Component Mounting Machine

Abstract

To suitably avoid interference of an electronic component with another electronic component previously mounted on a board when mounting the electronic component in a component mounting machine including a plurality of board conveyance devices.SOLUTION: A component mounting machine comprises: a component supply device; a first board conveyance device for conveying a first board; a first board support device for raising / lowering the first board between a first work position and an upper first support position; a second board conveyance device for conveying a second board; a second board support device for raising / lowering the second board between a second work position and an upper second support position; a component moving device for moving an electronic component to the first board and moving it to the second board while passing above the first work position; and a control device for mounting a second electronic component on the second board after moving the first board from the first support position to the first work position, in the case of mounting the second electronic component higher than a second predetermined height on the second board when a first electronic component higher than a first predetermined height is mounted on the first board.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component mounter that mounts electronic components on a board. [Background technology]

[0002] Some component mounters that mount electronic components on boards are provided with a first board transport device and a second board transport device, and are capable of mounting electronic components on a first board transported by the first board transport device and a second board transported by the second board transport device. When mounting electronic components on the second board, electronic components supplied from a component supply device may pass above the first board and be mounted on the second board. In this case, if electronic components having dimensions higher than a predetermined height have already been mounted on the first board, when mounting electronic components on the second board, the electronic components to be mounted on the second board may interfere with the electronic components having dimensions higher than the predetermined height mounted on the first board. For example, Patent Document 1 describes a method in which, when an electronic component to be mounted on a second board interferes with an electronic component that has already been mounted on a first board, the electronic component to be mounted on the second board is raised to a height that does not interfere with the electronic component that has already been mounted on the first board, and then passes above the first board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2013 / 128584 Summary of the Invention [Problem to be solved by the invention]

[0004] In the component mounter of Patent Document 1, it is necessary to raise the electronic component to a height that does not interfere with the electronic component previously mounted on the first board, based on the height dimension of the electronic component to be mounted on the second board and the height dimension of the electronic component previously mounted on the first board. However, because the electronic component to be mounted on the second board is raised to a position higher than its normal height, the moving distance of this electronic component from the component supply device to the mounting position becomes longer by the amount of elevation above its normal height.

[0005] This specification discloses a technology for, in a component mounter having multiple board transport devices, preferably avoiding interference with electronic components previously mounted on other boards when moving an electronic component to be mounted on one board. [Means for solving the problem]

[0006] The mounter disclosed in this specification includes a component supply device that supplies electronic components, a first board transport device that transports a first board to a first work position within the mounter and transports it from the first work position to the outside of the mounter, a first board support device that allows the first board transported to the first work position to be raised and lowered between the first work position and a first support position set above the first work position and supports the first board positioned at the first support position, a second board transport device that transports a second board to a second work position within the mounter and transports it from the second work position to the outside of the mounter, and a second board transport device that allows the second board transported to the second work position to be raised and lowered between the second work position and a second support position set above the second work position and supports the second board positioned at the second support position. a component moving device that allows electronic components supplied from the component supply device to be moved between the component supply device and the first substrate located at the first support position and to pass above the first work position between the component supply device and the second substrate located at the second support position; and a control device that, when a first electronic component having a dimension higher than a first predetermined height is mounted on the first substrate located at the first support position and a second electronic component having a dimension higher than the second predetermined height is mounted on the second substrate located at the second support position, controls the first substrate support device and the component moving device so that the second electronic component is mounted on the second substrate located at the second support position after moving the first substrate from the first support position to the first work position.

