Plating Equipment

Abstract

A technology is provided that can prevent plating solution from scattering outside a plating tank when the plating solution is stirred. The anti-scattering member of the plating device has a first member 61 and a second member 62, the first member being positioned in a region above the paddle and below the upper end of the outer wall of the plating tank, and being positioned in a region between the outer wall of the plating tank and the substrate holder, and extending in the vertical direction and extending in a curved shape circumferentially around the outer wall of the plating tank, the second member being extended horizontally and positioned above the upper end of the outer wall of the plating tank, and being positioned above the first member with a first space between it and the first member, and being positioned outside the substrate holder with a second space between it and the substrate holder, and the inner surface of the first member, at least a portion thereof a predetermined distance below the upper end of the first member, forms an inclined surface that is inclined so that the distance from the center of the plating tank increases the further it goes upward.

Description

[Technical Field]

[0001] The present invention relates to a plating apparatus. [Background technology]

[0002] Conventionally, plating devices capable of plating a substrate have been known (see, for example, Patent Document 1). Such plating devices generally include a plating tank that stores a plating solution and in which an anode is disposed, a substrate holder that holds a substrate as a cathode facing the anode, and a paddle that is disposed in a region inside the plating tank above the anode and below the substrate holder and configured to agitate the plating solution. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7079388 Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional plating apparatus described above, when the plating solution is stirred, the plating solution may splash up and splash outside the plating tank. In this respect, the conventional plating apparatus has room for improvement.

[0005] The present invention has been made in consideration of the above, and one of its objects is to provide a technology that can prevent plating solution from splashing outside the plating tank when the plating solution is stirred. [Means for solving the problem]

[0006] (Aspect 1) In order to achieve the above object, a plating apparatus according to one aspect of the present invention includes a plating tank configured to store a plating solution and in which an anode is disposed, a substrate holder for holding a substrate as a cathode so as to face the anode, a paddle disposed in a region inside the plating tank above the anode and below the substrate holder and configured to stir the plating solution, and a splash suppression member configured to suppress the plating solution from splashing up and splashing outside the plating tank when the plating solution is stirred by the paddle, the splash suppression member having a first member and a second member, the first member being disposed above the paddle and below the The second member is positioned in a region below the upper end of the outer wall of the plating tank and in a region between the outer wall of the plating tank and the substrate holder, and extends in the vertical direction and also in a curved shape circumferentially around the outer wall. The second member extends horizontally and is positioned above the upper end of the outer wall of the plating tank, has a first space between it and the first member and is positioned above the first member, and has a second space between it and the substrate holder and is positioned outside the substrate holder. At least a portion of the inner surface of the first member that is a predetermined distance below the upper end of the first member forms an inclined surface that is inclined so that the distance from the center of the plating tank increases the further it extends upward.

[0007] According to this aspect, when the plating solution is stirred by the paddles, the plating solution can be prevented from scattering outside the plating tank. In particular, according to this aspect, since the inclined surface is provided on the inner peripheral surface of the first member, the plating solution that flows upward along the inner peripheral surface of the first member can be scattered outward (away from the center of the plating tank) along the inclined surface. This effectively prevents the plating solution that flows upward along the inner peripheral surface of the first member from scattering outside from the second space between the second member and the substrate holder.

[0008] (Aspect 2) In the above-mentioned first aspect, the predetermined distance may be 20% or more of the overall height, which is the distance from the upper end to the lower end of the first member.

[0009] (Aspect 3) In the above-mentioned aspect 1 or 2, the inclined surface may have an inclination angle with respect to a horizontal plane that is greater than 90°, the inclined surface may have a lower inclined surface and an upper inclined surface located above the lower inclined surface, and the inclination angle of the upper inclined surface may be greater than the inclination angle of the lower inclined surface.

[0010] (Aspect 4) In the above-mentioned aspect 3, the inclined surface may further have a middle inclined surface located between the lower inclined surface and the upper inclined surface, and the inclination angle of the middle inclined surface may be greater than the inclination angle of the lower inclined surface and smaller than the inclination angle of the upper inclined surface.

[0011] (Aspect 5) In any one of the above aspects 1 to 4, the inclined surface may have an inclination angle with respect to a horizontal plane that is greater than 90°, and the inclination angle of the inclined surface of the first member may have a value that varies depending on the circumferential position of the first member.

[0012] (Aspect 6) In any one of the above-mentioned aspects 1 to 5, the inclined surface of the first member may be configured so that an imaginary surface extending upward from the inclined surface of the first member abuts against the lower surface of the second member.

[0013] (Aspect 7) Any one of the above-mentioned aspects 1 to 6 may include an overflow tank arranged outside the outer peripheral wall of the plating tank, and the second member may be connected to an upper end of the outer peripheral wall of the overflow tank.

