Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package

Abstract

Provided are: a resin composition comprising (A) one or more components selected from the group consisting of a maleimide resin having a group including a condensed ring of an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups and derivatives of the maleimide resin, and (B) one or more components selected from the group consisting of a maleimide resin having a substituted or unsubstituted biphenyl-diyl group and two or more N-substituted maleimide groups and derivatives of the maleimide resin; and a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package each produced using the resin composition.

Description

Resin compositions, prepregs, laminates, resin films, printed wiring boards, and semiconductor packages

[0001] The present embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package.

[0002] The speed and capacity of signals used in electronic devices such as mobile phones, their base station equipment, servers, routers, and other network infrastructure equipment, as well as large-scale computers, are increasing year by year. Accordingly, the substrate materials for the printed wiring boards used in these electronic devices are required to have a low dielectric constant in order to reduce transmission loss of high-frequency signals.

[0003] Patent Document 1 discloses a resin composition containing maleimide characterized by having a specific skeleton, as a curable resin composition that has excellent heat resistance and dielectric properties in the cured product.

[0004] International Publication No. 2020 / 217679

[0005] However, according to the investigations of the present inventors, it has been found that when a low dielectric constant is achieved by using a maleimide resin having a specific skeleton as described in Patent Document 1, the glass transition temperature of the cured product is lowered, making it difficult to achieve both a low dielectric constant and heat resistance.

[0006] In view of the current situation, an object of the present embodiment is to provide a resin composition that achieves both a low relative dielectric constant and good heat resistance, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that use the resin composition.

[0007] That is, this embodiment provides the following [1] to

[14] . [1] A resin composition containing: (A) one or more maleimide resins having a group containing a fused ring of an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups, and derivatives of the maleimide resins; and (B) one or more maleimide resins having a substituted or unsubstituted biphenyl-diyl group and two or more N-substituted maleimide groups, and derivatives of the maleimide resins. [2] The resin composition according to [1] above, in which the group containing a fused ring of an aromatic ring and an aliphatic ring in the component (A) is a group containing an indane ring as the fused ring. [3] The resin composition according to [2] above, in which the group containing an indane ring is a divalent group represented by the following general formula (A-1): (In the formula, R Ａ１ is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. Ａ１ is an integer from 0 to 3. Ａ２ ~R Ａ４ are each independently an alkyl group having 1 to 10 carbon atoms. * represents a bonding site.) [4] The resin composition according to any one of the above [1] to [3], wherein the component (B) is a compound represented by the following general formula (B-1): (In the formula, X Ｂ１ and X Ｂ２ are each independently an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms, and R Ｂ１ , R Ｂ２ , R Ｂ３ and R Ｂ４ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ｂ１ , n Ｂ２ , n Ｂ３ and n Ｂ４ are each independently an integer of 0 to 4. Ｂ５is an integer of 1 to 10.) [5] The resin composition according to any one of [1] to [4] above, wherein the total content of the (A) component and the (B) component is 30 to 95% by mass, relative to the total amount (100% by mass) of resin components in the resin composition. [6] The resin composition according to any one of [1] to [5] above, wherein the ratio of the content of the (A) component to the content of the (B) component [(A) component / (B) component] is 0.1 to 8 by mass. [7] The resin composition according to any one of [1] to [6] above, further comprising (C) a polyphenylene ether-based resin. [8] The resin composition according to any one of [1] to [7] above, further comprising (D) a styrene-based polymer. [9] The resin composition according to any one of [1] to [8] above, further comprising (E) an inorganic filler.

[10] A prepreg containing the resin composition according to any one of [1] to [9] above or a semi-cured product of the resin composition.

[11] A laminate having a cured product of the resin composition described in any one of [1] to [9] above and a metal foil.

[12] A resin film containing the resin composition described in any one of [1] to [9] above or a semi-cured product of the resin composition.

[13] A printed wiring board having a cured product of the resin composition described in any one of [1] to [9] above.

[14] A semiconductor package having the printed wiring board described in

[13] above and a semiconductor element.

[0008] According to the present embodiment, it is possible to provide a resin composition that has both a low relative dielectric constant and good heat resistance, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that use the resin composition.

[0009] In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. For example, a numerical range "X to Y" (X and Y are real numbers) means a numerical range that is equal to or greater than X and equal to or less than Y. In this specification, the term "X or greater" means X and a numerical value that exceeds X. In addition, the term "Y or less" in this specification means Y and a numerical value that is less than Y. The lower limit and upper limit of a numerical range described in this specification can be arbitrarily combined with the lower limit or upper limit of another numerical range. In the numerical ranges described in this specification, the lower limit or upper limit of that numerical range may be replaced with a value shown in the examples.

[0010] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more. In this specification, when a resin composition contains a plurality of substances corresponding to each component, the content of each component in the resin composition means the total amount of the plurality of substances present in the resin composition, unless otherwise specified.

[0011] In this specification, the term "solid content" refers to components other than the solvent, and components that are liquid at 25°C are also considered to be solid content.

[0012] The number average molecular weight (Mn) and weight average molecular weight (Mw) in this specification refer to values ​​measured in terms of polystyrene by gel permeation chromatography (GPC). Specifically, the number average molecular weight (Mn) and weight average molecular weight (Mw) in this specification can be measured by the method described in the examples.

