Low dielectric constant boron carbonitride film

Abstract

An exemplary method of semiconductor processing can include delivering a boron-carbon-nitrogen containing precursor to a processing region of a semiconductor processing chamber. A substrate can be disposed in the processing region of the semiconductor processing chamber. The method can include generating a capacitively coupled plasma of the boron-carbon-nitrogen containing precursor. The method can include forming a boron-carbon-nitrogen containing layer on the substrate. The boron-carbon-nitrogen containing layer can be characterized by a dielectric constant of about 3.5 or less.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and priority to U.S. patent application Ser. No. 17 / 144,972, filed Jan. 8, 2021, entitled "LOW-k BORON CARBONITRIDE FILMS," the entire contents of which are incorporated herein by reference.

[0002]

[0002] The present technology relates to methods and components for semiconductor processing. More particularly, the present technology relates to systems and methods for fabricating low dielectric constant films for semiconductor structures. [Background technology]

[0003]

[0003] Integrated circuits are made possible by processes that create intricately patterned layers of material on substrate surfaces. Fabricating patterned materials on substrates requires controlled methods for forming and removing materials. As devices become increasingly smaller, the resistive and capacitive properties of the resulting structures can significantly affect device performance. To limit the adverse effects that can be caused by reduced device spacing, improved operation can be achieved by utilizing films characterized by lower dielectric constants. However, these materials can also be characterized by low elastic moduli, which can make them difficult to use during integration.

[0004]

[0004] Therefore, there is a need for improved systems and methods that can be used to manufacture high quality devices and structures. The present technique addresses these and other needs.

[0005] An exemplary method for semiconductor processing can include delivering a boron-, carbon-, and nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate can be placed in the processing region of the semiconductor processing chamber. The method can include generating a capacitively coupled plasma of the boron-, carbon-, and nitrogen-containing precursor. The method can include forming a boron-, carbon-, and nitrogen-containing layer on the substrate. The boron-, carbon-, and nitrogen-containing layer can be characterized by a dielectric constant of about 3.5 or less.

[0006] In some embodiments, the pressure in the semiconductor processing chamber can be maintained at about 1 Torr or greater while forming the boron-carbon-nitrogen-containing layer. The pressure in the semiconductor processing chamber can be maintained at about 10 Torr or less while forming the boron-carbon-nitrogen-containing layer. The plasma power can be maintained at about 500 W or less while generating the capacitively coupled plasma. The boron-carbon-nitrogen-containing layer can be characterized by a boron-to-nitrogen ratio of about 1:1 or greater. The boron-carbon-nitrogen-containing layer can be characterized by a boron concentration of about 40% or greater. Once exposed to the atmosphere, the boron-carbon-nitrogen-containing layer can be characterized by an oxygen incorporation of about 15% or less. The boron-carbon-nitrogen-containing layer can be characterized by a Young's modulus of about 50 GPa or greater. The method can include forming a plasma of a nitrogen-containing precursor. The method can include pretreating the substrate with plasma effluents of a nitrogen-containing precursor before providing the boron-carbon-nitrogen-containing precursor. The method can include providing a nitrogen-containing precursor with the boron-carbon-nitrogen-containing precursor. The method can include exposing the boron-carbon-nitrogen-containing layer to an annealing process characterized by a temperature of about 750°C or greater.

[0007] Some embodiments of the present technology may include a semiconductor processing method. The method may include delivering a boron-, carbon-, and nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be placed in the processing region of the semiconductor processing chamber. The method may include generating a capacitively coupled plasma of the boron-, carbon-, and nitrogen-containing precursor at a plasma power level of about 500 W or less. A pressure in the processing region of the semiconductor processing chamber may be maintained between about 1 Torr and about 12 Torr. The method may include forming a boron-, carbon-, and nitrogen-containing layer on the substrate.