[0014] (Aspect 8) Any one of the above aspects 1 to 6 may include an overflow tank arranged outside the outer wall of the plating tank, and a support plate may be provided on the inner wall surface of the outer wall of the overflow tank, extending horizontally from the inner wall surface in a direction approaching the substrate holder, and the second member may be connected to the upper surface of the support plate. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a perspective view showing the overall configuration of a plating apparatus according to an embodiment; [Figure 2] 1 is a plan view showing the overall configuration of a plating apparatus according to an embodiment; [Figure 3] FIG. 2 is a schematic diagram showing the configuration of a plating module according to an embodiment. [Figure 4] FIG. 2 is a schematic view showing a state in which a substrate according to an embodiment is immersed in a plating solution. [Figure 5] FIG. 2 is a schematic diagram illustrating a paddle according to an embodiment. [Figure 6] FIG. 2 is a flow chart for explaining a series of operations from supplying a plating solution to starting a plating process according to an embodiment. [Figure 7] 7A and 7B are schematic perspective views of a scattering prevention member according to an embodiment. [Figure 8] FIG. 2 is a schematic enlarged cross-sectional view showing a state in which a scattering-prevention member according to an embodiment is placed in a plating tank. [Figure 9] 4 is a schematic enlarged cross-sectional view showing the flow of plating solution around a scattering suppression member according to an embodiment. FIG. [Figure 10] FIG. 2 is a schematic perspective view of an overflow tank according to an embodiment. [Figure 11] FIG. 3 is a schematic diagram for explaining in detail the configuration of a first member according to the embodiment. [Figure 12] 10A and 10B are schematic diagrams for explaining an example in which the inclination angle of the inclined surface of the first member according to the embodiment varies depending on the position in the circumferential direction of the first member. [Figure 13]FIG. 10 is a schematic plan view showing another example of a connection mode of the first member to the plating tank according to the embodiment. [Figure 14] FIG. 10 is a schematic front view showing another example of a connection mode of the first member to the plating tank according to the embodiment. [Figure 15] FIG. 10 is a schematic diagram illustrating a case where the first member according to the embodiment has only an upper inclined surface as an inclined surface. [Figure 16] FIG. 10 is a schematic diagram illustrating a case where the first member according to the embodiment has only an upper inclined surface and a lower inclined surface as inclined surfaces. [Figure 17] 10 is a schematic enlarged cross-sectional view illustrating another example of a connection mode of the scattering suppression member according to the embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are diagrammatically illustrated to facilitate understanding of the features of the components, and the dimensional ratios of the components may not be the same as those in reality. In addition, some drawings show XYZ Cartesian coordinates for reference. In these Cartesian coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0017] Fig. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 of this embodiment. Fig. 2 is a plan view (top view) showing the overall configuration of the plating apparatus 1000 of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0018] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates and is configured to transfer substrates between the load ports 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrates via a temporary stage (not shown).

[0019] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are arbitrary. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air inside the pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid inside the pattern with a plating liquid during plating, making it easier to supply the plating liquid inside the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are arbitrary.

[0020] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated using a treatment solution such as sulfuric acid or hydrochloric acid, thereby cleaning or activating the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 performs plating on the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0021] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers 600 are arranged vertically, but the number and arrangement of the spin rinse dryers 600 are optional. The transport device 700 is a device for transporting substrates between multiple modules in the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0022] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette on the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, etc. of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0023] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0024] The transfer device 700 transfers the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0025] It should be noted that the configuration of the plating apparatus 1000 described in FIGS. 1 and 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configurations shown in FIGS.

[0026] Next, a description will be given of the plating module 400. Since the multiple plating modules 400 included in the plating apparatus 1000 according to this embodiment have the same configuration, only one plating module 400 will be described.

[0027] Fig. 3 is a schematic diagram showing the configuration of a plating module 400 in a plating apparatus 1000 according to this embodiment. Specifically, Fig. 3 shows the plating module 400 before the substrate Wf is immersed in the plating solution Ps. Fig. 4 is a schematic diagram showing the substrate Wf immersed in the plating solution Ps. Note that Figs. 3 and 4 only show some of the scattering suppression members 60a and 60b, which will be described later.

[0028] The plating apparatus 1000 illustrated in FIGS. 3 and 4 is, for example, a plating apparatus of a type in which the substrate Wf is immersed in the plating solution Ps with its surface oriented horizontally (a so-called cup-type plating apparatus).

[0029] 3 and 4 includes a plating module 400 of a plating apparatus 1000, which includes a plating tank 10, an overflow tank 20, a substrate holder 30, and a paddle 70. The plating module 400 may also include a rotation mechanism 40, a tilt mechanism 45, and a lifting mechanism 50, as shown in FIG.

[0030] The plating tank 10 according to this embodiment is configured as a bottomed container with an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer peripheral edge of the bottom wall 10a, with the upper part of the outer peripheral wall 10b being open. The shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall 10b according to this embodiment has a cylindrical shape, as an example. A plating solution Ps is stored inside the plating tank 10.

[0031] The plating solution Ps may be any solution containing ions of the metal elements that make up the plating film, and specific examples thereof are not particularly limited. In this embodiment, copper plating is used as an example of plating, and a copper sulfate solution is used as an example of plating solution Ps. The plating solution Ps may also contain certain additives.

