Integrated circuit board, battery module, electronic device, and integrated circuit board manufacturing method

Abstract

The present application provides an integrated circuit board, a battery module, an electronic device, and an integrated circuit board manufacturing method. The integrated circuit board comprises a flexible circuit board, first electric components, second electric components, a connecting member, a reinforcing plate and a packaging member; the flexible circuit board comprises a main body part and an extension part which are connected in the length direction of the integrated circuit board; the first electric components and the second electric components are respectively arranged on two opposite sides of the main body part; the connecting member and the reinforcing plate are respectively arranged on two opposite sides of the extension part; in the thickness direction of the integrated circuit board, the projection of the reinforcing plate on the extension part and the projection of the connecting member on the extension part at least partially overlap; the packaging member is fixed onto the main body part, and the packaging member completely covers the first electric components; and in the thickness direction of the integrated circuit board, the projection of each second electric component and the projection of the main body part are both completely located on the packaging member. The thickness of the integrated circuit board is reduced, so that the lightweight design of the electronic device is facilitated.

Description

Integrated circuit board, battery module, electronic device and integrated circuit board preparation method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 14, 2023, with application number 202310704602.4 and application name “Integrated Circuit Board, Battery Module, Electronic Device and Integrated Circuit Board Preparation Method”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of circuit boards, and in particular to an integrated circuit board, a battery module, an electronic device, and a method for preparing the integrated circuit board. Background Art

[0003] Nowadays, a wide variety of electronic devices are widely used. Batteries are essential components for any electronic device. To enhance battery safety, integrated circuits are often installed on these devices to protect the battery and shut it down in the event of over-discharge or over-charge.

[0004] However, as electronic devices become thinner and lighter, the size of integrated circuit boards has become a bottleneck restricting the thinner and lighter design of electronic devices.

[0005] Summary of the Invention

[0006] The present application provides an integrated circuit board, a battery module, an electronic device, and a method for preparing the integrated circuit board. The size of the integrated circuit board is reduced, which is conducive to the lightweight and thin design of the electronic device.

[0007] In a first aspect, the present application provides an integrated circuit board (IC) comprising: a flexible printed circuit board (FPCB), a first electrical component, a second electrical component, a connector, a reinforcement plate, and a package. The FPCB comprises a main body and an extension connected along the length of the IC board. The first and second electrical components are disposed on opposite sides of the main body along the thickness direction of the IC board. The connector and the reinforcement plate are disposed on opposite sides of the extension along the thickness direction of the IC board. The projection of the reinforcement plate on the extension and the projection of the connector on the extension at least partially overlap in the thickness direction of the IC board. The package is secured to the main body and completely covers the first electrical component. The projection of the second electrical component and the main body are both completely located on the package in the thickness direction of the IC board. The first reinforcement plate supports the first connector, reducing the risk of deformation of the first connector pins.

[0008] In this application, the thickness of the integrated circuit board's thickest region along the Z-axis is the sum of the thicknesses of the package, the flexible printed circuit board, and the second electrical component. In the first prior art, the integrated circuit board is typically composed of a printed circuit board, a flexible printed circuit board, and a package. In this prior art, the thickness of the integrated circuit board's thickest region along the Z-axis is the sum of the thicknesses of the printed circuit board, the package, and the electrical component. Because the printed circuit board's thickness is greater than that of the flexible printed circuit board, the integrated circuit board provided in this application has a reduced thickness compared to the first prior art, facilitating lightweight electronic device design.

[0009] In the second prior art, the thickness of another integrated circuit board is generally the sum of the thickness of the dot-shaped package, the thickness of the reinforcement plate, and the thickness of the electrical components. In the present application, however, the projection of the main body is completely located on the package, meaning that the package is integrally formed on the main body. The package can provide support, so there is no need for a reinforcement plate. In this application, the thickness of the integrated circuit board is the sum of the thickness of the package, the thickness of the flexible circuit board, and the thickness of the second electrical component. The thickness of the reinforcement plate is greater than that of the flexible circuit board. Therefore, compared to the second prior art, the thickness of the integrated circuit board provided in this application is reduced, which facilitates the lightweight design of electronic equipment.

[0010] In some embodiments, the package is fixed to the main body by molding, thereby making the size of the package controllable, making the size of the package smaller, and further reducing the size of the integrated circuit board.

[0011] In some embodiments, the number of the first electrical components is at least two; and the package completely covers the at least two first electrical components.

[0012] In some embodiments, the main body has a first bearing surface; the first electrical component and the package are both fixed on the first bearing surface; the package includes a first packaging surface and a second packaging surface opposite to each other along the thickness direction of the integrated circuit board, and the first packaging surface is fixedly connected to the first bearing surface; among at least two first electrical components, the first electrical component with the largest thickness dimension includes an upper surface and a lower surface opposite to each other along the thickness direction of the integrated circuit board; the lower surface is fixedly connected to the first bearing surface; in the thickness direction of the integrated circuit board, the distance between the upper surface and the second packaging surface is greater than or equal to 0.05 mm and less than 0.3 mm.

[0013] In the prior art, when components are placed on a flexible board, each component is individually packaged using glue dispensing. This means that each component corresponds to a corresponding encapsulation device, and the height difference between the encapsulation device and the encapsulated component is generally 0.3 mm. In the present application, however, a single package is used to encapsulate all first electrical components, and the height difference between the package and the first electrical components is less than 0.3 mm. Compared to the prior art, the thickness of the package in this embodiment is reduced, thereby facilitating a reduction in the thickness of the integrated circuit board and facilitating the lightweight and thin design of electronic devices.

[0014] In some embodiments, among at least two first electrical components, the first electrical component with the largest width dimension includes a front surface and a rear surface opposite to each other along the width direction of the integrated circuit board; the package includes a first package side and a second package side opposite to each other along the width direction of the integrated circuit board; in the width direction of the integrated circuit board, the distance between the front surface and the first package side is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the rear surface and the second package side is greater than or equal to 0.1 mm and less than 0.6 mm.

[0015] In the prior art, when components are placed on a flexible board, each component is individually encapsulated using glue dispensing. This means that each component corresponds to a corresponding encapsulation device, and the spacing between the encapsulation device and the Y-axis edge of the encapsulated component is generally 0.6 mm. In the present application, however, a single encapsulation device is used to encapsulate all first electrical components, and the spacing between the Y-axis edge of the encapsulation device and the first electrical components is less than 0.6 mm. Compared to the prior art, the width of the encapsulation device in this embodiment is reduced, thereby facilitating a reduction in the width of the integrated circuit board and facilitating a thinner and lighter design for electronic devices.

[0016] In some embodiments, the package includes a first package end and a second package end opposite to each other along the length direction of the integrated circuit board; among at least two first electrical components, the first electrical component closest to the first package end has a left side surface, and the first electrical component closest to the second package end has a right side surface; in the length direction of the integrated circuit board, the distance between the left side surface and the first package end is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the right side surface and the second package end is greater than or equal to 0.1 mm and less than 0.6 mm.

[0017] In the prior art, when components are placed on a flexible board, each component is individually packaged. That is, each component corresponds to a corresponding packaging device, and the spacing between the packaging device and the edge of the packaged component in the X-axis direction is generally 0.6 mm. In the present application, however, a single package is used to package all first electrical components, and the spacing between the package and the edge of the first electrical component in the X-axis direction is less than 0.6 mm. Compared to the prior art, the length of the package in this embodiment is reduced, thereby facilitating a reduction in the length of the integrated circuit board and facilitating a thinner and lighter design for electronic devices.

[0018] In some embodiments, the extension portion includes a second bearing surface, which is connected to the first bearing surface along the length direction of the integrated circuit board; the package includes a second packaging end, the second bearing surface and the second packaging end are adjacent, and there is an angle between the second bearing surface and the second packaging end; the integrated circuit board also includes an adhesive, one side of the adhesive is bonded to the second bearing surface, and the other side of the adhesive is bonded to the second packaging end.

[0019] During the package manufacturing process, liquid material may leak from the bottom of the mold onto the second supporting surface of the extension. This leaked liquid material has an irregular shape and may solidify to form spikes. When the integrated circuit board is used in an electronic device, the extension needs to be bent relative to the package and the main body. At this time, the solidified spikes of the liquid material may puncture the extension. By providing an adhesive with a regular shape, the adhesive does not form spikes, thereby reducing the risk of punctures when the first extension is bent.

[0020] In some embodiments, the extension portion includes two angled extension segments, one of which is fixedly connected to the main body, and the connector and reinforcement plate are located at the end of the other extension segment. The two extension segments form a 90-degree angle, allowing the extension segment to bend to engage the connector with other components.

[0021] In some embodiments, the extension portion includes a first extension portion and a second extension portion, the first extension portion and the second extension portion being respectively fixed to opposite sides of the main portion along the length direction of the integrated circuit board; the reinforcement plate includes a first reinforcement plate and a second reinforcement plate, and the connector includes a first connector and a second connector. The first connector and the first reinforcement plate are respectively disposed on opposite sides of the first extension portion along the thickness direction of the integrated circuit board; the second connector and the second reinforcement plate are respectively disposed on opposite sides of the second extension portion along the thickness direction of the integrated circuit board; in the thickness direction of the integrated circuit board, the projection of the first reinforcement plate on the first extension portion and the projection of the first connector on the first extension portion at least partially overlap; and the projection of the second reinforcement plate on the second extension portion and the projection of the second connector on the second extension portion at least partially overlap. Thus, when the integrated circuit board is applied to a battery, it is convenient to provide the battery with two conductive loops.

[0022] The second aspect of the present application provides a battery module comprising: a battery and the integrated circuit board of the first aspect of the present application, wherein the battery has a positive tab and a negative tab; the integrated circuit board is disposed at the end of the battery, and the positive tab and the negative tab are respectively fixedly connected to a second electrical component, the positive tab and the negative tab are respectively electrically connected to the second electrical component, the second electrical component is electrically connected to the first electrical component, and the first electrical component is electrically connected to a connector. The size of the integrated circuit board is reduced compared to the prior art, and thus the size of the battery module is also reduced compared to the prior art. After the battery module is installed in an electronic device, the space occupied is reduced, which facilitates the lightweight and thin design of the electronic device.

[0023] A third aspect of the present application provides an electronic device comprising a housing, a main circuit board, and the battery module of the second aspect of the present application, wherein the main circuit board and the battery module are both disposed within the housing; the main circuit board is provided with a connector, and the connector and the connector are plugged into each other to form a conductive loop between the positive terminal, the integrated circuit board, the main circuit board, and the negative terminal. The size of the integrated circuit board is reduced compared to the prior art, and thus the size of the battery module is also reduced compared to the prior art. After the battery module is installed in the electronic device, the space occupied is reduced, which facilitates the lightweight and thin design of the electronic device.

[0024] A fourth aspect of the present application provides a method for preparing an integrated circuit board, comprising: providing a flexible substrate, the flexible substrate comprising a flexible circuit board; fixing an auxiliary reinforcing plate to a main body portion so that a projection of the main body portion in the thickness direction of the integrated circuit board is completely located on the auxiliary reinforcing plate; fixing a first electrical component to the main body portion and fixing a connector to an extension portion; fixing a package to the main body portion so that the package completely covers the first electrical component; peeling the auxiliary reinforcing plate from the main body portion; and fixing a second electrical component to the main body portion.

[0025] The integrated circuit board fabrication method provided in this application directly secures the package to a flexible circuit board, eliminating the need for a printed circuit board. This reduces the thickness of the integrated circuit board compared to existing technologies. Furthermore, the length, width, and thickness of the package are all reduced compared to existing technologies, resulting in a smaller overall size for the fabricated integrated circuit board. When used in electronic devices, it occupies less space, contributing to the slimmer design of these electronic devices.

[0026] Furthermore, when the first electrical component is secured to the main body, the auxiliary reinforcement plate is secured to the flexible circuit board. This supports the main body of the flexible circuit board, ensuring it remains flat, preventing any breakage or fracture, and reducing the risk of soldering failure of the first electrical component. When the second electrical component is soldered to the second pad, the auxiliary reinforcement plate is removed, allowing the package to support the main body, facilitating soldering and reducing the risk of soldering failure.

