Intelligent power module and manufacturing method therefor

Abstract

Provided in the present disclosure are an intelligent power module and a manufacturing method therefor. The intelligent power module comprises: a semiconductor device, which comprises a frame and a power chip arranged on one side of the frame; and a plastic package, wherein at least part of the semiconductor device is encapsulated within the plastic package. Among two opposite surfaces in the thickness direction of the plastic package, the surface further away from the frame is the front of the plastic package, and the surface closer to the frame is the back of the plastic package. The distance between the side of the frame away from the power chip and the back of the plastic package is A, which satisfies the relational expression: 0.3 mm≤A≤0.7 mm.

Description

Intelligent power module and manufacturing method thereof

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 28, 2023, with application number 202311283399.4, and invention name “Intelligent Power Module and Method for Manufacturing Intelligent Power Module”, the entire contents of which are incorporated by reference into this application; this application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on April 28, 2023, with application number 202321049262.8, and invention name “Power Module”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present disclosure relates to the technical field of semiconductor devices, and in particular to an intelligent power module and a manufacturing method thereof. Background Art

[0004] The power chip in the semiconductor device is fixed to the frame with solder paste. Under the frame is an insulating and highly thermally conductive plastic resin layer. The heat generated by the power chip is transferred to the resin through the frame and finally to the heat sink through the resin.

[0005] In related technologies, during the front-end core-loading process of semiconductor devices, the pressure exerted by the clamp on the pad may cause the frame to deform. During the plastic packaging process, the frame will bend and tilt due to the influence of mold flow, which will eventually cause the thickness of the insulating resin layer under the frame to change, thereby reducing the performance and reliability of the semiconductor device.

[0006] Summary of the Invention

[0007] In one aspect, some embodiments of the present disclosure provide an intelligent power module, including:

[0008] A semiconductor device comprising a frame and a power chip disposed on one side of the frame;

[0009] A plastic package body, wherein at least a portion of the semiconductor device is encapsulated within the plastic package body, the surface farther from the frame of the two opposite surfaces in the thickness direction of the plastic package body is the front surface of the plastic package body, and the surface closer to the frame of the two opposite surfaces in the thickness direction of the plastic package body is the back surface of the plastic package body, and the distance between the side of the frame facing away from the power chip and the back surface of the plastic package body is A, and A satisfies the relationship: 0.3mm≤A≤0.7mm.

[0010] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, A satisfies the relationship: 0.4 mm≤A≤0.6 mm.

[0011] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, the distance between the semiconductor device and the front surface of the plastic package is B, and B and A satisfy the relationship: B>A.

[0012] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the frame includes: a plurality of base islands extending along a first direction and arranged at intervals along a second direction, and a plurality of power-side pins arranged at intervals on one side of the plurality of base islands along the first direction; one end of each of the power-side pins is connected to the corresponding base island; wherein,

[0013] The corresponding power chip is respectively arranged on each base island, and the plastic package encapsulates multiple base islands;

[0014] A plurality of front pinholes are formed on the front of the plastic package body, and a plurality of back pinholes are formed on the back of the plastic package body. The base island positions at the two ends of the second direction correspond to the front pinholes respectively, and each base island position corresponds to at least one back pinhole. One end of each power side pin is located inside the plastic package body, and the other end of each power side pin is located outside the plastic package body.

[0015] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, along the first direction, each of the front pinholes and each of the back pinholes are arranged on a side of the base island away from the power-side pin.

[0016] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the back pinholes corresponding to two adjacent base islands are at least partially staggered along the second direction.

[0017] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the multiple base islands include: odd-numbered base islands and even-numbered base islands, the odd-numbered base islands and the even-numbered base islands are arranged alternately along the second direction, the center line connecting the back pinholes corresponding to the odd-numbered base islands is a first straight line, and the center line connecting the back pinholes corresponding to the even-numbered base islands is a second straight line, and the first straight line and the second straight line are parallel to each other and extend along the second direction.

[0018] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the central axis of the intelligent power module extending along the second direction is a third straight line, the center line connecting the multiple front pinholes is a fourth straight line, and the third straight line and the fourth straight line are parallel to each other.

[0019] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, the first straight line and the second straight line are both located between the third straight line and the fourth straight line.

[0020] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, the plurality of base islands include a first base island, a second base island, a third base island, and a fourth base island arranged sequentially along the second direction, the first base island and the third base island are the odd-numbered base islands, and the second base island and the fourth base island are the even-numbered base islands;

[0021] The multiple front pinholes include: a first front pinhole and a second front pinhole, and the multiple back pinholes include: a first back pinhole, a second back pinhole, a third back pinhole, a fourth back pinhole and a fifth back pinhole. Along the first direction, the first front pinhole corresponds to the first base island, the second front pinhole corresponds to the fourth base island, the first back pinhole corresponds to the first base island, the second back pinhole corresponds to the second base island, the third back pinhole corresponds to the third base island, and the fourth back pinhole and the fifth back pinhole both correspond to the fourth base island.

[0022] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the center distance between the first front pinhole and the second front pinhole is d1, and the center distance between the first back pinhole and the fifth back pinhole is d2, and d1 and d2 satisfy the relationship: d1>d2.

[0023] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, each of the power chips is divided into three low-voltage power chips and three high-voltage power chips, the three low-voltage power chips are respectively arranged on the first base island, the second base island and the third base island, the three high-voltage power chips are all arranged on the fourth base island and spaced apart along the second direction, and the three low-voltage power chips and the three high-voltage power chips are all located on the side of the frame facing the front of the plastic package.

[0024] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the orthographic projection of the back pinhole corresponding to the odd-numbered base island on the corresponding odd-numbered base island is located within the odd-numbered base island and is tangent to the edge of the odd-numbered base island away from the power side pin along the first direction.

[0025] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the projection of the back pinhole corresponding to the even-numbered base island on the corresponding even-numbered base island is located within the even-numbered base island and is tangent to the edge of the even-numbered base island away from the power-side pin along the first direction, the central axis of the intelligent power module extending along the second direction is a third straight line, the first straight line and the second straight line are located on the same side of the third straight line, and the back pinhole corresponding to the odd-numbered base island intersects with the third straight line.

[0026] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, one screw hole and two demolding holes are respectively provided on both sides of the center line of the plastic package body extending along the second direction, the center of the screw hole coincides with the center line of the plastic package body extending along the second direction, and the two demolding holes are provided on the back side of the plastic package body and are symmetrically arranged about the center line of the plastic package body along the second direction.

