Edge protection sheet and adhesive sheet for semiconductor wafers

Abstract

To provide a semiconductor wafer outer edge protection sheet and an adhesive sheet capable of preventing a manufacturing process for producing sheet attached product from becoming troublesome.SOLUTION: In a semiconductor wafer outer edge protection sheet PS1 which includes a substrate BS1 and an adhesive layer AL1 supported by the substrate BS1, and protects outer edge sections of a first surface WF1 of a semiconductor wafer WF and a second surface WF2 arranged at a rear surface side of the first surface WF1, the substrate BS1 includes: a first energy deformable material ET1 to be deformed by first energy; and a second energy deformable material ET2 to be deformed by second energy.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an edge protection sheet for a semiconductor wafer and an adhesive sheet. [Background technology]

[0002] BACKGROUND ART Adhesive sheets that protect the outer edges of the first and second surfaces of a semiconductor wafer (hereinafter also simply referred to as "wafer") are known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Utility Model Registration No. 3187573 Summary of the Invention [Problem to be solved by the invention]

[0004] In the case of the resin film (semiconductor wafer outer edge protection sheet) described in Patent Document 1, two materials must be prepared as the adhesive material to be applied to the silicon wafer 1 (semiconductor wafer): a device surface resin film 2 that protects the device surface 1a (second surface), and a bottom surface resin film 3 that protects the bottom surface 1b (first surface).This means that the preparation process for preparing the adhesive material, the storage process for storing the adhesive material, and the application process for applying the adhesive material to the semiconductor wafer are all duplicated, resulting in the inconvenience of complicated manufacturing processes for producing sheet-applied products such as silicon wafers for electroless plating.

[0005] An object of the present invention is to provide a semiconductor wafer edge protection sheet and adhesive sheet that can prevent the manufacturing process for producing a sheet-attached product from becoming complicated. [Means for solving the problem]

[0006] The present invention employs the configurations set forth in the claims. [Effects of the Invention]

[0007] According to the present invention, the substrate constituting the semiconductor wafer outer edge protection sheet (adhesive sheet) comprises a first energy deformation material that is deformed by a first energy and a second energy deformation material that is deformed by a second energy, so that only one attachment material can be attached to the semiconductor wafer (adherend), preventing the manufacturing process for producing the sheet-attached product from becoming complicated. Furthermore, since the substrate constituting the semiconductor wafer outer edge protection sheet (adhesive sheet) comprises a first energy deformation material that deforms with a first energy, and the adhesive layer constituting the semiconductor wafer outer edge protection sheet (adhesive sheet) comprises a second energy deformation material that deforms with a second energy, it is possible to apply only one adhesive material to the semiconductor wafer (adherend), thereby preventing the manufacturing process for producing sheet-applied products from becoming complicated. [Brief explanation of the drawings]

[0008] [Figure 1] (A) is an explanatory diagram of a semiconductor wafer edge protection sheet according to a first embodiment of the present invention; (B) to (D) are explanatory diagrams of a sheet attachment device using a semiconductor wafer edge protection sheet and an explanatory diagram of the operation of the device; and (E) to (H) are explanatory diagrams of modified examples. [Figure 2] (A) is an explanatory diagram of a semiconductor wafer edge protection sheet according to a second embodiment of the present invention, and (B) to (D) are explanatory diagrams of a sheet attachment device that uses a semiconductor wafer edge protection sheet and an explanatory diagram of the operation of the device. [Figure 3] 1A is an explanatory diagram of an adhesive sheet according to a third embodiment of the present invention, and FIGS. 1B and 1C are explanatory diagrams of examples of use of the adhesive sheet. [Figure 4] 1A is an explanatory diagram of an adhesive sheet according to a fourth embodiment of the present invention, and FIGS. 1B and 1C are explanatory diagrams of examples of use of the adhesive sheet. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, with the X-axis and Y-axis being axes within a predetermined plane, and the Z-axis being an axis perpendicular to the predetermined plane. Furthermore, in this embodiment, the view from the front in FIG. 1 parallel to the Y-axis is used as the reference, and when directions are indicated without specifying the view, "up" refers to the direction of the Z-axis arrow, "down" refers to the opposite direction, "left" refers to the direction of the X-axis arrow, "right" refers to the opposite direction, "front" refers to the front in FIG. 1 parallel to the Y-axis, and "rear" refers to the opposite direction. All views without arrows indicating directions are views from the same direction as FIG. 1(B).

