Component mounting system

Abstract

This component mounting system (10) comprises: a mounting head (24) for mounting a component on a substrate to which solder is applied; a heat ray head (43) for irradiating the solder with heat rays after the component is mounted; a camera (45) for capturing an image of the solder in parallel with the irradiation of heat rays; a training unit (53) for generating a trained model that receives an input of an image of solder and outputs the quality of soldering; a determination unit (52) for inputting the image of solder captured by the camera (45) to the trained model to determine whether or not soldering is of good quality; and a control unit (51) for stopping the irradiation of heat rays when it is determined that soldering is of good quality.

Description

Component Mounting System

[0001] The present disclosure relates to a component mounting system.

[0002] In the technical field related to component mounting systems, a production system such as that disclosed in Patent Document 1 is known.

[0003] Japanese Patent Application Publication No. 2023-026021

[0004] The boards on which components are mounted may have low heat resistance, such as resin boards. When soldering components to boards with low heat resistance, a local heating method is used. In such cases, a heat ray such as a laser is typically used for soldering. The cream solder applied to the board in advance melts, forming a fillet on the component's electrodes, soldering the component to the board. Maintaining a high temperature for a long time to ensure a secure soldering can damage the board. The temperature rise during heat ray irradiation varies depending on the size of the board's pads and the component's leads, making it difficult to control. Therefore, point-detection temperature sensors are used to manage the temperature, but they do not allow for control of the overall melting state of the solder. Failure to properly manage the melting state of the solder can result in a deterioration in the quality of the soldering.

[0005] The present disclosure aims to suppress deterioration in soldering quality.

[0006] The component mounting system according to the present disclosure includes a mounting head that mounts components on a board to which solder has been applied, a heat ray head that irradiates the solder with a heat ray after the components have been mounted, a camera that images the solder in parallel with the irradiation of the heat ray, a learning unit that generates a learning model that takes the image of the solder as input and outputs the quality of the soldering, a judgment unit that inputs the image of the solder taken by the camera into the learning model and judges whether the soldering is of good quality, and a control unit that stops the irradiation of the heat ray when it is judged that the soldering is of good quality.

[0007] According to the present disclosure, deterioration of soldering quality is suppressed.

[0008] FIG. 1 is a perspective view showing a substrate and components according to an embodiment. FIG. 2 is a perspective view showing a pallet that holds a substrate according to an embodiment. FIG. 3 is an exploded perspective view showing a substrate and pallet according to an embodiment. FIG. 4 is a diagram schematically showing a component mounting system according to an embodiment. FIG. 5 is a plan view schematically showing a mounting apparatus according to an embodiment. FIG. 6 is a perspective view showing a pallet and a stage according to an embodiment. FIG. 7 is an exploded perspective view showing a pallet and a stage according to an embodiment. FIG. 8 is a diagram schematically showing a mounting head according to an embodiment. FIG. 9 is a diagram schematically showing a laser irradiation device according to an embodiment. FIG. 10 is a diagram schematically showing a portion of a substrate on which components according to an embodiment are mounted. FIG. 11 is a block diagram showing a laser irradiation device according to an embodiment. FIG. 12 is a hardware configuration diagram of a controller according to an embodiment. FIG. 13 is an example of machine learning according to an embodiment and use of the learning results. FIG. 14 is an example of an image for learning and judgment according to an embodiment.

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis of the predetermined plane, which is perpendicular to the X axis, is defined as the Y-axis direction. The direction parallel to the Z axis, which is perpendicular to the predetermined plane, is defined as the Z-axis direction. The direction of rotation or tilt around the X-axis direction is defined as the θX direction. The direction of rotation or tilt around the Y axis direction is defined as the θY direction. The direction of rotation or tilt around the Z axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the −Z side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Furthermore, in the embodiments, the predetermined plane including the X axis and the Y axis is referred to as the XY plane as appropriate.

[0010] [Substrate] Fig. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0011] An electric circuit is provided on the surface of the substrate 1. In this embodiment, the substrate 1 is formed by in-mold molding technology. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes the electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0012] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0013] [Pallet] Fig. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing the substrate 1 and pallet 3 according to an embodiment. The pallet 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while held by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0014] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0015] The base portion 4A is formed in the shape of a plate having a plurality of openings. Two holes 4D are formed in the base portion 4A. The holes 4D penetrate the top and bottom surfaces of the base portion 4A.

