Transfer film, pattern formation method, circuit wiring manufacturing method, touch panel manufacturing method

Abstract

A first problem to be addressed by the present invention is to provide a transfer film having excellent durability under conditions of bending, moisture, and heat. A second problem to be addressed by the present invention is to provide, with regards to the transfer film, a pattern formation method, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel.　A transfer film according to the present invention comprises a temporary support and a photosensitive layer containing a compound A having an acid group, and satisfies the expression (X1), the expression (Y1), and the expression (XY1).　(X1): 0 ≤ X ≤ 1.80, (Y1): 1 ≤ Y ≤ 6, (XY1): Y ≤ -5X + 13.50. In the expressions, X is a value determined through a measurement X having prescribed steps 1 to 7 in that order, and Y is a value determined through a measurement Y having prescribed steps A to F in that order.

Description

[Technical Field]

[0001] The present invention relates to a transfer film, a pattern forming method, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel. [Background technology]

[0002] In display devices equipped with a touch panel, such as capacitive input devices (specifically, organic electroluminescent (EL) display devices and liquid crystal display devices), conductive patterns such as electrode patterns corresponding to the sensor in the viewing area, peripheral wiring, and wiring in the output wiring area are provided inside the touch panel.

[0003] Generally, photosensitive materials are used to form patterned layers (hereinafter also simply referred to as "patterns"), and in particular, a method using a transfer film having a temporary support and a photosensitive layer formed using a photosensitive material placed on the temporary support is widely used because it requires fewer steps to obtain the desired pattern shape. One method of forming a pattern using a transfer film is to expose and develop the photosensitive layer transferred from the transfer film onto an arbitrary substrate through a mask having a predetermined pattern shape.

[0004] As photosensitive materials and transfer films, for example, Patent Document 1 discloses "a photosensitive resin composition comprising a binder polymer having carboxyl groups with an acid value of 75 mgKOH / g or more, a photopolymerizable compound, and a photopolymerization initiator on a substrate" and "a photosensitive element comprising a support film and a photosensitive layer made of the photosensitive resin composition provided on the support film." [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] International Publication No. 2013 / 084886 [Overview of the project] [Problems that the invention aims to solve]

[0006] Incidentally, patterns formed using transfer film are also required to exhibit excellent low moisture permeability under high temperature and high humidity conditions even when folded (hereinafter also referred to as "excellent resistance to bending and moist heat").

[0007] The inventors of this invention formed a pattern using the photosensitive element (transfer film) described in Patent Document 1 and conducted an investigation, and found that there is room for improvement in the resistance to bending and moist heat.

[0008] Therefore, the object of the present invention is to provide a transfer film with excellent resistance to bending and humid heat. Another object of the present invention is to provide a pattern formation method, a circuit wiring manufacturing method, and a touch panel manufacturing method related to the above transfer film. [Means for solving the problem]

[0009] The inventors of the present invention diligently studied and found that the above problems can be solved by the following configuration, and thus completed the present invention.

[0010] [1] Temporary support and A photosensitive layer containing compound A having an acidic group, A transfer film having the following characteristics: A transfer film that satisfies the following formulas (X1), (Y1), and (XY1). 0 ≤ X ≤ 1.80 (X1) 1 ≤ Y ≤ 6 (Y1) Y ≤ -5X + 13.50 (XY1) In the above formula, X is the value obtained by the measurement X described below, and Y is the value obtained by the measurement Y described below. Measurement X; This is a measurement method comprising the following steps 1 to 7 in this order. Step 1: The process of bringing the surface of the photosensitive layer in the transfer film opposite to the temporary support side into contact with the substrate, thereby laminating the transfer film and the substrate together to obtain a laminate. However, the substrate used is a cellulose acylate film with a thickness of 60 μm. In the lamination process, the linear pressure is 3 N / cm, the transport speed is 1 m / min, and the lamination temperature is 100°C. Step 2: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using a proximity exposure machine equipped with an ultra-high pressure mercury lamp at an exposure dose of 80 mJ / cm². 2 The process of exposure. Step 3: After 30 minutes have elapsed since the exposure, the temporary support is peeled off from the laminate. Step 4: The photosensitive layer of the laminate is exposed to ultraviolet light from the opposite side of the substrate using an ultraviolet irradiation device with a high-pressure mercury lamp, with an exposure dose of 1000 mJ / cm². 2 This is the post-exposure process. Step 5: The laminate is left in an environment of 25°C and 50%RH for 24 hours. Step 6: For the laminate and the film consisting solely of the substrate, a water vapor permeability measurement is performed using the cup method at 65°C, 90%RH, and for a test period of 24 hours, in accordance with JIS-Z-0208 (1976). Step 7: The calculated moisture permeability is determined by referring to the following formula, and the moisture permeability of the exposed photosensitive layer of the laminate is calculated as X kg / (m³). 2 The process of determining the time (24 hours). Calculation formula: 1 / (X[kg / (m 2 (24h)) = [1 / (Moisture permeability of the above laminate [kg / (m³)] 2 ·24h)]))〕-〔1 / (Moisture permeability of film made only from the above substrate [kg / (m 2 (24 hours) Measurement Y is a measurement method comprising the following steps A to F in this order. Step A: The process of cutting the above transfer film to a size of 3.0 x 15.0 cm. Step B: A step in which the surface of the photosensitive layer in the cut-out transfer film, opposite to the temporary support side, is brought into contact with the substrate, and the transfer film and the substrate are laminated together to obtain a laminate. However, the substrate used is polyethylene terephthalate with dimensions of 3.5 × 23.0 cm and a film thickness of 50 μm. In addition, before lamination, the substrate is heated at 145°C for 25 minutes, and after cooling, lamination is performed within 5 minutes. In the lamination, the linear pressure is 3 N / cm, the transport speed is 4 m / min, and the lamination temperature is 100°C. Step C: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using a proximity exposure machine equipped with an ultra-high pressure mercury lamp at an exposure dose of 80 mJ / cm². 2 The process of exposure. Step D: After 30 minutes have elapsed since the exposure, the temporary support is peeled off from the laminate. Step E: The photosensitive layer of the laminate is exposed to ultraviolet light from the opposite side of the substrate using an ultraviolet irradiation device with a high-pressure mercury lamp, with an exposure dose of 1000 mJ / cm². 2 This is the post-exposure process. Step F: With the exposed photosensitive layer of the laminate facing outwards, an unloaded U-shaped stretch test is performed to determine the minimum bending width Y mm at which no cracks occur in the exposed photosensitive layer. However, in the above test, tests are performed with bending widths of 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, and 1 mm, in descending order of bending width. The holding width of the laminate before bending is 120 mm. In each bending width test, the number of bending cycles is 15, and the test speed is 100 rpm. After each bending width test is completed, the exposed photosensitive layer in the area ±10 mm from the center of the bend is observed at 5x magnification using an optical microscope to check for the presence or absence of cracks in the exposed photosensitive layer. The minimum bending width at which no cracks occur in the exposed photosensitive layer in the above test is defined as Y mm. Furthermore, if cracks occur in the exposed photosensitive layer even with a bending width of 6 mm, Y=7 is used, and if no cracks occur in the exposed photosensitive layer even with a bending width of 1 mm, Y=1 is used. [2] A transfer film as described in [1] that satisfies the following formula (XY2). Y≧-5X+6.00 (XY2) [3] A transfer film according to [1] or [2] that satisfies the following formula (Y2). 1 ≤ Y ≤ 4 (Y²) [4] A transfer film according to any of [1] to [3] that satisfies the following formula (X2). 0 ≤ X ≤ 1.50 (X²) [5] A transfer film according to any one of [1] to [4], wherein the photosensitive layer has a reduced content of the acid group in the photosensitive layer upon irradiation with active light or radiation. [6] A transfer film according to any of [1] to [5], wherein the above-mentioned photosensitive layer satisfies either of the following requirements (V01) and (W01). Requirements (V01) The above photosensitive layer comprises compound A having an acid group and compound β having a structure that reduces the amount of the acid group contained in compound A upon exposure. Requirements (W01) The above photosensitive layer contains compound A having an acid group, and compound A further contains a structure that reduces the amount of the acid group upon exposure. [7] In the above requirement (V01), compound β is compound B having a structure that can accept electrons from the acid group contained in compound A in the photoexcited state, The transfer film according to [6], wherein, in the above requirement (W01), the above structure is a structure that can accept electrons from the acid group in a photoexcited state. [8] The above requirement (V01) is met, and the above compound β is compound B having a structure in which it can accept electrons from the above acid group contained in compound A in the photoexcited state, The transfer film according to [6] or [7], wherein the total number of electron-accepting structures contained in compound B in the photosensitive layer is 1 mol% or more relative to the total number of acid groups contained in compound A. [9] A transfer film according to any one of [6] to [8], wherein compound A contains a polymer having an acid group.

[10] The transfer film according to [9], wherein the polymer has polymerizable groups.

[11] The transfer film according to any one of [1] to

[10] , wherein the above-mentioned photosensitive layer further contains a polymerizable compound.

[12] The transfer film according to any one of [1] to

[11] , wherein the above-mentioned photosensitive layer further comprises a photopolymerization initiator.

[13] A step of bonding the transfer film and the substrate by bringing the surface of the photosensitive layer in the transfer film described in any of [1] to

[12] that is opposite to the temporary support side into contact with the substrate, The process of exposing the above photosensitive layer in a patterned manner, The process includes developing the exposed photosensitive layer using a developer, A pattern forming method further comprising, in the case where the above-mentioned developer is an organic solvent-based developer, a step of exposing the pattern formed by development after the above-mentioned development step.

[14] A step of bonding the transfer film and the substrate by bringing the surface of the photosensitive layer in the transfer film described in any of [1] to

[12] that is opposite to the temporary support side into contact with the substrate, The process of exposing the above photosensitive layer in a patterned manner, A method for forming a pattern, comprising the steps of: developing the exposed photosensitive layer using an alkaline developer to form a pattern; and in this order.

[15] A step of bonding the transfer film and the substrate having the conductive layer by bringing the surface of the photosensitive layer in the transfer film described in any of [1] to

[12] that is opposite to the temporary support side into contact with the conductive layer in the substrate having the conductive layer, The process of exposing the above photosensitive layer in a patterned manner, The process involves developing the exposed photosensitive layer using an alkaline developer to form a patterned etching resist film, A method for manufacturing circuit wiring, comprising the steps of: etching the conductive layer in a region where the etching resist film is not present, in this order.

[16] A step of bonding the transfer film and the substrate having the conductive layer by bringing the surface of the photosensitive layer in the transfer film described in any of [1] to

[12] that is opposite to the temporary support side into contact with the conductive layer in the substrate having the conductive layer, The process of exposing the above photosensitive layer in a patterned manner, A method for manufacturing a touch panel, comprising the steps of: developing the exposed photosensitive layer using an alkaline developer to form a patterned protective film or insulating film on the conductive layer; and in this order. [Effects of the Invention]

[0011] According to the present invention, a transfer film with excellent resistance to bending and humid heat can be provided. Furthermore, a pattern formation method, a circuit wiring manufacturing method, and a touch panel manufacturing method related to the above transfer film can be provided. [Brief explanation of the drawing]

[0012] [Figure 1] This is a conceptual diagram of the test apparatus used for the unloaded U-shaped extension test. [Figure 2] This is a schematic diagram showing an example of the layer structure of the transfer film according to the embodiment. [Modes for carrying out the invention]

[0013] The present invention will be described in detail below. In this specification, numerical ranges represented by "~" mean a range that includes the numbers written before and after "~" as the lower and upper limits, respectively. Furthermore, in the numerical ranges described stepwise in this specification, the upper or lower limit stated in one numerical range may be replaced with the upper or lower limit of another numerical range described stepwise. Also, in the numerical ranges described in this specification, the upper or lower limit stated in one numerical range may be replaced with the value shown in the example.

[0014] Furthermore, the term "process" as used in this specification includes not only independent processes, but also processes that cannot be clearly distinguished from other processes, as long as their intended purpose is achieved.

[0015] In this specification, unless otherwise specified, the temperature condition may be 25°C. For example, the temperature when performing each of the above steps may be 25°C unless otherwise specified.

[0016] In this specification, "transparent" means that the average transmittance of visible light with a wavelength of 400 to 700 nm is 80% or more, and preferably 90% or more. Therefore, for example, "transparent resin layer" refers to a resin layer having an average transmittance of visible light with a wavelength of 400 to 700 nm of 80% or more. Furthermore, the average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, the Hitachi U-3310 spectrophotometer manufactured by Hitachi, Ltd.

[0017] In this specification, "active light" or "radiation" means, for example, the emission line spectra of mercury lamps such as g-rays, h-rays, and i-rays, far ultraviolet light represented by excimer lasers, extreme ultraviolet (EUV) light, X-rays, and electron beams (EB). Also, in this invention, "light" means active light or radiation.

[0018] In this specification, unless otherwise specified, "exposure" includes not only exposure using far ultraviolet, extreme ultraviolet, X-ray, and EUV light represented by mercury lamps and excimer lasers, but also drawing using particle beams such as electron beams and ion beams.

[0019] In this specification, unless otherwise specified, the content ratio of each structural unit of the polymer is expressed as a molar ratio. Furthermore, unless otherwise specified in this specification, the refractive index is the value measured by an ellipsometer at a wavelength of 550 nm.

[0020] In this specification, unless otherwise specified, molecular weights when a molecular weight distribution is given refer to weight-average molecular weights. In this specification, the weight-average molecular weight of the resin is the weight-average molecular weight obtained by gel permeation chromatography (GPC) on a polystyrene basis.

[0021] In this specification, "(meth)acrylic acid" is a concept that encompasses both acrylic acid and methacrylic acid, and "(meth)acryloyl group" is a concept that encompasses both acryloyl group and methacryloyl group.

[0022] In this disclosure, "alkali soluble" means that the compound or the layers constituting the transfer film have a dissolution rate of 0.01 μm / second or higher, as determined by the following method. A propylene glycol monomethyl ether acetate solution with a concentration of 25% by mass of the target material (e.g., resin) is applied to a glass substrate, and then heated in an oven at 100°C for 3 minutes to form a coating film (thickness 2.0 μm) of the target material. The dissolution rate (μm / second) of the coating film is determined by immersing the coating film in a 1% by mass aqueous solution of sodium carbonate (liquid temperature 30°C). If the substance does not dissolve in propylene glycol monomethyl ether acetate, dissolve it in an organic solvent with a boiling point of less than 200°C other than propylene glycol monomethyl ether acetate (for example, tetrahydrofuran, toluene, or ethanol).

[0023] In this specification, "water-soluble" means that the solubility in 100g of water at a pH of 7.0 at a liquid temperature of 22°C is 0.1g or more. Therefore, for example, a water-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions.

[0024] The "solid content" of a composition refers to the components that form the composition layer (e.g., the photosensitive layer) formed using the composition. If the composition contains a solvent (e.g., an organic solvent and water), it refers to all components excluding the solvent. Furthermore, any liquid components that form the composition layer are also considered to be solid content.

[0025] In this specification, unless otherwise specified, the layer thickness (film thickness) is the average thickness measured using a scanning electron microscope (SEM) for thicknesses of 0.5 μm or more, and the average thickness measured using a transmission electron microscope (TEM) for thicknesses less than 0.5 μm. The above average thickness is the average thickness obtained by arithmetic meaning the thicknesses of five arbitrary points measured by forming a section of the material to be measured using an ultramicrotome.

[0026] [Transfer film] Temporary support and A photosensitive layer containing compound A having an acidic group, A transfer film having the following characteristics: A transfer film that satisfies the following formulas (X1), (Y1), and (XY1). 0 ≤ X ≤ 1.80 (X1) 1 ≤ Y ≤ 6 (Y1) Y ≤ -5X + 13.50 (XY1) In the above formula, X is the value obtained by the measurement X described below, and Y is the value obtained by the measurement Y described below.

[0027] Although the detailed mechanism of action of the transfer film of the present invention is not clear, the inventors speculate as follows. In other words, the pattern formed from the photosensitive layer of the transfer film of the present invention (the photosensitive layer after exposure) exhibits excellent low moisture permeability when not curved, and is less prone to cracking even when bent. Therefore, the above pattern can maintain good low moisture permeability even in a curved state, and it is believed that the problem of the present invention has been solved. The features of the transfer film of the present invention will be described in detail below.

[0028] 〔Measurement X〕 For the transfer film of the present invention, the value of X obtained by the following-described Measurement X satisfies the following formula (X1). Further, it is preferable that the transfer film of the present invention satisfies the following formula (X2). 0≦X≦1.80 (X1) 0≦X≦1.50 (X2)

[0029] Measurement X is a measurement method having the following steps 1 to 7, which will be described below, in this order. Step 1: A step of obtaining a laminate by bringing the surface of the photosensitive layer in the transfer film, which is opposite to the temporary support side, into contact with a base material, laminating the transfer film and the base material. However, for the base material, a cellulose acetate film with a film thickness of 60 μm is used. In the above lamination, the line pressure is 3 N / cm, the conveyance speed is 1 m / min, and the lamination temperature is 100°C. Step 2: A step of performing exposure with an exposure amount of 80 mJ / cm 2 on the photosensitive layer of the laminate from the side opposite to the base material using a proximity type exposure machine having an ultra-high pressure mercury lamp. Step 3: A step of peeling the temporary support from the laminate 30 minutes after the above exposure. Step 4: A step of performing post-exposure with an exposure amount of 1000 mJ / cm 2 on the photosensitive layer of the laminate from the side opposite to the base material using an ultraviolet irradiation device having a high pressure mercury lamp. Step 5: A step of leaving the laminate in an environment of 25°C and 50% RH for 24 hours. Step 6: A step of performing a moisture permeability measurement by the cup method for 24 hours at 65°C and 90% RH based on JIS-Z-0208 (1976) for the film composed only of the laminate and the base material, respectively. Step 7: A step of obtaining the moisture permeability X kg / (m 2 ·24h) of the exposed photosensitive layer of the laminate according to the following calculation formula based on the obtained moisture permeability. Calculation formula: 1 / (X [kg / (m 2 ·24h)]) = [1 / (the moisture permeability of the laminate [kg / (m2 ·24h)]))〕-〔1 / (Moisture permeability of film made only from the above substrate [kg / (m 2 (24 hours) The following details each step.

[0030] <<<Process 1>>> Step 1 is a step in which the surface of the photosensitive layer in the transfer film opposite to the temporary support side is brought into contact with the substrate, and the transfer film and the substrate are bonded together and laminated to obtain a laminate. However, the above substrate is a cellulose acylate film with a film thickness of 60 μm. Specifically, Fujifilm's TG60UL is typically used as the above substrate. In the above lamination process, the linear pressure is set to 3 N / cm, the transport speed to 1 m / min, and the lamination temperature to 100°C. If the transfer film has a cover film (described later), the cover film should be peeled off the transfer film before proceeding with step 1. Furthermore, if the transfer film has other layers in addition to the cover film, photosensitive layer, and temporary support, the transfer film is laminated to the substrate, including the other layers, according to the normal method of use of the transfer film. In this case, the laminate may have the other layers, for example, between the temporary support and the photosensitive layer, and / or between the substrate and the photosensitive layer.

[0031] <<<Process 2>>> Step 2 involves exposing the photosensitive layer of the laminate to the opposite side of the substrate using a proximity exposure machine equipped with an ultra-high pressure mercury lamp, at an exposure dose of 80 mJ / cm². 2 This is the process of exposure. For the above-mentioned proximity type exposure system, a proximity type exposure system manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd. is typically used. Furthermore, exposure of the photosensitive layer in step 2 is performed through a temporary support. The above exposure dose is 80 mJ / cm². 2This is the cumulative exposure amount measured with a 365nm illuminometer, representing light that passes through the temporary support and reaches the layer (such as the photosensitive layer) located on the substrate side of the temporary support. The illuminance during exposure with an ultra-high pressure mercury lamp is 5-100 mW / cm². 2 Preferably, 10-50 mW / cm² 2 This is preferable.

[0032] <<<Step 3>>> Step 3 is the above exposure (80 mJ / cm²). 2 This step involves peeling the temporary support from the laminate after 30 minutes have elapsed since the exposure. If the transfer film used for measurement is a transfer film in which a temporary support and a photosensitive layer are directly laminated, the photosensitive layer (80 mJ / cm²) is located on the surface of the laminate. 2 The photosensitive layer (exposed by the light) is exposed. Furthermore, if the transfer film to be measured is laminated with other layers in between the temporary support and the photosensitive layer, these other layers will be exposed on the surface of the laminate.

[0033] <<<Step 4>>> Step 4 involves exposing the photosensitive layer of the laminate to an ultraviolet irradiation device with a high-pressure mercury lamp from the opposite side of the substrate, with an exposure dose of 1000 mJ / cm². 2 This is the post-exposure process. Typically, an ultraviolet irradiation conveyor system (manufactured by iGraphics Co., Ltd.) is used as the ultraviolet irradiation device mentioned above. Note that the above 1000 mJ / cm 2 Exposure refers to an integrated exposure of 1000 mJ / cm² measured with a 365 nm light meter. 2 This is the resulting exposure. The illuminance during exposure with a high-pressure mercury lamp is 10-200 mW / cm². 2 Preferably, 15-100 mW / cm² 2 This is preferable.

[0034] <<<Step 4.5>>> If the transfer film to be measured is laminated between a temporary support and a photosensitive layer with other layers in between, and the other layers are exposed on the surface of the laminate after step 4, and in the normal use of the transfer film, the exposed other layers are layers that should be removed without remaining in the final pattern, then a step to remove the other layers (step 4.5) is performed between step 4 and step 5. The method for removing the above-mentioned other layers may be to employ appropriate means for removing the above-mentioned other layers. For example, if the other layer is alkali-soluble or water-soluble after step 4, a method of removing the other layer can be used by treating the laminate with an alkaline developer (such as a 1% by mass aqueous solution of sodium carbonate). It is also preferable to rinse the laminate with water or the like after treatment with the alkaline developer and then dry it. However, it is preferable not to heat-treat the laminate in step 4.5. Furthermore, step 4.5 should be carried out in a manner that does not alter the photosensitive layer as much as possible.