[0027] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the intersection of the screw hole close to the inner side of the plastic package body and the center line of the plastic package body extending along the second direction is point E, and the intersection of the center line of the two demolding holes symmetrically arranged about the center line of the plastic package body extending along the second direction and the center line of the plastic package body extending along the second direction is point F, and point F is located between the center of the screw hole and point E.

[0028] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, the material of the plastic package includes insulating resin.

[0029] On the other hand, some embodiments of the present disclosure provide a method for manufacturing an intelligent power module, which is used to manufacture any of the above-mentioned intelligent power modules provided in some embodiments of the present disclosure, and the manufacturing method includes:

[0030] extending at least a portion of the semiconductor device into a packaging mold;

[0031] Inserting a core pulling needle into the packaging mold so that the core pulling needle contacts the frame of the semiconductor device to support the frame;

[0032] Injecting a molding compound into the packaging mold to encapsulate the semiconductor device in the molding compound;

[0033] After a preset time T, the core-pulling needle is taken out from the packaging mold, wherein T is less than the gelation time of the plastic packaging material.

[0034] In some embodiments, in the manufacturing method of the intelligent power module provided in some embodiments of the present disclosure, T satisfies the relationship: T≤30s.

[0035] In some embodiments, in the manufacturing method of the intelligent power module provided in some embodiments of the present disclosure, T satisfies the relationship: T≥4s.

[0036] In some embodiments, in the manufacturing method of the intelligent power module provided in some embodiments of the present disclosure, T satisfies the relationship: T≥12s.

[0037] In some embodiments, in the manufacturing method of the intelligent power module provided in some embodiments of the present disclosure, the core-pulling needle is a telescopic needle.

[0038] In some embodiments, in the manufacturing method of the intelligent power module provided in some embodiments of the present disclosure, a plurality of core pulling pins are provided on both sides of the packaging mold along the thickness direction of the molding compound. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG1 is a schematic structural diagram of an intelligent power module provided in the related art;

[0040] FIG2 is another structural diagram of an intelligent power module provided in the related art;

[0041] FIG3 is a schematic structural diagram of an intelligent power module provided in some embodiments of the present disclosure;

[0042] FIG4 is another structural diagram of an intelligent power module provided in the related art;

[0043] FIG5 is a structural diagram of a manufacturing process of an intelligent power module provided in some embodiments of the present disclosure;

[0044] FIG6 is another structural diagram of a manufacturing process of an intelligent power module provided by some embodiments of the present disclosure;

[0045] FIG7 is another structural diagram of the manufacturing process of the intelligent power module provided by some embodiments of the present disclosure;

[0046] FIG8 is a structural diagram of a manufacturing process of an intelligent power module according to a comparative example provided in some embodiments of the present disclosure;

[0047] FIG9 is another structural schematic diagram of the manufacturing process of the intelligent power module of the comparative example provided in some embodiments of the present disclosure;

[0048] FIG10 is a schematic structural diagram of a base island provided in some embodiments of the present disclosure;

[0049] FIG11 is a schematic diagram of the distribution of pinhole positions provided by some embodiments of the present disclosure;

[0050] FIG12 is a schematic structural diagram of a pinhole on the back side of a plastic package provided in some embodiments of the present disclosure;

[0051] FIG13 is a schematic structural diagram of a pinhole on the front surface of a plastic package provided in some embodiments of the present disclosure;

[0052] FIG14 is a schematic structural diagram of the lower surface of a core pulling needle support frame provided in some embodiments of the present disclosure;

[0053] FIG15 is a schematic structural diagram of a core-pulling needle detached from the lower surface of a support frame provided in some embodiments of the present disclosure;

[0054] FIG16 is a flow chart of a method for manufacturing an intelligent power module according to some embodiments of the present disclosure.

[0055] Reference numerals: 100, intelligent power module; 10, plastic package; 20, semiconductor device; 21, frame; 22, power chip; 30, core pulling pin; 211, base island; 211', odd-numbered base island; 211", even-numbered base island; 201, first base island; 202, second base island; 203, third base island; 204, fourth base island; 101, front pinhole; 1011, first front pinhole; 1012, second front pinhole; 102, Back pinhole; 1021, first back pinhole; 1022, second back pinhole; 1023, third back pinhole; 1024, fourth back pinhole; 1025, fifth back pinhole; 41, first straight line; 42, second straight line; 43, third straight line; 44, fourth straight line; 31, core-pulling needle plate; V, air hole; 33, reaming hole; 34, core-pulling needle sleeve; 50, screw hole; 51, demoulding hole; 60, power side pin. DETAILED DESCRIPTION

[0056] The following describes in detail embodiments of the present disclosure, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present disclosure and are not to be construed as limiting the present disclosure.

[0057] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0058] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0059] As shown in Figures 1 and 2, the power chip 22 in the semiconductor device 20 is fixed to the frame 21 by solder paste. The semiconductor device 20 is encapsulated in an insulating and highly thermally conductive plastic package 10. The heat generated by the power chip 22 during operation is transferred to the plastic package 10 through the frame 21 and finally transferred to the external heat sink through the plastic package 10. In the related art, during the front-end core loading process of the semiconductor device 20, the pressure exerted by the clamp on the pad will cause the frame 21 to deform. During the plastic packaging process, the frame 21 will bend and tilt due to the impact force generated by the mold flow stamping, which will eventually cause the thickness of the plastic package 10 below the frame 21 to change. As shown in Figures 1 and 2, Figure 1 shows the case where the frame 21 is bent and tilted upward, and Figure 2 shows the case where the frame 21 is bent and tilted downward. Both situations will reduce the performance and reliability of the semiconductor device 20.

[0060] In order to solve the problem of bending and tilting of the frame during the plastic packaging process, the related art generally optimizes the performance parameters of the plastic packaging process, such as optimizing the viscosity of the plastic packaging material, the rotation pressure and rotation time when the plastic packaging material is injected into the packaging mold, and controlling the temperature inside the packaging mold. However, the optimization of these parameters is limited and cannot effectively prevent the frame from bending and tilting.

[0061] In view of this, in order to solve the problem of bending and tilting of the frame during the plastic packaging process, some embodiments of the present disclosure provide an intelligent power module 100, as shown in Figure 3, including a semiconductor device 20, the semiconductor device 20 includes a frame 21 and a power chip 22 arranged on one side of the frame 21; the power chip 22 in the semiconductor device 20 can be fixed to the frame 21 by solder paste.

