Method for producing resin molded article, mold, and resin molded article

Abstract

The purpose of the present invention is to suppress molding defects in insert molding in which a resin film having strains is inserted into a mold. In a holding step, at least a part of end sides (10a), (10b) of a resin film (10) is sandwiched between a hold block (150) and a first mold (100) and brought into close contact with the first mold (100). In a mold clamping step, the first mold (100) and a second mold (200) are clamped, the hold block (150) is fixed by the first mold (100) and the second mold (200), and a cavity (C1) for accommodating a part of the resin film (10) is formed. In a molding step, a resin is injected into the cavity (C1), and a resin molded article (1) into which the resin film (10) is inserted is molded. The wall surface of the cavity (C1) includes a cavity formation region (155) which is a part of the hold block (150), and the cavity formation region (155) is configured to be in contact with a side surface (1a) of the resin molded article (1) rising from the vicinity of the end sides (10a), (10b) of the resin film (10).

Description

Manufacturing method for resin molded product, mold and resin molded product

[0001] The present invention relates to a method for manufacturing a resin molded product, a mold used in the manufacturing method, and a resin molded product.

[0002] As a method for integrating a metal wire with a resin molded product, for example, there is a manufacturing method in which a film having wiring is inserted and injection molded, as described in Patent Document 1 (JP 2022-144960 A). In the manufacturing method described in Patent Document 1, the resin molded product injection molded in the cavity of a mold is held in a movable mold after injection molding, but the inserted film is held in a fixed mold.

[0003] Japanese Patent Application Laid-Open No. 2022-144960

[0004] However, resin films with metal wires such as copper wires can be distorted by the shape of the metal wires due to their high rigidity. When insert molding is performed using such distorted resin films, correction by suction and / or positioning pins alone cannot remove the deformation of the resin film within the mold cavity, which can result in molding defects. Furthermore, when a method is used in which an undercut is provided in the fixed mold to hold the film in place so that the film can be hooked onto the fixed mold, the resin molded product may end up being held by the fixed mold when the mold is opened.

[0005] An object of the present invention is to suppress molding defects in insert molding in which a distorted resin film is inserted into a mold.

[0006] Several aspects are described below as means for solving the problems. These aspects can be combined as needed. A method for manufacturing a resin molded product according to one aspect of the present invention includes a setting step, a holding step, a mold clamping step, a molding step, and a mold opening / removal step. In the setting step, a resin film is fitted into a first mold. In the holding step, at least a portion of an edge of the resin film is sandwiched between a hold block and the first mold and brought into close contact with the first mold. In the mold clamping step, the first mold and the second mold are clamped together to fix the hold block between the first mold and the second mold, thereby forming a cavity that accommodates a portion of the resin film. In the molding step, resin is injected into the cavity to form a resin molded product with the resin film inserted. In the mold opening / removal step, the first mold and the second mold are opened, and the resin molded product with the resin film inserted is removed. The wall surface of the cavity includes a cavity-forming region that is part of the hold block, and the cavity-forming region is configured to contact a side surface of the resin molded product that rises from near the edge of the resin film. In the method for manufacturing a resin molded product configured as described above, the cavity-forming region contacts the side surface of the resin molded product that rises from the vicinity of the edge of the resin film. Furthermore, since the vicinity of the resin molded product is pressed against the first mold by the hold block, even if the resin film is distorted, the hold block can sufficiently correct the distorted resin film before inserting it, thereby suppressing molding defects during insert molding.

[0007] The above-described method for manufacturing a resin molded product can be configured to further include a preforming step in which the resin film is wired with metal wires and the resin film wired with the metal wires is three-dimensionally shaped before the setting step. This method for manufacturing a resin molded product configured in this manner can sufficiently correct the resin film, which is subject to significant distortion due to the metal wires, using the hold block, thereby suppressing molding defects during insert molding. The above-described method for manufacturing a resin molded product can be configured such that the hold block is attached to the first mold so as to be rotatable about a rotation axis, and in the holding step, the hold block is pressed by a cylinder to rotate about the rotation axis, thereby sandwiching at least a portion of the edge of the resin film between the hold block and the first mold and closely adhering it to the first mold, and in the mold opening and removal step, when the first and second molds open, the hold block is not pressed by the cylinder and is able to rotate about the rotation axis. In this method for manufacturing a resin molded product configured in this manner, the rotation of the hold block makes it easier for the hold block to sandwich the edge of the resin film between the hold block and the first mold and to closely adhering it to the first mold or to release it, thereby improving production speed. The above-described method for manufacturing a resin molded product can be configured so that, in the mold opening and removal process, when the first and second molds are opened, the convex portion of the hold block catches on the resin molded product, causing the resin molded product to push the hold block. In the method for manufacturing a resin molded product configured in this manner, the resin molded product pushes the hold block in the mold opening and removal process, making it easier to open the hold block and improving production speed.

