Mounting order determination method and mounting order determination device

Abstract

To provide a mounting order determination method which can suppress the occurrence of a malfunction such as luminance unevenness due to a difference in characteristics of components while performing efficient component suction that simultaneously suctions components.SOLUTION: A mounting order determination method comprises the steps of: dividing a substrate P into a plurality of areas A; setting a pair of the same type of components E supplied from mutually-different component supply parts 210 to be suctioned by a pair of nozzles 232 arranged at mutually-opposite positions in the plurality of nozzles 232; determining the component E to be mounted at a mounting position P1 such that the pair of components E are mounted in mutually-adjacent areas A in the plurality of areas A and the components E supplied from the same component supply part 210 are not adjacent to each other; and determining a mounting order of mounting the components E on the basis of determination results of the component E to be mounted at the mounting position P1.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a mounting order determination method and a mounting order determination device, and more particularly to a mounting order determination method and a mounting order determination device for determining the mounting order in which components are mounted on a board. [Background technology]

[0002] BACKGROUND ART Conventionally, component mounters that mount components on a board have been known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a component mounter that mounts components on a board. This component mounter includes a multi-nozzle head that mounts components on the board and a tape feeder that supplies components to the multi-nozzle head. This component mounter is configured, for example, to supply LED components using the tape feeder and then mount the supplied LED components on the board using the multi-nozzle head. LED components of the same type are mounted on the board so that they are densely packed together.

[0004] Furthermore, Patent Document 1 also describes that when LED components of the same type are densely mounted, even if the LED components have the same specified characteristics, different brightness levels are perceived by the human eye as different light-emitting states, so it is preferable to use LED components from the same lot, and even more preferably LED components from the same reel. For this reason, the component mounter of Patent Document 1 is configured to determine whether a component is an LED component, and if so, to adopt a condition for mounting only LED components belonging to the same lot. Specifically, when the condition for mounting only LED components belonging to the same lot is adopted, this component mounter is configured to sequentially pick up LED components supplied from the same tape feeder holding LED components from the same lot while moving a multi-nozzle head. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-294091 Summary of the Invention [Problem to be solved by the invention]

[0006] In the component mounter described in Patent Document 1, when the condition for mounting only LED components belonging to the same lot is adopted, the occurrence of brightness unevenness due to differences in the characteristics of the LED components is suppressed by mounting only LED components belonging to the same lot. However, when the condition for mounting only LED components belonging to the same lot is adopted, the component mounter described in Patent Document 1 has the disadvantage that, because only LED components supplied from the same tape feeder are sequentially picked up while moving the multi-nozzle head, it is not possible to efficiently pick up LED components of the same type supplied from different tape feeders at the same time. In this case, there is a problem in that it is difficult to efficiently pick up LED components (components) at the same time while suppressing the occurrence of defects such as brightness unevenness due to differences in the characteristics of the LED components (components).

[0007] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a mounting order determination method and a mounting order determination device that can efficiently pick up components simultaneously, while suppressing the occurrence of defects such as uneven brightness caused by differences in component characteristics. [Means for solving the problem]

[0008] A mounting order determination method according to a first aspect of the present invention is a mounting order determination method for mounting components on a substrate including a plurality of mounting positions where the same type of components are mounted in a regular arrangement, by using a rotary head including a plurality of nozzles arranged circumferentially, the method comprising the steps of: dividing the substrate into a plurality of regions; setting pairs of the same type of components supplied from different component supply units to be picked up by a pair of nozzles arranged at positions facing each other among the plurality of nozzles; determining the components to be mounted at the mounting positions such that the pairs of components are mounted in adjacent regions among the plurality of regions and components supplied from the same component supply unit are not adjacent to each other; and determining the mounting order for mounting the components based on the results of determination of the components to be mounted at the mounting positions.

[0009] As described above, the mounting order determination method according to the first aspect of the present invention includes a step of setting pairs of components of the same type supplied from different component supply units to be picked up by a pair of nozzles positioned opposite each other among a plurality of nozzles. This allows for the setting of pairs of components of the same type supplied from different component supply units, thereby enabling efficient component pickup by simultaneously picking up components of the same type supplied from different component supply units. The method also includes a step of determining components to be mounted at mounting positions such that components supplied from the same component supply unit are not adjacent to each other, and a step of determining a mounting order for the components based on the result of determining the components to be mounted at the mounting positions. By mounting components using the rotary head based on the determined mounting order, components supplied from the same component supply unit can be mounted so that they are not adjacent to each other, thereby preventing components supplied from the same component supply unit from concentrating in one area. As a result, even when mounting components of the same type (e.g., components from different lots) supplied from different component supply units, problems such as uneven brightness caused by differences in component characteristics can be prevented. These results enable efficient component pickup by simultaneously picking up components while preventing problems such as uneven brightness caused by differences in component characteristics.

[0010] While random component mounting may be considered to prevent components supplied from the same component supply unit from concentrating in one area, this approach would require the rotary head to be moved randomly, complicating the movement of the rotary head. As a result, the time required for component mounting would increase. To address this issue, the method includes the steps of determining components to be mounted at their mounting positions so that pairs of components are mounted in adjacent areas among a plurality of areas, and determining a mounting order for the components based on the results of determining the components to be mounted at their mounting positions. By mounting components using the rotary head based on the determined mounting order, pairs of components can be mounted in adjacent areas among a plurality of areas. This reduces the amount of movement of the rotary head compared to when the rotary head is moved randomly. As a result, the increase in the time required for component mounting can be reduced.

