Microscanner system comprising a microscanner and a reflection surface, integrated into an encapsulation of the microscanner, for deflecting radiation onto the microscanner

Abstract

The invention relates to a microscanner system comprising: a microscanner which is formed in a substrate, in particular in a semiconductor chip, and has a deflection element which is suspended so as to be rotatably oscillatable about at least one oscillation axis and has a surface designed as a mirror surface for deflecting electromagnetic radiation incident on the mirror surface; a radiation source, in particular a laser radiation source, for emitting an electromagnetic beam to be reflected at the deflection element; an encapsulation for encapsulating, in particular vacuum encapsulating, the microscanner, the encapsulation having a window region which is at least partially transparent to the beam after its deflection at the deflection element; and a deflection device having an at least partially reflective reflection surface for deflecting the electromagnetic beam, which can be emitted by the radiation source, onto the mirror surface. The radiation source is arranged and orientated such that a beam path of the beam at least partially passes through a radiation passage region in the substrate to the deflection device. Moreover, the deflection device is arranged in or on the encapsulation or is integrally formed therewith.

Description

[0001] MICROSCANNER SYSTEM WITH A MICROSCANNER AND A REFLECTIVE SURFACE COMBINED IN AN ENCAPSULATION OF THE MICROSCANNER

[0002] FOR REFLECTING RADIATION TO THE MICROSCANNER

[0003] The present invention relates to a microscanner system for projecting, in particular imaging, electromagnetic radiation onto an observation field.

[0004] Microscanners, which in technical jargon are also referred to as "MEMS scanners", "MEMS mirrors" or "micromirrors" or in English in particular as "micro-scanners" or "micro-scanning mirrors" or "MEMS mirrors", are micro-electro-mechanical systems (MEMS), more precisely micro-opto-electro-mechanical systems (MOEMS), from the class of micromirror actuators for the dynamic modulation of electromagnetic radiation, in particular visible light. Depending on the design, the modulating movement of an individual mirror can be translational or rotational about at least one axis. In the first case, a phase-shifting effect is achieved, in the second case a deflection of the incident electromagnetic radiation in a direction dependent on the current orientation of the mirror. In the following, microscanners will be considered in which the modulating movement of an individual mirror is, at least partly, rotational.In contrast to mirror arrays, where the modulation of incident light occurs via the interaction of several mirrors on a single MEMS component, the modulation in microscanners is typically generated via a single mirror per MEMS component (microscanner).

[0005] Microscanners can therefore be used in particular for the deflection of electromagnetic radiation in order to modulate an incident electromagnetic beam, in particular a laser beam, with regard to its deflection direction by means of a deflection element (“mirror”). This can be used in particular to effect a Lissajous projection of the beam into an observation field. This allows, for example, imaging and sensory tasks to be solved or display functionalities to be implemented. Furthermore, such microscanners can also be used to advantageously irradiate materials, in particular for their processing. Possible other applications lie in the field of illuminating or illuminating certain open or closed spaces or spatial areas with electromagnetic radiation, for example in the context of

[0006] Headlight applications. A microscanner can be implemented in a mostly plate-shaped substrate, especially a semiconductor chip. Microscanners often have a mirror plate (deflection plate) suspended laterally on elastically stretchable springs. A distinction is made between single-axis mirrors, which are preferably mounted for rotation about only a single axis, and dual-axis and multi-axis mirrors, in which rotations (especially rotational oscillations) about a corresponding number of different axes (oscillation axes) are possible, especially simultaneously.

[0007] A microscanner system for deflecting an electromagnetic beam can thus, in particular, comprise a biaxial microscanner, i.e., a microscanner with two different non-parallel, in particular mutually orthogonal, oscillation axes. However, it is also possible for the microscanner system to comprise a combination of two or more individual microscanners, in particular single-axis microscanners, arranged such that the incident beam can be deflected successively by the various individual microscanners of the microscanner system to generate a two-dimensional deflection pattern, such as a raster scan or a Lissajous pattern. In a microscanner system with a combination of two or three single-axis microscanners, their non-parallel oscillation axes can, in particular, be orthogonal to one another in pairs.In the present case, a microscanner system comprises, in addition to the at least one microscanner, also a radiation source for providing electromagnetic radiation to be deflected by the microscanner(s).

[0008] For a range of different microscanner applications, particularly for applications in the field of so-called "wearables," i.e., electronics worn on the body, very compact and cost-effective laser projectors are required. An important design for this purpose comprises one or more microscanners for beam deflection as well as one or more laser sources. Wearables include, in particular, virtual reality (VR) glasses, augmented reality (AR) glasses, mixed reality (MR) glasses, and other imaging devices worn on the body. The colors of the light generated by the light sources can, in the optical range of the spectrum, be primary colors of a color model for a color space and, for example, in the case of an RGB color model, be provided by three laser sources, one each for red, yellow, and blue light. It is an object of the invention to provide a microscanner system with a particularly compact design.

[0009] This object is achieved according to the teaching of claim 1. Various embodiments and further developments of the solution are the subject of the subclaims.

[0010] The solution presented here concerns a micro scanner system comprising:

[0011] (i) a microscanner formed in a substrate, in particular in a semiconductor chip, with a deflection element suspended so as to be capable of rotational vibration about at least one vibration axis, which deflection element has a surface formed as a mirror surface for deflecting electromagnetic radiation incident on the mirror surface;

[0012] (ii) a radiation source, in particular a laser radiation source, for emitting an electromagnetic beam to be reflected at the deflection element; and

[0013] (iii) an encapsulation for, in particular at least partially gas-tight, encapsulation, in particular vacuum encapsulation, of the microscanner, wherein the encapsulation has a window area that is at least partially transparent to the beam after its deflection at the deflection element; and

[0014] (iv) a deflection device (145) with an at least partially reflecting reflection surface for deflecting the electromagnetic beam (140) emitted by the radiation source (125) onto the mirror surface;

[0015] Here, the radiation source (125) is arranged and oriented such that a beam path of the beam (140) extends at least partially through a radiation passage region (135) in the substrate (105) to the deflection device (145). Furthermore, the deflection device is arranged in or on the encapsulation or is formed integrally (in one piece) therewith. In particular, the deflection device and the encapsulation can be formed together as an assembly.

[0016] The term "substrate," as used herein, refers to a homogeneous or heterogeneous solid (i.e., having a solid state of aggregation at standard temperature of 20°C and standard pressure of 1013 hPa) suitable for embodying a microscanner. The substrate may, in particular, have a plate-like shape, at least in sections, and, depending on its function, may be made, in particular, from a semiconductor wafer or a material that is at least partially optically transparent in the wavelength range used by the microscanner system for projection, such as a glass wafer or an at least partially transparent plastic wafer.