[0032] An anode 11 is disposed inside the plating tank 10. The specific type of the anode 11 is not particularly limited, and may be an insoluble anode or a soluble anode. In the present embodiment, an insoluble anode is used as an example of the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like may be used.

[0033] 3 and 4, an ion resistor 12 may be disposed above the anode 11 inside the plating tank 10. Specifically, as shown in the partially enlarged view of FIG. 4, the ion resistor 12 is formed of a porous plate member having a plurality of holes 12a (pores). The holes 12a are provided so as to connect the lower surface and the upper surface of the ion resistor 12.

[0034] The ion resistor 12 is provided to homogenize the electric field formed between the anode 11 and the substrate Wf serving as the cathode. By disposing the ion resistor 12 in the plating tank 10 as in this embodiment, it is possible to easily homogenize the thickness of the plating film (plating layer) formed on the substrate Wf.

[0035] As illustrated in FIGS. 3 and 4, a membrane 16 may be disposed inside the plating tank 10 above the anode 11 and below the ionic resistor 12. In this case, the membrane 16 divides the interior of the plating tank 10 into an anode chamber 17a below the membrane 16 and a cathode chamber 17b above the membrane 16. The anode 11 is disposed in the anode chamber 17a, and the ionic resistor 12 and the substrate Wf are disposed in the cathode chamber 17b. The membrane 16 is configured to allow ionic species, including metal ions, contained in the plating solution Ps to pass through the membrane 16 while preventing nonionic plating additives contained in the plating solution Ps from passing through the membrane 16. For example, an ion exchange membrane can be used as the membrane 16.

[0036] The plating tank 10 is provided with a supply port for supplying the plating solution Ps to the plating tank 10. Specifically, the outer wall 10b of the plating tank 10 according to this embodiment is provided with a first supply port 13a for supplying the plating solution Ps to the anode chamber 17a and a second supply port 13b for supplying the plating solution Ps to the cathode chamber 17b.

[0037] The plating tank 10 is also provided with a first outlet 14a for discharging the plating solution Ps in the anode chamber 17a to the outside of the plating tank 10. The plating solution Ps discharged from the first outlet 14a is pressure-fed by a pump (not shown) and supplied again to the anode chamber 17a from the first supply port 13a.

[0038] The overflow tank 20 is composed of a bottomed container disposed outside the plating tank 10. The overflow tank 20 is provided to temporarily store the plating solution Ps that has exceeded the upper end of the outer wall 10b of the plating tank 10 (i.e., the plating solution Ps that has overflowed from the plating tank 10). The plating solution Ps stored in the overflow tank 20 is discharged from the second outlet 14b, then pressure-fed by a pump (not shown), and again supplied to the cathode chamber 17b from the second supply port 13b.

[0039] The substrate holder 30 holds the substrate Wf as a cathode so that the surface Wfa to be plated of the substrate Wf faces the anode 11. In this embodiment, the surface Wfa to be plated of the substrate Wf is specifically provided on the surface (lower surface) facing downward of the substrate Wf.

[0040] The substrate holder 30 is connected to a rotation mechanism 40. The rotation mechanism 40 is a mechanism for rotating the substrate holder 30. "R1" illustrated in Figure 3 is an example of the rotation direction of the substrate holder 30. A known rotation motor or the like can be used as the rotation mechanism 40. The tilt mechanism 45 is a mechanism for tilting the rotation mechanism 40 and the substrate holder 30. The lifting mechanism 50 is supported by a support shaft 51 extending in the vertical direction. The lifting mechanism 50 is a mechanism for raising and lowering the substrate holder 30, the rotation mechanism 40, and the tilting mechanism 45 in the vertical direction. A known lifting mechanism such as a linear actuator can be used as the lifting mechanism 50.

[0041] The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, etc. The control module 800 controls the operation of the plating module 400 by the processor 801 operating based on instructions from a program stored in the storage device 802.

[0042] 5 is a schematic diagram illustrating the paddle 70. Referring to FIGS. 4 and 5, the paddle 70 is disposed in a region above the anode 11 and below the substrate holder 30 inside the plating tank 10. Specifically, the paddle 70 according to this embodiment is disposed between the ion resistor 12, which is disposed above the anode 11, and the substrate holder 30.

[0043] 5, the paddle 70 is an "agitation member" configured to be driven by a drive device 90 to agitate the plating solution Ps. As an example, the drive device 90 according to this embodiment receives instructions from a control module 800 and alternately drives the paddle 70 in a "first direction (1st)" parallel to the anode 11 (or the substrate Wf) and in a "second direction (2nd)" opposite to the first direction. That is, the paddle 70 according to this embodiment reciprocates in the first direction and the second direction.

[0044] It should be noted that known technology can be applied to the mechanical mechanism itself of such drive device 90. Specifically, drive device 90 according to this embodiment includes an electric motor 91 and a power conversion mechanism 92 that is connected to paddle 70 and is configured to convert the rotational motion of electric motor 91 into linear reciprocating motion and transmit the motion to paddle 70.