[0062] In some embodiments, as shown in FIG3 , the intelligent power module 100 further includes a plastic package 10, wherein at least a portion of the semiconductor device 20 is encapsulated in the plastic package 10. Of the two opposite surfaces in the thickness direction of the plastic package 10, the surface farther from the frame 21 is the front surface D1 of the plastic package, and of the two opposite surfaces in the thickness direction of the plastic package 10, the surface closer to the frame 21 is the back surface D2 of the plastic package. The distance between the side of the frame 21 facing away from the power chip 22 and the back surface D2 of the plastic package 10 is A, and A satisfies the relationship: 0.3 mm ≤ A ≤ 0.7 mm.

[0063] In some embodiments, A satisfies the relationship: 0.3 mm ≤ A ≤ 0.4 mm, or 0.4 mm ≤ A ≤ 0.5 mm, or 0.5 mm ≤ A ≤ 0.6 mm, or 0.6 mm ≤ A ≤ 0.7 mm.

[0064] In the intelligent power module provided by some embodiments of the present disclosure, by encapsulating at least a portion of the semiconductor device 20 within the plastic package 10, the heat generated by the semiconductor device 20 during operation can be transferred to an external heat sink through the plastic package 10. On the one hand, by setting the distance A between the side of the frame 21 facing away from the power chip 22 and the back surface D2 of the plastic package 10 to be greater than or equal to 0.3 mm and less than or equal to 0.7 mm, the distance A can be kept within a reasonable range. On the one hand, it can prevent the distance A from being too large (as shown in FIG. 1 ), which would result in the plastic package 10 below the frame 21 being too thick. Since the back surface D2 of the plastic package 10 would contact the external heat sink, when the semiconductor device 20 operates normally and generates heat, the heat is transmitted downward and transferred to the external heat sink through the plastic package 10 below the frame 21. If the plastic package 10 below the frame 21 is too thick, the heat dissipation performance of the intelligent power module 100 will be poor. Therefore, setting the distance A between the side of the frame 21 facing away from the power chip 22 and the back surface D2 of the plastic package 10 to be less than or equal to 0.7 mm can improve the heat dissipation performance of the intelligent power module 100. On the other hand, setting the distance A to be greater than or equal to 0.3 mm can prevent the distance A from being too small (as shown in FIG2 ). During the manufacturing process of the intelligent power module 100, the semiconductor device 20 needs to be inserted into the packaging mold and encapsulated with a packaging material. The plastic package material (such as resin) needs to flow and disperse evenly in the packaging mold. If the distance A is too small, it will affect the flow of the plastic package material between the frame 21 and the back surface D2 of the plastic package 10, which will easily form pores V in the plastic package material (as shown in FIG4 ), resulting in poor insulation performance after the plastic package material gels. Therefore, setting the distance A to be greater than or equal to 0.3 mm can improve the insulation performance of the plastic package 10.

[0065] It should be noted that during the production process of the semiconductor device 20, the clamp will apply pressure to the semiconductor device 20, causing the semiconductor device 20 to deform, and during the process of the semiconductor device 20 being encapsulated by the molding compound, due to the influence of mold flow, the semiconductor device 20 will bend and tilt, and ultimately cause the distance A between the side of the frame 21 of the semiconductor device 20 away from the power chip 22 and the back side D2 of the molding body 10 to change. Therefore, it is necessary to use components to support the bottom of the frame 21 during the process of the semiconductor device 20 being encapsulated by the molding compound, and remove them before the molding compound solidifies. The components supporting the semiconductor device 20 will produce pinholes in the molding compound. If the distance A is too small, the molding compound will produce air holes, which may easily cause breakdown and leakage at the weak points of the pinholes, thereby reducing the insulation of the molding body 10, and further reducing the stability and reliability of the intelligent power module 100.

[0066] In some embodiments, as shown in FIG1 , if the distance A is set too large, the flow properties of the molding compound will be improved, thereby improving the insulation performance of the intelligent power module 100. As shown in FIG2 , if the distance A is set too small, the heat dissipation performance of the intelligent power module 100 will be improved. Therefore, as shown in FIG3 , the present disclosure can achieve a balance between heat dissipation and insulation performance of the intelligent power module 100 by setting the distance A within a reasonable range, thereby optimizing the structural design of the intelligent power module 100.

[0067] Therefore, by setting the distance A within a reasonable range, not only the heat dissipation performance of the plastic package 10 can be guaranteed, but also the plastic package 10 can be prevented from having poor flow performance when not solidified, which causes bubbles to be generated in the plastic package 10, thereby ensuring the insulation performance of the plastic package 10.

[0068] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in FIG3 , the distance A may satisfy the relationship: 0.4 mm ≤ A ≤ 0.6 mm.

[0069] In some embodiments, A satisfies the relationship: 0.4 mm ≤ A ≤ 0.5 mm, or 0.5 mm ≤ A ≤ 0.6 mm.

[0070] Specifically, the above-mentioned setting of the distance A to be less than or equal to 0.6 mm and greater than or equal to 0.4 mm can not only prevent the distance A from being too large in some embodiments, thereby improving the heat dissipation performance of the intelligent power module 100 in some embodiments, but also prevent the distance A from being too small in some embodiments, thereby improving the insulation performance of the intelligent power module 100 in some embodiments, thereby improving the structural reliability of the intelligent power module 100 in some embodiments.

[0071] In some embodiments, as shown in FIG3 , by arranging the power chip 22 on the upper surface of the frame 21 and setting the distance A between the side of the frame 21 facing away from the power chip 22 and the surface D2 of the plastic package 10 to 0.4 mm ≤ A ≤ 0.6 mm, the power chip 22 can transfer heat downward through the frame 21 after generating heat during operation, thereby ensuring the stability and smoothness of heat transfer. In some embodiments, with such a setting, the calculation of the distance A will not be affected by the thickness of the frame 21 and the thickness of the power chip 22, and the heat dissipation performance and insulation performance of the intelligent power module 100 can be guaranteed in some embodiments, thereby improving the structural reliability of the semiconductor device 20 in some embodiments.

[0072] In some embodiments, in the intelligent power module provided in some embodiments of the present disclosure, as shown in FIG3 , the distance between the semiconductor device 20 and the front surface D1 of the plastic package 10 is B, and B and A satisfy the relationship: B>A. Specifically, the distance B between the semiconductor device 20 and the front surface D1 of the plastic package 10 is set to be greater than the distance A between the side of the frame 21 facing away from the power chip 22 and the back surface D2 of the plastic package 10. This can reduce the distance and time required for heat generated by the semiconductor device 20 to be transferred to the heat sink on the back surface D2 of the plastic package 10, thereby improving the heat dissipation efficiency of the semiconductor device 20.

