Display substrate, manufacturing method therefor and display apparatus

Abstract

The present disclosure provides a display substrate, a manufacturing method therefor, and a display apparatus. The display substrate comprises: a base, multiple island areas located at one side of the base, multiple bridge areas used to connect adjacent island areas, and hole areas located between adjacent bridge areas; each island area comprises at least one sub-pixel, and adjacent island areas are connected by multiple bridge areas disposed at intervals; at least one bridge area comprises a first metal layer, a first organic layer and a second metal layer, which are sequentially stacked in a direction away from the base, each bridge area first metal layer comprising a first signal line used to connect the sub-pixels in adjacent island areas, and each bridge area second metal layer comprising a second signal line used to connect the sub-pixels in adjacent island areas.

Description

Display substrate, manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate, a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, flexible organic light-emitting diodes (OLEDs) have promoted the diversification of displays and gradually become the mainstream of display technology. In some related technologies, OLED flexible display devices can meet the bending requirements of two-dimensional surfaces, but are not suitable for the flexible display substrates required for more complex display devices (such as wearable devices).

[0003] In order to develop the display function of OLED flexible display devices, some related technologies form islands for preparing pixel areas and bridges for routing by opening holes in the base material of the OLED flexible display device, and the stretching of the display device is achieved through the deformation of the bridges.

[0004] Summary of the Invention

[0005] The present disclosure provides a display substrate, a manufacturing method thereof, and a display device. The specific solutions are as follows:

[0006] The present disclosure provides a display substrate comprising: a base, a plurality of island regions located on one side of the base, a plurality of bridge regions for connecting adjacent island regions, and a hole region located between adjacent bridge regions; wherein,

[0007] Each of the island regions includes at least one sub-pixel, and a plurality of bridge regions arranged at intervals are connected between two adjacent island regions;

[0008] At least one of the bridge areas includes a first metal layer, a first organic layer, and a second metal layer stacked in sequence in a direction away from the substrate. The first metal layer of each bridge area includes a first signal line for connecting sub-pixels in adjacent island areas, and the second metal layer of each bridge area includes a second signal line for connecting sub-pixels in adjacent island areas.

[0009] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the bridge area also includes a second organic layer arranged on a side of the second metal layer away from the substrate, and the orthographic projections of the second organic layer and the first organic layer on the substrate are both located within the range of the substrate.

[0010] In a possible implementation, in the above-mentioned display substrate provided by an embodiment of the present disclosure, the first organic layer at least covers the top surface of the first signal line.

[0011] In a possible implementation, in the above-mentioned display substrate provided by an embodiment of the present disclosure, the first organic layer further covers the side surfaces of the first signal line, and the first organic layer is disposed in contact with the base.

[0012] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the orthographic projection of the second signal line on the substrate falls within the range of the orthographic projection of the first organic layer on the substrate.

[0013] In a possible implementation, in the above-mentioned display substrate provided by an embodiment of the present disclosure, the second organic layer covers the top surface and side surfaces of the second signal line, and the second organic layer is arranged in contact with the first organic layer.

[0014] In a possible implementation, in the above-mentioned display substrate provided by an embodiment of the present disclosure, the second signal line at least covers the top surface of the first organic layer.

[0015] In a possible implementation, in the display substrate provided in an embodiment of the present disclosure, the second signal line further covers a side surface of the first organic layer, and the second signal line is arranged in contact with the base.

[0016] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the second organic layer covers the top surface and side surfaces of the second signal line, and the second organic layer is arranged in contact with the base.

[0017] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the bridge area further includes an inorganic layer arranged on a side of the second organic layer away from the substrate, the inorganic layer covers the second organic layer and is arranged in contact with the substrate, and the inorganic layer has a hollow structure.

[0018] In one possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the inorganic layer includes a top structure arranged opposite to the base and two side structures arranged in contact with the base, and the top structure has a first hollow structure running through the thickness direction of the top structure.

[0019] In a possible implementation, in the display substrate provided in an embodiment of the present disclosure, along an extension direction of the signal line, the top structure has a plurality of the first hollow structures evenly spaced apart.

[0020] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the side structure has a second hollow structure that runs through the thickness direction of the side structure.

[0021] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the second hollow structure and the first hollow structure are interconnected.

[0022] In one possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the island area includes a first source-drain metal layer, a first planar layer, a second source-drain metal layer, and a second planar layer stacked in sequence along a direction away from the substrate, the first signal line is arranged on the same layer as the first source-drain metal layer, the first organic layer is arranged on the same layer as the first planar layer, the second signal line is arranged on the same layer as the second source-drain metal layer, and the second organic layer is arranged on the same layer as the second planar layer.

[0023] In a possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the island area also includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked in sequence on the side of the second flat layer away from the base, and the inorganic layer includes a first sub-inorganic layer and a second sub-inorganic layer that are stacked, the first sub-inorganic layer and the first inorganic encapsulation layer are arranged on the same layer, and the second sub-inorganic layer and the second inorganic encapsulation layer are arranged on the same layer.

[0024] In a possible implementation, in the display substrate provided in an embodiment of the present disclosure, the shape of the bridge region is a curve, and the shape of the signal line is the same as that of the bridge region.

[0025] In one possible implementation, in the above-mentioned display substrate provided in an embodiment of the present disclosure, the spacing between the orthographic projection edge of the first organic layer on the substrate and the orthographic projection edge of the first signal line on the substrate is greater than or equal to 1 μm, and the spacing between the orthographic projection edge of the second organic layer on the substrate and the orthographic projection edge of the second signal line on the substrate is greater than or equal to 1 μm.

[0026] Correspondingly, an embodiment of the present disclosure further provides a display device, comprising the above-mentioned display substrate provided by an embodiment of the present disclosure.

