Work device and camera check method

Abstract

To detect an angle of a camera or displacement which occurs in a scale.SOLUTION: A visual field V51 including a center Cw of a target component Wpt is imaged by a wafer camera 51, and a pre-movement image I1 (first image) including the center Cw of the target component Wpt is acquired. A relative moving amount M of a center Cv of the visual field V51 with respect to the center Cw of the target component Wpt required for matching the center Cv to the center Cw of the target component Wpt is calculated based on the pre-movement image I1, and the wafer camera 51 is moved just for the moving amount M with respect to a wafer W by an X-axis motor 356 and a Y-axis motor 355. A post-movement image I2 (second image) including the center Cw of the target component Wpt is acquired and based on a positional relation between the center Cv and the center Cw in the post-movement image I2, an angle of the wafer camera 51 or a displacement amount of a scale is calculated.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a calibration technique for a camera that captures an image of a workpiece on which a predetermined task is being performed. [Background technology]

[0002] In a component mounter, which holds components supplied by a feeder with a mounting head and mounts them on a board, various controls are performed based on images captured by a camera. Specifically, controls are performed to recognize the position of a recognition mark on a board carried into the component mounter based on an image captured by the camera (Patent Document 1), or to recognize the position of a component based on an image captured of the component picked up by the mounting head. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 5304739 Summary of the Invention [Problem to be solved by the invention]

[0004] However, deviations (in other words, errors) can occur in the camera mounting angle and camera scale due to various factors. When such deviations occur, it is impossible to accurately execute control based on the image captured by the camera. Therefore, there has been a demand for technology that can detect deviations that occur in the camera angle or scale.

[0005] The present invention has been made in consideration of the above-mentioned problems, and has an object to provide a technique that makes it possible to detect deviations that occur in the camera angle or scale. [Means for solving the problem]

[0006] The working device of the present invention includes a support unit that supports a workpiece having a predetermined characteristic location; a working unit that performs a predetermined task on the workpiece supported by the support unit; a camera that has a predetermined field of view and captures images within the field of view; a drive unit that moves the camera relative to the workpiece supported by the support unit by driving at least one of the drive objects of the support unit and the camera; and a control unit that acquires an image of a portion of the workpiece that overlaps the field of view by having the camera perform imaging while adjusting the position of the camera relative to the workpiece using the drive unit.The control unit performs the following operations: a first imaging operation that acquires an image including the characteristic location as a first image in a state where the characteristic location is shifted from a predetermined reference position in the field of view; a movement amount calculation operation that calculates, based on the first image, the relative movement amount of the reference position with respect to the characteristic location that is required to align the reference position with the characteristic location; a movement operation that moves the camera by the movement amount relative to the workpiece using the drive unit; a second imaging operation that acquires an image including the characteristic location as a second image after the movement operation; and a deviation amount calculation operation that calculates the deviation amount of at least one of the camera angle and a scale indicating the length of one pixel in the image based on the positional relationship between the reference position and the characteristic location in the second image.

[0007] The camera check method of the present invention includes the steps of: performing a first imaging operation to acquire a first image including the characteristic location in a state in which the characteristic location is displaced from a predetermined reference position in the field of view by driving at least one of the driving objects, which is a support part that supports a workpiece having a predetermined characteristic location and a camera that has a predetermined field of view and captures images within the field of view, and having the camera perform imaging while facing the workpiece using a driving part that moves the camera relative to the workpiece supported by the support part; performing a movement amount calculation operation to calculate, based on the first image, the relative movement amount of the reference position with respect to the characteristic location that is required to align the reference position with the characteristic location; performing a movement operation to move the camera by the movement amount relative to the workpiece using the driving part; performing a second imaging operation to acquire a second image including the characteristic location after the movement operation; and performing a deviation amount calculation operation to calculate the deviation amount of at least one of the camera angle and a scale indicating the length of one pixel in the image captured by the camera, based on the positional relationship between the reference position and the characteristic location in the second image.

[0008] A camera check program according to the present invention causes a computer to execute the camera check method described above.