[0008] In some embodiments, the boron-carbon-nitrogen-containing layer may be characterized by a dielectric constant of about 3 or less. The boron-carbon-nitrogen-containing layer may be characterized by a carbon concentration of about 15% or greater. The method may include forming a plasma of a nitrogen-containing precursor. The method may include pretreating the substrate with plasma effluents of the nitrogen-containing precursor. The boron-carbon-nitrogen-containing layer may be characterized by a boron-to-nitrogen ratio of about 1:1 or greater. The boron-carbon-nitrogen-containing precursor may be characterized by including at least three methyl moieties. The method may include providing a nitrogen-containing precursor with the boron-carbon-nitrogen-containing precursor.

[0009] Some embodiments of the present technology may include a semiconductor processing method. The method may include delivering a boron-, carbon-, and nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be placed in the processing region of the semiconductor processing chamber. The boron-, carbon-, and nitrogen-containing precursor may be characterized by having at least two methyl moieties bonded to nitrogen. The method may include generating a capacitively coupled plasma of the boron-, carbon-, and nitrogen-containing precursor. The method may include forming a boron-, carbon-, and nitrogen-containing layer on the substrate.

[0010] In some embodiments, generating the capacitively coupled plasma can include forming the plasma at a plasma power level of about 500 W or less. A pressure within the processing region of the semiconductor processing chamber can be maintained between about 1 Torr and about 12 Torr. The boron-carbon-nitrogen containing layer can be characterized by a dielectric constant of about 3.5 or less. The boron-carbon-nitrogen containing layer can be characterized by a Young's modulus of 50 GPa or greater.

[0011] Such techniques may offer many advantages over conventional systems and techniques. For example, embodiments of the present technique may produce materials that may be characterized by a lower dielectric constant. Furthermore, the present technique may produce films that are characterized by an increased Young's modulus. This may enable the films to be incorporated into an integrated flow that may include an annealing process. These and other embodiments, along with many of their advantages and features, are described in more detail below in conjunction with the description and accompanying drawings.

[0012] A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and the drawings. [Brief explanation of the drawings]

[0013] [Figure 1] 1 shows a schematic cross-sectional view of an exemplary plasma system in accordance with some embodiments of the present technique. [Figure 2]

[0014] 1 illustrates steps in a semiconductor processing method in accordance with some embodiments of the present technique. DETAILED DESCRIPTION OF THE INVENTION

[0014]

[0015] Some drawings are included as schematic diagrams. It should be understood that the drawings are for illustrative purposes and should not be considered to scale unless expressly stated to be to scale. Furthermore, as schematic diagrams, the drawings are provided to aid in understanding and may not include all aspects or information compared to realistic depictions and may include exaggerated material for illustrative purposes.

[0015]

[0016] In the accompanying drawings, similar components and / or features may have the same reference numerals. Furthermore, various components of the same type may be distinguished according to the reference numerals, with letters distinguishing between the similar components. When only a first reference numeral is used in this specification, the description is applicable to any of the similar components having the same first reference numeral, regardless of the letter.

[0016]

[0017] As device sizes continue to shrink, the thickness and size of many material layers can be reduced to tailor the devices. As structures move closer together within a device, dielectric materials can play a key role in limiting crosstalk and other electrical issues. Current materials may not be able to sufficiently lower their dielectric constant without sacrificing the film's material properties. For example, tailoring film properties to a lower dielectric constant for some materials can reduce the film's Young's modulus, reducing the film's strength to withstand subsequent processing. As a non-limiting example, logic processing may involve back-end-of-line annealing processes that expose structures to temperatures of 600°C or higher. Films characterized by low strength can shrink, potentially leading to structural damage.

[0017]

[0018] Prior art has struggled to produce films with sufficiently low dielectric constants while also maintaining structural requirements. The present technology overcomes these problems by implementing a plasma-enhanced deposition process for boron carbonitride films. By producing the films under conditions that overcome the competing properties of dielectric constant and film strength, materials are formed that can be included in integration and that can also be characterized by a low dielectric constant. The process implemented allows for improved tailoring of the produced films, resulting in films characterized by a variety of material properties for various applications.

