Method for attaching wires to substrate supporting ceramic

Abstract

The substrate support assembly includes a base plate, a ceramic plate disposed on the base plate, and a plurality of wires. The ceramic plate includes a plurality of slots disposed on a side facing the base plate, and a plurality of conductive terminals disposed in the plurality of slots. Each of the terminals includes a base portion connected to the ceramic plate, a second portion extending from the base portion toward the base plate, and an opening in the second portion extending from an end of the second portion adjacent to the base portion to a distal end of the second portion. Each of the wires passes through the opening of the respective terminal and is braided around the distal end of the second portion of the respective terminal.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Application No. 63 / 053,111, filed July 17, 2020. The entire disclosure of the aforementioned application is incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to substrate processing systems and, more particularly, to a method for attaching wires to a substrate supporting ceramic. [Background technology]

[0003] The background art description provided herein is intended to provide a general context for the present disclosure. Work by the presently named inventors, to the extent described in this background art section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure.

[0004] A substrate processing system typically includes multiple processing chambers (also called process modules) for deposition, etching, and other processing of substrates, such as semiconductor wafers. Examples of processes that may be performed on a substrate include, but are not limited to, plasma-enhanced chemical vapor deposition (PECVD), chemically enhanced plasma-enhanced chemical vapor deposition (CEPVD), sputtering physical vapor deposition (PVD), atomic layer deposition (ALD), and plasma-enhanced ALD (PEALD). Further examples of processes that may be performed on a substrate include, but are not limited to, etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.) and cleaning processes.

[0005] During processing, a substrate is placed on a substrate support assembly, such as a pedestal or electrostatic chuck (ESC), located within a processing chamber of a substrate processing system. A robot typically transfers substrates from one processing chamber to another in the order in which the substrates are processed. During deposition, a gas mixture containing one or more precursors is introduced into the processing chamber and a plasma is struck to activate a chemical reaction. During etching, a gas mixture containing an etching gas is introduced into the processing chamber and a plasma is struck to activate a chemical reaction. The processing chamber is periodically cleaned by supplying a cleaning gas into the processing chamber and striking a plasma. Summary of the Invention

[0006] The substrate support assembly includes a base plate, a ceramic plate disposed on the base plate, and a plurality of wires. The ceramic plate includes a plurality of slots disposed on a side facing the base plate, and a plurality of conductive terminals disposed within the plurality of slots. Each of the terminals includes a base portion connected to the ceramic plate, a second portion extending from the base portion toward the base plate, and an opening in the second portion extending from an end of the second portion adjacent to the base portion to a distal end of the second portion. Each of the wires passes through the opening in the respective terminal and is braided around the distal end of the second portion of the respective terminal.

[0007] In another feature, each of the wires is wrapped one or more times around the distal end of the second portion of the respective terminal.

[0008] In another feature, the substrate support assembly further includes an electrical bonding material deposited on the distal end of the second portion of each of the terminals.

[0009] In another feature, the openings in the terminals thermally isolate the respective wires from the ceramic plate during processing of the substrate.

[0010] In another feature, the electrical bonding material comprises a solder material or an epoxy.

[0011] In another feature, the electrical bonding material is localized at a distal end of the second portion of each of the terminals.

[0012] In another aspect, the electrical bonding material does not extend to the base portion of the terminal.

[0013] In another feature, the electrical bonding material does not fill the openings in the terminals.

[0014] In another feature, the base portion of the terminal is connected to an electrical component disposed within the ceramic plate.

[0015] In another feature, the distal ends of the wires run through the base plate and are connected to circuitry disposed along the side of the base plate facing away from the ceramic plate.

[0016] In another aspect, the circuit communicates via wires with electrical components disposed within the ceramic plate and connected to the base portions of the terminals.

[0017] In another feature, each of the terminals is T-shaped, with a horizontal portion of the T being a base portion of each of the terminals and a vertical portion of the T being a second portion of each of the terminals.

[0018] In another feature, in each of the terminals, the second portion extends perpendicularly from the base portion.

[0019] In another feature, in each of the terminals, the second portion is longer than the base portion.

[0020] In another feature, in each of the terminals, the base portion and the second portion are cylindrical, the base portion having a longer radius and a shorter height than the second portion.

[0021] In another feature, each of the terminals is made of a material having a first coefficient of thermal expansion within a predetermined range of a second coefficient of thermal expansion of the ceramic plate.

[0022] In another feature, each of the terminals is made of tungsten and copper.

[0023] In another feature, each of the terminals is coated with nickel.

[0024] In another feature, each of the wires is made from a single strand of conductive material.

[0025] In another feature, each of the wires is made from multiple strands of conductive material.

[0026] In another aspect, each of the wires is made of copper and coated with silver.

[0027] In another feature, the electrical bonding material includes a first material including Sn, Ag, and Cu or a second material including Sn and Ag.

[0028] In yet another feature, a method for attaching wires to a ceramic plate of a substrate support assembly includes disposing a plurality of slots on the ceramic plate on a side of the substrate support assembly facing the base plate and disposing a plurality of conductive terminals in the plurality of slots, each of the terminals including a base portion, a second portion extending from the base portion toward the base plate, and an opening in the second portion extending from an end of the second portion adjacent the base portion to a distal end of the second portion. The method includes connecting the base portions of the terminals to the ceramic plate. The method includes connecting the plurality of wires to distal ends of the second portions of the plurality of terminals by threading each of the wires through the opening of the respective terminal, folding each of the wires into two halves around the distal end, wrapping each of the wires around the distal end, and twisting the two halves together from the distal end of the second portion of the respective terminal to the distal ends of the two halves.

[0029] In another feature, the method further includes wrapping each of the wires multiple times around the distal end of the second portion of the respective terminal.

[0030] In another feature, the method further includes depositing an electrical bonding material on a distal end of the second portion of each of the terminals.

[0031] In another feature, the method further includes soldering each of the wires to a respective terminal until solder material is deposited on the distal end of the second portion of each of the terminals and until the solder material has penetrated into a loop around the distal end of the second portion of each of the terminals.

[0032] In other features, the method further includes applying solder paste to a distal end of the second portion of each of the terminals and to a portion of each of the wires proximate the distal end of the second portion of each of the terminals, and performing a reflow process on a ceramic plate until the solder paste melts.

[0033] In another feature, the openings in the terminals thermally isolate the respective wires from the ceramic plate during processing of the substrate.

[0034] In another feature, the electrical bonding material comprises a solder material or an epoxy.

[0035] In another feature, the method further includes maintaining an electrical bonding material localized at the distal end of the second portion of each of the terminals.

[0036] In another feature, the method further includes not extending the electrical bonding material to the base portion of the terminal.

[0037] In another feature, the method further includes not filling the openings of the terminals with the electrical bonding material.

[0038] In another feature, the method further includes connecting the base portion of the terminal to the electrical component disposed within the ceramic plate by performing a reflow process on the ceramic plate.

[0039] In other features, the method further includes running distal ends of the wires through a base plate coupled to the ceramic plate and connecting the distal ends of the wires to circuitry disposed adjacent to the base plate.

[0040] In another feature, each of the terminals is T-shaped, with a horizontal portion of the T being a base portion of each of the terminals and a vertical portion of the T being a second portion of each of the terminals.

[0041] In another feature, in each of the terminals, the second portion extends perpendicularly from the base portion.