[0027] In some embodiments, securing the package to the main body specifically includes: placing a mold on the flexible substrate, with the side of the main body provided with the first electrical component positioned within the mold; placing raw material in the mold, heating the raw material to form a liquid, and cooling the liquid material to form the package. Specifically, the package is secured to the main body using a molding process, allowing the shape and size of the package to be controlled. This allows the package to completely enclose the first electrical component while also reducing the size of the package, thereby reducing the size of the integrated circuit board.

[0028] In some embodiments, the flexible substrate further includes a redundant board, which is integrally formed with the flexible circuit board. The auxiliary reinforcement board is secured to the main body, specifically by bonding the auxiliary reinforcement board to the redundant board using adhesive. This allows the auxiliary reinforcement board to be formed into the main body while preventing the adhesive from damaging the pads on the main body used to connect electrical components.

[0029] In some embodiments, the flexible substrate includes a plurality of flexible circuit boards; after fixing the second electrical component on the main body, the integrated circuit board preparation method further includes: cutting the flexible substrate to remove redundant boards to form a plurality of integrated circuit boards.

[0030] In a fifth aspect, the present application provides an integrated circuit board, comprising: a flexible circuit board, a first electrical component and a package; the first electrical component is arranged on a side surface of the flexible circuit board; the package is fixed on the flexible circuit board, and the package completely covers the first electrical component; in the thickness direction of the integrated circuit board, the projection of the flexible circuit board is completely located on the package.

[0031] In this application, the thickness of the integrated circuit board's thickest region along the Z-axis is the sum of the thickness of the package and the thickness of the flexible printed circuit board. In contrast, in the first prior art, the integrated circuit board is typically composed of a printed circuit board, a flexible printed circuit board, and a package. In this prior art, the thickness of the integrated circuit board's thickest region along the Z-axis is the sum of the thickness of the printed circuit board and the thickness of the package. Because the printed circuit board's thickness is greater than that of the flexible printed circuit board, the integrated circuit board provided in this application has a reduced thickness compared to the first prior art, facilitating lightweight electronic device design.

[0032] In the second prior art, the thickness of another integrated circuit board is generally calculated as the sum of the thickness of the dot-shaped package and the thickness of the reinforcement plate. In the present application, however, the projection of the main body is located entirely on the package, meaning that the package is integrally formed on the main body. The package provides support, thus eliminating the need for a reinforcement plate. In this application, the thickness of the integrated circuit board is calculated as the sum of the thickness of the package and the thickness of the flexible circuit board. The thickness of the reinforcement plate is greater than that of the flexible circuit board. Therefore, compared to the second prior art, the thickness of the integrated circuit board provided in the present application is reduced, facilitating the lightweight design of electronic equipment.

[0033] In some embodiments, the package is fixed on the flexible circuit board by molding.

[0034] In some embodiments, the number of the first electrical components is at least two; and the package completely covers the at least two first electrical components.

[0035] In some embodiments, the flexible circuit board has a first surface; the first electrical component and the package are both fixed on the first surface; the package includes a first packaging surface and a second packaging surface opposite to each other along the thickness direction of the integrated circuit board, and the first packaging surface is fixedly connected to the first surface; among at least two first electrical components, the first electrical component with the largest thickness dimension includes an upper surface and a lower surface opposite to each other along the thickness direction of the integrated circuit board; the lower surface is fixedly connected to the first surface; in the thickness direction of the integrated circuit board, the distance between the upper surface and the second packaging surface is greater than or equal to 0.05 mm and less than 0.3 mm.

[0036] In some embodiments, among at least two first electrical components, the first electrical component with the largest width dimension includes a front surface and a rear surface opposite to each other along the width direction of the integrated circuit board; the package includes a first package side and a second package side opposite to each other along the width direction of the integrated circuit board; in the width direction of the integrated circuit board, the distance between the front surface and the first package side is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the rear surface and the second package side is greater than or equal to 0.1 mm and less than 0.6 mm.

[0037] In some embodiments, the package includes a first package end and a second package end opposite to each other along the length direction of the integrated circuit board; among at least two first electrical components, the first electrical component closest to the first package end has a left side surface, and the first electrical component closest to the second package end has a right side surface; in the length direction of the integrated circuit board, the distance between the left side surface and the first package end is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the right side surface and the second package end is greater than or equal to 0.1 mm and less than 0.6 mm.

[0038] In some embodiments, the integrated circuit board further includes a second electrical component, and the second electrical component is fixed on a surface of the flexible circuit board facing away from the first electrical component.

[0039] In a sixth aspect, the present application provides a method for preparing an integrated circuit board, comprising: providing a flexible substrate, the flexible substrate comprising a flexible circuit board; fixing an auxiliary reinforcing plate on the flexible circuit board so that the projection of the flexible circuit board is completely located on the auxiliary reinforcing plate in the thickness direction of the integrated circuit board; fixing a first electrical component on the flexible circuit board; fixing a package on the flexible circuit board so that the package completely covers the first electrical component; and peeling the auxiliary reinforcing plate from the flexible circuit board.

[0040] The integrated circuit board fabrication method provided in this application directly secures the package to a flexible circuit board, eliminating the need for a printed circuit board. This reduces the thickness of the integrated circuit board compared to existing technologies. Furthermore, the length, width, and thickness of the package are all reduced compared to existing technologies, resulting in a smaller overall size for the fabricated integrated circuit board. When used in electronic devices, it occupies less space, contributing to the slimmer design of these electronic devices.

[0041] Furthermore, when the first electrical component is attached to the flexible circuit board, the auxiliary reinforcing plate is also attached to the flexible circuit board. This supports the flexible circuit board, ensuring it remains flat, preventing any breakage or fracture, and reducing the risk of soldering failure of the first electrical component. The auxiliary reinforcing plate is then removed to reduce the thickness of the integrated circuit board.

[0042] In some embodiments, the package is fixed on the flexible circuit board, specifically including: placing a mold on the flexible substrate, and making the side of the flexible circuit board provided with the first electrical component located inside the mold; placing raw materials in the mold, heating the raw materials so that the raw materials become liquid materials, and cooling the liquid materials to form a package.

[0043] In some embodiments, the flexible substrate further includes a redundant board, and the redundant board and the flexible circuit board are integrally formed; fixing the auxiliary reinforcement board to the main body specifically includes: bonding the auxiliary reinforcement board to the redundant board using adhesive.

[0044] In some embodiments, after the auxiliary reinforcement plate is peeled off from the flexible circuit board, the integrated circuit board preparation method further includes: fixing a second electrical component on a surface of the flexible circuit board facing away from the first electrical component; the flexible substrate includes a plurality of flexible circuit boards; after the second electrical component is fixed on the flexible circuit board, the integrated circuit board preparation method further includes: cutting the flexible substrate, removing the redundant board, and forming a plurality of integrated circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0046] FIG1 is a schematic structural diagram of a mobile phone provided in the first embodiment of the present application.

[0047] FIG2 is a schematic diagram of the split structure of the mobile phone shown in FIG1 .

[0048] FIG3 is a schematic diagram of the split structure of the battery module of the mobile phone shown in FIG2 .

[0049] FIG4 is a schematic structural diagram of an integrated circuit board of the battery module shown in FIG3 .

[0050] FIG5 is a schematic diagram of a partial structure of the integrated circuit board shown in FIG4.

[0051] FIG. 6 is a schematic structural diagram of the integrated circuit board shown in FIG. 4 from another direction.

[0052] FIG7 is an enlarged schematic diagram of point A in FIG4 .

[0053] FIG8 is an enlarged schematic diagram of point C in FIG6 .

[0054] FIG9 is an enlarged schematic diagram of point B in FIG4 .

[0055] FIG10 is an enlarged schematic diagram of point D in FIG6 .

[0056] FIG11 is a schematic diagram of the process of the integrated circuit board manufacturing method provided in the second embodiment of the present application.

[0057] FIG. 12 is a schematic diagram of step S13 in FIG. 11 from another direction.

[0058] FIG13 is a schematic diagram of a method for preparing an integrated circuit board according to a second embodiment of the present application for simultaneously processing multiple integrated circuit boards.

[0059] FIG14 is a schematic diagram of the split structure of a mobile phone provided in the third embodiment of the present application.

[0060] FIG15 is a schematic diagram of the split structure of the battery module of the mobile phone shown in FIG14 .

[0061] FIG16 is a schematic structural diagram of the integrated circuit board of the battery module shown in FIG14.

[0062] FIG17 is a schematic diagram of the split structure of a part of the structure of the integrated circuit board shown in FIG16.

[0063] FIG18 is a schematic structural diagram of the integrated circuit board shown in FIG16 from another direction.

[0064] FIG19 is a schematic diagram of the process of the integrated circuit board manufacturing method provided in the fourth embodiment of the present application.

[0065] FIG20 is a schematic structural diagram of an integrated circuit board provided in the fifth embodiment of the present application.

[0066] FIG21 is a schematic diagram of the process of the integrated circuit board manufacturing method provided in the sixth embodiment of the present application.

[0067] FIG22 is a schematic structural diagram of an integrated circuit board provided in the seventh embodiment of the present application.

[0068] FIG23 is a schematic diagram of the process of the integrated circuit board preparation method provided in the eighth embodiment of the present application.

[0069] FIG24 is a schematic structural diagram of a wearable device provided in the ninth embodiment of the present application. DETAILED DESCRIPTION

[0070] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0071] The present application provides an electronic device, which includes but is not limited to a cell phone, a notebook computer, a tablet personal computer, a personal digital assistant, a wearable device, or a mobile device.

[0072] Please refer to Figures 1 and 2. Figure 1 is a structural diagram of a mobile phone provided in the first embodiment of the present application, and Figure 2 is a schematic diagram of the split structure of the mobile phone shown in Figure 1.

[0073] In the first embodiment of the present application, the electronic device is described as a mobile phone 1000. For ease of description, the width of the mobile phone 1000 is defined as the X-axis, the length of the mobile phone 1000 is defined as the Y-axis, and the thickness of the mobile phone 1000 is defined as the Z-axis. The X-axis, Y-axis, and Z-axis directions are mutually perpendicular.

[0074] It should be noted that the directional terms such as "up", "down", "left", "right", "front" and "back" used in the embodiment of the present application to describe the mobile phone 1000 are mainly explained based on the display orientation of the mobile phone 1000 in Figures 1 and 2, with the positive direction of the Z axis being "up", the negative direction of the Z axis being "down", the positive direction of the X axis being "right", the negative direction of the X axis being "left", the positive direction of the Y axis being "back", and the negative direction of the Y axis being "front". It does not constitute a limitation on the orientation of the mobile phone 1000 in actual application scenarios.

[0075] The mobile phone 1000 may have one conductive loop, two conductive loops, and so on. Accordingly, the battery of the mobile phone 1000 needs to be provided with one positive electrode ear, two positive electrode ears, and so on; the integrated circuit board for protecting the battery needs to have one extension part, two extension parts, and so on, and each extension part is provided with a corresponding connector. The connector may be a male end of a board-to-board connector, and so on. In one embodiment of the present application, taking the battery as an example of having one positive electrode ear and one negative electrode ear, the positive electrode ear is referred to as the first positive electrode ear, and a first connector is provided on the corresponding integrated circuit board. In another embodiment of the present application, taking the battery as an example of having two positive electrode ears and one negative electrode ear, the two positive electrode ears are respectively the first positive electrode ear and the second positive electrode ear, and a first extension part and a second extension part are provided on the corresponding integrated circuit board, a first connector is provided on the first extension part, and a second connector is provided on the second extension part. The following is a detailed description.

[0076] In the first embodiment of the present application, the mobile phone 1000 includes a main body 100 and a display screen 200 .

[0077] In the first embodiment of the present application, the display screen 200 has a touch function and is used to operate the mobile phone 1000 and display information such as images and videos. The display screen 200 includes a display surface and a mounting surface. The display screen 200 is mounted on the main body 100, with the mounting surface of the display screen 200 facing the main body 100 and the display surface of the display screen 200 facing away from the main body 100.

[0078] In the first embodiment of the present application, the display screen 200 can be an organic light-emitting diode (OLED) display screen 200, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen 200, a mini organic light-emitting diode (MID) display screen 200, a micro organic light-emitting diode (MID) display screen 200, a micro organic light-emitting diode (MID) display screen 200, or a quantum dot light-emitting diode (LED) display screen 200.

