Heat dissipation structure and electronic device comprising same

Abstract

According to embodiments of the present disclosure, an electronic device is provided, and may comprise: a housing including a plurality of first fins; a vapor chamber including a plurality of second fins, a first cover, a second cover, and a plurality of pillars; an electronic component; and a printed circuit board (PCB). The housing may include at least one heatsink portion forming an opening area. The vapor chamber may be disposed such that at least a part of the first surface of the first cover of the vapor chamber is exposed through the opening area. The plurality of second fins may be disposed on the exposed at least part of the first surface of the first cover. The electronic component may be disposed on one surface of the printed circuit board, and may be disposed in a space between the first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

Description

Heat dissipation structure and electronic device including the same

[0001] The disclosure relates to a heat dissipation structure and an electronic device including the same.

[0002] Electronic devices may include various electronic components to perform communications. These electronic components within the electronic device may generate heat. For example, heat generated by the electronic components may degrade the performance of the electronic components and other electronic components. To dissipate the heat generated by the electronic components, the electronic device may include a heat dissipation structure.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] According to embodiments of the present disclosure, an electronic device is provided. The electronic device may include a housing including a plurality of first pins, a vapor chamber including a plurality of second pins, a first cover, a second cover, and a plurality of pillars, an electronic component, and a printed circuit board (PCB). The housing may include at least one heatsink portion forming an opening area. The vapor chamber may be arranged such that at least a portion of a first surface of the first cover of the vapor chamber is exposed through the opening area. The plurality of second pins may be arranged on at least a portion of the exposed first surface of the first cover. The electronic component may be arranged on one surface of the printed circuit board. The electronic component may be arranged in a space between a first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

[0005] According to embodiments of the present disclosure, an electronic device is provided. The electronic device may include a housing including a plurality of first pins, a plurality of modules, and a printed circuit board (PCB). Each module of the plurality of modules may include a vapor chamber including a plurality of second pins, a first cover, a second cover, and a plurality of pillars, and an electronic component. The housing may include at least one heatsink portion forming an opening area. The vapor chamber may be arranged such that at least a portion of a first surface of the first cover of the vapor chamber is exposed through the opening area. The plurality of second pins may be arranged on at least a portion of the exposed first surface of the first cover. The electronic component may be arranged on one surface of the printed circuit board. The electronic component may be arranged in a space between a first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

[0006] According to embodiments of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure may be coupled to the first metal structure and form a space for a fluid between the first metal structure and the second metal structure. The vapor chamber may include a plurality of columns disposed within the space. The first metal structure may be formed based on a cladding in which a first metal material and a second metal material are coupled. The second metal structure may be formed based on a cladding in which the first metal material and the second metal material are coupled. The first metal structure may be arranged such that the first metal material is positioned on a first surface of the first metal structure and the second metal material is positioned on a second surface of the first metal structure opposite the first surface. The second metal structure may be arranged such that the first metal material is positioned on a first surface of the second metal structure and the second metal material is positioned on a second surface of the second metal structure opposite to the first surface. At least a portion of the second surface of the first metal structure may be joined to at least a portion of the second surface of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0007] According to embodiments of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure may be coupled to the first metal structure and form a space for a fluid between the first metal structure and the second metal structure. The vapor chamber may include a plurality of pillars disposed within the space. The vapor chamber may include a third metal structure. The third metal structure may be formed based on a first metal material. The first metal structure and the second metal structure may be formed based on a second metal material. A first surface of the first metal structure may be coupled to the third metal structure. At least a portion of a second surface of the first metal structure, opposite the first surface, may be coupled to at least a portion of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0008] Figure 1 illustrates a wireless communication system.

[0009] Figure 2 illustrates an example of the external appearance of an electronic device including a heat dissipation structure.

[0010] Figure 3 illustrates an example of an electronic device including a heat dissipation structure.

[0011] Figure 4a is an exploded perspective view of a vapor chamber of a heat dissipation structure.

[0012] Figure 4b is a cross-sectional view of a vapor chamber of a heat dissipation structure.

[0013] FIG. 5a illustrates a cross-sectional view of an electronic device including a heat dissipation structure.

[0014] Figure 5b shows examples of elements through which heat is dissipated.