[0035] <<<Step 5>>> Step 5 is a process in which the laminate obtained in Step 4 (or, if Step 4.5 is performed, the laminate obtained in Step 4.5) is left for 24 hours in an environment of 25°C and 50% RH. In step 5, the laminate is made humidity-controlled.

[0036] <<<Step 6>>> Step 6 is a process in which the laminate obtained in Step 5 and the film consisting only of the above-mentioned substrate are subjected to a water vapor permeability measurement using the cup method at 65°C, 90%RH, and for a test period of 24 hours, in accordance with JIS-Z-0208 (1976). The moisture permeability measurement using the cup method in step 6 is performed as follows: First, cut a circular sample with a diameter of 70 mm from the sample for moisture permeability measurement (the laminate or film consisting only of the substrate). Next, place 20 g of dried calcium chloride into the measuring cup, and then cover it with the circular sample to prepare a measuring cup with a lid. When using the laminate as the sample for moisture permeability measurement, cover it with the circular sample so that the substrate side is in contact with the measuring cup. This lidded measuring cup is left in a constant temperature and humidity chamber at 65°C and 90% RH for 24 hours. The change in mass of the lidded measuring cup before and after the above period is used to determine the water vapor permeability (WVTR) of the circular sample (unit: kg / (m³). 2 Calculate the day. The above measurement was performed three times, and the average value of the WVTR from the three measurements was used to determine the moisture permeability (unit: kg / (m³)) of the sample used for moisture permeability measurement. 2 Let's assume it's day)). Furthermore, the film consisting only of the substrate subject to measurement in step 6 is also a film that has been pre-conditioned by being left in an environment of 25°C and 50% RH for 24 hours.

[0037] <<<Step 7>>> Step 7 involves calculating the moisture permeability of the photosensitive layer of the laminate using the following formula, determining the moisture permeability of the photosensitive layer X kg / (m³). 2 This is the process to determine the X kg / (m³) obtained through this process. 2 The numerical value X obtained as (24h) is used in equation (X1) and (XY1) below. Calculation formula: 1 / (X[kg / (m 2 (24h)) = [1 / (Moisture permeability of laminate [kg / (m³)] 2 ·24h)]))〕-〔1 / (Moisture permeability of film consisting only of substrate [kg / (m 2 (24 hours) Furthermore, if the transfer film used for measurement has other layers, and in step 6 the laminate has other layers besides the substrate and the photosensitive layer, the X kg / (m²) obtained in step 7 2The reduction in moisture permeability due to the presence of the other layers mentioned above (24h) is also taken into account. Thus, even though the presence of the other layers mentioned above affects the calculated moisture permeability, the calculated X kg / (m 2 A value of 24 hours is adopted as the moisture permeability of the photosensitive layer.

[0038] [Measurement Y] The transfer film of the present invention satisfies the following formula (Y1) when the value of Y, determined by the measurement Y described below, is obtained. Furthermore, it is preferable that the transfer film of the present invention satisfies the following formula (Y2). 1 ≤ Y ≤ 6 (Y1) 1 ≤ Y ≤ 4 (Y²)

[0039] Measurement Y is a measurement method that includes the following steps A to F in this order. Step A: The process of cutting the above transfer film to a size of 3.0 x 15.0 cm. Step B: A step in which the surface of the photosensitive layer in the cut-out transfer film, opposite to the temporary support side, is brought into contact with the substrate, and the transfer film and the substrate are laminated together to obtain a laminate. However, the substrate used is polyethylene terephthalate with dimensions of 3.5 × 23.0 cm and a film thickness of 50 μm. In addition, before lamination, the substrate is heated at 145°C for 25 minutes, and after cooling, lamination is performed within 5 minutes. In the lamination, the linear pressure is 3 N / cm, the transport speed is 4 m / min, and the lamination temperature is 100°C. Step C: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using a proximity exposure machine equipped with an ultra-high pressure mercury lamp at an exposure dose of 80 mJ / cm². 2 The process of exposure. Step D: After 30 minutes have elapsed since the exposure, the temporary support is peeled off from the laminate. Step E: The photosensitive layer of the laminate is exposed to ultraviolet light from the opposite side of the substrate using an ultraviolet irradiation device with a high-pressure mercury lamp, with an exposure dose of 1000 mJ / cm². 2 This is the post-exposure process. Step F: With the exposed photosensitive layer of the laminate facing outwards, an unloaded U-shaped stretch test is performed to determine the minimum bending width Y mm at which no cracks occur in the exposed photosensitive layer. However, in the above test, tests are performed with bending widths of 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, and 1 mm, in descending order of bending width. The holding width of the laminate before bending is 120 mm. In each bending width test, the number of bending cycles is 15, and the test speed is 100 rpm. After each bending width test is completed, the exposed photosensitive layer in the area ±10 mm from the center of the bend is observed at 5x magnification using an optical microscope to check for the presence or absence of cracks in the exposed photosensitive layer. The minimum bending width at which no cracks occur in the exposed photosensitive layer in the above test is defined as Y mm. Furthermore, if cracks occur in the exposed photosensitive layer even with a bending width of 6 mm, Y=7 is used, and if no cracks occur in the exposed photosensitive layer even with a bending width of 1 mm, Y=1 is used. The following details each step.

[0040] <<<Process A>>> Step A is the process of cutting the transfer film to a size of 3.0 x 15.0 cm. If the transfer film has both an MD (machine direction) and a TD (transverse direction), the transfer film should be cut so that it has a 3.0 cm side along the TD direction and a 15.0 cm side along the MD direction. Furthermore, if the transfer film has a cover film as described later, step A involves removing the cover film.

[0041] <<<Process B>>> Step B is a process in which the surface of the photosensitive layer in the cut-out transfer film (a 3.0 x 15.0 cm transfer film) opposite to the temporary support is brought into contact with the substrate, and the transfer film and the substrate are bonded together and laminated to obtain a laminate. However, the above-mentioned substrate is polyethylene terephthalate with dimensions of 3.5 × 23.0 cm and a film thickness of 50 μm. Specifically, as the above-mentioned substrate, a film is usually used which is cut from Toyobo Industries Ltd.'s Cosmo Shine A4300 (double-sided easy-adhesion type, no front or back side) so that it has a 3.5 cm side along the TD direction and a 23.0 cm side along the MD direction. In the lamination process described above, the center of gravity of the rectangular shape of the base material and the center of gravity of the rectangular shape of the transfer film are aligned, and the long side of the rectangular shape of the base material and the long side of the rectangular shape of the transfer film are parallel to each other. Furthermore, prior to the lamination process, the substrate is heated at 145°C for 25 minutes, and after cooling, lamination is performed within 5 minutes. In the above lamination process, the linear pressure is set to 3 N / cm, the transport speed to 4 m / min, and the lamination temperature to 100°C. Furthermore, if the transfer film used in step A has other layers in addition to the cover film, photosensitive layer, and temporary support, the transfer film is laminated to the substrate, including the other layers, according to the normal method of use of the transfer film. In this case, the laminate may have the other layers, for example, between the temporary support and the photosensitive layer, and / or between the substrate and the photosensitive layer.

[0042] <<<Process C>>> Step C involves exposing the photosensitive layer of the laminate to the opposite side of the substrate using a proximity exposure machine equipped with an ultra-high pressure mercury lamp, with an exposure dose of 80 mJ / cm². 2 This is the process of exposure. For the above-mentioned proximity type exposure system, a proximity type exposure system manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd. is typically used. Furthermore, exposure of the photosensitive layer in step C is performed through a temporary support. The above exposure dose is 80 mJ / cm². 2 This is the cumulative exposure amount measured with a 365nm illuminometer, representing light that passes through the temporary support and reaches the layer (such as the photosensitive layer) located on the substrate side of the temporary support. The illuminance during exposure with an ultra-high pressure mercury lamp is 5-100 mW / cm². 2 Preferably, 10-50 mW / cm² 2 This is preferable.

[0043] <<<Process D>>> Step D is the above exposure (80 mJ / cm²). 2 This is the step of peeling the temporary support off the laminate after 30 minutes have elapsed since the exposure. If the transfer film used for measurement is a transfer film in which a temporary support and a photosensitive layer are directly laminated, the photosensitive layer (80 mJ / cm²) is located on the surface of the laminate. 2 The photosensitive layer (exposed by the light) is exposed. Furthermore, if the transfer film to be measured is laminated with other layers in between the temporary support and the photosensitive layer, these other layers will be exposed on the surface of the laminate.

[0044] <<<Process E>>> Step E involves exposing the photosensitive layer of the laminate to an ultraviolet irradiation device with a high-pressure mercury lamp from the opposite side of the substrate, with an exposure dose of 1000 mJ / cm². 2 This is the post-exposure process. Typically, an ultraviolet irradiation conveyor system (manufactured by iGraphics Co., Ltd.) is used as the ultraviolet irradiation device mentioned above. Note that the above 1000 mJ / cm 2 Exposure refers to an integrated exposure of 1000 mJ / cm² measured with a 365 nm light meter. 2 This is the resulting exposure. The illuminance during exposure with a high-pressure mercury lamp is 10-200 mW / cm². 2 Preferably, 15-100 mW / cm² 2 This is preferable.

[0045] <<<Process E2>>> If the transfer film to be measured is laminated with other layers in between a temporary support and a photosensitive layer, and the other layers are exposed on the surface of the laminate after step E, and in the normal use of the transfer film, the exposed other layers are layers that should be removed without remaining in the final pattern, then a step to remove the other layers (step E2) is performed between step E and step F. The method for removing the above-mentioned other layers may be to employ appropriate means for removing the above-mentioned other layers. For example, if the other layer is alkali-soluble or water-soluble after step E, a method of removing the other layer can be used by treating the laminate with an alkaline developer (such as a 1% by mass aqueous solution of sodium carbonate). It is also preferable to rinse the laminate with water or the like after treatment with the alkaline developer and then dry it. However, it is preferable not to perform heat treatment on the laminate in step E2. Furthermore, step E2 is carried out in a manner that minimizes alteration of the photosensitive layer (the exposed photosensitive layer).

[0046] <<<Process F>>> Step F uses the laminate obtained in step E (or, if step E2 is performed, the laminate obtained in step E2). Step F is a process in which an unloaded U-shaped stretch test is performed on the laminate with the photosensitive layer (exposed photosensitive layer) facing outwards, and the minimum bending width Y mm at which no cracks occur in the photosensitive layer (exposed photosensitive layer) is determined. The no-load U-shaped stretch test is a test in which a test specimen is bent into a U-shape until it reaches a certain width, while ensuring that no load other than bending is applied to the specimen, and the effects of bending are examined.

[0047] Figure 1 is a conceptual diagram of the test apparatus used for the unloaded U-shaped expansion and contraction test performed at measurement Y. In state (a) in Figure 1, the laminate 1 to be measured is fixed at the contact points with wall 3 and with the movable wall 5, and the laminate 1 is held between wall 3 and movable wall 5 in a gently sagging state. In state (a), the distance between wall 3 and movable wall 5 (the holding width of the laminate before bending) is 120 mm. Although not shown in Figure 1, the holding part that fixes the laminate 1 to wall 3 (the contact point between the laminate 1 and wall 3 in state (a) of Figure 1) and the holding part that fixes the laminate 1 to movable wall 5 (the contact point between the laminate 1 and movable wall 5 in state (a) of Figure 1) are each equipped with a holding angle adjustment function to adjust the angle at which the laminate 1 is held. As a result, even when the movable wall 5 moves, no bending stress is generated in the laminate 1 at the holding part. In state (a), the test apparatus moves until the movable wall 5 moves until the distance between wall 3 and the movable wall 5 becomes the bending width y, and then transitions to state (b). After reaching state (b), the test apparatus returns to state (a). The test apparatus performs an unloaded U-shaped expansion and contraction test on the laminate 1 by repeatedly performing the operation of transitioning from state (a) to state (b) and from state (b) to state (a). The specific test equipment typically used is the ET254A002-005 manufactured by Yuasa Systems Corporation.

[0048] In the test of process F, the same laminate is tested with bending widths (y above) of 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, and 1 mm, in descending order of bending width. In each flexion width test, the number of flexions will be 15 times. The holding width of the laminate before bending (the distance between wall 3 and movable wall 5 in state (a)) is 120 mm. A 15-bending cycle means that the above-mentioned test apparatus repeats the operation of transitioning from state (a) to state (b), and then from state (b) to state (a), 15 times (15 back-and-forth movements). In each bending width test, the test speed shall be 100 rpm. The unit of the above test speed, rpm, refers to the number of tests (bendings) per minute. Specifically, in the above-mentioned test apparatus, the speed at which the movable wall 5 approaches and moves away from the wall 3 is set to a speed at which the test apparatus transitions from state (a) to state (b), and then from state (b) to state (a), 100 times per minute.

[0049] Furthermore, after each test at each bending width is completed, the photosensitive layer (exposed photosensitive layer) in the area ±10 mm from the center of the bend is observed at 5x magnification using an optical microscope. The above observation confirms the presence or absence of cracks in the photosensitive layer (exposed photosensitive layer) of the observed area. In each bending width test, the minimum bending width at which no cracks occurred in the photosensitive layer (exposed photosensitive layer) is defined as Y mm. Furthermore, if a crack occurs in the photosensitive layer (exposed photosensitive layer) even with a bending width of 6 mm, Y=7 is used, and if no crack occurs in the photosensitive layer (exposed photosensitive layer) even with a bending width of 1 mm, Y=1 is used.

[0050] [The relationship between X and Y] The transfer film of the present invention satisfies the following formula (XY1). Furthermore, the transfer film of the present invention preferably satisfies the following formula (XY2), and more preferably satisfies the following formula (XY3). Y ≤ -5X + 13.50 (XY1) Y≧-5X+6.00 (XY2) Y≧-5X+8.50 (XY3) The methods for determining the values ​​of X and Y in each of the above equations are as described above.

[0051] [Composition of the transfer film] The composition of the transfer film will be described below. The transfer film of the present invention comprises a temporary support and a photosensitive layer containing compound A (compound A) having an acidic group.

[0052] Figure 2 is a schematic cross-sectional view showing an example of an embodiment of the transfer film of the present invention. The transfer film 100 shown in Figure 2 has a structure in which a temporary support 12, a photosensitive layer 14, and a cover film 16 are laminated in that order. Although the transfer film 100 shown in Figure 2 has a cover film 16 placed on it, the cover film 16 does not necessarily have to be placed on it. The following describes each element that makes up the transfer film.

[0053] <<<Temporary support>>> The temporary support is a support that supports the photosensitive layer and is peelable from the photosensitive layer. The temporary support preferably has light transmittance, in that it allows the photosensitive layer to be exposed through the temporary support when pattern exposure of the photosensitive layer. Here, "having light transmittance" means that the transmittance of the dominant wavelength of light used for exposure (either pattern exposure or full-surface exposure) is 50% or higher. The transmittance of the dominant wavelength of light used for exposure is preferably 60% or higher, and more preferably 70% or higher, as this provides superior exposure sensitivity. One method for measuring transmittance is to use the MCPD Series manufactured by Otsuka Electronics Co., Ltd.

[0054] Examples of temporary supports include glass substrates, resin films, and paper, with resin films being preferred due to their superior strength and flexibility. Examples of resin films include polyethylene terephthalate film, cellulose triacetate film, polystyrene film, and polycarbonate film. Among these, biaxially oriented polyethylene terephthalate film is preferred.

[0055] From the standpoint of pattern formation during pattern exposure via a temporary support and the transparency of the temporary support, it is preferable to have fewer particles, foreign matter, and defects in the temporary support. The number of fine particles, foreign matter, and defects with a diameter of 2 μm or more is 50 per 10 mm. 2 The following is preferable: 10 pieces / 10 mm 2 The following is more preferable: 3 pieces / 10mm 2 The following is even more preferable. There is no particular lower limit, but 1 piece / 10 mm 2This can be done. To further improve handling, the temporary support has a surface on the side opposite to where the photosensitive layer is formed, with one particle per millimeter having a diameter of 0.5 to 5 μm. 2 Preferably, the layer has 1 to 50 layers / mm 2 It is preferable for it to exist.

[0056] The thickness of the temporary support is not particularly limited, but 5 to 200 μm is preferred, and 10 to 150 μm is more preferred, in terms of ease of handling and versatility. The thickness of the temporary support can be appropriately selected depending on the material, taking into account factors such as the strength as a support, the flexibility required for bonding with the circuit wiring substrate, and the light transmittance required in the initial exposure process. The temporary support may be made from recycled materials. Examples of recycled materials include used film, which has been washed, chipped, and then made into film. A specific example of recycled materials is Toray's Ecouse series.

[0057] Preferred embodiments of the temporary support are described, for example, in paragraphs 0017-0018 of Japanese Patent Publication No. 2014-085643, paragraphs 0019-0026 of Japanese Patent Publication No. 2016-027363, paragraphs 0041-0057 of WO2012 / 081680A1, and paragraphs 0029-0040 of WO2018 / 179370A1, the contents of which are incorporated herein by reference.

[0058] As a temporary support, for example, CosmoShine® A4100, CosmoShine® A4160, and CosmoShine® A4360 (all manufactured by Toyobo Co., Ltd.), as well as Lumirror® 16FB40, Lumirror® 16KS40 (16QS62), Lumirror® #38-U48, Lumirror® #75-U34, and Lumirror® #25T60 (all manufactured by Toray Industries, Inc.) may be used. Furthermore, particularly preferred embodiments of the temporary support include a biaxially oriented polyethylene terephthalate film with a thickness of 16 μm, a biaxially oriented polyethylene terephthalate film with a thickness of 12 μm, and a biaxially oriented polyethylene terephthalate film with a thickness of 9 μm.

[0059] <<<Photosensitive layer>>> The photosensitive layer contains compound A having an acidic group (compound A), and it is preferable that the content of acidic groups (preferably acidic groups derived from compound A) in the photosensitive layer decreases upon exposure. If the acid group content in the photosensitive layer decreases due to exposure, the polarity of the exposed photosensitive layer changes before and after exposure, which alters its solubility in the developer (alkaline developer, organic solvent-based developer, etc.). Therefore, if a pattern exposure is performed on such a photosensitive layer, a difference in solubility in the developer will occur between the exposed and unexposed areas, allowing for the formation of a positive or negative pattern on the exposed pattern.

[0060] An example of a photosensitive layer having a mechanism for reducing the acid group content is a photosensitive layer containing compound A having a carboxyl group, and having a mechanism for reducing the carboxyl group content in the layer by undergoing a decarboxylation reaction of the carboxyl group upon exposure. The transfer film of the present invention, equipped with such a photosensitive layer, exhibits excellent pattern-forming properties with respect to developing solutions (especially alkaline developing solutions). Furthermore, because the amount of acidic groups in the photosensitive layer is reduced by exposure, the moisture permeability caused by the presence of acidic groups is reduced, and the effects of the present invention are even more pronounced in transfer films having such a photosensitive layer. Moreover, the patterns formed from the transfer film of the present invention can be suitably used as protective films (permanent films), such as conductive patterns.

[0061] Furthermore, as will be described later, it is preferable that the photosensitive layer also contains a polymerizable compound. For example, when the above-mentioned acid group (e.g., a carboxyl group) is removed (e.g., through a decarboxylation reaction), radicals may be generated in the portion of compound A where the acid group was removed. Such radicals initiate radical polymerization of the polymerizable compound, and compound A in the exposed area can be crosslinked.

[0062] Furthermore, as will be described later, the photosensitive layer may also preferably contain a polymerizable compound and a photopolymerization initiator. If the photosensitive layer contains a photopolymerization initiator, the detachment of acid groups (such as carboxyl groups) and the polymerization initiation reaction can be made to occur at different timings, as described above. For example, such a photosensitive layer may first be exposed to light at a wavelength or exposure level that causes almost no detachment of acid groups, allowing polymerization based on the photopolymerization initiator to proceed and cure. Then, the cured photosensitive layer may be exposed to light a second time to induce the detachment of acid groups. Alternatively, the first exposure may be a patterned exposure, and a developing process may be performed to remove unexposed or exposed areas before the second exposure, and then the second exposure may be performed again to obtain a pattern (patterned film).

[0063] The above photosensitive layer is particularly preferable in terms of having superior pattern-forming ability with respect to alkaline developers, such that the content of acid groups (preferably carboxyl groups) derived from compound A decreases by 5 mol% or more upon exposure, more preferably by 10 mol% or more, even more preferably by 20 mol% or more, even more preferably by 31 mol% or more, particularly preferably by 40 mol% or more, particularly more preferably by 51 mol% or more, and most preferably by 71 mol% or more. There is no particular upper limit, but for example, it is 100 mol% or less. If the acid group derived from compound A is a carboxyl group, the rate of decrease in the content of carboxyl groups derived from compound A in the photosensitive layer can be calculated by measuring the amount of carboxyl groups in the photosensitive layer before and after exposure. The amount of carboxyl groups in the photosensitive layer before exposure can be measured analytically by, for example, potentiometric titration. The amount of carboxyl groups in the photosensitive layer after exposure can be calculated by substituting the hydrogen atoms of the carboxyl groups with metal ions such as lithium, and then analyzing the amount of these metal ions using ICP-OES (Inductivity coupled plasma optical emission spectrometer). Furthermore, the rate of decrease in the acid group content derived from compound A in the photosensitive layer can also be obtained by measuring the IR (infrared) spectrum of the photosensitive layer before and after exposure and calculating the rate of decrease in the peak derived from the acid group.

[0064] <<Requirements (V01), Requirements (W01)>> The photosensitive layer is preferably a photosensitive layer that satisfies either requirement (V01) or requirement (W01) shown below. However, the photosensitive layer may be a photosensitive layer that satisfies both requirement (V01) and requirement (W01). Requirements (V01) The photosensitive layer comprises compound A having an acid group and compound β having a structure (hereinafter also referred to as "specific structure S0") that reduces the amount of the acid group contained in compound A upon exposure. Requirements (W01) The photosensitive layer contains compound A having an acid group, and compound A further contains a structure (specific structure S0) that reduces the amount of the acid group upon exposure.

[0065] The specific structure S0 described above is a structure that, when exposed to light, reduces the amount of acid groups contained in compound A. Preferably, the specific structure S0 is a structure that transitions from the ground state to an excited state upon exposure and, in the excited state, reduces the amount of acid groups in compound A. Examples of specific structures S0 include a structure that, upon exposure, becomes photoexcited and can accept electrons from the acid groups contained in compound A (specific structure S1 described later).

