Wiring board, electronic component mounting package using wiring board, and electronic module

Abstract

This wiring board is provided with: an insulator; and a first ground conductor, a first signal conductor, a second signal conductor, and a second ground conductor arranged in this order in a first direction on the insulator. The insulator has a first region extending in the first direction, and a first opening located in the first region. The first ground conductor has a first grounding line and a second grounding line opposed to each other. The second ground conductor has a third grounding line and a fourth grounding line opposed to each other. The first signal conductor has: a pair of first electrode portions opposed to each other across the first region; a first line portion; and a second line portion. The second signal conductor has: a pair of second electrode portions opposed to each other across the first region; a third line portion; and a fourth line portion. The first opening is located in a first section, of the first region, positioned between the first signal conductor and the second signal conductor in the first direction.

Description

Wiring board, package for mounting electronic components using wiring board, and electronic module

[0001] The present invention relates to a wiring board, an electronic component mounting package using the wiring board, and an electronic module.

[0002] A conventional wiring board is described in, for example, Japanese Patent Application Laid-Open No. 2003-222999.

[0003] International Publication No. 2020 / 040072

[0004] In one embodiment (1), a wiring board includes an insulator, a ground conductor portion, and a signal conductor portion. The insulator has a first upper surface. The first upper surface has a first region extending in a first direction. The ground conductor portion is located on the first upper surface and extends in a second direction intersecting the first direction. The signal conductor portion is located on the first upper surface and extends in the second direction. The insulator has a first opening, at least a portion of which is located in the first region. The ground conductor portion includes a first ground conductor and a second ground conductor located spaced apart from the first ground conductor. The signal conductor portion includes a first signal conductor and a second signal conductor. The first signal conductor is located between the first and second ground conductors. The second signal conductor is located spaced apart from the first signal conductor and between the first and second ground conductors. The first ground conductor includes a first ground line and a second ground line. The second ground line faces the first ground line in the second direction, sandwiching the first region. The second ground conductor has a third ground line and a fourth ground line. The fourth ground line faces the third ground line in the second direction, sandwiching the first region. The first signal conductor has a pair of first electrode portions, a first line portion, and a second line portion. The pair of first electrode portions face each other in the second direction, sandwiching the first region. The first line portion is connected to one of the pair of first electrode portions and extends away from the first region. The second line portion is connected to the other of the pair of first electrode portions and extends away from the first region. The second signal conductor has a pair of second electrode portions, a third line portion, and a fourth line portion. The pair of second electrode portions face each other in the second direction, sandwiching the first region. The third line portion is connected to one of the pair of second electrode portions and extends away from the first region. The fourth line portion is connected to the other of the pair of second electrode portions and extends away from the first region. In a plan view, the first ground conductor, the first signal conductor, the second signal conductor, and the second ground conductor are arranged in this order in a first direction. The first opening is located in a first portion of the first region between the first signal conductor and the second signal conductor in the first direction.

[0005] (2) In the wiring board of (1) above, the distance in the second direction between a pair of first electrode portions and the distance in the second direction between a pair of second electrode portions are smaller than at least one of the distance in the second direction between the first ground line and the second ground line and the distance in the second direction between the third ground line and the fourth ground line.

[0006] (3) In the wiring board of (1) or (2) above, the dimension of the first opening in the second direction is larger than at least one of the distance in the second direction between a pair of first electrode portions and the distance in the second direction between a pair of second electrode portions.

[0007] (4) In the wiring boards of (1) to (3) above, the dimension of the first opening in the second direction is smaller than at least one of the distance in the second direction between the first ground line and the second ground line and the distance in the second direction between the third ground line and the fourth ground line.

[0008] (5) In the wiring board according to any one of (1) to (4) above, the first opening extends at least from between the pair of first electrode portions to between the pair of second electrode portions.

[0009] (6) In the wiring board of (5) above, the dimension of the first opening in the first direction is greater than the distance in the first direction between the first ground conductor and the second ground conductor.

[0010] (7) In the wiring board of any one of (1) to (6), the insulator further has a second opening and a third opening. At least a portion of the second opening is located in the first region. At least a portion of the third opening is located in the first region. The second opening is located between the first ground line and the second ground line in the second direction and spaced apart from the first signal conductor in the first direction. The third opening is located between the third ground line and the fourth ground line in the second direction and spaced apart from the second signal conductor in the first direction.

[0011] (8) In the wiring board of (7) above, the first opening has a first connection portion and a second connection portion. The first connection portion is connected to the second opening. The first connection portion is located between the pair of first electrode portions in the second direction. The second connection portion is connected to the third opening. The second connection portion is located between the pair of second electrode portions in the second direction.

[0012] (9) In the wiring board of (7) or (8) above, the dimension of the first opening in the second direction is smaller than the dimension of the second opening in the second direction and the dimension of the third opening.

[0013] (10) In the wiring board of any one of (7) to (9) above, the depth of the first opening is greater than at least one of the depth of the second opening and the depth of the third opening.

[0014] (11) In the wiring board of any one of (7) to (10), the second opening contacts the first ground line and the second ground line in plan view, and the third opening contacts the third ground line and the fourth ground line in plan view.

[0015] (12) In the wiring board according to any one of (1) to (11), the ground conductor portion further includes a third ground conductor located between the first signal conductor and the second signal conductor. The third ground conductor includes a fifth ground line and a sixth ground line. The sixth ground line faces the fifth ground line in the second direction across the first region.

[0016] (13) In the wiring board of (12) above, the distance in the second direction between the fifth ground line and the sixth ground line is greater than at least one of the distance in the second direction between the first ground line and the second ground line and the distance in the second direction between the third ground line and the fourth ground line.

[0017] (14) In one embodiment, an electronic component mounting package includes the wiring board of any one of (1) to (13) above, a substrate, and a frame. The frame is located on the substrate. The wiring board is fixed to the frame.

[0018] (15) In one embodiment, an electronic module includes the electronic component mounting package of (14), an electronic component, and a lid. The electronic component is housed in the electronic component mounting package and is electrically connected to a wiring board. The lid is joined to the frame and is positioned to cover the interior of the electronic component mounting package.

