Mounting apparatus and control method for mounting apparatus

Abstract

To obtain the position of components more reliably.SOLUTION: A mounting device includes a mounting portion having a mounting head that has a reference portion that is a reference position and a predetermined member different from the reference portion and picks up the component and mounts it on a board, an imaging portion that images the mounting head that has sampled the component and obtains a captured image, and a control portion that uses either the reference portion or the predetermined member as a reference position depending on the type and / or size of the component.SELECTED DRAWING: Figure 1

Description

Technical Field

[0004] , , , , , , , ,

[0003] , ,

[0001] This specification discloses an implementation device and a control method for the implementation device.

Background Art

[0002] Conventionally, as an implementation device for mounting components on a substrate, for example, an image is taken together with components picked up by a mounting head and first to third reference marks provided in a plurality of types corresponding to a plurality of illumination conditions to obtain image data, and based on this image data, the relative positional relationship between the components and the first to third reference marks is determined and reflected in the movement control of the mounting head to the mounting position (see, for example, Patent Document 1). In this implementation device, by using a plurality of types of reference marks, when the mounting head holds components with different illumination conditions, the position of the components can be accurately recognized even if the illumination type is changed. Further, as an implementation device, a device has been proposed in which the moving direction of the mounting head at the time of imaging is determined according to the first X-axis distance and the first Y-axis distance from the imaging position to the mounting position, and the components picked up by the mounting head are imaged while moving the mounting head (see, for example, Patent Document 2, etc.). In this implementation device, it is possible to shorten the implementation time.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, while the aforementioned mounting device claims to be able to accurately recognize the position of a component by providing multiple reference marks on the mounting head, there were cases where the reference marks could not be used depending on the type and size of the component. The mounting device required reliable acquisition of component positioning.

[0005] This disclosure has been made in view of these challenges, and its main purpose is to provide a mounting apparatus and a control method for the mounting apparatus that can more reliably obtain the position of components. [Means for solving the problem]

[0006] The mounting apparatus and control method for the mounting apparatus disclosed herein employ the following means to achieve the main objectives described above.

[0007] In other words, the implementation device of this disclosure is A mounting unit having a mounting head that picks up a component and mounts it onto a substrate, having a reference part which is a reference position and a predetermined member different from the reference part, An imaging unit that images the mounting head from which the aforementioned parts have been collected and obtains an image of the image, A control unit that uses either the reference part or the predetermined member as the reference position, depending on the type and / or size of the aforementioned part, It is something that is provided.

[0008] In mounting equipment, depending on the type and size of the component, it may not be possible to image the reference area along with the component. However, even in such cases, a predetermined component can be used as the reference position, allowing for more reliable determination of the component's position. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram illustrating an example of the implemented system 10. [Figure 2] Diagram illustrating the mounting head 22 and imaging unit 16. [Figure 3] An explanatory diagram showing an example of the state in which parts P1 and P2 have been collected. [Figure 4] An explanatory diagram of an example of unique location information 34 stored in the memory unit 32. [Figure 5] A flowchart showing an example of an implementation processing routine. [Figure 6] A flowchart showing an example of an update processing routine. [Figure 7] An explanatory diagram of an example of a process for obtaining a correction value to correct the position of the sampling member 23. [Figure 8] A flowchart illustrating an example of a process for determining a reference position to replace the reference unit 24 using an captured image. [Modes for carrying out the invention]

[0010] This embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram of a mounting system 10 which is an example of the present disclosure. Figure 2 is an explanatory diagram showing an example of a mounting head 22 and an imaging unit 16. Figure 3 is an explanatory diagram showing an example of a state in which parts P1 (Figure 3A) and parts P2 (Figure 3B) have been collected. Figure 4 is an explanatory diagram showing an example of unique position information 34 stored in the storage unit 32. The mounting system 10 is a system that performs the process of mounting parts P, which are objects to be imaged, onto a substrate S, which is a base material to be processed. This mounting system 10 includes a mounting device 11, a management device 40, and a printing device, a printing inspection device, a mounting inspection device, a transport device, a reflow device, etc. (not shown). The mounting system 10 is configured as a mounting line in which a plurality of mounting devices 11 that perform the mounting process of mounting parts P onto the substrate S are arranged from upstream to downstream. Here, the object to be processed is described as a substrate S, but it is not particularly limited as long as it is used to mount parts, and may be a three-dimensional base material. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figures 1 and 2. Also, parts P1 and P2 (see Figure 3) are collectively referred to as part P, and sampling members 23a and 23b (see Figure 7) are collectively referred to as sampling member 23.

