Display device, and computer-readable storage medium

Abstract

This display device comprises: a processing route display unit that displays a processing route on a screen on the basis of processing route information; a section identification unit that identifies a section from a processing route displayed on the screen; an acquisition unit that acquires first condition information indicating a processing condition in the section identified by the section identification unit; and a waveform display unit that displays an output waveform of the laser in the section on a screen on the basis of the first condition information acquired by the acquisition unit.

Description

Display device and computer-readable storage medium

[0001] The present disclosure relates to a display device and a computer-readable storage medium.

[0002] Conventionally, mainly in the field of laser welding processing, the output of a laser is controlled so that the output waveform of the laser has a predetermined shape (for example, Patent Document 1). This prevents the occurrence of processing defects during laser processing and improves the processing quality of the workpiece.

[0003] Japanese Patent Application Laid-Open No. 2005-288481

[0004] However, when a laser processing machine processes a workpiece, the operator cannot easily check beforehand whether the laser output waveform for each processing path will be the pre-specified shape. In many cases, the operator actually performs laser processing and measures the laser output value to check whether the specified waveform is being achieved. Therefore, a technology is needed that allows the operator to easily check in advance whether the laser output waveform for each processing path will be the pre-specified shape.

[0005] The display device of the present disclosure includes a processing path display unit that displays a processing path on a screen based on processing path information, a section identification unit that identifies a section from the processing path displayed on the screen, an acquisition unit that acquires first condition information that indicates the processing conditions in the section identified by the section identification unit, and a waveform display unit that displays the laser output waveform in the section on a screen based on the first condition information acquired by the acquisition unit.

[0006] The computer-readable storage medium of the present disclosure stores instructions that cause a computer to execute the following: displaying a processing path on a screen based on processing path information; identifying a section from the processing path displayed on the screen; acquiring first condition information indicating processing conditions in the identified section; and displaying the laser output waveform in the section on a screen based on the acquired first condition information.

[0007] 1 is a block diagram showing an example of the hardware configuration of a display device; FIG. 2 is a block diagram showing an example of the functions of the display device; FIG. 3 is a diagram showing an example of an image displayed on a screen; FIG. 4 is a diagram showing an example of a laser output waveform; FIG. 5 is a diagram showing an example of a laser output waveform; and FIG. 6 is a flowchart showing an example of processing executed by the display device. 7 is a block diagram showing an example of the functions of the display device; FIG. 6 is a diagram showing an example of a reference waveform; FIG. 7 is a diagram showing an example of a laser output waveform displayed by a waveform display unit; FIG. 8 is a diagram showing an example of a laser output waveform displayed by a comparison result display unit; and FIG. 9 is a flowchart showing an example of processing executed by the display device. 10 is a block diagram showing an example of the functions of a display device that adjusts an output waveform; FIG. 9 is a diagram showing an example of an output waveform adjusted by an adjustment unit; and FIG. 10 is a flowchart showing an example of processing executed by the display device. 11 is a block diagram showing an example of the functions of a display device that automatically generates an adjusted waveform; and FIG. 11 is a flowchart showing an example of processing executed by the display device.

[0008] A display device and a computer-readable storage medium according to an embodiment of the present disclosure will be described below with reference to the drawings. In the following description, components having the same or similar functions will be denoted by the same reference numerals. Duplicate descriptions of those components may be omitted.

[0009] In this application, "based on XX" means "based on at least XX," and includes cases where it is based on other elements in addition to XX. Furthermore, "based on XX" is not limited to cases where XX is used directly, but also includes cases where it is based on XX that has been calculated or processed. "XX" is any element (for example, any information).

[0010] The display device is a device that displays the output waveform of the laser when the laser processing machine performs processing along the processing path. Laser processing machines include, for example, laser cutting machines and laser welding machines.

[0011] The display device is implemented in, for example, a personal computer (PC), a server, or a mobile terminal. The display device may also be implemented in a numerical control device that controls a laser processing machine. An embodiment of a display device implemented in a PC will be described below.

[0012] 1 is a block diagram showing an example of the hardware configuration of a display device 1. The display device 1 includes, for example, a hardware processor 101, a bus 102, a read-only memory (ROM) 103, a random access memory (RAM) 104, a non-volatile memory 105, and a display 106.

