Laser processing device, microscope device, and laser processing method

Abstract

This laser processing device comprises: an a disposition part on which a sample is disposed; a laser output unit that outputs laser light; a laser irradiation unit that irradiates the sample arranged on the arrangement part with the laser light output from the laser output unit; and a transmission member that is arranged, on an optical axis of the laser light, between the sample arranged on the arrangement part and the laser irradiation unit and transmits the laser light. The laser irradiation unit includes: a spatial modulator that displays a modulation pattern and modulates the laser light in accordance with the modulation pattern, thereby generating and emitting first laser light and second laser light from the laser light; a condensing unit that forms a first condensing point by condensing the first laser light and forms a second condensing point by condensing the second laser light; and a control unit that controls the spatial light modulator.

Description

Laser processing device, microscope device, and laser processing method

[0001] The present disclosure relates to a laser processing apparatus, a microscope apparatus, and a laser processing method.

[0002] Patent Document 1 describes a laser processing method. In this method, a workpiece is held in a vacuum chamber. The vacuum chamber is provided with a window that transmits a laser beam. A laser beam emitted from a laser light source passes through the window and is incident on the workpiece. This causes an etching phenomenon called ablation on the surface of the workpiece, and the surface of the workpiece is removed.

[0003] Japanese Patent Application Laid-Open No. 2002-248589

[0004] As in the laser processing method described in Patent Document 1, there is a demand for ablation processing of a sample by irradiating the sample with laser light through a transparent member such as a window of a vacuum container. When ablation processing of a sample is performed, particles may be generated from the sample and adhere to the transparent member. If ablation processing is continued in a situation where particles are adhering to the transparent member, the transmittance of the laser light through the transparent member may decrease, which may result in a decrease in processing quality or may cause unintended absorption of the laser light in the transparent member, resulting in damage to the transparent member.

[0005] An object of the present disclosure is to provide a laser processing apparatus, a microscope apparatus, and a laser processing method that can suppress a decrease in the transmittance of a transparent member.

[0006] The laser processing device according to the present disclosure includes: [1] "a placement section on which a sample is placed; a laser output section for outputting laser light; a laser irradiation section for irradiating the laser light output from the laser output section onto the sample placed on the placement section; and a transparent member that is placed on the optical axis of the laser light between the sample placed on the placement section and the laser irradiation section and transmits the laser light, wherein the laser irradiation section includes a spatial light modulator that displays a modulation pattern and modulates the laser light in accordance with the modulation pattern to generate and emit a first laser light and a second laser light from the laser light; a focusing section that focuses the first laser light to form a first focusing point and focuses the second laser light to form a second focusing point; and a control section that controls the spatial light modulator. and a control unit configured to cause the spatial light modulator to display the modulation pattern, which is generated based on the focal length of the focusing unit, so that the first laser light and the second laser light emitted from the spatial light modulator are focused by the focusing unit, such that the first focusing point is located at a first position closer to the sample than the transparent member and the second focusing point is located at a second position closer to the transparent member than the first focusing point, and a distance between the first focusing point and the second focusing point in the optical axis direction of the first laser light and the second laser light is a set distance, and the laser irradiation unit simultaneously performs ablation processing of the sample by the first laser light and ablation processing of particles generated by the ablation processing of the sample by the second laser light.

[0007] The laser processing method according to the present disclosure is

[13] a laser processing method using a laser processing device including: a placement section on which a sample is placed; a laser output section for outputting laser light; a laser irradiation section for irradiating the laser light output from the laser output section onto the sample placed on the placement section; and a transparent member that is arranged on an optical axis of the laser light between the sample placed on the placement section and the laser irradiation section and transmits the laser light, the method comprising: a processing step of performing ablation processing with first laser light and second laser light generated from the laser light; the laser irradiation section including a spatial light modulator that displays a modulation pattern and modulates the laser light in accordance with the modulation pattern to generate and emit the first laser light and the second laser light from the laser light; and a spatial light modulator that forms a first focal point by focusing the first laser light and a second focal point by focusing the second laser light. a focusing unit for forming a focusing point, and a control unit for controlling the spatial light modulator, wherein the processing step includes: a first step of causing the spatial light modulator to display the modulation pattern, which is generated based on a focal length of the focusing unit, so that the first laser beam and the second laser beam emitted from the spatial light modulator are focused by the focusing unit, such that the first focusing point is located at a first position closer to the sample than the transparent member and the second focusing point is located at a second position closer to the transparent member than the first focusing point, and a distance between the first focusing point and the second focusing point in the optical axis direction of the first laser beam and the second laser beam is a set distance; and a second step of, after the first step, simultaneously performing ablation processing of the sample with the first laser beam and ablation processing of particles generated by the ablation processing of the sample with the second laser beam.

[0008] In these laser processing devices and methods, the spatial light modulator generates first and second laser beams by modulating the laser beam output from the laser output unit according to a modulation pattern, and the focusing unit focuses the first and second laser beams generated by the spatial light modulator to form a first focusing point of the first laser beam and a second focusing point of the second laser beam. The modulation pattern is displayed on the spatial light modulator so that the first focusing point is located at a first position closer to the sample than the transparent member and the second focusing point is located at a second position closer to the transparent member than the first focusing point. This allows ablation of the sample with the first laser beam and ablation of particles generated by ablation of the sample with the second laser beam to be performed simultaneously. This reduces processing time and prevents a decrease in the transmittance of the transparent member due to adhesion of particles generated by ablation of the sample.

[0009] Here, the distance between the sample and the transparent member may vary depending on the size of the sample, the shape and size of the transparent member, etc. Therefore, in order to effectively simultaneously perform ablation processing of the sample with the first laser light and ablation processing of particles with the second laser light, it is desirable to set an appropriate distance between the first focal point of the first laser light and the second focal point of the second laser light. In contrast, in this laser processing apparatus and laser processing method, a modulation pattern generated based on the focal length of the focusing unit is displayed on the spatial light modulator so that the distance between the first focal point of the first laser light and the second focal point of the second laser light in the optical axis direction of the first laser light and the second laser light is the desired set distance. Therefore, the distance between the first focal point of the first laser light and the second focal point of the second laser light is set to an appropriate distance, making it possible to effectively simultaneously perform ablation processing of the sample with the first laser light and ablation processing of particles with the second laser light. As described above, this laser processing apparatus and laser processing method can effectively suppress a decrease in the transmittance of the transparent member while shortening the processing time.

[0010] In addition, in the above [1] and

[13] , it is specified that a transparent member is placed on the optical axis of the laser light between the sample placed in the placement unit and the laser irradiation unit. Meanwhile, the spatial light modulator of the laser irradiation unit generates the first laser light and the second laser light from the laser light. Therefore, specifically, the transparent member is placed on the optical axis of the first laser light and the second laser light as the laser light between the sample placed in the placement unit and the laser irradiation unit.