[0007] In the above-described component mounter, when a first electronic component having a dimension higher than the first predetermined height has been previously mounted on a first board, and a second electronic component having a dimension higher than the second predetermined height is mounted on a second board located at the second support position, the position of the upper end of the first electronic component is lowered rather than raising the position of the lower end of the second electronic component, thereby preventing the second electronic component from interfering with the first electronic component. This makes it possible to prevent the second electronic component to be mounted on the second board from interfering with the first electronic component previously mounted on the first board without increasing the moving distance of the second electronic component to be mounted on the second board. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a component mounter according to first and second embodiments. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a block diagram showing a control system of the component mounters according to the first and second embodiments. [Figure 4] 10 is a flowchart showing an example of a process for mounting electronic components onto a first circuit board carried by a first board conveyor and a second circuit board carried by a second board conveyor in the first embodiment. [Figure 5] FIG. 10 is a diagram for explaining a case where an electronic component (first electronic component) having dimensions higher than a predetermined height is first mounted on a first circuit board, and the first circuit board is positioned in a support position, and an electronic component sucked onto a nozzle passes above the first board circuit (showing a state in which the electronic component sucked onto the nozzle interferes with the first electronic component). [Figure 6] FIG. 10 is a diagram for explaining a case where a first electronic component is first mounted on a first circuit board, and the first circuit board is lowered from the support position, and an electronic component sucked onto a nozzle passes above the first board circuit (showing a state in which the electronic component sucked onto the nozzle does not interfere with the first electronic component). [Figure 7] 10 is a flowchart showing an example of a process for mounting electronic components onto a first circuit board carried by a first board conveyor and a second circuit board carried by a second board conveyor in the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] In the component mounter disclosed in this specification, when a first electronic component having a dimension higher than a first predetermined height is previously mounted on a first board, and a second electronic component having a dimension higher than a second predetermined height is to be mounted on a second board, the first board is moved (i.e., lowered) from the first support position to the first work position. As a result, the first electronic component previously mounted on the first board is also lowered. This makes it possible to preferably prevent the second electronic component to be mounted on the second board from interfering with the first electronic component previously mounted on the first board.

[0011] In the component mounter disclosed in this specification, a plurality of electronic components may be mounted on the first board. The plurality of electronic components may include a first electronic component having a dimension greater than a first predetermined height. The first electronic component may be mounted after other electronic components among the plurality of electronic components have been mounted on the first board. With this configuration, the first electronic component having a dimension greater than the first predetermined height is mounted on the first board after the other electronic components have been mounted. As a result, when the first board is moved from the first support position to the first work position after mounting the first electronic component having a dimension greater than the first predetermined height, the first board moves from the support position to the first work position with all electronic components mounted on it. Therefore, the first board can be transported from the first work position to the component mounter without having to be raised to the first support position again.

[0012] In the component mounter disclosed herein, when a first electronic component having a dimension greater than a first predetermined height is mounted on a first substrate located at the first support position and a third electronic component having a dimension equal to or less than the second predetermined height is to be mounted on a second substrate located at the second support position, the control device may control the first substrate support device and the component moving device to mount the third electronic component on the second substrate located at the second support position while the first substrate is located at the first support position. With this configuration, even if a first electronic component having a dimension greater than the first predetermined height has been previously mounted on the first substrate, when a third electronic component having a dimension equal to or less than the second predetermined height is to be mounted on the second substrate, the first substrate is not moved (i.e., lowered) from the first support position to the first work position. Because the third electronic component has a dimension equal to or less than the second predetermined height, even if the first electronic component has been previously mounted on the first substrate, the third electronic component does not interfere with the first electronic component when the third electronic component is to be mounted on the second substrate. Therefore, the mounting process can be carried out appropriately in accordance with the height of the electronic component to be mounted on the second substrate. [Example]

[0013] Example 1 A component mounter 10 according to an embodiment will be described with reference to the drawings. The component mounter 10 is a device that mounts electronic components 4 on a circuit board 2. The component mounter 10 is also called an electronic component placement device or a chip mounter. Typically, the component mounter 10 is installed alongside other board work machines such as a solder printer and a board inspection machine, forming a continuous mounting line.

[0014] 1 and 2, the component mounter 10 includes a plurality of component feeders 12, a feeder holder 14, two board conveyors 20a, 20b, a mounting head 16, a head moving device 18, two board support devices 34a, 34b, a control device 26, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounter 10 is disposed outside the component mounter 10.