[0066] The above requirement (V01) is preferably the requirement (V1) shown below, and the above requirement (W01) is preferably the requirement (W1) shown below. In other words, in the above requirement (V01), it is preferable that compound β is compound B having a structure that can accept electrons from the acid group contained in compound A in the photoexcited state. Furthermore, in the above requirement (W01), it is preferable that the above structure is a structure that can accept electrons from the acid group contained in compound A in the photoexcited state. Requirement (V1): The photosensitive layer comprises compound A having an acid group and compound B having a structure (specific structure S1) that can accept electrons from the acid group contained in compound A in a photoexcited state. Requirement (W1): The photosensitive layer contains compound A having an acid group, and compound A further contains a structure (specific structure S1) that can accept electrons from the acid group in a photoexcited state. The photosensitive layer may be a photosensitive layer that satisfies both requirement (V1) and requirement (W1).

[0067] As for the photosensitive layer, it is more preferable that it is a photosensitive layer that satisfies either requirement (V1-C) or requirement (W1-C). Requirement (V1-C) corresponds to the embodiment in requirement (V1) where the acid group is a carboxyl group, and requirement (W1-C) corresponds to the embodiment in requirement (W1) where the acid group is a carboxyl group. Requirements (V1-C) The photosensitive layer comprises compound A having a carboxyl group and compound B having a structure (hereinafter also referred to as "specific structure S1") that can accept electrons from the carboxyl group in compound A in a photoexcited state. Requirements (W1-C) The photosensitive layer contains compound A having a carboxyl group, and compound A further contains a structure (specific structure S1) that can accept electrons from the carboxyl group in compound A in a photoexcited state. The photosensitive layer may be a photosensitive layer that satisfies both requirement (V1-C) and requirement (W1-C).

[0068] The photosensitive layers of Embodiments X-1-a1 and X-1-a2 are preferably applied to the pattern formation method of Embodiment 1, which will be described later. Furthermore, the photosensitive layer of Embodiment X-1-a3 is preferably applied to the pattern formation method of Embodiment 2, which will be described later. Furthermore, among the embodiments of the photosensitive layer, the photosensitive layer of embodiments X-1-a1-C to X-1-a3-C is more preferred. Embodiments X-1-a1-C to X-1-a3-C correspond to embodiments X-1-a1 to X-1-a3 in which requirement (V01) and requirement (W01) are requirement (V1-C) and requirement (W1-C), respectively.

[0069] The following describes in detail the presumed mechanism by which the content of acidic groups (carboxyl groups) derived from compound A decreases upon exposure, using as an example a form in which the photosensitive layer contains polyacrylic acid as compound A and quinoline as compound β (compound B). As illustrated below, the carboxyl group of polyacrylic acid and the nitrogen atom of quinoline form hydrogen bonds in their coexistence. When exposed to light, quinoline's electron-accepting capacity increases, and it receives electrons from the carboxyl group of polyacrylic acid (step 1: photoexcitation). The carboxyl group of polyacrylic acid becomes unstable after receiving electrons from quinoline and is eliminated as carbon dioxide (step 2: decarboxylation reaction). After the above decarboxylation reaction, radicals are generated at the polyacrylic acid residues, and radical reactions proceed. Radical reactions can occur between polyacrylic acid residues, between polyacrylic acid residues and optionally present polymerizable compounds (monomers (M)), and between hydrogen atoms in the atmosphere (step 3: polarity change, crosslinking, and polymerization reaction). After the radical reaction is complete, compound β is regenerated and can again contribute to the decarboxylation process of compound A (step 4: compound β (catalyst) regeneration).

[0070] [ka]

[0071] Furthermore, the mechanism by which the content of acid groups derived from compound A decreases due to exposure is not limited to the decarboxylation method described above; any known method capable of reducing the content of acid groups derived from compound A can be appropriately selected.

[0072] <<Example of an embodiment of the photosensitive layer>> Furthermore, an example of an embodiment of the photosensitive layer is shown below. • Photosensitive layer of embodiment X-1-a1 A photosensitive layer that satisfies at least one of requirement (V01) or requirement (W01) and is substantially free of polymerizable compounds and photopolymerization initiators. • Photosensitive layer of embodiment X-1-a2 A photosensitive layer that satisfies at least one of requirement (V01) or requirement (W01) and is substantially free of a photopolymerization initiator. • Photosensitive layer of embodiment X-1-a3 A photosensitive layer that satisfies at least one of requirement (V01) or requirement (W01) and contains a polymerizable compound and a photopolymerization initiator.

[0073] In the photosensitive layer of Embodiment X-1-a1, "the photosensitive layer is substantially free of polymerizable compounds" means that the polymerizable compound content is less than 3% by mass of the total mass of the photosensitive layer, preferably 0 to 1% by mass, and more preferably 0 to 0.1% by mass. Furthermore, in the photosensitive layers of Embodiments X-1-a1 and X-1-a2, "the photosensitive layer is substantially free of a photopolymerization initiator" means that the content of the photopolymerization initiator is less than 0.1% by mass of the total mass of the photosensitive layer, preferably 0 to 0.05% by mass, and more preferably 0 to 0.01% by mass.

[0074] <<Various ingredients>> <Compound A containing an acidic group> The photosensitive layer contains compound A (compound A) which has an acidic group. The acid group contained in compound A is preferably a proton-dissociable group with a pKa of 12 or less. Specifically, examples of acid groups include carboxyl groups, sulfonamide groups, phosphonic acid groups, sulfo groups, phenolic hydroxyl groups, and sulfonylimide groups, with carboxyl groups being preferred. Compound A may be a low molecular weight compound or a high molecular weight compound (hereinafter also referred to as "polymer"), but it is preferable that it contains a polymer (a polymer having an acid group), and more preferably that it contains a polymer having a polymerizable group. Examples of polymerizable groups include ethylenically unsaturated groups (e.g., (meth)acryloyl groups, vinyl groups, and styryl groups) and cyclic ether groups (e.g., epoxy groups, oxetanyl groups), with ethylenically unsaturated groups being preferred and (meth)acryloyl groups being more preferred. If compound A is a low molecular weight compound, the molecular weight of compound A is preferably less than 5,000, more preferably 2,000 or less, even more preferably 1,000 or less, particularly preferably 500 or less, and most preferably 400 or less. When compound A is a polymer, the lower limit of the weight-average molecular weight of compound A is preferably 5,000 or more, more preferably 10,000 or more, and even more preferably 15,000 or more, in terms of excellent photosensitive layer formation (in other words, excellent film-forming ability for forming a photosensitive layer). There is no particular upper limit, but it is preferably 50,000 or less in terms of better adhesion (laminate adhesion) when bonding to any substrate (during transfer).

[0075] Furthermore, if compound A is a polymer, from the viewpoint of developability, the acid value of compound A, which is a polymer, is preferably 60 to 300 mg KOH / g, more preferably 60 to 275 mg KOH / g, and even more preferably 75 to 250 mg KOH / g. In this specification, the acid value of the resin is the value measured by the titration method specified in JIS K0070 (1992).

[0076] Compound A preferably contains a structure (specific structure S0) that reduces the amount of acid groups it contains upon exposure. In the following, Compound A without specific structure S0 will also be referred to as "Compound Aa," and Compound A containing specific structure S0 will also be referred to as "Compound Ab." Compound Ab is preferably a polymer. Compound A is said not to contain the specific structure S0 if it is not substantially contained in the specific structure S0. For example, the content of the specific structure S0 in compound Aa may be less than 1% by mass, preferably 0 to 0.5% by mass, and more preferably 0 to 0.05% by mass, relative to the total mass of compound Aa. The content of the specific structure S0 in compound Ab is preferably 1% by mass or more, more preferably 1 to 50% by mass, and even more preferably 5 to 40% by mass, based on the total mass of compound Ab. If compound A contains compound Ab, the content of compound Ab is preferably 5 to 100% by mass relative to the total mass of compound A. Here, the specific structure S0 is, as described above, a structure that, when exposed to light, reduces the amount of acid groups contained in compound A. Preferably, the specific structure S0 is a structure that transitions from the ground state to an excited state upon exposure and, in the excited state, reduces the amount of acid groups in compound A. A specific structure S0 of compound A is a structure (specific structure S1) in which the acid group contained in compound A can accept electrons in the photoexcited state. One example of such a specific structure S1 is a heteroaromatic ring.

[0077] The above-mentioned heteroaromatic ring may be monocyclic or polycyclic, but polycyclic is preferred. The polycyclic heteroaromatic ring consists of multiple (e.g., 2 to 5) aromatic ring structures fused together, and at least one of the multiple aromatic ring structures has a heteroatom as a ring member atom. The heteroaromatic ring has one or more heteroatoms (such as nitrogen, oxygen, or sulfur atoms) as ring member atoms, preferably 1 to 4. Furthermore, the heteroaromatic ring preferably has one or more nitrogen atoms (for example, 1 to 4) as ring member atoms. The number of ring member atoms in the above-mentioned heteroaromatic ring is preferably 5 to 15.

[0078] Examples of the above-mentioned heteroaromatic rings include monocyclic heteroaromatic rings such as pyridine rings, pyrazine rings, pyrimidine rings, and triazine rings; bicyclic heteroaromatic rings such as quinoline rings, isoquinoline rings, quinoxaline rings, and quinazoline rings; and tricyclic heteroaromatic rings such as acridine rings, phenanthridine rings, phenanthroline rings, and phenazine rings.

[0079] The above heteroaromatic ring may have one or more substituents (for example, 1 to 5), and examples of such substituents include alkyl groups, aryl groups, halogen atoms, acyl groups, alkoxycarbonyl groups, arylcarbonyl groups, carbamoyl groups, hydroxyl groups, cyano groups, and nitro groups. Furthermore, if the aromatic ring has two or more substituents, the substituents may bond to each other to form a nonaromatic ring. Furthermore, it is also preferable that the above-mentioned heteroaromatic ring is directly bonded to the carbonyl group. It is also preferable that the above-mentioned heteroaromatic ring is bonded to an imide group to form a heteroaromatic imide group. The imide group in the heteroaromatic imide group may or may not form an imide ring together with the heteroaromatic ring.

[0080] Furthermore, if compound A contains multiple aromatic rings (for example, 2 to 5 aromatic rings) linked by structures selected from the group consisting of single bonds, carbonyl groups, and multiple bonds (for example, vinylene groups which may have substituents, -C≡C-, -N=N-, etc.), and one or more of the multiple aromatic rings constituting the above series of aromatic ring structures are the above-mentioned heteroaromatic rings, then the entire series of aromatic ring structures is considered to be one specific structure S1.

[0081] Furthermore, some or all of the acid groups of compound A may or may not be anionized in the photosensitive layer, and both anionized and non-anionized acid groups are collectively referred to as acid groups. In other words, compound A may or may not be anionized in the photosensitive layer.

[0082] Compound A is preferably a compound having a carboxyl group, as it offers superior pattern formation performance for the photosensitive layer and superior film-forming properties. The compound having a carboxyl group is preferably a monomer containing a carboxyl group (hereinafter also referred to as "carboxyl group-containing monomer") or a polymer containing a carboxyl group (hereinafter also referred to as "carboxyl group-containing polymer"), and a carboxyl group-containing polymer is more preferable in terms of superior pattern formation performance of the photosensitive layer and superior film-forming properties.

[0083] Furthermore, some or all of the carboxyl groups (-COOH) in the carboxyl group-containing monomer and carboxyl group-containing polymer may be anionized or not anionized in the photosensitive layer, and the anionized carboxyl group (-COOH) -Both the anionized and unanionized carboxyl groups are referred to as carboxyl groups. In other words, carboxyl group-containing monomers may or may not be anionized in the photosensitive layer, and both anionized and non-anionized carboxyl group-containing monomers are collectively referred to as carboxyl group-containing monomers. In other words, the carboxyl group-containing polymer may or may not be anionized in the photosensitive layer, and both anionized and non-anionized carboxyl group-containing polymers are collectively referred to as carboxyl group-containing polymers.

[0084] As described above, compound A containing a carboxyl group may contain a specific structure S0 (preferably specific structure S1). In other words, carboxyl group-containing monomers and carboxyl group-containing polymers may contain a specific structure S0 (preferably specific structure S1). When compound A containing a carboxyl group contains a specific structure S0 (preferably specific structure S1), it is preferable that the carboxyl group-containing polymer contains a specific structure S0 (preferably specific structure S1), and more preferable that the carboxyl group-containing polymer contains a specific structure S1.

[0085] In the photosensitive layer, the lower limit of the compound A content is preferably 1% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, even more preferably 45% by mass or more, and particularly preferably 50% by mass or more, relative to the total mass of the photosensitive layer. The upper limit of the compound A content is preferably 100% by mass or less, more preferably 99% by mass or less, even more preferably 97% by mass or less, particularly preferably 93% by mass or less, even more preferably 85% by mass or less, and most preferably 75% by mass or less, relative to the total mass of the photosensitive layer. If the photosensitive layer satisfies requirement W01, the upper limit of the compound A content is preferably 99% by mass or less, relative to the total mass of the photosensitive layer. Compound A may be used alone or in combination of two or more types.

[0086] (Carboxyloid-containing monomer) Examples of carboxyl group-containing monomers include polymerizable compounds that contain a carboxyl group and one or more ethylenically unsaturated groups (for example, 1 to 15 groups). Examples of ethylenically unsaturated groups include (meth)acryloyl groups, vinyl groups, and styryl groups, with (meth)acryloyl groups being preferred. As carboxyl group-containing monomers, bifunctional or more monomers containing carboxyl groups are preferred because they have superior film-forming properties. A bifunctional or more monomer refers to a polymerizable compound having two or more ethylenically unsaturated groups (for example, 2 to 15) in one molecule. The carboxyl group-containing monomer may further contain acid groups other than the carboxyl group. Examples of acid groups other than the carboxyl group include phenolic hydroxyl groups, phosphoric acid groups, and sulfonic acid groups.

[0087] There are no particular restrictions on the bifunctional or more monomers containing a carboxyl group, and they can be appropriately selected from known compounds. Examples of bifunctional or more monomers containing a carboxyl group include Aronix® TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix M-520 (manufactured by Toagosei Co., Ltd.), and Aronix M-510 (manufactured by Toagosei Co., Ltd.).

[0088] Furthermore, examples of monomers with two or more functions containing a carboxyl group include three to four-functional polymerizable compounds having a carboxyl group (pentaerythritol tri-tetraacrylate [PETA] skeleton with a carboxyl group introduced (acid value = 80-120 mg KOH / g)) and five to six-functional polymerizable compounds having a carboxyl group (dipentaerythritol penta-hexaacrylate [DPHA] skeleton with a carboxyl group introduced (acid value = 25-70 mg KOH / g)). When using the above-mentioned monomers with three or more functions containing a carboxyl group, it is also preferable to use monomers with two or more functions containing a carboxyl group in combination, as this provides superior film-forming properties.

[0089] Examples of bifunctional or more monomers containing a carboxyl group include polymerizable compounds having an acid group as described in paragraphs 0025 to 0030 of Japanese Patent Publication No. 2004-239942. The contents of this publication are incorporated herein by reference.

[0090] (Carboxyloid-containing polymer) Typically, carboxyl group-containing polymers are alkali-soluble resins. The definition and measurement method of alkali solubility are as previously described.

[0091] The carboxyl group-containing polymer may further contain acid groups other than carboxyl groups. Examples of acid groups other than carboxyl groups include phenolic hydroxyl groups, phosphoric acid groups, and sulfonic acid groups.

[0092] From the viewpoint of developability, the acid value of the carboxyl group-containing polymer is preferably 60 to 300 mg KOH / g, more preferably 60 to 275 mg KOH / g, and even more preferably 75 to 250 mg KOH / g.

[0093] ≪Repeating units containing a carboxyl group≫ The carboxyl group-containing polymer preferably has repeating units having carboxyl groups. Examples of repeating units having a carboxyl group include the repeating unit represented by the following general formula (A).

[0094] [ka]

[0095] In general formula (A), R A1 represents a hydrogen atom, a halogen atom, or an alkyl group. The alkyl group may be linear or branched. The alkyl group preferably has 1 to 5 carbon atoms, and more preferably 1 carbon atom. In general formula (A), A 1 This represents a single bond or a divalent linking group. Examples of the above-mentioned divalent linking groups include -CO-, -O-, -S-, -SO-, -SO2-, and -NR. N -(R N Examples include hydrogen atoms or alkyl groups having 1 to 5 carbon atoms, hydrocarbon groups (for example, alkylene groups, cycloalkylene groups, alkenylene groups, phenylene groups, and other arylene groups), and linked groups formed by linking multiple of these.

[0096] Examples of monomers from which repeating units having a carboxyl group originate include (meth)acrylic acid, crotonic acid, itaconic acid, maleic acid, and fumaric acid. Among these, (meth)acrylic acid is preferred due to its superior patternability. In other words, it is preferable that the repeating units having a carboxyl group are derived from (meth)acrylic acid.

[0097] In the carboxyl group-containing polymer, the content of repeating units having carboxyl groups is preferably 5 to 100 mol%, more preferably 10 to 65 mol%, and even more preferably 15 to 45 mol%, relative to the total repeating units of the carboxyl group-containing polymer. Furthermore, the content of repeating units having carboxyl groups in the carboxyl group-containing polymer is preferably 1 to 100% by mass, more preferably 5 to 70% by mass, and even more preferably 12 to 50% by mass, relative to the total repeating units of the carboxyl group-containing polymer. The repeating units having a carboxyl group may be used individually or in combination of two or more types.

[0098] <<Repeating units with polymerizable groups>> In addition to the repeating units described above, the carboxyl group-containing polymer may also preferably have repeating units having polymerizable groups. Examples of polymerizable groups include ethylenically unsaturated groups (e.g., (meth)acryloyl groups, vinyl groups, and styryl groups) and cyclic ether groups (e.g., epoxy groups, oxetanyl groups), with ethylenically unsaturated groups being preferred and (meth)acryloyl groups being more preferred. Examples of repeating units having polymerizable groups include the repeating unit represented by the following general formula (B).

[0099] [ka]

[0100] In general formula (B), X B1 and X B2 These are, independently, -O- or -NR. N - represents R N represents a hydrogen atom or an alkyl group. The alkyl group may be linear or branched, and preferably has 1 to 5 carbon atoms. L represents an alkylene group or an arylene group. The alkylene group may be linear or branched, and preferably has 1 to 5 carbon atoms. The arylene group may be monocyclic or polycyclic, and preferably has 6 to 15 carbon atoms. The alkylene group and arylene group may have substituents, and a hydroxyl group is a preferred substituent. R B1 and R B2 Each of these independently represents either a hydrogen atom or an alkyl group. The alkyl group may be linear or branched. The alkyl group preferably has 1 to 5 carbon atoms, and more preferably 1 carbon atom.

[0101] In the carboxyl group-containing polymer, the content of repeating units having polymerizable groups is preferably 3 to 60 mol%, more preferably 5 to 40 mol%, and even more preferably 10 to 30 mol%, relative to the total repeating units of the carboxyl group-containing polymer. In the carboxyl group-containing polymer, the content of repeating units having polymerizable groups is preferably 1 to 70% by mass, more preferably 5 to 50% by mass, and even more preferably 12 to 45% by mass, relative to the total repeating units of the carboxyl group-containing polymer. The repeating units having polymerizable groups may be used individually or in combination of two or more types.

[0102] ≪Repeating units having a specific structure S0≫ In addition to the repeating units described above, the carboxyl group-containing polymer may also preferably have repeating units having a specific structure S0 (preferably a specific structure S1). The specific structures S0 and S1 are as previously described. In a repeating unit having a specific structure S0 (preferably specific structure S1), the specific structure S0 (preferably specific structure S1) may be present in the main chain or in the side chain, and is preferably present in the side chain. When the specific structure S0 (preferably specific structure S1) is present in the side chain, the specific structure S0 (preferably specific structure S1) is bonded to the polymer main chain via a single bond or a linking group. The repeating unit having a specific structure S0 (preferably specific structure S1) is, for example, a repeating unit based on a monomer having a heteroaromatic ring (specifically, vinyl heteroaromatic rings such as vinylpyridine and vinyl(iso)quinoline, and (meth)acrylate monomers having a heteroaromatic ring, etc.). The following are examples of repeating units having a specific structure S0 (preferably a specific structure S1), but are not limited thereto.

[0103] [ka]

[0104] When the carboxyl group-containing polymer has repeating units having a specific structure S0 (preferably a specific structure S1), its content is preferably 3 to 75 mol%, more preferably 5 to 60 mol%, and even more preferably 10 to 50 mol%, relative to the total repeating units of the carboxyl group-containing polymer. When the carboxyl group-containing polymer has repeating units having a specific structure S0 (preferably a specific structure S1), its content is preferably 1 to 75% by mass, more preferably 3 to 60% by mass, and even more preferably 5 to 30% by mass, relative to the total repeating units of the carboxyl group-containing polymer. A repeating unit having a specific structure S0 (preferably specific structure S1) may be used alone or in combination of two or more types.

[0105] ≪Repeating units containing aromatic rings≫ In addition to the repeating units described above, carboxyl group-containing polymers may also preferably have repeating units having aromatic rings (preferably aromatic hydrocarbon rings). Examples include repeating units based on (meth)acrylates having aromatic rings, and repeating units based on styrene and polymerizable styrene derivatives. Examples of (meth)acrylates having an aromatic ring include benzyl (meth)acrylate, phenethyl (meth)acrylate, and phenoxyethyl (meth)acrylate. Examples of styrene and polymerizable styrene derivatives include methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimers, and styrene trimers. As repeating units having an aromatic ring, for example, repeating units represented by the following general formula (C) are also preferred.

[0106] [ka]

[0107] In general formula (C), R C1 represents a hydrogen atom, a halogen atom, or an alkyl group. The alkyl group may be linear or branched. The alkyl group preferably has 1 to 5 carbon atoms, and more preferably 1 carbon atom. Ar C represents a phenyl group or a naphthyl group. The phenyl group and naphthyl group may have one or more substituents, and examples of such substituents include alkyl groups, alkoxy groups, aryl groups, halogen atoms, and hydroxyl groups. Examples of repeating units having an aromatic ring are shown below.

