Chip peeling device and chip peeling method

Abstract

To provide a chip peeling device which enables downsizing of the device and reduction of chips, and to provide a chip peeling method.SOLUTION: A chip peeling device 100 includes a housing 101 having a placing surface 111 capable of placing a wafer 10 thereon, having a recessed portion 113 and first vacuum suction holes 112 on the placing surface 111, and having second vacuum suction holes 115, blow holes 116, and protrusions 114 in the recessed portion 113. The chip peeling device further includes: a vacuum suction source 102 that evacuates the first vacuum suction holes 112 and the second vacuum suction holes 115; a pressure detector 105 that detects a degree of vacuum of the second vacuum suction holes 115; a pressurization source 107 that sends a fluid to the blow holes 116; a controller 106 that determines a flow rate of the fluid to be sent to the blow holes 116 based on the degree of vacuum; and a flow rate control valve 108 which controls a flow rate of the fluid to the flow rate determined by the controller 106. The controller 106 provides control to evacuate the second vacuum suction holes 115 and send the fluid to the blow holes 116.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a chip peeling device and a chip peeling method used in, for example, semiconductor manufacturing equipment. [Background technology]

[0002] The semiconductor packaging process includes a die bonding process in which diced chips are peeled off using a chip peeling device, picked up, and mounted on another wafer.

[0003] One method of chip removal is to use a sharp pin to push up the chip along with the dicing tape. For example, when pushing up a thin chip that is 10mm square and 30μm or less, the chip is thin and the tip of the pin is sharp, so the pushed-up part becomes the starting point and causes cracks or chips.

[0004] Patent Documents 1 to 3 are being considered as methods to solve this problem. Patent Document 1 describes a chip peeling device in which the ejector below the dicing tape is of a sliding type. Patent Document 2 describes a split-type chip peeling device. And Patent Document 3 describes a chip peeling device with an improved push-up shape. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 5184303 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-214739 [Patent Document 3] Patent No. 4816598 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the chip peeling devices of Patent Documents 1 to 3 have a problem in that the mechanisms are complicated and take up a lot of space, resulting in an increase in the size of the device. [Means for solving the problem]

[0007] In one embodiment, the chip peeling device comprises a housing having a mounting surface on which a wafer can be placed, the mounting surface having a recess and a first vacuum suction hole, the recess having a second vacuum suction hole, a blow hole, and a protrusion; a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole; a pressure detector that detects the degree of vacuum of the second vacuum suction hole; a pressurization source that delivers fluid to the blow hole; a controller that determines the flow rate of the fluid to be delivered to the blow hole based on the degree of vacuum; and a flow control valve that controls the fluid to the flow rate determined by the controller, wherein the controller evacuates the second vacuum suction hole and controls the delivery of fluid to the blow hole.

[0008] According to one embodiment of the chip peeling device, the vacuum suction pressure is controlled by the pressurized flow rate, so that sudden deformation of the chip during vacuum suction can be suppressed, thereby reducing cracking and chipping.

[0009] In one embodiment of the chip peeling device, the opening area of ​​the blow hole is smaller than the opening area of ​​the second vacuum suction hole.

[0010] According to the chip peeling device of one embodiment, it is possible to prevent the occurrence of sudden pressure application.

[0011] In one embodiment of the chip peeling device, the controller performs control to decrease the flow rate of the fluid delivered to the blow holes over time.

[0012] According to the chip peeling device of one embodiment, a sudden increase in vacuum pressure can be prevented.

[0013] In one embodiment of the chip peeling device, the housing has a block portion that can protrude into the recess.

[0014] According to one embodiment of the chip peeling device, the chip to be peeled is pressurized with a fluid and raised, thereby facilitating peeling of the four peripheral corners of the chip.

[0015] In one embodiment of the chip peeling device, the flow rate control valve is a servo valve that can periodically change the flow rate.

[0016] According to one embodiment of the chip peeling device, chip peeling can be promoted by vibration force while changing the cycle of pressure application.