[0015] Each component feeder 12 stores a plurality of electronic components 4. The component feeders 12 are detachably attached to the feeder holder 14 and supply the electronic components 4 to the mounting head 16. The specific configuration of the component feeders 12 is not particularly limited. Each component feeder 12 may be, for example, a tape feeder that supplies a plurality of electronic components 4 stored on a tape, a tray feeder that supplies a plurality of electronic components 4 stored on a tray, or a bulk feeder that supplies a plurality of electronic components 4 stored randomly in a container.

[0016] The feeder holding unit 14 has a plurality of slots, each of which can detachably accommodate a component feeder 12. The feeder holding unit 14 may be fixed to the component mounter 10, or may be detachable from the component mounter 10.

[0017] The board conveyors 20a and 20b transport the circuit boards 2 in the X direction. The two board conveyors 20a and 20b are installed side by side in the Y direction. Hereinafter, the board conveyor 20a installed on the component feeder 12 side (negative Y direction side) may be referred to as the "first board conveyor 20a," and the board conveyor 20b installed at a position farther from the component feeder 12 than the first board conveyor 20a (positive Y direction side) may be referred to as the "second board conveyor 20b." The board conveyors 20a and 20b are spaced apart in the Y direction and comprise a pair of conveyors extending parallel to each other in the X direction. The board conveyors 20a and 20b receive the circuit boards 2 from a component mounter (or another board work machine such as a solder printer) adjacent to one side and transport them to a predetermined component mounting position (i.e., a work position described below). Once the mounting of electronic components 4 on the circuit board 2 is complete, the board conveyors 20a, 20b send the circuit board 2 to an adjacent component mounter (or another board work machine, such as a board inspection machine) on the other side. In this embodiment, the board conveyors 20a, 20b are belt conveyors (not shown) in which the conveyor belt is driven by a motor, but the specific configuration of the board conveyors 20a, 20b is not particularly limited. For example, the board conveyors 20a, 20b may be roller conveyors. Furthermore, the pair of board conveyors 20a, 20b are driven by an actuator (not shown) to move in the Y direction, enabling them to move toward and away from each other. The first board conveyor 20a and the second board conveyor 20b are configured to be independently drivable. Note that, although two board conveyors 20a, 20b are provided in this embodiment, the configuration is not limited to this. For example, three or more board conveyors may be provided.

[0018] The placement head 16 has a nozzle 6 that picks up the electronic component 4. The nozzle 6 is detachably attached to the placement head 16. The placement head 16 is capable of moving the nozzle 6 in the Z direction (here, the vertical direction) to move the nozzle 6 toward and away from the component feeder 12 and the circuit board 2. The placement head 16 can pick up the electronic component 4 from the component feeder 12 using the nozzle 6, and can also place the electronic component 4 picked up by the nozzle 6 onto the circuit board 2. Note that the placement head 16 is not limited to one having a single nozzle 6, and may be one having multiple nozzles 6.

[0019] The head moving device 18 moves the placement head 16 between the component feeder 12 and the second board conveyor 20b. That is, the head moving device 18 moves the placement head 16 between the component feeder 12 and the circuit board 2 transported by the first board conveyor 20a, and also moves the placement head 16 between the component feeder 12 and the circuit board 2 transported by the second board conveyor 20b. When moving the placement head 16 between the circuit board 2 transported from the component feeder 12 by the second board conveyor 20b, the placement head 16 passes above the circuit board 2 transported by the first board conveyor 20a. As an example, the head moving device 18 in this embodiment is an XY robot that moves a moving base 18a in the X and Y directions, and the placement head 16 is fixed to the moving base 18a. Note that the placement head 16 is not limited to being fixed to the moving base 18a, but may be detachably attached to the moving base 18a.