[0017] The term "deflecting element," as used here, refers in particular to a body with a reflective surface (mirror surface) that is smooth enough so that reflected electromagnetic radiation, e.g., visible light, maintains its parallelism according to the law of reflection, thus allowing an image to be formed. The roughness of the mirror surface must be less than approximately half the wavelength of the electromagnetic radiation. In particular, roughnesses with a mean roughness value R a < 1000 nm, preferably R a s 100 nm, particularly preferably R a < 5 nm. The mean roughness indicates the average distance of a measuring point on the surface from the center line. The mean roughness corresponds to the arithmetic mean of the absolute deviation from the center line and is defined in particular in the standard DIN EN ISO 4287:2010.

[0018] The deflection element can, in particular, be designed as a mirror plate with at least one mirror surface or can have such a plate. In particular, the mirror surface itself can be made of a different material, e.g., a metal, in particular a deposited metal, than the rest of the body of the deflection element.

[0019] The term "radiation source," as used herein, refers to a source of electromagnetic radiation to be deflected, in particular scanned, by the microscanner system. It can, in particular, be a source of laser radiation. The wavelength range of the radiation can, in principle, be selected from the entire spectrum, from short-wave UV radiation, through the VIS range, NIR range, IR range, FIR range, to long-wave terahertz and radar radiation. The radiation source can have one or more identical or different radiation emitters, e.g., laser diodes.

[0020] The term "deflection device," as used herein, refers to an optical device suitable for changing the direction of an electromagnetic beam incident upon it. For this purpose, it can be designed, in particular, as a reflector, in particular a mirror, for at least partially reflecting the incident beam. The deflection device can, in particular, simultaneously be an imaging device that subjects the incident beam to a defined optical imaging process, in particular a mirroring and / or collimation process. The term "encapsulation," as used herein, refers to a device that encloses the microscanner, in particular its deflection element and suspension, at least partially, i.e., with respect to at least a limited solid angle range, in particular a half-space, in particular in a gas-tight (e.g., airtight) manner.In the case of a gas-tight seal, a negative pressure, in particular a vacuum, can be created in the space enclosed by the encapsulation (in which the microscanner is located) compared to a gas pressure, in particular air pressure, prevailing outside the enclosed space. If the encapsulation alone does not completely enclose the microscanner, it can be combined with one or more other bodies in such a way that, together with this or these bodies, it creates a completely, particularly gas-tight, enclosure of the microscanner.

[0021] The encapsulation can, in particular, be a vacuum encapsulation, i.e., an encapsulation that encloses a vacuum in a gas-tight manner. A vacuum is the state of a gas when the pressure of the gas inside a container, and thus the particle number density, is lower than outside, or when the gas pressure is lower than 300 mbar, i.e., lower than the lowest atmospheric pressure occurring on the Earth's surface - DIN 28400 Part 1 (May 1990). This allows the deflection element to be kept in a vacuum, so that its oscillations can be at least largely free of gas friction.

[0022] The term "radiation passage region," as used herein, refers in particular to a region of the substrate that is at least partially permeable to the radiation provided by the radiation source. The radiation passage region can in particular be formed entirely or partially as a continuous opening, in particular as an opening extending entirely through the substrate ("through opening") or as an opening in or on which a material is located that at least partially mechanically closes the opening but is at least partially transparent to the radiation (e.g., made of a (partially) transparent glass material or plastic, such as an optical fiber). The radiation passage region can in particular be arranged away from the edges of the substrate, in particular centrally in the substrate, or also directly on (at least) one substrate edge.

[0023] The terms "comprises," "includes," "includes," "has," "has," "with," or any other variation thereof, as used herein, are intended to cover non-exclusive inclusion. For example, a method or apparatus that includes or has a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or that are inherent in such a method or apparatus.

[0024] Furthermore, unless explicitly stated otherwise, "or" refers to an inclusive "or" rather than an exclusive "or." For example, a condition A or B is satisfied by one of the following conditions: A is true (or present) and B is false (or absent), A is false (or absent) and B is true (or present), and both A and B are true (or present).

[0025] The terms "a" or "an" as used herein are defined as "one or more." The terms "another" and "another," and any other variations thereof, are defined as "at least one other."

[0026] The term “plurality” as used herein shall mean “two or more”.

[0027] The terms "first," "second," "third," and similar terms in the description and claims are used, where appropriate, to distinguish between similar or otherwise similarly named elements and not necessarily to describe a sequential, spatial, or chronological order. It is understood that the terms so used are interchangeable under appropriate circumstances, and that the embodiments of the solution described herein may also function in orders other than those described or illustrated herein.

[0028] The term “configured” or “set up” to perform a specific function (and respective variations thereof), as used here, is to be understood that a relevant device or component thereof is already in a design or setting in which it can perform the function or is at least adjustable – i.e. configurable – so that it can perform the function after being set accordingly. The configuration can be carried out, for example, by appropriately setting parameters of a process sequence or of switches or the like for activating or deactivating functionalities or settings. In particular, the device can have a plurality of predetermined configurations or operating modes, such that the configuration can be carried out by selecting one of these configurations or operating modes.

[0029] In the above microscanner system, the integration of the radiation source into the microscanner system itself in combination with the beam path running through the radiation passage area in the substrate and the deflection device with the encapsulation arranged in or on it or formed integrally therewith enables a particularly compact design.

[0030] In particular, the beam path of the radiation emitted by the radiation source guided through the substrate in combination with the deflection device enables the radiation source not to be arranged laterally to (i.e. next to) the substrate as in conventional microscanners, but can be arranged in particular within the substrate or in the sense of a vertical stack arrangement on or behind the side of the substrate facing away from the mirror side of the microscanner.

[0031] The beam passage area allows the radiation emitted by the radiation source to pass through the substrate from the (first) half-space in which the radiation source is located to the (second) half-space into which the radiation is to be deflected by the microscanner. The deflection device enables the necessary deflection of the radiation passing through the substrate onto the mirror area of ​​the microscanner, where the radiation deflected by the deflection device can then be deflected into the observation field located in the second half-space.

[0032] Since the deflection device is arranged in or on the encapsulation or is formed integrally with it, which is already regularly present in microscanners, particularly to prevent gas friction (especially air friction) during the oscillating movement of the deflection element, the space required for the deflection device can be kept very small. In particular, it can be applied as a very thin layer on a surface of the encapsulation or embedded in the encapsulation, so it does not have to support itself.

[0033] Overall, this ensures that the beam path of the radiation within the microscanner system remains within the circumscribing installation space (in the sense of the mathematical concept of an enveloping surface) at least until it leaves the mirror surface of the deflection element. This allows for particularly compact designs with very small maximum dimensions, in particular less than 10 mm or even 5 mm or less, which are sufficiently small to allow the integration of the microscanner system into small-sized devices, especially wearables such as AR / VR glasses, for example, as microprojectors.

[0034] Next, various exemplary embodiments of the microscanner system(s) are described below, which can be combined with each other as desired, unless this is expressly excluded or is technically impossible.