[0011] In the above-described mounting order determination method according to the first aspect, the step of dividing the board into a plurality of regions preferably includes the step of dividing the board into a plurality of regions based on the distance between a pair of nozzles. With this configuration, it is possible to easily set a plurality of regions based on the distance between the pair of nozzles so as to reduce the movement of the rotary head when mounting pairs of components, and therefore it is possible to easily suppress an increase in the time required for mounting components.

[0012] In this case, preferably, the step of dividing the board into a plurality of regions includes the step of dividing the board into a plurality of regions such that the distance between corresponding mounting positions in adjacent regions is a value close to the distance between a pair of nozzles. With this configuration, the distance between corresponding mounting positions in adjacent regions is a value close to the distance between a pair of nozzles, making it easier to set a plurality of regions that reduces the movement of the rotary head when mounting pairs of components, and therefore making it easier to prevent an increase in the time required for component mounting.

[0013] In the above-described configuration in which each of the plurality of regions has a width close to the distance between the pair of nozzles, preferably, the step of dividing the substrate into the plurality of regions includes a step of dividing the substrate into the plurality of regions so as to include a termination region at an end of the substrate having a width smaller than the distance between the pair of nozzles, and the step of determining the components to be mounted at the mounting positions includes a step of determining the components to be mounted at the mounting positions of the termination region. With this configuration, even if it is not possible to ensure a width close to the distance between the pair of nozzles at the end of the substrate when dividing the substrate into the plurality of regions, by setting a termination region having a width smaller than the distance between the pair of nozzles, it is possible to divide the substrate into the plurality of regions and determine the components to be mounted at the mounting positions of the termination region.

[0014] In the mounting order determination method according to the first aspect, the step of dividing the board into a plurality of regions preferably includes the step of extracting corresponding mounting positions in adjacent regions, and the step of determining the components to be mounted at the mounting positions includes the step of determining the components to be mounted at the mounting positions such that pairs of components are mounted at the extracted corresponding mounting positions. With this configuration, pairs of components can be mounted at corresponding mounting positions that require a short moving distance of the rotary head, making it even easier to suppress an increase in the time required for mounting components.

[0015] In the mounting order determination method according to the first aspect, the step of determining the components to be mounted at the mounting positions preferably includes the steps of acquiring an arrangement of the same type of components supplied from different component supply units, randomly permuting the acquired order of the component arrangements, and allocating the components to the mounting positions in the permuted order of the component arrangements. With this configuration, components can be randomly allocated to the mounting positions, making it easy to prevent components supplied from the same component supply unit from concentrating in one area.

[0016] In the above-described mounting order determination method according to the first aspect, the components preferably include LED components. With this configuration, when LED components are used, it is possible to efficiently pick up the components simultaneously, while suppressing the occurrence of uneven brightness due to differences in the characteristics of the components.

[0017] A mounting order determination device according to a second aspect of the present invention is a mounting order determination device for mounting components on a substrate including a plurality of mounting positions where components of the same type are mounted in a regular arrangement, using a rotary head including a plurality of nozzles arranged circumferentially, and includes a control unit, which performs the following processes: dividing the substrate into a plurality of regions; setting pairs of components of the same type supplied from different component supply units to be picked up by a pair of nozzles arranged at positions facing each other among the plurality of nozzles; determining components to be mounted at the mounting positions such that the pairs of components are mounted in adjacent regions among the plurality of regions and components supplied from the same component supply unit are not adjacent to each other; and determining the mounting order for mounting the components based on the results of determination of the components to be mounted at the mounting positions.

[0018] As described above, the mounting order determination device according to a second aspect of the present invention includes a process for setting pairs of components of the same type supplied from different component supply units to be picked up by a pair of nozzles positioned opposite each other among the multiple nozzles. This allows for the setting of pairs of components of the same type supplied from different component supply units, thereby enabling efficient component pickup by simultaneously picking up components of the same type supplied from different tape feeders. The device also includes a process for determining components to be mounted at mounting positions so that components supplied from the same component supply unit are not adjacent to each other, and a process for determining the mounting order for the components based on the results of determining the components to be mounted at the mounting positions. By mounting components using the rotary head based on the determined mounting order, components supplied from the same component supply unit can be mounted so that they are not adjacent to each other, thereby preventing components supplied from the same component supply unit from concentrating in one area. As a result, even when mounting components of the same type (e.g., components from different lots) supplied from different component supply units, problems such as uneven brightness caused by differences in component characteristics can be prevented. These results enable efficient component pickup by simultaneously picking up components while preventing problems such as uneven brightness caused by differences in component characteristics. [Effects of the Invention]