[0020] The board support devices 34a and 34b are devices that support the circuit boards 2 on the board conveyors 20a and 20b from below. Specifically, the board support device 34a supports the circuit boards 2 on the first board conveyor 20a from below, and the board support device 34b supports the circuit boards 2 on the second board conveyor 20b from below. Hereinafter, the board support device 34a may be referred to as the "first board support device 34a," and the board support device 34b may be referred to as the "second board support device 34b." The board support devices 34a and 34b each have a plurality of backup pins 38 arranged on backup plates 36a and 36b, respectively. By raising the backup plates 36a and 36b, the backup pins 38 come into contact with the underside of the circuit board 2, and the backup pins 38 support the circuit board 2 from below. Hereinafter, the position where the backup plates 36a, 36b are raised and the circuit board 2 is supported from below by the backup pins 38 may be referred to as the "support position," and the position where the backup plates 36a, 36b are lowered and the circuit board 2 can be transported may be referred to as the "work position," since this is the state where the circuit board 2 has been transported to a predetermined position (position where work can be done) within the component mounter 10. The positions of the multiple backup pins 38 can be changed depending on the circuit pattern of the circuit board 2 to be mounted.

[0021] The control device 26 is configured using a computer including a CPU and a storage device. The control device 26 controls the operation of each part of the component mounter 10 based on a production program transmitted from the management device 8. As shown in FIG. 3 , the control device 26 is connected to the head moving device 18, the first board conveyor 20a, the second board conveyor 20b, the first board support device 34a, the second board support device 34b, and the touch panel 24, and controls each part of the head moving device 18, the first board conveyor 20a, the second board conveyor 20b, the first board support device 34a, the second board support device 34b, and the touch panel 24. The touch panel 24 is a display device that provides various information about the component mounter 10 to the operator, and is also an input device that receives instructions and information from the operator.

[0022] Next, a process for mounting electronic components 4 on a circuit board 2 (hereinafter also referred to as a first circuit board 2a) transported by a first board conveyor 20a and a circuit board 2 (hereinafter also referred to as a second circuit board 2b) transported by a second board conveyor 20b will be described. As shown in FIGS. 1 and 2, when mounting electronic components 4 on a second circuit board 2b, a head moving device 18 moves electronic components 4 supplied from a component feeder 12 over the first circuit board 2a to the circuit board 2 transported by the second board conveyor 20b. If an electronic component 4 having a larger height dimension is mounted on the first circuit board 2a first, the electronic component 4 may interfere with the larger height component 4 mounted earlier when passing over the first circuit board 2a. Below, a process for avoiding interference with the electronic component 4 mounted earlier on the first circuit board 2a when mounting electronic components 4 on the second circuit board 2b will be described. The types and mounting positions of the electronic components 4 to be mounted on the first circuit board 2a and the second circuit board 2b are set in advance by a production program transmitted from the management device 8. In this embodiment, a case will be described in which the production program is set so that, among the multiple electronic components 4 to be mounted on the first circuit board 2a, an electronic component 4 having a dimension greater than a predetermined height is mounted after the other electronic components 4 to be mounted on the first circuit board 2a have been mounted (the last of the multiple electronic components 4 to be mounted on the first circuit board 2a). Also, it is assumed that the mounting process on the first circuit board 2a is completed before the mounting process on the second circuit board 2b.

[0023] 4, first, control device 26 transports first circuit board 2a and second circuit board 2b into component mounter 10 (S12). That is, first circuit board 2a is transported to a work position within component mounter 10 by first board conveyor 20a, and second circuit board 2b is transported to a work position within component mounter 10 by second board conveyor 20b.

[0024] Next, the control device 26 raises the backup plate 36a of the first board support device 34a and the backup plate 36b of the second board support device 34b (S14). That is, the control device 26 raises the backup plate 36a of the first board support device 34a to support the first circuit board 2a, and raises the backup plate 36b of the second board support device 34b to support the second circuit board 2b. Then, the first circuit board 2a and the second circuit board 2b transported to the work position each move from the lower work position to the upper support position.

