Processing equipment

Abstract

To provide a novel processing device which prevents deterioration of process tolerance due to temperature changes by adjusting a temperature in a processing chamber, and realizes processing with higher accuracy.SOLUTION: A processing device has: a processing chamber 4 which accommodates a holding table 12 for holding a workpiece 2, and a processing unit (cutting unit 10) for processing the workpiece 2 held by the holding table 12; and an air introduction chamber 8 into which air is supplied from a constant-temperature air supply source 91. The device supplies air into the processing chamber 4 from the air introduction chamber 8 and forms down-flow toward a lower side from an upper side of the inside of the processing chamber 4, thereby performing temperature control in the processing chamber 4.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for processing workpieces such as semiconductor wafers, and more particularly to controlling the temperature inside a processing chamber. [Background technology]

[0002] BACKGROUND ART Conventionally, as disclosed in Patent Document 1, for example, a cutting tool is known which cuts the upper surface of a workpiece held by a so-called pin chuck table with a cutting tool.

[0003] In this type of tool cutting device, if a foreign object gets caught between the table and the workpiece, the height of the workpiece's top surface will vary, and the thickness of the workpiece after cutting will not be uniform. Therefore, as in Patent Document 1, a pin chuck table that holds the workpiece with the tips of multiple support pins is used as the holding table.

[0004] Before machining the workpiece, a so-called setup operation is performed to detect the height position of the tip of the tool relative to the holding surface of the holding table. During the setup operation, the cutting depth of the tool into the workpiece is adjusted based on the detected height position.

[0005] More specifically, a contact sensor of known thickness is placed on the holding surface of the holding table, and the cutting tool is lowered so that the cutting edge at the bottom of the cutting tool, which is made of a single crystal diamond or the like, comes into contact with the contact sensor, thereby detecting the height position of the cutting tool relative to the holding surface. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2019-204916 Summary of the Invention [Problem to be solved by the invention]

[0007] However, after the setup work is completed, the height position of the holding surface of the holding table may change due to, for example, the movement of the holding table or heat generated during machining. Even if the change is only a small amount, such as 1 μm, it can cause a problem in that the desired machining accuracy cannot be achieved for workpieces that require high-precision machining.

[0008] Furthermore, the problem of processing accuracy is not limited to bit cutting devices, but is also a problem in various processing devices such as cutting devices that use cutting blades to cut grooves in workpieces, and grinding devices that use grinding wheels to thin workpieces.

[0009] In view of the above problems, the present invention provides a novel processing device that adjusts the temperature inside the processing chamber to prevent a decrease in processing accuracy due to temperature changes and achieve higher precision processing. [Means for solving the problem]

[0010] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0011] According to one aspect of the present invention, a processing device is provided which has a processing chamber for accommodating a holding table for holding a workpiece and a processing unit for processing the workpiece held on the holding table, and an air introduction chamber to which air is supplied from a constant temperature air supply source, and which adjusts the temperature of the processing chamber by supplying air from the air introduction chamber to the processing chamber and forming a downflow from the top to the bottom inside the processing chamber.

[0012] According to one aspect of the present invention, the processing chamber is provided with an exhaust port connected to an exhaust source.

[0013] According to one aspect of the present invention, a temperature measuring instrument is provided within the processing chamber to measure the temperature of the processing chamber, and at least one of the temperature of the air supplied from the constant temperature air supply source, the flow rate of the air supplied from the constant temperature air supply source, and the flow rate of the exhaust air exhausted from the exhaust port is adjusted according to the temperature detected by the temperature measuring instrument.

[0014] According to one aspect of the present invention, the holding table is provided with a cooling unit that sprays cooling fluid onto the holding table as it moves along a path between a loading / unloading area where workpieces are loaded and unloaded onto the holding table and a processing area where the workpieces are processed by the processing unit.

[0015] According to another aspect of the present invention, the processing unit is a cutting unit equipped with a cutting tool for cutting the workpiece held by the holding table. [Effects of the Invention]

[0016] According to the present invention, by adjusting the temperature inside the processing chamber, the relative distance between the processing unit and the workpiece can be controlled with high precision, and processing precision can be improved.

[0017] Furthermore, according to one aspect of the present invention, the temperature inside the processing chamber can be adjusted by discharging the air inside the processing chamber through the exhaust port.

[0018] Furthermore, according to one aspect of the present invention, the temperature of the holding table and the temperature around the movement path of the holding table can be adjusted and kept constant, thereby improving processing accuracy.