[0013] In this specification, the term "semi-cured product" is synonymous with a resin composition in a B-stage state according to JIS K 6800 (2006), and the term "cured product" is synonymous with a resin composition in a C-stage state according to JIS K 6800 (2006).

[0014] The mechanism of action described in this specification is speculation and does not limit the mechanism by which the effects of this embodiment are achieved.

[0015] Any combination of the features described in this specification is also included in this embodiment.

[0016] [Resin Composition] The resin composition of the present embodiment is a resin composition containing: (A) one or more selected from the group consisting of maleimide resins having a group containing a fused ring of an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups, and derivatives of the maleimide resins; and (B) one or more selected from the group consisting of maleimide resins having a substituted or unsubstituted biphenyl-diyl group and two or more N-substituted maleimide groups, and derivatives of the maleimide resins.

[0017] In this specification, the term "biphenyl-diyl group" refers to a divalent group obtained by removing two hydrogen atoms from the benzene ring of biphenyl, and may also be referred to as a "biphenylylene group" or a "biphenylene group." In this specification, each component may be abbreviated as component (A), component (B), etc., and similar abbreviations may be used for other components. Hereinafter, each component that may be contained in the resin composition of this embodiment will be described in order.

[0018] <Component (A)> Component (A) is one or more types selected from the group consisting of maleimide resins having a group containing a fused ring of an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups, and derivatives of such maleimide resins. Component (A) has a group containing a fused ring of an aromatic ring and an aliphatic ring. The bulky steric structure of the fused ring is thought to contribute to a reduction in the dielectric constant. Component (A) may be used alone or in combination of two or more types.

[0019] From the viewpoints of dielectric properties, conductor adhesion, and heat resistance, the component (A) is preferably an aromatic maleimide resin having a group containing a fused ring of an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups directly bonded to the aromatic ring, and more preferably an aromatic bismaleimide resin having a group containing a fused ring of an aromatic ring and an aliphatic ring and two N-substituted maleimide groups directly bonded to the aromatic ring.

[0020] From the viewpoints of dielectric properties, conductor adhesion, and ease of production, the group containing a fused ring of an aromatic ring and an aliphatic ring in component (A) is preferably a group containing a fused bicyclic structure as the fused ring, more preferably a group containing a fused ring of a benzene ring and an aliphatic ring, and even more preferably a group containing an indane ring. That is, component (A) is preferably a maleimide resin having a group containing an indane ring and two or more N-substituted maleimide groups.

[0021] The group containing an indane ring is preferably a divalent group represented by the following general formula (A-1).

[0022] (In the formula, R Ａ１ is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. Ａ１ is an integer from 0 to 3. Ａ２ ~R Ａ４ are each independently an alkyl group having 1 to 10 carbon atoms. * represents a bonding site.

[0023] R in the above general formula (A-1) Ａ１ Examples of the alkyl group having 1 to 10 carbon atoms represented by R include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group. These alkyl groups may be either linear or branched. Ａ１ Examples of the alkyl group contained in the alkyloxy group having 1 to 10 carbon atoms and the alkylthio group having 1 to 10 carbon atoms represented by the formula (I) include the same alkyl groups as those having 1 to 10 carbon atoms described above. Ａ１ Examples of the aryl group having 6 to 10 carbon atoms represented by R include a phenyl group and a naphthyl group. Ａ１ Examples of the aryl group contained in the aryloxy group having 6 to 10 carbon atoms and the arylthio group having 6 to 10 carbon atoms represented by the formula (R) include the same as the aryl group having 6 to 10 carbon atoms described above. Ａ１Examples of the cycloalkyl group having 3 to 10 carbon atoms represented by the formula (A-1) include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, and a cyclodecyl group. Ａ１ is an integer from 1 to 3, R Ａ１ From the viewpoint of solvent solubility and reactivity, alkyl groups having 1 to 4 carbon atoms are preferred.

[0024] R Ａ２ ~R Ａ４ Examples of the alkyl group having 1 to 10 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group. These alkyl groups may be either linear or branched. Among these, R Ａ２ ~R Ａ４ is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group. Ａ１ is an integer from 0 to 3, and n Ａ１ When R is 2 or 3, multiple R Ａ１ They may be the same or different.

[0025] Among the above, the divalent group represented by the general formula (A-1) is, from the viewpoint of ease of production, Ａ１ is 0, and R Ａ２ ~R Ａ４ is a methyl group, more preferably a divalent group represented by the following formula (A-1a), (A-1a') or (A-1a'').

[0026] (In the formula, * represents a binding site.)

[0027] As the component (A) containing a divalent group represented by the above general formula (A-1), from the viewpoints of dielectric properties, conductor adhesion, heat resistance, and ease of production, one represented by the following general formula (A-2) is preferred.

[0028] (In the formula, R Ａ１ ~R Ａ４ and n Ａ１is the same as in the general formula (A-1). Ａ５ are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. Ａ２ are each independently an integer of 0 to 4. Ａ３ is a number between 0.95 and 10.0.)

[0029] In the general formula (A-2), multiple R Ａ１ Multiple n Ａ１ R Ａ５ Multiple n Ａ２ Each of the n may be the same or different. Ａ３ If R exceeds 1, multiple R Ａ２ R Ａ３ R Ａ４ Each of the two may be the same or different.