[0011] As shown in Figure 1, the mounting apparatus 11 comprises a substrate processing unit 12, a component supply unit 13, an imaging unit 16, a standby unit 19, a mounting unit 20, and a control device 30. The substrate processing unit 12 is a unit that loads, transports, fixes at the mounting position, and unloads the substrate S as a base material. The component supply unit 13 is a unit that supplies components P to the mounting unit 20. Multiple feeders 15, each having a tape holding components P, are mounted on this component supply unit 13. These feeders 15 send the components P held on the tape to the picking position. This component supply unit 13 may also include a tray unit having a tray 16 for arranging and placing multiple components. The components P used in the mounting apparatus 11 include components P1, P2, etc., as shown in Figure 3. Component P1 is a standard component having a size less than or equal to a predetermined size that can be picked up by each picking member 23 mounted on the mounting head 22, and examples include fine chip components. Component P2 has a size that, when picked by the picking member 23, would hinder the picking of other components by the picking member 23. For example, it is a large component that is larger than a predetermined size. Alternatively, as shown in Figure 3, component P2 may have a size that would interfere with (contact) other components P if those components are picked. The mounting head 22 is configured to pick only one component P2 at a time to prevent interference with other components P. This component P2 may be supplied by a tray 15.

[0012] The imaging unit 16 is an image-capturing device and is a parts camera that captures images of one or more components P acquired and held by the mounting head 22. This imaging unit 16 is located between the component supply unit 13 and the substrate processing unit 12. The imaging range of the imaging unit 16 is above the imaging unit 16, and the image-capable range is, for example, the imaging range 39 shown in Figure 3. The imaging unit 16 comprises an illumination unit 17, an image sensor 18, and an image processing unit. The illumination unit 17 is configured to irradiate light upwards and irradiate light onto the components P held by the mounting head 22. The image sensor 18 is an element that generates an electric charge upon receiving light and outputs the generated charge. The image sensor 18 may be, for example, a CMOS image sensor. The image processing unit performs processing to generate image data based on the input electric charge. When the mounting head 22 holding the components P passes above the imaging unit 16, the imaging unit 16 captures an image while the mounting head 22 is moving or while the mounting head 22 is stopped, and outputs the captured image data to the control device 30.

[0013] The mounting unit 20 is a unit that picks up components P from the component supply unit 13 and places them on a substrate S fixed to the substrate processing unit 12. The mounting unit 20 includes a head moving unit 21, a mounting head 22, a picking member 23, a reference unit 24, and a standby unit 19. The head moving unit 21 includes a slider that moves in the XY direction guided by a guide rail and a motor that drives the slider. The mounting head 22 picks up multiple components and moves in the XY direction by the head moving unit 21. This mounting head 22 is detachably mounted on the slider. One or more picking members 23 are detachably mounted on the lower surface of the mounting head 22. Multiple picking members 23 for picking components P are arranged circumferentially on the mounting head 22 (see Figures 2 and 3). The picking member 23 may be a nozzle that picks up components using negative pressure. In addition to a nozzle, the picking member 23 may be a mechanical chuck or the like that mechanically holds the component P. The reference section 24 is a reference mark that serves as a reference position in the image captured by the imaging section 16. The reference mark can be any member that serves as a reference position, and may have a visually recognizable shape such as a circle or a polygon. Two reference sections 24 are provided on the mounting head 22 near rotation positions D and F. The standby section 19 is a nozzle station that holds the sampling member 23 that is not yet mounted on the mounting head 22.

[0014] The mounting head 22 is capable of mounting multiple sampling members 23 for sampling parts P, and is configured as a rotary-type work head that is held in a rotatable state, as shown in Figure 2. Figure 2 illustrates a configuration that can mount eight sampling members 23, but is not limited to this; the number of sampling members 23 that can be mounted can be any number, such as two, four, six, or twelve, and it may be a non-rotatable type instead of a rotary type. As shown in Figure 2, the mounting head 22 comprises a mounting member 25, an R-axis drive unit 26, a Q-axis drive unit 27, a Z-axis drive unit 28, and a rotary unit 29. The mounting member 25 is a long-axis cylindrical holder that removably mounts the sampling member 23. The lower end of the mounting member 25 is fitted with the sampling member 23, and a pinion gear is disposed at the upper end. The mounting member 25 is supported by the rotary unit 29 so that it can be raised and lowered by the Z-axis drive unit 28 at a predetermined rotational position. This pinion gear meshes with a ring gear (not shown) that is rotatably supported on the main body of the mounting head 22. The R-axis drive unit 26 is a motor that rotates the entire rotary unit 29 on which the sampling member 23 is mounted. By rotating the rotary unit 29, the R-axis drive unit 26 rotates (revolves) the sampling member 23 along its circumference. The Q-axis drive unit 27 is a motor that rotates the mounting member 25 at each rotational position. By rotating a ring gear (not shown), the Q-axis drive unit 27 rotates all the pinion gears in conjunction, causing all the mounting members 25 to rotate synchronously. The Z-axis drive unit 28 is a linear actuator that raises and lowers the mounting member 25 along the Z-axis. The Z-axis drive unit 28 may be configured as a ball screw and a motor, or as a linear motor.