[0073] In some embodiments, in the intelligent power modules provided in some embodiments of the present disclosure, the material of the plastic encapsulation body 10 may include, but is not limited to, insulating resin. Specifically, using insulating resin to form the plastic encapsulation body 10 not only ensures the heat dissipation performance of the plastic encapsulation body 10 in some embodiments, but also improves the insulation properties of the plastic encapsulation body 10 in some embodiments, thereby enhancing the safety and stability of the intelligent power module 100. In some embodiments of the present disclosure, the heat dissipation coefficient of the insulating resin is approximately 2 W / (mk), and the heat dissipation coefficient of the frame of the semiconductor device 20 is approximately 400 W / (mk).

[0074] Specifically, in order to ensure that the distance A in Figure 3 is set within a reasonable range, when the semiconductor device 20 is encapsulated with a molding compound, the semiconductor device 20 can be inserted into a packaging mold having a core-pulling needle 30. Before the molding, the core-pulling needle 30 is inserted into the packaging mold from the bottom of the packaging mold and supports the lower surface of the frame 21, as shown in Figures 5 to 7. Figure 5 is a schematic diagram of injecting half of the molding compound into the packaging mold, Figure 6 is a schematic diagram of injecting the complete molding compound into the packaging mold, and Figure 7 is a schematic diagram of removing the core-pulling needle 30 from the packaging mold when the molding compound is not completely gelled. Since the core-pulling needle 30 is used to support the lower surface of the frame 21 during the molding process, the frame 21 will not bend or tilt, so that the distance A is set within a reasonable range, thereby ensuring the stability and reliability of the intelligent power module 100.

[0075] It should be noted that the core puller 30 in Figure 7 is removed before all the molding compound is injected and fully gelled. This ensures that the frame 21 does not bend or tilt. As shown in Figures 8 and 9, Figure 8 shows a schematic diagram of removing the core puller 30 after a portion of the molding compound has been injected. If the molding compound is then continued to be injected, as shown in Figure 9, this will still cause the frame 21 to bend or tilt. Therefore, the core puller 30 must be removed before all the molding compound is injected and fully gelled.

[0076] In some embodiments, as shown in Figures 10 to 13, the frame 21 includes: a plurality of base islands 211 extending along a first direction X and arranged at intervals along a second direction Y, where the second direction Y is the length direction of the intelligent power module 100. By arranging the plurality of base islands 211 at intervals, power chips 22 with different functions can be set on different base islands 211. For example, some base islands 211 are configured to place lower bridge chips in the inverter circuit, and other base islands 211 are configured to place upper bridge chips in the inverter circuit.

[0077] In some embodiments, as shown in Figures 10 to 13, the frame 21 also includes a plurality of power-side pins 60 arranged on one side of the plurality of base islands 211 along the first direction X and arranged at intervals, and one end of each power-side pin 60 is connected to the corresponding base island 211.

[0078] In some embodiments, as shown in Figures 10 to 13, a corresponding power chip 22 is respectively provided on each base island 211, and the plastic package 10 encapsulates multiple base islands 211. One end of each power side pin 60 is located inside the plastic package 10, and the other end of each power side pin 60 is located outside the plastic package 10; wherein, by encapsulating multiple base islands 211 with the plastic package 10, it is necessary to fill the multiple base islands 211 with resin for plastic packaging.

[0079] In some embodiments, as shown in Figures 10 to 13, a plurality of front pinholes 101 are formed on the front of the plastic-encapsulated body 10, and a plurality of back pinholes 102 are formed on the back of the plastic-encapsulated body 10. The base islands 211 at the two ends of the second direction Y respectively correspond to the front pinholes 101, and each base island 211 corresponds to at least one back pinhole 102. Specifically, after the plastic encapsulation of the plurality of base islands 211 is completed, a plurality of front pinholes 101 are formed on the front of the plastic-encapsulated body 10, and when the plastic encapsulation material is injected, the core-pulling needle 30 passes through the front pinhole 101 to support the frame 21. Moreover, a plurality of back pinholes 102 are formed on the back of the plastic-encapsulated body 10, and when the plastic encapsulation material is injected, the core-pulling needle 30 passes through the back pinhole 102 to support the frame 21. The core needle 30 penetrates from the back of the plastic-encapsulated body 10 to support the lower surface of the frame 21, so that the frame 21 can be continuously encapsulated. The support in the same direction can also speed up the plastic encapsulation rate. Moreover, the base islands 211 located at the two ends of the second direction Y respectively correspond to front pinholes 101, which can be plastic encapsulated together with the back pinholes 102. Each base island 211 corresponds to at least one back pinhole 102. When the plastic encapsulation body 10 is injected, the core-pulling needle 30 passes through the back pinhole 102 to support each base island 211. This can also extend the service life of the encapsulation mold and, in some embodiments, facilitate the miniaturization of the intelligent power module 100. Moreover, since the setting position of the front pinhole 101 is the same as that of other intelligent power modules, the same encapsulation mold as other intelligent power modules (such as an intelligent power module containing a DBC and with one side of the DBC surface exposed) can be used on the front of the plastic encapsulation body, thereby eliminating the need for the development of the front encapsulation mold, improving the versatility of the encapsulation mold, shortening the R&D cycle, and reducing R&D costs.

[0080] Thus, a plurality of front pinholes 101 are formed on the front of the plastic packaging body 10, and a plurality of back pinholes 102 are formed on the back of the plastic packaging body 10. During the plastic packaging process, the frame 21 can be supported in different directions and the plastic packaging speed can be accelerated.

[0081] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figure 12, along the first direction X, each front pinhole 101 and each back pinhole 102 are arranged on the side of the base island 211 away from the power side pin 60. In this way, the power side pin 60 can avoid interference with the core-pulling pins 30 corresponding to each front pinhole 101 and each back pinhole 102 during the plastic packaging process.

[0082] As shown in Figure 3, a suitable distance A needs to be designed between the side of the frame 21 facing away from the power chip 22 and the back side D2 of the plastic package body 10. The larger the distance A, the more conducive it is to the filling of resin during the plastic packaging process. Due to the flow characteristics of the resin filling, the frame 21 is pressed down by the flowing resin and deformed, which will cause the distance A to be further reduced. Due to the low thermal conductivity of the resin, the heat dissipation performance of the product deteriorates. In this way, air holes V are prone to appear in the thinned area of ​​the flowing resin that is deformed by the pressure of the frame 21, and the packaging is not utilized. In order to avoid the generation of air holes V and take into account the heat dissipation performance of the product and the filling performance of the plastic packaging resin, it is necessary to add a core-pulling needle 30 in the packaging mold to support the lower surface of the frame 21.