[0042] In another feature, in each of the terminals, the second portion is longer than the base portion.

[0043] In another feature, in each of the terminals, the base portion and the second portion are cylindrical, the base portion having a longer radius and a shorter height than the second portion.

[0044] In another feature, each of the terminals is made of a material having a first coefficient of thermal expansion within a predetermined range of a second coefficient of thermal expansion of the ceramic plate.

[0045] In another aspect, each of the terminals is made of tungsten and copper.

[0046] In another feature, each of the terminals is coated with nickel.

[0047] In another feature, each of the wires is made from a single strand of conductive material.

[0048] In another feature, each of the wires is made from multiple strands of conductive material.

[0049] In another aspect, each of the wires is made of copper and coated with silver.

[0050] In another feature, the electrical bonding material includes a first material including Sn, Ag, and Cu or a second material including Sn and Ag.

[0051] Further areas of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0052] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0053] [Figure 1A] FIG. 1A illustrates a first example of a substrate processing system according to the present disclosure.

[0054] [Figure 1B] FIG. 1B illustrates a second example of a substrate processing system according to the present disclosure.

[0055] [Figure 2] FIG. 2 is a cross-sectional side view of an example substrate support assembly including electrical components disposed within the ceramic plate of the substrate support assembly.

[0056] [Figure 3] FIG. 3 is a cross-sectional side view of another example of a substrate support assembly including a printed circuit board secured to a base plate of the substrate support assembly.

[0057] [Figure 4A] FIG. 4A shows a cross-sectional view and a top view of an example of metal terminals disposed within a ceramic plate of a substrate support assembly and wires connected to the terminals. [Figure 4B]FIG. 4B shows a cross-sectional view and a top view of an example of metal terminals disposed within a ceramic plate of a substrate support assembly and wires connected to the terminals. [Figure 4C] FIG. 4C shows a cross-sectional view and a top view of an example of metal terminals disposed within a ceramic plate of a substrate support assembly and wires connected to the terminals.

[0058] [Figure 5A] FIG. 5A shows a cross-sectional view and a top view of an example of a metal terminal disposed within a ceramic plate of a substrate support assembly and a wire connected to the terminal by wrapping the wire around an opening in the terminal. [Figure 5B] FIG. 5B shows a cross-sectional view and a top view of an example of a metal terminal disposed within a ceramic plate of a substrate support assembly and a wire connected to the terminal by wrapping the wire around an opening in the terminal. [Figure 5C] FIG. 5C shows a cross-sectional view and a top view of an example of a metal terminal disposed within a ceramic plate of a substrate support assembly and a wire connected to the terminal by wrapping the wire around an opening in the terminal.

[0059] [Figure 6A] FIG. 6A is a side cross-sectional view of an example metal terminal including an elongated opening with a wire wrapped around the opening in accordance with the present disclosure.

[0060] [Figure 6B] FIG. 6B is a cross-sectional side view of the metal terminal of FIG. 6A disposed within a ceramic plate of a substrate support assembly.

[0061] [Figure 6C] FIG. 6C shows the wire of FIG. 6B twisted in accordance with the present disclosure.

[0062] [Figure 6D] FIG. 6D shows twisted wires soldered to terminals according to the present disclosure.

[0063] [Figure 7A] FIG. 7A illustrates soldering twisted wires to terminals using hand soldering in accordance with the present disclosure.

[0064] [Figure 7B] FIG. 7B illustrates soldering of twisted wires to terminals using a reflow process in accordance with the present disclosure.

[0065] In the drawings, reference numbers may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0066] The substrate support assembly includes a base plate and a ceramic plate. The base plate is made of a metal, such as aluminum, or a composite material containing multiple different materials. The ceramic plate is disposed on the base plate and includes several layers of ceramic material. Various electrical components, such as heaters, sensors, and electrodes, are disposed on the ceramic layers. These components are connected by wires that run from the ceramic plate through the base plate to a printed circuit board (PCB) that is disposed on an equipment plate below the base plate. The PCB is connected to a power supply and control circuit that is remote and external to the substrate support assembly. The PCB provides signals from the sensors in the ceramic plate to the power supply and control circuit. Based on the signals, the power supply and control circuit provides power and control signals to the components via the PCB.

[0067] Fabricating the connection between the wire and the ceramic plate poses significant challenges. Specifically, metal terminals are placed on the bottom of the ceramic plate. The terminals are connected to components within the ceramic plate. Wires are soldered to the terminals. The wires then run through the base plate and connect to the PCB on the bottom of the base plate. The wires are soldered to the terminals using either hand soldering and / or a reflow oven. This approach presents many challenges, especially when soldering at high temperatures above 200°C.

[0068] Manually attaching wires to terminals with a soldering iron becomes impractical, especially when using solder materials that melt at temperatures above 270°C. While a solder reflow process can be used instead, it requires complex mounting to support the wire as it enters the reflow oven. Such mounting creates problems with manufacturing yield and component reliability.

[0069] For example, to accommodate the additional thermal mass of the fixture, the reflow process must be performed at a relatively high temperature and for a relatively long time. Long exposure to relatively high temperatures can induce aging of the solder joints and promote the formation of intermetallic compounds, which reduce the strength of the solder joints and reduce their reliability during board processing. Soldering must be performed in an inert environment. The manual nature of the process introduces manufacturing variability, leading to frequent wire disconnection issues and costly scrapping of the entire board support assembly.

[0070] Furthermore, many substrate processes are performed at relatively high temperatures, and the substrate support assembly is exposed to a wide temperature range (e.g., from -20°C to 200°C) during substrate processing. Consequently, maintaining mechanical stability and electrical contact between the wire and ceramic plate throughout the life of the substrate support assembly also presents significant challenges.

[0071] The present disclosure provides a method for soldering a metal terminal using a reflow process, followed by attaching a wire to the terminal in a specific manner, as detailed below. The terminal is designed with an opening for threading the wire. After the wire is threaded, it is folded back so that the fold is at the center of the wire. The wire is then twisted to ensure good mechanical stability and electrical contact with the terminal. Materials such as silver epoxy and / or solder are optionally used at the contact points to improve electrical contact between the wire and terminal.

[0072] An advantage of this method is that the wire attachment can be reliably performed at a much lower temperature than the reflow process. This method ensures electrical contact, mechanical strength, and a high degree of manufacturability and repeatability. This method improves manufacturing yield, component reliability, and field repeatability, and reduces the cost of the substrate support assembly. These and other features of the present disclosure are described in detail below.

[0073] This disclosure is organized as follows: First, an example of a substrate processing system that can use a substrate support assembly manufactured according to the present disclosure is shown and described with reference to Figures 1A and 1B. Then, an example of a cross section of a substrate support assembly is shown and described with reference to Figure 2 to illustrate various electrical components disposed within the ceramic plate of the substrate support assembly. Then, an example of a substrate support assembly including a PCB disposed on the bottom of a base plate of the substrate support assembly is shown and described with reference to Figure 3 to illustrate the connection of various electrical components disposed within the ceramic plate of the substrate support assembly to the PCB.

[0074] Next, examples of metal terminals disposed within ceramic plates of a substrate support assembly and wires connected to the terminals are shown and described with reference to Figures 4A-5C. Examples of new terminal designs and novel methods for connecting wires to the new terminals according to the present disclosure are shown and described with reference to Figures 6A-6D. Examples of methods for soldering wires to terminals according to the present disclosure are shown and described with reference to Figures 7A-7B.