[0008] A mold according to one aspect of the present invention includes a first mold, a second mold, and a hold block. The first and second molds are used to form a cavity for molding a resin molded product by clamping the mold. The hold block is attached to the first mold and, when the mold is open, is movable to switch between an open state in which at least a portion of an edge of a resin film to be inserted into the resin molded product is not pressed against the first mold and a closed state in which at least a portion of the edge is pressed against the first mold. When the first and second molds are clamped, the hold block forms part of the wall surface of the cavity and includes a cavity-forming region that rises from near the edge. This mold is suitable for a method of manufacturing a resin molded product in which a distorted resin film is inserted into the mold using the hold block, thereby suppressing molding defects in insert molding.

[0009] The above-mentioned mold can be configured such that the hold block is attached to the first mold so as to rotate around a rotation axis, the first mold has a cylinder that pushes the hold block to rotate it around the rotation axis, and a gap of a size corresponding to the thickness of the resin film is formed between the hold block and the first mold when in a closed state. The above-mentioned mold can also be configured such that when the first and second molds are opened, a convex portion of the hold block catches on the molded resin product, causing the molded resin product to press the hold block. A mold configured in this manner makes it easier to open the hold block, making it suitable for a method of manufacturing a molded resin product that easily improves production speed. The above-mentioned mold can also be configured such that the first mold has a spring or plunger that constantly applies pressure to the hold block to release the closed state of the hold block when in the mold open state. A mold configured in this manner makes it easier to open the hold block, making it suitable for a method of manufacturing a molded resin product that easily improves production speed.

[0010] A resin molded product according to one aspect of the present invention includes a resin molded body, a resin film integrated with the resin molded body by insert molding, and a metal wire meandering through the resin film. The resin film has a protruding portion whose edge protrudes from the resin molded body. The resin molded product thus configured can eliminate the step of cutting the protruding portion, thereby suppressing an increase in the cost of the resin molded product.

[0011] The manufacturing method of a resin molded product according to the present invention can suppress molding defects in insert molding in which a distorted resin film is inserted into a mold. The mold according to the present invention is suitable for a manufacturing method of a resin molded product that can suppress molding defects in insert molding in which a distorted resin film is inserted into a mold. The resin molded product according to the present invention is manufactured by a manufacturing method that can suppress molding defects in insert molding in which a distorted resin film is inserted into a mold, and can suppress manufacturing costs.

[0012] 6A and 6B are a flowchart showing an example of a manufacturing process for a resin molded product according to an embodiment; a front view showing an example of a resin film with an electric heating wire inserted into a resin molded product; a top view showing a state in which a portion corresponding to a protrusion is removed from the resin film of FIG. 2; a right side view showing the resin film in the state of FIG. 3; a perspective view showing an example of a first mold according to an embodiment; a perspective view showing a part of the first mold shown in FIG. 5; a plan view of the part of the first mold of FIG. 6; a side view of the part of the first mold of FIG. 6; a front view of the part of the first mold of FIG. 6; a perspective view showing a part of the first mold as seen from the opposite side to FIG. 6; a plan view showing a part of the first mold for explaining suction holes; a cross-sectional view showing a part of the first mold around a hold block in a state before a resin film is held; a cross-sectional view showing the first mold in a state in which a resin film is held; a perspective view showing an example of a second mold according to an embodiment; a cross-sectional view showing a part of the first mold and a part of the second mold around the hold block when the molds are clamped; a cross-sectional view showing a part of the first mold and a part of the second mold around the hold block during injection; a cross-sectional view showing a part of the first mold and a part of the second mold around the hold block during mold opening and removal;

