Component mounting device and position correction method for component mounting device

Abstract

To provide a component mounting device capable of easily correcting a position for a mounting error of a component caused by a dimensional error or other factors of a mechanical component.SOLUTION: A component mounting device 100 includes a head part 31 for sucking a component E and mounting it on a substrate, a jig component 11 including a first feature part 11a and a second feature part 11b and provided separately from the component E for correcting its position, a component imaging part 5 for imaging the first feature part 11a and the second feature part 11b from below, and a control part 7 for acquiring the amount of misalignment of a sucked position in a first state in which the jig component 11 is sucked by the head part 31 on the basis of a first captured image 12 obtained by capturing the first feature part 11a from below by the component imaging part 5, acquiring the amount of misalignment of the mounting position in a second state in which the head part 31 is lowered from a first state on the basis of a second captured image 13 obtained by capturing an image of the second feature part 11b from below by the component imaging part 5, and thereafter acquiring the amount of position correction from the amount of sucked position misalignment and the amount of mounted position misalignment.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus and a position correction method for the component mounting apparatus, and more particularly to a component mounting apparatus that picks up components and mounts them on a board, and a position correction method for the component mounting apparatus. [Background technology]

[0002] BACKGROUND ART Conventionally, component mounting devices that pick up components and mount them on a board are known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses an electronic component mounting apparatus including a suction head that picks up components and mounts them on a board, a component recognition camera that captures images of the components picked up by the suction head, and a board recognition camera that captures images of the board. In this electronic component mounting apparatus, component mounting errors due to dimensional errors of mechanical components and the like are present, so a correction value for the mounting error is acquired in advance. Specifically, first, a component (actual component or component for inspection) is picked up by the suction head. Then, the component picked up by the suction head is imaged by the component recognition camera to acquire the amount of pickup positional deviation. Then, with the acquired pickup positional deviation amount corrected, the component is mounted on an inspection reference board provided with a component positioning mark. Then, the component mounted on the reference board is imaged by the board recognition camera to acquire the correction value for the mounting error. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4494922 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the electronic component mounting device described in Patent Document 1 uses a reference board (jig board) to obtain a correction value (position correction amount) for the mounting error, which is inconvenient because it requires time and effort to prepare the reference board. In this case, there is a problem in that it is difficult to easily perform position correction for component mounting errors caused by dimensional errors of mechanical components, etc.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting device and a position correction method for a component mounting device that can easily perform position correction of component mounting errors caused by dimensional errors of mechanical components, etc. [Means for solving the problem]

[0007] A component mounting device according to a first aspect of the present invention includes a head unit that picks up a component and mounts it on a board; a jig component for position correction that includes a first characteristic portion and a second characteristic portion and is provided separately from the component; an imaging unit that images the first characteristic portion and the second characteristic portion from below; and a control unit that acquires an amount of pickup position deviation based on a first captured image obtained by capturing the first characteristic portion from below by the imaging unit in a first state in which the jig component is picked up by the head unit, and then acquires an amount of mounting position deviation based on a second captured image obtained by capturing the second characteristic portion from below by the imaging unit in a second state in which the head unit is lowered from the first state, and then acquires an amount of position correction from the pickup position deviation amount and the mounting position deviation amount.

[0008] In a component mounting device according to a first aspect of the present invention, as described above, a controller is provided that acquires a pickup position deviation amount based on a first captured image obtained by capturing a first feature portion from below with the imaging unit in a first state in which the jig component is picked up by the head unit, and then acquires a mounting position deviation amount based on a second captured image obtained by capturing a second feature portion from below with the imaging unit in a second state in which the head unit is lowered from the first state, and then acquires a position correction amount from the pickup position deviation amount and the mounting position deviation amount. This allows the position correction amount to be acquired simply by using the jig component without using a jig board. As a result, there is no need to prepare a jig board, and the effort required for preparing the jig board can be saved. This facilitates position correction of component mounting errors caused by dimensional errors of mechanical components, etc.

[0009] In the component mounting device according to the first aspect, preferably, the first feature portion is arranged on the jig component so as to appear blurred in the second captured image and appear more clearly in the first captured image than the second feature portion, and the second feature portion is arranged on the jig component so as to appear blurred in the first captured image and appear more clearly in the second captured image than the first feature portion. With this configuration, the first feature portion can be easily recognized in the first captured image, making it possible to easily obtain the amount of pickup positional deviation. Furthermore, the second feature portion can be easily recognized in the second captured image, making it possible to easily obtain the amount of mounting positional deviation.

[0010] In the component mounting device according to the first aspect, the first and second characteristic portions are preferably arranged on the jig component so as not to overlap each other in the first captured image and the second captured image. With this configuration, the first characteristic portion can be more easily recognized in the first captured image, and the second characteristic portion can be more easily recognized in the second captured image, compared to when the first and second characteristic portions overlap each other in the first and second captured images.

[0011] In the component mounting device according to the first aspect, the first and second characteristic portions are preferably marks. With this configuration, the first and second characteristic portions can be provided with a relatively simple configuration.

[0012] In the component mounting device according to the first aspect, the second state is preferably a state in which the head unit is lowered from the first state and the jig component sucked by the head unit is placed near the upper surface of the imaging unit. This configuration prevents the jig component from coming into contact with the upper surface of the imaging unit, unlike when the jig component is placed on the upper surface of the imaging unit. This prevents scratches on the upper surface of the imaging unit from being caused by contact between the jig component and the upper surface of the imaging unit. As a result, even if scratches are made on the upper surface of the imaging unit, it is possible to prevent the scratches from adversely affecting imaging.

[0013] In this case, preferably, the jig component further includes a reflection prevention part for preventing the head part from being reflected in the second captured image. With this configuration, even when capturing an image of the second characteristic part of the jig component in a state where it is sucked by the head part, the reflection prevention part can prevent the head part from being reflected in the second captured image, thereby making it possible to avoid a situation where the mounting position deviation amount cannot be accurately obtained due to the head part being reflected in the second captured image.

[0014] In the component mounting device according to the first aspect, the second state is preferably a state in which the head unit is lowered from the first state and a jig component is placed on the upper surface of the imaging unit. With this configuration, the second characteristic portion of the jig component can be imaged in a state in which the jig component is placed and stabilized on the upper surface of the imaging unit, making it easy to image the second characteristic portion.

[0015] The component mounting device according to the first aspect preferably further includes a mounting section on which a jig component can be placed and which is detachable from the imaging section. The second state is a state in which the head section is lowered from the first state to place the jig component on the upper surface of the mounting section. This configuration prevents contact between the jig component and the upper surface of the imaging section, unlike when the jig component is placed on the upper surface of the imaging section. This configuration prevents scratches on the upper surface of the imaging section due to contact between the jig component and the upper surface of the imaging section. As a result, even if scratches are made on the upper surface of the imaging section, the scratches on the upper surface of the imaging section can be prevented from adversely affecting imaging. Furthermore, because the mounting section is detachable from the imaging section, even if scratches are made on the upper surface of the mounting section due to contact between the jig component and the upper surface of the mounting section, the damaged mounting section can be replaced with an undamaged mounting section. As a result, even if scratches are made on the upper surface of the mounting section, the scratches on the upper surface of the mounting section can be prevented from adversely affecting imaging.

[0016] In the component mounting device according to the first aspect, the jig component preferably further includes a columnar main body made of a light-transmitting material, the main body having a lower surface on which the first characteristic portion is provided and an upper surface opposite the lower surface on which the second characteristic portion is provided. With this configuration, because the main body is made of a light-transmitting material, not only the first characteristic portion on the lower surface but also the second characteristic portion on the upper surface can be clearly imaged from below by the imaging unit.

[0017] In the component mounting device according to the first aspect, the jig component preferably further includes a main body portion having a concave shape recessed from bottom to top, the main body portion having a first surface as a bottom end surface of the concave shape on which the first characteristic portion is provided, and a second surface as a bottom surface of the concave shape on which the second characteristic portion is provided. With this configuration, the second characteristic portion can be imaged through the space, which prevents polarization and bending from occurring, unlike when the second characteristic portion is imaged by transmitting light through the main body portion. This prevents the second characteristic portion from being inaccurately imaged due to polarization and bending.

