Extrusion removal mechanism and expansion device

Abstract

To restrain a die attach film from adhering to a device and remove slack in an expanded sheet.SOLUTION: A protrusion removing mechanism 60 includes a holding unit 61 for holding a wafer unit 200, a feed-out unit 63 for feeding out a release tape 300 having an adhesive layer laminated to a protrusion 212 of the wafer unit 200 held by the holding unit 61, a wind-up unit 64 for winding up the release tape 300 which is fed out by the feed-out unit 63, DAF 202 of the protrusion 212 being attached to the adhesive layer of the release tape, and a peeling roller 622 which is arranged between the feed-out unit 63 and the wind-up unit 64 in a moving direction of the release tape 300, and rolls while pressing the adhesive layer side of the release tape 300 against the protrusion 212, thereby peeling the protrusion 212 from a sheet 203 and attaching the protrusion to the adhesive layer of the release tape 300.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an overhang removal mechanism that removes overhanging portions of a die attach film from a wafer unit in which a wafer is attached to a sheet via the die attach film, and an expanding device that expands the sheet of the wafer unit. [Background technology]

[0002] Die attach materials are widely used when mounting device chips on mounting substrates, and a sheet called 2-in-1, which is a sheet on which a die attach film is formed, is commercially available.

[0003] The diameter of the die attach film is made larger than the diameter of the wafer to take into account the possibility of misalignment when the wafer is positioned and attached onto the die attach film laminated on the sheet, and when the wafer is attached, an overhanging portion of the die attach film is formed on the outer periphery of the wafer.

[0004] When the sheet is expanded to break the die attach film, the excess die attach film peels off from the sheet and adheres to the surfaces of the chips formed when the wafer is divided. In semiconductor device wafers, if the die attach film adheres to the device surface, it can damage the device or cause mounting defects in the subsequent mounting process, which is a problem.

[0005] Therefore, an expanding device has been proposed that holds down the protruding portion of the die attach film to prevent it from scattering (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-272502 Summary of the Invention [Problem to be solved by the invention]

[0007] However, it was difficult to completely prevent fragments of the die attach film from scattering, as the die attach film attached to the restraining member could float inside the expanding device and adhere to the device. Also, if the protruding part of the die attach film breaks off and adheres to the inside of the expander, it could fall at an unintended time, float inside the expanding device, and adhere to the device, so improvement was eagerly desired.

[0008] On the other hand, when the wafer unit is attached to the frame in advance as described above, the sheet is heated and shrunk after expansion to remove the slack generated by the expansion between the outer periphery of the wafer and the inner periphery of the frame.

[0009] However, die attach films are generally made of thermosetting resin, and even if the sheet is heated while the protruding portion is present on the sheet, the sheet in the protruding area does not shrink, and if slack remains, the chips into which the wafer is divided may come into contact with each other and be damaged.

[0010] An object of the present invention is to provide an overhang removal mechanism and an expansion device that can prevent the die attach film from adhering to a device and can remove slack in the sheet after expansion. [Means for solving the problem]

[0011] In order to solve the above-mentioned problems and achieve the object, the protruding portion removing mechanism of the present invention is an protruding portion removing mechanism that removes, from a wafer unit consisting of a wafer, a die attach film that is larger than the wafer and is laminated on the back side of the wafer, and a sheet to which the wafer is attached via the die attach film, a protruding portion of the die attach film that protrudes to the outer periphery of the wafer, the protruding portion removing mechanism comprising: a holding unit that holds the wafer unit; a take-up unit that takes up the peeling tape that has been fed out by the feed-out unit and has the die attach film in the protruding portion adhered to the adhesive layer; and a peeling roller that is disposed between the feed-out unit and the take-up unit and that presses the adhesive layer side of the peeling tape against the protruding portion of the wafer unit while rolling relative to the wafer unit to peel the die attach film in the protruding portion from the sheet and adhere it to the adhesive layer of the peeling tape.

[0012] The expanding device of the present invention is an expanding device that expands a sheet of a wafer unit consisting of a wafer, a die attach film that is larger than the wafer and is laminated on the back side of the wafer, and a sheet to which the wafer is attached via the die attach film, and is equipped with an expanding unit that expands the sheet, an overhanging portion removing mechanism that removes an overhanging portion from the wafer unit before expanding the sheet, and a transport unit that transports the wafer unit from which the overhanging portion has been removed by the overhanging portion removing mechanism to the expanding unit, and the overhanging portion removing mechanism holds the wafer unit. The device is characterized by comprising a holding unit, a feed-out unit that feeds out a peeling tape having an adhesive layer laminated on its surface to the wafer unit held by the holding unit, a take-up unit that winds up the peeling tape that has been fed out by the feed-out unit and has the die attachment film in the protruding portion adhered to the adhesive layer, and a peeling roller that is disposed between the feed-out unit and the take-up unit and rolls over the protruding portion while pressing the adhesive layer side of the peeling tape against the protruding portion of the wafer unit, thereby adhering the die attachment film in the protruding portion to the adhesive layer of the peeling tape and peeling it off from the sheet.