[0027] Accordingly, an embodiment of the present disclosure further provides a method for manufacturing a display substrate, comprising:

[0028] A substrate is provided; the substrate has: a plurality of island areas, a plurality of bridge areas for connecting adjacent island areas, and a hole area located between adjacent bridge areas, and a plurality of bridge areas arranged at intervals are connected between adjacent two island areas;

[0029] At least one sub-pixel is formed in each of the island areas, and a first metal layer, a first organic layer, and a second metal layer are formed in at least one of the bridge areas, which are stacked in sequence along a direction away from the substrate; wherein the first metal layer of each of the bridge areas includes a first signal line for connecting sub-pixels in adjacent island areas, and the second metal layer of each of the bridge areas includes a second signal line for connecting sub-pixels in adjacent island areas. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG1 is a schematic diagram of a planar structure of a display substrate provided by an embodiment of the present disclosure;

[0031] FIG2A is a schematic diagram of a partial cross-sectional structure of a display substrate provided by an embodiment of the present disclosure;

[0032] FIG2B is an enlarged schematic diagram of the structure of the three bridge areas in FIG2A ;

[0033] FIG3A is a schematic diagram of another partial cross-sectional structure of a display substrate provided in an embodiment of the present disclosure;

[0034] FIG3B is a schematic diagram of a hollow structure provided on the top structure of the inorganic layer in the bridge area;

[0035] FIG3C is a schematic diagram showing that both the top structure and the side structure of the inorganic layer in the bridge region are provided with hollow structures;

[0036] FIG3D is a schematic diagram of the enlarged structure of the three bridge areas Q2 in FIG3A ;

[0037] FIG4A is a schematic diagram of another partial cross-sectional structure of a display substrate provided in an embodiment of the present disclosure;

[0038] FIG4B is an enlarged schematic diagram of the structure of the three bridge areas in FIG4A ;

[0039] FIG5A is a schematic diagram of another partial cross-sectional structure of a display substrate provided by an embodiment of the present disclosure;

[0040] FIG5B is a schematic diagram of a hollow structure provided on the top structure of the inorganic layer in the bridge area;

[0041] FIG5C is a schematic diagram showing that both the top structure and the side structure of the inorganic layer in the bridge region are provided with hollow structures;

[0042] FIG5D is an enlarged schematic diagram of the structure of the three bridge areas in FIG5A;

[0043] FIG6 is a schematic diagram of a 2T1C pixel circuit;

[0044] FIG7 is a schematic diagram of a 3T1C pixel circuit;

[0045] FIG8 is a schematic diagram of a pixel circuit of 7T1C;

[0046] FIG9 is a schematic flow chart of a method for manufacturing a display substrate according to an embodiment of the present disclosure;

[0047] 10A-10T are schematic structural diagrams corresponding to a display substrate in a manufacturing process according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0049] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “include” or “comprise” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0050] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0051] The present disclosure provides a display substrate, as shown in Figures 1, 2A, 3A, 4A and 5A. Figure 1 is a schematic diagram of a partial planar structure of the display substrate, and Figures 2A, 3A, 4A and 5A are schematic diagrams of a partial cross-sectional structure of the display substrate, respectively. The display substrate includes: a substrate 1, a plurality of island areas Q1 located on one side of the substrate 1, a plurality of bridge areas Q2 for connecting adjacent island areas Q1, and a hole area Q3 located between adjacent bridge areas Q2; specifically, the island areas Q1 are used to display images, the bridge areas Q2 are used for routing (to connect signals between adjacent island areas Q1) and to transmit tension, and the hole area Q3 is used to provide deformation space for the display substrate when stretched; wherein,

[0052] Each island region Q1 includes at least one sub-pixel 2, and a plurality of spaced bridge regions Q2 are connected between two adjacent island regions Q1. Specifically, FIG. 1 provided in the present disclosure takes an example in which each island region Q1 includes three sub-pixels 2. These three sub-pixels 2 may be a red sub-pixel R, a green sub-pixel G, and a blue sub-pixel B, respectively, but the present invention is not limited thereto. The island regions Q1 in FIG. 2A , FIG. 3A , FIG. 4A , and FIG. 5A each illustrate a schematic cross-sectional structure of only one sub-pixel.

[0053] At least one bridge area Q2 includes a first metal layer 3, a first organic layer 4, and a second metal layer 5 stacked in sequence along a direction away from the substrate 1. The first metal layer 3 of each bridge area Q2 includes a first signal line 31 for connecting the sub-pixels 2 in the adjacent island area Q1, and the second metal layer 5 of each bridge area Q2 includes a second signal line 51 for connecting the sub-pixels 2 in the adjacent island area Q1.

[0054] The above-mentioned display substrate provided by the embodiment of the present disclosure increases the signal line strength of the bridge area by providing multiple independent bridge areas between two adjacent island areas for connecting the two adjacent island areas, and the bridge area adopts a double-layer metal routing design. In this way, when the display substrate is removed from the rigid base during the preparation process, the signal line in the bridge area is not easily broken.

[0055] Specifically, the substrate can be a flexible substrate, enabling the stretchable region of the display substrate to be stretched. The substrate can include a single flexible layer, or can include a first flexible layer, a barrier layer, and a second flexible layer stacked in layers. The present disclosure uses the substrate including a single flexible layer as an example. Specifically, the flexible layer can be made of polyimide (PI), polyester, polyamide, or the like.

[0056] Specifically, as shown in Figures 2A, 3A, 4A and 5A, the base 1 and the film layer thereon can be arranged on a glass substrate 100 with a supporting function. After the production of each film layer is completed, the glass substrate 100 is peeled off to obtain a stretchable display substrate, which becomes a stretchable display substrate.

[0057] It should be noted that, as shown in Figures 2A, 3A, 4A, and 5A, the hole region Q3 in the embodiment of the present disclosure may completely penetrate the display substrate. Of course, the hole region Q3 may also penetrate all film layers on the base 1 of the display substrate and part of the base 1. The embodiment of the present disclosure takes the case where the hole region Q3 completely penetrates the display substrate as an example.

[0058] In specific implementations, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 1, 2A, 3A, 4A, and 5A, since only one signal line is provided on the same metal layer in the bridge region Q2, the width of the bridge region Q2 can be reduced and the length of the bridge region Q2 can be increased. Furthermore, by removing the corresponding inorganic layer in the bridge region, the modulus of the bridge region Q2 can be reduced, effectively improving the stretchability. In the embodiments of the present disclosure, a stretchable display substrate is used as an example for explanation.