[0079] In the first embodiment of the present application, the main body 100 includes a shell 10, a main circuit board 20 and a battery module 30, and the main circuit board 20 and the battery module 30 are both installed inside the shell 10. The main circuit board 20 is integrated with devices such as a first power management chip (not shown), a central processing unit (not shown) and a first connector (not shown). The first connector is the female end of a board-to-board connector (BTB), and the first connector is used to connect to the battery module 30 to achieve electrical connection between the main circuit board 20 and the battery module 30. The first power management chip is used to manage information such as the battery 30A's power level, charging status and brightness of the display screen 200. The central processing unit is used to read and execute instructions so that the mobile phone 1000 can perform functions such as communication, browsing text and video.

[0080] The battery module 30 includes a battery 30A and an integrated circuit board 30B. The integrated circuit board 30B is used to protect the battery 30A. Specifically, the integrated circuit board 30B detects the current and voltage of the battery module 30 and, if the current or voltage exceeds a threshold, disconnects the conductive circuit of the battery 30A, thereby protecting the battery 30A. The battery 30A, the integrated circuit board 30B, and the first power management chip are electrically connected in sequence. The battery 30A supplies power to components such as the central processing unit (not shown) and the display screen 200 through the integrated circuit board 30B and the first power management chip.

[0081] The housing 10 includes a middle frame 11 and a back cover 12. The middle frame 11 includes a middle plate and a frame. The frame surrounds the middle plate and is connected to the middle plate. The middle plate and the frame enclose a receiving cavity, which is used to install components such as the main circuit board 20 and the battery module 30. The back cover 12 is fixed to one side of the frame along the Z-axis direction, and the back cover 12 closes the receiving cavity. The display screen 200 is installed on the side of the middle frame 11 away from the back cover 12. Specifically, the receiving cavity includes a circuit compartment 13 and a battery compartment 14. The circuit compartment 13 and the battery compartment 14 are arranged in sequence along the Y-axis direction. The circuit compartment 13 is used to install the main circuit board 20, and the battery compartment 14 is used to install the battery module 30.

[0082] Refer to FIG3 , which is a schematic diagram of the split structure of the battery module of the mobile phone shown in FIG2 .

[0083] The battery 30A of the battery module 30 includes a housing 31, a bare cell 32, and a wrapping film (not shown). The housing 31 is rectangular and has a first peripheral wall 35 located on one side in the Y-axis direction. The wrapping film covers the outer side of the housing 31.

[0084] The bare cell 32 includes first pole pieces (not shown) and second pole pieces (not shown) alternately stacked along the Z-axis. Separators are provided between adjacent first and second pole pieces to insulate the first and second pole pieces. The first pole piece has a first positive tab 33, and the second pole piece has a negative tab 34. In other embodiments, the first and second pole pieces, along with the separator, can also be wound to form the bare cell 32.

[0085] The bare battery cell 32 is installed in the receiving cavity of the housing 31 , and the first positive tab 33 and the negative tab 34 both extend out of the receiving cavity from the first peripheral wall 35 . The receiving cavity is filled with electrolyte.

[0086] Refer to FIG4 , which is a schematic structural diagram of the integrated circuit board of the battery module shown in FIG3 .

[0087] The integrated circuit board 30B of the battery module 30 includes a flexible printed circuit (FPC) 40, a first electrical component 50, a second electrical component 60, a packaging element 70, a first connector 80, and a first reinforcing plate 81. As will be appreciated, the integrated circuit board 30B is elongated and extends along the X-axis, with the X-axis being the length and the X-axis being the width of the integrated circuit board 30B. The first electrical component 50, the second electrical component 60, and the first connector 80 are all integrated onto the flexible printed circuit 40, and the packaging element 70 is used to encapsulate the first electrical component 50.

[0088] Refer to FIG5 , which is a schematic diagram of a partial structure of the integrated circuit board shown in FIG4 .

[0089] The flexible circuit board 40 is a rectangular sheet having a first surface 401 and a second surface 402 facing each other along the Z-axis. The first surface 401 includes a first supporting surface 403 and a second supporting surface 404 connected in sequence along the X-axis. The second surface 402 includes a third supporting surface 405 and a fourth supporting surface 406 connected in sequence along the X-axis.

[0090] 5 and 6 , FIG6 is a schematic structural diagram of the integrated circuit board shown in FIG4 in another direction.

[0091] The flexible circuit board 40 includes a main body 41 and a first extension 42, connected in sequence along the X-axis. A first bearing surface 403 and a third bearing surface 405 are located on opposite sides of the main body 41 along the Z-axis, while a second bearing surface 404 and a fourth bearing surface 406 are located on opposite sides of the first extension 42 along the Z-axis. The first extension 42 includes a first extension section and a second extension section, which are connected at an angle. Specifically, the first and second extension sections can be connected at a 90-degree angle. The end of the first extension section, distal from the second extension section, is connected to the main body 41.

[0092] Referring to Figure 4, the first electrical component 50 is an electronic component integrated on the first bearing surface 403, and the second electrical component 60 is an electronic component integrated on the third bearing surface 405. The first electrical component 50 includes a first current detection element 51 and a first protection unit. The number of the first protection units can be one or two. The first protection unit includes a first detection chip 52 and a first switching element 53. The first current detection element 51 is a resistor, and the first switching element 53 is a P-type or N-type metal-oxide-semiconductor field-effect transistor (MOS). Multiple first electrical components 50 can be electrically connected through the copper foil circuit layer on the main body 41, and the first electrical component 50 does not need to contact other external devices. The first electrical component 50 can also include an anti-counterfeiting chip 54, which is used to identify whether the battery module 30 is a genuine product.

[0093] Referring to Figure 4 , the second electrical component 60 includes a first positive connector 61 and a negative connector 62, both of which are nickel sheets. The first positive connector 61 is used to securely connect to the first positive tab 33 of the battery 30A, while the negative connector 62 is used to securely connect to the negative tab 34 of the battery 30A. Therefore, both the first positive connector 61 and the negative connector 62 must be exposed.

[0094] Referring to Figures 4 and 5 , the encapsulation 70 is a rigid component made of an insulating material such as epoxy resin. The encapsulation 70 is laminated onto the first supporting surface 403 of the main body 41 of the flexible printed circuit board 40 and covers the first electrical component 50. Because the first electrical component 50 does not need to come into contact with other external components, the encapsulation 70 protects it. In the Z-axis, the main body 41's projection is completely positioned on the encapsulation 70. In other words, the encapsulation 70 covers the main body 41 as a whole, providing support for the main body 41.

[0095] 5 , the package 70 has a first package surface 71 and a second package surface 72 opposite to each other along the Z-axis direction, a first package side 73 and a second package side 74 opposite to each other along the Y-axis direction, and a first package end 75 and a second package end 76 opposite to each other along the X-axis direction.

[0096] The first packaging surface 71 of the package 70 is directly and securely connected to the first supporting surface 403 of the flexible printed circuit board 40, enabling the package 70 to support the main body 41. The package 70 enclosing the first electrical component 50 can be understood as follows: the first electrical component 50 extends from the first packaging surface 71 into the interior of the package 70, with no gap between the first electrical component 50 and the package 70, i.e., the first electrical component 50 is embedded within the package 70. More specifically, in the thickness direction of the integrated circuit board 30B, the thickness of the package 70 is greater than the thickness of the first electrical component 50; in the width direction of the integrated circuit board 30B, the width of the package 70 is greater than the width of the first electrical component 50; and in the length direction of the integrated circuit board 30B, the distance from the left side 505 of the leftmost first electrical component 50 to the right side 506 of the rightmost first electrical component 50 is less than the length of the package 70. In other words, the package 70 also protects the first electrical component 50.

[0097] In the first embodiment of the present application, the package 70 is fixed to the main body 41 by molding. This allows for controllable dimensions of the package 70, making it smaller and reducing the size of the integrated circuit board. Furthermore, there are multiple first electrical components 50, specifically including a first current-sensing element 51, a first detection chip 52, and a first switching element 53. Compared to the prior art method of individually packaging each first electrical component on a flexible circuit board in a dot-like manner, molded packaging allows all first electrical components 50 to be packaged simultaneously within a single package, reducing packaging complexity and improving packaging efficiency.

[0098] Referring to Figures 5 and 7, Figure 7 is an enlarged schematic diagram of point A in Figure 4. Among the multiple first electrical components 50, the thickest first electrical component 50 includes an upper surface 501 and a lower surface 502 that face each other along the Z-axis. The lower surface 502 is fixedly connected to the first supporting surface 403. In the Z-axis, the distance between the upper surface 501 and the first supporting surface 403 is less than the distance between the second packaging surface 72 and the first supporting surface 403. As a result, the packaging 70 completely covers all of the first electrical components 50 in the Z-axis.

[0099] Furthermore, after molding, the shape of the package 70 is controllable, so the size of the package 70 is reduced compared to the prior art. Specifically, in the Z-axis direction, the distance between the upper surface 501 and the second packaging surface 72 is greater than or equal to 0.05 mm and less than 0.3 mm. The distance between the upper surface 501 and the second packaging surface 72 can specifically be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.13 mm, 0.15 mm, 0.18 mm, 0.21 mm, 0.25 mm, 0.28 mm, 0.29 mm, etc. In the prior art, when components are provided on a flexible board, each component is packaged separately, that is, each component corresponds to a device for packaging, and the height difference between the device for packaging and the packaged component is generally 0.3 mm. In the present application, a package 70 is used to package all the first electrical components 50. The height difference between the package 70 and the first electrical components 50 is less than 0.3 mm. Compared with the prior art, the thickness of the package 70 in the first embodiment of the present application is reduced, which is beneficial to reducing the thickness of the integrated circuit board 30B and facilitating the lightweight design of electronic equipment.

[0100] Among the multiple first electrical components 50, referring to Figures 6 and 8, Figure 8 is an enlarged schematic diagram of point C in Figure 6. The first electrical component 50 with the largest width includes a front surface 503 and a rear surface 504 that face each other along the Y-axis. The package 70 includes a first package side 73 and a second package side 74 that face each other along the width of the integrated circuit board 30B. In the Y-axis direction, the distance between the front surface 503 and the first package side 73 is greater than or equal to 0.1 mm and less than 0.6 mm. The distance between the front surface 503 and the first package side 73 can be 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.21 mm, 0.24 mm, 0.27 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.48 mm, 0.51 mm, 0.53 mm, 0.55 mm, 0.57 mm, 0.59 mm, and so on. The distance between the rear surface 504 and the second package side 74 is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the rear surface 504 and the second package side 74 can specifically be 0.1 mm, 0.11 mm, 0.14 mm, 0.17 mm, 0.2 mm, 0.23 mm, 0.26 mm, 0.3 mm, 0.37 mm, 0.4 mm, 0.44 mm, 0.49 mm, 0.5 mm, 0.52 mm, 0.55 mm, 0.57 mm, 0.59 mm, etc.

[0101] As a result, the package 70 completely covers all first electrical components 50 in the Y-axis direction. Furthermore, in the prior art, when components are placed on a flexible board, each component is individually packaged, meaning each component corresponds to a device for packaging, and the spacing between the device for packaging and the edge of the packaged component in the Y-axis direction is generally 0.6 mm. In the present application, however, a single package 70 is used to package all first electrical components 50, and the spacing between the package 70 and the edge of the first electrical component 50 in the Y-axis direction is less than 0.6 mm. Compared to the prior art, the width of the package 70 in the first embodiment of the present application is reduced, thereby facilitating a reduction in the width of the integrated circuit board 30B and facilitating a thinner and lighter design for electronic devices.

[0102] Among the plurality of first electrical components 50, referring to Figures 7 and 8, the first electrical component 50 closest to the first package end 75 has a left side surface 505. The package 70 includes a first package end 75 and a second package end 76 that are opposite to each other along the X-axis. In the X-axis direction, the distance between the left side surface 505 and the first package end 75 is greater than or equal to 0.1 mm and less than 0.6 mm. The distance between the left side surface 505 and the first package end 75 can be 0.1 mm, 0.13 mm, 0.16 mm, 0.19 mm, 0.2 mm, 0.23 mm, 0.27 mm, 0.3 mm, 0.34 mm, 0.42 mm, 0.45 mm, 0.48 mm, 0.5 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, etc.