[0015] The control device 30 is configured as a microprocessor centered around a control unit 31 including a CPU, and includes a storage unit 32 for storing various data. This control device 30 outputs control signals to the board processing unit 12, component supply unit 13, imaging unit 16, and mounting unit 20, and inputs signals from the component supply unit 13, imaging unit 16, and mounting unit 20. The storage unit 32 stores mounting condition information 33, unique position information 34, reference member information 35, etc. The mounting condition information 33 includes information such as the sampling order and placement order when mounting components P, the identification information (ID) of components P, and the placement position (coordinates) on the board S. The unique position information 34 includes data for correcting the amount of deviation in the tip position of the sampling member 23 when it is positioned at rotation positions A to H of the mounting head 22. The unique position information 34 associates the identification information (ID) of the sampling member 23 with a correction value that corrects the amount of positional deviation of the tip when it is positioned at each rotation position A to H. Furthermore, each correction value is associated with the respective correction values ​​when the rotation angle of the sampling member 23 at the vertically moving rotation position A is θ1(°) and θ2(°). This rotation angle is defined because the sampling member 23 can rotate at each rotation position; for example, the sampling member 23 at rotation position A may be θ1=0° and θ1=90°. The correction value for the tip position of the sampling member 23 is associated with each rotation angle, as shown in Figure 4. The unique position information 34 may also include correction values ​​relating to the combination of the sampling member 23 and any of the multiple mounting members 25. The reference member information 35, as will be described in detail later, includes information about a predetermined member to be used as a reference position when the reference unit 24 is not included in the imaging range 39 and the reference unit 24 cannot be used. In the mounting device 11, the predetermined member used in place of the reference unit 24 is set to the tip position of the sampling member 23 mounted on the mounting member 25. The predetermined member used in place of the reference unit 24 is selected based on the shape of the component, such that it is not hidden by the component P captured by the mounting head 22, and / or that it is located within the imaging range 39 of the imaging unit 16.This reference member information 35 is associated with the identification information (ID) of the component P that cannot use the reference part 24, information regarding the position of the sampling member 23 used as the reference position when the component P is sampled, and the identification information of the mounted sampling member 23 mounted at the reference position. The ID of the mounted sampling member is updated according to the mounting and removal of the sampling member 23 to the mounting member 25 at the reference position.

[0016] The management device 40 is a computer that manages information of each device in the mounting system 10. As shown in FIG. 1, the management device 40 includes a control unit 41, a storage unit 42, a display unit, and an input device. The control unit 41 is configured as a microprocessor centered on a CPU. The storage unit 42 is a device that stores various data such as processing programs, for example, an HDD. It is assumed that the mounting condition information 33, the unique position information 34, etc. of each mounting device 11 are stored as a database in the storage unit 42. The display unit is a liquid crystal screen that displays various information. The input device includes a keyboard and a mouse, etc. for an operator to input various commands.

[0017] Next, the operation of the mounting system 10 of this embodiment configured in this way, particularly the mounting process of arranging the component P on the substrate S, will be described. FIG. 5 is a flowchart showing an example of a mounting process routine executed by the control device 30 of the mounting device 11. This routine is stored in the storage unit 32 and executed by the control unit 31 based on the operator's input to start mounting. Here, the process when the mounting device 11 mounts the component P1 or the component P2 on the substrate S will be described as an example. When this routine is started, the control unit 31 first reads and acquires the mounting condition information 33 from the storage unit 32 (S100), and determines whether it is the update timing of the unique position information 34 (S110). This update timing may be empirically determined to a timing at which the amount of positional deviation at the tip of the sampling member 23 can be more reliably corrected, for example, when there is no correction information for the sampling member 23 or when the usage time of the sampling member 23 has elapsed a predetermined time. When it is the update timing of the unique position information 34 in S110, the control unit 31 executes the unique position information update process (S120).