[0083] In some embodiments, as shown in Figures 14 and 15, the packaging mold includes a core pulling pin 30, a core pulling pin plate 31 and a core pulling pin sleeve 34. The core pulling pin 30 passes through the cavity and the core pulling pin plate 31 and is fixed by the bottom plate. The oil circuit provides power to the ejector pin 30 to eject the core pulling pin 30. After the oil circuit power is cut off, the core pulling pin 30 is reset by the reset spring or the reverse oil circuit. The reset position of the core pulling pin sleeve 34 and the core pulling pin 30 is usually set to be higher than the cavity surface of the mold, which can prevent the resin from filling into the cavity and the core pulling pin sleeve 34. Therefore, a cylindrical groove, i.e., a pinhole, will be generated on the final product. Moreover, the core pulling pin 30 is a retractable core pulling pin 30 design. When the resin is filled, the core pulling pin 30 first supports the fixed frame 21. During the resin filling process, in order to prevent the frame 21 from deforming, the core pulling pin 30 retracts and completes the entire plastic packaging process when the resin filling is completed and the pressure is maintained. When the core pulling pin 30 retracts, the resin has been completed and the frame 21 can be kept from deforming.

[0084] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, as shown in Figure 11, since the core pulling needle 30 needs to penetrate the core pulling needle plate 31 to plastic-encapsulate two adjacent base islands 211, the plastic encapsulation of the two adjacent base islands 211 corresponds to two adjacent expanded holes 33 on the core pulling needle plate 31. In order to avoid interference between the adjacent expanded holes 33 on the core pulling needle plate 31 and meet the strength design requirements of the core pulling needle plate 31, it is not necessary to change the lateral spacing of the adjacent base islands 211 of the frame 21. In order to miniaturize the product, it is necessary to make the back pinholes 102 corresponding to the two adjacent base islands 211 at least partially staggered along the second direction Y. In this way, the staggered core pulling needle 30 design is adopted to prevent the two adjacent expanded holes 33 on the core pulling needle plate 31 from interfering with each other, thereby improving the strength design requirements of the core pulling needle plate 31, increasing the service life of the mold, and being conducive to the miniaturization of the intelligent power module 100.

[0085] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, as shown in Figures 10 and 11, a plurality of base islands 211 include: odd base islands 211' and even base islands 211", the odd base islands 211' and the even base islands 211" are staggered along the second direction Y, the center line of the back pinholes 102 corresponding to the odd base islands 211' is a first straight line 41, and the center line of the back pinholes 102 corresponding to the even base islands 211" is a second straight line 42, the first straight line 41 and the second straight line 42 are parallel to each other and extend along the second direction Y. Among them, the back pinholes 102 corresponding to the odd base islands 211' and the even base islands 211" are also staggered along the second direction Y, and the core-pulling needle plate 31 through which the core-pulling needles 30 are inserted is provided with expansion holes 33 corresponding to the odd base islands 211' and the even base islands 211", so that the expansion holes 33 are also staggered in the second direction Y, which can avoid the pinholes 102 from being pulled out. The expansion holes 33 arranged on the core needle plate 31 corresponding to the odd base islands 211' and the even base islands 211" interfere with each other, and can also prevent stress concentration on the core pulling needle plate 31, thereby ensuring the strength of the core pulling needle plate 31. In addition, the center line of the back pinholes 102 corresponding to the odd base islands 211' is the first straight line 41, and the center line of the back pinholes 102 corresponding to the even base islands 211" is the second straight line 42. Correspondingly, the center line of the expansion holes 33 arranged on the core pulling needle plate 31 corresponding to the odd base islands 211' and the even base islands 211" is also divided into two straight lines. Since the first straight line 41 and the second straight line 42 are parallel to each other, and the first straight line 41 and the second straight line 42 extend along the second direction Y, the two straight lines formed by the center lines of the expansion holes 33 on the core pulling needle plate 31 are also parallel to each other, which can make the force on the core pulling needle plate 31 in the second direction Y more uniform, thereby improving the reliability of the core pulling needle plate 31.

[0086] In some embodiments, in the intelligent power module provided in some embodiments of the present disclosure, as shown in FIG11 , the central axis of the intelligent power module 100 extending along the second direction Y is a third straight line 43, and the center line connecting the plurality of front pinholes 101 is a fourth straight line 44, with the third straight line 43 and the fourth straight line 44 being parallel to each other. The parallel arrangement of the third straight line 43 and the fourth straight line 44 extending along the second direction Y of the intelligent power module 100 facilitates the arrangement of the plurality of core pulling pins 30 in different directions, avoids interference, and prevents deformation of the frame 21.

[0087] It should be noted that the “parallel to each other” mentioned above refers to being approximately parallel. Due to differences in manufacturing processes, the two straight lines may be only approximately parallel.

[0088] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figure 11, the first straight line 41 and the second straight line 42 are both located between the third straight line 43 and the fourth straight line 44. In this way, in some embodiments, the arrangement of the core pulling needle 30 in the packaging mold can be facilitated, but of course it is not limited to this.

[0089] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, as shown in Figures 10 and 11, the multiple base islands 211 include a first base island 201, a second base island 202, a third base island 203 and a fourth base island 204 arranged sequentially along the second direction Y. The first base island 201 and the third base island 203 may be odd-numbered base islands 211', and the second base island 202 and the fourth base island 204 may be even-numbered base islands 211".

[0090] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figures 10 and 11, the multiple front pinholes 101 include a first front pinhole 1011 and a second front pinhole 1012. Along the first direction X, the first front pinhole 1011 corresponds to the first base island 201, and the second front pinhole 1012 corresponds to the fourth base island 204.

[0091] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figures 10 and 11, in the first direction X, that is, the thickness direction of the intelligent power module 100, on the front side of the plastic package body 10, an expanded hole 33 corresponding to the first front side pinhole 1011 and the second front side pinhole 1012 is formed on the core-pulling needle plate 31, so that interference with the expanded hole 33 of the core-pulling needle plate 31 adapted thereto can be avoided.

[0092] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figures 10 and 11, the multiple back pinholes 102 include a first back pinhole 1021, a second back pinhole 1022, a third back pinhole 1023, a fourth back pinhole 1024 and a fifth back pinhole 1025, the first back pinhole 1021 corresponds to the first base island 201, the second back pinhole 1022 corresponds to the second base island 202, the third back pinhole 1023 corresponds to the third base island 203, and the fourth back pinhole 1024 and the fifth back pinhole 1025 both correspond to the fourth base island 204.