[0013] (1) Manufacturing Method of Resin Molded Product FIG. 1 shows an overview of the flow of a manufacturing method of a resin molded product according to one embodiment of the present invention. In step S1 shown in FIG. 1, a resin film 10 with an electric heating wire (see FIG. 2) is prepared. Here, a case where the resin film 10 with an electric heating wire is used as the resin film to be inserted will be described. The resin film 10 with an electric heating wire is an example of a resin film with a metal wire wired therein. Examples of materials for the resin film 10 include thermoplastic resins. Examples of thermoplastic resins include polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin. The thickness of the resin film 10 is, for example, 10 μm to 500 μm. The electric heating wire 20 (see FIG. 2), which is an example of a metal wire, is made of, for example, a metal or a metal alloy. Examples of the electric heating wire include copper, iron, nickel, aluminum, or alloys thereof. The thickness of the heating wire 20 is set, for example, within a range of 0.01 mm to 1.0 mm, and the width of the heating wire 20 is set, for example, within a range of 0.1 mm to 5.0 mm. Because the heating wire 20 can cause irregularities on the surface of the resin molded product 1 (see FIG. 18 ), it is preferable to set the thickness and width of the heating wire 20 within a range in which the irregularities caused by the heating wire 20 on the surface of the resin molded product 1 are difficult to visually recognize. However, the resin film to be inserted is not limited to the resin film 10 with the heating wire. The resin film may be, for example, a resin film to which components other than the heating wire 20 are attached, or a film made solely of resin. The resin molded product 1 with the heating wire 20 inserted is used, for example, to generate heat for anti-fogging purposes, snow melting purposes, cold weather protection, or agricultural temperature control. The heating wire 20 is fixed to the resin film 10 by, for example, fusion, adhesion, or pressure-sensitive adhesive. Therefore, even if the resin film 10 is moved, the position of the heating wire 20 on the resin film 10 does not change. The heating wire 20 is arranged in a serpentine manner, as shown in Figure 2. The area of ​​the region where the heating wire 20 is wired is 60% or more of the area of ​​the largest main surface 11 of the resin film 10. In the resin molded product 1, the heating wire 20 is arranged between the resin film 10 and the resin molded body 50 (see Figure 18).

[0014] The resin film 10 is preformed (step S2) to give it the shape (see FIGS. 2, 3, and 4) of the resin molded product 1 (see FIG. 18). Step S2 is the preforming process. Before preforming, the resin film 10 has a flat, sheet-like shape. As shown in FIGS. 2, 3, and 4, after preforming, a first raised portion 12 with an L-shaped cross section rising in a direction substantially perpendicular to the main surface 11 on which the heating wire 20 is mainly arranged, and a second raised portion 13 facing the first raised portion 12 are formed. Furthermore, after preforming, the main surface 11 is formed into a curved surface. Note that FIG. 2 shows a protrusion 19 to be held by a holding block 150 (see FIG. 11), which will be described later, but the protrusion 19 is omitted from FIGS. 3 and 4. The opening 16 shown in FIG. 2 exposes the heating wire 20 outside the resin film 10 when the resin molded product 1 (see FIG. 18) is formed, allowing the heating wire 20 to be electrically connected. During preforming (step S2), the resin film 10 is softened by heating and then cooled to set its shape. Therefore, the resin film 10 assumes a shape that conforms to the preforming mold. However, while the heating wire 20 is deformed to conform to the shape of the preforming mold during preforming, the preforming process causes both plastic and elastic deformation. Therefore, when the resin film 10 with the heating wire 20 attached is removed from the preforming mold, the elastic deformation of the heating wire 20 attempts to return to its original shape. As a result, the shape of the resin film 10 is distorted relative to the shape of the preforming mold, and ultimately the shape of the first mold 100, due to the rigidity of the heating wire 20. In this way, when a metal wire such as the heating wire 20 is fixed to the resin film 10, the distortion of the resin film 10 after preforming tends to be large.

[0015] Next, the preformed resin film 10 with the heating wire 20 attached is fitted into the first die 100 (see FIG. 5) (step S3). This step S3 is a setting process in which the resin film 10 is fitted into the first die 100. As shown in FIGS. 6, 7, 8, 9, and 10, the first die 100 is provided with a plurality of positioning pins 110 that regulate the position of the resin film 10. The resin film 10 is provided with a plurality of holes 15 into which the positioning pins 110 are inserted. When the resin film 10 is fitted into the first die 100, its movement is regulated by the positioning pins 110. The fitted resin film 10 is sucked through a plurality of suction holes 120 (see FIG. 11) provided in the first die 100. Note that an intake system for the suction holes 120 and an intake and exhaust system for the cylinder 170 (see FIG. 12) are provided separately. The plurality of suction holes 120 are arranged around the end of the bushing 130. Even when set using the multiple positioning pins 110 and multiple suction holes 120 in this manner, distortion of the resin film 10 with the heating wire 20 attached thereto may cause a portion of the resin film 10 fitted into the first die 100 to float up. Note that the attachment portion 140 shown in Figure 11 is a recess for attaching the hold block 150. In step S3, in which the resin film 10 is fitted into the first die 100, the hold block 150 is in an open state, as shown in Figure 12. Because the hold block 150 is in an open state, the resin film 10 can be easily set so as to contact the first die 100.