[0018] FIG. 6 is a flowchart showing an example of an update processing routine executed by the control device 30 of the mounting device 11. This routine is stored in the storage unit 32 and is executed by the control unit 31 in S120 of the mounting processing routine. When this routine is started, the control unit 31 first causes the sampling member 23 in the standby unit 19 to be mounted on the mounting head 22 and moves the mounting head 22 to a predetermined imaging position of the imaging unit 16 (S300). The mounting of the sampling member 23 may be performed, for example, in the order in which they are housed in the standby unit 19. Also, the predetermined imaging position is defined such that the rotary unit 29 is located at the center of the imaging range 39 in the imaging unit 16. Next, the control unit 31 causes the imaging unit 16 to image when the sampling member 23 is at a predetermined rotational position and the rotational angle of the sampling member 23 is at a predetermined angle (S310). At this time, the control unit 31 causes the imaging unit 16 to capture an imaging image while appropriately changing to the next rotational angle and rotational position.

[0019] Figure 7 is an explanatory diagram illustrating an example of the process for obtaining a correction value to correct the position of the sampling member 23. For the sake of explanation, the sampling member 23 of interest will be referred to as sampling member 23a, and the one of interest next will be referred to as sampling member 23b. First, the control unit 31 moves the mounting head 22 to a predetermined position on the imaging unit 16, rotates the sampling member 23a to rotation position A, sets the rotation angle of the sampling member 23 to θ1 (°), and captures an image (Figure 7A). The control unit 31 can also acquire the tip positions of the sampling members 23 mounted at rotation positions B to H at rotation angle θ1, which are included in this captured image. Next, the rotation angle of the sampling member 23a is changed to θ2 (°), and the imaging unit 16 captures an image (Figure 7B). The control unit 31 can also acquire the tip positions of the sampling members 23 mounted at rotation positions B to H at rotation angle θ2, which are included in this captured image. Next, the control unit 31 moves the sampling member 23a to rotation position B and causes the imaging unit 16 to capture an image at rotation angle θ1 (Figure 7C). Then, the control unit 31 causes the imaging unit 16 to capture an image of the sampling member 23a at rotation angle θ2 at rotation position B. This process is repeated to obtain images of the sampling members 23a, 23b, etc. at rotation positions A to H at rotation angles θ1 and θ2.

[0020] Next, the control unit 31 determines whether it has finished imaging all the sampling members 23 in the standby unit 19 (S320). If it has not finished imaging all the sampling members 23, it executes the processing from S300 onwards. That is, the control unit 31 mounts the next sampling member 23 and executes the process of capturing an image at a predetermined rotation angle and predetermined rotation position. On the other hand, if it has finished imaging all the sampling members 23 in S320, the control unit 31 determines the amount of positional displacement of the sampling member 23 at a predetermined rotation angle and predetermined rotation position, determines a correction value to correct this positional displacement, stores it in the unique position information 34 (S330), and terminates this routine. Through this process, the control device 30 can update the unique position information 34, which includes the new correction value.

[0021] Now, after the update processing routine is completed in S120 of the mounting processing routine, or if it is not time to update the unique position information 34 in S110, the control unit 31 executes the mounting process from S130 onwards. In the mounting process, the control unit 31 causes the substrate processing unit 12 to transport and fix the substrate S (S130). Next, the control unit 31 sets the parts P to be picked up by the picking member 23 based on the arrangement order of the mounting condition information 33 (S140). Next, the control unit 31 attaches or replaces the picking member 23 as necessary, and causes the mounting unit 20 to pick up and move one or more parts P (S150). At this time, the control unit 31 moves the mounting head 22 so that it passes above the imaging unit 16.

[0022] Next, the control unit 31 determines whether or not a specific component P is present among those sampled by the mounting head 22 (S160). The control unit 31 determines that a specific component is present when a specific component P, such as component P2, which is larger than a predetermined size and limits the use of the total number of sampled members mounted on the mounting head 22, is sampled by the mounting head 22. If there is no specific component P, i.e., the sampled component P is smaller than or equal to the predetermined size, the control unit 31 performs a moving imaging process (also called fly vision) (S170) in which the mounting head 22 is moved without stopping between the time the component P is sampled and when it is mounted on the substrate S, so that the imaging unit 16 can image the component P sampled by the mounting head 22. The control unit 31 controls the head movement unit 21 so that the center of the entire sampled member 23 that is sampling the component P passes through the center of the imaging range 39, and controls the imaging unit 16 to take a picture based on the value of the servo counter of the head movement unit 21. At this time, the control unit 31 can obtain an image in which the entire component P1 is included in the imaging range 39 (see Figure 3A). Next, the control unit 31 uses the captured image and the reference unit 24 to obtain the position of the sampled part P (S180) and the amount of displacement of the part P (S220). The moving imaging process is an imaging process that takes place while moving, and due to the minute time difference in when the shutter is released, the position of the mounting head 22 shifts slightly with each image. The control unit 31 uses the reference unit 24 as a reference position and can determine the tip position of the sampling member 23 from the relative positional relationship between the reference unit 24 and the tip center position of the sampling member 23, thereby obtaining the position of the sampled part P. Furthermore, based on the obtained positional relationship, the control unit 31 can determine the distance (amount of displacement) between the center position of the acquired part P and the tip center position of the sampling member 23.