[0015] Figures 6a and 6b illustrate examples of arrangements of multiple fins for heat dissipation.

[0016] Figure 7a illustrates an example of a vapor chamber comprising multiple metal materials.

[0017] Figure 7b illustrates another example of a vapor chamber comprising multiple metal materials.

[0018] Figure 8 illustrates an example of an electronic device including a heat dissipation structure.

[0019] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0020] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0021] Terms referring to parts of electronic devices used in the following description (e.g., communication module, wireless communication module, heat dissipation module, substrate, PCB (printed circuit board), FPCB (flexible PCB), PBA (printed circuit board assembly), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to RF-related parts (FEM (front end module0, PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to the shape of parts (e.g., opening area, opening, protrusion area, protrusion, structure, structure, support, contact), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, Feeding lines, data lines, RF signal lines, antenna lines, RF paths, RF modules, RF circuits, splitters, dividers, couplers, combiners, etc. are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', '... body', etc. used below may mean at least one shape structure or a unit that processes a function.

[0022] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0023] Figure 1 illustrates a wireless communication system.

[0024] Referring to FIG. 1, FIG. 1 illustrates a base station (110) and a terminal (120) as some of the nodes that utilize a wireless channel in a wireless communication system.

[0025] The base station (110) is a network infrastructure that provides wireless access to the terminal (120). The base station (110) has coverage defined based on the distance at which a signal can be transmitted. In addition to the base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5th generation node', 'next generation nodeB (gNB)', 'wireless point', 'transmission / reception point (TRP)', or other terms having equivalent technical meanings.

[0026] The terminal (120) is a device used by a user and communicates with the base station (110) via a wireless channel. The link from the base station (110) to the terminal (120) is referred to as a downlink (DL), and the link from the terminal (120) to the base station (110) is referred to as an uplink (UL). In addition, although not shown in FIG. 1, the terminal (120) and another terminal may communicate with each other via a wireless channel. In this case, the link between the terminal (120) and another terminal (device-to-device link, D2D) is referred to as a sidelink, and the sidelink may be used interchangeably with the PC5 interface. In some other embodiments, the terminal (120) may be operated without the involvement of a user. In one embodiment, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. Additionally, according to one embodiment, the terminal (120) may be an NB (narrowband)-IoT (internet of things) device.

[0027] The terminal (120) may be referred to as a terminal, or other terms such as 'user equipment (UE),' 'customer premises equipment (CPE),' 'mobile station,' 'subscriber station,' 'remote terminal,' 'wireless terminal,' 'electronic device,' or 'user device,' or other terms having equivalent technical meanings.

[0028] In the past, in communication systems with relatively large cell radius of base stations, each base station was installed to include the functions of a digital processing unit (or DU (distributed unit)) and an RF (radio frequency) processing unit (or RU (radio unit)). However, in 4G (4 th As higher frequency bands are used in the 5G generation and / or subsequent communication systems (e.g., 5G) and the cell coverage of base stations becomes smaller, the number of base stations to cover a specific area has increased. The installation cost burden on operators for installing base stations has also increased. In order to minimize the installation cost of base stations, a structure has been proposed in which the DU and RU of a base station (e.g., base station (110)) are separated, one or more RUs are connected to one DU through a wired network, and one or more RUs are geographically distributed to cover a specific area.

[0029] A housing is the outer shell that houses the internal components of various devices, such as electronic and mechanical devices. It is used to protect and secure the device components. Electronic devices that use power, such as network equipment, or mechanical devices that move physically, can generate heat during operation. Because heat can adversely affect the device's operation, housings are typically designed to dissipate heat to the outside. Recently, with the advancement of the electronics industry, circuit integration and miniaturization have led to closer integration of electronic components on printed circuit boards (PCBs). Furthermore, with the trend toward miniaturization of electronic devices, high-density and high-package packaging, including the PCBs themselves, are becoming increasingly important factors. When an electronic device operates, each of the electronic components on the PCB can generate heat. Failure to adequately dissipate the heat generated by these components can lead to reduced functionality and shortened product lifespan. Accordingly, to maintain optimal performance for electronic components mounted on printed circuit boards, an environment appropriate to the operating characteristics of each electronic component used in the device must be maintained. A device that disperses and dissipates heat generated within the device is essential.