[0075] 1A illustrates an example of a substrate processing system 10 that uses inductively coupled plasma to etch substrates, such as semiconductor wafers, according to the present disclosure. The substrate processing system 10 includes a coil driver circuit 11. In some examples, the coil driver circuit 11 includes an RF source 12, a pulsing circuit 14, and a tuning circuit (i.e., matching circuit) 13. The pulsing circuit 14 controls the transformer-coupled plasma (TCP) envelope of the RF signal generated by the RF source 12, varying the duty cycle of the TCP envelope between 1% and 99% during operation. The pulsing circuit 14 and the RF source 12 can be combined or separate.

[0076] Tuning circuit 13 may be connected directly to induction coil 16. While substrate processing system 10 uses a single coil, some substrate processing systems use multiple coils (e.g., an inner coil and an outer coil). Tuning circuit 13 tunes the output of RF source 12 to a desired frequency and / or a desired phase and matches the impedance of induction coil 16.

[0077] The dielectric window 24 is disposed along the top surface of the processing chamber 28. The processing chamber 28 includes a substrate support (or pedestal) 30 for supporting a substrate 34. The substrate support 30 may include an electrostatic chuck (ESC), a mechanical chuck, or other types of chuck. The substrate support 30 includes a base plate 32. A ceramic plate 33 is disposed on the top surface of the base plate 32. A thermal resistance layer 36 may be disposed between the ceramic plate 33 and the base plate 32. The substrate 34 is disposed on the ceramic plate 33 during processing.

[0078] A heater array 35 including multiple heaters is disposed within the ceramic plate 33 to heat the substrate 34 during processing. For example, the heater array 35 may include printed resistive traces embedded in the ceramic plate 33. One or more additional heaters (not shown), referred to as zone heaters or primary heaters, may be disposed above or below the heater array 35. Additionally, although not shown, one or more temperature sensors may be disposed within the ceramic plate 33. Electrical connections to these components within the ceramic plate 33 are shown and described with reference to Figures 6A-6D.

[0079] The base plate 32 further includes a cooling system 38 for cooling the substrate support 30. The cooling system 38 uses a fluid supplied by a fluid delivery system 39 to cool the substrate support 30. For example, the cooling system 38 includes cooling channels through which fluid from the fluid delivery system 39 is channeled to cool the substrate support 30.

[0080] Process gases are supplied to the processing chamber 28 and a plasma 40 is generated within the processing chamber 28. The plasma 40 etches the exposed surface of the substrate 34. An RF source 50, a pulsing circuit 51, and a bias matching circuit 52 may be used to provide a bias to the substrate support 30 and control ion energy during processing.

[0081] A gas delivery system 56 may be used to supply a process gas mixture to the processing chamber 28. The gas delivery system 56 may include a process gas and inert gas source 57, a gas metering system 58, such as valves and mass flow controllers, and a manifold 59. A gas injector 63 may be positioned at the center of the dielectric window 24 and used to inject the gas mixture from the gas delivery system 56 into the processing chamber 28. Additionally or alternatively, the gas mixture may be injected from the side of the processing chamber 28.

[0082] A temperature controller 64 may be connected to the heater array 35, the zone heaters, and the temperature sensors in the ceramic plate 33. The temperature controller 64 may be used to control the heater array 35 and the zone heaters to control the temperature of the substrate support 30 and the substrate 34. The temperature controller 64 may be in communication with a fluid delivery system 39 to control the flow of fluid through a cooling system 38 to cool the substrate support 30.

[0083] The exhaust system 65 includes valves 66 and pumps 67 for controlling the pressure within the processing chamber 28 and / or for removing reactants from the processing chamber 28 by purging or evacuation. A controller 70 may be used to control the etching process. The controller 70 controls the components of the substrate processing system 10. The controller 70 monitors system parameters and controls the delivery of gas mixtures, striking, maintaining, and extinguishing the plasma, removing reactants, providing coolant, etc. Additionally, the controller 70 may control various aspects such as the coil driver circuit 11, the RF source 50, and the bias matching circuit 52.

[0084] 1B illustrates another example of a substrate processing system 100 including a processing chamber 102 configured to generate a capacitively coupled plasma. While this example is described in the context of plasma-enhanced chemical vapor deposition (PECVD), the teachings of the present disclosure may be applied to other types of substrate processing, such as atomic layer deposition (ALD), plasma-enhanced ALD (PEALD), CVD, or even other processes involving etching.

[0085] The substrate processing system 100 includes a processing chamber 102 that surrounds the other components of the substrate processing system 100 and contains an RF plasma (if used). The processing chamber 102 includes an upper electrode 104 and an electrostatic chuck (ESC) 106 or other type of substrate support. During operation, a substrate 108 is placed on the ESC 106.

[0086] For example, the upper electrode 104 may include a gas distribution apparatus 110, such as a showerhead, for introducing and distributing process gases into the processing chamber 102. The gas distribution apparatus 110 may include a stem portion including one end connected to the top surface of the processing chamber 102. The base portion of the showerhead is generally cylindrical and extends radially outward from the opposite end of the stem portion at a location spaced from the top surface of the processing chamber 102. The substrate-facing surface or faceplate of the showerhead base portion includes a plurality of outlets or features (e.g., slots or through-holes) through which vaporized precursors, process gases, cleaning gases, or purge gases flow.

[0087] The ESC 106 includes a base plate 112 that functions as a bottom electrode. A ceramic plate 114 is disposed on the top surface of the base plate 112. A thermal resistance layer 116 may be disposed between the ceramic plate 114 and the base plate 112. The ceramic plate 114 includes a heater array 152 according to the present disclosure for heating the substrate 108. The heater array 152 includes printed resistive traces embedded in the ceramic plate 114. One or more additional heaters (not shown), referred to as zone heaters or primary heaters, may be disposed above or below the heater array 152. Additionally, although not shown, one or more temperature sensors may be disposed within the ceramic plate 114.

[0088] The base plate 112 further includes a cooling system 118 for cooling the ESC 106. The cooling system 118 cools the ESC 106 using fluid supplied from the fluid delivery system 154. For example, the cooling system 118 includes cooling channels through which the fluid from the fluid delivery system 154 is flowed to cool the ESC 106.

[0089] When a plasma is used, an RF generation system (or RF source) 120 generates and outputs an RF voltage to one of the upper electrode 104 and the lower electrode (e.g., the base plate 112 of the ESC 106). The other of the upper electrode 104 and the base plate 112 may be DC grounded, AC grounded, or ungrounded. For example, the RF generation system 120 may include an RF generator 122 that generates RF power that is supplied to the upper electrode 104 or the base plate 112 by a match and distribution network 124. In other examples, not shown, a plasma may be inductively or remotely generated and then supplied to the processing chamber 102.

[0090] Gas delivery system 130 includes one or more gas sources 132-1, 132-2, ... 132-N (collectively gas sources 132), where N is an integer greater than 0. Gas sources 132 are connected to manifold 140 by valves 134-1, 134-2, ... 134-N (collectively valves 134) and mass flow controllers 136-1, 136-2, ... 136-N (collectively mass flow controllers 136). Vapor delivery system 142 supplies vaporized precursors to manifold 140 or a separate manifold (not shown) connected to processing chamber 102. The output of manifold 140 is supplied to processing chamber 102. Gas sources 132 may supply process gases, cleaning gases, or purge gases.