[0103] Referring to Figures 9 and 10, Figure 9 is an enlarged schematic diagram of point B in Figure 4, and Figure 10 is an enlarged schematic diagram of point D in Figure 6. The first electrical component 50 closest to the second package end 76 has a right side surface 506. The distance between the right side surface 506 and the second package end 76 is greater than or equal to 0.1 mm and less than 0.6 mm. The distance between the right side surface 506 and the second package end 76 can be 0.1 mm, 0.13 mm, 0.16 mm, 0.19 mm, 0.2 mm, 0.25 mm, 0.28 mm, 0.3 mm, 0.34 mm, 0.42 mm, 0.45 mm, 0.48 mm, 0.5 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, etc.

[0104] As a result, the package 70 completely encapsulates all first electrical components 50 in the X-axis direction. Furthermore, in the prior art, when components are placed on a flexible board, each component is individually packaged. That is, each component corresponds to a corresponding packaging device, and the spacing between the packaging device and the X-axis edge of the packaged component is generally 0.6 mm. In the present application, however, a single package 70 is used to encapsulate all first electrical components 50. The spacing between the package 70 and the X-axis edge of the first electrical component 50 is less than 0.6 mm. Compared to the prior art, the length of the package 70 in the first embodiment of the present application is reduced, thereby facilitating a reduction in the length of the integrated circuit board 30B and facilitating a slimmer and lighter design for the electronic device.

[0105] After the package 70 is encapsulated on the main body 41, the main body 41 and the package 70 form a single unitary structure, supporting the main body 41 and protecting the first electrical component 50. Furthermore, the projection of the second electrical component 60 in the Z-axis direction is completely located on the package 70, meaning that the package 70 also supports the second electrical component 60. At this point, the first extension 42 remains flexible and can bend relative to the package 70 and the main body 41.

[0106] In the first embodiment of the present application, referring to Figures 4, 5, and 9, a first adhesive 84 is provided between the second package end 76 of the package 70 and the second bearing surface 404 of the first extension 42. The cross-sectional shape of the first adhesive 84 is triangular. The first adhesive 84 has a first adhesive surface 86, a second adhesive surface 87, and a first connecting surface 88. The first adhesive surface 86, the second adhesive surface 87, and the first connecting surface 88 are sequentially connected end to end. The first adhesive surface 86 is bonded to the package 70, and the second adhesive surface 87 is bonded to the first extension 42.

[0107] Typically, the package 70 is prepared on the main body 41 by molding. That is, the main body 41 is placed in a mold, and then a raw material is placed in the mold. The raw material is heated to form a liquid material, and the liquid material is cooled to form the package 70. The raw material here is a granular material composed of epoxy resin and a curing agent.

[0108] After the liquid material is injected into the mold, it may leak from the bottom of the mold onto the second supporting surface 404 of the first extension portion 42. The leaked liquid material has an irregular shape and may solidify to form spikes. When the integrated circuit board 30B is used in an electronic device, the first extension portion 42 needs to be bent relative to the package 70 and the main body 41. At this time, the solidified spikes of the liquid material may puncture the first extension portion 42. In the first embodiment of the present application, by providing a first adhesive 84 between the package 70 and the first extension portion 42, the first adhesive 84 has a regular shape and does not form spikes, thereby reducing the risk of punctures when the first extension portion 42 is bent.

[0109] In the first embodiment of the present application, the first connector 80 is integrated onto the second supporting surface 404 of the flexible printed circuit board 40, and the first reinforcement plate 81 is fixed to the fourth supporting surface 406. More specifically, the first connector 80 is integrated onto the end of the second extension section away from the first extension section, and the first reinforcement plate 81 is used to support the plug-in connector. The first connector 80 is the male end of the board-to-board connector. The first connector 80 is used to intermate with the first plug-in connector provided on the main printed circuit board 20, which is the female end of the board-to-board connector. The first extension portion 42 is bendable and can bend relative to the package 70 and the main body 41 to enable the first connector 80 on the first extension portion 42 to intermate with the first plug-in connector on the main printed circuit board 20. In other embodiments, the first connector 80 is integrated onto the fourth supporting surface 406 of the flexible printed circuit board 40, and the first reinforcement plate 81 is fixed to the second supporting surface 404.

[0110] In the first embodiment of the present application, the thickness of the integrated circuit board 30B along the Z-axis is the sum of the thicknesses of the package 70, the flexible circuit board 40, and the second electrical component 60. In the first prior art, the integrated circuit board 30B is typically composed of a printed circuit board (PCB), the flexible circuit board 40, and the package 70. In the first prior art, the thickness of the integrated circuit board 30B along the Z-axis is the sum of the thicknesses of the PCB, the package 70, and the electrical components. Because the PCB is thicker than the flexible circuit board 40, the thickness of the integrated circuit board 30B provided in this embodiment is reduced compared to the first prior art, facilitating a lightweight design for electronic devices.

[0111] In the second prior art, the thickness of another integrated circuit board is generally the sum of the thickness of the dot-shaped package, the thickness of the reinforcement plate, and the thickness of the electrical components. In the present application, however, the projection of the main body 41 is completely located on the package 70, meaning that the package 70 is integrally formed on the main body. The package 70 can provide support, thus eliminating the need for a reinforcement plate. In this application, the thickness of the integrated circuit board is the sum of the thickness of the package 70, the thickness of the flexible circuit board 40, and the thickness of the second electrical component 60. The thickness of the reinforcement plate is greater than that of the flexible circuit board. Therefore, compared to the second prior art, the thickness of the integrated circuit board provided in the present application is reduced, facilitating the lightweight design of electronic equipment.

[0112] In the first embodiment of the present application, referring to Figures 3 and 5, the integrated circuit board 30B is installed on the first peripheral wall 35 of the battery 30A, and the first positive electrode ear 33 of the battery 30A is fixedly connected to the first positive electrode connector 61 on the integrated circuit board 30B, and the negative electrode ear 34 of the battery 30A is fixedly connected to the negative electrode connector 62 on the integrated circuit board 30B.

[0113] Referring to Figures 2, 3, and 5, the battery module 30 is installed in the battery compartment 14, and the main circuit board 20 is installed in the circuit compartment 13. The first extension portion 42 is bent relative to the packaging member 70 and the main body 41, allowing the first connector on the main circuit board 20 to plug into the first connector 80 on the integrated circuit board 30B, thereby establishing an electrical connection between the battery module 30 and the main circuit board 20. Thus, the first positive tab 33 of the battery 30A, the integrated circuit board 30B, the first power management chip, and the negative tab 34 of the battery 30A form a conductive circuit that can power components such as the display screen 200 and the central processing unit, allowing the mobile phone 1000 to function normally.

[0114] More specifically, the first positive tab 33 of the battery 30A, the first positive connector 61, the first current-sensing element 51, the first switch element 53, the first connector 80, the first power management chip, and the negative tab 34 of the battery 30A are electrically connected in sequence to form a conductive loop. A first detection chip 52 is electrically connected to the first end of the first current-sensing element 51, the second end of the first current-sensing element 51, the first switch element 53, and the ground terminal, respectively. The first detection chip 52 is configured to detect the current flowing through the first current-sensing element 51 and the voltage of the battery 30A. The current flowing through the first current-sensing element 51 represents the current of the battery 30A. If the current or voltage of the battery 30A exceeds a threshold, the first detection chip 52 controls the first switch element 53 to turn off, thereby deactivating the conductive loop between the first positive tab 33 and the negative tab 34 of the battery 30A.

[0115] 11 and 12 , FIG. 11 is a schematic diagram of the process of the integrated circuit board manufacturing method provided by the second embodiment of the present application, and FIG. 12 is a schematic diagram of step S13 in FIG. 11 from another direction.

[0116] A second embodiment of the present application provides a method for preparing an integrated circuit board, which is used to prepare the integrated circuit board 30B of the first embodiment. The method for preparing the integrated circuit board includes the following steps.

[0117] Step S10: Providing a flexible substrate 91. The flexible substrate 91 includes a flexible circuit board 40, which includes a main body 41 and a first extension 42 connected in sequence. The main body 41 is provided with a first solder pad 44 and a second solder pad 45, which are located on opposite sides of the main body 41. The first extension 42 is provided with a first connecting pad 46 and a first reinforcing plate 81, which are located on opposite sides of the first extension 42.

[0118] It can be understood that the first pad 44, the second pad 45, and the first connection pad 46 are all components pre-layouted on the flexible substrate 91. The electrical connection relationship between each component has been set according to actual needs.

[0119] Specifically, the first pad 44 is located on the first bearing surface 403, and the second pad 45 is located on the third bearing surface 405. There are multiple first pads 44 and second pads 45, and the number of first pads 44 is the same as the number of first electrical components 50 to be installed, and the number of second pads 45 is the same as the number of second electrical components 60 to be installed. The first connecting pad 46 is located on the second bearing surface 404, and the first reinforcing plate 81 is located on the fourth bearing surface 406.

[0120] Step S11: Secure the auxiliary reinforcing plate 90 to the main body 41 so that the projection of the main body 41 in the thickness direction of the integrated circuit board is completely located on the auxiliary reinforcing plate 90. Specifically, the auxiliary reinforcing plate 90 is secured to the side surface of the main body 41 where the second solder pads 45 are located. In other words, the auxiliary reinforcing plate 90 is secured to the third supporting surface 405. At this point, the orthographic projections of the first and second solder pads 44, 45 in the Z-axis direction are completely located on the auxiliary reinforcing plate 90, meaning that the auxiliary reinforcing plate 90 can support all of the first and second solder pads 44, 45.

[0121] Specifically, the flexible substrate 91 also includes a redundant plate 92 integrally formed with the flexible circuit board 40. The auxiliary reinforcing plate 90 is placed on the side surface of the main body 41 where the second solder pads 45 are located, so that the auxiliary reinforcing plate 90 covers both the redundant plate 92 and the flexible circuit board 40. The auxiliary reinforcing plate 90 is then bonded to the redundant plate 92 using adhesive 93. Specifically, the area of ​​the auxiliary reinforcing plate 90 needs to be larger than that of the flexible circuit board 40 so that it covers both the flexible circuit board 40 and the redundant plate 92. This ensures that the auxiliary reinforcing plate 90 is securely fixed to the third supporting surface 405 while preventing the adhesive 93 from damaging the second solder pads 45.

[0122] Step S12: Fix the first electrical component 50 to the main body 41 and the first connector 80 to the first extension 42. Specifically, the first electrical component 50 is soldered to the first solder pad 44, and the first connector 80 is soldered to the first connection pad 46. Specifically, the first electrical component 50 and the first connector 80 can be assembled using surface mount technology (SMT).

[0123] Step S13: Place the package 70 on the main body 41 so that the package 70 completely covers the first electrical component 50. The package 70 is specifically secured to the first supporting surface 403 in the following manner: a mold is provided and placed on the flexible substrate 91, with the first supporting surface 403 of the main body 41 located within the mold; raw materials are placed in the mold and heated to form a liquid material. Once the liquid material solidifies, the package 70 is formed. The package 70 can be made of epoxy resin, which is a granular material composed of epoxy resin and a curing agent. The area of ​​the package 70 needs to be larger than that of the first supporting surface 403 so that the package 70 completely covers the first electrical component 50. The area of ​​the package 70 should be smaller than that of the auxiliary reinforcement plate 90 to provide support during the molding process of the package 70. The area of ​​the package 70 here refers to the area of ​​the surface of the package 70 perpendicular to the Z-axis. The area of ​​the auxiliary reinforcing plate 90 refers to the area of ​​the surface of the auxiliary reinforcing plate 90 perpendicular to the Z-axis direction.

[0124] Step S14: peeling the auxiliary reinforcing plate 90 from the main body 41. Specifically, the auxiliary reinforcing plate 90 can be peeled from the flexible substrate 91 using a laser.

[0125] Step S15: Fix the second electrical component 60 to the main body. Specifically, the second electrical component 60 is soldered to the second pad 45. Specifically, the second electrical component 60 can be assembled using surface mount technology.

[0126] Step S16 : disposing a first adhesive 84 between the packaging component 70 and the first extension portion 42 .

[0127] It is understood that after the first adhesive 84 is set, the redundant board 92 and the flexible circuit board 40 can be cut apart to form the integrated circuit board 30B. At this time, the portion of the package 70 that is larger than the first carrying surface 403 is also cut apart.

[0128] Refer to FIG. 13 , which is a schematic diagram of a method for preparing an integrated circuit board according to a second embodiment of the present application for simultaneously processing multiple integrated circuit boards.