[0019] 12 is a perspective view of a wiring board according to a first embodiment. FIG. 13 is a plan view of a wiring board according to the first embodiment. FIG. 14 is a perspective view of a wiring board according to the first embodiment with a capacitor mounted on it. FIG. 15 is a perspective view of a wiring board according to a second embodiment. FIG. 16 is a plan view of a wiring board according to the second embodiment. FIG. 17 is a perspective view of a wiring board according to a third embodiment. FIG. 18 is a plan view of a wiring board according to the third embodiment. FIG. 19 is a perspective view of a wiring board according to a fourth embodiment. FIG. 20 is a plan view of a wiring board according to the fourth embodiment. FIG. 21 is a plan view of a wiring board according to a fifth embodiment. FIG. 22 is a cross-sectional view taken along XII-XII of the wiring board shown in FIG. 11. FIG. 23 is an exploded perspective view of a wiring board according to the fifth embodiment. FIG. 24 is a perspective view of a wiring board according to a sixth embodiment. FIG. 25 is a plan view of a wiring board according to the sixth embodiment. FIG. 26 is an enlarged perspective view of a main part A shown in FIG. 27. FIG. 28 is an exploded perspective view of an electronic component mounting package and an electronic module including a wiring board according to an embodiment. FIG. 29 is a graph showing the reflection characteristics of wiring boards according to the fourth embodiment and the fifth embodiment. FIG. 29 is a graph showing the transmission characteristics of wiring boards according to the fourth embodiment and the fifth embodiment. 10 is a graph showing TDR (Time Domain Reflectometry) of wiring boards according to the fourth and fifth embodiments.

[0020] In the technology disclosed in Patent Document 1, a wiring board has a first ground pattern, a first wiring path, a second wiring path, a second ground pattern, a first pad pair, and a second pad pair on a ceramic base. The first pad pair is provided midway through the first wiring path. The second pad pair is provided midway through the second wiring path. Furthermore, the technology disclosed in Patent Document 1 describes a wiring board in which capacitors are mounted on each of the first pad pair and the second pad pair.

[0021] However, as capacitors become smaller and thinner, when the capacitor is mounted on the first and second pad pairs with a bonding material such as solder, the bonding material may be connected across the first and / or second pad pairs, which may result in electrical connection between the first and / or second pad pairs, causing a short circuit.

[0022] Furthermore, as wiring boards become smaller and thinner, it becomes necessary to place the first ground pattern and / or the second ground pattern closer to the first wiring path and the second wiring path. In this case, the bonding material may come into contact with the first ground pattern and / or the second ground pattern, resulting in an electrical short circuit. Furthermore, it may become difficult to adjust the impedance values ​​of the first wiring path and the second wiring path.

[0023] <Configuration of Wiring Board> Several exemplary embodiments will be described below with reference to the drawings. Note that while any direction of the wiring board may be considered up or down, for convenience, a Cartesian coordinate system xyz is defined, with the positive side of the z direction being considered up. In this disclosure, a plan view is a concept that includes a planar perspective view. Also, in this disclosure, the first direction refers to, for example, the x direction in the drawings. The second direction refers to, for example, the y direction in the drawings. The third direction refers to, for example, the z direction in the drawings. Note that in this disclosure, width, length, and thickness can refer to the dimension in the x direction, the dimension in the y direction, and the dimension in the z direction, respectively. Also, in the following, only the parts of the configurations of the second, third, fourth, fifth, and sixth embodiments that differ from the configurations of the respective embodiments will be described. The other configurations will be denoted by the same reference numerals as in the respective embodiments, and description thereof will be omitted.

[0024] 1 to 3, a wiring substrate 101A according to a first embodiment will be described. Note that the first region 1s is omitted in some of the drawings for convenience. The wiring substrate 101A includes an insulator 1, a ground conductor portion G0, and a signal conductor portion S0.

[0025] The insulator 1 has a first top surface 1t. The first top surface 1t has a first region 1s extending in a first direction (i.e., the x-direction). The first region 1s may be defined as a region sandwiched between a pair of first electrode portions S11 and a pair of second electrode portions S21 (described later). More specifically, the first region 1s may extend in the x-direction from at least a first virtual line T1 connecting the outer edges of the first ground line G1a and the second ground line G1b to a second virtual line T2 connecting the outer edges of the third ground line G2a and the fourth ground line G2b. In one embodiment, the first region 1s is rectangular, but may also be elliptical or partially inclined in the y-direction.

[0026] Examples of materials that can be used for the insulator 1 include ceramic materials such as aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, and silicon nitride sintered body, and dielectric materials such as glass ceramic material and glass epoxy material.

[0027] The insulator 1 may be a single layer or may have a configuration in which multiple insulating layers are stacked. For example, the insulator 1 has a rectangular shape in a plan view, with dimensions of 4 mm × 4 mm to 50 mm × 50 mm and a thickness of 0.5 mm to 10 mm. In one embodiment, the insulator 1 may have a configuration in which a third insulating layer 13, a second insulating layer 12, and a first insulating layer 11 are stacked in this order in the positive direction of the z-axis, as shown in FIG. 1 etc.

[0028] The insulator 1 and the ground conductor portion G0 and signal conductor portion S0 described below may be produced by additive manufacturing (AM) using a 3D printer.

[0029] The insulator 1 can be manufactured, for example, as follows: A plurality of green sheets are processed using a mold or the like to prepare a plurality of green sheets formed to the outer shape of the insulator 1. Next, the plurality of green sheets are stacked so that their outer edges coincide with each other to form a green sheet laminate. The green sheet laminate is fired to sinter the plurality of green sheets, thereby obtaining the insulator 1. The ground conductor portion G0 is located on the first upper surface 1t and extends in a second direction (i.e., the y direction) intersecting the first direction. The ground conductor portion G0 has a first ground conductor G1 and a second ground conductor G2 located at a distance from the first ground conductor G1.

[0030] Examples of materials for the ground conductor G0 include metal materials such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. The ground conductor G0 may be formed by sintering a metal paste on the first upper surface 1t, or by using a thin-film formation technique such as a vapor deposition method or a sputtering method. The first ground conductor G1, the second ground conductor G2, and the third ground conductor G3 described below do not need to be made of the same material and may be made of different materials.