[0018]

[0019] The remainder of the disclosure will routinely identify specific deposition processes utilizing the disclosed technology and describe one type of semiconductor processing chamber, but it will be readily understood that the described processes may be performed with any number of semiconductor processing chambers. Thus, the present technology should not be considered limited to use with only these specific deposition processes or chambers. Before describing methods for producing boron and carbon films, this disclosure will describe one possible chamber that may be used to perform processes in accordance with embodiments of the present technology.

[0019]

[0020] FIG. 1 illustrates a cross-sectional view of an exemplary processing chamber 100 in accordance with some embodiments of the present technique. This diagram may provide an overview of a system that may be specifically configured to incorporate one or more aspects of the present technique and / or perform one or more steps in accordance with embodiments of the present technique. Additional details of the chamber 100 or the method performed therein may be further described below. While the chamber 100 may be utilized to form a film layer in accordance with some embodiments of the present technique, it will be understood that the method may similarly be performed in any chamber in which film formation may occur. The processing chamber 100 may include a chamber body 102, a substrate support 104 disposed within the chamber body 102, and a lid assembly 106 connected to the chamber body 102 and enclosing the substrate support 104 in a processing space 120. A substrate 103 may be provided to the processing space 120 through an opening 126, which may be conventionally sealed for processing using a slit valve or door. The substrate 103 may be placed on a surface 105 of the substrate support during processing. The substrate support 104 may be rotatable, as indicated by arrow 145, along an axis 147 about which the shaft 144 of the substrate support 104 may lie. Alternatively, the substrate support 104 may be elevated to rotate as needed during the deposition process.

[0020]

[0021] The plasma profile modulator 111 may be positioned within the processing chamber 100 to control plasma distribution across a substrate 103 disposed on a substrate support 104. The plasma profile modulator 111 may include a first electrode 108 positioned adjacent to the chamber body 102 and capable of isolating the chamber body 102 from other components of the lid assembly 106. The first electrode 108 may be part of the lid assembly 106 or may be a separate sidewall electrode. The first electrode 108 may be an annular or ring-shaped member and may be a ring electrode. The first electrode 108 may be a continuous loop around the periphery of the processing chamber 100 surrounding the processing space 120, or may be discontinuous at selected locations, if desired. The first electrode 108 may also be a perforated electrode, such as a perforated ring or mesh electrode, or a flat electrode, such as a secondary gas distributor.

[0021]

[0022] One or more isolators 110 a, 110 b, which may be a dielectric material such as a ceramic or metal oxide, e.g., aluminum oxide and / or aluminum nitride, may contact the first electrode 108 and electrically and thermally isolate the first electrode 108 from the gas distributor 112 and the chamber body 102. The gas distributor 112 may define an aperture 118 for distributing process precursors to the processing space 120. The gas distributor 112 may be connected to a first power source 142, such as an RF generator, an RF power source, a DC power source, a pulsed DC power source, a pulsed RF power source, or any other power source that may be connected to a processing chamber. In some embodiments, the first power source 142 may be an RF power source.

[0022]

[0023] The gas distributor 112 may be a conductive gas distributor or a non-conductive gas distributor. The gas distributor 112 may also be formed from conductive and non-conductive components. For example, the body of the gas distributor 112 may be conductive, while the faceplate of the gas distributor 112 may be non-conductive. The gas distributor 112 may be powered, such as by a first power source 142 as shown in FIG. 1, or in some embodiments, the gas distributor 112 may be coupled with ground.

[0023]

[0024] The first electrode 108 may be connected to a first tuned circuit 128 that may control the ground path of the processing chamber 100. The first tuned circuit 128 may include a first electronic sensor 130 and a first electronic controller 134. The first electronic controller 134 may be or include a variable capacitor or other circuit element. The first tuned circuit 128 may be or include one or more inductors 132. The first tuned circuit 128 may be any circuit that allows for a variable or controllable impedance under plasma conditions present in the processing space 120 during processing. In some embodiments, such as the one shown, the first tuned circuit 128 may include a first circuit leg and a second circuit leg connected in parallel between ground and the first electronic sensor 130. The first circuit leg may include a first inductor 132A. The second circuit leg may include a second inductor 132B connected in series with the first electronic controller 134. The second inductor 132B can be disposed between the first electronic controller 134 and a node coupling both the first and second circuit legs to the first electronic sensor 130. The first electronic sensor 130 can be a voltage or current sensor that is connected to the first electronic controller 134 and can allow for some degree of closed-loop control of the plasma conditions within the process space 120.

