Substrate processing equipment

Abstract

To provide a substrate processing apparatus which can inhibit a liquid remaining on an upper surface of a cover from falling downward from the outer side of a distal end of the cover when an arm of a swing module is swung.SOLUTION: A substrate processing apparatus according to the disclosure is for processing a substrate. The substrate processing apparatus includes a swing module. The swing module includes a base portion, an arm which is supported by the base portion and is rotatable about the base portion, and a cover which covers an upper surface of the arm. The cover has an elongated shape in a plan view and has a protrusion formed on an outer peripheral portion of an upper surface of the cover and protruding upward. The protrusion is provided to be continuous to a distal end which is an end on the side farther from the base portion of the upper surface of the cover in a longitudinal direction and both ends of the upper surface of the cover in a transverse direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus.

Background Art

[0002] In the semiconductor manufacturing process, a polishing apparatus is used to polish the surface of a substrate. In the polishing apparatus, slurry (polishing liquid) is used to polish the substrate. When the substrate is polished, the slurry scatters and adheres to the cover for the components of the polishing apparatus. Then, the slurry adhering to the cover solidifies when it dries. If the solidified slurry falls off the cover and contacts the surface of the substrate being polished, defects such as scratches may occur on the substrate. Therefore, there is a need for a polishing apparatus having a configuration that can suppress the occurrence of such defects.

[0003] For example, Patent Document 1 discloses a cover for a component of a polishing apparatus. In the cover of the component of the polishing apparatus of Patent Document 1, as shown in FIG. 2 thereof, the outer surface of the cover exposed to the outside does not have recesses and does not have a horizontal surface except for the top of the cover. Since the cover of Patent Document 1 has such a configuration, the polishing liquid does not stay in the recesses of the cover. Also, since it does not have a horizontal surface except for the top of the cover, it is difficult for the scattered polishing liquid to accumulate. Therefore, it is difficult for the polishing liquid to adhere to the cover. As a result, it is difficult for a solidified product to be generated from the polishing liquid adhering to the cover, and it is difficult for scratches on the substrate to be caused by the solidified product.

[0004] Furthermore, the polishing apparatus disclosed in Patent Document 2 is housed inside a chamber, as shown in Figure 2. Multiple spray nozzles for spraying cleaning fluid are arranged inside the chamber. These spray nozzles spray the cleaning fluid onto the chamber walls and the covers of the polishing apparatus components, thereby maintaining a moist state on the chamber walls and the covers of the polishing apparatus components. As a result, the polishing fluid is prevented from adhering to the chamber walls and the covers of the polishing apparatus components and drying out. This prevents dried and solidified polishing fluid from falling onto the substrate, thereby preventing scratches on the substrate caused by solidified polishing fluid.

[0005] Furthermore, the first polishing unit (polishing apparatus) disclosed in Patent Document 3, as shown in Figure 5, has a spray nozzle for spraying cleaning fluid onto each part constituting the first polishing unit. In this first polishing unit, each part constituting the first polishing unit is cleaned with cleaning fluid, and the slurry adhering to each part is washed away before it solidifies. In other words, the occurrence of scratches on the substrate due to solidified polishing fluid is suppressed.

[0006] As described above, in the polishing apparatus disclosed in Patent Documents 2 and 3, cleaning fluid is supplied to the components of the polishing apparatus. As a result, processing fluid such as cleaning fluid may accumulate on the upper surface of the covers of oscillating components such as the top ring, polishing fluid supply nozzle, dresser, and atomizer, which are components of the polishing apparatus. Then, there is a risk that the processing fluid will fall from the cover of the oscillating component and adhere to the substrate. To solve this problem, Patent Document 4 discloses a cover for oscillating components that can prevent processing fluid from accumulating on the upper surface of the cover.