[0016] At least a portion of the end edges 10a, 10b (see FIG. 2) of the resin film 10 with the heating wire 20 fitted in the positioning pin 110 is sandwiched between the hold block 150 (see FIG. 5) and the first mold 100 and brought into close contact with the first mold 100 (step S4). Step S4 is a holding process for holding the resin film 10 in the first mold 100. When the hold block 150 moves from the open state to the closed state, the cylinder 170 pushes the hold block 150 and rotates it about the rotation axis 158, as shown by the arrow in FIG. 12. In FIGS. 12, 15, 16, and 18, arrows indicate the movement of each part of the mold. The cylinder 170 is a device operated by air pressure. When the hold block 150 is closed, the plunger 160 is pressed into the first mold 100. A spring may be used instead of the plunger 160, and in that case, the spring is also pressed into the first mold 100. The plunger 160 or spring opens the hold block 150. In this embodiment, the protrusion 19 indicated by the two-dot chain line is the portion of the end edges 10a, 10b of the resin film 10 that protrudes from the resin molded body 50. The protrusion 19 is cut off from this resin molded article 1 to form the resin molded article as the final product (merchandise). However, the resin molded article 1 with the protrusion 19 may also be used as the final product. The hold block 150 includes two first hold blocks 151 for holding one end edge 10a and one second hold block 152 for holding the other end edge 10b. As shown in FIG. 13 , a portion of the end edge 10a of the resin film 10 is sandwiched between the first hold block 151 and the first mold 100. Furthermore, a portion of the end edge 10b of the resin film 10 is sandwiched between the second hold block 152 and the first mold 100 (see FIG. 17 ). In FIG. 13, the portion shown between the two-dot chain line and the end sides 10 a and 10 b is the protrusion 19 .

[0017] Next, the first mold 100 and the second mold 200 (see FIG. 14 ) are clamped together to fix the hold block 150 between the first mold 100 and the second mold 200, forming a cavity C1 (see FIG. 15 ) that accommodates a portion of the resin film 10 (step S5). Step S5 is the mold clamping process. During mold clamping, the second mold 200, which is a movable mold, moves toward the first mold 100 so that the parting surfaces of the first mold 100 and the second mold 200 come into contact. Once the molds are clamped, the hold block 150 is fixed by the first mold 100 and the second mold 200. Therefore, after mold clamping, the hold block 150 remains closed even when the cylinder 170 is not pressing the hold block 150. The hold block 150 fits into the recess 210 of the second mold 200 shown in FIG. 14 and contacts the second mold 200. The portion of the resin film 10 that will become the protrusion 19 is not accommodated in the cavity C1, so not all of the resin film 10 is accommodated in the cavity C1. In other words, the first gap IS1 for sandwiching the resin film 10 between the first mold 100 and the hold block 150 and the second gap IS2 (see FIG. 17 ) for sandwiching the resin film 10 between the first mold 100 and the second mold 200 are not included in the cavity C1. The wall surface of the cavity C1 includes a cavity-forming region 159, which is part of the hold block 150. In this embodiment, the space surrounded by the first region 101 of the first mold 100, the second region 202 of the second mold 200, and the cavity-forming region 159 of the hold block 150 is the cavity C1. A portion of the first region 101 of the first mold 100 is curved. A preforming process is performed to align the main surface 11 of the resin film 10 with the first region 101 of the first mold 100. The cavity forming region 159 of the hold block 150 contacts the side surface 1a (see FIG. 18) of the resin molded product 1. When the mold is closed, the side surface 1a of the resin molded product 1 is a portion that rises from the vicinity of the end edges 10a, 10b of the resin film 10.