[0019] Furthermore, in the tool cutting device according to one embodiment of the present invention, the cutting depth can be prevented from changing due to the tool cutting unit and kept constant, thereby achieving the desired machining accuracy. [Brief explanation of the drawings]

[0020] [Figure 1]1 is a diagram showing the configuration of a tool cutting device which is an example of a processing device according to the present invention; [Figure 2] FIG. 2 is a diagram showing an outline of the internal structure of the air introduction chamber and the processing chamber. [Figure 3] 5A and 5B are diagrams illustrating a cooling unit that sprays a cooling fluid onto a holding table. [Figure 4] FIG. 10 is a diagram illustrating how the holding table is cooled. DETAILED DESCRIPTION OF THE INVENTION

[0021] 1 is a diagram showing the configuration of a tool cutting device 1, which is an example of a processing device according to the present invention. The present invention is widely applicable to processing devices equipped with a processing chamber, and is applicable not only to the tool cutting device 1 but also to various other processing devices such as a cutting device that uses a cutting blade to cut a groove in a workpiece, and a grinding device that uses a grinding wheel to thin the workpiece.

[0022] As shown in Fig. 1, the tool cutting device 1 has a base 7 that is long in the Y-axis direction, and the space above the base 7 is formed with a processing chamber 4 in which processing of the workpiece 2 is performed, and a load / unload chamber 6 for loading and unloading the workpiece 2 into and out of the processing chamber 4. The processing chamber 4 and the load / unload chamber 6 are separated by a partition wall 5, and are configured so that the workpiece 2 can be moved between the processing chamber 4 and the load / unload chamber 6 through an opening (not shown) provided in the partition wall 5. The processing chamber 4 refers to the area to the right of the partition wall 5, indicated by the two-dot chain line in Fig. 2.

[0023] Two cutting units 10 and 20 are provided as processing units in the processing chamber 4. The exposed surface of the workpiece 2 is cut by cutting tools 11a and 21a attached to the respective cutting units 10 and 20. Note that a configuration may be adopted in which only one cutting unit is provided.

[0024] The cutting tools 11a and 21a have cutting blades made of single-crystal diamond and are used to cut ductile materials such as resins and metals, as well as composite materials thereof. The workpiece 2 is a roughly circular wafer made of, for example, silicon, SiC (silicon carbide), or other semiconductor materials, or sapphire, glass, quartz, or other materials. Devices such as ICs and LSIs are formed on the wafer, and multiple protruding electrodes called bumps are formed on the surface. Because the height of the protruding electrodes is not necessarily uniform, even if the protruding electrodes are directly bonded to the electrodes of the mounting target, the bonding may not be uniform. In this embodiment, the cutting tool 1 cuts the heads of the protruding electrodes with the cutting blades of the cutting tools 11a and 21a, thereby making the height of each protruding electrode uniform. In addition to bumps, other materials that can be cut include resin substrates such as package substrates, tape attached to the wafer, sealing resin covering the wafer, and underfill material filled between the bumps.

[0025] 1, the cutting units 10, 20 are arranged adjacent to each other at a distance in the X-axis direction on the rear side of the base 7. Each cutting unit 10, 20 includes a spindle 14, 24 and a bite wheel 11, 21 attached to the tip of the spindle 14, 24. The bite wheel 11, 21 includes a wheel base 11k, 21k, a bite tool 11a, 21a attached to the wheel base 11k, 21k, a motor 15, 25 that rotates the spindle 14, 24, and a Z-axis moving plate 18, 28 that supports each component.

[0026] The cutting units 10, 20 are raised and lowered by processing feed units 16, 26, and the tips of the cutting tools 11a, 21a are fed for cutting. The processing feed units 16, 26 are equipped with motors 16a, 26a, ball screws 16b, 26b driven by the motors 16a, 26a, and a pair of guide rails 16c, 26c that guide the Z-axis moving plates 18, 28 of the cutting units 10, 20, respectively. The Z-axis moving plates 18, 28 are raised and lowered by rotation of the ball screws 16b, 26b, thereby raising and lowering the entire cutting units 10, 20.

[0027] The same type of cutting tool is attached to each cutting unit 10, and after rough cutting under predetermined machining conditions in one cutting unit 10, the other cutting unit 20 performs finish cutting by changing the number of rotations of the cutting tool wheel, the machining feed rate (movement rate in the Y-axis direction) of the holding table, the cutting depth of the cutting tool, etc. Alternatively, each cutting unit 10, 20 may cut the workpiece 2 under the same machining conditions.