[0007] In the cover disclosed in Patent Document 4, as shown in Figure 3, the upper surface of the cover is inclined downward along the entire length of the cover, from the leading edge to the base. This allows the processing liquid adhering to the upper surface of the cover to flow down to the base. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Patent No. 6580178 [Patent Document 2] Japanese Patent Publication No. 2014-111301 [Patent Document 3] Japanese Patent Publication No. 2019-209410 [Patent Document 4] Japanese Patent Publication No. 2021-2612 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] As described above, in the cover for the oscillating component of the substrate processing apparatus disclosed in Patent Document 4, the inclination of the upper surface of the cover causes the processing liquid to flow towards the base end, and the processing liquid is removed from the upper surface. However, there is a risk that the processing liquid may not be completely removed from the upper surface of the cover, and some of the processing liquid may remain on the upper surface of the cover. Such residual processing liquid may be subjected to centrifugal force by the oscillating motion of the oscillating component around the base end, move toward the distal end farther from the center of rotation of the cover, and fall downward from the outside of the distal end of the cover. In such a case, the processing liquid may drip or splash from the cover and adhere to surrounding components.

[0010] Therefore, one of the objectives of this disclosure is to provide a substrate processing apparatus that can prevent liquid remaining on the upper surface of the cover from falling downward from the outside of the distal end of the cover when the arm of the oscillating module (oscillating component) is oscillating. [Means for solving the problem]

[0011] A substrate processing apparatus according to one embodiment is a substrate processing apparatus for processing a substrate, wherein the substrate processing apparatus comprises a rocking module, the rocking module having a base, an arm supported by the base and rotatable about the base, and a cover covering the upper surface of the arm, the cover having an elongated shape in plan view and having projections projecting upward from the outer circumference of the upper surface of the cover, the projections being provided continuously at the distal end, which is the end of the upper surface of the cover furthest from the base in the longitudinal direction, and at both ends of the upper surface of the cover in the short direction. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1 is a plan view showing the overall configuration of the substrate processing apparatus of this embodiment. [Figure 2] Figure 2 is a schematic perspective view of the polishing apparatus shown in Figure 1. [Figure 3] Figure 3 is a schematic plan view of the polishing apparatus shown in Figure 1. [Figure 4] Figure 4 is a perspective view showing the dressing apparatus shown in Figure 2. [Figure 5] Figure 5 is a side view of the dressing apparatus shown in Figure 4. [Figure 6] Figure 6 is a plan view of the dressing apparatus shown in Figure 4. [Figure 7] Figure 7 is a cross-sectional view of AA in Figure 5. [Modes for carrying out the invention]

[0013] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0014] <Substrate processing device 1000> FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 1000 according to the present embodiment. The substrate processing apparatus 1000 is an apparatus for processing a semiconductor substrate W. The semiconductor substrate W includes wafers such as silicon wafers, glass wafers, and quartz wafers. Referring to FIG. 1, the substrate processing apparatus 1000 includes a load / unload module 200, a polishing module 300, and a cleaning module 400. The substrate processing apparatus 1000 also includes a control module 500 for controlling various operations of the load / unload module 200, the polishing module 300, and the cleaning module 400. Hereinafter, the configuration of each part of the substrate processing apparatus 10 00 will be described.

[0015] <Load / Unload Module 200> The load / unload module 200 performs a process of passing the substrate W before processing such as polishing and cleaning to the polishing module 300, and a process of receiving the substrate W after processing such as polishing and cleaning from the cleaning module 400. The load / unload module 200 includes a plurality (four in this embodiment) of front loaders 220. Each front loader 220 is equipped with a cassette 222 for stocking the substrate W.

[0016] The load / unload module 200 includes a rail 230 installed inside the housing 100 and a plurality (two in this embodiment) of transfer robots 240 arranged on the rail 230. The transfer robot 240 takes out the substrate W before processing such as polishing and cleaning from the cassette 222 and passes it to the polishing module 300. Also, the transfer robot 240 receives the substrate W after processing such as polishing and cleaning from the cleaning module 4, and returns it to the cassette 222.

[0017] <Polishing Module 300> The polishing module 300 has a function of polishing the substrate W. The polishing module 300 includes a first polishing device (CMP device: Chemical Mechanical Polishing device) 302A, a second polishing device (CMP device) 302B, a third polishing device (CMP device) 302C, and a fourth polishing device (CMP device) 302D. The first polishing device 302A, the second polishing device 302B, the third polishing device 302C, and the fourth polishing device 302D each have a function of polishing the substrate W using polishing liquid. Also, the first polishing device 302A, the second polishing device 302B, the third polishing device 302C, and the fourth polishing device 302D have the same configuration as each other as an example. For this reason, in the present disclosure, the first polishing device 302A, the second polishing device 302B, the third polishing device 302C, and the fourth polishing device 302D may simply be referred to as the polishing device 302.