[0108] [ka]

[0109] Among the repeating units having an aromatic ring, the following structure is particularly preferred.

[0110] [ka]

[0111] In the carboxyl group-containing polymer, the content of repeating units having an aromatic ring is preferably 5 to 80 mol%, more preferably 15 to 75 mol%, and even more preferably 30 to 70 mol%, relative to the total repeating units of the carboxyl group-containing polymer. In the carboxyl group-containing polymer, the content of repeating units having an aromatic ring is preferably 5 to 90% by mass, more preferably 10 to 80% by mass, and even more preferably 30 to 70% by mass, relative to the total repeating units of the carboxyl group-containing polymer. Repeating units having an aromatic ring may be used individually or in combination of two or more types.

[0112] ≪Repeating units with an alicyclic structure≫ In addition to the repeating units described above, the carboxyl group-containing polymer may also preferably have repeating units having an alicyclic structure. The alicyclic structure may be monocyclic or polycyclic. Examples of alicyclic structures include dicyclopentanyl ring structures, dicyclopentenyl ring structures, isobornyl ring structures, adamantane ring structures, and cyclohexyl ring structures. Examples of monomers from which repeating units having an alicyclic structure are derived include dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, and cyclohexyl (meth)acrylate.

[0113] In the carboxyl group-containing polymer, the content of repeating units having an alicyclic structure is preferably 3 to 70 mol%, more preferably 5 to 60 mol%, and even more preferably 10 to 55 mol%, relative to the total repeating units of the carboxyl group-containing polymer. In the carboxyl group-containing polymer, the content of repeating units having an alicyclic structure is preferably 3 to 90% by mass, more preferably 5 to 70% by mass, and even more preferably 25 to 60% by mass, relative to the total repeating units of the carboxyl group-containing polymer. The repeating units having an alicyclic structure may be used individually or in combination of two or more types.

[0114] <<Other repeating units>> The carboxyl group-containing polymer may have other repeating units in addition to those described above. Examples of monomers from which the above-mentioned other repeating units originate include alkyl (meth)acrylates, and the alkyl group is an alkyl group having a chain-like structure. The chain-like structure may be linear or branched. The alkyl group may have substituents such as hydroxyl groups. The number of carbon atoms in the alkyl group can be 1 to 50, with 1 to 10 being more preferred. A specific example is methyl (meth)acrylate. In the carboxyl group-containing polymer, the content of other repeating units is preferably 1 to 70 mol%, more preferably 2 to 50 mol%, and even more preferably 3 to 20 mol%, relative to the total repeating units of the carboxyl group-containing polymer. In the carboxyl group-containing polymer, the content of other repeating units is preferably 1 to 70% by mass, more preferably 2 to 50% by mass, and even more preferably 5 to 35% by mass, relative to the total repeating units of the carboxyl group-containing polymer. Other repeating units may be used individually or in combination of two or more types. The weight-average molecular weight of the carboxyl group-containing polymer is preferably 5,000 to 200,000, more preferably 10,000 to 100,000, and most preferably 11,000 to 49,000.

[0115] The content of the polymer (preferably a carboxyl group-containing polymer) in compound A is preferably 75 to 100% by mass, more preferably 85 to 100% by mass, even more preferably 90 to 100% by mass, and particularly preferably 95 to 100% by mass, relative to the total content of compound A.

[0116] The monomer content (preferably a carboxyl group-containing monomer) in compound A is preferably 0 to 25% by mass, more preferably 0 to 10% by mass, and even more preferably 0 to 5% by mass, relative to the total content of compound A.

[0117] The content of compound A is preferably 25 to 100% by mass relative to the total mass of the photosensitive layer. However, if the photosensitive layer satisfies requirement (V01) and / or requirement (V1) (i.e., if the photosensitive layer contains compound β and / or compound B), the content of compound A is preferably 25 to 99% by mass relative to the total mass of the photosensitive layer. In particular, in the photosensitive layer of Embodiment X-1-a1, the content of compound A is preferably 40 to 98% by mass, more preferably 50 to 96% by mass, and even more preferably 60 to 93% by mass, relative to the total mass of the photosensitive layer. In the photosensitive layer of Embodiment X-1-a2, the content of compound A is preferably 30 to 85% by mass, and more preferably 45 to 75% by mass, relative to the total mass of the photosensitive layer. In the photosensitive layer of Embodiment X-1-a3, the content of compound A is preferably 30 to 85% by mass, and more preferably 45 to 75% by mass, relative to the total mass of the photosensitive layer.

[0118] <Compound β> The photosensitive layer preferably contains compound β. Compound β is a compound that has a structure (specific structure S0) that reduces the amount of acid groups contained in compound A upon exposure. The specific structure S0 is as previously described. The specific structure S0 of compound β may be the overall structure that constitutes the entire compound β, or it may be a partial structure that constitutes a part of compound β. Compound β may be a high-molecular-weight compound or a low-molecular-weight compound, but it is preferably a low-molecular-weight compound. The molecular weight of compound β, which is a low molecular weight compound, is preferably less than 5,000, more preferably less than 1,000, even more preferably between 65 and 300, and particularly preferably between 75 and 250.

[0119] Among the specific structures S0, it is preferable that it is a structure (specific structure S1) that can accept electrons from the acid group contained in compound A in a photoexcited state. In other words, it is preferable that compound β is compound B having a structure (specific structure S1) that can accept electrons from the acid group contained in compound A in a photoexcited state.

[0120] Compound β (preferably compound B) will be described below. Compound β (preferably compound B) is preferably an aromatic compound in terms of superior pattern-forming ability and / or lower moisture permeability of the formed pattern. Here, an aromatic compound is a compound that has one or more aromatic rings. The aromatic ring may be present as a single ring or as a multiple ring in compound β (preferably compound B). If multiple rings are present, for example, the aromatic rings may be present in the side chains of the resin. In compound β (preferably compound B), the aromatic ring can be used as a structure (specific structure S1) that can accept electrons from the acid group contained in compound A in the photoexcited state. The aromatic ring may be an overall structure that constitutes the whole of compound β (preferably compound B), or it may be a partial structure that constitutes a part of compound β (preferably compound B). The above aromatic ring may be monocyclic or polycyclic, but polycyclic is preferred. A polycyclic aromatic ring is, for example, an aromatic ring formed by the fusion of multiple (e.g., 2 to 5) aromatic ring structures, and it is preferable that at least one of the multiple aromatic ring structures has a heteroatom as a ring member atom. The above aromatic ring may be a heteroaromatic ring, and it is preferable that it has one or more (for example, 1 to 4) heteroatoms (nitrogen atoms, oxygen atoms, sulfur atoms, etc.) as ring member atoms, and it is more preferable that it has one or more (for example, 1 to 4) nitrogen atoms as ring member atoms. The number of ring member atoms in the above aromatic ring is preferably 5 to 15.

[0121] Examples of the aromatic rings mentioned above include monocyclic aromatic rings such as pyridine rings, pyrazine rings, pyrimidine rings, and triazine rings; bicyclic aromatic rings such as quinoline rings, isoquinoline rings, quinoxaline rings, and quinazoline rings; and tricyclic aromatic rings such as acridine rings, phenanthridine rings, phenanthroline rings, and phenazine rings.

[0122] The aromatic ring may have one or more substituents (for example, 1 to 5), and examples of such substituents include alkyl groups, aryl groups, halogen atoms, acyl groups, alkoxycarbonyl groups, arylcarbonyl groups, carbamoyl groups, hydroxyl groups, cyano groups, amino groups, and nitro groups. Furthermore, if the aromatic ring has two or more substituents, the substituents may bond to each other to form a non-aromatic ring. Furthermore, it is also preferable that the aromatic ring is directly bonded to a carbonyl group to form an aromatic carbonyl group in compound β (preferably compound B). It is also preferable that multiple aromatic rings are bonded via carbonyl groups. It is also preferable that the above-mentioned aromatic ring is bonded to an imide group to form an aromatic imide group in compound β (preferably compound B). The imide group in the aromatic imide group may or may not form an imide ring together with the aromatic ring. Furthermore, if multiple aromatic rings (for example, 2 to 5 aromatic rings) are linked by structures selected from the group consisting of single bonds, carbonyl groups, and multiple bonds (for example, vinylene groups which may have substituents, -C≡C-, -N=N-, etc.), the entire series of aromatic ring structures is considered as one specific structure S1. Furthermore, it is preferable that one or more of the multiple aromatic rings constituting the series of aromatic ring structures described above are the heteroaromatic rings.

[0123] In terms of having superior pattern-forming ability and / or lower moisture permeability of the formed pattern, compound β (preferably compound B) is preferably a compound that satisfies one or more (e.g., 1 to 4) of the following requirements (1) to (4). In particular, it is preferable that it satisfies at least requirement (2), and that the heteroatom of the heteroaromatic ring has at least a nitrogen atom. (1) It has a polycyclic aromatic ring. (2) It has a heteroaromatic ring. (3) Having an aromatic carbonyl group. (4) It has an aromatic imide group.

[0124] Specific examples of compound β (preferably compound B) include monocyclic aromatic compounds such as pyridine and pyridine derivatives, pyrazine and pyrazine derivatives, pyrimidine and pyrimidine derivatives, and triazine and triazine derivatives; compounds in which two rings are fused to form an aromatic ring, such as quinoline and quinoline derivatives, isoquinoline and isoquinoline derivatives, quinoxaline and quinoxaline derivatives, and quinazoline and quinazoline derivatives; and compounds in which three or more rings are fused to form an aromatic ring, such as acridine and acridine derivatives, phenanthridine and phenanthridine derivatives, phenanthroline and phenanthroline derivatives, and phenazine and phenazine derivatives. In particular, compound β (preferably compound B) is preferably one or more selected from the group consisting of pyridine and pyridine derivatives, quinoline and quinoline derivatives, and isoquinoline and isoquinoline derivatives; more preferably one or more selected from the group consisting of quinoline and quinoline derivatives, and isoquinoline and isoquinoline derivatives; and even more preferably one or more selected from the group consisting of isoquinoline and isoquinoline derivatives. These compounds and their derivatives may further have substituents, and preferred substituents are alkyl groups, aryl groups, halogen atoms, acyl groups, alkoxycarbonyl groups, arylcarbonyl groups, carbamoyl groups, hydroxyl groups, cyano groups, amino groups, or nitro groups; more preferably alkyl groups, aryl groups, halogen atoms, acyl groups, alkoxycarbonyl groups, arylcarbonyl groups, carbamoyl groups, hydroxyl groups, cyano groups, or nitro groups; even more preferably alkyl groups, aryl groups, acyl groups, alkoxycarbonyl groups, arylcarbonyl groups, carbamoyl groups, hydroxyl groups, cyano groups, or nitro groups; and particularly preferred alkyl groups (for example, linear or branched alkyl groups having 1 to 10 carbon atoms).

[0125] Furthermore, in terms of having superior pattern-forming ability and / or lower moisture permeability of the formed pattern, compound β (preferably compound B) is preferably a substituted aromatic compound (a compound having substituents on the constituent atoms of the aromatic ring contained in compound β (preferably compound B)), and more preferably satisfies one or more (e.g., 1 to 4) of the above requirements (1) to (4), and is further preferably a substituted compound. Regarding the position of the substituent, for example, when compound β (preferably compound B) is quinoline and a quinoline derivative, it is preferable to have substituents at least at the 2nd and 4th positions on the quinoline ring in terms of superior pattern-forming ability and / or lower moisture permeability of the formed pattern. Also, for example, when compound β (preferably compound B) is isoquinoline and an isoquinoline derivative, it is preferable to have substituents at least at the 1st position on the isoquinoline ring in terms of superior pattern-forming ability and / or lower moisture permeability of the formed pattern. The substituent is preferably an alkyl group (for example, a linear or branched alkyl group having 1 to 10 carbon atoms).

[0126] If compound β (preferably compound B) is a polymer, it may be a polymer in which specific structure S0 (preferably specific structure S1) is bonded to the polymer main chain via single bonds or linking groups. The polymer compound β (preferably compound B) can be obtained, for example, by polymerizing a monomer having a heteroaromatic ring (specifically, a vinyl heteroaromatic ring and / or a (meth)acrylate monomer having a specific structure S0 (preferably specific structure S1, and more preferably a heteroaromatic ring)). Copolymerization with other monomers may be performed as needed.

[0127] In terms of having superior pattern-forming ability and / or lower moisture permeability of the formed pattern, the molar extinction coefficient (molar extinction coefficient ε) of compound β (preferably compound B) for light at a wavelength of 365 nm is, for example, 1 × 10⁻⁶. 3 (cm·mol / L) -1 The following is true: 1 × 10 3 (cm·mol / L) -1 The following is preferable: 5 × 10 2 (cm·mol / L) -1 It is more preferable that it be less than 1 × 10 2 (cm·mol / L) -1 The following is even more preferable. There is no particular limit to the lower limit of the molar extinction coefficient ε, for example, 0 (cm·mol / L) -1 It's incredible. Having the molar extinction coefficient ε of compound β (preferably compound B) within the above range is particularly advantageous when exposing the photosensitive layer through a temporary support (preferably a PET film). In other words, when the acid group of compound A is a carboxyl group, the molar extinction coefficient ε is moderately low, so even when exposed through a temporary support, the generation of bubbles due to decarboxylation can be controlled, and the deterioration of the pattern shape can be prevented. Furthermore, when the photosensitive layer is used to produce a protective film (permanent film), the film's discoloration can be suppressed by keeping the molar extinction coefficient ε of compound β (preferably compound B) within the above range. As compounds having such a molar extinction coefficient ε, the monocyclic aromatic compounds described above, or aromatic compounds in which two rings are fused to form an aromatic ring are preferred, pyridine or pyridine derivatives, quinoline or quinoline derivatives, or isoquinoline or isoquinoline derivatives are more preferred, and isoquinoline or isoquinoline derivatives are even more preferred.

[0128] Furthermore, in terms of having superior pattern-forming ability and / or lower moisture permeability of the formed pattern, the ratio of the molar extinction coefficient (molar extinction coefficient ε) of compound β (preferably compound B) at 365 nm to the molar extinction coefficient (molar extinction coefficient ε') of compound β (preferably compound B) at 313 nm is preferably 3 or less, more preferably 2 or less, and even more preferably less than 1. There is no particular lower limit, for example, 0.01 or more.

[0129] The molar extinction coefficients of compound β (preferably compound B) for light at a wavelength of 365 nm (molar extinction coefficient ε) and for light at a wavelength of 313 nm (molar extinction coefficient ε') are measured by dissolving compound β (preferably compound B) in acetonitrile. If compound β (preferably compound B) does not dissolve in acetonitrile, the solvent used to dissolve compound β (preferably compound B) may be changed as appropriate.

[0130] Specific examples of compound β (preferably compound B) include 5,6,7,8-tetrahydroquinoline, 4-acetylpyridine, 4-benzoylpyridine, 1-phenylisoquinoline, 1-n-butylisoquinoline, 1-n-butyl-4-methylisoquinoline, 1-methylisoquinoline, 2,4,5,7-tetramethylquinoline, 2-methyl-4-methoxyquinoline, 2,4-dimethylquinoline, phenanthidine, 9-methylacridine, 9-phenylacridine, pyridine, isoquinoline, quinoline, acridine, 4-aminopyridine, and 2-chloropyridine.

[0131] The lower limit of the pKa of compound β (preferably compound B) in the ground state is preferably 0.50 or more, and more preferably 2.00 or more in terms of better pattern forming ability and / or lower moisture permeability of the formed pattern. Further, the upper limit of the pKa of compound β (preferably compound B) in the ground state is preferably 10.00 or less, more preferably 9.00 or less, still more preferably 8.00 or less, and particularly preferably 7.00 or less. Note that the pKa of compound β (preferably compound B) in the ground state refers to the pKa of compound β (preferably compound B) in the unexcited state and can be determined by acid titration. When compound β (preferably compound B) is a nitrogen-containing aromatic compound, the pKa of compound β (preferably compound B) in the ground state refers to the pKa of the conjugate acid of compound β (preferably compound B) in the ground state.

[0132] In addition, when forming the photosensitive layer by coating, in terms of being less volatile during the coating process and having a better residual rate in the photosensitive layer (and thus better pattern forming ability and / or lower moisture permeability of the formed pattern), the molecular weight of compound β (preferably compound B) is more preferably 120 or more, still more preferably 130 or more, and even more preferably 150 or more. The upper limit of the molecular weight of compound β (preferably compound B) is not particularly limited, but is, for example, 50,000 or less.

[0133] When compound β (preferably compound B) is a compound showing a cationic state (for example, a nitrogen-containing aromatic compound), the energy level of the HOMO (highest occupied molecular orbital) of compound β (preferably compound B) in the cationic state is preferably -7.50 eV or less, and more preferably -7.80 eV or less in terms of better pattern forming ability and / or lower moisture permeability of the formed pattern. The lower limit is not particularly limited, but is more preferably -13.60 eV or more. In the case of the continuum β(which is also the coordinate B). In the case of the HOMO(1-dimensional chain reaction). The HOMO) spectral range is the high-performance spectrum of Gaussian09(Gaussian 09, Revision A.02, MJ Frisch, GW Trucks, HB Schlegel, GE Scuseria, MA Robb, JR Cheeseman, G Scalmani, V Barone, B Mennucci, Petersson GA, Nakatsuji H, Caricato M, Li, Hratchian AF, Izmaylov J, Bloino, G Zheng, JL Sonnenberg, 09, Revision A.02; Hada M, Ehara M, Toyota K, Fukuda R, Hasegawa J, Ishida M, Nakajima T, Honda Y, Kitao O, Nakai H, Vreven T, Montgomery, Jr., Peralta JE, Ogliaro F, Bearpark M, Heyd JJ, Brothers E, Kudin KN, Staroverov VN. Kobayashi, J, Normand, K, Raghavachari, A, Rendell, JC, Burant, SS, Iyengar, J, Tomasi, M, Cossi, N, Rega, JM, Millam, M, Klene, J, Knox, JB, Cross, V, Bakken, C, Adamo, J, Jaramillo, Gomperts, R, Pomelli C, Ochterski JW, Martin RL, Morokuma K, Zakrzewski VG, Voth GA, Salvador P, Dannenberg JJ, Dapprich S, ADCalculated by Daniels, O. Farkas, J. B. Foresman, J. V. Ortiz, J. Cioslowski, and D. J. Fox, Gaussian, Inc., Wallingford CT, 2009.). As the calculation method, time-dependent density functional theory using B3LYP for the functional and 6-31+G(d,p) for the basis function was utilized. In addition, to incorporate the solvent effect, the PCM method based on the parameters of chloroform set in Gaussian09 was used in combination. By this method, the structural optimization calculation of the first electronic excited state was performed to obtain the structure with the minimum energy, and the energy of the HOMO in that structure was calculated.

[0134] Hereinafter, for a typical example of compound β (preferably compound B), the HOMO energy level (eV) in its cationic state is shown. In addition, the molecular weight is also shown.

[0135] [Table 1]

[0136] In the photosensitive layer, the content of compound β (preferably compound B) is preferably 0.1 to 50% by mass based on the total mass of the photosensitive layer. Among them, in the photosensitive layer of Embodiment X-1-a1, the content of compound β (preferably compound B) is preferably 2.0 to 40% by mass, more preferably 4 to 35% by mass, and still more preferably 8 to 30% by mass based on the total mass of the photosensitive layer. In the photosensitive layer of Embodiment X-1-a2, the content of compound β (preferably compound B) is preferably 0.5 to 20% by mass, more preferably 1.0 to 10% by mass based on the total mass of the photosensitive layer. In the photosensitive layer of Embodiment X-1-a3, the content of compound β (preferably compound B) is preferably 0.3 to 20% by mass, more preferably 0.5 to 8% by mass based on the total mass of the photosensitive layer. Compound β (preferably compound B) may be used alone or in combination of two or more.

[0137] When compound β is compound B, the effects of the present invention are more superior in that the total number of electron-accepting structures (specific structure S1) of compound B in the photosensitive layer is preferably 1 mol% or more, more preferably 3 mol% or more, even more preferably 5 mol% or more, particularly preferably 10 mol% or more, and most preferably 20 mol% or more, relative to the total number of acid groups (preferably carboxyl groups) of compound A. There is no particular upper limit on the total number of electron-accepting structures (specific structure S1) in compound B, but from the viewpoint of the film quality of the resulting film, it is preferable that the number be 200 mol% or less, more preferably 100 mol% or less, and even more preferably 80 mol% or less, relative to the total number of acid groups (preferably carboxyl groups) in compound A.

[0138] <Polymerizable compound> The photosensitive layer may also preferably contain a polymerizable compound. This polymerizable compound is a different component from compound A, which has an acidic group, and preferably does not contain an acidic group.

[0139] The polymerizable compound is preferably a component different from compound A, and is preferably a compound with a molecular weight (or weight-average molecular weight if it has a molecular weight distribution) of less than 5,000, and is also preferably a polymerizable monomer.

[0140] Polymerizable compounds are polymerizable compounds that have one or more ethylenically unsaturated groups (for example, 1 to 15) in a single molecule. The polymerizable compound preferably contains two or more polymerizable compounds. Here, a polymerizable compound with two or more functions refers to a polymerizable compound that has two or more ethylenically unsaturated groups (for example, 2 to 15) in one molecule. Examples of ethylenically unsaturated groups include (meth)acryloyl groups, vinyl groups, and styryl groups, with (meth)acryloyl groups being preferred. (Meth)acrylates are preferred as polymerizable compounds.

[0141] The photosensitive layer preferably contains a bifunctional polymerizable compound (preferably a bifunctional (meth)acrylate) and / or a trifunctional or higher polymerizable compound (preferably a trifunctional or higher (meth)acrylate).

[0142] There are no particular restrictions on the bifunctional polymerizable compound; it can be appropriately selected from known compounds. Examples of bifunctional polymerizable compounds include tricyclodecanedimethanol di(meth)acrylate, tricyclodecanedimenanol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate. More specifically, examples of bifunctional polymerizable compounds include tricyclodecanedimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), tricyclodecanedimenol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), and 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).