[0023] On the other hand, in S160, if a specific component P is among those picked up by the mounting head 22, the control unit 31 sets a predetermined member to serve as the reference position (S190). Based on the information contained in the reference member information 35, the control unit 31 sets the picking member 23 at a predetermined rotation position to the predetermined member. For example, as shown in Figure 4, for component P2, the reference position is the center of the tip of the picking member 23 currently mounted at rotation position G. Next, similar to S170, the control unit 31 performs a moving imaging process to allow the imaging unit 16 to image the component P picked up by the mounting head 22 without moving or stopping the mounting head 22 (S200). The control unit 31 controls the head movement unit 21 so that the center of the picking member 23 picking up component P2 passes through the center of the imaging range 39, and controls the imaging unit 16 to take a picture based on the value of the servo counter of the head movement unit 21. At this time, the control unit 31 can obtain an image in which the entire component P2 is included in the center of the imaging range 39 (see Figure 3B). Next, the control unit 31 uses the reference position of the sampling member 23 with a correction value to acquire the position of the part P2 sampled by the mounting head 22 (S210) and acquire the amount of displacement of the part P (S220). As described above, when the mounting head 22 is moved so that the part P2 moves in the center of the imaging range 39 to obtain an image, the reference unit 24 may be outside the imaging range 39 (see Figure 3B). Here, the control unit 31 uses the sampling member 23, which is a visible component included in the image, as the reference position. In addition, the sampling member 23 and the mounting member 25 may have deviations from their theoretical position at the tip center due to their manufacturing precision and bending due to load during use. The control unit 31 corrects this amount of deviation at the tip position of the sampling member 23 using the correction value of the unique position information 34. As a result, the control unit 31 can acquire a more accurate position of the part P2. For example, if the sampling member 23 with sampling member ID=#1 is mounted on the mounting member 25 at rotational position G and rotational angle θ1, the control unit 31 reads and obtains the corresponding correction value from the unique position information 34.Furthermore, the control unit 31 corrects the tip center position of the sampling member 23, which is at the rotational position of the reference position, using the correction value of the unique position information 34. From the relative positional relationship between the corrected tip center position of the sampling member 23, which is the reference position, and the tip center position of the sampling member 23 that holds the part P2, the control unit 31 can determine the tip position of the sampling member 23 in the captured image. In addition, the control unit 31 can determine the distance (amount of positional displacement) between the center position of the part P2 acquired from the captured image and the tip center position of the sampling member 23 that collected the part P2.

[0024] After S220, the control unit 31 places the component P in a position corrected for the acquired misalignment (S230). Then, the control unit 31 determines whether the mounting process for the current board is complete (S240), and if not, executes the processes from S140 onwards. That is, the control unit 31 sets the next component P to be sampled, replaces the sampling member 23 as needed, images the component P while moving it, corrects the misalignment, and places it on the board S. On the other hand, if the mounting process for the current board is complete in S240, the control unit 31 has the board processing unit 12 eject the completed board S (S250), and determines whether the production of the board S is complete (S260). If production is not complete, the control unit 31 executes the processes from S130 onwards, while if production is complete, this routine ends. In this way, the mounting device 11 can perform mounting processing not only for standard components P1 but also for large components P2 by correcting the misalignment of their sampling position through moving imaging processing.

[0025] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The control device 30 of this embodiment is an example of the control device of the present disclosure, the control unit 31 is an example of the control unit, the imaging unit 16 is an example of the imaging unit, the mounting unit 20 is an example of the mounting unit, the mounting head 22 is an example of the mounting head, and the mounting device 11 is an example of the mounting device. Furthermore, the reference unit 24 is an example of the reference unit, the sampling member 23 is an example of the predetermined member and the sampling member, and the mounting member 25 is an example of the mounting member. In addition, in this embodiment, an example of the control method of the mounting device of the present disclosure is also clarified by explaining the operation of the control device 30 and the mounting device 11.