[0019] According to the present invention, as described above, it is possible to efficiently pick up components simultaneously, while suppressing the occurrence of problems such as uneven brightness caused by differences in the characteristics of the components. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 illustrates a component mounting system according to an embodiment. [Figure 2] 1 is a diagram illustrating a component mounting apparatus according to an embodiment. [Figure 3] FIG. 1 illustrates a component supply unit according to one embodiment. [Figure 4]FIG. 2 illustrates a head unit according to one embodiment. [Figure 5] FIG. 1 illustrates a substrate according to one embodiment. [Figure 6] 1A and 1B are diagrams illustrating division of a substrate into a plurality of regions according to an embodiment. [Figure 7] 10A and 10B are diagrams for explaining setting of components to be picked up simultaneously according to one embodiment. [Figure 8] 10A and 10B are diagrams for explaining determination of components to be mounted at mounting positions according to an embodiment. [Figure 9] FIG. 10 is a diagram for explaining determining a mounting order according to an embodiment. [Figure 10] 10A and 10B are diagrams for explaining determination of components to be mounted at mounting positions in a termination area according to an embodiment. [Figure 11] 10A and 10B are diagrams for explaining determining a mounting order in a termination area according to an embodiment; [Figure 12] 10 is a flowchart illustrating a control process related to determining a mounting order according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] The configuration of a component mounting system 300 including a mounting order determination device 100 according to one embodiment will be described with reference to FIGS.

[0023] (Component mounting system configuration) The component mounting system 300 is a system that mounts components E (electronic components) such as ICs, transistors, capacitors, and resistors on a board P such as a printed circuit board, and produces the board P on which the components E are mounted.

[0024] As shown in FIG. 1, the component mounting system 300 includes a mounting order determination device 100 and a component mounting device 200.

[0025] The mounting order determination device 100 is configured, for example, by a personal computer. The mounting order determination device 100 includes a control unit 11, a storage unit 12, a display unit 13, and an operation unit 14. The control unit 11 includes a processor such as a CPU (Central Processing Unit) and is a control circuit that controls each unit of the mounting order determination device 100. The control unit 11 is configured to create mounting data 12a including information about the mounting order, which will be described later. The storage unit 12 includes a non-volatile recording medium such as a hard disk drive and is configured to be able to store information. The storage unit 12 stores information such as the mounting data 12a. The display unit 13 includes a monitor such as a liquid crystal monitor and is configured to be able to display a screen for operating the mounting order determination device 100. The operation unit 14 includes input devices such as a keyboard and a mouse and accepts operations from a user. The mounting order determination device 100 is connected to a component mounting device 200 so as to be able to communicate with the component mounting device 200.

[0026] 1 and 2, component mounting apparatus 200 includes a base 201, a board transport unit 202, a rotary head 203, a head horizontal movement mechanism unit 204, a component imaging unit 205, a board imaging unit 206, a control unit 207, and a storage unit 208. In the following description, the board transport direction is defined as the X direction, the direction perpendicular to the X direction in a horizontal plane is defined as the Y direction, and the up-down direction perpendicular to the X and Y directions is defined as the Z direction.

[0027] Base 201 is a base on which each component is arranged in component mounting apparatus 200. A board transport unit 202, a rail unit 242, and a component imaging unit 205 are provided on base 201. A control unit 207 is also provided within base 201. A plurality of component supply units 210 are arranged side by side in the X direction on both sides of base 201 in the Y direction (the Y1 direction side and the Y2 direction side).

[0028] 3, the component supply unit 210 is a tape feeder that supplies components E to be mounted on the board P. A reel R on which a component supply tape T holding a plurality of components E is wound is attached to the component supply unit 210. The component supply unit 210 is configured to supply the components E by rotating the reel R and feeding out the component supply tape T in accordance with the component suction operation of the rotary head 203.

[0029] 2, the substrate transport unit 202 is configured to load the substrate P before mounting, transport it in the substrate transport direction (X direction), and load the substrate P after mounting. The substrate transport unit 202 is also configured to transport the loaded substrate P to a substrate fixing position Pa and fix it at the substrate fixing position Pa with a substrate fixing mechanism (not shown). The substrate transport unit 202 includes a pair of transport belts. The substrate transport unit 202 is configured to transport the substrate P in the substrate transport direction with the pair of transport belts supporting both ends of the substrate P in the width direction (Y direction) from below (Z2 direction sides).

[0030] As shown in FIGS. 2 and 4, the rotary head 203 is a rotary-type head unit for component mounting. The rotary head 203 mounts components E on a substrate P fixed at a substrate fixing position Pa. The rotary head 203 includes multiple (12) mounting head units 231 for picking up and mounting the components E, and nozzles 232 for picking up the components E attached to the tips of the mounting head units 231. The multiple mounting head units 231 and the multiple nozzles 232 are arranged circumferentially. The mounting head units 231 are configured to be able to pick up the components E onto the nozzles 232 by using negative pressure supplied from a negative pressure supply unit (not shown). The mounting head units 231 and the nozzles 232 are configured to be able to move up and down between a lowered position for picking up the components E or for mounting the picked-up components E, and an upper position for transporting the picked-up components E to the substrate P. The multiple mounting head units 231 and the multiple nozzles 232 are configured to be rotatable in the circumferential direction around the center of the circle formed by the arrangement. A pair of nozzles 232 that are positioned opposite each other in the horizontal direction are spaced a distance D1 apart. The pair of nozzles 232 are positioned so that they can simultaneously pick up components E from different component supply units 210.

[0031] Furthermore, a plurality (two) of rotary heads 203 are provided. The rotary head 203 on the Y1 direction side and the component supply unit 210 on the Y1 direction side form a mounting table 211 on the Y1 direction side. The rotary head 203 on the Y2 direction side and the component supply unit 210 on the Y2 direction side form a mounting table 211 on the Y2 direction side. The component mounting device 200 is provided with two mounting tables 211.

