Thermal transfer printing device

Abstract

A thermal transfer printing device (100). The heat transfer printing device (100) comprises a housing (10), a first handle (20), a heating member (40), a first control circuit (50), and a heat dissipation member (70). The housing (10) comprises a first side (10a) and a second side (10b) which are arranged opposite to each other; the first handle (20) is disposed on the first side (10a), and the first handle (20) is provided with a first accommodating cavity (21); the heating member (40) is disposed on the second side (10b), and the heating member (40) is used for executing a thermal transfer printing task on a workpiece to be machined; the first control circuit (50) is disposed in the first accommodating cavity (21); and the heat dissipation member (70) is disposed on the first control circuit (50) and located in the first accommodating cavity (21), and the heat dissipation member (70) is used for dissipating heat of the first control circuit (50) and not in contact with the inner wall of the first accommodating cavity (21). By providing the heat dissipation member (70), the first control circuit (50) is prevented from being overheated to affect the service life, and the heat dissipation stability of the heat dissipation member (70) for the first control circuit (50) is good, thereby facilitating the improvement of use experience of operators.

Description

Thermal transfer device

[0001] This application claims priority to the Chinese patent applications filed with the Patent Office of China on June 30, 2023, with application number 2023217211786 and application name “A Thermal Transfer Device”, and filed with the Patent Office of China on June 20, 2024, with application number 2024214244918 and application name “Thermal Transfer Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the field of thermal transfer processing technology, and in particular relates to a thermal transfer device. Background Art

[0003] Thermal transfer, also known as thermal sublimation, is a special process in which any image, such as a portrait or landscape, is printed on a thermal transfer film using thermal transfer ink. The thermal transfer device then heats the image to a certain temperature within a few minutes, and the image on the thermal transfer film is transferred to materials such as porcelain cups, plates, tiles, clothing, and metal.

[0004] Most thermal transfer devices currently available on the market are constructed in the form of a handle. A portion of the control circuit board is integrated into the handle. By gripping the handle, the thermal transfer device heats the thermal transfer film, transferring the pattern on the film to the object being processed.

[0005] Summary of the Invention

[0006] In order to address the shortcomings of the prior art, the present application provides a thermal transfer device that can ensure the heat dissipation effect of at least part of the control circuit set in the handle.

[0007] The present application provides a thermal transfer device, comprising:

[0008] The housing comprises a first side and a second side disposed opposite to each other;

[0009] A first handle is provided on the first side, wherein the first handle defines a first receiving cavity;

[0010] a heating element, disposed on the second side, and configured to perform a thermal transfer task on the workpiece to be processed;

[0011] A first control circuit is disposed in the first receiving cavity; and

[0012] A heat sink is provided on the first control circuit and is located in the first receiving cavity. The heat sink is used to dissipate heat for the first control circuit and does not contact the inner wall of the first receiving cavity.

[0013] In a possible implementation, the thermal transfer device further includes:

[0014] a second handle disposed on the first side, the second handle being spaced apart from the first handle, and the second handle defining a second receiving cavity; and

[0015] The second control circuit is electrically connected to the first control circuit and is used to transmit electrical signals to the first control circuit.

[0016] In a possible implementation, the first control circuit is a heating control circuit, which is electrically connected to the heating element; the second control circuit is a main control circuit, which is electrically connected to the heating control circuit and is used to send a control electrical signal to the heating control circuit.

[0017] In a possible embodiment, the first handle is provided with a first fixing column, and the first fixing column is fixed to the inner wall of the first receiving cavity;

[0018] The heating control circuit is provided with a first fixing groove, and the first fixing column is clamped in the first fixing groove.

[0019] In a possible implementation, a relief groove is provided on the heat dissipation element, and the relief groove does not contact the first fixing column.

[0020] In a possible embodiment, the housing has a receiving cavity, and the heating element is at least partially received in the receiving cavity and exposed at the second side;

[0021] The accommodating cavity is communicated with the first receiving cavity to form a first through hole, and the heating control circuit is electrically connected to the heating element via a first electrical connector penetrating the first through hole.

[0022] In a possible embodiment, the accommodating cavity is connected to the second accommodating cavity to form a second through hole, and the main control circuit is electrically connected to the heating control circuit through a second electrical connector penetrating the first through hole, the accommodating cavity and the second through hole.

[0023] In a possible implementation, the thermal transfer device further includes a heat insulating member disposed between the first side of the housing and the heat generating element;

[0024] The second electrical connector electrically connecting the main control circuit and the heating control circuit is disposed between the first side of the housing and the thermal insulation member.

[0025] In a possible embodiment, the first handle includes a first handle body, a first covering member, and a first fixing member. The first handle body defines the first receiving cavity. The first covering member covers a side of the heat sink facing away from the heating control circuit.

[0026] A first fixing hole is provided on the first covering member. The first fixing member passes through the first fixing hole and is connected to the first fixing column, so that the first covering member is fixedly connected to the first fixing member.

[0027] In a possible embodiment, the first handle further includes a first decorative piece, which is mounted on a side of the first covering piece facing away from the heating control circuit; a first card slot is provided on the first covering piece, and a first buckle is provided on the first decorative piece, and the first buckle engages with the first card slot.

