Printed circuit board fixing chuck for printed circuit board polishing equipment

Abstract

To provide a printed circuit board fixed chuck for a printed circuit board polishing device which flexibly copes with upper surface or bottom surface processing of workpiece, and remarkably reduces time and cost required for replacement of the chuck.SOLUTION: A printed circuit board fixed chuck 100 for a printed circuit board polishing device includes a chuck body 200, a chuck block 300, and a bumper member 400. In the disc-shape chuck body, its lower side is fixed to a rotary shaft 110, and is rotated in conjugation with rotation of the rotation shaft, and has a block storage part 210 formed therein. The block storage part is formed with placing steps 211 which are formed into a rectangle corresponding to the shape of the chuck block so as to store the chuck block, and are radially arrayed in the chuck body or are arrayed in the chuck body so that its longitudinal directions are parallel with each other, based on the center of the chuck body, and are fastened with bolts inserted to the periphery of the block frame of the chuck block on its inner peripheral surface.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a chuck for fixing a printed circuit board in a polishing apparatus for a printed circuit board, and more particularly to a chuck for fixing a printed circuit board in a polishing apparatus for a printed circuit board, the chuck including a bumper member that contacts a ball tip of a thickness measuring means for measuring the thickness of a printed circuit board before the ball tip contacts the printed circuit board fixed to a chuck block and is located on a path of the ball tip, thereby reducing the impact of the ball tip contacting the printed circuit board. [Background technology]

[0002] Generally, a semiconductor package is manufactured by fabricating a semiconductor chip on which circuits such as transistors and capacitors are formed on a semiconductor substrate made of silicon material, and then attaching the semiconductor chip to a strip material such as a lead frame or a printed circuit board.

[0003] In other words, the semiconductor package can be manufactured through a process in which the semiconductor chip and the strip material are electrically connected by wires or the like so that they can be electrically connected to each other, and the semiconductor chip is molded with epoxy resin to protect it from the external environment.

[0004] Such strip material undergoes a polishing process, which is a mechanical and chemical polishing process to reduce the thickness.

[0005] The strip material can be ground to a desired thickness by rotating a grinding wheel disposed on the top of the strip and contacting the strip member.

[0006] A polishing device for polishing the above-mentioned conventional strip is disclosed in Korean Patent Registration No. 10-1675271 (November 7, 2016).

[0007] However, conventional fixing chucks for fixing a workpiece are one-piece, and when the chuck is replaced for material changes or testing, it requires a lot of manufacturing cost and time for replacement.

[0008] For this reason, conventionally, when changing processes, it takes a long time to change the chuck.

[0009] In addition, when the surface of the workpiece is polished, the thickness of the workpiece is measured using a thickness measuring means to determine whether the workpiece has been polished to the selected thickness. At this time, the thickness of the workpiece is measured while the ball tip of the thickness measuring means passes over the surface of the workpiece.

[0010] However, when the ball tip of the thickness measuring means passes through the surface of the workpiece, the ball tip collides with the side surface of the workpiece, causing problems such as damage to the side surface of the plate-shaped workpiece. Summary of the Invention [Problem to be solved by the invention]

[0011] SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board fixing chuck for a printed circuit board polishing apparatus which allows selective replacement of only the chuck block in the chuck body in accordance with the workpiece, thereby significantly reducing the time and cost required for chuck replacement compared to conventional methods, and which can flexibly handle processing of the top or bottom surface of the workpiece. The present invention also provides a bumper member which is provided on the path of a ball tip of a thickness measuring means for measuring the thickness of the printed circuit board during the polishing process and which comes into contact with the ball tip before the printed circuit board fixed to the chuck block passes through, thereby attenuating the contact impact between the ball tip and the printed circuit board and preventing damage to the printed circuit board caused by contact between the ball tip and the printed circuit board. [Means for solving the problem]

[0012] The present invention provides a printed circuit board fixing chuck for a printed circuit board polishing apparatus, comprising: a chuck body having a block receiving portion formed therein, the chuck body having a lower side fixed to a rotary shaft and rotating in conjunction with the rotation of the rotary shaft; a chuck block received in the block receiving portion formed in the chuck body, the upper surface of which faces and fixes a printed circuit board (workpiece) to be polished; and a bumper member connected to a bumper connecting groove formed in a path along which a ball tip of a thickness measuring means for measuring the thickness of the printed circuit board passes, the bumper member contacting the ball tip of the thickness measuring means before the printed circuit board fixed to the chuck block and attenuating contact impact.