[0032] The head horizontal movement mechanism 204 is configured to move the rotary head 203 in horizontal directions (X and Y directions). The head horizontal movement mechanism 204 includes a support portion 241 that supports the rotary head 203 movably in the X direction, and a rail portion 242 that supports the support portion 241 movably in the Y direction. A plurality (two) of the support portions 241 are provided to correspond to the plurality (two) of rotary heads 203. The support portion 241 is configured to move the rotary head 203 in the X direction, for example, by an X-axis motor and a ball screw shaft mechanism. The rail portion 242 supports both ends of the support portion 241 in the X direction movably in the Y direction. The rail portion 242 is configured to move the support portion 241 in the Y direction, for example, by a Y-axis motor and a ball screw shaft mechanism.

[0033] The two support parts 241 and rail parts 242 of the head horizontal movement mechanism part 204 enable the two rotary heads 203 to move horizontally independently of each other on the base 201. This allows the rotary heads 203 to move above the component supply part 210 and pick up components E supplied from the component supply part 210. The rotary heads 203 can also move above the substrate P fixed at the substrate fixing position Pa and mount the picked-up components E on the substrate P. The rotary head 203 on the Y1 direction side is configured to obtain components E from the component supply part 210 on the Y1 direction side. The rotary head 203 on the Y2 direction side is configured to obtain components E from the component supply part 210 on the Y2 direction side.

[0034] The component imaging unit 205 is a camera for component recognition. The component imaging unit 205 images the component E held (sucked) by the nozzle of the mounting head unit 231 while the rotary head 203 is transporting the component E to the board P. The component imaging unit 205 is fixed on the upper surface of the base 201, and images the component E sucked by the nozzle 232 of the mounting head unit 231 from below the component E (the Z2 direction side). Based on the image of the component E captured by the component imaging unit 205, the control unit 207 acquires (recognizes) the suction state of the component E (the rotational attitude and the suction position relative to the nozzle 232).

[0035] The board imaging unit 206 is a camera for board recognition. Before the rotary head 203 starts mounting components E on the board P, the board imaging unit 206 captures an image of a position recognition mark F (fiducial mark) attached to the top surface of the board P, from above, with the board P fixed at the board fixing position Pa. The position recognition mark F is a mark for recognizing the position of the board P. Based on the image of the position recognition mark F captured by the board imaging unit 206, the control unit 207 acquires (recognizes) the accurate position and posture of the board P fixed at the board fixing position Pa. The board imaging unit 206 is attached to the rotary head 203. The board imaging unit 206 is configured to be movable horizontally together with the rotary head 203.

[0036] The control unit 207 is a control circuit that includes a processor such as a CPU (Central Processing Unit) and controls the operation of the component mounting apparatus 200. The control unit 207 is configured to control the board transport unit 202, the head horizontal movement mechanism unit 204, the component supply unit 210, etc., based on the mounting data 12a acquired from the mounting order determination device 100, thereby causing the rotary head 203 to mount components E on the board P and producing the board P. The storage unit 208 includes a non-volatile recording medium such as a hard disk drive, and is configured to be able to store information. The storage unit 208 stores the mounting data 12a acquired from the mounting order determination device 100.

[0037] (Board configuration) FIG. 5 shows a substrate P on which LED components are mounted as components E. The substrate P includes a plurality of mounting positions P1 that are regularly arranged and on which the same type of components (LED components) E are mounted. The plurality of mounting positions P1 are arranged in a matrix. Such a substrate P is used, for example, as a light-emitting substrate for a liquid crystal display or the like. Below, a method for determining the order in which components E are mounted on such a substrate P using a rotary head 203 will be described.

[0038] (Configuration for determining the mounting order) 6 to 11, in this embodiment, the control unit 11 is configured to perform the following processes: dividing the substrate P into a plurality of regions A; setting pairs of the same type of components E supplied from different component supply units 210 to be picked up by a pair of nozzles 232 arranged at positions facing each other among the plurality of nozzles 232; determining the components E to be mounted at the mounting positions P1 such that the pairs of components E are mounted in adjacent regions A (A1, A2) among the plurality of regions A and the components E supplied from the same component supply unit 210 are not adjacent to each other; and determining the mounting order for mounting the components E based on the result of determining the components E to be mounted at the mounting positions P1. For convenience, an example will be described in which the plurality of regions A include three regions: a first region A1, a second region A2, and a terminal region A3; however, the plurality of regions A may include four or more regions.

[0039] As shown in FIG. 6, the control unit 11 is configured to perform a process of dividing the substrate P into a plurality of regions A based on a distance (pitch) D1 between a pair of nozzles 232. Specifically, the control unit 11 is configured to perform a process of dividing the substrate P into a plurality of regions A so that a distance (pitch) D2 between corresponding mounting positions P1 (e.g., the first mounting position P1) in adjacent regions A (A1, A2) is a value close to the distance D1 between the pair of nozzles 232. The distance D2 has a value similar to the distance D1. Specifically, when the distance (pitch) between adjacent mounting positions P1 on the substrate P is D3, the distance D2 has a value within the range of D1-D3≦D2≦D1+D3. Ideally, the value of the distance D2 is preferably the same as the value of the distance D1. Furthermore, the width W1 of each of the plurality of regions A (A1, A2) is also a value close to the distance D1 between the pair of nozzles 232. Each of the multiple areas A (A1, A2) includes the same number of mounting positions P1 in the same arrangement.