[0009] In the present invention (working device, camera check method, and camera check program) configured as described above, the camera captures an image of the field of view including the characteristic location while the reference position of the camera's field of view and the characteristic location of the workpiece are misaligned, and a first image including the characteristic location is acquired (first imaging operation). Next, the relative movement amount of the reference position with respect to the characteristic location required to align the reference position of the field of view with the characteristic location of the workpiece is calculated based on the first image (movement amount calculation operation), and the drive unit moves the camera by the movement amount relative to the workpiece (movement operation). If there is no deviation in the camera angle or scale, the reference position and the characteristic location will match (in other words, overlap) within the camera's field of view after the movement operation is performed. On the other hand, if there is a deviation in the camera angle or scale, the reference position and the characteristic location will not match (in other words, not overlap) within the camera's field of view after the movement operation is performed. Therefore, after the movement operation is performed, a second image including the characteristic location is acquired (second imaging operation), and the amount of deviation of at least one of the camera angle and scale is calculated based on the positional relationship between the reference position and the characteristic location in the second image (deviation calculation operation). In this way, it is possible to detect deviations that have occurred in the camera angle or scale.

[0010] The control unit may be configured to calculate the amount of deviation in the camera angle in the deviation amount calculation operation. With this configuration, deviation that has occurred in the camera angle can be detected.

[0011] The work device may further include a notification unit that notifies the worker, and the control unit may be configured to cause the notification unit to notify the worker when the deviation of the camera angle calculated in the deviation amount calculation operation is equal to or greater than a predetermined threshold angle. With this configuration, the worker can recognize that the deviation of the camera angle is equal to or greater than the threshold angle and can appropriately perform maintenance such as adjusting the camera angle.

[0012] The control unit may be configured to calculate the angle of the target portion included in the image while correcting the amount of deviation in the camera angle calculated in the deviation amount calculation operation. In this configuration, the correction is performed based on the amount of deviation that occurs in the camera angle. Therefore, the angle of the target portion included in the image captured by the camera can be appropriately calculated.

[0013] The working device may further include a camera driver that changes the camera angle by driving the camera, and the control unit corrects the camera angle by driving the camera using the camera driver based on the amount of deviation in the camera angle calculated in the deviation amount calculation operation. With this configuration, deviations that occur in the camera angle can be corrected.

[0014] The control unit may be configured to calculate the amount of deviation of the scale in the deviation amount calculation operation. With this configuration, deviation that occurs in the scale of the camera can be detected.

[0015] The control unit may be configured to calculate the position of the target portion included in the image while correcting the amount of deviation of the scale calculated in the deviation amount calculation operation. With this configuration, it is possible to correct the deviation that occurs in the camera scale.

[0016] Various specific examples of the reference position of the field of view are possible. For example, the reference position may be the center of the field of view.

[0017] Furthermore, various specific examples of the working device are conceivable. Therefore, the working device may be configured so that the workpiece has a sheet and a bare chip attached to the sheet, and the working unit is a mounting head that performs, as a predetermined operation, a mounting operation of mounting the bare chip taken out of the sheet onto a board. In other words, the working device may be a component mounter.

[0018] In this case, the control unit may be configured to perform the first imaging operation, the movement amount calculation operation, the movement operation, the second imaging operation, and the deviation amount calculation operation at any of the following timings: after the work supported by the support unit is replaced, after the board is carried out from the working device, when a positional deviation of a bare chip held by the mounting head is detected, at the start of mounting work, when a work lot is switched, and after a certain period of time has passed. At such timings, deviations that have occurred in the camera angle or scale can be accurately detected. [Effects of the Invention]

[0019] As described above, according to the present invention, it is possible to detect deviations that occur in the camera angle or scale. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a plan view schematically showing an example of a component mounter that is an example of a working device according to the present invention; [Figure 2] FIG. 2 is a block diagram showing an example of an electrical configuration of the component mounter of FIG. 1. [Figure 3] 10 is a flowchart illustrating an example of a camera check performed on a wafer camera. [Figure 4] FIG. 2 is a plan view schematically showing the relationship between the field of view of a wafer camera and a wafer. [Figure 5] 4 is a diagram schematically showing each operation executed in the camera check of FIG. 3. FIG. [Figure 6] FIG. 4 is a diagram schematically showing the content calculated by the camera check in FIG. 3 . [Figure 7] FIG. 10 is a block diagram showing a modified example of the component mounter. DETAILED DESCRIPTION OF THE INVENTION

[0021] Fig. 1 is a plan view showing a schematic diagram of an example of a component mounter, which is an example of a working device according to the present invention. As shown in Fig. 1, in this specification, orthogonal coordinate axes consisting of an X direction, a Y direction, and a Z direction that are orthogonal to each other are used as appropriate. Here, the X direction and the Y direction are horizontal directions, and the Z direction is vertical.

[0022] The mounter 1 mounts components on a board B that is carried in from the upstream side in the X direction (board transport direction) and carries it out downstream in the X direction. The board B is provided with a plurality of mounting target points Bp, and a control unit 100 provided in the mounter 1 controls each unit of the mounter 1 to mount a component Wp at each mounting target point Bp. Here, the component Wp is a bare chip on a diced wafer W, and is attached to an adhesive sheet Ws.