[0018] Referring to FIG. 1, the first polishing device 302A includes a polishing table 320 and a top ring device 330 having a top ring 332. The polishing table 320 is rotationally driven by a driving unit 328 (see FIG. 2). A polishing pad 322 is attached to the polishing table 320. The top ring 332 holds the substrate W and presses it against the polishing pad 322. The top ring 332 is rotationally driven by a driving source not shown. The substrate W is polished by being held by the top ring 332 and pressed against the polishing pad 322.

[0019] Next, a transport mechanism for transporting the substrate W will be described. The transport mechanism includes a lifter 390, a first linear transporter 392, a swing transporter 394, a second linear transporter 396, and a temporary placement table 398.

[0020] The lifter 390 receives the substrate W from the transport robot 240. The first linear transporter 392 transports the substrate W received from the lifter 390 between the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4. The first polishing device 302A and the second polishing device 302B receive the substrate W from the first linear transporter 392 and polish it. The first polishing device 302A and the second polishing device 302B pass the polished substrate W back to the first linear transporter 392.

[0021] The swing transporter 394 transfers the substrate W between the first linear transporter 392 and the second linear transporter 396. The second linear transporter 396 transports the substrate W received from the swing transporter 394 between the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7. The third polishing apparatus 302C and The fourth polishing device 302D receives the substrate W from the second linear transporter 396 and polishes it. The third polishing device 302C and the fourth polishing device 302D pass the polished substrate W to the second linear transporter 396. The substrate W that has been polished by the polishing module 300 is placed on the temporary storage table 398 by the swing transporter 394.

[0022] <Cleaning Module 400> The cleaning module 400 has the function of cleaning and drying the substrate W that has been polished by the polishing module 300. The cleaning module 400 comprises a first cleaning chamber 410, a first transport chamber 420, a second cleaning chamber 430, a second transport chamber 440, and a drying chamber 450.

[0023] The substrate W placed on the temporary storage table 398 is transported via the first transport chamber 420 to the first washing chamber 410 or the second washing chamber 430. The substrate W is washed in the first washing chamber 410 or the second washing chamber 430. The substrate W that has been washed in the first washing chamber 410 or the second washing chamber 430 is transported via the second transport chamber 440 to the drying chamber 450. The substrate W is dried in the drying chamber 450. The dried substrate W is removed from the drying chamber 450 by the transport robot 240 and returned to the cassette 222.

[0024] <Polishing device 302> Next, refer to Figures 2 and 3. Figure 2 is a schematic perspective view of the polishing apparatus 302. Figure 3 is a schematic plan view of the polishing apparatus 302. Referring to Figures 2 and 3, the polishing apparatus 302 includes, as an example, a polishing table 320, a polishing fluid supply nozzle 310, an atomizer 340, and a top ring device 330.

[0025] The polishing table 320 supports a polishing pad 322 having a polishing surface 324. The polishing table 320 is supported by a table shaft 326. The polishing table 320 is configured to rotate around the axis of the table shaft 326 by a drive unit 328.

[0026] The polishing fluid supply nozzle 310 is configured to supply polishing fluid or dressing fluid to the polishing pad 322. The polishing fluid is, for example, a slurry. The dressing fluid is, for example, pure water. During polishing, polishing fluid is supplied from the polishing fluid supply nozzle 310 to the polishing surface 324 of the polishing pad 322. On the other hand, during dressing, dressing fluid is supplied from the polishing fluid supply nozzle 310 to the polishing surface 324 of the polishing pad 322.

[0027] The atomizer 340 has the function of spraying cleaning fluid toward the polishing pad 322 and cleaning the polishing pad 322. The atomizer 340 extends radially along the polishing pad 322 (or polishing table 320). The cleaning fluid consists of a mixture of cleaning liquid (e.g., pure water) and gas (e.g., an inert gas such as nitrogen gas), or cleaning liquid alone. By spraying the cleaning fluid onto the polishing surface 324, the atomizer 340 removes polishing debris remaining on the polishing surface 324 of the polishing pad 322 and abrasive particles contained in the polishing liquid.

