Deposition ring of a process kit for semiconductor substrate processing
Patent Information
- Application Number
- US29/848747
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2022-08-04
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2040-01-28
Smart Images
Figure USD1059312-D00000_ABST
Description
[0001] FIG. 1 is a top isometric view of a deposition ring of a process kit for semiconductor substrate processing, according to the novel design.
[0002] FIG. 2 is a bottom isometric view thereof.
[0003] FIG. 3 is a top plan view thereof.
[0004] FIG. 4 is a bottom plan view thereof.
[0005] FIG. 5 is a left elevation view thereof, enlarged to more clearly show details.
[0006] FIG. 6 is a right elevation view thereof, enlarged to more clearly show details.
[0007] FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,
[0008] FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.
Claims
The ornamental design for a deposition ring of a process kit for semiconductor substrate processing, as shown and described.
Citation Information
Patent Citations
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KR1020090064113A
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