[0028] In a possible implementation, a second fixing post is provided on the second handle, and the second fixing post is fixed to the inner wall of the second receiving cavity;

[0029] The main control circuit is provided with a second fixing groove, and the second fixing column is clamped in the second fixing groove;

[0030] The second handle includes a second handle body, a second covering member, and a second fixing member. The second handle body defines a second receiving cavity. The second covering member covers a side of the main control circuit away from a bottom wall of the second receiving cavity.

[0031] The second covering member is provided with a second fixing hole, and the second fixing member passes through the second fixing hole and is connected to the second fixing column.

[0032] In a possible implementation, the second handle further includes a second decorative piece, and the second decorative piece is mounted on a side of the second covering piece facing away from the heating control circuit;

[0033] The second covering member is provided with a second card slot, and the second decorative member is provided with a second buckle, and the second buckle is engaged with the second card slot.

[0034] The thermal transfer device provided by the present application integrates the first control circuit into the first receiving cavity of the first handle, so that the installation of the components of the thermal transfer device is more compact, which is conducive to improving the space utilization efficiency of the thermal transfer device and further miniaturizing the thermal transfer device. In addition, by providing a heat sink to dissipate heat from the first control circuit, the influence of the first control circuit on the temperature of the first handle can be reduced, and the service life of the first control circuit due to excessive self-heating of the first control circuit can be reduced. At the same time, by not contacting the heat sink with the inner wall of the first receiving cavity, the heat sink can be prevented from being displaced relative to the first control circuit due to deformation of the handle caused by the operator holding the first handle, which is conducive to ensuring the heat dissipation effect of the heat sink on the first control circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] To more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some implementation methods provided by the embodiments of the present application. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0036] FIG1 is a schematic structural diagram of a thermal transfer system provided in one embodiment of the present application;

[0037] FIG2 is a schematic diagram of an assembly of a thermal transfer device provided in one embodiment of the present application;

[0038] FIG3 is an exploded schematic diagram of a thermal transfer device provided in one embodiment of the present application;

[0039] FIG4 is a cross-sectional schematic diagram of a thermal transfer device provided in one embodiment of the present application;

[0040] FIG5 is a second cross-sectional schematic diagram of a thermal transfer device provided in one embodiment of the present application;

[0041] FIG6 is a schematic diagram of a partial structure of a handle body provided in one embodiment of the present application;

[0042] FIG7 is a schematic diagram of an assembly structure of a heating control circuit and a heat sink provided in one embodiment of the present application;

[0043] FIG8 is a schematic structural diagram of a first covering member provided in one embodiment of the present application;

[0044] FIG9 is a schematic structural diagram of a first decorative element provided in one embodiment of the present application;

[0045] FIG10 is a schematic diagram of the structure of a second handle body provided in one embodiment of the present application;

[0046] FIG11 is a schematic structural diagram of a main control circuit provided in one embodiment of the present application;

[0047] FIG12 is a schematic structural diagram of a second covering member provided in one embodiment of the present application;

[0048] FIG13 is a schematic structural diagram of a second decorative component provided in one embodiment of the present application. DETAILED DESCRIPTION

[0049] The technical solution of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] In the description of the present application, the description of the following embodiments is with reference to the attached diagrams to illustrate specific embodiments that the present application can be used to implement. The directional terms mentioned in the description of the present application, such as "upper", "lower", "front", "back", "left", "right", "inside", "outside", "side", "side wall", "top surface", "top wall", "bottom surface", "bottom wall", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, for example, "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. In the description of the present application, the "connection" and "connection" involved, unless otherwise specified, include direct connection (connection) and indirect connection (connection). The above definitions are only for convenience of expression and cannot be understood as limitations on the present application.

[0051] In conventional thermal transfer devices, the control circuit board easily generates heat when powered on, resulting in a high temperature on the control circuit board, which can affect its service life. Furthermore, since the handle needs to be gripped by the operator, the heat generated by the control circuit board also increases the temperature of the handle, affecting the operator's experience.

[0052] Based on this, the present application provides a thermal transfer device and a thermal transfer system to solve the technical problems existing in the above-mentioned prior art. The thermal transfer device and the thermal transfer system provided by the present application are described in detail below with reference to the accompanying drawings.

[0053] Please refer to FIG1 , which is a schematic structural diagram of a thermal transfer system provided in one embodiment of the present application.

[0054] The present embodiment provides a thermal transfer system 1000, which includes a thermal transfer device 100 and an external extension structure 300, and the thermal transfer device 100 and the external extension structure 300 are detachably connected. The thermal transfer system 1000 includes a manual state and a semi-automatic state. In the manual state, the thermal transfer device 100 and the external extension structure 300 are separated, and the user can directly drive the thermal transfer device 100 to move to perform thermal transfer processing on the workpiece to be processed. The user can directly perform thermal transfer processing on the workpiece to be processed that is smaller in size and irregular in shape. In the semi-automatic state or the fully automatic state, the thermal transfer device 100 is connected to the external extension structure 300, and the thermal transfer device 100 can be driven to move by the external extension structure 300 to perform thermal transfer processing on the workpiece to be processed that is larger in size. It can be understood that the external extension structure 300 includes but is not limited to other structures such as a manipulator and a robotic arm, and this application does not limit this.