[0030] R in the above general formula (A-2) Ａ５ The alkyl group having 1 to 10 carbon atoms, the alkyloxy group having 1 to 10 carbon atoms, the alkylthio group having 1 to 10 carbon atoms, the aryl group having 6 to 10 carbon atoms, the aryloxy group having 6 to 10 carbon atoms, the arylthio group having 6 to 10 carbon atoms, and the cycloalkyl group having 3 to 10 carbon atoms represented by R Ａ１ The same applies to the alkyl group having 1 to 10 carbon atoms, the alkyloxy group having 1 to 10 carbon atoms, the alkylthio group having 1 to 10 carbon atoms, the aryl group having 6 to 10 carbon atoms, the aryloxy group having 6 to 10 carbon atoms, the arylthio group having 6 to 10 carbon atoms, and the cycloalkyl group having 3 to 10 carbon atoms represented by R Ａ５ From the viewpoints of solvent solubility and ease of production, is preferably an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group.

[0031] n in the above general formula (A-2)Ａ２ is an integer of 0 to 4, and from the viewpoints of compatibility with other resins, dielectric properties, conductor adhesion and ease of production, is preferably an integer of 0 to 3, more preferably 0 or 2. Ａ３ From the viewpoints of dielectric properties, conductor adhesion, solvent solubility, handling properties, and heat resistance, n is preferably a number from 0.98 to 8.0, more preferably a number from 1.0 to 7.0, and even more preferably a number from 1.1 to 6.0. Ａ３ represents the average number of structures containing an indane ring.

[0032] From the viewpoints of dielectric properties, conductor adhesion, solvent solubility, and ease of production, the component (A) represented by the above general formula (A-2) is more preferably a compound represented by the following general formula (A-3) or a compound represented by the following general formula (A-4):

[0033] (In the formula, R Ａ１ ~R Ａ５ and n Ａ１ and n Ａ３ is the same as in the general formula (A-2) above.

[0034] (In the formula, R Ａ１ ~R Ａ４ and n Ａ１ and n Ａ３ is the same as in the general formula (A-2) above.

[0035] Examples of the component (A) represented by the general formula (A-3) above include maleimide resins represented by the following general formula (A-3-1).

[0036] (In the formula, R Ａ６ are each independently a methyl group, an ethyl group, or an isopropyl group. Ａ３ is the same as in the general formula (A-2) above.

[0037] From the viewpoints of dielectric properties, conductor adhesion, solvent solubility, and ease of production, the component (A) represented by the above general formula (A-4) is more preferably one represented by the following general formula (A-4-1).

[0038] (In the formula, nＡ３ is the same as in the general formula (A-2) above.

[0039] A preferred example of a maleimide resin derivative having a group containing a fused ring of an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups is an aminomaleimide resin containing a structure derived from the maleimide resin listed as component (A) and a structure derived from a diamine compound. The aminomaleimide resin can be produced, for example, by subjecting the maleimide resin listed as component (A) to a Michael addition reaction with a diamine compound.

[0040] Examples of the diamine compound include aromatic diamine compounds having two amino groups directly bonded to an aromatic ring, such as 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, and 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline; and silicone compounds having two primary amino groups.

[0041] The number average molecular weight (Mn) of component (A) is preferably 600 to 3,000, more preferably 800 to 2,000, and even more preferably 1,000 to 1,500, from the viewpoints of compatibility with other resins, conductor adhesion, and heat resistance.

[0042] The content of component (A) in the resin composition of this embodiment is preferably 5 to 90 mass%, more preferably 10 to 80 mass%, and even more preferably 15 to 70 mass%, based on the total amount (100 mass%) of the resin components in the resin composition of this embodiment. When the content of component (A) is within the above range, it tends to be easier to achieve both a low relative dielectric constant and good heat resistance to a higher degree.

[0043] Here, in this specification, the term "resin component" refers to a resin and a compound that forms a resin through a curing reaction. In the resin composition of this embodiment, for example, component (A) and component (B) correspond to the resin component. When the resin composition of this embodiment contains, as optional components, a resin or a compound that forms a resin through a curing reaction in addition to the above components, these optional components are also included in the resin component. Examples of the optional resin component include component (C) and component (D), which will be described later. On the other hand, component (E) and component (F), which will be described later, are not included in the resin component.

[0044] The content of the resin component in the resin composition of this embodiment is preferably 10 to 90% by mass, more preferably 30 to 80% by mass, and even more preferably 50 to 70% by mass, based on the total solid content (100% by mass) of the resin composition of this embodiment. When the content of the resin component is equal to or greater than the above-mentioned lower limit, the heat resistance, moldability, processability, and conductor adhesion tend to be improved. On the other hand, when the content of the resin component is equal to or less than the above-mentioned upper limit, the low thermal expansion property tends to be improved.

[0045] <Component (B)> The resin composition of this embodiment contains (B) one or more components selected from the group consisting of maleimide resins having a substituted or unsubstituted biphenyl-diyl group and two or more N-substituted maleimide groups, and derivatives of such maleimide resins. Component (B) mainly contributes to improving heat resistance. When used alone, component (B) tends to increase the dielectric constant, but when used in combination with component (A), it exhibits the effect of improving heat resistance while suppressing an increase in the dielectric constant. Component (B) may be used alone or in combination of two or more components.

