Component mounting system, method for determining picking and mounting order, and management device

Abstract

This component mounting system comprises a component mounting device that comprises a first head and a second head which face each other, and that performs control so that after a collection process has been executed, a cycle for executing an installation process is repeated alternately with the first head and the second head, and while one of the first head and the second head is executing the installation process, the installation process to be performed by the other head is made to wait. In this system, if the installation process of the first head is made to wait while the installation process of the second head is being executed, the component collection order and installation order to be carried out by the first head are determined so as to shorten or eliminate the waiting time of the first head.

Description

[Technical Field]

[0001] This specification discloses a component mounting system, a method for determining a picking and mounting order, and a management device. [Background technology]

[0002] A conventional component mounter includes a first component transfer device including a first placement head and a second component transfer device including a second placement head disposed opposite the first placement head across a circuit board. The component mounter alternately executes a pick-and-place (PP) cycle transfer process using the first placement head and a PP cycle transfer process using the second placement head to prevent interference between the first and second placement heads (see, for example, Patent Document 1). In this component mounter, an exclusive area is set within the first placement head's range of motion, where the first placement head is permitted to move but the second placement head is prohibited to move. This exclusive area prevents interference between the first and second placement heads. The exclusive area includes a narrow exclusive area that prioritizes the movement of the second placement head and a wide exclusive area that prioritizes the movement of the first placement head. The exclusive area is set according to a priority condition. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-64019 Summary of the Invention [Problem to be solved by the invention]

[0004] In the component mounting machine described above, when multiple mounting heads are used to mount components on a common circuit board, if the movement of one mounting head is given priority, the time required for the transfer process by that mounting head can be shortened, but waiting time will be required for the transfer process by the other mounting head, which may result in an increase in overall throughput.

[0005] A primary object of the present disclosure is to reduce unnecessary waiting time and shorten throughput when components are placed on a board by first and second heads facing each other. [Means for solving the problem]

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] A component mounting system according to the present disclosure is a component mounting system that mounts components, and includes a first head having a plurality of nozzles capable of picking up components, a second head that is disposed opposite the first head and has a plurality of nozzles capable of picking up components, a first head moving device that moves the first head, a second head moving device that moves the second head independently of the first head, a first component supply unit that supplies components to the first head, a second component supply unit that supplies components to the second head, and a component mounting process that performs a picking process to pick up components from the corresponding component supply unit and then mounts the picked components on a board. a control unit that controls the first and second heads and the first and second head moving devices so that the first head and the second head alternately repeat a cycle of the above-mentioned mounting process, and while one of the first and second heads is performing the mounting process, the other head waits until the mounting process by the first head is completed; and a determination unit that, when the mounting process by the first head must wait while the mounting process by the second head is being performed, determines the order in which the first head will pick up and place components so that the waiting time of the first head is shortened or reduced.

[0008] The component mounting system disclosed herein includes first and second heads facing each other, and alternates between performing a picking process and then a placement process, with the first and second heads being controlled so that while one of the first and second heads is performing a placement process, the other head waits for the placement process. In this component mounting system, if the first head must wait for the placement process while the second head is performing the placement process, the component picking order and placement order by the first head are determined so as to shorten or eliminate the wait time of the first head. This reduces unnecessary wait time and improves throughput when components are placed on a board by the first and second heads facing each other. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic configuration diagram of a component mounting system. [Figure 2] FIG. 2 is a schematic diagram of a head. [Figure 3] 2 is a block diagram showing an electrical connection relationship between a component mounter and a management device provided in the component mounting system. FIG. [Figure 4] 10 is a flowchart illustrating an example of a production schedule creation process. [Figure 5] FIG. 2 is an explanatory diagram showing an example of each PP cycle of SIDE1 and SIDE2. [Figure 6] FIG. 10 is an explanatory diagram showing how the PP cycle is executed in a conventional pickup order and mounting order. [Figure 7] FIG. 10 is an explanatory diagram showing how a PP cycle is performed in the pickup order and mounting order of the present disclosure. [Figure 8] FIG. 10 is a schematic configuration diagram of a component mounting system according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Fig. 1 is a schematic diagram of a component mounting system. Fig. 2 is a schematic diagram of a head. Fig. 3 is a block diagram showing the electrical connection relationship between a component mounter and a management device provided in the component mounting system. In Fig. 1, the left-right direction is the X-axis direction, and the front-back direction is the Y-axis direction.