[0013] The hardware processor 101 is a processor that uses a system program to control the entire display device 1. The hardware processor 101 reads the system program stored in the ROM 103 via the bus 102. The hardware processor 101 is, for example, a CPU (Central Processing Unit) or an electronic circuit.

[0014] The bus 102 is a communication path that connects the various pieces of hardware of the display device 1 to one another. The various pieces of hardware of the display device 1 exchange data via the bus 102.

[0015] The ROM 103 is a storage device that stores system programs, etc. The ROM 103 is a computer-readable storage medium.

[0016] The RAM 104 is a storage device that temporarily stores various data and functions as a work area for the hardware processor 101 to process various data.

[0017] The nonvolatile memory 105 is a storage device that retains data even when the display device 1 is turned off. The nonvolatile memory 105 stores, for example, a machining program. The nonvolatile memory 105 is a computer-readable storage medium. The nonvolatile memory 105 is, for example, a battery-backed memory or an SSD (Solid State Drive).

[0018] The display 106 is a device for displaying various types of information, such as the output waveform of the laser.

[0019] The display 106 is, for example, a touch panel. When the display 106 is a touch panel, the display 106 is, for example, a capacitive touch panel. The touch panel is not limited to a capacitive touch panel and may be a touch panel of another type.

[0020] The display device 1 may include a communication device. The communication device performs wired or wireless communication with, for example, a numerical control device that controls the laser processing machine.

[0021] 2 is a block diagram showing an example of the functions of the display device 1. The display device 1 includes a program analysis unit 111, a simulation execution unit 112, a machining path display unit 113, a section identification unit 114, an acquisition unit 115, and a waveform display unit 116. The program analysis unit 111, the simulation execution unit 112, the machining path display unit 113, the section identification unit 114, the acquisition unit 115, and the waveform display unit 116 are realized, for example, by the hardware processor 101 performing arithmetic processing using a system program stored in the ROM 103 and various programs and data stored in the non-volatile memory 105.

[0022] The program analysis unit 111 reads a machining program and analyzes it. The program analysis unit 111 reads the machining program from, for example, a program storage unit (not shown). The program analysis unit 111 analyzes the read machining program. Specifically, the program analysis unit 111 analyzes various codes specified in each block of the machining program.

[0023] The simulation execution unit 112 executes a machining simulation based on the analysis result of the machining program analyzed by the program analysis unit 111 and the machining conditions.

[0024] The simulation execution unit 112 executes a machining simulation using, for example, first condition information indicating machining conditions stored in a machining condition storage unit (not shown). The first condition information indicating machining conditions is stored in the machining condition storage unit using, for example, parameters.

[0025] The first condition information includes, for example, information indicating the feed speed of the control axis and the conditions of the assist gas, and also includes setting information for the output waveform of the laser.

[0026] The setting information of the laser output waveform is, for example, information indicating the shape of one laser pulse. In other words, the information indicating the pulse shape is information indicating the relationship between the output value of one pulse and time. Furthermore, the setting information of the laser output waveform may be, for example, information indicating the laser output waveform relative to the speed of a servo motor.

[0027] The simulation execution unit 112 executes a processing simulation using, for example, a virtual model of a laser processing machine.

[0028] The virtual model of the laser processing machine includes a model of an oscillator, models of each structure that constitutes the laser processing machine, a model of a servo motor, and a model of a workpiece.

[0029] The oscillator model is generated based on information such as the wavelength, average power, frequency, pulse energy, and pulse width of the laser output by the oscillator.

[0030] A model of each structure that constitutes the laser processing machine is generated based on information such as the shape, weight, and strength of each structure.

[0031] The servo motor model is generated based on information such as the rated output, rated torque, rated rotation speed, maximum rotation speed, maximum torque, and rated current of the servo motor.

[0032] The workpiece model is generated based on information such as the shape, material, strength, and weight of the workpiece.

[0033] The simulation execution unit 112 generates machining path information in the machining simulation based on the analysis result of the machining program by the program analysis unit 111.