[0035] In some embodiments, the microscanner system is configured such that the reflection surface of the deflection device is simultaneously designed as a collimator for collimating the beam emitted by the radiation source during operation of the microscanner system and incident on the deflection device during the deflection of the beam. In this way, the beam incident on the deflection element, or more precisely its mirror surface, and previously deflected by the deflection device, can be formed into an at least substantially parallel radiation beam. If the mirror surface is flat, the beam deflected by the deflection element can also be described as a substantially parallel radiation beam, so that the projection image that can be generated thereby depends at least approximately not at all, or at least only slightly, on the distance of a projection surface from the deflection element.

[0036] In some embodiments, the reflection surface is specifically shaped to collimate the beam incident upon it during operation of the microscanner system such that at least 90%, in particular at least 99%, of the cross-sectional area of ​​the collimated beam, upon impinging on the deflection element, does not extend beyond the mirror surface of the deflection element, optionally including the radiation passage area at the deflection element. This ensures that the beam impinging on the deflection element is largely or even substantially completely reflected by the mirror surface and can thus be used to generate a projection image in the observation field. Radiation losses can thus be largely avoided.

[0037] In some embodiments, the reflection surface is designed, at least in sections, as a vault that at least partially spans the deflection element. Viewed from the deflection element, the reflection surface, or possibly its relevant section, is concave. This has the advantage that, due to this shape, the aforementioned collimation effect of the deflection element can be achieved or supported, since the reflection surface acts like a concave mirror. As already explained above, the reflection surface does not have to be self-supporting, although this is also possible.

[0038] In some such embodiments, a virtual circle of curvature adjacent to a vertex of the vault (also called an osculating circle or osculating circle, i.e., the circle that best approximates the vault shape at the vertex) has a focus that lies on the mirror surface of the deflection element or is located no more than 10%, in particular no more than 1%, away from it, of the radius of curvature R of the circle of curvature. This allows for a good collimation effect.

[0039] Instead of a (two-dimensional) circle of curvature, a virtual sphere (sphere of curvature) adjacent to the vertex can be considered as a corresponding extension to three-dimensional space, which best approximates the shape of the vault at the vertex. The circle of curvature can then be obtained as an intersection line between the sphere of curvature and a virtual plane passing through the vertex. At least in the surface area immediately adjacent to the vertex, a mirror surface according to these embodiments therefore represents a spherical concave mirror.

[0040] Spherical concave mirror surfaces are generally easier to manufacture than other concave mirror types, especially lighter than parabolic mirrors. The use of a spherical concave mirror is advantageous in this case primarily when a center of divergence of the beam incident on the reflection surface lies at least approximately on a surface defined by the mirror surface of the deflection element, particularly when the radiation passage region lies in the deflection element, so that the center of divergence can then lie at least approximately in or on the radiation passage region. The center of divergence can be considered approximately a point radiation source, in particular, if the beam diameter there is very small, approximately corresponding to the beam diameter of the beam (especially a laser beam) when leaving the radiation source, or even smaller due to prior focusing.

[0041] In some embodiments, a virtual two-dimensional circle of curvature (or again correspondingly a sphere of curvature) adjacent to an apex of the vault has a radius of curvature R which satisfies the condition R = ad, where d indicates the distance (i.e. minimum distance) of the reflection surface from a center of divergence of the beam emitted by the radiation source during its operation and 1.9 < a ​​< 2.1 applies. In these embodiments, the radius of curvature R therefore corresponds at least approximately to twice the distance of the reflection surface from the center of divergence. In this way, at least approximately a good collimation effect can be achieved, in particular if the center of divergence is at least approximately in or on the radiation passage region in the substrate, in particular on or in the deflection element.

[0042] It should be noted that every real radiation source (especially a light source) is a surface radiator, so that it has an aperture angle of its beam path that is different from zero and at least a small divergence of its beam path is always unavoidable.

[0043] In some embodiments, the vault is formed as a dome in a region surrounding the apex (i.e., with a central apex; in particular, it can be rotationally symmetrical to an axis of symmetry passing through the apex). This allows for a good collimation effect across the entire cross-sectional area of ​​the beam to be collimated, which is incident on the reflecting surface.

[0044] In particular, the dome can be designed as a spherical dome in the area surrounding the apex, especially as a whole, or as an elliptical paraboloid dome (i.e., a parabolic mirror). While spherical domes are generally easier to manufacture, parabolic mirrors have the advantage that they are best able to transform (collimate) a divergent radiation beam emanating from a point source at their focal point into a (largely) parallel radiation beam.

[0045] In some embodiments, the vault is formed in an area surrounding the apex, particularly as a whole, as a prismatic paraboloid or as a partial ellipsoid. With a prismatic paraboloid, the collimating effect can be achieved primarily along a cross-sectional direction of the beam. In applications where the projection beam emitted by the deflection element into the observation field is to be focused to a distance a short distance from the microscanner system, for example, when the microscanner system is to be used as a picoprojector to generate a real intermediate image at a short distance, as can be the case, particularly when used in ARA / R / MR glasses, the ellipsoidal shape is advantageous.

[0046] In some embodiments, the radiation passage region in the substrate is located at least partially in the deflection element, in particular centrally. It can, in particular, extend through the deflection element, for example as a through-opening. This allows a particularly compact design to be achieved, since the lateral extent of the substrate can be kept particularly small. This is because, when the substrate is completely located in the deflection element, no space is required to accommodate the radiation passage region outside the deflection element (i.e., next to it), and, when partially located in the deflection element, only a small amount of space is required.

[0047] In some embodiments, the reflection surface overlaps with the window region and, at least in the overlap region, has a transmittance T > 0, in particular T > 40%, for the beam impinging on it during operation of the microscanner system. This makes it possible for the reflection surface in the overlap region to both deflect the beam coming from the radiation source onto the mirror surface of the deflection element, but also to allow the radiation reflected by the mirror surface to pass at least partially through the overlap region as part of the window region, in order to allow the microscanner to project radiation through the overlap region as well.These embodiments are particularly advantageous in conjunction with the aforementioned embodiments in which the radiation passage region in the substrate is located at least partially in the deflection element, since here the reflection surface is usually located centrally “above” the mirror surface, in particular if the radiation passage region is arranged centrally in the mirror surface.

[0048] In some embodiments, the reflective surface is arranged at least partially on an inner or outer side of the encapsulation. This particularly facilitates the production of the reflective surface. It can be applied, in particular, to the inner or outer side of the encapsulation as a very thin and thus space-taking layer using a coating process, e.g., vapor deposition.