[0045] The first direction and the second direction are not limited to the above-mentioned directions. A direction perpendicular to the reciprocating direction of the paddle 70 is referred to as the "third direction (3rd)." Fig. 5 illustrates, as central axes of the paddle 70, a first central axis XL1 extending in the third direction and a second central axis XL2 extending in the reciprocating direction of the paddle 70.

[0046] The paddle 70 only needs to be disposed inside the plating tank 10 at least when stirring the plating solution Ps, and does not need to be disposed inside the plating tank 10 at all times. For example, when the driving of the paddle 70 is stopped and the plating solution Ps is not stirred by the paddle 70, the paddle 70 may be configured to be disposed outside the plating tank 10.

[0047] The specific configuration of the paddle 70 is not particularly limited as long as it can agitate the plating solution Ps. The paddle 70 shown in FIG. 5 includes, as an example, a honeycomb structure portion 71 having a honeycomb structure and a pair of outer frames (a first outer frame 72a and a second outer frame 72b) connected to the third direction end of the honeycomb structure portion 71. The specific structures of the first outer frame 72a and the second outer frame 72b are not particularly limited. As an example, the first outer frame 72a and the second outer frame 72b according to this embodiment are made of flat plate-like members. At least one of the first outer frame 72a and the second outer frame 72b is connected to a driving device 90.

[0048] The honeycomb structure section 71 has a plurality of polygonal holes 74 partitioned by beam members 73. The holes 74 according to this embodiment penetrate in the vertical direction so as to connect the upper and lower surfaces of the honeycomb structure section 71. The honeycomb structure section 71 also has a first peripheral wall 75 facing in a first direction and a second peripheral wall 76 facing in a second direction. The first peripheral wall 75 and the second peripheral wall 76 are formed by the beam members 73.

[0049] Moreover, the paddle 70 illustrated in FIG. 5 has a configuration in which the "paddle width D1 (the length in the reciprocating movement direction of the paddle 70)" of the honeycomb structure portion 71 changes along the third direction in a plan view. Specifically, the paddle 70 has a shape in which the paddle width D1 at the center in the third direction is wider than the paddle width D1 at the end portions in the third direction. In other words, the paddle 70 has a shape in which the portion closer to the center than the end portions in the third direction protrudes in the first and second directions more than the end portions. Moreover, the paddle 70 according to this embodiment has, as an example, a shape that is line-symmetric (bilaterally symmetric) with respect to the second central axis XL2.

[0050] The configuration of the paddle 70 is not limited to the above-described configuration, and may be any other known configuration as long as it is capable of stirring the plating solution Ps. As another example, the paddle 70 may include, instead of the honeycomb structure portion 71, a plurality of beam members extending linearly in the third direction.

[0051] 6 is a flow diagram illustrating a series of operations from supplying the plating solution to starting the plating process according to this embodiment. First, the plating solution Ps is supplied to the plating tank 10 (step S10). Specifically, the plating solution Ps is supplied to the plating tank 10 so that the anode 11 and the ion resistor 12 are immersed in the plating solution Ps. More specifically, in this embodiment, the plating solution Ps is supplied to the plating tank 10 from the first supply port 13a and the second supply port 13b.

[0052] Next, the substrate Wf is immersed in the plating solution Ps (step S20). Specifically, in this embodiment, the lifting mechanism 50 lowers the substrate holder 30, thereby immersing at least the plating surface Wfa of the substrate Wf in the plating solution Ps.

[0053] Next, the driving device 90 starts driving the paddle 70, thereby causing the paddle 70 to start stirring the plating solution Ps (step S30).

[0054] Next, a current is applied between the anode 11 and the substrate Wf by a current applying device (not shown), thereby starting the plating process on the substrate Wf (step S40). This starts the formation of a plating film on the plating surface Wfa of the substrate Wf. Specifically, in this embodiment, even during the plating process on the substrate Wf in step S40, the plating solution Ps is being stirred by the paddle 70 in step S30 (i.e., the plating solution Ps is being stirred while the plating film is being formed on the plating surface Wfa). Note that it is preferable that the control module 800 rotates the substrate holder 30 at least during the plating process in step S40.

[0055] 3 and 4, the plating module 400 of the plating apparatus 1000 according to this embodiment further includes a scattering suppression member 60a (i.e., a first scattering suppression member) and a scattering suppression member 60b (i.e., a second scattering suppression member).

[0056] Fig. 7A is a schematic perspective view of the scattering suppression member 60a. Fig. 7B is a schematic perspective view of the scattering suppression member 60b. Fig. 8 is a schematic enlarged cross-sectional view showing the scattering suppression member 60a arranged in the plating tank 10 (Fig. 8 corresponds to the enlarged cross-sectional view of part A1 in Fig. 4). Fig. 9 is a schematic enlarged cross-sectional view showing the flow of plating solution Ps around the scattering suppression member 60a.