[0026] The control device 30 of the embodiment described above is used in a mounting apparatus that performs mounting processing and includes a mounting unit 20 having a mounting head 22 that picks up a component P and mounts it on a substrate S, having a reference unit 24 which is a reference position and a picking member 23 which is a predetermined member different from the reference unit 24, and an imaging unit 16 that images the mounting head 22 that has picked up the component P and obtains an image. The control device 30 includes a control unit 31 that uses either the reference unit 24 or the predetermined member as the reference position depending on the type and / or size of the component P. In the control device 30, depending on the type and size of the component P, it may not be possible to image the reference unit 24 together with the component P, but even in such cases, the predetermined member can be used as the reference position, so the position of the component P can be obtained more reliably.

[0027] Furthermore, the control unit 31 moves the mounting head 22 without stopping it between the time the component P is picked up and when it is mounted on the substrate S, allowing the imaging unit 16 to image the component P picked up by the mounting head 22. With this control device 30, the mounting process can be performed without stopping the mounting head 22, thus shortening the processing time. In addition, the mounting head 22 can be fitted with multiple picking members 23 for picking up components P, and the predetermined member is a picking member 23 that is mounted on the mounting head 22 and picks up components P, even though it has not picked up any components P. Therefore, with this control device 30, the picking member that has not picked up any components P is used as the reference position without providing any other reference unit 24, thus further suppressing complexity of the configuration. Moreover, the control unit 31 acquires unique position information 34 related to the position correction of the picking member 23 before the mounting process, and uses the reference position using this unique position information 34 to acquire the position of the component P picked up by the mounting head 22. With this control device 30, by using the unique position information 34, it is possible to take into account positional deviations that may occur due to the mounting accuracy of the picking member 23, etc., and acquire a more accurate component position. Furthermore, the control device 30 selects a predetermined member that is not hidden by the part P captured by the mounting head 22, and / or a predetermined member that is located within the imaging range 39 of the imaging unit 16, based on the shape of the part P. In this control device 30, a predetermined member is selected that is not hidden by the part P and is located within the imaging range 39, so the reference position can be used more reliably. The control unit 31 then uses the reference unit 24 as the reference position for parts P1 of a predetermined size or smaller, and uses a predetermined member as the reference position for parts P2 that are larger than the predetermined size. In this control device 30, the predetermined size is determined based on the imaging range of the imaging unit 16 and the position of the reference unit 24 provided on the mounting head 22. For example, for large parts P2, where it may be difficult to obtain the part position due to the reference unit 24 being hidden by the suctioned part P, or the reference unit 24 being outside the imaging range 39 of the imaging unit 16, the part position can be obtained more reliably.

[0028] Furthermore, the mounting apparatus 11 mounts components P onto a substrate S, which is the object to be processed, and includes a mounting unit 20 having a mounting head 22 that picks up components P, which has a reference unit 24 that is a reference position and a predetermined member different from the reference unit 24, an imaging unit 16 that images the mounting head 22 that has picked up components P and obtains an image, and the control device 30 described above. Because this mounting apparatus 11 is equipped with the control device 30 and control unit 31 described above, the position of the components can be obtained more reliably. In addition, since the mounting apparatus 11 obtains the position of components P by moving imaging processing, the processing time can be shortened compared to stopping the mounting head 22 at a predetermined position in the imaging range 39 and obtaining an image. In particular, the mounting apparatus 11 can perform moving imaging processing not only on components P1 of a predetermined size or smaller, but also on large components P2 for which the number of components to be picked up is limited, so the time required for mounting processing can be further shortened.

[0029] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0030] For example, in the embodiment described above, a moving imaging process (fly vision) is performed in which the component P collected by the mounting head 22 is imaged by the imaging unit 16 without moving and stopping the mounting head 22. However, the invention is not limited to this, and a stopping imaging process (stop vision) may be performed in which the mounting head 22 is stopped at a predetermined stopping position and the component P collected by the mounting head 22 is imaged by the imaging unit 16. In this control device 30 as well, a predetermined member is used as the reference position instead of the reference unit 24, so the position of the component can be obtained more reliably. In particular, the mounting device 11 may perform a stopping imaging process when the reference position of the reference unit 24 or the predetermined member cannot be used.

[0031] In the embodiment described above, the predetermined member used as the reference position was explained as a sampling member 23 mounted on the mounting head 22 that does not have a component P sampled from it. However, it is not limited to this, and for example, a mounting member 25 that does not have a sampling member 23 mounted on it may be used as the predetermined member for the reference position, or it may be any other visible member or part of the mounting head 22. Using these predetermined members as reference positions will allow for more reliable determination of the component position.

[0032] In the embodiment described above, the position of part P is determined more accurately using unique position information 34 that corrects the position of the sampling member 23 as a predetermined member. However, the invention is not limited to this, and the use of unique position information 34 may be omitted. In this control device 30 as well, the position of the part can be obtained more reliably by using a predetermined member.