[0055] The thermal transfer system 1000 and the thermal transfer device 100 provided in this application perform a thermal transfer process on the workpiece to be processed as a hot pressing process to achieve the transfer of the pattern, that is, the user places the thermal transfer device 100 on the transfer paper and the workpiece to be processed, so that the thermal transfer device 100 and the transfer paper are in contact with each other, so that the pattern, text, etc. on the transfer paper are transferred to the workpiece to be processed under the action of the heat and pressure generated by the thermal transfer device 100. It is understandable that in other embodiments, the thermal transfer system 1000 and the thermal transfer device 100 can process the workpiece to be processed only by the heat generated by the thermal transfer device 100, or the thermal transfer system 1000 and the thermal transfer device 100 can process the workpiece to be processed only by the pressure generated by the thermal transfer device 100, and this application does not limit this.

[0056] The thermal transfer system 1000 provided in the present application is detachably connected to the thermal transfer device 100 and the external extension structure 300, so that the thermal transfer system 1000 can be switched between a manual state and a semi-automatic state or a fully automatic state, so that the operation of the thermal transfer device 100 in processing the workpiece to be processed is more flexible and convenient. Moreover, when the thermal transfer system 1000 is in the semi-automatic state or the fully automatic state, the thermal transfer device 100 is driven to move by the external extension structure 300 to process the workpiece to be processed. The user does not need to manually drive the thermal transfer device 100 to move, which can reduce the user's workload when processing the workpiece to be processed, and can also improve the safety of the thermal transfer system 1000 in processing the workpiece to be processed, which is conducive to improving the processing efficiency and processing safety of the thermal transfer system 1000 in processing the workpiece to be processed.

[0057] In some embodiments, the thermal transfer system 1000 may further include a worktable 500 for supporting a workpiece to be processed. The worktable 500 is rotatably connected to the external expansion structure 300. The external expansion structure 300 can drive the thermal transfer device 100 to rotate relative to the worktable, allowing the thermal transfer device 100 to process the workpiece placed on the worktable 500.

[0058] In some embodiments, the thermal transfer system 1000 may further include a control device (not shown). In a semi-automatic state or a fully automatic state, the control device is used to control the movement of the external extension structure 300, thereby driving the thermal transfer device 100 connected to the external extension structure 300 to move, thereby processing the workpiece to be processed.

[0059] The thermal transfer system 1000 provided in this embodiment adds a control device to the thermal transfer system 1000. When batch processing of the workpieces to be processed is required, a control program can be preset in the control device so that the control device controls the movement of the external extension structure 300, thereby driving the thermal transfer device 100 connected to the external extension structure 300 to move, so as to perform batch processing of the workpieces to be processed, thereby making the thermal transfer system 1000 intelligent, and also helping to improve the efficiency of the thermal transfer system 1000 in processing the workpieces to be processed.

[0060] Please refer to Figures 2 to 4. Figure 2 is an assembly diagram of a thermal transfer device provided in an embodiment of the present application. Figure 3 is an exploded diagram of a thermal transfer device provided in an embodiment of the present application. Figure 4 is a cross-sectional diagram of a thermal transfer device provided in an embodiment of the present application.

[0061] In one embodiment, the thermal transfer device 100 includes a housing 10, a first handle 20, a heating element 40, a first control circuit 50 and a heat sink 70. The housing 10 includes a first side 10a and a second side 10b that are arranged opposite to each other. The first handle 20 is arranged on the first side 10a. The heating element 40 is arranged on the second side 10b. The heating element 40 is used to generate heat to achieve the thermal transfer task of the workpiece to be processed, that is, the heating element 40 can generate heat to provide heat to the workpiece to be processed during the hot pressing process. The first handle 20 has a first receiving cavity 21. The first control circuit 50 and the heat sink 70 are arranged in the first receiving cavity 21. The heat sink 70 is arranged on the first control circuit 50. The heat sink 70 is used to dissipate heat for the first control circuit 50. Among them, the first control circuit 50 includes but is not limited to circuits that generate a large amount of heat when working, such as a heating control circuit.

[0062] The thermal transfer device 100 provided in this embodiment integrates the first control circuit 50 within the first receiving cavity 21 of the first handle 20, thereby making the installation of the components of the thermal transfer device 100 more compact. This improves the space utilization efficiency of the thermal transfer device 100 and facilitates the miniaturization of the thermal transfer device 100. Furthermore, the heat sink 70 is provided to dissipate heat from the first control circuit 50, thereby reducing the impact of the first control circuit 50 on the temperature of the first handle 20 and reducing the lifespan of the first control circuit 50 due to excessive self-heating.

[0063] In a specific embodiment, the heat sink 70 does not contact the inner wall of the first receiving cavity 21. This prevents the heat sink 70 from being displaced relative to the first control circuit 50 due to deformation of the first handle 20 caused by the operator gripping it, thereby ensuring the heat dissipation effect of the heat sink 70 on the first control circuit 50. Furthermore, this prevents direct transfer of heat from the heat sink 70 to the first handle 20 due to contact between the heat sink 70 and the inner wall of the first receiving cavity 21.

[0064] Please refer to FIG. 2 to FIG. 5 , FIG. 5 is a second cross-sectional schematic diagram of a thermal transfer device provided in one embodiment of the present application.