[0040] In this embodiment, the control unit 11 is configured to extract corresponding mounting positions P1 in adjacent regions A (A1, A2) during the process of dividing the substrate P into multiple regions A. The corresponding mounting positions P1 refer to mounting positions P1 that can be considered to be identical in placement positions within the adjacent regions A (A1, A2) when comparing the adjacent regions A (A1, A2). In the example shown in FIG. 6, for convenience, the corresponding mounting positions P1 are assigned the same numbers (1, 2, . . . 16). As described above, the substrate P is divided into multiple regions A such that the distance D2 between the corresponding mounting positions P1 is close to the distance D1 between the pair of nozzles 232. Therefore, the corresponding mounting positions P1 are positioned such that a pair of components E to be picked up by the pair of nozzles 232 (a pair of components E to be picked up simultaneously) can be mounted with little or no movement of the rotary head 203.

[0041] As shown in FIG. 7, the control unit 11 is configured to perform processing to set one or more pairs of components E (two pairs in FIG. 7) to be picked up by a pair of nozzles 232. Specifically, the control unit 11 is configured to perform processing to set the pairs of components E to be picked up by a pair of nozzles 232 based on a division number d that is set based on a user input. The division number d represents the number of component divisions. Furthermore, component division means that multiple component supply units 210 that supply the same type of components E are arranged in the component mounting device 200 so that multiple components E of the same type can be picked up simultaneously. The division number d is calculated using the following formula (1): d=2×T×L (1) where: d: Number of divisions T: Number of mounting tables (number of rotary heads) L: Division level is.

[0042] In the above formula (1), the coefficient "2" represents the number of components E picked up simultaneously by a pair of nozzles 232. T represents the number of mounting tables, which is 2 in this embodiment. L represents the degree (level) of component division, and is set by input by the user. For example, if T is 2 and L is 1, the number of divisions d is 2×2×1=4. Furthermore, if the number of divisions d is 4, the same type of component E will be divided into four. In other words, four component supply units 210 (reels R) that supply the same type of component E will be arranged in the component mounting apparatus 200.

[0043] 7, A, B, C, and D represent the same type of parts E that have been divided. In the example shown in Fig. 7, parts E A and B are set as a pair of parts E to be picked up by a pair of nozzles 232, and part E C and D are set as a pair of parts E to be picked up by a pair of nozzles 232. Note that since the rotary head 203 of this embodiment includes six pairs of nozzles 232, for example, a pair of parts E A and B is assigned to three pairs of nozzles 232, and a pair of parts E C and D is assigned to the remaining three pairs of nozzles 232.

[0044] 8, control unit 11 is configured to perform processing to determine components E to be mounted at mounting positions P1 so that pairs of components E are mounted at the extracted corresponding mounting positions P1. Specifically, control unit 11 is configured to perform processing to acquire the arrangements of the same type of components E supplied from different component supply units 210, to randomly rearrange the acquired order of the arrangements of components E, and to assign components E to mounting positions P1 in the rearranged order of the arrangements of components E.

[0045] In the example shown in FIG. 8, an arrangement (A, B, C, D) is acquired as an arrangement of the same type of components E supplied from different component supply units 210. The order of the acquired arrangement (A, B, C, D) is randomly shuffled to acquire a shuffled arrangement (C, D, A, B). The components E are assigned to the mounting positions P1 in the first row of the first area A1 in the shuffled order (C, D, A, B). Note that in the example shown in FIG. 8, the number of mounting positions P1 in the first row is the same as the number of components E included in the arrangement. However, since many mounting positions P1 are typically formed on the board P, the number of mounting positions P1 in the first row often exceeds the number of components E included in the arrangement. In this case, the order of the arrangement (C, D, A, B) is repeated as C, D, A, B, C, D, A, etc., until all of the mounting positions P1 in the first row of the first area A1 are assigned.

[0046] Furthermore, after a component E is assigned to a mounting position P1 in the first row in the first area A1, the corresponding component E (the component E of the pair of components E that was not assigned to the corresponding mounting position P1 in the first area A1) is assigned to the corresponding mounting position P1 in the second area A2. Specifically, in the example shown in FIG. 8, a component E designated C is assigned to the first mounting position P1 in the first area A1, and therefore a component E designated D is assigned to the first mounting position P1 in the second area A2. Similarly, a component E designated D is assigned to the second mounting position P1 in the first area A1, and therefore a component E designated C is assigned to the second mounting position P1 in the second area A2. The same applies to the other mounting positions P1. As a result, a component E is also assigned to the first mounting position P1 in the second area A2. By allocating pairs of components E in this manner, when components E are mounted at corresponding mounting positions P1, it is possible to mount a pair of components E that are picked up by a pair of nozzles 232 (a pair of components E that are picked up simultaneously) with little or no movement of the rotary head 203.