[0025] Next, the control device 26 mounts the electronic components 4 on the first circuit board 2a and the second circuit board 2b in accordance with the production program transmitted from the management device 8 (S16). The electronic components 4 are mounted in the following procedure. First, the control device 26 moves the moving base 18a so that the nozzle 6 is positioned above a supply position (not shown) of the electronic components 4 on the component feeder 12. Next, the control device 26 moves the nozzle 6 downward, and the nozzle 6 picks up the electronic component 4. Next, the control device 26 moves the nozzle 6 upward while the nozzle 6 is picking up the electronic component 4. Then, the control device 26 moves the moving base 18a so that the picked-up electronic component 4 is positioned above a predetermined mounting position on the first circuit board 2a or the second circuit board 2b. Finally, the control device 26 moves the nozzle 6 downward, and the electronic component 4 is mounted in the predetermined mounting position.

[0026] Next, control device 26 determines whether an electronic component 4 having dimensions higher than a predetermined height has been mounted on first circuit board 2a (S18). Here, the predetermined height refers to a height at which, when electronic component 4 mounted on first circuit board 2a is mounted on first circuit board 2a and electronic component 4 picked up by nozzle 6 passes above first circuit board 2a (more specifically, a predetermined height from the top surface of first circuit board 2a supported at the support position), electronic component 4 picked up by nozzle 6 may interfere with electronic component 4 mounted on first circuit board 2a. Hereinafter, this height may be referred to as a "first predetermined height," and an electronic component 4 having dimensions higher than the first predetermined height may be referred to as a "first electronic component 4a."

[0027] 5, if a first electronic component 4a is mounted first on the first circuit board 2a and then an electronic component 4 is mounted on the second circuit board 2b in this state, the lower end of the electronic component 4 picked up by the nozzle 6 may interfere with the already-mounted first electronic component 4a as the electronic component 4 picked up by the nozzle 6 passes over the first circuit board 2a. If the first electronic component 4a is not mounted on the first circuit board 2a (NO in step S18), even if the next electronic component 4 to be mounted is to be mounted on the second circuit board 2b, there will be no electronic component 4 mounted on the first circuit board 2a at a height that would cause interference with the electronic component 4 picked up by the nozzle 6 as the electronic component 4 passes over the first circuit board 2a. Therefore, the process returns to step S16, and the processes of steps S16 and S18 are repeated.

[0028] On the other hand, if the first electronic component 4a is mounted on the first circuit board 2a (YES in step S18), if the electronic component 4 to be mounted on the second circuit board 2b passes above the first circuit board 2a in this state, the lower end of the electronic component 4 sucked by the nozzle 6 may interfere with the first electronic component 4a. Therefore, the control device 26 moves the first circuit board 2a from the support position to the work position (S20). Specifically, the control device 26 lowers the backup plate 36a of the first board support device 34a.

[0029] Next, the control device 26 mounts the electronic components 4 on the second circuit board 2b (S22). As described above, in this embodiment, the first electronic components 4a are mounted last on the first circuit board 2a. Therefore, after the first electronic components 4a are mounted, no electronic components 4 are mounted on the first circuit board 2a, and the electronic components 4 are mounted on the second circuit board 2b.

[0030] 6, when the first circuit board 2a is moved from the support position to the working position, the position of the upper end of the first electronic component 4a mounted on the first circuit board 2a also drops. In this state, when the electronic component 4 to be mounted on the second circuit board 2b passes above the first circuit board 2a, the upper end of the first electronic component 4a becomes lower than the lower end of the electronic component 4 held by the nozzle 6, and the electronic component 4 held by the nozzle 6 no longer interferes with the first electronic component 4a. Therefore, the electronic component 4 can be moved from the component feeder 12 to the second circuit board 2b without interfering with the first electronic component 4a on the first circuit board 2a as it passes above the first circuit board 2a. That is, with regard to the electronic components 4 mounted on the second circuit board 2b, not only electronic components 4 that do not have a large dimension in the height direction (electronic components 4 with a small dimension in the height direction) but also electronic components 4 with a large dimension in the height direction can be moved from the component feeder 12 to the second circuit board 2b without interfering with the first electronic components 4a on the first circuit board 2a when passing above the first circuit board 2a.