[0017] In one embodiment, a chip peeling method is provided in a chip peeling device that includes a housing having a mounting surface on which a wafer can be placed, the mounting surface having a recess and a first vacuum suction hole, the recess having a second vacuum suction hole, a blow hole, and a protrusion, a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole, a pressure detector that detects the degree of vacuum evacuated to the second vacuum suction hole, a pressurization source that delivers fluid to the blow hole, and a flow control valve that controls the flow rate of the fluid, wherein the second vacuum suction hole is evacuated and the delivery of fluid to the blow hole is controlled.

[0018] According to the chip peeling method of one embodiment, the vacuum suction pressure is controlled by the pressurized flow rate, so that sudden deformation of the chip during vacuum suction can be suppressed, thereby reducing cracking and chipping. [Effects of the Invention]

[0019] According to the chip peeling device and chip peeling method of the present invention, the device can be made smaller, and the vacuum suction pressure is controlled by the pressurized flow rate, thereby suppressing sudden chip deformation during vacuum suction and reducing cracking and chipping. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a cross-sectional view showing an example of a chip peeling device according to a first embodiment. [Figure 2] 1 is a top perspective view showing an example of a chip peeling device according to a first embodiment. [Figure 3] 3 is a top view showing an example of a recess 113 of the chip peeling device according to the first embodiment. FIG. [Figure 4] 1 is a cross-sectional view showing an example of a chip peeling device according to a first embodiment. [Figure 5] 1 is a cross-sectional view showing an example of a chip peeling device according to a first embodiment. [Figure 6] 10 is a graph comparing the presence and absence of flow rate control. [Figure 7] FIG. 10 is a cross-sectional view showing an example of a chip peeling device according to a second embodiment; [Figure 8] FIG. 10 is a top view for explaining peeling. [Figure 9] FIG. 10 is a cross-sectional view showing an example of a chip peeling device according to a third embodiment. [Figure 10] FIG. 10 is a cross-sectional view showing an example of a chip peeling device according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] (Embodiment 1) Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of a chip peeling apparatus according to the first embodiment. In FIG. 1, the chip peeling apparatus 100 includes a housing 101, a vacuum suction source 102, a first valve 103, a second valve 104, a pressure detector 105, a controller 106, a pressurized source 107, and a flow control valve 108. The picker 20 is configured to pick up chips 12 from a semiconductor wafer 10 from which dicing tape 11 has been peeled. In FIG. 1, an example will be described in which the downward direction in the drawing is the direction of gravity.

[0022] The housing 101 has a mounting surface 111 on which a diced semiconductor wafer 10 is mounted. Vacuum suction holes 112 are distributed over the entire mounting surface 111. In addition, a recess 113 is provided in an area the size of one chip on the mounting surface 111. FIG. 2 is a top perspective view showing an example of a chip peeling device according to the first embodiment. FIG. 3 is a top view showing an example of the recess 113 of the chip peeling device according to the first embodiment. As shown in FIGS. 1 to 3, the recess 113 is provided with a protrusion 114, a vacuum suction hole 115, and a blow hole 116. As shown in FIG. 1, the upper end of the protrusion 114 is flush with the mounting surface 111.

[0023] The opening area of ​​the blow holes 116 is smaller than the opening area of ​​the vacuum suction holes 115. The size relationship between the hole areas makes it possible to prevent sudden pressure buildup.

[0024] In addition, a block portion 117 that can move up and down is provided in the recessed portion 113 of the housing 101. The housing 101 and the block portion 117 constitute an ejector. That is, the protrusion 114, the vacuum suction hole 115, and the blow hole 116 are provided in the block portion 117 of the housing 101.

[0025] 1, the vacuum suction source 102 draws a vacuum through the vacuum suction holes 112 via the first valve 103. The vacuum suction source 102 also draws a vacuum through the vacuum suction holes 115 via the second valve 104.

[0026] The first valve 103 is a stop valve provided midway in the pipe connecting the vacuum suction hole 112 and the vacuum suction source 102 .

[0027] The second valve 104 is a stop valve provided midway in the pipe connecting the vacuum suction hole 115 and the vacuum suction source 102 .