[0030] Network communication equipment such as a base station (110), a terminal (120), a RAN intelligence controller (RIC), a central unit (CU), a DU, an RU, a massive MIMO (multiple input multiple output) unit (MMU), or an access unit (AU) may include a plurality of electronic components for generating a transmission signal to an external electronic device or processing a reception signal from an external electronic device. At least one electronic component may generate heat while the network communication equipment operates. The network communication equipment may have a heat dissipation structure to disperse the generated heat or release the heat to the outside. Hereinafter, in the present disclosure, a structure and related technologies for a heat dissipation structure for dissipating heat generated in network communication equipment such as a CU, a DU, an RU, an MMU, and an AU are described. Hereinafter, the network communication equipment may be referred to as an electronic device.

[0031] FIG. 2 illustrates an example of the external appearance of an electronic device (e.g., a base station (110), a terminal (120), a DU, a RU, an MMU, an AU) including a heat dissipation structure.

[0032] Referring to FIG. 2, an electronic device may include a first housing (210) and a second housing (220). The first housing (210) may be referred to as an upper housing, and the second housing (220) may be referred to as a lower housing. The first housing (210) and the second housing (220) may be assembled to form a sealed space for protecting a printed board assembly (PBA) from the outside. A PBA is a collection of circuits including a board and a plurality of components installed on the board. Like a PBA, components disposed in the internal space formed by the first housing (210) and the second housing (220) may generate heat depending on their operation. For example, the operation may include transmitting and / or receiving signals for wireless communication, and data operations. According to one embodiment, each of the first housing (210) and the second housing (220) may include a plurality of fins for heat dissipation. In another embodiment, either the first housing (210) or the second housing (220) may not include fins for heat dissipation.

[0033] The housing of the electronic device (e.g., the first housing (210), the second housing (220)) can protect the PBA mounted inside the electronic device from the external environment. For example, the inner side of the housing that comes into contact with the PBA can have a shape with various heights due to the various sizes of the electronic components of the PBA. The outer side of the housing can include a plurality of fins to dissipate heat generated in the PBA to the outside (e.g., into the air). These fins can be referred to as heat dissipation fins. To effectively dissipate heat, the fins can have a plate shape with a large surface area. The electronic components inside the PBA can be in contact with the bottom surface of the housing. Through this, while the electronic components are operating (e.g., while the electronic components are processing a wireless signal), the heat generated from the electronic components of the PBA can be dissipated to the outside air through the bottom surface of the housing and the heat dissipation fins.

[0034] FIG. 3 illustrates an example of an electronic device (e.g., a base station (110), a terminal (120), a DU, a RU, an MMU, an AU) including a heat dissipation structure. FIG. 3 illustrates a cross-section of the interior of one housing (e.g., a first housing (210), a second housing (220)) of the electronic device.

[0035] Referring to FIG. 3, an electronic device may include a housing (300). A plurality of electronic components may be arranged inside the housing (300) of the electronic device. The housing (300) of the electronic device may protect a printed circuit board assembly (PBA) mounted inside the product from the external environment. A PBA refers to a board completed by soldering electronic components to a printed circuit board (PCB). A PCB is an insulating board on which a conductive pattern (e.g., a pattern composed of copper wires) is formed for electrical connection of electronic components, and a PBA may be manufactured through a connection between electronic components and the conductive pattern. The inner side of the housing (300) that comes into contact with the PBA may have a shape that is thin with various heights due to various component heights above the PBA.