[0031] Next, the control device 26 transports the first circuit board 2a out of the component mounter 10 (S24). Specifically, the control device 26 drives the first board conveyor 20a to transport the first circuit board 2a. Because the first electronic component 4a is mounted last on the first circuit board 2a, when the first electronic component 4a has already been mounted on the first circuit board 2a, all of the multiple electronic components 4 have already been mounted on the first circuit board 2a. Also, in step S20, the first circuit board 2a has moved from the support position to the work position. Therefore, by driving the first board conveyor 20a, the first circuit board 2a can be transported out. Note that if not all of the electronic components 4 have been mounted on the second circuit board 2b, mounting of the electronic components 4 on the second circuit board 2b continues. The processing of step S24 may be performed simultaneously with the mounting processing of the electronic components 4 on the second circuit board 2b.

[0032] In this embodiment, when the first electronic component 4a is mounted on the first circuit board 2a first, the control device 26 lowers the backup plate 36a of the first board support device 34a to move the first circuit board 2a from the support position to the working position. This prevents the lower end of the electronic component 4 from interfering with the first electronic component 4a as it passes above the first circuit board 2a. For example, if the first electronic component 4a is mounted on the first circuit board 2a first, and the electronic component 4 held by the nozzle 6 is raised, the movement distance of the electronic component 4 increases by the amount of the lift. In this embodiment, without increasing the movement distance of the electronic component 4, it is possible to prevent the electronic component 4 from interfering with the first electronic component 4a as it passes above the first circuit board 2a.

[0033] Example 2 In the first embodiment, the first electronic component 4a is mounted last on the first circuit board 2a, but this is not a limitation. The mounting order of the first electronic components 4a on the first circuit board 2a may be set arbitrarily. That is, other electronic components 4 may be mounted on the first circuit board 2a after the first electronic component 4a is mounted.

[0034] 7, first, control device 26 transports first circuit board 2a and second circuit board 2b into component mounter 10 (S32), and then raises backup plate 36a of first board support device 34a and backup plate 36b of second board support device 34b (S34). Control device 26 then mounts electronic components 4 on first circuit board 2a and second circuit board 2b in accordance with the production program transmitted from management device 8 (S36). Thereafter, control device 26 determines whether first electronic component 4a has been mounted on first circuit board 2a (S38). Note that the processing of steps S32 to S38 is similar to the processing of steps S12 to S18 in the first embodiment, and therefore detailed description thereof will be omitted.

[0035] If the first electronic component 4a is not mounted on the first circuit board 2a (NO in step S18), even if the next electronic component 4 to be mounted is to be mounted on the second circuit board 2b, there is no electronic component 4 mounted on the first circuit board 2a that is at a height that would interfere with the electronic component 4 sucked by the nozzle 6 when the electronic component 4 passes above the first circuit board 2a. Therefore, the process returns to step S36, and the processes of steps S36 and S38 are repeated.

[0036] On the other hand, if the first electronic component 4a is mounted on the first circuit board 2a (YES in step S18), there is a risk that the electronic component 4 picked up by the nozzle 6 will interfere with the first electronic component 4a if the electronic component 4 to be mounted on the second circuit board 2b passes above the first circuit board 2a (see FIG. 5). Therefore, the control device 26 determines whether the next electronic component 4 to be mounted is to be mounted on the second circuit board 2b and has a dimension greater than a predetermined height (S40). Hereinafter, the predetermined height refers to a height at which the electronic component 4, when picked up by the nozzle 6 and passing above the first circuit board 2a, may interfere with the first electronic component 4a when the first electronic component 4a is mounted on the first circuit board 2a and the first circuit board 2a is in the support position. Hereinafter, this height may be referred to as the "second predetermined height," and an electronic component 4 having a dimension greater than the second predetermined height may be referred to as the "second electronic component 4b." The second predetermined height may be the same as the first predetermined height described in the first embodiment, or may be a different height.