[0028] The top ring device 330 comprises a top ring 332, a top ring head 334, and a pivot shaft 336. The top ring head 334 has a top ring cover 335 that covers the entire top ring head 334. The top ring cover 335 has a shape that covers the upper part of the top ring 332. This prevents polishing fluid from entering the upper part of the top ring 332 and from entering the interior of the top ring head 334. The top ring head 334 also includes a top ring shaft (not shown) to which the top ring 332 is fixed, a top ring rotating device (not shown) for rotating the top ring 332 via the top ring shaft, and a top ring for raising and lowering the top ring 332. It has a top ring lifting device (not shown). In the top ring device 330, a portion of the top ring shaft, the top ring rotating device, and the top ring lifting device are covered by the top ring cover 335.

[0029] Furthermore, the top ring 332 is configured to hold the substrate W by vacuum suction on the surface of the top ring 332 facing the polishing surface 324. The top ring head 334 is supported by a pivot shaft 336 and is configured to rotate about the pivot shaft 336. This allows the top ring head 334 to move between a polishing position above the polishing table 320 and a standby position outside the area directly above the polishing table 320 (see Figure 3).

[0030] Polishing of the substrate W is performed as follows: The top ring 332 holding the substrate W is moved from the standby position to the polishing position. The top ring 332 and the polishing table 320 rotate in the same direction, and polishing fluid is supplied from the polishing fluid supply nozzle 310 onto the polishing pad 322. In this state, the top ring 332 presses the substrate W against the polishing surface 324 of the polishing pad 322, bringing the substrate W into contact with the polishing surface 324. The surface of the substrate W is polished by the chemical action of the polishing fluid and the mechanical action of the abrasive grains contained in the polishing fluid.

[0031] Furthermore, the polishing device 302 is equipped, for example, with a spray nozzle (not shown) for supplying cleaning fluid to each component of the polishing device 302 and washing away the polishing fluid adhering to each component. As a result, each component of the polishing device 302 is cleaned as needed. Consequently, the polishing fluid adhering to each component of the polishing device 302 during substrate polishing is washed away.

[0032] Referring to Figure 2, the polishing apparatus 302 further comprises, as an example, a dressing device (an example of an oscillating module) 350. The dressing device 350 has the function of dressing or conditioning the polishing surface 324 of the polishing pad 322. The dressing device 350 comprises a dresser 352, a base 354, a dresser arm (an example of an arm) 360, and a cover 362. The cover 362 covers the upper part of the dresser arm 360. This prevents polishing fluid from entering the interior of the dresser arm 360. The dresser arm 360 also supports the dresser 352. More specifically, the dresser arm 360 includes a dresser shaft (not shown) to which the dresser 352 is fixed, a dresser rotation device (not shown) for rotating the dresser 352 via the dresser shaft, and a dresser lifting device (not shown) for raising and lowering the dresser 352. In the dressing device 350, a portion of the dresser shaft, the dresser rotation device, and the dresser lifting device are covered by a cover 362.

[0033] A dressing surface for dressing the polishing surface 324 is located on the underside of the dresser 352. Abrasive particles such as diamond particles are fixed to the dressing surface. During dressing, the dresser 352 comes into contact with the polishing pad 322 and dresses the polishing surface 324 of the polishing pad 322.

[0034] The base 354 has a cylindrical shape and extends vertically. The base 354 is fixed to the outside of the polishing table 320 and supports one end of the dresser arm 360.

[0035] The dresser arm 360 is supported by the base 354 and extends horizontally from the top of the base 354. The dresser arm 360 is configured to rotate about the base 354. When the dresser arm 360 rotates, the dresser 352 oscillates radially over the polishing surface 324 of the polishing table 320. The dresser 352 rotates while oscillating over the polishing surface 324 of the polishing pad 322, dressing the polishing surface 324 by slightly scraping off the polishing pad 322. Furthermore, by rotating about the base 354, the dresser arm 360 moves to a dressing position above the polishing table 320 and to the polishing table 320. It can move between the outer waiting position and the surrounding area (see Figure 3).

[0036] Figure 4 is a perspective view of the dressing apparatus 350. Figure 5 is a side view of the dressing apparatus 350. Figure 6 is a top view of the dressing apparatus 350. Figure 7 is a cross-sectional view of Figure 5, section AA. The dressing apparatus 350 will be described in more detail with reference to Figures 4 to 7.