[0024]

[0025] The second electrode 122 may be connected to the substrate support 104. The second electrode 122 may be embedded within the substrate support 104 or connected to a surface of the substrate support 104. The second electrode 122 may be a plate, perforated plate, mesh, wire screen, or other distributed arrangement of conductive elements. The second electrode 122 may be a tuning electrode and may be connected to a second tuning circuit 136 by a conduit 146, such as a cable having a selected resistance, such as 50 ohms, disposed within a shaft 144 of the substrate support 104. The second tuning circuit 136 may include a second electronic sensor 138 and a second electronic controller 140, which may be a second variable capacitor. The second electronic sensor 138 may be a voltage or current sensor and may be connected to the second electronic controller 140 to provide further control over the plasma conditions in the process space 120.

[0025]

[0026] A third electrode 124, which may be a bias electrode and / or an electrostatic chuck electrode, may be connected to the substrate support 104. The third electrode is coupled to a second power source 150 through a filter 148, where the filter 148 may be an impedance matching circuit. The second power source 150 may be DC power, pulsed DC power, RF bias power, a pulsed RF source or bias power, or a combination of these or other power sources. In some embodiments, the second power source 150 may be RF bias power. The substrate support 104 may also include one or more heating elements configured to heat the substrate to a processing temperature, which may be between about 25° C. and about 800° C. or higher.

[0026]

[0027] The lid assembly 106 and substrate support 104 of FIG. 1 can be used with any processing chamber for plasma or thermal processing. In operation, the processing chamber 100 can allow real-time control of plasma conditions within the processing space 120. The substrate 103 is placed on the substrate support 104, and process gases can be flowed through the lid assembly 106 using the inlet 114 according to any desired flow scheme. The gases can exit the processing chamber 100 through the outlet 152. Power can be connected to the gas distributor 112 to establish a plasma within the processing space 120. The substrate can receive an electrical bias using the third electrode 124 in some embodiments.

[0027]

[0028] Upon exciting a plasma in the processing space 120, a potential difference may be established between the plasma and the first electrode 108. A potential difference may also be established between the plasma and the second electrode 122. Electronic controllers 134, 140 may then be used to adjust the flow characteristics of the ground paths represented by the two tuned circuits 128, 136. Set points may be provided to the first tuned circuit 128 and the second tuned circuit 136 for independent control of the deposition rate and the center-to-edge plasma density uniformity. In embodiments in which both electronic controllers may be variable capacitors, electronic sensors may independently adjust the variable capacitors to maximize the deposition rate and minimize thickness non-uniformity.

[0028]

[0029] Each of the tuning circuits 128, 136 may have a variable impedance that can be adjusted using the respective electronic controllers 134, 140. If the electronic controllers 134, 140 are variable capacitors, the capacitance range of each of the variable capacitors and the inductance of the first inductor 132A and the second inductor 132B may be selected to provide an impedance range. This range depends on the frequency and voltage characteristics of the plasma, and there may be a minimum value within the capacitance range of each variable capacitor. Therefore, when the capacitance of the first electronic controller 134 is minimum or maximum, the impedance of the first tuning circuit 128 may be high, resulting in a plasma shape with minimal aerial or lateral coverage on the substrate support. When the capacitance of the first electronic controller 134 approaches a value that minimizes the impedance of the first tuning circuit 128, the aerial coverage of the plasma may grow to a maximum, effectively covering the entire working area of ​​the substrate support 104. If the capacitance of the first electronic controller 134 is deviated from the minimum impedance setting, the plasma shape may contract from the chamber walls, reducing the air coverage of the substrate support. The second electronic controller 140 has a similar effect, and as the capacitance of the second electronic controller 140 can be changed, the air coverage of the plasma on the substrate support may increase or decrease.

