Resin, photosensitive compositions, cured object, display device, electronic component, and method for producing cured object

Abstract

The purposes of the present invention are: to provide a photosensitive composition which can be inhibited from leaving residue after development; to provide a photosensitive composition which can give a cured object to be included in a display device that can be operated at a low voltage in obtaining a desired current density, has excellent light-emitting properties, and has excellent light-emitting-element reliability; and to provide a photosensitive composition which can give a cured object to be included in an electronic component having excellent migration resistance. This resin comprises one or more resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, poly(amide-imide)s, poly(amide-imide) precursors, and copolymers of these, and has a primary amine residue (DA1), which is an amine residue having a phenolic hydroxyl group. The primary amine residue (DA1) includes at least two cyclic structures having a phenolic hydroxyl group and further has a specific structure that connects the cyclic structures. This resin has a content of fluorine element in the structure of 10,000 mass ppm or less.

Description

Resin, photosensitive composition, cured product, display device, electronic component, and method for producing the cured product

[0001] The present invention relates to a resin, a photosensitive composition, a cured product, a display device, an electronic component, and a method for producing the cured product.

[0002] In recent years, efforts have been made to reduce costs and increase integration by improving the efficiency of semiconductor manufacturing processes, and semiconductor devices with multilayer metal rewiring have attracted attention. Materials used for interlayer insulating layers in such multilayer metal rewiring require high electrical insulation reliability due to the miniaturization of wiring accompanying the high integration of semiconductor devices, and therefore high migration resistance is required. Furthermore, suppression of development residues during positive or negative pattern formation by photolithography is also required.

[0003] Furthermore, in organic electroluminescence (hereinafter "organic EL") displays, which are display devices, pixel division layers and thin film transistor (hereinafter "TFT") planarization layers are formed adjacent to or in the vicinity of light-emitting elements, so that improving the reliability of organic EL displays requires consideration of the configuration of the pixel division layers, etc., and the physical properties such as heat resistance of the materials used for the pixel division layers, etc. Additionally, in order to achieve high brightness and power saving in organic EL displays, excellent light-emitting characteristics that enable low-voltage driving to obtain the desired current density are required.

[0004] Known examples of display devices include a display device having a pixel dividing layer containing polyimide (see, for example, Patent Document 1) and an organic EL display in which the total content of metal elements and / or halogen elements in a cured film is within a specific range (see, for example, Patent Document 2).

[0005] JP 2002-091343 A International Publication No. 2018 / 123853

[0006] However, the display devices described in Patent Documents 1 and 2 still have problems with light-emitting characteristics related to low-voltage driving, reliability of the light-emitting element, or migration resistance. In addition, the compositions described in Patent Documents 1 and 2 have problems with suppressing residues after development.

[0007] The present invention aims to provide a photosensitive composition capable of suppressing residues after development, a display device having excellent light-emitting properties that enable low-voltage operation to obtain a desired current density, and an electronic component having excellent migration resistance.

[0008] As a result of extensive research to solve the above-mentioned problems, it was found that significant effects can be obtained by focusing on fluorine, among halogen elements. In particular, it was found that the above-mentioned problems can be solved by a specific configuration relating to the content of fluorine in the resin contained in the composition used to form the cured film or the content of fluorine in the composition, and this led to the completion of the present invention. The resin of the present invention, the photosensitive composition of the present invention, and the display device of the present invention have the following configurations [1] to

[22] .

[0009] [1] One or more resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, polyamideimides, polyamideimide precursors, and copolymers thereof, the resin having (DA1) a primary amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) primary amine residue having at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, and (IIa) structures: a structure connecting at least two of the (Ia) structures, the (IIa) structures being a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and satisfying the following condition (P1a): (P1a) The content of fluorine elements in the structure of the resin is 10,000 mass ppm or less.

[0010] [2] The resin according to [1], wherein the primary amine residue (DA1) has an amine residue that satisfies the following condition (S1x): (S1x) The molecular symmetry of the amine residue is C１ It has an axis of symmetry and C ２ It has no axis of symmetry.

[0011] [3] The resin according to [1] or [2], wherein the resin further has (DA2) secondary amine residues: amine residues having no phenolic hydroxyl group, and satisfies the following condition (α1) and / or condition (α2): the total content ratio of the (DA1) primary amine residues to all amine residues in the resin is 20 mol% or more and 90 mol% or less, and the total content ratio of the (DA2) secondary amine residues to all amine residues in the resin is 10 mol% or more and 80 mol% or less: (α1) the (DA2) secondary amine residues have at least two (Ib) structures: cyclic structures having no phenolic hydroxyl group, and (IIb) structure: a structure connecting at least two (Ib) structures; (α2) The (DA2) secondary amine residue has a (IIIb) structure: a silicone structure and / or a siloxane structure; and (α3) the (IIb) structure is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0012] [4] The resin according to [3], wherein the primary amine residue (DA1) has an amine residue that satisfies the following condition (S1x), and / or the secondary amine residue (DA2) has an amine residue that satisfies at least one of the following conditions (S1x) and (S2x): (S1x) is a molecular symmetry of the amine residue. １ It has an axis of symmetry and C ２ The (S2x) amine residue does not have an axis of symmetry but has at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis.

[0013] [5] The resin according to any one of [1] to [4], wherein the resin has polyimide units and polyimide precursor units, the content of the polyimide units in the total of the polyimide units and the polyimide precursor units is 1.0 mol % or more and 30 mol % or less, and the content of the amic acid ester structures in the polyimide precursor units in the total of the amic acid structures and amic acid ester structures is 40 mol % or more and 99 mol % or less.

[0014] [6] The resin according to any one of [1] to [5], wherein the resin contains polyimide units and / or polyimide precursor units, and the resin contains one or more units selected from the group consisting of polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units, and the total content of the polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units in the resin is 10 mol % or more and 90 mol % or less.

[0015] [7] The resin according to any one of [1] to [6], further satisfying at least one of the following conditions (P1b), (P1c), and (P1d): (P1b) the content of chlorine element in the structure of the resin is 30,000 ppm by mass or less; (P1c) the content of bromine element in the structure of the resin is 30,000 ppm by mass or less; and (P1d) the content of sulfur element in the structure of the resin is 30,000 ppm by mass or less.

[0016] [8] A photosensitive composition containing (A) a binder resin and (C) a photosensitizer, and further containing (B) a radical polymerizable compound and / or (F) a crosslinking agent, wherein the (A) binder resin contains the resin according to any one of [1] to [7].

[0017] [9] The photosensitive composition according to [8], wherein the (A) binder resin, the (C) photosensitizer, the (B) radical polymerizable compound, or the (F) crosslinking agent has a fluorine atom, a chlorine atom, a bromine atom, a fluoride ion, a chloride ion, or a bromide ion in its structure, or the photosensitive composition further contains a component containing a fluorine element, a chlorine element, or a bromine element and / or a component containing a fluoride ion, a chloride ion, or a bromide ion, and the photosensitive composition satisfies the following condition (P1x) and the following condition (1x): (P1x) the total content of fluorine element, chlorine element, and bromine element in the structure of the resin is 30,000 ppm by mass or less; and (1x) the total content of fluorine element, chlorine element, and bromine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0018]

[10] A photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, and further comprising (B) a radically polymerizable compound and / or (F) a crosslinking agent, wherein the (A) binder resin comprises (Ax) a resin: one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof, the (Ax) resin has (DA1) a primary amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) primary amine residue having at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, and (IIa) structure: a structure connecting at least two (Ia) structures, The (IIa) structure is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and the photosensitive composition satisfies the following condition (1a): (1a) the content of elemental fluorine in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

[0019]

[11] The photosensitive composition according to

[10] , wherein the (A) binder resin, the (C) photosensitizer, the (B) radical polymerizable compound, or the (F) crosslinking agent has a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or the following sulfur-based anion in the structure, or further contains a component containing a chlorine element, a bromine element, or a sulfur element and / or a component containing a chloride ion, a bromide ion, or the following sulfur-based anion, and satisfies at least one of the following conditions (1b), (1c), and (1d): sulfur-based anion: one or more ions selected from the group consisting of sulfide ions, hydrogen sulfide ions, sulfate ions, and hydrogen sulfate ions; (1b) the content of chlorine element in the total solid content of the photosensitive composition is 0.010 mass ppm or more and 1,000 mass ppm or less. (1c) The content of bromine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less. (1d) The content of sulfur element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0020]

[12] The photosensitive composition according to any one of [8] to

[11] , further comprising a (I) phenolic compound, which satisfies the following condition (β1) and the following condition (5): (β1) having at least two of the following (Ic) structures and the following (IIIc) structure: Structure (Ic): a cyclic structure having a phenolic hydroxyl group Structure (IIIc): a structure connecting at least two of the (Ic) structures, which is a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. (5) The total content of the phenol compounds (I) in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 10,000 ppm by mass or less.

[0021]

[13] The photosensitive composition according to any one of [8] to

[12] , further comprising one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins.

[0022]

[14] The photosensitive composition according to any one of [8] to

[13] , wherein the (C) photosensitizer contains a compound having a 1,2-naphthoquinonediazide-5-sulfonic acid ester structure and a compound containing a 1,2-naphthoquinonediazide-4-sulfonic acid ester structure.

[0023]

[15] The photosensitive composition according to any one of [8] to

[14] , further containing water and satisfying the following condition (3): (3) The content of water in the photosensitive composition is 0.010% by mass or more and 3.0% by mass or less.

[0024]

[16] The photosensitive composition according to any one of [8] to

[15] , further comprising (H) a nitrogen-containing compound, the nitrogen-containing compound (H) comprising one or more compounds selected from the group consisting of cyclic amide compounds, amide compounds, cyclic urea compounds, urea compounds, oxazolidone compounds, and isoxazolidone compounds, and the photosensitive composition satisfies the following condition (4): (4) The total content of the cyclic amide compounds, amide compounds, cyclic urea compounds, urea compounds, oxazolidone compounds, and isoxazolidone compounds in the total solid content of the photosensitive composition is 0.010 mass % or more and 5.0 mass % or less.

[0025]

[17] The photosensitive composition according to any one of [8] to

[16] , further comprising a (J) crosslinkable aromatic compound, the (J) crosslinkable aromatic compound having at least two (Id) structures: cyclic structures to which a phenolic hydroxyl group and at least two crosslinkable groups are bonded, and at least two (IId) structures: cyclic structures having a phenolic hydroxyl group different from the (Id) structures, and further having a (IIId) structure: a structure connecting at least two of the (IId) structures, and satisfying the following condition (6): (6) The photosensitive composition according to any one of [8] to

[16] , wherein the total content of the (J) crosslinkable aromatic compound in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 5,000 ppm by mass or less.

[0026]

[18] A cured product obtained by curing the photosensitive composition according to any one of [8] to

[17] .

[0027]

[19] A display device comprising the cured product according to

[18] .

[0028]

[20] An electronic component comprising the cured product according to

[18] .

[0029]

[21] A method for producing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of [8] to

[17] on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern of the photosensitive composition to obtain a cured pattern of the photosensitive composition.

[0030]

[22] A display device having a substrate, a first electrode, a second electrode, a pixel dividing layer, a light-emitting layer, and a TFT planarizing layer, wherein the pixel dividing layer and / or the TFT planarizing layer contains one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof, the resin having an amine residue having a phenolic hydroxyl group, the amine residue having a phenolic hydroxyl group having at least two (XIa) structures: a cyclic structure having a phenolic hydroxyl group, and a (XIIa) structure: a structure connecting at least two (XIa) structures, The display device, wherein the structure (XIIa) is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, satisfies the following condition (X1a): (X1a) the content of fluorine elements in the pixel dividing layer is 1,000 ppm by mass or less, and / or the content of fluorine elements in the TFT planarizing layer is 1,000 ppm by mass or less.

[0031] The resin of the present invention can provide a photosensitive composition that can suppress residues after development. It can also provide a photosensitive composition that has excellent light-emitting properties that allow low-voltage operation to obtain a desired current density, and that can yield a cured product suitable for use in a display device with excellent reliability of the light-emitting element. Additionally, it can provide a photosensitive composition that can yield a cured product suitable for use in an electronic component with excellent migration resistance.

[0032] Furthermore, the photosensitive composition of the present invention can suppress residues after development, and can provide a cured product that can be used in displays having similarly excellent light-emitting properties and excellent reliability of the light-emitting elements. In addition, the cured product can be used in electronic components having excellent migration resistance. Furthermore, the display device of the present invention can provide a display device having similarly excellent light-emitting properties and excellent reliability of the light-emitting elements.

[0033] 1A and 1B are schematic cross-sectional and plan views showing an example of a display device 100A in which a pixel division layer has a stepped shape having a thick film portion and a thin film portion, respectively, and a plan view showing steps 1 to 4 of a manufacturing process for an organic EL display substrate used in evaluating light-emitting characteristics.

[0034] The resin, photosensitive composition, cured product, and method for producing the cured product of the present invention are described below. When referring to the photosensitive composition of the present invention, this description is common to the photosensitive compositions of the first and second aspects of the present invention. On the other hand, when referring to a specific aspect of the photosensitive composition, it is referred to as the photosensitive composition of the first aspect of the present invention. However, the present invention is not limited to the following embodiments, and various modifications are naturally possible within the scope of the invention, as long as the object of the invention can be achieved and the gist of the invention is not deviated from.

[0035] A hydrocarbon group or alkylene group containing a "** bond" or "** group" refers to a hydrocarbon group or alkylene group to which a "** bond" or "** group" is bonded, or at least two hydrocarbon groups or at least two alkylene groups linked by a "** bond" or "** group". A silicone structure refers to a structure having an Si-O-Si bond as the main backbone and two organic groups on the silicon atom. In other words, the silicon atom in the silicone structure is bonded to two organic groups and two oxygen atoms. A siloxane structure refers to a structure having an Si-O-Si bond as the main backbone and one organic group on the silicon atom. In other words, the silicon atom in the siloxane structure is bonded to one organic group and three oxygen atoms.

[0036] In the resin of the present invention and the binder resin (A) in the photosensitive composition of the present invention, the amine residue refers to a structure obtained by removing a nitrogen atom and a substituent on the nitrogen atom from a structure derived from an amine in the resin or a structure derived from an amine derivative. That is, the amine residue corresponds to a structure obtained by removing a nitrogen atom and a substituent on the nitrogen atom from an amine molecule or an amine derivative molecule that is a raw material for the resin. The amine residue preferably has a divalent or higher structure, i.e., a structure obtained by removing at least two nitrogen atoms and a substituent on the nitrogen atom from a structure derived from an amine in a structural unit of the resin or a structure derived from an amine derivative. It is also preferable that the amine residue has a trivalent or higher structure. Examples of such amine residues include structures obtained by removing a nitrogen atom and a substituent on the nitrogen atom from a diamine molecule, triamine molecule, diamine derivative molecule, or triamine derivative molecule that is a raw material for the resin.

[0037] In the resin of the present invention and the binder resin (A) in the photosensitive composition of the present invention, the carboxylic acid residue refers to a structure obtained by removing a carbonyl group and a substituent on the carbonyl carbon atom from a structure derived from a carboxylic acid or a carboxylic acid derivative in the resin. That is, the carboxylic acid residue corresponds to a structure obtained by removing a carbonyl group and a substituent on the carbonyl carbon atom from a carboxylic acid molecule or a carboxylic acid derivative molecule, which are raw materials for the resin. The carboxylic acid residue preferably has a divalent or higher structure, i.e., a structure obtained by removing at least two carbonyl groups and a substituent on the carbonyl carbon atom from a structure derived from a carboxylic acid or a carboxylic acid derivative in the structural unit of the resin. The carboxylic acid residue preferably has a trivalent or higher structure, and more preferably a tetravalent or higher structure. Examples of such carboxylic acid residues include structures obtained by removing a carbonyl group and a substituent on the carbonyl carbon atom from a dicarboxylic acid molecule, tricarboxylic acid molecule, tetracarboxylic acid molecule, dicarboxylic acid derivative molecule, tricarboxylic acid derivative molecule, or tetracarboxylic acid derivative molecule, which are raw materials for the resin.

[0038] <Resin> The resin of the present invention has the configuration described in [1] above. By adopting the above configuration, the resin of the present invention can provide a photosensitive composition capable of suppressing residue after development. Furthermore, it is possible to provide a photosensitive composition that has excellent light-emitting properties that allow low-voltage operation to obtain a desired current density, and that can yield a cured product suitable for use in a display device with excellent light-emitting device reliability. In addition, it is possible to provide a photosensitive composition that can yield a cured product suitable for use in an electronic component with excellent migration resistance. This is because, by incorporating the above-mentioned resins having a fluorine content below a specific value into the photosensitive composition, the content of fluorine elements, fluoride ions, or fluorine-containing anions derived from these resins is below a specific value. It is presumed that these resins locally activate protons in the photosensitive composition through interactions such as hydrogen bonding. Therefore, it is believed that the effect of promoting dissolution in the developer is effective in suppressing residue after development. Furthermore, it is presumed that the surface modification of the substrate by these components prevents residue adhesion at the openings, thereby suppressing residue after development, and that the effects of low-voltage operation of light-emitting properties and improved luminance are significant. Furthermore, by incorporating a polyimide or the like having an amine residue of a specific structure having a phenolic hydroxyl group, hydrogen bonding between the phenolic hydroxyl group and a fluorine atom is formed, which is thought to improve the stability of the above-mentioned fluorine-containing component and fluorine-containing anion in the photosensitive composition, and contribute to the successful effect of suppressing residues after development.

[0039] Furthermore, intentionally incorporating the above-mentioned resin with a fluorine content below a specific value is believed to adjust the detection intensity of these ions on the surface of the cured product to a specific value or below, thereby controlling the polarization structure and charge balance in the cured product. As a result, it is believed that suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect light-emitting properties or electrical insulation will contribute to high reliability or excellent migration resistance of light-emitting elements. Furthermore, suppressing migration and aggregation of metals in electrodes or metal wiring will contribute to high reliability in display devices, electronic components, and semiconductor devices.

[0040] The resin of the present invention (Ax resin) is one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof (hereinafter referred to as "polyimide-based resins"). Examples of polyimide precursors include polyamic acid, polyamic acid ester, polyamic acid amide, and polyisoimide. Examples of polyimides include resins obtained by dehydration and cyclization of polyimide precursors. Examples of polybenzoxazole precursors include polyhydroxyamides. Examples of polybenzoxazoles include resins obtained by dehydration and cyclization of polybenzoxazole precursors. Examples of polyamideimide precursors include resins obtained by reacting tricarboxylic acid anhydrides with diamines. Examples of polyamideimides include resins obtained by dehydration and cyclization of polyamideimide precursors. Examples of polyamides include resins obtained by reacting dicarboxylic acid chlorides with diamines. The resin of the present invention may be a single resin, a mixture thereof, or a copolymer thereof.

[0041] <(DA1) Primary Amine Residue> The resin of the present invention has a (DA1) primary amine residue: an amine residue having a phenolic hydroxyl group, and the (DA1) primary amine residue has at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, and a (IIa) structure: a structure connecting at least two (Ia) structures. It is also preferable that the resin of the present invention has two or more types of (DA1) primary amine residues.

[0042] From the viewpoint of improving the reliability and migration resistance of the light-emitting device, the cyclic structure in the (Ia) structure is preferably an aromatic structure or a fused polycyclic structure, and more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure. The phenolic hydroxyl group in the (DA1) primary amine residue may react with a structure and / or group in the resin to form a benzoxazole ring. That is, in a resin having a benzoxazole ring in its structural unit, the benzoxazole ring may have a (DA1) primary amine residue.

[0043] In the resin of the present invention, the structure (IIa) is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. The alkylene group, cycloalkylene group, or arylene group in the structure (IIa) is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group in the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group preferably have 1 to 15 carbon atoms, and the hydrocarbon group preferably has an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure.

[0044] <Specific Primary Amine Residue (DA1)> From the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting properties, improving the reliability of the light-emitting device, and improving migration resistance, the primary amine residue (DA1) preferably has an amine residue satisfying the following condition (S1x) (hereinafter referred to as "specific primary amine residue (DA1)"). The amine residue (DA1) satisfying the following condition (S1x) is more preferably an amine residue further satisfying the following condition (S1y), and even more preferably an amine residue further satisfying the following condition (S1z). The resin of the present invention also preferably has two or more types of specific primary amine residues (DA1). The molecular symmetry of the amine residue (S1x) is C １ It has an axis of symmetry and C ２ No symmetry axis (S1y) C as the molecular symmetry of the amine residue １ It has an axis of symmetry and C ２ Axis of symmetry and C ３ (S1z) The molecular symmetry of the amine residue is C １ It has an axis of symmetry and C １ It has no other axis of symmetry than the axis of symmetry.

[0045] The amine residue in the primary amine residue (DA1) is as described above. The molecular symmetry of the amine residue in the above conditions (S1x) to (S1z) refers to the molecular symmetry of the amine residue when the amine residue contained in the resin of the present invention is considered as a molecule. Examples of molecular symmetry include an axis of symmetry, a plane of symmetry, a center of symmetry, and an axis of rotation. The above conditions (S1x) to (S1z) are intended to take into consideration the axis of symmetry among these molecular symmetries.

[0046] As the molecular symmetry under the above conditions (S1x) to (S1z), C ｘ Having a symmetry axis means that when the three-dimensional structure of the molecule in question is rotated (360 / x) degrees around an arbitrary axis, the three-dimensional structure before and after the rotation is the same. Here, x represents an integer of 1 or more. In other words, the molecular symmetry is C １ Having an axis of symmetry means that the three-dimensional structure is the same before and after a 360° rotation around an arbitrary axis.２ Having an axis of symmetry means that the three-dimensional structure is the same before and after a 180° rotation around an arbitrary axis. ３ Having a symmetry axis means that the three-dimensional structure is the same before and after a 120° rotation around an arbitrary axis. １ The fact that there is no axis of symmetry other than the axis of symmetry means that ２ Axis of symmetry (the axis on which the three-dimensional structure is the same before and after a 180° rotation) and C ３ Symmetry axis (the axis on which the three-dimensional structure is the same before and after a 120° rotation) ｘ It means that there is no axis of symmetry (1<x≦360).

[0047] In the above conditions (S1x) to (S1z) for the primary amine residue (DA1), when the symmetry axis of the molecular symmetry of the amine residue is taken into consideration, the three-dimensional structure of the target amine residue before rotation takes into consideration all possible conformations of the molecule. That is, in the three-dimensional structure before rotation, at least one of the possible conformations of the target amine residue as a molecule is C ２ If there is a symmetry axis, the above condition (S1x) is not satisfied, and at least one of them is C ２ Axis of symmetry or C ３ If there is a symmetry axis, the condition (S1y) above is not satisfied, and at least one of them is C ｘ If there is an axis of symmetry (1<x≦360), the above condition (S1z) is not satisfied.

[0048] It is also preferable that the primary amine residue (DA1) has an amine residue that includes at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis.

[0049] By making the primary amine residue (DA1) have the above-mentioned structure, the primary amine residue (DA1) is C ２Because the resin has an asymmetric structure without an axis of symmetry, the symmetry of the resin of the present invention is reduced. Therefore, it is believed that orientation and stacking of the resin in the film of the photosensitive composition are suppressed. As a result, the solubility of the resin is improved, and the effect of promoting the dissolution of the resin in the developer is significant, resulting in a significant effect of suppressing residue after development. Furthermore, it is believed that the effect of suppressing residue after development promotes the surface modification action of the substrate surface by the above-mentioned fluorine element, fluoride ions, etc., resulting in a significant effect of low-voltage driving of light-emitting characteristics. In addition, it is believed that the above-mentioned fluorine element, fluoride ions, etc. promote the control of the polarization structure and charge balance in the cured product. As a result, it is believed that ion migration and electromigration are suppressed, resulting in a significant effect of improving the reliability and migration resistance of the light-emitting device.

[0050] The primary amine residue (DA1) preferably has an amine residue represented by formula (31) from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance.

[0051]

[0052] In formula (31), R ３１ and R ３２ R each independently represents a carboxy group, a mercapto group, or a sulfonic acid group. ３９ represents a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. ６１ and R ６２ each independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms. X １１ and X １２ each independently represents a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonylamide group. １１represents a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. a and b each independently represent an integer of 1 to 4. g and h each independently represent an integer of 0 to 3. o and p each independently represent an integer of 0 to 3. w represents an integer of 0 to 6. Note that 1≦a+g+o≦4 and 1≦b+h+p≦4. １ and * ２ each independently represents a bonding point in the resin.

[0053] In formula (31), R ３９ The hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group containing a carbonyl group is preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or an arylalkyl group having 10 to 20 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms. When o represents an integer of 1 to 3, the corresponding R ６１ is preferably an alkyl group having 1 to 6 carbon atoms, more preferably a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, or an s-butyl group. When p represents an integer of 1 to 3, the corresponding R ６２ is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably a methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, or s-butyl group. It is preferable that at least one of o and p is 1. It is also preferable that o and p are 0, and more preferably that o and p are 1. It is also preferable that o represents an integer of 1 to 3 and p is 0, and more preferably o is 1. It is also preferable that o is 0 and p represents an integer of 1 to 3, and more preferably p is 1.