[0011] 1, a component mounting system 1 of this embodiment includes a component mounter 10 that mounts components P on a board S, and a management device 100 that manages the entire system including the component mounter 10. In this embodiment, a plurality of component mounters 10 are arranged in the board transport direction to form a mounting line.

[0012] 1, the component mounter 10 includes first and second feeders 11a and 11b, a substrate transport device 12, first and second heads 20a and 20b, first and second head moving devices 30a and 30b, and a control device 40 (see FIG. 3). In addition to these, the component mounter 10 also includes first and second part cameras 41a and 41b, first and second nozzle stockers 42a and 42b, and the like.

[0013] The first feeder 11a is detachably mounted on a feeder table (not shown) provided at the front of the component mounter 10. The second feeder 11b is detachably mounted on a feeder table (not shown) provided at the rear of the component mounter 10. The first and second feeders 11a and 11b are, for example, tape feeders that are equipped with reels around which tape containing a plurality of components P is wound, and supply the components P by pulling out the tape from the reels and feeding the tape by a predetermined amount.

[0014] The substrate transport device 12 is configured as a belt conveyor device that has a pair of conveyor belts that extend parallel to the left and right with a gap between them in the front and back, and that transports substrates on the conveyor belts from left to right by driving the conveyor belts in a circular motion.

[0015] 2, the first and second heads 20a, 20b each include a head main body 21 having a plurality of holders 22 arranged in the circumferential direction, an R-axis actuator 23 that rotates the head main body 21 (revolves the holders 22), a θ-axis actuator 24 that rotates (spins) the holders 22, and a Z-axis actuator 25 that raises and lowers the holders 22. A suction nozzle 26 is detachably attached to the tip of the holder 22. Negative pressure is introduced from a negative pressure source (not shown) through the holders 22, and the suction nozzle 26 sucks and holds the component P by the negative pressure.

[0016] The first head moving device 30a moves the first head 20a back and forth and left and right, and the second head moving device 30b moves the second head 20b back and forth and left and right independently of the first head 20a. As shown in FIG. 1, the first and second head moving devices 30a and 30b each include a Y-axis slider 33 extending left and right, a Y-axis actuator 34 (see FIG. 3) that moves the Y-axis slider 33 back and forth, an X-axis slider 31 supported so as to be movable left and right relative to the Y-axis slider 33, and an X-axis actuator 32 (see FIG. 3) that moves the X-axis slider 31 left and right. The first head 20a is attached to the X-axis slider 31 of the first head moving device 30a and is moved back and forth and left and right together with the X-axis slider 31 by the first head moving device 30a. The second head 20b is attached to an X-axis slider 31 of a second head moving device 30b, and is moved together with the X-axis slider 31 by the second head moving device 30b back and forth and left and right independently of the first head 20a.

[0017] The first part camera 41a is installed between the first feeder 11a and the board transport device 12, and captures images of the components P picked up by the first head 20a from below and sends the images to the control device 50. The control device 50 processes the captured images to recognize any pickup errors or pickup deviations of the components P picked up by the first head 20a. The second part camera 41b is installed between the second feeder 11b and the board transport device 12, and captures images of the components P picked up by the second head 20b from below and sends the images to the control device 50. The control device 50 processes the captured images to recognize any pickup errors or pickup deviations of the components P picked up by the second head 20b.

[0018] As shown in Fig. 1, the first nozzle stocker 42a is installed between the first feeder 11a and the substrate transport device 12 and stores a plurality of replacement suction nozzles 26. The suction nozzles 26 attached to the holders 22 of the first head 20a are automatically replaced in the first nozzle stocker 42a as needed. The second nozzle stocker 42b is installed between the first feeder 11a and the substrate transport device 12 and stores a plurality of replacement suction nozzles 26. The suction nozzles 26 attached to the holders 22 of the second head 20b are automatically replaced in the second nozzle stocker 42b as needed.