[0049] In some embodiments, the reflection surface is arranged so as to be at least partially embedded in the interior of the encapsulation. It is thus particularly protected against external influences. In particular, it can be embedded, at least in part, between two or more components or layers of the encapsulation that are at least partially transparent to the respective deflected beam incident on it from the deflection element during operation of the microscanner system. This also offers, on the one hand, the aforementioned advantages during production (simple application as a coating) and, on the other hand, the aforementioned protective effect during embedding. The components or layers can, in particular, be in surface contact, in particular within the framework of a form-fitting or material-fitting connection. It is also conceivable for them to be separated from one another, at least in regions, by a gap. Depending on the geometry of the components orLayers also make it possible for the imaging effect of the reflective surface to be supplemented by the imaging effect of the component / layer(s) located between it and the deflection element, resulting in an overall imaging effect that differs from the individual imaging effect of the reflective surface itself (in particular, a catadioptric arrangement or catadioptric dialyte). In particular, this can ensure that incident divergent radiation, whose center of divergence lies below the deflection element, is collimated by the deflection. The optically effective surfaces (reflective and transmitting) of such an optical arrangement constructed from multiple components or layers can, in particular, be spherical or aspherical.Insofar as the term “centre of curvature” introduced above with reference to a single optically effective surface is relevant in such arrangements, this should be replaced by “focal point” (of the catadioptric arrangement) or interpreted as such, since the imaging here is caused by the interaction of different surfaces or optically effective components or layers.

[0050] In some embodiments, the radiation passage region in the substrate is located at least partially outside the deflection element. Thus, accommodation within the deflection element, in particular a through-opening therein, can be dispensed with, or, in the case of only partial placement within the deflection element, the required space in the deflection element can be kept small. This can be used particularly advantageously to increase the effective mirror surface of the deflection element.

[0051] In some embodiments, the window region is formed as a planar window, at least in one section. It can, in particular, run parallel to the substrate or tilted at an acute angle relative to it. Embodiments with planar windows are particularly advantageous in combination with the aforementioned embodiments in which the radiation passage region in the substrate is located at least partially outside the deflection element, since, due to the beam guidance past the deflection element, the reflection surface and the window region can be easily spatially separated, so that the window region does not have to provide any deflection, in particular no collimation effect. The easier manufacture of planar windows compared to curved window regions thus becomes an important advantage.

[0052] In some embodiments, the reflective surface is located at least partially within the window area and is partially transparent to the incident beam. These applications are primarily advantageous when the radiation transmission area is located at least partially within the deflection element. The reflective surface can thus partially redirect the beam coming from the radiation source onto the deflection element by reflection and, in turn, allow the beam reflected by the deflection element onto the window area to pass partially into the observation field. This also facilitates the construction of very compact designs for the microscanner system.

[0053] In some embodiments, the window region has a constant window thickness across its surface. This generally makes encapsulation easier to produce, and it also results in a largely distortion-free imaging characteristic, particularly the transmission characteristic of the window region.

[0054] In some embodiments, the microscanner system further comprises a polarization modifier arranged in the beam path between the deflection element and the deflection element. The microscanner system is configured to impart a first, in particular linear, polarization to the beam coming from the radiation source and incident on the reflection surface. When using one or more laser diodes as radiation emitters of the radiation source, this is generally already the case in the sense of pre-polarization. Typical laser diodes can have a degree of polarization of approximately 100:1. However, it is also possible, instead of or in addition to this, to arrange one or more (additional) polarization filters in the microscanner system for this purpose.

[0055] The polarization modifier is configured to impart a second polarization different from the first polarization to the beam as it travels from the reflection surface to the deflection element and back again. Specifically in the case of linear polarization, the second polarization can correspond to a linear polarization with a polarization direction different from the polarization direction of the first polarization (in particular, a polarization direction orthogonal thereto). The polarization modifier can then be designed, in particular, as a retardation plate (polarization rotator).

[0056] In addition, the reflection surface has a higher reflectance with respect to the first polarization than with respect to the second polarization.

[0057] Specifically, according to some embodiments, the polarization modifier can be configured such that the beam coming from the radiation source can pass through it before impinging on the reflecting surface without being subjected to polarization modification. In particular, it can have an opening (hole) in the spatial region through which the (divergent) beam coming from the radiation source passes through it toward the deflection element, so that this beam can pass through it undisturbed, in particular without being subjected to polarization.

[0058] The utilization of polarization described here can be used to further increase the overall achievable transmittance of the optical arrangement of the microscanner system. Since the first polarization results in a higher reflectance (relative to the second polarization) and thus a lower transmittance, radiation losses during deflection can be kept to a minimum. On the other hand, however, conversely, the beam reflected by the deflection element with the second polarization at the reflection surface results in a lower reflectance (relative to the first polarization) and thus a higher transmittance.Overall, with the same intensity of the beam coming from the radiation source, an increase in the overall transmittance (intensity of the beam from the radiation source in relation to the intensity of the beam emitted into the observation field after transmission through the window area) of the optical arrangement can be achieved compared to a corresponding arrangement but without use of polarization, in particular without a polarization modifier.

[0059] In some embodiments, the substrate delimits a first spatial region and a second spatial region from one another, and the first spatial region is at least partially delimited by the mirror surface and contains the deflection device, while the second spatial region is delimited by the side of the substrate facing away from the mirror surface and at least partially contains the radiation source. The spatial regions can be understood in particular as two half-spaces of the three-dimensional space delimited from one another by a virtual plane running through the substrate, in particular through its geometric center of gravity or center of mass. The radiation source and the deflection device are thus located on opposite sides of the virtual plane in different half-spaces.In this way, the radiation source and the substrate with the microscanner can initially be manufactured independently of each other and then combined, in particular assembled, into the microscanner system in a very compact installation space together with the deflection device and, if necessary, other components.

[0060] In some embodiments, the microscanner system comprises a layer stack consisting of multiple substrate layers stacked one above the other. This allows for simplified and throughput-enhancing manufacturing in the sense of wafer-level processing.

[0061] Specifically, the substrate and the encapsulation can each be formed as a single substrate layer or as a group of interconnected, adjacent substrate layers of the layer stack, with no substrate layer being part of both the substrate and the encapsulation. This allows these layers to be manufactured separately, particularly sequentially, and optionally from different materials.

[0062] According to some embodiments, the layer stack may comprise a substrate layer that belongs neither to the substrate nor to the encapsulation, in or on which the radiation source is arranged. Such a substrate layer may, in particular, fulfill the function of a carrier substrate for the radiation source, optionally also for the other substrate layers located above it, for example, to impart the required mechanical robustness and / or rigidity to the layer stack.

[0063] In some embodiments, the radiation source is arranged at least partially in a cavity formed in the substrate. It can, in particular, be partially located within the cavity and extend from there into the second spatial region. By being at least partially accommodated within the substrate, the (circumscribing) installation space required for the microscanner system can be further reduced. The cavity can, in particular, be arranged in a section of the substrate outside the deflection element. This means that the moment of inertia and thus its influence on the resonant frequency(ies) of the oscillations about the oscillation axis(es) that can be executed by the deflection element are not, or at least not significantly, influenced.