[0065] In one embodiment, the thermal transfer device 100 includes a housing 10, a first handle 20, a second handle 30, a heating element 40, a first control circuit 50, a second control circuit 60, and a heat sink. The housing 10 includes a first side 10a and a second side 10b that are arranged opposite to each other, the first handle 20 is arranged on the first side 10a, the second handle 30 is arranged on the first side 10a, and the first handle 20 and the second handle 30 are arranged at intervals. The heating element 40 is arranged on the second side 10b, and the heating element 40 is used to generate heat to achieve the thermal transfer function, that is, the heating element 40 can generate heat to provide heat to the workpiece to be processed during the hot pressing process. It can be understood that in the embodiment of the present application, the first control circuit 50 is a heating control circuit, and the heating control circuit is electrically connected to the heating element 40. The second control circuit 60 is a main control circuit. The main control circuit is electrically connected to the heating control circuit, and the main control circuit is used to send a control signal to the heating control circuit. The first handle 20 has a first receiving cavity 21, and a first control circuit 50 is disposed within the first receiving cavity 21. The first control circuit 50 is electrically connected to the heating element 40. The second handle 30 has a second receiving cavity 31, and a second control circuit 60 is disposed within the second receiving cavity 31. The second control circuit 60 is electrically connected to the first control circuit 50. Since the first control circuit 50 is used to output an electrical signal to the heating element 40, causing the heating element 40 to generate heat, in order to generate a large amount of heat in a short period of time, the voltage required to be input to the heating element 40 is correspondingly higher. Therefore, a higher voltage is input to the first control circuit 50. The second control circuit 60 is only used to output control electrical signals and can be implemented without a high voltage. Therefore, a lower voltage is input to the second control circuit 60 than to the first control circuit 50. The second control circuit 60 sends control electrical signals to the first control circuit 50 to change the operating mode of the thermal transfer device 100, the heating temperature of the heating element 40, the heating time of the heating element 40, and so on. The heat sink 70 is disposed on the first control circuit 50 and located in the first receiving cavity 21 . The heat sink 70 is used to dissipate heat from the first control circuit 50 .

[0066] The thermal transfer device 100 provided in this embodiment has, firstly, a first handle 20 and a second handle 30 spaced apart from each other provided on the housing 10. When the thermal transfer device 100 is in manual operation, the user can simultaneously grasp the first handle 20 and the second handle 30, thereby making the force applied to the thermal transfer device 100 more uniform, thereby facilitating improved thermal transfer effects and quality of patterns, text, and the like transferred by the thermal transfer device 100. Secondly, based on the spacing between the first handle 20 and the second handle 30, a first receiving cavity 21 is provided on the first handle 20, and a second receiving cavity 31 is provided on the main body of the second handle 30. The first control circuit 50 is provided in the first receiving cavity 21, and the second control circuit 60 is provided in the second receiving cavity 31. When the thermal transfer device 100 is in operation, the mutual interference between the first control circuit 50 and the second control circuit 60 is reduced, thereby facilitating stable working performance of the first control circuit 50 and the second control circuit 60, and also facilitating long service lives of the first control circuit 50 and the second control circuit 60. Thirdly, by integrating the first control circuit 50 with the first handle 20, and the second control circuit 60 with the second handle 30, the components of the thermal transfer device 100 are more compactly mounted, thereby improving the space efficiency of the thermal transfer device 100 and facilitating the miniaturization of the thermal transfer device 100. Fourthly, by dissipating heat from the first control circuit 50 through the heat sink 70, the impact of the first control circuit 50 on the temperature of the first handle 20 can be reduced, and the lifespan of the first control circuit 50, which may be affected by excessive self-heating, can be reduced.

[0067] Please refer to Figures 2 to 4. In one embodiment, the housing 10 has a receiving cavity 11, and part of the heating element 40 is received in the receiving cavity 11 to be fixedly connected to the housing 10, and another part of the heating element 40 is exposed to the second side 10b of the housing 10 to realize the thermal transfer function. The receiving cavity 11 is connected to the first receiving cavity 21 and forms a first through hole 12. The first control circuit 50 passes through the first through hole 12 and is electrically connected to the heating element 40 through a first electrical connector (not shown). The first through hole 12 is formed by communicating with the first receiving cavity 21 through the receiving cavity 11, so that the first control circuit 50 can be electrically connected to the heating element 40 through the first electrical connector.

[0068] Referring to Figures 2 to 5 , in one embodiment, the housing 10's accommodating cavity 11 communicates with the second accommodating cavity 31 and forms a second through-hole 13. The first through-hole 12, the accommodating cavity 11, and the second through-hole 13 are sequentially connected. The first control circuit 50 is electrically connected to the second control circuit 60 via a second electrical connector (not shown) extending through the first through-hole 12, the accommodating cavity 11, and the second through-hole 13. The first through-hole 12, the accommodating cavity 11, and the second through-hole 13 facilitate electrical connection between the first control circuit 50 and the second control circuit 60.