[0019] 3, the control device 50 includes a CPU 51, a ROM 52, a RAM 53, a storage device 54, and an input / output interface 55. These are electrically connected via a bus 56. Detection signals from an X-axis position sensor that detects the position of the X-axis slider 31, a Y-axis position sensor that detects the position of the Y-axis slider 33, a Z-axis position sensor that detects the elevation position of the holder 22 (suction nozzle 26), and the like are input to the control device 50 via the input / output interface 55. Image signals from the first and second part cameras 41a, 41b, and the like are also input to the control device 50 via the input / output interface 55. Meanwhile, various control signals are output from the control device 50 to the first and second feeders 11a, 11b, the substrate transport device 12, the R-axis actuator 23, the θ-axis actuator 24, the Z-axis actuator 25, the X-axis actuator 32, the Y-axis actuator 34, the first and second part cameras 41a, 41b, and the like. The control device 50 is communicably connected to the management device 100, receives production instructions from the management device 100, and produces products in which components P are mounted on the board S in accordance with the received instructions.

[0020] In the component mounting machine 10 of this embodiment, product production is carried out by alternately repeating a pick-and-place cycle (hereinafter referred to as the PP cycle) between the first head 20a and the second head 20b, in which a board S is carried into the machine by the board transport device 20, a suction process (pick process) is performed to suction the components to be mounted, the components that have been picked up are moved above the board S, and a mounting process (place process) is performed to mount them on the board S.

[0021] One PP cycle of the first head 20a (SIDE1) is executed as follows. That is, the CPU 51 first moves the first head 20a above the first feeder 11a that supplies the components to be mounted using the first head moving device 30a, and then uses the Z-axis actuator 25 of the first head 20a to lower the suction nozzles 26 to pick up the components to be mounted. The components to be mounted are picked up by the multiple suction nozzles 26 of the first head 20a picking up a planned number of components to be mounted in a planned pickup order. If the planned number of components to be mounted include multiple components of the same type, the CPU 51 has one suction nozzle 26 pick up the components to be mounted, then rotates the head main body 21 using the R-axis actuator 23 (revolving the multiple suction nozzles 26), and then lowers the next suction nozzle 26 using the Z-axis actuator 25 to pick up consecutive components to be mounted of the same type. Furthermore, if the planned number of target components includes multiple components of different types, the CPU 51 moves the first head 20a above the first feeder 11a that supplies the next target components, and then uses the Z-axis actuator 25 of the first head 20a to lower the suction nozzles 26 to pick up the different types of target components. After the planned number of target components has been picked up by each suction nozzle 26 of the first head 20a, the CPU 51 uses the first head moving device 30a to move the first head 20a above the first part camera 41a. Next, the CPU 51 uses the first part camera 41a to capture an image of the target components picked up by the suction nozzles 26 and processes the captured image to measure the suction misalignment of the target components. The measured suction misalignment is used to adjust the mounting position of the target components when they are mounted on the board S. Then, CPU 51 causes first head moving device 30a to move first head 20a so that the component to be mounted is located above the adjusted mounting position on board S, and causes Z-axis actuator 25 of first head 20a to lower suction nozzle 26, thereby mounting the component to be mounted. Mounting of the component to be mounted is performed by mounting the multiple components to be mounted that have been picked up by the multiple suction nozzles 26 of first head 20a in the scheduled mounting order.