[0037] Referring to Figure 4, the cover 362 has a top surface 364 and side surfaces 366, and has an elongated shape in plan view (see Figure 6 in particular). The side surfaces 366 extend downward from the outer periphery 368 of the top surface 364. The cover 362 also has projections 370 that protrude upward from the outer periphery 368 of the top surface 364. The projections 370 are provided continuously at the distal end 372, which is the end of the top surface 364 of the cover 362 that is farther from the base 354 in the longitudinal direction 902 (see Figure 6), and at both ends (first end 374a and second end 374b) of the top surface 364 of the cover 362 in the short direction 904. The height L of the projections 370 is, for example, 3 mm or more (see Figure 7). In Figure 7, the upper end 386 of the projections 370 of the cover 362 is not chamfered, but it may be chamfered outward or inward. In other words, the upper end 386 of the projection 370 may be inclined outward or inward. The width t of the projection 370 is, for example, 3 mm or less.

[0038] As described above, each component of the polishing device 302 is cleaned as needed. When cleaning is performed, the dressing device 350, which is one of the components of the polishing device 302, is also cleaned. As a result, liquid used for cleaning may remain on the upper surface 364 of the cover 362 of the dressing device 350. Such residual liquid is subjected to centrifugal force by the oscillating motion of the dresser arm 360 around the base 354 and moves toward the distal end 372, which is farther from the rotation center of the cover 362, and may fall downward from outside the distal end 372 of the cover 362. Furthermore, the liquid that falls from the distal end 372 may mix with the polishing liquid supplied to the polishing surface 324 (see Figure 2) of the polishing pad 322, potentially diluting the polishing liquid.

[0039] However, such problems are less likely to occur with the dressing device 350. As described above, the cover 362 has projections 370 that are continuously provided at the distal end 372 in the longitudinal direction 902 and at both ends 374a, 374b in the short direction 904. Therefore, the liquid that moves to the distal end 372 due to the rotation of the dresser arm 360 has its flow stopped by the projections 370, preventing it from falling downward from outside the distal end 372. Furthermore, since the liquid is prevented from falling from the distal end 372, dilution of the polishing liquid supplied to the polishing surface 324 is also prevented. Since the projections 370 are also provided at both ends 374a, 374b in the short direction 904, it is also possible to prevent water droplets from moving in the short direction 904 due to inertia force when the dresser arm 360 swings and dripping outside the dresser arm 360.

[0040] Furthermore, even if solidified polishing liquid is contained in the liquid remaining on the upper surface 364 of the cover 362, this liquid is prevented from falling from the distal end 372 of the cover 362 onto the polishing surface 324, making it difficult for solidified polishing liquid to fall onto the polishing surface 324. As a result, there is less chance of solidified polishing liquid coming into contact with the substrate W and causing scratches on the substrate W.

[0041] Furthermore, in the cover 362, the projection 370 is provided on the entire outer circumference 368 of the upper surface 364 of the cover 362 that passes directly above the polishing table 320 due to the rotation of the dresser arm 360. The liquid on the upper surface 364 of the cover 362 is less likely to fall downward from outside the position where the projection 370 is provided on the outer circumference 368 of the upper surface 364 of the cover 362. For this reason, in the cover 362, the liquid on the upper surface 364 of the cover 362 is less likely to fall onto the polishing table 320.

[0042] Furthermore, in the case of cover 362, the projection 370 is not provided on at least a portion of the outer circumference 368 of the upper surface 364 of cover 362 that does not pass directly over the polishing table 320 due to the rotation of the dresser arm 360. In other words, the projection 370 is not provided around the proximal end 378. As a result, liquid adhering to the upper surface 364 of cover 362 is drained at a position on the base 354 side where the projection 370 is not provided, and is not drained in a way that flows toward the polishing table 320.

[0043] Furthermore, as shown in Figure 4, the upper surface 364 of the cover 362 has an inclined surface 376 that slopes downward toward the base 354. The inclined surface 376 extends continuously in the longitudinal direction 902 of the cover 362 from the distal end 372 to the proximal end 378, which is the end closer to the base 354 in the longitudinal direction 902, without becoming horizontal. As a result, in the cover 362, liquid adhering to the upper surface 364 of the cover 362 flows toward the base 354 by the inclined surface 376 and is drained at the base 354 side. In the cover 362, the inclined surface 376 comprises a first inclined surface 380, a second inclined surface 382, ​​and a third inclined surface 384 that extend in a straight line. Thus, the inclined surface 376 may be formed from a plurality of inclined surfaces that extend in a straight line. In addition, the inclined surface 376 may be configured so that the angle of inclination changes along its slope.