[0054] From the viewpoint of satisfying the above condition (S1x), R ３９In order to satisfy the condition (S1x), it is preferable that the chemical structure of (a) R ３１ and R ３２ (b) the chemical structures of R bonded to the aromatic ring in formula (31) are not the same; ３１ and R ３２ and (c) g and h each independently represent an integer of 0 to 3 that is different from each other. ６１ and R ６２ (e) The chemical structures of R bonded to the aromatic ring in formula (31) are not the same. ６１ and R ６２ and (f) o and p each independently represent a mutually different integer of 0 to 3. From the viewpoint of satisfying the condition (S1x), it is also preferable to satisfy at least one of the conditions (g) at least two phenolic hydroxyl groups bonded to the aromatic ring in formula (31) each independently represent a mutually different integer of 1 to 4 (asymmetric substitution positions).

[0055] In formula (31), X １１ and X １２ The hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group containing a carbonylamide group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an arylalkylene group having 10 to 20 carbon atoms. １１ and X １２The hydrocarbon group in the hydrocarbon group containing a carbonylamide group in formula (31) is more preferably an arylene group having 6 to 15 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. It is preferable that the arylene group having 6 to 15 carbon atoms is bonded to the carbonyl group in the carbonylamide group. In addition, the nitrogen atom of the carbonylamide group is bonded to the aromatic ring in formula (31), and the arylene group having 6 to 15 carbon atoms bonded to the carbonyl group in the carbonylamide group is * in formula (31). １ or* ２ It is preferable that Y １１ In the hydrocarbon group containing an ether bond, the hydrocarbon group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. １１ In the above, the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group preferably have 1 to 15 carbon atoms, and the hydrocarbon group preferably has an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted.

[0056] From the viewpoint of satisfying the above condition (S1x), (i) X １１ and X １２ and (j) the X bonded to the aromatic ring in formula (31) １１ and X １２ In addition, from the viewpoint of satisfying the above condition (S1x), it is preferable that at least one of the following conditions is satisfied: １１ It is also preferable that the chemical structure satisfies the above condition (S1x).

[0057] The phenolic hydroxyl group in the amine residue represented by formula (31) may react with a structure and / or group in the resin to form a benzoxazole ring. That is, in a resin having a benzoxazole ring in its structural unit, the benzoxazole ring may have an amine residue represented by formula (31). The phenolic hydroxyl group in the amine residue represented by formula (31) may be protected with a monovalent acid-dissociable group having 1 to 120 carbon atoms. That is, the amine residue represented by formula (31) preferably has a phenolic hydroxyl group, and also has an amine residue in which the phenolic hydroxyl group in the amine residue represented by formula (31) is protected with a monovalent acid-dissociable group having 1 to 120 carbon atoms. The monovalent acid-dissociable group having 1 to 120 carbon atoms is preferably an alkyl group having 1 to 6 carbon atoms, a cycloacrylic group having 4 to 10 carbon atoms, an alkoxyalkyl group having 2 to 10 carbon atoms, or a cycloalkoxyalkyl group having 5 to 15 carbon atoms.

[0058] When the chemical structures in the specific (DA1) primary amine residue are not identical, it is preferable that the compared structures differ in at least one of the number of carbon atoms, the number of hydrogen atoms, the number of heteroatoms, the molecular weight, the molecular volume, and the aspect ratio. Furthermore, when the chemical structures in the specific (DA1) primary amine residue are not identical, it is also preferable that the compared structures are in a relationship of structural isomerism or geometric isomerism. It is also preferable that the compared structures have at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis. The same applies to the following description of the structure in the specific (DA1) primary amine residue.

[0059] In formula (31), Y １１ As the group represented by formula (31), a group represented by formula (32), formula (33), or formula (34) is preferred from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. １１ is a group represented by formula (32), formula (33), or formula (34), R in formula (31) ３９ is R bonded to an atom of the ring member in formula (32). ３４ a group corresponding to R bonded to a ring atom in formula (33) ３５or a group corresponding to R in formula (34) ３６ Or R ３７ is a group that bonds to

[0060]

[0061] In formulas (32) to (34), R ３４ and R ３５ R each independently represents a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. ３６ and R ３７ R each independently represents a hydrogen atom, a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. ３９ represents a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. a and b each independently represent an integer of 1 or 2. c represents an integer of 1 to ((4×a)+2). d represents an integer of 1 to ((4×a)+4). w represents an integer of 0 to 6. * １ ~* ６ each independently represents a bonding point with an aromatic ring in the resin of formula (31). Formula (32) satisfies the following condition (Y1), formula (33) satisfies the following condition (Y2), and formula (34) satisfies the following condition (Y3).

[0062] (Y1) When the carbon center bonding to the aromatic ring in formula (31) is α (denoted by □), and the carbon atom is the 1st position, and the (a+2) position of the carbon atom forming the ring is β (denoted by ○), the chemical structures on the left and right sides separated by the dashed line passing through α and β on the paper are not identical. (Y2) When the carbon center bonding to the aromatic ring in formula (31) is γ (denoted by □), and the carbon atom is the 1st position, and the midpoint between the (b+2) position and the (b+3) position of the carbon atom forming the ring is δ (denoted by ●), the chemical structures on the left and right sides separated by the dashed line passing through γ and δ on the paper are not identical. (Y3) When R in formula (34) is ３６ and R ３７ The chemical structures of the compounds are not identical.

[0063] In addition, when the group represented by formula (32) has at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis, formula (32) satisfies the above-mentioned condition (Y1).In addition, when the group represented by formula (33) has at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis, formula (33) satisfies the above-mentioned condition (Y2).In addition, when the group represented by formula (34) has at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis, formula (34) satisfies the above-mentioned condition (Y3).

[0064] When considering the above conditions (Y1) to (Y3) for formula (32) to formula (34), the chemical structure of the group represented by the target formula (32), formula (33), or formula (34) takes into consideration all possible conformations that the target group can take. That is, if at least one of the possible conformations that the target group represented by the target formula (32) has the same chemical structure on the left and right sides separated by a dashed line passing through α and β on the paper, it is deemed not to satisfy the above condition (Y1). Also, if at least one of the possible conformations that the target group represented by the target formula (33) has the same chemical structure on the left and right sides separated by a dashed line passing through α and γ on the paper, it is deemed not to satisfy the above condition (Y2). Also, if at least one of the possible conformations that the target group represented by the target formula (34) has the same chemical structure on the left and right sides separated by a dashed line passing through α and γ on the paper, it is deemed not to satisfy the above condition (Y2). ３６ and R ３７ are the same, the condition (Y3) above is not satisfied.

[0065] In formulas (32) to (34), R ３６ and R ３７ are each independently preferably a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. ３４ Medium, R ３５ Medium, R ３６ Medium, R ３７ Naka, and R ３９The hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group containing a carbonyl group is preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or an arylalkyl group having 10 to 20 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0066] By making the primary amine residue (DA1) have the above-mentioned structure, the primary amine residue (DA1) is C ２ The resin of the present invention has an asymmetric structure without an axis of symmetry or a three-dimensionally asymmetric structure, which reduces the symmetry. Therefore, it is believed that orientation and stacking of the resin in the film of the photosensitive composition are suppressed. For the same reasons as above, it is presumed that the effects of suppressing residue after development, lowering the voltage required for light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance are significant.

[0067] The primary amine residue (DA1) satisfies the above condition (S1x) from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, and has an amine residue represented by formula (31), and further, in formula (31), Y １１ is particularly preferably a group represented by formula (32), formula (33), or formula (34).

[0068] In formula (31), Y １１ From the viewpoint of the above-mentioned effects of the present invention, is preferably a group represented by any one of formulas (55) to (68).

[0069]

[0070] In formulas (55) to (68), * each independently represents a bonding point in the resin.

[0071] In formula (31), Y １１ The primary amine residue (DA1) is a group represented by any one of formulas (55) to (68), and is preferably an amine residue represented by any one of formulas (70) to (99).

[0072]

[0073]

[0074] The total content of amine residues represented by formula (31) in all amine residues in the resin of the present invention is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, and particularly preferably 50 mol% or more, from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. On the other hand, from the viewpoint of the effects of the present invention, the total content of amine residues represented by formula (31) is preferably 100 mol% or less, more preferably 90 mol% or less, even more preferably 80 mol% or less, and particularly preferably 70 mol% or less.

[0075] <Secondary amine residue (DA2)> From the viewpoint of improving the reliability and migration resistance of the light-emitting device, the resin of the present invention preferably further has a secondary amine residue (DA2): an amine residue having no phenolic hydroxyl group, and satisfies the following condition (α1) and / or condition (α2). From the viewpoint of suppressing residues after development, the resin of the present invention preferably satisfies the following conditions (α1) and (α2). It is also preferable that the resin of the present invention has two or more types of secondary amine residues (DA2). (α1) (DA2) secondary amine residue has at least two (Ib) structures: cyclic structures having no phenolic hydroxyl group, and further has (IIb) structure: a structure connecting at least two (Ib) structures, and the (IIb) structure is a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. (α2) (DA2) secondary amine residue has (IIIb) structure: a silicone structure and / or a siloxane structure.

[0076] From the viewpoint of improving the reliability and migration resistance of the light-emitting device, the cyclic structure in the (Ib) structure is preferably an aromatic structure or a fused polycyclic structure, more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure.

[0077] The alkylene group, cycloalkylene group, or arylene group in the structure (IIb) is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group in the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group preferably have 1 to 15 carbon atoms, and the hydrocarbon group preferably has an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure.

[0078] The silicone structure and siloxane structure in the (IIIb) structure are preferably bonded to at least two alkylene groups and are divalent or higher structures via these alkylene groups. The divalent or higher structures are more preferably trivalent or higher, and even more preferably tetravalent or higher. On the other hand, the divalent or higher structures are preferably hexavalent or lower. The number of silicon atoms in the silicone structure and / or siloxane structure is preferably 2 or higher, more preferably 3 or higher, and even more preferably 4 or higher. On the other hand, the number of silicon atoms is preferably 15 or lower, more preferably 10 or lower, and even more preferably 8 or lower. The silicone structure is preferably a dialkyl silicone structure and / or a monoalkyl silicone structure, and the siloxane structure is preferably a monoalkyl siloxane structure. The number of carbon atoms in the alkyl group in the dialkyl silicone structure, monoalkyl silicone structure, and monoalkyl siloxane structure is preferably 1 or higher, more preferably 2 or higher, and even more preferably 3 or higher. On the other hand, the number of carbon atoms in the alkyl group is preferably 10 or lower, more preferably 8 or lower, and even more preferably 6 or lower.

[0079] <Specific (DA2) Secondary Amine Residue> From the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting properties, improving the reliability of light-emitting devices, and improving migration resistance, the (DA2) secondary amine residue preferably has an amine residue that satisfies at least one of the following conditions (S1x) and (S2x) (hereinafter referred to as "specific (DA2) secondary amine residue"). When the resin of the present invention has a (DA2) secondary amine residue, from the viewpoint of the effects of the present invention, it is preferred that the (DA1) primary amine residue has an amine residue that satisfies the following condition (S1x), and / or the (DA2) secondary amine residue has an amine residue that satisfies at least one of the following conditions (S1x) and (S2x) (hereinafter referred to as "specific (DA2) secondary amine residue"). It is also preferred that the resin of the present invention has two or more types of specific (DA2) secondary amine residues. The molecular symmetry of the (S1x) amine residue is C １ It has an axis of symmetry and C ２ No symmetry axis (S1y) C as the molecular symmetry of the amine residue １ It has an axis of symmetry and C ２ Axis of symmetry and C ３ (S1z) The molecular symmetry of the amine residue is C １ It has an axis of symmetry and C １ (S2x) The amine residue has at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis; (S2y) The amine residue has at least one of an asymmetric center and an asymmetric axis; and (S2z) The amine residue has an asymmetric axis.

[0080] The amine residue in the secondary amine residue (DA2) that satisfies the above condition (S1x) is more preferably an amine residue that also satisfies the above condition (S1y), and even more preferably an amine residue that also satisfies the above condition (S1z).Furthermore, the amine residue in the secondary amine residue (DA2) that satisfies the above condition (S2x) is more preferably an amine residue that also satisfies the above condition (S2y), and even more preferably an amine residue that also satisfies the above condition (S2z).

[0081] The amine residue in the (DA2) secondary amine residue is as described above. The examples and preferred descriptions regarding the conditions (S1x) to (S1z) for the (DA1) primary amine residue are the same as those described above. The examples and preferred descriptions regarding the amine residue in the conditions (S1x) to (S1z) for the (DA2) secondary amine residue are the same as those described above for the (DA1) primary amine residue. Furthermore, the molecular symmetry and molecular symmetry of the amine residue in the conditions (S1x) to (S1z) for the (DA2) secondary amine residue are C ｘ Examples and preferred descriptions regarding the presence of an axis of symmetry are as described above in (DA1) primary amine residue.

[0082] In the above conditions (S1x) to (S1z) for the secondary amine residue (DA2), when the symmetry axis of the amine residue is taken into consideration, all possible conformations of the molecule are taken into consideration for the three-dimensional structure of the target amine residue before rotation, as with the primary amine residue (DA1). That is, in the three-dimensional structure before rotation, at least one of the possible conformations of the target amine residue as a molecule is C. ２ If there is a symmetry axis, the above condition (S1x) is not satisfied, and at least one of them is C ２ Axis of symmetry or C ３ If there is a symmetry axis, the condition (S1y) above is not satisfied, and at least one of them is C ｘ If there is an axis of symmetry (1<x≦360), the above condition (S1z) is not satisfied.

[0083] The asymmetric center, asymmetric axis, asymmetric plane, and helical axis in the above conditions (S2x) to (S2z) refer to the asymmetric center, asymmetric axis, asymmetric plane, and helical axis in the molecule when the amine residue in the resin of the present invention is considered as a molecule.

[0084] Examples of asymmetric centers include asymmetric atoms.Preferably, asymmetric atoms include asymmetric carbon atoms, asymmetric silicon atoms, asymmetric germanium atoms, asymmetric nitrogen atoms, asymmetric phosphorus atoms, or asymmetric arsenic atoms.As asymmetric axes, for example, the axis connecting two rings in two ring structures, the axis connecting two ring structures passing through the central atom in two ring structures connected by sharing one central atom, or the axis linearly connecting three atoms connected by two double bonds.As structures having asymmetric axes, preferred are biphenyl structures, binaphthyl structures, spiro structures, or allene structures.As asymmetric planes, for example, the faces of at least two rings facing each other in a ring structure formed by connecting at least two rings with a single bond, or the faces of at least two rings facing each other in a metal coordination ring structure containing at least two rings coordinated to a metal atom.As structures having asymmetric planes, preferred are cyclophane structures or metallocene structures, and more preferred are paracyclophane structures or ferrocene structures. The helical axis may be, for example, an axis of a helical structure in which at least two aromatic rings are fused in succession. The structure having a helical axis is preferably a polyhelicene structure.

[0085] In the above conditions (S2x) to (S2z), when the amine residue in the resin of the present invention is a molecule, the asymmetric center, asymmetric axis, asymmetric plane, and helical axis may be a meso compound. Furthermore, in the above conditions (S2x) to (S2z), the amine residue preferably has chirality, more preferably central chirality, axial chirality, planar chirality, or helicity.

[0086] By configuring the secondary amine residue (DA2) as described above, the secondary amine residue (DA2) is C ２ Since the resin of the present invention has an asymmetric structure without an axis of symmetry or a three-dimensionally asymmetric structure, the symmetry of the resin is reduced. Therefore, it is believed that orientation and stacking of the resin in the film of the photosensitive composition is suppressed. As a result, for the same reasons as the primary amine residue (DA1), it is presumed that the effects of suppressing residue after development, lowering the voltage required for light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance are significant.

[0087] The secondary amine residue (DA2) preferably has an amine residue represented by formula (36) from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance.

[0088]

[0089] In formula (36), R ８１ and R ８２ R each independently represents a carboxy group, a mercapto group, or a sulfonic acid group. ８９ represents a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. ９１ and R ９２ each independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms. X ３１ and X ３２ each independently represents a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonylamide group. ３３ and X ３４ each independently represents a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. ３１ represents a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. g and h each independently represent an integer of 0 to 4. o and p each independently represent an integer of 0 to 4. x and y each independently represent 0 or 1. w represents an integer of 0 to 6. １ and * ２each independently represents a bonding point in the resin.

[0090] In formula (36), R ８９ The hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group containing a carbonyl group is preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or an arylalkyl group having 10 to 20 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms. When o represents an integer of 1 to 3, the corresponding R ９１ is preferably an alkyl group having 1 to 6 carbon atoms, more preferably a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, or an s-butyl group. When p represents an integer of 1 to 3, the corresponding R ９２ is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably a methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, or s-butyl group. It is preferable that at least one of o and p is 1. It is also preferable that o and p are 0, and more preferably that o and p are 1. It is also preferable that o represents an integer of 1 to 3 and p is 0, and more preferably o is 1. It is also preferable that o is 0 and p represents an integer of 1 to 3, and more preferably p is 1.

[0091] From the viewpoint of satisfying the above condition (S1x), R ８９ In order to satisfy the condition (S1x), it is preferable that the chemical structure of (a) R ８１ and R ８２ (b) the chemical structures of R bonded to the aromatic ring in formula (36) are not the same; ８１ and R ８２ and (c) g and h each independently represent an integer of 0 to 4 that is different from each other. ９１ and R ９２ (e) The chemical structures of R bonded to the aromatic ring in formula (36) are not the same. ９１ and R９２ and (f) o and p each independently represent an integer of 0 to 4 that is different from each other. ８９ It is preferable that the chemical structure satisfies the above condition (S2x).

[0092] In formula (36), X ３１ and X ３２ The hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group containing a carbonylamide group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an arylalkylene group having 10 to 20 carbon atoms. ３３ and X ３４ The hydrocarbon group, the hydrocarbon group containing an ether bond, the hydrocarbon group containing a carbonyloxy group, and the hydrocarbon group containing a carbonylamide group are preferably alkylene groups having 1 to 10 carbon atoms, cycloalkylene groups having 4 to 10 carbon atoms, arylene groups having 6 to 15 carbon atoms, or arylalkylene groups having 10 to 20 carbon atoms. ３１ In the hydrocarbon group containing an ether bond, the hydrocarbon group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. ３１ In the above, the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group preferably have 1 to 15 carbon atoms, and the hydrocarbon group preferably has an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted.

[0093] From the viewpoint of satisfying the above condition (S1x), (i) X ３１ and X ３２ and (j) the X bonded to the aromatic ring in formula (36) ３１ and X ３２In addition, from the viewpoint of satisfying the above condition (S1x), it is preferable that (k) X ３３ and X ３４ and (l) the X bonded to the aromatic ring in formula (36) ３３ and X ３４ In addition, from the viewpoint of satisfying the above condition (S1x), it is also preferable that at least one of the following conditions is satisfied: ３１ On the other hand, from the viewpoint of satisfying the condition (S2x), it is also preferable that the chemical structure of Y ３１ It is preferable that the chemical structure of the formula (S2x) satisfies the condition (S2x), more preferably satisfies the condition (S2y), and even more preferably satisfies the condition (S2z). ３１ It is preferable that the structure having an asymmetric axis is a biphenyl structure, a binaphthyl structure, a spiro structure, or an allene structure.

[0094] When the chemical structures in the specific (DA2) secondary amine residue are not identical, it is preferable that the compared structures differ in at least one of the number of carbon atoms, the number of hydrogen atoms, the number of heteroatoms, the molecular weight, the molecular volume, and the aspect ratio. Furthermore, when the chemical structures in the specific (DA2) secondary amine residue are not identical, it is also preferable that the compared structures are in a relationship of structural isomerism or geometric isomerism. It is also preferable that the compared structures have at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis. The same applies to the following description of the structure in the specific (DA2) secondary amine residue.

[0095] In formula (36), Y ３１ In view of the effects of the present invention, Y in formula (36) is preferably a group represented by formula (37) or formula (38). ３１ is a group represented by formula (37) or formula (38), R in formula (36) ８９ is R bonded to an atom of the ring member in formula (37). ８４ ~R ８７or a group corresponding to R bonded to a ring atom in formula (38) ９４ ~R ９６ is a group corresponding to

[0096]

[0097] In formula (37) and formula (38), R ８４ ~R ８７ and R ９４ ~R ９６ each independently represents a hydrocarbon group, a hydrocarbon group containing an ether bond, or a hydrocarbon group containing a carbonyl group. a, b, and c each independently represent an integer of 1 or 2. e and f each independently represent an integer from 0 to 3. g represents an integer from 0 to ((2×a)+2). h represents an integer from 0 to ((2×b)+2). i represents an integer from 0 to 3. j represents an integer from 0 to 4. k represents an integer from 0 to ((2×c)+3). * １ ~* ４ are each independently X in formula (36). ３３ or X ３４ Represents the point of attachment to

[0098] In formula (37) and formula (38), R ８４ Medium, R ８５ Medium, R ８６ Medium, R ８７ Medium, R ９４ Medium, R ９５ Naka, and R ９６ The hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group containing a carbonyl group is preferably an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or an arylalkyl group having 10 to 20 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0099] By configuring the secondary amine residue (DA2) as described above, the secondary amine residue (DA2) is C ２The resin of the present invention has an asymmetric structure without an axis of symmetry or a three-dimensionally asymmetric structure, which reduces the symmetry. Therefore, it is believed that orientation and stacking of the resin in the film of the photosensitive composition are suppressed. For the same reasons as above, it is presumed that the effects of suppressing residue after development, lowering the voltage required for light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance are significant.

[0100] The secondary amine residue (DA2) satisfies at least one of the above conditions (S1x) and (S2x) from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, and has an amine residue represented by formula (36), and further, in formula (36), Y ３１ is particularly preferably a group represented by formula (37) or formula (38).

[0101] The total content of amine residues represented by formula (36) in all amine residues in the resin of the present invention is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 10 mol% or more, even more preferably 15 mol% or more, and particularly preferably 20 mol% or more, from the viewpoint of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. On the other hand, from the viewpoint of the effects of the present invention, the total content of amine residues represented by formula (36) is preferably 80 mol% or less, more preferably 50 mol% or less, even more preferably 40 mol% or less, and even more preferably 30 mol% or less.

[0102] From the viewpoint of the effects of the present invention, it is preferable that the secondary amine residue (DA2) has an amine residue that satisfies the condition (S1x) above and also has an amine residue that satisfies the condition (S2x) above.Furthermore, from the viewpoint of the effects of the present invention, it is also preferable that the secondary amine residue (DA2) has an amine residue that satisfies at least one of the conditions (S1x) and (S2x) above and also has an amine residue that does not satisfy either of the conditions (S1x) or (S2x) above.

[0103] By configuring the secondary amine residue (DA2) in this manner, the secondary amine residue (DA2) is C２ In addition to the asymmetric structure having no axis of symmetry or the three-dimensionally asymmetric structure, the resin of the present invention has a structure different from the aforementioned structure, which reduces the symmetry of the resin as a whole, thereby suppressing the orientation and stacking of the resin in the film of the photosensitive composition, and it is presumed that the effect of the present invention becomes significant for the same reason as above.

[0104] In view of the effects of the present invention, the resin of the present invention preferably has a secondary amine residue (DA2) and also has an amine residue (DA2) other than the secondary amine residue that does not have a phenolic hydroxyl group. The resin of the present invention may further have an amine residue other than the primary amine residue (DA1) and the secondary amine residue (DA2). Examples of such amine residues include alicyclic amine residues and aliphatic amine residues.

[0105] In the resin of the present invention, the total content ratio of (DA1) primary amine residues to all amine residues in the resin is preferably 20 mol% or more and 90 mol% or less, and the total content ratio of (DA2) secondary amine residues to all amine residues is preferably 10 mol% or more and 80 mol% or less. The total content ratio of (DA1) primary amine residues to all amine residues is preferably 20 mol% or more, more preferably 30 mol% or more, even more preferably 40 mol% or more, and particularly preferably 50 mol% or more, from the viewpoint of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. On the other hand, the total content ratio of (DA1) primary amine residues is preferably 90 mol% or less, more preferably 80 mol% or less, and even more preferably 70 mol% or less, from the viewpoint of the effects of the present invention described above. The total content of the secondary amine residues (DA2) in all amine residues is preferably 10 mol% or more, more preferably 20 mol% or more, and even more preferably 30 mol% or more, from the viewpoint of improving the reliability and migration resistance of the light-emitting device. On the other hand, the total content of the secondary amine residues (DA2) is preferably 80 mol% or less, more preferably 70 mol% or less, even more preferably 60 mol% or less, and particularly preferably 50 mol% or less, from the viewpoint of the effects of the present invention.