[0028] In the processing chamber 4, holding tables 12 and 22 are provided at positions offset in the X-axis direction on the upper surface side of the base 7. Each holding table 12 and 22 is moved in the Y-axis direction by a drive mechanism (not shown) provided in the base 7 between a processing area A1, which is located below the cutting units 10 and 20, and a load / unload area A2, where the workpiece 2 is loaded and unloaded.

[0029] The holding surface formed on the upper surface of each holding table 12, 22 is connected to a suction source (not shown), and the workpiece 2 placed on the holding surface is held by suction. Each holding table 12, 22 is formed by a pin chuck table in which the holding surface is formed by the tips of multiple support pins.

[0030] Extendable bellows 13, 23 are connected to both sides of each holding table 12, 22 in the Y-axis direction, and below the bellows 13, 23 are provided a drive mechanism for moving each holding table 12, 22 in the Y-axis direction and a drainage mechanism for receiving and draining cutting water.

[0031] On the side of the base 7 opposite to the processing chamber 4, cassette placement sections 9a, 9b for placing cassettes 51, 52 containing the workpieces 2 are provided. A first transport unit 61 is provided in the carry-in / out chamber 6, and the first transport unit 61 transports the workpiece 2 in the cassette 51 to a temporary placement area 62.

[0032] The workpiece 2 is aligned to a predetermined position by an alignment mechanism 63 provided in the temporary placement area 62 , and then sucked and held by a second transport unit 64 having a suction pad, and delivered to the holding table 12 .

[0033] A third transport unit 65 is provided adjacent to the second transport unit 64. The third transport unit 65 has a suction pad and transports the processed workpiece 2 on the holding table 12 to the other holding table 22, and transports the processed workpiece 2 on the holding table 22 to a cleaning unit 66.

[0034] The cleaning unit 66 is configured as a spinner cleaning device equipped with a spinner table, and uses cleaning water to clean the surface of the workpiece 2. After cleaning, the workpiece 2 is dried with dry air while being rotated at high speed, and the workpiece 2 is carried out to the cassette 52 by the first transport unit 61.

[0035] In the tool cutting device 1 configured as above, cutting of the workpiece 2 is performed. For example, in cutting processing with the cutting unit 10, the workpiece 2 is placed on the holding surface of the holding table 12 and held by suction, the cutting unit 10 is lowered to a predetermined height, and the cutting tool is positioned at a predetermined height. Then, the holding table 12 is moved toward the processing area A1 at a predetermined speed, and the cutting tool is rotated at a predetermined speed, whereby the cutting tool cuts the surface of the workpiece 2. During this cutting, cutting fluid is supplied to the surface of the workpiece, as will be described in detail later.

[0036] Next, the air introduction chamber 8 shown in FIGS. 1 and 2 will be described. The air introduction chamber 8 is disposed above the processing chamber 4, and is configured to have an inlet 81 through which air supplied from a constant temperature air supply source 91 flows in, and an outlet 84 through which the air flows out into the processing chamber 4. This air introduction chamber 8 forms a downflow air flow from the top to the bottom inside the processing chamber 4.

[0037] 1 and 2, the air introduction chamber 8 in this embodiment is disposed above the partition wall 4a that constitutes the ceiling of the machining chamber 4, and is configured to extend over not only the machining chamber 4 but also the upper side of the loading / unloading chamber 6, so that the tool cutting device 1 as a whole forms a rectangular parallelepiped. This configuration allows it to be installed as an add-on to an existing tool cutting device. The air introduction chamber 8 may be provided only above the machining chamber 4, or the unit that constitutes the air introduction chamber 8 may be housed in the upper part of the interior space of the machining chamber 4.

[0038] 2, air controlled to a predetermined temperature is supplied from a constant-temperature air supply source 91 via a control valve 92. An inlet 81 is formed in a wall surface 83a on the rear side of the air introducing chamber 8, for allowing the air supplied from the constant-temperature air supply source 91 to flow into the air introducing chamber 8. Air is introduced horizontally from the inlet 81 toward the upper part of a wall surface 83b on the front side of the air introducing chamber 8. By introducing air from the inlet 81 toward the wall surface 83b farther from the inlet 81, the temperature inside the air introducing chamber 8 becomes more uniform.