[0046] From the viewpoints of dielectric properties, conductor adhesion, and heat resistance, component (B) is preferably an aromatic maleimide resin having a substituted or unsubstituted biphenyl-diyl group and two or more N-substituted maleimide groups directly bonded to an aromatic ring. Furthermore, from the viewpoint of improving heat resistance, component (B) is preferably one having three or more N-substituted maleimide groups, and more preferably one having three or more N-substituted maleimide groups directly bonded to an aromatic ring. Furthermore, component (B) is preferably a biphenylaralkyl maleimide resin.

[0047] The substituted or unsubstituted biphenyl-diyl group contained in the component (B) is, for example, a divalent group represented by the following general formula (B-2).

[0048] (In the formula, R Ｂ１ and R Ｂ２ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ｂ１ and n Ｂ２ are each independently an integer of 0 to 4. * represents a binding site.

[0049] R in the above general formula (B-2) Ｂ１ and R Ｂ２ Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. In the above general formula (B-2), n Ｂ１ and n Ｂ２ are each independently an integer of 0 to 4, and from the viewpoint of availability, are preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. Ｂ１ and n Ｂ２ is an integer of 2 or more, a plurality of R Ｂ１ R Ｂ２ They may be the same or different from each other.

[0050] From the viewpoint of achieving a high degree of compatibility between a low relative dielectric constant and good heat resistance, the component (B) is preferably a compound represented by the following general formula (B-1):

[0051] (In the formula, X Ｂ１ and X Ｂ２ are each independently an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms, and R Ｂ１ , R Ｂ２ , R Ｂ３ and R Ｂ４ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ｂ１ , n Ｂ２ , n Ｂ３ and n Ｂ４ are each independently an integer of 0 to 4. Ｂ５ is an integer from 1 to 10.

[0052] X in the above general formula (B-1) Ｂ１ and X Ｂ２ Examples of the alkylene group having 1 to 5 carbon atoms represented by X include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group. Ｂ１ and X Ｂ２ Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group.

[0053] R in the above general formula (B-1) Ｂ１ , R Ｂ２ , n Ｂ１ and n Ｂ２ The explanation for R in the general formula (B-1) is as explained in the general formula (B-2). Ｂ３ and R Ｂ４ The explanation for R in the general formula (B-2) is as follows: Ｂ１ and R Ｂ２The same applies to n in the general formula (B-1). Ｂ３ and n Ｂ４ are each independently an integer of 0 to 4, and from the viewpoint of availability, are preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.

[0054] n in the above general formula (B-1) Ｂ５ is an integer of 1 to 10, preferably an integer of 1 to 5.

[0055] As a derivative of a maleimide resin having a substituted or unsubstituted biphenyl-diyl group and two or more N-substituted maleimide groups, for example, an aminomaleimide resin containing a structure derived from the maleimide resin listed as component (B) and a structure derived from a diamine compound is preferred. The aminomaleimide resin can be produced, for example, by subjecting the maleimide resin listed as component (B) to a Michael addition reaction with a diamine compound. Examples of the diamine compound include the same compounds as those listed in the description of component (A).

[0056] The content of component (B) in the resin composition of this embodiment is preferably 5 to 90 mass%, more preferably 10 to 80 mass%, and even more preferably 15 to 70 mass%, based on the total amount (100 mass%) of the resin components in the resin composition of this embodiment. When the content of component (B) is within the above range, it tends to be easier to achieve both a low relative dielectric constant and good heat resistance to a higher degree.

[0057] The total content of components (A) and (B) in the resin composition of this embodiment is preferably 30 to 95% by mass, more preferably 50 to 90% by mass, and even more preferably 70 to 85% by mass, based on the total amount (100% by mass) of the resin components in the resin composition of this embodiment. When the total content of components (A) and (B) is equal to or greater than the above-mentioned lower limit, the dielectric constant, heat resistance, moldability, processability, and conductor adhesion tend to be better. Furthermore, when the total content of components (A) and (B) is equal to or less than the above-mentioned upper limit, the low thermal expansion property tends to be better.

[0058] The ratio of the content of component (A) to the content of component (B) in the resin composition of this embodiment [component (A) / component (B)], on a mass basis, is preferably 0.1 to 8, more preferably 0.2 to 6, and even more preferably 0.3 to 4. When the content ratio [component (A) / component (B)] is within the above range, it tends to be easier to achieve both a low relative dielectric constant and good heat resistance to a higher degree.

[0059] <(C) Polyphenylene ether-based resin> The resin composition of this embodiment preferably further contains a (C) polyphenylene ether-based resin. By containing the (C) polyphenylene ether-based resin, the resin composition of this embodiment tends to easily produce a cured product with more excellent dielectric properties. The (C) polyphenylene ether-based resin may be used alone or in combination of two or more.

[0060] The polyphenylene ether resin (C) has a phenylene ether bond and preferably has a structural unit represented by the following general formula (C-1).

[0061] (In the formula, R Ｃ１ is a hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ｃ１ is an integer from 0 to 4.

[0062] R in the above general formula (C-1) Ｃ１ Examples of the hydrocarbon group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. The hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. As the hydrocarbon group having 1 to 5 carbon atoms, a hydrocarbon group having 1 to 3 carbon atoms is preferred, and a methyl group is more preferred. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc.

[0063] The phenylene ether unit represented by the above general formula (C-1) is preferably a phenylene ether unit represented by the following general formula (C-1').