[0023] This mounter 1 is equipped with a transport unit 2 that transports a board B in the X direction. The transport unit 2 has an input conveyor 21, a mounting conveyor 22, and an output conveyor 23, which are arranged in this order in the X direction, and these conveyors 21 to 23 work together to transport the board B in the X direction. The input conveyor 21 allows the board B that has been input from outside the mounter 1 to wait or delivers it to the mounting conveyor 22. The mounting conveyor 22 is provided at a mounting position Pm located downstream of the input conveyor 21 in the X direction, and fixes the board B received from the input conveyor 21 at the mounting position Pm or delivers it to the output conveyor 23. The output conveyor 23 is provided at a position downstream of the mounting position Pm in the X direction, and delivers the board B received from the mounting conveyor 22 to the outside of the mounter 1.

[0024] The component mounter 1 also includes a component supply mechanism 3 that supplies components Wp. The component supply mechanism 3 includes a wafer table 31 that supports a wafer W, and a component removal unit 35 that removes components Wp from the wafer W supported on the wafer table 31. The component removal unit 35 has a removal head 36 that removes the components Wp from the wafer table 31, and is capable of driving the removal head 36 in the X and Y directions. That is, the component removal unit 35 has an X-axis rail 351 that supports the removal head 36 movably in the X direction, and an X-axis motor 352 that extends in the X direction and drives a ball screw attached to the removal head 36, and the removal head 36 can be moved in the X direction by driving the ball screw with the X-axis motor 352. The component removal unit 35 also has a Y-axis rail 353 that supports the X-axis rail 351 so that it can move in the Y direction, a ball screw 354 that extends in the Y direction and is attached to the Y-axis rail 353, and a Y-axis motor 355 that drives the ball screw 354. Therefore, by driving the ball screw 354 with the Y-axis motor 355, the removal head 36 can be moved in the Y direction together with the X-axis rail 351.

[0025] The take-out head 36 has a bracket 361 extending in the X direction and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 rotates about a rotation axis parallel to the X direction to be positioned at either a suction position facing downward or a delivery position facing upward (the position in FIG. 1). The bracket 361 can move up and down together with each nozzle 362.

[0026] When the component supply mechanism 3 positions the nozzle 362 at the suction position to face the component Wp on the wafer table 31 from above, it lowers the nozzle 362 to make contact with the component Wp. The component supply mechanism 3 also has a push-up needle that faces the component Wp from below across the sheet Ws, and pushes up the center of the component Wp with the push-up needle to peel the component Wp from the sheet Ws, and also applies negative pressure to the nozzle 362 to suction the component Wp from the sheet Ws to the nozzle 362. The component supply mechanism 3 then raises the nozzle 362 to remove the component Wp from the wafer table 31. The component supply mechanism 3 then positions the nozzle 362 at the delivery position to supply the component Wp.

[0027] The component mounter 1 is equipped with a mounting unit 4 that mounts the components Wp supplied by the component supply mechanism 3 onto the board B. The mounting unit 4 has a support member 41 that is movable along a fixed rail provided in the Y direction on the ceiling of the component mounter 1, and a mounting head 42 that is supported by the support member 41 so as to be movable in the X direction, and can move the mounting head 42 in the X and Y directions. The mounting head 42 has two nozzles 421 that face downward.

[0028] When picking up and mounting the component Wp, the mounting unit 4 moves above the take-out head 36, positions the nozzle 421 from above to face the component Wp held by the nozzle 362 positioned at the delivery position, and then lowers the nozzle 421 to contact the component Wp. Next, the component supply mechanism 3 releases the negative pressure on the nozzle 362, and the mounting unit 4 raises the nozzle 421 while applying negative pressure to it. Once the mounting head 42 has picked up the component Wp in this way, the mounting unit 4 mounts the component Wp at the mounting target point Bp on the board B fixed at the mounting position Pm.

[0029] The component mounter 1 also has a wafer camera 51 supported by an X-axis rail 351 so as to be movable in the X direction. Correspondingly, the component removal unit 35 has an X-axis motor 356 that extends in the X direction and drives a ball screw attached to the wafer camera 51. By driving the ball screw with the X-axis motor 356, the wafer camera 51 can be moved in the X direction. Furthermore, by driving the ball screw 354 with the Y-axis motor 355, the wafer camera 51 can be moved in the Y direction together with the X-axis rail 351. In other words, the control unit 100 adjusts the position of the wafer camera 51 in the X direction with the X-axis motor 352, while adjusting the position of the wafer camera 51 in the Y direction with the Y-axis motor 355, so that the wafer camera 51 faces the component Wp on the wafer table 31 from above, and captures an image of the component Wp with the wafer camera 51.