[0069] Referring to Figures 2 to 5, in one embodiment, the thermal transfer device 100 further includes a thermal insulation member 80, which is disposed between the first side 10a of the housing 10 and the heating element 40. By disposing the thermal insulation member 80 between the first side 10a of the housing 10 and the heating element 40, heat conduction between the heating element 40 and the first side 10a of the housing 10 is reduced, thereby reducing the thermal impact of the heating element 40 on the components connected to the first side 10a of the housing 10 or located between the first side 10a of the housing 10 and the thermal insulation member 80. Specifically, the second electrical connector electrically connecting the first control circuit 50 and the second control circuit 60 is disposed between the first side 10a of the housing 10 and the thermal insulation member 80. By disposing the second electrical connector between the first side 10a of the housing 10 and the thermal insulation member 80, the thermal impact of the heating element 40 on the second electrical connector electrically connecting the first control circuit 50 and the second control circuit 60 can be reduced.

[0070] Please refer to Figures 3 to 6 and Figure 7. Figure 6 is a schematic diagram of the partial structure of a handle body provided in an embodiment of the present application. Figure 7 is a schematic diagram of the assembly structure of a heating control circuit and a heat sink provided in an embodiment of the present application.

[0071] In one embodiment, the first handle 20 is provided with a first fixing post 22, which is fixed to the inner sidewall of the first receiving cavity 21 and extends from the first side 10a to the second side 10b. The first control circuit 50 is provided with a first fixing groove 51, which is provided around the periphery of the first control circuit 50 and has an opening located at the edge of the first control circuit 50. When the first control circuit 50 is installed in the first receiving cavity 21, the first fixing groove 51 cooperates with the first fixing post 22, and at least a portion of the first fixing post 22 is engaged in the first fixing groove 51, thereby securing the first control circuit 50 in the first receiving cavity 21. The first control circuit 50 is spaced apart from the bottom wall of the first receiving cavity 21, thereby ensuring that the first control circuit 50 is spaced apart from the first side 10a. The spacing between the first control circuit 50 and the bottom wall of the first receiving cavity 21 can be achieved by changing the size of the first fixing column 22, that is, the size of the bottom wall of the part of the first fixing column 22 close to the first receiving cavity 21 is larger than the size of the bottom wall of the part of the first fixing column 22 away from the first receiving cavity 21, so that the first fixing groove 51 and the part of the first fixing column 22 close to the bottom wall of the first receiving cavity 21 are spaced apart.

[0072] The thermal transfer device 100 provided in this embodiment, on the one hand, prevents the first control circuit 50 from loosening and shaking within the first receiving cavity 21 by cooperating with the first fixing post 22 on the inner wall of the first receiving cavity 21, thereby securing the first control circuit 50 within the first receiving cavity 21. This helps improve the stability of the first control circuit 50 when installed within the first receiving cavity 21, thereby improving the performance stability of the first control circuit 50 during operation. On the other hand, by spacing the first control circuit 50 from the bottom wall of the first receiving cavity 21, thereby spacing the first control circuit 50 from the first side 10a, the heat generated by the heating element 40 can be reduced from being transmitted to the first control circuit 50 through the housing 10, thereby reducing the impact of the heat generated by the heating element 40 on the electronic components of the first control circuit 50, ensuring the stability of the performance of the first control circuit 50 during operation, and also helping to improve the service life of the first control circuit 50, thereby improving the stability of the thermal transfer function of the thermal transfer device 100.

[0073] In a specific embodiment, there are ten first fixing posts 22, which are spaced circumferentially along the inner wall of the first receiving cavity 21. There are ten first fixing grooves 51, which are spaced circumferentially along the circumference of the first control circuit 50. The ten first fixing posts 22 and the ten first fixing grooves 51 cooperate to position the first control circuit 50 within the first receiving cavity 21 in any direction along the first side 10a, thereby further improving the stability of the first control circuit 50 within the first receiving cavity 21.

[0074] It can be understood that in some other embodiments, the number of first fixing columns 22 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of first fixing slots 51 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and this application does not impose any restrictions on this.

[0075] Referring to Figures 3, 4, 6, and 7, in one embodiment, a heat sink 70 is fixedly mounted on the first control circuit 50. The heat sink 70 is used to dissipate heat from the first control circuit 50, so that the first control circuit 50 can operate at a normal ambient temperature. The heat sink 70 can also continue to dissipate heat from the first control circuit 50 when the first control circuit 50 stops operating. In the thermal transfer device 100 provided in this embodiment, when the first control circuit 50 is operating, the electronic components on the first control circuit 50 will generate heat. By providing the heat sink 70 on the first control circuit 50, the heat sink 70 is used to dissipate heat from the first control circuit 50, thereby preventing the first control circuit 50 from experiencing performance abnormalities due to excessively high ambient temperatures, thereby improving the stability of the first control circuit 50 during operation and ensuring that the thermal transfer device 100 can normally perform its thermal transfer function.

[0076] In a specific embodiment, an avoidance groove 71 is provided on the heat sink 70. The avoidance groove 71 is provided around the heat sink 70, and the avoidance groove 71 is spaced apart from the first fixed column 22 so that the first fixed column 22 does not contact the inner wall of the avoidance groove 71. This can prevent the heat sink 70 from being displaced relative to the first control circuit 50 due to the displacement of the first fixed column 22 caused by the deformation of the first handle 20, thereby ensuring the heat dissipation effect of the heat sink 70 on the first control circuit 50.

[0077] It can be understood that in some other embodiments, the thermal transfer device 100 may further include a sensor (not shown in the figure), which is used to monitor the ambient temperature when the first control circuit 50 is working in real time, and then control whether the heat sink 70 is working, or control the working power of the heat sink 70, so as to make the process of heat dissipation of the first control circuit 50 by the heat sink 70 intelligent.