[0143] There are no particular restrictions on the polymerizable compound with three or more functions; it can be appropriately selected from known compounds. Examples of polymerizable compounds with three or more functions include dipentaerythritol (tri / tetra / penta / hexa)(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and (meth)acrylate compounds with a glycerin tri(meth)acrylate skeleton.

[0144] Here, "(tri / tetra / penta / hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, while "(tri / tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

[0145] Other polymerizable compounds include, for example, caprolactone-modified (meth)acrylate compounds (such as KAYARAD® DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and A-9300-1CL manufactured by Shin Nakamura Chemical Industry Co., Ltd.), alkylene oxide-modified (meth)acrylate compounds (such as KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin Nakamura Chemical Industry Co., Ltd., and EBECRYL® 135 manufactured by Daicel Ornex), and ethoxylated glycerin triacrylate (such as A-GLY-9E manufactured by Shin Nakamura Chemical Industry Co., Ltd.).

[0146] Examples of polymerizable compounds include urethane (meth)acrylates (preferably urethane (meth)acrylates with three or more functional groups). The lower limit of the number of functional groups is more preferably six or more, and even more preferably eight or more. The upper limit of the number of functional groups is, for example, 20 or fewer. Examples of urethane (meth)acrylates with three or more functionalities include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P, U-15HA, and UA-1100H (all manufactured by Shin Nakamura Chemical Industry Co., Ltd.), AH-600 (product name) manufactured by Kyoeisha Chemical Co., Ltd., UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000 (all manufactured by Nippon Kayaku Co., Ltd.).

[0147] The weight-average molecular weight (Mw) of the polymerizable compound that the photosensitive layer may contain is preferably 200 to 3000, more preferably 250 to 2600, and even more preferably 280 to 2200. When the photosensitive layer contains a polymerizable compound, the molecular weight of the polymerizable compound having the lowest molecular weight among all the polymerizable compounds contained in the photosensitive layer is preferably 250 or more, more preferably 280 or more.

[0148] When the photosensitive layer contains a polymerizable compound, its content is preferably 3 to 70% by mass, more preferably 10 to 70% by mass, and particularly preferably 20 to 55% by mass based on the total mass of the photosensitive layer. When the photosensitive layer contains a polymerizable compound, the mass ratio of the polymerizable compound to compound A (mass of polymerizable compound / mass of compound A) is preferably 0.2 to 2.0, more preferably 0.4 to 0.9. The polymerizable compound may be used alone or in combination of two or more.

[0149] When the photosensitive layer contains a bifunctional polymerizable compound and a trifunctional or higher-functional polymerizable compound, the content of the bifunctional polymerizable compound is preferably 10 to 90% by mass, more preferably 20 to 85% by mass, and still more preferably 30 to 80% by mass based on all the polymerizable compounds contained in the photosensitive layer. Also, the content of the trifunctional or higher-functional polymerizable compound is preferably 10 to 100% by mass, more preferably 15 to 100% by mass, still more preferably 20 to 100% by mass based on all the polymerizable compounds contained in the photosensitive layer. Particularly preferably 70 to 100% by mass.

[0150] When the photosensitive layer contains a bifunctional or higher-functional polymerizable compound, this photosensitive layer may further contain a monofunctional polymerizable compound. However, when the photosensitive layer contains a bifunctional or higher-functional polymerizable compound, it is preferable that the bifunctional or higher-functional polymerizable compound is the main component among the polymerizable compounds that the photosensitive layer can contain. Specifically, when the photosensitive layer contains a bifunctional or higher-functional polymerizable compound, the content of the bifunctional or higher-functional polymerizable compound is preferably 60 to 100% by mass, more preferably 80 to 100% by mass, and still more preferably 90 to 100% by mass based on the total content of the polymerizable compounds contained in the photosensitive layer.

[0151] <Photoinitiator> The photosensitive layer may also preferably contain a photopolymerization initiator. The photopolymerization initiator may be a photoradical polymerization initiator, a photocationic polymerization initiator, or a photoanionic polymerization initiator, but it is preferably a photoradical polymerization initiator.

[0152] There are no particular restrictions on the photopolymerization initiator; known photopolymerization initiators can be used. Preferably, the photopolymerization initiator is an oxime ester compound (a photopolymerization initiator having an oxime ester structure) or an alkylphenone compound (a photopolymerization initiator having an alkylphenone structure), and may contain at least one of these compounds, or both. When both compounds are included, the content of the oxime ester compound relative to the total content of both compounds is preferably 5 to 90% by mass, and more preferably 15 to 50% by mass. The alkylphenone compound may also preferably be an aminoacetophenone compound (a photopolymerization initiator having an aminoacetophenone structure). The photopolymerization initiator may be used in combination with other photopolymerization initiators, such as hydroxyacetophenone compounds, acylphosphine oxide compounds, and bistriphenylimidazole compounds.

[0153] Furthermore, as photopolymerization initiators, for example, those described in paragraphs 0031 to 0042 of Japanese Patent Publication No. 2011-095716 and paragraphs 0064 to 0081 of Japanese Patent Publication No. 2015-014783 may be used.

[0154] The following are examples of photopolymerization initiators. Examples of oxime ester compounds include 1,2-octanedione,1-[4-(phenylthio)phenyl-,2-(O-benzoyl oxime)] (product name: IRGACURE OXE-01, IRGACURE series are BASF products), ethanone,1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyloxime) (product name: IRGACURE OXE-02, manufactured by BASF), and [8-[5-(2,4,6-trimethylphenyl)-11-(2-ethylhexyl)-11H-benzo[a]carbazoyl][2-(2,2,3,3-tetrafluoropropoxy)phenyl]methanone-(O-acetyloxime) (product name: IRGACURE OXE-03 (manufactured by BASF), 1-[4-[4-(2-benzofuranylcarbonyl)phenyl]thio]phenyl]-4-methylpentanone-1-(O-acetyloxime) (product name: IRGACURE OXE-04, manufactured by BASF, and product name: Lunar 6. Examples include 1-[4-(phenylthio)phenyl]-3-cyclopentylpropane-1,2-dione-2-(O-benzoyloxime) (product name: TR-PBG-305, manufactured by Changzhou Strong Electronic Materials Co., Ltd.), 1,2-propanedione,3-cyclohexyl-1-[9-ethyl-6-(2-furanylcarbonyl)-9H-carbazole-3-yl]-,2-(O-acetyloxime) (product name: TR-PBG-326, manufactured by Changzhou Strong Electronic Materials Co., Ltd.), and 3-cyclohexyl-1-(6-(2-(benzoyloxyimino)hexanoyl)-9-ethyl-9H-carbazole-3-yl)-propane-1,2-dione-2-(O-benzoyloxime) (product name: TR-PBG-391, manufactured by Changzhou Strong Electronic Materials Co., Ltd.). Examples of aminoacetophenone compounds include 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379, the Omnirad series is a product of IGM Resins BV), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907), and APi-307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one, manufactured by ShenzhenUV-ChemTech Ltd.). Other photopolymerization initiators include, for example, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)-benzyl]phenyl}-2-methylpropan-1-one (trade name: Omnirad 127), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (trade name: Omnirad 369), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173), 1-hydroxycyclohexyl-phenyl-ketone (trade name: Omnirad 184), 2,2-dimethoxy-1,2-diphenylethane-1-one (trade name: Omnirad 651), and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO Examples include H) and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819).

[0155] If the photosensitive layer contains a photopolymerization initiator, its content is preferably 0.01 to 15% by mass, more preferably 0.05 to 10% by mass, and even more preferably 0.1 to 5% by mass, relative to the total mass of the photosensitive layer. The photopolymerization initiator may be used alone or in combination of two or more types.

[0156] <Surfactants> The photosensitive layer may contain a surfactant. Examples of surfactants include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants, with nonionic surfactants being preferred. Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, polyoxyethylene glycol higher fatty acid diesters, silicone-based surfactants, and fluorine-based surfactants.

[0157] As surfactants, for example, those described in paragraphs 0120 to 0125 of International Publication No. 2018 / 179640 can also be used. Furthermore, surfactants described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of Japanese Unexamined Patent Publication No. 2009-237362 can also be used as surfactants. Examples of commercially available fluorine-based surfactants include Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F -563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Florard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Co., Ltd.), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Futegent Examples include 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (all manufactured by NEOS Corporation). Furthermore, acrylic compounds having a molecular structure with a functional group containing a fluorine atom, in which the fluorine atom-containing functional group is cleaved and the fluorine atom volatilizes when heat is applied, can also be suitably used as fluorine-based surfactants. Examples of such fluorine-based surfactants include the Megafac DS series manufactured by DIC Corporation (Chemical Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), such as Megafac DS-21. Furthermore, as a fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. In addition, block polymers can also be used as fluorine-based surfactants. Furthermore, as a fluorine-based surfactant, a fluorine-containing polymer compound can also be preferably used, which includes repeating units derived from a (meth)acrylate compound having a fluorine atom and repeating units derived from a (meth)acrylate compound having two or more (preferably five or more) alkylene oxy groups (preferably ethylene oxy groups, propylene oxy groups). Furthermore, fluorine-containing polymers having ethylenically unsaturated bond-containing groups in their side chains can also be used as fluorine-based surfactants. Examples include Megafac RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

[0158] As for fluorine-based surfactants, from the viewpoint of improving environmental suitability, it is preferable that the surfactant is derived from a substitute material for compounds having a linear perfluoroalkyl group with 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS). Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic® L10, L31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), and Solspers. Examples include 20000 (manufactured by Lubrizol Nippon Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (manufactured by Fujifilm Wako Pure Chemical Industries Ltd.), Paionin D-6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Orfin E1010, Surfinol 104, 400, 440 (manufactured by Nisshin Chemical Industry Co., Ltd.), etc.

[0159] Examples of silicone-based surfactants include linear polymers composed of siloxane bonds, and modified siloxane polymers in which organic groups are introduced into the side chains or terminals.

[0160] Specific examples of surfactants include DOWSIL 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (all manufactured by Toray Dow Corning Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, KF- Examples include 945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicone Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BIC Chemie), etc.

[0161] The surfactant content is preferably 0.0001 to 10% by mass, more preferably 0.001 to 5% by mass, and even more preferably 0.005 to 3% by mass, relative to the total mass of the photosensitive layer. Surfactants may be used individually or in combination of two or more types.

[0162] <Other additives> The photosensitive layer may contain other additives as needed. Other additives include, for example, plasticizers, sensitizers, heterocyclic compounds, and alkoxysilane compounds. Examples of plasticizers, sensitizers, heterocyclic compounds, and alkoxysilane compounds include those described in paragraphs 0097-0119 of International Publication No. 2018 / 179640.

[0163] When a photosensitive layer is formed using a photosensitive material containing a solvent, some solvent may remain, but it is preferable that the photosensitive layer itself does not contain the solvent. The solvent content in the photosensitive layer is preferably 5% by mass or less, more preferably 2% by mass or less, even more preferably 1% by mass or less, particularly preferably 0.5% by mass or less, and most preferably 0.1% by mass or less, based on the total mass of the photosensitive layer.

[0164] Furthermore, the photosensitive layer may further contain known additives such as rust inhibitors, metal oxide particles, antioxidants, dispersants, acid growth agents, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, thickeners, crosslinking agents, and organic or inorganic precipitation inhibitors. Preferred embodiments of these components are described in paragraphs 0165 to 0184 of Japanese Patent Publication No. 2014-085643, respectively, and the contents of this publication are incorporated herein by reference.

[0165] The photosensitive layer may contain impurities. Examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and their ions. Among these, halide ions, sodium ions, and potassium ions are particularly likely to be mixed in as impurities, so it is especially preferable to have them in the following amounts.

[0166] The impurity content in the photosensitive layer is preferably 80 ppm by mass or less, more preferably 10 ppm by mass or less, and even more preferably 2 ppm by mass or less, relative to the total mass of the photosensitive layer. The impurity content in the photosensitive layer may be 1 ppb by mass or 0.1 ppm by mass or more, relative to the total mass of the photosensitive layer.

[0167] Methods to keep impurities within the above range include, for example, selecting raw materials with low impurity content for the photosensitive material, preventing the incorporation of impurities during the formation of the photosensitive material, and removing them by washing. By such methods, the amount of impurities can be kept within the above range.

[0168] Impurities can be quantified using known methods such as ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, and ion chromatography.

[0169] Furthermore, it is preferable that the content of compounds such as benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive layer be low. The content of these compounds in the photosensitive layer is preferably 100 ppm by mass or less, more preferably 20 ppm by mass or less, and even more preferably 4 ppm by mass or less, based on the total mass of the photosensitive layer. The lower limit of the above content may be 10 ppb or more by mass, or 100 ppb or more by mass, relative to the total mass of the photosensitive layer. The content of these compounds can be suppressed in the same way as the metal impurities described above. Furthermore, they can be quantified by known measurement methods.

[0170] The water content in the photosensitive layer is preferably 0.01 to 1.0% by mass, and more preferably 0.05 to 0.5% by mass, relative to the total mass of the photosensitive layer, in order to improve patternability.

[0171] <<Average thickness of the photosensitive layer>> The average thickness of the photosensitive layer is preferably 0.5 to 20 μm. An average thickness of 20 μm or less of the photosensitive layer provides better pattern resolution, while an average thickness of 0.5 μm or more is preferable in terms of pattern linearity. A more preferable average thickness of 0.8 to 15 μm is preferred for the photosensitive layer, and even more preferable for 1.0 to 10 μm. Specific examples of average thicknesses of the photosensitive layer include 3.0 μm, 5.0 μm, and 8.0 μm.

[0172] <<Method for forming a photosensitive layer>> The photosensitive layer can be formed by preparing a photosensitive material containing components that the photosensitive layer may contain and a solvent, then coating and drying it. Alternatively, each component can be dissolved in a solvent beforehand to form a solution, and then the resulting solutions can be mixed in a predetermined ratio to prepare the composition. The composition prepared in this manner is preferably filtered using, for example, a filter with a pore size of 0.2 to 30 μm. A photosensitive layer can be formed by applying a photosensitive material onto a temporary support or cover film and drying it. The coating method is not particularly limited and includes known methods such as slit coating, spin coating, curtain coating, and inkjet coating. Furthermore, when other layers described later are formed on a temporary support or cover film, the photosensitive layer may be formed on top of the other layers.

[0173] The 365nm transmittance of the photosensitive layer is preferably 20% or more, more preferably 65% ​​or more, and even more preferably 90% or more, in terms of having superior pattern-forming ability and / or lower moisture permeability of the formed pattern. There is no particular upper limit, but it should be 100% or less.

[0174] Furthermore, the ratio of the transmittance of the photosensitive layer at 365 nm to the transmittance of the photosensitive layer at 313 nm (the ratio expressed as the transmittance of the photosensitive layer at 365 nm / transmittance of the photosensitive layer at 313 nm) is preferably 1 or greater, and more preferably 1.5 or greater, in terms of having superior pattern-forming ability and / or lower moisture permeability of the formed pattern. There is no particular upper limit, but for example, it is 1000 or less.

[0175] In the photosensitive layer, the acidic group of compound A is preferably a carboxyl group. Furthermore, it is preferable that the photosensitive layer decreases in content of carboxyl groups at a rate of 5 mol% or more upon irradiation with active light or radiation. Such a photosensitive layer is more preferably one that satisfies either requirement (V1-C) or requirement (W1-C) described above. Furthermore, among the embodiments of the photosensitive layer, the photosensitive layer of embodiments X-1-a1-C to X-1-a3-C described above is more preferable.

[0176] The visible light transmittance per 1.0 μm of film thickness of the photosensitive layer is preferably 80% or higher, more preferably 90% or higher, and most preferably 95% or higher. It is preferable that the visible light transmittance satisfies the above conditions for the average transmittance at wavelengths of 400 to 800 nm, the minimum transmittance at wavelengths of 400 to 800 nm, and the transmittance at a wavelength of 400 nm. Preferred values ​​for the visible light transmittance per 1.0 μm of film thickness of the photosensitive layer include, for example, 87%, 92%, and 98%. The dissolution rate of the photosensitive layer in a 1.0% by mass aqueous solution of sodium carbonate is preferably 0.01 μm / sec or higher, more preferably 0.10 μm / sec or higher, and even more preferably 0.20 μm / sec or higher, from the viewpoint of suppressing residue during development. Furthermore, from the viewpoint of the pattern edge shape, a rate of 5.0 μm / sec or lower is preferred. Specific preferred values ​​include, for example, 1.8 μm / sec, 1.0 μm / sec, and 0.7 μm / sec. The dissolution rate per unit time of the photosensitive layer in a 1.0 mass% sodium carbonate aqueous solution shall be measured as follows: A photosensitive layer (with a film thickness of 1.0 to 10 μm) formed on a glass substrate, from which the solvent has been thoroughly removed, is subjected to shower development with a 1.0% by mass sodium carbonate aqueous solution at 25°C until the photosensitive layer is completely dissolved (however, this should not exceed 2 minutes). The thickness of the photosensitive layer is determined by dividing it by the time it took for the photosensitive layer to completely dissolve. If it does not dissolve completely in 2 minutes, the same calculation is performed using the change in thickness up to that point. For development, a 1 / 4 MIN JJX030PP shower nozzle manufactured by Ikeuchi Co., Ltd. will be used, with a shower spray pressure of 0.08 MPa. Under the above conditions, the shower flow rate per unit time will be 1,800 mL / min.

[0177] From the standpoint of pattern formation, the number of foreign particles with a diameter of 1.0 μm or more in the photosensitive layer should be 10 particles / mm².2 The following is preferable: 5 pieces / mm 2 The following is more preferable: The number of foreign objects shall be measured as follows: Using an optical microscope, five arbitrary regions (1 mm × 1 mm) on the surface of the photosensitive layer are observed visually from the direction normal to the surface of the photosensitive layer. The number of foreign objects with a diameter of 1.0 μm or more in each region is measured, and the total number of foreign objects is calculated by arithmetic mean. A specific desirable value would be, for example, 0 pieces / mm 2 , 1 piece / mm 2 , 4 pieces / mm 2 , 8 pieces / mm 2 Examples include: To suppress the formation of aggregates during development, 1.0 cm³ of 1.0% sodium carbonate aqueous solution at 30°C is added to 1.0 liter of the solution. 3 The haze of the solution obtained by dissolving the photosensitive layer is preferably 60% or less, more preferably 30% or less, even more preferably 10% or less, and most preferably 1% or less. Haze shall be measured as follows: First, prepare a 1.0% by mass sodium carbonate aqueous solution and adjust the liquid temperature to 30°C. Add 1.0 cm to 1.0 L of sodium carbonate aqueous solution. 3 Add the photosensitive layer. Stir at 30°C for 4 hours, taking care not to introduce air bubbles. After stirring, measure the haze of the solution in which the photosensitive resin layer has dissolved. The haze is measured using a haze meter (product name "NDH4000", manufactured by Nippon Denshoku Industries Co., Ltd.) with a liquid measurement unit and a liquid measurement cell with an optical path length of 20 mm. Specific desirable values ​​include, for example, 0.4%, 1.0%, 9%, and 24%.

[0178] <Photosensitive material> The photosensitive material preferably contains components that can be included in the photosensitive layer and a solvent. By mixing each component with the solvent to adjust the viscosity, and then applying and drying the mixture, a suitable photosensitive layer can be formed.

[0179] (Components that the photosensitive layer may contain) The components that the photosensitive layer may contain are as previously described. The preferred numerical range for the content of each component in the photosensitive material is the same as the preferred range obtained by replacing "content of each component relative to the total mass of the photosensitive layer (mass%)" with "content of each component relative to the total solid content of the photosensitive material (mass%)". Note that the solid content of the photosensitive material refers to components other than the solvent in the photosensitive material. Therefore, for example, the statement "The content of compound A in the photosensitive layer is preferably 25 to 100% by mass relative to the total mass of the photosensitive layer" should be read as "The content of compound A in the photosensitive material is preferably 25 to 100% by mass relative to the total solid content of the photosensitive material." Note that the solid content refers to all components of the photosensitive material excluding the solvent. Furthermore, even if the photosensitive material is liquid, components other than the solvent are considered to be solid content.

[0180] (solvent) Any commonly used solvent can be used without any particular restrictions. An organic solvent is preferred as the solvent. Examples of organic solvents include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (also known as 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, caprolactam, n-propanol, 2-propanol, and mixtures thereof. Preferred solvents include a mixed solvent of methyl ethyl ketone and propylene glycol monomethyl ether acetate, a mixed solvent of diethylene glycol ethyl methyl ether and propylene glycol monomethyl ether acetate, or a mixed solvent of methyl ethyl ketone, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate.

[0181] When the photosensitive material contains a solvent, the solid content of the photosensitive material is preferably 5 to 80% by mass, more preferably 8 to 40% by mass, and even more preferably 10 to 30% by mass. In other words, when the photosensitive material contains a solvent, the solvent content is preferably 20 to 95% by mass, more preferably 60 to 95% by mass, and even more preferably 70 to 95% by mass, relative to the total mass of the photosensitive material. The solvent may be used alone or in combination of two or more types.

[0182] When the photosensitive material contains a solvent, the viscosity of the photosensitive material (at 25°C) is preferably 1 to 50 mPa·s, more preferably 2 to 40 mPa·s, and even more preferably 3 to 30 mPa·s, from the viewpoint of coatability. Viscosity is measured using, for example, a VISCOMETER TV-22 (manufactured by TOKI SANGYO CO.LTD). When the photosensitive material contains a solvent, the surface tension (at 25°C) of the photosensitive material is preferably 5 to 100 mN / m, more preferably 10 to 80 mN / m, and even more preferably 15 to 40 mN / m, from the viewpoint of coatability. Surface tension is measured by, for example, an automatic surface tensile. Measurements are performed using CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.).

[0183] As a solvent, the Solvent described in paragraphs 0054 and 0055 of U.S. Patent Publication No. 2005 / 282073 may also be used, and the contents of that specification are incorporated herein by reference. Additionally, organic solvents with a boiling point of 180-250°C (high-boiling point solvents) can be used as solvents if necessary.

[0184] <<<Cover film>>> The transfer film of the present invention may further have a cover film on the side opposite to the temporary support when viewed from the photosensitive layer. When the transfer film of the present invention includes a high refractive index layer as described below, it is preferable that the cover film be placed on the side opposite to the temporary support (i.e., opposite to the photosensitive layer) when viewed from the high refractive index layer. In this case, the transfer film is a laminate in which, for example, "temporary support / photosensitive layer / high refractive index layer / cover film" are laminated in that order.