[0011] The laser processing apparatus according to the present disclosure may be the laser processing apparatus described in [1] above, [2] "wherein the spatial light modulator displays the modulation pattern including a lens pattern that focuses only a portion of the laser light, and modulates the laser light using the modulation pattern to generate the second laser light including the portion of the laser light and the first laser light including the remainder of the laser light, and the control unit causes the spatial light modulator to display the modulation pattern including the lens pattern having a focal length calculated based on the focal length of the focusing unit and the set distance so that the distance between the first and second focusing points becomes the set distance." In this case, it is possible to preferably set the distance between the first and second focusing points to a desired set distance while generating the first and second laser lights using the modulation pattern including the lens pattern that focuses only a portion of the laser light.

[0012] The laser processing device according to the present disclosure may be [3] "the laser processing device described in [1] or [2] above, wherein the control unit causes the spatial light modulator to display the modulation pattern generated so that a ratio between the intensity of the first laser light at the first focusing point and the intensity of the second laser light at the second focusing point becomes a set ratio." In this case, it is possible to set the ratio between the intensity of the first laser light at the first focusing point and the intensity of the second laser light at the second focusing point to a desired set ratio suitable for each processing.

[0013] The laser processing device according to the present disclosure may be [4] "the laser processing device according to any one of the above [1] to [3], wherein the control unit causes the spatial light modulator to display the modulation pattern generated based on the irradiation conditions of the first laser light and the irradiation conditions of the second laser light." In this case, the irradiation conditions of the first laser light and the irradiation conditions of the second laser light can be set to desired conditions.

[0014] The laser processing apparatus according to the present disclosure may be [5] "the laser processing apparatus according to the above [4], wherein the irradiation conditions of the second laser light include a condition in which the beam pattern of the second laser light at the second focal point is a top hat shape." In this case, it is possible to efficiently perform ablation processing of particles generated by ablation processing of a sample using the second laser light.

[0015] The laser processing apparatus according to the present disclosure may be [6] "the laser processing apparatus described in [4] above, wherein the irradiation conditions of the second laser light include conditions under which a plurality of second focal points are formed along the optical axis direction of the second laser light." In this case, it is possible to perform ablation processing of particles generated by ablation processing of a sample using the second laser light over a wider range in the optical axis direction of the second laser light. Therefore, even if the second focal point shifts in the optical axis direction or the processing position (e.g., the surface position of a transparent member) shifts in the optical axis direction due to, for example, environmental changes or changes over time, stable ablation processing is possible.

[0016] The laser processing apparatus according to the present disclosure may be [7] "the laser processing apparatus according to any one of [4] to [6] above, wherein the irradiation conditions of the first laser beam include a condition in which a plurality of the first focal points are formed along a direction intersecting the optical axis direction of the first laser beam." In this case, it is possible to efficiently perform ablation processing of the sample. Furthermore, in this case, for example, by adjusting the polarization direction of the first laser beam at a plurality of first focal points arranged along a direction intersecting the optical axis direction of the first laser beam (e.g., by making the polarization directions of adjacent first focal points orthogonal to each other), the formation of a fine periodic structure on the processed cross section of the sample can be suppressed.

[0017] The laser processing apparatus according to the present disclosure may be [8] "the laser processing apparatus according to any one of the above [1] to [7], wherein the laser irradiation unit has a variable attenuator for adjusting the output of the laser beam." In this case, it is possible to adjust the output of the first laser beam at the first focal point P1 (processing point output) to a desired value.

[0018] The laser processing apparatus according to the present disclosure may be [9] "the laser processing apparatus according to any one of the above [1] to [8], wherein the laser irradiation unit is arranged in front of the spatial light modulator and has a half-wave plate that controls the polarization direction of the laser light incident on the spatial light modulator." In this case, it is possible to adjust the ratio of modulated light modulated by the spatial light modulator to unmodulated light that is not modulated by the spatial light modulator, within the laser light.

[0019] The laser processing apparatus according to the present disclosure may be

[10] "the laser processing apparatus according to any one of [1] to [9] above, in which the pulse width of the laser light is 1 ps or less." In this case, ablation processing can be performed effectively. Furthermore, in this case, by using an ultrashort pulse laser having a pulse width of 1 ps or less, changes in the properties of the processed cross section due to heat can be suppressed.

[0020] The laser processing apparatus according to the present disclosure may be

[11] "the laser processing apparatus according to any one of the above [1] to

[10] , further including a distance measuring unit that measures the distance between the sample and the transparent member by detecting light reflected from the laser light incident surface of the sample and light reflected from the sample-side surface of the transparent member, and the control unit obtains the set distance based on the distance measured by the distance measuring unit." In this case, even if the distance between the sample and the transparent member is not known, it is possible to set the distance between the first focal point and the second focal point to a desired set distance based on the measurement result by the distance measuring unit.

[0021] The microscope device according to the present disclosure may be

[12] "a microscope device including the laser processing device according to any one of [1] to

[11] above and a microscope unit for observing the sample placed in the placement unit." In this case, it is possible to provide a microscope device that can suppress a decrease in the transmittance of the transparent member.

[0022] According to the present disclosure, it is possible to provide a laser processing apparatus, a microscope apparatus, and a laser processing method that can suppress a decrease in the transmittance of a transparent member.

[0023] FIG. 1 is a schematic diagram showing a portion of a microscope apparatus according to this embodiment. FIG. 2 is a schematic diagram showing the remaining portion of the microscope apparatus shown in FIG. 1. FIG. 3 is a schematic diagram showing a portion of the laser irradiation unit shown in FIG. 2. FIG. 4 is a schematic diagram showing the relationship between a first focal point and a second focal point. FIG. 5 is a flowchart showing an example of a laser processing method according to this embodiment. FIG. 6 is a flowchart showing specific steps of step S102 shown in FIG. 5. FIG. 7 is a graph showing the relationship between the gradation value of a Fresnel lens pattern and the intensity of the second laser light at the second focal point. FIG. 8 is a schematic diagram showing a distance measuring unit according to a modified example.

[0024] Hereinafter, an embodiment of a laser processing apparatus, a microscope apparatus including the laser processing apparatus, and a laser processing method according to the present disclosure will be described with reference to the drawings. In the description of each drawing, the same or corresponding elements are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0025] Fig. 1 is a schematic diagram showing a part of a microscope apparatus according to this embodiment. Fig. 2 is a schematic diagram showing the remaining part of the microscope apparatus shown in Fig. 1. As will be described later, the microscope apparatus 1 shown in Fig. 1 and Fig. 2 includes a focused ion beam (FIB) apparatus that irradiates a sample with focused ions (e.g., Ga ions) to etch the sample, a scanning electron microscope (SEM) apparatus that irradiates the sample with an electron beam to observe the sample, and a laser processing apparatus that irradiates the sample with laser light to perform laser processing (here, ablation processing) of the sample, and is an apparatus that allows the SEM apparatus to observe a processed cross section of the sample formed by processing using the FIB apparatus and / or the laser processing apparatus.