[0036] The exterior of the housing (300) may include a heat sink (310) to dissipate heat generated from the PBA to the outside. The heat sink (310) of the housing (300) may be formed for heat dissipation. According to one embodiment, the heat sink (310) may include a plurality of fins. Each fin of the plurality of fins may be referred to as a heat dissipation fin. To effectively dissipate heat, the fins may have a plate shape with a large surface area. For example, the housing (300) may be manufactured using a die casting method. The die casting method is one of the casting processes, which not only provides high productivity but also provides high precision because parts are manufactured using a mold. The die casting method includes a method of manufacturing parts using various metals (e.g., aluminum, zinc, magnesium, copper, tin, lead, and iron). For example, the housing (300) may be formed of aluminum. Aluminum is lightweight, has high thermal conductivity, and is also excellent in corrosion resistance. As network communication equipment becomes more functional and highly integrated, the demand for lightweight housing (300) also continuously arises. There are various methods for lightweighting the housing (300). For example, a technology may be used to reduce the weight by using magnesium, which has a lower specific gravity than aluminum, a lightweight metal, or by making the fin thickness of the housing (300) thinner. For example, in order to diffuse the heat from the high-heat generation unit to the surroundings and release it to the outside, a material with high thermal conductivity may be used instead of aluminum for the housing (300), or a separate component with high thermal conductivity (e.g., a graphite sheet, a heat pipe, a vapor chamber) may be attached to the inside of the housing (300).

[0037] The housing (300) can reduce the influence of corrosion due to exposure of the PBA or electronic components to external moisture or dust. Heat generated from the electronic components can be dissipated into the outside air through the fins on the inner surface of the housing (300). At least some components located on or within the PBA can come into contact with the surface of the housing (300). While the electronic device is operating, heat generated from the components can be dissipated into the outside air through the bottom surface of the housing and the heat dissipation fins. The electronic components arranged in the PBA can have various temperature margins. For components with high heat generation or insufficient temperature margin among the electronic components, a vapor chamber (360) or a heat pipe can be used to widely spread the heat generated from the components to the fins of the heat sink (310) of the housing (300) with a wider area for sufficient heat dissipation. The vapor chamber (360) or the heat pipe may be disposed between the electronic component and the inner side of the housing (300). For example, the electronic component (340) (e.g., the first electronic component (341) and the second electronic component (342)) may contact the surface of the housing (300) through the vapor chamber (360) (or through the vapor chamber (360) and a thermal interface material (TIM) (not shown)) instead of directly contacting the surface of the housing (300). The electronic device may include a first vapor chamber (361) for the first electronic component (341). The electronic device may include a second vapor chamber (362) for the second electronic component (342). Since the vapor chamber (360) or the heat pipe has excellent thermal conductivity, heat generated in the electronic component can be quickly diffused to the surroundings.

[0038] Figure 4a is an exploded perspective view of a vapor chamber (360) of a heat dissipation structure. For identical or similar descriptions, the same reference numbers may be used.

[0039] Referring to FIG. 4A, the vapor chamber (360) may include a first cover (411), a second cover (412), a plurality of pillars (420), a first wick structure (431), and a second wick structure (432). The vapor chamber (360) may have a laminated structure. For example, in the (+) z direction, the second cover (412), the second wick structure (432), the plurality of pillars (420), the first wick structure (431), and the first cover (411) may be laminated in that order. An electronic component (not shown) that generates heat may be placed under the bottom surface (e.g., the surface facing the (-) z direction) of the second cover (412).

[0040] The vapor chamber (360) can be used to conduct heat. Heat generated from electronic components can be conducted in the (+) z-axis direction by the vapor chamber (360) and released to the outside. The vapor chamber (360) is made of a metal material and can contain a fluid therein. To store the fluid therein, the vapor chamber (360) can include a first cover (411) and a second cover (412). The fluid absorbs heat and is converted into vapor, and the converted vapor can move to the outside of the vapor chamber (360) to release heat. The vapor chamber (360) can include a plurality of pillars (420) to transfer the heat inside to the outside. For example, each pillar can have a cylindrical shape. For example, each pillar can have a square pillar shape. For example, each pillar can have a polygonal pillar shape. The vapor chamber (360) may include a wick structure to improve heat diffusion and cooling efficiency. For example, the vapor chamber (360) may include at least one of a first wick structure (431) and / or a second wick structure (432). Each wick structure may have a plate shape with porosity. To create surface tension through the capillary force of the fluid, a wick structure may be arranged on each of one surface of the first cover (411) and one surface of the second cover (412).

[0041] Fig. 4b is a cross-sectional view of a vapor chamber of a heat dissipation structure. Fig. 4b illustrates a cross-sectional view of the vapor chamber (360) of Fig. 4a viewed in the (-) y-axis direction. For the same or similar descriptions, the same reference numbers may be used.