[0010] [First embodiment] The semiconductor wafer edge protection sheet (hereinafter simply referred to as "protective sheet") PS1 of the present invention comprises a substrate BS1 and an adhesive layer AL1 supported on the substrate BS1, as shown in Figure 1(A), and protects the outer edge portions of the first surface WF1 of the semiconductor wafer (hereinafter simply referred to as "wafer") WF and the second surface WF2 located on the back side of the first surface WF1 (see Figure 1(D)).

[0011] The substrate BS1 includes a first energy deformation material ET1 that is deformed by a first energy and a second energy deformation material ET2 that is deformed by a second energy. In this first embodiment, the first energy deformation material ET1 is a heat-shrinkable film whose main component is polyolefin (PO) resin that deforms when exposed to heat of 160°C as the first energy, and the second energy deformation material ET2 is a heat-shrinkable film whose main component is polyethylene terephthalate (PET) resin that deforms when exposed to heat of 180°C as the second energy. In addition, the heat-shrinkable film mainly composed of polyolefin resin may be, for example, the heat-shrinkable film described in JP-A-2006-51862 or JP-A-2021-66775, and is not limited thereto. Furthermore, the heat-shrinkable film mainly composed of polyethylene terephthalate resin may be, for example, the heat-shrinkable sheet described in JP-A-61-203161 or JP-A-2016-521807, and is not limited in any way.

[0012] The adhesive layer AL1 is laminated on the first energy deformation material ET1, and may be made of, for example, any of the adhesives or pressure-sensitive adhesives described in JP-A-2009-132787 and JP-A-2016-169389, but is not limited thereto.

[0013] The protective sheet PS1 as described above can be used, for example, by a sheet application device EA as shown in FIG. 1(B). That is, the sheet application device EA comprises a supply means 10 that performs a supply step of supplying a protective sheet PS1, a pressing means 20 that performs a pressing step of pressing the protective sheet PS1 onto the first surface WF1 of the wafer WF to form an overhang area PS1H where the protective sheet PS1 supplied by the supply means 10 overhangs the outer edge of the first surface WF1 of the wafer WF, and a folding and pasting means 30 that performs a folding and pasting step of applying heat to the overhang area PS1H to deform it, and folding and pasting the overhang area PS1H toward the second surface WF2, and is arranged near a moving means 40 that performs a moving step of moving the pressing means 20 and the wafer WF relative to each other. In the first embodiment, a circular wafer WF is used, the center of which is the reference position WFR.

[0014] The supply means 10 includes a support roller 11 that supports the raw roll RS on which the protective sheet PS1 has been temporarily attached to a strip-shaped release sheet RL, a guide roller 12 that guides the raw roll RS, a release plate 13 as a release means that folds the release sheet RL at the release edge 13A and releases the protective sheet PS1 from the release sheet RL, a drive roller 14 that is supported by an output shaft (not shown) of a rotary motor 14A that serves as a drive device and that pinches the release sheet RL between itself and a pinch roller 14B, and a recovery roller 15 that is supported by an output shaft (not shown) of the drive device and that constantly applies a predetermined tension to the release sheet RL that is between itself and the pinch roller 14B while the sheet application device EA is operating automatically, and that recovers the release sheet RL.

[0015] The pressing means 20 includes a pressing roller 21 .