[0031] Metal plating such as nickel plating or gold plating may be formed on the surface of the ground conductor G0. Furthermore, an insulating film such as ceramic (e.g., an alumina coating) and / or resin may be further located on a portion of the ground conductor G0. The insulating film may be formed on the ground conductor G0 by screen printing. Furthermore, the insulating film may be located only on a portion of the ground conductor G0. This configuration reduces the possibility of the ground conductor G0 shorting out with other wiring.

[0032] The first ground conductor G1 has a first ground line G1a and a second ground line G1b. The second ground line G1b faces the first ground line G1a in the y direction across the first region 1s. That is, the first ground line G1a and the second ground line G1b are separated by the first region 1s. This state may also be described as the first ground conductor G1 being cut by the first region 1s. In one embodiment, the first ground line G1a and the second ground line G1b have a linear shape, but may also have a partially curved shape. In one embodiment, the first ground line G1a and the second ground line G1b have a line-symmetric shape across the first region 1s, but the first ground line G1a and the second ground line G1b may have different shapes.

[0033] The first ground conductor G1 may be electrically connected to the inner-layer ground conductor G4 by vias or the like. More specifically, the first ground line G1a and the second ground line G1b may each be electrically connected to the inner-layer ground conductor G4 by vias or the like. In this case, the first ground line G1a and the second ground line G1b may be electrically connected via the inner-layer ground conductor G4. The third ground line G2a and the fourth ground line G2b, which will be described later, may also have the same or similar configuration as the first ground line G1a and the second ground line G1b.

[0034] The second ground conductor G2 has a third ground line G2a and a fourth ground line G2b. The fourth ground line G2b faces the third ground line G2a in the y direction across the first region 1s. That is, the third ground line G2a and the fourth ground line G2b are separated by the first region 1s. This state may also be described as the second ground conductor G2 being cut by the first region 1s. In one embodiment, the third ground line G2a and the fourth ground line G2b have a linear shape, but may also have a partially curved shape. Furthermore, the third ground line G2a and the fourth ground line G2b have line-symmetric shapes across the first region 1s, but the third ground line G2a and the fourth ground line G2b may have different shapes. Furthermore, the second line conductor G2 does not need to have the same shape as the first ground conductor G1 and may have a different shape. Furthermore, the width, length, and thickness of the first ground conductor G1 and the width, length, and thickness of the second ground conductor G2 may be the same or different.

[0035] The signal conductor portion S0 is located on the first upper surface 1t and extends in the y direction. The material of the signal conductor portion S0 may be the same as or different from the material of the ground conductor portion G0, for example, a material the same as or similar to the material of the ground conductor portion G0 described above. Note that the signal conductor portion S0 and the ground conductor portion G0 do not necessarily need to be made of the same material and may be different. Furthermore, the signal conductor portion S0 may be formed by the same or similar method as the ground conductor portion G0 described above.

[0036] The signal conductor portion S0 has a first signal conductor S1 and a second signal conductor S2. In one embodiment, the first signal conductor S1 and the second signal conductor S2 form a pair of differential signal lines. A differential signal line can reduce the possibility of being affected by noise compared to a single-ended signal line.

[0037] The first signal conductor S1 is located between the first ground conductor G1 and the second ground conductor G2. The first signal conductor S1 has a pair of first electrode portions S11, a first line portion S12a, and a second line portion S12b. The pair of first electrode portions S11 face each other in the y direction with the first region 1s interposed therebetween. The first line portion S12a is connected to one of the pair of first electrode portions S11, S11a, and extends away from the first region 1s. The second line portion S12b is connected to the other of the pair of first electrode portions S11, S11b, and extends away from the first region 1s.

[0038] One S11a of the pair of first electrode portions S11 and the other S11b of the pair of first electrode portions S11 do not have to be symmetrical with respect to the first region 1s. That is, the pair of first electrode portions S11 may have the same shape or different shapes. In addition, in one embodiment, the width of the pair of first electrode portions S11 may be larger than the width of the first line portion S12a and the width of the second line portion S12b. Note that the width of the pair of first electrode portions S11 may be the same as or different from the width of the first line portion S12a and the second line portion S12b. The relationship between the width of the pair of second electrode portions S21, the width of the third line portion S22a, and the width of the fourth line portion S22b, which will be described later, may also be the same as the above.

[0039] Electric circuit elements such as capacitors, inductors, resistors, noise reduction filters, chip beads, etc. can be connected to the pair of first electrode portions S11. In one embodiment, first capacitors 31 can be electrically connected to the pair of first electrode portions S11, as shown in Fig. 3. Connecting the first capacitors 31 to the pair of first electrode portions S11 can reduce the DC voltage component of the signal transmitted through the first signal conductor S1.

[0040] The first capacitor 31 may be rectangular in plan view, with dimensions of 0.1 mm x 0.1 mm to 2 mm x 4 mm, and a height of 0.1 mm to 3 mm. The width of the first capacitor 31 may be greater than the width of the pair of first electrode portions S11 in plan view. The first capacitor 31 may contain, for example, forsterite, aluminum oxide, barium magnesium niobate, and barium neodymium titanate. More specifically, the first capacitor 31 may be a multi-layer ceramic capacitor (MLCC) or a silicon capacitor.

[0041] The second signal conductor S2 is located apart from the first signal conductor S1 and between the first ground conductor G1 and the second ground conductor G2. The second signal conductor S2 has a pair of second electrode portions S21, a third line portion S22a, and a fourth line portion S22b. The pair of second electrode portions S21 face each other in the y direction with the first region 1s interposed therebetween. The third line portion S22a is connected to one S21a of the pair of second electrode portions S21 and extends away from the first region 1s. The fourth line portion S22b is connected to the other S21b of the pair of second electrode portions S21 and extends away from the first region 1s.

[0042] Electric circuit elements such as capacitors, inductors, and resistors can be connected to the pair of second electrode portions S21. The electric circuit elements connected to the pair of second electrode portions S21 may be the same as or different from the electric circuit elements connected to the pair of first electrode portions S11. In one embodiment, as shown in FIG. 3 , second capacitors 32 can be electrically connected to the pair of second electrode portions S21. Connecting the second capacitors 32 to the pair of second electrode portions S21 can reduce the DC voltage component of the signal transmitted through the second signal conductor S2.

[0043] In the following description, the pair of first electrode portions S11 and the pair of second electrode portions S21 may be collectively referred to as electrode portions. Furthermore, the first capacitor 31 and the second capacitor 32 may be collectively referred to as electric circuit elements.