[0042] Referring to FIG. 4B, the vapor chamber (360) may include a structure that is stacked in the (+) z-axis direction. A first cover (411) may be placed on a second cover (412). The first cover (411) and the second cover (412) may be formed of a metal that provides thermal conductivity greater than a specified threshold value. For example, each of the first cover (411) and the second cover (412) may be formed of copper. As an example, the thermal conductivity of copper is about 401 W / (m·K) (watts per meter-kelvin). The vapor chamber (360) may conduct heat in the (+) z-axis direction and release heat to the outside. For example, a first surface (461) of the first cover (411) may face the (+) z-axis direction. The second surface (471) of the first cover (411), which is opposite to the first surface (461) of the first cover (411), may face in the (-) z-axis direction. The first surface (462) of the second cover (412) may face in the (-) z-axis direction. Heat generated from the electronic component may be transferred to the first surface (462) of the second cover (412). The second surface (472) of the second cover (412), which is opposite to the first surface (462) of the second cover (412), may face in the (+) z-axis direction. One area of ​​the second surface (472) of the second cover (412) may be in contact with the first cover (411). Another area of ​​the second face (472) of the second cover (412) can be in contact with a plurality of pillars (420) (e.g., pillar (420a), pillar (420b), pillar (420c), pillar (420d)).

[0043] A plurality of pillars (420) may be placed within the space between the first cover (411) and the second cover (412). A fluid (e.g., water) for absorbing heat may be placed within the space. The plurality of pillars (420) may be formed of a metal material to effectively transfer heat transferred from the second cover (412) to the first cover (411). For example, the plurality of pillars (420) may be formed of a copper material.

[0044] Figure 5a illustrates a cross-sectional view of an electronic device including a heat dissipation structure. For identical or similar descriptions, the same reference numerals may be used.

[0045] Referring to FIG. 5A, an electronic device may include a housing (300). The housing (300) may include a first housing portion (300a) and a second housing portion (300b). For example, the housing (300) may include a plurality of portions. For example, the housing (300) may be formed integrally and may appear as separate portions in a cross-sectional view. In another example, the housing (300) may include a plurality of physically separate portions. The housing (300) may be configured to dissipate heat generated from each electronic component to the outside. The housing (300) may include a heat sink (310). The heat sink (310) may include fins (310a) and fins (310b). The fins (310a) may be disposed on one surface of the first housing portion (300a). The fins (310b) may be positioned on one surface of the second housing portion (300b). Each fin of the fins (310a) and the fins (310b) may have a plate shape. Each fin of the fins (310a) and the fins (310b) may be configured to be exposed to the air and cool heat generated by the electronic device being placed outdoors. The fins (310a) and the fins (310b) may be formed together with the housing (300) by a die casting method.

[0046] An electronic device may include a PCB (520). The PCB (520) may be configured as a PBA by being combined with electronic components configured in a circuit form. A plurality of electronic components may be arranged on one surface of the PCB (520). For example, electronic components (531) and electronic components (532) may be arranged on one surface of the PCB (520). The electronic components (531) and electronic components (532) may be in contact with the housing (300). For example, the electronic component (531) may be in contact with the inner surface of the first housing part (300a). The electronic component (532) may be in contact with the inner surface of the second housing part (300b). Since the inner surface of the housing (300) and each electronic component are in contact, heat generated from the corresponding electronic components may be transferred to the housing (300). Heat is dissipated to the outside through the fins of the heat sink (310) (e.g., fins (310a), fins (310b)). The power margin of the electronic component (531) or the electronic component (532) may be higher than the power margin of the electronic component (340) described below. This is because the heat dissipation structure using only the housing provides low heat dissipation performance. For example, the electronic component (531) or the electronic component (532) may be a module (e.g., RFFE, FEM, FEMid, PAMid, LPAMid) or a chip including a power amplifier.