[0030] Fig. 2 is a block diagram showing an example of the electrical configuration of the component mounter of Fig. 1. As shown in Fig. 2, the component mounter 1 includes a control unit 100 and a storage unit 110. The storage unit 110 is a storage device such as an HDD (Hard Disk Drive) or an SSD (Solid State Drive), and stores a camera check program 120 (described later) and various images I (before-movement image I1, after-movement image I2).

[0031] The control unit 100 has a calculation unit 101, a drive control unit 102, an imaging control unit 103, and a UI control unit 104. The calculation unit 101 is a processor such as a CPU (Central Processing Unit), and controls the drive control unit 102, the imaging control unit 103, and the UI control unit 104.

[0032] The drive control unit 102 controls the X-axis motor 356 and the Y-axis motor 355 to control the movement of the wafer camera 51 in the X and Y directions. Specifically, the X-axis motor 356 and the Y-axis motor 355 are servo motors. In response to this, the drive control unit 102 controls the position of the wafer camera 51 in the X direction by controlling the X-axis motor 356 based on a command value for the X direction received from the calculation unit 101 and an output value from the encoder of the X-axis motor 356. The drive control unit 102 also controls the position of the wafer camera 51 in the Y direction by controlling the Y-axis motor 355 based on a command value for the Y direction received from the calculation unit 101 and an output value from the encoder of the Y-axis motor 355.

[0033] The imaging control unit 103 controls the wafer camera 51. That is, the imaging control unit 103 causes the wafer camera 51 to capture an image at a timing according to an imaging command received from the calculation unit 101, and acquires the image I captured by the wafer camera 51. The imaging control unit 103 also transmits the image I acquired from the wafer camera 51 to the calculation unit 101.

[0034] Specifically, the calculation unit 101 captures an image of the part Wp on the wafer table 31 using the wafer camera 51, and the image I showing the part Wp captured by the imaging control unit 103 is acquired from the imaging control unit 103. The calculation unit 101 then recognizes the position of the part Wp based on the position (XY coordinates) of the wafer camera 51 indicated by the output values ​​of the encoders of the X-axis motor 356 and the Y-axis motor 355 that drive the wafer camera 51, and the position (XY coordinates) of the part Wp in the image I. The calculation unit 101 controls the X-axis motor 356 and the Y-axis motor 355 based on the position of the part Wp thus recognized, thereby positioning the nozzle 362 with respect to the part Wp. This allows the nozzle 362 to remove the part Wp from the wafer table 31.

[0035] The UI control unit 104 also controls a UI (User Interface) 52 included in the mounter 1. For example, the UI 52 is a touch panel display, and the UI control unit 104 acquires input operations made by the operator on the touch panel display from the UI 52 and transmits them to the calculation unit 101, and displays content according to a display command from the calculation unit 101 on the touch panel display.

[0036] FIG. 3 is a flowchart showing an example of a camera check performed on a wafer camera, FIG. 4 is a plan view showing the relationship between the field of view of the wafer camera and the wafer, FIG. 5 is a diagram showing the operations performed in the camera check of FIG. 3, and FIG. 6 is a diagram showing the contents calculated by the camera check of FIG. 3.

[0037] The camera check in Fig. 3 is executed under the control of the calculation unit 101. In step S101, the drive control unit 102 controls the X-axis motor 356 and the Y-axis motor 355 to move the wafer camera 51 from above toward the wafer W on the wafer table 31. As shown in Fig. 4, the wafer camera 51 has a field of view V51, and captures an image of the field of view V51 by detecting light from the field of view V51 with a solid-state imaging element. In particular, in step S101, since the wafer camera 51 faces the wafer W, the field of view V51 overlaps with the multiple components Wp that make up the wafer W, and the multiple components Wp fit within the field of view V51.

[0038] In step S102, the wafer camera 51 captures images of the parts Wp that make up the wafer W. As a result, as shown in the column of step S102 in FIG. 5, a pre-movement image I1 is acquired that shows the parts Wp within the field of view V51. Note that in FIG. 5, of the parts Wp within the field of view V51, only five parts Wp near the center of the field of view V51 are shown as representatives. However, the pre-movement image I1 does not limit the number of parts Wp to five, and all parts Wp included within the field of view V51 appear. This pre-movement image I1 includes one target part Wpt among the multiple parts Wp. Furthermore, as shown in the column of step S102 in FIG. 5, the pre-movement image I1 is captured in a state in which the center Cw of the target part Wpt is shifted from the center Cv of the field of view V51.