[0026] The microscope device 1 includes a sample holder (placement unit) 2, a beam irradiation unit 3, a first microscope unit (microscope unit) 4, a second microscope unit (microscope unit) 5, a cover 7 (transmitting member), a chamber 10, and a laser processing device 20. A sample A is placed on the sample holder 2. The sample holder 2 may support the sample A without fixing it, as in the case where the sample A is simply placed on the sample holder 2, or may hold the sample A fixedly by, for example, gluing it on something. In this example, the sample holder 2 holds the sample A. The beam irradiation unit 3 is for irradiating the sample A held (placed (the same applies hereinafter)) on the sample holder 2 with a focused ion beam. Therefore, the beam irradiation unit 3 may include at least a focused ion beam emission unit of the FIB device.

[0027] The first microscope unit 4 is for observing the sample A held in the sample holder 2. More specifically, the first microscope unit 4 is configured to be able to obtain an image of the sample A (observe the sample A) by irradiating the sample A held in the sample holder 2 with an electron beam and detecting secondary electrons and the like generated in the sample A. Therefore, the first microscope unit 4 can be at least a part of the SEM apparatus that includes an electron beam emission unit and detection unit.

[0028] Like the first microscope unit 4, the second microscope unit 5 is used to observe the sample A held in the sample holder 2. More specifically, the second microscope unit 5 is capable of irradiating the sample A held in the sample holder 2 with an electron beam and detecting the electron beam scattered by the sample A, thereby acquiring information about the crystalline structure of the sample A (observing the sample A). That is, an example of the second microscope unit 5 may be a part of an SEM device using the electron backscatter diffraction (EBSD) method, including at least an electron beam emission unit and a detection unit. Note that the microscope device 1 may be equipped with a transmission electron microscope (TEM) device instead of (or in addition to) the SEM device. In this case, the first microscope unit 4 and the second microscope unit 5 may be at least a part of the TEM device.

[0029] The cover 7 is made of a material that transmits the laser light L described below, and is provided so as to cover the sample A held in the sample holder 2. As a result, the cover 7 can be placed at a reference position that is between the sample holder 2 and the beam irradiation unit 3, the first microscope unit 4, and the second microscope unit 5, and that is interposed in the optical path of the laser light L. The cover 7 is configured to be movable from the reference position so as not to be interposed between the sample holder 2 and the beam irradiation unit 3, the first microscope unit 4, and the second microscope unit 5.

[0030] The cover 7 may be formed in a box shape or a flat plate shape. When the cover 7 is box-shaped, it may be formed, for example, in a rectangular box shape with one side open (example in FIG. 4 ) or a box shape with one side open and a semicircular cross section (example in FIG. 1 ). In this case, the cover 7 may be arranged so that, with the sample A placed inside the box, the open part of the box faces the bottom of the chamber 10 and the bottom of the box faces the beam irradiation unit 3, the first microscope unit 4, and the second microscope unit 5. In this case, the edge forming the open part of the box may be in contact with the bottom of the chamber 10 or may be spaced apart from the bottom of the chamber 10 (example shown).

[0031] The chamber 10 houses the sample holder 2, the beam irradiation unit 3, the first microscope unit 4, the second microscope unit 5, and the cover 7. The chamber 10 is formed with an entrance unit 11 for the laser light L, which is configured in the shape of a window and made of a material that transmits the laser light L. The chamber 10 also has an exhaust unit 12 for exhausting the inside of the chamber 10 to reduce the pressure (to create a vacuum). Furthermore, the chamber 10 may be provided with another unit 6 for processing or observing the sample A held in the sample holder 2.

[0032] The laser processing apparatus 20 includes a laser output unit 30 and a laser irradiation unit 40. The laser output unit 30 outputs low-fluence, ultrashort-pulse laser light L. The pulse width of the laser light L output from the laser output unit 30 is, for example, 1 ps or less. Furthermore, the low fluence of the laser light L may mean, for example, that the energy density of the laser light L is near the processing threshold of the sample A, which is determined so that ablation processing occurs during laser processing of the sample A. The laser irradiation unit 40 irradiates the laser light L output from the laser output unit 30 onto the sample A held in the sample holder 2. The laser light L output from the laser output unit 30 is guided by the laser irradiation unit 40 and incident into the chamber 10 from the incident unit 11.

[0033] The laser irradiation unit 40 has a spatial light modulator 41 and a galvano scanner 43. The spatial light modulator 41 modulates the laser light output from the laser output unit 30 according to a modulation pattern and emits the modulated laser light. More specifically, the spatial light modulator 41 is, for example, an LCOS-SLM (Liquid Crystal On Silicon - Spatial Light Modulator), and displays a modulation pattern on a liquid crystal layer, thereby modulating the laser light L that enters and exits the liquid crystal layer according to the modulation pattern.

[0034] The spatial light modulator 41 can, for example, as described below, modulate the laser light L so that the laser light L has multiple focal points in the optical axis direction, or modulate the laser light L so as to correct aberrations that occur when the laser light passes through transparent members such as the cover 7 and the entrance portion 11, thereby suppressing the spread of the spot system at the focal position of the laser light L.

[0035] The galvano scanner 43 includes mirrors 43a and 43b, and by driving the mirrors 43a and 43b, the laser light L emitted from the spatial light modulator 41 is scanned and irradiated onto the sample A held by the sample holder 2. The laser light L emitted from the galvano scanner 43 is focused by a lens (focusing unit) 42 toward the sample A. The lens 42 is, for example, an fθ lens.

[0036] The laser irradiation unit 40 has a relay optical system 44. The relay optical system 44 is disposed between the spatial light modulator 41 and the galvanometer scanner 43. The relay optical system 44 includes a pair of lenses 44a and 44b, and is configured to transfer an image of the laser light L modulated by the spatial light modulator 41 onto the lens 42. The laser light L emitted from the spatial light modulator 41 and passed through the relay optical system 44 has its optical path adjusted by predetermined mirrors 56 and 57 and is then supplied to the galvanometer scanner 43.

[0037] The laser irradiation unit 40 further includes a collimating lens 51, an output control unit 52, a beam diameter control unit 53, and a half-wave plate 54, which are arranged in this order on the optical path of the laser light L traveling from the laser output unit 30 to the spatial light modulator 41. The collimating lens 51 collimates the laser light L output from the laser output unit 30 and emits it. Therefore, the collimated laser light L is incident on the spatial light modulator 41. The collimating lens 51 may be omitted.

[0038] The output control unit 52 is, for example, a variable attenuator, and adjusts the output of the laser light L output from the laser output unit 30. The beam diameter control unit 53 is, for example, a beam expander, and adjusts the beam diameter of the laser light L output from the laser output unit 30. In this way, the output control unit 52 and the beam diameter control unit 53 are disposed between the spatial light modulator 41 and the laser output unit 30, and function as adjustment units that adjust the output and beam diameter of the laser light L.