[0047] Then, components E are similarly assigned to mounting positions P1 in the second column of the first region A1, and components E are similarly assigned to mounting positions P1 in the second column of the second region A2. The above process is repeated until components E are assigned to all mounting positions P1 in the first region A1 and the second region A2. As a result, pairs of components E are mounted in the first region A1 and the second region A2 that are adjacent to each other, and the components E to be mounted at the mounting positions P1 are determined so that components E supplied from the same component supply unit 210 are not adjacent to each other. Note that although an example in which components E are assigned to each column of the mounting positions P1 has been described, components E may also be assigned to each row of the mounting positions P1.

[0048] 9, the control unit 11 is configured to perform processing for determining the mounting order for mounting the components E based on the determination result of the components E to be mounted at the mounting positions P1. Specifically, the control unit 11 is configured to perform processing for determining the mounting order such that the components E are mounted at corresponding mounting positions P1 in adjacent areas A (A1, A2) while sequentially shifting by one mounting position P1 in the row direction (X direction) or the column direction (Y direction) (in the column direction in FIG. 9). More specifically, when sequentially shifting in the column direction, the control unit 11 is configured to perform processing for determining the mounting order such that the components E are mounted at corresponding mounting positions P1 in adjacent areas A (A1, A2) while repeatedly shifting in the column direction and, when the sequential shifting in the column direction reaches an end of the area A (A1, A2), shifting in the row direction and turning back. Similarly, the control unit 11 is configured to perform processing to determine the mounting order so that, when shifting in the row direction in order, components E are mounted at corresponding mounting positions P1 in adjacent areas A (A1, A2) by repeating the process of shifting in the row direction in order, and then shifting in the column direction and turning back when the end of area A (A1, A2) is reached after shifting in the row direction in order.

[0049] As described above, the mounting order of the areas A (A1, A2) to be mounted by one mounting table 211 (one rotary head 203) is determined. Note that, in the examples shown in FIGS. 6 to 11, for convenience, an example has been described in which the multiple areas A include one first area A1 and one second area A2, but normally the multiple areas A will include multiple first areas A1 and multiple second areas A2. In this case, a mounting table 211 (rotary head 203) is assigned to each pair of the first area A1 and the second area A2, and the mounting order is determined.

[0050] 6, the control unit 11 is configured to perform a process of dividing the substrate P into a plurality of regions A so as to include a terminal region A3 at an end of the substrate P, the terminal region A3 having a width W2 smaller than the distance D1 between the pair of nozzles 232. Also, as shown in FIGS. 10 and 11, the control unit 11 is configured to perform a process of determining the components E to be mounted at the mounting positions P1 in the terminal region A3, and a process of determining the mounting order in the terminal region A3. These processes are similar to those for the first region A1 and the second region A2.

[0051] 10, the control unit 11 is configured to perform the following processes: acquire the arrangement of the same type of components E supplied from different component supply units 210; randomly rearrange the acquired arrangement of the components E; and assign the components E to mounting positions P1 in the termination area A3 in the rearranged order of the components E. Although detailed description will be omitted, in the example shown in FIG. 10, the rearranged arrangement (A, C, B, D) is acquired, and the components E are assigned to mounting positions P1 in the termination area A3 in the rearranged order (A, C, B, D). Note that, although the example shown in FIG. 10 shows that the termination area A3 includes only one row of mounting positions P1, the termination area A3 may also include multiple rows of mounting positions P1. In this case, the rows to which the components E are assigned may be shifted in order, as in the first area A1 and the second area A2, and the components E may be assigned to all of the multiple rows of mounting positions P1.

[0052] 11, the control unit 11 is configured to perform a process of determining the mounting order such that the components E are mounted at the mounting positions P1 in the termination area A3 while being shifted in order in the column direction (Y direction). Note that if the termination area A3 includes multiple columns of mounting positions P1, the control unit 11 may be configured to perform a process of determining the mounting order such that the components E are mounted at the mounting positions P1 in the termination area A3 while being shifted in order in the row direction (X direction).

[0053] As described above, the control unit 11 is configured to determine a mounting order for mounting components E by the rotary head 203 on the board P, which includes a plurality of mounting positions P1 where components E of the same type are regularly arranged and mounted. The control unit 11 is also configured to create mounting data 12a including information on the determined mounting order. The component mounting apparatus 200 is configured to acquire the created mounting data 12a before starting production of the board P. Then, once production of the board P starts, the component mounting apparatus 200 is configured to mount the components E on the board P by the rotary head 203 based on the acquired mounting data 12a. That is, the component mounting apparatus 200 is configured to mount the components E on the board P in the mounting order specified in the mounting data 12a while efficiently suctioning components by simultaneously suctioning pairs of the same type of components E supplied from different component supply units 210 using a pair of nozzles 232.

[0054] (Control process for determining the mounting order) Next, a control process relating to the determination of the mounting order by the mounting order determination device 100 of this embodiment will be described based on a flowchart with reference to Fig. 12. Each process in the flowchart is performed by the control unit 11.

[0055] As shown in FIG. 12, first, in step S1, a process of dividing the substrate P into a plurality of regions A is performed.

[0056] Then, in step S2, it is determined whether the process of dividing the substrate P into multiple regions A was successful. If the substrate P to be processed is a substrate other than a substrate on which LED components are mounted (a substrate on which mounting positions P1 are irregularly arranged), the process of dividing the substrate P into multiple regions A fails. In this case, the control process is terminated. Also, if the substrate P to be processed is a substrate on which LED components are mounted (a substrate on which mounting positions P1 are regularly arranged), the process of dividing the substrate P into multiple regions A is successful. In this case, proceed to step S3.