[0039] In step S103, the calculation unit 101 calculates, based on the before-movement image I1, the movement amount M by which the wafer camera 51 should be moved in order to align the center Cv of the field of view V51 with the center Cw of the target part Wpt. Specifically, the calculation unit 101 calculates the position of the center Cv indicated in the before-movement image I1 and the position of the center Cw indicated in the before-movement image I1, and calculates the vector from the center Cv to the center Cw as the movement amount M from the before-movement image I1.

[0040] In step S104, the calculation unit 101 transmits a drive command to the drive control unit 102 to move the wafer camera 51 by the movement amount M, and the drive control unit 102 controls the X-axis motor 356 and the Y-axis motor 355 based on this drive command. As a result, the wafer camera 51 moves by the movement amount M.

[0041] In step S105, the wafer camera 51, which has been moved by the vector movement amount M shown in the step 103 column of FIG. 5, captures an image of the component Wp. As a result, as shown in the step S105 column of FIG. 5, a post-movement image I2 showing the component Wp within the field of view V51 is acquired. If there are no errors in the angle and scale of the wafer camera 51, the center Cv of the field of view V51 and the center Cw of the target component Wpt will coincide in the post-movement image I2. However, in the example shown in the step S105 column of FIG. 5, the centers Cv and Cw do not coincide but are shifted from each other. This is because an error has occurred in at least one of the angle and scale of the wafer camera 51.

[0042] In step S106, the calculation unit 101 calculates the scale error of the wafer camera 51 based on the post-movement image I2. Here, the scale indicates the length per pixel of the wafer camera 51. For example, in the field of view V51 of the wafer camera 51, if the number of pixels of the wafer camera 51 arranged over a length L in the X direction is N, the scale SC is calculated using the following formula: SC=L / N The same applies to the Y direction. The set value of the scale SC is stored in the storage unit 110, for example.

[0043] Therefore, when calculating the movement amount M in step S104 above, the pixel corresponding to the center Cv and the pixel corresponding to the center Cw are identified. Then, the movement amount M from the former pixel toward the latter pixel in the field of view V51 is calculated based on the product of the number of pixels between these pixels and the scale SC. Therefore, as shown in Fig. 6, the calculation unit 101 can calculate the error (scale error) occurring in the scale SC by comparing the actual movement amount Mr (vector) from the position of the center Cv of the field of view V51 in the pre-shift image I1 toward the position of the center Cv of the field of view V51 in the post-shift image I2 with the movement amount M.

[0044] Furthermore, in step S107, the calculation unit 101 calculates the angle θ between the movement amount M and the actual movement amount Mr as the angle error of the wafer camera 51. Here, the angle θ is an angle with the rotation axis parallel to the Z direction as the center Cr.

[0045] In step S108, the calculation unit 101 corrects the scale error. Specifically, the calculation unit 101 subtracts the scale error from the setting value of the scale SC stored in the storage unit 110, and stores the result as a new setting value of the scale SC in the storage unit 110. In this way, the setting value of the scale SC stored in the storage unit 110 is updated, thereby correcting the scale error.

[0046] In step S109, the calculation unit 101 determines whether the angle θ is equal to or greater than a predetermined threshold angle. If the angle θ is less than the threshold angle (if "NO" in step S109), the calculation unit 101 corrects the angle error. Specifically, the angle of the coordinate axes (camera coordinate axes) used by the calculation unit 101 when calculating the position of the object in image I based on image I captured by wafer camera 51 is adjusted by the angle θ, thereby correcting the angle error.

[0047] On the other hand, if the angle θ is equal to or greater than the threshold angle (YES in step S109), the calculation unit 101 displays a message on the touch panel display of the UI 52 informing the user that the angle error of the wafer camera 51 is large (step S111).