[0047] An electronic device may include a PCB (520). The PCB (520) may be configured as a PBA by combining electronic components configured in a circuit form. A plurality of electronic components may be arranged on one surface of the PCB (520). For example, an electronic component (340) may be arranged on one surface. Heat generated from the electronic component (340) may be dissipated through a vapor chamber (360). The heat may contact the vapor chamber (360) and spread to the periphery in the area of ​​the vapor chamber (360). The power margin of the electronic component (340) may be relatively lower than the power margin of the electronic component (531) or the electronic component (532). For example, the electronic component (340) may include a processor, a central processing unit (CPU), a graphical processing unit (GPU), an application processor (AP), a communication processor (CP), or a field-programmable gate array (FPGA). If the electronic component (340) and the vapor chamber (360) come into direct contact, an interface may inevitably occur due to component tolerances. To improve thermal resistance, a terminal interface material (TIM) (540) may be placed between the electronic component (340) and the vapor chamber (360). For example, the TIM (540) may include a thermal pad, gel, or grease. Since the TIM (540) includes metal and ceramic particles having thermally conductive properties based on a polymer material, the arrangement of the TIM (540) may reduce the mechanical tolerance and increase the thermal conductivity at the interface.

[0048] Unlike FIG. 5a, the placement of TIM between the vapor chamber (360) and the inner surface of the housing (300) may be considered. However, TIM has a thermal conductivity of approximately 20 to 30 W / (m·K), and the higher the thermal conductivity, the higher the price, and since it is subject to pressing conditions and reuse, there are mechanical restrictions on the placement of TIM. For example, the fin molding of the heat sink (310) of the housing (300) can be manufactured through a die-casting method. The die-casting method has the advantage of being able to mold the complex internal shape of the housing (300) and the heat sink (310) at a low cost, but a certain level of fin thickness and arrangement interval are required to prevent breakage or deformation of the fins when the product molded in the die-casting mold is extracted from the mold. In addition, the higher the heat generation amount, the longer the fin length is required to improve the heat dissipation effect. In other words, the higher the heat generation amount, the thicker and longer the heat dissipation fins are required for the component. However, as the heat dissipation fins become thicker and longer, the volume and weight of the electronic device increase, which is not advantageous in terms of reducing the weight of the electronic device.

[0049] To solve the above-described problem, at least a portion of the housing (300) may include an opening area (569). Through at least a portion of the opening area (569) of the housing (300), one surface of the vapor chamber (360) (e.g., the first surface (461) of the first cover (411) or the coated layer) may be exposed to the outside. A structure in which an aluminum sheet is disposed on a copper vapor chamber or a structure in which a coating layer is formed on one surface of the vapor chamber may both be understood as an implementation of the vapor chamber (360). In other words, an aluminum sheet exposed through the opening area (569) may also be included in an embodiment of the present disclosure. Heat dissipation fins (560) may be disposed on one surface of the vapor chamber (360) that is exposed. The heat dissipation fins (560) can be joined by welding to the above-mentioned surface of the vapor chamber (360). Unlike the heat dissipation fins that are formed integrally with the housing (300) through a die-casting process, the heat dissipation fins are manufactured separately and then arranged through a welding process, so that the electronic device can have a wider gap margin and a thinner thickness than the heat dissipation fins of the heat sink (310). Hereinafter, for convenience of explanation, the heat dissipation fins of the heat sink (310) of the housing (300) may be referred to as first fins. The heat dissipation fins (560) formed on one surface of the vapor chamber (360) may be referred to as second fins.

[0050] The second fins may be arranged on one side of the vapor chamber (360), and the first fins may be arranged on one side of the heat sink (310) of the housing (300). For example, aluminum die casting (ADC) 12 types or ADC 3 types may be used for the die casting molding of the housing (300). The aluminum material typically has a thermal conductivity of about 90 to 160 W / (m·K). For the second fins attached to the vapor chamber (360), a material having a high thermal conductivity of about 170 to 210 W / (m·K), such as AL1050, AL1070, AL3003, or AL6063, may be used. Since the first fins are formed through a die casting method together with the housing (300), there are restrictions on their thickness and arrangement. However, since the second fins attached to the vapor chamber (360) are manufactured separately rather than by die casting, they can be formed in the form of a relatively thin sheet. In addition, since a certain thickness is not required, the weight of each fin can be reduced. Due to the opening area (569) of the housing (300), the thickness of one side of the housing (300) can be removed. The thickness of one side of the housing (300) is approximately 3 to 4 mm. Since the vapor chamber (360) replaces the housing (300), the weight of the housing (300) can be reduced. In addition, since the length of the second fin can be increased by the amount of the removed thickness, the second fin can provide more advantageous heat dissipation performance.