[0013] In this case, the chuck block according to the present invention includes a block frame formed in a shape corresponding to the block receiving portion of the chuck body, and a porous pad received in a pad receiving groove formed on an upper surface of the block frame.

[0014] According to the present invention, a mounting step is formed on the inner peripheral surface of the block receiving portion of the chuck body, and supports the lower side of the block frame while fastening a bolt passing through the periphery of the block frame.

[0015] In addition, the chuck body according to the present invention may be made of one of ceramic and stainless steel (SUS).

[0016] Preferably, the bumper member according to the present invention is formed to a height corresponding to the height of a printed circuit board, which is a workpiece, placed on the upper surface of the chuck block.

[0017] In addition, the bumper member according to the present invention may have a tapered side that comes into contact with the ball tip of the thickness measuring means.

[0018] In addition, the bumper member according to the present invention may have one side and the other side that come into contact with the ball tip of the thickness measuring means formed in a tapered shape. [Effects of the Invention]

[0019] The advantages of the PCB fixing chuck for a PCB polishing apparatus according to the present invention are as follows.

[0020] By making it possible to selectively replace only the chuck block in the chuck body in accordance with the workpiece, the time and cost required for replacing the chuck are significantly reduced compared to the conventional case.

[0021] This allows for flexible machining of either the top or bottom surface of the workpiece.

[0022] In addition, a bumper member is provided on a path through which a ball tip of a thickness measuring means for measuring the thickness of a printed circuit board passes, the bumper member contacting the ball tip before the printed circuit board fixed to the chuck block passes, thereby reducing the impact of contact between the ball tip and the printed circuit board and preventing damage to the printed circuit board caused by the contact between the ball tip and the printed circuit board. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is an exemplary view showing a printed circuit board polishing apparatus according to an embodiment of the present invention; [Figure 2] 1 is an exemplary view showing a printed circuit board fixing chuck for a printed circuit board polishing apparatus according to an embodiment of the present invention; [Figure 3] 10 is an exemplary view showing a ball tip path of a thickness measuring means in a printed circuit board fixing chuck according to an embodiment of the present invention; [Figure 4] 1 is a cross-sectional view showing a cross section of a printed circuit board fixing chuck for a printed circuit board polishing apparatus according to an embodiment of the present invention; [Figure 5] 1 is an exemplary view showing a bumper member of a printed circuit board fixing chuck for a printed circuit board polishing apparatus according to an embodiment of the present invention; [Figure 6] 10 is an exemplary view showing a state in which one side of a bumper member of a printed circuit board fixing chuck for a printed circuit board polishing apparatus according to an embodiment of the present invention is tapered; FIG. [Figure 7] 10 is an exemplary view showing a state in which one side and the other side of a bumper member of a printed circuit board fixing chuck for a printed circuit board polishing apparatus according to an embodiment of the present invention are tapered; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms and words used in the specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, but should be interpreted as meanings and concepts that correspond to the technical ideas of the present invention, based on the principle that the inventor can appropriately define the concepts of terms in order to best describe his / her invention.

[0025] Therefore, it should be understood that the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent the technical ideas of the present invention, and that there may be equivalent modifications that can replace them at the time of this application.

[0026] The present invention relates to a PCB fixing chuck for a PCB polishing apparatus, which includes a bumper member that contacts a ball tip of a thickness measuring means for measuring the thickness of a PCB during a polishing process before the ball tip contacts the PCB, the bumper member being located on a path of the ball tip, thereby reducing a contact shock between the ball tip and the PCB. The present invention will be described with reference to the accompanying drawings.

[0027] First, referring to FIG. 1, a description will be given of a printed circuit board polishing apparatus according to an embodiment of the present invention. The apparatus is for polishing the surface of a printed circuit board, which is a workpiece, and is disposed below a rotating polishing wheel 10, and the surface of the printed circuit board, which is the workpiece, is polished by the polishing wheel 10.

[0028] That is, the grinding wheel 10 is preferably provided to rotate about its axial direction, and the grinding wheel 10 rotates and comes into contact with the surface of the printed circuit board, which is the workpiece, to grind the surface of the printed circuit board.

[0029] Although the workpiece will be described as being limited to a printed circuit board, other objects requiring surface polishing may also be used.

[0030] Therefore, it is preferable that a printed circuit board fixing chuck 100 for fixing the workpiece, i.e., the printed circuit board, is disposed below the grinding wheel 10, and the grinding wheel 10 comes close to the surface of the printed circuit board fixed to the printed circuit board fixing chuck 100 to polish the surface of the printed circuit board.