[0013] In the expanding device, the peeling roller may peel the die attach film at the protruding portion from the sheet by repeatedly rolling in the radial direction of the wafer and then in the circumferential direction of the wafer. [Effects of the Invention]

[0014] The present invention has the effect of being able to prevent the die attach film from adhering to the device and to remove slack in the sheet after expansion. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view showing a configuration example of an expanding device according to the first embodiment. [Figure 2]FIG. 2 is a perspective view showing an example of a wafer unit to be processed by the expanding apparatus according to the first embodiment. [Figure 3] FIG. 3 is a side view, partially in cross section, schematically illustrating the configuration of the protruding portion removing mechanism according to the first embodiment. [Figure 4] FIG. 4 is an enlarged view of part IV in FIG. [Figure 5] FIG. 5 is a side view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 3 removes the protruding portion of the wafer unit. [Figure 6] FIG. 6 is an enlarged view of part VI in FIG. [Figure 7] FIG. 7 is a plan view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 3 first removes a part of the protruding portion when removing the protruding portion of the wafer unit. [Figure 8] FIG. 8 is a plan view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 7 has first removed a part of the protruding portion. [Figure 9] FIG. 9 is a plan view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 8 next removes a part of the protruding portion. [Figure 10] FIG. 10 is a plan view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 9 has removed a part of the protruding portion. [Figure 11] FIG. 11 is a plan view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 10 next removes a part of the protruding portion. [Figure 12] FIG. 12 is a plan view schematically showing a state in which the protruding portion removing mechanism shown in FIG. 10 has removed a part of the protruding portion. DETAILED DESCRIPTION OF THE INVENTION

[0016] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0017] [Embodiment 1] An expanding device according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of the configuration of the expanding device according to the first embodiment. Fig. 2 is a perspective view showing an example of a wafer unit to be processed by the expanding device according to the first embodiment.

[0018] The expanding device 1 shown in Fig. 1 according to the first embodiment is a device that expands (also referred to as expanding) a sheet 203 of a wafer unit 200 shown in Fig. 2. As shown in Fig. 2, the wafer unit 200 is made up of a wafer 201, a die attach film (hereinafter referred to as DAF) 202, a sheet 203, and a frame 204.

[0019] In the first embodiment, the wafer 201 is a disk-shaped semiconductor wafer, an optical device wafer, or the like, whose substrate is silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like. As shown in Fig. 2, the wafer 201 has a surface 205 partitioned by a plurality of mutually intersecting planned division lines 206, and devices 207 are formed in each of the regions. The devices 207 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors), or memories (semiconductor storage devices).

[0020] The wafer 201 is irradiated along the dividing lines 206 with a laser beam having a wavelength that is transparent to the substrate from the back surface 208 side behind the front surface 205, and modified layers 209 (shown by dotted lines in FIG. 2) that serve as dividing start points are formed inside the substrate along the dividing lines 206. The wafer 201 is divided into individual chips 210 starting from the modified layers 209. Each chip 210 includes a portion of the substrate divided along the dividing lines 206 and a device 207 formed on the front surface of the substrate, and has a portion of the divided DAF 202 attached to the back surface 208 of the substrate.

[0021] The modified layer 209 refers to a region where the density, refractive index, mechanical strength, or other physical properties are different from those of the surrounding area, and examples thereof include a melting process region, a crack region, a dielectric breakdown region, a refractive index change region, and a region where these regions are mixed, etc. The mechanical strength of the modified layer 209 is lower than the mechanical strength of other positions on the substrate.

[0022] The DAF 202 is an adhesive film for die bonding to fix the individually separated chips 210 to other chips or a substrate, etc. The DAF 202 is formed in a disk shape with a diameter (corresponding to the size) larger than the diameter of the wafer 201. The DAF 202 is laminated on the back surface 208 side of the wafer 201. The DAF 202 is also formed with a diameter larger than the wafer 201, and has a protruding portion 212 that protrudes outward from the outer periphery of the wafer 201, which is provided around the entire periphery of the wafer 201.

[0023] The wafer 201 is attached to the sheet 203 via the DAF 202. The sheet 203 is made of a stretchable resin and has heat-shrinkability, meaning that it shrinks when heated. The sheet 203 is formed into a disk shape with a diameter larger than the diameters of the wafer 201 and the DAF 202, and includes a base layer made of a stretchable and heat-shrinkable synthetic resin, and an adhesive layer laminated on the base layer, attached to the wafer 201, and made of a stretchable and heat-shrinkable synthetic resin.