[0093] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figures 10 and 11, on the back of the plastic packaging body 10, an expansion hole 33 corresponding to the first back pinhole 1021, the second back pinhole 1022, the third back pinhole 1023, the fourth back pinhole 1024 and the fifth back pinhole 1025 is formed on the core-pulling needle plate 31. In this way, interference with the expansion hole 33 of the core-pulling needle plate 31 adapted thereto can be avoided. Moreover, during the plastic packaging process, the fourth back pinhole 1024 and the fifth back pinhole 1025 both support the fourth base island 204 through the core-pulling needle 30 provided therethrough, thereby preventing the fourth base island 204 from tilting.

[0094] In some embodiments, in the above-mentioned intelligent power module provided in some embodiments of the present disclosure, as shown in Figure 11, the center distance between the first front pinhole 1011 and the second front pinhole 1012 is d1, and the center distance between the first back pinhole 1021 and the fifth back pinhole 1025 is d2, and d1 and d2 satisfy the relationship: d1>d2. In this way, during the plastic packaging process, the core pulling needle 30 of the first front pinhole 1011 and the core pulling needle 30 of the second front pinhole 1012 can be avoided from completely overlapping with the core pulling needle 30 of the first back pinhole 1021 and the core pulling needle 30 of the fifth back pinhole 1025, which can be beneficial to the positioning of the base island 211 in the plastic packaging body 10.

[0095] In some embodiments, in the intelligent power module provided by some embodiments of the present disclosure, as shown in FIG11 , the orthographic projections of the backside pinholes 102 corresponding to the odd-numbered islands 211′ (the first island 201 and the third island 203) on the corresponding odd-numbered islands 211′ are located within the odd-numbered islands 211′ and are tangent to the edge of the odd-numbered islands 211′ away from the power-side pins 60 along the first direction X. This facilitates the arrangement of the core pulling pins 30 and ensures support for each island 211, thereby preventing deformation.

[0096] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, as shown in Figure 11, the projection of the back pinhole 102 corresponding to the even-numbered base island 211" (the second base island 202 and the fourth base island 204) on the corresponding even-numbered base island 211" is located within the even-numbered base island 211" and is tangent to the edge of the even-numbered base island 211" away from the power-side pin 60 along the first direction X. The central axis of the intelligent power module 100 extending along the second direction Y is the third straight line 43. The first straight line 41 and the second straight line 42 are located on the same side of the third straight line 43. The back pinhole 102 corresponding to the odd-numbered base island 211' intersects with the third straight line 43. In this way, the arrangement of the core-pulling pin 30 can be facilitated, and the space of the intelligent power module 100 can be reasonably utilized, so that multiple power chips 22 can be packaged in the intelligent power module 100.

[0097] In some embodiments, in the intelligent power module provided in some embodiments of the present disclosure, as shown in FIG11 , at least one screw hole 50 and at least two demolding holes 51 are respectively provided on both sides of the centerline of the plastic encapsulation body 10 extending along the second direction Y. The center of the screw hole 50 coincides with the centerline of the plastic encapsulation body 10 extending along the second direction Y. The two demolding holes 51 are provided on the back side of the plastic encapsulation body 10 and are symmetrically arranged with respect to the centerline of the plastic encapsulation body 20 along the second direction Y. The fact that the center of the screw hole 50 coincides with the centerline of the plastic encapsulation body 10 along the second direction Y facilitates securing the plastic encapsulation body 10. Furthermore, the fact that the two demolding holes 51 are provided on the back side of the plastic encapsulation body and are symmetrical with respect to the centerline of the plastic encapsulation body 20 along the second direction Y prevents damage to the plastic encapsulation body 10 and deformation of the plastic encapsulation body 10 during the demolding process.

[0098] In some embodiments, as shown in Figure 11, the embodiment of the present disclosure takes the example of a plastic package body 10 having one screw hole 50 and two demolding holes 51 on both sides of the center line extending along the second direction Y. Of course, in a specific implementation, the number of screw holes 50 can also be two or more, and the number of demolding holes 51 can also be four or more. The present disclosure does not specifically limit the number of screw holes 50 and demolding holes 51. A larger number of screw holes 50 and demolding holes 51 is more conducive to fixing the plastic package body 10, and during the demolding process, damage to the plastic package body 10 can be further avoided and deformation of the plastic package body 10 can be further avoided.

[0099] In some embodiments, in the intelligent power module provided by some embodiments of the present disclosure, as shown in FIG11 , the intersection of the screw hole 50 near the inner side of the plastic encapsulation body 10 and the centerline of the plastic encapsulation body 10 extending along the second direction Y is point E. The intersection of the centerline connecting the two demolding holes 51 symmetrically arranged about the centerline of the plastic encapsulation body 10 extending along the second direction Y and the centerline of the plastic encapsulation body 10 extending along the second direction Y is point F. Point F is located between the center of the screw hole 50 and point E. This facilitates demolding, avoids damage to the plastic encapsulation body 10 during the demolding process, extends the service life of the packaging mold, and facilitates product miniaturization of the intelligent power module 100.

[0100] In some embodiments, in the above-mentioned intelligent power module provided by some embodiments of the present disclosure, each power chip can be divided into three low-voltage power chips and three high-voltage power chips, the three low-voltage power chips are respectively arranged on the first base island 201, the second base island 202 and the third base island 203, the three high-voltage power chips are all arranged on the fourth base island 204 and are arranged at intervals along the second direction Y, and the three low-voltage power chips and the three high-voltage power chips are all located on the side of the frame 21 facing the front of the plastic package 10. Among them, each low-voltage base island (201, 202, 203) is correspondingly provided with a low-voltage power chip, and each high-voltage base island (204) is provided with three high-voltage power chips. Moreover, each power chip can be composed of two chips IGBT (insulated gate bipolar transistor) and FRD (freewheeling diode), or can be composed of one RC-IGBT (IGBT and FRD integrated in one chip). In this way, the intelligent power module 100 including multiple low-voltage power chips and high-voltage power chips can be made smaller in size, thereby achieving miniaturization of the product.

[0101] It should be noted that the embodiment of the present disclosure takes the example that each power chip can be divided into three low-voltage power chips and three high-voltage power chips, but is of course not limited to this. For example, each power chip can be divided into two low-voltage power chips and two high-voltage power chips, and so on.

[0102] Based on the same inventive concept, some embodiments of the present disclosure provide a method for manufacturing an intelligent power module 100 , which is applicable to the above-mentioned intelligent power module 100 , as shown in FIG16 , and includes the following steps:

[0103] S1, extending at least a portion of the semiconductor device 20 into a packaging mold;

[0104] S2, extending the core pulling needle 30 into the packaging mold, so that the core pulling needle 30 contacts the frame 21 of the semiconductor device 20 to support the frame 21;

[0105] S3, injecting a plastic encapsulating compound into the encapsulating mold to encapsulate the semiconductor device 20 in the plastic encapsulating compound;

[0106] S4. After a preset time T, the core-pulling needle 30 is taken out from the packaging mold, wherein T is less than the gelation time of the plastic packaging material.