[0018] In the component mounting device according to the first aspect, the jig component preferably further includes an anti-slip portion that prevents the jig component from sliding when placed. With this configuration, the anti-slip portion can prevent the jig component from sliding when placed, thereby avoiding an inaccurate image capture of the first characteristic portion and the second characteristic portion due to sliding of the jig component.

[0019] In the component mounting device according to the first aspect, the jig component preferably further includes a mirror unit or a projection unit for positioning the second characteristic portion at a position where the imaging unit is focused. With this configuration, even if the thickness of the jig component is reduced, the second characteristic portion can be positioned at a position where the imaging unit is focused. Furthermore, if the thickness of the jig component is reduced, the height position of the head unit when capturing an image of the second characteristic portion can be made closer to the height position of the head unit when the actual component is mounted, thereby enabling the amount of mounting position deviation to be obtained with greater accuracy.

[0020] In the component mounting device according to the first aspect, preferably, the first and second characteristic portions are set with unique correction values ​​resulting from manufacturing errors, and the control unit is configured to acquire the position correction amount based on the unique correction value of the first characteristic portion, the unique correction value of the second characteristic portion, the pickup position deviation amount, and the mounting position deviation amount. With this configuration, the position correction amount can be acquired with higher accuracy by taking into account the unique correction value resulting from manufacturing errors.

[0021] The component mounting apparatus according to the first aspect preferably further includes a placement unit for placing the jig component, the placement unit being provided in a nozzle storage unit for storing the suction nozzle attached to the head unit or in the imaging unit. With this configuration, the jig component can be easily removed from the placement unit provided in the nozzle storage unit or the imaging unit, making it easy to perform position correction using the jig component even during spare time in production setup.

[0022] A position correction method for a component mounting device according to a second aspect of the present invention is a position correction method for a component mounting device having a head unit that adsorbs a component and mounts it on a board, the method comprising the steps of: adsorbing, by the head unit, a jig component for position correction that includes a first characteristic portion and a second characteristic portion and is provided separately from the component; acquiring an amount of adsorption position deviation based on a first captured image obtained by capturing an image of the first characteristic portion from below in a first state in which the jig component is adsorbed by the head unit; after acquiring the amount of adsorption position deviation, acquiring an amount of mounting position deviation based on a second captured image obtained by capturing an image of the second characteristic portion from below in a second state in which the head unit is lowered from the first state; and, after acquiring the amount of mounting position deviation, acquiring a position correction amount from the amount of adsorption position deviation and the amount of mounting position deviation.

[0023] A position correction method for a component mounting device according to a second aspect of the present invention includes the steps of: acquiring a pickup position deviation amount based on a first captured image of a first feature portion captured from below in a first state in which the jig component is picked up by the head; acquiring a mounting position deviation amount based on a second captured image of a second feature portion captured from below in a second state in which the head is lowered from the first state after acquiring the pickup position deviation amount; and acquiring a position correction amount from the pickup position deviation amount and the mounting position deviation amount after acquiring the mounting position deviation amount. This allows the position correction amount to be acquired using only the jig component without using a jig board. As a result, there is no need to prepare a jig board, thereby saving the effort required for preparing the jig board. This provides a position correction method for a component mounting device that can easily correct the position of component mounting errors caused by dimensional errors of mechanical components, etc. [Effects of the Invention]

[0024] According to the present invention, as described above, it is possible to easily perform position correction for component mounting errors caused by dimensional errors of mechanical components. [Brief explanation of the drawings]

[0025] [Figure 1]FIG. 1 is a schematic plan view showing a component mounting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a block diagram showing a control configuration of the component mounting apparatus according to the first embodiment. [Figure 3] FIG. 2 is a schematic diagram showing a component imaging unit according to the first embodiment. [Figure 4] FIG. 2 is a perspective view showing a jig part according to the first embodiment. [Figure 5] 5A to 5C are schematic diagrams for explaining the imaging operation of the jig part according to the first embodiment. [Figure 6] 5A and 5B are schematic diagrams for explaining a captured image of a jig part according to the first embodiment. [Figure 7] 5 is a flowchart for explaining a control process relating to imaging of a jig part according to the first embodiment. [Figure 8] FIG. 10 is a perspective view showing a component imaging unit according to a second embodiment. [Figure 9] FIG. 10 is a perspective view showing a jig part according to a second embodiment. [Figure 10] 10A and 10B are schematic diagrams for explaining the imaging operation of the jig part according to the second embodiment. [Figure 11] FIG. 10 is a perspective view showing a jig part according to a third embodiment. [Figure 12] 10A and 10B are schematic diagrams for explaining the imaging operation of a jig part according to the third embodiment. [Figure 13] FIG. 10 is a schematic view showing a jig part according to a fourth embodiment. [Figure 14] 10A and 10B are schematic diagrams for explaining the state when an image of a jig part is captured according to the fourth embodiment. [Figure 15] 10A and 10B are schematic diagrams for explaining the imaging operation of a jig part according to the fourth embodiment. [Figure 16] FIG. 10 is a schematic view showing a jig part according to a first modified example. [Figure 17] FIG. 10 is a schematic view showing a jig part according to a second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0027] [First embodiment] The configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0028] (Configuration of component mounting equipment) As shown in FIGS. 1 and 2, the component mounting apparatus 100 is an apparatus that mounts components E (electronic components) such as ICs, transistors, capacitors, and resistors onto a substrate P such as a printed circuit board.

[0029] The component mounting apparatus 100 includes a base 1, a board transport unit 2, a head unit 3, a head horizontal movement mechanism 4, a component imaging unit 5, a board imaging unit 6, a control unit 7 (see FIG. 2), and a storage unit 8 (see FIG. 2). The component imaging unit 5 is an example of the "imaging unit" in the claims.

[0030] The base 1 is a base on which each component is arranged in the component mounting apparatus 100. A board transport unit 2, a rail unit 42 (described later), and a component imaging unit 5 are provided on the base 1. A control unit 7 is also provided within the base 1. A plurality of feeders 10 are also arranged on both sides of the base 1 in the Y direction (the Y1 direction side and the Y2 direction side). The feeders 10 are tape feeders that supply components E to a head unit 31 (described later) of the head unit 3 using a component supply tape that holds the components E.

[0031] The substrate transport section 2 is configured to carry in the substrate P before mounting, transport it in the substrate transport direction (X direction), and carry out the substrate P after mounting. The substrate transport section 2 is also configured to transport the carried-in substrate P to a mounting stop position Pa and fix it at the mounting stop position Pa with a substrate fixing mechanism (not shown) such as a clamp mechanism. The substrate transport section 2 also includes a pair of transport belts 21. The substrate transport section 2 is configured to transport the substrate P in the substrate transport direction with the pair of transport belts 21 supporting both ends of the substrate P in the width direction (Y direction) from below (Z2 direction sides).

[0032] The head unit 3 is a head unit for mounting components. The head unit 3 is configured to mount components E on a substrate P fixed at a mounting stop position Pa. Specifically, the head unit 3 includes a plurality of (five) head portions 31. The head portions 31 are configured to pick up the components E and mount them on the substrate P. A suction nozzle 31a (see FIG. 5) for picking up the components E is removably attached to the tip of the head portion 31. The head portion 31 is configured to pick up the components E onto the suction nozzle 31a by using negative pressure supplied from a negative pressure supply portion (not shown).

[0033] The component mounting apparatus 100 is also provided with a nozzle storage unit 9. The nozzle storage unit 9 is configured to store suction nozzles 31a attached to the tip of the head unit 31. The nozzle storage unit 9 stores a plurality of nozzles according to the type of component E. This makes it possible to change the suction nozzles 31a attached to the tip of the head unit 31 depending on the type of component E.

[0034] 1 and 2, the head unit 3 includes a Z-axis motor 32 (see FIG. 2) that moves the suction nozzle 31a of the head unit 31 in the vertical direction (Z direction), and an R-axis motor 33 (see FIG. 2) that rotates the suction nozzle 31a of the head unit 31 about a rotation axis that extends in the vertical direction. The head unit 31 is configured to be movable in the vertical direction between a predetermined lowered position and a predetermined raised position by the Z-axis motor 32. In addition, the head unit 31 is configured to be rotated by the R-axis motor 33 while holding a component E, thereby adjusting the orientation of the component E that is being picked up.