[0091] A temperature controller 150 may be connected to the heater array 152, the zone heaters, and the temperature sensors in the ceramic plate 114. The temperature controller 150 may be used to control the heater array 152 and the zone heaters to control the temperature of the ESC 106 and the substrate 108. The temperature controller 150 may be in communication with a fluid delivery system 154 to control the flow of fluid through the cooling system 118 to cool the ESC 106.

[0092] A valve 156 and a pump 158 may be used to evacuate reactants from the processing chamber 102. A system controller 160 controls the components of the substrate processing system 100.

[0093] FIG. 2 is a cross-sectional view of an example of a substrate support assembly 250 including electrical components disposed within the ceramic plate of the substrate support assembly 250. The substrate support assembly 250 includes a base plate 252 and a ceramic plate 260. For example, the base plate 252 is made of a metal such as aluminum. The base plate 252 is similar to the base plates 32 and 112 shown in FIGS. 1A and 1B. The ceramic plate 260 is similar to the ceramic plates 33 and 114 shown in FIGS. 1A and 1B. A thermal resistance layer 262 (similar to elements 36 and 116 shown in FIGS. 1A and 1B) may be disposed between the ceramic plate 260 and the base plate 252. The base plate 252 includes a cooling system 254 similar to the cooling systems 38 and 118 shown in FIGS. 1A and 1B.

[0094] The ceramic plate 260 includes several laminated layers of ceramic material. A clamping electrode 270 is disposed on a first layer 272, which is the top layer on which a substrate (e.g., element 34 or 108 shown in FIGS. 1A and 1B) is disposed during processing. A plurality of heaters 273 are disposed in a matrix or array on a second layer 274 below the first layer 272. A first set of conductors 275 is disposed on a third layer 276. A second set of conductors 277 and a switch (e.g., a diode) 279 are disposed on a fourth layer 278. A first terminal of the switch 279 is directly connected to the second set of conductors 277. A via 280 directly connects a first terminal of the heater 273 to the first set of conductors 275. A via 282 connects a second terminal of the heater 273 to the second terminal of the switch 279.

[0095] One or more additional zone heaters (also referred to as primary heaters) 284 may be disposed within ceramic plate 260. For example, zone heater 284 may be disposed above heater 273 and below clamping electrode 270 (e.g., in first layer 272). Alternatively, zone heater 284 may be disposed below heater 273 (e.g., in fifth layer 290 of ceramic plate 260). Although not shown, one or more temperature sensors may be disposed in one or more layers of ceramic plate 260. Electrical connections to these components within ceramic plate 260 are shown and described with reference to Figures 6A-6D.

[0096] 3 shows an example of a substrate support assembly 300 including a PCB secured to the substrate support assembly 300 and a fixture plate 306. The substrate support assembly 300 includes a base plate 302, a heating plate 304, a ceramic plate 305, and the fixture plate 306. The base plate 302 includes a plurality of cooling channels 308. The heating plate 304 includes a main heater (e.g., element 284 shown in FIG. 2) and a plurality of micro-heaters (e.g., element 273 shown in FIG. 2). One or more temperature sensors (not shown) are disposed on the ceramic plate 305 and the base plate 302.

[0097] In the illustrated example, a first PCB 310 is secured to the bottom of the base plate 302. A second PCB 312 is secured to the equipment plate 306. The first PCB 310 contains electrical connections to the heaters and sensors, and includes power and signal distribution hardware. The second PCB 312 interfaces with the first PCB 310 and is also referred to as a multiplexer or MUX PCB. The second PCB 312 is connected to the power and control circuitry 330.

[0098] The power supply and control circuit 330 supplies power to the second PCB 312. The first PCB 310 receives power from the second PCB 312 and supplies power to the heaters in the heating plate 304. The first PCB 310 receives signals from the temperature sensors. The second PCB 312 receives signals from the first PCB 310 and supplies the signals to the power supply and control circuit 330. The power supply and control circuit 330 controls power to the heaters in the heating plate 304 and the flow of coolant through the cooling channels 308 based on signals from the temperature sensors located in the ceramic plate 305 and the base plate 302.

[0099] The first PCB 310 and the second PCB 312 are connected to each other by a plurality of spring-loaded pin connections 320. The pin connections 320 are disposed on the second PCB 312. The first PCB 310 includes a plurality of pads (not shown). Tips of the pin connections 320 contact corresponding pads on the first PCB 310.

[0100] A plurality of metal terminals 318 are disposed on the bottom of the ceramic plate 305. The terminals 318 are shown and described with reference to FIGS. 4A-6D (as elements 400 and 500). The terminals 318 are connected to various electrical components (e.g., heaters, sensors, electrodes) disposed within the ceramic plate 305. Examples of components are already shown in FIG. 2 and are omitted here to illustrate the connection of the components to the PCB. Wires are also shown and described with reference to FIGS. 4A-6D (as elements 408 and 508), but are connected to the terminals 318. The wires run through the base plate 302 and are connected to the first PCB 310 at 314.

[0101] 4A-4C show cross-sectional views of a portion of ceramic plate 305 indicated by the dotted circle in FIG. 3, including terminal 318 and wires connected to terminal 318. All elements are shown inverted (i.e., upside down). That is, in use, ceramic plate 305 would be mounted facing downwards rather than upwards as shown, and the terminals and wires would extend downwards rather than upwards as shown. A top view is shown below each cross-sectional view.

[0102] In FIG. 4A , a metal terminal 400 is disposed within a slot 402 in the bottom of a ceramic plate 305 (again, shown upside down). A plurality of terminals 400 are disposed within respective slots 402 in the bottom of the ceramic plate 305. By way of example only, the terminal 400 is shown as T-shaped. The terminal 400 may have any other shape. Additionally, by way of example only, the legs (i.e., vertical portion) and base (i.e., horizontal portion) of the T-shaped terminal 400 are shown as cylindrical. These elements of the terminal 400 may have any other shape. Non-limiting examples of other shapes include hexagonal, square, rectangular, triangular, etc. The shape of the slot 402 may be similar to the shape of the terminal 400.

[0103] The base portion of terminal 400 is soldered to a conductor (not shown) disposed within ceramic plate 305 using a reflow process. The solder material is indicated at 404. The conductor is connected to a component (e.g., a heater, sensor, or electrode; see FIG. 2 ) within ceramic plate 305. By soldering terminal 400 to the conductor within ceramic plate 305, terminal 400 is connected to a component (e.g., a heater, sensor, or electrode) within ceramic plate 305.

[0104] The vertical portion of terminal 400 includes an opening (or through-hole) 406 through which wire 408 is threaded, as shown in FIG. 4B. In FIG. 4C, wire 408 is soldered to terminal 400 using a hand soldering or reflow process, as described above. The solder material is shown generally at 410. The size and shape of the illustrated solder material 410 are not representative and are for illustrative purposes only. Soldering processes present several of the challenges discussed above. Additionally, the manual nature of these processes introduces manufacturing variability, leading to frequent wire disconnection issues and scrapping of the entire substrate support assembly.