[0057] 7 to 9, the scattering suppression members 60a, 60b are configured to suppress the plating solution Ps from splashing up and scattering outside the plating tank 10 when the plating solution Ps is stirred by the paddle 70. Specifically, the scattering suppression members 60a, 60b are disposed in the plating tank 10 and used at least when the plating solution Ps is stirred by the paddle 70 (i.e., at least when the paddle 70 is driven). The scattering suppression members 60a, 60b are members that can be called "scatter suppression cover members."

[0058] The specific manner in which the scattering suppression members 60a, 60b are connected to the plating apparatus 1000 is not particularly limited, but as an example, the scattering suppression members 60a, 60b according to this embodiment are connected to the outer peripheral wall 21 of the overflow tank 20 (i.e., the outer tank). Specifically, the scattering suppression members 60a, 60b may have a second member 62, which will be described later, connected to the upper end 21a of the outer peripheral wall 21 of the overflow tank 20 (see FIGS. 8 and 9).

[0059] Specifically, as illustrated in Fig. 10, the outer peripheral wall 21 of the overflow tank 20 according to this embodiment has a rectangular shape in plan view, for example. The upper end 21a of the outer peripheral wall 21 of the overflow tank 20 is located higher than the upper end of the outer peripheral wall 10b of the plating tank 10. With reference to Figs. 7A, 7B, and 10, the scattering suppression member 60a is placed on the upper end 21a of the outer peripheral wall 21 of the overflow tank 20 such that the predetermined position C1a of the scattering suppression member 60a corresponds to the predetermined position C1b of the outer peripheral wall 21 of the overflow tank 20, and the predetermined position C2a of the scattering suppression member 60a corresponds to the predetermined position C2b of the outer peripheral wall 21. Similarly, the anti-scattering member 60b is placed on the upper end 21a of the outer peripheral wall 21 of the overflow tank 20 so that the predetermined location C3a of the anti-scattering member 60b corresponds to the predetermined location C3b of the outer peripheral wall 21 of the overflow tank 20, and the predetermined location C4a of the anti-scattering member 60b corresponds to the predetermined location C4b of the outer peripheral wall 21.

[0060] The scattering suppression members 60a and 60b connected to the outer peripheral wall 21 of the overflow tank 20 may be fixed to the outer peripheral wall 21 by detachable fastening members such as bolts or pins.

[0061] However, the above example is merely one example of how the scattering suppression members 60a, 60b may be connected to the overflow tank 20. For example, the scattering suppression members 60a, 60b may be connected as follows. FIG. 17 is a schematic enlarged cross-sectional view illustrating another example of how the scattering suppression members 60a, 60b may be connected. As illustrated in FIG. 17, a support plate 22 may be provided on the inner peripheral wall surface 21b of the outer peripheral wall 21 of the overflow tank 20, extending horizontally from the inner peripheral wall surface 21b toward the substrate holder 30. Specifically, the support plate 22 illustrated in FIG. 17 is located above the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. In this case, the scattering suppression members 60a, 60b may have a second member 62 (described later) connected to the upper surface 22a of the support plate 22.

[0062] 7 to 9, the scattering suppression member 60a and the scattering suppression member 60b each include a first member 61 and a second member 62. Note that the configuration of the scattering suppression member 60b is similar to the configuration of the scattering suppression member 60a, so from here on, the scattering suppression member 60a will be described in detail.

[0063] 8 and 9, the first member 61 is disposed in a region above the paddle 70 and below the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. Specifically, the first member 61 illustrated in FIGS. 8 and 9 is disposed, for example, in a region above the paddle 70 and below the liquid level Ls of the plating solution Ps. As illustrated in FIGS. 8 and 9, the entire first member 61 may be disposed inside the plating solution Ps, but this configuration is not limiting. For example, it is sufficient that at least a portion of the first member 61 is disposed inside the plating solution Ps.

[0064] The first member 61 is disposed in a region between the outer peripheral wall 10b of the plating tank 10 and the substrate holder 30. The first member 61 according to this embodiment is formed of a plate member (plate-shaped member), for example. The first member 61 has an inner peripheral surface 61a on the side facing the substrate holder 30, and an outer peripheral surface 61b on the side facing the outer peripheral wall 10b. The first member 61 is disposed inside the plating tank 10 so that the inner peripheral surface 61a does not contact the substrate holder 30 and the outer peripheral surface 61b does not contact the outer peripheral wall 10b of the plating tank 10.

[0065] Furthermore, the first member 61 extends in the vertical direction and also in a curved shape in the circumferential direction of the outer peripheral wall 10b of the plating tank 10 (or in the circumferential direction of the substrate holder 30). Specifically, the first member 61 according to this embodiment extends in a curved shape in the circumferential direction of the outer peripheral wall 10b so as to follow the shape of the inner peripheral surface of the outer peripheral wall 10b of the plating tank 10 (in this embodiment, the shape extending in a curved shape in the circumferential direction of the outer peripheral wall 10b).

[0066] As illustrated in FIG. 7A, the first member 61 according to this embodiment has both circumferential ends of the first member 61 connected to the second member 62 via connecting members 65.