[0044] The first capacitor 31 can be connected to the pair of first electrode portions S11 by a bonding material. The second capacitor 32 can be connected to the pair of second electrode portions S21 by a bonding material. As the bonding material, for example, a well-known solder such as Sn—Ag—Cu solder, Sn—Zn—Bi solder, or Sn—Cu solder can be used.

[0045] In a plan view, the first ground conductor G1, the first signal conductor S1, the second signal conductor S2, and the second ground conductor G2 are arranged in this order in the x direction. In other words, the first signal conductor S1 and the second signal conductor S2 are sandwiched between the first ground conductor G1 and the second line conductor G2 in the x direction. This allows the wiring board 101A to have a differential signal line or a coplanar structure, and enables stable transmission of high-frequency signals in the signal conductor portion S0.

[0046] The insulator 1 has a first opening O1, at least a portion of which is located in the first region 1s. The first opening O1 may be formed by punching the insulator 1 before sintering, or by performing a known drilling process such as drilling, blasting, or laser processing on the insulator 1 after sintering. In one embodiment, the first opening O1 has a rectangular shape with rounded corners in a plan view. However, the first opening O1 may have a square shape or a circular shape including an elliptical shape in a plan view. The first opening O1 may penetrate the insulator 1.

[0047] The first opening O1 is filled with at least one dielectric material, such as air, a resin material, or a glass material, and has a lower dielectric constant than the insulator 1. This allows the characteristic impedance of the first signal conductor S1 and the second signal conductor S2 to be adjusted to a desired value when transmitting a high-frequency signal. This reduces the signal power loss that occurs in the first signal conductor S1 and the second signal conductor S2.

[0048] The first opening O1 is located in the first portion 1r of the first region 1s in the x-direction, between the first signal conductor S1 and the second signal conductor S2. Therefore, even if the amount of bonding material connecting the first capacitor 31 and the pair of first electrode portions S11 or the amount of bonding material connecting the second capacitor 32 and the pair of second electrode portions S21 increases, the excess bonding material can be contained within the first opening O1, reducing the possibility of the bonding materials coming into contact with each other and causing an electrical short. Furthermore, this allows the distance between the pair of electrode portions S11 and the pair of second electrode portions S21 to be reduced. Therefore, even when the electrical circuit elements are miniaturized along with the wiring board 101A, the electrical circuit elements can be stably mounted on the electrodes.

[0049] In plan view, at least a part of the inner-layer ground conductor G4 may be located on the bottom surface of the first opening O1, i.e., at least a part of the inner-layer ground conductor G4 may be exposed on the bottom surface of the first opening O1.

[0050] In one embodiment, the distance Ls1 in the y direction between the pair of first electrode portions S11 and the distance Ls2 in the y direction between the pair of second electrode portions S21 may be smaller than at least one of the distance Lg1 in the y direction between the first ground line G1a and the second ground line G1b and the distance Lg2 in the y direction between the third ground line G2a and the fourth ground line G2b. More specifically, the first ground conductor G1 and the second ground conductor G2 may not be located on at least a portion of the x-direction lateral sides of the pair of electrode portions S11 and the pair of second electrode portions S21. The impedance value is likely to be low between the pair of first electrode portions S11 to which the first capacitor 31 is connected and the pair of second electrode portions S21 to which the second capacitor 32 is connected. Therefore, the above-described configuration can reduce the possibility of a decrease in the impedance value at the electrode portions. Furthermore, with the above-described configuration, when mounting an electrical circuit element on the electrode portion, the possibility of the protruding bonding material coming into contact with the first ground conductor G1 and / or the second ground conductor G2, causing a short circuit between the first signal conductor S1 and / or the second signal conductor S2, can be reduced.

[0051] The dimension L1y of the first opening O1 in the y direction may be greater than at least one of the distance Ls1 in the y direction between the pair of first electrode portions S11 and the distance Ls2 in the y direction between the pair of second electrode portions S21. This reduces the possibility of a decrease in impedance in electrodes that are prone to low impedance when mounting electrical circuit elements. Note that the dimension L1y of the first opening O1 in the y direction refers to the maximum dimension of the first opening O1 in the y direction.

[0052] In one embodiment, the first line portion S12a, the second line portion S12b, the third line portion S22a, and the fourth line portion S22b are not located to the sides of the first opening O1 in the x direction, but at least one of the first line portion S12a, the second line portion S12b, the third line portion S22a, and the fourth line portion S22b may be located to the sides of the first opening O1 in the x direction.

[0053] The dimension L1y of the first opening O1 in the y direction may be smaller than at least one of the distance Lg1 between the first ground line G1a and the second ground line G1b in the y direction and the distance Lg2 between the third ground line G2a and the fourth ground line G2b in the y direction. That is, the first ground line G1a and the second ground line G1b may be spaced apart in the y direction by a distance greater than the dimension L1y of the first opening O1 in the y direction. Furthermore, the third ground line G2a and the fourth ground line G2b may be spaced apart in the y direction by a distance greater than the dimension L1y of the first opening O1 in the y direction. This configuration allows the first ground conductor G1 and / or the second ground conductor G2 to be spaced further away from the sides of the pair of electrode portions S11 and the pair of second electrode portions S21 in the x direction, thereby reducing the possibility of a decrease in the impedance value of the electrode portions.

[0054] The ground conductor portion G0 may further include a third ground conductor G3 located between the first signal conductor S1 and the second signal conductor S2. In other words, the third ground conductor G3 may be sandwiched between the first signal conductor S1 and the second signal conductor S2.

[0055] The third ground conductor G3 may include a fifth ground line G3 a and a sixth ground line G3 b. In one embodiment, the fifth ground line G3 a and the sixth ground line G3 b are linear, but may be partially curved.

[0056] The sixth ground line G3b may face the fifth ground line G3a across the first region 1s in the y direction. This configuration strengthens the ground potential around the signal conductor portion S0, thereby reducing the possibility of resonance occurring in the first signal conductor S1 and the second signal conductor S2.