[0106] <(CB) Alicyclic Structure-Containing Carboxylic Acid Residue> From the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving migration resistance, it is preferable that the resin of the present invention further contains (CB) an alicyclic structure-containing carboxylic acid residue (hereinafter referred to as "(CB) alicyclic acid residue"). It is also preferable that the resin of the present invention contains two or more types of (CB) alicyclic acid residues.

[0107] The carboxylic acid residue in the (CB) alicyclic acid residue is as described above. The (CB) alicyclic acid residue has an alicyclic structure. In the (CB) alicyclic acid residue, it is preferable that the atom bonding to the bonding point in the resin is a ring member atom of the alicyclic structure. In other words, it is preferable that the structure derived from a carboxylic acid or a structure derived from a carboxylic acid derivative in the resin has a ring member atom of the alicyclic structure bonding to a carbonyl group.

[0108] When the alicyclic acid residue (CB) has a divalent or higher valence structure, the structure derived from a carboxylic acid or the structure derived from a carboxylic acid derivative in the structural unit of the resin preferably has at least two ring atoms of the alicyclic structure that are bonded to a carbonyl group, and also preferably has one ring atom of the alicyclic structure that is bonded to a carbonyl group and at least one ring atom of the alicyclic structure that is not bonded to a carbonyl group.

[0109] When the (CB) alicyclic acid residue is a tetravalent or higher structure, the structure derived from a carboxylic acid or a carboxylic acid derivative in the structural unit of the resin preferably has at least four ring atoms of the alicyclic structure that bond to a carbonyl group, and also preferably has two ring atoms of the alicyclic structure that bond to a carbonyl group and at least two ring atoms of the alicyclic structure that do not bond to a carbonyl group. When the (CB) alicyclic acid residue is a tetravalent or higher structure and has four ring atoms of the alicyclic structure that bond to a carbonyl group, it is preferred that two of the four ring atoms are adjacent atoms. When the (CB) alicyclic acid residue is a tetravalent or higher structure and has two ring atoms of the alicyclic structure that bond to a carbonyl group, it is preferred that the two ring atoms are adjacent atoms.

[0110] The alicyclic acid residue (CB) preferably has a cycloalkylene group having 4 to 10 carbon atoms or a cycloalkenylene group having 4 to 10 carbon atoms. The alicyclic acid residue (CB) preferably has a cyclobutane structure, a cyclopentane structure, a cyclohexane structure, a cycloheptane structure, a cyclobutene structure, a cyclopentene structure, a cyclohexene structure, or a cycloheptene structure.

[0111] The alicyclic acid residue (CB) more preferably has a condensed polycyclic alicyclic structure, and more preferably has a tricyclo[5.2.1.0 ２，６ ] It is more preferable that the compound has a decane structure, an adamantane structure, a norbornene structure, an indane structure, a tetrahydroindane structure, a hexahydroindane structure, a tetrahydronaphthalene structure, an octahydronaphthalene structure, a decahydronaphthalene structure, a tetrahydrofluorene structure, a hexahydrofluorene structure, a tetrahydroanthracene structure, or an octahydroanthracene structure.

[0112] The total content of alicyclic acid residues (CB) relative to all carboxylic acid residues in the resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more, from the viewpoints of suppressing residues after development, improving the reliability of the light-emitting device, and improving migration resistance. On the other hand, the total content of alicyclic acid residues (CB) is preferably 100 mol% or less, more preferably 80 mol% or less, even more preferably 60 mol% or less, and particularly preferably 50 mol% or less, from the viewpoint of the effects of the present invention described above.

[0113] The resin of the present invention may further contain a carboxylic acid residue (CB) other than the alicyclic acid residue. Examples of such a carboxylic acid residue include an aromatic carboxylic acid residue and an aliphatic carboxylic acid residue.

[0114] <Polyimide Units, etc.> The resin of the present invention preferably contains polyimide units and polyimide precursor units from the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance.

[0115] The polyimide unit refers to a unit having two imide structures among structural units of a resin containing an amine residue and a carboxylic acid residue. The polyimide unit is preferably a unit represented by formula (1). The polyimide precursor unit refers to a unit having two amic acid structures, two amic acid ester structures, two amic acid amide structures, an amic acid structure and an amic acid ester structure, an amic acid structure and an amic acid amide structure, or an amic acid ester structure and an amic acid amide structure among structural units of a resin containing an amine residue and a carboxylic acid residue. The amic acid structure refers to a structure having one carboxylic acid amide bond and one carboxy group. The amic acid ester structure refers to a structure having one carboxylic acid amide bond and one carboxylic acid ester bond. The amic acid amide structure refers to a structure having one carboxylic acid amide bond and another carboxylic acid amide bond. The polyimide precursor unit is preferably a unit having two amic acid structures, two amic acid ester structures, or an amic acid structure and an amic acid ester structure, and more preferably a unit having two amic acid ester structures or an amic acid structure and an amic acid ester structure. The polyimide precursor unit is preferably a unit represented by formula (2).

[0116]

[0117] In formula (1) and formula (2), W １ and W ５ each independently represents a tetravalent to decavalent organic group. ２ and W ６ R each independently represents a divalent to decavalent organic group. ３ , R ４ , and R ９ R each independently represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by formula (7) or formula (8). ７ represents a substituent represented by formula (7) or formula (8). ８ represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. p represents an integer of 0 to 6. q represents an integer of 0 to 8. t represents an integer of 2 to 8, u represents an integer of 0 to 6, and 2≦t+u≦8. v represents an integer of 0 to 8. However, R３ or R ４ When represents a phenolic hydroxyl group, W bonding to the phenolic hydroxyl group １ or W ２ contains an aromatic structure in its structure. ８ or R ９ When represents a phenolic hydroxyl group, W bonding to the phenolic hydroxyl group ５ or W ６ contains an aromatic structure in its structure. １ and W ５ Each independently represents a carboxylic acid residue. ２ and W ６ each independently represents an amine residue. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0118]

[0119] In formula (7) and formula (8), R ２８ ~R ３０ each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an acyl group having 2 to 6 carbon atoms, or an aryl group having 6 to 15 carbon atoms. ２８ ~R ３０ are each independently preferably a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acyl group having 2 to 4 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted. In formula (2), R ７ contains a substituent represented by formula (7), and R ２８ When R is a hydrogen atom, it has an amide acid structure. ７ contains a substituent represented by formula (7), and R ２８ When R is an alkyl group having 1 to 10 carbon atoms, an acyl group having 2 to 6 carbon atoms, or an aryl group having 6 to 15 carbon atoms, it has an amic acid ester structure. ７ When the group has a substituent represented by formula (8), it has an amic acid amide structure.

[0120] The polybenzoxazole unit refers to a unit having two benzoxazole structures among the structural units of a resin containing an amine residue and a carboxylic acid residue. The polybenzoxazole unit is preferably a unit represented by formula (3). The polybenzoxazole precursor unit refers to a unit having two hydroxyamide structures among the structural units of a resin containing an amine residue and a carboxylic acid residue. The polybenzoxazole precursor unit is preferably a unit represented by formula (4).

[0121]

[0122] In formulas (3) and (4), W １０ and W １４ each independently represents a divalent to decavalent organic group. １１ and W １５ R each independently represents a tetravalent to decavalent organic group having an aromatic structure. １２ , R １３ , and R １６ R each independently represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above formula (7) or formula (8). １７ represents a phenolic hydroxyl group. １８ represents a sulfonic acid group, a mercapto group, or a substituent represented by the above formula (7) or formula (8). r represents an integer of 0 to 8. s represents an integer of 0 to 6. w represents an integer of 0 to 8. x represents an integer of 2 to 8, and y represents an integer of 0 to 6, with 2≦x+y≦8. However, R １２ or R １３ When represents a phenolic hydroxyl group, W bonding to the phenolic hydroxyl group １０ or W １１ contains an aromatic structure in its structure. １６ When represents a phenolic hydroxyl group, W bonding to the phenolic hydroxyl group １４ contains an aromatic structure in its structure. １７ W combines with １５ contains an aromatic structure in its structure. １０ and W １４ Each independently represents a carboxylic acid residue. １１ and W１５ each independently represents an amine residue. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0123] The polyamideimide unit refers to a unit having an imide structure and an amide structure among structural units of a resin containing an amine residue and a carboxylic acid residue. The polyamideimide unit is preferably a unit represented by formula (5). The polyamideimide precursor unit refers to a unit having an amide structure and an amic acid structure, an amide structure and an amic acid ester structure, or an amide structure and an amic acid amide structure among structural units of a resin containing an amine residue and a carboxylic acid residue. The polyamideimide precursor unit is preferably a unit having an amide structure and an amic acid structure, or an amide structure and an amic acid ester structure ... represented by formula (5).

[0124]

[0125] In equations (5) and (6), W １９ and W ２３ each independently represents a trivalent to decavalent organic group. ２０ and W ２４ R each independently represents a divalent to decavalent organic group. ２１ , R ２２ , and R ２７ R each independently represents a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above formula (7) or formula (8). ２５ represents a substituent represented by formula (7) or formula (8). ２６ represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. m represents an integer of 0 to 7. n represents an integer of 0 to 8. a represents an integer of 0 to 7. b represents an integer of 0 to 8. However, R ２１ or R ２２ When represents a phenolic hydroxyl group, W bonding to the phenolic hydroxyl group １９ or W ２０ contains an aromatic structure in its structure. ２６ or R ２７When represents a phenolic hydroxyl group, W bonding to the phenolic hydroxyl group ２３ or W ２４ contains an aromatic structure in its structure. １９ and W ２３ Each independently represents a carboxylic acid residue. ２０ and W ２４ each independently represents an amine residue. The above-mentioned substituents and structures may have a heteroatom, and may be either unsubstituted or substituted.

[0126] The polyimide unit, polyimide precursor unit, polybenzoxazole unit, polybenzoxazole precursor unit, polyamideimide unit, and polyamideimide precursor unit are all structural units that constitute a resin, and are repeating units having a repeating number of 2 or more. The repeating number of these units is preferably 2 or more, more preferably 5 or more, and even more preferably 10 or more. On the other hand, the repeating number is preferably 1,000 or less.

[0127] Resins in which the content of polyimide units in the total of polyimide units and polyimide precursor units is 50 mol% or more are classified as polyimides. On the other hand, resins in which the content of polyimide units is less than 50 mol% are classified as polyimide precursors. Similarly, resins in which the content of polybenzoxazole units in the total of polybenzoxazole units and polybenzoxazole precursor units is 50 mol% or more are classified as polybenzoxazoles. On the other hand, resins in which the content of polybenzoxazole units in the total of polyamideimide units and polyamideimide precursor units is less than 50 mol% are classified as polybenzoxazole precursors. Similarly, resins in which the content of polyamideimide units in the total of polyamideimide units and polyamideimide precursor units is 50 mol% or more are classified as polyamideimides. On the other hand, resins in which the content of polyamideimide units in the total of polyamideimide units is less than 50 mol% are classified as polyamideimide precursors. The content ratios of polyimide units and polyimide precursor units can be calculated from the imide ring closure rate of the resin. The content ratios of polybenzoxazole units and polybenzoxazole precursor units can be calculated from the benzoxazole ring closure rate of the resin. The content ratio of the polyamideimide unit and the polyamideimide precursor unit can be calculated from the imide ring closure rate of the resin.

[0128] Resins containing two or more units selected from the group consisting of (1) polyimide units or their precursor units, (2) polybenzoxazole units or their precursor units, and (3) polyamideimide units or their precursor units are classified as both resins based on the respective units. In other words, resins containing polyimide precursor units and polybenzoxazole precursor units are classified as both polyimide precursors and polybenzoxazole precursors. Furthermore, when a structural unit in a resin corresponds to both a polyimide precursor unit and a polybenzoxazole precursor unit, that structural unit is used when calculating the total content of polyimide precursor units in the resin and the total content of polybenzoxazole precursor units in the resin.

[0129] In the resin of the present invention, the content of polyimide units in the total of polyimide units and polyimide precursor units is preferably 1.0 mol% or more, more preferably 3.0 mol% or more, even more preferably 5.0 mol% or more, even more preferably 7.0 mol% or more, and particularly preferably 10 mol% or more, from the viewpoint of the effects of the present invention. On the other hand, the content of polyimide units is preferably 30 mol% or less, more preferably 25 mol% or less, and even more preferably 20 mol% or less, from the viewpoint of the effects of the present invention.

[0130] In the resin of the present invention, the content of the amic acid ester structure in the polyimide precursor unit relative to the total of the amic acid structure and the amic acid ester structure is preferably 40 mol% or more, more preferably 45 mol% or more, even more preferably 50 mol% or more, even more preferably 55 mol% or more, and particularly preferably 60 mol% or more, from the viewpoint of the effects of the present invention. On the other hand, the content of the amic acid ester structure is preferably 99 mol% or less, more preferably 95 mol% or less, even more preferably 90 mol% or less, even more preferably 80 mol% or less, and particularly preferably 70 mol% or less, from the viewpoint of the effects of the present invention.

[0131] In the resin of the present invention, when the content ratio of polyimide units is as described above, and / or when the content ratio of amic acid ester structures in the total of amic acid structures and amic acid ester structures is as described above, the resin of the present invention preferably has the above-mentioned (DA1) primary amine residue, and the above-mentioned (DA1) primary amine residue has an amine residue that satisfies the above-mentioned condition (S1x). Furthermore, the resin of the present invention preferably further has the above-mentioned (DA2) secondary amine residue and satisfies the above-mentioned condition (α1) and / or condition (α2), and more preferably the above-mentioned (DA1) primary amine residue has an amine residue that satisfies the above-mentioned condition (S1x) and / or the above-mentioned (DA2) secondary amine residue has an amine residue that satisfies at least one of the above-mentioned conditions (S1x) and (S2x).

[0132] From the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, the resin of the present invention preferably has a polyimide unit and / or a polyimide precursor unit, and also has one or more units selected from the group consisting of a polybenzoxazole unit, a polybenzoxazole precursor unit, a polyamideimide unit, and a polyamideimide precursor unit.

[0133] In the resin of the present invention, the total content of polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units relative to the total of polyimide units, polyimide precursor units, polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units is, from the viewpoint of the effects of the invention described above, preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 40 mol% or more, and particularly preferably 50 mol% or more. On the other hand, the total content of polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units is, from the viewpoint of the effects of the invention described above, preferably 90 mol% or less, more preferably 85 mol% or less, even more preferably 80 mol% or less, even more preferably 75 mol% or less, and particularly preferably 70 mol% or less.

[0134] In the resin of the present invention, when the total content ratio of the polybenzoxazole unit, polybenzoxazole precursor unit, polyamideimide unit, and polyamideimide precursor unit is as described above, the resin of the present invention preferably has the above-mentioned (DA1) primary amine residue, and the above-mentioned (DA1) primary amine residue has an amine residue that satisfies the above-mentioned condition (S1x). Furthermore, the resin of the present invention preferably further has the above-mentioned (DA2) secondary amine residue and satisfies the above-mentioned condition (α1) and / or condition (α2), and more preferably the above-mentioned (DA1) primary amine residue has an amine residue that satisfies the above-mentioned condition (S1x) and / or the above-mentioned (DA2) secondary amine residue has an amine residue that satisfies at least one of the above-mentioned conditions (S1x) and (S2x).

[0135] <Fluorine Element Content in Resin Structure> The resin of the present invention satisfies the following condition (P1a): The resin of the present invention preferably further satisfies the following condition (P2a): (P1a) The fluorine element content in the resin structure is 10,000 ppm by mass or less (P2a) The fluoride ion content in the resin structure is 10,000 ppm by mass or less.

[0136] The content of elemental fluorine in the resin structure is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more, from the viewpoint of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. On the other hand, from the viewpoint of the effects of the invention described above, the content of elemental fluorine is preferably 10,000 ppm by mass or less, more preferably 5,000 ppm by mass or less, even more preferably 1,000 ppm by mass or less, even more preferably 500 ppm by mass or less, particularly preferably 300 ppm by mass or less, and most preferably 100 ppm by mass or less. Furthermore, the fluorine content is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0137] The preferred range of the content of fluoride ions in the resin structure is the same as the preferred range of the content of fluorine element in the resin structure described above.

[0138] The content of fluorine element in the structure of the resin may be 0 ppm by mass, and the content of fluoride ions in the structure of the resin may also be 0 ppm by mass.

[0139] In addition, if the storage stability of the photosensitive composition is poor, for example, the generation of foreign matter after storage at room temperature may become an issue. If foreign matter is generated during storage of the photosensitive composition, when a pixel division layer or the like is formed using the photosensitive composition, the foreign matter will remain in the pixel division layer or pattern opening. Such foreign matter can, for example, cause a decrease in the reliability of the light-emitting element in the display device of the present invention or a decrease in the migration resistance of the electronic component of the present invention. By setting the content of fluorine element in the structure of the resin of the present invention within a specific range, the generation of foreign matter during storage of the photosensitive composition is suppressed, and the effect of improving storage stability is significantly achieved.

[0140] <Contents of chlorine, bromine, and sulfur elements in the resin structure> From the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, it is preferable that the resin of the present invention further satisfies at least one of the following conditions (P1b), (P1c), and (P1d): The resin of the present invention more preferably further satisfies at least one of the following conditions (P2b), (P2c), and (P2d): Sulfur-based anion: one or more ions selected from the group consisting of sulfide ions, hydrogen sulfide ions, sulfate ions, and hydrogen sulfate ions. (P1b) The content of chlorine elements in the resin structure is 30,000 ppm by mass or less. (P1c) The content of bromine elements in the resin structure is 30,000 ppm by mass or less. (P1d) The content of sulfur elements in the resin structure is 30,000 ppm by mass or less. (P2b) The content of chloride ions in the resin structure is 30,000 ppm by mass or less. (P2c) The content of bromide ions in the resin structure is 30,000 ppm by mass or less. (P2d) The content of the above sulfur-based anions in the resin structure is 30,000 ppm by mass or less.

[0141] From the viewpoint of the effects of the present invention, the content of chlorine element in the resin structure is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, even more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention, the content of chlorine element is preferably 30,000 mass ppm or less, more preferably 10,000 mass ppm or less, and even more preferably 5,000 mass ppm or less. Furthermore, the content of chlorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the content of chlorine element is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0142] The preferred ranges of the bromine element content, sulfur element content, chloride ion content, bromide ion content, and sulfur-based anion content in the resin structure are the same as the preferred ranges of the chlorine element content described above.

[0143] The content of one or more selected from the group consisting of chlorine, bromine, and sulfur elements in the resin structure may be 0 ppm by mass, and the content of one or more selected from the group consisting of chloride ions, bromide ions, and sulfur-based anions in the resin structure may also be 0 ppm by mass.

[0144] When the resin of the present invention satisfies at least one of the above conditions (P1b), (P1c), and (P1d), it is preferred that the resin of the present invention has the above primary amine residue (DA1), and that the above primary amine residue (DA1) has an amine residue that satisfies the above condition (S1x). Furthermore, it is preferred that the resin of the present invention further has the above secondary amine residue (DA2) and satisfies the above condition (α1) and / or condition (α2), and it is more preferred that the above primary amine residue (DA1) has an amine residue that satisfies the above condition (S1x), and / or that the above secondary amine residue (DA2) has an amine residue that satisfies at least one of the above conditions (S1x) and (S2x).

[0145] <Photosensitive composition> The photosensitive composition of the first aspect of the present invention is a photosensitive composition containing (A) a binder resin and (C) a photosensitizer, and further containing (B) a radical polymerizable compound and / or (F) a crosslinking agent, and the (A) binder resin contains the resin of the present invention.

[0146] A photosensitive composition according to a second aspect of the present invention is a photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, and further comprising (B) a radically polymerizable compound and / or (F) a crosslinking agent, wherein the (A) binder resin comprises (Ax) resin: one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof, the (Ax) resin has (DA1) a primary amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) primary amine residue having at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, and (IIa) structure: a structure connecting at least two (Ia) structures, The (IIa) structure is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and satisfies the following condition (1a): (1a) the content of elemental fluorine in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

[0147] By adopting the above-described configuration, the photosensitive compositions of the first and second aspects of the present invention can suppress residue after development, have excellent light-emitting properties that allow low-voltage operation to obtain a desired current density, and can produce cured products suitable for use in display devices with excellent light-emitting device reliability. In addition, cured products suitable for use in electronic components with excellent migration resistance can be produced. This is because by controlling the content of compounds containing fluorine atoms in the structure or components containing fluorine atoms in the photosensitive composition to a specific value or less, the content of fluorine atoms, fluoride ions, or anions containing fluorine atoms derived from these components in these components is controlled to a specific value or less. It is believed that this causes local activation of protons in the photosensitive composition due to interactions such as hydrogen bonding between the components in the photosensitive composition. Therefore, it is believed that the effect of promoting dissolution in the developer is effective in suppressing residue after development. Furthermore, it is believed that the surface modification of the substrate by these components prevents residue adhesion at the openings, thereby suppressing residue after development, and significantly improving the light-emitting properties, lowering the voltage required for operation, and improving the luminance. Furthermore, by incorporating a polyimide or the like having an amine residue of a specific structure having a phenolic hydroxyl group, hydrogen bonding between the phenolic hydroxyl group and a fluorine atom is formed, which is thought to improve the stability of the above-mentioned fluorine-containing component and fluorine-containing anion in the photosensitive composition, and contribute to the successful effect of suppressing residues after development.

[0148] Furthermore, intentionally setting the content of the above components to a specific value or less is thought to adjust the detection intensity of these ions on the surface of the cured product, thereby controlling the polarization structure and charge balance in the cured product. As a result, it is thought that by suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect light-emitting properties or electrical insulation, high reliability or excellent migration resistance of light-emitting elements is achieved. Furthermore, suppression of migration and aggregation of metals in electrodes or metal wiring is thought to contribute to high reliability in display devices, electronic components, and semiconductor devices.

[0149] <(A) Binder Resin> The photosensitive composition of the present invention contains (A) a binder resin. The photosensitive composition of the first aspect of the present invention comprises the resin of the present invention. That is, in the photosensitive composition of the first aspect of the present invention, the binder resin (A) contains the resin of the present invention. The photosensitive composition of the second aspect of the present invention preferably comprises the resin of the present invention. That is, in the photosensitive composition of the second aspect of the present invention, the binder resin (A) preferably contains the resin of the present invention.

[0150] In the photosensitive composition of the present invention, the binder resin (A) contains the resin of the present invention. In this case, the binder resin (A) preferably contains one or more resins selected from the group consisting of the polyimide resins described above, and has the primary amine residue (DA1) described above, and the primary amine residue (DA1) preferably has at least two of the structures (Ia) described above and further has the structure (IIa) described above. In such a configuration, the binder resin (A) preferably has the primary amine residue (DA1) having an amine residue that satisfies the condition (S1x) described above.

[0151] In the photosensitive composition of the present invention, when the binder resin (A) contains one or more resins selected from the group consisting of the polyimide resins and has the primary amine residue (DA1), it is preferable that the binder resin (A) further has the secondary amine residue (DA2) and satisfies the condition (α1) and / or the condition (α2). In such a configuration, it is preferable that the primary amine residue (DA1) of the binder resin (A) has an amine residue that satisfies the condition (S1x), and / or the secondary amine residue (DA2) has an amine residue that satisfies at least one of the conditions (S1x) and (S2x).

[0152] The (A) binder resin preferably has heat resistance such that at least a portion of it remains in the cured product obtained by curing the composition. The (A) binder resin is preferably a resin that cures by forming a crosslinked structure through a reaction. The reaction is not particularly limited, and may be caused by heating, irradiation with energy rays, or the like, and the crosslinked structure may also be formed by a (F) crosslinking agent described below. The (A) binder resin is preferably a thermosetting resin.

[0153] The (A) binder resin is preferably a resin that can form a positive or negative pattern by imparting positive or negative photosensitivity to the composition with the (C) photosensitizer described below. The (A) binder resin is more preferably an alkali-soluble resin having an acidic group in the structural unit of the resin or an organic solvent-soluble resin having an organic solvent-soluble structure. From the viewpoint of pattern processability in an alkaline developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group. Furthermore, from the viewpoint of improving sensitivity during exposure and suppressing residue after development, a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group is more preferred.

[0154] From the viewpoint of improving sensitivity during exposure, the (A) binder resin preferably has a radical polymerizable group, and more preferably has a radical polymerizable group in the structural unit of the resin. As the radical polymerizable group, a group having an ethylenically unsaturated double bond group is preferred, and a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms is more preferred. As the photoreactive group, a styryl group, a cinnamoyl group, a maleimide group, a nadimide group, or a (meth)acryloyl group is preferred, and from the viewpoint of improving sensitivity during exposure, a (meth)acryloyl group is more preferred. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, a 2-methyl-2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group, and from the viewpoint of improving sensitivity during exposure, a vinyl group or an allyl group is more preferable.