[0029]

[0030] Electronic sensors 130, 138 may be used to adjust the respective circuits 128, 136 in a closed loop. Depending on the type of sensor used, a current or voltage set point may be established for each sensor, and the sensors may be provided with control software that determines adjustments to each respective electronic controller 134, 140 to minimize deviations from the set point. As a result, plasma shapes may be selected and dynamically controlled during processing. While the above discussion is based on electronic controllers 134, 140 being variable capacitors, it will be understood that any electronic component with adjustable characteristics may be used to provide tuning circuits 128, 136 with adjustable impedance.

[0030]

[0031] Boron nitride is used in many processes in semiconductor processing, but it may not provide the low dielectric constant characteristics that can be used during integration. However, incorporating carbon into the structure to produce boron carbonitride can further reduce the dielectric constant. Thermal formation of boron carbonitride may not produce a viable route to low dielectric constant, high modulus films. While the dielectric constant may be fine-tuned to a range below 5, low values ​​of the dielectric constant can be difficult. Furthermore, the films produced may be characterized by increased leakage and reduced breakdown voltage due to structures fabricated by thermal bonding processes. By performing plasma-enhanced deposition, this technique overcomes the dielectric constant issues as well as electrical properties, and may provide improved hardness over many conventional films.

[0031]

[0032] Turning to FIG. 2 , exemplary steps in a processing method 200 according to some embodiments of the present technique are shown. The method may be performed in, and steps may be performed in, a variety of processing chambers, including the processing chamber 100 described above, as well as any other chamber, including non-plasma chambers. Method 200 may include numerous optional steps that may or may not be specifically related to some embodiments of the method according to the present technique. For example, many of the steps are described to provide a broader range of structure formation, but may not be critical to the present technique or may be performed by alternative methodologies that will be readily understood. Method 200 may include a processing method that may include multiple steps to develop a boron-carbon-nitrogen-containing film that may be characterized by a lower dielectric constant while maintaining sufficient physical properties. As further described below, by controlling the process conditions under which the film is formed, the dielectric constant may be further reduced while increasing the Young's modulus.

[0032]

[0033] In some embodiments, method 200 may optionally include pre-treating the substrate surface in optional step 205. Pre-treating the surface of the substrate may result in a good termination between the substrate and the film, improving film adhesion. The pre-treatment may be or include a thermal process, or may include a plasma-enhanced process. As described below, processing conditions may be maintained during film formation, facilitating the production of low dielectric constant, high modulus films. The treatment may include the delivery of a hydrogen-containing precursor, a nitrogen-containing precursor, or other precursor. Exemplary precursors may include hydrogen, ammonia, or other hydrogen- or nitrogen-containing precursors, among other materials that may pre-treat the substrate.

[0033]

[0034] In step 210, the method can include providing a boron-, carbon-, and nitrogen-containing precursor to a processing region of a semiconductor processing chamber that can house a substrate. In step 215, a plasma can be formed from the precursor, such as a capacitively coupled plasma, and in step 220, a boron-, carbon-, and nitrogen-containing layer can be formed on the substrate. By maintaining the processing conditions described below, the boron-, carbon-, and nitrogen-containing layer, such as boron carbonitride, can be characterized by a dielectric constant of about 4.0 or less, and can be characterized by a dielectric constant of about 3.9 or less, about 3.8 or less, about 3.7 or less, about 3.6 or less, about 3.5 or less, about 3.4 or less, about 3.3 or less, about 3.2 or less, about 3.1 or less, about 3.0 or less, about 2.9 or less, about 2.8 or less, or less.

[0034]

[0035] The plasma power at which the process is performed can affect film growth as well as various film properties. For example, incorporating carbon into the film can lower the dielectric constant by incorporating additional methyl groups into the film. However, during plasma processing, the methyl moieties can be relatively easily decomposed, and the carbon can be exhausted from the chamber. Additionally, increasing the plasma power can increase film bombardment, remove pores, and densify the film, further increasing the film's dielectric constant. Thus, in some embodiments, the plasma is generated at a plasma power of about 500 W or less, and can be generated at about 450 W or less, about 400 W or less, about 350 W or less, about 300 W or less, about 250 W or less, about 200 W or less, about 150 W or less, about 100 W or less, about 50 W or less, or less.