[0028] The pressure detector 105 detects the pressure applied from the vacuum suction holes 115 (i.e., the pressure in the space formed by the semiconductor wafer 10 and the recess 113 of the housing 101). The pressure detector 105 then outputs the detected pressure value to the controller 106.

[0029] The controller 106 adjusts the flow rate at the flow rate control valve 108 based on the pressure value detected by the pressure detector 105. The controller 106 also controls the opening and closing of the first valve 103 and the second valve 104. The control by the controller 106 will be described in detail later.

[0030] The pressure source 107 pressurizes the semiconductor wafer 10 by supplying fluid to the blowhole 116 via the flow control valve 108. The fluid is preferably a gas. Preferably, the fluid is an inert gas. For example, the pressure source 107 is preferably a pressure pump or a gas-filled cylinder.

[0031] Flow control valve 108 regulates the amount of fluid delivered from pressure source 107 to blowhole 116 under the direction of controller 106 .

[0032] With the above configuration, the chip peeling device 100 peels the dicing tape 11 from the chip 12. Next, the operation of the chip peeling device 100 will be described. FIGS. 4 and 5 are cross-sectional views showing an example of the chip peeling device according to the first embodiment. FIG. 6 is a graph comparing the presence and absence of flow rate control. The operation described below is controlled by the controller 106.

[0033] First, as shown in A of Fig. 4, the diced semiconductor wafer 10 with the ring is placed on the ejector (housing 101) in the chip peeling device 100. The tape is peeled off from the chip on this ejector.

[0034] Next, with the horizontal position of the recess 113 of the ejector aligned with the chip 12 to be peeled, the height of the ejector is moved to the same height as the dicing tape 11.

[0035] Then, as shown in FIG. 4B, the dicing tape 11 is vacuum-sucked by the vacuum suction source 102 of the ejector.

[0036] The vacuum pressure is detected by a pressure detector 105, and pressurized air is introduced into the blow hole 116 via a flow control valve 108 provided on the pressurizing side, controlling the flow to prevent a sudden increase in vacuum pressure. Figure 6 shows the change in vacuum pressure with and without flow control. In Figure 6, the vertical axis represents the degree of vacuum, and the horizontal axis represents time. As shown in Figure 6, a sudden increase in vacuum pressure is prevented by controlling the flow rate of pressurizing air to decrease over time. When the dicing tape 11 is vacuum-adsorbed, the state becomes as shown in Figure 5A.

[0037] Then, as shown in FIG. 5B, the block portion 117 is raised by an actuator (not shown) or the like so as not to come into contact with the adjacent chips.

[0038] The pick-up head of the picker 20 is placed above the chip 12 and lowered to approach the chip 12 and suck up the chip 12 by vacuum suction at a position where it can be sucked up. By this operation, the chip is picked up as shown in C of FIG. By the above operations, the chip is picked up from the semiconductor wafer.

[0039] The recess 113 of the housing 101 is provided in advance with a protrusion 114 (or groove) in the shape of a base for vacuum adsorption. This shape limits the area where the chip 12 and tape 11 come into contact with each other when vacuum adsorbed to the protrusion 114, thereby reducing the contact area between the chip 12 and tape 11 and facilitating separation.

[0040] For example, when forming a central groove, it is desirable that the central groove be smaller than the size of the chip to be peeled and that its area ratio to the chip be 90% to 99%.

[0041] The depth of the groove is preferably 100 to 500 μm in addition to the thickness of the dicing tape.

[0042] It is desirable that the apex position of the protrusion 114 is movable so as to protrude from the housing 101 of the ejector by 100 μm to 500 μm.

[0043] The diameter of the vacuum suction holes 112 and 115 is preferably about 0.5 mm. Also, the diameter of the blow hole 116 for pressurization is preferably much smaller than the diameters of the vacuum suction holes 112 and 115. Specifically, the diameter of the blow hole 116 is preferably 0.1 mm or less. The dicing tape 11 is sucked by vacuum suction using the vacuum suction source 102, and the dicing contact area between the chip 12 and the tape 11 decreases, causing the chip 12 to peel off from the semiconductor wafer 10.