[0048] In the embodiment described above, with the center Cv (reference position) of the field of view V51 of the wafer camera 51 (camera) and the center Cw (characteristic location) of the target part Wpt on the wafer W (workpiece) misaligned from each other, the field of view V51 including the center Cw of the target part Wpt is captured by the wafer camera 51, and a before-movement image I1 (first image) including the center Cw of the target part Wpt is acquired (step S102, first imaging operation). Next, a relative movement amount M of the center Cv of the field of view V51 with respect to the center Cw of the target part Wpt, which is required to align the center Cv of the field of view V51 with the center Cw of the target part Wpt, is calculated based on the before-movement image I1 (step S103, movement amount calculation operation), and the X-axis motor 356 and the Y-axis motor 355 (drive units) move the wafer camera 51 by the movement amount M relative to the wafer W (step S104, movement operation). If there is no deviation in the angle and scale of the wafer camera 51, the center Cv and the center Cw of the target part Wpt will coincide (i.e., overlap) within the field of view V51 of the wafer camera 51 after the movement operation of step S104. On the other hand, if there is deviation in the angle or scale of the wafer camera 51, the center Cv and the center Cw will not coincide (i.e., not overlap) within the field of view V51 of the wafer camera 51 after the movement operation of step S104. Therefore, after the movement operation of step S104, a post-movement image I2 (second image) including the center Cw of the target part Wpt is acquired (step S105, second imaging operation), and the amount of deviation of at least one of the angle and scale of the wafer camera 51 is calculated based on the positional relationship between the center Cv and the center Cw in the post-movement image I2 (steps S106 and S107, deviation amount calculation operation). In this way, it is possible to detect deviations in the angle or scale of the wafer camera 51.

[0049] Furthermore, the calculation unit 101 calculates the amount of deviation (error) in the angle of the wafer camera 51 (step S107). With this configuration, deviation that occurs in the angle of the wafer camera 51 can be detected.

[0050] Furthermore, a UI 52 (notification unit) that issues a notification to an operator is provided, and the calculation unit 101 causes the UI 52 to issue a notification when the amount of deviation in the angle of the wafer camera 51 calculated in step S107 is equal to or greater than a predetermined threshold angle. With this configuration, the operator can recognize that a deviation equal to or greater than the threshold angle has occurred in the angle of the wafer camera 51, and can appropriately perform maintenance such as adjusting the angle of the wafer camera 51.

[0051] Furthermore, the calculation unit 101 corrects the angle error in step S110. That is, thereafter, the calculation unit 101 calculates the angle of the target portion included in image I while correcting the amount of deviation in the angle of wafer camera 51 calculated in step S107. In this configuration, correction is performed based on the amount of deviation that has occurred in the angle of wafer camera 51. Therefore, it is possible to appropriately calculate the angle of the target portion included in image I captured by wafer camera 51.

[0052] Furthermore, the calculation unit 101 calculates the amount of deviation of the scale of the wafer camera 51 (step SS108). With this configuration, deviation that occurs in the scale of the wafer camera 51 can be detected.

[0053] Furthermore, the calculation unit 101 corrects the scale error in step S108. That is, thereafter, the calculation unit 101 calculates the position of the target portion included in the image I while correcting the amount of deviation of the wafer camera 51 calculated in step S106. With this configuration, it is possible to correct the deviation that occurs in the scale of the wafer camera 51.

[0054] As described above, in this embodiment, the component mounter 1 corresponds to an example of a "working device" of the present invention, the control unit 100 corresponds to an example of a "control unit" of the present invention, the wafer table 31 corresponds to an example of a "support unit" of the present invention, the X-axis motor 356 and the Y-axis motor 355 correspond to an example of a "drive unit" of the present invention, the mounting head 42 corresponds to an example of a "working unit" of the present invention, the wafer camera 51 corresponds to an example of a "camera" of the present invention, the wafer camera 51 corresponds to an example of a "drive target" of the present invention, the UI 52 corresponds to an example of a "notification unit" of the present invention, the pre-movement image I1 corresponds to an example of a "first image" of the present invention, the post-movement image I2 corresponds to an example of a "second image" of the present invention, the movement amount M corresponds to an example of a "movement amount" of the present invention, The field V51 corresponds to an example of a "field of view" of the present invention, the wafer W and the sheet Ws correspond to an example of a "work" of the present invention, the sheet Ws corresponds to an example of a "sheet" of the present invention, the component Wp corresponds to an example of a "bare chip" of the present invention, the center Cv of the field of view V51 corresponds to an example of a "reference position" of the present invention, the center Cw of the target component Wpt corresponds to an example of a "characteristic location" of the present invention, step S102 corresponds to an example of a "first imaging operation" of the present invention, step S103 corresponds to an example of a "movement amount calculation operation" of the present invention, step S104 corresponds to an example of a "movement operation" of the present invention, step S105 corresponds to an example of a "second imaging operation" of the present invention, and steps S106 and S107 correspond to an example of a "shift amount calculation operation" of the present invention.

[0055] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, the mounter 1 may be configured as shown in FIG.

[0056] Fig. 7 is a block diagram showing a modified example of a component mounter. The component mounter 1 in Fig. 7 is equipped with a camera rotation drive unit 53 that rotates the wafer camera 51 around a rotation axis parallel to the Z direction. This camera rotation drive unit 53 drives the wafer camera 51 using, for example, a motor or an actuator. In contrast, the control unit 100 has a camera drive control unit 105 that controls the driving of the wafer camera 51 by the camera rotation drive unit 53.