[0105] 5A-5C show how wire 408 can be wrapped one or more times after it is threaded through opening 406 to alleviate the problem of wire dislodgment. Again, all elements are shown inverted (i.e., upside down), with top views shown below each cross-sectional view.

[0106] 5A, wire 408 is threaded through opening 406 and wrapped one or more times around opening 406 at the distal end of the vertical portion of terminal 400. Wire 408 is threaded after terminal 400 is soldered to ceramic plate 305, as shown and described below with reference to FIG.

[0107] 5B, a base portion of terminal 400 is placed in slot 402 in ceramic plate 305 and soldered to a conductor (not shown) located within ceramic plate 305 using a reflow process. The solder material is indicated at 404. The conductor is connected to a component (e.g., a heater, sensor, or electrode; see FIG. 2 for an example) within ceramic plate 305. By soldering terminal 400 to the conductor within ceramic plate 305, terminal 400 is connected to the component (e.g., a heater, sensor, or electrode) within ceramic plate 305.

[0108] In Figure 5C, wire 408 is threaded and wrapped as shown and described above with reference to Figure 5A, but may or may not be soldered to terminal 400 using hand soldering or a reflow process as described above. The solder material is shown generally at 412. The size and shape of solder material 412 are not actual and are for illustrative purposes only.

[0109] In Figure 5C, wire 408 is threaded and wrapped as shown and described above with reference to Figure 5A, but may be reinforced with conductive epoxy to enhance mechanical and electrical contact with terminal 400. The conductive epoxy material is shown generally at 412. The size and shape of conductive epoxy 412 are not actual and are for illustrative purposes only.

[0110] With this design of terminal 400, solder material 412 tends to spread to almost completely cover opening 406, often leaving only a small gap 414 in opening 406 unfilled with solder material 412. In some instances, solder material 412 may flow further to contact the base portion of terminal 400 without leaving a gap 414. This spreading of solder material 412 allows heat transfer from the base portion of terminal 400, which conducts heat from ceramic plate 305, to the distal end of the vertical portion of terminal 400 and wire 408. Heat transfer from ceramic plate 305 to wire 408 can adversely affect thermal uniformity and the mechanical stability of the connection of wire 408 to terminal 400.

[0111] 6A-6D illustrate an example of a terminal design and a method for connecting a wire to the terminal according to the present disclosure. This design overcomes the initial manufacturing problems and the subsequent wire dislodgment problem described above. Specifically, the terminal includes an elongated opening in the vertical portion of the terminal, thus acting as a thermal choke that thermally isolates the wire from the ceramic plate. The wire is wrapped around the terminal opening one or more times at the distal end of the vertical portion of the terminal and then twisted. The wrapping and twisting of the wire ensures mechanical stability and electrical contact between the wire and the terminal. Optionally, although not necessary after the wrapping and twisting of the wire, solder or conductive epoxy can be used to further reinforce and strengthen the electrical contact. The solder or epoxy can be deposited using a process described below with reference to FIGS. 7A and 7B so that the solder or epoxy does not degrade the thermal closure characteristics of the terminal, while the wire remains thermally isolated from the ceramic plate.

[0112] 6A shows a terminal 500 similar to terminal 400, except that the opening 506 of terminal 500 is elongated along the length of the vertical portion of terminal 500. The size and shape of the opening 506 shown are for illustrative purposes only, and other sizes and shapes are contemplated. Non-limiting examples of such shapes include oval and elliptical, rectangular, etc. The vertical portion of terminal 500 is longer than the base portion of terminal 500. The opening 506 extends along the length of the vertical portion of terminal 500 from the point where the vertical portion begins to extend from the base portion to the distal end of the vertical portion.

[0113] By way of example only, terminal 500 may be T-shaped. By way of example only, the base and vertical portions of terminal may be cylindrical, with the vertical portion extending perpendicularly from the base portion, and the base portion having a longer radius (i.e., larger diameter) and a shorter height than the vertical portion. Alternatively, like terminal 400, terminal 500 may be any other shape as described above with reference to terminal 400, the description of which will not be repeated for the sake of brevity.

[0114] Terminal 500 is made of a material having a coefficient of thermal expansion (CTE) that closely matches the CTE of ceramic plate 305. Specifically, terminal 500 is made of a material having a first CTE that is within a predetermined range of the second CTE of ceramic plate 305. For example, terminal 500 is made of a mixture of tungsten and copper. Additionally, terminal 500 may be coated with nickel to facilitate and strengthen bonding of a solder material to terminal 500. Wire 508 is threaded and wrapped around opening 506, as described below with reference to FIG. 6B. Wire 508 is twisted, as shown and described below with reference to FIG. 6C.

[0115] In FIG. 6B , terminal 500 is positioned in slot 402 in ceramic plate 305. The base of terminal 500 is soldered to ceramic plate 305 using a reflow process, similar to terminal 400. The solder material is indicated at 404. Wire 508 is threaded through opening 506 and folded back so that the folding point is in the center of wire 508 (i.e., near the middle of its length). Thus, two halves of wire 508 extend from the distal end of the vertical portion of terminal 500. These two halves of wire 508 are wrapped around opening 506 and the distal end of the vertical portion of terminal 500, as described below, and then twisted as shown in FIG. 6C to ensure mechanical stability and electrical contact between wire 508 and terminal 500.

[0116] 6B , after threading and folding the wire 508 and before twisting the wire 508, the wire 508 is wrapped or entangled around the opening 506 of the terminal 500 as follows: For example, the wire 508 can be wrapped around the opening 506 one or more times. In some examples, the wire 508 is wrapped around the opening 506 at least multiple times. In some examples, instead of or in addition to wrapping, the wire 508 can be tied around the opening 506 one or more times using a simple knot. Any type of knot can be used. For example, any type of knot used for tying shoelaces can be used. In some examples, one or more knots can be tied around the opening 506 before or after wrapping the wire 508 around the opening 506 one or more times. In some examples, a combination of one or more knots and one or more loops can be used, in any order. Twisting the wire 508 around the opening 506 after wrapping (and / or knotting) ensures mechanical stability and electrical contact between the wire 508 and the terminal 500 .

[0117] For example, the wire 508 may be a single-strand wire or a multi-strand wire. The gauge of the wire 508 may depend on the current supplied through the wire 508. For example, the wire 508 used to power the heater may be of a heavier gauge than the wire 508 connected to the temperature sensor. The material of the wire 508 is malleable so that the mechanical stress during wrapping / tying and twisting of the wire 508 does not cause the wire 508 to break. For example, the wire 508 may be made of copper coated with silver.

[0118] Because the wire 508, which is wrapped and / or tied around the opening 506 at the distal end of the vertical portion of the terminal 500, does not contact the base portion of the terminal 500 and is thermally isolated from the base portion of the terminal 500 by the elongated opening 506, only a relatively small amount of heat conducted from the ceramic plate 305 by the base portion of the terminal 500 is conducted to the wire 508 during substrate processing. For example, the temperature of the ceramic plate 305 may be approximately 200°C, while the temperature of the wire 508 may be approximately 70-80°C. In other words, only about one-third (i.e., approximately 35%) of the heat conducted from the ceramic plate 305 by the base portion of the terminal 500 is conducted to the wire 508 during substrate processing. In this manner, the terminal 500 thermally isolates the wire 508 from the ceramic plate 305, and the terminal 500 with the elongated opening 506 functions as a thermal choke.