[0059] In a specific implementation, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 1, 2A, 3A, 4A and 5A, the bridge area Q2 adopts a first metal layer 3 / second metal layer 5 double-layer metal routing design, so that the first signal line 31 of the first metal layer 3 and the second signal line 51 of the second metal layer 5 can be designed as independent signal lines, that is, the signal lines in the display substrate are double-layered, which can reduce the number of bridge areas Q2, so that there is more space to design the bending structure of the bridge area Q2, further improving the tensile performance.

[0060] In a specific implementation, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 2A, 3A, 4A, and 5A, the bridge region Q2 further includes a second organic layer 6 disposed on the side of the second metal layer 5 away from the substrate, and the orthographic projections of the second organic layer 6 and the first organic layer 4 on the substrate 1 are both located within the range of the substrate 1. Thus, the bridge region Q2 utilizes a multi-layer metal / organic film layer alternately arranged with the first signal line 31 / first organic layer 4 / second signal line 51 / second organic layer 6, which can thicken the film layer of the bridge region Q2, thereby increasing the strength of the bridge region Q2. Furthermore, since the inorganic layer has a low elongation at break, it is prone to cracking first, which in turn triggers cracking of the signal line, reducing the overall tensile performance. Therefore, in the present disclosure, no inorganic layer is disposed in direct contact above and below the two adjacent metal layers of the bridge region Q2, thereby preventing signal line breakage and further improving tensile performance.

[0061] In a specific implementation, in order to protect the first signal line from being corroded by subsequent manufacturing processes, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 2A, 3A, 4A and 5A, the first organic layer 4 at least covers the top surface of the first signal line 31.

[0062] In specific implementations, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 2A, 3A, 4A, and 5A, the first organic layer 4 also covers the side surfaces of the first signal lines 31, and the first organic layer 4 is disposed in contact with the substrate 1. This completely encapsulates the first signal lines 31, protecting them from corrosion at all locations and enhancing their strength. Furthermore, because the first and second signal lines 31 and 51 of the upper and lower metal layers are independent signal lines, the complete encapsulation of the first signal lines 31 by the first organic layer 4 prevents short circuits between the signal lines of the upper and lower metal layers.

[0063] In some embodiments, as shown in Figures 2A, 3A, 4A and 5A, in the bridge area Q2, the first organic layer 4 wraps around both sides of the first signal line 31, and the orthographic projection of the first organic layer 4 on the glass substrate 100 is located within the orthographic projection range of the base 1 on the glass substrate 100; of course, it is also possible that the first organic layer 4 does not wrap around both sides of the first signal line 31, the width of the first organic layer 4 is greater than the width of the first signal line 31, and the width of the first organic layer 4 is less than the width of the base 1.

[0064] In a specific implementation, in the display substrate provided in the embodiment of the present disclosure, as shown in FIG2A and FIG3A , the orthographic projection of the second signal line 51 on the substrate 1 falls within the orthographic projection of the first organic layer 4 on the substrate 1. The second organic layer 6 covers the top and side surfaces of the second signal line 51, and the second organic layer 6 is disposed in contact with the first organic layer 4. In this way, the second organic layer 6 completely encases the second signal line 51, protecting the second signal line 51 from corrosion.

[0065] In a specific implementation, in the display substrate provided in the embodiment of the present disclosure, as shown in FIG4A and FIG5A , the second signal line 51 at least covers the top surface of the first organic layer 4 , which can improve the strength of the second signal line 51 .

[0066] In specific implementations, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 4A and 5A , the second signal lines 51 also cover the side surfaces of the first organic layer 4, and are disposed in contact with the substrate 1. Thus, the second signal lines 51 completely encase the first organic layer 4, thereby increasing the modulus of the bridge region Q2 and further enhancing the strength of the bridge region Q2.

[0067] In specific implementations, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 4A and 5A , the second organic layer 6 covers the top and side surfaces of the second signal lines 51, and the second organic layer 6 is disposed in contact with the substrate 1. Thus, the second organic layer 6 completely encases the second signal lines 51, thereby protecting the second signal lines 51 from corrosion and further enhancing the strength of the bridge region Q2.

[0068] In some embodiments, as shown in Figures 4A and 5A, the second organic layers 6 in each bridge region Q2 are spaced apart, and the first organic layers 4 in each bridge region Q2 are spaced apart, with the distance between two adjacent second organic layers 6 being less than or equal to the distance between two adjacent first organic layers 4. In this way, the second organic layers 6 can completely encapsulate the first organic layer 4, thereby improving the strength of the bridge region Q2.

[0069] In a specific implementation, in order to further enhance the strength of the bridge region, in the display substrate provided in the embodiment of the present disclosure, as shown in Figures 3A, 3B, 3C, 5A, 5B, and 5C, Figure 3B is a schematic diagram of a planar structure of the inorganic layer 7 in a bridge region Q2 in Figure 3A, Figure 3C is another schematic diagram of a planar structure of the inorganic layer 7 in a bridge region Q2 in Figure 3A, Figure 5B is a schematic diagram of a planar structure of the inorganic layer 7 in a bridge region Q2 in Figure 5A, and Figure 5C is another schematic diagram of a planar structure of the inorganic layer 7 in a bridge region Q2 in Figure 5A. The bridge region Q2 further includes an inorganic layer 7 disposed on a side of the second organic layer 6 away from the substrate 1. The inorganic layer 7 covers the second organic layer 6 and is disposed in contact with the substrate 1. The inorganic layer 7 has a hollow structure. Providing the inorganic layer 7 on the outside of the second organic layer 6 can increase the modulus and enhance the strength of the bridge region Q2. Furthermore, the hollow structure of the inorganic layer 7 can enhance tensile properties and prevent cracking in the bridge region Q2.

[0070] In specific implementations, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 3B and 5B , the inorganic layer 7 in the bridge region Q2 includes a top structure 71 disposed opposite the substrate 1 and two side structures 72 disposed in contact with the substrate 1. The top structure 71 includes a first hollow structure 711 extending through the thickness of the top structure 71. By hollowing out the top structure 71 of the inorganic layer 7, the area of ​​the inorganic layer 7 can be reduced, thereby reducing the risk of fracture of the inorganic layer 7 when the display substrate is stretched, thereby ensuring that the signal lines in the bridge region Q2 will not break.