[0035]

[0036] Similarly, the pressure at which the process may be carried out can also affect process aspects. For example, increasing the pressure can increase absorption of atmospheric moisture, increasing the dielectric constant of the film. Maintaining a lower pressure can increase the hydrophobicity of the film. Thus, in some embodiments, the pressure can be maintained at about 10 Torr or less to enable the production of a sufficiently low dielectric constant. The pressure can be maintained at about 9 Torr or less, about 8 Torr or less, about 7 Torr or less, about 6 Torr or less, about 5 Torr or less, about 4 Torr or less, about 3 Torr or less, about 2 Torr or less, about 1 Torr or less, about 0.5 Torr or less, or less. However, to maintain plasma parameters to facilitate film formation, the pressure can be maintained at about 0.5 Torr or more, and can be maintained at about 1 Torr or more.

[0036]

[0037] For plasma processes that produce precursor decomposition in some embodiments, the semiconductor processing chamber, pedestal, or substrate may be maintained at a temperature of about 500°C or less, and in some embodiments, may be maintained at a temperature of about 475°C or less, about 450°C or less, about 425°C or less, about 400°C or less, about 375°C or less, about 350°C or less, about 325°C or less, about 300°C or less, about 275°C or less, about 250°C or less, about 225°C or less, about 200°C or less, about 175°C or less, about 150°C or less, about 125°C or less, about 100°C or less, about 75°C or less, or less.

[0037]

[0038] Many factors can affect the concentrations of nitrogen, carbon, and boron in the film. For example, in some embodiments, the deposited resultant film can be limited to or consist essentially of boron, carbon, nitrogen, and hydrogen, along with any trace substances that may constitute, for example, contaminants. In addition, some oxygen incorporation can occur after exposure to atmosphere. In some embodiments, the boron concentration can be about 30% or greater, about 32% or greater, about 34% or greater, about 36% or greater, about 38% or greater, about 40% or greater, about 42% or greater, about 44% or greater, about 46% or greater, or more. Similarly, the carbon concentration can be about 12% or greater, about 14% or greater, about 16% or greater, about 18% or greater, about 20% or greater, about 22% or greater, about 24% or greater, about 26% or greater, about 28% or greater, about 30% or greater, or more. The nitrogen concentration is about 20% or more, and may be about 22% or more, about 24% or more, about 26% or more, about 28% or more, about 30% or more, about 32% or more, about 34% or more, about 36% or more, about 38% or more, or more. Once exposed to the atmosphere, the film may incorporate any amount of oxygen, which may be maintained at about 15% or less, about 14% or less, about 13% or less, about 12% or less, about 11% or less, about 10% or less, about 9% or less, about 8% or less, or less. As described above, films according to some embodiments of the present technology are more hydrophobic, and therefore may absorb some oxygen, although the oxygen may not be hydroxyl oxygen. Therefore, the oxygen incorporated into the film may have a more limited effect on increasing the dielectric constant.

[0038]

[0039] While carbon or methyl groups can promote a lower dielectric constant within the film, the boron-to-nitrogen ratio within the film can affect the film's hardness and modulus. Thus, in some embodiments, the boron-to-nitrogen ratio is maintained at about 1:1 or greater, and may be maintained at about 1.2:1 or greater, about 1.4:1 or greater, about 1.6:1 or greater, about 1.8:1 or greater, about 2:1 or greater, or greater. The carbon-to-boron ratio can also promote beneficial properties of films according to some embodiments of the present technology. For example, while carbon incorporation can generally adversely affect film hardness, sufficient boron bonding based on film growth characteristics can improve hardness and modulus.