[0064] In some embodiments, the radiation source has a plurality of radiation emitters for electromagnetic radiation and a radiation combination device for combining the radiation emitted by the various radiation emitters, in particular of different wavelengths, to form the electromagnetic beam. This allows the intensity of the beam to be increased and / or its color to be adjusted, in particular also in a temporally variable manner. For this purpose, various controllable radiation emitters, e.g., laser diodes, can be used, the respective radiation intensity of which can be varied by control. Thus, with an appropriate selection of the radiation emitters, a color space can be created, e.g., an RGB color space with the selection of a red, a yellow, and a blue laser diode, within which the color of the combined overall beam can be adjusted.In particular, color projection images can be realized using the microscanner system. When using multiple radiation emitters, the overall data rate or modulation density transmitted by the beam can be increased with appropriate control if the radiation emitters or their respective radiation are modulated out of phase with each other.

[0065] In some embodiments, the radiation source comprises at least one VCSEL laser diode (vertical-cavity surface-emitting laser, also known in German as a surface emitter (laser)) and / or edge-emitting laser diode as the radiation emitter. Due to the small dimensions and high radiation output of such radiation emitters, as well as the extensive parallelism of the laser radiation, very space-saving yet powerful radiation sources can be implemented. Particularly when using one or more VCSEL laser diodes, it can be exploited that these can be platelet-shaped and radiate from one of their main surfaces, thus enabling a particularly space-saving combination with the substrate, particularly in terms of stacking and the need for additional beam deflection in front of or in the substrate.VCSELs also have the advantage of directly generating a round beam profile, which is often desired or advantageous for a microscanner system, without the need for additional beam shaping, and thus do not require compensation for intensity losses caused by such processes. Edge emitters, on the other hand, have the advantage of high availability, particularly for wavelengths in the visual (VIS) range. In some embodiments, the laser diode, or at least one of the laser diodes, is designed as a single-mode laser diode. This allows, in particular, high pixel resolution to be achieved in the images projected by the microscanner.

[0066] Further advantages, features and possible applications of the present solution will become apparent from the following detailed description in conjunction with the figures.

[0067] This shows or shows:

[0068] Fig. 1 shows a microscanner system according to a (symmetrical) first variant;

[0069] Fig. 2A-G various embodiments of the microscanner system according to the variant from Fig. 1;

[0070] Fig. 3 shows a microscanner system according to a (asymmetric) second variant;

[0071] Fig. 4A-C various embodiments of the microscanner system according to the variant of Fig. 1; and

[0072] Fig. 5 a microscanner system according to a third variant.

[0073] In the figures, like reference numerals designate like, similar, or corresponding elements. Elements depicted in the figures are not necessarily drawn to scale. Rather, the various elements depicted in the figures are depicted in such a way that their function and general purpose will be understood by those skilled in the art.

[0074] In a first variant 100 of a microscanner system shown in Fig. 1, which indicates a first possible basic concept for implementing the present solution, on the one hand, a substrate 105, in particular made of a semiconductor material such as silicon or a glass material, and on the other hand, a carrier substrate 110, in particular a semiconductor substrate, are stacked on top of one another and connected to one another to form a component, e.g., by a wafer bonding connection or die bonding connection. The side of the substrate 105 facing away from the carrier substrate 110 is referred to below as the "top side" 115. It also defines a virtual plane that coincides with the top side in the region of the top side.A microscanner with a deflection element 130 is formed in the substrate 105, in particular as a disc that is completely or partially mirrored on its side ("top side") facing away from the carrier substrate 110. The deflection element 130 is arranged suspended in a cavity 120 of the substrate 105 and on a spring suspension (not shown) in such a way that it can perform a rotational oscillation about at least one oscillation axis. In particular, the microscanner can be designed as a biaxial oscillator, so that the deflection element 130 can oscillate rotationally about two oscillation axes that are orthogonal to one another and each run in or parallel to its top side. To drive the oscillations, the microscanner has a drive device (not shown), which can in particular have one or more piezo actuators per oscillation axis.For illustrative purposes, the deflection element 130 is shown here in two different positions simultaneously. In reality, however, these positions can only be assumed successively if the deflection element is deflected from its rest position accordingly. Corresponding simultaneous representations of several different beam paths can also be found in the other figures.

[0075] A radiation source 125, for example a laser diode designed as a VCSEL or edge emitter, is arranged on the carrier substrate 110 and simultaneously within the cavity 120 surrounding the deflection element in such a way that, during operation, it can emit an electromagnetic beam 140, in particular a laser beam, through a radiation passage region 135 provided, preferably centrally, in the deflection element 130. The radiation passage region 135 can be designed, in particular, as a through-opening ("hole") through which the beam 140 can pass. If the three-dimensional space is divided into two half-spaces delimited from one another by the aforementioned virtual plane, it can be said that the radiation source 125 emits the beam 140 from the lower (first) half-space in the drawing through the radiation passage region 135 into the upper (second) half-space.

[0076] In the second half-space, in the beam path of beam 140, a deflection device 145 (shown only in part) is arranged, which is configured to deflect the incident beam 140 onto the deflection element 130 and, in the process, also to collimate it, so that the beam deflected to the deflection element 130 can be described, at least to a good approximation, as a parallel beam bundle. The deflection device 145 is combined with an encapsulation of the microscanner (i.e., at least the deflection element 139 with its suspension on the substrate 105), which encloses it in a gas-tight manner, in particular vacuum-encapsulated, to form a single component, in particular is designed integrally therewith.

[0077] The beam path of the beam 140 can be divided into different sections, namely a first beam section 140a between the radiation source 125 and the deflection device 145, a second beam section 140b between the deflection device 145 and the deflection element 130 and a third beam section 140c after the deflection element 130. While the beam 140 in the first beam section 140a can, depending on the radiation characteristics of the radiation source 125 and any intermediate optical elements (not present in Fig. 1), in particular also appear as a divergent beam, the collimator property of the deflection element 145 means that in the present case the beam sections 140b and 140c appear essentially as parallel beams when the deflection element 130 has a flat mirror surface. The radiation angle of the beam section 140c depends on the current orientation of the deflection element 130a, iefrom the current phase position of its oscillations around the oscillation axes.

[0078] The reflection surface 145a of the deflection element is preferably shaped such that it collimates the beam 140 incident on it during operation of the microscanner system at the transition from the beam section 140a to the beam section 140b such that at least 90%, in particular at least 99% of the cross-sectional area of ​​the collimated beam does not extend beyond the mirror surface of the deflection element 130, optionally including the radiation passage area 135 on the deflection element, when it strikes the deflection element.

[0079] The shape of the reflection surface 145a of the deflection element can, in particular, be designed such that the focus of the concave mirror formed by the reflection surface 145a lies, at least to a good approximation, at the location (of the image) of the source, i.e., in the plane defined by the deflection element, in particular by its mirror surface. The center of curvature of the reflection surface 145a is then located at a distance from it that is at least approximately twice the distance of the mirror surface of the deflection element 130 from the reflection surface 145a. In particular, this distance can be set such that it deviates by no more than 10%, in particular no more than 1%, from twice the distance of the mirror surface of the deflection element 130 from the reflection surface 145a. Overall, the microscanner system 100 represents a particularly compact design of a microprojector, making it suitable for integration into very small devices, such as AR / VR headsets.