[0022] One PP cycle of the second head 20b (SIDE2 side) is executed as follows. That is, the CPU 51 first moves the second head 20b above the second feeder 11b that supplies the components to be mounted using the second head moving device 30b, and then uses the Z-axis actuator 25 of the second head 20b to lower the suction nozzles 26, thereby picking up the components to be mounted. The second head 20b picks up the components to be mounted by using the multiple suction nozzles 26 of the second head 20b to pick up a planned number of components to be mounted in a planned pickup order, similar to the pickup of the components to be mounted by the first head 20a. Furthermore, when the planned number of components to be mounted includes multiple components of the same type or multiple components of different types, the pickup operation of the second head 20b is similar to the pickup operation of the first head 20a. After the planned number of target components are picked up by each suction nozzle 26 of the second head 20b, the CPU 51 controls the second head moving device 30b to move the second head 20b above the second part camera 41b. The CPU 51 then captures an image of the target components picked up by the suction nozzles 26 using the second part camera 41b, processes the captured image, and measures the suction offset of the target components. The CPU 51 then controls the second head moving device 30b to move the second head 20b so that the target components are positioned above the adjusted mounting position on the board S, and then controls the Z-axis actuator 25 of the second head 20b to lower the suction nozzles 26, thereby mounting the target components. Mounting of the target components by the second head 20b is performed in the same way as mounting of the target components by the first head 20a, by mounting multiple target components picked up by the multiple suction nozzles 26 in the planned mounting order.

[0023] When the PP cycle of the first head 20a and the PP cycle of the second head 20b are alternately performed on the same substrate S, if the second head 20b performs a mounting process while the first head 20a is performing a mounting process, or if the first head 20a performs a mounting process while the second head 20b is performing a mounting process, the first head 20a and the second head 20b will interfere with each other. Therefore, in this embodiment, while the first head 20a is performing a mounting process, the mounting process of the second head 20b is put on hold until the mounting process is completed. Similarly, while the second head 20b is performing a mounting process, the mounting process of the first head 20a is put on hold until the mounting process is completed.

[0024] The management device 100 is, for example, a general-purpose computer, and as shown in FIG. 3 , includes a CPU 101, a ROM 102, a RAM 103, a storage device 104, and an input / output interface 105. These components are electrically connected via a bus 106. An input signal is input to the management device 100 from an input device 111, such as a mouse or keyboard, via the input / output interface 105. The management device 100 also outputs an image signal to a display device 112 via the input / output interface 105. The storage device 104 stores a production schedule for the boards S. Here, the production schedule for the boards S refers to a schedule that determines which components P are picked up and mounted on the boards S in each mounter 10, the order in which the components P are picked up and mounted on the boards S, and how many boards S with the components P mounted thereon are to be produced. The management device 100 creates a production schedule based on data input by an operator via the input device 111, and instructs production by transmitting the created production schedule to each mounter 10.

[0025] 4 is a flowchart showing an example of a production schedule creation process executed by CPU 101 of management device 100. In the production schedule creation process, CPU 101 of management device 100 first assigns components to be mounted on board S to SIDE 1 on the first head 20a side and SIDE 2 on the second head 20b side (step S100). The components to be mounted are assigned by distributing the components to SIDE 1 and SIDE 2 so as to maximize the efficiency of component mounting by the first and second heads 20a and 20b. For example, the assignment is performed based on the mounting position of the component to be mounted, such that the component is mounted by the head of first or second head 20a, 20b that has the shortest movement distance.

[0026] Next, the CPU 51 determines the arrangement order of the first feeders 11a containing the components to be mounted assigned to SIDE1 (step S110), and determines the components to be mounted (a group of components to be mounted in one PP cycle) for each PP cycle of the first head 20a from the determined arrangement order of the first feeders 11a (step S120). The CPU 51 then determines the pickup order of the components to be mounted for each PP cycle (step S130) and the mounting order of the components to be mounted (step S140). For example, the components to be mounted for each PP cycle and their pickup order are determined so that components of the same type are picked up consecutively by the first head 20a as much as possible in order to shorten the pickup process. The mounting order is also determined so that the movement distance of the first head 20a is as short as possible in order to shorten the mounting process.

[0027] Next, CPU 51 determines the arrangement order of second feeders 11b that accommodate the components to be mounted assigned to SIDE2 (step S150), and determines the components to be mounted for each PP cycle of second head 20b from the determined arrangement order of second feeders 11b (step S160). Next, CPU 51 determines the pickup order of the components to be mounted for each PP cycle (step S170), and also determines the mounting order of the components to be mounted (step S180). The determination of the components to be mounted for each PP cycle of second head 20b, their pickup order, and mounting order are performed in the same manner as for first head 20a.

