the Z-direction movement mechanism 42. At this time, the ring-shaped member 230 of the wafer ring structure 200 is supported by the lower gripping portion 63a of the clamp portion 63.

[0115] Then, in step S302, the plurality of slide moving bodies 63ba of the upper gripping part 63b are slid horizontally toward the wafer 210 side.

[0116] Then, in step S303, the lower gripping portion 63a is raised while supporting the ring-shaped member 230 of the wafer ring structure 200. As a result, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a.

[0117] Then, in step S304, the debris cleaner 9 together with the cold air supply unit 7 is lowered by a cylinder toward the wafer ring structure 200.

[0118] Then, in step S305, it is determined whether cooling by supplying cold air to the sheet member 220 by the cold air supply unit 7 is necessary. If cooling by supplying cold air to the sheet member 220 by the cold air supply unit 7 is necessary, the process proceeds to step S305a. Then, in step S305a, the cold air supply unit 7 starts supplying cold air to the sheet member 220. Then, the process proceeds to step S306. On the other hand, if cooling by supplying cold air to the sheet member 220 by the cold air supply unit 7 is not necessary, the process proceeds to step S306 without performing the processing of step S305a.

[0119] Then, in step S306, it is determined whether or not cooling of the sheet member 220 by the cooling unit 8 is necessary. If cooling of the sheet member 220 by the cooling unit 8 is necessary, the process proceeds to step S307. Then, in step S307, in addition to cooling of the sheet member 220 by the cold air supply unit 7, cooling of the sheet member 220 by the cooling unit 8 is performed. Then, the process proceeds to step S308. On the other hand, if cooling of the sheet member 220 by the cooling unit 8 is not necessary, the process proceeds to step S308 without performing the process of step S307.

[0120] Then, as shown in FIG. 23, in step S308, the suction of the scattered debris by the debris cleaner 9 is started.

[0121] Then, in step S309, the clamp unit 63 is rapidly lowered by the Z-direction movement mechanism 61 to press the sheet member 220 against the expansion ring 64, thereby expanding the sheet member 220. As a result, the wafer 210 on the sheet member 220 is divided into a plurality of semiconductor chips arranged in a matrix, and the gaps between the plurality of semiconductor chips are widened. Also in step S309, the clamp unit 63 is lowered from the expansion start position to the expansion completion position.

[0122] Then, in step S310, the supply of cool air by the cool air supply unit 7 to the sheet member 220 is stopped. If it is determined in step 305 that cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is not necessary, the process proceeds to step S311 without performing the process of step S310.

[0123] Then, in step S311, the suction of the scattered debris by the debris cleaner 9 is stopped.

[0124] Then, in step S312, the debris cleaner 9 is raised by the cylinder together with the cold air supply unit 7. Then, the expansion process is terminated. Then, while maintaining the sheet member 220 in an expanded state, the expansion unit 6 (Z-direction movement mechanism 61, clamp unit 63, and expansion ring 64) is moved by the Y-direction movement mechanism 62 from the first position P1 to the second position P2.

[0125] (Heat shrink treatment) 24 and 25, the heat shrink process in the expanding apparatus 100 will be described. The heat shrink process is a process carried out in step S5 in the semiconductor chip manufacturing process.

[0126] As shown in FIG. 24, in step S401, the ultraviolet ray irradiation unit 11 is raised by the cylinder 121.

[0127] Then, in step S402, the expansion maintaining ring 113 is lowered by the cylinder. As a result, the sheet member 220 is sandwiched between the expansion maintaining ring 113 and the expand ring 64.

[0128] Then, in step S403, the heating ring 111 and the suction ring 112 are lowered by the Z-direction movement mechanism 110. Note that the vertical movement mechanism (Z-direction movement mechanism 110) for the heating ring 111 and the suction ring 112 and the vertical movement mechanism (cylinder) for the expansion maintaining ring 113 are separate mechanisms.

[0129] Then, in step S404, the intake ring 112 starts intake.