[0080] Figures 2A to 2G illustrate various embodiments of the microscanner system 100 of Figure 1.

[0081] Fig. 2A shows a first embodiment 200 of the microscanner system 100. An annular intermediate layer 150 is arranged between the top side 115 of the substrate 105 and the deflection element 145, which is designed as a vault. The vault has an apex 145e and, in the area surrounding it, is designed as a dome, in particular as a spherical dome or as an elliptical paraboloid dome.

[0082] The deflection element 145, in conjunction with the intermediate layer 150 and the substrate in the second half-space, thus forms a gas-tight encapsulation of the microscanner. On the rear side, i.e., in the first half-space, the carrier substrate 110 also seals the cavity surrounding the deflection element 130 in a gas-tight manner, so that the cavity as a whole is sealed gas-tight, in particular airtight, and in particular can be evacuated, in order to enable largely undamped oscillations of the deflection element 130.

[0083] On its concave inner side facing the deflection element 130, the dome-shaped deflection element 145 has a reflection layer 145 that is partially transparent to the incident beam 140 (cf. beam section 140a) for partially deflecting, including collimating, the beam 140 onto the deflection element 130 (cf. beam section 140b). The deflection element 145 can in particular be made of a glass or plastic material that is largely transparent to the beam 140, to which the reflection layer is applied as a beam splitter (i.e., as a mirror with a transmittance T > 0), in particular by means of metallization, e.g., with aluminum. The deflection element can in particular be designed in the region of the reflection layer such that it has a transmittance T > 40% for the incident beam 240.

[0084] At the deflection element, the beam 140 coming from the deflection element 145 (cf. beam section 140b) is mirrored and, depending on the current deflection of the deflection element 130, is reflected back to the deflection element 145 in a direction corresponding thereto (cf. beam section 140c) and can leave the microscanner system 201 into the observation field (proportionately, since T < 100%) due to the partial transparency of the deflection element 145 in a window area 145f (no longer labeled in the following Figures 2B to 2G for reasons of clarity).

[0085] Fig. 2B shows a second embodiment 201 of the microscanner system 100. It largely corresponds to embodiment 200 of Fig. 2A, but differs in that the reflective layer 145a is formed on the outside of the dome-shaped deflection element 145, rather than on the inside.

[0086] Fig. 2C shows a third embodiment 202 of the microscanner system 100. It largely corresponds to embodiment 201 of Fig. 2B, but differs in that the deflection element 145 is multilayered, with two (or more) layers 145b and 145c, each made of a glass or plastic material that is largely transparent to the beam 140, and the reflection layer 145a is embedded between two of the layers. In particular, the layers 145b and 145c can each have a thickness that remains constant across the respective layer. In particular, these thicknesses of the layers 145b and 145c can also be identical to one another.

[0087] Fig. 2D shows a fourth embodiment 203 of the microscanner system 100. It largely corresponds to embodiment 202 of Fig. 2C, but differs in that the two layers 145b and 145c embedding the reflection layer 145a are each meniscus-shaped, in particular as a meniscus lens. The concave inner side of layer 145b and the convex outer side of layer 145c define an interface therebetween, at which the reflection surface 145a is embedded between the layers. The respective concave inner sides of the two layers 145b and 145c each have an at least approximately paraboloid shape. Together, the layers 145b and 145c thus form a (partially transparent) meniscus lens ("thick meniscus").The focus of this meniscus lens lies, at least to a good approximation, on the plane defined by the deflection element, in particular its mirror surface, in order to ensure good imaging properties.

[0088] Fig. 2E shows a fifth embodiment 204 of the microscanner system 100. It largely corresponds to embodiment 203 of Fig. 2D, but differs in that here, not only the reflection layer is located between the layers 145b and 145d, but also a gap 145 is provided, which can in particular be air-filled or evacuated. It is also conceivable to provide several separate gaps, which are either arranged next to one another between the layers 145b and 145d or (in the case of more than two layers) lie between different layers of the deflection element 145. Furthermore, the radii of the elements can be given different radii, creating degrees of freedom in the optical design with which imaging errors can be better corrected.

[0089] Fig. 2F shows a sixth embodiment 205 of the microscanner system 100. It largely corresponds to embodiment 204 from Fig. 2E, but differs in that here the layer 145b has a ring shape at its edge, with which it rests on a likewise ring-shaped support surface on the layer 145c, forming a gas-tight connection. Within this ring-shaped connection surface, the layers 145b and 145c are spaced apart, at least in sections, by a gap 145d. The reflection surface 145a can optionally be located on the concave side of the layer 145b (embodiment 145a') or on the convex side of the layer 145c (embodiment 145a"). Furthermore, it is indicated how lenses with monolithically manufactured edge shapes can be assembled into a lens stack. Thus, a wafer-level process can be used to manufacture the components and the projectors.

[0090] Fig. 2G shows a seventh embodiment 206 of the microscanner system 100. It largely corresponds to embodiment 203 from Fig. 2D, but differs in that here the two layers 145b and 145c are planar on their respective outer sides, so that the combination of the two layers 145b and 145c with the reflective layer 145a embedded between them has a plate shape delimited by parallel, flat outer surfaces. An advantage of this embodiment is that it is particularly suitable for wafer-level manufacturing (wafer-level processing), wherein first a plurality of microscanner systems are manufactured simultaneously using common wafer-level processing and then singulated, and the geometry is simplified compared to Fig. 2F.

[0091] Fig. 3 shows a second variant 300 of a microscanner system. It largely corresponds to the microscanner system 100 from Fig. 1, so that only the essential special features will be discussed below. These special features include the fact that here the radiation passage region is not arranged in the deflection element 130, but instead in a different section of the substrate 105. Thus, the beam 140 emitted by the radiation source 125, which is arranged correspondingly offset on the carrier substrate 110 and simultaneously in the radiation passage region 135 itself, can pass past the cavity 120 and the deflection element 105 from the first half-space to the deflection device 145, which is also arranged correspondingly offset, in the second half-space.

[0092] It is advantageous here that the location of the beam section 145c passing through the deflection element 145, which depends on the current orientation of the deflection element 130, can usually be located at a different location than the reflection surface 145a. Thus, the reflection surface can also be designed, in particular, as a highly reflective mirror with negligible transmission. In the areas of the deflection element 145 not occupied by the reflection surface 145a, however, the transmittance can be maximized. Overall, the overall transmittance of the microscanner system for the beam 140 can be significantly increased with one or a combination of these two configurations.

[0093] The radiation from the radiation source 125 (not shown) is directed via a (light) waveguide 155, in particular an optical fiber, through the radiation passage region 135 onto the reflection surface 145a of the deflection element 145.

[0094] Overall, the microscanner system 300 also represents a particularly compact microprojector design, making it suitable for integration into very small devices, such as AR / VR headsets. However, compared to the microscanner system 100 of Fig. 1, sufficient space must be provided next to the cavity 120 for the lateral arrangement of the radiation passage area 135 with the radiation source 125 as well as for the offset position of the deflection device 145.