[0071] In specific implementation, in order to further reduce the problem of signal line breakage in the bridge area caused by breakage of the inorganic layer, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 3B and 5B, along the extension direction of the signal line (for example, 51), the top structure 71 has multiple first hollow structures 711 evenly spaced.

[0072] Specifically, the shape of the first hollow structures 711 can be circular, square, etc., and the number and size of the first hollow structures 711 are designed according to the length of the bridge area Q2.

[0073] In some embodiments, as shown in Figures 3B and 5B , along the extension direction of a signal line (e.g., the second signal line 51), the width of the first hollow structure 711 (e.g., in a direction perpendicular to the second signal line 51) can be smaller than the width of the second signal line 51. This prevents the first hollow structure 711 from being too large, which could cause a short circuit between the second signal line 51 and the first signal line 31 during manufacturing. Preferably, the orthographic projection of the first hollow structure 711 on the substrate 1 is within the orthographic projection of the second signal line 51 on the substrate 1.

[0074] In practice, to further reduce the risk of signal line breakage in the bridge region due to inorganic layer breakage, in the display substrate provided in the embodiments of the present disclosure, as shown in Figures 3A, 3C, 5A, and 5C, the top structure 71 of the inorganic layer 7 includes a first hollow structure 711 extending through the thickness of the top structure 71, and the side structure 72 of the inorganic layer 7 includes a second hollow structure 721 extending through the thickness of the side structure 72. This further reduces the area of ​​the inorganic layer 7 and mitigates the risk of fracture in the inorganic layer 7.

[0075] In a specific implementation, in the display substrate provided in the embodiment of the present disclosure, as shown in FIG3C and FIG5C , the second hollow structure 721 is interconnected with the first hollow structure 711. In this way, the inorganic layer 7 along the extension direction of the signal line is equivalent to including multiple independently arranged structures. Of course, the second hollow structure 721 and the first hollow structure 711 can also be independently arranged.

[0076] In a specific implementation, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 2A, 3A, 4A and 5A, the island area Q1 includes a first source-drain metal layer SD1, a first flat layer PLN1, a second source-drain metal layer SD2 and a second flat layer PLN2 which are stacked in sequence along a direction away from the substrate 1, the first signal line 31 is arranged on the same layer as the first source-drain metal layer SD1, the first organic layer 4 is arranged on the same layer as the first flat layer PLN1, the second signal line 51 is arranged on the same layer as the second source-drain metal layer SD2, and the second organic layer 6 is arranged on the same layer as the second flat layer PLN2. In this way, the pattern of the first signal line 31 and the first source-drain metal layer SD1 can be formed through a single patterning process, the pattern of the first organic layer 4 and the first flat layer PLN1 can be formed through a single patterning process, the pattern of the second signal line 51 and the second source-drain metal layer SD2 can be formed through a single patterning process, and the pattern of the second organic layer 6 and the second flat layer PLN2 can be formed through a single patterning process. There is no need to add a process for separately preparing the first signal line 31, the second signal line 51, the first organic layer 4 and the second organic layer 6, which can simplify the preparation process, save production costs, and improve production efficiency.

[0077] In a specific implementation, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 2A, 3A, 4A and 5A, the island area Q1 also includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer OC and a second inorganic encapsulation layer CVD2 which are stacked in sequence on the side of the second flat layer PLN2 away from the substrate 1, and the inorganic layer 7 of the bridge area Q2 in Figures 3A and 5A includes a first sub-inorganic layer 73 and a second sub-inorganic layer 74 which are stacked, the first sub-inorganic layer 73 is arranged on the same layer as the first inorganic encapsulation layer CVD1, and the second sub-inorganic layer 74 is arranged on the same layer as the second inorganic encapsulation layer CVD2. Specifically, since the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 are generally patterned using the same mask, the patterns of the first sub-inorganic layer 73, the second sub-inorganic layer 74 and the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 can be formed through a single patterning process. There is no need to add a process for separately preparing the first sub-inorganic layer 73 and the second sub-inorganic layer 74, which can simplify the preparation process, save production costs, and improve production efficiency.

[0078] In some embodiments, as shown in Figure 4A , the height of the bridge region Q2 (the distance from the outermost upper surface of the bridge region away from the substrate to the upper surface of substrate 1) is less than the distance from the upper surface of the second source / drain metal layer SD2 of the island region Q1 to the upper surface of substrate 1. This design prevents excessive thickness in the bridge region Q2, thereby ensuring the overall height and flexibility of the bridge region Q2. For example, the distance from the upper surface of the second signal line 51 of the bridge region Q2 to the upper surface of substrate 1 is less than the distance from the upper surface of the second source / drain metal layer SD2 of the island region Q1 to the upper surface of substrate 1.

[0079] In specific implementation, since the present disclosure sets up independent bridge areas, and each bridge area only sets up one signal line on the same layer, there is more space to design the curved structure of the bridge area, further improving the tensile performance. Therefore, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figure 1, the shape of the bridge area Q2 can be a curve, and the shape of the signal line (31 and 51) is the same as the shape of the bridge area Q2.

[0080] In a specific implementation, in the display substrate provided in the embodiment of the present disclosure, as shown in Figures 2B, 3D, 4B, and 5D, Figure 2B is an enlarged schematic diagram of the structure of the three bridge areas Q2 in Figure 2A, Figure 3D is an enlarged schematic diagram of the structure of the three bridge areas Q2 in Figure 3A, Figure 4B is an enlarged schematic diagram of the structure of the three bridge areas Q2 in Figure 4A, and Figure 5D is an enlarged schematic diagram of the structure of the three bridge areas Q2 in Figure 5A, the line width of the signal lines (31 and 51) is 2.5μm to 6μm. For example, the line width W1 of the first signal line 31 is 2.5μm to 6μm, and the line width W2 of the second signal line 51 is 2.5μm to 6μm.

[0081] In a specific implementation, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 2B, 3D, 4B and 5D, the distance D1 between the orthographic edge of the first organic layer 4 on the substrate 1 and the orthographic edge of the first signal line 31 on the substrate 1 is greater than or equal to 1 μm, and the distance D2 between the orthographic edge of the second organic layer 6 on the substrate 1 and the orthographic edge of the second signal line 51 on the substrate 1 is greater than or equal to 1 μm.