[0130] Then, in step S405, heating of the sheet member 220 by the heating ring 111 and irradiation of ultraviolet rays by the ultraviolet irradiation unit 11 onto the sheet member 220 are started. Heating of the sheet member 220 by the heating ring 111 causes slack in the portion 220b of the sheet member 220 around the wafer 210 to shrink and be removed. Furthermore, irradiation of ultraviolet rays onto the sheet member 220 by the ultraviolet irradiation unit 11 reduces the adhesive strength of the adhesive layer of the sheet member 220.

[0131] Then, in step S406, it is determined whether the heating time of the sheet member 220 by the heating ring 111 has reached the set time. If the heating time of the sheet member 220 by the heating ring 111 has not reached the set time, the process of step S406 is repeated. If the heating time of the sheet member 220 by the heating ring 111 has reached the set time, the process proceeds to step S407.

[0132] Then, in step S407, the heating of the sheet member 220 by the heating ring 111 is stopped.

[0133] Then, in step S408, the clamp unit 63 is raised at a low speed by the Z-direction movement mechanism 61.

[0134] Then, in step S409, it is determined whether or not the clamp unit 63 has risen to the expansion start position. If the clamp unit 63 has not risen to the expansion start position, the process of step S409 is repeated. If the clamp unit 63 has risen to the expansion start position, the process proceeds to step S410.

[0135] In the processing of steps S406 to S409, an example has been shown in which the heating of the sheet member 220 by the heating ring 111 and the lifting of the clamp unit 63 by the Z-direction movement mechanism 61 are performed in one go, but the heat shrink configuration is not limited to this. For example, the heating of the sheet member 220 by the heating ring 111 and the lifting of the clamp unit 63 by the Z-direction movement mechanism 61 may be performed in multiple separate runs. In other words, the heating of the sheet member 220 by the heating ring 111 and the lifting of the clamp unit 63 by the Z-direction movement mechanism 61 may be repeated until the clamp unit 63 reaches the expansion start position.

[0136] Then, in step S410, the suction by the suction ring 112 and the irradiation of ultraviolet light by the ultraviolet irradiation unit 11 onto the sheet member 220 are stopped.

[0137] Then, in step S411, the heating ring 111 and the suction ring 112 are raised by the Z-direction movement mechanism 110.

[0138] Then, in step S412, the expansion maintaining ring 113 is raised by the cylinder.

[0139] Then, in step S413, the ultraviolet irradiation unit 11 is lowered by the cylinder 121. Then, the heat shrink process is completed. Then, the expanding unit 6 (Z-direction moving mechanism 61, clamping unit 63, and expanding ring 64) is moved from the second position P2 to the first position P1 by the Y-direction moving mechanism 62. Then, the wafer ring structure 200, which has been expanded and heat shrunk, is transferred by the suction hand 43 from the expanding unit 6 at the first position P1 to the lift-up hand 32.

[0140] (Containment Processing) The accommodation process in the expanding device 100 will be described with reference to Fig. 26. The accommodation process is a process carried out in step S8 in the semiconductor chip manufacturing process.

[0141] 26, in step S501, it is determined whether the lift-up hand 32 of the lift-up hand section 3 is free. If the lift-up hand 32 is not free, the storage process is ended. If the lift-up hand 32 is free, the process proceeds to step S502.

[0142] Then, in step S502, it is determined whether or not the lift-up hand 32 is present in the wafer cassette 22 of the cassette unit 2. If the lift-up hand 32 is not present in the wafer cassette 22, the process proceeds to step S504. If the lift-up hand 32 is present in the wafer cassette 22, the process proceeds to step S503.

[0143] Then, in step S503, the lift-up hand 32 is moved by the Y-direction movement mechanism 31 from inside the wafer cassette 22 to outside the wafer cassette 22 in the Y2 direction.

[0144] Then, in step S504, the wafer cassette 22 is moved in the Z direction by the Z-direction movement mechanism 21 so that the wafer ring structure 200 to be accommodated on the lift-up hand 32 can be accommodated in the wafer cassette 22. Specifically, in step S504, the wafer cassette 22 is moved in the Z direction by the Z-direction movement mechanism 21 so that the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at a height slightly toward the Z1 direction side of the upper surfaces of the pair of mounting portions 23 in the wafer cassette 22.

[0145] Then, in step S505, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 so that the underside of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at the accommodation position within the wafer cassette 22 (directly above the pair of mounting portions 23).