[0064]

[0065] The (C) polyphenylene ether resin preferably has a functional group containing an ethylenically unsaturated bond [hereinafter, sometimes referred to as an "ethylenically unsaturated bond-containing group."]. In this specification, "ethylenically unsaturated bond" means a carbon-carbon double bond capable of undergoing an addition reaction, and does not include double bonds in aromatic rings. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, an allyl group, a 1-methylallyl group, an isopropenyl group, a 2-butenyl group, a 3-butenyl group, a styryl group, a maleimide group, and a (meth)acryloyl group. Among these, from the viewpoint of dielectric properties, a (meth)acryloyl group is preferred, and a methacryloyl group is more preferred.

[0066] The number of ethylenically unsaturated bond-containing groups that the polyphenylene ether resin (C) has in one molecule is preferably 1 to 5, more preferably 2 to 3, and even more preferably 2, from the viewpoints of the heat resistance of the cured product and the fluidity of the resin composition.

[0067] The polyphenylene ether resin (C) preferably has an ethylenically unsaturated bond-containing group at its terminal, more preferably at both terminals. The polyphenylene ether resin (C) may have an ethylenically unsaturated bond-containing group at a terminal other than the terminal, but preferably has an ethylenically unsaturated bond-containing group only at its terminal, more preferably has an ethylenically unsaturated bond-containing group only at both terminals.

[0068] The weight average molecular weight (Mw) of the polyphenylene ether resin (C) is preferably 500 to 7,000, more preferably 800 to 5,000, and even more preferably 1,000 to 3,000, from the viewpoints of dielectric properties, heat resistance, and moldability.

[0069] The content of the polyphenylene ether resin (C) in the resin composition of this embodiment is preferably 1 to 30 mass%, more preferably 4 to 20 mass%, and even more preferably 7 to 15 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition of this embodiment. When the content of the polyphenylene ether resin (C) is equal to or greater than the above-mentioned lower limit, a cured product with excellent dielectric properties tends to be easily obtained. Furthermore, when the content of the polyphenylene ether resin (C) is equal to or less than the above-mentioned upper limit, the moldability of the resin composition tends to be more easily improved.

[0070] <(D) Styrene-based polymer> The resin composition of this embodiment preferably further contains a (D) styrene-based polymer. By containing the (D) styrene-based polymer, the resin composition of this embodiment tends to have better dielectric properties. One type of (D) styrene-based polymer may be used alone, or two or more types may be used in combination.

[0071] The (D) styrene-based polymer has structural units derived from a styrene-based compound (hereinafter, may be referred to as "styrene-based units").

[0072] Examples of styrene compounds include styrene and alkyl-substituted styrenes such as α-methylstyrene, o-methylstyrene, m-methylstyrene, and p-methylstyrene. The number of carbon atoms in the alkyl group of the alkyl-substituted styrene is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 or 2.

[0073] The (D) styrene-based polymer may contain structural units other than styrene-based units. Examples of structural units other than styrene-based units include butadiene-derived structural units, isoprene-derived structural units, maleic acid-derived structural units, and maleic anhydride-derived structural units. The butadiene-derived structural units and isoprene-derived structural units may be hydrogenated. When hydrogenated, the butadiene-derived structural units become structural units in which ethylene units and butylene units are mixed, and the isoprene-derived structural units become structural units in which ethylene units and propylene units are mixed.

[0074] Examples of (D) styrene-based polymers include hydrogenated products of styrene-butadiene-styrene block copolymers, hydrogenated products of styrene-isoprene-styrene block copolymers, and styrene-maleic anhydride copolymers. Examples of hydrogenated products of styrene-butadiene-styrene block copolymers include SEBS, which is obtained by completely hydrogenating the carbon-carbon double bonds in the butadiene block, and SBBS, which is obtained by partially hydrogenating the carbon-carbon double bonds at 1,2-bond sites in the butadiene block. Hydrogenated products of styrene-isoprene-styrene block copolymers are obtained as SEPS by hydrogenating the polyisoprene portion. Among these, SEBS and SEPS are preferred, with SEBS being more preferred, from the viewpoints of dielectric properties, conductor adhesion, heat resistance, glass transition temperature, and low thermal expansion.

[0075] In the (D) styrene-based polymer, the content of styrene-based units (hereinafter, may be referred to as "styrene content") is preferably 10 to 60 mass%, more preferably 15 to 50 mass%, and even more preferably 20 to 40 mass%, from the viewpoints of dielectric properties, adhesion to conductors, heat resistance, and low thermal expansion.

[0076] The melt flow rate (MFR) of the (D) styrene-based polymer is preferably 0.1 to 20 g / 10 min, more preferably 1 to 10 g / 10 min, and even more preferably 3 to 7 g / 10 min, measured under conditions of 230°C and a load of 2.16 kgf (21.2 N).

[0077] The weight average molecular weight (Mw) of the (D) styrene-based polymer is preferably 10,000 to 500,000, more preferably 30,000 to 200,000, and even more preferably 50,000 to 100,000.

[0078] When the resin composition of this embodiment contains a (D) styrene-based polymer, the content of the (D) styrene-based polymer is preferably 1 to 30 mass%, more preferably 5 to 20 mass%, and even more preferably 7 to 15 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition of this embodiment. When the content of the (D) styrene-based polymer is equal to or greater than the above-mentioned lower limit, the dielectric properties tend to be better. On the other hand, when the content of the (D) styrene-based polymer is equal to or less than the above-mentioned upper limit, the heat resistance and flame retardancy tend to be better.