[0034] The machining path information is information that indicates the position on the workpiece where laser machining is performed, and is, for example, a data group that includes a plurality of coordinate values ​​that indicate the position on the workpiece.

[0035] The simulation execution unit 112 executes a machining simulation and associates the machining path information with first condition information indicating the machining conditions. That is, the simulation execution unit 112 associates, with a coordinate value indicating the machining path, the first condition information indicating the machining conditions when the position indicated by the coordinate value is machined.

[0036] The machining path display unit 113 displays the machining path on a screen based on the machining path information generated by the simulation execution unit 112. The screen is, for example, the display 106 of the PC.

[0037] 3 is a diagram showing an example of an image displayed on the screen. The image displayed on the screen includes, for example, a processing path display area A1, an output waveform display area A2, and a program display area A3.

[0038] The processing path display area A1 is an area where a processing path is displayed. That is, the processing path display unit 113 displays a processing path in the processing path display area A1. In Fig. 3, the processing path that constitutes the letters "FA" is displayed in the processing path display area A1.

[0039] The output waveform display area A2 is an area where an output waveform when a selected section of the machining path is machined is displayed. The output waveform displayed in the output waveform display area A2 will be described in detail later.

[0040] The program display area A3 is an area where a machining program used in machining simulation is displayed. The program display area A3 displays the machining program currently being executed.

[0041] The section specifying unit 114 specifies a section from the machining route displayed on the screen. For example, the section specifying unit 114 specifies a section based on a position selected by an operator on the screen.

[0042] The section identified by the section identification unit 114 is, for example, a section to be machined by commands specified in one block of the machining program. The commands specified in one block are a group of commands specified in one line of the machining program.

[0043] The section identification unit 114 identifies the position on the screen touched by the operator. The section identification unit 114 may also identify the position on the screen selected by a mouse pointer on the screen. The position on the screen is represented, for example, by coordinate values ​​set on the screen. The position on the screen may also be represented using the position of each pixel that constitutes the screen.

[0044] Each line segment drawn in the machining path display area A1 represents one section. In the example shown in Fig. 3, the operator selects, for example, the leftmost line segment L among the line segments constituting the letter "F." In this case, the section identification unit 114 identifies the area in which the line segment L is drawn as a section.

[0045] The acquisition unit 115 acquires first condition information indicating the machining conditions in the section identified by the section identification unit 114. The acquisition unit 115 acquires the first condition information associated with the machining path information by the simulation execution unit 112. The first condition information acquired by the acquisition unit 115 is, for example, setting information of the output waveform of the laser.

[0046] The waveform display unit 116 displays on a screen the laser output waveform in the section identified by the section identification unit 114 based on the first condition information acquired by the acquisition unit 115. The laser output waveform is a figure in which time-series data of the laser output value is displayed on a graph. In other words, the laser output waveform is a figure drawn as a two-dimensional graph showing the relationship between time and the laser output value. The laser output waveform may also be a figure drawn as a two-dimensional graph showing the relationship between distance and the laser output value.

[0047] The waveform display unit 116 displays the output waveform in the section identified by the section identification unit 114 in the output waveform display area A2 on the screen.

[0048] 4 is a diagram showing an example of a laser output waveform displayed on the screen by the waveform display unit 116. The laser output waveform is plotted on a two-dimensional graph with the horizontal axis representing time and the vertical axis representing the laser output value.

[0049] 4 shows the output waveform when the section specified by the section specifying unit 114 is processed. Therefore, the length of the horizontal axis on which the output waveform is drawn indicates the processing time when the section specified by the section specifying unit 114 is processed.

[0050] The waveform display unit 116 can enlarge and display a portion of the output waveform. For example, by selecting a portion of the output waveform, the waveform display unit 116 enlarges and displays the selected portion of the output waveform. In the example shown in Fig. 4, the portion enclosed by the rectangular frame in the output waveform display area A2 is displayed in an enlarged manner.

[0051] 5 is a diagram showing an example of a laser output waveform displayed on the screen by the waveform display unit 116. The laser output waveform is plotted on a two-dimensional graph with the horizontal axis representing distance and the vertical axis representing the laser output value.