[0039]

[0040] By fabricating films according to embodiments of the present technology, Young's modulus can be maintained in the deposited films at about 40 GPa or greater, and can be maintained at about 42 GPa or greater, about 44 GPa or greater, about 46 GPa or greater, about 48 GPa or greater, about 50 GPa or greater, about 52 GPa or greater, about 54 GPa or greater, about 56 GPa or greater, about 58 GPa or greater, about 60 GPa or greater, about 62 GPa or greater, or higher. Furthermore, film hardness can be maintained at about 4.0 GPa or greater, and can be maintained at about 4.1 GPa or greater, about 4.2 GPa or greater, about 4.3 GPa or greater, about 4.4 GPa or greater, about 4.5 GPa or greater, about 4.6 GPa or greater, about 4.7 GPa or greater, about 4.8 GPa or greater, or higher. These properties can be produced without additional treatments such as UV or other processes.

[0040]

[0041] Precursors utilized in processes according to some embodiments of the present technology may include one or more precursors containing boron, carbon, and / or nitrogen in the precursor. For example, the present technology may utilize any boron-carbon-nitrogen-containing precursor in some embodiments. Non-limiting exemplary precursors may be or include tris(dimethylamino)borane, dimethylamineborane, trimethylamineborane, triethylamineborane, tetrakis(dimethylamino)diborane, or any other precursor containing one or more of boron, carbon, and / or nitrogen. In some embodiments, additional precursors may be included to adjust the atomic ratio. For example, additional hydrogen-containing precursors or nitrogen-containing precursors such as ammonia may be included along with a carrier gas or inert gas such as argon, nitrogen, helium, or other material.

[0041]

[0042] As previously mentioned, the present techniques may produce films that may have sufficient properties to be included in integration processes. For example, films produced according to some embodiments of the present techniques may be exposed to a high-temperature anneal in optional step 225 during downstream processing, which may be performed at temperatures above 700°C, such as about 750°C or higher, about 800°C or higher, about 850°C or higher, or higher. Due to the higher modulus and other properties of films produced by some embodiments of the present techniques, the low-k dielectric material may not be damaged by the annealing process, allowing for additional integration steps on the low-k dielectric material.

[0042]

[0043] In the foregoing description, for purposes of explanation, numerous details have been presented in order to facilitate an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that particular embodiments may be practiced without some of these details or with additional details.

[0043]

[0044] Although several embodiments have been disclosed, those skilled in the art will recognize that various modifications, alternative structures, and equivalents may be used without departing from the spirit of the embodiments. Additionally, some well-known processes and elements have not been described to avoid unnecessarily obscuring the technology. Therefore, the above description should not be construed as limiting the scope of the technology.

[0044]

[0045] Where a range of values ​​is given, unless the context clearly indicates otherwise, each intervening value between the upper and lower limit of that range is understood to be specifically disclosed to the smallest unit of the lower limit. Any narrower range between any stated or unstated intervening value in a stated range, and any other stated or intervening value in that stated range, is also included. The upper and lower limits of such narrower ranges may individually be included or excluded within that range. Each range where either, neither, or both limits are included within this narrower range is also encompassed within the technology, even though there may be specifically excluded limits within the stated range. When a stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.

[0045]

[0046] As used in this specification and claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to "a precursor" includes a plurality of such precursors, a reference to "the layer" includes a reference to one or more layers and equivalents thereof known to those skilled in the art, and so forth.

[0046]

[0047] Additionally, the terms "comprise(s)," "comprising," "contain(s)," "containing," "include(s)," and "including," when used in this specification and claims, are intended to specify the presence of stated features, integers, components, or operations, but do not exclude the presence or addition of one or more other features, integers, components, operations, activities, or groups.

Claims

1. delivering a boron-carbon-nitrogen containing precursor to a processing region of a semiconductor processing chamber in which a substrate is disposed; generating a capacitively coupled plasma of the boron-carbon-nitrogen containing precursor; forming a boron-carbon-nitrogen-containing layer on the substrate, the layer being characterized by a dielectric constant of 3.5 or less and a boron concentration of 40% or more; A semiconductor processing method comprising:

2. 10. The semiconductor processing method of claim 1, wherein a pressure within said semiconductor processing chamber is maintained at or above 1 Torr during formation of said boron-carbon-nitrogen containing layer.