[0024] The surface of the adhesive layer is a surface to which the DAF 202 is attached and to which the back surface 208 of the wafer 201 is attached via the DAF 202. In the first embodiment, the adhesive layer is made of a synthetic resin that hardens and loses its adhesive strength when irradiated with ultraviolet light.

[0025] In embodiment 1, the sheet 203 is a so-called 2-in-1 tape in which a DAF 202 is attached to the surface to be attached in advance, and the DAF 202 is attached to the back surface 208 of the wafer 201, thereby attaching the sheet 203 to the back surface 208 of the wafer 201 via the DAF 202.

[0026] The frame 204 is formed in an annular shape with an inner diameter larger than the diameter of the wafer 201 and the DAF 202, and the outer periphery of the sheet 203 is attached to the frame 204.

[0027] The wafer unit 200 having the above-described configuration is configured such that the back surface 208 of the wafer 201 is attached to the DAF 202 attached to the attachment surface of the sheet 203, and the frame 204 is attached to the outer periphery of the sheet 203.

[0028] The expanding apparatus 1 according to the first embodiment shown in Fig. 1 is an apparatus that expands a sheet 203 of a wafer unit 200, divides a wafer 201 on which a modified layer 209 has been formed as a division starting point into individual chips 210 along a planned division line 206, and divides a DAF 202 into each chip 210. As shown in Fig. 1, the expanding apparatus 1 includes a cassette elevator 3 provided in an apparatus main body 2, an expansion unit 10, a heat shrink unit 20, a cleaning unit 30, an ultraviolet irradiation unit 40, a transport unit 50, an overhang portion removing mechanism 60 that removes, from the wafer unit 200, an overhang portion 212 of the DAF 202 that overhangs the outer periphery of the wafer 201, and a control unit 100 that serves as a control means.

[0029] The cassette elevator 3 is disposed at one end of the apparatus main body 2 in the Y-axis direction, which is parallel to the horizontal direction, and a cassette 4 containing a plurality of wafer units 200 is removably placed thereon. The cassette 4 contains a plurality of wafer units 200 at intervals in the Z-axis direction, which is parallel to the vertical direction. The cassette 4 is placed on the cassette elevator 3 with an opening 5, through which the wafer units 200 can be freely inserted and removed, facing the center of the apparatus main body 2 in the Y-axis direction. The cassette elevator 3 raises and lowers the cassette 4 in the Z-axis direction.

[0030] The expanding apparatus 1 also includes a pair of first guide rails 6 and a pair of second guide rails 7 on which wafer units 200 to be inserted into or removed from the cassette 4 are temporarily placed. The pair of first guide rails 6 are parallel to the Y-axis direction and are spaced apart from each other in the X-axis direction, which is parallel to the horizontal direction and perpendicular to the Y-axis direction. The pair of first guide rails 6 are disposed in the center of the apparatus body 2 in the Y-axis direction so as to be aligned with both ends of the X-axis direction of the opening 5 of the cassette 4 placed in the cassette elevator 3. The pair of first guide rails 6 are movable in the X-axis direction by a drive mechanism (not shown), and are moved toward or away from each other by the drive mechanism. The pair of first guide rails 6 are placed with wafer units 200 to be inserted into or removed from the cassette 4, and when they are moved toward each other by the drive mechanism, they position the wafer units 200 in the X-axis direction.

[0031] The pair of second guide rails 7 are provided for temporary placement of wafer units 200 and the like transferred from the first guide rails 6 by the transfer unit 50. The pair of second guide rails 7 are parallel to the Y-axis direction, parallel to the horizontal direction, and spaced apart from each other in the X-axis direction. The pair of second guide rails 7 are disposed in the center of the apparatus main body 2 in the Y-axis direction, and adjacent to the first guide rails 6 in the X-axis direction. The pair of second guide rails 7 are provided so as to be movable in the X-axis direction by a drive mechanism (not shown), and are moved toward and away from each other by the drive mechanism. The pair of second guide rails 7 are provided for placement of wafer units 200 and the like transferred from the first guide rails 6, and when they are moved toward each other by the drive mechanism, the wafer units 200 are positioned in the X-axis direction.

[0032] The transport unit 50 includes a first transport unit 51 that transports the wafer unit 200 between the cassette 4 and the first guide rail 6, between the first guide rail 6 and the ultraviolet irradiation unit 40, and between the first guide rail 6 and the protrusion removal mechanism 60, a second transport unit 52 that transports the wafer unit 200 between the first guide rail 6 and the second guide rail 7, between the second guide rail 7 and the heat shrink unit 20, between the heat shrink unit 20 and the cleaning unit 30, and between the cleaning unit 30 and the first guide rail 6, and a third transport unit 53 that transports the wafer unit 200 between the second guide rail 7 and the expansion unit 10. By including the first transport unit 51, the second transport unit 52, and the third transport unit 53, the transport unit 50 transports the wafer unit 200, from which the protrusion 212 has been removed by the protrusion removal mechanism 60, to the expansion unit 10.