[0057] The distance Lg3 in the y direction between the fifth ground line G3a and the sixth ground line G3b may be greater than at least one of the distance Lg1 in the y direction between the first ground line G1a and the second ground line G1b and the distance Lg2 in the y direction between the third ground line G2a and the fourth ground line G2b. Although the impedance value is likely to decrease in the space sandwiched between the first signal conductor S1 and the second signal conductor S2 (particularly, the pair of first electrode portions S11 and the pair of second electrode portions S21), the above-described configuration can reduce the possibility of the impedance value decreasing in the first signal conductor S1 and the second signal conductor S2.

[0058] Second Embodiment A wiring substrate 101B according to a second embodiment will be described with reference to FIGS.

[0059] In the second embodiment, the first opening O1 may extend from between at least a pair of first electrode portions S11 to a pair of second electrode portions S21. That is, the first opening O1 may be located below the first capacitor 31 and the second capacitor 32. Therefore, even if at least one of the amount of bonding material connecting the pair of first electrode portions S11 and the first capacitor 31 and the amount of bonding material connecting the pair of second electrode portions S21 and the second capacitor 32 increases, the excess bonding material can be contained within the first opening O1, thereby reducing the possibility of the bonding materials coming into contact with each other and causing an electrical short. Furthermore, this allows the distance between the pair of electrode portions S11 and the pair of second electrode portions S21 to be reduced. Therefore, even when the electrical circuit elements are miniaturized together with the wiring board 101B, the electrical circuit elements can be stably mounted on the electrodes.

[0060] Here, the depth of the first opening O1 may be shallow in part. That is, in a cross-sectional view perpendicular to the first surface 1t, the first opening O1 may have a stepped portion. Note that the depth here may be the maximum dimension in the z direction from the first surface 1t to the bottom surface of the first opening O1. Furthermore, in a cross-sectional view perpendicular to the first surface 1t, the bottom surface of the first opening O1 may have a curved shape that is convex in the negative direction of the z axis.

[0061] In one embodiment, the first opening O1 may have a portion in the x direction that extends further in the positive direction of the x axis than between the pair of first electrode portions S11. This portion may be considered as a second opening O2, which will be described later. In another embodiment, the first opening O1 may have a portion in the x direction that extends further in the negative direction of the x axis than between the pair of second electrode portions S21. This portion may be considered as a third opening O3, which will be described later.

[0062] The dimension L1x in the x-direction of the first opening O1 may be greater than the distance Lg12 in the x-direction between the first ground conductor G1 and the second ground conductor G2. Here, the distance Lg12 in the x-direction between the first ground conductor G1 and the second ground conductor G2 refers to the smallest distance between the outer edge of the first ground conductor G1 and the outer edge of the second ground conductor G2. The first opening O1 crosses the pair of first electrode portions S11, the pair of second electrode portions S21, the first ground conductor G1, and the second ground conductor G2 in the x-direction, thereby reducing the possibility of a decrease in the impedance value around the electrical circuit element.

[0063] Third Embodiment A wiring substrate 101C according to a third embodiment will be described with reference to FIGS.

[0064] The insulator 1 may further include a second opening O2 and a third opening O3. The second opening O2 and the third opening O3 can be formed in the insulator 1 by the same or similar method as for the first opening O1. Hereinafter, the first opening O1, the second opening O2, and the third opening O3 may be collectively referred to as openings.

[0065] At least a portion of the second opening O2 may be located in the first region 1s. The second opening O2 is located between the first ground line G1a and the second ground line G1b in the y direction and spaced apart from the first signal conductor S1 in the x direction. In other words, the second opening O2 is sandwiched between the first ground line G1a and the second ground line G1b in the y direction. In FIG. 6 , the second opening O2 is connected to the first opening O1, but the second opening O2 may be spaced apart from the first opening O1. In other words, the second opening O2 and the first opening O1 do not have to be connected.

[0066] At least a portion of the third opening O3 may be located in the first region 1s. The third opening O3 is located between the third ground line G2a and the fourth ground line G2b in the y direction and spaced apart from the second signal conductor S2 in the x direction. In other words, the second opening O2 is sandwiched between the third ground line G2a and the fourth ground line G2b in the y direction. In FIG. 6 , the third opening O3 is connected to the first opening O1, but the third opening O3 may be spaced apart from the first opening O1. In other words, the third opening O3 and the first opening O1 do not have to be connected.

[0067] With the above-described configuration, the pair of first electrode portions S11 are at least partially surrounded by the first opening O1 and the second opening O2, and the pair of second electrode portions S21 are at least partially surrounded by the first opening O1 and the third opening O3. This makes it possible to more effectively reduce the possibility of a decrease in impedance value in electrodes that may have a low impedance value when mounting an electric circuit element.

[0068] Furthermore, with the above-described configuration, excess bonding material generated when mounting the electrodes and the electric circuit elements can be contained within the second opening O2 and / or the third opening O3, thereby reducing the possibility of the bonding materials coming into contact with each other and / or the possibility of an electrical short circuit occurring between the signal conductor S0 and the ground conductor G0 due to the bonding material.

[0069] As shown in FIG. 6, the first opening O1 may have a first connection portion O11 and a second connection portion O12.

[0070] The first connection portion O11 may be connected to the second opening O2. The first connection portion O11 is located between the pair of first electrode portions S11 in the y direction. That is, the region of the first opening O1 that is located between the pair of first electrode portions S11 in the y direction and where the first opening O1 and the second opening O2 are connected can be the first connection portion O11.

[0071] The second connection portion O12 may be connected to the third opening O3. The second connection portion O12 is located between the pair of second electrode portions S21 in the y direction. That is, the region of the first opening O1 that is located between the pair of second electrode portions S21 in the y direction and where the first opening O1 and the third opening O3 are connected can be the second connection portion O12.

[0072] The above-described configuration effectively reduces the possibility of a decrease in the impedance value in the pair of first electrode portions S11 and the pair of second electrode portions S21. In addition, in this case, the openings can be formed simultaneously, making it possible to easily manufacture the wiring substrate 101C.

[0073] The dimension L1y in the y direction of the first opening O1 may be smaller than the dimension L2y in the y direction of the second opening O2 and the dimension L3y of the third opening O3. This allows the dimension L1y in the y direction of the first opening O1 to be set to a distance that matches the size of the electrical circuit element, effectively reducing the possibility of a decrease in impedance around the electrical circuit element without increasing the size of the wiring substrate 101C.