[0035] The head horizontal movement mechanism 4 is configured to move the head unit 3 in horizontal directions (X and Y directions). The head horizontal movement mechanism 4 includes a support portion 41 that supports the head unit 3 movably in the substrate transport direction (X direction) and a rail portion 42 that supports the support portion 41 movably in a direction (Y direction) that is substantially perpendicular to the substrate transport direction in a horizontal plane. The support portion 41 has a ball screw shaft 41a extending in the substrate transport direction and an X-axis motor 41b that rotates the ball screw shaft 41a. The head unit 3 is provided with a ball nut (not shown) that engages with the ball screw shaft 41a of the support portion 41. The head unit 3 is configured to be movable in the substrate transport direction along the support portion 41 together with the ball nut that engages with the ball screw shaft 41a when the ball screw shaft 41a is rotated by the X-axis motor 41b.

[0036] The rail portion 42 has a pair of guide rails 42a that support both ends of the support portion 41 in the X direction so as to be movable in the Y direction, a ball screw shaft 42b extending in the Y direction, and a Y-axis motor 42c that rotates the ball screw shaft 42b. A ball nut (not shown) that engages with the ball screw shaft 42b of the rail portion 42 is provided on the support portion 41. The support portion 41 is configured to be movable in the Y direction along the pair of guide rails 42a of the rail portion 42 together with the ball nut that engages with the ball screw shaft 42b when the ball screw shaft 42b is rotated by the Y-axis motor 42c.

[0037] The head unit 3 is configured to be movable horizontally on the base 1 by the support parts 41 and rail parts 42 of the head horizontal movement mechanism part 4. This allows the head part 31 of the head unit 3 to move above the feeder 10 and pick up components E supplied from the feeder 10. The head part 31 of the head unit 3 can also move above the substrate P fixed at the mounting stop position Pa and mount the picked-up components E onto the substrate P.

[0038] The component imaging unit 5 is a camera for component recognition. The component imaging unit 5 images the component E picked up by the suction nozzle 31a of the head unit 31 while the head unit 31 of the head unit 3 is transporting the component E to the board P. The component imaging unit 5 is fixed on the upper surface of the base 1, and images the component E picked up by the suction nozzle 31a of the head unit 31 from below (the Z2 direction side) of the component E. Based on the image of the component E picked up by the component imaging unit 5, the control unit 7 acquires (recognizes) the state of the component E (its rotational attitude and position relative to the head unit 31). The component imaging unit 5 also images a jig component 11, which will be described later, from below.

[0039] 3, the component imaging unit 5 includes an illumination unit 51, an imaging element 52, a lens unit 53, and a light-transmitting unit 54. The illumination unit 51, the imaging element 52, and the lens unit 53 are disposed inside a housing unit 55. The light-transmitting unit 54 is provided in the housing unit 55 so as to cover an opening at the upper end of the housing unit 55.

[0040] The illumination unit 51 is configured to emit illumination light when capturing an image. The illumination unit 51 has an arrangement of multiple LEDs (Light Emitting Diodes). The imaging element 52 is configured to capture an image of light entering through the light-transmitting unit 54. The imaging element 52 is a solid-state imaging element. The lens unit 53 is disposed so that its optical axis O is approximately parallel to the vertical direction (Z direction). The lens unit 53 is configured to focus light on the imaging element 52a. The light-transmitting unit 54 is made of a light-transmitting material such as glass. The light-transmitting unit 54 is a highly transparent plate-shaped member. The light-transmitting unit 54 is configured to transmit illumination light from the illumination unit 51 and imaging light captured by the imaging element 52. The light-transmitting unit 54 also has the function of protecting the structures within the housing unit 55, such as the illumination unit 51, the imaging element 52, and the lens unit 53.

[0041] 1 and 2, the board imaging unit 6 is a camera for recognizing the board. Before the head section 31 of the head unit 3 starts mounting components E on the board P, the board imaging unit 6 captures an image of a position recognition mark F (fiducial mark) attached to the top surface of the board P, with the board P fixed at the mounting stop position Pa. The position recognition mark F is a mark for recognizing the position of the board P. Based on the image of the position recognition mark F captured by the board imaging unit 6, the control unit 7 acquires (recognizes) the accurate position and posture of the board P fixed at the mounting stop position Pa.

[0042] 2, the control unit 7 is a control circuit that controls the operation of the component mounting apparatus 100. The control unit 7 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The control unit 7 is configured to control the board transport unit 2, the feeder 10, the X-axis motor 41b, the Y-axis motor 42c, etc. in accordance with a production program, thereby controlling the head unit 3 to mount components E on the board P. The memory unit 8 is a non-volatile memory medium such as a hard disk drive, and is configured to be able to store information.

[0043] (Configuration of jig parts) In the component mounting apparatus 100, mounting errors (deviations from the theoretical mounting position) of the component E occur due to dimensional errors and driving errors of the mechanical components, and the mounting accuracy decreases due to the mounting errors that occur. Therefore, in order to ensure mounting accuracy, the component mounting apparatus 100 is configured to acquire a position correction amount (described later) before the production of the substrate P, and store the acquired amount in the storage unit 8. Furthermore, the component mounting apparatus 100 is configured to read the position correction amount from the storage unit 8 during the production of the substrate P and perform the position correction. For this reason, as shown in FIG. 4, the component mounting apparatus 100 is provided with a jig component 11 for acquiring the position correction amount.

[0044] The jig part 11 is provided separately from the part E. The jig part 11 includes a first characteristic portion 11a and a second characteristic portion 11b. The first characteristic portion 11a and the second characteristic portion 11b are marks. The first characteristic portion 11a and the second characteristic portion 11b are configured to be opaque to light. The first characteristic portion 11a and the second characteristic portion 11b are black. The jig part 11 also includes a main body portion 11c. The main body portion 11c is made of a light-transmitting material such as glass or resin. The main body portion 11c is a highly transparent member. The main body portion 11c has a columnar shape. Specifically, the main body portion 11c has a quadrangular columnar shape.

[0045] Furthermore, the main body 11c has a lower surface 11d on which the first characteristic portions 11a are provided, and an upper surface 11e on the opposite side of the lower surface 11d on which the second characteristic portions 11b are provided. Four first characteristic portions 11a are arranged on the lower surface 11d. Specifically, one first characteristic portion 11a is arranged at each of four positions (corners) of the lower surface 11d. One second characteristic portion 11b is arranged on the upper surface 11e. Specifically, one second characteristic portion 11b is arranged at the center of the upper surface 11e. The four first characteristic portions 11a and one second characteristic portion 11b are arranged so as not to overlap each other in the vertical direction.

[0046] (Getting position correction amount) Here, in the first embodiment, as shown in Figures 5 and 6, the control unit 7 is configured to obtain the amount of suction position deviation based on a first captured image 12 in which the first feature portion 11a is captured from below by the component imaging unit 5 in a first state in which the jig component 11 is suctioned by the head unit 31, and then obtain the amount of mounting position deviation based on a second captured image 13 in which the second feature portion 11b is captured from below by the component imaging unit 5 in a second state in which the head unit 31 is lowered from the first state, and then obtain the amount of position correction from the amount of suction position deviation and the amount of mounting position deviation.

[0047] Specifically, the control unit 7 is configured to control the head unit 31 so as to suck the upper surface 11e of the jig component 11. The control unit 7 is configured to control the head unit 31 so as to position the jig component 11 on the optical axis O (see FIG. 3) of the component imaging unit 5. The control unit 7 is configured to control the head unit 31 so as to position the lower surface 11d of the jig component 11 (i.e., the first feature portion 11a) at a height position H at which the component imaging unit 5 is focused.