[0039] The half-wave plate 54 is disposed before the spatial light modulator 41. The half-wave plate 54 changes the polarization direction of the laser light L output from the laser output unit 30. As described above, the laser light L incident on the spatial light modulator 41 is modulated and then incident into the chamber 10 via the galvano scanner 43, where it is used to scan the sample A.

[0040] The microscope device 1 described above can process the sample A using the focused ion beam from the beam irradiation unit 3, and can also process the sample A using the laser light L from the laser processing device 20. When the focused ion beam is used, it is possible to process and observe the sample A with high precision. On the other hand, when the laser light L is used, it is possible to process and observe a large area of ​​the sample A with high throughput.

[0041] The laser processing apparatus 20 further includes a control unit 60. The control unit 60 can control at least the spatial light modulator 41, the output control unit 52, and the half-wave plate 54. The control unit 60 is configured as a computer device including a processor, a memory, a storage, a communication device, etc. In the control unit 60, the processor executes software (programs) loaded into the memory, etc., and controls reading and writing of data from and to the memory and storage, as well as communication via the communication device, thereby performing various processes for controlling each unit such as the spatial light modulator 41.

[0042] Next, the operation of each part of the laser irradiation unit 40 will be described in more detail. Fig. 3 is a schematic diagram showing a part of the laser irradiation unit shown in Fig. 2. As shown in Fig. 3, under the control of the control unit 60, the spatial light modulator 41 displays a modulation pattern Q and modulates the laser light L in accordance with the modulation pattern Q to generate and emit a first laser light L1 and a second laser light L2 from the laser light L.

[0043] To achieve this, the control unit 60 controls the half-wave plate 54 arranged in front of the spatial light modulator 41 (for example, by adjusting the angle around the optical axis of the laser light L) to convert the polarization direction of the laser light L emitted from the half-wave plate 54 into a polarization direction including a first polarization direction which is a first linearly polarized light (for example, p-polarized light) and a second linearly polarized light (for example, s-polarized light) which is perpendicular to the first polarization direction.

[0044] At the same time, the control unit 60 controls the spatial light modulator 41 to display a modulation pattern Q including a Fresnel lens pattern (lens pattern) Qf that focuses only a portion of the laser light L on the spatial light modulator 41, and modulates the laser light L using the modulation pattern Q to generate a second laser light L2 including the portion of the laser light L and a first laser light L1 including the remaining portion of the laser light L. The Fresnel lens pattern Qf has a focal length f Ｑ It has.

[0045] As a result, for example, a portion of the component of the laser light L in the first polarization direction is modulated and condensed by the Fresnel lens pattern Qf and emitted from the spatial light modulator 41 as the second laser light L2, while the remaining portion of the component in the first polarization direction and the component in the second polarization direction are not modulated by the Fresnel lens pattern Qf, are not condensed, and are emitted from the spatial light modulator 41 as the first laser light L1. In other words, the second laser light L2 includes a portion of the laser light L that has been modulated by the Fresnel lens pattern Qf in the spatial light modulator 41 (modulated light). Also, the first laser light L1 includes the remaining portion of the laser light L (unmodulated light).

[0046] The lens 42 forms a first focal point P1 by converging the first laser beam L1 emitted from the spatial light modulator 41, and forms a second focal point P2 by converging the second laser beam L2 emitted from the spatial light modulator 41. The first focal point P1 is formed on an (original) focal plane Sa that is separated from the lens 42 by the focal length f of the lens 42. The second focal point P2 is located closer to the spatial light modulator 41 than the first focal point P1, and is formed on a composite focal plane Sb of the Fresnel lens pattern Qf and the lens 42.

[0047] The distance D12 between the first and second focal points P1 and P2 in the optical axis direction of the first laser beam L1 and the second laser beam L2 (the offset between the first and second focal points P1 and P2), i.e., the distance between the focal plane Sa and the composite focal plane Sb, is determined by the focal length f of the lens 42 and the composite focal length f of the Fresnel lens pattern Qf and the lens 42. Ｇ Using the above, it is expressed by the following formula (1).

[0048] Distance D12=ffＧ ...(1)

[0049] In addition, the composite focal length f Ｇ is the focal length f of the lens 42 and the focal length f of the Fresnel lens pattern Qf Ｑ and is expressed by the following formula (2).

[0050] composite focal length f Ｇ = (f f Ｑ ) / (f Ｑ + f) ... (2)

[0051] Therefore, the distance D12 between the first condensing point P1 and the second condensing point P2 is the focal length f of the Fresnel lens pattern Qf. Ｑ The control unit 60 appropriately adjusts the Fresnel lens pattern Qf included in the modulation pattern Q to be displayed on the spatial light modulator 41, thereby setting the distance D12 between the first condensing point P1 and the second condensing point P2 to a desired set distance. This point will be described next.

[0052] 4 is a schematic diagram showing the relationship between the first and second focal points. As shown in FIGS. 3 and 4 , the first focal point P1 is positioned at a first position H1 closer to the sample A than the cover 7, and the second focal point P2 is positioned at a second position H2 closer to the cover 7 than the first focal point P1. As a result, the first laser beam L1 having the first focal point P1 is used to ablate the sample A, and the second laser beam L2 having the second focal point P2 is used to ablate particles (hereinafter, sometimes simply referred to as "particles") generated in the sample A by the ablation of the sample A. The particles generated in the sample A include particles floating between the sample A and the cover 7 and particles attached to the surface 7s of the cover 7 on the sample A side.

[0053] In the illustrated example, the first position H1 is a position on the surface As of the sample A on the cover 7 side, and the second position H2 is a position closer to the sample A than the surface 7s of the cover 7 on the sample A side. However, the first position H1 may be any position at least closer to the sample A side than the cover 7 as long as it is possible to perform ablation processing of the sample A with the first laser beam L1 having the first focal point P1 positioned at the first position H1 (i.e., any position closer to the sample A than the cover 7).

[0054] Furthermore, the second position H2 may be any position at least closer to the cover 7 than the first position H1 as long as it is possible to perform ablation processing of particles with the second laser beam L2 having the second focal point P2 located at the second position H2. For example, the second position H2 may be any of a position outside the cover 7 on the sample A side of the surface 7s of the cover 7 as shown in the figure, a position on the surface 7s of the cover 7, a position inside the cover 7, and a position outside the cover 7 on the opposite side of the surface 7s of the cover 7.

[0055] The desired set distance Db between the first focal point P1 and the second focal point P2 is set to a distance that allows ablation processing of the sample A by the first laser beam L1 and ablation processing of particles by the second laser beam L2 to be performed simultaneously. The set distance Db can be set based on the distance Da between the surface As of the sample A and the surface 7s of the cover 7. The set distance Db may or may not be the same as the distance Da (in the illustrated example, it is shorter than the distance Da). The distance D12 between the first focal point P1 and the second focal point P2 is set to the set distance Db.