[0016] The folding and adhering means 30 includes a first energy applying means 31 that applies heat of 160° C. to the protruding region PS1H, and a second energy applying means 32 that applies heat of 180° C. to the protruding region PS1H. The first energy applying means 31 includes a first hot air generating means 31A that heats a gas such as the atmosphere or a gas with a heating device (not shown) such as a coil heater or the heating side of a heat pipe to generate first hot air AR1 capable of heating the protruding region PS1H to 160°C, and an annular nozzle 31D formed with an outlet 31C that ejects the first hot air AR1 generated by the first hot air generating means 31A and blown through piping 31B. The outlet 31C is provided in an annular shape centered on a center line CL that is a straight line parallel to the Z axis. The second energy applying means 32 includes second hot air generating means 32A that heats a gas such as the atmosphere or a gas with a heating device (not shown), such as a coil heater or the heating side of a heat pipe, to generate second hot air AR2 capable of heating the protruding region PS1H to 180° C., and an annular nozzle 32D formed with an outlet 32C that ejects the second hot air AR2 generated by the second hot air generating means 32A and blown through a pipe 32B. The annular nozzle 32D is supported via a bracket 32E on an output shaft 32G of a linear motor 32F serving as a driving device, and the outlet 32C is provided in an annular shape centered on a center line CL.

[0017] The moving means 40 includes a support table 42 supported by a slider 41A of a linear motor 41 as a driving device and having a holding surface 42A that can be sucked and held by a pressure reducing means (holding means) (not shown) such as a vacuum pump or a vacuum ejector, a linear motor 43 as a driving device disposed in a recess 42B formed in the holding surface 42A, and a lift table 44 supported by the output shaft 43A of the linear motor 43 and having an upper surface that forms a holding surface 44A that can be sucked and held by a pressure reducing means (holding means) (not shown) such as a vacuum pump or a vacuum ejector. Note that a non-adhesive material such as a fluororesin or silicone resin is laminated on the holding surface 42A to which the protective sheet PS1 will not adhere, or which allows the protective sheet PS1 to be peeled off even if the protective sheet PS1 adheres to the holding surface 42A.

[0018] The operation of the sheet sticking apparatus EA will now be described. First, a user of the sheet applicator EA (hereinafter simply referred to as the "user") sets the web RS in the sheet applicator EA, with each component positioned in the initial position indicated by the solid lines in FIG. 1A, and then inputs a signal to start automatic operation via an operation means (not shown), such as an operation panel or a personal computer. The supply means 10 then drives the rotary motor 14A to pay out the web RS. When the leading edge of the leading protective sheet PS1 in the payout direction is peeled off a predetermined length by the peeling edge 13A of the peeling plate 13, the rotary motor 14A is stopped. Next, the user or a transport means (not shown), such as an articulated robot or belt conveyor, places the wafer WF on the holding surfaces 42A and 44A so that the reference position WFR coincides with the lift table center 44R, as shown in FIG. 1A. The moving means 40 then drives the pressure-reducing means (not shown), and the wafer WF begins to be suction-held on the holding surfaces 42A and 44A.

[0019] Thereafter, the moving means 40 drives the linear motor 41 to move the support table 42 leftward. When the wafer WF reaches a predetermined position relative to the supply means 10, the supply means 10 drives the rotary motor 14A to pay out the raw web RS in accordance with the movement speed of the wafer WF. As a result, the protective sheet PS1 is peeled off from the release sheet RL, and the protective sheet PS1 peeled off from the release sheet RL is pressed against the wafer WF by the pressure roller 21 and attached to the first surface WK1 so as to form an overhang region PS1H, as shown by the two-dot chain line in FIG. 1(B). Next, the entire leading protective sheet PS1 is attached to the wafer WF, and when the leading end of the next protective sheet PS1 in the payout direction following the leading protective sheet PS1 is peeled off by a predetermined length by the peeling edge 13A of the peeling plate 13, the supply means 10 stops driving the rotary motor 14A. Then, as shown by the two-dot chain line in Figure 1(B), when the lift table center 44R (reference position WFR) coincides with the center line CL, the moving means 40 stops driving the linear motor 41, stopping the movement of the wafer WF to the left, and then stops driving the pressure reducing means (not shown), releasing the suction holding on the holding surface 42A.