[0018] After the mold is clamped, molten resin is injected into the cavity C1 (step S6), as shown in FIG. 16 . FIG. 17 shows a cross section of the cavity C1 where the hold block 150 is not included. A second gap IS2 is also formed between the first mold 100 and the second mold 200, sandwiching the end edges 10a and 10b of the resin film 10. The size of the second gap IS2 is the same as the thickness of the resin film 10, e.g., 10 μm to 500 μm. To form the second gap IS2, a step (a stepped portion) is provided in the second mold 200. Therefore, not only is the resin film 10 sandwiched between the hold block 150 and the first mold 100 to form the protrusion 19, but the resin film 10 is also sandwiched between the first mold 100 and the second mold 200 on both sides of the protrusion 19 to form the protrusion 19. The molten resin injected into the cavity C1 is subjected to a dwelling process in which a predetermined pressure is continuously applied to maintain a normal density (step S7). Then, cooling is performed by the cooling function of the molds (first mold 100 and second mold 200) for a preset cooling time to solidify all of the molten resin in cavity C1 (step S8). After the molds are clamped, steps S6 to S8 are carried out to form a resin molded product 1 with the resin film 10 inserted. That is, steps S6 to S8 are the molding process of injecting resin into cavity C1 and forming the resin molded product 1 with the resin film 10 inserted.

[0019] Next, in mold opening, as shown in Figure 18, the second mold 200 is separated from the first mold 100 (step S9). Step S9 is the mold opening process. When the first mold 100 and the second mold 200 open, the cooled and solidified resin molded article 1 is ejected, for example, by an ejection cylinder (not shown). The resin molded article 1 ejected from the first mold 100 and the second mold 200 is released and removed (step S10). In the removal process (step S10), when the first mold 100 and the second mold 200 open, the convex portion 155 of the hold block 150 catches on the resin molded article 1, and the resin molded article 1 pushes the hold block 150. The mold opening process and removal process are sometimes collectively referred to as the mold opening / removal process. During the mold opening and removal process, the convex portion 155 of the holding block 150 is pressed against the resin molded product 1, making it easier for the holding block 150 to open, thereby improving the reliability of removing the resin molded product 1 during the mold opening and removal process.

[0020] (2) Mold Used in the Method for Producing a Resin Molded Product The mold used in the method for producing a resin molded product includes a first mold 100 shown in FIG. 5 and a second mold 200 shown in FIG. 14. The first mold 100 and the second mold 200 are molds for forming a cavity C1 for molding the resin molded product 1 by clamping. However, in this embodiment, the cavity C1 is formed by three members, including not only the first mold 100 and the second mold 200 but also a hold block 150. The hold block 150 is movably attached to the first mold 100. When the molds are open, the hold block 150 can be switched between an open state in which at least a portion of the end edges 10a and 10b of the resin film 10 to be inserted into the resin molded product 1 is not pressed against the first mold 100, and a closed state in which at least a portion of the end edges 10a and 10b are pressed against the first mold 100. As an example of a mode of movably mounting the hold block 150 to the first mold 100, the hold block 150 is mounted to the first mold 100 so as to be rotatable about a rotation axis 158. In this case, the first mold 100 has a cylinder 170 that pushes the hold block 150 to rotate it about the rotation axis 158. When the first mold 100 is in a closed state, a first gap IS1 is formed between the hold block 150 and the first mold 100, the size of which corresponds to the thickness of the resin film 10. The hold block 150 switches between an open state and a closed state by rotating, making it easy to set the resin film 10. The size of the first gap IS1 is the same as the thickness of the resin film 10, for example, 10 μm to 500 μm. To form the first gap IS1, a step (a stepped portion) is formed in the hold block 150.

[0021] As shown in FIG. 18 , the hold block 150 is preferably configured to have a protrusion 155. If the protrusion 155 of the hold block 150 is provided, it will catch on the resin molded product 1 when the first mold 100 and the second mold 200 are opened, and the resin molded product 1 will press the protrusion 155 of the hold block 150. In this way, the protrusion 155 is pressed by the resin molded product 1, thereby assisting in the removal of the resin molded product 1 and improving the reliability of the removal of the resin molded product 1. The first mold 100 has a spring or plunger 160 for constantly releasing the closed state of the hold block 150 when the molds are open. Because a force is applied to the hold block 150 from the plunger 160 or spring in the release direction, it is easy to switch from the closed state to the open state.