[0056] In order to set the distance D12 to the set distance Db, the set distance Db and the focal length f of the lens 42 are known values. Therefore, as an example, the composite focal length f of the above formula (1) in which the distance D12 is the set distance Db can be calculated as follows: Ｇ The above formula (2) is substituted into the above to obtain the focal length f of the Fresnel lens pattern Qf. Ｑ A Fresnel lens pattern Qf having a focal length that is a specific value obtained by solving the above equation can be generated.

[0057] As described above, the control unit 60 causes the spatial light modulator 41 to display the modulation pattern Q (including the Fresnel lens pattern Qf) generated based on the focal length f of the lens 42 so that the first laser light L1 and the second laser light L2 emitted from the spatial light modulator 41 are focused by the lens 42, so that the first focusing point P1 is located at a first position H1 closer to the sample A than the cover 7, and the second focusing point P2 is located at a second position H2 closer to the cover 7 than the first focusing point P1, and so that the distance D12 between the first focusing point P1 and the second focusing point P2 in the optical axis direction of the first laser light L1 and the second laser light L2 becomes the set distance Db.

[0058] This allows the laser irradiation unit 40 to simultaneously perform ablation processing of the sample A using the first laser light L1 and ablation processing of particles generated during the ablation processing of the sample A using the second laser light L2.

[0059] Next, a more detailed operation of the laser irradiation unit 40 will be described using the laser processing method according to this embodiment. Fig. 5 is a flowchart showing an example of the laser processing method according to this embodiment. As shown in Fig. 5, in the laser processing method according to this embodiment, first, the irradiation conditions of the laser light L are determined (step S101).

[0060] Specifically, in step S101, patterns (irradiation conditions) of the first laser beam L1 and the second laser beam L2 at the processing point are determined. Here, as an example, the irradiation conditions for the second laser beam L2 are determined as conditions such that the beam pattern at the second focal point P2 of the second laser beam L2 is a top hat shape, or conditions such that multiple second focal points P2 are formed along the optical axis direction of the second laser beam L2. Also, as an example, the irradiation conditions for the first laser beam L1 are determined as conditions such that multiple first focal points P1 are formed along a direction intersecting the optical axis direction of the first laser beam L1.

[0061] These irradiation conditions are related to the generation of the modulation pattern Q to be displayed on the spatial light modulator 41 in a subsequent step. For example, to realize irradiation conditions under which multiple second focal points P2 are formed along the optical axis direction of the second laser beam L2, the modulation pattern Q may be generated to include an axicon lens pattern. Furthermore, to realize irradiation conditions under which multiple first focal points P1 are formed along a direction intersecting the optical axis direction of the first laser beam L1, the modulation pattern Q may be generated to include a diffraction grating pattern that diffracts and branches the first laser beam L1. Therefore, in the subsequent step, the modulation pattern Q to be displayed on the spatial light modulator 41 is determined (step S102: processing step). Step S102 will be described in more detail.

[0062] FIG. 6 is a flowchart showing specific steps of step S102 shown in FIG. 5 . As shown in FIG. 6 , in step S102, the control unit 60 acquires various conditions for generating the modulation pattern Q to be displayed on the spatial light modulator 41. That is, here, first, the control unit 60 acquires a set distance Db (step S201). The set distance Db is determined based on the distance Da between the specimen A and the cover 7. If the design value of the distance Da between the specimen A and the cover 7 is known, the design value is used. If the design value is unknown, the distance Da may be acquired by measuring using an optical method (distance measuring unit 70) as described below. The control unit 60 can acquire the set distance Db, for example, by receiving input of the set distance Db determined based on the distance Da.

[0063] Next, the control unit 60 determines the focal length f of the Fresnel lens pattern Qf. Ｑ (Step S202). Ｑ As described above, the focal length f of the lens 42 can be calculated using the above formulas (1) and (2) based on the known setting distance Db and the focal length f of the lens 42. The control unit 60 may, for example, calculate the focal length f of the calculated Fresnel lens pattern Qf. Ｑ By accepting the input of the focal length f Ｑ can be obtained.

[0064] Next, the control unit 60 acquires the output value (processing point output) of the first laser light L1 at the first focal point P1 for ablation processing of the sample A (step S203). The control unit 60 also acquires the output value (processing point output) of the second laser light L2 at the second focal point P2 for ablation processing of particles on the cover 7 side (step S204). The control unit 60 can acquire the output value, for example, by accepting the input of the output value. Note that the processing point output of the second laser light L2 can be a fixed value if the material of the cover 7 remains unchanged.

[0065] Next, the control unit 60 acquires the gradation value of the Fresnel lens pattern Qf (phase image) (step S205). The gradation value of the Fresnel lens pattern Qf is determined so that the ratio between the intensity of the first laser light L1 at the first focal point P1 and the intensity of the second laser light L2 at the second focal point P2 is a desired set ratio. FIG. 7 is a graph showing the relationship between the gradation value of the Fresnel lens pattern Qf and the intensity J2 of the second laser light L2 at the second focal point P2. Here, based on the graph (table) shown in FIG. 7, a gradation value T is selected that realizes the intensity J2 of the second laser light L2 such that the ratio between the intensity of the first laser light L1 at the first focal point P1 and the intensity of the second laser light L2 at the second focal point P2 is a desired set ratio. The control unit 60 can acquire the selected gradation value T, for example, by receiving an input of the selected gradation value T.

[0066] Next, the control unit 60 generates the modulation pattern Q based on the various conditions acquired above (step S206: first step). Specifically, the control unit 60 generates the modulation pattern Q based on the focal length f of the Fresnel lens pattern Qf acquired in step S202. Ｑ and the gradation value T of the Fresnel lens pattern Qf acquired in step S205. Furthermore, the control unit 60 determines, for example, an axicon lens pattern or a diffraction grating pattern based on the irradiation conditions determined in step S101. Then, the control unit 60 generates a modulation pattern Q in which the Fresnel lens pattern Qf, the axicon lens pattern, the diffraction grating pattern, and other patterns (for example, an aberration correction pattern) are superimposed.

[0067] That is, the control unit 60 generates the modulation pattern Q based on (taking into consideration) the set distance Db between the first focal point P1 and the second focal point P2 in the optical axis direction of the first laser light L1 and the second laser light L2, the focal length f of the lens 42, the gradation value T of the Fresnel lens pattern Qf such that the ratio between the intensity of the first laser light L1 at the first focal point P1 and the intensity of the second laser light L2 at the second focal point P2 becomes a set ratio, and the irradiation conditions of the first laser light L1 and the second laser light L2.