3. 3. The semiconductor processing method of claim 2, wherein a pressure within said semiconductor processing chamber is maintained at 10 Torr or less during formation of said boron-carbon-nitrogen containing layer.

4. 10. The semiconductor processing method of claim 1, wherein plasma power is maintained at 500 W or less while generating said capacitively coupled plasma.

5. 10. The semiconductor processing method of claim 1, wherein said boron-carbon-nitrogen containing layer is characterized by a boron to nitrogen ratio of 1:1 or greater.

6. The semiconductor processing method of claim 1, wherein once exposed to the atmosphere, the boron-carbon-nitrogen-containing layer is characterized by an oxygen uptake of 15% or less.

7. 7. The semiconductor processing method of claim 6, wherein said boron-carbon-nitrogen containing layer is characterized by a Young's modulus of 50 GPa or greater.

8. forming a plasma of a nitrogen-containing precursor; pretreating the substrate with plasma effluents of the nitrogen-containing precursor prior to delivering the boron-, carbon-, and nitrogen-containing precursor; The semiconductor processing method of claim 1 further comprising:

9. providing a nitrogen-containing precursor together with said boron-, carbon-, and nitrogen-containing precursor; The semiconductor processing method of claim 1 further comprising:

10. exposing the boron-carbon-nitrogen containing layer to an annealing process characterized by a temperature of 750° C. or greater. The semiconductor processing method of claim 1 further comprising:

11. delivering a boron-carbon-nitrogen containing precursor to a processing region of a semiconductor processing chamber in which a substrate is disposed; generating a capacitively coupled plasma of the boron-carbon-nitrogen containing precursor at a plasma power level of 500 W or less, wherein a pressure within the processing region of the semiconductor processing chamber is maintained between 1 Torr and 12 Torr; forming a boron-carbon-nitrogen-containing layer on the substrate, the boron-carbon-nitrogen-containing layer being characterized by a boron concentration of 40% or greater; A semiconductor processing method comprising:

12. 12. The semiconductor processing method of claim 11, wherein said boron-carbon-nitrogen containing layer is characterized by a dielectric constant of 3 or less.

13. 12. The semiconductor processing method of claim 11, wherein the boron-carbon-nitrogen containing layer is characterized by a carbon concentration of 15% or greater.

14. forming a plasma of a nitrogen-containing precursor; pretreating the substrate with plasma effluents of the nitrogen-containing precursor; The semiconductor processing method of claim 11 further comprising:

15. 12. The semiconductor processing method of claim 11, wherein said boron-carbon-nitrogen containing layer is characterized by a boron to nitrogen ratio of 1:1 or greater.

16. 12. The semiconductor processing method of claim 11, wherein the boron-carbon-nitrogen containing precursor is characterized by including at least three methyl moieties.

17. providing a nitrogen-containing precursor together with said boron-, carbon-, and nitrogen-containing precursor; The semiconductor processing method of claim 11 further comprising:

18. delivering a boron, carbon, and nitrogen-containing precursor to a processing region of a semiconductor processing chamber, wherein a substrate is disposed in the processing region of the semiconductor processing chamber, the boron, carbon, and nitrogen-containing precursor being characterized by having at least two methyl moieties bonded to nitrogen; generating a capacitively coupled plasma of the boron-carbon-nitrogen containing precursor; forming a boron-carbon-nitrogen-containing layer on the substrate; Including, the boron-carbon-nitrogen-containing layer is characterized by a boron concentration of 40% or greater; Semiconductor processing methods.

19. 20. The semiconductor processing method of claim 18, wherein generating the capacitively coupled plasma comprises forming the plasma at a plasma power level of 500 W or less, and wherein a pressure within the processing region of the semiconductor processing chamber is maintained between 1 Torr and 12 Torr.

20. 20. The semiconductor processing method of claim 18, wherein said boron-carbon-nitrogen containing layer is characterized by a dielectric constant of 3.5 or less and a Young's modulus of 50 GPa or greater.

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