[0078] Please refer to FIG. 3 to FIG. 5 and FIG. 8 . FIG. 8 is a structural diagram of a first covering member provided in an embodiment of the present application.

[0079] In one embodiment, the first handle 20 includes a first handle body 23, a first covering member 24, and a first fixing member 25. The first receiving cavity 21 is located within the first handle body 23. The first covering member 24 covers the side of the first control circuit 50 facing away from the bottom wall of the first receiving cavity 21. The first covering member 24 is used to seal the first control circuit 50 within the first receiving cavity 21. The first covering member 24 is provided with a first fixing hole 241. The first fixing member 25 passes through the first fixing hole 241 and is fixedly connected to the first fixing post 22 to secure the first covering member 24 within the first receiving cavity 21.

[0080] The thermal transfer device 100 provided in this embodiment adds a first cover 24 to the first handle 20, and the first cover 24 is fixed to the first receiving cavity 21 via a first fixing member 25, thereby covering the first control circuit 50 within the first receiving cavity 21 of the first handle body 23, thereby preventing the first control circuit 50 from being exposed. This can prevent dust and other impurities from falling on the first control circuit 50 and causing malfunctions of the electronic components on the first control circuit 50, thereby improving the stability of the performance of the first control circuit 50 during operation. Moreover, the first cover 24 is fixed to the first receiving cavity 21 by the first fixing member 25, and the first control circuit 50 is limited in the direction from the first side 10a to the second side 10b under the action of the first cover 24, which helps to improve the stability of the first control circuit 50 within the first receiving cavity 21.

[0081] In a specific embodiment, the first fixing member 25 is a screw, the first fixing hole 241 on the first covering member 24 is a through hole extending from the first side 10a to the second side 10b, and the first fixing column 22 is provided with a first threaded hole 221. The first fixing member 25 passes through the first fixing hole 241 and is threadedly connected to the first threaded hole 221, so that the first covering member 24 can be removed from the first receiving cavity 21, making it convenient for the user to maintain or replace the first control circuit 50.

[0082] Please refer to FIG. 3 , FIG. 4 , FIG. 8 and FIG. 9 . FIG. 9 is a schematic structural diagram of a first decorative element provided in an embodiment of the present application.

[0083] In one embodiment, the first handle 20 further includes a first decorative member 26, which is removably mounted on the side of the first cover 24 facing away from the first control circuit 50 and the opening of the first receiving cavity 21 of the first cover 24 away from the first side 10a. The thermal transfer device 100 provided in this embodiment, by adding the first decorative member 26 to the first handle 20, enhances the appearance of the first handle 20 and the thermal transfer device 100. Furthermore, the first decorative member 26 prevents the first fixing member 25 from being exposed to the environment and corroding, thereby improving the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0084] In a specific embodiment, a first latch 242 is provided on the first covering member 24, and a first latch 261 is provided on the first decorative member 26. The first latch 261 engages with the first latch 242, allowing the first decorative member 26 to be removably mounted on the first covering member 24. The first latch 242 extends through the first covering member 24 from the first side 10a to the second side 10b. The first latch 261 is provided on a side of the first decorative member 26 proximal to the first covering member 24 to prevent the first latch 261 from being exposed outside the first handle 20, thereby ensuring the aesthetics of the first handle 20. The latching connection between the first decorative member 26 and the first covering member 24 conceals the connection between the first decorative member 26 and the first covering member 24, preventing the first latch 261 of the first decorative member 26 from being exposed to the environment and corroding, thereby preventing it from being removed. This improves the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0085] More specifically, in this embodiment, the number of the first card slots 242 is 10, and the 10 first card slots 242 are arranged in sequence at intervals near the periphery of the first cover 24. The number of the first clips 261 is 10, and the 10 first clips 261 are arranged in sequence at intervals near the periphery of the first decorative member 26. The 10 first clips 261 are respectively engaged with the 10 first card slots 242, so that the first decorative member 26 can be detachably installed on the side of the first cover 24 away from the first control circuit 50, and the risk of the first decorative member 26 falling off from the first cover 24 can be reduced, which is conducive to further improving the stability of the first decorative member 26 installed on the first cover 24.

[0086] It can be understood that in some other embodiments, the number of first card slots 242 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of first clips 261 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc. It is only necessary to ensure that the number of first card slots 242 and first clips 261 are the same and the positions correspond. This application does not impose any restrictions on this.

[0087] Please refer to Figures 3, 5, 10 and 11. Figure 10 is a schematic structural diagram of a second handle body provided in an embodiment of the present application. Figure 11 is a schematic structural diagram of a main control circuit provided in an embodiment of the present application.