[0185] The cover film contains 5 fisheyes with a diameter of 80 μm or more per square meter. 2 The following is preferable. Note that "fish eye" refers to foreign matter, undissolved material, and / or oxidized degradation products incorporated into the film when the material is heated and melted, kneaded, extruded, and / or manufactured by methods such as biaxial stretching and casting.

[0186] The cover film contains 30 particles / mm² with a diameter of 3 μm or larger. 2 The following is preferable: 10 pieces / mm 2 The following is more preferable: 5 pieces / mm 2 The following is even more preferable: This makes it possible to suppress defects caused by the transfer of irregularities resulting from particles contained in the cover film to the photosensitive resin layer.

[0187] The arithmetic mean roughness Ra of the cover film surface is preferably 0.01 μm or more, more preferably 0.02 μm or more, and even more preferably 0.03 μm or more. If Ra is within this range, for example, when the transfer film is in a long length, the winding properties when winding the transfer film can be improved. Furthermore, from the viewpoint of suppressing defects during transfer, Ra is preferably less than 0.50 μm, more preferably 0.40 μm or less, and even more preferably 0.30 μm or less.

[0188] Examples of cover films include polyethylene terephthalate film, polypropylene film, polystyrene film, and polycarbonate film. As the cover film, for example, one described in paragraphs 0083 to 0087 and 0093 of Japanese Patent Publication No. 2006-259138 may be used.

[0189] As a cover film, for example, Alphan® FG-201 or Alphan® E-201F manufactured by Oji F-Tex Co., Ltd., Therapiel® 25WZ manufactured by Toray Film Processing Co., Ltd., or Lumirror® 16QS62 (16KS40) manufactured by Toray Industries, Inc. may be used.

[0190] <<<Other layers>>> The transfer film may have other layers besides those described above. Other layers include, for example, high refractive index layers. Furthermore, when a high refractive index layer is formed on a temporary support or cover film, the photosensitive layer may be formed on top of the high refractive index layer.

[0191] <<High refractive index layer>> The high refractive index layer is preferably positioned adjacent to the photosensitive layer, and also preferably on the opposite side from the temporary support when viewed from the photosensitive layer. The high refractive index layer is not particularly limited, other than being a layer with a refractive index of 1.50 or higher at a wavelength of 550 nm. The refractive index of the high refractive index layer is preferably 1.55 or higher, and more preferably 1.60 or higher. There is no particular upper limit to the refractive index of the high refractive index layer, but it is preferably 2.10 or less, more preferably 1.85 or less, even more preferably 1.78 or less, and particularly preferably 1.74 or less. Furthermore, it is preferable that the refractive index of the high-refractive-index layer be higher than that of the photosensitive layer.

[0192] The high refractive index layer may be photocurable (i.e., photosensitive), thermocurable, or both photocurable and thermocurable. An embodiment in which the high refractive index layer is photosensitive has the advantage that, after transfer, the photosensitive layer and the high refractive index layer transferred onto the substrate can be patterned together in a single photolithography. The high refractive index layer is preferably alkali-soluble (for example, soluble in a weakly alkaline aqueous solution). Furthermore, the high refractive index layer is preferably a transparent layer.

[0193] The thickness of the high refractive index layer is preferably 500 nm or less, more preferably 110 nm or less, and even more preferably 100 nm or less. Furthermore, the film thickness of the high refractive index layer is preferably 20 nm or more, more preferably 55 nm or more, even more preferably 60 nm or more, and particularly preferably 70 nm or more.

[0194] The high refractive index layer may be sandwiched between the transparent electrode pattern (preferably an ITO pattern) and the photosensitive layer after transfer, thereby forming a laminate together with the transparent electrode pattern and the photosensitive layer. In this case, reducing the refractive index difference between the transparent electrode pattern and the high refractive index layer, and between the high refractive index layer and the photosensitive layer, further reduces light reflection. This improves the opacity of the transparent electrode pattern. For example, when a transparent electrode pattern, a high refractive index layer, and a photosensitive layer are stacked in this order, the transparent electrode pattern becomes difficult to see when viewed from the transparent electrode pattern side.

[0195] The refractive index of the high refractive index layer is preferably adjusted according to the refractive index of the transparent electrode pattern. When the refractive index of the transparent electrode pattern is in the range of 1.8 to 2.0, for example, when formed using an oxide of In and Sn (ITO), the refractive index of the high refractive index layer is preferably 1.60 or higher. In this case, there is no particular upper limit to the refractive index of the high refractive index layer, but it is preferably 2.1 or lower, more preferably 1.85 or lower, even more preferably 1.78 or lower, and particularly preferably 1.74 or lower. If the refractive index of the transparent electrode pattern exceeds 2.0, for example, when formed using an oxide of In and Zn (IZO; Indium Zinc Oxide), the refractive index of the high refractive index layer is preferably 1.70 or more and 1.85 or less.

[0196] The method for controlling the refractive index of the high refractive index layer is not particularly limited. Examples include using a resin with a predetermined refractive index alone, using a resin with metal oxide particles or metal particles, and using a composite of a metal salt and a resin.

[0197] There are no particular restrictions on the type of metal oxide particles or metal particles; known metal oxide particles or metal particles can be used. The metals in the metal oxide particles or metal particles include metalloids such as B, Si, Ge, As, Sb, and Te.

[0198] The average primary particle diameter of the particles (metal oxide particles or metal particles) is preferably 1 to 200 nm, and more preferably 3 to 80 nm, from the viewpoint of transparency. The average primary particle diameter of a particle is calculated by measuring the particle diameters of 200 arbitrary particles using an electron microscope and taking the arithmetic mean of the measurement results. If the particle is not spherical, the longest side is used as the particle diameter. Specifically, the metal oxide particles are preferably at least one selected from the group consisting of zirconium oxide particles (ZrO2 particles), Nb2O5 particles, titanium oxide particles (TiO2 particles), silicon dioxide particles (SiO2 particles), and composite particles thereof. Among these, at least one selected from the group consisting of zirconium oxide particles and titanium oxide particles is more preferred as the metal oxide particles, for example, because it is easier to adjust the refractive index of the high refractive index layer to 1.6 or higher.

[0199] If the high refractive index layer contains metal oxide particles, the high refractive index layer may contain only one type of metal oxide particle, or it may contain two or more types.

[0200] The content of particles (metal oxide particles or metal particles) is preferably 1 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 40 to 85% by mass, relative to the total mass of the high refractive index layer, in order to improve the concealment of objects to be concealed, such as electrode patterns, and effectively improve the visibility of the objects to be concealed. When titanium oxide is used as the metal oxide particles, the titanium oxide particle content is preferably 1 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 40 to 85% by mass, relative to the total mass of the high refractive index layer.

[0201] Commercially available metal oxide particles include calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F04), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F74), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F75), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT%-F76), zirconium oxide particles (NanoYouth OZ-S30M, manufactured by Nissan Chemical Industries, Ltd.), and zirconium oxide particles (NanoYouth OZ-S30K, manufactured by Nissan Chemical Industries, Ltd.).

[0202] The high refractive index layer preferably contains one or more selected from the group consisting of inorganic particles (metal oxide particles or metal particles) with a refractive index of 1.50 or higher (more preferably 1.55 or higher, even more preferably 1.60 or higher), a resin with a refractive index of 1.50 or higher (more preferably 1.55 or higher, even more preferably 1.60 or higher), and a polymerizable compound with a refractive index of 1.50 or higher (more preferably 1.55 or higher, even more preferably 1.60 or higher). In this embodiment, it is easy to adjust the refractive index of the high refractive index layer to 1.50 or higher (more preferably 1.55 or higher, and especially preferably 1.60 or higher).

[0203] Furthermore, the high refractive index layer preferably contains a binder polymer, a polymerizable monomer, and particles. For the components of the high refractive index layer, refer to the components of the curable transparent resin layer described in paragraphs 0019-0040 and 0144-0150 of Japanese Patent Publication No. 2014-108541, the components of the transparent layer described in paragraphs 0024-0035 and 0110-0112 of Japanese Patent Publication No. 2014-010814, the components of the composition having an ammonium salt described in paragraphs 0034-0056 of International Publication No. 2016 / 009980, and so on.

[0204] Furthermore, it is preferable that the high refractive index layer also contains a metal oxidation inhibitor. When the high refractive index layer contains a metal oxidation inhibitor, the component that comes into direct contact with the high refractive index layer (for example, a conductive component formed on the substrate) can be surface-treated when transferring the high refractive index layer onto the substrate (i.e., the object to be transferred). This surface treatment imparts a metal oxidation inhibitory function (protective properties) to the component that comes into direct contact with the high refractive index layer.

[0205] The metal oxidation inhibitor is preferably a compound having an aromatic ring containing a nitrogen atom. The compound having an aromatic ring containing a nitrogen atom may have substituents. The aromatic ring containing a nitrogen atom is preferably an imidazole ring, a triazole ring, a tetrazole ring, a thiazole ring, a thiadiazole ring, or a fused ring of any one of these with another aromatic ring, and more preferably an imidazole ring, a triazole ring, a tetrazole ring, or a fused ring of any one of these with another aromatic ring. The "other aromatic rings" that form the fused ring may be monocyclic or heterocyclic, but monocyclic rings are preferred, benzene rings or naphthalene rings are more preferred, and benzene rings are even more preferred.

[0206] Preferred metal oxidation inhibitors include imidazole, benzimidazole, tetrazole, 5-amino-1H-tetrazole, mercaptothiadiazole, or benzotriazole, with imidazole, benzimidazole, 5-amino-1H-tetrazole, or benzotriazole being more preferred. As the metal oxidation inhibitor, a commercially available product may be used. As the commercially available product, for example, BT120 manufactured by Johoku Chemical Industry Co., Ltd. containing benzotriazole can be preferably used.

[0207] When the high refractive index layer contains a metal oxidation inhibitor, the content of the metal oxidation inhibitor is preferably 0.1 to 20% by mass, more preferably 0.5 to 10% by mass, and still more preferably 1 to 5% by mass with respect to the total solid content of the high refractive index layer.

[0208] The high refractive index layer may contain other components other than the above-described components. Examples of the other components that the high refractive index layer may contain include the same components as the other components that the photosensitive layer may contain. The high refractive index layer preferably contains a surfactant.

[0209] The method for forming the high refractive index layer is not particularly limited. Examples of the method for forming the high refractive index layer include a method of applying a composition for forming a high refractive index layer in a form containing an aqueous solvent onto the above-described photosensitive layer formed on a temporary support and drying it as necessary.

[0210] The composition for forming a high refractive index layer may contain each component of the high refractive index layer described above. The composition for forming a high refractive index layer contains, for example, a binder polymer, a polymerizable monomer, particles, and an aqueous solvent. Also, as the composition for forming a high refractive index layer, a composition having an ammonium salt described in paragraphs 0034 to 0056 of International Publication No. 2016 / 009980 is also preferable.

[0211] The photosensitive layer and the high refractive index layer are preferably achromatic. Specifically, the total reflection (incident angle 8°, light source: D-65 (2° field of view)) is in the CIE1976 (L * , a * , b * ) color space, and the L * value is preferably 10 to 90, the a * value is preferably -1.0 to 1.0, and the b *The value is preferably between -1.0 and 1.0.

[0212] <<Other layers>> The transfer film may include other layers besides the layer described above (hereinafter also referred to as "other layers"). Examples of other layers include an intermediate layer and a thermoplastic resin layer, and known ones can be used as appropriate.

[0213] Preferred embodiments of the thermoplastic resin layer are described in paragraphs 0189 to 0193 of Japanese Patent Application Publication No. 2014-085643, and preferred embodiments of other layers not mentioned above are described in paragraphs 0194 to 0196 of the same publication, the contents of which are incorporated herein by reference.

[0214] <<<<Manufacturing method for transfer film>>> The method for manufacturing the transfer film is not particularly limited, and known manufacturing methods can be applied. A method for manufacturing a transfer film preferably includes a step of forming a photosensitive layer by coating and drying a photosensitive material containing a solvent onto a temporary support, and more preferably includes a step of placing a cover film on the photosensitive layer after the step of forming the photosensitive layer. Furthermore, after the step of forming the photosensitive layer, the process may further include a step of forming a high refractive index layer by applying and drying a high refractive index layer-forming composition. In this case, it is more preferable to further include a step of placing a cover film on the high refractive index layer after the step of forming the high refractive index layer.

[0215] [Pattern formation method] It is also preferable to perform pattern formation using the transfer film of the present invention. The method of forming a pattern using the transfer film of the present invention will hereinafter also be referred to as the pattern forming method of the present invention. The pattern formation method of the present invention is not particularly limited as long as it uses the transfer film described above, but it is preferable to include in this order the steps of forming a photosensitive layer on a substrate, pattern exposure of the photosensitive layer, and development (alkaline development or organic solvent development) of the exposed photosensitive layer. If the development is organic solvent development, it is preferable to include a step of further exposure of the obtained pattern. Specific embodiments of the pattern forming method of the present invention include the pattern forming methods of Embodiment 1 and Embodiment 2 described below. The following describes in detail each step of the pattern formation method of Embodiment 1 and Embodiment 2.

[0216] [Pattern formation method of Embodiment 1] The pattern formation method of Embodiment 1 comprises steps X1 to X3. Step X2 below corresponds to a step in which the content of acid groups derived from compound A in the photosensitive layer is reduced by exposure. However, if the developer in step X3 is an organic solvent-based developer, it is preferable to further include step X4 after step X3. Process X1: A process of bonding the transfer film and the substrate by bringing the surface of the photosensitive layer in the transfer film, opposite to the temporary support side, into contact with the substrate. Process X2: Process of pattern exposure of the photosensitive layer. Step X3: A step in which the photosensitive layer is developed using a developer (e.g., an alkaline developer or an organic solvent-based developer). Process X4: A process in which the pattern formed by development is exposed after the development process of process X3.

[0217] When an alkaline developer is used as the developer in step X3, the photosensitive layer is preferably the photosensitive layer of Embodiment X-1-a1 and Embodiment X-1-a2. When an organic solvent-based developer is used as the developer in step X3, the photosensitive layer is preferably the photosensitive material of Embodiment X-1-a1. The pattern formation method of Embodiment 1 is preferably applied to a transfer film containing the photosensitive layer of Embodiments X-1-a1 and X-1-a2 described above.

[0218] Furthermore, the pattern forming method of Embodiment 1 preferably includes a step of peeling off the temporary support between step X1 and step X2, or between step X2 and step X3.

[0219] <<<Process X1>>> The pattern formation method of Embodiment 1 includes the step of bringing the surface of the photosensitive layer in the transfer film, opposite to the temporary support side, into contact with the substrate, thereby bonding the transfer film and the substrate together.

[0220] <<Base material>> The substrate is not particularly limited and includes, for example, glass substrates, silicon substrates, and resin substrates, as well as substrates having a conductive layer. Examples of substrates that include a conductive layer include glass substrates, silicon substrates, and resin substrates. The above-mentioned substrate is preferably transparent. The refractive index of the above-mentioned substrate is preferably 1.50 to 1.52. The above substrate may be composed of a light-transmitting substrate such as a glass substrate, and tempered glass such as Corning's Gorilla Glass can also be used. Furthermore, as materials included in the above substrate, materials used in Japanese Patent Publication No. 2010-086684, Japanese Patent Publication No. 2010-152809, and Japanese Patent Publication No. 2010-257492 are also preferred. When the above-mentioned substrate includes a resin substrate, it is more preferable to use a resin film with low optical distortion and / or high transparency as the resin substrate. Specific materials include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetylcellulose, and cycloolefin polymers.

[0221] As for the substrate containing the conductive layer, a resin substrate is preferred, and a resin film is more preferred, given that it is manufactured using a roll-to-roll method.

[0222] Examples of conductive layers include any conductive layer used in general circuit wiring or touch panel wiring. As the conductive layer, from the viewpoint of conductivity and fine wire formation, one or more layers selected from the group consisting of a metal layer (metal foil, etc.), a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer are preferred, with a metal layer being more preferred, and a copper layer or a silver layer being even more preferred. Furthermore, the conductive layer in the substrate having a conductive layer may be one layer or two or more layers. When a substrate having a conductive layer includes two or more conductive layers, it is preferable that each conductive layer be made of a different material. Examples of materials for the conductive layer include elemental metals and conductive metal oxides. Examples of elemental metals include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag, and Au. Examples of conductive metal oxides include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO2. Note that "conductivity" refers to a volume resistivity of 1 × 10⁻⁶. 6 This means that the volume resistivity is less than Ωcm, and the volume resistivity is 1 × 10⁻⁶. 4 A value of less than Ωcm is preferable.

[0223] When a substrate having conductive layers contains two or more conductive layers, it is preferable that at least one of the conductive layers contains a conductive metal oxide. The conductive layer is preferably an electrode pattern corresponding to the sensor in the viewing area used in a capacitive touch panel, or wiring in the peripheral extraction area. Furthermore, the conductive layer is preferably a transparent layer.

[0224] <<Steps for Process X1>> Step X1 is preferably a bonding process involving pressure and heat using a roll or the like. Known laminators such as laminators, vacuum laminators, and auto-cut laminators can be used for bonding. Process X1 is preferably carried out using a roll-to-roll method, and therefore, the substrate to which the transfer film is to be bonded is preferably a resin film or a resin film having a conductive layer. The roll-to-roll method will be explained below. The roll-to-roll method refers to a method in which a base material that can be wound up and unwound is used as the base material, and the method includes a step of unwinding the base material (also called the "unwinding step") before any of the steps included in the pattern forming method of the present invention, and a step of winding the base material (also called the "winding step") after any of the steps, and at least one of the steps (preferably all of the steps, or all of the steps except the heating step) is performed while the base material is being transported. The unwinding method in the unwinding process and the winding method in the winding process are not particularly limited, and any known method in a manufacturing method that applies a roll-to-roll system may be used.

[0225] <<Process X2>> The pattern formation method of Embodiment 1 includes a step (step X2) of pattern exposure of the photosensitive layer after step X1. Step X2 corresponds to a step of reducing the content of acid groups derived from compound A in the photosensitive layer by exposure. More specifically, it is preferable to pattern expose the photosensitive layer using light of a wavelength that excites a specific structure S0 (preferably specific structure S1) (in the case of requirement V01) in compound β (preferably compound B) in the photosensitive layer and a specific structure S0 (preferably specific structure S1) (in the case of requirement W01) in compound A.

[0226] In the exposure process, the detailed arrangement and specific size of the pattern are not particularly limited. For example, when applying the pattern formation method of Embodiment 1 to the manufacture of circuit wiring, in order to improve the display quality of a display device (e.g., a touch panel) equipped with an input device having circuit wiring manufactured by the pattern formation method of Embodiment 1, and to minimize the area occupied by the output wiring, it is preferable that at least a portion of the pattern (particularly the portion corresponding to the electrode pattern and output wiring of the touch panel) be fine lines of 100 μm or less, and more preferably fine lines of 70 μm or less.

[0227] As the light source used for exposure, any light source can be appropriately selected as long as it irradiates light in a wavelength range capable of reducing the content of acid groups derived from Compound A in the photosensitive layer (light having a wavelength that excites a specific structure S0 (preferably specific structure S1) in Compound β (preferably Compound B) in the photosensitive layer (in the case of Requirement V01) and a specific structure S0 (preferably specific structure S1) in Compound A (in the case of Requirement W01). For example, when the photosensitive layer is the above-described photosensitive layer, light in wavelength ranges such as 254 nm, 313 nm, 365 nm, 405 nm, etc. can be mentioned.). Specifically, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, an LED (Light Emitting Diode), and the like can be mentioned.

[0228] The exposure amount is preferably 10 to 10,000 mJ / cm 2 and more preferably 50 to 3,000 mJ / cm 2 is even more preferable.

[0229] In Step X2, after peeling the temporary support from the photosensitive layer, pattern exposure may be performed, or before peeling the temporary support, pattern exposure may be performed through the temporary support, and then the temporary support may be peeled off. In order to prevent mask contamination due to contact between the photosensitive layer and the mask and avoid the influence on exposure caused by foreign matter adhering to the mask, it is preferable to perform pattern exposure without peeling the temporary support. Note that the pattern exposure may be exposure through a mask or direct exposure using a laser or the like. Before Step X3 described later, the temporary support is peeled from the photosensitive layer.

[0230] <<Step X3>> The pattern forming method of Embodiment 1 includes a step (Step X3) of developing the pattern-exposed photosensitive layer using a developer (an alkaline developer or an organic solvent-based developer). After step X2, the photosensitive layer exhibits a difference in solubility in the developer between the exposed and unexposed areas (dissolution contrast) due to a decrease in the acid group content in the photosensitive layer in the exposed areas. The formation of this dissolution contrast in the photosensitive layer enables the formation of a pattern in step X3. If the developer in step X3 is an alkaline developer, the unexposed areas are removed and a negative pattern is formed. On the other hand, if the developer in step X3 is an organic solvent-based developer, the exposed areas are removed and a positive pattern is formed. The resulting positive pattern needs to be subjected to a process in step X4, described later, to reduce the acid group content derived from compound A.

[0231] (Alkaline developer) As for the alkaline developer, there are no particular restrictions as long as it can remove the unexposed parts of the photosensitive resin layer. For example, known developers such as the developer described in Japanese Patent Publication No. 5-072724 can be used. As the alkaline developer, for example, an alkaline aqueous solution containing a compound with a pKa of 7 to 13 at a concentration of 0.05 to 5 mol / L (liter) is preferred. Furthermore, the alkaline developer may also contain a water-soluble organic solvent and a surfactant. As the alkaline developer, for example, the developer described in paragraph 0194 of International Publication No. 2015 / 093271 is preferred. The water concentration in the alkaline developer is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 85% by mass or more, particularly preferably 90% by mass or more, and most preferably 95% by mass or more. The upper limit is, for example, less than 100% by mass.