[0048] The first state is a state in which the jig component 11 is sucked by the head unit 31, the jig component 11 is positioned on the optical axis O, and the first feature portion 11a of the jig component 11 is positioned at a height position H at which the component imaging unit 5 is focused. In this first state, the control unit 7 controls the component imaging unit 5 to capture an image of the first feature portion 11a from below while irradiating illumination light from the illumination unit 51 from below. The control unit 7 then acquires a first captured image 12 from the component imaging unit 5. The first captured image 12 shows the first feature portion 11a, which is clearer than the second feature portion 11b, and the second feature portion 11b, which is blurred. This is because the first feature portion 11a is positioned at a position at which the component imaging unit 5 is focused, while the second feature portion 11b is not positioned at a position at which the component imaging unit 5 is focused.

[0049] Furthermore, after acquiring the first captured image 12 in the first state, the control unit 7 controls the head unit 31 to descend along the optical axis O of the component imaging unit 5. That is, the control unit 7 performs a pseudo-mounting operation using the head unit 31 that has adsorbed the jig component 11. Furthermore, in the first embodiment, the control unit 7 controls the head unit 31 to descend and place the jig component 11 on the upper surface 5a of the component imaging unit 5. Note that the upper surface 5a of the component imaging unit 5 is the upper surface of the light-transmitting portion 54. Furthermore, after placing the jig component 11 on the upper surface 5a of the component imaging unit 5, the head unit 31 releases adsorption of the jig component 11 and ascends to retreat.

[0050] In the first embodiment, the second state is a state in which the head unit 31 is lowered from the first state and the jig component 11 is placed on the upper surface 5a of the component imaging unit 5. The second state is a state in which the upper surface 11e of the jig component 11 (i.e., the second feature portion 11b) is positioned at a height position H at which the component imaging unit 5 is focused. The main body portion 11c of the jig component 11 has a thickness that is approximately the same as the distance from the upper surface 5a of the component imaging unit 5 to the height position H. That is, the distance from the lower surface 11d to the upper surface 11e of the jig component 11 is approximately the same as the distance from the upper surface 5a of the component imaging unit 5 to the height position H. In this second state, the control unit 7 controls the component imaging unit 5 to capture an image of the second feature portion 11b from below while irradiating illumination light from the illumination unit 51 from below. The control unit 7 then acquires a second captured image 13 from the component imaging unit 5. The second captured image 13 shows the second feature portion 11b, which is clearer than the first feature portion 11a, and the blurred first feature portion 11a. This is because the second feature portion 11b is located at a position where the component imaging unit 5 focuses, while the first feature portion 11a is not located at a position where the component imaging unit 5 focuses.

[0051] Furthermore, in the first embodiment, the first characteristic portion 11a is arranged on the jig component 11 so as to appear blurred in the second captured image 13 and to appear more clearly than the second characteristic portion 11b in the first captured image 12. The second characteristic portion 11b is arranged on the jig component 11 so as to appear blurred in the first captured image 12 and to appear more clearly than the first characteristic portion 11a in the second captured image 13. The first characteristic portion 11a and the second characteristic portion 11b are arranged on the jig component 11 so as to be spaced apart from each other so that both the first characteristic portion 11a and the second characteristic portion 11b are not simultaneously positioned in the focus of the component imaging unit 5. Furthermore, the first characteristic portion 11a and the second characteristic portion 11b are arranged on the jig component 11 so as not to overlap each other in the first captured image 12 and the second captured image 13.

[0052] The control unit 7 also acquires the amount of suction position deviation based on the first characteristic portions 11a in the first captured image 12. Specifically, the control unit 7 recognizes the first characteristic portions 11a in the first captured image 12 through image recognition processing. The control unit 7 then acquires the center position of the jig component 11 based on the recognized first characteristic portions 11a. For example, the control unit 7 acquires the center position of a rectangular shape defined by the four first characteristic portions 11a as the center position of the jig component 11. The control unit 7 then acquires the amount of suction position deviation, which represents the amount of deviation of the center position of the jig component 11 from the center position of the suction nozzle 31a, based on the acquired center position of the jig component 11 and the known center position of the suction nozzle 31a. For example, if the center position of the suction nozzle 31a is (Xn:0, Yn:0) and the center position of the jig component 11 is (Xp1:+10, Yp1:0), the amount of suction position deviation is (X1:+10, Y1:0). The amount of deviation of the pickup position can be treated as the amount of deviation of the center position of the component E from the center position of the pickup nozzle 31a when the component E is picked up by the head unit 31.

[0053] The control unit 7 also acquires the amount of mounting position deviation based on the second feature portion 11b in the second captured image 13. Specifically, the control unit 7 recognizes the second feature portion 11b in the second captured image 13 through image recognition processing. The control unit 7 then acquires the center position of the jig component 11 based on the recognized second feature portion 11b. For example, the control unit 7 acquires the center position of the second feature portion 11b as the center position of the jig component 11. The control unit 7 then acquires the amount of mounting position deviation, which represents the amount of deviation of the center position of the jig component 11 from the center position of the mounting position, based on the acquired center position of the jig component 11 and the center position of a known mounting position. For example, if the center position of the mounting position is (Xm:0, Ym:0) and the center position of the jig component 11 is (Xp2:+20, Yp2:0), the amount of mounting position deviation is (X2:+20, Y2:0). The amount of deviation in the mounting position can be treated as the amount of deviation of the center position of the component E from the center position of the mounting position when the component E is mounted by the head unit 31.

[0054] The control unit 7 then acquires a position correction amount based on the acquired pickup position deviation amount and mounting position deviation amount. Specifically, the control unit 7 acquires a position correction amount that represents the deviation amount of the center position of the jig component 11 from the center position of the mounting position, not including the pickup position deviation amount, by subtracting (correcting) the pickup position deviation amount from the mounting position deviation amount. For example, if the pickup position deviation amount is (X1:+10, Y1:0) and the mounting position deviation amount is (X2:+20, Y2:0), the position correction amount is (X:+10, Y:0). Note that X = X2 - X1 and Y = Y2 - Y1. The position correction amount can be treated as a mounting error of the component E when the component E is mounted by the head unit 31.

[0055] Here, the first feature portion 11a and the second feature portion 11b of the jig component 11 are slightly misaligned from their ideal positions due to manufacturing errors such as printing misalignment, and each jig component has its own unique misalignment amount. In this case, if the position correction amount is calculated based on the pickup position deviation amount and the mounting position deviation amount without considering the unique misalignment amount, the accuracy of the position correction amount will be slightly reduced. Therefore, in the first embodiment, unique correction values ​​resulting from the manufacturing errors are set for the first feature portion 11a and the second feature portion 11b. Specifically, unique correction values ​​corresponding to the unique misalignment amounts of the first feature portion 11a and the second feature portion 11b resulting from the manufacturing errors are stored in the storage unit 8. The control unit 7 is configured to calculate the position correction amount based on the unique correction value of the first feature portion 11a, the unique correction value of the second feature portion 11b, the pickup position deviation amount, and the mounting position deviation amount.

[0056] Specifically, the control unit 7 corrects the pickup position deviation amount using the correction value specific to the first feature unit 11a, and corrects the mounting position deviation amount using the correction value specific to the second feature unit 11b.The control unit 7 then obtains the position correction amount based on the corrected pickup position deviation amount and the corrected mounting position deviation amount.The control unit 7 then stores the obtained position correction amount in the storage unit 8.

[0057] (Control processing related to imaging of jig parts) 7, a control process related to imaging of the jig component 11 by the component mounting apparatus 100 of the first embodiment will be described. This control process is performed when the component mounting apparatus 100 is installed, when the type of board P produced by the component mounting apparatus 100 is changed, when mounting accuracy deteriorates, etc. Each process in the flowchart is executed by the control unit 7.

[0058] As shown in FIG. 7, in step S1, the jig part 11 is sucked by the head part 31.

[0059] Then, in step S2, the jig part 11 is imaged in the first state by the part imaging unit 5. As a result, a first captured image 12 is acquired.

[0060] Then, in step S3, it is determined whether or not the first characteristic portion 11a in the first captured image 12 can be recognized. If it is determined that the first characteristic portion 11a in the first captured image 12 cannot be recognized, the process returns to step S2. Then, the jig component 11 is imaged again by the component imaging unit 5. If it is determined that the first characteristic portion 11a in the first captured image 12 can be recognized, the process proceeds to step S4.