[0033] The expansion unit 10 is disposed adjacent to one side in the Y-axis direction of the pair of second guide rails 7. The expansion unit 10 expands the sheet 203 of the wafer unit 200 from which the sheet 203 has been irradiated with ultraviolet light by the ultraviolet irradiation unit 40 and the protruding portion 212 of the DAF 202 has been removed by the protruding portion removing mechanism 60, and divides the wafer 201 into individual chips 210 starting from the modified layer 209. The expansion unit 10 is housed in a cooling chamber 14 (shown in FIG. 1 ) whose inside is cooled and which is disposed adjacent to one side in the Y-axis direction of the pair of second guide rails 7 of the apparatus main body 2.

[0034] The heat shrink unit 20 is disposed adjacent to the other side in the Y-axis direction of the pair of second guide rails 7. The heat shrink unit 20 heats and shrinks the slack that occurs between the outer periphery of the wafer 201 on the sheet 203 and the inner periphery of the frame 204 when the sheet 203 is expanded by the expansion unit 10.

[0035] The cleaning unit 30 mainly cleans the wafers 201 of the wafer unit 200, whose sheet 203 has been expanded by the expansion unit 10 and whose slack has been heated and shrunk by the heat shrink unit 20. The cleaning unit 30 includes a spinner table 31 that is disposed below the pair of first guide rails 6 and that suction-holds the wafers 201 via the sheet 203 of the wafer unit 200, and a cleaning water supply nozzle (not shown) that supplies cleaning water to the surface 205 of the wafer 201 that is suction-held on the spinner table 31.

[0036] In cleaning unit 30, when the pair of first guide rails 6 are separated from each other, the slack is heated by heat shrink unit 20 via second transport unit 52, and the shrunk wafer unit 200 is placed on spinner table 31. Cleaning unit 30 supplies cleaning water from a cleaning water supply nozzle onto surface 205 of wafer 201 while rotating spinner table 31 about an axis parallel to the Z-axis direction, thereby cleaning wafer 201.

[0037] The ultraviolet irradiation unit 40 irradiates ultraviolet light onto the sheet 203 of the wafer unit 200 after it has been carried out of the cassette 4 and before the sheet 203 is expanded, thereby hardening the adhesive layer and reducing the adhesive strength of the adhesive layer. The ultraviolet irradiation unit 40 is disposed at the other end of the apparatus main body 2 in the Y-axis direction, and is disposed next to one side of the first guide rail 6 in the Y-axis direction.

[0038] The wafer unit 200 on the first guide rails 6 is carried in by the first transport unit 51, and the ultraviolet irradiation unit 40 irradiates the sheet 203 of the carried-in wafer unit 200 with ultraviolet rays for a predetermined period of time. The wafer unit 200 irradiated with ultraviolet rays is carried out onto the first guide rails 6 by the first transport unit 51.

[0039] The ultraviolet irradiation unit 40 is raised and lowered in the Z-axis direction by an elevator 8 provided in the apparatus body 2. The ultraviolet irradiation unit 40 is housed in a case 41 that is raised and lowered by the elevator 8. The wafer unit 200 is carried in and out of the case 41 through a carry-in / out port (not shown).

[0040] The protruding portion removing mechanism 60 removes the protruding portion 212 of the DAF 202 from the wafer unit 200, where the sheet 203 has been irradiated with ultraviolet rays by the ultraviolet irradiation unit 40, before the sheet 203 is expanded by the expansion unit 10. In the first embodiment, the protruding portion removing mechanism 60 is installed on a case 41 that houses the ultraviolet irradiation unit 40 and is raised and lowered by the elevator 8. Next, the protruding portion removing mechanism 60 according to the first embodiment will be described with reference to the drawings.