[0028] After determining the components to be mounted for each PP cycle on SIDE1, the pickup order, and the mounting order, and the components to be mounted for each PP cycle on SIDE2, the CPU 51 calculates the waiting time that occurs on SIDE1 when the PP cycle is repeated between SIDE1 (first head 20a) and SIDE2 (second head 20b) (step S190), and calculates the waiting time that occurs on SIDE2 (step S200).

[0029] Here, when multiple components P are picked up and mounted on a board S in one PP cycle, the pickup process is basically performed by successively picking up the same type of components P, and the placement process is performed by placing the components P at different placement positions. For this reason, in most PP cycles, the time required for the placement process (placement time) is longer than the time required for the pickup process (pickup time). Therefore, when PP cycles are executed in parallel on SIDE1 and SIDE2 for the same board S, one of the placements will wait. In this embodiment, as shown in the left diagram of FIG. 5, the CPU 51 arranges the PP cycles of SIDE1 and SIDE2 (cycles of "pickup," "movement," "placement," and "return" in FIG. 5) in chronological order and estimates the required time for each operation based on the movement distance and number of movements of the corresponding head. Then, when "placement" on SIDE1 and SIDE2 overlap, the CPU 51 places the "placement" on hold until one "placement" is completed, and calculates the time until completion as the wait time.

[0030] After calculating the waiting time for SIDE1 and the waiting time for SIDE2, CPU 51 determines whether a waiting time of a predetermined time or longer is predicted (step S210). If CPU 51 determines that a waiting time of a predetermined time or longer is predicted, CPU 51 takes the waiting time into consideration, returns to step S110, and changes the components to be mounted, and the pickup order and placement order for each PP cycle of SIDE1 and SIDE2, so as to shorten or reduce the waiting time for each PP cycle of SIDE1 and SIDE2.

[0031] FIG. 6 is an explanatory diagram showing how a PP cycle is executed in a conventional pickup order and placement order. FIG. 7 is an explanatory diagram showing how a PP cycle is executed in a pickup order and placement order according to the present disclosure. Conventionally, as shown in FIG. 6, in one PP cycle, all components P of the same type are consecutively picked up as components to be mounted, and the picked components P are mounted on a board S, thereby optimizing the sum of the pickup time and placement time. However, when two heads (first and second heads 20a and 20b) alternately place components on one board S, one head cannot place a component while the other head is placing a component, which results in a wait time and can increase overall throughput. Therefore, in this embodiment, as shown in FIG. 7, multiple components that are close to each other in placement positions are defined as components to be mounted in one PP cycle, and the pickup order and placement order of these components to be mounted are set. As mentioned above, when picking up multiple different types of components, the head must move, which increases the time required for the pick-up process, but by grouping components that are close to each other into a single PP cycle as components to be mounted, the resulting wait time can be used for the pick-up process, shortening the placement process.This reduces wait time and shortens overall throughput, as shown in the right diagram of Figure 5.

[0032] Here, the correspondence between the main elements of the embodiment and the main elements of the present disclosure described in the claims will be described. That is, the first head 20a of the present embodiment corresponds to the first head of the present disclosure, the second head 20b corresponds to the second head, the first head moving device 30a corresponds to the first head moving device, the second head moving device 30b corresponds to the second head moving device, the first feeder 11a corresponds to the first component supply unit, the second feeder 11b corresponds to the second component supply unit, the control device 50 corresponds to the control unit, and the management device 100 corresponds to the determination unit.

[0033] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0034] For example, in the above-described embodiment, the board transport device 12 has one lane for transporting the board S, but may have two lanes (a first lane 12a and a second lane 12b) for transporting the board S, as shown in Fig. 8. In this case, the component mounter 10 may have a mode in which the first head 20a places components on the board S transported on the first lane 12a and the second head 20b places components on the board S transported on the second lane 12b, and a mode in which components are alternately placed on one board S transported on one of the lanes by the first head 20a and the second head 20b.