[0039] 2, the air that hits the upper part of the wall surface 83b and is returned flows into the loading / unloading chamber 6 and the processing chamber 4 through an outlet 86 that opens toward the loading / unloading chamber 6 and an outlet 84 that opens toward the processing chamber 4. Note that in order to ensure a smooth air flow from the inlet 81 to the outlets 84, 86, a guide plate or the like for rectifying the air may be provided.

[0040] An air filter (not shown) is provided at each of the outlets 84, 86, and removes dirt, dust, and the like contained in the air when the air flows into the loading / unloading chamber 6 or the processing chamber 4. For example, a HEPA filter (High Efficiency Particulate Air Filter) is used as the air filter.

[0041] 2, the air that passes through the outlet 84 and enters the processing chamber 4 becomes a downflow, flows downward within the processing chamber 4, passes through the recovery port 43, and is exhausted to the outside from the exhaust port 42 provided at the rear of the processing chamber 4. In this way, as will be described later, the temperature within the processing chamber 4 can be adjusted by exhausting the air within the processing chamber 4 through the exhaust port 42.

[0042] 1, the outlet 84 is provided in two locations corresponding to the two cutting units 10, 20 and the two holding tables 12, 22. The outlets 84 are preferably provided so as to open at positions corresponding to positions above the movement paths of the holding tables 12, 22 in the Y-axis direction.

[0043] As shown in FIG. 2, the recovery port 43 is configured by, for example, forming an opening on the surface facing the holding table 12 in a long box that is long in the Y direction. The opening of the recovery port 43 is formed over the movement range of the holding table 12 in the Y axis direction and is arranged to the side of the holding surface of the holding table 12. The interior of the recovery port 43 is connected to an exhaust source 46 via an exhaust port 42 and a control valve 45. As shown in FIG. 1, a recovery port 44 is also provided corresponding to the other holding table 22, and the two recovery ports 43, 44 are arranged adjacent to each other in the X axis direction. The opening of the recovery port 43 may be formed widely over the entire range of the movement path 17 (FIG. 3) of the holding table 12, or it may be formed only in a partial range, for example, in a range facing the processing area A1 (FIG. 3).

[0044] With the above configuration, a downflow of air is formed in the processing chamber 4 from the upper outlet 84 toward the lower recovery port 43, and this downflow makes it possible to adjust the ambient temperature inside the processing chamber 4.

[0045] As shown in Figure 2, temperature adjustment can be performed, for example, by measuring the temperature using temperature measuring devices 41 installed at multiple locations within the processing chamber 4, and having the controller 100 control the opening and closing of the control valve 92 based on the temperature, thereby adjusting the amount of air flowing in from the inlet 81 and into the processing chamber 4 via the outlet 84.

[0046] In addition to adjusting the temperature by adjusting the air flow rate through the opening and closing control of the control valve 92, it is also possible to adjust the temperature by changing the temperature of the air supplied from the constant temperature air supply source 91, or by adjusting the flow rate of the exhausted air through the opening and closing control of the control valve 45 connected to the exhaust port 42, or these methods may be combined.

[0047] Furthermore, the location of the temperature measuring device 41 to be installed in the processing chamber 5 is not particularly limited, and it may be installed, for example, in the housing of the base member supporting the holding table 12, in the space below the bellows 13 (for example, the guide rail of the holding table 12), or in the guide rails 16c, 26c of the processing feed units 16, 26 (Figure 1), etc.

[0048] By performing the above-described feedback control, the temperature inside the processing chamber 4 becomes constant, which in turn suppresses the temperature rise of the holding table 12 that occurs during movement and processing of the holding table 12, and suppresses changes in the height position of the holding surface 12a of the holding table 12.

[0049] By keeping the height position of the holding surface 12a of the holding table 12 constant, the relative distance between the machining unit 10 and the workpiece 2 can be controlled with high precision, thereby improving machining accuracy. With the tool cutting device 1 of this embodiment, it is possible to prevent changes in the cutting depth caused by the tool cutting unit 10, and to obtain the desired machining accuracy.

[0050] Furthermore, similar to the processing chamber 4, the ambient temperature in the loading / unloading chamber 6 can be adjusted by supplying air from the outlet 86. A temperature measuring device 48 may also be provided in the loading / unloading chamber 6, and the temperature in the loading / unloading chamber 6 may be fed back to the controller 100 to appropriately control the opening and closing of the control valve 92. This makes it possible to adjust the temperature not only in the processing chamber 4 but also in the loading / unloading chamber 6, and to adjust the temperature of the entire tool cutting device 1.