[0067] However, this is not a limitation. Figures 13 and 14 are schematic diagrams showing other examples of the manner in which the first member 61 is connected to the plating tank 10. For example, the first member 61 may not be connected to the second member 62, and instead may be directly connected to the plating tank 10 via at least one connecting member 68, as illustrated in Figures 13 and 14.

[0068] 13 and 14, the first member 61 is connected to the inner circumferential surface of the outer circumferential wall 10b of the plating tank 10 via, for example, two connecting members 68. Specifically, in this case, the two connecting members 68 may connect the lower end 61d of the first member 61 to the outer circumferential wall 10b of the plating tank 10. Furthermore, the two connecting members 68 may be disposed at one end and the other end of the first member 61 in the circumferential direction, respectively.

[0069] Fig. 11 is a schematic diagram for explaining the configuration of the first member 61 in detail. Specifically, Fig. 11 is an enlarged schematic cross-sectional view of a portion of the first member 61 and the second member 62. Referring to Fig. 11, at least a portion of the inner circumferential surface 61a of the first member 61 that is a predetermined distance (d2) below the upper end 61c of the first member 61 forms an inclined surface 67 that is inclined such that the distance (r1) from the center of the plating tank 10 increases the further upward.

[0070] The specific value of this specified distance (d2) is not particularly limited, but for example, a value of 20% or more of the "total height (La)", which is the distance from the upper end 61c to the lower end 61d of the first member 61, can be used, more specifically a value of 40% or more can be used, and even more specifically a value of 50% or more can be used.

[0071] 11, the predetermined distance (d2) is, for example, a value that is 100% of the overall height (La) of the first member 61. That is, the inclined surface 67 of the first member 61 illustrated in FIG. 11 is provided in a location from the upper end 61c to the lower end 61d of the first member 61. In other words, the inner circumferential surface 61a of the first member 61 illustrated in FIG. 11 is the inclined surface 67 as a whole.

[0072] The inclined surface 67 of the first member 61 illustrated in FIG. 11 has, in order from the top, an upper inclined surface 67a, a middle inclined surface 67b, and a lower inclined surface 67c.

[0073] Here, the inclined surface 67 according to this embodiment has an "inclination angle with respect to the horizontal plane hp that is greater than 90°." Specifically, this inclination angle means the angle (which is greater than 90°) formed between the upper surface of the imaginary horizontal plane hp that intersects with the inclined surface 67 and the surface of the inclined surface 67.

[0074] More specifically, in FIG. 11, the upper inclined surface 67a has an inclination angle α1, the middle inclined surface 67b has an inclination angle α2, and the lower inclined surface 67c has an inclination angle α3.

[0075] 11, in this embodiment, the inclination angle α1 of the upper inclined surface 67a is larger than the inclination angle α2 of the middle inclined surface 67b, which is larger than the inclination angle α3 of the lower inclined surface 67c. In other words, the inclination angle α2 of the middle inclined surface 67b is larger than the inclination angle α3 of the lower inclined surface 67c, and is smaller than the inclination angle α1 of the upper inclined surface 67a. In other words, the distance (r1) from the center of the plating tank 10 decreases in the order of the upper inclined surface 67a, the middle inclined surface 67b, and the lower inclined surface 67c.

[0076] The specific values ​​of the inclination angles α1, α2, and α3 are not particularly limited as long as they are greater than 90°, but may be values ​​selected from the range of 95° to 130°, for example.

[0077] 11, the inclined surface 67 may be configured such that an imaginary surface L1 extending upward from the inclined surface 67 abuts against the lower surface 62a of the second member 62. Specifically, in FIG. 11, as an example, an imaginary surface L1 extending upward from the upper inclined surface 67a abuts against the lower surface 62a of the second member 62. Although not shown, the imaginary surfaces of the middle inclined surface 67b and the lower inclined surface 67c also abut against the lower surface 62a of the second member 62.

[0078] 11 is merely one example of the first member 61, and the configuration of the first member 61 is not limited thereto. As another example, as shown in FIG. 15, the first member 61 may have only an upper inclined surface 67a as the inclined surface 67. In this case, the portion of the inner circumferential surface 61a of the first member 61 other than the upper inclined surface 67a may be a vertical wall surface.

[0079] 16, the first member 61 may have an upper inclined surface 67a and a lower inclined surface 67c as the inclined surface 67, but may not have a middle inclined surface 67b. In this case, the inclination angle α1 of the upper inclined surface 67a is larger than the inclination angle α3 of the lower inclined surface 67c. Alternatively, the inclined surface 67 of the first member 61 may be composed of inclined surfaces having four or more different inclination angles.

[0080] Furthermore, the inclination angle of the inclined surface 67 of the first member 61 may have the same value along the circumferential direction of the first member 61. In other words, the inclination angle of the inclined surface 67 of the first member 61 may be uniform along the circumferential direction of the first member 61.