[0031] 2 to 7, the PCB fixing chuck 100 for a PCB polishing apparatus according to one embodiment of the present invention includes a chuck body 200, a chuck block 300, and a bumper member 400. The chuck body 200 is disk-shaped, has a lower side fixed to a rotary shaft 110, and rotates in conjunction with the rotation of the rotary shaft 110. The chuck body 200 has a block receiving portion 210 formed therein.

[0032] In this case, the chuck body 200 is made of either ceramic or stainless steel (SUS). When made of ceramic, it has advantages of corrosion resistance, less thermal deformation, and lower manufacturing costs compared to stainless steel, but has disadvantages of a higher rate of cracking when subjected to a large impact and a relatively longer manufacturing period compared to stainless steel. When made of stainless steel, it has advantages of corrosion resistance, high impact resistance, and a relatively shorter manufacturing period compared to ceramic.

[0033] Therefore, it is preferable that the material of the chuck body 200 is selected in consideration of thermal deformation due to heat generated during machining.

[0034] The block receiving portion 210 is preferably formed in a rectangular shape corresponding to the shape of the chuck block 300 so that the chuck block 300 can be received therein. The block receiving portions 210 are arranged radially on the chuck body 200 based on the center of the chuck body 200, or arranged such that their longitudinal directions are parallel to each other on the chuck body 200.

[0035] In addition, a mounting step 211 is formed on the inner peripheral surface of the block receiving portion 210, to which a bolt passing through the periphery of the block frame 310 of the chuck block 300 is fastened.

[0036] The mounting stage 211 protrudes inward from the inner peripheral surface of the block accommodating portion 210, and when the chuck block 300 is accommodated in the block accommodating portion 210, the mounting stage 211 supports the block frame 310 of the chuck block 300 to prevent the chuck block 300 from slipping out below the block accommodating portion 210.

[0037] Therefore, when the chuck block 300 is accommodated in the block accommodating portion 210 of the chuck body 200, it is fixed by fastening bolts. In this case, bolts are passed through bolt holes formed around the periphery of the block frame 310 of the chuck block 300, and the bolts are fastened to mounting steps 211 formed on the inner peripheral surface of the block accommodating portion 210, thereby fixing the chuck block 300 to the block accommodating portion 210 of the chuck body 200.

[0038] The chuck block 300 is accommodated in a block accommodating portion 210 formed in the chuck body 200, and a printed circuit board (a workpiece) is fixed to the upper surface of the chuck block 300 in contact with the upper surface.

[0039] In this case, the chuck block 300 includes a block frame 310 and a porous pad 320. The block frame 310 is preferably formed in a shape corresponding to the block receiving portion 210 of the chuck body 200, and a pad receiving groove 311 corresponding to the shape of the porous pad 320 is formed on the upper surface of the block frame 310.

[0040] A plurality of bolt holes through which bolts for fastening to the mounting stage 211 pass are formed at corresponding positions around the periphery of the block frame 310, and a plurality of vacuum holes 312 are formed at regular intervals along the area of ​​the bottom surface of the pad receiving groove 311 so that the chuck block 300 has a porous chuck structure.

[0041] Here, the porous pad 320 is a porous ceramic pad and is connected to a plurality of vacuum holes 312 formed on the bottom surface of the pad receiving groove 311, and the porous pad 320 has a vacuum suction force due to the vacuum generated by the vacuum holes 312.

[0042] Therefore, when the plurality of vacuum holes 312 are connected to a vacuum pump and the vacuum generated by the operation of the vacuum pump is transmitted to the porous pad 320, a vacuum suction force is generated on the surface of the porous pad 320, and the chuck block 300 functions as a porous chuck that fixes the workpiece by the vacuum suction force formed on the surface.

[0043] In addition, the height of the block frame 310 is formed to be the same as the plane height of the chuck body 200, so that no step is generated between the plane of the chuck body 200 and the block frame 210 of the chuck block 300 accommodated in the block accommodating portion 210 of the chuck body 200.

[0044] In addition, a bumper coupling groove 313 is formed on the periphery of the block frame 310 on a path through which a ball tip 21 of a thickness measuring means 20 for measuring the thickness of the printed circuit board fixed to the chuck block 300 passes, and the bumper member 400 is coupled to the bumper coupling groove 313.

[0045] The bumper member 400 is coupled to a bumper coupling groove 313 formed around the periphery of the chuck block 300 on a path through which the ball tip 21 of the thickness measuring means 20 for measuring the thickness of the printed circuit board passes, and comes into contact with the ball tip 21 of the thickness measuring means 20 before the printed circuit board fixed to the chuck block 300 comes into contact with the ball tip 21 of the thickness measuring means 20, thereby attenuating contact shock.