[0022] (3) Resin Molded Product As shown in Figure 18, the resin molded product 1 includes a resin molded body 50, a resin film 10 integrated with the resin molded body by insert molding, and a heating wire 20, which is a metal wire wired in a serpentine manner in the resin film 10. The resin film 10 has protruding portions 19 with end edges 10a, 10b protruding from the resin molded body 50. Even when the protruding portions 19 are cut off to produce a resin molded product as a final product, the resin molded product 1 can be transported with the protruding portions 19 attached to protect it.

[0023] (4) Modifications (4-1) Modification A In the above embodiment, a case where metal wires (heating wires 20) are wired in the resin film 10 has been described. However, the method for manufacturing a resin molded product according to the present invention can also be applied to a resin film without metal wires. For example, the method for manufacturing a resin molded product according to the present invention is suitable for a resin film having multiple layers, each of which is made of a different material and thus warping occurs during the preforming process. Furthermore, the method for manufacturing a resin molded product according to the present invention is also preferably applied to a case where a different material other than metal wires is integrated with the resin film and distortion occurs during the preforming process. Examples of different materials other than metal wires include wires other than metal wires. Examples of wires other than metal wires include optical fibers. (4-2) Modification B In the above embodiment, a case where the protrusions 19 are cut off after injection molding to produce a resin molded product as a final product has been described. However, the resin molded product 1 with the protrusions 19 remaining may also be used as a final product. For example, the protrusions 19 may be left as a fixing or adhesive point when the resin molded product 1 is incorporated into another device.

[0024] (4-3) Modification C In the above embodiment, the case where portions of the end edges 10a, 10b of the resin film 10 are brought into close contact with the first mold 100 by the hold block 150 has been described. However, the portions that are brought into close contact with the first mold 100 by the hold block 150 may be the entire end edges 10a, 10b of the resin film 10. In the above embodiment, the case where two opposing end edges 10a, 10b of the resin film 10 are brought into close contact with the first mold 100 by the hold block 150 has been described. However, the number of end edges that are brought into close contact with the first mold 100 by the hold block 150 may be one or three or more. (4-4) Modification D In the above embodiment, the case where the positioning pins 110 and the suction holes 120 are used in the setting step (step S3) has been described. However, to set the resin film 10 in the setting step, one of the positioning pins 110 and the suction holes 120 may be used, and the resin film 10 may be set by a method other than the method using the positioning pins 110 and the suction holes 120. (4-5) Modification E In the above embodiment, the mold cavity C1 is formed by the first mold 100, the second mold 200, and the hold block 150. However, the components for forming the mold cavity C1 may include components other than the first mold 100, the second mold 200, and the hold block 150.

[0025] (5) Features (5-1) In the mold of the above embodiment, the wall surface of the cavity C1 includes a cavity-forming region 159, which is a part of the hold block 150. In the manufacturing method of the resin molded product 1, the cavity-forming region 159 contacts the side surface 1a of the resin molded product 1, which rises from the vicinity of the end edges 10a, 10b of the resin film 10. Because the vicinity of the resin molded product 1 is pressed against the first mold 100 by the hold block 150, the hold block 150 can correct any distortion of the resin film 10 relative to the mold before inserting it, thereby reducing molding defects during insert molding. (5-2) If the resin film 10 is wired with a metal heating wire 20 and a preforming process is performed to three-dimensionally mold the resin film 10 with the heating wire 20 wired therein before the setting process, distortion due to the heating wire 20 will increase. Even if the heating wire 20 is present, the hold block 150 can sufficiently correct the distortion, reducing molding defects during insert molding.

[0026] (5-3) In the above embodiment, in the holding step, the hold block 150 is pushed by the cylinder 170 to rotate about the rotation axis 158, whereby the hold block 150 sandwiches at least a portion of the end edges 10a, 10b of the resin film 10 between the first mold 100 and the hold block 150 and brings the resin film 10 into close contact with the first mold 100. In the mold opening and removal step, when the first mold 100 and the second mold 200 open, the hold block 150 is not pushed by the cylinder 170 and is in a state in which the hold block 150 can rotate about the rotation axis. The rotation of the hold block 150 makes it easier for the hold block 150 to sandwich the end edges 10a, 10b of the resin film 10 between the hold block 150 and the first mold 100 and bring the resin film 10 into close contact with the first mold 100 or release the end edges 10a, 10b, which facilitates improving the production speed. (5-4) In the mold opening and removal process of the above embodiment, when the first mold 100 and the second mold 200 are opened, the convex portion 155 of the hold block 150 is caught on the resin molded product 1, and the resin molded product 1 presses the hold block 150. In this way, since the resin molded product 1 presses the hold block 150 in the mold opening and removal process, it becomes easier to open the hold block 150, and it becomes easier to improve the manufacturing speed.