[0074] Fourth Embodiment A wiring substrate 101D according to a fourth embodiment will be described with reference to FIGS.

[0075] The insulator 1 further includes a second opening O2 and a third opening O3. In the fourth embodiment, the dimension L1y in the y direction of the first opening O1 may be larger than the dimension L2y in the y direction of the second opening O2 and the dimension L3y in the y direction of the third opening O3. This configuration effectively adjusts the impedance value by providing the openings, while reducing the possibility of a decrease in the strength of the insulator 1 by making the dimension L2y in the y direction of the second opening O2 and / or the dimension L3y in the y direction of the third opening O3 smaller than the dimension L1y in the y direction of the first opening O1. The dimension L2y in the y direction of the second opening O2 may be the same as or different from the dimension L3y in the y direction of the third opening O3.

[0076] Fifth Embodiment A wiring substrate 101E according to a fifth embodiment will be described with reference to FIGS.

[0077] In the fifth embodiment, the first opening O1 may have a maximum dimension L1y in the y direction between the first signal conductor S1 and the second signal conductor S2. In this case, the dimension L11y in the y direction of the first connection portion O11 and the dimension L12y in the y direction of the second connection portion O12 may be smaller than the dimension L1y in the y direction of the first opening O1. Furthermore, the dimension L2y in the y direction of the second opening O2 and / or the dimension L3y in the y direction of the third opening O3 may be equal to or greater than the dimension L1y in the y direction of the first opening O1. In other words, the pair of first electrode portions S11 may be at least partially surrounded by the first opening O1 including the first connection portion O11 and the second opening O2. Furthermore, the pair of second electrode portions S21 may be at least partially surrounded by the first opening O1 including the second connection portion O12 and the third opening O3. This allows the volume of the insulator 1 to be further reduced around the electrode portion, thereby more effectively reducing the possibility of a decrease in the impedance value in the first signal conductor S1 and the second signal conductor S2.

[0078] The depth D1 of the first opening O1 may be deeper than at least one of the depth D2 of the second opening O2 and the depth D3 of the third opening O3. This configuration further reduces the volume of the insulator 1 around the electrode portion where the impedance value may decrease, while reducing the possibility of a decrease in the strength of the insulator 1 at the second opening O2 and / or the third opening O3. The depth here may be the maximum dimension in the z-direction from the first surface 1t to the bottom surfaces of the first opening O1, the second opening O2, and the third opening O3. In addition, in a cross-sectional view perpendicular to the first surface 1t, the bottom surfaces of the openings may have a curved shape that is convex in the negative direction of the z-axis.

[0079] 12 , in the fifth embodiment, the first opening O1 extends to the first insulating layer 11 and the second insulating layer 12, but the second opening O2 and the third opening O3 are located only in the first insulating layer 11. Note that the second opening O2 and the third opening O3 do not necessarily need to penetrate the first insulating layer 11. Furthermore, the first opening O1 does not necessarily need to penetrate the first insulating layer 11 and the second insulating layer 12.

[0080] In another embodiment, the depth D1 of the first opening O1 may be shallower than at least one of the depth D2 of the second opening O2 and the depth D3 of the third opening O3. For example, when the wiring substrate 101E is located close to each other, the impedance value between adjacent signal conductor portions S0 may decrease. Therefore, the above configuration can reduce the possibility of the impedance value between adjacent signal conductor portions S0 decreasing.

[0081] In one embodiment, the inner-layer ground conductor G4 may be located between the second insulating layer 12 and the third insulating layer 13. Also, as shown in FIG. 13 , the inner-layer ground conductor G4 may have a lattice portion G4m. The lattice portion G4m is a portion of the inner-layer ground conductor G4 with through holes, and the conductor is in a mesh pattern. A portion of the lattice portion G4m may be exposed at the bottom surface of the first opening O1. Furthermore, at least a portion of the electrode portion may be located in a position of the lattice portion G4m that overlaps with the through hole in a plan view. This configuration stabilizes the ground potential of the wiring board 101E while reducing the possibility of a decrease in impedance in the electrode portion.

[0082] Sixth Embodiment A wiring substrate 101F according to a sixth embodiment will be described with reference to FIGS.

[0083] In a plan view, the second opening O2 may be in contact with the first ground line G1 a and the second ground line G1 b. In a plan view, the third opening O3 may be in contact with the third ground line G2 a and the fourth ground line G2 b. This configuration makes it easier to adjust the impedance around the electrode portion.

[0084] The second opening O2 may have a first notch K1 at a position where it contacts the first ground line G1 a and a second notch K2 at a position where it contacts the second ground line G1 b. The third opening O3 may have a third notch K3 at a position where it contacts the third ground line G2 a and a fourth notch K4 at a position where it contacts the fourth ground line G2 b.

[0085] Conductors may be located on the inner surfaces of the first notch K1, the second notch K2, the third notch K3, and the fourth notch K4. That is, the first notch K1, the second notch K2, the third notch K3, and the fourth notch K4 may be so-called castellations. This allows the ground potential to be strengthened in the wiring substrate 101F.

[0086] <Simulation Results> Figure 18 is a graph showing the reflection characteristics of the wiring substrate 101 according to the fourth and fifth embodiments, with the horizontal axis representing the frequency (GHz) of the input signal and the vertical axis representing the reflection characteristic (dB). In the graph showing the reflection characteristics, the smaller the value of the reflection characteristic (dB), the smaller the signal reflection. The dashed line represents the characteristics of the fourth embodiment, and the solid line represents the characteristics of the fifth embodiment (the same applies to Figures 19 and 20 described below). It can be seen that both the fourth and fifth embodiments achieve good reflection characteristics in the 0 GHz to 110 GHz range. Furthermore, it can be seen that the fifth embodiment achieves better characteristics than the fourth embodiment.

[0087] 19 is a graph showing the pass characteristics of the wiring board 101 according to the fourth and fifth embodiments, with the horizontal axis representing the frequency (GHz) of the input signal and the vertical axis representing the pass characteristics (dB). In the graph showing the pass characteristics, the larger the pass characteristics (dB) value, the smaller the signal loss. It can be seen that both the fifth and fourth embodiments achieve good pass characteristics in the frequency range of 0 GHz to 110 GHz.