[0088] In one embodiment, the second handle 30 is provided with a second fixing post 32, which is fixed to the inner sidewall of the second receiving cavity 31 and extends from the first side 10a to the second side 10b. The second control circuit 60 is provided with a second fixing groove 61, which is provided around the periphery of the second control circuit 60 and has an opening located at the edge of the second control circuit 60. When the second control circuit 60 is installed in the second receiving cavity 31, the second fixing groove 61 cooperates with the second fixing post 32, and at least a portion of the second fixing post 32 is received in the second fixing groove 61, thereby securing the second control circuit 60 in the second receiving cavity 31. The second control circuit 60 is spaced apart from the bottom wall of the second receiving cavity 31, thereby ensuring that the second control circuit 60 is spaced apart from the first side 10a. The spacing between the second control circuit 60 and the bottom wall of the second receiving cavity 31 can be achieved by changing the size of the second fixing column 32, that is, the size of the bottom wall of the part of the second fixing column 32 close to the second receiving cavity 31 is larger than the size of the bottom wall of the part of the second fixing column 32 away from the second receiving cavity 31, so that the second fixing groove 61 and the part of the second fixing column 32 close to the bottom wall of the second receiving cavity 31 are spaced apart.

[0089] The thermal transfer device 100 provided in this embodiment, on the one hand, prevents the second control circuit 60 from loosening and shaking in the second receiving cavity 31 by cooperating with the second fixing post 32 on the inner wall of the second receiving cavity 31, thereby fixing the second control circuit 60 in the second receiving cavity 31. This helps to improve the stability of the second control circuit 60 when installed in the second receiving cavity 31, thereby improving the performance stability of the second control circuit 60 during operation. On the other hand, by spacing the second control circuit 60 from the bottom wall of the second receiving cavity 31, thereby spacing the second control circuit 60 from the second side 10b, the heat generated by the heating element 40 can be reduced from being transmitted to the second control circuit 60 through the housing 10, thereby reducing the impact of the heat generated by the heating element 40 on the electronic components of the second control circuit 60, ensuring the stability of the performance of the second control circuit 60 during operation, and also helping to improve the service life of the second control circuit 60, thereby improving the stability of the thermal transfer function of the thermal transfer device 100.

[0090] In a specific embodiment, there are ten second fixing posts 32, which are spaced circumferentially along the inner wall of the second receiving cavity 31. There are four second fixing slots 61, which are spaced circumferentially along the circumference of the second control circuit 60. The four second fixing posts 32 and the four second fixing slots 61 cooperate to position the second control circuit 60 within the second receiving cavity 31 in any direction along the second side 10b, further improving the stability of the second control circuit 60 within the second receiving cavity 31.

[0091] It can be understood that in some other embodiments, the number of second fixing columns 32 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of second fixing slots 61 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and this application does not impose any restrictions on this.

[0092] Please refer to FIG. 3 , FIG. 5 , FIG. 10 and FIG. 12 . FIG. 12 is a schematic structural diagram of a second covering member provided in an embodiment of the present application.

[0093] In one embodiment, the second handle 30 includes a second handle body 33, a second cover 34, and a second fixing member 35. The second receiving cavity 31 is located within the second handle body 33. The second cover 34 covers the side of the second control circuit 60 facing away from the bottom wall of the second receiving cavity 31. The second cover 34 is used to seal the second control circuit 60 within the second receiving cavity 31. The second cover 34 is provided with a second fixing hole 341. The second fixing member 35 passes through the second fixing hole 341 and is fixedly connected to the second fixing post 32 to secure the second cover 34 within the second receiving cavity 31.

[0094] The thermal transfer device 100 provided in this embodiment adds a second cover 34 to the second handle 30, and the second cover 34 is fixed to the second receiving cavity 31 via a second fixing member 35, so as to cover the second control circuit 60 within the second receiving cavity 31 of the second handle body 33, thereby preventing the second control circuit 60 from being exposed. This can prevent dust and other impurities from falling on the second control circuit 60 and causing malfunctions of the electronic components in the second control circuit 60, thereby improving the stability of the performance of the second control circuit 60 during operation. Moreover, the second cover 34 is fixed to the second receiving cavity 31 by the second fixing member 35, and the second control circuit 60 is limited in the direction from the second side 10b to the second side 10b under the action of the second cover 34, which helps to improve the stability of the second control circuit 60 within the second receiving cavity 31.

[0095] In a specific embodiment, the second fixing member 35 is a screw, the second fixing hole 341 on the second cover member 34 is a through hole extending from the first side 10a to the second side 10b, and a second threaded hole 321 is provided on the second fixing column 32. The second fixing member 35 passes through the second fixing hole 341 and is threadedly connected to the second threaded hole 321, so that the second cover member 34 can be removed from the second receiving cavity 31, making it convenient for the user to maintain or replace the second control circuit 60.

[0096] Please refer to Figures 3, 5, 12 and 13. Figure 13 is a structural diagram of a second decorative element provided in one embodiment of the present application.