[0041] FIG. 3 is a side view, partially in cross section, showing a schematic configuration of the protruding portion removing mechanism according to the first embodiment. FIG. 4 is an enlarged view of section IV in FIG. 3. FIG. 5 is a side view, partially in cross section, showing a state in which the protruding portion removing mechanism shown in FIG. 3 removes a protruding portion of a wafer unit. FIG. 6 is an enlarged view of section VI in FIG. 5. FIG. 7 is a plan view, partially in section, showing a state in which the protruding portion removing mechanism shown in FIG. 3 first removes a portion of the protruding portion when removing the protruding portion of a wafer unit. FIG. 8 is a plan view, partially in section, showing a state in which the protruding portion removing mechanism shown in FIG. 7 first removes a portion of the protruding portion. FIG. 9 is a plan view, partially in section, showing a state in which the protruding portion removing mechanism shown in FIG. 8 next removes a portion of the protruding portion. FIG. 10 is a plan view, partially in section, showing a state in which the protruding portion removing mechanism shown in FIG. 9 removes a portion of the protruding portion. Fig. 11 is a plan view schematically showing a state in which the protrusion removing mechanism shown in Fig. 10 next removes a part of the protrusion. Fig. 12 is a plan view schematically showing a state in which the protrusion removing mechanism shown in Fig. 10 has removed a part of the protrusion.

[0042] As shown in FIGS. 1 and 3, the protruding portion removing mechanism 60 includes a holding unit 61, a removing unit 62 that removes the protruding portion 212 from the wafer unit 200, a lifting unit 65, a rotating unit 66, and a horizontal moving unit 67.

[0043] The holding unit 61 is installed on the upper surface of the case 41 and holds the wafer unit 200 before the sheet 203 is expanded. The holding unit 61 is in the shape of a disk with a diameter larger than the outer shape of the frame 204, and includes a disk-shaped frame body 611 made of a metal such as stainless steel, and a disk-shaped suction part 612 made of a porous material such as porous ceramic and surrounded by the frame body 611.

[0044] The upper surfaces of the frame 611 and the suction portion 612 are arranged on the same plane and form a holding surface 613 that suction-holds the wafer unit 200. The suction portion 612 has the same outer diameter as the frame 204. The suction portion 612 is connected to a suction source (not shown), such as an ejector, via a suction path 614 formed in the frame 611, etc.

[0045] The holding unit 61 has the back surface 208 of the wafer 201 placed on the holding surface 613 via the sheet 203 of the wafer unit 200 before the sheet 203 is spread by the first transport unit 51 and before the sheet 203 is irradiated with ultraviolet rays by the ultraviolet irradiation unit 40. The holding unit 61 suction-holds the back surface 208 of the wafer 201 on the holding surface 613 by sucking the suction portion 612 of the holding surface 613 with the suction source.

[0046] 3, the removing unit 62 includes a unit main body 621, a feeding unit 63, a winding unit 64, a peeling roller 622, and a plurality of guide rollers 623. The unit main body 621 is disposed such that both surfaces are parallel to the Z-axis direction and one surface is parallel to the radial direction of the wafer 201 of the wafer unit 200 held by the holding unit 61 under suction.

[0047] The delivery unit 63 delivers the peeling tape 300 to the wafer unit 200 held by suction in the holding unit 61. The peeling tape 300 delivered by the delivery unit 63 to the wafer unit 200 is formed in a strip shape, and its width is smaller than the diameter of the wafer 201 of the wafer unit 200. As shown in Fig. 4, the peeling tape 300 includes a base layer 301 made of a flexible, non-adhesive synthetic resin, and an adhesive layer 302 laminated on the surface of the base layer 301 and made of a flexible, adhesive synthetic resin. In this way, the peeling tape 300 has the adhesive layer 302 laminated on the surface of the base layer 301.

[0048] In the first embodiment, the feed unit 63 is disposed at the upper end of the unit main body 621 and includes a feed roller 631 around which the peeling tape 300 is wound. The feed roller 631 is wound with the peeling tape 300 with the adhesive layer 302 positioned on the outer periphery. The feed roller 631 is rotatably disposed on one surface of the unit main body 621, has a cylindrical appearance, and is rotated around its axis by a motor (not shown). The axis of the feed roller 631 is parallel to the tangent direction of the outer edge of the wafer 201 of the wafer unit 200 held by suction in the holding unit 61. The feed unit 63 feeds the peeling tape 300 to the wafer unit 200 held by suction in the holding unit 61 by rotating the feed roller 631 around its axis.

[0049] The winding unit 64 winds up the peeling tape 300 that has been fed out by the feeding unit 63 and in which the DAF 202 of the protruding portion 212 is adhered to the adhesive layer 302. In the first embodiment, the winding unit 64 is disposed below the feeding unit 63 and at the upper end of the unit body 621, and includes a winding roller 641 that winds around its outer circumferential surface the peeling tape 300 in which the DAF 202 of the protruding portion 212 is adhered to the adhesive layer 302.

[0050] The take-up roller 641 winds the peeling tape 300 around it, with the adhesive layer 302 positioned on the outer periphery. The take-up roller 641 is rotatably arranged on one surface of the unit body 621, has a cylindrical appearance, and is rotated around its axis by a motor (not shown). The axis of the take-up roller 641 is parallel to the tangent direction of the outer edge of the wafer 201 of the wafer unit 200 held by suction in the holding unit 61 and to the axis of the feed roller 631. The take-up unit 64 winds up the peeling tape 300 fed from the feed unit onto the wafer unit 200 held by suction in the holding unit 61, as the take-up roller 641 rotates around its axis.