[0068] Thereafter, the control unit 60 causes the spatial light modulator 41 to display the modulation pattern Q generated in step S206 (step S207: first step). As a result, in the laser irradiation unit 40, the spatial light modulator 41 modulates the laser light L using the modulation pattern Q, and a first laser light L1 and a second laser light L2 are generated from the laser light L. In addition, the first laser light L1 and the second laser light L2 are focused by the lens 42, and a first focus point P1 and a second focus point P2 are simultaneously formed. At this time, the relationship between the first focal point P1 and the second focal point P2 is set in accordance with the modulation pattern Q (Fresnel lens pattern Qf) and the lens 42 so that the first focal point P1 is located at a first position H1 closer to the sample A than the cover 7, and the second focal point P2 is located at a second position H2 closer to the cover 7 than the first focal point P1, and the distance between the first focal point P1 and the second focal point P2 in the optical axis direction of the first laser light L1 and the second laser light L2 is set to a set distance Db.

[0069] 5, in the next step, the control unit 60 controls the output control unit 52, which is, for example, a variable attenuator, to adjust the output of the laser light L (step S103). In step S103, the control unit 60 controls the output control unit 52 so that the output of the first laser light L1 at the first focal point P1 becomes the processing point output obtained in step S203, and the output of the second laser light L2 at the second focal point P2 becomes the processing point output obtained in step S204.

[0070] Then, for example, the control unit 60 controls the laser output unit 30 to output the laser light L while causing the spatial light modulator 41 to display the modulation pattern Q, and controls the galvanometer scanner 43 to scan with the first laser light L1 and the second laser light L2, thereby performing ablation processing of the sample A and ablation processing of the particles (step S104: second step). In step S104, the laser irradiation unit 40 simultaneously performs ablation processing of the sample A with the first laser light L1 and ablation processing of the particles generated by the ablation processing of the sample A with the second laser light A2.

[0071] As such, the laser processing method according to this embodiment includes processing steps (step S102, steps S201 to S207, step S104) in which ablation processing is performed using the first laser light L1 and the second laser light L2 generated from the laser light L. The processing process also includes a first step (steps S201 to S207) of displaying a modulation pattern Q generated based on the focal length f of the lens 42 on the spatial light modulator 41 so that the first laser light L1 and the second laser light L2 emitted from the spatial light modulator 41 are focused by the lens 42, so that the first focus point P1 is located at a first position H1 closer to the sample A than the cover 7, and the second focus point P2 is located at a second position H2 closer to the cover 7 than the first focus point P1, and so that the distance between the first focus point P1 and the second focus point P2 in the optical axis direction of the first laser light L1 and the second laser light L2 is a set distance Db; and a second step (step S104) of simultaneously performing, after the first step, ablation processing of the sample A with the first laser light L1 and ablation processing of particles generated by the ablation processing of the sample A with the second laser light L2.

[0072] As described above, in the laser processing apparatus 20 and laser processing method according to this embodiment, the spatial light modulator 41 generates the first laser light L1 and the second laser light L2 by modulating the laser light L output from the laser output unit 30 according to the modulation pattern Q, and the lens 42 focuses the first laser light L1 and the second laser light L2 generated by the spatial light modulator 41 to form a first focal point P1 of the first laser light L1 and a second focal point P2 of the second laser light L2.

[0073] At this time, a modulation pattern Q generated so that the first focal point P1 is located at a first position H1 closer to the sample A than the cover 7 and the second focal point P2 is located at a second position H2 closer to the cover 7 than the first focal point P1 is displayed on the spatial light modulator 41. This allows the ablation processing of the sample A by the first laser light L1 and the ablation processing of particles generated by the ablation processing of the sample A by the second laser light L2 to be performed simultaneously. Therefore, it is possible to reduce the processing time and suppress a decrease in the transmittance of the cover 7 due to the adhesion of particles generated by the ablation processing of the sample A.

[0074] Here, the distance between the sample A and the cover 7 may vary depending on the size of the sample A and the shape and size of the cover 7. Therefore, in order to effectively simultaneously perform the ablation processing of the sample A with the first laser light L1 and the ablation processing of the particles with the second laser light L2, it is desirable to set the distance D12 between the first focal point P1 of the first laser light L1 and the second focal point P2 of the second laser light L2 to an appropriate distance.

[0075] In contrast, in the laser processing apparatus 20 and laser processing method according to this embodiment, a modulation pattern Q (including a Fresnel lens pattern Qf) generated based on the focal length f of the lens 42 is displayed on the spatial light modulator 41 so that the distance D12 between the first focal point P1 and the second focal point P2 in the optical axis direction of the first laser light L1 and the second laser light L2 is the desired set distance Db. Therefore, the distance D12 between the first focal point P1 and the second focal point P2 is set to the appropriate set distance Db, making it possible to effectively simultaneously perform ablation processing of the sample A with the first laser light L1 and ablation processing of particles with the second laser light L2. As described above, the laser processing apparatus 20 and laser processing method according to this embodiment can effectively suppress a decrease in the transmittance of the cover 7 while shortening the processing time.

[0076] Furthermore, in the laser processing apparatus 20 according to this embodiment, the spatial light modulator 41 displays a modulation pattern Q including a Fresnel lens pattern Qf that focuses only a portion of the laser light L, and modulates the laser light L using the modulation pattern Q to generate a second laser light L2 including the portion (modulated light) of the laser light L and a first laser light L1 including the remaining portion (unmodulated light) of the laser light L. Then, the control unit 60 adjusts the focal length f of the lens 42 calculated based on the focal length f and the set distance Db so that the distance D12 between the first focus point P1 and the second focus point P2 becomes the set distance Db. Ｑ A modulation pattern Q including a Fresnel lens pattern Qf having the following configuration is displayed on the spatial light modulator 41. This makes it possible to suitably generate the first laser beam L1 and the second laser beam L2 using the modulation pattern Q including the Fresnel lens pattern Qf that focuses only a portion of the laser beam L, while setting the distance D12 between the first focusing point P1 and the second focusing point P2 to the desired set distance Db.

[0077] Furthermore, in the laser processing apparatus 20 according to this embodiment, the control unit 60 causes the spatial light modulator 41 to display a modulation pattern Q (i.e., a modulation pattern Q including a Fresnel lens pattern Qf having a gradation value T at which the ratio becomes the set ratio) generated so that the ratio between the intensity of the first laser beam L1 at the first focal point P1 and the intensity (intensity J2) of the second laser beam L2 at the second focal point P2 becomes a set ratio. Therefore, it is possible to set the ratio between the intensity of the first laser beam L1 at the first focal point P1 and the intensity of the second laser beam L2 at the second focal point P2 to a desired set ratio suitable for each processing.

[0078] Furthermore, in the laser processing apparatus 20 according to this embodiment, the control unit 60 causes the spatial light modulator 41 to display the modulation pattern Q generated based on the irradiation conditions of the first laser light L1 and the irradiation conditions of the second laser light L2. This makes it possible to set the irradiation conditions of the first laser light L1 and the irradiation conditions of the second laser light L2 to desired conditions.

[0079] Furthermore, in the laser processing apparatus 20 according to this embodiment, the irradiation conditions of the second laser beam L2 may include a condition that the beam pattern of the second laser beam L2 at the second focal point P2 is a top hat shape. In this case, it is possible to efficiently perform ablation processing of particles generated during ablation processing of the sample A by the second laser beam L2.