[0119] Because a lower or partial amount of heat is transferred from the ceramic plate 305 to the wires 508 during substrate processing, the heat from the ceramic plate 305 does not adversely affect the connection of the wires 508 to the terminals 500. As a result, the connection between the wires 508 and the terminals 500 remains intact throughout the life of the substrate support assembly without the problem of the wires becoming dislodged. Because the wires 508 remove a limited amount of heat from the ceramic plate 305, this design provides the additional benefit of enhancing thermal uniformity across the ceramic plate 305.

[0120] 6C, the two halves of wire 508 are twisted (i.e., braided) as shown. The twisting action may be performed using a drill, a power screwdriver, or a specialized wire twister. The twist in wire 508 extends from the end of wire 508 to the distal end of the vertical portion of terminal 500 where wire 508 is wrapped around opening 506. This wrapping and twist ensures mechanical stability and electrical contact between wire 508 and terminal 500.

[0121] The distal ends of the wires 508 run through a base plate (e.g., element 302 shown in FIG. 3) and connect to a circuit (e.g., element 310 shown in FIG. 3), which communicates via the wires 508 and the terminals 500 with a component (e.g., a heater, sensor, or electrode shown in FIG. 2) connected to the base portion of the terminals 500.

[0122] 6D, electrical bonding material 512, such as solder and / or conductive epoxy, may optionally be deposited at the contact points between wire 508 and terminal 500 to enhance mechanical stability and electrical contact between wire 508 and terminal 500. Material 512 is shown schematically. The size and shape of material 512 are not actual and are for illustrative purposes only.

[0123] Only a small amount of material 512 needs to be used because the contact of wire 508 with terminal 500 is already strong by wrapping and / or knotting and twisting wire 508 around opening 506. For example, if used, material 512 can be deposited by hand soldering at a relatively low temperature, as described below with reference to Figure 7A. Alternatively, a reflow process can be used, as described below with reference to Figure 7B.

[0124] Furthermore, because only a small amount of material 512 is used, material 512 does not spread / flow toward the base portion of terminal 500 and fill opening 506. For example, at least 80-90% of opening 506 is free of material 512. Material 512 remains localized at the contact point between wire 508 and terminal 500 (i.e., around the distal end of the vertical portion of terminal 500). As a result, terminal 500 continues to operate as a thermal choke, and wire 508 remains thermally isolated from ceramic plate 305 after material 512 is deposited.

[0125] 7A and 7B show examples of how wire 508 can be soldered to terminal 500 after wrapping / tying and twisting wire 508 around opening 506 as described above. FIG. 7A shows an example of hand soldering. FIG. 7B shows an example of a reflow process. Either method bonds wire 508 to terminal 500, as shown in FIG. 6D.

[0126] In Figure 7A, a soldering iron is used to solder wire 508 to terminal 500. The tip of the soldering iron is positioned (e.g., at position 550) close to (e.g., about 1-2 cm above) the top of the vertical portion of terminal 500. A small amount of solder is placed on the tip to warm wire 508 close to (e.g., about 1-2 cm above) the top of the vertical portion of terminal 500 (e.g., at position 550). The solder wire is positioned to contact wire 508 near the top of the vertical portion of terminal 500 below the tip (e.g., at position 552).

[0127] Once the solder thread melts, it is forced onto the wire 508, allowing it to penetrate or saturate the wire 508, until the solder reaches the top (i.e., distal) end of the vertical portion of the terminal 500. Soldering continues until the solder penetrates or saturates the loop / knot of the wire 508 around the opening 506 in the terminal 500. At this point, the soldering of the wire 508 to the terminal 500 is complete, and the wire 508 is joined to the terminal 500, as shown in FIG. 6D. For example, the solder thread can include SAC305 (96.5% Sn + 3.0% Ag + 0.5% Cu) or Sn3.5Ag (96.5% Sn + 3.5% Ag) solder.

[0128] In FIG. 7B, a paste of solder material (e.g., SAC305) is applied to a portion 554 of the wire 508 above the top of the vertical portion of the terminal 500 and to the top (i.e., distal) end of the vertical portion of the terminal 500. Care is taken to ensure that the solder paste does not reach the base of the terminal 500. The ceramic plate is then placed in a reflow oven and subjected to a reflow process at an appropriate temperature to melt the solder paste. At this point, the loop / knot of the wire 508 around the opening 506 of the terminal 500 has been saturated or permeated with solder, completing the soldering of the wire 508 to the terminal 500 and joining the wire 508 to the terminal 500, as shown in FIG. 6D.

[0129] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be embodied in a variety of forms. Thus, while the disclosure includes specific examples, the true scope of the disclosure should not be so limited, as other variations will become apparent from a review of the drawings, the specification, and the following claims.

[0130] It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure can be implemented in any other embodiment and / or combined with features of any other embodiment, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and it is within the scope of the present disclosure to interchange one or more embodiments.

[0131] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms such as "connected," "engaged," "coupled," "adjacent," "next to," "on," "above," "below," and "disposed." Unless expressly described as "direct," when a relationship between first and second elements is described in the above disclosure, the relationship may be a direct relationship where no other intervening elements exist between the first and second elements, but may also be an indirect relationship where one or more intervening elements exist (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C) with a non-exclusive logical OR, and not to mean "at least one of A, at least one of B, and at least one of C."

[0132] In some embodiments, the controller is part of a system, which may be part of the examples described above. Such a system may include semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (e.g., pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of semiconductor wafers or substrates. The electronics, sometimes referred to as a "controller," may control various components or sub-parts of one or more systems.

[0133] The controller may be programmed to control any of the processes disclosed herein, including delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and motion settings, loading and unloading of wafers into and out of the tool, and loading and unloading of wafers into and out of other transport tools and / or load locks connected or interfaced with the particular system, depending on the processing requirements and / or type of system.

[0134] Broadly speaking, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software).

[0135] The program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define operational parameters for performing a particular process on, for, or for a semiconductor wafer or system. The operational parameters, in some embodiments, may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of the wafer.

[0136] The controller, in some embodiments, may be part of or connected to a computer that is integrated into the system, connected to the system, or otherwise networked to the system, or a combination thereof. For example, the controller may be all or part of a "cloud," or fab host computer system, which allows remote access of wafer processing. The computer may allow remote access to the system to monitor the current progress of a manufacturing operation, examine the history of past manufacturing operations, examine trends or performance criteria from multiple manufacturing operations, change parameters of a current process, set processing steps to track a current process, or initiate a new process.

[0137] In some examples, a remote computer (e.g., a server) can provide the process recipe to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that allows for entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is configured to interface with or control.

[0138] Thus, as described above, the controller may be distributed, such as by including one or more individual controllers networked together and operating toward a common purpose, such as the processes and controls described herein. One example of a distributed controller for such purposes is one or more integrated circuits on the chamber that are located remotely (e.g., at the platform level or as part of a remote computer) and communicate with one or more integrated circuits that cooperatively control the processes in the chamber.