[0051] The peeling roller 622 is disposed between the feeding unit 63 and the winding unit 64 in the moving direction of the peeling tape 300. In the first embodiment, the peeling roller 622 is disposed at the lower end of the unit main body 621 and at a position facing, in the Z-axis direction, the protruding portion 212 of the DAF 202 on the outer periphery side of the wafer 201 of the wafer unit 200 held by suction on the holding unit 61, as shown in FIG.

[0052] The peeling roller 622 is rotatably disposed on one surface of the unit body 621, has a cylindrical appearance, and is supported by the unit body 621 so as to be rotatable about its axis. The axis of the peeling roller 622 is parallel to the tangent direction of the outer edge of the wafer 201 of the wafer unit 200 held by suction in the holding unit 61, the axis of the feed roller 631, and the axis of the take-up roller 641. The peeling roller 622 passes the peeling tape 300, which is fed from the feed unit 63 and taken up by the take-up unit 64, below it.

[0053] 5 , by lowering the unit body 621, the peeling roller 622 presses the adhesive layer 302 of the peeling tape 300, which is fed out from the feed unit 63 and taken up by the take-up unit 64, against the protruding portion 212 of the DAF 202 of the wafer unit 200 held by suction on the holding unit 61. The peeling roller 622 rolls on the protruding portion 212 relative to the wafer unit 200 by being moved by the horizontal movement unit 67 in the radial direction of the wafer 201 of the wafer unit 200 held by suction on the holding unit 61.

[0054] The peeling roller 622 is pressed against the protruding portion 212 of the DAF 202 of the wafer unit 200 held by suction in the holding unit 61, and rolls on the protruding portion 212 relative to the wafer unit 200, thereby peeling the DAF 202 of the protruding portion 212 from the sheet 203 and adhering it to the adhesive layer 302 of the peeling tape 300, as shown in Figure 6, and the peeling tape 300 with the protruding portion 212 of the DAF 202 adhered to the adhesive layer 302 is then taken up by the winding roller 641 of the winding unit 64.

[0055] The plurality of guide rollers 623 are arranged between the feed unit 63 and the take-up unit 64 in the movement direction of the peeling tape 300. In the first embodiment, two guide rollers 623 are provided between the feed unit 63 and the peeling roller 622 in the movement direction of the peeling tape 300, and one guide roller 623 is provided between the peeling roller 622 and the take-up unit 64 in the movement direction of the peeling tape 300. The guide roller 623 is rotatably arranged on one surface of the unit main body 621, has a cylindrical appearance, and is supported by the unit main body 621 so as to be rotatable about its axis. The axis of the guide roller 623 is parallel to the tangent direction of the outer edge of the wafer 201 of the wafer unit 200 suction-held by the holding unit 61, the axis of the feed roller 631, the axis of the take-up roller 641, and the axis of the peeling roller 622. The guide roller 623 applies tension to the peeling tape 300 by bringing the base layer 301 of the peeling tape 300 into contact with the outer peripheral surface thereof.

[0056] The lifting unit 65 lifts and lowers the removing unit 62 along the Z-axis direction. The rotating unit 66 rotates the removing unit 62, together with the lifting unit 65, around an axis parallel to the Z-axis direction of the holding unit 61. The horizontal moving unit 67 moves the removing unit 62 in the radial direction of the holding surface 613 of the holding unit 61.

[0057] In the protruding portion removing mechanism 60 having the above-described configuration, the wafer unit 200 before the sheet 203 is expanded after ultraviolet light has been irradiated onto the sheet 203 by the ultraviolet irradiation unit 40 is placed on the holding surface 613 of the holding unit 61. The protruding portion removing mechanism 60 suction-holds the wafer unit 200 on the holding surface 613 of the holding unit 61. The protruding portion removing mechanism 60 lowers the removing unit 62, and presses the adhesive layer of the peeling tape 300 abutting against the outer peripheral surface of the peeling roller 622 against the inner edge of the protruding portion 212 closer to the wafer 201, as shown in FIGS.

[0058] The protruding portion removing mechanism 60 moves the removing unit 62 radially outward of the holding surface 613, causes the peeling roller 622 to roll on the protruding portion 212, and in conjunction with the radial movement of the removing unit 62, rotates the feed roller 631 in the direction to feed out the peeling tape 300 and rotates the take-up roller 641 in the direction to take up the peeling tape 300. The protruding portion removing mechanism 60 adheres the protruding portion 212 to the adhesive layer 302 of the peeling tape 300 by the rolling of the peeling roller 622, thereby removing it from the sheet 203, and also rotates the feed roller 631 and the take-up roller 641 to take up the peeling tape 300 with the protruding portion 212 adhered to the adhesive layer 302, around the take-up roller 641 by the rotation of the feed roller 631 and the take-up roller 641.