[0097] In one embodiment, the second handle 30 further includes a second decorative member 36, which is removably mounted on the side of the second cover 34 facing away from the second control circuit 60. The second cover 34 blocks the opening of the second receiving cavity 31 away from the second side 10b. The thermal transfer device 100 provided in this embodiment, by adding the second decorative member 36 to the second handle 30, enhances the appearance of the second handle 30 and the thermal transfer device 100. Furthermore, the second decorative member 36 prevents the second fixing member 35 from being exposed to the environment and corroding, thereby improving the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0098] In a specific embodiment, a second latch 342 is provided on the second covering member 34, and a second latch 361 is provided on the second decorative member 36. The second latch 361 engages with the second latch 342, allowing the second decorative member 36 to be removably mounted on the second covering member 34. The second latch 342 extends through the second covering member 34 from the second side 10b to the second side 10b. The second latch 361 is provided on a side of the second decorative member 36 proximal to the second covering member 34 to prevent the second latch 361 from being exposed outside the second handle 30, thereby ensuring the aesthetics of the second handle 30. The latching connection between the second decorative member 36 and the second covering member 34 conceals the connection between the second decorative member 36 and the second covering member 34, preventing the second latch 361 of the second decorative member 36 from being exposed to the environment and corroding, thereby preventing it from being removed. This improves the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0099] In a specific embodiment, the number of the second card slots 342 is 10, and the 10 second card slots 342 are arranged in sequence and spaced apart at positions close to the periphery of the second cover member 34. The number of the second clips 361 is 10, and the 10 second clips 361 are arranged in sequence and spaced apart at positions close to the periphery of the second decorative member 36. The 10 second clips 361 are respectively engaged with the 10 second card slots 342, so that the second decorative member 36 can be detachably installed on the side of the second cover member 34 away from the second control circuit 60, and the risk of the second decorative member 36 falling off from the second cover member 34 can be reduced, which is conducive to further improving the stability of the second decorative member 36 installed on the second cover member 34.

[0100] It can be understood that in some other embodiments, the number of second card slots 342 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of second clips 361 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc. It is only necessary to ensure that the number of second card slots 342 and second clips 361 are the same and the positions correspond. This application does not impose any restrictions on this.

[0101] The above are some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A thermal transfer device, wherein: The thermal transfer device comprises: A housing including a first side and a second side disposed opposite to each other; A first handle is disposed on the first side, wherein the first handle defines a first receiving cavity; A heating element, disposed on the second side, and used for performing a thermal transfer task on the workpiece to be processed; A first control circuit is disposed in the first receiving cavity; and A heat sink is arranged on the first control circuit and located in the first receiving cavity. The heat sink is used to dissipate heat for the first control circuit and does not contact the inner wall of the first receiving cavity.

2. The thermal transfer device according to claim 1, wherein: The thermal transfer device also includes: a second handle disposed on the first side, the second handle being spaced apart from the first handle, and the second handle defining a second receiving cavity; and The second control circuit is electrically connected to the first control circuit and is used to transmit electrical signals to the first control circuit.

3. The thermal transfer device according to claim 2, wherein: The first control circuit is a heating control circuit, which is electrically connected to the heating element; the second control circuit is a main control circuit, which is electrically connected to the heating control circuit and is used to send a control electrical signal to the heating control circuit.

4. The thermal transfer device according to claim 3, wherein: The first handle is provided with a first fixing column, and the first fixing column is fixed to the inner wall of the first receiving cavity; The heating control circuit is provided with a first fixing groove, and the first fixing column is clamped in the first fixing groove.

5. The thermal transfer device according to claim 4, wherein: The heat sink is provided with an avoidance groove, and the avoidance groove is not in contact with the first fixing column.

6. The thermal transfer device according to claim 3, wherein: The housing has a receiving cavity, and the heating element is at least partially received in the receiving cavity and exposes the second side; The accommodating cavity is communicated with the first receiving cavity to form a first through hole, and the heating control circuit is electrically connected to the heating element through a first electrical connector penetrating the first through hole.

7. The thermal transfer device according to claim 6, wherein: The accommodating cavity is communicated with the second accommodating cavity to form a second through hole, and the main control circuit is electrically connected to the heating control circuit through a second electrical connector penetrating the first through hole, the accommodating cavity and the second through hole.

8. The thermal transfer device according to claim 7, wherein: The thermal transfer device further comprises a heat insulating member, wherein the heat insulating member is disposed between the first side of the housing and the heat generating member; The second electrical connector electrically connecting the main control circuit and the heating control circuit is disposed between the first side of the housing and the thermal insulation member.

9. The thermal transfer device according to claim 4, wherein: The first handle comprises a first handle body, a first covering member and a first fixing member, the first handle body is provided with the first receiving cavity, and the first covering member is provided to cover a side of the heat sink away from the heating control circuit; The first covering member is provided with a first fixing hole, and the first fixing member passes through the first fixing hole and is connected to the first fixing column, so that the first covering member is fixedly connected to the first fixing member.

10. The thermal transfer device according to claim 9, wherein: The first handle also includes a first decorative piece, which is installed on a side of the first covering piece away from the heating control circuit; the first covering piece is provided with a first slot, the first decorative piece is provided with a first buckle, and the first buckle is engaged with the first slot.

11. The thermal transfer device according to claim 3, wherein: The second handle is provided with a second fixing column, and the second fixing column is fixed to the inner wall of the second receiving cavity; The main control circuit is provided with a second fixing groove, and the second fixing column is clamped in the second fixing groove; The second handle comprises a second handle body, a second cover and a second fixing member, the second handle body is provided with the second receiving cavity, and the second cover is provided to cover a side of the main control circuit away from the bottom wall of the second receiving cavity; The second covering member is provided with a second fixing hole, and the second fixing member passes through the second fixing hole and is connected to the second fixing column.

12. The thermal transfer device according to claim 11, wherein: The second handle further comprises a second decorative member, and the second decorative member is mounted on a side of the second covering member away from the heating control circuit; The second covering member is provided with a second card slot, the second decorative member is provided with a second buckle, and the second buckle is engaged with the second card slot.

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