[0139] Examples of systems may include, but are not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0140] As described above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used to transport materials to and from tool locations and / or load ports of wafers within a semiconductor fabrication factory. The present disclosure includes the following application examples: [Application example 1] A base plate and a ceramic plate disposed on the base plate, a plurality of slots disposed on a side facing the base plate; a plurality of conductive terminals disposed within the plurality of slots, respectively; Including, Each of the terminals is a base portion connected to the ceramic plate; a second portion extending from the base portion toward the base plate; an opening in the second portion extending from an end of the second portion adjacent the base portion to a distal end of the second portion; Including, Ceramic plate and a plurality of wires, each of the wires passing through the opening of a respective one of the terminals and braided around the distal end of the second portion of a respective one of the terminals; a substrate support assembly including: [Application example 2] A substrate support assembly as described in Application Example 1, wherein each of the wires is wound one or more times around the distal end of the second portion of each of the terminals. [Application example 3] A substrate support assembly according to Application Example 1, further comprising an electrical bonding material deposited on the distal end of the second portion of each of the terminals. [Application example 4] A substrate support assembly according to Application Example 1, wherein the openings in the terminals thermally isolate each of the wires from the ceramic plate during substrate processing. [Application example 5] 10. The substrate support assembly of claim 3, wherein the electrical bonding material comprises a solder material or an epoxy. [Application Example 6] A substrate support assembly according to Application Example 3, wherein the electrical bonding material is localized at the distal end of the second portion of each of the terminals. [Application Example 7] A substrate support assembly according to Application Example 3, wherein the electrical bonding material does not extend to the base portion of the terminal. [Application Example 8] A substrate support assembly according to Application Example 3, wherein the electrical bonding material does not fill the openings of the terminals. [Application Example 9] A substrate support assembly according to Application Example 1, wherein the base portion of the terminal is connected to an electrical component disposed within the ceramic plate. [Application Example 10] A substrate support assembly as described in Application Example 1, wherein the distal end of the wire runs through the base plate and is connected to a circuit arranged along the side of the base plate facing away from the ceramic plate. [Application Example 11] A substrate support assembly as described in Application Example 10, wherein the circuit communicates via the wire with an electrical component disposed within the ceramic plate and connected to the base portion of the terminal. [Application Example 12] A substrate support assembly as described in Application Example 1, wherein each of the terminals is T-shaped, the horizontal portion of the T is the base portion of each of the terminals, and the vertical portion of the T is the second portion of each of the terminals. [Application Example 13] A substrate support assembly according to Application Example 1, wherein, in each of the terminals, the second portion extends perpendicularly from the base portion. [Application Example 14] A substrate support assembly according to Application Example 1, wherein the second portion of each of the terminals is longer than the base portion. [Application Example 15] A substrate support assembly as described in Application Example 1, wherein, in each of the terminals, the base portion and the second portion are cylindrical, and the base portion has a longer radius and a shorter height than the second portion. [Application Example 16] A substrate support assembly as described in Application Example 1, wherein each of the terminals is made of a material having a first thermal expansion coefficient within a predetermined range of the second thermal expansion coefficient of the ceramic plate. [Application Example 17] A substrate support assembly according to Application Example 1, wherein each of the terminals is made of tungsten and copper. [Application Example 18] A substrate support assembly according to Application Example 1, wherein each of the terminals is coated with nickel. [Application Example 19] A substrate support assembly according to Application Example 1, wherein each of the wires is made of a single strand of conductive material. [Application Example 20] A substrate support assembly according to Application Example 1, wherein each of the wires is made of multiple strands of conductive material. [Application Example 21] A substrate support assembly according to Application Example 1, wherein each of the wires is made of copper and coated with silver. [Application Example 22] A substrate support assembly according to Application Example 3, wherein the electrical bonding material comprises a first material including Sn, Ag, and Cu, or a second material including Sn and Ag. [Application Example 23] 1. A method for attaching wires to a ceramic plate of a substrate support assembly, comprising: disposing a plurality of slots on the ceramic plate on a side of the substrate support assembly facing a base plate; disposing a plurality of conductive terminals respectively within the plurality of slots, each of the terminals including a base portion, a second portion extending from the base portion toward the base plate, and an opening in the second portion extending from an end of the second portion adjacent the base portion to a distal end of the second portion; connecting the base portion of the terminal to the ceramic plate; passing each of the wires through the opening in a respective one of the terminals; folding each of the wires into two halves about the distal end; wrapping each of the wires around the distal end; twisting the two halves together from the distal end of the second portion of each of the terminals to the distal ends of the two halves for each of the wires; connecting a plurality of wires to the distal ends of the second portions of the plurality of terminals by A method comprising: [Application Example 24] The method of application example 23, further comprising winding each of the wires multiple times around the distal end of the second portion of each of the terminals. [Application Example 25] The method of application example 23, further comprising depositing an electrical bonding material on the distal end of the second portion of each of the terminals. [Application Example 26] The method described in Application Example 23, further comprising soldering each of the wires to a respective one of the terminals until a solder material is deposited on the distal end of the second portion of each of the terminals and until the solder material has penetrated into a loop around the distal end of the second portion of each of the terminals. [Application Example 27] The method according to Application Example 23, applying solder paste to the distal end of the second portion of each of the terminals and to a portion of each of the wires proximate the distal end of the second portion of each of the terminals; performing a reflow process on the ceramic plate until the solder paste melts; The method further comprises: [Application Example 28] 24. The method of claim 23, wherein the openings in the terminals thermally isolate each of the wires from the ceramic plate during processing of the substrate. [Application Example 29] The method of application example 25, wherein the electrical bonding material comprises a solder material or an epoxy. [Application Example 30] The method of claim 25, further comprising maintaining the electrical bonding material localized at the distal end of the second portion of each of the terminals. [Application Example 31] The method of application example 25, further comprising not extending the electrical bonding material to the base portion of the terminal. [Application Example 32] The method of application example 25, further comprising not filling the opening of the terminal with the electrical bonding material. [Application Example 33] The method described in Application Example 23, further comprising connecting the base portion of the terminal to an electrical component disposed within the ceramic plate by performing a reflow process on the ceramic plate. [Application Example 34] The method according to Application Example 23, running the distal end of the wire through a base plate coupled to the ceramic plate; connecting the distal ends of the wires to circuitry disposed adjacent the base plate; The method further comprises: [Application Example 35] The method described in Application Example 23, wherein each of the terminals is T-shaped, the horizontal portion of the T is the base portion of each of the terminals, and the vertical portion of the T is the second portion of each of the terminals. [Application Example 36] The method of application example 23, wherein in each of the terminals, the second portion extends perpendicularly from the base portion. [Application Example 37] The method of application example 23, wherein in each of the terminals, the second portion is longer than the base portion. [Application Example 38] 24. The method of claim 23, wherein, for each of the terminals, the base portion and the second portion are cylindrical, and the base portion has a longer radius and a shorter height than the second portion. [Application Example 39] 24. The method of claim 23, wherein each of the terminals is made of a material having a first coefficient of thermal expansion within a predetermined range of the second coefficient of thermal expansion of the ceramic plate. [Example 40] 24. The method of claim 23, wherein each of the terminals is made of tungsten and copper. [Application Example 41] The method of application example 23, wherein each of the terminals is coated with nickel. [Application Example 42] 24. The method of claim 23, wherein each of the wires is made of a single strand of conductive material. [Application Example 43] 24. The method of claim 23, wherein each of the wires is made of multiple strands of conductive material. [Example 44] 24. The method of claim 23, wherein each of the wires is made of copper and coated with silver. [Application Example 45] The method according to Application Example 25, wherein the electrical bonding material comprises a first material containing Sn, Ag, and Cu, or a second material containing Sn and Ag.