[0155] <(A1) Resin and (A2) Resin> The (A) binder resin preferably contains an (A1) weakly acidic group-containing resin and / or an (A2) resin not containing a weakly acidic group. From the viewpoint of improving sensitivity during exposure, the (A) binder resin preferably contains an (A1) weakly acidic group-containing resin. The (A1) weakly acidic group-containing resin preferably contains a (WA) weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, and a mercapto group, and more preferably contains a (WA) weakly acidic group in the structural unit of the resin. From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the (WA) weakly acidic group is preferably a phenolic hydroxyl group or a silanol group, and more preferably a phenolic hydroxyl group. From the viewpoint of improving sensitivity during exposure, the (A) binder resin preferably contains a (A1) weakly acidic group-containing resin containing a radical polymerizable group. Examples and preferred descriptions regarding the radical polymerizable group are as described above in (A) Binder resin.

[0156] The above-mentioned (A1) weakly acidic group-containing resin exhibits improved solubility in exposed areas due to the moderate acidity of the (WA) weakly acidic group and its interaction with the (C) photosensitizer (described below), resulting in a significant effect of improving sensitivity during exposure. The phenolic hydroxyl group in the (WA) weakly acidic group promotes alkaline dissolution, resulting in a significant effect of suppressing residue after development. Furthermore, when the composition has positive photosensitivity, the phenolic hydroxyl group in the (WA) weakly acidic group can enhance the dissolution contrast between exposed and unexposed areas due to its strong interaction with the (C) photosensitizer, and also enhances the dissolution promotion effect in exposed areas, resulting in a significant effect of improving sensitivity during exposure and suppressing residue after development.

[0157] From the viewpoint of suppressing residue after development, the binder resin (A) also preferably contains a resin (A2) that does not have a weakly acidic group. The resin (A2) that does not have a weakly acidic group preferably has an acidic group different from the weakly acidic group (WA), and more preferably has an acidic group different from the weakly acidic group (WA) in its structural unit. From the viewpoint of improving sensitivity during exposure and suppressing residue after development, the acidic group different from the weakly acidic group (WA) is preferably a group selected from a carboxy group, a carboxylic acid anhydride group, and a sulfonic acid group.

[0158] The (A) binder resin preferably contains (A1) a weakly acidic group-containing resin and / or (A2) a resin not having a weakly acidic group, the (A1) weakly acidic group-containing resin preferably containing (A1x) a resin having one or more structures selected from the group consisting of imide structures, amide structures, oxazole structures, and siloxane structures (hereinafter referred to as "imide structures, etc.") in the structural unit of the resin, and / or (A1y) a resin having a phenolic hydroxyl group in the structural unit of the resin, and the (A2) resin not having a weakly acidic group preferably containing (A2x) a resin having a radically polymerizable group and / or (A2y) a resin not having a radically polymerizable group. From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the (A) binder resin preferably contains (A1) a weakly acidic group-containing resin and (A2) a resin not having a weakly acidic group.

[0159] The structural unit having an imide structure or the like and the structural unit having a phenolic hydroxyl group are both structural units that constitute the resin, and are repeating units having a repeating number of 2 or more. The repeating number of these units is preferably 2 or more, more preferably 5 or more, and even more preferably 10 or more. On the other hand, the repeating number is preferably 1,000 or less. The repeating number of these units is preferably 2 or more, more preferably 5 or more, and even more preferably 10 or more. On the other hand, the repeating number is preferably 1,000 or less. The structural unit having an imide structure is preferably the above-mentioned polyimide unit or polyamideimide unit. The structural unit having an amide structure is preferably the above-mentioned polyimide precursor unit, polybenzoxazole precursor unit, polyamideimide unit, or polyamideimide precursor unit. The structural unit having an oxazole structure is preferably the above-mentioned polybenzoxazole unit.

[0160] In addition, when the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin each have a structure or group that constitutes a different resin, they are classified into one of the classification methods shown in Table 1-1 below. When a certain resin can be classified into two or more of the (A1x) resin, (A1y) resin, (A2x) resin, and (A2y) resin, the resin to which it belongs is determined by the classification method.

[0161]

[0162] The (A) binder resin preferably contains an (A1x) resin and / or an (A1y) resin, more preferably contains an (A1x) resin, and even more preferably contains an (A1x) resin and an (A1y) resin. The (A) binder resin preferably contains an (A1x) resin and / or an (A1y) resin and further contains an (A2x) resin, and more preferably contains an (A1x) resin, an (A1y) resin, and an (A2x) resin. The (A) binder resin also preferably contains an (A1x) resin, an (A1y) resin, or an (A2x) resin and further contains an (A2y) resin. From the viewpoint of improving the properties of each resin, the (A) binder resin also preferably contains two or more resins selected from the group consisting of an (A1x) resin, an (A1y) resin, an (A2x) resin, and an (A2y) resin.

[0163] From the viewpoint of improving sensitivity during exposure, the (A1) weakly acidic group-containing resin preferably has a structure in which the (WA) weakly acidic group is protected by a tert-butyl group, a tert-butoxycarbonyl group, or an oxyalkyl group. From the viewpoint of improving sensitivity during exposure, the (A2) weakly acidic group-free resin preferably has a structure in which an acidic group other than the (WA) weakly acidic group is protected by a tert-butyl group, a tert-butoxycarbonyl group, or an oxyalkyl group. The oxyalkyl group is preferably an alkoxyalkyl group, and more preferably a 1-alkoxy-1-ethyl group. The structure protected by an oxyalkyl group is preferably a structure derived from a vinyl ether compound. When the resin has such a structure, it is preferable that the (C) photosensitizer described below contains a (C3) photoacid generator or a (C4) photobase generator.

[0164] <(A1x) Resin> When the (A) binder resin contains the (A1) weakly acidic group-containing resin, the (A1) weakly acidic group-containing resin preferably contains the (A1x) resin, from the viewpoints of improving sensitivity during exposure, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. The (A1x) resin preferably contains one or more resins selected from the group consisting of (A1x-1) resin: polyimide, (A1x-2) resin: polyimide precursor, (A1x-3) resin: polybenzoxazole, (A1x-4) resin: polybenzoxazole precursor, (A1x-5) resin: polyamideimide, (A1x-6) resin: polyamideimide precursor, (A1x-7) resin: polyamide, (A1x-8) resin: polysiloxane, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, and more preferably contains one or more resins selected from the group consisting of (A1x-1) resin, (A1x-2) resin, (A1x-3) resin, (A1x-4) resin, (A1x-5) resin, (A1x-6) resin, and copolymers thereof (hereinafter referred to as "polyimide resin having a weakly acidic group"). It is more preferable that the (A1x) resin contains two or more resins selected from the group consisting of polyimide-based resins having weak acidic groups, and it is particularly preferable that it contains resin (A1x-2) and resin (A1x-4). The polyimide-based resin having weak acidic groups may further be a copolymer with resin (A1x-7). It is preferable that the polyimide-based resin having weak acidic groups contains the resin of the present invention. From the viewpoint of improving the reliability and migration resistance of the light-emitting device, it is more preferable that the (A1x) resin contains resin (A1x-1) and / or resin (A1x-3). From the viewpoint of improving sensitivity during exposure and achieving low-voltage driving of light-emitting characteristics, it is more preferable that the (A1x) resin contains resin (A1x-2) and / or resin (A1x-4). The (A1x) resin may be a single resin or a copolymer thereof.

[0165] From the viewpoint of improving sensitivity during exposure, the resin (A1x) preferably has a radical polymerizable group. Examples and preferred descriptions of the radical polymerizable group are as described above for the binder resin (A). The radical polymerizable group is preferably obtained by reacting a portion of the phenolic hydroxyl groups and / or carboxyl groups of the resin with a compound having a radical polymerizable group.

[0166] From the viewpoints of improving sensitivity during exposure, suppressing residue after development, enabling low-voltage driving of light-emitting characteristics, improving reliability of the light-emitting device, and improving migration resistance, it is preferable that the (A1x) resin contains an (A1x) resin that does not have a radical polymerizable group and an (A1x) resin that has a radical polymerizable group. By adopting the above-mentioned configuration, the effects of improving multiple properties are remarkable due to the functional separation of the suppression of residue after development and the ability to capture metal impurities, ionic impurities, etc., due to the acidic group or organic solvent-soluble structure, and the improvement of sensitivity during exposure and the improvement of the degree of crosslinking of the film due to the radical polymerizable group.

[0167] The acid equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of improving sensitivity during exposure. On the other hand, the acid equivalent of the (A1x) resin is preferably 600 g / mol or less from the viewpoint of suppressing residue after development. The exposure here refers to irradiation with active actinic rays (radiation), and examples include irradiation with visible light, ultraviolet light, electron beams, and X-rays. Hereinafter, exposure refers to irradiation with active actinic rays (radiation). The double bond equivalent of the (A1x) resin is preferably 200 g / mol or more from the viewpoint of suppressing residue after development. On the other hand, the double bond equivalent of the (A1x) resin is preferably 3,000 g / mol or less from the viewpoint of improving sensitivity during exposure.

[0168] On the other hand, from the viewpoints of improving sensitivity during exposure and suppressing residues after development, the (A2x) resin and the (A2y) resin preferably contain one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof (hereinafter referred to as "polyimide resins without weak acidic groups"). The polyimide resin without weak acidic groups may also be a copolymer with polyamide. It is preferred that the polyimide resin without weak acidic groups contains the resin of the present invention.

[0169] Hereinafter, polyimide resins having weakly acidic groups and polyimide resins not having weakly acidic groups will be collectively described. These resins may also be collectively referred to as polyimide resins. It is preferable that the polyimide resin contains the resin of the present invention. The polyimide precursor preferably has an amic acid structure and an amic acid ester structure from the viewpoints of improving sensitivity during exposure and achieving low-voltage driving of light-emitting characteristics.

[0170] From the viewpoint of improving storage stability, the polyimide resin preferably has a structure in which the terminal of the resin is sealed with a monoamine, a dicarboxylic acid anhydride, or a monocarboxylic acid derivative. From the viewpoint of improving sensitivity during exposure, lowering the voltage required for light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, the polyimide resin preferably has a radical polymerizable group or a crosslinkable group capable of reacting with resins, etc., at the terminal of the resin, and more preferably has a maleimide group or a nadic acid anhydride. Examples of acid monomers having these groups include maleic anhydride and nadic anhydride.

[0171] A maleimide resin is a resin having at least two maleimide groups. A maleimide-styrene resin is a resin having a maleimide group and a unit derived from a styrene derivative. A maleimide-triazine resin is a resin having a maleimide group and a unit containing a triazine structure. A maleimide-oxazine resin is a resin having a maleimide group and a unit containing an oxazine structure. These resins are different from polyimide-based resins.

[0172] In the photosensitive composition according to the second aspect of the present invention, the binder resin (A) contains one or more resins selected from the group consisting of (Ax) resins: polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof (hereinafter referred to as "polyimide resins"). In the photosensitive composition according to the second aspect of the present invention, the binder resin (A) is preferably the (Ax) resin.

[0173] In a photosensitive composition according to a second aspect of the present invention, the binder resin (A) has a primary amine residue (DA1): an amine residue having a phenolic hydroxyl group, and the primary amine residue (DA1) has at least two of the above-described structure (Ia): a cyclic structure having a phenolic hydroxyl group, and further has the above-described structure (IIa): a structure linking at least two of the (Ia) structures.In a photosensitive composition according to the second aspect of the present invention, the resin (Ax) has a primary amine residue (DA1), and the primary amine residue (DA1) has at least two of the above-described structure (Ia), and further has the above-described structure (IIa).

[0174] In the photosensitive composition of the second aspect of the present invention, the structure (IIa) in the primary amine residue (DA1) is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0175] In the photosensitive composition according to the second aspect of the present invention, it is preferred that the binder resin (A) further contains (DA2) a secondary amine residue: an amine residue having no phenolic hydroxyl group, and that the photosensitive composition satisfies the above-mentioned condition (α1) and / or condition (α2).

[0176] <(A1y) Resin> The (A1) weakly acidic group-containing resin preferably contains an (A1y) resin from the viewpoints of improving sensitivity during exposure, suppressing residue after development, improving reliability of the light-emitting device, and improving migration resistance. From the viewpoint of the effects of the invention described above, the (A1y) resin preferably contains one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. That is, the photosensitive composition of the present invention preferably further contains one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. The (A1y) resin may be either a single resin or a copolymer thereof.

[0177] The phenolic resin is preferably a novolac resin, a resol resin, or a phenol aralkyl resin. The phenolic resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure. The polyhydroxystyrene preferably has units derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or units derived from a styrene derivative. Examples of phenolic group-containing epoxy resins include resins obtained by reacting a polyfunctional epoxy compound with a phenolic compound having an epoxy-reactive group. Phenol group-containing cardo resins or phenolic group-containing epoxy-modified resins are preferred. Phenol group-containing epoxy-modified resins are preferably phenolic group-containing epoxy ester resins. Phenol group-containing cardo resins preferably have a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. Phenol group-containing epoxy-modified resins preferably have a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure. Examples of phenol group-containing acrylic resins include resins obtained by reacting an acrylic resin described below with a phenolic compound having an addition reactive group. Other examples include resins obtained by radical copolymerization of a copolymerization component having a phenolic hydroxyl group with another copolymerization component such as a (meth)acrylic acid derivative. The phenol group-containing acrylic resin is a different resin from polyhydroxystyrene. The phenol group-containing acrylic resin preferably has units derived from a (meth)acrylic acid ester derivative or a styrene derivative that contain a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure.

[0178] The condensed polycyclic structure, condensed polycyclic heterocyclic structure, aromatic structure, or heterocyclic structure in these resins includes a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0] structure, ２，６ ] A decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure is preferred.

[0179] <(A2x) Resin and (A2y) Resin> From the viewpoints of improving sensitivity during exposure and suppressing residue after development, the resin (A2) that does not have a weak acidic group preferably contains an (A2x) resin, and more preferably further contains an (A2y) resin. From the viewpoints of improving sensitivity during exposure and suppressing residue after development, the (A2x) resin preferably contains one or more resins selected from the group consisting of polycyclic side chain-containing resins, acid-modified epoxy resins, and acrylic resins. The (A2x) resin may be either a single resin or a copolymer thereof. As the polycyclic side chain-containing resin, a cardo resin having a fused polycyclic structure or a fused polycyclic heterocyclic structure is preferred. As the acid-modified epoxy resin, an epoxy (meth)acrylate resin having a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure is preferred. The acrylic resin preferably has a unit derived from a (meth)acrylic acid ester derivative having a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, a unit derived from a styrene derivative, or a unit derived from a (meth)acrylic acid ester derivative having an epoxy group.

[0180] The total content of the (A1x) resins relative to 100% by mass of the total binder resins (A) is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, and particularly preferably 70% by mass or more, from the viewpoint of the effects of the (A1x) resins described above. On the other hand, the total content of the (A1x) resins is preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less, from the viewpoint of suppressing residues after development. Furthermore, the total content of the (A1y) resins is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoint of the effects of the (A1x) resins described above. On the other hand, the total content of the (A1y) resins is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, from the viewpoint of improving the light-emitting properties and driving at a low voltage. From the viewpoint of the effects of the (A2x) resin and the (A2y) resin, the total content of the (A2x) resin and the (A2x) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoints of achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, the total content of the (A2x) resin and the (A2y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less.

[0181] The content ratio of the (A) binder resin in the total solid content of the photosensitive composition of the present invention is preferably 10% by mass or more from the viewpoint of improving the properties of each resin. On the other hand, the content ratio of the (A) binder resin is preferably 75% by mass or less from the viewpoint of improving the properties of each resin. The total solid content of the composition refers to the sum of the masses of all components in the composition excluding the solvent. The solid content concentration can be calculated by heating 1 g of the composition at 150°C for 30 minutes to evaporate to dryness, measuring the mass remaining after heating, and calculating the solid content concentration from the masses before and after heating.

[0182] <(B) Radically Polymerizable Compound> The photosensitive composition of the present invention further contains a (B) radically polymerizable compound (hereinafter referred to as "(B) compound") and / or a (F) crosslinking agent. The (B) radically polymerizable compound refers to a compound having a radically polymerizable group. Examples and preferred descriptions regarding the radically polymerizable group are as described above for the (A) binder resin. As the radically polymerizable group, a (meth)acryloyl group is preferred from the viewpoint of improving sensitivity during exposure. The number of radically polymerizable groups possessed by the (B) compound is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more, from the viewpoint of improving sensitivity during exposure. Meanwhile, the number of radically polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less, from the viewpoint of suppressing residues after development.

[0183] The crosslinking agent (F) will be described later.

[0184] When the photosensitive composition of the present invention contains an (A) binder resin and a (B) compound, the content of the (A) binder resin, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass, is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and even more preferably 45 parts by mass or more, from the viewpoint of improving the reliability and mechanical properties of the light-emitting device. On the other hand, the content of the (A) binder resin, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass, is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and even more preferably 75 parts by mass or less, from the viewpoint of improving the sensitivity during exposure and suppressing residue after development. Furthermore, the content of the (B) compound, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass, is preferably 15 parts by mass or more, from the viewpoint of improving the above-mentioned properties. On the other hand, the content of the (B) compound, when the total of the (A) binder resin and the (B) compound is taken as 100 parts by mass, is preferably 75 parts by mass or less, from the viewpoint of improving the above-mentioned properties.

[0185] <(C) Photosensitizer> The photosensitive composition of the present invention contains a (C) photosensitizer. The (C) photosensitizer refers to a compound that undergoes bond cleavage, reaction, or structural change upon exposure to generate another compound, thereby imparting positive or negative photosensitivity to the composition. The (C) photosensitizer preferably includes one or more compounds selected from the group consisting of a (C1) naphthoquinone diazide compound (hereinafter referred to as "(C1) compound"), a (C2) photopolymerization initiator (hereinafter referred to as "(C2) compound"), a (C3) photoacid generator (hereinafter referred to as "(C3) compound"), and a (C4) photobase generator (hereinafter referred to as "(C4) compound").

[0186] The content of the (C) photosensitizer is preferably 1.0 part by mass or more, based on 100 parts by mass of the total of the (A) binder resin and the (B) compound, from the viewpoint of improving sensitivity during exposure, while the content of the (C) photosensitizer is preferably 30 parts by mass or less from the viewpoint of suppressing residues after development.

[0187] <(C1) Naphthoquinonediazide Compound> The (C1) compound refers to a compound that undergoes a structural change upon exposure to generate an indenecarboxylic acid and / or a sulfoindenecarboxylic acid. The inclusion of the (C1) compound is suitable for forming a positive-tone pattern. During exposure, the acidic compound resulting from the structural change of the (C1) compound selectively solubilizes the exposed portion of the film of the composition in an alkaline developer, resulting in a significant improvement in resolution after development.

[0188] The (C1) compound preferably contains a compound having a 1,2-naphthoquinone diazide-5-sulfonic acid ester structure (hereinafter referred to as "5-ester structure") and / or a compound having a 1,2-naphthoquinone diazide-4-sulfonic acid ester structure (hereinafter referred to as "4-ester structure"). From the viewpoint of improving resolution after development, the (C1) compound preferably contains a compound having a 5-ester structure. From the viewpoint of improving sensitivity during exposure, suppressing residue after development, and improving resolution after development, the (C1) compound more preferably contains a compound having a 5-ester structure and a compound containing a 4-ester structure. That is, the (C) photosensitizer preferably contains a compound having a 1,2-naphthoquinone diazide-5-sulfonic acid ester structure and a compound containing a 1,2-naphthoquinone diazide-4-sulfonic acid ester structure. The compound (C1) preferably has a 5-ester structure of a phenolic hydroxyl group (hereinafter referred to as a "5-ester group") or a 4-ester structure of a phenolic hydroxyl group (hereinafter referred to as a "4-ester group").

[0189] The total content ratio of 5-ester groups and 4-ester groups in the compound (C1) relative to the total number of moles of phenolic hydroxyl groups, 5-ester groups, and 4-ester groups (hereinafter referred to as "esterification rate") is preferably 50 mol% or more, more preferably 55 mol% or more, and even more preferably 60 mol% or more, from the viewpoint of improving resolution after development. On the other hand, from the viewpoint of improving sensitivity during exposure, the esterification rate is preferably 100 mol% or less, more preferably 90 mol% or less, even more preferably 80 mol% or less, and particularly preferably 70 mol% or less. It is also preferable to mix two or more types of (C1) compounds with different esterification rates to achieve the above-mentioned esterification rate.

[0190] The total content of the compound having one 5-ester group or one 4-ester group in the molecule and the compound having two 5-ester groups or two 4-ester groups in the molecule (hereinafter referred to as the "low ester substitution ratio") in 100 mol % of the compound (C1) is preferably 60 mol % or more, more preferably 70 mol % or more, and even more preferably 80 mol % or more, from the viewpoint of improving sensitivity during exposure. On the other hand, the low ester substitution ratio is preferably 100 mol % or less, more preferably 95 mol % or less, and even more preferably 90 mol % or less, from the viewpoint of improving resolution after development.

[0191] The proportion of low ester substitution products in the total 100 mol% of the compound (C1) is preferably 0 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more, from the viewpoint of improving sensitivity during exposure. On the other hand, the proportion of low ester substitution products is preferably less than 60 mol%, more preferably 50 mol% or less, and even more preferably 40 mol% or less, from the viewpoint of suppressing residues after development.

[0192] Examples of methods for producing compound (C1) include a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid, a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid chloride, etc. The naphthoquinone diazide sulfonic acid chloride is preferably 1,2-naphthoquinone diazide-5-sulfonic acid chloride or 1,2-naphthoquinone diazide-4-sulfonic acid chloride.

[0193] <(C2) Photopolymerization Initiator> The (C2) compound refers to a compound that generates radicals by bond cleavage and / or reaction upon exposure. The inclusion of the (C2) compound is suitable for forming a negative pattern. Even if only a small amount of radicals are generated from the (C2) compound upon exposure, radical polymerization of the above-mentioned (B) compound and the like proceeds in a chain reaction, resulting in a significant effect of improving sensitivity upon exposure.

[0194] The (C2) compound is preferably a benzyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, a biimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a titanocene compound, a benzophenone compound, an acetophenone compound, an aromatic ketoester compound, or a benzoate ester compound, and from the viewpoint of improving sensitivity during exposure, an oxime ester compound is more preferred. From the viewpoints of improving sensitivity during exposure, improving the reliability of the light-emitting device, and improving migration resistance, the oxime ester compound preferably contains a compound having an oxime ester structure (hereinafter referred to as "α-oxime structure") and / or a compound having an oxime ester carbonyl structure (hereinafter referred to as "β-oxime structure").

[0195] <(C3) Photoacid Generator> The (C3) compound refers to a compound that generates an acid by bond cleavage and / or reaction upon exposure. The inclusion of the (C3) compound is suitable for negative pattern formation from the viewpoint of promoting cationic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by an acid-dissociable group, the acidic group is liberated by exposure, making it suitable for positive pattern formation, and the effect of improving sensitivity upon exposure is significant. The (C3) compound is a different compound from the (C1) compound.

[0196] Examples of the (C3) compound include ionic compounds and nonionic compounds. As the ionic compound, a triorganosulfonium salt compound is preferred. As the nonionic compound, a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonate compound, a carboxylate compound, a sulfonimide compound, a phosphate compound, or a sulfonebenzotriazole compound is preferred.

[0197] <(C4) Photobase Generator> The (C4) compound refers to a compound that generates a base by bond cleavage and / or reaction upon exposure. The inclusion of the (C4) compound is suitable for negative pattern formation from the viewpoint of promoting anionic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by a base-dissociable group, it is suitable for positive pattern formation from the viewpoint of liberating the acidic group upon exposure, and the effect of improving sensitivity during exposure is remarkable.

[0198] Examples of the (C4) compound include ionic compounds and nonionic compounds. Preferred ionic compounds are diazabicycloalkene salt compounds, triazabicycloalkene salt compounds, α-keto quaternary ammonium salt compounds, benzyl quaternary ammonium salt compounds, guanidine salt compounds, and biguanide salt compounds. Preferred ionic compounds have a ketoprofen structure, an oxoxanthene structure, a benzofuran structure, or a naphthalene structure. Preferred nonionic compounds are nitrobenzyl carbamate compounds, anthracenyl carbamate compounds, benzoin-based carbamate compounds, anthraquinone-based carbamate compounds, hydroxycinnamamide-based compounds, and coumarinamide-based compounds.

[0199] <(D) Colorant, Thermal Colorant, and Oxidative Colorant> From the viewpoint of suppressing external light reflection, it is preferable that the photosensitive composition of the present invention further contains a (D) colorant. The (D) colorant refers to a compound that imparts color by absorbing light of visible light wavelengths (380 to 780 nm). The (D) colorant is preferably a pigment or a dye. The (D) colorant preferably contains a black agent or a mixture of two or more colorants. The black agent preferably contains an organic black pigment and / or an inorganic black pigment. The black color of the (D) colorant is as described in paragraphs

[0284] and

[0285] of WO 2019 / 087985.

