Electrode plate for semiconductor manufacturing apparatus

Description

[0001] FIG. 1 is a top perspective view of an electrode plate for semiconductor manufacturing apparatus, showing our new design;

[0002] FIG. 2 is a bottom perspective view thereof;

[0003] FIG. 3 is a top plan view thereof;

[0004] FIG. 4 is a bottom plan view thereof;

[0005] FIG. 5 is a front side elevational view thereof;

[0006] FIG. 6 is a back side elevational view thereof;

[0007] FIG. 7 is a right side elevational view thereof;

[0008] FIG. 8 is a left side elevational view thereof;

[0009] FIG. 9 is an enlarged portion view taken from encircled portion labeled, “9,” in FIG. 1;

[0010] FIG. 10 is an enlarged portion view taken from encircled portion labeled, “10,” in FIG. 3; and,

[0011] FIG. 11 is a cross-sectional view taken along lines 11-11 in FIG. 3.

[0012] The even dashed broken lines showing of the electrode plate for semiconductor manufacturing apparatus are for the purpose of illustrating portions of the article that form no part of the claimed design.

[0013] The dot-dashed lines illustrate the boundary of the enlarged portion views of FIGS. 9 and 10 in FIGS. 1, 3, 9, and 10 and form no part of the claimed design.

Claims

The ornamental design for an electrode plate for semiconductor manufacturing apparatus, as shown and described.

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