Claims

1. A base plate and a ceramic plate disposed on the base plate, a plurality of slots disposed on a side facing the base plate; a plurality of conductive terminals disposed within the plurality of slots, respectively; Including, Each of the terminals is a base portion connected to the ceramic plate; a second portion extending from the base portion toward the base plate; an opening in the second portion extending from an end of the second portion adjacent the base portion to a distal end of the second portion; Including, Ceramic plate and a plurality of wires, each of the wires passing through the opening of a respective one of the terminals and braided around the distal end of the second portion of the respective one of the terminals; a substrate support assembly including:

2. 2. The substrate support assembly of claim 1, wherein each of the wires is wrapped one or more times around the distal end of the second portion of the respective terminal.

3. The substrate support assembly of claim 1 , further comprising an electrical bonding material deposited on the distal end of the second portion of each of the terminals.

4. 10. The substrate support assembly of claim 1, wherein the openings in the terminals thermally isolate each of the wires from the ceramic plate during processing of the substrate.

5. The substrate support assembly of claim 3 , wherein the electrical bonding material comprises a solder material or an epoxy.

6. 4. The substrate support assembly of claim 3, wherein the electrical bonding material is localized at the distal end of the second portion of each of the terminals.

7. 4. The substrate support assembly of claim 3, wherein the electrical bonding material does not extend to the base portions of the terminals.

8. 4. The substrate support assembly of claim 3, wherein the electrical bonding material does not fill the openings in the terminals.

9. 2. The substrate support assembly of claim 1, wherein the base portions of the terminals are connected to electrical components disposed within the ceramic plate.

10. 2. The substrate support assembly of claim 1, wherein the distal ends of the wires run through the base plate and are connected to circuitry disposed along a side of the base plate facing away from the ceramic plate.

11. 11. The substrate support assembly of claim 10, wherein the circuitry communicates via the wires with an electrical component disposed within the ceramic plate and connected to the base portion of the terminal.

12. 2. The substrate support assembly of claim 1, wherein each of the terminals is T-shaped, a horizontal portion of the T being the base portion of each of the terminals, and a vertical portion of the T being the second portion of each of the terminals.

13. 2. The substrate support assembly of claim 1, wherein, for each of the terminals, the second portion extends perpendicularly from the base portion.

14. 2. The substrate support assembly of claim 1, wherein the second portion of each of the terminals is longer than the base portion.

15. 2. The substrate support assembly of claim 1, wherein for each of the terminals, the base portion and the second portion are cylindrical, the base portion having a longer radius and a shorter height than the second portion.

16. 2. The substrate support assembly of claim 1, wherein each of the terminals is made of a material having a first coefficient of thermal expansion that is within a predetermined range of a second coefficient of thermal expansion of the ceramic plate.

17. 10. The substrate support assembly of claim 1, wherein each of the terminals is made of tungsten and copper.

18. 10. The substrate support assembly of claim 1, wherein each of the terminals is coated with nickel.

19. 10. The substrate support assembly of claim 1, wherein each of the wires is made from a single strand of conductive material.

20. 10. The substrate support assembly of claim 1, wherein each of the wires is made from multiple strands of conductive material.

21. 10. The substrate support assembly of claim 1, wherein each of the wires is made of copper and is coated with silver.

22. The substrate support assembly of claim 3 , wherein the electrical bonding material comprises a first material comprising Sn, Ag, and Cu, or a second material comprising Sn and Ag.

23. 1. A method for attaching a plurality of wires to a ceramic plate of a substrate support assembly, comprising: disposing a plurality of slots on the ceramic plate on a side of the substrate support assembly facing a base plate; disposing a plurality of conductive terminals respectively within the plurality of slots, each of the terminals including a base portion, a second portion extending from the base portion toward the base plate, and an opening in the second portion extending from an end of the second portion adjacent the base portion to a distal end of the second portion; connecting the base portion of the terminal to the ceramic plate; passing one of the wires through the opening in each of the terminals; folding said one of said wires into two halves around said distal end of said second portion of each of said terminals; wrapping said one of said wires around said distal end; twisting the two halves together from the distal end of the second portion of each of the terminals to the distal ends of the two halves, for each of the wires. connecting a plurality of wires to the plurality of terminals by A method comprising:

24. 24. The method of claim 23, further comprising wrapping each of the wires multiple times around the distal end of the second portion of the respective terminal.

25. 24. The method of claim 23, further comprising depositing an electrical bonding material on the distal end of the second portion of each of the terminals.

26. 24. The method of claim 23, further comprising soldering each of the wires to a respective one of the terminals until solder material is deposited on the distal end of the second portion of each of the terminals and until the solder material has penetrated into a loop around the distal end of the second portion of each of the terminals.

27. 24. The method of claim 23, applying solder paste to the distal end of the second portion of each of the terminals and to a portion of each of the wires proximate the distal end of the second portion of each of the terminals; performing a reflow process on the ceramic plate until the solder paste melts; The method further comprises:

28. 24. The method of claim 23, wherein the openings in the terminals thermally isolate each of the wires from the ceramic plate during processing of a substrate.

29. 26. The method of claim 25, wherein the electrical bonding material comprises a solder material or an epoxy.

30. 26. The method of claim 25, further comprising maintaining the electrical bonding material localized at the distal end of the second portion of each of the terminals.

31. 26. The method of claim 25, further comprising not extending the electrical bonding material to the base portion of the terminal.

32. 26. The method of claim 25, further comprising not filling the openings in the terminals with the electrical bonding material.

33. 24. The method of claim 23, further comprising connecting the base portion of the terminal to an electrical component disposed within the ceramic plate by performing a reflow process on the ceramic plate.

34. 24. The method of claim 23, running the distal end of the wire through a base plate coupled to the ceramic plate; connecting the distal ends of the wires to circuitry disposed adjacent the base plate; The method further comprises:

35. 24. The method of claim 23, wherein each of the terminals is T-shaped, a horizontal portion of the T being the base portion of each of the terminals, and a vertical portion of the T being the second portion of each of the terminals.

36. 24. The method of claim 23, wherein in each of the terminals, the second portion extends perpendicularly from the base portion.

37. 24. The method of claim 23, wherein in each of the terminals, the second portion is longer than the base portion.

38. 24. The method of claim 23, wherein for each of the terminals, the base portion and the second portion are cylindrical, the base portion having a larger radius and a smaller height than the second portion.

39. 24. The method of claim 23, wherein each of the terminals is made of a material having a first coefficient of thermal expansion that is within a predetermined range of a second coefficient of thermal expansion of the ceramic plate.

40. 24. The method of claim 23, wherein each of the terminals is made of tungsten and copper.

41. 24. The method of claim 23, wherein each of the terminals is coated with nickel.

42. 24. The method of claim 23, wherein each of the wires is made from a single strand of conductive material.

43. 24. The method of claim 23, wherein each of the wires is made of multiple strands of conductive material.

44. 24. The method of claim 23, wherein each of the wires is made of copper and coated with silver.

45. 26. The method of claim 25, wherein the electrical bonding material comprises a first material comprising Sn, Ag, and Cu, or a second material comprising Sn and Ag.

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