[0080] Furthermore, in the laser processing apparatus 20 according to this embodiment, the irradiation conditions of the second laser light L2 may include conditions under which a plurality of second focal points P2 are formed along the optical axis direction of the second laser light L2. In this case, it becomes possible to perform ablation processing by the second laser light L2 on particles generated during ablation processing of the sample A over a wider range in the optical axis direction of the second laser light L2. Therefore, even if the second focal point P2 shifts in the optical axis direction or the processing position (e.g., the surface position of the cover 7) shifts in the optical axis direction due to, for example, environmental changes or changes over time, stable ablation processing is possible.

[0081] Furthermore, in the laser processing apparatus 20 according to this embodiment, the irradiation conditions of the first laser beam L1 may include a condition in which a plurality of first focal points P1 are formed along a direction intersecting the optical axis direction of the first laser beam L1. In this case, it is possible to efficiently perform ablation processing of the sample A. In addition, in this case, for example, by adjusting the polarization direction of the first laser beam L1 at the plurality of first focal points P1 arranged along a direction intersecting the optical axis direction of the first laser beam L1 (for example, by setting the polarization directions of adjacent first focal points P1 to be orthogonal to each other), the formation of a fine periodic structure on the processed cross section of the sample A is suppressed.

[0082] Furthermore, in the laser processing apparatus 20 according to this embodiment, the laser irradiation unit 40 has an output control unit 52, which is, for example, a variable attenuator, for adjusting the output of the laser light L (i.e., the first laser light L1 and the second laser light L2). This makes it possible to adjust the processing point output of the first laser light L1 and the second laser light L2 to a desired value.

[0083] Furthermore, in the laser processing apparatus 20 according to this embodiment, the laser irradiation unit 40 is disposed in front of the spatial light modulator 41 and has a half-wave plate 54 that controls the polarization direction of the laser light L incident on the spatial light modulator 41. This makes it possible to adjust the ratio of modulated light that is modulated in the spatial light modulator 41 to unmodulated light that is not modulated in the spatial light modulator 41, within the laser light L.

[0084] In the laser processing apparatus 20 according to this embodiment, the pulse width of the laser light L is 1 ps or less. This enables effective ablation processing. Furthermore, by using an ultrashort pulse laser having a pulse width of 1 ps or less, changes in the properties of the processed cross section of the sample A due to heat can be suppressed.

[0085] The microscope apparatus 1 according to this embodiment also includes the laser processing apparatus 20 according to this embodiment, and a first microscope unit 4 and a second microscope unit 5 for observing the sample A placed in the sample holder 2. Therefore, the microscope apparatus 1 is provided which can suppress a decrease in the transmittance of the cover 7.

[0086] The above embodiment has described one aspect of the laser processing apparatus, microscope apparatus, and laser processing method according to the present invention. Therefore, the laser processing apparatus, microscope apparatus, and laser processing method according to the present invention are not limited to the above embodiment, and can be modified as desired.

[0087] For example, as shown in FIG. 8 , the laser processing apparatus 20 may include a distance measuring unit 70. The distance measuring unit 70 emits a distance measuring laser beam L3 toward the sample A and the cover 7. The distance measuring laser beam L3 has, for example, a wavelength different from the wavelength of the processing laser beam L. The distance measuring unit 70 measures the distance Da between the sample A and the cover 7 by detecting reflected light LR1 of the distance measuring laser beam L3 reflected by the surface As, which is the laser beam incident surface of the sample A, and reflected light LR2 of the distance measuring laser beam L3 reflected by the surface 7s on the sample A side of the cover 7. In this case, the control unit 60 can obtain the set distance Db based on the distance Da measured by the distance measuring unit 70.

[0088] Furthermore, in the above embodiment, an example was given in which the irradiation conditions of the first laser beam L1 included conditions for forming a plurality of first focal points P1 arranged in a direction intersecting the optical axis direction of the first laser beam L1. In this example, the control unit 60 displays, on the spatial light modulator 41, a modulation pattern Q generated based on the irradiation conditions so as to include a diffraction grating pattern for branching the first laser beam L1. However, the irradiation conditions of the first laser beam L1 are not limited thereto and may include, for example, a condition for forming a single first focal point P1 of the first laser beam L1. In this case, the control unit 60 displays, on the spatial light modulator 41, a modulation pattern Q generated based on the irradiation conditions so as not to include a diffraction grating pattern for branching the first laser beam L1.

[0089] In the above embodiment, the irradiation conditions of the second laser beam L2 include a condition that the beam pattern of the second laser beam L2 at the second focal point P2 is a top hat shape. However, the irradiation conditions of the second laser beam L2 may also include a condition that the beam pattern of the second laser beam L2 at the second focal point P2 is a Gaussian beam. In this case, the control unit 60 can display on the spatial light modulator 41 a modulation pattern Q that is generated based on the irradiation conditions so as not to adjust the beam pattern of the second laser beam L2 at the second focal point P2.

[0090] Furthermore, in the above embodiment, the case where the irradiation conditions of the second laser beam L2 include conditions under which a plurality of second focal points P2 are formed along the optical axis direction of the second laser beam L2 has been exemplified. In this example, the control unit 60 can display, on the spatial light modulator 41, the modulation pattern Q generated to include an axicon lens pattern based on the irradiation conditions. However, the irradiation conditions of the second laser beam L2 may also include conditions under which a single second focal point P2 is formed along the optical axis direction of the second laser beam L2. In this case, the control unit 60 can display, on the spatial light modulator 41, the modulation pattern Q generated to not include an axicon lens pattern based on the irradiation conditions.

[0091] In this way, the control unit 60 can generate the modulation pattern Q based on (taking into account) the irradiation conditions of the first laser light L1 and the second laser light L2, whether or not some control is performed on them.

[0092] Furthermore, in the above embodiment, the cover 7 is given as an example of a transparent member arranged on the optical axis of the laser light L between the sample A placed in the sample holder 2 and the laser irradiation unit 40. However, the transparent member may be the incident unit 11 formed in the chamber 10.

[0093] In the above embodiment, the optical axis of the first laser beam L1 and the optical axis of the second laser beam L2 are considered to be aligned, as in the description of "the distance D12 between the first focal point P1 and the second focal point P2 in the optical axis direction of the first laser beam L1 and the second laser beam L2." On the other hand, when the modulation pattern Q displayed on the spatial light modulator 41 includes a diffraction grating pattern that diffracts and branches the first laser beam L1, the optical axis of modulated light modulated by the diffraction grating pattern among the multiple branches of the first laser beam L1 may not be aligned with the optical axis of the second laser beam L2. In this case, the optical axis of unmodulated light (zero-order light) not modulated by the diffraction grating pattern among the multiple branches of the first laser beam L1 will be aligned with the optical axis of the second laser beam L2. In such a case, the optical axis of the first laser beam L1 and the optical axis of the second laser beam L2 may be considered to be aligned.