[0052] The distance is the length of the section identified by the section identification unit 114. The output waveform shown in Fig. 5 represents the change in the laser output value when the path indicated by the leftmost line segment L among the line segments constituting the letter "F" displayed in the processing path display area A1 is processed.

[0053] The section specification unit 114 may specify a section based on a currently executing block of the machining program. That is, the section specification unit 114 may specify a section in which machining is performed based on the currently executing block.

[0054] In this case, the acquisition unit 115 acquires first condition information indicating the machining conditions when the workpiece is machined based on the commands specified in the block being executed. Also, the waveform display unit 116 displays on the screen the laser output waveform output when the workpiece is machined based on the commands specified in the block being executed. In other words, the waveform display unit 116 displays the laser output waveform in real time during execution of the machining program.

[0055] 6 is a flowchart showing an example of processing executed by the display device 1. In the display device 1, first, the program analysis unit 111 analyzes the machining program (step SA1).

[0056] Next, the simulation execution unit 112 executes a machining simulation (step SA2), and then the machining path display unit 113 displays the machining path on the screen (step SA3).

[0057] Next, the section identification unit 114 identifies a section from the machining path (step SA4). Next, the acquisition unit 115 acquires first condition information indicating the machining conditions for the section (step SA5). Finally, the waveform display unit 116 displays the laser output waveform on the screen (step SA6), and the process ends.

[0058] The display device 1 may determine whether the output waveform of the laser has the same shape as a reference waveform that serves as a reference.

[0059] Fig. 7 is a block diagram showing an example of the functions of the display device 1. Of the functions of the display device 1 shown in Fig. 7, the description of the same functions as those of the display device 1 shown in Fig. 2 will be omitted.

[0060] The display device 1 includes a program analysis unit 111, a simulation execution unit 112, a machining path display unit 113, a section identification unit 114, an acquisition unit 115, and a waveform display unit 116, as well as a reference waveform setting unit 117, a comparison unit 118, and a comparison result display unit 119. The reference waveform setting unit 117, the comparison unit 118, and the comparison result display unit 119 are realized, for example, by the hardware processor 101 performing arithmetic processing using a system program stored in the ROM 103 and various programs and data stored in the non-volatile memory 105.

[0061] The reference waveform setting unit 117 sets a reference waveform to be compared with the output waveform. The reference waveform is, for example, a waveform that serves as a reference for one pulse of the laser. The reference waveform, for example, matches one pulse of the output waveform indicated by the setting information of the laser output waveform described above.

[0062] FIG. 8 is a diagram showing an example of a reference waveform. The reference waveform shown in FIG. 8 shows that the laser output value changes as follows: The laser output value initially rises from a minimum value to a maximum value. Then, the laser output value is maintained at the maximum value for a predetermined period. Then, the laser output value changes to an intermediate value between the maximum and minimum values. Then, the laser output value is maintained at the intermediate value for a predetermined period. Then, the laser output value changes to a minimum value. Then, the laser output value is maintained at the minimum value until the end of one pulse. Now, returning to the description of FIG. 7 .

[0063] The reference waveform setting unit 117 stores the reference waveform in, for example, a predetermined register, thereby setting the reference waveform.

[0064] The comparison unit 118 compares the output waveform with the reference waveform set by the reference waveform setting unit 117. For example, the comparison unit 118 compares the output waveform of each pulse of the laser output in the section with the reference waveform.

[0065] 9 is a diagram showing an example of the laser output waveform displayed by the waveform display unit 116. Among the output waveforms shown in FIG. 9, the output waveform of the last pulse is different from the output waveforms of the other pulses. In other words, the output waveform of the last pulse is missing a portion. This is because the processing position reached the end point of the section while the last pulse was being output. The processing position is the position where the laser is irradiated.

[0066] When the comparison section 118 compares the reference waveform with the output waveform of the last pulse, it determines that there is a difference between the reference waveform and the output waveform.

[0067] The comparison result display unit 119 displays the comparison result obtained by the comparison unit 118 on the screen. The comparison result includes information indicating that there is a difference between the reference waveform and the output waveform. In other words, if there is a difference between the reference waveform and the output waveform, the comparison result display unit 119 displays information indicating that there is a difference between the reference waveform and the output waveform. The information indicating the difference is, for example, information to warn that there is a missing part in the output waveform of the last pulse.