[0200] The content ratio of the colorant (D) relative to the total solid content of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more, from the viewpoints of suppressing external light reflection and improving the reliability of the light-emitting device, while the content ratio of the colorant (D) is preferably 70% by mass or less, more preferably 50% by mass or less, from the viewpoints of improving sensitivity during exposure and suppressing residues after development.

[0201] From the viewpoints of suppressing residue after development, achieving low-voltage operation of light-emitting characteristics, improving the reliability of light-emitting devices, and improving migration resistance, the organic black pigment preferably contains one or more types selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azo-based black pigments. The benzofuranone-based black pigment preferably contains a compound having at least two benzofuran-2(3H)-one structures that may share a benzene ring or at least two benzofuran-3(2H)-one structures that may share a benzene ring, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof. The perylene-based black pigment preferably contains a compound having a 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole structure, a geometric isomer thereof, a salt thereof, or a salt of a geometric isomer thereof. The azo-based black pigment preferably contains a compound having an azomethine structure and a carbazole structure, or a salt thereof. The above organic black pigments have high transmittance in the ultraviolet region (e.g., 400 nm or less), thereby significantly improving sensitivity during exposure.

[0202] From the viewpoints of suppressing residues after development, achieving low-voltage operation of light-emitting characteristics, improving the reliability of light-emitting devices, and improving migration resistance, the inorganic black pigment contains one or more elements selected from the group consisting of nitrides containing metal elements, carbides containing metal elements, and oxynitrides containing metal elements (hereinafter referred to as "specific inorganic black pigments"). Preferably, the metal element is one or more elements selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum, and more preferably, one or more elements selected from the group consisting of zirconium nitride, zirconium carbide, and zirconium oxynitride. Because the inorganic black pigments have high transmittance in the ultraviolet wavelength range, they exhibit a significant effect of improving sensitivity during exposure. The specific inorganic black pigment preferably contains zirconium, vanadium, niobium, hafnium, or tantalum as its main component element. The "main component element" in a specific inorganic black pigment refers to the element that is most abundant by mass among the constituent elements.

[0203] The mixture of two or more colors of colorants preferably contains a mixture of two or more color pigments and / or a mixture of two or more color dyes. From the viewpoint of suppressing residues after development, it is more preferable that the two or more colors include blue and / or purple, and also red and orange. The color pigment preferably contains an anthraquinone-based pigment, a diketopyrrolopyrrole-based pigment, a perylene-based pigment, an isoindoline-based pigment, an isoindolinone-based pigment, an imidazolone-based pigment, a quinacridone-based pigment, a pyranthrone-based pigment, a phthalocyanine-based pigment, an indanthrone-based pigment, or a dioxazine-based pigment. The color dye preferably contains a squarylium-based dye, a xanthene-based dye, a triarylmethane-based dye, or a phthalocyanine-based dye.

[0204] In the photosensitive composition of the present invention, the pigment preferably has a coating layer from the viewpoints of suppressing residue after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. The coating layer refers to a layer that coats the pigment surface, and examples thereof include a layer formed by surface treatment with a silane coupling agent or coating treatment with a resin. The coating layer preferably has one or more types selected from the group consisting of a silica coating layer, a metal oxide coating layer, and a metal hydroxide coating layer.

[0205] From the viewpoint of suppressing external light reflection, the photosensitive composition of the present invention preferably further contains a thermal colorant and / or an oxidative colorant. A thermal colorant refers to a compound that colorizes by absorbing light in the wavelength range of visible light (380 to 780 nm) after heating in an inert atmosphere. An oxidative colorant refers to a compound that colorizes by absorbing any light within the wavelength range of visible light (380 to 780 nm) after heating in an oxygen-containing gas atmosphere. The thermal colorant and oxidative colorant are preferably compounds having a structure that undergoes structural change or decomposition after heating. The thermal colorant and oxidative colorant preferably contain a compound having an aromatic structure to which at least two phenolic hydroxyl groups are bonded, more preferably a compound having an aromatic structure to which at least three phenolic hydroxyl groups are bonded. From the viewpoints of suppressing residue after development, improving the reliability of light-emitting devices, and improving migration resistance, they further preferably contain 1,2,4-trihydroxybenzene or pyrogallol.

[0206] From the viewpoints of suppressing residue after development, improving the reliability of the light-emitting device, and improving migration resistance, the thermal colorant and the oxidative colorant preferably contain a compound having an aromatic structure to which at least two phenolic hydroxyl groups are bonded, and further contain a compound having a structure represented by formula (11). The compound having a structure represented by formula (11) has at least one crosslinkable group on a nitrogen atom, and the crosslinkable group is preferably an alkoxymethyl group and / or a methylol group. The alkoxymethyl group is preferably a methoxymethyl group, an ethoxymethyl group, or a butoxymethyl group, and more preferably a methoxymethyl group.

[0207]

[0208] In formula (11), R １１ represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. １ and * ２ each independently represents a bonding point, but a carbonyl group is not adjacent to the nitrogen atom. a represents 1 or 2. b represents 0 or 1. Note that a+b=2. １ and * ２In view of the effects of the present invention, it is preferable that at least one of the groups be a bonding point to an aromatic structure, an aromatic heterocyclic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. １ and * ２ are also preferably points of attachment to an aromatic structure, an aromatic heterocyclic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. １ and * ２ At the bonding point, from the viewpoint of the effects of the invention described above, the aromatic structure is preferably a benzene structure, a biphenyl structure, or a terphenyl structure, the aromatic heterocyclic structure is preferably a triazine structure, an isocyanuric acid structure, a pyrrole structure, an imidazole structure, or a triazole structure, the fused polycyclic structure is preferably a fluorene structure or a naphthalene structure, and the fused polycyclic heterocyclic structure is preferably a carbazole structure, an indole structure, a benzimidazole structure, or a benzotriazole structure. １ and * ２ At the bonding point, the aromatic heterocyclic structure is more preferably a triazine structure.

[0209] The compound having the structure represented by formula (11) above has a specific crosslinkable group described later, and therefore may be used as a crosslinking agent (F) described later. In other words, the compound is classified as both a thermal colorant and / or an oxidative colorant and a crosslinking agent (F).

[0210] <(E) Dispersant> From the viewpoint of improving the dispersion stability of the pigment, the photosensitive composition of the present invention preferably further contains a (E) dispersant. The (E) dispersant refers to a compound having a structure that interacts with the pigment surface and a structure that inhibits approach of pigment particles to each other. The (E) dispersant preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0211] <(F) Crosslinking Agent> The (F) crosslinking agent refers to a compound having a crosslinkable group, a cationically polymerizable group, or an anionically polymerizable group capable of reacting with a resin or the like. From the viewpoint of improving the reliability and migration resistance of the light-emitting device, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (hereinafter referred to as "specific crosslinkable group"). The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a methylol group or an ethylol group. From the viewpoint of improving the reliability and migration resistance of the light-emitting device, the number of specific crosslinkable groups possessed by the (F) crosslinking agent is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and particularly preferably 6 or more. On the other hand, from the viewpoint of suppressing residue after development, the number of specific crosslinkable groups is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less.

[0212] The content of the (F) crosslinking agent is preferably 1.0 part by mass or more, based on 100 parts by mass of the total of the (A) binder resin and the (B) compound, from the viewpoint of improving sensitivity during exposure, while the content of the (F) crosslinking agent is preferably 30 parts by mass or less, from the viewpoint of suppressing residues after development.

[0213] <(G) Inorganic Particles> From the viewpoint of improving the reliability and migration resistance of the light-emitting device, the photosensitive composition of the present invention preferably further contains (G) inorganic particles. (G) Inorganic particles refer to particles containing an element selected from the group consisting of a metal element, a metalloid element, and a semiconductor element as a main component element. The main component element in inorganic particles refers to the element that is contained most abundantly by mass among the constituent elements of the inorganic particles. The (G) inorganic particles preferably have hydroxy groups and / or silanol groups on the particle surface. The (G) inorganic particles preferably contain silica particles from the viewpoint of suppressing external light reflection.

[0214] <(I) Phenolic Compound> The photosensitive composition of the present invention preferably further contains a (I) phenolic compound from the viewpoints of suppressing residue after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. The (I) phenolic compound preferably satisfies the following condition (β1) and also satisfies the following condition (5). The (I) phenolic compound does not contain a fluorine atom or a fluoride ion in its structure. The (I) phenolic compound preferably does not contain a chlorine atom, a bromine atom, a chloride ion, or a bromide ion in its structure. (β1) Having at least two of the following (Ic) structures and the following (IIIc) structure: Structure (Ic): a cyclic structure having a phenolic hydroxyl group Structure (IIIc): a structure connecting at least two (Ic) structures, which is a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group (5) The total content of (I) phenol compounds in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 10,000 ppm by mass or less.

[0215] From the viewpoint of the effects of the present invention, the total content of the (I) phenol compounds relative to the total solid content of the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the total content of the (I) phenol compounds is preferably 10,000 ppm by mass or less, more preferably 5,000 ppm by mass or less, even more preferably 1,000 ppm by mass or less, even more preferably 500 ppm by mass or less, particularly preferably 300 ppm by mass or less, and most preferably 100 ppm by mass or less. Furthermore, the total content of (I) phenol compounds is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0216] The cyclic structure in the (Ic) structure is preferably an aromatic structure or a fused polycyclic structure, more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure.

[0217] In view of the effects of the invention described above, the phenol compound (I) preferably contains a compound represented by formula (41).

[0218]

[0219] In formula (41), R ４１ and R ４２ R each independently represents a carboxy group, a mercapto group, or a sulfonic acid group. ５９ represents an alkyl group having 1 to 6 carbon atoms. ７１ and R ７２each independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms. Y ２１ represents a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. a and b each independently represent an integer of 1 to 5. g and h each independently represent an integer of 0 to 4. o and p each independently represent an integer of 0 to 4. w represents an integer of 0 to 6. Note that 1≦a+g+o≦5 and 1≦b+h+p≦5.

[0220] Y ２１ In the above, the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. ２１ In the above, the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group preferably have 1 to 15 carbon atoms, and the hydrocarbon group preferably has an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted.

[0221] By adopting the above-described configuration, these compounds are believed to promote the surface modification of the surface of the first electrode at the opening of the pixel dividing layer. Therefore, it is estimated that the effects of suppressing residue after development, lowering the driving voltage of light-emitting characteristics, and improving the light-emitting brightness are significant. Furthermore, these compounds function as catalysts that promote the crosslinking reaction in the film of the photosensitive composition due to a thermal reaction. Therefore, improving the degree of crosslinking in the film of the photosensitive composition contributes to improving heat resistance and suppressing outgassing, thereby significantly improving the reliability and migration resistance of the light-emitting element.

[0222] <(J) Crosslinkable Aromatic Compound> From the viewpoints of suppressing residue after development, achieving low-voltage operation of light-emitting properties, improving the reliability of light-emitting devices, and improving migration resistance, it is preferable that the photosensitive composition of the present invention further contains a (J) crosslinkable aromatic compound. The (J) crosslinkable aromatic compound preferably has at least two (Id) structures: cyclic structures to which a phenolic hydroxyl group and at least two crosslinkable groups are bonded, and at least two (IId) structures: cyclic structures having a phenolic hydroxyl group different from the (Id) structures, and further has a (IIId) structure: a structure connecting at least two (IId) structures, and satisfies the following condition (6). The (J) crosslinkable aromatic compound preferably does not contain fluorine atoms or fluoride ions in its structure. The (J) crosslinkable aromatic compound preferably does not contain chlorine atoms, bromine atoms, chloride ions, or bromide ions in its structure. (6) The total content of the crosslinkable aromatic compounds (J) in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 5,000 ppm by mass or less.

[0223] The cyclic structure in the (Id) structure and the (IId) structure is preferably an aromatic structure or a fused polycyclic structure, more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure. The linking structure in the (IIId) structure is preferably a hydrocarbon group, more preferably an alkylene group, and even more preferably an alkylene group having 1 to 10 carbon atoms.

[0224] The (IId) structure is preferably a (IIdx) structure: an aromatic structure having a phenolic hydroxyl group and at least one crosslinkable group. The crosslinkable group in the (Id) structure and the (IIdx) structure preferably has one or more types selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, a vinyl group, and an allyl group, and more preferably has an alkoxyalkyl group and / or a hydroxyalkyl group. The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, and more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a methylol group or an ethylol group. Note that the (J) crosslinkable aromatic compound is a compound different from the (B) compound and the (F) crosslinking agent.

[0225] From the viewpoint of the effects of the present invention, the total content of the (J) crosslinkable aromatic compounds relative to the total solid content of the photosensitive composition is preferably 0.010 ppm by mass or more, more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, even more preferably 0.070 ppm by mass or more, and particularly preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the total content of the (J) crosslinkable aromatic compounds is preferably 5,000 ppm by mass or less, more preferably 1,000 ppm by mass or less, even more preferably 500 ppm by mass or less, even more preferably 300 ppm by mass or less, and particularly preferably 100 ppm by mass or less. Furthermore, the total content of the crosslinkable aromatic compounds (J) is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, still more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0226] In view of the effects of the present invention described above, the crosslinkable aromatic compound (J) preferably contains a compound represented by formula (51).

[0227]

[0228] In formula (51), R １０１ ~R １０６R each independently represents an alkyl group having 1 to 10 carbon atoms. １０７ and R １０８ R each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. １１１ ~R １１６ each independently represents an alkoxyalkyl group having 2 to 10 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, an alkyl group having 1 to 6 carbon atoms and an epoxy group, an alkoxyalkyl group having 2 to 10 carbon atoms and an epoxy group, an alkyl group having 1 to 8 carbon atoms and an oxetanyl group, an alkoxyalkyl group having 2 to 12 carbon atoms and an oxetanyl group, a vinyl group, or an allyl group. X １０７ and X １０８ each independently represent a direct bond, an arylene group having 6 to 15 carbon atoms linked via an alkylene group having 1 to 10 carbon atoms, or a cycloalkylene group having 4 to 10 carbon atoms linked via an alkylene group having 1 to 10 carbon atoms. a, b, e, and f each independently represent an integer of 1 to 3. c and d each independently represent an integer of 1 to 4. g, h, i, j, k, and l each independently represent an integer of 0 to 3. u, v, y, and z each independently represent an integer of 2 to 4. w and x each independently represent an integer of 0 to 3. Note that 3≦a+g+u≦5, 3≦b+h+v≦5, 1≦c+i+w≦4, 1≦d+j+x≦4, 3≦e+k+y≦5, and 3≦f+l+z≦5. The above-mentioned substituents and structures may contain heteroatoms and may be either unsubstituted or substituted.

[0229] By adopting the above-described configuration, these compounds are believed to promote the surface modification of the surface of the first electrode at the opening of the pixel dividing layer. Therefore, it is estimated that the effects of suppressing residue after development, lowering the driving voltage of light-emitting characteristics, and improving the light-emitting brightness are significant. Furthermore, these compounds function as catalysts that promote the crosslinking reaction in the film of the photosensitive composition due to a thermal reaction. Therefore, improving the degree of crosslinking in the film of the photosensitive composition contributes to improving heat resistance and suppressing outgassing, thereby significantly improving the reliability and migration resistance of the light-emitting element.

[0230] <(H) Nitrogen-Containing Compound> The photosensitive composition of the present invention preferably further contains (H) a nitrogen-containing compound from the viewpoints of suppressing residue after development, achieving low-voltage operation of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance. The (H) nitrogen-containing compound preferably contains one or more compounds selected from the group consisting of cyclic amide compounds, amide compounds, cyclic urea compounds, urea compounds, oxazolidone compounds, and isoxazolidone compounds (hereinafter referred to as "specific nitrogen-containing compounds") and satisfies the following condition (4). When the photosensitive composition of the present invention contains one or more compounds selected from the group consisting of polyimide resins, the photosensitive composition of the present invention preferably contains (H) a nitrogen-containing compound from the viewpoint of the above-mentioned effects of the invention, and more preferably satisfies the following condition (4). (4) The total content of the cyclic amide compounds, amide compounds, cyclic urea compounds, urea compounds, oxazolidone compounds, and isoxazolidone compounds in the total solid content of the photosensitive composition is 0.010% by mass or more and 5.0% by mass or less.

[0231] In view of the effects of the present invention, the specific nitrogen-containing compound preferably contains one or more compounds selected from the group consisting of a cyclic amide compound represented by formula (20), an amide compound represented by formula (21), a cyclic urea compound represented by formula (22), a urea compound represented by formula (23), an oxazolidone compound represented by formula (24), and an isoxazolidone compound represented by formula (25).

[0232]

[0233] In formulas (20) to (25), R ４６ ~R ５６ R each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. １３０represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, a hydroxy group, an amino group, a monoalkylamino group having 1 to 6 carbon atoms, or a dialkylamino group having 2 to 12 carbon atoms. １３１ ~R １４２ each independently represents an alkyl group having 1 to 6 carbon atoms. α, β, and γ each independently represent an integer of 0 to 6. a, b, c, e, f, g, h, i, j, k, l, and m each independently represent an integer of 0 to 2. When α is 0, a is 0. When β is 0, b is 0. When γ is 0, c is 0. The above-mentioned substituents and structures may have heteroatoms, and may be either unsubstituted or substituted.

[0234] Specific nitrogen-containing compounds include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-butyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-dimethylpropionamide, N,N-dimethylisobutyramide, and N,N-dimethyl-3-methoxypropionamide. N,N-dimethyl-3-butoxypropionamide, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N,N'-dimethylpropyleneurea, 1,1,3,3-tetramethylurea, 1,1,3,3-tetraethylurea, N-methyl-2-oxazolidone, N-ethyl-2-oxazolidone, N-methyl-3-isoxazolidone, or N-ethyl-3-isoxazolidone is preferred.

[0235] From the viewpoint of the effects of the invention described above, the total content of the specific nitrogen-containing compounds relative to the total solid content of the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoint of the effects of the invention described above, the total content of the specific nitrogen-containing compounds is preferably 4.0% by mass or less, more preferably 3.5% by mass or less, and even more preferably 3.0% by mass or less. Furthermore, the total content of the specific nitrogen-containing compounds is preferably 2.5% by mass or less, more preferably 2.0% by mass or less, even more preferably 1.5% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0236] By adopting the above-described configuration, these compounds are believed to promote the surface modification of the surface of the first electrode at the opening of the pixel dividing layer. Therefore, it is estimated that the effects of suppressing residue after development, lowering the driving voltage of light-emitting characteristics, and improving the light-emitting brightness are significant. Furthermore, these compounds function as catalysts that promote the crosslinking reaction in the film of the photosensitive composition due to a thermal reaction. Therefore, improving the degree of crosslinking in the film of the photosensitive composition contributes to improving heat resistance and suppressing outgassing, thereby significantly improving the reliability and migration resistance of the light-emitting element.

[0237] <Contents of Fluorine, Chlorine, and Bromine Elements> From the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, the photosensitive composition of the present invention preferably satisfies the following conditions (P1x) and (1x) described below. From the viewpoint of the effects of the present invention described above, the photosensitive composition of the present invention more preferably satisfies the following conditions (P2x) and (2x) described below.

[0238] From the viewpoints of suppressing residues after development, achieving low-voltage operation of light-emitting properties, improving the reliability of light-emitting devices, and improving migration resistance, it is preferable that the photosensitive composition of the present invention has a fluorine atom, a chlorine atom, a bromine atom, a fluoride ion, a chloride ion, or a bromide ion in its structure, or that the photosensitive composition further contains a component containing a fluorine element, a chlorine element, or a bromine element and / or a component containing a fluoride ion, a chloride ion, or a bromide ion, and that the photosensitive composition satisfies the following conditions (P1x) and (1x): (P1x) the total content of fluorine element, chlorine element, and bromine element in the resin structure is 30,000 ppm by mass or less, and (1x) the total content of fluorine element, chlorine element, and bromine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0239] In view of the above-described effects of the invention, it is more preferable that the photosensitive composition of the present invention further satisfies the following condition (P2x) and condition (2x): (P2x) the total content of fluoride ions, chloride ions, and bromide ions in the resin structure is 30,000 ppm by mass or less, and (2x) the total content of fluoride ions, chloride ions, and bromide ions in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0240] From the viewpoint of the effects of the present invention, the total content of fluorine, chlorine, and bromine elements in the resin structure is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the total content of fluorine, chlorine, and bromine elements is preferably 30,000 ppm by mass or less, more preferably 10,000 ppm by mass or less, and even more preferably 5,000 ppm by mass or less. Furthermore, the total content of fluorine, chlorine, and bromine elements is preferably 1,000 ppm by mass or less, more preferably 500 ppm by mass or less, even more preferably 300 ppm by mass or less, and particularly preferably 100 ppm by mass or less. Furthermore, the total content of fluorine element, chlorine element, and bromine element is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, still more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0241] The preferred ranges of the total content of fluoride ions, chloride ions, and bromide ions in the resin structure are the same as the preferred ranges of the total content of fluorine elements, chlorine elements, and bromine elements in the resin structure described above.

[0242] The total content of elemental fluorine, elemental chlorine, and elemental bromine in the resin structure may be 0 ppm by mass, and the total content of fluoride ions, chloride ions, and bromide ions in the resin structure may also be 0 ppm by mass.

[0243] Preferred components containing fluorine, chlorine, or bromine include phenol compounds having a substituent containing a fluorinated alkyl group, alkyl fluoride compounds, cycloalkyl fluoride compounds, aryl fluoride compounds, phenol compounds having a substituent containing a chlorinated alkyl group, alkyl chloride compounds, cycloalkyl chloride compounds, aryl chloride compounds, phenol compounds having a substituent containing a brominated alkyl group, alkyl bromide compounds, cycloalkyl bromide compounds, and aryl bromide compounds. Components containing fluoride ions, chloride ions, or bromide ions preferably contain ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions, or quaternary ammonium ions as cationic species. The quaternary ammonium ions preferably have a linear or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0244] From the viewpoint of the effects of the present invention, the total content of elemental fluorine, elemental chlorine, and elemental bromine in the total solid content of the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention, the total content of elemental fluorine, elemental chlorine, and elemental bromine is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the total content of elemental fluorine, elemental chlorine, and elemental bromine is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0245] The preferred ranges of the total contents of fluoride ions, chloride ions, and bromide ions in the total solid content of the photosensitive composition are the same as the preferred ranges of the total contents of fluorine element, chlorine element, and bromine element in the total solid content of the photosensitive composition described above.

[0246] The total content of elemental fluorine, elemental chlorine, and elemental bromine in the total solid content of the photosensitive composition may be 0 ppm by mass. The total content of elemental fluoride, elemental chloride, and elemental bromide in the total solid content of the photosensitive composition may also be 0 ppm by mass. When the total content of elemental fluorine, elemental chlorine, and elemental bromine and / or the total content of elemental fluoride, elemental chloride, and elemental bromide in the total solid content of the photosensitive composition (hereinafter referred to as "the total content of specific elements and / or the total content of specific ions in the total solid content of the photosensitive composition") exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably has a fluorine atom, a chlorine atom, a bromine atom, a fluoride ion, a chloride ion, or a bromide ion in its structure. Furthermore, when the total content of the specific elements and / or the total content of the specific ions in the total solid content of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably further contains a component containing a fluorine element, a chlorine element, or a bromine element and / or a component containing a fluoride ion, a chloride ion, or a bromide ion.

[0247] As described above, when the storage stability of a photosensitive composition is poor, for example, generation of foreign matter after storage at room temperature may become a problem. By setting the total content of elemental fluorine, elemental chlorine, and elemental bromine in the total solid content of the photosensitive composition of the present invention within a specific range, generation of foreign matter during storage is suppressed, and the effect of improving storage stability is significantly achieved.

[0248] <Fluorine Element Content> The photosensitive composition of the first aspect of the present invention preferably satisfies the following condition (1a) from the viewpoints of suppressing residue after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, and more preferably the photosensitive composition of the first aspect of the present invention further satisfies the following condition (2a) from the viewpoint of the effects of the invention described above.

[0249] The photosensitive composition according to the second aspect of the present invention satisfies the following condition (1a): The photosensitive composition according to the second aspect of the present invention preferably further satisfies the following condition (2a).

[0250] From the viewpoints of suppressing residues after development, achieving low-voltage operation of light-emitting characteristics, improving the reliability of light-emitting devices, and improving migration resistance, the photosensitive composition of the present invention preferably has (A) the binder resin, (C) the photosensitizer, (B) the radical-polymerizable compound, or (F) the crosslinking agent having a fluorine atom or a fluoride ion in its structure, or the photosensitive composition further contains a component containing elemental fluorine and / or a component containing fluoride ion, and satisfies the following condition (1a): From the viewpoint of the effects of the present invention, the photosensitive composition of the present invention more preferably further satisfies the following condition (2a): (1a) the content of elemental fluorine in the total solid content of the photosensitive composition is 1,000 ppm by mass or less, and (2a) the content of fluoride ions in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

[0251] Examples and preferred descriptions regarding the component containing elemental fluorine, the component containing fluoride ions, and the cationic species in the component containing fluoride ions are the same as those described above.