[0044] In the cover 362, the inclined surface 376 only needs to be inclined at all positions to allow sufficient liquid flow, but it is preferable that it be inclined at an angle of 10 degrees or more, 15 degrees or more, 20 degrees or more, or 30 degrees or more with respect to the horizontal plane. This is because the inclined surface 376 has such an angle of inclination so that it can allow sufficient liquid flow.

[0045] Furthermore, in the cover 362, the side surface 366 extends vertically. In other words, the side surface 366 is inclined at an angle of 85 degrees or more with respect to the horizontal plane. This makes it easier for liquid adhering to the side surface 366 to flow downwards, and prevents liquid from remaining on the side surface 366.

[0046] Furthermore, a water-repellent or hydrophilic layer is formed on the surface of the cover 362. As a result, any liquid adhering to the surface of the cover 362 is quickly washed away and removed. The cover 362 may also have a water-repellent layer formed on its surface by applying a fluorine-based or ceramic-based coating agent. Alternatively, the cover 362 may have a hydrophilic layer formed on its surface by blasting it with glass beads.

[0047] Furthermore, although the cover 362 is described as a cover for the dressing device 350, it is not limited to this configuration. The cover according to this disclosure is applicable to the entire oscillating module of the substrate processing apparatus 1000. For example, the cover according to this disclosure may be applied to the polishing fluid supply nozzle 310, atomizer 340, or top ring device 330 of the polishing device 302. In addition, it may be applied to the oscillating module for cleaning the substrate W provided in the cleaning module 400 of the substrate processing apparatus 1000.

[0048] [Note] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0049] (Note 1) The substrate processing apparatus according to Appendix 1 is a substrate processing apparatus for processing a substrate, wherein the substrate processing apparatus comprises a rocking module, the rocking module having a base, an arm supported by the base and rotatable about the base, and a cover covering the upper surface of the arm, the cover having an elongated shape in plan view and having a projection projecting upward from the outer circumference of the upper surface of the cover, the projection being far from the base in the longitudinal direction of the upper surface of the cover It is provided continuously at the distal end, which is the end on the right side, and at both ends in the short direction of the upper surface of the cover.

[0050] In the substrate processing apparatus described in Appendix 1, the cover of the oscillating module has projections that are continuously provided at the distal end and at both ends of the short side of the upper surface of the cover. Therefore, the projections prevent the liquid that moves to the distal end due to the rotation of the arm from falling downward from the outside of the distal end. In other words, this substrate processing apparatus can prevent liquid remaining on the upper surface of the cover from falling downward from the distal end of the cover when the arm of the oscillating module is oscillating.

[0051] (Note 2) The substrate processing apparatus according to Appendix 2 is the substrate processing apparatus described in Appendix 1, wherein the substrate processing apparatus comprises a polishing device for polishing the substrate using a polishing liquid, the polishing device has a polishing table for supporting a polishing pad having a polishing surface, and the arm is a dresser arm for dressing the polishing surface of the polishing pad.

[0052] The substrate processing apparatus described in Appendix 2 can suppress the dilution of the polishing solution. Furthermore, the substrate processing apparatus described in Appendix 2 can suppress the scratching of the substrate.

[0053] (Note 3) The substrate processing apparatus according to Appendix 3 is the substrate processing apparatus described in Appendix 1 or 2, wherein the upper surface of the cover has an inclined surface that slopes downward toward the base, and the inclined surface extends continuously in the longitudinal direction of the cover from the distal end to the proximal end, which is the end closer to the base in the longitudinal direction, without becoming horizontal.

[0054] The substrate processing apparatus described in Appendix 3 can reduce the amount of liquid remaining on the upper surface of the cover, and can drain the liquid adhering to the upper surface of the cover at the base side.

[0055] (Note 4) The substrate processing apparatus according to Appendix 4 is the substrate processing apparatus described in Appendix 3, wherein the inclined surface has an inclination of 10 degrees or more with respect to the horizontal plane.