[0020] Next, as shown by the two-dot chain line in Fig. 1(B), the moving means 40 drives the linear motor 43 to raise the lift table 44, and then the folding and attaching means 30 drives the first hot air generating means 31A, and as shown in Fig. 1(C), first hot air AR1 is blown from the nozzle 31C onto the protruding region PS1H. This causes the first energy deformation material ET1 located in the protruding region ASH to contract and deform, and as shown by the solid line in Fig. 1(C), the protruding region PS1H hangs down from the outer edge of the adherend WK. At this time, the protruding region PS1H may or may not contact the second surface WF2. Thereafter, the folding and pasting means 30 drives the linear motor 32F to lower the annular nozzle 32D as shown in Fig. 1(D), and after stopping the driving of the first hot air generating means 31A, drives the second hot air generating means 32A to blow second hot air AR2 from the nozzle 32C onto the protruding area PS1H. As a result, the second energy deformation material ET2 located in the protruding area ASH contracts and deforms, and as shown by the solid line in Fig. 1(D), the protruding area PS1H is stuck to the second surface WF2 to form the sheet-pasted product UP.

[0021] Next, the folding and pasting means 30 stops driving the second hot air generating means 32A, and then drives the linear motor 32F to return the annular nozzle 32D to its initial position, and the moving means 40 drives the linear motor 43 to return the lift table 44 to its initial position. Then, the moving means 40 stops driving the pressure reducing means (not shown) and releases the suction and holding on the holding surface 44A, and when the user or the conveying means (not shown) conveys the sheet-attached product UP to the next process, the linear motor 41 is driven to return the support table 42 to its initial position, and the same operations as above are repeated thereafter.

[0022] According to the first embodiment described above, the substrate BS1 constituting the protective sheet PS1 comprises a first energy deformation material ET1 that deforms when heated to 160°C and a second energy deformation material ET2 that deforms when heated to 180°C. This allows only one attachment material to be attached to the wafer WF, thereby preventing the manufacturing process for producing the sheet-attached product UP from becoming complicated.

[0023] [Second embodiment] The semiconductor wafer edge protection sheet of the present invention may be a protection sheet PS2 as shown in FIG. 2(A). The protective sheet PS2 comprises a base material BS2 and an adhesive layer AL2 supported on the base material BS2, and protects the first surface WF1 of the wafer WF and the outer edge portion of the second surface WF2 located on the back side of the first surface WF1.

[0024] The substrate BS2 includes a first energy deformation material ET3 that is deformed by a first energy. In the second embodiment, the first energy deformation material ET3 is a heat-shrinkable film mainly composed of polyolefin resin that deforms when exposed to heat of 160°C as the first energy, but a heat-shrinkable film mainly composed of polyethylene terephthalate resin that deforms when exposed to heat of 180°C as the first energy may also be used. The heat-shrinkable film mainly composed of polyolefin resin and the heat-shrinkable film mainly composed of polyethylene terephthalate resin can be the heat-shrinkable film shown in the first embodiment, and is not limited in any way.

[0025] The adhesive layer AL2 includes a second energy deformation material ET4 that is deformed by a second energy. In the second embodiment, the second energy deformation material ET4 is an ultraviolet curing adhesive that is deformed by ultraviolet light UV as the second energy. In addition, the ultraviolet-curing adhesive may be, for example, the ultraviolet-curing adhesive described in JP-A-11-116934 or JP-A-2021-70707, and is not limited in any way.

[0026] The protective sheet PS2 as described above can be used by modifying the sheet application apparatus EA exemplified in the first embodiment as follows. That is, in the sheet sticking apparatus EA, the supply means 10 supplies the protective sheet PS2, and the folding and sticking means 30 applies heat and ultraviolet light UV to the protruding area PS2H to deform it, and then folds and sticks the protruding area PS2H in the direction of the second surface WF2. Below, only the differences from the sheet sticking apparatus EA exemplified in the first embodiment will be described.

[0027] As shown in FIG. 2(B), the supply means 10 differs from the sheet application device EA exemplified in the first embodiment in that a support roller 11 supports the raw sheet RS having the protective sheet PS2 temporarily attached to the release sheet RL.