[0057] 3, the calculation unit 101 transmits to the camera drive control unit 105 a rotation command value for rotating the wafer camera 51 by the angle required to eliminate the angle error calculated in step S107. The camera drive control unit 105 then controls the camera rotation drive unit 53 based on this rotation command value, thereby rotating the wafer camera 51 by the angle indicated by the rotation command value. In this way, the angle error of the wafer camera 51 is eliminated.

[0058] That is, this modified example is provided with a camera rotation drive unit 53 (camera drive unit) that changes the angle of wafer camera 51 by driving wafer camera 51. Then, calculation unit 101 corrects the angle of wafer camera 51 by driving wafer camera 51 using camera rotation drive unit 53 based on the amount of deviation (angle error) in the angle of wafer camera 51 calculated in step S107 (step S110). With this configuration, deviation that occurs in the angle of wafer camera 51 can be corrected.

[0059] 3. The timing for performing the camera check in FIG. 3 can be variously assumed. After replacing the wafer W supported on the wafer table 31 After board B is removed from component mounter 1 When detecting misalignment of the component Wp held by the mounting head 42 When component mounter 1 starts the mounting operation of mounting component Wp onto board B When switching wafer W lots After a certain period of time has passed A camera check may be performed at any of the following times. At such times, any deviation in the angle or scale of the wafer camera 51 can be accurately detected. Detection of positional deviation of the component Wp held by the mounting head 42 can be performed based on an image of the component Wp held by the mounting head 42 captured by a camera from below. Specifically, if the distance between the center of the component Wp and the center of the nozzle 421 that picks up the component Wp is equal to or greater than a predetermined threshold distance, it can be determined that positional deviation of the component Wp has occurred.

[0060] Furthermore, the relative movement of the wafer camera 51 with respect to the wafer W held on the wafer table 31 may be performed by driving the wafer table 31, rather than by driving the wafer camera 51. Alternatively, this relative movement may be performed by driving both the wafer camera 51 and the wafer table 31.

[0061] Furthermore, the reference position of the field of view V51 is not limited to the center Cv of the field of view V51, and may be a position other than the center Cv. Furthermore, the characteristic location is not limited to the center Cw of the target part Wpt, and may be a position other than the center Cw (for example, a corner of the target part Wpt).

[0062] 3 is not limited to the wafer camera 51, but may be another camera provided in the component mounter 1. In short, the above camera check should be performed for the characteristic parts of the workpiece that can be photographed by the camera and the camera.

[0063] Furthermore, as described above, the component mounter 1 inverts the component Wp using the take-out head 36 and supplies the component Wp. However, the configuration of the component mounter 1 is not limited to this. For example, the camera check can be similarly performed in the surface mounter described in Japanese Patent No. 4308736. That is, in this surface mounter, a transfer head transfers components from a wafer on an XY table to a transfer stage, and a head unit mounts the components from the transfer stage onto a board. The component mounter is also equipped with a camera that captures an image of the wafer on the XY table from above. Therefore, the above-described camera check can be performed to detect any errors in the angle or scale of this camera.

[0064] Furthermore, the device equipped with the camera to be checked is not limited to the component mounter 1. Therefore, a camera check may be performed on a fiducial camera mounted on a printing device described in Japanese Patent Application Laid-Open Publication No. 2011-151222. This printing device (working device) includes a printing stage that supports a board and a squeegee that performs a printing operation to print solder on the board on the printing stage via a mask. Furthermore, a fiducial camera is provided that captures an image of a fiducial mark on the board supported on the printing stage. Therefore, the above-described camera check can be performed to detect errors in the angle or scale of this fiducial camera. In this case, the fiducial mark or land on the board can be used as the characteristic location.

[0065] Alternatively, a camera check may be performed on an imaging camera mounted on a visual inspection device described in WO2015 / 104799. This visual inspection device includes a transport conveyor that supports substrates and an inspection head that inspects the substrates on the transport conveyor. The inspection head also includes an imaging camera that captures images of the substrates. Therefore, the camera check can be performed to detect errors in the angle or scale of the imaging camera. In this case, for example, a fiducial mark on the substrate can be used as the characteristic location. [Explanation of symbols]