[0082] In a specific implementation, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 1, 2B, 3D, 4B and 5D, for each bridge area Q2 connecting two adjacent island areas Q1, the spacing D3 between adjacent bridge areas Q2 is greater than 3μm, so that the spacing between the second signal lines 51 of two adjacent bridge areas Q2 is greater than or equal to 5μm.

[0083] Specifically, as shown in Figures 1, 2B and 3D, the width of the first signal line 31 and the width of the second signal line 51 can be the same, or the width of the first signal line 31 can be greater than the width of the second signal line 51, or the width of the second signal line 51 can be greater than the width of the first signal line 31.

[0084] Specifically, as shown in Figure 1, the first signal line 31 and the second signal line 51 can be gate lines, data lines, power lines, sensing signal lines, etc., and the widths of the bridge areas Q2 may also be unequal. For example, the width of the bridge area Q2 where the power line is set will be wider.

[0085] In some embodiments, as shown in Figures 1, 2A, 3A, 4A, and 5A, the line width W1 of the first signal line 31 is smaller than the line width W2 of the second signal line 51. The first signal line 31 can be a data line (e.g., data), and the second signal line 51 can be a power line (e.g., VDD). The first signal line 31 can be a data line, and the second signal line 51 can be a sensing signal line SL (e.g., applied to a 3T1C pixel circuit).

[0086] In some embodiments, as shown in Figures 1, 2A, 3A, 4A and 5A, in a first direction (for example, the horizontal direction of Figure 1), the line width W1 of the first signal line 31 is smaller than the line width W2 of the first signal line 51, the first signal line 31 can be a scan line (for example, scan), and the second signal line 51 can be an initial signal line (for example, vinit); in a second direction (for example, the vertical direction of Figure 1), the first signal line 31 can be a data line (for example, data), and the second signal line 51 can be a power line (for example, VDD).

[0087] In some embodiments, as shown in Figures 1, 2A, 3A, 4A and 5A, in a first direction (for example, the horizontal direction of Figure 1), the line width W1 of the first signal line 31 is smaller than the line width W2 of the second signal line 51, and the signals transmitted on the second signal line 51 and the first signal line 31 can be the same, for example, both are scan lines (for example, scan) or initial signal lines (for example, vinit); in a second direction (for example, the vertical direction of Figure 1), the signals transmitted on the second signal line 51 and the first signal line 31 can be the same, for example, both are data lines (for example, data) or power lines (for example, VDD).

[0088] In a specific implementation, in the above-mentioned display substrate provided in the embodiment of the present disclosure, as shown in Figures 1, 2A, 3A, 4A and 5A, the island area Q1 also includes: a first passivation layer PVX1, a second passivation layer PVX2, an anode 8, a pixel defining layer PDL, a light-emitting layer 9 and a cathode 10 sequentially stacked in a direction away from the substrate 1 between the second flat layer PLN2 and the first inorganic encapsulation layer CVD1, and a barrier layer BR, a buffer layer BF, an active layer ACT, a first gate insulating layer GI1, a first gate layer G1, a second gate insulating layer GI2, a second gate layer G2 and an interlayer insulating layer ILD sequentially stacked in a direction away from the substrate 1 between the substrate 1 and the first source and drain metal layer SD1; each sub-pixel 2 of the island area Q1 includes a pixel circuit and a light-emitting device, and the pixel circuit includes It includes a thin film transistor and a storage capacitor, the first source-drain metal layer SD1 includes a source S and a drain D, the second source-drain metal layer SD2 includes a overlap portion 12, a data line, etc., the first gate layer G1 includes a gate G1, a first plate cst1 of the storage capacitor, the second gate layer G2 includes a second plate cst2 of the storage capacitor, including an anode 8 electrically connected to the overlap portion 12 located in the second source-drain metal layer SD2 through a via hole that sequentially penetrates the second flat layer PLN2, the first passivation layer PVX1 and the second passivation layer PVX2, the overlap portion 12 is electrically connected to the drain D through a via hole that penetrates the first flat layer PLN1, the active layer ACT, the gate of the first gate layer G1, the source and drain of the first source-drain metal layer SD1 constitute a thin film transistor, and the anode 8, the light-emitting layer 9 and the cathode 10 constitute a light-emitting device.

[0089] Specifically, as shown in Figures 2A, 3A, 4A and 5A, the blocking layer BR, the buffer layer BF, the first gate insulation layer GI1, the second gate insulation layer GI2, the interlayer insulation layer ILD, the first passivation layer PVX1, and the second passivation layer PVX2 are all inorganic film layers, which are prone to breakage. The present disclosure etches away all of the above-mentioned inorganic film layers located in the bridge area Q2, which can prevent the bridge area Q2 from breaking during stretching.

[0090] In some embodiments, as shown in Figures 2A, 3A, 4A and 5A, the distance from the bridge area Q2 (for example, the second organic layer 6) to the encapsulation layer of the island area Q1 (for example, the first inorganic encapsulation layer CVD1) is greater than the distance from the bridge area Q2 (for example, the second organic layer 6) to the buffer layer BF of the island area Q1, and is smaller than the distance from the bridge area Q2 (for example, the second organic layer 6) to the first gate insulation layer GI1 of the island area Q1. With this design, the encapsulation layer of the island area Q1 forms an inward-retracted structure, thereby avoiding extrusion damage to the encapsulation layer of the island area Q1 when the bridge area is stretched.

[0091] Specifically, the anode may include a three-layer stacked structure of transparent conductive film / metal film / transparent conductive film, wherein the material of the transparent conductive film may be indium tin oxide ITO or indium zinc oxide IZO, and the metal film may be a metal film such as Al, Ag, or Cu.

[0092] Specifically, the material of the cathode may be any one or more of magnesium (Mg), silver (Ag), aluminum (Al), copper (Cu) and lithium (Li), or an alloy made of any one or more of the above metals.

[0093] Specifically, the light-emitting device can be an inorganic light-emitting diode, an organic light-emitting diode (OLED) made of organic materials, a micro light-emitting diode (Micro LED), or a mini light-emitting diode (Mini LED). The embodiments of the present disclosure take the light-emitting device as an organic light-emitting diode as an example.