[0035] In the above-described embodiment, the standby time for SIDE1 and the standby time for SIDE2 are calculated, and the calculated standby times are reflected in determining the components to be mounted for each PP cycle, as well as their pickup order and placement order. However, this is not limited to directly calculating the standby times, and it is sufficient to predict whether a standby will occur in the placement process of one of the heads, and determine the components to be mounted for each PP cycle of that one of the heads, as well as their pickup order and placement order, so that the sum of the pickup time, placement time, and standby time of that one of the heads is optimized.

[0036] In the above-described embodiment, the CPU 51 determines the components to be mounted, the pickup order, and the placement order for each PP cycle so as to shorten or reduce both the standby time for SIDE 1 and the standby time for SIDE 2. However, the CPU 51 may also determine the components to be mounted, the pickup order, and the placement order for each PP cycle so as to shorten or reduce either SIDE 1 or SIDE 2.

[0037] As described above, the component mounter disclosed herein includes first and second heads facing each other, and alternates between performing a picking process and then a placement process, with the first and second heads being controlled so that while one of the first and second heads is performing a placement process, the other head waits for the placement process. In this component mounting system, if the first head must wait for the placement process while the second head is performing the placement process, the component picking order and placement order by the first head are determined so as to shorten or eliminate the wait time of the first head. This reduces unnecessary wait time and improves throughput when components are placed on a board by the first and second heads facing each other.

[0038] In addition, in the mounter disclosed herein, the determination unit may calculate a waiting time for the first head when the mounting process of the first head must wait while the mounting process of the second head is being performed, and determine the order in which components are picked up and placed by the first head so as to shorten or reduce the calculated waiting time. In this way, it is possible to more accurately estimate the waiting time and determine the order in which components are picked up and placed so as to shorten or reduce the waiting time.

[0039] In the mounter of the present disclosure, the determination unit may determine the order in which the first head picks up and places components so that the standby time of the first head is used for the first head's collection process, thereby shortening the time required for the first head's placement process. This makes it possible to shorten or eliminate the standby time through simpler processing.

[0040] Furthermore, in the component mounter disclosed herein, the determination unit may further determine the component pick-up order and placement order of the second head so as to shorten or reduce the waiting time of the second head when the second head's placement process waits while the first head is performing the placement process. The determination unit may take into account both the waiting time of the first head and the waiting time of the second head. In this case, the determination unit may calculate the waiting time of the second head when the second head's placement process waits while the first head is performing the placement process, and determine the component pick-up order and placement order of the second head so as to shorten or reduce the calculated waiting time. This makes it possible to more accurately estimate the waiting time and determine the component pick-up order and placement order to shorten or reduce it. Furthermore, in these cases, the determination unit may determine the component pick-up order and placement order of the second head so as to allocate the waiting time of the second head to the second head's collection process and reduce the time required for the second head's placement process. This allows for a simpler process to shorten or reduce the waiting time.

[0041] The present disclosure is not limited to the form of a component mounting system, but may also be in the form of a method for determining a picking and mounting order, or in the form of a management device. [Industrial Applicability]

[0042] The present disclosure can be used in the manufacturing industry of component mounting systems and management devices. [Explanation of symbols]

[0043] 1 Component mounting system, 10 Component mounter, 11a First feeder, 11b Second feeder, 12 Substrate transport device, 12a First lane, 12b Second lane, 20 Substrate transport device, 20a First head, 20b Second head, 21 Head body, 22 Holder, 23 R-axis actuator, 24 θ-axis actuator, 25 Z-axis actuator, 26 Suction nozzle, 30a First head moving device, 30b Second head moving device, 31 X-axis slider, 32 X-axis actuator, 33 Y-axis slider, 34 Y-axis actuator, 41a First part camera, 41b Second part camera, 42a First nozzle stocker, 42b Second nozzle stocker, 50 Control device, 51 CPU, 52 ROM, 53 RAM, 54 Storage device, 55 Input / output interface, 56 Bus, 100 Management device, 101 CPU, 102 ROM, 103 RAM, 104 storage device, 105 input / output interface, 106 bus, 111 input device, 112 display device, P components, S board.