[0051] In addition to adjusting the indoor temperatures of the processing chamber 4 and the loading / unloading chamber 6, the indoor pressures of the processing chamber 4 and the loading / unloading chamber 6 are controlled to be more positive than the pressure outside the processing apparatus. This prevents particles such as dust and dirt from outside the processing apparatus from entering the processing apparatus and contaminating the inside of the processing apparatus and the workpieces.

[0052] Next, the cooling unit 30 that sprays cooling fluid onto the holding tables 12 and 22 as shown in FIGS. 1 and 3 will be described.

[0053] As shown in Figure 3, the cooling unit 30 is composed of multiple fluid injection units 32 arranged along the movement path of the holding tables 12, 22 in the Y-axis direction, and fluid supply sources (air source 34, cooling liquid source 36) for supplying fluid 38 to the fluid injection units 32.

[0054] 3, the movement paths 17, 27 of the holding tables 12, 22 are between a processing area A1 located below the cutting units 10, 20 and a carry-in / out area A2 where workpieces are carried in and out, and a plurality of fluid ejection units 32 are arranged at predetermined intervals on the sides of the movement paths 17, 27 of each holding table 12, 22. In this embodiment, seven fluid ejection units 32 are arranged along the Y-axis direction at outer positions in the X-axis direction of the tool grinding device.

[0055] Recovery ports 43 and 44 are provided along the movement paths 17 and 27 on the opposite side of the fluid ejection unit 32 in each of the movement paths 17 and 27, that is, at the center of the tool grinding device in the X-axis direction.

[0056] The recovery ports 43, 44 each have an opening facing the movement paths 17, 27, and collect the fluid 38 sprayed from each fluid spray unit 32. The recovery ports 43, 44 are connected to the exhaust source 46 via the exhaust port 42, and the fluid 38 is sucked and collected by the negative pressure generated by the exhaust source 46. The fluid 38 is in a mist state, and is separated into liquid and gas inside the recovery ports 43, 44 and then discharged to the outside. By collecting the mist-like fluid 38 through the recovery ports 43, 44, problems such as moisture adhering to moving parts of the device and causing rust can be prevented. The vertical dimensions of the openings of the recovery ports 43, 44 are designed to sufficiently suck in the floating mist-like fluid 38. The vertical dimension of the opening 43a of the recovery port 43 facing the holding table 13 shown in FIG. 4 is an example and may be narrower. In addition, the opening of the recovery port 43 may be formed widely over the entire range of the movement path 17 (Figure 3) of the holding table 12, or it may be provided only in a partial range, for example, it may be formed in a range facing the processing area A1 (Figure 3).

[0057] Each fluid ejection unit 32 is connected to an air source 34 and a coolant source 36. Each fluid ejection unit 32 has an ejection nozzle that ejects fluid toward the movement paths 17, 27, and ejects two fluids that are a mixture of supplied air and coolant. Note that instead of the two fluids, only the coolant may be ejected.

[0058] A cooling pipe such as a vortex tube may be provided between each fluid injection unit 32 and the air source 34 to lower the temperature of the air. The cooling liquid source 36 (for example, a constant temperature water machine outside the tool cutting device) may cool the cooling liquid to a predetermined temperature. The temperatures of the two fluids injected from each fluid injection unit 32 are set to, for example, 10°C or less.

[0059] By using the cooling unit 30 configured as described above, the fluid 38 is continuously supplied to the movement paths 17, 27 of the holding tables 12, 22, thereby adjusting and maintaining constant the temperatures of the holding tables 12, 22 and the ambient temperatures of the movement paths 17, 27, thereby improving processing accuracy. Furthermore, by having the fluid 38 directly fall on the holding tables 12, 22, a rise in the temperature of the holding tables 12, 22 can be efficiently suppressed.

[0060] Furthermore, the controller 100 may control the control valves 35, 37 to adjust the amounts of air and coolant supplied from the fluid supply sources (air source 34, coolant source 36) based on the temperature measured by the temperature measuring device 41 provided in the processing chamber 4. Furthermore, the controller 100 may adjust the temperatures of the air and coolant supplied from the fluid supply sources (air source 34, coolant source 36).

[0061] It is preferable to adjust the pressure and flow rate of the air supplied to each fluid ejection unit 32 so that the fluid 38 is supplied to the entire holding surfaces of the holding tables 12 and 22 in all areas of the movement paths 17 and 27.