[0051] The vapor chamber (360) can replace a portion of the housing (300). For example, the vapor chamber (360) and the housing (300) can be assembled such that the edge portion (577) of the vapor chamber (360) overlaps the housing (300) when viewed from above in the (-) z-axis direction. In order to prevent foreign substances such as external moisture and dust from penetrating into the space formed by the housing (300), the PCB (520), and the vapor chamber (360), an additional structure can be arranged between the edge portion (577) and the housing (300). For example, a gasket (555) can be arranged between the edge portion (577) and the housing (300). For example, a screw can be arranged between the edge portion (577) and the housing (300) to secure the vapor chamber (360) to the housing (300). The gasket (555) may be composed of a polymer material having elastic properties (e.g., silicone). For example, the gasket (555) is required to have a surface hardness of Shore A 20 or higher. The elastic properties of the gasket (555) can maintain the tolerance between the vapor chamber (360) and the electronic component (320) below a certain level, thereby reducing the thermal resistance of the TIM. Additionally, a screw (not shown) with an added spring may be used to reduce the tolerance between the vapor chamber (360) and the electronic component (340).

[0052] The first cover (411) and / or the second cover (412) of the vapor chamber (360) may be formed of a copper material. Copper has high thermal conductivity, and a working fluid with excellent cooling efficiency may be placed inside the vapor chamber (360). For example, water may be used as the working fluid of the vapor chamber (360). Water is chemically stable and has a high latent heat, so it has the advantage of excellent heat dissipation. If the working fluid is water, hydrogen gas may be generated due to a reaction between water and aluminum, which may cause a problem of reduced heat dissipation performance. Since the stability is low, the first cover (411) and / or the second cover (412) of the vapor chamber (360) may be formed of a copper material. For another example, other working fluids (acetone, ammonia, HCFCs (hydrochlorofluorocarbons), HFCs (hydrofluorocarbons), etc.) may be used instead of water. Since most network communication equipment is installed and used in outdoor environments, there is a risk of corrosion if copper material is directly exposed to the outside. Therefore, in the vapor chamber (360) according to the embodiments of the present disclosure, a plating or paint coating may be additionally performed to prevent corrosion on one surface of the vapor chamber (360) to which the heat dissipation fins (560) are joined (e.g., the first surface (461) of the first cover (411)). One surface of the first cover (411) of the vapor chamber (360) may include a coating layer.

[0053] Figure 5b illustrates examples of elements through which heat is dissipated. For identical or similar descriptions, the same reference numerals may be used. In Figure 5b, each thermal resistance in the heat dissipation structure of the electronic device of Figure 5a is described.

[0054] Referring to FIG. 5b, a PCB (520), an electronic component (340), a TIM (540), a vapor chamber (360), and heat dissipation fins (560) may be arranged in that order. The heat generated from the electronic component (340) may be conducted in the (+) z-axis direction and released to the outside. The fins of the heat sink (310) and the heat dissipation fins (560) may release heat due to the influence of air wind. In the path along which the heat generated from the electronic component is conducted, the thermal resistance (R) of the electronic component (340) JC )(581), thermal resistance (R) of TIM(540) TIM )(582), thermal resistance (R) of vapor chamber (360) vC )(583), thermal resistance of the welding layer (R welding )(584), thermal resistance (R) of the heat dissipation fins (560) fin )(585) may be located. Since the vapor chamber (360) and the heat sink (310) do not directly contact each other, the thermal resistance of the TIM between the vapor chamber (360) and the heat sink (310) may be ignored. In addition, without the thermal resistance due to the thickness of the housing (300), the path through the welding layer and the heat dissipation fins (560) from the vapor chamber (360) may have a lower thermal resistance than the path through contact with the housing (300). Due to the low thermal resistance, the heat dissipation structure in which the vapor chamber (360) and the heat dissipation fins (560) are combined may provide improved heat dissipation performance.