[0094] Specifically, the pixel circuit can adopt a variety of structures. For example, the pixel circuit can be a structure including 2 transistors and 1 capacitor (2T1C), as shown in Figure 6; or the pixel circuit can be a structure including 3 transistors and 1 capacitor (3T1C), as shown in Figure 7; or the pixel circuit can be a structure including 7 transistors and 1 capacitor (7T1C), as shown in Figure 8.

[0095] In a specific implementation, in the above-mentioned display substrate provided by the embodiment of the present disclosure, as shown in Figures 1, 2A, 3A, 4A and 5A, the second flat layer PLN2 and the first passivation layer PVX1 located in the island area Q1 are provided with a groove 11 near the sub-pixel 2, the second inorganic layer PVX2 covers the bottom of the groove 11, the light-emitting layer 9 and the cathode 10 are both disconnected at the groove 11, and the organic encapsulation layer OC covers the second passivation layer PVX2 at the groove 11; since the light-emitting layer 9 and the cathode 10 near the hole area Q3 are easily invaded by water and oxygen, the groove 11 can be provided to surround all sub-pixels 2 in the island area Q1, or a groove 11 can be provided around each sub-pixel 2, so that the groove 11 can separate the light-emitting layer 9 and the cathode 10 near the hole area Q3 from the light-emitting layer 9 and the cathode 10 located in the sub-pixel 2 with a macroporous resin, thereby preventing water and oxygen from invading the light-emitting layer 9 and the cathode 10 in the sub-pixel 2 from the hole area Q3, thereby ensuring normal display of the display product.

[0096] In specific implementation, the display substrate provided by the present disclosure may further include other functional film layers well known to those skilled in the art, which will not be described in detail here.

[0097] Based on the same inventive concept, the present disclosure further provides a method for manufacturing the above-mentioned display substrate, as shown in FIG9 , comprising:

[0098] S901, providing a substrate; the substrate having: a plurality of island regions, a plurality of bridge regions for connecting adjacent island regions, and a hole region located between adjacent bridge regions, wherein a plurality of bridge regions arranged at intervals are connected between two adjacent island regions;

[0099] S902. Form at least one sub-pixel in each island area, and form a first metal layer, a first organic layer, and a second metal layer stacked in sequence along a direction away from the substrate in at least one bridge area; wherein the first metal layer of each bridge area includes a first signal line for connecting sub-pixels in adjacent island areas, and the second metal layer of each bridge area includes a second signal line for connecting sub-pixels in adjacent island areas.

[0100] The manufacturing method of the above-mentioned display substrate provided by the embodiment of the present disclosure is to set a plurality of independent bridge areas for connecting the two adjacent island areas between the two adjacent island areas, and only set one signal line on the same metal layer of each bridge area, so that the width of each bridge area can be reduced and the length of each bridge area can be increased. Then, the modulus of the bridge area can be reduced by removing the corresponding inorganic layer of the bridge area, which can effectively improve the tensile capacity. In addition, the bridge area adopts a double-layer metal routing design, which can increase the strength of the signal line in the bridge area on the one hand, so that when the display substrate is removed from the rigid base during the preparation process, the signal line in the bridge area is not easily broken. On the other hand, the bridge area adopts a double-layer metal routing design, and the signal lines of the upper and lower metal layers can be designed as independent signal lines, which can reduce the number of bridge areas and have more space to design the bending structure of the bridge area, further improving the tensile performance. Therefore, the present disclosure can not only improve the tensile performance of the display substrate, but also avoid the problem of the signal line in the bridge area breaking when the display substrate is removed from the rigid base.

[0101] The process of forming each film layer in the present disclosure may include a composition process and a photolithography process, among which the composition process may include depositing a film layer, coating a photoresist, mask exposure, development, etching, stripping the photoresist and other processes, while the photolithography process may include coating a film layer, mask exposure, development and other processes. The evaporation, deposition, coating, and coating used are all mature preparation processes in the relevant technology.

[0102] Taking the display substrate shown in FIG. 2A as an example, the manufacturing process of the display substrate shown in FIG. 2A is described in detail below. The manufacturing process may include the following steps:

[0103] (1) Taking the substrate 1 including a flexible layer structure as an example, the substrate 1 is divided into an island area Q1, a bridge area Q2 and a hole area Q3, and the substrate 1 is formed on a glass substrate 100. A barrier layer BR is formed on the substrate 1, and a buffer layer BF is formed on the barrier layer BR. An active layer thin film (for example, an amorphous silicon layer) is deposited on the buffer layer BF. After the amorphous silicon layer is dehydrogenated at high temperature, excimer laser annealing (ELA) is used to convert the amorphous silicon into polycrystalline silicon. Then, the polycrystalline silicon layer is patterned through a patterning process to form an active layer ACT. The active layer ACT may include partial ion doping, as shown in FIG. 10A .

[0104] (2) A first gate insulating layer GI1 is formed on the active layer ACT, as shown in FIG10B .

[0105] (3) depositing a metal film (first gate layer G1) on the first gate insulating layer GI1, patterning the metal film through a patterning process, and forming a gate G, a gate line (not shown), and a first electrode plate cst1 on the first insulating layer GI1, as shown in FIG10C ;

[0106] (4) A second gate insulating layer GI2 is formed on the gate G, as shown in FIG10D .

[0107] (5) A metal film (second gate layer G2) is deposited on the second gate insulating layer GI2, and the metal film is patterned through a patterning process to form a second electrode cst2 on the second insulating layer GI2. The position of the first electrode cst1 corresponds to the position of the second electrode cst2, as shown in Figure 10E.

[0108] (6) An interlayer insulating layer ILD is formed on the second gate layer G2, as shown in FIG10F ; at the same time, the blocking layer BR, the buffer layer BF, the first gate insulating layer GI1, the second gate insulating layer GI2 and the interlayer insulating layer ILD are patterned, and all of the above-mentioned film layers located in the bridge area Q2 and the hole area Q3 are removed, exposing the substrate 1 in the bridge area Q2 and the hole area Q3, and at the same time, via holes penetrating the first gate insulating layer GI1, the second gate insulating layer GI2 and the interlayer insulating layer ILD are etched above both ends of the active layer ACT in the island area Q1 for subsequent electrical connection with the source and drain, as shown in FIG10G .