[0016] The guard portion 4B is formed to extend in the X-axis direction. A pair of guard portions 4B is provided. The pair of guard portions 4B are spaced apart in the Y-axis direction. One guard portion 4B is arranged to protrude toward the +Z side from the +Y side end of the upper surface of the base portion 4A. The other guard portion 4B is arranged to protrude toward the +Z side from the -Y side end of the upper surface of the base portion 4A.

[0017] Each of the multiple pin portions 4C is arranged so as to protrude from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the +Y side of the substrate 1. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the -Y side of the substrate 1.

[0018] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the end of the substrate 1 on the -X side, and a movable part 5B that supports the end of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, thereby sandwiching the substrate 1 between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0019] [Component Mounting System] Fig. 4 is a diagram schematically illustrating a component mounting system 10 according to an embodiment. As shown in Fig. 4, the component mounting system 10 includes a mounting device 12, a preheating device 13, and a laser irradiation device 14. The mounting device 12, the preheating device 13, and the laser irradiation device 14 form a production line for electronic devices.

[0020] The mounting device 12 mounts the components 2 on the substrate 1. At least one mounting device 12 is provided in the production line. However, a plurality of mounting devices 12 may be provided.

[0021] 5 is a plan view schematically illustrating a mounting apparatus 12 according to an embodiment. The mounting apparatus 12 includes a base member 18, a transport device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a board camera 25, a height sensor 26, a head moving device 27, and a chamber 29.

[0022] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , and the head moving device 27 .

[0023] The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to a processing position of the mounting device 12. The processing position is defined by the transport path of the transport device 19.

[0024] The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0025] The guide member 19B is formed to extend in the X-axis direction. A pair of guide members 19B is provided. The pair of guide members 19B are spaced apart from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0026] The conveyor belt 19A is formed in a ring shape. A pair of conveyor belts 19A is provided. The conveyor belts 19A are supported by guide members 19B via a drive pulley and a driven pulley. The conveyor belts 19A are looped around the drive pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0027] Of the pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the underside of the pallet 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the pallet 3 in the X-axis direction.

[0028] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0029] Fig. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. Fig. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0030] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side when it is transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into the holes 4D of the pallet 3. The stage 20 and the pallet 3 are positioned by inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hooked onto the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hooked onto the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is transported to the processing position by the transport device 19, the +Y side guide member 19B moves in the +Y direction away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. When the +Y side guide member 19B moves in the Y axis direction away from the other guide member 19B, support of the pallet 3 by the transport belt 19A is released. When support of the pallet 3 by the transport belt 19A is released and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the transport device 19 to the stage 20. With the pallet 3 supported on the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is centered between the two guide members 19B, making it possible to move the stage 20 in each of the Z axis direction, the θX direction, and the θY direction.

[0033] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 is on the transport belt 19A, and the guide member 19B on the +Y side moves in the -Y side until the other side of the pallet 3 is on the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released from fixation, the stage 20 moves in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0034] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supply device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Note that the component supply devices 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0035] The mounting head 24 mounts components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 in both the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. Operation of the X-axis moving device 27X causes the mounting head 24 to move in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. Operation of the Y-axis moving device 27Y causes the X-axis moving device 27X to move in the Y-axis direction, thereby moving the mounting head 24 in the Y-axis direction.

[0037] FIG. 8 is a schematic diagram showing a mounting head 24 according to an embodiment. As shown in FIG. 8 , the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is formed at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact, a suction operation is performed through the opening provided at the lower end of the nozzle 23, thereby suction-holding the component 2 at the lower end of the nozzle 23. When the suction operation through the opening is released, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that clamps and holds the component 2.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in both the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to the plurality of shafts 23A, respectively. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to the plurality of shafts 23A, respectively. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0039] The nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. By moving the nozzle 23, the component 2 held by the nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0040] The board camera 25 images the board 1. In the embodiment, the board camera 25 images the surface of the board 1 from the +Z side of the board 1. The board camera 25 is provided on the mounting head 24. The board camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The board camera 25 can image alignment marks provided on the surface of the board 1.

[0041] The height sensor 26 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is provided on the mounting head 24. The height sensor 26 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. In the embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 can detect the distance from the mounting head 24 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0042] The chamber 29 forms an internal space that accommodates the base member 18, the transport device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, and the nozzle moving device 28.

[0043] In the embodiment, the mounting device 12 has a dispenser 34 that applies cream solder to the board 1. The dispenser 34 moves in each of the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transport device 19. The dispenser 34 and the mounting head 24 are movable separately. After the cream solder is applied to the surface of the board 1 by the dispenser 34, the mounting head 24 mounts the components 2 on the board 1 that has been applied with the cream solder. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

[0044] The preheating device 13 reduces the liquid component of the cream solder applied to the substrate 1. The cream solder contains flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by activating the flux and vaporizing at least a portion of the liquid component.