[0107] In the manufacturing method of the above-mentioned intelligent power module provided in some embodiments of the present disclosure, during the production process of the intelligent power module 100, at least a portion of the semiconductor device 20 is first inserted into the packaging mold, and the core pulling needle 30 is inserted into the packaging mold, so that the core pulling needle 30 contacts the frame 21 of the semiconductor device 20 to support the frame 21. The core pulling needle 30 can prevent the semiconductor device 20 from being deformed by pressure exerted by external forces such as clamps during the production process. Then, plastic encapsulation material is injected into the mold to encapsulate the semiconductor device 20 in the plastic encapsulation material. The plastic encapsulation material is fluid when it is just injected. After a preset time T, it will gel into a solid plastic encapsulation body 10, thereby ensuring the insulation of the semiconductor device 20.

[0108] In some embodiments, since the molding compound has a certain weight, during the process of injecting the molding compound into the packaging mold to wrap the semiconductor device 20, the molding compound will squeeze the semiconductor device 20 downward, causing the semiconductor device 20 to bend downward, thereby causing the distance between the semiconductor device 20 and the bottom of the molding compound 10 to change unpredictably, thereby causing the final produced intelligent power module 100 to be unreliable.

[0109] Therefore, before injecting the molding compound into the packaging mold, the present invention needs to extend the core-pulling needle 30 into the packaging mold and support the frame 21 of the semiconductor device 20, so as to ensure that the semiconductor device 20 will not bend or deform even under pressure, thereby ensuring the structural stability and reliability of the intelligent power module 100.

[0110] In some embodiments, by setting the preset time T for removing the core-pulling needle 30 to be less than the time for the molding compound to gel, it is possible to prevent the molding compound from gelling and the core-pulling needle 30 from being unable to be removed or the resin from being unable to be completely filled after removal, thereby forming a molding needle hole and causing the intelligent power module 100 to have a poor appearance. In this way, the reliability of the manufacturing method of the intelligent power module 100 can be improved, and the yield rate of the intelligent power module 100 can be improved.

[0111] In some embodiments, in the manufacturing method provided in some embodiments of the present disclosure, T satisfies the relationship: T≤30s. Specifically, setting the preset time T for removing the core puller 30 to be less than or equal to 30s can, in some embodiments, prevent the core puller 30 from being unable to be removed or the resin from being incompletely filled after removal, thereby preventing the formation of plastic encapsulation pinholes and resulting in a poor appearance of the intelligent power module 100. This can, in some embodiments, improve the reliability of the manufacturing method of the intelligent power module 100 and improve the yield rate of the intelligent power module 100.

[0112] In some embodiments, the core-pulling needle 30 cannot be completely removed until the molding compound is gelled. It is necessary to selectively set the removal time of the core-pulling needle 30 according to the viscosity characteristics of the molding compound and the mold flow, so as to ensure that the core-pulling needle 30 can not only be removed stably, but also prevent the molding compound from failing to fill the pinhole completely.

[0113] In some embodiments, in the above-mentioned manufacturing method provided in some embodiments of the present disclosure, T satisfies the relationship: T ≥ 4s. Specifically, setting the preset time T for removing the core puller 30 to be greater than or equal to 4s can prevent the preset time T for removing the core puller 30 from being too short, which may result in the semiconductor device 20 being susceptible to deformation due to continued flow of the molding compound after the core puller 30 is withdrawn. In severe cases, this may cause the frame pad or base island of the semiconductor device 20 to leak out. This can improve the stability and reliability of the manufacturing method of the intelligent power module 100 in some embodiments.

[0114] In some embodiments, in the above-mentioned manufacturing method provided in some embodiments of the present disclosure, T satisfies the relationship: T ≥ 12s. Specifically, setting the preset time T for removing the core pulling needle 30 to be greater than or equal to 12s can prevent, in some embodiments, the preset time T for removing the core pulling needle 30 from being too short, which can cause the semiconductor device 20 to be susceptible to deformation after the core pulling needle 30 is withdrawn due to the continued flow of the molding compound mold flow. In severe cases, this can cause the frame pad or base island of the semiconductor device 20 to leak out. This can improve the stability and reliability of the manufacturing method of the intelligent power module 100 in some embodiments.

[0115] In some embodiments, in the above-mentioned manufacturing method provided in some embodiments of the present disclosure, as shown in Figures 14 and 15, the core pulling needle 30 is a telescopic needle. Such a configuration can not only ensure the stability and reliability of the core pulling needle 30 supporting the semiconductor device 20, but also improve the stability and smoothness of the core pulling needle 30 in inserting into the plastic package body 10 and removing from the plastic package body 10 in some embodiments, and prevent the core pulling needle 30 from shaking during the insertion and removal process, thereby improving the reliability of the manufacturing method of the intelligent power module 100 in some embodiments.

[0116] In some embodiments, in the above-mentioned manufacturing method provided in some embodiments of the present disclosure, a plurality of core-pulling pins are provided on both sides of the encapsulation mold along the thickness direction of the molding compound. For example, the encapsulation mold is provided with two core-pulling pins corresponding to the front of the molding body, and the encapsulation mold is provided with three core-pulling pins corresponding to the back of the molding body. Thus, two front pinholes 101 are formed on the front of the molding body 10, and three back pinholes 102 are formed on the back of the molding body 10. Therefore, during the molding process, the frame 21 can be supported in different directions, and the molding rate can be accelerated. Moreover, the fully encapsulated intelligent power module thus provided can share the encapsulation mold with other semi-encapsulated power modules (for example, a power module containing a DBC and with one side of the DBC surface exposed) on the front of the molding body 10, thereby improving the versatility of the encapsulation mold, shortening the R&D cycle, and reducing R&D costs.

[0117] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0118] Obviously, those skilled in the art may make various changes and modifications to some embodiments of the present disclosure without departing from the spirit and scope of some embodiments of the present disclosure. Thus, if these modifications and variations of some embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations.

Claims

1. An intelligent power module, wherein: include: A semiconductor device, comprising a frame and a power chip disposed on one side of the frame; A plastic package, wherein at least a portion of the semiconductor device is encapsulated in the plastic package, the surface farther from the frame of the two opposite surfaces in the thickness direction of the plastic package is the front side of the plastic package, the surface closer to the frame of the two opposite surfaces in the thickness direction of the plastic package is the back side of the plastic package, and the distance between the side of the frame away from the power chip and the back side of the plastic package is A, and A satisfies the relationship: 0.3mm≤A≤0.7mm.