[0109] (7) A metal film (SD1) is deposited on the interlayer insulating layer ILD and patterned by a patterning process to form a source S and a drain D in the island region Q1 and a first signal line 31 in the bridge region Q2 on the interlayer insulating layer ILD, as shown in FIG10H .

[0110] (8) A flat thin film of organic material is coated on SD1, and a first flat layer PLN1 is formed in the island area Q1 through masking, exposure, and development processes. The first flat layer PLN1 corresponding to the drain D position and the hole area Q3 position are both developed away, and a first organic layer 4 covering the first signal line 31 is formed in the bridge area Q2, as shown in FIG10I.

[0111] (9) A metal film (SD2) is deposited on the first flat layer PLN1, and the metal film is patterned through a patterning process to form a lap joint 12 located on the first flat layer PLN1 in the island area Q1, and a second signal line 51 is formed in the bridge area Q2, as shown in FIG10J.

[0112] (10) A flat thin film coated with an organic material is formed on the film layer where the overlapping portion 12 is located, and a second flat layer PLN2 is formed through masking, exposure, and development processes. The second flat layer 32 corresponding to the overlapping portion 12 and the position corresponding to the hole area Q3 are developed away, and a second organic layer 6 covering the second signal line 51 is formed in the bridge area Q2, as shown in FIG10K.

[0113] (11) An inorganic insulating material film layer is deposited on the second flat layer PLN2, and the inorganic insulating material film layer is patterned to form grooves penetrating the inorganic insulating material film layer around all sub-pixels in the island region Q1, as shown in FIG10L.

[0114] (12) Using the first passivation layer PVX1 as a mask, the second flat layer PLN2 is exposed and developed to form a groove 11 located below the groove, as shown in FIG10M .

[0115] (13) An inorganic insulating material film layer is deposited on the first passivation layer PVX1, and the inorganic insulating material film layer and the first passivation layer PVX1 are patterned. The positions of the inorganic insulating material film layer and the first passivation layer PVX1 corresponding to the overlapping portion 12 are etched away, and all inorganic insulating material film layers in the bridge area Q2 and the hole area Q3 are removed to form a second passivation layer PVX2 in the island area Q1, as shown in FIG10N.

[0116] (14) A conductive film is deposited on the second passivation layer PVX2, and the conductive film is patterned by a patterning process to form an anode 8. The anode 8 is electrically connected to the overlapping portion 12 through a via hole penetrating the second passivation layer PVX2, the first passivation layer PVX1, and the second flat layer PLN2, as shown in FIG10O.

[0117] (15) A pixel defining film is coated on the anode 8, and a pixel defining layer PDL is formed in the island area Q1 through masking, exposure, and development processes. A pixel opening is provided on the pixel defining layer PDL of the island area Q1, and the pixel defining film in the pixel opening is developed away to expose the surface of the anode 8; and the pixel defining film corresponding to the position of the hole area Q3 and the position of the bridge area Q2 are all developed away, as shown in FIG10P.

[0118] (16) A light-emitting layer 9 and a cathode 10 are sequentially formed on the pixel defining layer PDL. The light-emitting layer 9 is formed in the pixel opening of the pixel defining layer PDL and is connected to the anode 8. The light-emitting layer 9 and the cathode 10 are disconnected at the position of the groove 11, as shown in FIG10Q.

[0119] (16) A first inorganic encapsulation film 30 is formed on the cathode 10, an organic encapsulation film is formed on the first inorganic encapsulation film 30, the organic encapsulation film is exposed and developed, an organic encapsulation layer OC is formed in the island area Q1, and all organic encapsulation films in the bridge area Q2 and the hole area Q3 are removed, and then a second inorganic encapsulation film 40 is formed on the organic encapsulation layer OC, as shown in FIG10R.

[0120] (17) The first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 are patterned. The first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 corresponding to the hole area Q3 form the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 in the island area Q1, and the first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 are retained in the bridge area Q2, as shown in FIG10S.

[0121] (18) Using the first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 as masks, the substrate 1 is patterned to remove the substrate 1 in the hole region Q3, as shown in FIG10T.

[0122] (19) The first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 in the bridge region Q2 are removed to form the display substrate as shown in FIG. 2A .

[0123] Finally, a protective film is attached to the second inorganic encapsulation layer CVD2, and then the glass substrate 100 is peeled off through a laser lift-off process. After that, the protective film is removed to form a stretchable display substrate.

[0124] It should be noted that the embodiment of the present disclosure is described using the method for manufacturing the display substrate shown in FIG2A as an example. The method for manufacturing the display substrate shown in FIG3A is similar to the method for manufacturing the display substrate shown in FIG2A , except that the first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 of the bridge region Q2 are retained in the above step (19), and a hollow structure as shown in FIG3B or FIG3C is formed on the first inorganic encapsulation film 30 and the second inorganic encapsulation film 40. The method for manufacturing the display substrate shown in FIG4A is similar to the method for manufacturing the display substrate shown in FIG2A , except that when the second signal line 51 is formed in the above step (9), the second signal line 51 covers the first organic layer 4, and when the second organic layer 6 is formed in the above step (10), the second organic layer 6 covers the second signal line 51 and is arranged in contact with the substrate 1. The manufacturing method of the display substrate shown in Figure 5A is similar to the manufacturing method shown in Figure 2A, except that when the second signal line 51 is formed in the above step (9), the second signal line 51 covers the first organic layer 4, and when the second organic layer 6 is formed in the above step (10), the second organic layer 6 covers the second signal line 51 and is arranged in contact with the substrate 1, and in the above step (19), the first inorganic encapsulation film 30 and the second inorganic encapsulation film 40 of the bridge area Q2 are retained, and a hollow structure as shown in Figure 5B or Figure 5C is formed on the first inorganic encapsulation film 30 and the second inorganic encapsulation film 40.

[0125] Based on the same inventive concept, the present disclosure further provides a display device comprising any of the aforementioned display substrates. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. The implementation of the display device can be referenced to the aforementioned embodiments of the display substrate, and any repetitive details will not be repeated here.