[0081] Alternatively, the inclination angle of the inclined surface 67 of the first member 61 may have a value that varies depending on the circumferential position of the first member 61. Fig. 12 is a schematic diagram for explaining an example in which the inclination angle of the inclined surface 67 of the first member 61 varies depending on the circumferential position of the first member 61. Specifically, the diagram on the right side of Fig. 12 shows a schematic plan view (top view) of the first member 61, and the diagram on the left side of Fig. 12 shows schematic partial cross-sectional views of the first member 61 at different circumferential positions.

[0082] 12 and 11, a specific example in which the inclination angle of the inclined surface 67 varies depending on the circumferential position of the first member 61 will be given. For example, the inclination angle of the inclined surface 67 relative to the horizontal plane may be smaller in a central portion E1a in the circumferential direction of the first member 61 than in portions other than the central portion E1a in the circumferential direction of the first member 61 (i.e., the inclination angle of the central portion E1a may be the shallowest). In this case, the "central portion E1a" refers to a region within a predetermined range centered at the center of the first member 61 in the circumferential direction. The specific value of the range of the central portion E1a is not particularly limited, and may be, for example, a range of 10% to 30% of the circumferential length (Lb) of the first member 61.

[0083] 12, the inclination angle of the inclined surface 67 of the first member 61 may be smallest at the center E1a and may increase toward both end portions E1b. That is, in this case, the inclination angle of the inclined surface 67 is smallest at the center E1a and largest at both end portions E1b.

[0084] In the above case, for example, the inclination angles of all of the upper inclined surface 67a, the middle inclined surface 67b, and the lower inclined surface 67c of the inclined surface 67 may have different values ​​depending on the circumferential position of the first member 61. Alternatively, only the inclination angle of the upper inclined surface 67a may have a different value depending on the circumferential position of the first member 61, and the inclination angles of the middle inclined surface 67b and the lower inclined surface 67c may have the same value throughout the circumferential direction of the first member 61.

[0085] However, the above example is merely one example in which the inclination angle of the inclined surface 67 varies depending on the circumferential position of the first member 61, and the manner in which the inclination angle of the inclined surface 67 changes is not limited to the above example.

[0086] Next, the second member 62 will be described in detail. Referring again to FIG. 8, the second member 62 is disposed above the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. The second member 62 is disposed above the first member 61, with a space SP1 (i.e., the "first space") defined between the second member 62 and the first member 61. A space SP3 (i.e., the "third space") may be provided between the second member 62 and the upper end 10ba of the outer peripheral wall 10b. This allows the plating solution Ps that overflows from the outer peripheral wall 10b of the plating tank 10 to pass through this space SP3 and flow into the overflow tank 20. The second member 62 according to this embodiment is disposed above the liquid level Ls of the plating solution Ps.

[0087] 8, the second member 62 is disposed at a position such that it does not come into contact with the substrate holder 30. Specifically, the second member 62 is disposed outside the substrate holder 30 with a space SP2 (i.e., a "second space") defined between the second member 62 and the substrate holder 30.

[0088] Furthermore, the second member 62 according to this embodiment extends horizontally. Specifically, the second member 62 according to this embodiment is formed of a plate member having a lower surface 62a extending horizontally. Referring to FIG. 9, the lower surface 62a of the second member 62 is configured to allow the plating solution Ps that has splashed upward along the first member 61 to abut against this lower surface 62a. Specifically, the lower surface 62a of the second member according to this embodiment is located directly above the first member 61, and extends from the point directly above the first member 61 a predetermined distance toward the center of the plating tank 10 and also a predetermined distance toward the outer periphery of the plating tank 10.

[0089] The aforementioned space SP1 (the space provided between the first member 61 and the second member 62) is provided primarily to allow the plating solution Ps that has come into contact with the lower surface 62a of the second member 62 to escape horizontally.

[0090] If the space SP1 were not provided between the first member 61 and the second member 62, the flow of plating solution Ps in the plating tank 10 would be concentrated between the substrate holder 30 and the scattering-reducing member 60a, particularly between the first member 61. In this case, the plating solution Ps in the plating tank 10 would forcefully spray upward from between the substrate holder 30 and the scattering-reducing member 60a and would be scattered to the outside through the space SP2. In contrast, according to the present embodiment, the space SP1 is provided between the first member 61 and the second member 62, so that such a problem can be effectively prevented from occurring.

[0091] Referring to Figure 11, the specific value of the distance d1 between the first member 61 and the second member 62 is not particularly limited, but for example, a value selected from the range of 1 mm or more and 7 mm or less can be used, and specifically, a value selected from the range of 3 mm or more and 5 mm or less can be used.

[0092] As described above, according to this embodiment, the scattering suppression members 60a, 60b include the first member 61. Therefore, when the plating solution Ps is stirred by the paddle 70 (or when the substrate holder 30 is rotated), the first member 61 can reduce the momentum of the plating solution Ps flowing from the outer peripheral wall 10b of the plating tank 10 toward the center of the plating tank 10, or from the center of the plating tank 10 toward the outer peripheral wall 10b. This can prevent the plating solution Ps from colliding forcefully with the substrate holder 30 or the outer peripheral wall 10b. As a result, the plating solution Ps can be prevented from scattering outside the plating tank 10.