[0061] Then, in step S4, the amount of deviation in the suction position is acquired based on the first captured image 12. The acquired amount of deviation in the suction position is stored in the storage unit 8.

[0062] Then, in step S5, a pseudo mounting operation is performed by the head portion 31 that has sucked the jig component 11.

[0063] Then, in step S6, the jig part 11 in the second state is imaged by the part imaging unit 5. As a result, a second captured image 13 is acquired.

[0064] Then, in step S7, it is determined whether or not the second characteristic portion 11b in the second captured image 13 can be recognized. If it is determined that the second characteristic portion 11b in the second captured image 13 cannot be recognized, the process returns to step S6. Then, the jig component 11 is imaged again by the component imaging unit 5. If it is determined that the second characteristic portion 11b in the second captured image 13 can be recognized, the process proceeds to step S8.

[0065] Then, in step S8, the amount of mounting position deviation is acquired based on the second captured image 13. The acquired amount of mounting position deviation is stored in the storage unit 8.

[0066] Then, in step S9, it is determined whether the pickup position deviation amount and the mounting position deviation amount have been acquired for all angles. Specifically, it is determined whether the pickup position deviation amount and the mounting position deviation amount have been acquired for four conditions: the rotation angle of the jig component 11 is 0 degrees, 90 degrees, 180 degrees, and 270 degrees. The rotation angle of the jig component 11 is changed to four rotation angles by rotating the pickup nozzle 31a while the jig component 11 is being picked up. If it is determined that the pickup position deviation amount and the mounting position deviation amount have not been acquired for all angles, the process returns to step S1. Then, the processes of steps S1 to S8 are performed again with the rotation angle of the pickup nozzle 31a changed. At this time, the processes of steps S1 to S8 are performed with the rotation angle changed at the position of the component imaging unit 5 without moving the head unit 31 from the position of the component imaging unit 5. This makes it possible to acquire the pickup position deviation amount and the mounting position deviation amount for each rotation angle in a relatively short time. If it is determined that the pickup position deviation amount and the mounting position deviation amount have been acquired for all angles, the process proceeds to step S10.

[0067] Then, in step S10, a position correction amount is acquired based on the pickup position deviation amount and the mounting position deviation amount. The acquired position correction amount is stored in the storage unit 8. That is, the position correction amount for each rotation angle is stored in the storage unit 8. The processing of steps S1 to S10 is performed for each head unit 31. As a result, the position correction amount for each head unit 31 is stored in the storage unit 8. Then, the control processing ends. The position correction amount stored in the storage unit 8 is used for position correction during production of the board P.

[0068] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0069] In the first embodiment, as described above, the controller 7 acquires the pickup position deviation amount based on the first captured image 12, in which the component imaging unit 5 captures the first characteristic portion 11a from below while the jig component 11 is being picked up by the head unit 31 in a first state. Then, the controller 7 acquires the mounting position deviation amount based on the second captured image 13, in which the component imaging unit 5 captures the second characteristic portion 11b from below while the head unit 31 is lowered from the first state. The controller 7 then acquires the position correction amount from the pickup position deviation amount and the mounting position deviation amount. This allows the position correction amount to be acquired simply by using the jig component 11 without using a jig board. This eliminates the need to prepare a jig board, thereby reducing the time and effort required for preparing the jig board. This facilitates position correction of mounting errors of the component E due to dimensional errors of the mechanical components, etc.

[0070] Furthermore, unlike when a jig board is used, there is no need to move the head unit 31 toward the jig board. As a result, the pickup position deviation amount and the mounting position deviation amount can be obtained with fewer operations than when a jig board is used. This reduces the time required to obtain the pickup position deviation amount and the mounting position deviation amount. Furthermore, since there is no need to move the head unit 31 toward the jig board, it is possible to eliminate the impact on the accuracy of position correction of disturbances such as thermal expansion that accompany the movement of the head unit 31.

[0071] Furthermore, since both the pickup position deviation amount and the mounting position deviation amount can be obtained using only one component imaging unit 5, it is possible to prevent the influence of machine differences between the two imaging units from being included in the position correction amount, unlike when the pickup position deviation amount and the mounting position deviation amount are obtained using two imaging units, the component imaging unit 5 and the board imaging unit 6. As a result, it is possible to eliminate the influence of machine differences between the imaging units on the accuracy of position correction.

[0072] Furthermore, in the first embodiment, as described above, the first characteristic portion 11a is arranged on the jig component 11 so as to appear blurred in the second captured image 13 and to appear more clearly in the first captured image 12 than the second characteristic portion 11b, and the second characteristic portion 11b is arranged on the jig component 11 so as to appear blurred in the first captured image 12 and to appear more clearly in the second captured image 13 than the first characteristic portion 11a. This makes it possible to easily recognize the first characteristic portion 11a in the first captured image 12, and therefore to easily obtain the amount of pickup positional deviation. Furthermore, since the second characteristic portion 11b can be easily recognized in the second captured image 13, the amount of mounting positional deviation can be easily obtained.

[0073] Furthermore, in the first embodiment, as described above, the first characteristic portion 11a and the second characteristic portion 11b are arranged on the jig part 11 so as not to overlap each other in the first captured image 12 and the second captured image 13. This makes it easier to recognize the first characteristic portion 11a in the first captured image 12 and the second characteristic portion 11b in the second captured image 13, compared to when the first characteristic portion 11a and the second characteristic portion 11b overlap each other in the first captured image 12 and the second captured image 13.

[0074] In the first embodiment, as described above, the first characteristic portion 11a and the second characteristic portion 11b are marks, which allows the first characteristic portion 11a and the second characteristic portion 11b to be provided with a relatively simple configuration.

[0075] Furthermore, in the first embodiment, as described above, the second state is a state in which the head unit 31 is lowered from the first state and the jig component 11 is placed on the upper surface 5a of the component imaging unit 5. This allows the second characteristic portion 11b of the jig component 11 to be imaged in a state in which the jig component 11 is placed and stabilized on the upper surface 5a of the component imaging unit 5, making it easy to image the second characteristic portion 11b.

[0076] Moreover, in the first embodiment, as described above, the jig part 11 further includes a columnar main body 11c made of a light-transmitting material, and the main body 11c has a lower surface 11d on which the first characteristic portion 11a is provided, and an upper surface 11e provided on the opposite side of the lower surface 11d and on which the second characteristic portion 11b is provided. As a result, because the main body 11c is made of a light-transmitting material, not only the first characteristic portion 11a provided on the lower surface 11d but also the second characteristic portion 11b provided on the upper surface 11e can be clearly imaged from below by the part imaging unit 5.

[0077] Furthermore, in the first embodiment, as described above, specific correction values ​​resulting from manufacturing errors are set for the first feature portion 11a and the second feature portion 11b, and the control unit 7 is configured to obtain the position correction amount based on the specific correction value for the first feature portion 11a, the specific correction value for the second feature portion 11b, the pickup position deviation amount, and the mounting position deviation amount. This makes it possible to obtain the position correction amount with higher accuracy by taking into account the specific correction values ​​resulting from manufacturing errors.

[0078] [Second embodiment] Next, a second embodiment will be described with reference to Figures 8 to 10. In this second embodiment, unlike the first embodiment in which the jig component is placed on the upper surface of the component imaging unit, an example in which the jig component is placed on the upper surface of the placement unit will be described. Note that the same components as those in the first embodiment will be given the same reference numerals, and their description will be omitted.

[0079] (Configuration of component mounting equipment) 8, a component mounting apparatus 200 according to a second embodiment of the present invention further includes a mounting unit 214 on which a jig component 211 can be placed and which is detachable from the component imaging unit 5. In the second embodiment, the component mounting apparatus 200 further includes a placement unit 215 for placing the jig component 211. In the second embodiment, the component mounting apparatus 200 includes a jig component 211 instead of the jig component 11 of the first embodiment, as shown in FIG.