[0094] Furthermore, in the above embodiment, an example has been described in which the second laser light L2, which includes modulated light modulated by the Fresnel lens pattern Qf, is focused closer to the cover 7 and used for ablation processing of particles, and the first laser light L1, which includes unmodulated light not modulated by the Fresnel lens pattern Qf, is focused closer to the sample A and used for ablation processing of the sample A. However, by adjusting the Fresnel lens pattern Qf, it is also possible to form the second focal point P2 of the second laser light L2 closer to the sample than the first focal point P1 of the first laser light L1. In other words, the second focal point P2 of the second laser light L2 can be formed at a position opposite the spatial light modulator 41 with respect to the first focal point P1 of the first laser light L1. In this case, the second focal point P2 of the second laser light L2 becomes a first focal point located substantially at a first position closer to the sample A than the cover 7, and the first focal point P1 of the first laser light L1 becomes a second focal point located substantially at a second position closer to the cover 7 than the first focal point. Also, in this case, the sample A can be ablated by the second laser light L2, and the particles can be ablated by the first laser light L1.

[0095] In the above embodiment, an example has been described in which step S103 of adjusting the output of the laser light L is performed after step S102 of determining the modulation pattern Q to be displayed on the spatial light modulator 41. However, step S103 may be performed before step S102.

[0096] A laser processing apparatus, a microscope apparatus, and a laser processing method are provided that are capable of suppressing a decrease in the transmittance of a transparent member.

[0097] 1...microscope device, 2...sample holder (placement section), 4...first microscope section (microscope section), 5...second microscope section (microscope section), 7...cover (transparent member), 20...laser processing device, 30...laser output section, 40...laser irradiation section, 41...spatial light modulator, 42...lens (focusing section), 52...output control section (variable attenuator), 54...half wavelength plate, 60...control section, A...sample, D12...distance, Db...set distance, f...focal length, L...laser light, L1...first laser light, L2...second laser light, P1...first focus point, P2...second focus point, Q...modulation pattern, Qf...Fresnel lens pattern.

Claims

1. a placement section on which the sample is placed; a laser output unit for outputting a laser beam; a laser irradiation unit for irradiating the laser light output from the laser output unit onto the sample placed in the placement unit; a transparent member that is disposed on the optical axis of the laser light between the sample disposed in the placement unit and the laser irradiation unit, and that transmits the laser light; Equipped with The laser irradiation unit a spatial light modulator that displays a modulation pattern and modulates the laser light in accordance with the modulation pattern to generate and emit a first laser light and a second laser light from the laser light; a focusing unit for forming a first focusing point by focusing the first laser beam and for forming a second focusing point by focusing the second laser beam; a control unit for controlling the spatial light modulator; and the control unit controls the spatial light modulator to display the modulation pattern generated based on the focal length of the focusing unit so that, by focusing the first laser light and the second laser light emitted from the spatial light modulator by the focusing unit, the first focusing point is located at a first position closer to the sample than the transparent member and the second focusing point is located at a second position closer to the transparent member than the first focusing point, and a distance between the first focusing point and the second focusing point in an optical axis direction of the first laser light and the second laser light becomes a set distance; the laser irradiation unit simultaneously performs ablation processing of the sample by the first laser light and ablation processing of particles generated by the ablation processing of the sample by the second laser light. Laser processing equipment.

2. the spatial light modulator displays the modulation pattern including a lens pattern that focuses only a portion of the laser light, and modulates the laser light using the modulation pattern to generate the second laser light including the portion of the laser light and the first laser light including the remainder of the laser light; the control unit causes the spatial light modulator to display the modulation pattern including the lens pattern having a focal length calculated based on the focal length of the focusing unit and the set distance so that the distance between the first focusing point and the second focusing point becomes the set distance. The laser processing device according to claim 1 .

3. the control unit causes the spatial light modulator to display the modulation pattern generated so that a ratio between an intensity of the first laser light at the first focusing point and an intensity of the second laser light at the second focusing point becomes a set ratio. The laser processing device according to claim 1 .

4. the control unit causes the spatial light modulator to display the modulation pattern generated based on the irradiation conditions of the first laser light and the irradiation conditions of the second laser light. The laser processing device according to claim 1 .

5. the irradiation conditions of the second laser light include a condition that the beam pattern of the second laser light at the second focusing point is a top hat shape. The laser processing device according to claim 4.

6. the irradiation conditions of the second laser light include a condition in which a plurality of the second focal points are formed along an optical axis direction of the second laser light. The laser processing device according to claim 4.

7. the irradiation conditions of the first laser light include a condition in which a plurality of the first focal points are formed along a direction intersecting a direction of an optical axis of the first laser light, The laser processing device according to claim 4.

8. The laser irradiation unit has a variable attenuator for adjusting the output of the laser light. The laser processing device according to claim 1 .

9. the laser irradiation unit is disposed in front of the spatial light modulator and has a half-wave plate that controls the polarization direction of the laser light incident on the spatial light modulator. The laser processing device according to claim 1 .

10. The pulse width of the laser light is 1 ps or less. The laser processing device according to claim 1 .

11. a distance measuring unit that measures a distance between the sample and the transparent member by detecting light reflected by a laser light incident surface of the sample and light reflected by a surface of the transparent member facing the sample, the control unit acquires the set distance based on the distance measured by the distance measuring unit. The laser processing device according to claim 1 .

12. The laser processing device according to any one of claims 1 to 11, a microscope unit for observing the sample placed in the placement unit; A microscope apparatus comprising:

13. A laser processing method using a laser processing device including: a placement section in which a sample is placed; a laser output section for outputting laser light; a laser irradiation section for irradiating the laser light output from the laser output section onto the sample placed in the placement section; and a transparent member that is placed on an optical axis of the laser light between the sample placed in the placement section and the laser irradiation section and that transmits the laser light, a processing step of performing ablation processing by first laser light and second laser light generated from the laser light, The laser irradiation unit a spatial light modulator that displays a modulation pattern and modulates the laser light in accordance with the modulation pattern to generate and emit the first laser light and the second laser light from the laser light; a focusing unit for forming a first focusing point by focusing the first laser beam and for forming a second focusing point by focusing the second laser beam; a control unit for controlling the spatial light modulator; and The processing step includes: a first step of displaying the modulation pattern, generated based on the focal length of the focusing unit, on the spatial light modulator so that the first laser light and the second laser light emitted from the spatial light modulator are focused by the focusing unit, so that the first focusing point is located at a first position closer to the sample than the transparent member and the second focusing point is located at a second position closer to the transparent member than the first focusing point, and a distance between the first focusing point and the second focusing point in the optical axis direction of the first laser light and the second laser light is a set distance; a second step of simultaneously performing, after the first step, ablation processing of the sample by the first laser light and ablation processing of particles generated by the ablation processing of the sample by the second laser light; Including, Laser processing method.