[0057] Then, in step S3, a pair of components E of the same type that are supplied from different component supply units 210 are set to be picked up by the pair of nozzles 232. That is, in step S3, a pair of components E that are simultaneously picked up from different component supply units 210 by the pair of nozzles 232 are set.

[0058] Then, in step S4, a process is performed to determine the component E to be mounted at the mounting position P1 so that pairs of components E are mounted in adjacent areas A (A1, A2) among the multiple areas A, and components E supplied from the same component supply unit 210 are not adjacent to each other.

[0059] Then, in step S5, a process is performed to determine the mounting order for mounting the components E based on the result of determining the components E to be mounted at the mounting positions P1.

[0060] Then, in step S6, processing is performed on the terminal area A3 of the multiple areas A. That is, in step S6, processing is performed to determine the component E to be mounted at the mounting position P1 in the terminal area A3, and processing is performed to determine the mounting order in the terminal area A3. Then, the control processing is terminated.

[0061] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0062] As described above, this embodiment provides a step of setting pairs of components E of the same type supplied from different component supply units 210 to be picked up by a pair of nozzles 232 arranged at opposing positions among the plurality of nozzles 232. This allows pairs of components E of the same type supplied from different component supply units 210 to be set, thereby enabling efficient component pick-up by simultaneously picking up components E of the same type supplied from different component supply units 210. Also provided are a step of determining components E to be mounted at mounting positions P1 so that components E supplied from the same component supply unit 210 are not adjacent to each other, and a step of determining a mounting order for mounting the components E based on the result of determining the components E to be mounted at mounting positions P1. By mounting the components E by the rotary head 203 based on the determined mounting order, components E supplied from the same component supply unit 210 can be mounted so that they are not adjacent to each other, thereby preventing components E supplied from the same component supply unit 210 from congregating in one area. As a result, even when mounting the same type of components E (e.g., components E from different lots) supplied from different component supply units 210, it is possible to prevent defects such as uneven brightness caused by differences in the characteristics of the components E. As a result, it is possible to efficiently pick up components E simultaneously, while preventing defects such as uneven brightness caused by differences in the characteristics of the components E.

[0063] While random mounting of components E supplied from the same component supply unit 210 may be considered to prevent components E from concentrating in one area, this would require random movement of the rotary head 203, complicating the movement of the rotary head 203. As a result, there is the disadvantage of increased time required to mount the components E. To address this issue, as described above, the method includes the steps of determining components E to be mounted at mounting positions P1 so that pairs of components E are mounted in adjacent areas A (A1, A2) among the multiple areas A, and determining the mounting order for the components E based on the determination of the components E to be mounted at mounting positions P1. By mounting the components E using the rotary head 203 based on the determined mounting order, pairs of components E can be mounted in adjacent areas A (A1, A2) among the multiple areas A. This reduces the movement of the rotary head 203 compared to when the rotary head 203 is moved randomly. As a result, the increase in time required to mount the components E can be reduced.

[0064] Furthermore, in this embodiment, as described above, the step of dividing the substrate P into a plurality of regions A includes a step of dividing the substrate P into a plurality of regions A based on the distance D1 between the pair of nozzles 232. This makes it possible to easily set a plurality of regions A based on the distance D1 between the pair of nozzles 232 so as to reduce the movement of the rotary head 203 when mounting a pair of components E, and therefore makes it possible to easily suppress an increase in the time required to mount the components E.

[0065] Furthermore, in this embodiment, as described above, the step of dividing the substrate P into a plurality of regions A includes a step of dividing the substrate P into a plurality of regions A such that the distance D2 between corresponding mounting positions P1 in adjacent regions A (A1, A2) is a value close to the distance D1 between the pair of nozzles 232. In this way, the distance D2 between corresponding mounting positions P1 in adjacent regions A (A1, A2) is a value close to the distance D1 between the pair of nozzles 232, and therefore it is possible to more easily set a plurality of regions A that reduce the movement of the rotary head 203 when mounting a pair of components E, and therefore it is possible to more easily suppress an increase in the time required to mount the components E.

[0066] Furthermore, in this embodiment, as described above, the step of dividing the substrate P into a plurality of regions A includes a step of dividing the substrate P into a plurality of regions A so as to include a terminal region A3 at an end of the substrate P, the terminal region A3 having a width W2 smaller than the distance D1 between the pair of nozzles 232, and the step of determining the component E to be mounted at the mounting position P1 includes a step of determining the component E to be mounted at the mounting position P1 in the terminal region A3. As a result, even if a width close to the distance D1 between the pair of nozzles 232 cannot be secured at the end of the substrate P when dividing the substrate P into a plurality of regions A, by setting the terminal region A3 having a width W2 smaller than the distance D1 between the pair of nozzles 232, it is possible to divide the substrate P into a plurality of regions A and also determine the component E to be mounted at the mounting position P1 in the terminal region A3.

[0067] Furthermore, in this embodiment, as described above, the step of dividing the substrate P into a plurality of regions A includes the step of extracting corresponding mounting positions P1 in adjacent regions A (A1, A2), and the step of determining the components E to be mounted at the mounting positions P1 includes the step of determining the components E to be mounted at the mounting positions P1 such that pairs of components E are mounted at the extracted corresponding mounting positions P1. This allows pairs of components E to be mounted at corresponding mounting positions P1 that require a short moving distance of the rotary head 203, making it even easier to prevent an increase in the time required to mount the components E.