[0129] It is understood that the above-described integrated circuit board fabrication method can simultaneously process multiple integrated circuit boards 30B. For example, a relatively large flexible substrate 91 is provided, having multiple rows of first solder pads 44. The number of first solder pads 44 in each row is equal to the number of first electrical components 50 on an integrated circuit board 30B, and each row of first solder pads 44 corresponds to a corresponding first connection pad 46. In other words, the flexible substrate 91 includes multiple flexible circuit boards 40. Therefore, after soldering the second electrical component 60 to the second solder pad 45, the integrated circuit board fabrication method provided in this embodiment further includes cutting the flexible substrate 91 to remove the redundant pads 92 to form multiple integrated circuit boards 30B. This allows for simultaneous processing of multiple integrated circuit boards 30B, improving processing efficiency.

[0130] Taking the simultaneous processing of 16 integrated circuit boards 30B as an example, the flexible substrate 91 comprises a first portion and a second portion arranged sequentially along the X-axis. The first portion comprises eight flexible circuit boards 40 arranged sequentially along the Y-axis. Within the first portion, the two first soldering pads of any two adjacent flexible circuit boards 40 are staggered in the X-axis. The second portion comprises eight flexible circuit boards 40 arranged sequentially along the Y-axis. Within the second portion, the two first connection pads 46 of any two adjacent flexible circuit boards 40 are staggered in the X-axis. This saves material and allows a larger number of flexible circuit boards 40 to be mounted on the flexible substrate 91.

[0131] Regardless of the number of flexible circuit boards 40 disposed on the flexible substrate 91, when the encapsulation member 70 is provided, the encapsulation member 70 only covers the first supporting surfaces 403 of each flexible circuit board 40. If the first supporting surfaces 403 of the flexible circuit boards 40 on the flexible substrate 91 are arranged continuously, a single encapsulation member 70 can cover the first supporting surfaces 403 of multiple flexible circuit boards 40. If the first supporting surfaces 403 of the flexible circuit boards 40 on the flexible substrate 91 are arranged at intervals, multiple encapsulation members 70 can be provided accordingly. For example, one encapsulation member 70 covers the first supporting surfaces 403 of the eight flexible circuit boards 40 in the first section. Another encapsulation member 70 covers the first supporting surfaces 403 of the eight flexible circuit boards 40 in the second section.

[0132] In the integrated circuit board manufacturing method provided in this embodiment, the package 70 is directly fixed to the main body 41 by molding, so that the package 70 supports the main body 41 and the second electrical component 60 and protects the first electrical component 50.

[0133] Compared to the prior art, the integrated circuit board 30B includes a flexible board, a second device is arranged at the bottom of the flexible board, a printed circuit board is arranged on the top of the flexible board, and then a first device is arranged on the top of the printed circuit board, and then the first device is packaged using a device for packaging. In the prior art, the first device is soldered to the bottom of the flexible board, the printed circuit board is soldered to the top of the flexible board, and the first device is soldered to the top of the printed circuit board, requiring a total of three SMT operations. In this embodiment, the first electrical component 50 is directly soldered to the first bearing surface 403 of the main body 41, and the second electrical component 60 is directly soldered to the third bearing surface 405 of the main body 41, requiring a total of two SMT operations. Compared to the prior art, this embodiment reduces the number of SMT operations and simplifies the preparation process.

[0134] Furthermore, in the integrated circuit board 30B manufactured in this embodiment, the package 70 directly encapsulates all first electrical components 50 on the main body 41. The length, width, and thickness of the package 70 are reduced compared to the prior art, thereby reducing the length, width, and thickness of the integrated circuit board 30B compared to the prior art, thereby facilitating a slimmer and lighter design for the electronic device.

[0135] In this embodiment, the thickness of the thickest region of the processed integrated circuit board 30B along the Z-axis is the sum of the thicknesses of the package 70, the flexible circuit board 40, and the second electrical component 60. In the prior art, the integrated circuit board 30B is typically composed of a printed circuit board (PCB), the flexible circuit board 40, and the package 70. In the prior art, the thickness of the thickest region of the integrated circuit board 30B along the Z-axis is the sum of the thicknesses of the PCB, the thickness of the package 70, and the thickness of the electrical components. Because the thickness of the PCB is greater than that of the flexible circuit board 40, the thickness of the integrated circuit board 30B produced in this embodiment is reduced compared to the prior art, facilitating the lightweight design of electronic devices.

[0136] Furthermore, when the first electrical component 50 is soldered to the first solder pad 44, the auxiliary reinforcing plate 90 is fixed to the flexible printed circuit board 40. This supports the main body 41 of the flexible printed circuit board 40, ensuring that the main body 41 remains flat, preventing any broken lines on the main body 41 and reducing the risk of soldering failure of the first electrical component 50. When the second electrical component 60 is soldered to the second solder pad 45, the package 70 supports the main body 41, facilitating soldering of the second electrical component 60 and reducing the risk of soldering failure of the second electrical component.

[0137] A third embodiment of the present application provides an electronic device, which is a mobile phone. The mobile phone includes a display screen and a main body.

[0138] Refer to Figure 14, which is a schematic diagram of the split structure of a mobile phone provided in the third embodiment of the present application.

[0139] In this embodiment, the main body includes a housing, a main circuit board 20, and a battery module 30, and the main circuit board 20 and the battery module 30 are both installed inside the housing. The main circuit board 20 integrates a first power management chip (not shown), a second power management chip, a central processing unit (not shown), a first connector 80, and a second connector. The first connector and the second connector are both female ends of a board-to-board connector. The first connector and the second connector are both used to connect to the battery module 30 to achieve electrical connection between the main circuit board 20 and the battery module 30. The first power management chip and the second power management chip are both used to manage information such as the battery 30A's power level, charging status, and display brightness.

[0140] The battery module 30 includes a battery 30A and an integrated circuit board 30B. The battery 30A, integrated circuit board 30B, and first power management chip are electrically connected in sequence. The battery 30A supplies power to components such as a central processing unit (CPU) (not shown) and a display screen via the integrated circuit board 30B and the first power management chip. The battery 30A, integrated circuit board 30B, and second power management chip are electrically connected in sequence. The battery 30A supplies power to components such as a CPU (not shown) and a display screen via the integrated circuit board 30B and the second power management chip.

[0141] The housing includes a middle frame 11 and a back cover. The middle frame 11 comprises a center plate and a frame, which together form a housing cavity. The back cover is fixed to one side of the frame along the Z axis and seals the housing cavity. The display is mounted on the side of the middle frame 11 facing away from the back cover. Specifically, the housing cavity includes a circuit compartment 13 for mounting the main circuit board 20 and a battery compartment 14 for mounting the battery module 30.

[0142] Refer to FIG15 , which is a schematic diagram of the split structure of the battery module of the mobile phone shown in FIG14 .

[0143] The battery 30A of the battery module 30 includes a housing 31 and a bare cell 32. The bare cell 32 includes a first electrode sheet (not shown) and a second electrode sheet (not shown). A separator is provided between adjacent first and second electrode sheets to insulate the first and second electrode sheets. The first electrode sheet has a first positive electrode tab 33 and a second positive electrode tab 36, and the second electrode sheet has a negative electrode tab 34. In other embodiments, the first electrode sheet, the second electrode sheet, and the separator can also be wound into a bare cell 32.

[0144] The bare cell 32 is installed in the receiving cavity of the housing 31 , and the first positive tab 33 , the second positive tab 36 and the negative tab 34 all extend out of the receiving cavity from the first peripheral wall 35 . The receiving cavity is filled with electrolyte.

[0145] Refer to FIG16 , which is a schematic structural diagram of the integrated circuit board of the battery module shown in FIG14 .

[0146] The integrated circuit board 30B of the battery module 30 includes a flexible printed circuit 40 (FPC), a first electrical component 50 , a second electrical component 60 , a packaging component 70 , a first connector 80 , a second connector 82 , a first reinforcing plate 81 , and a second reinforcing plate 83 .

[0147] Refer to FIG17 , which is a schematic diagram of the split structure of a portion of the integrated circuit board shown in FIG16 .

[0148] The flexible circuit board 40 is a rectangular sheet having a first surface 401 and a second surface 402 facing each other along the Z-axis. The first surface 401 includes a first supporting surface 403, a second supporting surface 404, and a fifth supporting surface 407. The fifth supporting surface 407, the first supporting surface 403, and the second supporting surface 404 are sequentially connected along the X-axis. The second surface 402 includes a third supporting surface 405, a fourth supporting surface 406, and a sixth supporting surface 408. The sixth supporting surface 408, the third supporting surface 405, and the fourth supporting surface 406 are sequentially connected along the X-axis.

[0149] The flexible circuit board 40 includes a main body 41, a first extension 42, and a second extension 43. The second extension 43, main body 41, and first extension 42 are sequentially connected along the X-axis. A first bearing surface 403 and a third bearing surface 405 are located on opposite sides of the main body 41 along the Z-axis. A second bearing surface 404 and a fourth bearing surface 406 are located on opposite sides of the first extension 42 along the Z-axis. A fifth bearing surface 407 and a sixth bearing surface 408 are located on opposite sides of the second extension 43 along the Z-axis.

[0150] Refer to FIG18 , which is a schematic structural diagram of the integrated circuit board shown in FIG16 in another direction.

[0151] The first extension portion 42 includes a first extension section and a second extension section, connected at an angle to each other. The end of the first extension section away from the second extension section is connected to the main body, and the first connector 80 is disposed at the end of the second extension section away from the first extension section. The second extension portion 43 includes a third extension section and a fourth extension section, connected at an angle to each other. The end of the third extension section away from the fourth extension section is connected to the main body, and the second connector 82 is disposed at the end of the fourth extension section away from the third extension section.

[0152] Referring to Figure 16 , the first electrical component 50 is an electronic device integrated on the first carrying surface 403, and the second electrical component 60 is an electronic device integrated on the third carrying surface 405. The first electrical component 50 includes a first current-sensing element 51, a second current-sensing element 55, a first protection unit, and a second protection unit. The first protection unit includes a first detection chip 52 and a first switch element 53. The second protection unit includes a second detection chip 56 and a second switch element 57.

[0153] The second electrical component 60 includes a first positive electrode connector 61 , a second positive electrode connector 63 , and a negative electrode connector 62 . The second positive electrode connector 63 is used to connect to the second positive electrode tab 36 .

[0154] Referring to Figure 17 , package 70 is a rigid component made of an insulating material such as epoxy resin. Package 70 is laminated onto first supporting surface 403 of main body 41 of flexible printed circuit board 40 and encapsulates first electrical component 50. Package 70 has a first packaging surface 71 and a second packaging surface 72 facing each other along the Z-axis, a first packaging side 73 and a second packaging side 74 facing each other along the Y-axis, and first packaging ends 75 and second packaging ends 76 facing each other along the X-axis. The shape, dimensions, connection method of package 70 to main body 41, and positional relationship of package 70 to first electrical component 50 are similar to those described in the first embodiment.

[0155] The first connector 80 is integrated onto the second bearing surface 404 of the first extension 42. The second connector 82 is integrated onto the fifth bearing surface 407 of the second extension 43. The second connector 82 is the male end of the board-to-board connector. The second connector 82 is configured to mate with the second connector provided on the main circuit board 20. The second connector is the female end of the board-to-board connector.

[0156] After the package 70 is encapsulated on the main body 41, the main body 41 and the package 70 become a single unitary structure, supporting the main body 41 and protecting the first electrical component 50. Furthermore, the projection of the second electrical component 60 in the Z-axis direction is completely located on the package 70, meaning that the package 70 also supports the second electrical component 60. At this point, the first extension 42 remains flexible and can bend relative to the package 70 and the main body 41. The second extension 43 remains flexible and can bend relative to the package 70 and the main body 41.

[0157] 16 , a first adhesive 84 is provided between the second packaging end 76 of the packaging component 70 and the second supporting surface 404 of the first extension portion 42. The shape and connection method of the first adhesive 84 are the same as those of the first embodiment.

[0158] In this embodiment, referring to FIG16 , a second adhesive 85 is provided between the first packaging end 75 of the packaging element 70 and the fifth supporting surface 407 of the second extension portion 43. The cross-section of the second adhesive 85 is triangular. The second adhesive 85 has a third adhesive surface, a fourth adhesive surface, and a second connecting surface, which are connected end to end. The third adhesive surface is bonded to the packaging element 70, and the fourth adhesive surface is bonded to the second extension portion 43. The shape of the second adhesive 85 is relatively regular and does not produce sharp spikes, thereby reducing the risk of injury when the second extension portion 43 is bent.