[0037] Next, when the second electronic component 4b is to be mounted on the second circuit board 2b (YES in step S40), if the second electronic component 4b passes above the first circuit board 2a in this state, the lower end of the second electronic component 4b held by the nozzle 6 may interfere with the first electronic component 4a (see FIG. 5). For this reason, the control device 26 lowers the backup plate 36a of the first board support device 34a to move the first circuit board 2a from the support position to the working position (S42). Next, the control device 26 mounts the next electronic component 4 to be mounted (S44). That is, the control device 26 mounts the second electronic component 4b on the second circuit board 2b. Because the first circuit board 2a is located at the working position, it is possible to prevent the lower end of the second electronic component 4b from interfering with the first electronic component 4a when the second electronic component 4b passes above the first circuit board 2a (see FIG. 6).

[0038] On the other hand, if the next electronic component 4 to be mounted is not the second electronic component 4b to be mounted on the second circuit board 2b (NO in step S40), that is, if the next electronic component 4 to be mounted is one to be mounted on the first circuit board 2a, or if it is mounted on the second circuit board 2b but has a dimension equal to or smaller than the second predetermined height, the next electronic component 4 to be mounted will not interfere with the first electronic component 4a previously mounted on the first circuit board 2a. Therefore, the process of step S42 is skipped. Then, the control device 26 mounts the next electronic component 4 to be mounted (S44).

[0039] Next, the control device 26 determines whether all electronic components 4 have been mounted on the first circuit board 2a (S46). If all electronic components 4 have not been mounted on the first circuit board 2a (NO in step S46), the control device 26 determines whether the first circuit board 2a has been moved from the support position to the working position (S48). As described above, if it is determined in step S40 that the second electronic components 4b will not be mounted on the second circuit board 2b (NO in step S40), the process of step S42 is skipped, and the first circuit board 2a is placed in the support position. If the first circuit board 2a has been moved from the support position to the working position (YES in step S48), the control device 26 raises the backup plate 36a of the first board support device 34a to return the first circuit board 2a from the working position to the support position (S50). Then, the process returns to step S38, and the processes of steps S38 to S46 are repeated. On the other hand, if the first circuit board 2a has not been moved from the support position to the working position (that is, is placed at the support position) (NO in step S48), the process returns to step S38, and the processes of steps S38 to S46 are repeated.

[0040] Even when all electronic components 4 have been mounted on the first circuit board 2a (YES in step S46), the control device 26 determines whether the first circuit board 2a has been moved from the support position to the work position (S52). If the first circuit board 2a has not been moved from the support position to the work position (NO in step S52), the control device 26 lowers the backup plate 36a of the first board support device 34a to move the first circuit board 2a from the support position to the work position (S54). On the other hand, if the first circuit board 2a has been moved from the support position to the work position (YES in step S52), the process of step S52 is skipped. The first circuit board 2a is then placed in a work position where it can be transported. Therefore, the control device 26 drives the first board conveyor 20a to transport the first circuit board 2a out of the component mounter 10 (S56). In this embodiment, if not all of the electronic components 4 have been mounted on the second circuit board 2b, the mounting of the electronic components 4 on the second circuit board 2b continues. The processing of step S56 may be performed simultaneously with the mounting of the electronic components 4 on the second circuit board 2b.

[0041] In this embodiment, the first electronic component 4a is mounted on the first circuit board 2a first, and when the second electronic component 4b is mounted on the second circuit board 2b, the control device 26 lowers the backup plate 36a of the first board support device 34a to move the first circuit board 2a from the support position to the working position. Therefore, in this embodiment as well, it is possible to prevent the lower end of the second electronic component 4b from interfering with the first electronic component 4a when the second electronic component 4b passes above the first circuit board 2a, without increasing the moving distance of the second electronic component 4b.