[0028] The folding and adhering means 30 differs from the sheet adhering apparatus EA exemplified in the first embodiment in that the second energy applying means 32 applies ultraviolet light UV to the protruding region PS2H. 2(C), the second energy applying means 32 includes an annular bracket 32J that supports an annular ultraviolet lamp 32H that emits ultraviolet light UV as the second energy, instead of the second hot gas generating means 32A, the piping 32B, and the annular nozzle 32D illustrated in the first embodiment. Note that the ultraviolet lamp 32H may be any type of lamp, such as an LED lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, or a halogen lamp.

[0029] The sheet application apparatus EA operates in the same manner as in the first embodiment: after applying the protective sheet PS2 to the first surface WF1 of the wafer WF to form the protruding area PS2H, first hot air AR1 is blown onto the protruding area PS2H, as shown in FIG. 2(C). This causes the first energy deformation material ET3 located in the protruding area ASH to contract and deform, causing the protruding area PS2H to hang down from the outer edge of the wafer WF, as shown by the solid line in FIG. 2(C). At this time, the protruding area PS2H may or may not contact the second surface WF2. Next, as in the first embodiment, the annular bracket 32J is lowered, as shown in FIG. 2(D), and then the folding and application means 30 drives the ultraviolet lamp 32H to irradiate the protruding area PS2H with ultraviolet light UV. As a result, the second energy deformation material ET4 located in the protruding area ASH contracts and deforms, and as shown by the solid line in Figure 2(D), the protruding area PS2H adheres to the second surface WF2 to form a sheet-attached product UP, and the subsequent operation is the same as in the first embodiment.

[0030] According to the second embodiment described above, the substrate BS2 constituting the protective sheet PS2 comprises a first energy deformation material ET3 that deforms when heated to 160°C, and the adhesive layer AL2 constituting the protective sheet PS2 comprises a second energy deformation material ET4 that deforms when exposed to ultraviolet light UV. This allows only one attachment material to be attached to the wafer WF, thereby preventing the manufacturing process for producing the sheet-attached product UP from becoming complicated.

[0031] [Third embodiment] As shown in Figure 3(A), the adhesive sheet AS1 of the present invention comprises a substrate BS1 and an adhesive layer AL1 supported on the substrate BS1, and protects a first surface WK1 of the adherend WK and a second surface WK2 different from the first surface WK1. The base material BS1 and adhesive layer AL1 may be the same as the base material BS1 and adhesive layer AL1 shown in the first embodiment. As shown in FIG. 3(B), the adherend WK has a first surface WK1, a second surface WK2, a third surface WK3, and a fourth surface WK4.

[0032] The adhesive sheet AS1 as described above can be used in the same manner as in the example of use exemplified in the first embodiment. That is, as in the first embodiment, the adhesive sheet AS1 is attached to the first surface KW1 of the adherend WK so as to form an overhang region AS1H, and then, as shown in FIG. 3(B), first hot air AR1 is blown onto the overhang region AS1H. This causes the first energy deformation material ET1 located in the overhang region ASH to contract and deform, causing the overhang region AS1H to hang down from the outer edge of the adherend WK as shown by the solid line in FIG. 3(B). At this time, the overhang region AS1H may or may not contact the second surface WK2, the third surface WK3, etc. Next, as in the first embodiment, second hot air AR2 is blown onto the overhang region AS1H as shown in FIG. 3(C). As a result, the second energy deformation material ET2 located in the protruding region ASH contracts and deforms, and as shown by the solid line in Fig. 3(C), the protruding region AS1H adheres to the entire second surface WK2 and a part of the third surface WK3 to form a sheet-attached item UP. Note that the adhesive sheet AS1 may be configured so that the protruding region AS1H adheres to a part of the second surface WK2, or so that the protruding region AS1H adheres to the entire third surface WK3, or so that the protruding region AS1H adheres to a part of the fourth surface WK4.

[0033] According to the third embodiment described above, the substrate BS1 constituting the adhesive sheet AS1 comprises a first energy deformation material ET1 that deforms when heated to 160°C and a second energy deformation material ET2 that deforms when heated to 180°C. This allows only one adhesive material to be attached to the adherend WK, preventing the manufacturing process for producing the sheet-attached product UP from becoming complicated.