[0068] The comparison result display unit 119 may display the reference waveform superimposed on the output waveform.

[0069] 10 is a diagram showing an example of a laser output waveform displayed by the comparison result display unit 119. The comparison result display unit 119 displays the reference waveform superimposed on the output waveform. The comparison result display unit 119 displays the reference waveform in a manner different from the output waveform. For example, the comparison result display unit 119 displays the reference waveform with a line thinner than the line depicting the output waveform.

[0070] For example, if a thin line is displayed after the end point of the section, it is understood that there is a difference between the output waveform and the reference waveform, i.e., the operator can recognize that there is a difference between the output waveform and the reference waveform.

[0071] 11 is a flowchart showing an example of processing executed by the display device 1 including the reference waveform setting section 117, the comparison section 118, and the comparison result display section 119. The processing from step SB1 to step SB6 is the same as the processing from step SA1 to step SA6 shown in Fig. 6. Therefore, a description of the processing from step SB1 to step SB6 will be omitted.

[0072] After step SB6 is completed, the reference waveform setting unit 117 sets the reference waveform (step SB7). Next, the comparison unit 118 compares the reference waveform with the output waveform (step SB8). Finally, the comparison result display unit 119 displays the comparison result on the screen (step SB9), and the process ends.

[0073] The display device 1 may adjust the shape of the output waveform displayed on the screen, and may change the processing conditions based on the adjusted shape of the output waveform.

[0074] Fig. 12 is a block diagram showing an example of the functions of the display device 1 that adjust the shape of the output waveform. Of the functions of the display device 1 shown in Fig. 12, the same functions as those of the display device 1 shown in Fig. 2 will not be described.

[0075] The display device 1 includes a program analysis unit 111, a simulation execution unit 112, a machining path display unit 113, a section identification unit 114, an acquisition unit 115, and a waveform display unit 116, as well as a reception unit 120, an adjustment unit 121, a condition generation unit 122, and a condition output unit 123. The reception unit 120, the adjustment unit 121, the condition generation unit 122, and the condition output unit 123 are realized, for example, by the hardware processor 101 performing arithmetic processing using a system program stored in the ROM 103 and various programs and data stored in the non-volatile memory 105.

[0076] The receiving unit 120 receives an operation to change the shape of the output waveform displayed on the screen. An operation to change the shape of the output waveform is, for example, an operation to change the time at which one pulse is output. In other words, an operation to change the shape of the output waveform changes the period of one pulse of the output waveform.

[0077] When the screen is configured as a touch panel, the operation for changing the shape of the output waveform is, for example, a pinch-in operation or a pinch-out operation on the touch panel.

[0078] The adjustment unit 121 adjusts the shape of the output waveform displayed on the screen based on the operation received by the reception unit 120. For example, when the reception unit 120 receives a pinch-in operation, the adjustment unit 121 changes the period of the output waveform to a shorter period. The adjustment unit 121 adjusts the shape of the output waveform based on the operation amount of the pinch-in operation.

[0079] FIG. 13 is a diagram showing an example of an output waveform adjusted by the adjustment unit 121. The output waveform shown in FIG. 13 is the waveform after adjustment of the output waveform shown in FIG. 9. After adjustment, no part of the output waveform of the last pulse is missing. In other words, the output of one cycle of pulses ends at the end point of the section. In other words, the output waveform of the last pulse is corrected by adjusting the cycle of each pulse in the section identified by the section identification unit 114.

[0080] The condition generating unit 122 generates second condition information different from the first condition information based on the shape of the output waveform adjusted by the adjusting unit 121. The second condition information is information indicating processing conditions. The second condition information is, for example, setting information for the laser output waveform. In other words, the second condition information is information indicating processing conditions to be used in laser processing instead of the first condition information.

[0081] The condition output unit 123 outputs the second condition information generated by the condition generation unit 122. The condition output unit 123 outputs the second condition information to, for example, a numerical control device that controls the laser processing machine. The numerical control device controls the laser processing machine based on the second condition information output from the condition output unit 123.