[0059] 8, the protruding portion removing mechanism 60 stops the radial movement of the removing unit 62 when the peeling roller 622 is positioned on the outer edge of the protruding portion 212. In this way, the protruding portion removing mechanism 60 removes a part of the protruding portion 212 on which the peeling roller 622 has rolled above. The protruding portion removing mechanism 60 raises the removing unit 62, rotates the removing unit 62 about its axis, and moves the removing unit 62 in the circumferential direction relative to the wafer unit 200 by the length of the peeling roller 622, thereby moving the removing unit 62 radially inward.

[0060] The protruding portion removing mechanism 60 lowers the removing unit 62 and presses the adhesive layer of the peeling tape 300 in contact with the outer circumferential surface of the peeling roller 622 against the inner edge of the protruding portion 212 closer to the wafer 201, as shown in Fig. 9. The protruding portion removing mechanism 60 moves the removing unit 62 to the outer circumferential side in the radial direction of the holding surface 613 and rolls the peeling roller 622 on the protruding portion 212 as shown in Fig. 10, and removes the part of the protruding portion 212 that the peeling roller 622 has rolled above, in the same manner as before.

[0061] The protruding portion removing mechanism 60 raises the removing unit 62, rotates the removing unit 62 about its axis, and moves the removing unit 62 in the circumferential direction relative to the wafer unit 200 by the length of the peeling roller 622, thereby moving the removing unit 62 radially inward. The protruding portion removing mechanism 60 lowers the removing unit 62, and presses the adhesive layer of the peeling tape 300 abutting the outer peripheral surface of the peeling roller 622 against the inner edge of the protruding portion 212 closer to the wafer 201, as shown in Fig. 11, moves the removing unit 62 radially outward of the holding surface 613, and rolls the peeling roller 622 on the protruding portion 212, as shown in Fig. 12, thereby removing the part of the protruding portion 212 that the peeling roller 622 has rolled above, in the same manner as before. In this way, the protruding portion removing mechanism 60 peels the DAF 202 of the protruding portion 212 from the sheet 203 by repeatedly causing the peeling roller 622 to roll in the radial direction of the holding surface 613, i.e., the wafer 201, in the circumferential direction of the wafer 201.

[0062] The control unit 100 controls the above-mentioned components of the expanding apparatus 1, i.e., at least the heating means 38, etc., and causes the expanding apparatus 1 to perform processing operations on the wafers 201. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the expanding apparatus 1 to the above-mentioned components of the expanding apparatus 1 via the input / output interface device.

[0063] The control unit 100 is connected to a display unit (not shown) that is configured with a liquid crystal display device or the like that displays the status of the machining operation, images, etc., and an input unit (not shown) that the operator uses to register machining content information, etc. The input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

[0064] As described above, the protruding portion removing mechanism 60 and the expanding apparatus 1 according to the first embodiment remove the protruding portions 212 of the DAFs 202 of the wafer units 200 from the sheet 203 before the sheet 203 is expanded, and therefore can prevent the protruding portions 212 of the DAFs 202 from peeling off from the sheet 203 when the sheet 203 is expanded. Furthermore, the protruding portion removing mechanism 60 and the expanding apparatus 1 according to the first embodiment remove the protruding portions 212 of the DAFs 202 of the wafer units 200 from the sheet 203 before the sheet 203 is expanded, and therefore can prevent the protruding portions 212 of the DAFs 202 from interfering with contraction of the sheet 203 when heating the expanded sheet 203 to remove slack. As a result, the protruding portion removing mechanism 60 and the expanding apparatus 1 according to the first embodiment exhibit the effects of being able to prevent the DAFs 202 from adhering to the device 207 and being able to remove slack from the expanded sheet 203.

[0065] If the protruding portion 212 is to be removed by positioning the axis of the peeling roller 622 in the radial direction of the wafer 201 and rolling the peeling roller 622 along the outer periphery of the wafer 201, the widths of the peeling roller 622 and the peeling tape 300 must be set according to the width of the protruding portion 212, which requires the time and effort of preparing and managing a plurality of peeling rollers 622 and peeling tapes 300 with different widths. Furthermore, if the protruding portion 212 is to be removed by rolling the peeling roller 622 along the outer periphery of the wafer 201, the DAF 202 will be twisted during peeling because the moving distances of the peeling roller 622 will be different on the inside and outside. However, the protrusion removal mechanism 60 and the expanding device 1 according to the first embodiment peel off the DAF 202 of the protrusion 212 from the sheet 203 by repeatedly rolling the peeling roller 622 in the radial direction of the holding surface 613, i.e., the wafer 201, in the circumferential direction of the wafer 201 multiple times. This eliminates the need to prepare and manage multiple peeling rollers 622 and peeling tapes 300 of different widths, and enables the protrusion 212 to be removed without twisting the DAF 202.