[0080] As shown in FIG. 8 , the placing portion 214 is disposed above (on the Z1 direction side of) the light-transmitting portion 54 of the component imaging unit 5. The placing portion 214 is made of a light-transmitting material such as glass or resin. The placing portion 214 is a highly transmissive, transparent, plate-shaped member. The placing portion 214 is disposed so as to cover the light-transmitting portion 54. Specifically, the placing portion 214 is larger than the light-transmitting portion 54. The placing portion 214 is disposed so as to cover the entire surface of the light-transmitting portion 54 in a plan view. This prevents the edges of the placing portion 214 from appearing in an image captured by the component imaging unit 5. The placing portion 214 is removably attached to the housing 55 of the component imaging unit 5 by fastening members 214a such as bolts.

[0081] The arrangement section 215 is provided in the nozzle storage section 9 or the component imaging section 5 (in FIG. 8 , it is provided in the component imaging section 5). The arrangement section 215 in FIG. 8 is provided as part of the housing section 55 of the component imaging section 5. The arrangement section 215 in FIG. 8 is provided near the light transmitting section 54. The arrangement section 215 in FIG. 8 has a concave shape that is recessed from the top (Z1 direction side) toward the bottom (Z2 direction side). The arrangement section 215 in FIG. 8 is configured so that the jig component 211 is arranged inside the concave shape. Furthermore, when the arrangement section 215 is provided in the nozzle storage section 9, for example, one of the multiple nozzle storage recesses of the nozzle storage section 9 is provided as the arrangement section 215. In this case, it is possible to provide the arrangement section 215 by effectively utilizing an existing nozzle storage recess.

[0082] As shown in FIG. 9, the jig part 211 includes a main body 211c instead of the main body 11c of the first embodiment. The main body 211c is made of a light-transmitting material such as glass or resin. The main body 211c is a highly transmissive transparent member. The main body 211c has a cylindrical shape. Similar to the main body 11c of the first embodiment, the main body 211c has a first characteristic portion 11a on its lower surface 11d and a second characteristic portion 11b on its upper surface 11e.

[0083] Moreover, in the second embodiment, the jig part 211 further includes an anti-slip part 211f that prevents the jig part 211 from sliding when placed. The anti-slip part 211f is made of a high-friction material such as rubber. The anti-slip part 211f is made of an O-ring. The anti-slip part 211f is disposed at the lower end of the main body part 211c. The anti-slip part 211f is configured to prevent the jig part 211 from sliding by generating a frictional force between the jig part 211 and the placement surface when the jig part 211 is placed.

[0084] In the second embodiment, as shown in Fig. 10, after acquiring the first captured image 12 in the first state, the control unit 7 controls the head unit 31 to descend along the optical axis O of the component imaging unit 5. That is, the control unit 7 performs a pseudo-mounting operation with the head unit 31 that has adsorbed the jig component 11. Also, in the second embodiment, the control unit 7 controls the head unit 31 to descend and place the jig component 211 on the upper surface 214b of the placement unit 214. Also, after placing the jig component 11 on the upper surface 214b of the placement unit 214, the head unit 31 releases adsorption of the jig component 211 and rises to retreat.

[0085] In the second embodiment, the second state is a state in which the head unit 31 is lowered from the first state and the jig component 211 is placed on the upper surface 214b of the placement unit 214. The second state is a state in which the upper surface 11e of the jig component 211 (i.e., the second characteristic portion 11b) is located at a height position H at which the component imaging unit 5 is focused. The main body 211c of the jig component 211 has a thickness that is approximately the same as the distance from the upper surface 214b of the placement unit 214 to the height position H. In other words, the distance from the lower surface 11d to the upper surface 11e of the jig component 211 is approximately the same as the distance from the upper surface 214b of the placement unit 214 to the height position H. In this second state, the control unit 7 controls the component imaging unit 5 to image the second characteristic portion 11b from below while irradiating the second characteristic portion 11b from the illumination unit 51 from below.

[0086] The other configurations of the second embodiment are the same as those of the first embodiment.

[0087] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0088] In the second embodiment, as described above, the component mounting apparatus 200 further includes the placement unit 214 on which the jig component 211 can be placed and which is detachable from the component imaging unit 5. The second state is a state in which the head unit 31 is lowered from the first state to place the jig component 211 on the upper surface 214b of the placement unit 214. This prevents the jig component 211 from coming into contact with the upper surface 5a of the component imaging unit 5, unlike when the jig component 211 is placed on the upper surface 5a of the component imaging unit 5. This prevents the upper surface 5a of the component imaging unit 5 from being scratched due to contact between the jig component 211 and the upper surface 5a of the component imaging unit 5. As a result, even if the upper surface 5a of the component imaging unit 5 is scratched, the scratch on the upper surface 5a of the component imaging unit 5 can be prevented from adversely affecting imaging. Furthermore, because the placing portion 214 is detachable from the component imaging unit 5, even if the upper surface 214b of the placing portion 214 is scratched due to contact between the jig component 211 and the upper surface 214b of the placing portion 214, the scratched placing portion 214 can be replaced with an unscratched placing portion 214. As a result, even if the upper surface 214b of the placing portion 214 is scratched, it is possible to prevent the scratch on the upper surface 214b of the placing portion 214 from adversely affecting imaging.

[0089] Furthermore, in the second embodiment, as described above, the jig part 211 further includes the anti-slip part 211f that prevents the jig part 211 from sliding when placed. This makes it possible to prevent the jig part 211 from sliding when placed by the anti-slip part 211f, thereby making it possible to avoid the first characteristic part 11a and the second characteristic part 11b from being inaccurately imaged due to the jig part 211 sliding.

[0090] Moreover, in the second embodiment, as described above, the component mounting apparatus 200 further includes the placement unit 215 for placing the jig component 211, and the placement unit 215 is provided in the nozzle storage unit 9 for storing the suction nozzle 31a attached to the head unit 31, or in the component imaging unit 5. This allows the jig component 211 to be easily taken out from the placement unit 215 provided in the nozzle storage unit 9 or the component imaging unit 5, so that position correction using the jig component 211 can be easily performed even during spare time in production setup.

[0091] The other effects of the second embodiment are the same as those of the first embodiment.

[0092] [Third embodiment] Next, a third embodiment will be described with reference to Figures 11 and 12. Unlike the first embodiment in which the jig component is placed on the upper surface of the component imaging unit and the second embodiment in which the jig component is placed on the upper surface of the placement unit, this third embodiment describes an example in which the jig component is placed near the upper surface of the component imaging unit but in a non-contact state with the upper surface of the component imaging unit. Note that the same components as those in the first or second embodiment are denoted by the same reference numerals, and their description will be omitted.

[0093] (Configuration of component mounting equipment) As shown in FIG. 11, a component mounting apparatus 300 according to the third embodiment of the present invention includes a jig component 311 in place of the jig component 11 of the first embodiment.

[0094] The jig part 311 includes a main body 311c instead of the main body 11c of the first embodiment. The main body 311c is made of a light-transmitting material such as glass or resin. The main body 211c is a highly transmissive transparent member. The main body 211c has a cylindrical shape. Similar to the main body 11c of the first embodiment, the main body 211c has a first characteristic portion 11a on the bottom surface 11d and a second characteristic portion 11b on the top surface 11e.

[0095] In the third embodiment, the jig part 311 further includes a reflection prevention portion 311g for preventing the head part 31 from being reflected in the second captured image 13. The reflection prevention portion 311g is disposed on the upper surface 11e. The reflection prevention portion 311g is disposed on the upper surface 11e so as to cover substantially the entire upper surface 11e. The surface of the reflection prevention portion 311g on the upper surface 11e side (the Z2 direction side) is configured to reflect light. The reflection prevention portion 311g is, for example, a silver sticker. The surface of the reflection prevention portion 311g on the Z1 direction side is configured to be adsorbed by the head part 31. The reflection prevention portion 311g is configured to prevent the head part 31, which has adsorbed its surface on the Z1 direction side, from being reflected in the second captured image 13 by reflecting illumination light from the component imaging unit 5 with the surface on the Z2 direction side.