[0062] 4, when the holding table 12 is in the machining area A1 (FIG. 3), a fluid 38 is supplied from a fluid injection unit 32 arranged on the side of the machining area A1 toward the surface 2a of the workpiece 2. Then, while the cutting tool 11a is cutting the workpiece 2 by the rotation of the cutting wheel 11, the fluid 38 is continuously supplied to the surface 2a of the workpiece 2, washing away the cuttings. At this time, the holding table 12 is also cooled.

[0063] In this way, the fluid 38 can also function as a coolant (machining fluid) that cools the machining point. In particular, for the fluid jetting unit 32 arranged on the side of the machining area A1, the angle of the jetting nozzle is adjusted so that the fluid 38 efficiently reaches the machining point (the position of the cutting tool 11a). Note that Figure 4 shows the workpiece 2 being a semiconductor wafer, and how bumps 2d (protruding electrodes) formed on the surface 2a are cut and flattened.

[0064] Also, as shown in FIG. 3, when the holding table 12 is in the loading / unloading area A2, the supply of fluid 38 to the holding table 12 may be stopped, or the fluid 38 may be supplied to a partial area (e.g., half of the area) of the holding surface of the holding table 12.

[0065] 1 and 3, the supply of fluid 38 by the cooling unit 30 can be performed continuously after the apparatus is started. Also, when the holding table 12 is positioned in the loading / unloading area A2 and the workpiece 2 is being loaded or unloaded, the supply of fluid 38 to the holding table 12 in the loading / unloading area A2 may be stopped, while the supply of fluid 38 to other locations may be continued. Note that when the holding table 12 is not holding a workpiece 2, the holding table 12 performs an idling operation in which it moves back and forth along its movement path. Even in this case, the supply of fluid 38 by the cooling unit 30 continues, thereby making it possible to maintain a constant temperature in the processing chamber 4. [Explanation of symbols]

[0066] 1. Bit cutting device 2 Work 2a surface 2D Bump 4 Processing room 4a Bulkhead 5 Bulkhead 6 Loading and unloading room 7. Bass 8 Air introduction chamber 10 Cutting unit 11 Bite Wheel 11a Bit tool 12 Holding table 12a Holding surface 17 Travel Route 20 Cutting unit 22 Holding table 27 Travel Route 30 Cooling Unit 32 Fluid injection unit 34 Air source 36 Coolant source 38 Fluid 41 Temperature measuring instrument 42 Exhaust port 43 Collection port 44 Collection port 46 Exhaust Source 48 Temperature Measuring Instrument 81 Inlet 84 Outlet 86 Outlet 91 Constant temperature air supply source 100 Controllers A1 Machining area A2 Loading / unloading area

Claims

1. a holding table for holding the workpiece; a processing unit for processing the workpiece held on the holding table; a processing chamber for accommodating the an air introduction chamber to which air is supplied from a constant temperature air supply source; The processing apparatus supplies air from the air introduction chamber to the processing chamber, and forms a downflow from the upper side to the lower side of the processing chamber, thereby adjusting the temperature of the processing chamber, The air introduction chamber is disposed above the ceiling of the processing chamber, Air is introduced from the inlet on the rear side of the air introduction chamber toward the wall surface on the front side. Processing equipment.

2. The processing chamber is provided with an exhaust port connected to an exhaust source.

2. The processing device according to claim 1.

3. a temperature measuring device for measuring the temperature of the processing chamber is provided in the processing chamber; 3. The processing apparatus according to claim 2, wherein at least one of the temperature of the air supplied from the constant temperature air supply source, the flow rate of the air supplied from the constant temperature air supply source, and the flow rate of the exhaust air exhausted from the exhaust port is adjusted in accordance with the temperature detected by the temperature measuring device.

4. The holding table moves along a movement path between a carry-in / out area where the workpiece is carried in and out of the holding table and a processing area where the workpiece is processed by the processing unit. A cooling unit for injecting a cooling fluid is provided.

4. The processing device according to claim 1, wherein the processing device is a processing device for processing a substrate.

5. The processing unit comprises: a bite cutting unit equipped with a bite tool for cutting the workpiece held by the holding table; 5. The processing device according to claim 1, wherein the processing device is a processing device for processing a substrate.

6. the cooling unit including a plurality of fluid ejection units; When the holding table is located in the loading / unloading area, When the holding table moves along the movement path, When the holding table is positioned in the processing area, In either case, the holding table can be cooled.

5. The processing device according to claim 4.

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