[0232] (Organic solvent-based developer) As for the organic solvent-based developer, there are no particular restrictions as long as it can remove the exposed areas of the photosensitive resin layer. For example, developers containing organic solvents such as ketone solvents, ester solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents can be used. In organic solvent-based developers, multiple organic solvents may be mixed, or they may be mixed with other organic solvents or water. However, in order to fully achieve the effects of the present invention, it is preferable that the water content of the organic solvent-based developer as a whole be less than 10% by mass, and more preferably that it contains substantially no water. The concentration of the organic solvent (total in the case of a mixture of multiple solvents) in the organic solvent-based developer is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 85% by mass or more, particularly preferably 90% by mass or more, and most preferably 95% by mass or more. The upper limit is, for example, 100% by mass or less.

[0233] There are no particular restrictions on the development method; any of paddle development, shower development, spin development, and dip development may be used. In shower development, unwanted parts can be removed by spraying the developer solution onto the photosensitive resin layer after exposure. Alternatively, after development, it is preferable to spray a cleaning agent or the like onto the surface with a shower and remove the development residue by scrubbing with a brush or the like. The developer solution temperature is preferably 20 to 40°C.

[0234] The pattern formation method of Embodiment 1 may or may not further include a post-bake step in which the pattern, which includes the photosensitive layer obtained by development, is heat-treated. Post-baking is preferably carried out in an environment of 8.1 to 121.6 kPa, and more preferably in an environment of 50.66 kPa or higher. On the other hand, it is more preferably carried out in an environment of 111.46 kPa or lower, and even more preferably in an environment of 101.3 kPa or lower. The post-bake temperature is preferably 80-250°C, more preferably 110-170°C, and even more preferably 130-150°C. The post-bake time is preferably 1 to 60 minutes, more preferably 2 to 50 minutes, and even more preferably 5 to 40 minutes. Post-baking can be performed in an air environment or in a nitrogen-purged environment.

[0235] <<Process X4>> If the developer in step X3 is an organic solvent-based developer, step X4 is performed on the obtained positive pattern. Step X4 is a step in which the positive pattern obtained in step X3 is exposed to light to reduce the content of acid groups derived from compound A. More specifically, it is preferable to pattern expose the photosensitive layer using light of a wavelength that excites a specific structure S0 (preferably specific structure S1) (in the case of requirement V01) in compound β (preferably compound B) in the photosensitive layer and a specific structure S0 (preferably specific structure S1) (in the case of requirement W01) in compound A.

[0236] The light source and exposure amount used for exposure are the same as those described in step X1, and the preferred embodiment is also the same.

[0237] [Pattern formation method of Embodiment 2] The pattern forming method of Embodiment 2 comprises steps Y1, Y2P, and Y3 in that order, and further includes step Y2Q (a step of further exposing the photosensitive layer exposed in step Y2P) between step Y2P and step Y3, or after step Y3. Step Y1: A step in which the surface of the photosensitive layer in the transfer film opposite to the temporary support side is brought into contact with the substrate, thereby bonding the transfer film and the substrate. Process Y2P: The process of exposing the photosensitive layer. Step Y3: The process of developing the photosensitive layer using a developer.

[0238] As described above, the pattern formation method of Embodiment 2 corresponds to an embodiment applicable when the photosensitive layer further includes a photopolymerization initiator and a polymerizable compound. Therefore, the pattern formation method of Embodiment 2 is preferably applied to a transfer film containing the photosensitive layer of Embodiment X-1-a3 described above. The pattern formation method of Embodiment 2 will be described below, but steps Y1 and Y3 are the same as steps X1 and X3, respectively, and will not be explained. Furthermore, process Y3 only needs to be performed at least after process Y2P, and process Y3 may be performed between process Y2P and process Y2Q. The pattern formation method of Embodiment 2 may or may not include a post-bake step after step Y3, in which the pattern including the photosensitive layer obtained by development is further heat-treated. The post-bake step can be carried out in the same manner as the post-bake step that may be included in the pattern formation method of Embodiment 1 described above. If step Y3 is carried out between step Y2P and step Y2Q, the post-bake step may be carried out before step Y2Q or after step Y2Q, as long as it is carried out after step Y3.

[0239] Furthermore, the pattern formation method of Embodiment 2 preferably includes a step of peeling off the temporary support between step Y1 and step Y2P, or between step Y2P and step Y3.

[0240] <<Process Y2P, Process Y2Q>> The pattern formation method of Embodiment 2 includes a step of exposing the photosensitive layer that has gone through step Y1 (step Y2P) and a step of further exposing the exposed photosensitive layer (step Y2Q). One of the exposure processes (steps Y2P and Y2Q) is primarily for reducing the content of acid groups derived from compound A, while the other of the exposure processes (steps Y2P and Y2Q) is primarily for inducing a polymerization reaction of the polymerizable compound based on the photopolymerization initiator. Furthermore, the exposure processes (steps Y2P and Y2Q) may be either full-surface exposure or pattern exposure, but one of the exposure processes is pattern exposure. For example, if step Y2P is a pattern exposure to reduce the content of acid groups derived from compound A by exposure, the developer used in step Y3 may be an alkaline developer or an organic solvent-based developer. However, when developing with an organic solvent-based developer, step Y2Q is usually performed after step Y3, and a polymerization reaction of polymerizable compounds based on a photopolymerization initiator occurs in the developed photosensitive layer (pattern), and the content of acid groups (preferably carboxyl groups) derived from compound A is reduced. Furthermore, for example, if step Y2P is a pattern exposure to induce a polymerization reaction of a polymerizable compound based on a photopolymerization initiator, the developer used in step Y3 is usually an alkaline developer. In this case, step Y2Q may be performed either before or after step Y3, and if step Y2Q is performed before step Y3, it is usually a pattern exposure.

[0241] In steps Y2P and Y2Q, the light source used for exposure can be appropriately selected as long as it emits light in a wavelength range capable of reducing the content of acid groups derived from compound A in the photosensitive layer (light with wavelengths that excite specific structures S0 (preferably specific structure S1) in compound β (preferably compound B) in the photosensitive layer (in the case of requirement V01) and specific structures S0 (preferably specific structure S1) in compound A (in the case of requirement W01). For example, if the photosensitive layer is the above-mentioned photosensitive layer, this includes light in wavelength ranges such as 254 nm, 313 nm, 365 nm, and 405 nm), or light in a wavelength range capable of causing a reaction of polymerizable compounds based on the photopolymerization initiator in the photosensitive layer (light with wavelengths that expose the photopolymerization initiator. For example, 254 nm, 313 nm, 365 nm, and 405 nm). Specifically, this includes ultra-high pressure mercury lamps, high-pressure mercury lamps, metal halide lamps, and LEDs (Light Emitting Diodes).

[0242] In exposure to reduce the content of acidic groups derived from compound A in the photosensitive layer, the exposure dose is 10 to 10,000 mJ / cm². 2 Preferably, 50-3000 mJ / cm² 2 This is preferable. In exposure to induce a reaction of polymerizable compounds based on a photopolymerization initiator in the photosensitive layer, the exposure dose is 5-200 mJ / cm². 2 Preferably, 10-150 mJ / cm² 2 This is preferable.

[0243] In steps Y2P and Y2Q, pattern exposure may be performed after peeling the temporary support from the photosensitive layer, or pattern exposure may be performed through the temporary support before peeling it off, and then the temporary support may be peeled off. To prevent mask contamination due to contact between the photosensitive layer and the mask, and to avoid the influence of foreign matter adhering to the mask on the exposure, it is preferable to perform pattern exposure without peeling off the temporary support. Pattern exposure may be performed through the mask, or by direct exposure using a laser or the like.

[0244] In the exposure process, the detailed arrangement and specific size of the pattern are not particularly limited. For example, when applying the pattern formation method of Embodiment 2 to the manufacture of circuit wiring, in order to improve the display quality of a display device (e.g., a touch panel) equipped with an input device having circuit wiring manufactured by the pattern formation method of Embodiment 2, and to minimize the area occupied by the output wiring, it is preferable that at least a portion of the pattern (particularly the portion corresponding to the electrode pattern and output wiring of the touch panel) be fine lines of 100 μm or less, and more preferably fine lines of 70 μm or less.

[0245] [Preferred Embodiment] As a pattern formation method, it is also preferable to have steps Y1, Y2A, and Y3 in this order. Furthermore, it is also preferable to have step Y2B after step Y3 in this order. It is also preferable that one of steps Y2A and Y2B is an exposure step to reduce the content of acid groups derived from compound A by exposure, and the other is an exposure step to induce a polymerization reaction of a polymerizable compound based on a photopolymerization initiator. Step Y1: A step in which the surface of the photosensitive layer in the transfer film opposite to the temporary support side is brought into contact with the substrate, thereby bonding the transfer film and the substrate. Process Y2A: Process of pattern exposure of the photosensitive layer. Step Y3: A step in which the photosensitive layer is developed using an alkaline developer to form a pattern. Process Y2B: A process to expose the pattern obtained in process Y3.

[0246] Furthermore, it is preferable that the above pattern forming method includes a step of peeling off the temporary support between step Y1 and step Y2A, or between step Y2A and step Y3.

[0247] The above step Y2A is preferably an exposure step to induce a polymerization reaction of a polymerizable compound based on a photopolymerization initiator, and the above step Y2B is preferably an exposure step to reduce the content of acid groups derived from compound A by exposure.

[0248] [Optional steps that the pattern forming method may include] The pattern forming method (Embodiment 1, Embodiment 2, or the pattern forming method of the preferred embodiment described above) may include any other steps (other steps) not described above. For example, the following steps are possible, but the method is not limited to these steps.

[0249] <<Cover film removal process>> The above pattern forming method preferably includes a step of peeling off the cover film from the transfer film (hereinafter also referred to as the "cover film peeling step") if the transfer film has a cover film. The method of peeling off the cover film is not particularly limited, and known methods can be applied.

[0250] <<Process to reduce visible light reflectance>> If the substrate is a substrate having a conductive layer, the pattern formation method may further include a step of performing a treatment to reduce the visible light reflectance of the conductive layer. If the substrate is a substrate having multiple conductive layers, the treatment to reduce the visible light reflectance may be performed on some of the conductive layers or on all of the conductive layers. One treatment that reduces visible light reflectivity is oxidation. For example, oxidizing copper to form copper oxide causes it to blacken, thereby reducing the visible light reflectivity of the conductive layer. Preferred embodiments of a treatment for reducing visible light reflectance are described in paragraphs 0017 to 0025 of Japanese Patent Application Publication No. 2014-150118 and in paragraphs 0041, 0042, 0048 and 0058 of Japanese Patent Application Publication No. 2013-206315, the contents of which are incorporated herein by reference.

[0251] <<Etching Process>> If the substrate is a substrate having a conductive layer, the pattern formation method preferably includes a step (etching step) in which the pattern formed by step X3 (or step X4) and step Y3 (or step Y2B) is used as an etching resist film, and the conductive layer in areas where this etching resist film is not present is etched. As for the etching process, methods such as the wet etching method described in paragraphs 0048 to 0054 of Japanese Patent Publication No. 2010-152155, and known dry etching methods such as plasma etching can be applied.

[0252] For example, a commonly used etching method is the wet etching method, which involves immersion in an etching solution. The etching solution used in wet etching can be appropriately selected from either an acidic or alkaline type depending on the object being etched. Examples of acidic etching solutions include aqueous solutions of acidic components alone, such as hydrochloric acid, sulfuric acid, hydrofluoric acid, and phosphoric acid, as well as aqueous solutions of acidic components mixed with salts such as ferric chloride, ammonium fluoride, or potassium permanganate. The acidic component may be a combination of multiple acidic components. Examples of alkaline etching solutions include aqueous solutions of alkaline components alone, such as sodium hydroxide, potassium hydroxide, ammonia, organic amines, and salts of organic amines such as tetramethylammonium hydroxide, as well as aqueous solutions of mixed alkaline components with salts such as potassium permanganate. Multiple alkaline components may also be used as the alkaline component.

[0253] The temperature of the etching solution is not particularly limited, but 45°C or lower is preferred. In the circuit wiring manufacturing method of the present invention, the pattern formed by steps X3 (or X4) and Y3 (or Y2B), which is used as an etching resist film, preferably exhibits particularly excellent resistance to acidic and alkaline etching solutions in the temperature range of 45°C or lower. With the above configuration, peeling of the etching resist film during the etching process is prevented, and areas where the etching resist film is absent are selectively etched. After the etching process, a cleaning process to wash the etched substrate and a drying process to dry the washed substrate may be performed as needed to prevent contamination of the process line.

[0254] <<Other Embodiments>> In the pattern formation method described above, it is also preferable to use a substrate having multiple conductive layers on both surfaces, and to form patterns sequentially or simultaneously on the conductive layers formed on both surfaces. With this configuration, a first conductive pattern can be formed on one surface of the substrate, and a second conductive pattern on the other surface. Forming from both sides of the substrate using a roll-to-roll method is also preferable.

[0255] 〔pattern〕 The patterns formed by the pattern forming methods of Embodiment 1 and Embodiment 2 described above have a reduced acid group content, resulting in low polarity, low moisture permeability, and low dielectric constant. The acid group content in the above pattern is preferably reduced by 5 mol% or more, more preferably by 10 mol% or more, even more preferably by 20 mol% or more, even more preferably by 31 mol% or more, particularly preferably by 40 mol% or more, particularly more preferably by 51 mol% or more, and most preferably by 71 mol% or more, relative to the acid group content in the photosensitive layer formed in step X1 or step Y1. There is no particular upper limit, but for example, it is 100 mol% or less. The moisture permeability of the above pattern is preferably reduced by 5% or more, more preferably by 10% or more, and even more preferably by 20% or more, compared to the moisture permeability of the photosensitive layer formed in step X1 or step Y1. There is no particular upper limit, but for example, it should be 100% or less. The dielectric constant of the above pattern is preferably reduced by 5% or more, more preferably by 10% or more, and even more preferably by 15% or more, compared to the dielectric constant of the photosensitive layer formed in step X1 or step Y1. There is no particular upper limit, but for example, it is 100% or less.

[0256] The average thickness of the pattern formed by the pattern forming method described above is preferably 0.5 to 20 μm. More preferably, the average thickness of the pattern is 0.8 to 15 μm, and even more preferably 1.0 to 10 μm.

[0257] The pattern formed by the pattern formation method described above is preferably achromatic. Specifically, total internal reflection (incident angle 8°, light source: D-65 (2° field of view)) is CIE1976(L * a * , b * ) In the color space, the L of the pattern * The value is preferably between 10 and 90, and pattern a * The value is preferably between -1.0 and 1.0, and pattern b * The value is preferably between -1.0 and 1.0.

[0258] The patterns formed by the pattern formation method described above are not particularly limited in their applications and can be used as various protective films or insulating films. Specifically, applications include use as a protective film (permanent film) to protect conductive patterns, as an interlayer insulating film between conductive patterns, and as an etching resist film during the manufacture of circuit wiring. Since the above patterns have excellent low moisture permeability, their use as a protective film (permanent film) to protect conductive patterns or as an interlayer insulating film between conductive patterns is particularly preferred. Furthermore, the above pattern can be used, for example, as a protective film (permanent film) or as an interlayer insulating film between conductive patterns to protect conductive patterns such as electrode patterns corresponding to sensors in the viewing area, peripheral wiring, and wiring in the output wiring area, which are provided inside a touch panel.

[0259] [Method of manufacturing circuit wiring] It is also preferable to manufacture circuit wiring using the transfer film of the present invention. The method for manufacturing circuit wiring using the transfer film of the present invention will hereinafter also be referred to as the method for manufacturing circuit wiring of the present invention. The method for manufacturing circuit wiring of the present invention is not particularly limited as long as it uses the transfer film described above. However, it is preferable that the method includes, in this order: a step of bonding the transfer film and the substrate having a conductive layer by bringing the surface of the photosensitive layer in the transfer film opposite to the temporary support side into contact with the conductive layer in the substrate having a conductive layer (bonding step); a step of pattern exposure of the photosensitive layer on the bonded transfer film (first exposure step); a step of developing the exposed photosensitive layer with an alkaline developer to form a patterned etching resist film (etching resist film formation step); and a step of etching the conductive layer in areas where the etching resist film is not placed (etching step). Furthermore, it is preferable that the etching resist film formation step includes a step of developing the exposed photosensitive layer obtained through the first exposure step with an alkaline developer to form a pattern (alkaline development step); and a step of exposing the obtained pattern to form an etching resist film (second exposure step). In the circuit wiring manufacturing method of the present invention, the bonding step, the first exposure step, the alkali development step, and the second exposure step can all be carried out in the same procedure as steps Y1, Y2A, Y3, and Y2B of the pattern formation method of Embodiment 2 described above. The etching resist film formation step may also be carried out in the same procedure as step Y3. Furthermore, the substrate having a conductive layer used in the circuit wiring manufacturing method of the present invention is the same as the substrate having a conductive layer used in step X1 described above. In addition, the circuit wiring manufacturing method of the present invention may have other steps other than those described above. Other steps include any steps that may be included in the pattern formation methods of the first and second embodiments.

[0260] The present invention also preferably involves a method for manufacturing circuit wiring in which the steps from the bonding step to the etching step are considered as one set and repeated multiple times. The film used as an etching resist can also be used as a protective film (permanent film) for the formed circuit wiring.

[0261] [Manufacturing method for touch panels] It is also preferable to manufacture touch panels using the transfer film of the present invention. The method for manufacturing a touch panel using the transfer film of the present invention will hereinafter also be referred to as the method for manufacturing a touch panel of the present invention. The method for manufacturing a touch panel according to the present invention is not particularly limited as long as it uses the transfer film described above, The process preferably includes, in this order: a step of bonding the transfer film and the substrate having a conductive layer (bonding step) by bringing the surface of the photosensitive layer in the transfer film opposite to the temporary support side into contact with a conductive layer in a substrate having a conductive layer (preferably a patterned conductive layer, specifically a conductive pattern such as a touch panel electrode pattern or wiring); a step of pattern exposure of the photosensitive layer on the bonded transfer film (first exposure step); and a step of developing the exposed photosensitive layer with an alkaline developer to form a patterned protective film or insulating film on the conductive layer (protective film or insulating film formation step). Furthermore, the protective film or insulating film formation step preferably includes a step of developing the exposed photosensitive layer obtained through the first exposure step with an alkaline developer to form a pattern (alkaline development step); and a step of exposing the obtained pattern to form a protective film or insulating film on the conductive layer (second exposure step). The protective film functions as a film that protects the surface of the conductive layer. The insulating film also functions as an interlayer insulating film between conductive layers. When forming the insulating film of the conductive layer, the manufacturing method of the touch panel of the present invention preferably further includes a step of forming a conductive layer (preferably a patterned conductive layer, specifically a conductive pattern such as a touch panel electrode pattern or wiring) on ​​the formed insulating film. In the method for manufacturing a touch panel of the present invention, the bonding step, the first exposure step, the alkali development step, and the second exposure step can all be carried out in the same manner as steps Y1, Y2A, Y3, and Y2B of the pattern formation method of Embodiment 2 described above. The protective film or insulating film formation step may be carried out in the same manner as step Y3. Furthermore, the substrate having a conductive layer used in the method for manufacturing a touch panel of the present invention is the same as the substrate having a conductive layer used in step X1 described above. Other steps include any steps that may be included in the pattern formation methods of the first and second embodiments.

[0262] For the manufacturing method of the touch panel of the present invention, configurations other than those described above can be referenced from known methods for manufacturing touch panels.

[0263] A touch panel manufactured by the method for manufacturing a touch panel of the present invention preferably comprises a transparent substrate, electrodes, and a protective layer (protective film). The detection method for the above-mentioned touch panel may be any known method, such as resistive touch, capacitive touch, ultrasonic touch, electromagnetic induction touch, or optical touch. Among these, the capacitive touch method is preferred. Examples of touch panel types include the so-called in-cell type (for example, those described in Figures 5, 6, 7, and 8 of Japanese Patent Publication No. 2012-517051), the so-called on-cell type (for example, those described in Figure 19 of Japanese Patent Application Publication No. 2013-168125 and Figures 1 and 5 of Japanese Patent Application Publication No. 2012-089102), OGS (One Glass Solution) type, TOL (Touch-on-Lens) type (for example, those described in Figure 2 of Japanese Patent Application Publication No. 2013-054727), other configurations (for example, those described in Figure 6 of Japanese Patent Application Publication No. 2013-164871), and various out-cell types (so-called GG, G1·G2, GFF, GF2, GF1, G1F, etc.). [Examples]

[0264] The present invention will be described in more detail below with reference to examples. The materials, amounts used, proportions, processing content, and processing procedures shown in the following examples can be modified as appropriate without departing from the spirit of this disclosure. Therefore, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, "parts" and "%" are based on mass. In the following examples, the weight-average molecular weight of the resin is the weight-average molecular weight obtained by gel permeation chromatography (GPC) on a polystyrene basis.

[0265] In the following examples, unless otherwise specified, the high-pressure mercury lamp used was the H03-L31 manufactured by I-Graphics Co., Ltd. This high-pressure mercury lamp has a dominant wavelength of 365 nm and strong line spectra at 254 nm, 313 nm, 405 nm, and 436 nm. Also, unless otherwise specified, the ultra-high-pressure mercury lamp used was the USH-2004MB manufactured by USHIO Electric Co., Ltd. This ultra-high-pressure mercury lamp has a strong line spectrum at 313 nm, 365 nm, 405 nm, and 436 nm. For the proximity-type exposure system equipped with an ultra-high-pressure mercury lamp, we used a product from Hitachi High-Tech Electronics Engineering Co., Ltd. For the ultraviolet irradiation device equipped with a high-pressure mercury lamp, we used an ultraviolet irradiation conveyor system manufactured by I-Graphics Co., Ltd.

[0266] [Transfer film] Photosensitive materials were prepared according to the procedure shown below, and the transfer films for Examples 1 to 14 and Comparative Examples 1 to 7 were prepared using the obtained photosensitive materials.

[0267] [Preparation of photosensitive materials] The components were mixed and stirred according to the formulations described in the "Formulation of Photosensitive Material" column in the table shown below to obtain the photosensitive material to be used in each example or comparative example.

[0268] [Preparation of transfer film] A 16 μm thick polyethylene terephthalate film (Toray Industries, Ltd., 16KS40 (16QS62)) (temporary support) was coated with the photosensitive material of each example or comparative example using a slit nozzle, and dried at 100°C for 2 minutes to form a photosensitive layer. The amount of photosensitive material applied was adjusted to match the value shown in the "Film Thickness (μm)" column of the table below. A 16 μm thick polyethylene terephthalate film (Toray Industries, Ltd., 16KS40 (16QS62)) (cover film) was pressed onto the obtained photosensitive layer to prepare transfer films for each example and comparative example.