[0034] [Fourth embodiment] The adhesive sheet AS2 of the present invention may be an adhesive sheet AS2 as shown in FIG. 4(A). The adhesive sheet AS2 comprises a base material BS2 and an adhesive layer AL2 supported on the base material BS2, and protects a first surface WK1 of the adherend WK and a second surface WK2 different from the first surface WK1.

[0035] The adhesive sheet AS2 as described above can be used in the same manner as in the example of use exemplified in the second embodiment. That is, as in the second embodiment, the adhesive sheet AS2 is attached to the first surface KW1 of the adherend WK so as to form an overhang region AS2H, and then, as shown in FIG. 4(B), first hot air AR1 is blown onto the overhang region AS2H. This causes the first energy deformation material ET3 located in the overhang region ASH to contract and deform, causing the overhang region AS2H to hang down from the outer edge of the adherend WK as shown by the solid line in FIG. 4(B). At this time, the overhang region AS2H may or may not contact the second surface WK2, the third surface WK3, etc. Next, as in the second embodiment, ultraviolet light UV is irradiated onto the overhang region AS2H as shown in FIG. 4(C). As a result, the second energy deformation material ET4 located in the protruding region ASH contracts and deforms, and as shown by the solid line in Fig. 4(C), the protruding region AS2H adheres to the entire second surface WK2 and a part of the third surface WK3 to form a sheet-attached item UP. Note that the adhesive sheet AS2 may be configured so that the protruding region AS2H adheres to a part of the second surface WK2, or so that the protruding region AS2H adheres to the entire third surface WK3, or so that the protruding region AS2H adheres to a part of the fourth surface WK4.

[0036] According to the fourth embodiment described above, the substrate BS2 constituting the adhesive sheet AS2 comprises a first energy deformation material ET3 that is deformed by heat of 160°C, and the adhesive layer AL2 constituting the adhesive sheet AS2 comprises a second energy deformation material ET4 that is deformed by ultraviolet light UV. Therefore, only one adhesive material is attached to the adherend WK, and the manufacturing process for producing the sheet-attached product UP can be prevented from becoming complicated.

[0037] The semiconductor wafer edge protection sheet and adhesive sheet of the present invention are not limited in any way as long as they can perform the functions described for those semiconductor wafer edge protection sheets and adhesive sheets, and are certainly not limited to the components and processes of the single embodiment shown in the above embodiment. For example, the semiconductor wafer edge protection sheet may be any sheet that includes a substrate and an adhesive layer supported on the substrate and protects the outer edges of the first surface of a semiconductor wafer and the second surface located behind the first surface, and is not limited in any way as long as it falls within the technical scope in light of the common general technical knowledge at the time of filing.

[0038] In the first and third embodiments, the protective sheet PS1 and the adhesive sheet AS1 may have the second energy deformation material ET2 laminated between the first energy deformation material ET1 and the adhesive layer AL1, or may have one or more other layers made of resin, paper, metal foil, etc. laminated between the first energy deformation material ET1 and the second energy deformation material ET2, between the base material BS1 and the adhesive layer AL1, or on the outermost layer opposite to the adhesive layer AL1. For example, the first energy deformation material ET1 may be made of a polyolefin that is deformed by heat other than 160°C, such as 130°C or 180°C. Alternatively, polyethylene terephthalate that deforms at temperatures other than 180°C, such as 150°C or 200°C, may be used for the first energy deformation material ET1 and the second energy deformation material ET2. Alternatively, as shown in FIG. 1(E), the second energy deformation material ET2 may be provided only on the outer edge of the first energy deformation material ET1, or as shown in FIG. 1(F), the first energy deformation material ET1 may be provided only on the outer edge of the second energy deformation material ET2. In the first and third embodiments, the protective sheet PS1 and adhesive sheet AS1 employ a first energy deformation material ET1 that is deformed by a first energy such as heat, cold, ultraviolet light, infrared light, X-rays, or gamma rays, and the second energy deformation material ET2 may employ a material that is deformed by a second energy different from the first energy such as heat, cold, ultraviolet light, infrared light, X-rays, or gamma rays, and any combination of the first energy and the second energy may be used.