[0082] 14 is a flowchart showing an example of processing executed by the display device 1 including the reception unit 120, the adjustment unit 121, the condition generation unit 122, and the condition output unit 123. The processing from step SC1 to step SC6 is the same as the processing from step SA1 to step SA6 shown in Fig. 6. Therefore, a description of the processing from step SC1 to step SC6 will be omitted.

[0083] After the process of step SC6 is completed, the receiving unit 120 receives an operation to change the shape of the output waveform (step SC7). Next, the adjustment unit 121 adjusts the shape of the output waveform displayed on the screen based on the operation received by the receiving unit 120 (step SC8).

[0084] Next, the condition generating unit 122 generates second condition information different from the first condition information (step SC9) based on the shape of the output waveform adjusted by the adjusting unit 121. Finally, the condition output unit 123 outputs the second condition information generated by the condition generating unit 122 (step SC10), and the process ends.

[0085] The display device 1 may automatically adjust the output waveform displayed on the screen.

[0086] Fig. 15 is a block diagram showing an example of the function of the display device 1 that automatically adjusts the output waveform. Of the functions of the display device 1 shown in Fig. 15, the description of the same functions as the functions of the display device 1 shown in Fig. 2 will be omitted.

[0087] The display device 1 includes a program analysis unit 111, a simulation execution unit 112, a machining path display unit 113, a section identification unit 114, an acquisition unit 115, and a waveform display unit 116, as well as a reference waveform setting unit 117, a comparison unit 118, an automatic adjustment unit 124, a condition generation unit 122, and a condition output unit 123. The reference waveform setting unit 117, the comparison unit 118, the automatic adjustment unit 124, the condition generation unit 122, and the condition output unit 123 are realized, for example, by the hardware processor 101 performing arithmetic processing using a system program stored in the ROM 103 and various programs and data stored in the non-volatile memory 105.

[0088] As described above, the reference waveform setting section 117 sets a reference waveform to be compared with the output waveform. The comparison section 118 compares the reference waveform set by the reference waveform setting section 117 with the output waveform.

[0089] The automatic adjustment unit 124 adjusts the shape of the output waveform based on the output waveform and the reference waveform. For example, the automatic adjustment unit 124 adjusts the shape of the output waveform so that the shape of the output waveform matches or approximates the shape of the reference waveform. That is, the automatic adjustment unit 124 does not need to make the shape of the output waveform exactly match the shape of the reference waveform. For example, there may be a difference between the period of the adjusted output waveform and the period of the reference waveform. The allowable degree of difference may be set in advance using parameters, etc.

[0090] The condition generating unit 122 generates third condition information different from the first condition information based on the shape of the output waveform adjusted by the automatic adjusting unit 124. The third condition information is information indicating processing conditions. The third condition information is, for example, setting information for the laser output waveform. In other words, the third condition information is information indicating processing conditions to be used in laser processing instead of the first condition information.

[0091] The condition output unit 123 outputs the third condition information generated by the condition generation unit 122. The condition output unit 123 outputs the third condition information to, for example, a numerical control device that controls the laser processing machine. The numerical control device controls the laser processing machine based on the third condition information output from the condition output unit 123.

[0092] 16 is a flowchart showing an example of processing executed by the display device 1 including the reference waveform setting unit 117, the comparing unit 118, the automatic adjusting unit 124, the condition generating unit 122, and the condition output unit 123. The processing from step SD1 to step SD6 is the same as the processing from step SA1 to step SA6 shown in Fig. 6. Therefore, a description of the processing from step SD1 to step SD6 will be omitted.

[0093] After step SD6 is completed, the reference waveform setting unit 117 sets a reference waveform (step SD7), and the comparison unit 118 compares the reference waveform with the output waveform (step SD8).

[0094] Next, the automatic adjustment unit 124 adjusts the shape of the output waveform based on the output waveform and the reference waveform (step SD9). Next, the condition generation unit 122 generates third condition information different from the first condition information based on the shape of the output waveform adjusted by the automatic adjustment unit 124 (step SD10). Finally, the condition output unit 123 outputs the third condition information generated by the condition generation unit 122 (step SD11), and the process ends.