[0146] Then, in step S506, the wafer ring structure 200 to be accommodated on the lift-up hand 32 is transferred to the pair of mounting portions 23 in the wafer cassette 22. Specifically, in step S506, the wafer cassette 22 is moved in the Z1 direction by the Z-direction moving mechanism 21 so that the upper surface of the lift-up hand 32 is slightly lower than the upper surfaces of the pair of mounting portions 23.

[0147] Then, in step S508, the lift-up hand 32 is moved in the Y2 direction by the Y-direction movement mechanism 31 while the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated is supported by the upper surfaces of the pair of mounting parts 23. As a result, the lift-up hand 32 is removed while the wafer ring structure 200 to be accommodated is accommodated in the wafer cassette 22. Then, the accommodation process is completed.

[0148] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0149] In this embodiment, as described above, the expansion maintaining ring 113, which maintains the expansion of the portion of the sheet member 220 where the wafer 210 is placed, is provided with an adhesion preventing portion 113c that is disposed at the contact portion that contacts the sheet member 220 and prevents the expansion maintaining ring 113 from sticking to the sheet member 220. This prevents the expansion maintaining ring 113 from sticking to the sheet member 220 when the expansion maintaining ring 113 is separated from the sheet member 220 after the sheet member 220 has been contracted by the heat shrink unit 10. As a result, vibration of the sheet member 220 can be prevented when a member that contacts the sheet member 220 is separated from the sheet member 220 after heating by the heat shrink unit 10. This prevents the wafer 210 placed on the sheet member 220 from peeling off or shifting position due to vibration of the sheet member 220 when a member that contacts the sheet member 220 is separated from the sheet member 220 after heating by the heat shrink unit 10.

[0150] Furthermore, in this embodiment, the sticking prevention portion 113c of the expansion-maintaining ring 113 has a coating layer that coats the contact portion that contacts the sheet member 220. This allows the sticking prevention portion 113c to be formed by the coating layer at the contact portion of the expansion-maintaining ring 113 that contacts the sheet member 220, making it possible to easily provide the sticking prevention portion 113c at the contact portion of the expansion-maintaining ring 113.

[0151] In this embodiment, the coating layer of the sticking prevention portion 113c is fluorine-coated at the contact portion, thereby effectively preventing the expansion-retaining ring 113 from sticking to the sheet member 220.

[0152] Furthermore, in this embodiment, the expansion maintaining ring 113 is formed so that the cross section of the abutting portion that abuts against the sheet member 220 has a round shape. This makes it possible to reduce the area of ​​the portion of the expansion maintaining ring 113 that abuts against the sheet member 220 compared to when the abutting portion of the expansion maintaining ring 113 is flat, thereby effectively preventing the expansion maintaining ring 113 from sticking to the sheet member 220. Furthermore, by making the cross section of the abutting portion of the expansion maintaining ring 113 that abuts against the sheet member 220 round, it is possible to prevent the sheet member 220 from being scratched, unlike when an angular abutting portion abuts against the sheet member 220.

[0153] Furthermore, in this embodiment, the expand ring 64 is formed so that the cross section of the portion that abuts against the sheet member 220 has a round shape. This allows the round surface to abut against the sheet member 220, unlike when the cross section of the expand ring 64 that abuts against the sheet member 220 is formed in an angular shape, and therefore it is possible to prevent the sheet member 220 from being scratched by the abutment of the expand ring 64.

[0154] Furthermore, in this embodiment, the radius of the expansion maintaining ring 113 at the center of the ring thickness is larger than the radius of the expand ring 64 at the center of the ring thickness. This allows the expansion maintaining ring 113 to abut against the sheet member 220 outside the expand ring 64. Therefore, even if slight vibrations occur when the expansion maintaining ring 113 is separated from the sheet member 220, the expand ring 64 is in abutting contact with the sheet member 220 on the inside of the expansion maintaining ring 113, so that the vibrations can be prevented from being transmitted to the inner portion of the sheet member 220 where the wafer 210 is arranged. This effectively prevents the wafer 210 arranged on the sheet member 220 from peeling off or shifting position.