[0039] In the second and fourth embodiments, the protective sheet PS2 and the adhesive sheet AS2 may have one or more other layers made of resin, paper, metal foil, etc. laminated between the base material BS2 and the adhesive layer AL2 or on the outermost layer opposite the adhesive layer AL2; for example, a polyolefin that deforms when heated to a temperature other than 160°C, such as 130°C or 180°C, may be used for the third energy deformation material ET3; for example, polyethylene terephthalate that deforms when heated to a temperature other than 180°C, such as 150°C or 200°C, may be used for the third energy deformation material ET3; the first energy deformation material ET3 may be one that deforms when exposed to a first energy such as heat, cold, ultraviolet light, infrared light, X-rays, or gamma rays, and the second energy deformation material ET4 may be one that deforms when exposed to a second energy different from the first energy such as heat, cold, ultraviolet light, infrared light, X-rays, or gamma rays; and any combination of the first and second energies may be used. In the second and fourth embodiments, the second energy deformation material ET4 may be provided only on the outer edge of the adhesive AD as shown in Figures 1(G) and 1(H), or may be mixed into the adhesive AD as shown in Figure 1(I).

[0040] The first and second energy deformation materials ET1, ET2, and ET3 may be heat-shrinkable films whose main component is, for example, polyvinyl chloride (PVC) resin, polypropylene (PP) resin, polyethylene (PE) resin, polystyrene (PS) resin, polyolefin (PO) resin, or polyethylene terephthalate (PET) resin, and the first energy deformation material ET1 and the second energy deformation material ET2, or the third energy deformation material ET3 and the fourth energy deformation material ET4, may be combined so as to deform when exposed to heat at different temperatures. The first energy deformation material ET1 and the second energy deformation material ET2, which are primarily composed of polyvinyl chloride resin, can be, for example, the heat-shrinkable films described in JP-A-9-59467 and JP-A-2018-197292, and are not limited in any way. The first energy deformation material ET1 and the second energy deformation material ET2, which are primarily composed of polypropylene resin, can be, for example, the heat-shrinkable films described in JP-A-7-330983 and JP-A-2019-7006, and are not limited in any way. The first energy deformation material ET1 and the second energy deformation material ET2, which are primarily composed of polyethylene resin, may be, for example, the heat-shrinkable films described in Japanese Patent Application Laid-Open No. 5-84826 and Japanese Patent Application Laid-Open No. 2004-75130, and are not limited in any way. The first energy deformation material ET1 and the second energy deformation material ET2, which are mainly composed of polystyrene resin, can be, for example, the heat-shrinkable films described in Japanese Patent Application Laid-Open No. 2000-233444 and Japanese Patent Application Laid-Open No. 2005-187518, and are not limited in any way.

[0041] The first and second energy deformation materials ET1, ET2, ET3, and ET4 may be materials that expand and deform due to the first energy or the second energy, or materials that deform due to the first energy or the fourth energy without contracting or expanding.

[0042] Protective sheet PS1 and adhesive sheet AS1 may be made of a single base material that contains both a material that is deformed by the first energy and a material that is deformed by the second energy. The protective sheets PS1, PS2 and adhesive sheets AS1, AS2 are annular in shape with a hole HL formed in the center, as shown in Figures 1(J) and (K), and may protect the outer edge of the first surface WF1 and the outer edge of the second surface WF2 of the wafer WF, or may protect the outer edge of the first surface WK1 and the entire second surface of the adherend WK exemplified in the second embodiment. The protective sheets PS1, PS2 and adhesive sheets AS1, AS2 may be of any shape, such as a circle, an oval, or a polygon such as a triangle or a rectangle. The semiconductor wafer WF may be a silicon semiconductor wafer, a compound semiconductor wafer, or the like. The adherend WK may be, for example, a single member, multiple members of the same or different types, may have a shape similar to that of the semiconductor wafer WF, may be composed of a first surface WK1 and a second surface WK2, may be composed of a first surface WK1, a second surface WK2 and a third surface WK3, or may be composed of a first surface through a fifth surface or more.