[0096] In the third embodiment, as shown in FIG. 12 , after acquiring the first captured image 12 in the first state, the control unit 7 controls the head unit 31 to descend along the optical axis O of the component imaging unit 5. That is, the control unit 7 performs a pseudo-mounting operation using the head unit 31 that has adsorbed the jig component 11. Also, in the third embodiment, the control unit 7 controls the head unit 31 to descend and place the jig component 311 near the upper surface 5a of the component imaging unit 5 in a non-contact state with the upper surface 5a of the component imaging unit 5. Note that the head unit 31 is in a state in which it has adsorbed the jig component 311. Also, the lower surface 11d of the jig component 311 and the upper surface 5a of the component imaging unit 5 are spaced apart by a small distance and are arranged in a non-contact state.

[0097] The second state is a state in which the head unit 31 is lowered from the first state, and the jig component 311 sucked by the head unit 31 is positioned near the upper surface 5a of the component imaging unit 5. The second state is also a state in which the upper surface 11e of the jig component 311 (i.e., the second characteristic portion 11b) is positioned at a height position H at which the component imaging unit 5 is focused. The main body portion 311c of the jig component 311 has a thickness that is approximately the same as the distance from the upper surface 5a of the component imaging unit 5 to the height position H. In other words, the distance from the lower surface 11d to the upper surface 11e of the jig component 311 is approximately the same as the distance from the upper surface 5a of the component imaging unit 5 to the height position H. In this second state, the control unit 7 controls the component imaging unit 5 to capture an image of the second characteristic portion 11b from below while irradiating illumination light from the illumination unit 51 from below.

[0098] The other configurations of the third embodiment are the same as those of the first or second embodiment.

[0099] (Effects of the third embodiment) In the third embodiment, the following effects can be obtained.

[0100] As described above, in the third embodiment, the second state is a state in which the head unit 31 is lowered from the first state and the jig component 311 sucked by the head unit 31 is positioned near the upper surface 5a of the component imaging unit 5. This prevents the jig component 311 from coming into contact with the upper surface 5a of the component imaging unit 5, unlike when the jig component 311 is placed on the upper surface 5a of the component imaging unit 5, thereby preventing scratches on the upper surface 5a of the component imaging unit 5 due to contact between the jig component 311 and the upper surface 5a of the component imaging unit 5. As a result, even if scratches are made on the upper surface 5a of the component imaging unit 5, it is possible to prevent the scratches on the upper surface 5a of the component imaging unit 5 from adversely affecting imaging.

[0101] Furthermore, in the third embodiment, as described above, the jig component 311 further includes a reflection prevention portion 311g for preventing the head portion 31 from appearing in the second captured image 13. As a result, even when capturing an image of the second characteristic portion of the jig component 311 in a state where it is held by the head portion 31, the reflection prevention portion 311g can prevent the head portion 31 from appearing in the second captured image 13, thereby making it possible to avoid a situation where the amount of mounting position deviation cannot be accurately obtained due to the head portion 31 appearing in the second captured image 13.

[0102] The other effects of the third embodiment are the same as those of the first or second embodiment.

[0103] [Fourth embodiment] Next, a fourth embodiment will be described with reference to Figures 13 to 15. In this fourth embodiment, an example will be described in which jig parts with a relatively small thickness are used, unlike the first to third embodiments in which jig parts with a relatively large thickness are used. Note that the same components as those in the first, second, or third embodiment will be assigned the same reference numerals, and their description will be omitted.

[0104] (Configuration of component mounting equipment) As shown in FIGS. 13 and 14, a component mounting apparatus 400 according to the fourth embodiment of the present invention includes a jig component 411 in place of the jig component 11 of the first embodiment.

[0105] The jig part 411 includes a first characteristic portion 411a and a second characteristic portion 411b. The first characteristic portion 411a and the second characteristic portion 411b are marks. The first characteristic portion 411a and the second characteristic portion 411b are configured to be opaque to light. The first characteristic portion 411a and the second characteristic portion 411b are black. The jig part 411 also includes a main body portion 411c. The main body portion 411c has a thin rectangular prism shape.

[0106] The main body 411c has a bottom surface 411d on which the first feature portion 411a is provided and side surfaces 411e on which the second feature portion 411b is provided. One first feature portion 411a is disposed on the bottom surface 411d. Specifically, one first feature portion 411a is disposed at the center of the bottom surface 411d. Four second feature portions 411b are disposed on the side surfaces 411e. Specifically, one second feature portion 411b is disposed at the center of each of the four side surfaces 411e. The first feature portion 411a and the second feature portion 411b are disposed so as not to overlap each other in the first captured image 12 and the second captured image 13. The main body 411c has a thickness smaller than the distance from the top surface 5a of the component imaging unit 5 to the height position H. The jig part 411 further includes a reflection prevention part 411g for preventing the head part 31 from being reflected in the second captured image 13. Note that the configuration of the reflection prevention part 411g is similar to that of the reflection prevention part 311g in the third embodiment, and therefore detailed description thereof will be omitted.

[0107] In the fourth embodiment, the jig part 411 further includes a mirror part 411h for positioning the second feature part 411b at a position where the component imaging part 5 is in focus. The mirror part 411h is configured to reflect (bend) illumination light from below (the Z2 direction side) by the component imaging part 5 toward the side (towards the side surface 411e and the second feature part 411b). The mirror part 411h is configured to extend the optical path length from the component imaging part 5 to the second feature part 411b by reflection, thereby positioning the second feature part 411b at a position where the component imaging part 5 is in focus. In FIG. 14, the illumination light is schematically indicated by an outlined arrow.

[0108] Furthermore, a space 411i is provided between the side surface 411e and the mirror portion 411h. Illumination light from the component imaging unit 5 travels through the space 411i toward the second feature portion 411b. Note that a light-transmitting portion made of a material that transmits light may be provided instead of the space 411i.

[0109] 12, the imaging of the first characteristic portion 411a is the same as in the first embodiment. That is, the control unit 7 controls the head unit 31 so that the lower surface 411d of the jig part 411 (i.e., the first characteristic portion 411a) is positioned at a height position H at which the component imaging unit 5 is focused. Then, the control unit 7 controls the component imaging unit 5 so that the first characteristic portion 411a is imaged from below while the illumination unit 51 irradiates illumination light from below in the first state.

[0110] Furthermore, after acquiring the first captured image 12 in the first state, the control unit 7 controls the head unit 31 to descend along the optical axis O of the component imaging unit 5. That is, the control unit 7 performs a pseudo-mounting operation using the head unit 31 that has adsorbed the jig component 11. Furthermore, in the fourth embodiment, the control unit 7 controls the head unit 31 to descend and place the jig component 411 near the upper surface 5a of the component imaging unit 5 in a non-contact state with the upper surface 5a of the component imaging unit 5. Note that the head unit 31 is in a state in which it has adsorbed the jig component 311. Furthermore, the lower surface 411d of the jig component 411 and the upper surface 5a of the component imaging unit 5 are spaced apart by a small distance and are arranged in a non-contact state.

[0111] The second state is a state in which the head unit 31 is lowered from the first state, and the jig component 411 sucked by the head unit 31 is positioned near the upper surface 5a of the component imaging unit 5. The second state is also a state in which the side surface 411e of the jig component 411 (i.e., the second feature portion 411b) is positioned at a position where the component imaging unit 5 focuses on the side surface 411e (i.e., the second feature portion 411b) due to the action of the mirror unit 411h. In this second state, the control unit 7 controls the component imaging unit 5 so that the illumination unit 51 irradiates illumination light from below while imaging the second feature portion 11b from below.

[0112] The other configurations of the fourth embodiment are the same as those of the first, second or third embodiment.

[0113] (Effects of the fourth embodiment) In the fourth embodiment, the following effects can be obtained.

[0114] In the fourth embodiment, as described above, the jig component 411 further includes a mirror portion 411h for positioning the second feature portion 411b at a position where the component imaging unit 5 focuses. This allows the second feature portion 411b to be positioned at a position where the component imaging unit 5 focuses, even when the thickness of the jig component 411 is reduced. Furthermore, when the thickness of the jig component 411 is reduced, the height position of the head portion 31 when imaging the second feature portion 411b can be made closer to the height position of the head portion 31 when the actual component E is mounted, making it possible to obtain the amount of mounting position deviation with higher accuracy.

[0115] The other effects of the fourth embodiment are the same as those of the first, second or third embodiment.