[0088] 20 is a graph showing the TDR of the wiring substrate 101 according to the fourth and fifth embodiments, with the horizontal axis representing time (ps) and the vertical axis representing TDR (Ohm). It can be seen that both the fourth and fifth embodiments provide good characteristics. Furthermore, it can be seen that the fifth embodiment provides better characteristics than the fourth embodiment.

[0089] 17 , an electronic component mounting package 10 a according to one embodiment includes a wiring substrate 101, a base 104, and a frame 102. The frame 102 is located on the base 104. The wiring substrate 101 is fixed to the frame 102.

[0090] In one embodiment, the wiring substrate 101 may have an input / output terminal portion 101 a and a frame portion 101 b. The wiring substrate 101 may be connected to an external connection member by an adhesive.

[0091] Input / output terminal portion 101a may be located outside electronic component mounting package 10a. In this case, input / output terminal portion 101a may be electrically connected to signal conductor portion S0 and ground conductor portion G0 of wiring substrate 101, thereby providing electrical continuity between the inside and outside of electronic component mounting package 10a. Furthermore, the pair of first electrode portions S11 and the pair of second electrode portions S12 may be located inside electronic component mounting package 10a.

[0092] An external connection member may be connected to input / output terminal portion 101 a. The external connection member may be, for example, a flexible printed circuit (FPC), a printed circuit board (PCB) on which an electronic circuit is formed, or a metal member such as a lead terminal and / or a bonding wire. Connecting an external connection member to input / output terminal portion 101 a enables electronic component 103 mounted in electronic component mounting package 10 a to operate.

[0093] Frame-shaped portion 101b may be partially joined to a frame body 102, which will be described later. In other words, the interior of electronic component mounting package 10a is surrounded by frame-shaped portion 101b and frame body 102.

[0094] The wiring substrate 101 may be bonded to the upper surface of the base 104. The base 104 may be rectangular in plan view, measuring 10 mm x 10 mm to 50 mm x 50 mm and having a thickness of 0.5 mm to 20 mm. Examples of materials for the base 104 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, as well as alloys containing these metal materials. In this case, the base 104 may be a single metal plate or a laminate of multiple metal plates. Furthermore, when the base 104 is made of any of the above metal materials, a plating layer of nickel, gold, or the like may be formed on the surface of the base 104 by electroplating or electroless plating to reduce oxidation corrosion. Furthermore, the base 104 may be made of an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics. Alternatively, the base 104 may be a PCB on which an electric circuit is printed. In this case, the wiring board 101 may be joined to the base 104 by a BGA.

[0095] The frame 102 is located on the upper surface of the base 104 and protects the electronic component 103 located inside in a plan view. That is, in a plan view, the frame 102 surrounds at least a portion of the periphery of the electronic component 103. The frame 102 does not have to surround the entire outer edge of the upper surface of the base 104. In one embodiment, the frame 102 is located along the outer edge of the upper surface of the base 104, but the frame 102 may be located inside the outer edge of the upper surface of the base 104.

[0096] The frame 102 may be rectangular in plan view. In this case, the wiring board 101 may be bonded to the lower surface of the frame 102. Furthermore, when the wiring board 101 is bonded to the upper surface of the base 104, the wiring board 101 may be sandwiched between the frame 102 and the base 104.

[0097] The material of the frame 102 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The material of the frame 102 may also be an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0098] The frame 102 can be joined to the base 104 via a brazing material or the like. The brazing material may be, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus.

[0099] The frame 102 may have a through-hole 102 a. A fixing member including a light-transmitting window member may be joined to the through-hole 102 a. An optical fiber may be inserted and fixed in the fixing member.

[0100] <Configuration of Electronic Module> An electronic module 10 according to one embodiment includes an electronic component mounting package 10a, an electronic component 103, and a lid 105. The electronic component 103 is located on a base 104 and electrically connected to a wiring substrate 101. The lid 105 is located on a frame 102 and covers the interior of the electronic component mounting package 10a. In the electronic module 10, the wiring substrate 101 may be a wiring structure 100 connected to an external connection member via an adhesive.

[0101] The electronic component 103 may be a component that performs signal processing, such as converting an optical signal to an electrical signal or an electrical signal to an optical signal. The electronic component 103 is located on the upper surface of the base 104 and housed in the electronic component mounting package 10a. The electronic component 103 may be a component that performs signal processing, such as converting a wireless signal or an optical signal to an electrical signal, or converting an electrical signal to a wireless signal or an optical signal. The electronic component 103 may be directly bonded to the base 104. Alternatively, a pedestal containing a ceramic material and / or a metal material may be located between the electronic component 103 and the base 104. In other words, the electronic component 103 may be indirectly bonded to the base 104. Examples of the electronic component 103 include optical semiconductor elements such as a semiconductor laser (LD: Laser Diode) or a photodiode (PD: Photodiode), semiconductor integrated circuit elements such as a field effect transistor (FET), and sensor elements such as an optical sensor. The electronic component 103 can be formed from a semiconductor material such as gallium arsenide or gallium nitride.

[0102] The lid 105 is positioned on the frame 102, covering the interior of the electronic component mounting package 10a, and protects the electronic component 103 together with the frame 102. The lid 105 may be rectangular in plan view. The lid 105 may have dimensions of 10 mm x 10 mm to 50 mm x 50 mm and a thickness of 0.5 mm to 2 mm. Examples of materials for the lid 105 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, and tungsten, as well as alloys combining multiple of these metal materials. The metal member that constitutes the lid 105 can be produced by subjecting an ingot of such a metal material to metalworking methods such as rolling and punching.

[0103] The electronic module 10 may further include a seal ring located between the lid body 105 and the frame body 102. The seal ring functions to bond the lid body 105 and the frame body 102. The seal ring is located on the frame body 102 and surrounds the electronic component 103 in a plan view. Examples of materials for the seal ring include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, and tungsten, as well as alloys combining a plurality of these metal materials. Note that if a seal ring is not provided on the frame body 102, the lid body 105 may be bonded to the frame body 102 via an adhesive such as solder, brazing material, glass, or resin adhesive.

[0104] It should be noted that various combinations of the characteristic parts in each embodiment and each modification are not limited to the examples of the above-described embodiment. In addition, each embodiment and each modification can also be combined with each other.

[0105] The present disclosure can be used as a wiring board, an electronic component mounting package using the wiring board, and an electronic module.