[0045] The preheating device 13 includes a base member 35 , a transport device 36 for transporting the pallet 3 , a heater 37 for heating the substrate 1 , and a chamber 38 .

[0046] The base member 35 supports a conveying device 36. The conveying device 36 conveys the pallet 3 holding the substrate 1 in the X-axis direction. The conveying device 36 has a conveying belt 36A that conveys the pallet 3 and a guide member 36B that guides the pallet 3.

[0047] The heater 37 heats the substrate 1 so that at least a part of the liquid component of the flux of the cream solder is vaporized.

[0048] The chamber 38 forms an internal space in which the base member 35, the transport device 36, and the heater 37 are housed.

[0049] Preheating device 13 heats substrate 1 held on pallet 3 so as to reduce the liquid component of the cream solder. Preheating device 13 heats substrate 1 at a temperature lower than the melting point of the cream solder. Preheating device 13 heats substrate 1 for 10 minutes, for example, at a temperature of 80°C or higher and 100°C or lower. Substrate 1 preheated by preheating device 13 is transported to laser irradiation device 14 while fixed to pallet 3.

[0050] The laser irradiation device 14 irradiates the cream solder with laser light so as to melt the cream solder. The laser irradiation device 14 includes a base member 39, a transport device 40 that transports the pallet 3, a stage 41 that supports the pallet 3, a stage moving device 42 that moves the stage 41, a laser head 43 that emits laser light, a fillet camera 45 that images the substrate 1, and a chamber 44.

[0051] The base member 39 supports the transport device 40 , the stage 41 , the stage moving device 42 , and the laser head 43 .

[0052] The conveying device 40 conveys the pallet 3 holding the substrate 1 in the X-axis direction. The conveying device 40 has a conveying belt 40A that conveys the pallet 3 and a guide member 40B that guides the pallet 3. The structure and function of the conveying device 40 are substantially the same as the structure and function of the conveying device 19.

[0053] The stage 41 supports the pallet 3 from the -Z side. The stage movement device 42 moves the stage 41 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 41 are substantially the same as the structure and function of the stage 20.

[0054] After the mounting head 24 mounts the component 2 on the board 1 via the cream solder, the laser head 43 irradiates the cream solder with laser light. The laser head 43 irradiates the cream solder with laser light to melt the cream solder. The laser head 43 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the conveying device 40. The laser head 43 is an example of a hot ray head. The laser light emitted from the laser head 43 is an example of a hot ray.

[0055] The fillet camera 45 captures an image of the substrate 1. The fillet camera 45 captures an image of at least the cream solder. In the embodiment, the fillet camera 45 captures an image of the surface of the substrate 1 from the +Z side of the substrate 1. The fillet camera 45 is provided on the laser head 43. The fillet camera 45 moves in the X-axis direction, the Y-axis direction, and the Z-axis direction together with the laser head 43.

[0056] The chamber 44 forms an internal space in which the base member 39, the transport device 40, the stage 41, the stage moving device 42, and the laser head 43 are housed.

[0057] [Laser Irradiation Apparatus] Fig. 9 is a diagram schematically showing a laser irradiation apparatus 14 according to an embodiment. Fig. 10 is a diagram schematically showing a part of a substrate 1 on which a component 2 according to an embodiment is mounted.

[0058] The stage 41 of the laser irradiation device 14 supports the pallet 3 holding the substrate 1. The substrate 1 is supported by the stage 41 via the pallet 3. The stage 41 is rotatable about a rotation axis Rm.

[0059] Component 2 is mounted on substrate 1 via cream solder 90. As shown in Fig. 10, component 2 has a main body portion 2A and an electrode portion 2B. Substrate 1 has pads 1C. Electrode portion 2B and pads 1C are soldered together with cream solder 90.

[0060] In the laser irradiation device 14, the cream solder 90 is irradiated with laser light emitted from the laser head 43. The cream solder 90 is heated by the laser light and melts. The melted cream solder 90 is cooled, and a fillet is formed between the electrode portion 2B and the pad 1C, thereby soldering the component 2 to the board 1. The fillet is a portion where solder is piled up on the surface of the board 1.

[0061] In the embodiment, the cream solder 90 is irradiated with laser light after the liquid component of the cream solder 90 is reduced in the preheating device 13. Since the cream solder 90 is irradiated with laser light in a state in which the liquid component of the cream solder 90 is reduced, solder balls due to bumping of the cream solder 90 are suppressed.