[0044] As described above, with the chip peeling device of embodiment 1, the vacuum suction pressure is controlled by the pressurized flow rate, which suppresses sudden deformation of the chip during vacuum suction, thereby reducing cracking and chipping. Also, with the chip peeling device of embodiment 1, the drive system can be made smaller because it uses minute drive of the block section. Also, with the chip peeling device of embodiment 1, the vacuum pressure is controlled by pressurized air, so response is faster than control using a vacuum valve alone, and the time until peeling can be shortened.

[0045] (Embodiment 2) In the second embodiment, an example will be described in which the recessed portion is raised only by applying pressure. The chip peeling device of the second embodiment has the same configuration as the chip peeling device of the first embodiment, but operates differently.

[0046] The operation will be described with reference to Fig. 7. Fig. 7 is a cross-sectional view showing an example of a chip peeling device according to the second embodiment. Fig. 8 is a top view for explaining peeling.

[0047] 7A, the diced semiconductor wafer 10 with the ring is placed on the ejector (housing 101) in the chip peeling device 100. The tape is peeled off from the chip on this ejector.

[0048] Next, with the horizontal position of the recess 113 of the ejector aligned with the chip 12 to be peeled, the height of the ejector is moved to the same height as the dicing tape 11.

[0049] Then, as shown in B of Fig. 7, pressurized air is introduced into blow hole 116 via flow control valve 108 on the pressure side, and block portion 117 is raised by an actuator (not shown) or the like to prevent contact with adjacent chips. This action lifts the tape and chip, causing the tape to bend like a bow, facilitating peeling at the four corners around the chip. In other words, peeling is promoted in the area circled 801 in Fig. 8.

[0050] 7C, the block part 117 is lowered by an actuator (not shown) or the like, and the dicing tape 11 is vacuum-adsorbed by the vacuum suction source 102 of the ejector. Also, the vacuum pressure is detected by the pressure detector 105, and pressurized air is introduced into the blow hole 116 via the flow control valve 108 provided on the pressure side.

[0051] The pick-up head of the picker 20 is placed above the chip 12 and lowered to approach the chip 12 and suck up the chip 12 by vacuum suction at a position where it can be sucked up. By this operation, the chip is picked up as shown in FIG. 7D.

[0052] In this way, according to the chip peeling device of the second embodiment, the chip to be peeled is pressurized with a fluid and raised, thereby facilitating peeling of the four peripheral corners of the chip.

[0053] (Embodiment 3) In the third embodiment, an example in which a servo valve is provided in the flow path on the pressurizing side will be described. Fig. 9 is a cross-sectional view showing an example of a chip peeling device according to the third embodiment. In Fig. 9, a chip peeling device 900 includes a housing 101, a vacuum suction source 102, a first valve 103, a second valve 104, a pressure detector 105, a controller 906, a pressurizing source 107, and a servo valve 908. In Fig. 9, the same components as those in Fig. 1 are assigned the same numbers, and descriptions thereof will be omitted.

[0054] The controller 906 adjusts the flow rate at the servo valve 908 based on the pressure value detected by the pressure detector 105. The controller 106 also controls the opening and closing of the first valve 103 and the second valve 104. The details of the control by the controller 906 are the same as those of the controller 106 in the first embodiment, with the addition of control of the servo valve 908.

[0055] The servo valve 908 adjusts the amount of fluid delivered from the pressure source 107 to the blowhole 116 in accordance with instructions from the controller 906. Specifically, the servo valve 908 periodically adjusts the amount of fluid.

[0056] Next, a description will be given of the operation of the chip peeling device 900. Fig. 10 is a cross-sectional view showing an example of the chip peeling device according to the third embodiment. The operation described below is controlled by the controller 906.

[0057] First, as shown in A of Fig. 10, the diced semiconductor wafer 10 with the ring is placed on the ejector (housing 101) in the chip peeling device 100. The tape is peeled off from the chip on this ejector.

[0058] Next, with the horizontal position of the recess 113 of the ejector aligned with the chip 12 to be peeled, the height of the ejector is moved to the same height as the dicing tape 11.