[0079] <(E) Inorganic Filler> The resin composition of this embodiment preferably further contains an inorganic filler (E). By containing the inorganic filler (E), the resin composition of this embodiment tends to have better low thermal expansion properties and heat resistance. One type of (E) inorganic filler may be used alone, or two or more types may be used in combination.

[0080] (E) inorganic filler can be enumerated as follows: silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide etc.Among these, from the viewpoint of low thermal expansion, heat resistance and flame retardancy, silica, alumina, mica, talc are preferred, silica, alumina are more preferred, and silica is even more preferred.As silica, from the viewpoint of dispersibility and moldability, fused silica is preferred.

[0081] (E) Average particle diameter of inorganic filler (D ５０ From the viewpoint of dispersibility of the inorganic filler (E) and fine wiring properties, the average particle diameter (D) of the inorganic filler (E) is preferably 0.1 to 10 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 0.8 μm. ５０) refers to the particle diameter at the point corresponding to 50% volume when a cumulative frequency distribution curve of particle diameters is calculated, with the total volume of the particles being 100%. The average particle diameter of the (E) inorganic filler can be measured, for example, with a particle size distribution measuring device using a laser diffraction scattering method. Examples of the shape of the (E) inorganic filler include spherical and crushed shapes, with spherical being preferred. The (E) inorganic filler may be surface-treated with a surface treatment agent such as a silane coupling agent, from the viewpoint of improving dispersibility and adhesion to organic components.

[0082] When the resin composition of this embodiment contains an inorganic filler (E), the content of the inorganic filler (E) is preferably 20 to 90% by mass, more preferably 30 to 80% by mass, and even more preferably 40 to 60% by mass, based on the total solids content (100% by mass) of the resin composition. When the content of the inorganic filler (E) is equal to or greater than the above-mentioned lower limit, low thermal expansion and heat resistance tend to be more favorable. On the other hand, when the content of the inorganic filler (E) is equal to or less than the above-mentioned upper limit, moldability and conductor adhesion tend to be more favorable.

[0083] <(F) Curing Accelerator> The resin composition of this embodiment preferably further contains a (F) curing accelerator. By containing the (F) curing accelerator, the resin composition of this embodiment tends to have improved curability and better dielectric properties, heat resistance, and conductor adhesion. One type of (F) curing accelerator may be used alone, or two or more types may be used in combination.

[0084] Examples of the (F) curing accelerator include acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, tributylamine, pyridine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate; isocyanate-masked imidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; quaternary ammonium compounds; and phosphorus compounds such as triphenylphosphine and quaternary phosphonium compounds which are addition reaction products of p-benzoquinone and tri-n-butylphosphine. peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-bis(t-butylperoxy)diisopropylbenzene; inorganic peroxides such as potassium persulfate, sodium persulfate, and ammonium persulfate; azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile); carboxylic acid salts of manganese, cobalt, zinc, and the like; and acidic catalysts such as p-toluenesulfonic acid. Among these, from the viewpoint of curing acceleration effect and storage stability, organic peroxides, imidazole compounds, and phosphorus-based compounds are more preferred, and it is even more preferred to use an organic peroxide and an imidazole compound in combination.

[0085] When the resin composition of this embodiment contains a (F) curing accelerator, the content of the (F) curing accelerator is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and even more preferably 0.5 to 5 parts by mass, relative to the total amount (100 parts by mass) of the resin components in the resin composition of this embodiment. When the content of the (F) curing accelerator is equal to or greater than the above-mentioned lower limit, a sufficient curing acceleration effect tends to be easily obtained. Furthermore, when the content of the (F) curing accelerator is equal to or less than the above-mentioned upper limit, storage stability tends to be more easily improved.

[0086] <Other Components> The resin composition of the present embodiment may further contain, as necessary, one or more additives selected from the group consisting of resin materials other than the above components, antioxidants, heat stabilizers, antistatic agents, UV absorbers, pigments, colorants, lubricants, and other additives. Each of these may be used alone or in combination of two or more. The amount of these additives used is not particularly limited, and they may be used as needed within a range that does not impair the effects of the present embodiment.

[0087] (Organic Solvent) The resin composition of the present embodiment may contain an organic solvent from the viewpoint of facilitating handling and facilitating the production of the prepreg described below. One organic solvent may be used alone, or two or more organic solvents may be used in combination. Examples of the organic solvent include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic hydrocarbon-based solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone.

[0088] <Method for producing resin composition> The resin composition of this embodiment can be produced by mixing the components by a known method. At this time, the components may be dissolved or dispersed while stirring. The conditions such as the mixing order, temperature, and time are not particularly limited and may be set as desired depending on the types of raw materials, etc.

[0089] [Prepreg] The prepreg of the present embodiment is a prepreg containing the resin composition of the present embodiment or a semi-cured product of the resin composition. The prepreg of the present embodiment contains, for example, the resin composition of the present embodiment or a semi-cured product of the resin composition and a sheet-like fiber base material.