[0095] As described above, the display device 1 includes a processing path display unit 113 that displays the processing path on the screen based on processing path information, a section identification unit 114 that identifies a section from the processing path displayed on the screen, an acquisition unit 115 that acquires first condition information that indicates the processing conditions in the section identified by the section identification unit 114, and a waveform display unit 116 that displays the laser output waveform in the section on the screen based on the first condition information acquired by the acquisition unit 115.

[0096] Therefore, the display device 1 enables the operator to easily check whether the output waveform of the laser in each processing path has a predetermined shape.

[0097] The section specifying unit 114 specifies a section based on a position selected on the screen, and the display device 1 can therefore display the output waveform in the section selected by the operator.

[0098] Furthermore, the section specifying unit 114 specifies a section based on a block currently being executed in the machining program. Therefore, the display device 1 can display the output waveform in real time while the machining program is being executed.

[0099] The output waveform is a two-dimensional graph that shows the relationship between time and the laser output value, or the relationship between distance and the output value. Therefore, the display device 1 can display the output waveform in a manner that is easy for the operator to recognize.

[0100] The display device 1 further includes a reference waveform setting unit 117 that sets a reference waveform to be compared with the output waveform, a comparison unit 118 that compares the reference waveform set by the reference waveform setting unit 117 with the output waveform, and a comparison result display unit 119 that displays the comparison result by the comparison unit 118 on the screen.

[0101] Therefore, even if the operator does not compare the shape of the reference waveform with the shape of the output waveform, the display device 1 can allow the operator to easily recognize whether the shape of the reference waveform and the shape of the output waveform match.

[0102] Furthermore, the comparison result displayed by the comparison result display unit 119 includes information indicating that there is a difference between the output waveform and the reference waveform. Therefore, the display device 1 allows the operator to recognize which part of the output waveform differs from the reference waveform.

[0103] Furthermore, the comparison result display unit 119 displays the reference waveform superimposed on the output waveform, so that the display device 1 allows the operator to easily recognize the difference between the shape of the output waveform and the shape of the reference waveform.

[0104] The display device 1 further includes a reception unit 120 that receives an operation to change the shape of the output waveform displayed on the screen, an adjustment unit 121 that adjusts the shape of the output waveform displayed on the screen based on the operation received by the reception unit 120, and a condition generation unit 122 that generates second condition information different from the first condition information based on the shape of the output waveform adjusted by the adjustment unit 121.

[0105] In addition, the display device 1 further includes an automatic adjustment unit 124 that adjusts the shape of the output waveform based on the output waveform and the reference waveform, and a condition generation unit 122 that generates third condition information different from the first condition information based on the shape of the output waveform adjusted by the automatic adjustment unit 124.

[0106] Therefore, the display device 1 can generate second or third condition information indicating the processing conditions used in the laser processing machine based on the shape of the adjusted output waveform.

[0107] Although the present disclosure has been described in detail, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible to these embodiments without departing from the gist of the present disclosure or the gist of the present disclosure derived from the content of the claims and their equivalents. Furthermore, these embodiments can also be implemented in combination.

[0108] The following are supplementary notes related to embodiments of the present disclosure. Supplementary Note [1] A display device comprising: a machining path display unit that displays a machining path on a screen based on machining path information; a section identification unit that identifies a section from the machining path displayed on the screen; an acquisition unit that acquires first condition information indicating machining conditions for the section identified by the section identification unit; and a waveform display unit that displays a laser output waveform for the section on the screen based on the first condition information acquired by the acquisition unit. Supplementary Note [2] The display device according to Supplementary Note [1], in which the section identification unit identifies the section based on a position selected on the screen. Supplementary Note [3] The display device according to Supplementary Note [1], in which the section identification unit identifies the section based on a block currently being executed in a machining program. Supplementary Note [4] The display device according to any of Supplements [1] to [3], in which the output waveform is a graphic drawn as a two-dimensional graph showing the relationship between time and the output value of the laser, or the relationship between distance and the output value. Supplementary Note [5] The display device according to any one of Supplements [1] to [4], further comprising: a reference waveform setting unit that sets a reference waveform to be compared with the output waveform; a comparison unit that compares the output waveform with the reference waveform set by the reference waveform setting unit; and a comparison result display unit that displays the comparison result by the comparison unit on the screen. Supplementary Note [6] The display device according to Supplementary Note [5], wherein the comparison result displayed by the comparison result display unit includes information indicating a difference between the output waveform and the reference waveform. Supplementary Note [7] The display device according to Supplementary Note [5] or [6], wherein the comparison result display unit displays the reference waveform superimposed on the output waveform. Supplementary Note [8] The display device according to any one of Supplements [1] to [7], further comprising: a reception unit that receives an operation to change the shape of the output waveform displayed on the screen; an adjustment unit that adjusts the shape of the output waveform displayed on the screen based on the operation received by the reception unit; and a condition generation unit that generates second condition information different from the first condition information based on the shape of the output waveform adjusted by the adjustment unit.Supplementary note [9] The display device according to Supplementary note [5], further comprising: an automatic adjustment unit that adjusts the shape of the output waveform based on the output waveform and the reference waveform, and a condition generation unit that generates third condition information different from the first condition information based on the shape of the output waveform adjusted by the automatic adjustment unit. Supplementary note