[0093] Furthermore, according to this embodiment, the scattering suppression members 60a, 60b include the second member 62. Therefore, when the plating solution Ps stirred and flowing by the paddle 70 splashes upward along the first member 61, the lower surface 62a of the second member 62 can receive the splashed plating solution Ps (see FIG. 9). The plating solution Ps received by the lower surface 62a can then be released horizontally in the space SP1. This effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0094] Furthermore, according to this embodiment, the inclined surface 67 described above is provided on the inner circumferential surface 61a of the first member 61, so that the plating solution Ps that flows upward along the inner circumferential surface 61a of the first member 61 can be scattered outward (in a direction away from the center of the plating tank 10) along the inclined surface 67 (see FIG. 9). This effectively prevents the plating solution Ps that flows upward along the inner circumferential surface 61a of the first member 61 from scattering outward from the space SP2 between the second member 62 and the substrate holder 30.

[0095] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various further modifications and alterations are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0096] 10 Plating tank 10b Outer wall of plating tank 10ba Upper end of the outer wall of the plating tank 11 Anode 20 Overflow tank 21 Outer wall of overflow tank 21a Upper end of the outer wall of the overflow tank 21b Inner peripheral wall surface of the outer peripheral wall of the overflow tank 22 Support plate 22a Upper surface of support plate 30 Substrate holder 60a, 60b Scattering prevention member 61 First member 61a: Inner circumferential surface of the first member 61c Upper end of first member 61d Lower end of first member 62 Second member 62a Lower surface of second member 67 Slope 67a Upper slope 67b Middle slope 67c Lower slope 70 paddles 1000 plating equipment L1 virtual plane Ps plating solution SP1 Space (1st space) SP2 space (second space) Wf substrate d2 predetermined distance α1,α2,α3 Inclination angle

Claims

1. a plating tank configured to store a plating solution and having an anode disposed therein; a substrate holder for holding a substrate as a cathode so as to face the anode; a paddle disposed in a region inside the plating tank above the anode and below the substrate holder, and configured to agitate the plating solution; a scattering suppression member configured to suppress the plating solution from splashing up and scattering outside the plating tank when the plating solution is stirred by the paddle, The scattering suppression member has a first member and a second member, the first member is disposed in a region above the paddle and below an upper end of an outer peripheral wall of the plating tank, and in a region between the outer peripheral wall of the plating tank and the substrate holder, and extends in a vertical direction and in a curved shape in a circumferential direction of the outer peripheral wall; the second member extends in a horizontal direction, is disposed above the upper end of the outer peripheral wall of the plating tank, is disposed above the first member with a first space defined between the second member and the first member, and is disposed outside the substrate holder with a second space defined between the second member and the substrate holder, and has a lower surface configured to come into contact with the plating solution that has splashed upward along the first member; A plating apparatus, wherein at least a portion of the inner circumferential surface of the first member downward from the upper end of the first member forms an inclined surface that is inclined so that the distance from the center of the plating tank increases the further upward, and at least a portion of the inclined surface is disposed inside the plating solution in the plating tank.

2. The inclined surface is provided on the inner peripheral surface of the first member at a location at least a predetermined distance below the upper end of the first member, 2. The plating apparatus according to claim 1, wherein the predetermined distance is equal to or greater than 20% of an overall height of the first member, which is the distance from the top end to the bottom end of the first member.

3. The inclined surface has an inclination angle with respect to a horizontal plane that is greater than 90°. having an oblique angle, the inclined surface has a lower inclined surface and an upper inclined surface located above the lower inclined surface, The plating apparatus according to claim 1 , wherein the inclination angle of the upper inclined surface is larger than the inclination angle of the lower inclined surface.

4. the inclined surface further includes a middle inclined surface located between the lower inclined surface and the upper inclined surface, 4. The plating apparatus according to claim 3, wherein the inclination angle of the middle inclined surface is larger than the inclination angle of the lower inclined surface and smaller than the inclination angle of the upper inclined surface.

5. the inclined surface has an inclination angle with respect to a horizontal plane that is greater than 90°; 2. The plating apparatus according to claim 1, wherein the inclination angle of the inclined surface of the first member varies depending on the position in the circumferential direction of the first member.

6. 2. The plating apparatus according to claim 1, wherein the inclined surface of the first member is configured such that an imaginary surface extending upward from the inclined surface of the first member abuts against a lower surface of the second member.

7. an overflow tank disposed outside the outer peripheral wall of the plating tank; The plating apparatus according to claim 1 , wherein the second member is connected to an upper end of an outer peripheral wall of the overflow tank.

8. an overflow tank disposed outside the outer peripheral wall of the plating tank; a support plate is provided on an inner peripheral wall surface of the outer peripheral wall of the overflow tank, the support plate extending horizontally from the inner peripheral wall surface in a direction approaching the substrate holder, The plating apparatus according to claim 1 , wherein the second member is connected to an upper surface of the support plate.

Images