[0090] The sheet-like fiber substrate contained in the prepreg of this embodiment can be, for example, a known sheet-like fiber substrate used in various laminates for electrical insulating materials. Examples of the material for the sheet-like fiber substrate include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber substrates have shapes such as woven fabric, nonwoven fabric, roving, chopped strand mat, and surfacing mat.

[0091] The prepreg of this embodiment can be produced, for example, by impregnating or applying the resin composition of this embodiment to a sheet-like fiber substrate, and then heating and drying the composition to B-stage. The temperature and time for heating and drying can be, for example, 50 to 200°C and 1 to 30 minutes, from the viewpoints of productivity and appropriately B-staging the resin composition of this embodiment.

[0092] The content of the resin composition in the prepreg of the present embodiment is preferably 20 to 90% by mass, more preferably 25 to 80% by mass, and even more preferably 30 to 75% by mass, from the viewpoint that better moldability is easily obtained when the prepreg is made into a laminate.

[0093] [Resin Film] The resin film of this embodiment is a resin film containing the resin composition of this embodiment or a semi-cured product of the resin composition. The resin film of this embodiment can be produced, for example, by applying the resin composition of this embodiment containing an organic solvent to a support and then heating and drying it. Examples of the support include plastic film, metal foil, and release paper. The temperature and time of the heating and drying are not particularly limited, but can be set to 50 to 200°C and 1 to 30 minutes from the viewpoints of productivity and appropriately B-staging the resin composition of this embodiment.

[0094] The resin film of this embodiment is preferably used to form an insulating layer when producing a printed wiring board.

[0095] [Laminate] The laminate of the present embodiment is a laminate having a cured product of the resin composition of the present embodiment and a metal foil. Note that a laminate having a metal foil is sometimes called a metal-clad laminate.

[0096] The metal of the metal foil is not particularly limited, and examples thereof include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements.

[0097] The laminate of this embodiment can be produced, for example, by placing metal foil on one or both sides of the prepreg of this embodiment and then hot-press molding. Typically, the B-staged prepreg is cured by this hot-press molding to obtain the laminate of this embodiment. When hot-press molding, only one prepreg may be used, or two or more prepregs may be laminated together. Hot-press molding can be performed using, for example, a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, or the like. Hot-press molding conditions can be, for example, a temperature of 100 to 300°C, a time of 10 to 300 minutes, and a pressure of 1.5 to 5 MPa.

[0098] [Printed Wiring Board] The printed wiring board of this embodiment is a printed wiring board having a cured product of the resin composition of this embodiment. The printed wiring board of this embodiment can be produced, for example, by forming a conductor circuit on one or more materials selected from the group consisting of a cured product of the prepreg of this embodiment, a cured product of the resin film of this embodiment, and a laminate by a known method. Furthermore, a multilayer printed wiring board can also be produced by further performing a multilayer adhesive process as necessary. The conductor circuit can be formed, for example, by appropriately performing drilling, metal plating, etching of metal foil, etc.

[0099] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package including the printed wiring board of this embodiment and a semiconductor element. The semiconductor package of this embodiment can be manufactured, for example, by mounting a semiconductor chip, a memory, etc. on the printed wiring board of this embodiment by a known method.

[0100] The present embodiment will be specifically described below with reference to examples, although the present embodiment is not limited to the following examples.

[0101] In each example, the number average molecular weight (Mn) and weight average molecular weight (Mw) were measured by the following method. They were calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. Apparatus: Pump: L-6200 type [manufactured by Hitachi High-Technologies Corporation] Detector: L-3300 type RI [manufactured by Hitachi High-Technologies Corporation] Column oven: L-655A-52 [manufactured by Hitachi High-Technologies Corporation] Column: Guard column; TSK Guard column HHR-L + column; TSKgel G4000HHR + TSKgel G2000HHR (all manufactured by Tosoh Corporation, trade names) Column size: 6.0 x 40 mm (guard column), 7.8 x 300 mm (column) Eluent: tetrahydrofuran Sample concentration: 30 mg / 5 mL Injection volume: 20 μL Flow rate: 1.00 mL / min Measurement temperature: 40°C

[0102] [Production of Resin Composition] Examples 1 to 3, Comparative Example 1 Each component shown in Table 1 was blended with methyl ethyl ketone according to the formulation shown in Table 1, and the blended mixture was stirred and mixed at 25° C. to prepare a varnish-like resin composition having a solid content concentration of 60% by mass. In Table 1, the unit of the blend amount of each component is parts by mass, and in the case of a solution, it means parts by mass converted into solid content.

[0103] (Production of Prepreg) A glass cloth having a thickness of 0.1 mm was impregnated with the varnish-like resin composition obtained above, and the cloth was dried by heating at 130° C. for 4 minutes to obtain a prepreg. The content of the resin composition in the prepreg was 57% by mass.

[0104] (Production of Copper-Clad Laminate) Four prepregs obtained above were stacked, and 12 μm thick copper foil (manufactured by Mitsui Kinzoku Co., Ltd., product name "3EC-M3-VLP-12", roughened surface Rz: 3.0 μm) was placed on top and bottom of them so that the roughened surface was in contact with the prepreg. This laminate was heated and press-molded at a temperature of 230° C., a pressure of 3.0 MPa, and a time of 90 minutes to produce a copper-clad laminate (thickness: 0.43 mm).

[0105] [Evaluation Method] Each evaluation was carried out according to the following methods. The results are shown in Table 1.