[10] A computer-readable storage medium that stores instructions for causing a computer to execute the following: displaying a machining path on a screen based on machining path information, identifying a section from the machining path displayed on the screen, acquiring first condition information indicating the machining conditions for the identified section, and displaying the laser output waveform in the section on the screen based on the acquired first condition information.

[0109] 1 Display device 101 Hardware processor 102 Bus 103 ROM 104 RAM 105 Non-volatile memory 106 Display 111 Program analysis unit 112 Simulation execution unit 113 Machining path display unit 114 Section identification unit 115 Acquisition unit 116 Waveform display unit 117 Reference waveform setting unit 118 Comparison unit 119 Comparison result display unit 120 Reception unit 121 Adjustment unit 122 Condition generation unit 123 Condition output unit 124 Automatic adjustment unit

Claims

1. a machining path display unit that displays a machining path on a screen based on the machining path information; a section identification unit that identifies a section from the processing path displayed on the screen; an acquisition unit that acquires first condition information indicating processing conditions in the section identified by the section identification unit; a waveform display unit that displays an output waveform of the laser in the section on the screen based on the first condition information acquired by the acquisition unit; A display device comprising:

2. The display device according to claim 1 , wherein the section specifying unit specifies the section based on a position selected on the screen.

3. The display device according to claim 1 , wherein the section specifying unit specifies the section based on a block currently being executed in a machining program.

4. The display device according to any one of claims 1 to 3, wherein the output waveform is a graphic drawn as a two-dimensional graph showing the relationship between time and the output value of the laser, or the relationship between distance and the output value.

5. a reference waveform setting unit that sets a reference waveform to be compared with the output waveform; a comparison unit that compares the reference waveform set by the reference waveform setting unit with the output waveform; a comparison result display unit that displays the comparison result by the comparison unit on the screen; The display device according to any one of claims 1 to 3, further comprising:

6. The display device according to claim 5 , wherein the comparison result displayed by the comparison result display unit includes information indicating that there is a difference between the output waveform and the reference waveform.

7. The display device according to claim 5 , wherein the comparison result display unit displays the reference waveform superimposed on the output waveform.

8. a receiving unit that receives an operation to change the shape of the output waveform displayed on the screen; an adjustment unit that adjusts the shape of the output waveform displayed on the screen based on the operation received by the reception unit; a condition generating unit that generates second condition information different from the first condition information based on the shape of the output waveform adjusted by the adjusting unit; The display device according to any one of claims 1 to 3, further comprising:

9. an automatic adjustment unit that adjusts the shape of the output waveform based on the output waveform and the reference waveform; a condition generating unit that generates third condition information different from the first condition information based on the shape of the output waveform adjusted by the automatic adjusting unit; The display device according to claim 5 , further comprising:

10. Displaying a machining path on a screen based on the machining path information; Identifying a section from the processing route displayed on the screen; acquiring first condition information indicating processing conditions in the specified section; displaying an output waveform of the laser in the section on the screen based on the acquired first condition information; A computer-readable storage medium that stores instructions for causing a computer to execute the above.