[0252] From the viewpoint of the effects of the present invention, the content of elemental fluorine in the total solid content of the photosensitive composition is preferably 0 ppm by mass or more, more preferably 0.010 ppm by mass or more, even more preferably 0.030 ppm by mass or more, even more preferably 0.050 ppm by mass or more, particularly preferably 0.070 ppm by mass or more, and most preferably 0.10 ppm by mass or more. On the other hand, from the viewpoint of the effects of the present invention, the content of elemental fluorine is preferably 1,000 ppm by mass or less, more preferably 500 ppm by mass or less, even more preferably 300 ppm by mass or less, and particularly preferably 100 ppm by mass or less. Furthermore, the content of elemental fluorine is preferably 50 ppm by mass or less, more preferably 30 ppm by mass or less, even more preferably 10 ppm by mass or less, even more preferably 5 ppm by mass or less, particularly preferably 3 ppm by mass or less, and most preferably 1 ppm by mass or less.

[0253] The preferred range of the content of fluoride ions in the total solid content of the photosensitive composition is the same as the preferred range of the content of elemental fluorine in the total solid content of the photosensitive composition described above.

[0254] The content of elemental fluorine in the total solid content of the photosensitive composition may be 0 ppm by mass. The content of fluoride ions in the total solid content of the photosensitive composition may also be 0 ppm by mass. When the content of elemental fluorine and / or fluoride ions in the total solid content of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably contains a fluorine atom or a fluoride ion in the structure of the (A) binder resin, the (C) photosensitizer, the (B) compound, or the (F) crosslinking agent, or the photosensitive composition further contains a component containing elemental fluorine and / or a component containing fluoride ions.

[0255] As described above, when the storage stability of a photosensitive composition is poor, for example, generation of foreign matter after storage at room temperature may become a problem. By setting the content of elemental fluorine relative to the total solid content of the photosensitive composition of the present invention within a specific range, generation of foreign matter during storage is suppressed, and the effect of improving storage stability is significantly achieved.

[0256] <Contents of chlorine, bromine, and sulfur> From the viewpoints of suppressing residues after development, achieving low-voltage driving of light-emitting characteristics, improving the reliability of the light-emitting device, and improving migration resistance, the photosensitive composition of the present invention preferably satisfies at least one of the following conditions (1b), (1c), and (1d) described below. From the viewpoint of the effects of the present invention, the photosensitive composition of the present invention more preferably satisfies at least one of the following conditions (2b), (2c), and (2d) described below.

[0257] From the viewpoints of suppressing residues after development, achieving low-voltage operation of light-emitting characteristics, improving the reliability of light-emitting devices, and improving migration resistance, the photosensitive composition of the present invention preferably has a structure in which the (A) binder resin, (C) photosensitizer, (B) radically polymerizable compound, or (F) crosslinking agent has a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or the following sulfur-based anion, or the photosensitive composition further contains a component containing a chlorine element, a bromine element, or a sulfur element and / or a component containing a chloride ion, a bromide ion, or the following sulfur-based anion, and satisfies at least one of the following conditions (1b), (1c), and (1d): It is more preferable that the photosensitive composition of the present invention satisfies the above condition (1a) and further satisfies at least one of the following conditions (1b), (1c), and (1d): Sulfur-based anion: one or more ions selected from the group consisting of sulfide ion, hydrogen sulfide ion, sulfate ion, and hydrogen sulfate ion. (1b) The content of chlorine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less. (1c) The content of bromine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less. (1d) The content of sulfur element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0258] In view of the effects of the invention described above, the photosensitive composition of the present invention more preferably satisfies at least one of the following conditions (2b), (2c), and (2d): (2b) the chloride ion content relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less, (2c) the bromide ion content relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less, and (2d) the sulfur-based anion content relative to the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0259] Examples and preferred descriptions of cationic species in components containing chlorine or bromine; components containing chloride ions or bromide ions; and components containing these anions are the same as those described above. As components containing sulfur, thiol compounds, sulfide compounds, disulfide compounds, sulfoxide compounds, sulfone compounds, sultone compounds, or thiophene compounds are preferred. Components containing sulfur-based anions preferably contain ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions, or quaternary ammonium ions as cationic species. Examples and preferred descriptions of cationic species in components containing sulfur-based anions are the same as those described above.

[0260] From the viewpoint of the effects of the present invention, the content of chlorine element in the total solid content of the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention, the content of chlorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the content of chlorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0261] The preferred ranges of the content of elemental bromine, elemental sulfur, chloride ion, bromide ion, and sulfur-based anion in the total solid content of the photosensitive composition are the same as the preferred ranges of the content of elemental chlorine in the total solid content of the photosensitive composition described above.

[0262] The content of one or more selected from the group consisting of elemental chlorine, elemental bromine, and elemental sulfur relative to the total solid content of the photosensitive composition may be 0 ppm by mass. The content of one or more selected from the group consisting of chloride ions, bromide ions, and sulfur-based anions relative to the total solid content of the photosensitive composition may also be 0 ppm by mass. When the content of one or more selected from the group consisting of elemental chlorine, elemental bromine, elemental sulfur, chloride ions, bromide ions, and sulfur-based anions relative to the total solid content of the photosensitive composition (hereinafter referred to as "content of elemental chlorine, chloride ions, etc. relative to the total solid content of the photosensitive composition") exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably contains a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or the following sulfur-based anions in its structure. When the content of chlorine element or chloride ion in the total solid content of the photosensitive composition exceeds 0 ppm by mass, the photosensitive composition of the present invention preferably further contains a component containing chlorine element, bromine element, or sulfur element and / or a component containing chloride ion, bromide ion, or the following sulfur-based anion.

[0263] From the viewpoint of the effects of the invention described above, the photosensitive composition of the present invention preferably satisfies the conditions (P1x) and (1x) above, and further satisfies the condition (1a). Furthermore, from the viewpoint of the effects of the invention described above, the photosensitive composition of the present invention preferably satisfies the conditions (P1x) and (1x) above, and further satisfies at least one of the conditions (1b), (1c), and (1d). Furthermore, from the viewpoint of the effects of the invention described above, the photosensitive composition of the present invention preferably satisfies the condition (1a) above, and further satisfies the condition (1x). For each of the above, the examples, preferred descriptions, and preferred contents of the condition (1a) above; the conditions (1b), (1c), and (1d) above; and the condition (1x) above are the same as those described above. <Water Content> From the viewpoints of suppressing residue after development, achieving low-voltage operation of light-emitting properties, improving the reliability of light-emitting devices, and improving migration resistance, the photosensitive composition of the present invention preferably further contains water and satisfies the following condition (3). (3) The content of water in the photosensitive composition is 0.010% by mass or more and 3.0% by mass or less.

[0264] From the viewpoint of the effects of the invention described above, the water content in the photosensitive composition is preferably 0.010% by mass or more, more preferably 0.030% by mass or more, even more preferably 0.050% by mass or more, even more preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoint of the effects of the invention described above, the water content is preferably 3.0% by mass or less, more preferably 2.5% by mass or less, even more preferably 2.2% by mass or less, and particularly preferably 2.0% by mass or less. Furthermore, the water content is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.2% by mass or less, even more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0265] As described above, poor storage stability of the photosensitive composition can lead to reduced reliability of the light-emitting device and reduced migration resistance. By setting the water content of the photosensitive composition of the present invention within a specific range, generation of foreign matter during storage is suppressed, and the effect of improving storage stability is significantly achieved.

[0266] <Other Additives and Solvents> The photosensitive composition of the present invention preferably further contains a dissolution promoter, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, an ink repellent, or a surfactant. Known additives may be used as these additives. The photosensitive composition of the present invention preferably further contains a solvent. When the photosensitive composition of the present invention contains a pigment and further contains a dispersant, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond, from the viewpoint of improving the dispersion stability of the pigment.

[0267] <Photosensitive Composition Coating and Photosensitive Composition Film> The photosensitive composition coating of the present invention is a film formed from the photosensitive composition of the present invention in a semi-cured state (B stage). The semi-cured state refers to a state in which a crosslinked structure is not formed or a crosslinked structure is formed by a partial reaction, but the film has fluidity, or a state in which the film is in this state. For example, the semi-cured state refers to a state in which the coating film is applied to a substrate or the like, and then dried under reduced pressure to remove the solvent, or a state in which the coating film is heated to 40 to 150°C and dried, and is soluble in an alkaline solution or an organic solvent.

[0268] The photosensitive composition film of the present invention preferably has a photosensitive composition coating formed from the photosensitive composition of the present invention and a support. Such a configuration is suitable from the viewpoint of handleability. The photosensitive composition film has positive or negative photosensitivity. It is also preferable that the photosensitive composition film is capable of forming a free-standing film as a single film. The photosensitive composition film preferably has adhesive properties, and it is also preferable that multiple components are bonded to it. "Able to form a free-standing film as a single film" means that a film having a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more can be formed without a support. In other words, it is also preferable that the photosensitive composition film is a photosensitive composition coating capable of forming a free-standing film as a single film.

[0269] The support is preferably a flexible substrate, but may also be a rigid substrate. The surface of the support on the photosensitive film side may be surface-treated with a silane coupling agent or the like. From the viewpoint of handleability, the thickness of the support is preferably 10 to 200 μm.

[0270] <Cured Product of Photosensitive Composition> The cured product of the present invention is obtained by curing the photosensitive composition of the present invention. Curing refers to the formation of a crosslinked structure by a reaction, resulting in the loss of fluidity of the film, or the state in which this occurs. The curing reaction may be by heating, by irradiation with energy rays, or the like, but is not particularly limited; however, a curing reaction by heating is preferred. A state in which a crosslinked structure is formed in the components constituting the photosensitive composition by heating, resulting in the loss of fluidity of the film, is called thermal curing. Preferred heating conditions include, for example, heating at 150 to 500°C for 5 to 300 minutes. The cured product of the present invention may also be obtained by curing the photosensitive film of the present invention.

[0271] The cured product of the present invention is preferably black. From the viewpoint of suppressing external light reflection and improving the reliability of the light-emitting device, the optical density at the wavelength of visible light per 1 μm of film thickness of the cured product of the present invention is preferably 0.5 or more, more preferably 0.7 or more, even more preferably 1.0 or more, even more preferably 1.2 or more, and particularly preferably 1.5 or more. On the other hand, from the viewpoint of achieving low-voltage driving of the light-emitting characteristics, the optical density is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. Note that the optical density referred to here is preferably the optical density of a cured product obtained by heating and curing the composition.

[0272] An element of the present invention comprises the cured product of the present invention. Also, an article of the present invention comprises the cured product of the present invention. Examples of the article include a display device, an electronic component, an electronic device, a mobile object, a building, or a window.

[0273] <Method for producing a cured product> The method for producing a cured product of the present invention includes the steps of (1) forming a coating film of the photosensitive composition of the present invention on a substrate, (2) irradiating the coating film of the photosensitive composition with actinic rays through a photomask to expose the coating film, (3) developing the exposed coating film using a developer to form a pattern of the photosensitive composition, and (4) heating the pattern of the photosensitive composition to obtain a cured pattern of the photosensitive composition. Note that in these steps, the methods described in paragraphs

[0453] to

[0481] of WO 2019 / 087985 may also be applied. The step of forming a coating film preferably involves applying the coating and then pre-baking to form the film. The step of obtaining a cured pattern preferably involves heating the pattern to thermally cure it.

[0274] <Display Device and Electronic Component> The display device of the present invention and the electronic component of the present invention will be described below. Note that when referring to the display device of the present invention, this description is common to the display devices of the first, second, and third aspects of the present invention. On the other hand, when referring to a display device of a specific aspect, it will be referred to as the display device of the first aspect of the present invention, etc. However, the present invention is not limited to the following embodiments, and various modifications are naturally possible within the scope that can achieve the object of the invention and does not deviate from the gist of the invention.

[0275] A display device of the present invention comprises the cured product of the present invention. A display device of a first aspect of the present invention comprises the cured product of the photosensitive composition of the first aspect of the present invention, which contains the resin of the present invention. A display device of a second aspect of the present invention comprises the cured product of the photosensitive composition of the second aspect of the present invention.

[0276] <Display Device> The display device of the present invention preferably has a first electrode, a second electrode, and a light-emitting layer, and also has a pixel dividing layer. Furthermore, the display device of the present invention preferably has a first electrode, a second electrode, a light-emitting layer, a pixel dividing layer, and metal wiring, and also has one or more layers selected from the group consisting of a TFT planarizing layer, a TFT protective layer, a TFT interlayer insulating layer, and a gate insulating layer. Examples of such display devices include organic EL displays and quantum dot displays.

[0277] The display device of the present invention preferably has light-emitting elements and a metal wiring layer, and also has a partition layer and / or a planarization layer. The display device of the present invention also preferably has light-emitting elements, a metal wiring layer, and a rewiring layer, and also has an interlayer insulating layer for the rewiring layer. Furthermore, the display device of the present invention preferably has the light-emitting elements and the metal wiring layer and / or the light-emitting elements and the rewiring layer electrically connected, and the light-emitting elements are semiconductor chips. The partition layer is preferably formed between adjacent light-emitting elements, and the planarization layer is preferably formed so as to cover at least a portion of the light-emitting elements. Furthermore, from the viewpoints of improving integration density and suppressing transmission loss between wiring, the display device of the present invention preferably has an area of ​​the rewiring layer larger than the area of ​​the light-emitting elements in a planar view. Examples of such display devices include micro LED displays and mini LED displays.

[0278] In the display device of the present invention, it is preferable that the pixel division layer has a stepped shape having thick and thin portions, from the viewpoint of improving the reliability of the light-emitting element. By having the pixel division layer have thick portions, only the thick portions of the pixel division layer come into contact with the vapor deposition mask when forming the light-emitting layer, thereby reducing the contact area between the pixel division layer and the vapor deposition mask. Therefore, by suppressing damage to the pixel division layer, the effect of suppressing a decrease in panel yield and improving the reliability of the light-emitting element is significant. Furthermore, by having the thin portions have light-blocking properties, outgassing from the pixel division layer and the films below it is suppressed, thereby significantly improving the reliability of the light-emitting element. Figure 1 shows a schematic cross-sectional view and plan view of an example of a display device 100A in which the pixel division layer has a stepped shape having thick and thin portions. The cross-sectional view in Figure 1 is a view of a cross section cut along the cross-sectional axis 100x in the plan view. Metal wiring 102 and a TFT element layer 103 are formed on a substrate 101, and an interlayer insulating layer 104 and a TFT planarizing layer / TFT protective layer 105 are formed thereon in this order. A stepped pixel dividing layer 106 and first electrodes 107 are formed on the TFT planarizing layer / TFT protective layer 105 such that the pixel dividing layer 106 divides the first electrodes 107 and overlaps with portions of the first electrodes 107. The pixel dividing layer 106 has a thick film portion 116. Further formed thereon in this order are a light-emitting layer 108, a second electrode 109, a sealing layer 110, touch panel wiring / touch panel electrodes 111, a color filter layer 112, a black matrix layer 113, an overcoat layer 114, and a substrate 115. Furthermore, a color filter layer portion 112a, an opening 117a in the pixel dividing layer portion, and an opening 118a in the black matrix layer portion are formed in the portion corresponding to the pixel portion in a plan view.

[0279] <Electronic Component> The electronic component of the present invention comprises the cured product of the present invention. The electronic component of the present invention has metal wiring, and preferably has one or more selected from the group consisting of an insulating layer for the metal wiring, a protective layer for the metal wiring, and an interlayer insulating layer for the metal wiring. Examples of the electronic component include semiconductor devices, antennas, metal-clad laminates, wiring boards, semiconductor packages, active components including semiconductor devices, and passive components.

[0280] The hollow structure of the present invention comprises the cured product of the present invention. The electronic component of the present invention preferably has a hollow structure. The hollow structure of the present invention preferably has a hollow structure support material and a hollow structure roofing material, and also has a metal electrode and / or a metal wiring layer. From the viewpoint of improving heat resistance and reliability, the hollow structure support material and the hollow structure roofing material preferably contain the above-mentioned polyimide-based resin. Examples of electronic components having hollow structures include MEMS (Micro Electro Mechanical Systems).

[0281] <Semiconductor Device> The semiconductor device of the present invention comprises the cured product of the present invention. The semiconductor device of the present invention preferably includes a semiconductor chip, an encapsulant covering the semiconductor chip, and a rewiring layer, and also includes an interlayer insulating layer for the rewiring layer. Furthermore, in terms of improving integration density and suppressing transmission loss between wiring, the semiconductor device of the present invention preferably has a rewiring layer with a larger area than the semiconductor chip in a planar view. The encapsulant covering the semiconductor chip preferably directly contacts the interlayer insulating layer for the rewiring layer. Furthermore, in terms of improving heat resistance and reliability, the encapsulant covering the semiconductor chip preferably contains an epoxy resin, and more preferably contains a cured epoxy resin. Examples of semiconductor devices include semiconductor devices having a fan-out wafer-level package structure, a fan-out panel-level package structure, or an antenna-in-package structure. These package structures in the semiconductor device of the present invention may be either a single-die or multi-die structure, with a multi-die structure being preferred in terms of improving integration density and suppressing transmission loss between wiring. The structure including the multi-die preferably has a chiplet structure, and more preferably includes one or more types of die selected from the group consisting of logic, memory, analog IC (analog integrated circuit), RF circuit (radio frequency circuit), and power semiconductor, and even more preferably includes two or more types of die.

[0282] <Other Electronic Articles> The antenna of the present invention comprises the cured product of the present invention. The antenna of the present invention preferably has metal wiring and / or ground wiring, and has one or more layers selected from the group consisting of an insulating layer for the metal wiring, a protective layer for the metal wiring, and an interlayer insulating layer between the metal wiring and the ground wiring. Examples of the antenna include a microstrip line antenna and a strip line antenna.

[0283] The metal-clad laminate of the present invention comprises the cured product of the present invention. The metal-clad laminate of the present invention has metal wiring and preferably has one or more layers selected from the group consisting of an insulating layer for the metal wiring, a protective layer for the metal wiring, and a solder resist layer for the metal wiring. Examples of metal-clad laminates include printed circuit boards.

[0284] <Uses of Photosensitive Composition> The cured product of the present invention can have excellent light-emitting properties that allow low-voltage operation, excellent light-emitting device reliability, and high migration resistance. Therefore, the photosensitive composition of the present invention is preferably used to form a pixel dividing layer, a TFT planarizing layer, a TFT protective layer, a TFT interlayer insulating layer, or a gate insulating layer in an organic EL display or a quantum dot display, and is also preferably used to form a partition layer, a planarizing layer, or an interlayer insulating layer of a rewiring layer in a micro LED display or a mini LED display. The photosensitive composition of the present invention is also preferably used to form a metal wiring insulating layer, a metal wiring protective layer, or a metal wiring interlayer insulating layer in electronic components, and is also preferably used to form a rewiring interlayer insulating layer in a semiconductor device, and is also preferably used to form a metal wiring insulating layer, a metal wiring protective layer, or an interlayer insulating layer between a metal wiring and a ground wiring in an antenna, and is also preferably used to form a metal wiring insulating layer, a metal wiring protective layer, or a metal wiring solder resist layer in a metal-clad laminate.

[0285] <Display Device of Third Aspect> A display device of a third aspect of the present invention is a display device having a substrate, a first electrode, a second electrode, a pixel dividing layer, a light-emitting layer, and a TFT planarizing layer, wherein the pixel dividing layer and / or the TFT planarizing layer contains one or more resins selected from the group consisting of polyimide, a polyimide precursor, polybenzoxazole, a polybenzoxazole precursor, polyamideimide, a polyamideimide precursor, and copolymers thereof, and the resin has an amine residue having a phenolic hydroxyl group, and the amine residue having a phenolic hydroxyl group has at least two structures (XIa): cyclic structures having a phenolic hydroxyl group, and a structure (XIIa): a structure connecting at least two of the (XIa) structures, The display device is one in which the structure (XIIa) is a sulfonyl group, an alkylene group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a urethane bond, a carbonate ester bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and satisfies the following condition (X1a): (X1a) The content of fluorine elements in the pixel dividing layer is 1,000 ppm by mass or less, and / or the content of fluorine elements in the TFT planarizing layer is 1,000 ppm by mass or less.

[0286] By adopting the above-described configuration, the photosensitive composition according to the third aspect of the present invention can provide a display device with excellent light-emitting properties that enable low-voltage operation to achieve a desired current density, and with highly reliable light-emitting elements. It is believed that by limiting the content of compounds containing fluorine atoms in the structure or components containing fluorine atoms in the photosensitive composition to a specific value or less, the substrate surface is modified by these components, resulting in significant effects of low-voltage operation of light-emitting properties and improved luminance. Furthermore, intentionally limiting the content of these components to a specific value or less is believed to adjust the detection intensity of these ions on the surface of the cured product, thereby controlling the polarization structure and charge balance in the cured product. As a result, it is believed that suppressing ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect light-emitting properties or electrical insulation can contribute to the high reliability of light-emitting elements. It is also believed that suppressing migration and aggregation of metals in electrodes or metal wiring contributes to the high reliability of display devices.

[0287] The resin in the pixel dividing layer and the resin in the TFT planarizing layer are preferably the binder resin (A) in the photosensitive composition, and a resin having a structure derived from the binder resin (A) is also preferred. Examples and preferred descriptions of the resin in the pixel dividing layer and the resin in the TFT planarizing layer are as described above for the binder resin (A).

[0288] A display device according to a third aspect of the present invention satisfies the following condition (X1a). From the viewpoint of achieving low-voltage driving of light-emitting characteristics and improving the reliability of light-emitting elements, it is preferable that the display device of the present invention further satisfies the following condition (X2a): (X1a) The content of fluorine elements in the pixel dividing layer is 1,000 ppm by mass or less, and / or the content of fluorine elements in the TFT planarizing layer is 1,000 ppm by mass or less. (X2a) The content of fluoride ions in the pixel dividing layer is 1,000 ppm by mass or less, and / or the content of fluoride ions in the TFT planarizing layer is 1,000 ppm by mass or less.

[0289] In the display device according to the third aspect of the present invention, the pixel dividing layer preferably contains a component containing a fluorine element and / or a component containing a fluoride ion. It is also preferable that the resin in the pixel dividing layer has a fluorine atom or a fluoride ion in its structure. It is also preferable that the TFT planarizing layer contains a component containing a fluorine element and / or a component containing a fluoride ion. It is also preferable that the resin in the TFT planarizing layer has a fluorine atom or a fluoride ion in its structure.

[0290] From the viewpoint of the effects of the present invention, the content of fluorine element in the pixel dividing layer and the content of fluorine element in the TFT planarizing layer are preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, even more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention, the content of fluorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the content of fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0291] The preferred ranges of the fluoride ion content in the pixel dividing layer and the TFT planarizing layer are the same as the preferred ranges of the fluorine element content in the pixel dividing layer and the TFT planarizing layer, respectively. Examples and preferred descriptions of the fluorine element-containing component and the fluoride ion-containing component in the pixel dividing layer and the TFT planarizing layer are as described for each component in the photosensitive composition above.

[0292] The content of elemental fluorine in the pixel dividing layer may be 0 ppm by mass. The content of fluoride ions in the pixel dividing layer may also be 0 ppm by mass. When the content of elemental fluorine and / or the content of fluoride ions in the pixel dividing layer exceeds 0 ppm by mass, the display device of the third aspect of the present invention preferably contains a component containing elemental fluorine and / or a component containing fluoride ions. When the content of elemental fluorine and / or the content of fluoride ions in the pixel dividing layer exceeds 0 ppm by mass, the display device of the third aspect of the present invention preferably contains a resin in the pixel dividing layer that has fluorine atoms or fluoride ions in its structure.

[0293] The content of elemental fluorine in the TFT planarizing layer may be 0 ppm by mass. The content of fluoride ions in the TFT planarizing layer may also be 0 ppm by mass. When the content of elemental fluorine and / or the content of fluoride ions in the TFT planarizing layer exceeds 0 ppm by mass, the display device of the third aspect of the present invention preferably contains a component containing elemental fluorine and / or a component containing fluoride ions. When the content of elemental fluorine and / or the content of fluoride ions in the pixel dividing layer exceeds 0 ppm by mass, it is also preferable that the resin in the TFT planarizing layer has fluorine atoms or fluoride ions in its structure.

[0294] <Contents of chlorine, bromine, and sulfur elements in pixel dividing layer and TFT planarizing layer> From the viewpoint of achieving low-voltage driving of light-emitting characteristics and improving the reliability of the light-emitting elements, it is preferable that the display device of the third aspect of the present invention further satisfies at least one of the following conditions (X1b), (X1c), and (X1d). (X1b) The content of chlorine element in the pixel dividing layer is 0.010 mass ppm or more and 1,000 mass ppm or less, and / or the content of chlorine element in the TFT planarizing layer is 0.010 mass ppm or more and 1,000 mass ppm or less. (X1c) The content of bromine element in the pixel dividing layer is 0.010 mass ppm or more and 1,000 mass ppm or less, and / or the content of bromine element in the TFT planarizing layer is 0.010 mass ppm or more and 1,000 mass ppm or less. (X1d) The content of sulfur element in the pixel dividing layer is 0.010 mass ppm or more and 1,000 mass ppm or less, and / or the content of sulfur element in the TFT planarizing layer is 0.010 mass ppm or more and 1,000 mass ppm or less.