[0106] (Method for measuring relative permittivity (Dk)) The copper-clad laminate prepared in each example was immersed in a 10 mass % solution of ammonium persulfate (manufactured by Mitsubishi Gas Chemical Company, Inc.) as a copper etching solution to remove the copper foil, and then cut into a 2 mm × 50 mm piece. The piece was then dried for 1 hour at 105° C. to prepare a test piece. Next, the relative permittivity (Dk) of the test piece was measured in the 10 GHz band at an ambient temperature of 25° C. in accordance with the cavity resonator perturbation method.

[0107] (Method for measuring glass transition temperature) The copper foil on both sides of the copper-clad laminate obtained in each example was removed by etching to prepare a 5 mm square test piece. Next, the test piece was mounted in a thermomechanical measuring apparatus (TMA) (manufactured by TA Instruments Japan, Inc., product name "Q400"), and thermomechanical measurements were performed twice consecutively using a compression method under the following conditions: temperature range 30 to 260 ° C, load 5 g, heating rate 10 ° C / min, frequency 1 Hz. The glass transition temperature obtained from the second thermomechanical measurement was used as the glass transition temperature.

[0108]

[0109] Details of each component listed in Table 1 are as follows: [Component (A)] Maleimide resin having a group containing an indane ring: Aromatic bismaleimide resin having a group containing an indane ring, represented by the above general formula (A-4-1): Number average molecular weight (Mn) 1,300

[0110] [Component (B)] Maleimide resin having a biphenyl-diyl group: biphenylaralkyl-type maleimide (manufactured by Nippon Kayaku Co., Ltd., trade name "MIR-3000")

[0111] [Component (C)] Polyphenylene ether having a methacryloyl group: polyphenylene ether having a methacryloyl group at both ends (weight average molecular weight (Mw) 1,700)

[0112] [Component (D)] SEBS: styrene-ethylene-butylene-styrene (SEBS) copolymer (manufactured by Kraton Polymer Japan Co., Ltd., product name "Kraton (registered trademark) MD1653", melt flow rate 5.0 g / 10 min, styrene content 30 mass%, hydrogenation rate 100%, weight average molecular weight (Mw) = 70,000)

[0113] [Component (E)] Silica: spherical fused silica, average particle diameter (D ５０ ) 0.5 to 0.7 μm

[0114] [Component (F)] Organic peroxide: α,α'-bis(t-butylperoxy)diisopropylbenzene Imidazole curing accelerator: isocyanate-masked imidazole (addition product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole) (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., trade name "G-8009L")

[0115] The results shown in Table 1 show that the resin compositions of Examples 1 to 3 of this embodiment have improved glass transition temperatures while maintaining a good dielectric constant (Dk) compared to the resin composition of Comparative Example 1.

Claims

1. A resin composition comprising: (A) one or more members selected from the group consisting of maleimide resins having a group containing a condensed ring of an aromatic ring and an aliphatic ring, and two or more N-substituted maleimide groups, and derivatives of said maleimide resins; and (B) one or more members selected from the group consisting of maleimide resins having a substituted or unsubstituted biphenyl-diyl group, and two or more N-substituted maleimide groups, and derivatives of said maleimide resins.

2. The resin composition according to claim 1, wherein the group containing a fused ring of an aromatic ring and an aliphatic ring contained in the component (A) is a group containing an indane ring as the fused ring.

3. The resin composition according to claim 2, wherein the group containing an indane ring is a divalent group represented by the following general formula (A-1): (In the formula, R Ａ１ is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. Ａ１ is an integer from 0 to 3. Ａ２ ~R Ａ４ are each independently an alkyl group having 1 to 10 carbon atoms. * represents a bonding site.

4. The resin composition according to any one of claims 1 to 3, wherein the component (B) is a compound represented by the following general formula (B-1): (In the formula, X Ｂ１ and X Ｂ２ are each independently an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms; R Ｂ１ , R Ｂ２ , R Ｂ３ and R Ｂ４ Each of n is independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ｂ１ , n Ｂ２ , n Ｂ３ and n Ｂ４ Each n is independently an integer from 0 to 4. Ｂ５ is an integer from 1 to 10.

5. A resin composition described in any one of claims 1 to 3, wherein the total content of the (A) component and the (B) component is 30 to 95 mass% relative to the total amount (100 mass%) of resin components in the resin composition.

6. A resin composition according to any one of claims 1 to 3, wherein the ratio of the content of the component (A) to the content of the component (B) [component (A) / component (B)] is 0.1 to 8 on a mass basis.

7. The resin composition according to any one of claims 1 to 3, further comprising (C) a polyphenylene ether resin.

8. The resin composition according to any one of claims 1 to 3, further comprising (D) a styrene-based polymer.

9. The resin composition according to any one of claims 1 to 3, further comprising (E) an inorganic filler.

10. A prepreg containing the resin composition according to any one of claims 1 to 3 or a semi-cured product of said resin composition.

11. A laminate comprising a cured product of the resin composition according to any one of claims 1 to 3 and a metal foil.

12. A resin film comprising the resin composition according to any one of claims 1 to 3 or a semi-cured product of said resin composition.

13. A printed wiring board having a cured product of the resin composition according to any one of claims 1 to 3.

14. A semiconductor package comprising the printed wiring board according to claim 13 and a semiconductor element.