[0106] 1 Insulator 1t First upper surface 1s First region 1r First portion 11 First insulating layer 12 Second insulating layer 13 Third insulating layer O1 First opening O11 First connection portion O12 Second connection portion O2 Second opening O3 Third opening K1 First notch portion K2 Second notch portion K3 Third notch portion K4 Fourth notch portion T1 First virtual line T2 Second virtual line D1 Depth of first opening D2 Depth of second opening D3 Depth of third opening L1x Dimension of first opening in x direction L1y Dimension of first opening in y direction L2y Dimension of second opening in y direction L3y Dimension of third opening in y direction L11y Dimension of first connection portion O11 in y direction L12y Dimension of second connection portion O12 in y direction G0 Ground conductor portion G1 First ground conductor G1a First ground line G1b Second ground line G2 Second ground conductor G2a Third ground line G2b Fourth ground line G3 Third ground conductor G3a Fifth ground line G3b Sixth ground line G4 Inner layer ground conductor G4m Lattice portion Lg1 Distance in the y direction between the first ground line and the second ground line Lg2 Distance in the y direction between the third ground line and the fourth ground line Lg3 Distance in the y direction between the fifth ground line and the sixth ground line Lg12 Distance in the x direction between the first ground conductor and the second ground conductor S0 Signal conductor portion S1 First signal conductor S11 Pair of first electrode portions S12a First line portion S12b Second line portion S2 Second signal conductor S21 Pair of second electrode portions S22a Third line portion S22b Fourth line portion Ls1 Distance between a pair of first electrode portions Ls2 Distance between a pair of second electrode portions 31 First capacitor 32 Second capacitor 10 Electronic module 10a Package for mounting electronic components 101A to 101F Wiring board 101a Input / output terminal portion 101b Frame-shaped portion 102 Frame body 102a Through-hole portion 103 Electronic component 104 Base body 105 Lid body

Claims

1. an insulator having a first top surface including a first region extending in a first direction; a ground conductor portion located on the first upper surface and extending in a second direction intersecting the first direction; a signal conductor portion located on the first top surface and extending in the second direction, the insulator has a first opening at least partially located in the first region; the ground conductor portion includes a first ground conductor and a second ground conductor positioned with a space therebetween, the signal conductor portion includes a first signal conductor located between the first ground conductor and the second ground conductor, and a second signal conductor located apart from the first signal conductor and between the first ground conductor and the second ground conductor; the first ground conductor includes a first ground line and a second ground line facing the first ground line in the second direction across the first region, the second ground conductor includes a third ground line and a fourth ground line facing the third ground line in the second direction across the first region, the first signal conductor has a pair of first electrode portions facing each other across the first region in the second direction, a first line portion connected to one of the pair of first electrode portions and extending away from the first region, and a second line portion connected to the other of the pair of first electrode portions and extending away from the first region, the second signal conductor has a pair of second electrode portions facing each other across the first region in the second direction, a third line portion connected to one of the pair of second electrode portions and extending away from the first region, and a fourth line portion connected to the other of the pair of second electrode portions and extending away from the first region, the first ground conductor, the first signal conductor, the second signal conductor, and the second ground conductor are arranged in this order in the first direction in a plan view; The wiring substrate, wherein the first opening is located in a first portion of the first region that is located between the first signal conductor and the second signal conductor in the first direction.

2. 2. The wiring board according to claim 1, wherein the distance in the second direction between the pair of first electrode portions and the distance in the second direction between the pair of second electrode portions are smaller than at least one of the distance in the second direction between the first ground line and the second ground line and the distance in the second direction between the third ground line and the fourth ground line.

3. 3. The wiring board according to claim 1, wherein the dimension of the first opening in the second direction is greater than at least one of the distance in the second direction between the pair of first electrode portions and the distance in the second direction between the pair of second electrode portions.

4. 3. The wiring board according to claim 1, wherein a dimension of the first opening in the second direction is smaller than at least one of a distance in the second direction between the first ground line and the second ground line and a distance in the second direction between the third ground line and the fourth ground line.

5. The wiring board according to claim 1 , wherein the first opening extends at least from between the pair of first electrode portions to between the pair of second electrode portions.

6. The wiring board according to claim 5 , wherein a dimension of the first opening in the first direction is greater than a distance in the first direction between the first ground conductor and the second ground conductor.

7. the insulator further has a second opening at least a portion of which is located in the first region and a third opening at least a portion of which is located in the first region; the second opening is located between the first ground line and the second ground line in the second direction and is spaced apart from the first signal conductor in the first direction; 3. The wiring board according to claim 1, wherein the third opening is located between the third ground line and the fourth ground line in the second direction and is located spaced apart from the second signal conductor in the first direction.

8. the first opening has a first connection portion connected to the second opening and a second connection portion connected to the third opening, the first connection portion is located between the pair of first electrode portions in the second direction, The wiring board according to claim 7 , wherein the second connection portion is located between the pair of second electrode portions in the second direction.

9. The wiring board according to claim 7 , wherein a dimension of the first opening in the second direction is smaller than a dimension of the second opening in the second direction and a dimension of the third opening.

10. The wiring board according to claim 7 , wherein the depth of the first opening is greater than at least one of the depth of the second opening and the depth of the third opening.

11. the second opening is in contact with the first ground line and the second ground line in a plan view; The wiring board according to claim 7 , wherein the third opening is in contact with the third ground line and the fourth ground line in a plan view.

12. the ground conductor section further includes a third ground conductor located between the first signal conductor and the second signal conductor; 3. The wiring board according to claim 1, wherein the third ground conductor has a fifth ground line and a sixth ground line that faces the fifth ground line across the first region in the second direction.

13. 13. The wiring board according to claim 12, wherein a distance in the second direction between the fifth ground line and the sixth ground line is greater than at least one of a distance in the second direction between the first ground line and the second ground line and a distance in the second direction between the third ground line and the fourth ground line.

14. A substrate; a frame positioned on the substrate; An electronic component mounting package comprising: the wiring board according to claim 1 or 2 fixed to the frame.

15. The electronic component mounting package according to claim 14; an electronic component housed in the electronic component mounting package and electrically connected to the wiring board; a lid body joined onto the frame body and positioned to cover the inside of the electronic component mounting package.