[0155] Furthermore, in this embodiment, the expansion maintaining ring 113 and the expand ring 64 are configured to sandwich and hold the sheet member 220 between the inner peripheral portion of the expansion maintaining ring 113 and the outer peripheral portion of the expand ring 64. As a result, the sheet member 220 is sandwiched and held between the inner peripheral portion of the expansion maintaining ring 113, which has a round cross section, and the outer peripheral portion of the expand ring 64, which also has a round cross section, so that the sheet member 220 is securely held and the expansion of the portion of the sheet member 220 where the wafer 210 is placed can be reliably maintained. Furthermore, even if slight vibrations occur when the expansion maintaining ring 113, which sandwiches the sheet member 220 from the outside, is separated from the sheet member 220, the vibrations can be suppressed from being transmitted to the inner portion of the sheet member 220 where the wafer 210 is placed.

[0156] Furthermore, in this embodiment, the heat shrink unit 10 includes a heating ring 111 that heats the entire periphery of the wafer 210 on the sheet member 220. This allows the entire periphery of the wafer 210 on the sheet member 220 to be heated simultaneously, so that the entire periphery of the wafer 210 on the sheet member 220 can be shrunk simultaneously. This makes it possible to suppress uneven shrinkage compared to when the periphery of the wafer 210 on the sheet member 220 is shrunk partially.

[0157] Furthermore, in this embodiment, the heat shrink unit 10 includes an air suction ring 112 that sucks in air all around the sheet member 220 that is heated by the heating ring 111. As a result, even if gas is generated from the sheet member 220 due to heating by the heating ring 111, the generated gas can be sucked in all around the sheet member 220 by the air suction ring 112, which prevents the generated gas from reaching the wafer 210 and also prevents the gas from accumulating inside the device.

[0158] Furthermore, in this embodiment, when the sheet member 220 is heated by the heating ring 111, the suction ring 112 is configured to suck in air around the entire circumference of the sheet member 220 heated by the heating ring 111, and when heating by the heating ring 111 is stopped and the sheet member 220 is cooled, the suction ring 112 is configured to suck in air around the entire circumference of the sheet member 220 heated by the heating ring 111. This allows the suction ring 112 to suck in surrounding air around the entire circumference when cooling the sheet member 220, so that the sheet member 220 can be cooled quickly.

[0159] Furthermore, in this embodiment, the suction ring 112 is disposed close to the inner periphery of the heating ring 111. This allows air to be sucked into a position close to the inside of the heating ring 111, so that, as shown in Fig. 18(A), when air is sucked into the suction ring 112 from the sheet member 220 heated by the heating ring 111, an air flow can be formed along the inside of the sheet member 220 from the outside. This makes it possible to prevent warm air from accumulating on the sheet member 220, and therefore allows the sheet member 220 to be cooled evenly and efficiently.

[0160] In this embodiment, the intake ring 112 includes a plurality of intake ports 112a arranged circumferentially around the entire circumference. As a result, as shown in Fig. 19(A), the plurality of intake ports 112a arranged circumferentially around the entire circumference can suck in warm air evenly from the sheet member 220 heated by the heating ring 111, thereby preventing the formation of a warm air pocket where warm air stagnates on the sheet member 220. This allows the sheet member 220 to be cooled evenly and efficiently.

[0161] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims.

[0162] For example, in the above embodiment, an example was shown in which the expansion maintaining ring is formed so that the radius of the center of the ring thickness is larger than the radius of the center of the expanding ring (support ring) in the ring thickness, but the present invention is not limited to this. In the present invention, the expansion maintaining ring may be formed so that the radius of the center of the ring thickness is the same as or smaller than the radius of the center of the support ring in the ring thickness.

[0163] In addition, in the above embodiment, an example of a configuration in which the expansion maintaining ring is provided above the sheet member and the expand ring (support ring) is provided below the sheet member is shown, but the present invention is not limited to this. In the present invention, the expansion maintaining ring may be provided below the sheet member and the support ring may be provided above the sheet member. Furthermore, the expansion maintaining ring and the support ring may be arranged so as to face each other horizontally, with the sheet member in between.