[0159] In this embodiment, the first connector 80 is integrated onto the second bearing surface 404 of the first extension portion 42, and the first reinforcement plate 81 is fixed to the fourth bearing surface 406. The second connector 82 is integrated onto the fifth bearing surface 407 of the second extension portion 43, and the second reinforcement plate 83 is integrated onto the sixth bearing surface 408 of the second extension portion 43. In other embodiments, the second connector 82 is integrated onto the sixth bearing surface 408 of the second extension portion 43, and the second reinforcement plate 83 is integrated onto the fifth bearing surface 407 of the second extension portion 43.

[0160] In this embodiment, the thickness dimension of the integrated circuit board 30B along the Z-axis direction is smaller than the thickness dimension of the circuit board in the prior art, and the length, width and thickness of the package 70 are all smaller than the length, width and thickness of the package device in the prior art. Therefore, the length, width and thickness of the integrated circuit board 30B are further reduced compared with the prior art, which is conducive to the lightweight design of electronic equipment.

[0161] In this embodiment, the integrated circuit board 30B is installed on the first peripheral wall 35 of the battery 30A, and the first positive electrode ear 33 of the battery 30A is fixedly connected to the first positive electrode connector 61 on the integrated circuit board 30B, the second positive electrode ear 36 of the battery 30A is fixedly connected to the second positive electrode connector 63 on the integrated circuit board 30B, and the negative electrode ear 34 of the battery 30A is fixedly connected to the negative electrode connector 62 on the integrated circuit board 30B.

[0162] The battery module 30 is installed in the battery compartment 14, and the main circuit board 20 is installed in the circuit compartment 13. The first extension portion 42 is bent relative to the main body 41 and the packaging member 70, allowing the first connector on the main circuit board 20 to plug into the first connector 80 on the integrated circuit board 30B, thus establishing an electrical connection between the battery module 30 and the main circuit board 20. Thus, the first positive tab 33 of the battery 30A, the integrated circuit board 30B, the first power management chip, and the negative tab 34 of the battery 30A form a conductive circuit that can power components such as the display and the central processing unit, ensuring the normal operation of the mobile phone.

[0163] The second extension 43 folds outward relative to the main body 41 and the packaging 70, allowing the second connector on the main circuit board 20 to plug into the second connector 82 on the integrated circuit board 30B, thereby electrically connecting the battery module 30 to the main circuit board 20. Thus, the second positive tab 36 of the battery 30A, the integrated circuit board 30B, the second power management chip, and the negative tab 34 of the battery 30A form a conductive loop that can power components such as the display screen and the central processing unit, allowing the mobile phone to operate normally. More specifically, the second positive tab 36 of the battery 30A, the second positive connector 63, the second current-sensing element 55, the second switching element 57, the second connector 82, the second power management chip, and the negative tab 34 of the battery 30A are electrically connected in sequence to form a conductive loop. The second detection chip 56 is electrically connected to the first end of the second current detection element 55, the second end of the second current detection element 55, the second switch element 57, and the ground terminal, respectively. The second detection chip 56 is used to detect the current flowing through the second current detection element 55 and the voltage of the battery 30A. The current flowing through the second current detection element 55 is the current of the battery 30A. When the current or voltage of the battery 30A is greater than a threshold value, the second detection chip 56 controls the second switch element 57 to be cut off, so that the conductive circuit between the second positive electrode tab 36 and the negative electrode tab 34 of the battery 30A stops working.

[0164] In other words, in this embodiment, the mobile phone has two conductive circuits, which can improve the charging and discharging efficiency, reduce the heat generation of the battery 30A, delay the attenuation of the battery 30A capacity, and increase the service life of the battery 30A.

[0165] In other embodiments, the battery 30A may further include a third positive tab, a fourth positive tab, and the like. The corresponding protection circuit board may include a third positive connector, a fourth positive connector, and the like, as well as third connectors and fourth connectors. The main circuit board 20 may also include a third power management chip, a fourth power management chip, and third and fourth connectors, etc., to provide the battery 30A with more conductive circuits.

[0166] In other embodiments, the battery 30A may also have multiple negative tabs, such as a first negative tab, a second negative tab, a third negative tab, etc. One negative tab may be used as the negative electrode of one or more conductive circuits.

[0167] The fourth embodiment of the present application further provides a method for preparing an integrated circuit board, which is used to prepare the integrated circuit board 30B of the third embodiment.

[0168] 19 is a schematic diagram of a process of manufacturing an integrated circuit board according to a fourth embodiment of the present application. The method of manufacturing an integrated circuit board includes the following steps.

[0169] Step S20: Providing a flexible substrate. The flexible substrate includes a flexible circuit board 40, which comprises a second extension portion 43, a main portion 41, and a first extension portion 42, which are connected in sequence. The main portion 41 is provided with a first solder pad 44 and a second solder pad 45, which are located on opposite sides of the main portion 41. The first extension portion 42 is provided with a first connecting pad 46 and a first reinforcing plate 81, which are located on opposite sides of the first extension portion 42. The second extension portion 43 is provided with a second connecting pad 47 and a second reinforcing plate 83, which are located on opposite sides of the second extension portion 43.

[0170] It can be understood that the first pad 44, the second pad 45, the first connecting pad 46, and the second connecting pad 47 are all components pre-layouted on the flexible substrate 91. The electrical connection relationship between each component has been set according to actual needs.

[0171] Specifically, the first pad 44 is located on the first bearing surface 403, and the second pad 45 is located on the third bearing surface 405. There are multiple first pads 44 and multiple second pads 45, and the number of first pads 44 is the same as the number of first electrical components 50 to be installed, and the number of second pads 45 is the same as the number of second electrical components 60 to be installed. The first connecting pad 46 is located on the fifth bearing surface 407, and the second reinforcement plate 83 is located on the sixth bearing surface 408.

[0172] Step S21: Secure the auxiliary reinforcing plate 90 to the main body 41 so that the projection of the main body 41 in the thickness direction of the integrated circuit board is completely located on the auxiliary reinforcing plate 90. Specifically, the auxiliary reinforcing plate 90 is secured to the side surface of the main body 41 where the second solder pads 45 are located. In other words, the auxiliary reinforcing plate 90 is secured to the third supporting surface 405. At this point, the orthographic projections of the first and second solder pads 44, 45 in the Z-axis direction are completely located on the auxiliary reinforcing plate 90, meaning that the auxiliary reinforcing plate 90 can support all of the first and second solder pads 44, 45.

[0173] Specifically, the flexible substrate also includes a redundant board integrally formed with the flexible circuit board 40. An auxiliary reinforcing plate 90 is placed on the side surface of the main body 41 where the second solder pads 45 are located, so that the auxiliary reinforcing plate 90 covers both the redundant board and the flexible circuit board 40. The auxiliary reinforcing plate 90 is then bonded to the redundant board using adhesive. This ensures that the auxiliary reinforcing plate 90 is securely fixed to the third supporting surface 405 while preventing the adhesive from damaging the second solder pads 45.

[0174] Step S22: Fix the first electrical component 50 to the main body 41, fix the first connector 80 to the first extension 42, and fix the second connector 82 to the second extension 43. Specifically, the first electrical component 50 is soldered to the first solder pad 44, the first connector 80 is soldered to the first connection pad 46, and the second connector 82 is soldered to the second connection pad 47. Specifically, the first electrical component 50, the first connector 80, and the second connector 82 can be assembled using surface mount technology (SMT).

[0175] Step S23: Place the package 70 on the main body 41 so that it completely covers the first electrical component 50. The package 70 is specifically secured to the first supporting surface 403 by providing a mold and placing it on the flexible substrate 91, with the first supporting surface 403 of the main body 41 located within the mold. Raw material is placed in the mold and heated to form a liquid. Once the liquid solidifies, the package 70 is formed. The package 70 can be made of epoxy resin, which is a granular material composed of epoxy resin and a curing agent.

[0176] Step S24: peeling the auxiliary reinforcing plate 90 from the main body 41. Specifically, laser can be used to peel the auxiliary reinforcing plate 90 from the flexible substrate.

[0177] Step S25: Fix the second electrical component 60 to the main body. Specifically, the second electrical component 60 is soldered to the second pad 45. Specifically, the second electrical component 60 can be assembled using surface mount technology.

[0178] Step S26 : disposing a first adhesive 84 between the packaging component 70 and the first extension portion 42 , and disposing a second adhesive 85 between the packaging component 70 and the second extension portion 43 .

[0179] It will be appreciated that the above-described integrated circuit board manufacturing method can simultaneously process multiple integrated circuit boards 30B, for example, by providing a relatively large flexible substrate comprising multiple flexible circuit boards 40. After soldering the second electrical component 60 to the second solder pad 45, the integrated circuit board manufacturing method further includes cutting the flexible substrate 91 and removing the redundant circuit board 92 to form multiple integrated circuit boards 30B. This allows for simultaneous processing of multiple integrated circuit boards 30B, improving processing efficiency.

[0180] In the integrated circuit board fabrication method provided in this embodiment, the package 70 is directly molded and fixed to the main body 41, so that the package 70 supports the main body 41 and the second electrical component 60, and protects the first electrical component 50. The first electrical component 50 is directly soldered to the first supporting surface 403 of the main body 41, and the second electrical component 60 is directly soldered to the third supporting surface 405 of the main body 41, requiring a total of two SMT operations. Compared to the prior art, this embodiment reduces the number of SMT operations and simplifies the fabrication process.

[0181] Furthermore, the integrated circuit board 30B manufactured in this embodiment has a package 70 that directly encapsulates all first electrical components 50 on the main body 41. The length, width, and thickness of the package 70 are reduced compared to the prior art, thereby reducing the length, width, and thickness of the integrated circuit board 30B, thereby facilitating the lightweight and thin design of electronic devices. Compared to the prior art, the integrated circuit board 30B provided in this embodiment does not require a printed circuit board, resulting in a reduced thickness, facilitating the lightweight design of electronic devices.

[0182] Furthermore, when the first electrical component 50 is soldered to the first solder pad 44, the auxiliary reinforcing plate 90 is fixed to the flexible printed circuit board 40. This supports the main body 41 of the flexible printed circuit board 40, ensuring that the main body 41 remains flat, preventing any broken lines on the main body 41 and reducing the risk of soldering failure of the first electrical component 50. When the second electrical component 60 is soldered to the second solder pad 45, the package 70 supports the main body 41, facilitating soldering of the second electrical component 60 and reducing the risk of soldering failure of the second electrical component.

[0183] Refer to Figure 20, which is a schematic structural diagram of an integrated circuit board provided in the fifth embodiment of the present application.

[0184] A fifth embodiment of the present application provides an integrated circuit board 30B comprising a flexible circuit board 40, a first electrical component 50, and a package 70. The first electrical component 50 is disposed on a side surface of the flexible circuit board 40. The package 70 is secured to the flexible circuit board 40 and covers the first electrical component 50. The first electrical component 50 may be a resistor, a capacitor, an inductor, a detection chip, an anti-counterfeiting chip 54, or the like. The integrated circuit board 30B can be used in various electronic devices, such as cell phones, notebook computers, tablet personal computers, personal digital assistants, wearable devices, and mobile devices.

[0185] In this embodiment, the shape, size and connection method of the package 70 with the flexible circuit board 40 refer to the description in the first embodiment.

[0186] In this embodiment, the package 70 is directly connected to the flexible printed circuit board 40 and encapsulates the first electrical component 50. Compared to the prior art method that requires a printed circuit board, the thickness of the integrated circuit board 30B is reduced. Compared to the prior art method that separately encapsulates the first electrical component 50, the length, width, and thickness of the package 70 are all reduced, thereby reducing the length, width, and thickness of the integrated circuit board 30B.

[0187] A sixth embodiment of the present application provides a method for preparing an integrated circuit board, which is used to prepare the integrated circuit board 30B of the fifth embodiment.

[0188] Referring to Figure 21, Figure 21 is a schematic diagram of the process of the integrated circuit board manufacturing method provided by the sixth embodiment of the present application. The integrated circuit board manufacturing method includes the following steps.