[0059] Then, as shown in FIG. 10B, pressurized air is introduced into the blow hole 116 via the servo valve 908 provided on the pressurizing side.

[0060] Then, as shown in FIG. 10C, the dicing tape 11 is vacuum-sucked by the vacuum suction source 102 of the ejector.

[0061] The pressure application in B of FIG. 10 and the vacuum suction in C of FIG. 10 are alternately repeated.

[0062] Then, the pick-up head of the picker 20 is placed above the chip 12 and lowered to approach the chip 12 and suck up the chip 12 by vacuum suction at a position where it can be sucked up. By this operation, the chip is picked up as shown in D of FIG. By the above operations, the chip is picked up from the semiconductor wafer.

[0063] In this way, according to the chip peeling device of the third embodiment, peeling of the chip can be promoted by the force of vibration while changing the cycle of pressure application.

[0064] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit of the present invention. For example, in the above-described embodiment, the downward direction in the drawing is the direction of gravity, but the present invention may be embodied in other directions. [Explanation of symbols]

[0065] 10 Semiconductor wafers 11 Dicing tape 12 chips 20 Picker 100, 900 Chip peeling device 101 Housing 102 Vacuum suction source 103 First Valve 104 Second valve 105 Pressure detector 106, 906 Controller 107 Pressure source 108 Flow control valve 111 Placement surface 112, 115 Vacuum suction hole 113 Recess 114 Protrusion 116 Blow Hole 117 Block Section 908 Servo valve

Claims

1. a housing having a mounting surface on which a wafer can be mounted, the mounting surface having a recess and a first vacuum suction hole, the recess having a second vacuum suction hole, a blow hole, and a protrusion; a vacuum suction source that draws a vacuum through the first vacuum suction hole and the second vacuum suction hole; a pressure detector for detecting the degree of vacuum of the second vacuum suction hole; a pressurized source for delivering fluid to the blowhole; a controller that determines a flow rate of fluid to be delivered to the blowhole based on the vacuum level; a flow control valve that controls the fluid to a flow rate determined by the controller; Equipped with the controller performs vacuum drawing of the second vacuum suction hole and controls the delivery of a fluid to the blow hole, The controller controls the flow rate of the fluid delivered to the blow hole to decrease over time.

2. 2. The chip peeling device according to claim 1, wherein an opening area of ​​the blow hole is smaller than an opening area of ​​the second vacuum suction hole.

3. 3. The chip peeling device according to claim 1, wherein the housing has a block portion that can protrude into the recess.

4. 3. The chip peeling device according to claim 1, wherein the flow rate control valve is a servo valve capable of periodically changing the flow rate.

5. 4. The chip peeling device according to claim 3, wherein the flow rate control valve is a servo valve capable of periodically changing the flow rate.

6. a housing having a mounting surface on which a wafer can be mounted, the mounting surface having a recess and a first vacuum suction hole, the recess having a second vacuum suction hole, a blow hole, and a protrusion; a vacuum suction source that draws a vacuum through the first vacuum suction hole and the second vacuum suction hole; a pressure detector for detecting the degree of vacuum of the second vacuum suction hole; a pressurized source for delivering fluid to the blowhole; a flow control valve for controlling the flow rate of the fluid; A chip peeling device comprising: A chip peeling method that performs vacuum drawing of the second vacuum suction hole and controls the delivery of fluid to the blow hole, A chip peeling method in which the flow rate of the fluid delivered to the blowhole is controlled to decrease over time.

7. A chip peeling method as described in Claim 6, wherein the opening area of ​​the blow hole is smaller than the opening area of ​​the second vacuum suction hole.

8. A chip peeling method as described in claim 6 or 7, wherein the housing has a block portion that can protrude into the recess.

9. A chip peeling method as described in claim 6 or 7, wherein the flow control valve is a servo valve capable of periodically changing the flow rate.

10. A chip peeling method as described in Claim 8, wherein the flow control valve is a servo valve capable of periodically changing the flow rate.

Images