2. The intelligent power module according to claim 1, wherein: A satisfies the relationship: 0.4mm≤A≤0.6mm.

3. The intelligent power module according to claim 1 or 2, wherein: The distance between the semiconductor device and the front side of the plastic package body is B, and B and A satisfy the relationship: B>A.

4. The intelligent power module according to any one of claims 1 to 3, wherein: The frame includes: a plurality of base islands extending along a first direction and arranged at intervals along a second direction, and a plurality of power side pins arranged at intervals on one side of the plurality of base islands along the first direction; one end of each of the power side pins is connected to the corresponding base island; wherein, The corresponding power chip is disposed on each base island, and the plastic package encapsulates a plurality of base islands; A plurality of front pinholes are formed on the front side of the plastic package body, and a plurality of back pinholes are formed on the back side of the plastic package body. The base island positions at the two ends of the second direction correspond to the front pinholes respectively, and each base island position corresponds to at least one back pinhole. One end of each power side pin is located inside the plastic package body, and the other end of each power side pin is located outside the plastic package body.

5. The intelligent power module according to claim 4, wherein: Along the first direction, each of the front pinholes and each of the back pinholes are arranged on a side of the base island away from the power-side pin.

6. The intelligent power module according to claim 4 or 5, wherein: The back side pinholes corresponding to two adjacent base islands are at least partially staggered along the second direction.

7. The intelligent power module according to claim 6, wherein: The multiple base islands include: odd-numbered base islands and even-numbered base islands, and the odd-numbered base islands and the even-numbered base islands are arranged alternately along the second direction. The center line of the back pinholes corresponding to the odd-numbered base islands is a first straight line, and the center line of the back pinholes corresponding to the even-numbered base islands is a second straight line. The first straight line and the second straight line are parallel to each other and extend along the second direction.

8. The intelligent power module according to claim 7, wherein: The central axis of the intelligent power module extending along the second direction is a third straight line, the center line connecting the plurality of front pinholes is a fourth straight line, and the third straight line and the fourth straight line are parallel to each other.

9. The intelligent power module according to claim 8, wherein: The first straight line and the second straight line are both located between the third straight line and the fourth straight line.

10. The intelligent power module according to any one of claims 7 to 9, wherein: The plurality of base islands include a first base island, a second base island, a third base island and a fourth base island arranged in sequence along the second direction, the first base island and the third base island are the odd-numbered base islands, and the second base island and the fourth base island are the even-numbered base islands; The multiple front pinholes include a first front pinhole and a second front pinhole, and the multiple back pinholes include a first back pinhole, a second back pinhole, a third back pinhole, a fourth back pinhole and a fifth back pinhole. Along the first direction, the first front pinhole corresponds to the first base island, the second front pinhole corresponds to the fourth base island, the first back pinhole corresponds to the first base island, the second back pinhole corresponds to the second base island, the third back pinhole corresponds to the third base island, and the fourth back pinhole and the fifth back pinhole both correspond to the fourth base island.

11. The intelligent power module according to claim 10, wherein: The center distance between the first front pinhole and the second front pinhole is d1, the center distance between the first back pinhole and the fifth back pinhole is d2, and d1 and d2 satisfy the relationship: d1>d2.

12. The intelligent power module according to claim 10, wherein: Each of the power chips is divided into three low-voltage power chips and three high-voltage power chips. The three low-voltage power chips are respectively arranged on the first base island, the second base island and the third base island. The three high-voltage power chips are all arranged on the fourth base island and are spaced apart along the second direction. The three low-voltage power chips and the three high-voltage power chips are all located on the side of the frame facing the front of the plastic package body.

13. The intelligent power module according to claim 7, wherein: The orthographic projection of the back pinhole corresponding to the odd-numbered base island on the corresponding odd-numbered base island is located in the odd-numbered base island and is tangent to the edge of the odd-numbered base island away from the power-side pin along the first direction.

14. The intelligent power module according to claim 7, wherein: The projection of the back pinhole corresponding to the even-numbered base island on the corresponding even-numbered base island is located within the even-numbered base island and is tangent to the edge of the even-numbered base island away from the power-side pin along the first direction, the central axis of the intelligent power module extending along the second direction is a third straight line, the first straight line and the second straight line are located on the same side of the third straight line, and the back pinhole corresponding to the odd-numbered base island intersects with the third straight line.

15. The intelligent power module according to claim 4, wherein: One screw hole and two demolding holes are respectively arranged on both sides of the center line of the plastic sealing body extending along the second direction, the center of the screw hole coincides with the center line of the plastic sealing body extending along the second direction, and the two demolding holes are arranged on the back side of the plastic sealing body and are symmetrically arranged about the center line of the plastic sealing body along the second direction.

16. The intelligent power module according to claim 15, wherein: The intersection of the inner side of the screw hole close to the plastic sealing body and the center line of the plastic sealing body extending along the second direction is point E, and the intersection of the center line of the two demoulding holes symmetrically arranged about the center line of the plastic sealing body extending along the second direction and the center line of the plastic sealing body extending along the second direction is point F, and point F is located between the center of the screw hole and point E.

17. The intelligent power module according to any one of claims 1 to 16, wherein: The material of the plastic package body includes insulating resin.

18. A method for manufacturing an intelligent power module, for manufacturing the intelligent power module according to any one of claims 1 to 17, wherein: The manufacturing method comprises: Extending at least a portion of the semiconductor device into a packaging mold; Extending a core pulling needle into the packaging mold so that the core pulling needle contacts the frame of the semiconductor device to support the frame; Injecting a plastic encapsulation material into the encapsulation mold to encapsulate the semiconductor device in the plastic encapsulation material; After a preset time T, the core-pulling needle is taken out from the packaging mold, wherein T is less than the gelation time of the plastic packaging material.

19. The method for manufacturing an intelligent power module according to claim 18, wherein: T satisfies the relationship: T≤30s.

20. The method for manufacturing an intelligent power module according to claim 19, wherein: T satisfies the relationship: T≥4s.

21. The method for manufacturing an intelligent power module according to claim 20, wherein: T satisfies the relationship: T≥12s.

22. The method for manufacturing an intelligent power module according to any one of claims 18 to 21, wherein: The core-pulling needle is a telescopic needle.

23. The method for manufacturing an intelligent power module according to any one of claims 18 to 22, wherein: The packaging mold is provided with a plurality of core-pulling pins on both sides along the thickness direction of the plastic packaging material.

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