[0062] The fillet camera 45 is fixed to the laser head 43. The fillet camera 45 captures an image of the cream solder 90 provided on the surface of the substrate 1. The fillet camera 45 captures an image of the cream solder 90 in parallel with the irradiation of the cream solder 90 with laser light. That is, the fillet camera 45 captures an image of the cream solder 90 at least during the period in which the laser light is being emitted from the laser head 43. The fillet camera 45 captures an image of the cream solder 90 while the cream solder 90 is being irradiated with laser light.

[0063] If the cream solder 90 is irradiated with laser light for a long period of time in order to ensure reliable soldering, there is a possibility that the board 1 will be damaged. If the cream solder 90 is not irradiated with laser light insufficiently, the quality of the soldering may be reduced. In other words, if the cream solder 90 is not irradiated with laser light insufficiently, there is a possibility that the board 1 and the component 2 will not be sufficiently soldered. Conventionally, the melted state of the cream solder 90 has been controlled by a point detection temperature sensor, but the method using a temperature sensor can only control the melted state of a localized portion of the cream solder 90.

[0064] In the embodiment, the melted state of the cream solder 90 is managed based on an image of the cream solder 90. Specifically, the irradiation time of the laser light is managed based on the image of the cream solder 90. According to the embodiment, the melted state of the entire solder is managed, so that damage to the substrate 1 can be suppressed while deterioration of the soldering quality can be suppressed.

[0065] 11 is a block diagram showing the laser irradiation device 14 according to the embodiment. The laser irradiation device 14 includes a laser head 43, a fillet camera 45, and a controller 16. The controller 16 controls the laser irradiation device 14.

[0066] FIG. 12 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 has a processor 47 such as a CPU (Central Processing Unit), a main memory 48 including a nonvolatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 49, and an interface 50 including an input / output circuit. The functions of the controller 16 are stored in the storage 49 as a computer program. The processor 47 reads the computer program from the storage 49, loads it into the main memory 48, and executes predetermined processing in accordance with the computer program. The computer program may be distributed to the controller 16 via a network.

[0067] 11 , an inspection device 15 is connected to the laser irradiation device 14. The controller 16 can communicate with the inspection device 15. The inspection device 15 includes a board appearance inspection device (AOI: Automated Optical Inspection) that inspects the state of the board 1 after the components 2 have been soldered. The inspection device 15 can inspect the quality of the soldering.

[0068] In an embodiment, the quality of soldering includes the fillet shape of the cream solder 90. The inspection device 15 inspects the fillet shape. As described above, the cream solder 90 is melted by irradiating it with laser light from the laser head 43. The melted cream solder 90 is cooled, forming a fillet of the cream solder 90. The quality of soldering can be evaluated by the fillet shape. If the fillet shape is good (matches the target shape), the soldering is evaluated as good. If the fillet shape is poor (different from the target shape), the soldering is evaluated as poor. The inspection results of the inspection device 15 are sent to the controller 16.

[0069] The controller 16 includes a control unit 51 , a fillet formation determination unit 52 , and a machine learning unit 53 .

[0070] The control unit 51 controls the laser head 43. The control unit 51 controls the laser oscillation. The control unit 51 can control the irradiation time of the laser light.

[0071] The fillet formation determination unit 52 determines whether the soldering is of good quality based on the image of the cream solder 90 captured by the fillet camera 45. That is, the fillet formation determination unit 52 determines whether the fillet shape of the cream solder 90 is of good quality based on the image of the cream solder 90 captured by the fillet camera 45.

[0072] The machine learning unit 53 receives an image of the cream solder 90 as an input and generates a learning model that outputs the quality of soldering. The machine learning unit 53 receives an image of the cream solder 90 in a molten state and the inspection results of the inspection device 15 as training data, for example, and generates a learning model that receives an image of the cream solder 90 in a molten state and outputs the fillet shape of the cream solder 90.

[0073] The fillet formation determination unit 52 inputs an image of the cream solder 90 in a molten state (a state in which laser light is being irradiated) captured by the fillet camera 45 into the learning model and determines whether the soldering is of good quality. That is, the fillet formation determination unit 52 predicts the fillet shape after the cream solder 90 has cooled based on the image of the cream solder 90 in a molten state (a state in which laser light is being irradiated) and the learning model, and determines whether the predicted fillet shape is of good quality.

[0074] The control unit 51 stops the irradiation of the laser light when the fillet formation determination unit 52 determines that the soldering is of good quality, thereby suppressing excessive irradiation of the laser light, that is, suppressing damage to the substrate 1 and suppressing deterioration in the quality of the soldering.