[0126] The above-mentioned display device can be any product or component with display function, such as an organic light-emitting diode display panel, a quantum dot light-emitting diode display panel, a display module, a curved screen mobile phone, a smart watch, etc.

[0127] The embodiment of the present disclosure provides a display substrate, a manufacturing method thereof, and a display device. By setting a plurality of independent bridge areas for connecting two adjacent island areas between the two adjacent island areas, only one signal line is set on the same metal layer of each bridge area, so that the width of each bridge area can be reduced and the length of each bridge area can be increased. Then, by removing the corresponding inorganic layer of the bridge area, the modulus of the bridge area is reduced, which can effectively improve the tensile capacity. In addition, the bridge area adopts a double-layer metal routing design, on the one hand, it can increase the strength of the signal line in the bridge area, so that when the display substrate is removed from the rigid base during the preparation process, the signal line in the bridge area is not easily broken. On the other hand, the bridge area adopts a double-layer metal routing design, and the signal lines of the upper and lower metal layers can be designed as independent signal lines. This can reduce the number of bridge areas, and there is more space to design the bending structure of the bridge area, further improving the tensile performance. Therefore, the present disclosure can not only improve the tensile performance of the display substrate, but also avoid the problem of the signal line in the bridge area breaking when the display substrate is removed from the rigid base.

[0128] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0129] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such changes and modifications of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such changes and modifications.

Claims

1. A display substrate, wherein: include: A substrate, a plurality of island regions located on one side of the substrate, a plurality of bridge regions for connecting adjacent island regions, and a hole region located between adjacent bridge regions; wherein, Each of the island regions includes at least one sub-pixel, and a plurality of bridge regions arranged at intervals are connected between two adjacent island regions; At least one of the bridge areas includes a first metal layer, a first organic layer, and a second metal layer arranged in a direction away from the substrate, the first metal layer of each of the bridge areas includes a first signal line for connecting sub-pixels in adjacent island areas, and the second metal layer of each of the bridge areas includes a second signal line for connecting sub-pixels in adjacent island areas.

2. The display substrate according to claim 1, wherein: The bridge region further includes a second organic layer disposed on a side of the second metal layer away from the substrate, and orthographic projections of the second organic layer and the first organic layer on the substrate are both located within the range of the substrate.

3. The display substrate according to claim 2, wherein: The first organic layer at least covers a top surface of the first signal line.

4. The display substrate according to claim 3, wherein: The first organic layer also covers the side surface of the first signal line, and the first organic layer is disposed in contact with the substrate.

5. The display substrate according to claim 4, wherein: An orthographic projection of the second signal line on the substrate falls within a range of an orthographic projection of the first organic layer on the substrate.

6. The display substrate according to claim 5, wherein: The second organic layer covers the top surface and the side surfaces of the second signal line, and the second organic layer is disposed in contact with the first organic layer.

7. The display substrate according to claim 4, wherein: The second signal line at least covers a top surface of the first organic layer.

8. The display substrate according to claim 7, wherein: The second signal line also covers a side surface of the first organic layer, and the second signal line is disposed in contact with the substrate.

9. The display substrate according to claim 8, wherein: The second organic layer of the display substrate covers the top surface of the second signal line and the side surface of the display substrate, and the second organic layer is arranged in contact with the base.

10. The display substrate according to any one of claims 2 to 9, wherein: The bridge region further includes an inorganic layer disposed on a side of the second organic layer away from the substrate, the inorganic layer covers the second organic layer and is disposed in contact with the substrate, and the inorganic layer has a hollow structure.

11. The display substrate according to claim 10, wherein: The inorganic layer includes a top structure arranged opposite to the substrate and two side structures arranged in contact with the substrate, and the top structure has a first hollow structure penetrating through the thickness direction of the top structure.

12. The display substrate according to claim 11, wherein: Along the extending direction of the signal line, the top structure has a plurality of the first hollow structures evenly spaced apart.

13. The display substrate according to claim 11 or 12, wherein: The side structure has a second hollow structure that runs through the side structure in a thickness direction.

14. The display substrate according to claim 13, wherein: The second hollow structure is connected to the first hollow structure.

15. The display substrate according to any one of claims 10 to 14, wherein: The island area includes a first source-drain metal layer, a first planarizing layer, a second source-drain metal layer, and a second planarizing layer which are stacked in sequence in a direction away from the substrate; the first signal line is arranged on the same layer as the first source-drain metal layer, the first organic layer is arranged on the same layer as the first planarizing layer, the second signal line is arranged on the same layer as the second source-drain metal layer, and the second organic layer is arranged on the same layer as the second planarizing layer.

16. The display substrate according to claim 15, wherein: The island area also includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are stacked in sequence on a side of the second flat layer away from the substrate, the inorganic layer includes a first sub-inorganic layer and a second sub-inorganic layer which are stacked, the first sub-inorganic layer and the first inorganic encapsulation layer are arranged on the same layer, and the second sub-inorganic layer and the second inorganic encapsulation layer are arranged on the same layer.

17. The display substrate according to any one of claims 1 to 16, wherein: The shape of the bridge area is a curve, and the shape of the signal line is the same as that of the bridge area.

18. According to any one of claims 2 to 16, the display substrate, wherein the spacing between the orthographic projection edge of the first organic layer on the substrate and the orthographic projection edge of the first signal line on the substrate is greater than or equal to 1 μm, and the spacing between the orthographic projection edge of the second organic layer on the substrate and the orthographic projection edge of the second signal line on the substrate is greater than or equal to 1 μm.

19. A display device, wherein: Comprising the display substrate according to any one of claims 1-18.

20. A method for manufacturing a display substrate, wherein: include: A substrate is provided; the substrate has: a plurality of island regions, a plurality of bridge regions for connecting adjacent island regions, and a hole region located between adjacent bridge regions, wherein a plurality of bridge regions arranged at intervals are connected between two adjacent island regions; At least one sub-pixel is formed in each of the island areas, and a first metal layer, a first organic layer, and a second metal layer are formed in sequence stacked in a direction away from the substrate in at least one of the bridge areas; wherein the first metal layer of each of the bridge areas includes a first signal line for connecting sub-pixels in adjacent island areas, and the second metal layer of each of the bridge areas includes a second signal line for connecting sub-pixels in adjacent island areas.

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