[0033] In the embodiment described above, instead of the reference unit 24, a sampling member 23, which is a predetermined member located at a rotational position set in advance in the unique position information 34, is used as the reference position, but the invention is not limited to this. For example, the control unit 31 may use the captured image to select a predetermined member that is captured together with the component P collected by the mounting head 22 in place of the reference unit 24. In particular, the control device 30 may automatically determine which position of predetermined member to use as the reference position in place of the reference unit 24. Figure 8 is a flowchart of an example of a process for determining a reference position in place of the reference unit 24 using the captured image. Note that this flowchart is a modified version of the mounting processing routine in Figure 5, and the same steps as in the mounting processing routine are numbered the same way, and their detailed explanations are omitted. In the mounting process of Figure 8, the control unit 31 executes the processes S100 to S160. Then, in S160, if there is a specific component, the control unit 31 stops the mounting head 22 and determines whether or not a stopped imaging component, which captures an image of the component P, has been collected by the mounting head 22 (S400). The stationary imaging component is a component type that will be set later in S450, and is a component P that cannot be subjected to moving imaging processing. If no stationary imaging component has been set yet, the control unit 31 determines in this step that there is no stationary imaging component. If there is no stationary imaging component on the mounting head 22 in S400, the control unit 31 moves and stops the mounting head 22 at a predetermined position and performs stationary imaging processing to image the component P captured by the mounting head 22 (S410). In the stationary imaging processing, a reference position is set at the center of the imaging range 39. Next, the control unit 31 extracts a sampled member 23 as a predetermined member from the captured image (S420) and determines whether there is a sampled member 23 that can serve as a reference (S430). The control unit 31 determines that there is a sampled member 23 that can serve as a reference if a sampled member 23 that can be recognized without being hidden by the component P is located at any of the rotation positions B to H. If there is a sampling member 23 that can serve as a reference, the control unit 31 sets the rotational position of the corresponding sampling member 23 to the reference position, stores it in reference member information 35, for example (S440), and executes the processing from S210 onward.On the other hand, if there is no sample member 23 that can serve as a reference in S430, the control unit 31 sets the component P sampled by the mounting head 22 as a component to be subjected to stop imaging (S450), obtains the position of the sampled component P using a reference point (such as the center of the imaging range 39) at a predetermined position where the mounting head 22 is stopped as the reference position (S460), and executes the processes from S220 onward. Then, if there is a component to be subjected to stop imaging among the components sampled by the mounting head 22 in S400, the control unit 31 executes the stop imaging process in the same manner as in S410 (S470), and executes the processes from S460 onward. In this way, the control device 30 obtains an image only at the beginning through stop imaging, and uses this image to set a predetermined member that will serve as the reference position. Furthermore, if there is no predetermined member that will serve as the reference position in this stop imaging process, the control unit 31 performs stop imaging on the relevant component to correct the misalignment of the sampled position of component P. This control device 30 can automatically set the predetermined member to serve as the reference position.

[0034] Furthermore, in the above-described embodiment, instead of the reference unit 24, a sampling member 23, which is a predetermined member located at a rotational position set in advance in the unique position information 34, is used as the reference position, but the device is not limited to this. For example, the control unit 31 may acquire information on the type and size of the component P from mounting condition information 33, etc., and automatically set a predetermined member to be used as the reference position instead of the reference unit 24 based on this information. In this control device 30, the predetermined member can be set automatically. Alternatively, the control unit 31 may select a predetermined member specified by the operator. In this control device 30, the predetermined member can be selected by the operator, which is more preferable as it offers greater flexibility.

[0035] In the embodiment described above, a predetermined member is used as the reference position instead of the reference part 24 for a part P2 that is larger than a part P1 of a predetermined size or smaller. However, a different predetermined member may be used when the reference part 24 cannot be used, regardless of whether the part P2 is particularly large.

[0036] In the embodiment described above, the sampling member 23, as a predetermined member, is used as a reference position to perform positional deviation correction when sampling part P. However, the invention is not limited to this, and for example, the sampling member 23, as a predetermined member, is used as a reference position to perform super-resolution processing to generate a higher-resolution image from two or more captured images. In this control device 30 as well, since the predetermined member can be used as a reference position when the reference unit 24 is unavailable, the position of part P can be obtained more reliably.

[0037] Furthermore, although the above-described embodiments have described the present disclosure as a control device 30, a mounting device 11, and a mounting system 10, it may also be, for example, a control method for the mounting device 11, or a program in which a computer executes the above-described process.