[0066] 1...Component mounting machine (working device) 100...Control unit 31...Wafer table (support part) 355...Y-axis motor (drive unit) 356...X-axis motor (drive unit) 42...Mounting head (working part) 51...Wafer camera (camera, driving object) 52...UI (Notification) I1...Image before movement (first image) I2...Image after movement (second image) M…Movement amount V51…Field of view W...wafer (work) Ws...Sheet (work) Wp...Components (bare chips) Wpt...Target parts Cv…Center (reference position) Cw: Center (characteristic point) S102...Step S102 (first imaging operation) S103...Step S103 (movement amount calculation operation) S104...Step S104 (movement operation) S105...Step S105 (second imaging operation) S106...Step S106 (deviation amount calculation operation) S107...Step S107 (deviation amount calculation operation)

Claims

1. a support portion for supporting a workpiece having a predetermined characteristic portion; a working unit that performs a predetermined operation on the workpiece supported by the support unit; a camera having a predetermined field of view and capturing an image within the field of view; a drive unit that drives at least one of the support unit and the camera to move the camera relative to the workpiece supported by the support unit; a control unit that acquires an image of a portion of the workpiece that overlaps with the field of view by causing the camera to capture an image while adjusting the position of the camera with respect to the workpiece using the drive unit; Equipped with The control unit a first imaging operation of acquiring, as a first image, the image including the characteristic location in a state where the characteristic location is displaced from a predetermined reference position in the field of view; a movement amount calculation operation of calculating, based on the first image, a relative movement amount of the reference position with respect to the characteristic location that is required to align the reference position with the characteristic location; a movement operation in which the driving unit moves the camera relative to the work by the movement amount; a second imaging operation of acquiring the image including the characteristic location as a second image after the moving operation is performed; a deviation amount calculation operation of calculating a deviation amount of at least one of the angle of the camera and a scale indicating the length of one pixel of the image based on a positional relationship between the reference position and the characteristic location in the second image; Work equipment to perform.

2. The work apparatus according to claim 1 , wherein the control unit calculates the amount of deviation in the angle of the camera in the deviation amount calculation operation.

3. Further provided is a notification unit that notifies the worker, The work apparatus according to claim 1 , wherein the control unit causes the notification unit to issue a notification when the amount of deviation of the camera angle calculated in the deviation amount calculation operation is equal to or greater than a predetermined threshold angle.

4. The work apparatus according to claim 2 or 3, wherein the control unit calculates the angle of the target portion included in the image while correcting the amount of deviation of the camera angle calculated in the deviation amount calculation operation.

5. a camera driving unit that changes the angle of the camera by driving the camera; The work device according to claim 2 or 3, wherein the control unit corrects the angle of the camera by driving the camera using the camera driving unit based on the amount of deviation of the angle of the camera calculated in the deviation amount calculation operation.

6. The working device according to claim 1 , wherein the control unit calculates the amount of deviation of the scale in the deviation amount calculation operation.

7. The working device according to claim 6 , wherein the control unit calculates the position of the target portion included in the image while correcting the amount of deviation of the scale calculated in the deviation amount calculation operation.

8. The work device according to claim 1 , wherein the reference position is the center of the field of view.

9. the workpiece has a sheet and a bare chip attached to the sheet, 2. The working device according to claim 1, wherein the working unit is a mounting head that performs a mounting operation of mounting the bare chip taken out of the sheet onto a substrate as the predetermined operation.

10. 10. The working device according to claim 9, wherein the control unit executes the first imaging operation, the movement amount calculation operation, the movement operation, the second imaging operation, and the displacement amount calculation operation at any one of the following timings: after the work supported by the support unit is replaced, after the board is carried out from the working device, when a positional deviation of the bare chip held by the mounting head is detected, when the mounting operation is started, when a lot of the work is switched, and after a certain period of time has elapsed.

11. a step of performing a first imaging operation to acquire a first image including a predetermined characteristic location in a state where the characteristic location is displaced from a predetermined reference position in the field of view by driving at least one of a support unit that supports a workpiece having the predetermined characteristic location and a camera that has a predetermined field of view and images the field of view, by causing the camera to image while facing the workpiece using a driving unit that moves the camera relatively to the workpiece supported by the support unit; a step of performing a movement amount calculation operation of calculating, based on the first image, a relative movement amount of the reference position with respect to the characteristic location that is required to align the reference position with the characteristic location; a step of performing a movement operation by the driving unit to move the camera relative to the work by the movement amount; performing a second imaging operation to acquire a second image including the characteristic location after the moving operation is performed; a step of performing a deviation amount calculation operation to calculate a deviation amount of at least one of an angle of the camera and a scale indicating a length of one pixel of an image captured by the camera, based on a positional relationship between the reference position and the characteristic location in the second image; A camera check method comprising:

Images