[0043] The materials, types, shapes, etc. of the protective sheets PS1, PS2, adhesive sheets AS1, AS2, wafer WF, and adherend WK in the present invention are not particularly limited. For example, the protective sheets PS1, PS2, adhesive sheets AS1, AS2, wafer WF, and adherend WK may be circular, elliptical, polygonal (e.g., triangular or rectangular), or other shapes. Furthermore, such protective sheets PS1, PS2, and adhesive sheets AS1, AS2 may be three-layer or more layers in which one or more intermediate layers are laminated between the substrate and the adhesive layer, three-layer or more layers in which one or more cover layers are laminated on the top surface of the substrate, or those in which the substrate, intermediate layer, or cover layer is provided in a peelable manner. Furthermore, the wafer WF may be, for example, a silicon semiconductor wafer or a compound semiconductor wafer, and the adherend WK may be, for example, a food product, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disk, a glass plate, a steel plate, a ceramic plate, a wooden board, or a resin, or may be a composite formed of two or more of these, and any type of member or article may be targeted. The protective sheets PS1, PS2 and adhesive sheets AS1, AS2 may be interpreted in terms of their function or use, and may refer to any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, or a recording layer-forming resin sheet.

[0044] The driving device in the above-described embodiments may be an electric device such as a rotary motor, a linear motor, a single-axis robot, or an articulated robot with two or more joints, or an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder, or may be a direct or indirect combination of these. In the above-described embodiments, when a rotating member such as a roller is used, a driving device for driving the rotating member to rotate may be provided, the surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member, or other members such as a rotating or non-rotating shaft or blade may be used instead of the roller, and when a pressing means or pressing member such as a pressing roller or pressing head that presses an object to be pressed is used, a roller, a round bar, a blade material, a brush-like member, or a member that blows air or gas may be used instead of or in combination with the above-described examples, or the pressing member may be made of a deformable member such as rubber, resin, sponge, etc. However, it may be made of an indeformable material such as metal or resin, and when a peeling means or peeling member such as a peeling plate or peeling roller is used to peel the object to be peeled, a plate-shaped member, a round bar, a roller, or other member may be used in place of or in combination with the above-mentioned examples, and the peeling means may be made of a deformable material such as rubber or resin, or may be made of an indeformable material, and when a supporting (holding) means or supporting (holding) member that supports (holds) the supported member (held member) is used, a configuration may be used in which the supported member is supported (held) using a gripping means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure-sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, driving equipment, etc. [Explanation of symbols]

[0045] AL1, AL2…Adhesive layer AS1, AS2...Adhesive sheet BS1, BS2…Base material ET1, ET3...First energy deformation material ET2, ET4...Second energy deformation material PS1, PS2...protective sheet WF: Semiconductor wafer WF1, WK1...First page WF2, WK2...2nd side WK...Adherend

Claims

1. A semiconductor wafer edge protection sheet includes a substrate and an adhesive layer supported on the substrate, and protects the edge portions of a first surface of a semiconductor wafer and a second surface located on the back side of the first surface, The substrate comprises a first energy deformation material that is deformed by a first energy, and a second energy deformation material that is deformed by a second energy.

2. The semiconductor wafer edge protection sheet according to claim 1, characterized in that either the first energy deformation material or the second energy deformation material is provided only on the outer edge portion of the other of the second energy deformation material or the first energy deformation material.

3. A semiconductor wafer edge protection sheet includes a substrate and an adhesive layer supported on the substrate, and protects the edge portions of a first surface of a semiconductor wafer and a second surface located on the back side of the first surface, the substrate includes a first energy deformation material that is deformed by a first energy, The adhesive layer is provided with a second energy deformation material that is deformed by a second energy.

4. 4. The semiconductor wafer edge protection sheet according to claim 3, wherein the second energy deformation material is provided only on the outer edge of the adhesive layer.

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