[0269] [Measurement X, Measurement Y] Using the transfer films obtained for each example and comparative example, measurements X and Y were performed using the method described in the specification, and the values ​​of X and Y were determined for each transfer film of each example and comparative example. For measurement X, Fujifilm's TG60UL was used as the substrate. For measurement Y, the substrate used was CosmoShine A4300 (double-sided easy-adhesion type, no front or back side) manufactured by Toyobo Industries Ltd., cut into a film having a 3.5 cm side along the TD direction and a 23.0 cm side along the MD direction.

[0270] [test] The transfer films of each example and comparative example were evaluated by performing the following tests.

[0271] [Evaluation of resistance to bending and moist heat] The following steps were performed in order from top to bottom to evaluate the curvature and heat resistance of the transfer film being evaluated. Step I: The cover film was peeled off the transfer film. Step II: The photosensitive layer side of the transfer film was brought into contact with the surface of the copper foil on the copper substrate and laminated to obtain a laminate. The copper substrate mentioned above is a polyethylene terephthalate film (manufactured by Geomatec) with copper foil laminated on it. The lamination was performed under the following conditions: linear pressure of 3 N / cm, lamination temperature of 100°C, and transport speed of 4 m / min. Step III: The photosensitive layer of the laminate is exposed from the temporary support side using a proximity exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) equipped with an ultra-high pressure mercury lamp, and the cumulative exposure amount measured with a 365 nm illuminometer is 80 mJ / cm². 2 The exposure was performed in such a way that it resulted in the following. Step IV: Thirty minutes after the above exposure, the temporary support was peeled off the laminate. Step V: Exposure of the photosensitive layer of the laminate to the photosensitive layer side using an ultraviolet irradiation conveyor device (manufactured by iGraphics Co., Ltd.) equipped with a high-pressure mercury lamp, at an exposure dose of 1000 mJ / cm². 2 Post-exposure was performed. Note that the above 1000 mJ / cm 2 Exposure refers to an integrated exposure of 1000 mJ / cm² measured with a 365 nm light meter. 2 This is the resulting exposure. Step VI: With the photosensitive layer (cured film) facing outwards, the laminate was bent to a bending diameter of 6 mm (diameter), and the laminate was left standing in a constant temperature and humidity chamber set to 85°C and 85% RH. The time until discoloration of the copper foil in the copper substrate of the laminate occurred was observed, and the results were classified according to the following categories. Furthermore, the color of the copper foil was observed through the photosensitive layer. A: No discoloration occurs in the copper foil even after 750 hours. B: No discoloration occurred in the copper foil after 500 hours, but discoloration occurred in the copper foil after 750 hours. C: Discoloration has occurred in the copper foil after 500 hours.

[0272] [result] The table below shows the composition of the photosensitive material used in the manufacture of the transfer film used in the test, the thickness of the photosensitive layer of the transfer film, the values ​​of X and Y determined by the measurements X and Y, and the evaluation results. In the table, the "X Moisture Permeability" column shows the value of X determined by the measurement of X. The "Y Bending" column shows the Y value determined by the X measurement. The "Y+5X" column shows the value of Y+5X calculated from the X and Y values ​​obtained for each transfer film. If "Y+5X" is 13.50 or less, equation (XY1) is satisfied.

[0273] [Table 2]

[0274] The abbreviations for the components of the photosensitive materials shown in the table are explained below.

[0275] 〔polymer〕 In the "Type" column of the "Polymer" section, the repeating units of the polymer and the mass ratio of each repeating unit are shown for the polymer used to prepare the photosensitive material of the transfer film in each example or comparative example. • DCPMA: Repeating unit based on dicyclopentanyl methacrylate • AA: Repeating unit based on acrylic acid • AA-GMA: A repeating unit formed by reacting a carboxyl group of an acrylic acid-based repeating unit with glycidyl methacrylate. • St: Repeating unit based on styrene • MAA: Repeating unit based on methacrylic acid • MMA: Repeating unit based on methyl methacrylate • MAA-GMA: A repeating unit formed by reacting glycidyl methacrylate with the carboxyl group of a repeating unit based on methacrylic acid. • IBMA: Repeating unit based on isoboronyl methacrylate CHMA: Repeating unit based on cyclohexyl methacrylate The weight-average molecular weight of the polymer "St / MAA / MMA / MAA-GMA=47.7 / 19 / 1.3 / 32" is 18,000. The weight-average molecular weight of the polymer "CHMA / MAA / MMA / MAA-GMA=55.1 / 14.5 / 1.3 / 29.1" is 27,000. The weight-average molecular weights of the other polymers are all within the range of 11,000 to 49,000. "AA" and "AA-GMA" are different repeating units, and "MAA" and "MAA-GMA" are also different repeating units. Furthermore, the polymer used in the examples corresponds to compound A.

[0276] The following is an example of a polymer synthesis method, specifically the synthesis method for resin X (DCPMA / AA / AA-GMA=68 / 16 / 16).

[0277] 77.2 g of propylene glycol monomethyl ether was placed in a flask and heated to 90°C under a nitrogen stream. To this solution, a solution of dicyclopentanyl methacrylate (manufactured by Showa Denko Materials Co., Ltd.) (89.8 g) and acrylic acid (28.3 g) dissolved in propylene glycol monomethyl ether (30 g), and a solution of polymerization initiator V-601 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) (5.5 g) dissolved in propylene glycol monomethyl ether (30 g) were simultaneously added dropwise over 2 hours. After the dropwise addition was complete, the resulting reaction solution was reacted at 90°C for 1 hour, and then 0.7 g of V-601 was added. The reaction solution was then reacted for a further 3 hours. After that, the reaction solution was diluted with propylene glycol monomethyl ether acetate (60.4 g) and propylene glycol monomethyl ether (26.4 g). Under an airflow, the reaction solution was heated to 100°C, and tetraethylammonium bromide (0.47 g) and p-methoxyphenol (0.23 g) were added. Glycidyl methacrylate (Bremmer G, NOF Corporation) (14.0 g) was added dropwise to the reaction solution over 20 minutes. This reaction solution was allowed to react at 100°C for 7 hours to obtain a resin solution containing resin X. The solid content concentration of the obtained resin solution was 36.3% by mass. The weight-average molecular weight on a standard polystyrene basis in GPC was 15000, the dispersion was 2.2, and the acid value of the polymer was 125 mgKOH / g. The amount of residual monomer measured by gas chromatography was less than 0.1% by mass relative to the polymer solid content for all monomers.

[0278] Other polymers were synthesized similarly by changing the type and amount of monomers used. Although each polymer is synthesized while contained in the resin solution, when using polymers as components of photosensitive materials, only the solid components (polymers) that were present in the resin solution are added as components of the photosensitive material. For example, the photosensitive material used in the transfer films of Examples 1 and 2 contains 100 parts by mass of resin X (DCPMA / AA / AA-GMA=68 / 16 / 16) itself, not 100 parts by mass of the resin solution.

[0279] [Polymerizable compound] • DPHA: Dipenerythritol hexaacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., A-DPH) • A-NOD-N: 1,9-nonanediol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., A-NOD-N) • TMPTA: Trimethylolpropane triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., A-TMPT) • DTMPTA: Ditrimethylolpropanetetraacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD T-1420(T))

[0280] [Photopolymerization initiator] • Irg379: Omnirad 379 (manufactured by IGM Resins BV, an alkylphenone compound) • Oxe02: Irgacure OXE02 (manufactured by BASF, oxime ester compound) The molar extinction coefficient of the substance, acetonitrile, for light at a wavelength of 365 nm is 2700 (cm·mol / L). -1 ) · Api307:(1-(biphenyl-4-yl)-2-methyl-2-morpholinopro Pan-1-ON (manufactured by Shenzhen UV-ChemTech LTD)

[0281] [Surfactants] • F551A: Megafuck F551 (manufactured by DIC Corporation)

[0282] 〔solvent〕 • MEK: Methyl ethyl ketone • PGMEA: Propylene glycol monomethyl ether acetate • MFG: Propylene glycol monomethyl ether

[0283] The results shown in the table confirm that the effects of the present invention can be achieved by using the transfer film of the present invention.

[0284] Furthermore, it was confirmed that the effects of the present invention are even better when the value of X is 1.50 or less (i.e., when equation (X2) is satisfied).

[0285] Furthermore, it was confirmed that the effects of the present invention are even better when the value of Y is 4 or less (i.e., when equation (Y2) is satisfied).

[0286] [Preparation and evaluation of transfer films (Examples 1A-14A)] Each of the transfer films in Examples 1A to 14A was prepared in the same manner as in Examples 1 to 14, except that the temporary support and cover film used in the preparation of the transfer films were changed to the materials described below. Using each of the obtained transfer films, measurements were performed in the same manner as in Examples 1 to 14, and the bending and moist heat resistance was evaluated in the same manner. The measurement results and bending and moist heat resistance evaluations for Examples 1A to 14A were the same as those for Examples 1 to 14. • Temporary support: Product name "Cosmoshine (registered trademark) A4160", manufactured by Toyobo Co., Ltd., 50 μm thick, PET film • Cover film: Product name "Alfan (registered trademark) E-210F", manufactured by Oji F-Tex Co., Ltd., 50 μm thick, polypropylene film

[0287] [Preparation and evaluation of transfer films (Examples 1B-14B)] Each of the transfer films in Examples 1B to 14B was prepared in the same manner as in Examples 1 to 14, except that the temporary support and cover film used in the preparation of the transfer films were changed to the materials described below. Using each of the obtained transfer films, measurements were performed in the same manner as in Examples 1 to 14, and the bending and moist heat resistance was evaluated in the same manner. The measurement results and bending and moist heat resistance evaluations for Examples 1B to 14B were the same as those for Examples 1 to 14. • Temporary support: Product name "Cosmoshine (registered trademark) A4360", manufactured by Toyobo Co., Ltd., 38 μm thick, PET film • Cover film: Product name "Alfan (registered trademark) FG-201", manufactured by Oji F-Tex Co., Ltd., 30 μm thick, polypropylene film

[0288] [Preparation and evaluation of transfer films (Examples 1C-14C)] Each of the transfer films in Examples 1C to 14C was prepared in the same manner as in Examples 1 to 14, except that the temporary support and cover film used in the preparation of the transfer films were changed to the materials described below. Using each of the obtained transfer films, measurements were performed in the same manner as in Examples 1 to 14, and the bending and moist heat resistance was evaluated in the same manner. The measurement results and bending and moist heat resistance evaluations for Examples 1C to 14C were the same as those for Examples 1 to 14. • Temporary support: Product name "Lumirror (registered trademark) #38-U48", manufactured by Toray Industries, Inc., 38 μm thick, PET film • Cover film: Product name "Alfan (registered trademark) E-210F", manufactured by Oji F-Tex Co., Ltd., 50 μm thick, polypropylene film

[0289] [Preparation and evaluation of transfer films (Examples 1D-14D)] Each of the transfer films in Examples 1D to 14D was prepared in the same manner as in Examples 1 to 14, except that the temporary support and cover film used in the preparation of the transfer films were changed to the materials described below. Using each of the obtained transfer films, measurements were performed in the same manner as in Examples 1 to 14, and the bending and moist heat resistance was evaluated in the same manner. The measurement results and bending and moist heat resistance evaluations for Examples 1D to 14D were the same as those for Examples 1 to 14. • Temporary support: Product name "Lumirror (registered trademark) #25-T60", manufactured by Toray Industries, Inc., 25 μm thick, PET film • Cover film: Product name "Alfan (registered trademark) FG-201", manufactured by Oji F-Tex Co., Ltd., 30 μm thick, polypropylene film

[0290] [Preparation and evaluation of transfer films (Examples 1E-14E)] Each of the transfer films in Examples 1E to 14E was prepared in the same manner as in Examples 1 to 14, except that the temporary support and cover film used in the preparation of the transfer films were changed to the materials described below. Using each of the obtained transfer films, measurements were performed in the same manner as in Examples 1 to 14, and the bending and moist heat resistance was evaluated in the same manner. The measurement results and bending and moist heat resistance evaluations for Examples 1E to 14E were the same as those for Examples 1 to 14. • Temporary support: Product name "Lumirror (registered trademark) 16FB40", manufactured by Toray Industries, Inc., 16 μm thick, PET film • Cover film: Product name "Alfan (registered trademark) E-210F", manufactured by Oji F-Tex Co., Ltd., 50 μm thick, polypropylene film

[0291] [Evaluation of patternability] Using the transfer films described in Examples 1 to 14 above, patterns were formed according to the following procedure. (1) The cover film of the prepared transfer film was peeled off to expose the photosensitive layer. Next, a transfer film was laminated onto a copper substrate (a PET film with copper foil laminated on it, manufactured by Geomatec Co., Ltd.) so that the copper foil and the exposed photosensitive layer were in contact. The lamination conditions were: lamination temperature: 100°C, line thickness: 3 N / cm, and transport speed: 1 m / min. (2) For the above photosensitive layer, using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) equipped with an ultra-high pressure mercury lamp, the distance between the exposure mask surface having a line-and-space pattern with a line size of 150 μm and a line:space ratio of 1:1 and the surface of the temporary support was set to 125 μm, and the accumulated exposure amount at 365 nm through the polyethylene terephthalate film, which is the temporary support, was 80 mJ / cm². 2 Pattern exposure was performed to achieve the following result. (3) After exposure, the sample was left in an environment of 25°C and 50%RH for 30 minutes, and then the polyethylene terephthalate film, which served as the temporary support, was peeled off. (4) The photosensitive layer after exposure was developed for 45 seconds using a 1% by mass aqueous solution of sodium carbonate (solution temperature: 30°C) as the developer. After development, it was rinsed with pure water for 15 seconds, and the moisture was removed by blowing air to obtain the pattern. Next, using an ultraviolet irradiation conveyor system (I-Graphics Co., Ltd.) equipped with a high-pressure mercury lamp, the integrated exposure dose at 365 nm was 1000 mJ / cm². 2 The entire pattern was exposed in this manner. We confirmed that clean line and space patterns were obtained on the transfer films of all examples. [Explanation of symbols]

[0292] 1: Laminate 3: Wall 5: Movable wall y: flexion width 12: Temporary support 14: Photosensitive layer 16: Cover film 100: Transfer film

Claims

1. Temporary support and A photosensitive layer containing compound A having a carboxyl group, A transfer film having the following characteristics: The photosensitive layer satisfies either of the following requirements (V01) and (W01), A transfer film that satisfies the following formulas (X1), (Y1), and (XY1). Requirements (V01) The photosensitive layer comprises compound A and compound β having a structure that undergoes a decarboxylation reaction of the carboxyl groups contained in compound A upon exposure, thereby reducing the amount of carboxyl groups contained in compound A. The compound A comprises a polymer having the carboxyl group and one or more repeating units selected from the group consisting of repeating units having an aromatic ring and repeating units having an alicyclic structure. The aforementioned compound β includes compounds having a bicyclic aromatic ring structure formed by the condensation of two monocyclic aromatic rings, with 1 to 4 nitrogen atoms as ring member atoms. Requirements (W01) The photosensitive layer comprises the compound A, Compound A comprises a polymer having the carboxyl group, a structure that undergoes a decarboxylation reaction of the carboxyl group upon exposure to reduce the amount of the carboxyl group, and one or more repeating units selected from the group consisting of repeating units having an aromatic ring and repeating units having an alicyclic structure. The aforementioned structure is a bicyclic aromatic ring structure formed by the condensation of two monocyclic aromatic rings, and has 1 to 4 nitrogen atoms as ring member atoms. 0≦X≦1.80 (X1) 1 ≤ Y ≤ 6 (Y1) Y≦-5X+13.50 (XY1) In the above formula, X is the value obtained by the measurement X described below, and Y is the value obtained by the measurement Y described below. Measurement X is a measurement method comprising the following steps 1 to 7 in this order. Step 1: The step of bringing the surface of the photosensitive layer in the transfer film opposite to the temporary support side into contact with the substrate, thereby bonding the transfer film and the substrate together and laminating them to obtain a laminate. However, the substrate used is a cellulose acylate film with a thickness of 60 μm. In the lamination process described above, the linear pressure is 3 N / cm, the transport speed is 1 m / min, and the lamination temperature is 100°C. Step 2: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using a proximity exposure machine equipped with an ultra-high pressure mercury lamp at an exposure dose of 80 mJ / cm². ２ The process of exposure. Step 3: After 30 minutes have elapsed since the exposure, the temporary support is peeled off the laminate. Step 4: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using an ultraviolet irradiation device with a high-pressure mercury lamp at an exposure dose of 1000 mJ / cm². ２ This is the post-exposure process. Step 5: The laminate is left in an environment of 25°C and 50% RH for 24 hours. Step 6: A step in which the vapor permeability of the laminate and the film consisting only of the substrate is measured by the cup method at 65°C, 90% RH, and for a test period of 24 hours, in accordance with JIS-Z-0208 (1976). Step 7: The moisture permeability obtained is calculated using the following formula, and the moisture permeability of the exposed photosensitive layer of the laminate is calculated as X kg / (m³). ２ - The process of determining 24 hours. Calculation formula: 1 / (X[kg / (m ２ ・24h)) = [1 / (Moisture permeability of the laminate [kg / (m ２ ・24h) )]) )] - [1 / (Moisture permeability of film made only of the above substrate [kg / (m ２ ・24h) Measurement Y; This is a measurement method comprising the following steps A to F in this order. Step A: A step of cutting the transfer film to a size of 3.0 x 15.0 cm. Step B: A step of laminating the transfer film and the substrate by bringing the surface of the photosensitive layer in the cut transfer film that is opposite to the temporary support side into contact with the substrate, thereby obtaining a laminate. However, the substrate used is polyethylene terephthalate with dimensions of 3.5 × 23.0 cm and a film thickness of 50 μm. In addition, before lamination, the substrate is heated at 145°C for 25 minutes, and after cooling, lamination is performed within 5 minutes. In lamination, the linear pressure is 3 N / cm, the transport speed is 4 m / min, and the lamination temperature is 100°C. Step C: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using a proximity type exposure machine equipped with an ultra-high pressure mercury lamp, at an exposure dose of 80 mJ / cm². ２ The process of exposure. Step D: A step of peeling the temporary support from the laminate 30 minutes after exposure. Step E: Exposure of the photosensitive layer of the laminate to the opposite side of the substrate using an ultraviolet irradiation device with a high-pressure mercury lamp at an exposure dose of 1000 mJ / cm². ２ This is the post-exposure process. Step F: With the exposed photosensitive layer of the laminate facing outwards, an unloaded U-shaped stretch test is performed to determine the minimum bending width Y mm at which no cracks occur in the exposed photosensitive layer. However, in the above test, tests are performed with bending widths of 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, and 1 mm, in descending order of bending width. The holding width of the laminate before bending is 120 mm. In each bending width test, the number of bending cycles is 15, and the test speed is 100 rpm. After each bending width test is completed, the exposed photosensitive layer in a region of ±10 mm from the center of the bend is observed at 5x magnification using an optical microscope to check for the presence or absence of cracks in the exposed photosensitive layer. The minimum bending width at which no cracks occur in the exposed photosensitive layer in the above test is defined as Y mm. Furthermore, if a crack occurs in the exposed photosensitive layer even with a bending width of 6 mm, Y = 7; if no crack occurs in the exposed photosensitive layer even with a bending width of 1 mm, Y = 1.

2. A transfer film according to claim 1, satisfying the following formula (XY2). Y≧-5X+6.00 (XY2)

3. A transfer film according to claim 1 or 2, satisfying the following formula (Y2). 1 ≤ Y ≤ 4 (Y²)

4. A transfer film according to any one of claims 1 to 3, satisfying the following formula (X2). 0≦X≦1.50 (X2)

5. The above requirement (V01) is met, The transfer film according to any one of claims 1 to 4, wherein the total number of the two-ring aromatic ring structures contained in the photosensitive layer is 1 mol% or more relative to the total number of carboxyl groups contained in the compound A.

6. The transfer film according to any one of claims 1 to 5, wherein the polymer has polymerizable groups.

7. The transfer film according to any one of claims 1 to 6, wherein the photosensitive layer further comprises a polymerizable compound.

8. The transfer film according to any one of claims 1 to 7, wherein the photosensitive layer further comprises a photopolymerization initiator.

9. A step of bonding the transfer film and the substrate by bringing the surface of the photosensitive layer in the transfer film according to any one of claims 1 to 8, on the side opposite to the temporary support, into contact with the substrate, A step of exposing the photosensitive layer in a patterned manner, The process includes developing the exposed photosensitive layer using a developer, A pattern forming method further comprising, in the case where the developer is an organic solvent-based developer, a step of exposing the pattern formed by development after the development step.

10. A step of bonding the transfer film and the substrate by bringing the surface of the photosensitive layer in the transfer film according to any one of claims 1 to 8, on the side opposite to the temporary support, into contact with the substrate, A step of exposing the photosensitive layer in a patterned manner, A method for forming a pattern, comprising the steps of: developing the exposed photosensitive layer with an alkaline developer to form a pattern; and in this order.

11. A step of bonding the transfer film and the substrate having the conductive layer by bringing the surface of the photosensitive layer in the transfer film according to any one of claims 1 to 8, opposite to the temporary support side, into contact with the conductive layer in the substrate having the conductive layer, A step of exposing the photosensitive layer in a patterned manner, The process involves developing the exposed photosensitive layer using an alkaline developer to form a patterned etching resist film, A method for manufacturing circuit wiring, comprising the steps of: etching the conductive layer in a region where the etching resist film is not present, in this order.

12. A step of bonding the transfer film and the substrate having the conductive layer by bringing the surface of the photosensitive layer in the transfer film according to any one of claims 1 to 8, opposite to the temporary support side, into contact with the conductive layer in the substrate having the conductive layer, A step of exposing the photosensitive layer in a patterned manner, A method for manufacturing a touch panel, comprising the steps of: developing the exposed photosensitive layer with an alkaline developer to form a patterned protective film or insulating film on the conductive layer; and in this order.

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