[0027] (5-5) The resin molded product 1 manufactured by the manufacturing method of the above embodiment includes a resin molded body 50, a resin film 10 integrated with the resin molded body 50 by insert molding, and a heating wire 20, which is a metal wire wired in a serpentine manner in the resin film 10. The resin film 10 of the resin molded product 1 has a protruding portion 19 with edges 10a and 10b protruding from the resin molded body 50. By incorporating the protruding portion 19 as a component of the resin molded product 1, the process of cutting the protruding portion 19 can be omitted, thereby suppressing an increase in the cost of the resin molded product 1. While one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible within the scope of the invention. In particular, the multiple embodiments and modifications described herein can be arbitrarily combined as needed.

[0028] REFERENCE SIGNS LIST 1 resin molded product 10 resin film 10a, 10b edge 20 heating wire (an example of a metal wire) 50 resin molded body 100 first mold 150 holding block 151 first holding block 152 second holding block 155 convex portion 158 rotating shaft 159 cavity forming region 160 plunger 170 cylinder 200 second mold C1 cavity

Claims

1. A method for manufacturing a resin molded product comprising: a setting step of fitting a resin film into a first mold; a holding step of sandwiching at least a portion of an edge of the resin film between a hold block and the first mold to adhere it to the first mold; a mold clamping step of clamping the first mold and the second mold to fix the hold block between the first mold and the second mold and form a cavity to accommodate a portion of the resin film; a molding step of injecting resin into the cavity to mold a resin molded product with the resin film inserted; and a mold opening and removal step of opening the first mold and the second mold to remove the resin molded product with the resin film inserted, wherein a wall surface of the cavity includes a cavity forming region which is part of the hold block, and the cavity forming region contacts a side surface of the resin molded product that rises from near the edge of the resin film.

2. The method for producing a resin molded product according to claim 1, further comprising a preforming process, prior to the setting process, of three-dimensionally forming the resin film on which the metal wires are wired.

3. A method for manufacturing a resin molded product as described in claim 1, wherein the hold block is attached to the first mold so as to be rotatable around a rotation axis, and in the holding process, the hold block is pushed by a cylinder to rotate around the rotation axis, thereby causing the hold block to sandwich at least a portion of the end edge of the resin film between the hold block and the first mold and adhere it to the first mold, and in the mold opening and removal process, when the first mold and the second mold are opened, the hold block is not pushed by the cylinder and is brought into a state in which the hold block can rotate around the rotation axis.

4. The method for manufacturing a resin molded product described in claim 3, wherein in the mold opening and removal process, when the first mold and the second mold are opened, a convex portion of the hold block catches on the resin molded product, and the resin molded product presses the hold block.

5. A mold comprising: a first mold and a second mold for forming a cavity for molding a resin molded product by mold clamping; and a hold block attached to the first mold and movable when the mold is open to switch between an open state in which at least a portion of an edge of a resin film to be inserted into the resin molded product is not pressed against the first mold, and a closed state in which at least a portion of the edge is pressed against the first mold, wherein the hold block constitutes a part of the wall of the cavity when the first mold and the second mold are clamped, and includes a cavity forming region rising from the vicinity of the edge.

6. The mold described in claim 5, wherein the hold block is attached to the first mold so as to be rotatable around a rotation axis, and the first mold has a cylinder which pushes the hold block to rotate it around the rotation axis, and is configured so that in the closed state, a gap of a size corresponding to the thickness of the resin film is formed between the hold block and the first mold.

7. The mold according to claim 6, wherein the hold block is configured such that, when the first mold and the second mold are opened, a convex portion of the hold block is caught on the resin molded product, causing the resin molded product to press the hold block.

8. A mold according to any one of claims 5 to 7, wherein the first mold has a spring or plunger that constantly applies pressure to the hold block to release the closed state of the hold block when the mold is in an open state.

9. A resin molded product comprising: a resin molded body; a resin film integrated with the resin molded body by insert molding; and a metal wire wired in a serpentine manner on the resin film, wherein the resin film has a protruding portion whose end edge protrudes beyond the resin molded body.

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