[0068] Furthermore, in this embodiment, as described above, the step of determining the components E to be mounted at the mounting positions P1 includes the steps of acquiring the arrangement of the same type of components E supplied from different component supply units 210, randomly rearranging the acquired arrangement order of the components E, and allocating the components E to the mounting positions P1 in the rearranged order of the arrangement of the components E. This allows the components E to be randomly allocated to the mounting positions P1, making it easy to prevent components E supplied from the same component supply unit 210 from concentrating in one area.

[0069] In this embodiment, as described above, the components E include LED components. This makes it possible to efficiently pick up the components E simultaneously when using LED components, while suppressing uneven brightness caused by differences in the characteristics of the components E.

[0070] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than the above description of the embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0071] For example, in the above embodiment, an example was shown in which the control unit of a mounting order determination device provided independently of the component mounting device performs the control processing of the present invention, but the present invention is not limited to this. In the present invention, the control unit of the component mounting device may perform the control processing of the present invention. In this case, the component mounting device is an example of the "mounting order determination device" in the claims.

[0072] In addition, in the above embodiment, an example has been shown in which the component mounting apparatus has two mounting tables (two rotary heads), but the present invention is not limited to this. In the present invention, the component mounting apparatus may have one mounting table (one rotary head), or may have three or more mounting tables (three or more rotary heads).

[0073] In the above embodiment, an example of a substrate on which LED components are mounted is shown as a substrate including a plurality of mounting positions where components of the same type are mounted in a regular arrangement, but the present invention is not limited to this. In the present invention, the substrate including a plurality of mounting positions where components of the same type are mounted in a regular arrangement may be a substrate other than a substrate on which LED components are mounted.

[0074] Furthermore, in the above embodiment, for convenience of explanation, the processing operation of the control unit is described using a flow-driven flowchart in which processing is performed in order according to a processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the processing may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing. [Explanation of symbols]

[0075] 11 Control section 100 Mounting order determination device 203 Rotary Head 210 Parts Supply Department 232 nozzle Area A A1 1st area (area) A2 2nd area (area) A3 Termination area (area) D1 Distance between a pair of nozzles D2 Distance between corresponding mounting positions E parts P board P1 Mounting position W2 width

Claims

1. A mounting order determination method for mounting components on a substrate including a plurality of mounting positions where the same type of components are mounted in a regular arrangement, using a rotary head including a plurality of nozzles arranged circumferentially, comprising: Dividing the substrate into a plurality of regions; setting a pair of the components of the same type supplied from different component supply units to be picked up by a pair of nozzles arranged at positions opposite to each other among the plurality of nozzles; determining the components to be mounted at the mounting positions such that the pairs of components are mounted in adjacent regions among the plurality of regions, and the components supplied from the same component supply unit are not adjacent to each other; determining a mounting order for mounting the components based on a result of determining the components to be mounted at the mounting positions.

2. 2. The mounting order determination method according to claim 1, wherein the step of dividing the board into the plurality of regions includes the step of dividing the board into the plurality of regions based on a distance between the pair of nozzles.

3. 3. The mounting order determination method according to claim 2, wherein the step of dividing the substrate into the plurality of regions includes a step of dividing the substrate into the plurality of regions such that a distance between the corresponding mounting positions in the adjacent regions is a value close to a distance between the pair of nozzles.

4. the step of dividing the substrate into the plurality of regions includes a step of dividing the substrate into the plurality of regions so as to include a termination region at an end of the substrate, the termination region having a width smaller than a distance between the pair of nozzles; 4. The mounting order determination method according to claim 3, wherein the step of determining the components to be mounted at the mounting positions includes the step of determining the components to be mounted at the mounting positions in the termination area.

5. the step of dividing the substrate into the plurality of regions includes a step of extracting the corresponding mounting positions in the adjacent regions; 2. The mounting order determination method according to claim 1, wherein the step of determining the components to be mounted at the mounting positions includes a step of determining the components to be mounted at the mounting positions such that the pairs of components are each mounted at the extracted corresponding mounting positions.

6. The step of determining the component to be mounted at the mounting position includes: acquiring an arrangement of the components of the same type supplied from the different component supply units; Randomly changing the order of the arrangement of the acquired parts; allocating the components to the mounting positions in the order of the rearranged arrangement of the components; The mounting order determination method according to claim 1 , comprising:

7. The mounting order determination method according to claim 1 , wherein the components include LED components.

8. A mounting order determination device for mounting components on a substrate including a plurality of mounting positions where the same type of components are mounted in a regular arrangement, using a rotary head including a plurality of nozzles arranged circumferentially, the device comprising: A control unit is provided, The control unit dividing the substrate into a plurality of regions; a process of setting a pair of the components of the same type supplied from different component supply units to be picked up by a pair of nozzles arranged at positions opposite to each other among the plurality of nozzles; a process of determining the components to be mounted at the mounting positions such that the pairs of components are mounted in adjacent regions among the plurality of regions, and the components supplied from the same component supply unit are not adjacent to each other; a process of determining a mounting order for mounting the components based on a result of determining the components to be mounted at the mounting positions; A mounting order determination device that performs the above.

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