[0189] Step S30 : providing a flexible substrate, wherein the flexible substrate includes a flexible circuit board 40 , and a first solder pad 44 is provided on one side surface of the flexible circuit board 40 .

[0190] Step S31: Secure the auxiliary reinforcing plate 90 to the flexible printed circuit board 40, such that the projection of the flexible printed circuit board 40 lies entirely on the auxiliary reinforcing plate 90 in the thickness direction of the integrated circuit board. Specifically, the auxiliary reinforcing plate 90 is secured to the surface of the flexible printed circuit board 40 facing away from the first solder pads 44. Specifically, the flexible substrate also includes a redundant plate integrally formed with the flexible printed circuit board 40. The auxiliary reinforcing plate 90 is bonded to the redundant plate using adhesive, such that the adhesive is offset from the flexible printed circuit board 40.

[0191] Step S32: Fix the first electrical component 50 on the flexible printed circuit board 40. Specifically, the first electrical component 50 is soldered to the first solder pad 44. Specifically, the first electrical component 50 can be assembled in a SMT manner.

[0192] Step S33: Secure the package 70 to the main body 41 so that it completely covers the first electrical component 50. The package 70 is secured to the first supporting surface 403 by providing a mold with the side of the flexible printed circuit board 40 mounted with the first electrical component 50 positioned within the mold. Raw material is placed in the mold and heated to form a liquid. Once the liquid solidifies, the package 70 is formed.

[0193] Step S34: peeling the auxiliary reinforcing plate 90 from the flexible circuit board 40. Specifically, the auxiliary reinforcing plate 90 can be peeled from the flexible circuit board 40 using a laser.

[0194] It will be appreciated that the above-described integrated circuit board manufacturing method can simultaneously process multiple integrated circuit boards 30B. For example, a relatively large flexible substrate comprising multiple flexible circuit boards 40 is provided. After peeling the auxiliary reinforcement plate 90 from the flexible circuit board 40, the integrated circuit board manufacturing method further includes cutting the flexible substrate 91 and removing the redundant plate 92 to form multiple integrated circuit boards 30B. This allows for simultaneous processing of multiple integrated circuit boards 30B, improving processing efficiency.

[0195] The integrated circuit board 30B manufactured by the integrated circuit board manufacturing method provided in this embodiment has a small size. When used in electronic equipment, it occupies a small space, which is conducive to the lightweight and thin design of the electronic equipment.

[0196] In addition, when the first electrical component 50 is soldered to the first solder pad 44, the auxiliary reinforcing plate 90 is fixed on the flexible circuit board 40. At this time, the auxiliary reinforcing plate 90 plays the role of supporting the flexible circuit board 40, ensuring that the flexible circuit board 40 remains flat, avoiding the occurrence of dead bends and broken lines in the flexible circuit board 40, and reducing the risk of welding failure of the first electrical component 50.

[0197] Refer to Figure 22, which is a structural diagram of an integrated circuit board provided in the seventh embodiment of the present application.

[0198] A seventh embodiment of the present application provides an integrated circuit board 30B comprising a flexible circuit board 40, a first electrical component 50, a second electrical component 60, and a package 70. The integrated circuit board 30B comprises the flexible circuit board 40, the first electrical component 50, and the package 70. The first electrical component 50 is disposed on one surface of the flexible circuit board 40, and the second electrical component 60 is fixed to a surface of the flexible circuit board 40 facing away from the first electrical component 50. That is, the first electrical component 50 and the second electrical component 60 are respectively fixed to opposite sides of the flexible circuit board 40. The package 70 is fixed to the flexible circuit board 40 and covers the first electrical component 50. The first electrical component 50 and the second electrical component 60 can be resistors, capacitors, inductors, detection chips, anti-counterfeiting chips 54, and the like. The integrated circuit board 30B can be used in various electronic devices, such as cell phones, notebook computers, tablet personal computers, personal digital assistants, wearable devices, and mobile devices.

[0199] In this embodiment, the shape, size and connection method of the package 70 with the flexible circuit board 40 refer to the description in the first embodiment.

[0200] In this embodiment, the package 70 is directly connected to the flexible printed circuit board 40 and encapsulates the first electrical component 50. Compared to the prior art method that requires a printed circuit board, the thickness of the integrated circuit board 30B is reduced. Compared to the prior art method that separately encapsulates the first electrical component 50, the length, width, and thickness of the package 70 are all reduced, thereby reducing the length, width, and thickness of the integrated circuit board 30B.

[0201] An eighth embodiment of the present application provides a method for preparing an integrated circuit board, which is used to prepare the integrated circuit board 30B of the seventh embodiment.

[0202] Referring to Figure 23, Figure 23 is a schematic diagram of the process of the integrated circuit board manufacturing method provided by the eighth embodiment of the present application. The integrated circuit board manufacturing method includes the following steps.

[0203] Step S40 : providing a flexible substrate, the flexible substrate including a flexible circuit board 40 , a first solder pad 44 being provided on one side surface of the flexible circuit board 40 , and a second solder pad 45 being provided on the other side surface of the flexible circuit board 40 .

[0204] Step S41: Secure the auxiliary reinforcing plate 90 to the flexible printed circuit board 40, ensuring that the projection of the flexible printed circuit board 40 lies entirely on the auxiliary reinforcing plate 90 in the thickness direction of the integrated circuit board. Specifically, the auxiliary reinforcing plate 90 is secured to the surface of the flexible printed circuit board 40 facing away from the first solder pads 44. Specifically, the flexible substrate also includes a redundant plate integrally formed with the flexible printed circuit board 40. The auxiliary reinforcing plate 90 is bonded to the redundant plate using adhesive, such that the adhesive is offset from the second solder pads 45.

[0205] Step S42: Fix the first electrical component 50 on the flexible printed circuit board 40. Specifically, the first electrical component 50 is soldered to the first solder pad 44. Specifically, the first electrical component 50 can be assembled in a SMT manner.

[0206] Step S43: Secure the package 70 to the main body 41 so that it covers the first electrical component 50. The package 70 is secured to the first supporting surface 403 in the following manner: a mold is provided, with the side of the flexible printed circuit board 40 mounted with the first electrical component 50 positioned within the mold. Raw materials are placed in the mold and heated to form a liquid. Once the liquid solidifies, the package 70 is formed. The raw materials are granular, consisting of epoxy resin and a curing agent.

[0207] Step S44: peeling the auxiliary reinforcing plate 90 from the flexible circuit board 40. Specifically, the auxiliary reinforcing plate 90 can be peeled from the flexible circuit board 40 using a laser.

[0208] Step S45: Fix the second electrical component 60 on the flexible printed circuit board 40. Specifically, the second electrical component 60 is soldered to the second solder pad 45. Specifically, the second electrical component 60 can be assembled in a SMT manner.

[0209] It will be appreciated that the above-described integrated circuit board manufacturing method can simultaneously process multiple integrated circuit boards 30B. For example, a relatively large flexible substrate comprising multiple flexible circuit boards 40 is provided. After peeling the auxiliary reinforcement plate 90 from the flexible circuit board 40, the integrated circuit board manufacturing method further includes cutting the flexible substrate 91 and removing the redundant plate 92 to form multiple integrated circuit boards 30B. This allows for simultaneous processing of multiple integrated circuit boards 30B, improving processing efficiency.

[0210] The integrated circuit board 30B manufactured by the integrated circuit board manufacturing method provided in this embodiment has a small size. When used in electronic equipment, it occupies a small space, which is conducive to the lightweight and thin design of the electronic equipment.

[0211] Furthermore, when the first electrical component 50 is soldered to the first solder pad 44, the auxiliary reinforcing plate 90 is fixed to the flexible printed circuit board 40. This supports the flexible printed circuit board 40, ensuring that it remains flat, preventing any breakage or fracture, and reducing the risk of soldering failure of the first electrical component 50. When the second electrical component 60 is soldered to the second solder pad 45, the package 70 supports the flexible printed circuit board 40, facilitating soldering and reducing the risk of soldering failure of the second electrical component.

[0212] A ninth embodiment of the present application provides an electronic device. Referring to FIG24 , FIG24 is a schematic structural diagram of a wearable device provided in the ninth embodiment of the present application.

[0213] The electronic device is a wearable device 2000, which can be a wearable watch or wristband. The wearable device 2000 includes a display screen (not shown) and a main body.

[0214] The display screen has a touch function and is used to operate the phone and display information such as images and videos. The display screen includes a display surface and a mounting surface. The display screen is mounted on the main body, with the mounting surface of the display screen facing the main body and the display surface of the display screen facing away from the main body.

[0215] The display screen can specifically be: an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, and a quantum dot light-emitting diode (QLED) display screen.

[0216] The main body includes a wearable strip 2100, a housing 2200, a main circuit board 2300, and a battery 2400. The housing 2200 has a housing cavity, which includes a circuit compartment and a battery compartment. The main circuit board 2300 is installed in the circuit compartment, and the battery 2400 is installed in the battery compartment. The main circuit board 2300 integrates components such as a first power management chip and a central processing unit (CPU) (not shown). The battery 2400 is equipped with an integrated circuit board 2500.

[0217] Wearable strip 2100 is made of a flexible material such as steel chain, canvas, plastic, or nylon. It includes a first wearable portion 2110 and a second wearable portion 2120. One end of the first wearable portion 2110 is connected to one end of the housing 2200, while one end of the second wearable portion 2120 is connected to the other end of the housing 2200. The other end of the first wearable portion 2110 and the other end of the second wearable portion 2120 are detachably connected. Wearable strip 2100 allows users to wear wearable electronic devices on a limb, such as a wrist, ankle, arm, or leg.

[0218] The structure, connection relationship and working principle of the housing 2200, the main circuit board 2300 and the battery 2400 can be referred to the first embodiment mentioned above.

[0219] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An integrated circuit board, characterized in that: include: A flexible circuit board, a first electrical component, a second electrical component, a connector, a reinforcing plate and a packaging component; the flexible circuit board comprises a main body and an extension connected along the length direction of the integrated circuit board; The first electrical component and the second electrical component are respectively arranged on two opposite sides of the main body along the thickness direction of the integrated circuit board; the connecting member and the reinforcing plate are respectively arranged on two opposite sides of the extension portion along the thickness direction of the integrated circuit board; in the thickness direction of the integrated circuit board, the projection of the reinforcing plate on the extension portion and the projection of the connecting member on the extension portion at least partially overlap; The package is fixed on the main body, and the package completely covers the first electrical component. In the thickness direction of the integrated circuit board, the projection of the second electrical component and the projection of the main body are completely located on the package.

2. The integrated circuit board according to claim 1, characterized in that: The packaging component is fixed on the main body by molding.

3. The integrated circuit board according to claim 2, characterized in that: The number of the first electrical components is at least two; and the package completely covers at least two of the first electrical components.

4. The integrated circuit board according to claim 3, characterized in that: The main body has a first bearing surface; the first electrical component and the package are both fixed on the first bearing surface; the package includes a first packaging surface and a second packaging surface opposite to each other along the thickness direction of the integrated circuit board, and the first packaging surface is fixedly connected to the first bearing surface; Among at least two of the first electrical components, the first electrical component with the largest thickness dimension includes an upper surface and a lower surface opposite to each other along the thickness direction of the integrated circuit board; the lower surface is fixedly connected to the first bearing surface; in the thickness direction of the integrated circuit board, the distance between the upper surface and the second packaging surface is greater than or equal to 0.05 mm and less than 0.3 mm.

5. The integrated circuit board according to claim 3, characterized in that: Among the at least two first electrical components, the first electrical component with the largest width dimension comprises a front surface and a rear surface opposite to each other along the width direction of the integrated circuit board; the package comprises a first package side and a second package side opposite to each other along the width direction of the integrated circuit board; In the width direction of the integrated circuit board, the distance between the front surface and the first packaging side is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the rear surface and the second packaging side is greater than or equal to 0.1 mm and less than 0.6 mm.

6. The integrated circuit board according to claim 3, characterized in that: The package comprises a first package end and a second package end opposite to each other along the length direction of the integrated circuit board; among at least two of the first electrical components, the first electrical component closest to the first package end has a left side surface, and the first electrical component closest to the second package end has a right side surface; In the length direction of the integrated circuit board, the distance between the left side surface and the first packaging end is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the right side surface and the second packaging end is greater than or equal to 0.1 mm and less than 0.6 mm.