[0066] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the first embodiment, the modified layer 209 is formed as the division starting point, but the present invention is not limited to this, and a laser-processed groove or a cut groove may be formed as the division starting point. Furthermore, in the present invention, the wafer unit 200 irradiated with ultraviolet light in advance may be stored in the cassette 4, and the expanding device 1 may not be equipped with the ultraviolet light irradiation unit 40.

[0067] In the first embodiment, the extrusion removing mechanism 60 and the expanding device 1 rotate the rollers 631, 641 using a motor, but the present invention is not limited to this, and a configuration may also be adopted in which the feed roller 631 and the take-up roller 641 rotate in conjunction with each other using an interlocking mechanism such as gears and a belt without using a motor. In this case, for example, the interlocking mechanism may attach gears to the respective axes of the feed roller 631 and the take-up roller 641, and loop a belt around the outer peripheries of these gears to rotate these rollers 631, 641 in conjunction with each other in a direction in which the feed roller 631 feeds out the release tape 300 and the take-up roller 641 takes up the release tape 300. In this case, the extrusion removing mechanism 60 rolls while adhering the extrusion portion 212 by moving the peeling roller 622 radially outward from the inner edge toward the outer edge of the extrusion portion 212 while pressing the adhesive layer 302 side of the peeling tape 300 against the extrusion portion 212. In the protrusion removal mechanism 60, the rolling peeling roller 622 pulls the peeling tape 300 from the feed roller 631, causing the feed roller 631 to rotate in the direction of feeding the peeling tape 300, and the rotational force rotates the take-up roller 641 via an interlocking mechanism such as gears and a belt, and the take-up roller 641 takes up the peeling tape 300 to which the protrusion 212 of the DAF 202 has been attached. [Explanation of symbols]

[0068] 1 Expanding device 10 Expansion Unit 50 transport units 60 Protruding part removal mechanism 61 Holding Unit 63 Sending unit 64 Winding unit 200 wafer units 201 wafers 202 DAF (Die Attach Film) 203 seats 208 Back side 212 protruding part 300 Peeling Tape 302 Adhesive layer 622 Peeling roller

Claims

1. A protrusion removal mechanism for removing, from a wafer unit comprising a wafer, a die attachment film having a size larger than the wafer and laminated on the back surface of the wafer, and a sheet to which the wafer is attached via the die attachment film, a protrusion of the die attachment film that protrudes to the outer periphery of the wafer, a holding unit that holds the wafer unit; a delivery unit that delivers a peeling tape having an adhesive layer laminated on its surface to the protruding portion of the wafer unit held by the holding unit; a take-up unit that takes up the peeling tape fed by the feed-out unit and with the protruding portion of the die attach film attached to the adhesive layer; and a peeling roller that is disposed between the delivery unit and the winding unit and that rolls relative to the wafer unit while pressing the adhesive layer side of the peeling tape against the protruding portion of the wafer unit, thereby peeling the die attach film at the protruding portion from the sheet and adhering it to the adhesive layer of the peeling tape.

2. An expanding device for expanding a sheet of a wafer unit comprising a wafer, a die attach film having a size larger than the wafer and laminated on the back surface of the wafer, and a sheet to which the wafer is attached via the die attach film, an expansion unit that expands the seat; an overhang removal mechanism that removes overhangs from the wafer unit before expanding the sheet; a transport unit that transports the wafer unit from which the protruding portion has been removed by the protruding portion removing mechanism to the expansion unit, The protrusion removing mechanism includes: a holding unit that holds the wafer unit; a delivery unit that delivers a peeling tape having an adhesive layer laminated on its surface to the wafer unit held by the holding unit; a take-up unit that takes up the peeling tape fed by the feed-out unit and with the protruding portion of the die attach film attached to the adhesive layer; an expanding device that is disposed between the delivery unit and the winding unit, and that rolls over the protruding portion while pressing the adhesive layer side of the peeling tape against the protruding portion of the wafer unit, thereby adhering the die attach film of the protruding portion to the adhesive layer of the peeling tape and peeling it off from the sheet.

3. The expanding apparatus according to claim 2, wherein the peeling roller peels the die attach film at the protruding portion from the sheet by repeatedly rolling in the radial direction of the wafer and in the circumferential direction of the wafer.

Images