[0095] Figures 4A to 4C illustrate various embodiments of the microscanner system 300 of Fig. 3.

[0096] Fig. 4A shows a first embodiment 400 of the microscanner system 300. Instead of a dome-shaped vault, a largely planar deflection element 145 is provided as an encapsulation or part thereof, in which a concavely shaped cavity is located, the concave inner wall of which forms the reflection surface 145a, which is thus integrated into the deflection element 145. Furthermore, the waveguide 155 is tilted relative to the substrate 105, so that the beam 140 is directed obliquely through the encapsulated cavity onto the reflection surface. The planar region of the deflection element 145 runs, at least substantially, parallel to the substrate 105, resulting in an overall at least largely cuboidal design.

[0097] Fig. 4B shows a second embodiment 401 of the microscanner system 300. It largely corresponds to embodiment 400 of Fig. 4A, but differs in that the largely planar deflection element 145 is tilted at an acute angle relative to the substrate 105. To form the reflection surface 145a, however, the deflection element 145 here has a projection in which a concavely shaped cavity is located, the concave inner wall of which forms the reflection surface 145a, which is thus integrated into the deflection element 145.

[0098] Fig. 4C shows a third embodiment 402 of the microscanner system 300. It largely corresponds to embodiment 400 of Fig. 4A, but differs in that the deflection element 145 is designed as a vault, in particular with two vertices. To form the reflection surface 145a, the deflection element 145 has a concavely shaped cavity, the concave inner wall of which forms the reflection surface 145a, which is thus integrated into the deflection element 145. Due to the vaulted shape, the intermediate layer 150 can optionally be omitted.

[0099] Fig. 5 shows a third variant 500 of a microscanner system. It largely corresponds to the microscanner system 100 from Fig. 1, so that only the essential special features and the partially different polarization of the beam in certain sections will be discussed below. The microscanner system 500 is configured to impart a first polarization, in particular a linear polarization aligned along a first transverse direction "x", to the beam coming from the radiation source 125 and incident on the reflection surface 145a (cf. beam section 140a). This can also optionally be the case in each of the embodiments described above with reference to Figures 1 to 4G.

[0100] The same applies to one or more, in particular focusing, optical elements 160, such as one or more converging lenses, which can be arranged in the beam path of the beam section 140a in order to focus the beam 140 at a focal point in the region of the radiation passage area 135 such that its cross-section has a minimum there. Ideally, this minimum cross-section is smaller than the smallest cross-section of the radiation passage area 135, viewed in the direction of the beam path, so that the beam 140 is not partially shielded by the edge of the radiation passage area 135.

[0101] The first polarization can, in particular, already be effected in the radiation source 125 itself (in particular a laser diode) and / or by a polarization filter (not shown) following the beam path. Depending on the design, it is also possible for the polarization modifier 165 to contribute to the creation of the first polarization. In the present example of Fig. 5, however, the polarization modifier 165 has a continuous opening at the point where the beam path passes through it in the beam section 140a, so that it can pass through the polarization modifier 165 before impinging on the reflection surface 145a without being subjected to polarization modification.

[0102] However, the aforementioned special features of the microscanner system 500 primarily include the fact that in the microscanner system 500, a polarization modifier 165 is additionally arranged in the beam path between the deflection element 145 and the deflection element 130. This polarization modifier is configured to impart a second polarization different from the first polarization to the beam 140 as it travels from the reflection surface 145a to the deflection element 130 (cf. beam section 140b) and back again (cf. beam section 140c), in particular a linear polarization aligned along a second transverse direction "y". Thus, the beam 140 coming from the radiation source 125 has the first polarization when it first strikes the deflection element 145, more precisely its reflection surface 145a (cf. beam section 140a), while subsequently coming from the deflection element (cf.Beam section 140c) has the second polarization upon its second impact, which is different from the first polarization.

[0103] As a further special feature, the reflection surface 145a has a higher reflectance (and thus lower transmittance) with respect to the first polarization than with respect to the second polarization. As a result, the transmission-related radiation loss of the beam coming from the beam section 140a at the reflection surface 145a, as well as the reflection-related radiation loss of the beam coming from the deflection element (cf. beam section 140c) at the reflection surface 145a, are also reduced. This results in a higher usable transmittance of the entire arrangement, which can be used for brighter projections into the observation field or to reduce the required radiant power of the radiation source 125. LIST OF REFERENCE SYMBOLS

[0104] 100 micro scanner system, first variant (basic concept)

[0105] 105 (microscanner) substrate with deflection element

[0106] 110 Carrier substrate

[0107] 115 Top side of the substrate 105, defines virtual plane as interface between two spatial areas

[0108] 120 Cavity in the substrate 105 for receiving the deflection element

[0109] 125 Radiation source, e.g. laser diode

[0110] 130 Deflection element with mirror surface

[0111] 135 Radiation passage area, in particular passage opening

[0112] 140 beam or beam path

[0113] 140a Beam section between radiation passage area and deflection device

[0114] 140b Beam section between deflection device and deflection element

[0115] 140c Beam section after deflection element, scanning beam

[0116] 145 Deflection device, also encapsulation or part thereof

[0117] 145a Reflecting surface of the deflection device

[0118] 145b first layer of the deflection element

[0119] 145c second layer of the deflection element

[0120] 145d Gap, especially air gap or vacuum gap

[0121] 145e vertex

[0122] 145f window area

[0123] 150 intermediate layer

[0124] 155 optical fiber as (light) waveguide

[0125] 160 optical elements, especially convex lenses

[0126] 165 Polarization modifier, in particular retardation plate

[0127] 200 Microscanner system, first embodiment of the microscanner system 100

[0128] 201 Microscanner system, second embodiment of the microscanner system 100

[0129] 202 Microscanner system, third embodiment of the microscanner system 100

[0130] 203 Microscanner system, fourth embodiment of the microscanner system 100

[0131] 204 Microscanner system, fifth embodiment of the microscanner system 100

[0132] 205 Microscanner system, sixth embodiment of the microscanner system 100

[0133] 206 Microscanner system, seventh embodiment of the microscanner system 100

[0134] 300 micro scanner system, second variant (basic concept)

[0135] 400 micro scanner system, first embodiment of the 300 micro scanner system

[0136] 401 Microscanner system, second embodiment of the microscanner system 300

[0137] 402 Microscanner system, third embodiment of the microscanner system 300

[0138] 500 micro scanner system, third variant

Claims

CLAIMS 1. A microscanner system (100; 200,..., 206; 300; 400, ..., 402; 500), comprising: a microscanner formed in a substrate (105), in particular in a semiconductor chip, with a deflection element (130) suspended so as to be capable of rotational vibration about at least one vibration axis, said deflection element having a surface formed as a mirror surface for deflecting electromagnetic radiation incident on the mirror surface; a radiation source (125) for emitting an electromagnetic beam (140) to be reflected by the deflection element (130); an encapsulation for encapsulating the microscanner, wherein the encapsulation has a window region (145f) that is at least partially transparent to the beam (140) after its deflection by the deflection element (130); and a deflection device (145) with an at least partially reflecting reflection surface (145a) for deflecting the electromagnetic beam (140) emitted by the radiation source (125) onto the mirror surface;wherein the radiation source (125) is arranged and oriented such that a beam path of the beam (140) extends at least partially through a radiation passage region (135) in the substrate (105) to the deflection device (145); and wherein the deflection device (145) is arranged in or on the encapsulation or formed integrally therewith.