[0295] In view of the effects of the invention described above, it is more preferable that the display device according to the third aspect of the invention further satisfies at least one of the following conditions (X2b), (X2c), and (X2d): sulfur-based anion: one or more ions selected from the group consisting of sulfide ions, hydrogen sulfide ions, sulfate ions, and hydrogen sulfate ions; (X2b) the content of chloride ions in the pixel dividing layer is 0.010 ppm by mass or more and 1,000 ppm by mass or less, and / or the content of chloride ions in the TFT planarizing layer is 0.010 ppm by mass or more and 1,000 ppm by mass or less; (X2c) the content of bromide ions in the pixel dividing layer is 0.010 ppm by mass or more and 1,000 ppm by mass or less, and / or the content of bromide ions in the TFT planarizing layer is 0.010 ppm by mass or more and 1,000 ppm by mass or less. (X2d) The content of the sulfur-based anion in the pixel dividing layer is 0.010 ppm by mass or more and 1,000 ppm by mass or less, and / or the content of the sulfur-based anion in the TFT planarizing layer is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

[0296] In a display device according to a third aspect of the present invention, the pixel dividing layer preferably contains a component containing a chlorine atom, a bromine atom, or a sulfur atom and / or a component containing a chloride ion, a bromide ion, or the above-mentioned sulfur-based anion. It is also preferable that the resin in the pixel dividing layer has a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or the above-mentioned sulfur-based anion in its structure. In a display device according to a third aspect of the present invention, the TFT planarizing layer preferably contains a component containing a chlorine atom, a bromine atom, or a sulfur atom and / or a component containing a chloride ion, a bromide ion, or the above-mentioned sulfur-based anion. It is also preferable that the resin in the TFT planarizing layer has a chlorine atom, a bromine atom, or a sulfur atom, a chloride ion, a bromide ion, or the above-mentioned sulfur-based anion in its structure.

[0297] From the viewpoint of the effects of the present invention, the content of chlorine element in the pixel dividing layer and the content of chlorine element in the TFT planarizing layer are preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, even more preferably 0.050 mass ppm or more, even more preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention, the content of chlorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, even more preferably 300 mass ppm or less, and particularly preferably 100 mass ppm or less. Furthermore, the content of chlorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, even more preferably 10 mass ppm or less, even more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0298] The preferred ranges of the bromine content, sulfur content, chloride ion content, bromide ion content, and sulfur-based anion content in the pixel dividing layer and the TFT planarizing layer are the same as the preferred ranges of the chlorine content in the pixel dividing layer and the TFT planarizing layer. The components containing chlorine, bromine, or sulfur; the components containing chloride ions, bromide ions, or sulfur-based anions; and the cationic species in the components containing these anions in the pixel dividing layer and the TFT planarizing layer are as described for each component in the photosensitive composition above.

[0299] The content of one or more elements selected from the group consisting of the chlorine element, the bromine element, and the sulfur element in the pixel dividing layer may be 0 ppm by mass. The content of one or more elements selected from the group consisting of the chloride ion content, the bromide ion content, and the sulfur-based anion content in the pixel dividing layer may also be 0 ppm by mass. When the content of one or more elements selected from the group consisting of the chlorine element, the bromine element, the sulfur element, the chloride ion content, the bromide ion content, and the sulfur-based anion content in the pixel dividing layer (hereinafter referred to as the "content of chlorine element, chloride ion, etc. in the pixel dividing layer") exceeds 0 ppm by mass, the display device according to the third aspect of the present invention preferably has a pixel dividing layer containing a component containing chlorine element, bromine element, or sulfur element and / or a component containing chloride ions, bromide ions, or sulfur-based anions. Furthermore, when the content of chlorine element or chloride ion in the pixel dividing layer exceeds 0 ppm by mass, in the display device of the third aspect of the present invention, it is also preferable that the resin in the pixel dividing layer has a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or a sulfur-based anion in its structure.

[0300] The content of one or more elements selected from the group consisting of the chlorine element, the bromine element, and the sulfur element in the TFT planarizing layer may be 0 ppm by mass. The content of one or more elements selected from the group consisting of the chloride ion content, the bromide ion content, and the sulfur-based anion content in the TFT planarizing layer may also be 0 ppm by mass. When the content of one or more elements selected from the group consisting of the chlorine element, the bromine element, the sulfur element, the chloride ion content, the bromide ion content, and the sulfur-based anion content in the TFT planarizing layer (hereinafter referred to as the "content of chlorine element in the TFT planarizing layer or chloride ions") exceeds 0 ppm by mass, the display device according to the third aspect of the present invention preferably has a TFT planarizing layer containing a component containing chlorine element, bromine element, or sulfur element and / or a component containing chloride ions, bromide ions, or sulfur-based anions. Furthermore, when the content of chlorine element or chloride ion in the TFT planarization layer exceeds 0 ppm by mass, in the display device according to the third aspect of the present invention, it is also preferable that the resin in the TFT planarization layer has a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or a sulfur-based anion in its structure.

[0301] The present invention will be described in more detail below with reference to Examples, Reference Examples, and Comparative Examples, but the present invention is not limited to these examples. For compounds used in the following explanations or tables that use abbreviations, the names corresponding to the abbreviations are listed in Table 1-2.

[0302]

[0303] <Synthesis Examples of Each Resin> The compositions of the resins obtained in Synthesis Examples 1 to 62 as the (A) binder resin are summarized in Tables 1-3 to 1-8. Each resin was synthesized by a known method based on a method described in a known literature, with the monomer compounds to be used as monomers and the copolymerization ratios appropriately changed. The copolymerization ratios of the monomers are as shown in Tables 1-3 to 1-8.

[0304] The hydroxyl group-containing diamines (HA-1) and (HA-2) having the following structures used in Synthesis Examples 9 and 23 were synthesized by a known method based on the synthesis method described in Synthesis Example 1 in paragraphs

[0374] to

[0376] of WO 2016 / 056451. The resins obtained in Synthesis Examples 9 and 23 using the hydroxyl group-containing diamines (HA-1) and (HA-2) having the following structures are polyimide precursors having an amic acid structure and an amic acid ester structure and an imide ring closure rate of less than 50%, and are also polybenzoxazole precursors having a hydroxyamide structure and a benzoxazole ring closure rate of less than 50%.

[0305]

[0306] The structures of the diamines (DA70), (DA71), (DA75) to (DA80), (DA82), (DA84), (DA86), (DA90), (DA92), (DA94), and (DA100) to (DA104) used in each synthesis example are shown below. These compounds were synthesized by known methods. The structures of the tetracarboxylic dianhydrides (AH1) and (AH2) used in each synthesis example are also shown below.

[0307]

[0308]

[0309] The amine residue derived from any of the diamines (DA70), (DA71), (DA75) to (DA80), (DA82), (DA84), (DA86), (DA90), (DA92), and (DA94) corresponds to the primary amine residue (DA1) and satisfies the above conditions (S1x), (S1y), and (S1z). Furthermore, the amine residue derived from any of the diamines (DA70), (DA71), (DA79), (DA86), and (DA94) has an asymmetric carbon atom that is an asymmetric center. The amine residue derived from any of the diamines (DA70), (DA71), (DA86), and (DA90) also satisfies the above condition (Y1). The amine residue derived from any of the diamines (DA75) to (DA80), (DA82), (DA84), (DA92), and (DA94) also satisfies the above-mentioned condition (Y3). The resins obtained in Synthesis Examples 42 to 45 using the diamines (DA86), (DA90), (DA92), and (DA94) are polyimide precursors having an amic acid structure and an amic acid ester structure and an imide ring closure rate of less than 50%, and are also polybenzoxazole precursors having a hydroxyamide structure and a benzoxazole ring closure rate of less than 50%. The resin obtained in Synthesis Example 31 using the diamine (DA94) is a polyimide having an imide structure and an imide ring closure rate of 50% or more, and is also a polybenzoxazole precursor having a hydroxyamide structure and a benzoxazole ring closure rate of less than 50%.

[0310] The amine residue derived from any of the diamines (DA100) to (DA104) corresponds to the (DA2) secondary amine residue. Furthermore, the amine residue derived from the diamine (DA100) has a spiro structure that is an asymmetric axis, and therefore satisfies the above conditions (S2x), (S2y), and (S2z). The amine residue derived from the diamine (DA101) satisfies the above conditions (S1x), (S1y), and (S1z). The amine residue derived from the diamine (DA101) has an asymmetric carbon atom that is an asymmetric center, and therefore also satisfies the above conditions (S2x) and (S2y). The amine residue derived from any of the diamines (DA102) to (DA104) satisfies the above conditions (S1x), (S1y), and (S1z).

[0311] The carboxylic acid residue derived from either the tetracarboxylic dianhydride (AH1) or (AH2) corresponds to the alicyclic structure-containing carboxylic acid residue (CB). The carboxylic acid residue derived from the tetracarboxylic dianhydride (AH1) has two ring atoms of the alicyclic structure bonded to a carbonyl group and two ring atoms of the alicyclic structure not bonded to a carbonyl group. The carboxylic acid residue derived from the tetracarboxylic dianhydride (AH1) also has a cyclohexane structure. The carboxylic acid residue derived from the tetracarboxylic dianhydride (AH2) has four ring atoms of the alicyclic structure bonded to a carbonyl group. The carboxylic acid residue derived from the tetracarboxylic dianhydride (AH2) also has a tetrahydronaphthalene structure.

[0312] In Synthesis Examples 3 to 17, 23, and 32 to 56, the amide acid structure in the resin was reacted with DFA as an esterifying agent, and the structure was converted to an amide acid ester structure having a methyl group.

[0313] In Synthesis Example 27, GMA having an epoxy group was reacted with the carboxy group derived from MAA in the resin, and all of the epoxy groups of GMA were subjected to ring-opening addition.

[0314]

[0315]

[0316]

[0317]

[0318]

[0319]

[0320] The structural units and structures of the resins obtained in each synthesis example and the resins used in each example, reference example, and comparative example are shown in Tables 2-1 to 2-4.

[0321]

[0322]

[0323]

[0324]

[0325] <Preparation Examples of Each Pigment Dispersion> The compositions of the pigment dispersions obtained in Preparation Examples Bk-1 to Bk-5 are summarized in Table 2-5. In Preparation Examples Bk-1 to Bk-5, each pigment dispersion was prepared by the following method. Table 2-5 also lists and describes the (D) colorant and (E) dispersant used in each Example, Reference Example, and Comparative Example.

[0326] Preparation Examples Bk-1 to Bk-5 Preparation of Pigment Dispersions (Bk-1) to (Bk-5) Based on the method described in paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261 and Preparation Example 1, a colorant described in Table 2-5 and ADP, a polyalkyleneamine-based polyoxyalkylene ether-based dispersant, were used as the dispersant, and a wet media dispersion treatment was carried out using a circulation system so that the average primary particle diameter of the pigment was the value described in Table 2-5. Then, filtration was carried out using a 0.80 μmφ filter to obtain pigment dispersions (Bk-1) to (Bk-5) with a solids concentration of 15% by mass and a colorant / dispersant ratio of 100 / 35 (by mass). The average primary particle diameter of the pigment in the obtained pigment dispersion is shown in Table 2-5. Table 2-5 also shows the average primary particle size of the pigment in the cured film (hereinafter referred to as "cured film") prepared by the method described in the Examples below, the crystallite size of the pigment in the pigment dispersion, and the crystallite size of the pigment in the cured film.

[0327]

[0328] <Synthesis Examples of Silica Particle Dispersions> Synthesis Example 30 Synthesis of Silica Particle (SP-1) Dispersion Based on the method described in paragraphs

[0132] to

[0134] and Synthesis Example 3 of WO 2022 / 196261, a dispersion of silica particles (SP-1) was obtained using MEK-ST-40 as the silica particle dispersion, KBM-503 as a surface modifier, and MOP as a polymerization inhibitor. The inorganic silica particles (SP-1) have methacryloyl groups as functional groups on the particle surface, a primary particle size distribution range of 10 to 16 nm, an average primary particle size of 12 nm, an aspect ratio range of 1.0 to 1.1, an average aspect ratio of 1.1, and a sodium content of 100 ppm by mass.

[0329] <Evaluation Methods in Each Example, Reference Example, and Comparative Example> The evaluation methods in each Example, Reference Example, and Comparative Example are as follows. A glass substrate (manufactured by Geomatec Co., Ltd.; hereinafter referred to as "ITO / Ag substrate") was prepared by sputtering a 100 nm film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) on glass, and then sputtering a 10 nm film of ITO on top of the APC layer. The glass substrate was then irradiated with UV-O for 100 seconds using a tabletop optical surface treatment device (PL16-110; manufactured by Sen Special Light Sources Co., Ltd.). ３ The substrates were washed before use. Tempax glass substrates (AGC Technoglass) were used without pretreatment. The other substrates were used after a dehydration bake treatment by heating at 130°C for 2 minutes using a hot plate (HP-1SA; AS ONE Corporation). The film thickness was measured using a surface roughness and contour shape measuring instrument (SURFCOM1400D; Tokyo Seimitsu Co., Ltd.) at a measurement magnification of 10,000x, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0330] (1) Weight average molecular weight of resin In measuring the weight average molecular weight of the above polyimides (PI-1) to (PI-3), polyimide precursors (PIP-1) to (PIP-16), polybenzoxazole (PB-1), polybenzoxazole precursors (PBP-1) to (PBP-3), and polyamideimide (PAI-1), a 0.10 mass% N-methyl-2-pyrrolidone solution of each resin was prepared and used as a measurement sample. Using a gel permeation chromatography (hereinafter "GPC") analyzer (Waters 2690; manufactured by Waters), lithium chloride and phosphoric acid were dissolved in N-methyl-2-pyrrolidone at 0.050 mol / L as a fluidized bed. The weight average molecular weight in terms of polystyrene was measured and determined. For other resins, the weight average molecular weight in terms of polystyrene was measured at around room temperature using a GPC analyzer (HLC-8220; manufactured by Tosoh Corporation) and tetrahydrofuran or N-methyl-2-pyrrolidone as the fluidized bed in accordance with JIS K7252-3 (2008).

[0331] (2) Imide Ring Closure Rate and Benzoxazole Ring Closure Rate of Resin Regarding the imide ring closure rate, each of the above resins was dissolved in GBL to a concentration of 35% by mass to prepare a resin solution. Each of the resulting resin solutions was applied to a silicon wafer using a spin coater (1H-DX; manufactured by Mikasa Co., Ltd.) and then baked at 120 ° C for 180 seconds to produce a resin film with a thickness of 4 to 5 μm. The prepared silicon wafer with the resin film was divided into two, and one of the two was heated in a clean oven (CLH-21CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) at 140 ° C for 30 minutes in a nitrogen atmosphere with an oxygen concentration of 20 ppm by mass or less, and then further heated to 320 ° C for 60 minutes to completely close the imide ring (resin film after heating). The other half was used as is without heat treatment (resin film before heating). Using an infrared spectrophotometer (FT-720; manufactured by Horiba, Ltd.), the transmission infrared absorption spectra of the resin film before and after heating were measured. The absorption peak of the imide structure due to polyimide (1,780 cm －１ Near 1,377 cm －１ After confirming the presence of 1,377 cm before heating, －１Peak intensity (X) near 1,377 cm after heating －１ The peak intensity (Y) around each of the points was determined. The imide ring closure rate in the resin film before heating was calculated using the following formula: Imide ring closure rate [%] = (X / Y) x 100.

[0332] Regarding the benzoxazole ring closure rate, a resin film with a thickness of 4 to 5 μm was prepared using the same method as above. The prepared silicon wafer with the resin film was divided into two, and one half was heated at 320°C for 30 minutes using a buzzer hot plate (HPD-3000BZN; manufactured by AS ONE Corporation) to completely close the benzoxazole ring (resin film after heating). The other half was used as is without being heated (resin film before heating). Using an infrared spectrophotometer (FT-720; manufactured by HORIBA, Ltd.), the transmission infrared absorption spectra of the resin film before and after heating were measured. The absorption peak (1,570 cm) of the benzoxazole structure due to polybenzoxazole was measured. －１ After confirming the presence of a peak due to C=C (C=N) stretching vibration near 1,570 cm before heating, －１ Peak intensity (P) near 1,570 cm after heating －１ The peak intensity (Q) around each peak was determined. The benzoxazole ring closure rate in the resin film before heating was calculated using the following formula: Benzoxazole ring closure rate [%] = (P / Q) x 100.

[0333] (3) Molar Ratio of Polyimide Units, etc. Each of the above resins was separated by GPC fractionation before use. Even when the resins were composed of resins with different structural units, they were also separated by GPC fractionation before use. Regarding the resins in the composition, whether they contained a single resin or resins with different structural units, the composition was extracted with dichloromethane, ultracentrifuged, and then the resins were separated from the dichloromethane-insoluble matter by GPC fractionation before use. Each resin was analyzed by methods such as proton nuclear magnetic resonance spectroscopy, infrared spectroscopy, pyrolysis-gas chromatography-mass spectrometry, and reactive pyrolysis-gas chromatography-mass spectrometry. From the measurement results, the structures of the polyimide unit (imide structure), polyimide precursor unit (amidic acid structure and amic acid ester structure), polybenzoxazole unit (benzoxazole structure), polybenzoxazole precursor unit (hydroxyamide structure), and polyamideimide unit (imide structure and amide structure), as well as the copolymerization monomers that constitute them, were determined. Next, each copolymerizable monomer was prepared as a standard sample, and peaks specific to each copolymerizable monomer were confirmed by proton nuclear magnetic resonance spectroscopy. Next, the molar ratio of each unit in the resin to the copolymerizable monomer constituting it was calculated from the area ratio of the peaks in the proton nuclear magnetic resonance spectroscopy spectrum of each resin.

[0334] (4) Content of specific compounds in the composition or cured film The contents of specific nitrogen-containing compounds, (I) phenolic compounds having a specific structure, and (J) crosslinkable aromatic compounds having a specific structure in the composition or cured film were measured by gas chromatography mass spectrometry and liquid chromatography mass spectrometry using calibration curves based on standard substances. The content relative to the total solid content of the composition was calculated from the obtained measured values ​​and the following formula: (Content of specific compounds relative to the total solid content of the composition) = (Content of specific compounds in the composition) × 100 / (Solid content concentration of the composition [mass %]).

[0335] (5) Content of specific elements in resin, composition, or cured film The contents of fluorine, chlorine, bromine, and sulfur elements in the resin, composition, or cured film were measured by combustion ion chromatography under the following measurement conditions. The resin and resin in the composition were used after separation by GPC fractionation or dichloromethane extraction, ultracentrifugation, and GPC fractionation using the method described in (3) above. The resin, composition, or cured film was burned and decomposed in the combustion tube of an analyzer, and the generated gas was absorbed in an absorption liquid. A portion of the absorption liquid was analyzed by ion chromatography. The absence of an element content indicates that the element was not detected. The content of each element relative to the total solid content of the composition was calculated using the measured value and the following formula. (Content of specific element in total solid content of composition) = (Content of specific element in composition) × 100 / (Solid content concentration of composition [mass %]) <Combustion and absorption conditions> System: AQF-2100H, GA-210 (manufactured by Mitsubishi Chemical Corporation) Electric furnace temperature: Inlet 900°C, Outlet 1000°C Gas: Ar / O ２ 200mL / min, O ２ 400 mL / min Absorption liquid: H ２ O ２ 0.1 mass% Absorption solution volume: 5 mL <Conditions for ion chromatography and anion analysis> System: ICS1600 (manufactured by DIONEX) Mobile phase: 2.7 mmol / L Na ２ CO ３ , 0.3 mmol / L NaHCO ３ Flow rate: 1.50 mL / min Detector: electrical conductivity detector Injection volume: 100 μL.

[0336] (6) Content of specific anions in resins, compositions, or cured films The contents of fluoride ions, chloride ions, bromide ions, and sulfur-based anions in resins, compositions, or cured films were measured by ion chromatography under the following measurement conditions. The resins and resins in the compositions were separated by GPC fractionation or by dichloromethane extraction, ultracentrifugation, and GPC fractionation using the method described in (3) above. The resins, compositions, or cured films were added to ultrapure water and shaken at room temperature to extract ionic components. The extract was treated with a solid-phase extraction cartridge and then analyzed for anionic components by ion chromatography. When anionic components could not be measured using the ion chromatography analysis condition 1 described below, they were measured using the ion chromatography analysis condition 2 described below. The absence of an ion content indicates that the ion was not detected. The content of each component relative to the total solid content of the composition was calculated using the measured values ​​and the following formula: (Content of specific anion in total solid content of composition) = (Content of specific anion in composition) × 100 / (Solid content concentration [mass %] of composition) <Ion chromatography analysis condition 1 (anion component)> Apparatus: IC-2010 (manufactured by Tosoh Corporation) Separation column: 4.6 mmφ × 100 mm, TSKgel Super IC-Anion HS Eluent: sodium bicarbonate Column temperature: 40°C Detector: electrical conductivity meter Sample injection volume: 250 μL <Ion chromatography analysis condition 2 (anion component)> Apparatus: IC-2010 (manufactured by Tosoh Corporation) Separation column: 4.6 mmφ × 100 mm, TSKgel Super IC-Anion HS Eluent: sodium carbonate / sodium bicarbonate Column temperature: 40°C Detector: electrical conductivity meter Sample injection volume: 250 μL.

[0337] (7) Water Content in Composition The water content in the composition was measured by volumetric titration in accordance with JIS K0113 (2005) using a Karl Fischer moisture meter (MKS-520; manufactured by Kyoto Electronics Manufacturing Co., Ltd.) and a Karl Fischer reagent as a titration reagent.

[0338] (8) Development Residue Using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation), the resolution pattern of the developed film prepared in each example was observed. As an index of development residue, the presence or absence of residue in a 20 μm line and space pattern was observed, and the area occupied by the residue in the opening was calculated. The evaluation was carried out as follows, and A+, A, B+, B, C+, and C, where the area of ​​residue was 20% or less, were considered to be acceptable. A+: No residue A: The area where residue is present is 3% or less B+: The area where residue is present is more than 3% but not more than 6% B: The area where residue is present is more than 6% but not more than 10% C+: The area where residue is present is more than 10% but not more than 15% C: The area where residue is present is more than 15% but not more than 20% D: The area where residue is present is more than 20% but not more than 50% E: The area where residue is present is more than 50% but not more than 100%.

[0339] (9) Light-shielding property (optical density value (hereinafter, "OD value")) A cured film of the composition was prepared on a Tempax glass substrate (manufactured by AGC Technoglass Co., Ltd.) by the method described in Example 1 below. The incident light intensity (I ) at three points on the surface of the prepared cured film was measured using a transmission densitometer (X-Rite 361T(V); manufactured by X-Rite Co., Ltd.). ０ The optical density (OD) per 1 μm of film thickness was calculated as an index of light-shielding ability using the following formula, and the average value of the OD values ​​at three points on the surface was calculated. OD value=log １０ (I ０ / I).

[0340] (10) Light-emitting characteristics of light-emitting element (low-voltage driving characteristics and light-emitting brightness) An organic EL display fabricated by the method described in Example 1 below was driven at a voltage gradually increasing from the low voltage side until the current density reached 30 mA / cm. ２ The voltage value and current density were plotted when the voltage value was changed sequentially from the low voltage side, and the value at a current density of 10 mA / cm was used as an index of low-voltage driving characteristics and luminance. ２The driving voltage at which the driving voltage was 4.5 V or less was determined. The evaluation was made as follows, and A+, A, B+, B, C+, and C, which gave driving voltages of 4.5 V or less, were rated as passing. A+: driving voltage 3.2 V or less A: driving voltage greater than 3.2 V and less than 3.5 V B+: driving voltage greater than 3.5 V and less than 3.7 V B: driving voltage greater than 3.7 V and less than 4.0 V C+: driving voltage greater than 4.0 V and less than 4.2 V C: driving voltage greater than 4.2 V and less than 4.5 V D: driving voltage greater than 4.5 V and less than 5.5 V E: driving voltage greater than 5.5 V or not measurable.