[0075] [Operation of Laser Irradiation Device] An example of the operation of the laser irradiation device 14 will be described below. Fig. 13 is a flowchart showing the operation of the laser irradiation device 14 according to the embodiment. Fig. 14 is a diagram schematically showing the state of a fillet according to the embodiment. Fig. 14 shows an example of a learning image and a determination image according to the embodiment.

[0076] The fillet camera 45 can capture video. The machine learning unit 53 extracts images from a video of fillet formation when a laser beam is irradiated onto the cream solder 90, as shown in FIG. 14, and labels the extracted images with the state of the fillet (step S1). The labels attached to the images include a label indicating the fillet "before formation" and a label indicating the fillet "after formation." For example, the machine learning unit 53 may label an image taken just before the end of soldering under normal time management as "after formation," and label an image taken just before the end as "before formation."

[0077] The machine learning unit 53 performs supervised machine learning on the labeled images to generate a learning model (step S2).

[0078] 14, the fillet formation determination unit 52 inputs the image of the cream solder 90 captured by the fillet camera 45 into the learning model, and determines the state of the fillet from the image during soldering at any time. That is, the fillet formation determination unit 52 uses the learning model to determine from the image during soldering at any time whether the fillet is "before formation" or "after formation" (step S3).

[0079] The control unit 51 stops the laser oscillation at the point when the determination result of the fillet formation determination unit 52 changes from "before formation" to "after formation" of the fillet (step S4).

[0080] By controlling the laser oscillation time during soldering in the operations of steps S3 and S4, soldering is performed with minimal heating. The image used for the judgment is saved, and if the soldering is judged to be poor by the inspection device 15 in the subsequent process, the image can be labeled as "before fillet formation" and re-learned, thereby improving the judgment accuracy.

[0081] In addition, if the laser irradiation device 14 is provided with a temperature sensor capable of detecting the temperature of the cream solder 90 (fillet temperature) and the temperature of the substrate 1 (substrate temperature), the reliability of soldering can be improved by stopping the laser oscillation in the above-mentioned step S4 after the judgment result of the fillet formation judgment unit 52 changes from ``before fillet formation'' to ``after fillet formation'', after the fillet temperature exceeds the specified temperature, and before the substrate temperature exceeds the specified temperature.

[0082] This application appropriately incorporates the contents disclosed in Japanese Patent Application No. 2023-107900 filed on June 30, 2023.

[0083] 1...substrate, 1A...base material, 1B...film, 1C...pad, 2...component, 2A...main body portion, 2B...electrode portion, 3...pallet, 4...support member, 4A...base portion, 4B...guard portion, 4C...pin portion, 4D...hole, 5...clamp mechanism, 5A...support portion, 5B...movable portion, 10...component mounting system, 12...mounting device, 13...preheating device, 14...laser irradiation device, 15...inspection device, 16...controller, 18...base member, 19...conveyor device, 19A...conveyor belt, 19B...guide member, 20...stage, 20A...positioning member, 21...stage moving device, 22...component supply device, 23...nozzle, 23A...shaft, 24...mounting head, 25...substrate camera, 26...height sensor, 27... Head moving device, 27X...X-axis moving device, 27Y...Y-axis moving device, 28...nozzle moving device, 29...chamber, 34...dispenser, 35...base member, 36...conveying device, 36A...conveying belt, 36B...guide member, 37...heater, 38...chamber, 39...base member, 40...conveying device, 40A...conveying belt, 40B...guide member, 41...stage, 42...stage moving device, 43...laser head, 44...chamber, 45...fillet camera, 47...processor, 48...main memory, 49...storage, 50...interface, 51...control unit, 52...fillet formation determination unit (determination unit), 53...machine learning unit (learning unit), 90...cream solder (solder).

Claims

1. A component mounting system comprising: a mounting head for mounting components on a board to which solder has been applied; a heat ray head for irradiating the solder with a heat ray after the components have been mounted; a camera for capturing an image of the solder in parallel with the irradiation of the heat ray; a learning unit for generating a learning model in which the image of the solder is input and the quality of the soldering is output; a judgment unit for inputting the image of the solder captured by the camera into the learning model and judging whether the soldering is of good quality; and a control unit for stopping the irradiation of the heat ray when it is judged that the soldering is of good quality.

2. The component mounting system according to claim 1, wherein the quality of the soldering includes a fillet shape of the solder, and the judgment unit judges whether or not the fillet shape is of good quality.

3. The component mounting system according to claim 2, further comprising an inspection device for inspecting the quality of the soldering, wherein the learning unit generates the learning model using images of the solder and the inspection results of the inspection device as training data.

Images