[0038] Herein, the present disclosure may be configured as follows. For example, the control method for a mounting apparatus of the present disclosure is a control method for a mounting apparatus comprising: a mounting unit having a mounting head that picks up a component and mounts it on a substrate, having a reference unit which is a reference position and a predetermined member different from the reference unit; and an imaging unit which images the mounting head that has picked up the component and obtains an image. Depending on the type and / or size of the aforementioned part, the step of using either the reference part or the predetermined member as the reference position, It includes.

[0039] In this control method for the mounting device, similar to the control device described above, a predetermined member can be used as a reference position, thus more reliably obtaining the position of the component. In this control method for the mounting device, various embodiments of the control device and mounting device described above may be adopted, and steps to realize each of the functions of the control device and mounting device described above may be added.

[0040] This specification also discloses technical concepts in which "the control device described in claim 1 or 2" in the original claim 4 was changed to "the control device described in any one of claims 1 to 3", technical concepts in which "the control device described in claim 1 or 2" in the original claim 5 was changed to "the control device described in any one of claims 1 to 4", and technical concepts in which "the control device described in claim 1 or 2" in the original claim 6 was changed to "the control device described in any one of claims 1 to 5". [Industrial applicability]

[0041] This disclosure can be used in apparatus for mounting components onto a substrate. [Explanation of Symbols]

[0042] 10 Mounting system, 11 Mounting device, 12 Substrate processing unit, 13 Component supply unit, 14 Feeder, 15 Tray, 16 Imaging unit, 17 Illumination unit, 18 Image sensor, 19 Standby unit, 20 Mounting unit, 21 Head movement unit, 22 Mounting head, 23, 23a, 23b Sampling material, 24 Reference unit, 25 Mounting material, 26 R-axis drive unit, 27 Q-axis drive unit, 28 Z-axis drive unit, 29 Rotary unit, 30 Control device, 31 Control unit, 32 Storage unit, 33 Mounting condition information, 34 Unique position information, 35 Reference material information, 39 Imaging range, 40 Management device, 41 Control unit, 42 Storage unit, A~H Rotation position, P, P1, P2 Component, S Substrate.

Claims

1. A mounting unit having a mounting head that has a reference part and a predetermined member different from the reference part, which picks up a component and mounts it on a substrate, An imaging unit that images the mounting head from below and obtains images of the reference unit, the predetermined member, and the component captured by the mounting head, A storage unit stores the position of the predetermined member relative to the reference unit based on the imaging results of the reference unit and the predetermined member that have been previously imaged by the imaging unit, A control unit that acquires the position of the component captured on the mounting head using either the reference unit or the predetermined member as a reference position, depending on the type and / or size of the component; A mounting device equipped with this device.

2. The mounting head can be equipped with multiple sampling members for sampling the components. The mounting apparatus according to claim 1, wherein the predetermined member is one or more of the following: a sampling member that has not sampled the component and is attached to the mounting head for sampling the component; and a mounting member for attaching the sampling member.

3. The storage unit acquires and stores the unique position information of the sampling member and / or the mounting member before the mounting process. The mounting apparatus according to claim 1, wherein the control unit obtains the position of the component taken by the mounting head using the reference position obtained using the unique position information stored in the storage unit.

4. The mounting apparatus according to claim 1 or 2, wherein the control unit moves the mounting head without stopping it between the time the component is picked up and the time it is mounted on the substrate, causing the imaging unit to image the component picked up by the mounting head.

5. The mounting head has a plurality of predetermined members as reference positions, The mounting apparatus according to claim 1 or 2, wherein the control unit selects one of the predetermined members as the reference position based on one or more of the conditions (1) to (3). (1) Based on the shape of the component, a predetermined member is selected that is not hidden by the component captured on the mounting head, and / or that is located within the imaging range of the imaging unit. (2) Select the predetermined member specified by the worker. (3) Using the captured image, select the predetermined member that is captured together with the collected part.

6. The mounting apparatus according to claim 1 or 2, wherein the control unit uses the reference portion at the reference position for components of a predetermined size or smaller, and uses the predetermined member at the reference position for components larger than the predetermined size.

7. A control method for controlling a mounting apparatus comprising: a mounting unit having a mounting head that has a reference unit and a predetermined member different from the reference unit and picks up a component and mounts it on a substrate; and an imaging unit that can image the mounting head from below and obtains an image of the reference unit, the predetermined member and the component picked up by the mounting head, (a) A step of obtaining the position of the predetermined member relative to the reference unit based on the imaging result of the reference unit imaging the reference unit and the predetermined member, (b) A step in which either the reference part or the predetermined member is used as a reference position, depending on the type and / or size of the part, (c) A step of obtaining the position of the component relative to the reference position based on the imaging result of the component taken by the mounting head, A control method for an implementation device that includes [a specific component].

Images