[0056] (Note 5) The substrate processing apparatus described in Appendix 5 is the substrate processing apparatus described in Appendix 2, wherein the projection is provided on the entire outer circumference of the upper surface of the cover, and passes directly over the polishing table as the arm rotates.

[0057] In the substrate processing apparatus described in Appendix 5, protrusions are provided along the entire outer circumference that passes directly above the polishing table, making it difficult for liquid to fall onto the polishing table. In other words, this substrate processing apparatus can prevent liquid from the top surface of the cover from falling onto the polishing table.

[0058] (Note) The substrate processing apparatus relating to Appendix 6 is the polishing apparatus described in Appendix 1 or 2, wherein the height of the protrusion is 3 mm or more.

[0059] (Note 7) The substrate processing apparatus relating to Appendix 7 is the polishing apparatus described in Appendix 1 or 2, wherein the width of the protrusion is 3 mm or less.

[0060] (Note 8) The substrate processing apparatus relating to Appendix 8 is the polishing apparatus described in Appendix 1 or 2, wherein the cover A water-repellent or hydrophilic layer is formed on the surface.

[0061] According to the substrate processing apparatus described in Appendix 8, since the surface of the cover is water-repellent or hydrophilic, any liquid adhering to the surface of the cover is quickly washed away and removed. Therefore, this substrate processing apparatus can prevent liquid from remaining on the surface of the cover.

[0062] The embodiments of the present invention and their respective modifications have been described above. It goes without saying that the examples described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved as appropriate without departing from its spirit, and equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least a part of the above-described problems can be solved or at least a part of the effects can be achieved. [Explanation of Symbols]

[0063] 300: Polishing Module 302: Polishing equipment 310: Polishing fluid supply nozzle 320: Polishing Table 322: Polishing pad 324: Polished surface 330: Top ring device 340: Atomizer 350: Dressing device 352: Dresser 354: Base 360: Dresser Arm 362: Cover 364:Top surface 366: Side view 368: Outer perimeter 370: Protrusion 372: Distal end 374a, 374b: Both ends (first end, second end) 376: Inclined surface 378: Proximal end 902: Longitudinal direction 904: Short direction 1000: Substrate processing equipment W: Circuit board L: Height t:width

Claims

1. A substrate processing apparatus for processing substrates, The substrate processing apparatus includes an oscillating module, The aforementioned oscillation module, The base and, An arm supported by the base and rotatable about the base, A cover that covers the upper surface of the arm, It has, The cover has an elongated shape in plan view and is provided with an upwardly projecting projection on the outer circumference of the upper surface of the cover. The projection is provided continuously at the distal end, which is the end of the upper surface of the cover that is farther from the base in the longitudinal direction, and at both ends of the upper surface of the cover in the short direction. Circuit board processing equipment.

2. A substrate processing apparatus according to claim 1, The substrate processing apparatus includes a polishing device for polishing the substrate using a polishing liquid, The polishing apparatus has a polishing table for supporting a polishing pad having a polishing surface, The arm is a dresser arm that supports a dresser for dressing the polishing surface of the polishing pad. Circuit board processing equipment.

3. A substrate processing apparatus according to claim 1 or 2, The upper surface of the cover has an inclined surface that slopes downward toward the base, The inclined surface extends continuously in the longitudinal direction of the cover, from the distal end to the proximal end, which is the end closer to the base in the longitudinal direction, without becoming horizontal. Circuit board processing equipment.

4. In the substrate processing apparatus according to claim 3, The inclined surface has an inclination of 10 degrees or more with respect to the horizontal plane. Circuit board processing equipment.

5. A substrate processing apparatus according to claim 2, The projection is provided on the entire outer circumference of the upper surface of the cover, specifically the portion that passes directly over the polishing table as the arm rotates. Circuit board processing equipment.

6. A polishing apparatus according to claim 1 or 2, The height of the aforementioned protrusion is 3 mm or more. Polishing equipment.

7. A polishing apparatus according to claim 1 or 2, The width of the aforementioned protrusion is 3 mm or less. Circuit board processing equipment.

8. A polishing apparatus according to claim 1 or 2, A water-repellent layer or a hydrophilic layer is formed on the surface of the cover. Circuit board processing equipment.

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