Claims

1. A component mounting system for mounting components, a first head having a plurality of nozzles capable of picking up components; a second head disposed opposite the first head and having a plurality of nozzles capable of picking up components; a first head moving device that moves the first head; a second head moving device that moves the second head independently of the first head; a first component supply unit that supplies components to the first head; a second component supply unit that supplies components to the second head; a control unit that controls the first and second heads and the first and second head moving devices so that a cycle of performing a picking process to pick components from a corresponding component supply unit and then performing a mounting process to mount the picked components on a board is repeated alternately between the first and second heads, and while one of the first and second heads is performing the mounting process, the other head waits until the mounting process by the first or second head is completed; a determination unit that, when a waiting period for the mounting process of the first head occurs during execution of the mounting process of the second head, determines a plurality of components that are close to each other in mounting positions as components to be mounted in one cycle so that the waiting time of the first head is shortened or reduced, and determines an order in which the first head picks up and places the components to be mounted; A component mounting system comprising:

2. 2. The component mounting system according to claim 1, the determination unit calculates a waiting time for the first head when a waiting period for the mounting process of the first head occurs during execution of the mounting process of the second head, and determines an order of component picking and mounting by the first head so as to shorten or reduce the calculated waiting time. Component mounting system.

3. 3. The component mounting system according to claim 1, The determination unit allocates the standby time of the first head to consumption of the collection process of the first head. determining a sequence of component picking and mounting by the first head so as to reduce the time required for the mounting process by the first head; Component mounting system.

4. 4. The component mounting system according to claim 1, the determination unit further determines the order in which components are picked up and placed by the second head so as to shorten or reduce the waiting time of the second head when the placement process of the second head is waiting while the placement process of the first head is being executed. Component mounting system.

5. 5. The component mounting system according to claim 4, the determination unit calculates a waiting time for the second head when a waiting period for the mounting process of the second head occurs during execution of the mounting process of the first head, and determines an order of component picking and mounting by the second head so as to shorten or reduce the calculated waiting time. Component mounting system.

6. 6. The component mounting system according to claim 4, the determination unit determines a component picking order and a component mounting order by the second head so that a waiting time of the second head is used for the picking process of the second head to reduce a required time for the mounting process of the second head. Component mounting system.

7. a first head having a plurality of nozzles capable of picking up components; a second head disposed opposite the first head and having a plurality of nozzles capable of picking up components; a first head moving device that moves the first head; a second head moving device that moves the second head independently of the first head; a first component supply unit that supplies components to the first head; a second component supply unit that supplies components to the second head; a control unit that controls the first and second heads and the first and second head moving devices so that a cycle of performing a picking process to pick components from a corresponding component supply unit and then performing a mounting process to mount the picked components on a board is repeated alternately between the first and second heads, and while one of the first and second heads is performing the mounting process, the other head waits until the mounting process by the first or second head is completed; A method for determining a picking and placing order of components to be placed on a board by the first and second heads in a component mounter comprising: When the mounting process of the first head is to wait while the mounting process of the second head is being performed, a plurality of components that are close to each other in mounting positions are determined as components to be mounted in one cycle so that the waiting time of the first head is shortened or reduced, and an order of picking and mounting of the components to be mounted by the first head is determined. Method for determining the order of collection and attachment.

8. a first head having a plurality of nozzles capable of picking up components; a second head disposed opposite the first head and having a plurality of nozzles capable of picking up components; a first head moving device that moves the first head; a second head moving device that moves the second head independently of the first head; a first component supply unit that supplies components to the first head; a second component supply unit that supplies components to the second head; After executing the collection process to collect components from the corresponding component supply unit, the collected components are attached to the board. a control unit that controls the first and second heads and the first and second head moving devices so that a cycle of executing a mounting process is alternately repeated between the first head and the second head, and while one of the first and second heads is executing the mounting process, the other head waits until the mounting process by the one head is completed; A management device for managing a component mounter comprising: When the mounting process of the first head is to wait while the mounting process of the second head is being performed, a plurality of components that are close to each other in mounting positions are determined as components to be mounted in one cycle so that the waiting time of the first head is shortened or reduced, and an order of picking and mounting of the components to be mounted by the first head is determined. Management device.

Images