[0046] In this case, it is preferable that the bumper member 400 is formed to a height corresponding to the height of the printed circuit board, which is the workpiece, placed on the upper surface of the chuck block 300. The bumper member 400 may have one side that contacts the ball tip 21 of the thickness measuring means 20 tapered, or both the one side that contacts the ball tip 21 of the thickness measuring means 20 and the other side may be tapered.

[0047] Therefore, the PCB fixing chuck for a PCB polishing apparatus according to one embodiment of the present invention selectively replaces only the chuck block 300 of the chuck body 200 in accordance with the workpiece, thereby significantly reducing the time and cost required for chuck replacement compared to conventional methods and flexibly adapting to processing of the top or bottom surface of the workpiece. Furthermore, the bumper member 400 is provided on the path along which the ball tip 21 of the thickness measuring means 20 for measuring the thickness of the PCB passes, and the bumper member 400 contacts the ball tip 21 before the PCB fixed to the chuck block 300. This reduces the impact of contact between the ball tip 21 and the PCB, thereby preventing damage to the PCB caused by contact between the ball tip 21 and the PCB, and also prevents the accumulation of by-products generated during the PCB polishing process.

[0048] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and those skilled in the art will recognize that various modifications and equivalent embodiments are possible. Therefore, the true technical scope of protection of the present invention should be determined by the technical spirit of the claims. [Explanation of symbols]

[0049] 10: Polishing wheel 20: Thickness measuring means 21: Ball tip 100: Printed circuit board fixing chuck 110: Rotation axis 200: Chuck body 210: Block storage section 211: Placement stage 300: Chuck block 310: Block Frame 311: Pad receiving groove 312: Vacuum Hall 313: Bumper connecting groove 320: Porous pad 400: Bumper parts

Claims

1. A fixing chuck for fixing a printed circuit board in a printed circuit board polishing apparatus for polishing a printed circuit board as a workpiece with a rotating polishing wheel, a chuck body having a lower side fixed to a rotary shaft, which rotates in conjunction with the rotation of the rotary shaft, and which has a block accommodating portion formed therein; a chuck block accommodated in a block accommodating portion formed in the chuck body, the chuck block having a printed circuit board (workpiece) facing and fixed to an upper surface thereof by vacuum suction; a bumper member that is coupled to a bumper coupling groove formed on a path through which a ball tip of a thickness measuring means for measuring the thickness of the printed circuit board fixed on the upper surface of the chuck block passes among the periphery of the chuck block, the bumper member being formed between the chuck body and the printed circuit board at a height corresponding to the height of the processed surface of the printed circuit board, the bumper member contacting the ball tip of the thickness measuring means before the printed circuit board fixed on the upper surface of the chuck block comes into contact with the ball tip of the thickness measuring means to attenuate contact impact; Including, A printed circuit board fixing chuck for a printed circuit board polishing apparatus, wherein the ball tip of the thickness measuring means is positioned on the chuck body in an initial state of measurement.

2. The chuck block is a block frame formed in a shape corresponding to the block accommodating portion of the chuck body; 2. The printed circuit board fixing chuck of claim 1, further comprising: a porous pad received in a pad receiving groove formed on the upper surface of the block frame.

3. The inner peripheral surface of the block accommodating portion of the chuck body is 3. The printed circuit board fixing chuck for a printed circuit board polishing apparatus according to claim 2, further comprising a mounting step for supporting a lower side of the block frame and fastening a bolt passing through the periphery of the block frame.

4. The chuck body includes:

2. The PCB fixing chuck for a PCB polishing apparatus according to claim 1, wherein the PCB fixing chuck is made of one of ceramic and stainless steel (SUS).

5. The bumper member is 2. The printed circuit board fixing chuck for a printed circuit board polishing apparatus according to claim 1, wherein the height of the chuck block corresponds to the height of the rear surface of the printed circuit board, which is the workpiece fixed to the upper surface of the chuck block and contacts the bumper member.

6. The bumper member is 6. The printed circuit board fixing chuck for a printed circuit board polishing apparatus according to claim 5, wherein one side surface of the thickness measuring means that comes into contact with the ball tip is tapered.

7. The bumper member is 6. The chuck for fixing a printed circuit board for a polishing apparatus for a printed circuit board according to claim 5, wherein one side surface contacting the ball tip of the thickness measuring means and the other side surface are tapered.

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