[0116] [Variations] The present invention is not limited to the above embodiments, but is illustrated by the claims, and includes all modifications within the scope of the claims.

[0117] For example, in the present invention, among the configurations described in the first to fourth embodiments, configurations that are applicable to each other may be combined. For example, the jig component arrangement portion of the second embodiment may be combined with the configurations of the first, third, and fourth embodiments. Also, for example, the slip prevention portion of the second embodiment may be combined with the configuration of the first embodiment.

[0118] In the first to fourth embodiments, the first and second characteristic portions are marks, but the present invention is not limited to this. For example, the first and second characteristic portions may be characteristically shaped portions of the jig part, such as corners or sides. Furthermore, one of the first and second characteristic portions may be a mark, and the other may be a characteristically shaped portion.

[0119] In addition, although the first to third embodiments each show an example in which four first characteristic portions and one second characteristic portion are provided, and the fourth embodiment shows an example in which one first characteristic portion and four second characteristic portions are provided, the present invention is not limited to this. For example, as long as the center position of the jig part can be acquired, the number, shape, and arrangement of the first characteristic portions and second characteristic portions are not particularly limited.

[0120] Furthermore, in the first to third embodiments, an example was described in which light was transmitted through the interior of the main body of the jig part to capture an image of the second feature portion. However, the present invention is not limited to this. For example, in a first modified example shown in FIG. 16, a jig part 511 includes a main body 511c having a concave shape that is recessed from the bottom (Z2 direction side) toward the top (Z1 direction side). The main body 511c has a cylindrical shape with a bottom. The main body 511c also has a first surface 511d as a bottom end surface of the concave shape on which the first feature portion 511a is provided, and a second surface 511e as a bottom surface of the concave shape on which the second feature portion 511b is provided. This allows the second feature portion 511b to be captured through the space 511i. This prevents polarization and bending, unlike when capturing an image of the second feature portion 511b by transmitting light through the main body (as in the first to third embodiments). This prevents the second feature portion 511b from being captured accurately due to polarization and bending. In the first modified example, the main body 511c may or may not be a highly transmissive transparent material.

[0121] Furthermore, in the fourth embodiment, an example was described in which the jig part included a mirror part for positioning the second feature part at a position where the component imaging unit 5 focuses. However, the present invention is not limited to this. For example, in a second modified example shown in FIG. 17 , a jig part 611 includes a projection part 611j for positioning the second feature part 611b at a position where the component imaging unit 5 focuses. The projection part 611j has a transparent member 611k, a lens part 611l, and an illumination part 611m. The transparent member 611k is provided with a first feature part 611a. The lens part 611l is provided for projecting the first feature part 611a as the second feature part 611b. The illumination part 611m is configured to irradiate the first feature part 611a with light. The projection unit 611j is configured to project the second feature portion 611b as a virtual image of the first feature portion 611a at a predetermined position spaced apart from the jig part 611 by irradiating light from the illumination unit 611m onto the first feature portion 611a of the transparent member 611k and causing the light to pass through the lens unit 611l. The projection unit 611j is configured to position the second feature portion 611b at a position where the component imaging unit 5 focuses by extending the optical path length from the component imaging unit 5 to the second feature portion 611b through projection.

[0122] Furthermore, in the first embodiment, for convenience of explanation, the processing operation of the control unit is described using a flow-driven flowchart in which processing is performed in order according to a processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven. [Explanation of symbols]

[0123] 5. Parts imaging unit (imaging unit) 5a Top surface (top surface of imaging unit) 7 Control Unit 9 Nozzle storage area 11, 211, 311, 411, 511, 611 Jig parts 11a, 411a, 511a, 611a First characteristic part 11b, 411b, 511b, 611b Second characteristic part 11c, 211c, 311c, 411c, 511c Main body 11d Top surface 11e Bottom side 12 First captured image 13 Second captured image 31 Mounting head 31a Suction nozzle 100, 200, 300, 400 component mounting equipment 211f Anti-slip part 214 Placement section 214b upper surface (upper surface of the mounting portion) 215 Placement section 311g, 411g Anti-reflection section 411h Mirror section 511d 1st page 511e 2nd page 611j Projection section E parts P board

Claims

1. A head unit that picks up components and mounts them on the board; a jig component for position correction, the jig component including a first characteristic portion and a second characteristic portion, the jig component being provided separately from the component; an imaging unit that images the first characteristic portion and the second characteristic portion from below; a control unit that acquires a suction position deviation amount based on a first captured image of the first characteristic portion taken from below by the imaging unit in a first state in which the jig component is suctioned by the head unit, and then acquires a mounting position deviation amount based on a second captured image of the second characteristic portion taken from below by the imaging unit in a second state in which the head unit is lowered from the first state, and then acquires a position correction amount from the suction position deviation amount and the mounting position deviation amount.

2. the first characteristic portion is arranged on the jig part so as to appear blurred in the second captured image and to appear more clearly in the first captured image than the second characteristic portion; 2. The component mounting device according to claim 1, wherein the second feature portion is positioned on the jig component so as to appear blurred in the first captured image and to appear more clearly in the second captured image than the first feature portion.

3. The component mounting device according to claim 1 , wherein the first feature portion and the second feature portion are arranged on the jig component so as not to overlap each other in the first captured image and the second captured image.

4. The component mounting device according to claim 1 , wherein the first characteristic portion and the second characteristic portion are marks.

5. 2. The component mounting device according to claim 1, wherein the second state is a state in which the head unit is lowered from the first state and the jig component adsorbed to the head unit is positioned near an upper surface of the imaging unit.

6. The component mounting device according to claim 5 , wherein the jig component further includes a reflection prevention portion for preventing the head portion from being reflected in the second captured image.

7. 2. The component mounting device according to claim 1, wherein the second state is a state in which the head unit is lowered from the first state and the jig component is placed on an upper surface of the imaging unit.

8. a mounting portion on which the jig part can be mounted and which is detachable from the imaging portion, 2. The component mounting device according to claim 1, wherein the second state is a state in which the head unit is lowered from the first state and the jig component is placed on an upper surface of the placement unit.

9. the jig part further includes a columnar main body made of a light-transmitting material; The component mounting device according to claim 1 , wherein the main body has a lower surface on which the first feature portion is provided, and an upper surface provided on the opposite side of the lower surface and on which the second feature portion is provided.

10. The jig part further includes a main body portion having a concave shape recessed from below toward above, 2. The component mounting device according to claim 1, wherein the main body portion has a first surface serving as a lower end surface of the concave shape on which the first feature portion is provided, and a second surface serving as a bottom surface of the concave shape on which the second feature portion is provided.

11. The component mounting device according to claim 1 , wherein the jig component further includes an anti-slip portion that prevents the jig component from sliding when placed on the jig component.

12. The component mounting device according to claim 1 , wherein the jig component further includes a mirror unit or a projection unit for positioning the second feature portion at a position where the imaging unit is in focus.

13. a specific correction value resulting from a manufacturing error is set for the first characteristic portion and the second characteristic portion; 2. The component mounting device according to claim 1, wherein the control unit is configured to acquire the position correction amount based on the inherent correction value of the first feature portion, the inherent correction value of the second feature portion, the pickup position deviation amount, and the mounting position deviation amount.

14. Further, a placement unit for placing the jig part is provided, 2. The component mounting apparatus according to claim 1, wherein the placement unit is provided in a nozzle storage unit for storing a suction nozzle attached to the head unit, or in the imaging unit.

15. A position correction method for a component mounting device having a head unit that picks up components and mounts them on a substrate, comprising: a step of suctioning, by the head portion, a jig component for position correction, the jig component including a first characteristic portion and a second characteristic portion, the jig component being provided separately from the component; acquiring a suction position deviation amount based on a first captured image obtained by capturing an image of the first characteristic portion from below in a first state in which the jig part is suctioned by the head portion; after acquiring the pickup position deviation amount, acquiring a mounting position deviation amount based on a second captured image obtained by capturing an image of the second feature portion from below in a second state in which the head unit is lowered from the first state; and after acquiring the mounting position deviation amount, acquiring a position correction amount from the pickup position deviation amount and the mounting position deviation amount.

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