[0341] (11) Reliability of Light-Emitting Device An organic EL display prepared by the method described in Example 1 below was subjected to a current of 10 mA / cm ２ The device was driven with a direct current to emit light, and the device was observed for light emission defects such as non-emitting areas and uneven brightness. As a durability test, the device was heated to 80°C with the light extraction side facing up, and the wavelength was 365 nm and the illuminance was 0.6 mW / cm. ２ After 500 hours, the organic EL display was irradiated with light of 10 mA / cm ２ The light-emitting devices were driven by DC current and the light-emitting characteristics were observed for any changes. As an index of the reliability of the light-emitting device, the light-emitting area after the durability test was measured, with the light-emitting area before the durability test being taken as 100%. The evaluation was carried out as follows, and A+, A, B+, B, C+, and C, which indicate that the light-emitting area was 80% or more, were judged to be acceptable. A+: Light-emitting area is 100%. A: Light-emitting area is 97% or more but less than 100%. B+: Light-emitting area is 94% or more but less than 97%. B: Light-emitting area is 90% or more but less than 94%. C+: Light-emitting area is 85% or more but less than 90%. C: Light-emitting area is 80% or more but less than 85%. D: Light-emitting area is 60% or more but less than 80%. E: Light-emitting area is less than 60%.

[0342] (12) Migration Resistance (Insulation Reliability) A cured film of the composition was prepared to a thickness of approximately 1.5 μm on a migration evaluation substrate (WALTS-TEG ME0102JY; manufactured by Waltz Corporation) using the same method as the cured film preparation method described in Example 1 below. Next, an evaluation element was prepared by soldering a lead wire to the measurement terminals with 15 μm lines and 10 μm spaces in a line-and-space pattern of comb-shaped copper wiring. The insulation reliability of the prepared evaluation element under high temperature and high humidity conditions was evaluated using an insulation degradation characteristic evaluation system (ETAC SIR13; manufactured by Kusumoto Chemicals Co., Ltd.). The evaluation element was placed in a high-temperature, high-humidity chamber set at a temperature of 85°C and a humidity of 85% RH, and a voltage of 5.0 V was applied. The change in resistance over time was measured at 5-minute intervals. When the resistance value was 1.0 × 10 ６ When the resistance reached Ω or less, it was judged to be insulation failure, and the test time at that point was measured as an index of migration resistance. The evaluation was made as follows, and A+, A, B+, B, C+, and C, which were test times of 200 hours or more, were judged to be pass. A+: Test time was 1,000 hours or more A: Test time was 800 hours or more but less than 1,000 hours B+: Test time was 600 hours or more but less than 800 hours B: Test time was 400 hours or more but less than 600 hours C+: Test time was 300 hours or more but less than 400 hours C: Test time was 200 hours or more but less than 300 hours D: Test time was 50 hours or more but less than 200 hours E: Test time was less than 50 hours or measurement was impossible.

[0343] <Compounds used in each Example, Reference Example, and Comparative Example> The structures of the compounds used in each Example, Reference Example, and Comparative Example are shown below. These compounds were synthesized by known methods. (p-1) is a dissolution promoter. (i-1) to (i-5) are (I) phenol compounds having a specific structure. (j-1) and (j-2) are (J) crosslinkable aromatic compounds having a specific structure.

[0344]

[0345]

[0346]

[0347]

[0348]

[0349] Furthermore, compounds containing fluorine, chlorine, bromine, or sulfur (hereinafter referred to as "compounds containing specific elements"); specific nitrogen-containing compounds; and corresponding compounds used in each of the Examples, Reference Examples, and Comparative Examples are collectively shown in Tables 2-6.

[0350]

[0351] <Preparation of Photosensitive Compositions> Compositions 1 to 110 were prepared according to the formulations listed in Tables 3-1 to 3-10. In Tables 3-1 to 3-10, the values ​​in parentheses indicate the parts by mass of the solid content of each component. When a composition contained a pigment, a preparation not containing a pigment dispersion was first prepared, and then the pigment dispersion and the preparation were mixed to prepare the composition. A PGMEA / EL / GBL solvent (50 / 40 / 10 by mass ratio) was used to prepare the composition so that the solid content concentration of the composition was 20% by mass. The resulting composition solution was filtered through a 0.45 μm diameter filter before use. Compositions 45 to 56 were prepared in a similar manner, using a PGMEA / EDM / MBA solvent (70 / 20 / 10 by mass ratio).

[0352] Example 1 First, a method for preparing a cured film of the composition will be described. Composition 1 prepared on an ITO / Ag substrate was applied using a spin coater (MS-A100; manufactured by Mikasa Corporation), and then prebaked at 120°C for 120 seconds using a buzzer hotplate (HPD-3000BZN; manufactured by AS ONE Corporation) to prepare a prebaked film with a film thickness of approximately 1.8 μm. The prepared prebaked film was subjected to patterning exposure using a double-sided alignment single-sided exposure device (Mask Aligner PEM-6M; manufactured by Union Optical Co., Ltd.) with the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp through a grayscale mask for sensitivity measurement (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International). After exposure, the film was developed using a compact photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) with a 2.38 wt% TMAH aqueous solution and rinsed with water for 30 seconds to produce a developed film. The development time was 60, 90, or 120 seconds. If a pattern could not be formed after development with the 2.38 wt% TMAH aqueous solution, an exposed film was prepared in the same manner as above, and after exposure, the film was developed with cyclopentanone and rinsed with water for 30 seconds to produce a developed film. The development time was also 60, 90, or 120 seconds. The developed patterns for all films were observed, and the optimal exposure dose (value measured with an i-line illuminometer) capable of forming a space pattern with a 20 μm dimensional width corresponding to the openings in a 20 μm line-and-space pattern was determined from these results. The optimal development time and the optimal exposure dose for that development time were determined. After exposure at the optimum exposure dose and development for the optimum development time, the pattern was thermally cured at 200°C for 60 minutes using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) to produce a cured film with a film thickness of approximately 1.2 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 ppm by mass or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heat treatment was carried out at 200°C for 60 minutes, and then cooling to 50°C.

[0353] The cured film was analyzed using methods such as proton nuclear magnetic resonance spectroscopy, infrared spectroscopy, pyrolysis-gas chromatography-mass spectrometry, reactive pyrolysis-gas chromatography-mass spectrometry, liquid chromatography-mass spectrometry, and time-of-flight secondary ion mass spectrometry to analyze the structural units of the resins and the structures of the compounds contained in the cured film. It was confirmed that the cured film of Composition 1 contained the resins and compounds in Composition 1, as well as resins and compounds having structures derived from them, as follows: (XA1x) resin: polyimide (unit represented by formula (1)); polyimide precursor (unit represented by formula (2)); polybenzoxazole (unit represented by formula (3)); polybenzoxazole precursor (unit represented by formula (4)); (XA1y) resin: phenolic resin; (XC1x) compound: carboxylic acid containing an indene structure; carboxylic acid ester containing an indene structure; sulfonic acid containing an indene structure; sulfonic acid aryl ester containing an indene structure.

[0354] <Fabrication of an Organic EL Display (Having a Pixel Dividing Layer with Thick and Thin Film Portions)> Next, the fabrication method of the organic EL display will be described. Figure 2 shows a schematic diagram of the substrate used. First, a 100-nm-thick non-transparent conductive metal layer of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) was sputtered onto a 38 x 46 mm alkali-free glass substrate 47, and then patterned by etching to form an APC layer. A 10-nm-thick amorphous ITO film was then sputtered onto the APC layer as a transparent conductive oxide layer, and then patterned by etching to form a first electrode portion 48, which serves as a reflective electrode. At this time, an auxiliary electrode portion 49 for connecting the second electrode was also formed at the same time (Figure 2 (1)). The resulting electrode-attached substrate was ultrasonically cleaned for 10 minutes using "Semicoclean" (registered trademark) 56 (manufactured by Furuuchi Chemical Co., Ltd.) and then rinsed with ultrapure water. Next, Composition 1 was applied to this substrate and prebaked in the same manner as described above. It was then exposed to patterning through a photomask with a predetermined pattern, developed, rinsed, and then heated to thermally cure. The processing conditions were the optimal exposure dose and optimal development time measured in advance. The thermal curing conditions were also the same as described above. Using the above method, a pixel division layer 50 was formed in the effective area of ​​the substrate. The pixel division layer 50 had rectangular openings, each 70 μm wide and 70 μm long, arranged at a widthwise pitch of 175 μm and a lengthwise pitch of 175 μm, each exposing a first electrode (see (2) in Figure 2). The openings in this pixel division layer 50 ultimately become the light-emitting pixels of the organic EL display. The effective area of ​​the substrate was 16 mm square, and the pixel division layer 50 was formed to a thickness of approximately 1.5 μm. Composition 1 was then applied to the substrate on which the pixel division layer 50 had been formed and prebaked in the same manner as described above. It was then exposed to patterning through a photomask with a predetermined pattern, developed, rinsed, and then heated to thermally cure. The processing conditions were the optimal exposure dose and optimal development time measured in advance. The thermal curing conditions were also the same as those described above. Using this method, rectangular thick film portions with a width of 35 μm and a length of 35 μm were formed at multiple locations on the pixel dividing layer portion 50 that were not adjacent to the openings. The thick film portions were formed to a thickness of approximately 1.5 μm.

[0355] Next, an organic EL display was fabricated using the substrate on which the first electrode portion 48, the auxiliary electrode portion 49, and the pixel dividing layer portion 50 were formed. After nitrogen plasma treatment as a pretreatment, an organic EL layer portion 51 including a light-emitting layer was formed by vacuum deposition ((3) in FIG. 2). The degree of vacuum during deposition was 1×10 －３ The pressure was below 1 Pa, and the substrate was rotated relative to the evaporation source during evaporation. First, compound (HT-1) was evaporated to a thickness of 10 nm as a hole injection layer, and compound (HT-2) was evaporated to a thickness of 50 nm as a hole transport layer. Next, compound (GH-1) was evaporated as a host material to a thickness of 40 nm in the emitting layer, and compound (GD-1) was evaporated as a dopant material to a thickness of 40 nm so that the doping concentration was 10% by volume. Thereafter, compound (ET-1) and compound (LiQ) were laminated to a thickness of 40 nm at a volume ratio of 1:1 as electron transport materials. The compounds used in the organic EL layer (compounds (HT-1), (HT-2), (GH-1), (GD-1), (ET-1), and (LiQ)) were the same compounds as those described in paragraphs

[0599] to

[0600] of WO 2017 / 057281. Next, a compound (LiQ) was vapor-deposited to a thickness of 2 nm, followed by vapor-depositing MgAg (magnesium / silver = 10 / 1 (volume ratio)) to a thickness of 10 nm to form the second electrode portion 52, which is a transparent electrode ((4) in Figure 2). After that, in a low-humidity nitrogen atmosphere, a cap-shaped glass plate was attached using an epoxy resin adhesive to seal the substrate, and four 5 mm square top-emission organic EL displays were fabricated on one substrate. The film thickness here is the value displayed on a quartz crystal oscillator film thickness monitor.

[0356] Examples 2 to 104 and Comparative Examples 1 to 6: Using each composition shown in Tables 3-1 to 3-10, the same operations and evaluations as in Example 1 were carried out. The evaluation results are summarized in Tables 3-1 to 3-10. When a negative-tone photosensitive composition was used in each example, a prebaked film was prepared in the same manner as in Example 1, and spray-developed with a 2.38% by mass aqueous solution of TMAH or cyclopentanone. The time required for the prebaked film (unexposed area) to completely dissolve (Breaking Point; hereinafter, "BP") was measured, and the development time was set to 1.3 times the measured BP. A photomask with reversed light-transmitting and light-shielding areas was used, and after exposure at an optimal exposure dose, the developed pattern was thermally cured at 200°C for 60 minutes. The sulfur element content and sulfur-based anion content were measured only in Examples 45 to 56.

[0357]

[0358]

[0359]

[0360]

[0361]

[0362]

[0363]

[0364]

[0365]

[0366]

[0367] In Comparative Examples 1 to 4, the content of elemental fluorine in the total solid content of the composition does not satisfy the requirements for the composition of the present invention. In Comparative Examples 5 and 6, the content of elemental fluorine in the structure of the (A1x) resin is high, and the content of elemental fluorine in the total solid content of the composition exceeds the preferred range. Therefore, Comparative Examples 1 to 6 are inferior in various properties.

[0368] Example 105: Fabrication of an Organic EL Display An organic EL display was fabricated by the method described in Example 1, except that the thin film portion of the pixel dividing layer was fabricated using composition 47 instead of composition 1, and the thick film portion of the pixel dividing layer was formed using composition 51. The results of evaluating various properties in the same manner as in Example 1 are summarized in Table 3-11. The structural units of the resins and the structures of the compounds contained in the thin film portion and the thick film portion were analyzed using the same method. The thin film portion and the thick film portion each contained the resin and compound in composition 47 or composition 51, as well as resins and compounds having structures derived from them, as shown below. The OD value per μm of film thickness, which is an index of the light-blocking ability of the thin film portion, was 0.9. Thin film portion: (XA1x) Resin: Polyimide; Polybenzoxazole; Polybenzoxazole precursor (XA1y) Resin: Phenol resin (XC2x) Compound: Compound having a fluorene structure in which an imino group is bonded to the fluorene structure (XD) Colorant: Benzofuranone-based black pigment Thick film portion: (XA1x) Resin: Polyimide; Polybenzoxazole; Polybenzoxazole precursor (XA1y) Resin: Phenol resin (XC2x) Compound: Compound having a fluorene structure in which an imino group is bonded to the fluorene structure.

[0369] Example 106: Fabrication of Organic EL Display (Processing Thick and Thin Film Portions Simultaneously) An organic EL display was fabricated using the method described in Example 1, except that a cured film of Composition 43 was formed as the pixel dividing layer portion 50 using a method for processing a stepped shape simultaneously using a halftone photomask having a predetermined pattern. The pixel dividing layer portion 50 was formed to have a thick film portion with a thickness of approximately 3.0 μm and a thin film portion with a thickness of approximately 1.5 μm. The results of evaluating various properties in the same manner as in Example 1 are summarized in Table 3-11. Using the same method, the structural units of the resins and the structures of the compounds contained in the thin film portion and the thick film portion were analyzed. The thin film portion and the thick film portion each contained the resin and compound in Composition 43, as well as resins and compounds having structures derived from them, as shown below. In other words, the thin film portion and the thick film portion obtained by curing Composition 43 contained the same compounds. Furthermore, the OD value per μm of film thickness, which is an index of the light-blocking ability of the thin film portion and the thick film portion, was both 0.9. (XA1x) resin: polyimide (units represented by formula (1)); polyimide precursor (units represented by formula (2)); polybenzoxazole (units represented by formula (3)); polybenzoxazole precursor (units represented by formula (4)) (XA1y) resin: phenolic resin (XC1x) compound: carboxylic acid having an indene structure; carboxylic acid ester having an indene structure; sulfonic acid having an indene structure; sulfonic acid aryl ester having an indene structure (XD) colorant: C.I. Acid Red 52; C.I. Basic Blue 7; C.I. Solvent Red 18 Other compounds: 1,2,4-trihydroxybenzene; structure represented by formula (12) Compounds having a specific crosslinked structure (structure represented by formula (12) and quinone structure of the structure represented by formula (12)).

[0370]

[0371] <Storage Stability of Photosensitive Composition> Each of the compositions prepared in Examples 1 to 104 was stored at 25°C for one week. After storage, the composition was formed into a film on a substrate in the same manner as in Example 1. As a result, no foreign matter was generated, and the storage stability was good. Meanwhile, Compositions 105 to 110 prepared in Comparative Examples 1 to 6, in which the fluorine content relative to the total solid content of the photosensitive composition exceeded 1,000 ppm by mass, were similarly stored at 25°C for one week. After storage, the composition was similarly formed into a film on a substrate. As a result, a large amount of foreign matter was generated, and the storage stability was poor.

[0372] 47 Alkali-free glass substrate 48 First electrode portion 49 Auxiliary electrode portion 50 Pixel division layer portion 51 Organic EL layer portion including light-emitting layer 52 Second electrode portion 100A Display device in which pixel division layer has a stepped shape having a thick film portion and a thin film portion 101 Substrate 102 Metal wiring 103 TFT element layer 104 Interlayer insulating layer 105 TFT planarizing layer / TFT protective layer 106 Stepped pixel division layer 106a Thin film portion in pixel division layer portion 107 First electrode 108 Light-emitting layer 109 Second electrode 110 Sealing layer 111 Touch panel wiring / touch panel electrode 112 Color filter layer 113 Black matrix layer 114 Overcoat layer 115 Substrate 116 Thick film portion in pixel division layer 100x Cross-sectional axis in plan view 112a Color filter layer portion 116a: Thick film portion in pixel dividing layer portion 117a: Step-shaped opening in pixel dividing layer portion 118a: Opening in black matrix layer portion

Claims

1. One or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof, the resin having (DA1) a primary amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) primary amine residue having at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, and (IIa) structure: a structure connecting at least two of the (Ia) structures, the (IIa) structure being a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a urethane bond, a carbonate bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and satisfying the following condition (P1a): (P1a) The content of fluorine elements in the structure of the resin is 10,000 ppm by mass or less.

2. The resin according to claim 1, wherein the primary amine residue (DA1) has an amine residue that satisfies the following condition (S1x): (S1x) the molecular symmetry of the amine residue is C １ Having an axis of symmetry and C ２ It has no axis of symmetry.

3. The resin according to claim 1, further comprising (DA2) a secondary amine residue: an amine residue having no phenolic hydroxyl group, and satisfying the following condition (α1) and / or condition (α2): the total content ratio of the (DA1) primary amine residue in all amine residues in the resin is 20 mol% or more and 90 mol% or less, and the total content ratio of the (DA2) secondary amine residue in all amine residues in the resin is 10 mol% or more and 80 mol% or less: (α1) the (DA2) secondary amine residue has at least two (Ib) structures: a cyclic structure having no phenolic hydroxyl group, and (IIb) structure: a structure connecting at least two (Ib) structures, The (IIb) structure is a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a urethane bond, a carbonate bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. (α2) The (DA2) secondary amine residue has a (IIIb) structure: a silicone structure and / or a siloxane structure.

4. The resin according to claim 3, wherein the primary amine residue (DA1) has an amine residue satisfying the following condition (S1x), and / or the secondary amine residue (DA2) has an amine residue satisfying at least one of the following conditions (S1x) and (S2x): １ Having an axis of symmetry and C ２ The (S2x) amine moiety does not have an axis of symmetry, but has at least one of an asymmetric center, an asymmetric axis, an asymmetric plane, and a helical axis.

5. The resin according to claim 2, wherein the resin has polyimide units and polyimide precursor units, the content of the polyimide units in the total of the polyimide units and the polyimide precursor units is 1.0 mol % or more and 30 mol % or less, and the content of the amic acid ester structures in the total of the amic acid structures and amic acid ester structures in the polyimide precursor units is 40 mol % or more and 99 mol % or less.

6. The resin according to claim 2, wherein the resin has polyimide units and / or polyimide precursor units, and the resin has one or more units selected from the group consisting of polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units, and the total content of polybenzoxazole units, polybenzoxazole precursor units, polyamideimide units, and polyamideimide precursor units in the resin is 10 mol % or more and 90 mol % or less.

7. The resin according to claim 2, further satisfying at least one of the following conditions (P1b), (P1c), and (P1d): (P1b) the content of chlorine element in the structure of the resin is 30,000 mass ppm or less; (P1c) the content of bromine element in the structure of the resin is 30,000 mass ppm or less; (P1d) the content of sulfur element in the structure of the resin is 30,000 mass ppm or less.

8. A photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, and further comprising (B) a radical polymerizable compound and / or (F) a crosslinking agent, wherein the (A) binder resin comprises the resin described in claim 2.

9. The photosensitive composition according to claim 8, wherein the (A) binder resin, the (C) photosensitizer, the (B) radical polymerizable compound, or the (F) crosslinking agent has a fluorine atom, a chlorine atom, a bromine atom, a fluoride ion, a chloride ion, or a bromide ion in its structure, or the photosensitive composition further contains a component containing a fluorine element, a chlorine element, or a bromine element and / or a component containing a fluoride ion, a chloride ion, or a bromide ion, and the photosensitive composition satisfies the following condition (P1x) and the following condition (1x): (P1x) the total content of fluorine element, chlorine element, and bromine element in the structure of the resin is 30,000 ppm by mass or less; (1x) the total content of fluorine element, chlorine element, and bromine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

10. A photosensitive composition comprising (A) a binder resin and (C) a photosensitizer, and further comprising (B) a radical polymerizable compound and / or (F) a crosslinking agent, wherein the (A) binder resin comprises (Ax) a resin: one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof, the (Ax) resin having (DA1) a primary amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) primary amine residue having at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, and (IIa) structures: a structure connecting at least two of the (Ia) structures, The (IIa) structure is a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a urethane bond, a carbonate bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and the photosensitive composition satisfies the following condition (1a): (1a) the content of elemental fluorine in the total solid content of the photosensitive composition is 1,000 ppm by mass or less.

11. The photosensitive composition according to claim 10, wherein the (A) binder resin, the (C) photosensitizer, the (B) radical polymerizable compound, or the (F) crosslinking agent has a chlorine atom, a bromine atom, a sulfur atom, a chloride ion, a bromide ion, or the following sulfur-based anion in the structure, or further contains a component containing a chlorine element, a bromine element, or a sulfur element and / or a component containing a chloride ion, a bromide ion, or the following sulfur-based anion, and satisfies at least one of the following conditions (1b), (1c), and (1d): Sulfur-based anion: one or more ions selected from the group consisting of sulfide ions, hydrogen sulfide ions, sulfate ions, and hydrogen sulfate ions (1b) The content of chlorine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less. (1c) the content of bromine element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less; and (1d) the content of sulfur element in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 1,000 ppm by mass or less.

12. The photosensitive composition according to any one of claims 8 to 11, further comprising a phenolic compound (I), the phenolic compound (I) satisfies the following condition (β1) and also satisfies the following condition (5): (β1) having at least two of the following (Ic) structures and the following (IIIc) structure: Structure (Ic): a cyclic structure having a phenolic hydroxyl group Structure (IIIc): a structure connecting at least two of the (Ic) structures, the structure being a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a urethane bond, a carbonate bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. (5) The total content of the phenol compounds (I) in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 10,000 ppm by mass or less.

13. The photosensitive composition according to any one of claims 8 to 11, further comprising one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrene, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins.

14. The photosensitive composition according to any one of claims 8 to 11, wherein the photosensitizer (C) contains a compound having a 1,2-naphthoquinone diazide-5-sulfonic acid ester structure and a compound containing a 1,2-naphthoquinone diazide-4-sulfonic acid ester structure.

15. The photosensitive composition according to any one of claims 8 to 11, further containing water and satisfying the following condition (3): (3) The content of water in the photosensitive composition is 0.010 mass % or more and 3.0 mass % or less.

16. The photosensitive composition according to any one of claims 8 to 11, further comprising (H) a nitrogen-containing compound, the nitrogen-containing compound (H) comprising one or more compounds selected from the group consisting of cyclic amide compounds, amide compounds, cyclic urea compounds, urea compounds, oxazolidone compounds, and isoxazolidone compounds, and the photosensitive composition satisfies the following condition (4): (4) The total content of the cyclic amide compounds, amide compounds, cyclic urea compounds, urea compounds, oxazolidone compounds, and isoxazolidone compounds in the total solid content of the photosensitive composition is 0.010 mass% or more and 5.0 mass% or less.

17. The photosensitive composition according to any one of claims 8 to 11, further comprising a crosslinkable aromatic compound (J), the crosslinkable aromatic compound having at least two (Id) structures: cyclic structures having a phenolic hydroxyl group and at least two crosslinkable groups bonded thereto, and at least two (IId) structures: cyclic structures having a phenolic hydroxyl group different from the (Id) structures, and further having a (IIId) structure: a structure connecting at least two of the (IId) structures, and satisfying the following condition (6): (6) the total content of the (J) crosslinkable aromatic compound in the total solid content of the photosensitive composition is 0.010 ppm by mass or more and 5,000 ppm by mass or less.

18. A cured product obtained by curing the photosensitive composition according to any one of claims 8 to 11.

19. A display device comprising the cured product according to claim 18.

20. An electronic part comprising the cured product according to claim 18.

21. A method for producing a cured product, comprising the steps of: (1) forming a coating film of the photosensitive composition according to any one of claims 8 to 11 on a substrate; (2) irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) developing the coating film with a developer to form a pattern of the photosensitive composition; and (4) heating the pattern of the photosensitive composition to obtain a cured pattern of the photosensitive composition.

22. A display device having a substrate, a first electrode, a second electrode, a pixel dividing layer, a light emitting layer, and a TFT planarizing layer, the pixel dividing layer and / or the TFT planarizing layer containing one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, and copolymers thereof, the resin containing an amine residue having a phenolic hydroxyl group, the amine residue having a phenolic hydroxyl group containing at least two (XIa) structures: a cyclic structure having a phenolic hydroxyl group, and a (XIIa) structure: a structure connecting at least two of the (XIa) structures, The display device, wherein the (XIIa) structure is a sulfonyl group, an alkylene group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a urethane bond, a carbonate bond, a cycloalkylene group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, and which satisfies the following condition (X1a): (X1a) the content of fluorine element in the pixel dividing layer is 1,000 ppm by mass or less, and / or the content of fluorine element in the TFT planarizing layer is 1,000 ppm by mass or less.

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