[0042] In this embodiment, the first circuit board 2a is lowered from the support position to the work position in step S42 only if it is determined in step S40 that the second electronic component 4b is to be mounted on the second circuit board 2b. However, this is not a limitation. When the first electronic component 4a has already been mounted on the first circuit board 2a and an electronic component 4 is to be mounted on the second circuit board 2b, the first circuit board 2a may be moved from the support position to the work position regardless of the type of electronic component 4 to be mounted on the second circuit board 2b. In other words, even if the electronic component 4 to be mounted on the second circuit board 2b is equal to or less than the second predetermined height, if the first electronic component 4a has already been mounted on the first circuit board 2a, the first circuit board 2a may be moved from the support position to the work position when mounting the electronic component 4 on the second circuit board 2b. In addition, in the above-described embodiment, interference with the first electronic component 4a is determined based on the dimensions of the electronic component 4 regardless of the mounting position of the electronic component 4 to be mounted on the second circuit board 2b. However, this is not a limitation. For example, the mounting position of the electronic component 4 to be mounted on the second circuit board 2b and the mounting position of the first electronic component 4a mounted on the first circuit board 2a may be taken into consideration to determine whether the electronic component 4 will interfere with the first electronic component 4a when mounted on the second circuit board 2b. In other words, the movement path of the electronic component 4 may also be taken into consideration to determine whether the electronic component 4 will interfere with the first electronic component 4a.

[0043] The following points are to be noted regarding the component mounter 10 described in the embodiment. The component feeder 12 in the embodiment is an example of a "component supply device," the head moving device 18 is an example of a "component moving device," the first board conveyor 20a is an example of a "first board transport device," and the second board conveyor 20b is an example of a "second board transport device."

[0044] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings simultaneously achieves multiple objectives, and achieving one of those objectives itself has technical utility. [Explanation of symbols]

[0045] 2: Circuit board 2a: 1st circuit board 2b: 2nd circuit board 4: Electronic components 4a: 1st electronic component 4b: Second electronic component 6: Suction nozzle 8: Management device 10: Component mounter 12: Parts feeder 14: Feeder holder 16: Mounting head 18: Head moving device 20a: First board conveyor 20b: Second board conveyor 24: Touch panel 26: Control device 34a: First substrate support device 34b: Second board support device 36a: Backup plate of first substrate support device 36b: Backup plate of second substrate support device 38: Backup pin

Claims

1. a component supply device that supplies electronic components; a first substrate transport device that transports a first substrate to a first work position within the component mounter and transports the first substrate from the first work position to the outside of the component mounter; a first substrate support device that enables the first substrate transported to the first work position to be raised and lowered between the first work position and a first support position set above the first work position, and supports the first substrate positioned at the first support position; a second substrate transport device that transports a second substrate to a second work position within the mounter and transports the second substrate from the second work position to the outside of the mounter; a second substrate support device that enables the second substrate transported to the second work position to be raised and lowered between the second work position and a second support position set above the second work position, and supports the second substrate positioned at the second support position; a component moving device that allows the electronic components supplied from the component supply device to be moved between the component supply device and the first board located at the first support position, and also allows the electronic components to be moved between the component supply device and the second board located at the second support position, passing above the first work position; a control device that controls the first board support device and the component moving device, The control device mounting the electronic component on the first substrate positioned at the first support position by the component moving device; when a first electronic component having a dimension higher than a first predetermined height is mounted by the component moving device onto the first board located at the first support position, and when a second electronic component having a dimension higher than a second predetermined height is mounted onto the second board located at the second support position, if the already-mounted first electronic component is located on a movement path of the second electronic component from the component supply device to a mounting position of the second electronic component on the second board, the first board is moved from the first support position to the first work position, and then the second electronic component is mounted onto the second board located at the second support position; a component mounter that controls the first board support device and the component moving device so that, after mounting the second electronic component on the second board, the first board is moved from the first work position to the first support position, and then another electronic component is mounted on the first board.

2. a plurality of electronic components are mounted on the first substrate; the plurality of electronic components includes a first electronic component having a dimension higher than the first predetermined height, 2. The component mounter according to claim 1, wherein the first electronic component is mounted on the first board after other electronic components of the plurality of electronic components have been mounted on the first board.

3. 3. The component mounter according to claim 1, wherein when a first electronic component having a dimension higher than a first predetermined height is mounted on the first substrate positioned at the first support position and a third electronic component having a dimension equal to or smaller than the second predetermined height is to be mounted on the second substrate positioned at the second support position, the control device controls the first substrate support device and the component moving device so that the third electronic component is mounted on the second substrate positioned at the second support position while the first substrate is positioned at the first support position.

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