7. The integrated circuit board according to any one of claims 1 to 6, characterized in that: The extension portion includes a second bearing surface, the second bearing surface is connected to the first bearing surface along the length direction of the integrated circuit board; the package includes a second packaging end, the second bearing surface is adjacent to the second packaging end, and an angle is formed between the second bearing surface and the second packaging end; The integrated circuit board also includes an adhesive, one side of which is bonded to the second bearing surface. The other side of the packaging end is bonded to the second packaging end.

8. The integrated circuit board according to any one of claims 1 to 6, characterized in that: The extension portion comprises two extension segments connected at an angle, wherein an end of one of the extension segments is fixedly connected to the main body portion, and the connecting member and the reinforcing plate are arranged at an end of the other extension segment.

9. The integrated circuit board according to any one of claims 1 to 6, characterized in that: The extension portion includes a first extension portion and a second extension portion, and the first extension portion and the second extension portion are respectively fixed to two opposite sides of the main body along the length direction of the integrated circuit board; the reinforcement plate includes a first reinforcement plate and a second reinforcement plate, and the connecting member includes a first connecting member and a second connecting member; The first connecting member and the first reinforcing plate are respectively arranged on two opposite sides of the first extending portion along the thickness direction of the integrated circuit board; the second connecting member and the second reinforcing plate are respectively arranged on two opposite sides of the second extending portion along the thickness direction of the integrated circuit board; In the thickness direction of the integrated circuit board, the projection of the first reinforcement plate on the first extension portion and the projection of the first connector on the first extension portion at least partially overlap; the projection of the second reinforcement plate on the second extension portion and the projection of the second connector on the second extension portion at least partially overlap.

10. A battery module, characterized in that: include: A battery and an integrated circuit board as claimed in any one of claims 1 to 9, wherein the battery has a positive electrode ear and a negative electrode ear; the integrated circuit board is arranged at the end of the battery, and the positive electrode ear and the negative electrode ear are respectively fixedly connected to the second electrical component, the positive electrode ear and the negative electrode ear are respectively electrically connected to the second electrical component, the second electrical component is electrically connected to the first electrical component, and the first electrical component is electrically connected to the connector.

11. An electronic device, characterized in that: It comprises a shell, a main circuit board and the battery module as claimed in claim 10, wherein the main circuit board and the battery module are both arranged inside the shell; the main circuit board is provided with a plug-in component, and the connecting component is plugged into the plug-in component to make the positive electrode ear, the integrated circuit board, the main circuit board and the negative electrode ear form a conductive loop.

12. A method for preparing an integrated circuit board, for preparing the integrated circuit board according to any one of claims 1 to 9, characterized in that: include: Providing a flexible substrate, wherein the flexible substrate includes the flexible circuit board; Fixing the auxiliary reinforcing plate on the main body, in the thickness direction of the integrated circuit board, so that the projection of the main body is completely located on the auxiliary reinforcing plate; Fixing the first electrical component to the main body, and fixing the connector to the extension; Fixing the package on the main body so that the package completely covers the first electrical component; peeling the auxiliary reinforcement plate from the main body; The second electrical component is fixed on the main body.

13. The method for preparing an integrated circuit board according to claim 12, characterized in that: Fixing the package on the main body specifically includes: placing a mold on the flexible substrate, and making the side of the main body provided with the first electrical component located inside the mold; placing raw materials in the mold, heating the raw materials to make the raw materials into liquid materials, and cooling the liquid materials to form the package.

14. The method for preparing an integrated circuit board according to claim 12 or 13, characterized in that: The flexible substrate also includes a redundant board, and the redundant board and the flexible circuit board are integrally formed; fixing the auxiliary reinforcement board on the main body; specifically including: using adhesive to bond the auxiliary reinforcement board to the redundant board.

15. The method for preparing an integrated circuit board according to claim 14, characterized in that: The flexible substrate includes a plurality of flexible circuit boards; after the second electrical component is fixed on the main body, the integrated circuit board preparation method further includes: cutting the flexible substrate to form a plurality of integrated circuit boards after removing the redundant boards.

16. An integrated circuit board, characterized in that: include: A flexible circuit board, a first electrical component and a packaging component; the first electrical component is arranged on a side surface of the flexible circuit board; The package is fixed on the flexible circuit board, and the package completely covers the first electrical component; in the thickness direction of the integrated circuit board, the projection of the flexible circuit board is completely located on the package.

17. The integrated circuit board according to claim 16, characterized in that: The packaging component is fixed on the flexible circuit board by molding.

18. The integrated circuit board according to claim 16, characterized in that: The number of the first electrical components is at least two; and the package completely covers at least two of the first electrical components.

19. The integrated circuit board according to claim 18, characterized in that: The flexible circuit board has a first surface; the first electrical component and the package are both fixed on the first surface; the package includes a first package surface and a second package surface opposite to each other along the thickness direction of the integrated circuit board, and the first package surface is fixedly connected to the first surface; Among at least two of the first electrical components, the first electrical component with the largest thickness dimension includes an upper surface and a lower surface opposite to each other along the thickness direction of the integrated circuit board; the lower surface is fixedly connected to the first surface; in the thickness direction of the integrated circuit board, the distance between the upper surface and the second packaging surface is greater than or equal to 0.05 mm and less than 0.3 mm.

20. The integrated circuit board according to claim 18, characterized in that: Among the at least two first electrical components, the first electrical component with the largest width dimension comprises a front surface and a rear surface opposite to each other along the width direction of the integrated circuit board; the package comprises a first package side and a second package side opposite to each other along the width direction of the integrated circuit board; In the width direction of the integrated circuit board, the distance between the front surface and the first packaging side is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the rear surface and the second packaging side is greater than or equal to 0.1 mm and less than 0.6 mm.

21. The integrated circuit board according to claim 18, characterized in that: The package comprises a first package end and a second package end opposite to each other along the length direction of the integrated circuit board; among at least two of the first electrical components, the first electrical component closest to the first package end has a left side surface, and the first electrical component closest to the second package end has a right side surface; In the length direction of the integrated circuit board, the distance between the left side surface and the first packaging end is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the right side surface and the second packaging end is greater than or equal to 0.1 mm and less than 0.6 mm.

22. The integrated circuit board according to any one of claims 16 to 21, characterized in that: The integrated circuit board also includes a second electrical component, which is fixed on a surface of the flexible circuit board on a side facing away from the first electrical component.

23. A method for preparing an integrated circuit board, for preparing the integrated circuit board according to any one of claims 16 to 21, characterized in that: include: Providing a flexible substrate, wherein the flexible substrate includes the flexible circuit board; Fixing the auxiliary reinforcing plate on the flexible circuit board, in the thickness direction of the integrated circuit board, so that the projection of the flexible circuit board is completely located on the auxiliary reinforcing plate; Fixing the first electrical component on the flexible circuit board; Fixing the package on the flexible circuit board so that the package completely covers the first electrical component; The auxiliary reinforcing plate is peeled off from the flexible circuit board.

24. The method for preparing an integrated circuit board according to claim 23, characterized in that: Fixing the package on the flexible circuit board specifically includes: placing a mold on the flexible substrate, and making the side of the flexible circuit board provided with the first electrical component located inside the mold; placing raw materials in the mold, heating the raw materials to make the raw materials into liquid materials, and cooling the liquid materials to form the package.

25. The method for preparing an integrated circuit board according to claim 23 or 24, characterized in that: The flexible substrate also includes a redundant board, and the redundant board and the flexible circuit board are integrally formed; fixing the auxiliary reinforcement board on the flexible circuit board specifically includes: using adhesive to bond the auxiliary reinforcement board to the redundant board.

26. The method for preparing an integrated circuit board according to claim 25, characterized in that: After the auxiliary reinforcement plate is peeled off from the flexible circuit board, the integrated circuit board preparation method further includes: fixing a second electrical component on a surface of the flexible circuit board facing away from the first electrical component; the flexible substrate includes a plurality of flexible circuit boards; after the second electrical component is fixed on the flexible circuit board, the integrated circuit board preparation method further includes: cutting the flexible substrate to remove the redundant board to form a plurality of integrated circuit boards.

27. An integrated circuit board, characterized in that: include: A flexible circuit board, a first electrical component, a second electrical component, a connector, a reinforcing plate and a packaging component; the flexible circuit board comprises a main body and an extension connected along the length direction of the integrated circuit board; The first electrical component and the second electrical component are respectively arranged on two opposite sides of the main body along the thickness direction of the integrated circuit board; the connecting member and the reinforcing plate are respectively arranged on two opposite sides of the extension portion along the thickness direction of the integrated circuit board; in the thickness direction of the integrated circuit board, the projection of the reinforcing plate on the extension portion and the projection of the connecting member on the extension portion at least partially overlap; The package is fixed on the main body, and the package completely covers the first electrical component, and in the thickness direction of the integrated circuit board, the projection of the second electrical component and the projection of the main body are completely located on the package; The extension portion includes a second bearing surface; the package includes a second packaging end, the second bearing surface is adjacent to the second packaging end, and an angle is formed between the second bearing surface and the second packaging end; The integrated circuit board also includes an adhesive, the adhesive has a regular shape, and the adhesive has two adhesive surfaces, one adhesive surface of the adhesive is bonded to the second bearing surface, and the other adhesive surface of the adhesive is bonded to the second packaging end.

28. The integrated circuit board according to claim 27, characterized in that: The packaging component is fixed on the main body by molding.

29. The integrated circuit board according to claim 28, characterized in that: The number of the first electrical components is at least two; and the package completely covers at least two of the first electrical components.

30. The integrated circuit board according to claim 29, characterized in that: The main body has a first bearing surface; the first electrical component and the package are both fixed on the first bearing surface; the package includes a first packaging surface and a second packaging surface opposite to each other along the thickness direction of the integrated circuit board, and the first packaging surface is fixedly connected to the first bearing surface; Among at least two of the first electrical components, the first electrical component with the largest thickness dimension includes an upper surface and a lower surface opposite to each other along the thickness direction of the integrated circuit board; the lower surface is fixedly connected to the first bearing surface; in the thickness direction of the integrated circuit board, the distance between the upper surface and the second packaging surface is greater than or equal to 0.05 mm and less than 0.3 mm.

31. The integrated circuit board according to claim 29, characterized in that: Among the at least two first electrical components, the first electrical component with the largest width dimension comprises a front surface and a rear surface opposite to each other along the width direction of the integrated circuit board; the package comprises a first package side and a second package side opposite to each other along the width direction of the integrated circuit board; In the width direction of the integrated circuit board, the distance between the front surface and the first package side is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the rear surface and the second packaging side is greater than or equal to 0.1 mm and less than 0.6 mm.

32. The integrated circuit board according to claim 29, characterized in that: The package comprises a first package end and a second package end opposite to each other along the length direction of the integrated circuit board; among at least two of the first electrical components, the first electrical component closest to the first package end has a left side surface, and the first electrical component closest to the second package end has a right side surface; In the length direction of the integrated circuit board, the distance between the left side surface and the first packaging end is greater than or equal to 0.1 mm and less than 0.6 mm; the distance between the right side surface and the second packaging end is greater than or equal to 0.1 mm and less than 0.6 mm.

33. An integrated circuit board according to any one of claims 27 to 32, characterized in that: The extension portion comprises two extension segments connected at an angle, wherein an end of one of the extension segments is fixedly connected to the main body portion, and the connecting member and the reinforcing plate are arranged at an end of the other extension segment.

34. The integrated circuit board according to any one of claims 27 to 32, characterized in that: The extension portion includes a first extension portion and a second extension portion, and the first extension portion and the second extension portion are respectively fixed to two opposite sides of the main body along the length direction of the integrated circuit board; the reinforcement plate includes a first reinforcement plate and a second reinforcement plate, and the connecting member includes a first connecting member and a second connecting member; The first connecting member and the first reinforcing plate are respectively arranged on two opposite sides of the first extending portion along the thickness direction of the integrated circuit board; the second connecting member and the second reinforcing plate are respectively arranged on two opposite sides of the second extending portion along the thickness direction of the integrated circuit board; In the thickness direction of the integrated circuit board, the projection of the first reinforcement plate on the first extension portion and the projection of the first connector on the first extension portion at least partially overlap; the projection of the second reinforcement plate on the second extension portion and the projection of the second connector on the second extension portion at least partially overlap.

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