2. Microscanner system (100; 200, ..., 206; 300; 400, ..., 402; 500) according to claim 1, wherein the microscanner system (100; 200, ..., 206; 300; 400, ..., 402; 500) is configured such that the reflection surface (145a) of the deflection device (145) is simultaneously designed as a collimator for collimating the beam (140) emitted by the radiation source (125) and incident on the deflection device (145) during operation of the microscanner system (100; 200, ..., 206; 300; 400, ..., 402; 500) during the deflection of the beam.

3. Microscanner system (100; 200, ..., 206; 300; 400, ..., 402; 500) according to claim 2, wherein the reflection surface (145a) is shaped such that it collimates the beam (140) incident on it during operation of the microscanner system (100; 200, ..., 206; 300; 400, ..., 402; 500) such that at least 90%, in particular at least 99% of the cross-sectional area of ​​the collimated beam (140) does not pass over the mirror surface of the Deflection element (130), optionally including the radiation passage region (135) on the deflection element (130).

4. Microscanner system (100; 200,...,206; 300; 400, ...,402; 500) according to one of the preceding claims, wherein the reflection surface (145a) is formed at least in sections as a vault at least partially spanning the deflection element (130).

5. Microscanner system (100; 200, ...,206; 300; 400, ...,402; 500) according to claim 4, wherein a virtual circle of curvature adjacent to a vertex of the vault has a focus which lies on the mirror surface of the deflection element (130) or is not more than 10%, in particular not more than 1%, of the radius of curvature R of the circle of curvature away from it.

6. Microscanner system (100; 200, ...,206; 300; 400, ...,402; 500) according to claim 4, wherein a virtual two-dimensional circle of curvature adjacent to a vertex of the vault has a radius of curvature R which satisfies the condition R = ad, where d indicates the distance of the reflection surface (145a) from a center of divergence of the beam (140) emitted by the radiation source (125) during its operation and 1.9 < a ​​< 2.

1.

7. Microscanner system (100; 200, ..., 206; 500) according to one of claims 4 to 6, wherein the vault is formed as a dome in a region surrounding the apex.

8. Microscanner system (100; 200,...,206; 500) according to claim 7, wherein the dome is formed as a spherical dome or as an elliptical paraboloidal dome in the region surrounding the vertex.

9. Microscanner system (100) according to one of claims 4 to 6, wherein the vault is formed as a prismatic paraboloid or as a partial ellipsoid in a region surrounding the vertex.

10. Microscanner system (100; 200, ..., 206; 500) according to one of the preceding claims, wherein the radiation passage region (135) in the substrate (105) is located at least partially in the deflection element (130).

11. Microscanner system (100; 200, ..., 206; 500) according to claim 10, wherein the reflection surface (145a) overlaps with the window region (145f) and has a transmittance T > 0, in particular T > 40%, at least in the overlap region for the beam (140) impinging on it during operation of the microscanner system (100; 200, ..., 206; 500).

12. Microscanner system (100; 200; 201; 300; 400, ..., 402; 500) according to one of the preceding claims, wherein the reflection surface (145a) is arranged at least in sections on an inner side or on an outer side of the encapsulation.

13. Microscanner system (100; 202, ..., 206; 300) according to one of the preceding claims, wherein the reflection surface (145a) is arranged at least partially embedded in the interior of the encapsulation.

14. Microscanner system (100; 202, ..., 206; 300) according to claim 13, wherein the reflection surface (145a) is embedded at least partially between two or more components or layers (145b, 145c) of the encapsulation which are at least partially transparent to the respective deflected beam (140) incident on it from the deflection element (130) during operation of the microscanner system (100; 202, ..., 206; 300).

15. Microscanner system (300; 400,...,402) according to one of the preceding claims, wherein the radiation passage region (135) in the substrate (105) is located at least partially outside the deflection element (130).

16. Microscanner system (400; 401) according to one of the preceding claims, wherein the window region (145f) is formed as a plan window at least in one section.

17. Microscanner system (400) according to claim 16, wherein the section of the window region (145f) formed as a planar window runs parallel to the substrate (105).

18. Microscanner system (401) according to claim 16, wherein the section of the window region (145f) formed as a planar window is tilted at an acute angle relative to the substrate (105).

19. Microscanner system (100; 200, ..., 206; 500) according to one of the preceding claims, wherein the reflection surface (145a) lies at least partially in the window region (145f) and is partially transparent to the beam (140) incident on it.

20. Microscanner system (100; 200,...,206; 300; 400, ...,402; 500) according to one of the preceding claims, wherein the window region (145f) has a constant window thickness over its area.

21. The microscanner system (500) according to any one of the preceding claims, further comprising a polarization modifier (165) arranged in the beam path between the deflection element and the deflection element (130); wherein: the microscanner system (500) is configured to impart a first polarization to the beam (140) coming from the radiation source (125) and incident on the reflection surface (145a); the polarization modifier (165) is configured to impart a second polarization different from the first polarization to the beam (140) on its path from the reflection surface (145a) to the deflection element (130) and back again; and the reflection surface (145a) has a higher reflectance with respect to the first polarization than with respect to the second polarization.

22. Microscanner system (500) according to claim 21, wherein the polarization modifier (165) is designed such that the beam (140) coming from the radiation source (125) can pass through it before impinging on the reflection surface (145a) without being subjected to a polarization modification.

23. Microscanner system (100; 200,...,206; 300; 400, ...,402; 500) according to one of the preceding claims, wherein the substrate (105) delimits a first spatial region and a second spatial region from one another and the first spatial region is at least partially delimited by the mirror surface and contains the deflection device (145), while the second spatial region is delimited by the side of the substrate (105) facing away from the mirror surface and at least partially contains the radiation source (125).

24. Microscanner system (100; 200, ..., 206; 300; 400) according to one of the preceding claims, wherein the microscanner system (100; 200, ..., 206; 300; 400) comprises a layer stack of several substrate layers stacked one above the other.

25. Microscanner system (100; 200, ..., 206; 300; 400) according to claim 24, wherein the The substrate (105) and the encapsulation are each formed as a single substrate layer or as a group of interconnected, adjacent substrate layers of the layer stack, and no substrate layer is part of both the substrate and the encapsulation.

26. The microscanner system (100; 200,...,206; 300; 400) according to claim 24 or 25, wherein the layer stack comprises a substrate layer (110) belonging neither to the substrate (105) nor to the encapsulation, in or on which the radiation source (125) is arranged.

Images