[0164] In the above embodiment, the expansion-maintaining ring has a configuration in which the contact portion that contacts the sheet member has a rounded surface, but the present invention is not limited to this. In the present invention, the contact portion of the expansion-maintaining ring that contacts the sheet member may be formed in a flat shape or a tapered shape.

[0165] In the above embodiment, the heating ring of the heat shrink unit heats the entire periphery of the wafer of the sheet member, but the present invention is not limited to this. In the present invention, the heat shrink unit may be configured to heat the periphery of the wafer sequentially, portion by portion.

[0166] In the above embodiment, the heating ring of the heat-shrink unit includes a sheathed heater, but the present invention is not limited to this. In the present invention, the heating ring of the heat-shrink unit may include a heater other than a sheathed heater. For example, the heating ring may include a heater such as a carbon heater, a ceramic heater, a halogen heater, or an infrared heater. Furthermore, the heat-shrink unit may heat the sheet member by blowing hot air onto the sheet member.

[0167] In the above embodiment, the suction ring is disposed close to the inner periphery of the heating ring, but the present invention is not limited to this. In the present invention, the suction ring may be disposed close to the outer periphery of the heating ring, or may be disposed at a predetermined distance from the heating ring.

[0168] In the above embodiment, for convenience of explanation, the control processing of the second control unit 13 (control unit) is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing. [Explanation of symbols]

[0169] 6 Expanding section 10 Heat shrink section 64 Expanding ring (supporting ring) 100 Expanding device 111 Heating Ring 112 Intake ring 112a Air intake 113 Expansion Maintenance Ring 113c Sticking prevention part 210 wafers 220 Sheet material

Claims

1. an expanding section including a support ring that supports a divisible wafer attached along a dividing line by contacting the periphery of the wafer on one side of a heat-shrinkable sheet member having elasticity, and that expands the sheet member while keeping the sheet member in contact with the support ring to divide the wafer along the dividing line; a heat shrink section that heats and shrinks the slack in the portion of the sheet member around the wafer that occurs due to expansion by the expanding section; an expansion maintaining ring that, when the sheet member is shrunk by the heat shrink section, contacts the periphery of the wafer on the other surface of the sheet member in a circumferential manner, and sandwiches and holds the sheet member together with the support ring, thereby maintaining the expansion of the sheet member at the portion where the wafer is placed; the expansion maintaining ring includes an adhesion preventing portion provided at a contact portion that contacts the sheet member and that prevents the expansion maintaining ring from sticking to the sheet member; the expansion maintaining ring is formed so that the cross section of the abutting portion that abuts against the sheet member has a round shape; the support ring is formed so that a cross section of a portion that abuts against the sheet member has a round shape, An expanding device, wherein the expansion maintaining ring and the support ring are configured to sandwich and hold the sheet member between the inner peripheral portion of the expansion maintaining ring and the outer peripheral portion of the support ring.

2. The expanding device according to claim 1 , wherein the sticking prevention portion of the expansion maintaining ring has a coating layer that coats the contact portion that contacts the sheet member.

3. The expanding device according to claim 2 , wherein the coating layer of the sticking prevention portion is a fluorine coating on the contact portion.

4. the expansion retention ring and the support ring both have an annular shape; The expansion device according to any one of claims 1 to 3, wherein the radius of the center of the expansion maintaining ring in its wall thickness is larger than the radius of the center of the support ring in its wall thickness.

5. The expanding device according to any one of claims 1 to 4, wherein the heat shrink section includes a heating ring that heats the entire periphery of the portion of the sheet member surrounding the wafer.

6. The expanding device according to claim 5 , wherein the heat shrink portion includes an air suction ring that sucks air around the entire periphery of the sheet member heated by the heating ring.

7. The expanding device according to claim 6, wherein the suction ring is configured to suck in air around the entire circumference of the sheet member heated by the heating ring when the sheet member is heated by the heating ring, and to suck in air around the entire circumference of the sheet member heated by the heating ring when heating by the heating ring is stopped and the sheet member is cooled.

8. The expanding device according to claim 6 or 7, wherein the suction ring is disposed adjacent to the inner periphery of the heating ring.

9. The expanding device according to any one of claims 6 to 8, wherein the intake ring includes a plurality of intake ports arranged circumferentially around the entire circumference.