[0055] Figures 6a and 6b illustrate examples of arrangements of a plurality of fins for heat dissipation. Figures 6a and 6b illustrate the arrangement of the heat dissipation structure of Figures 5a and 5b as viewed from the (+) z-axis direction to the (-) z-axis direction. For identical or similar descriptions, the same reference numbers may be used.

[0056] Referring to FIG. 6A, the heat sink (310) of the housing (300) may include a plurality of first fins. The heat dissipation fins (560) (i.e., the second fins) may be arranged on one surface of the vapor chamber (360). The thickness of each fin of the heat dissipation fins (560) may be thinner than the thickness of each first fin. Unlike the first fin formed by the housing (300) and the die-casting method, the second fin is manufactured separately and may thus have the shape of a sheet having a relatively thin thickness. For example, the first fin formed by the die-casting method may have a thickness of about 1.64 mm and a spacing between the fins of about 13 mm. The second fin formed as a sheet may have a thickness of about 0.5 to 1.0 mm and a spacing between the fins of about 5 to 10 mm.

[0057] Although FIG. 6A illustrates an arrangement in which the surfaces of the first fins and the second fins are aligned to face the x-axis direction, embodiments of the present disclosure are not limited thereto. Depending on the variety of wind directions, the fins may be aligned such that the surfaces of each fin face various directions. For example, referring to FIG. 6B, at least some of the fins may be arranged to face a direction inclined from the x-axis toward the (-) y-axis, and the remaining some of the fins may be arranged to face a direction inclined from the x-axis toward the (+) y-axis.

[0058] Fig. 7a illustrates an example of a vapor chamber (360) comprising multiple metal materials. Fig. 7a illustrates an example in which the vapor chamber (360) of Fig. 4a is composed of multiple metal materials. Metals may have various properties depending on their type. Metals have various ionization tendencies depending on their type. The ionization tendencies indicate the degree to which a metal is likely to become ions. Metals with a high ionization tendencies easily lose electrons and become ions, while metals with a low ionization tendencies have difficulty losing electrons and thus have difficulty becoming ions. For example, the ionization tendencies of aluminum are higher than those of copper. In addition, metals have various thermal conductivities depending on their type. For example, the thermal conductivity of copper or silver is higher than that of aluminum. The same reference numbers may be used for the same or similar descriptions.

[0059] Referring to Fig. 7a, a clad in which a first metal material (710) and a second metal material (720) are joined can be used to form a vapor chamber (360). A clad is a material made by joining two or more metals. Since the advantages of each metal can be taken advantage of through the clad, it can be used in various fields. The first metal material (710) can form an outer surface of the vapor chamber (360). The second metal material (720) can form an inner surface of the vapor chamber (360). The ionization tendency of the first metal material (710) can be higher than the ionization tendency of the second metal material (720). The first metal material (710) having a high ionization tendency can react with oxygen in the air to form an oxide film. Due to the oxide film, oxidation resistance increases, and corrosion can be prevented. For example, the first metal material (710) may include aluminum. The second metal material (720) may include copper. That is, the cladding may be an aluminum-copper cladding. For example, the aluminum-copper cladding may have a thickness of about 0.3 to 1.5 mm (millimeter), a thickness ratio of copper may be about 30 to 50%, and a thickness ratio of aluminum may be about 50 to 70%. The aluminum-copper cladding may be used as a material for each of the first cover (411) and the second cover (412).

[0060] The first substrate (711) may be formed of an aluminum-copper clad material. The second surface (471) of the first substrate (711) may be a copper surface. The second substrate (712) may be formed of an aluminum-copper clad material. The second surface (472) of the second substrate (712) may be a copper surface. Since the copper surface is located on the inner surface rather than the outer surface, the copper is not exposed to the air, so that the vapor chamber (360) can provide a corrosion-resistant characteristic. By bonding the second surface (471) of the first substrate (711) and the second surface (472) of the second substrate (712) to face each other, a space surrounded by copper can be formed. A working fluid (e.g., water) can be placed inside the space. Since the first metal material (710) (e.g., aluminum) is disposed on the outside of the vapor chamber (360), it may be easy to arrange heat dissipation fins (e.g., heat dissipation fins (560)) having the first metal material (710). Due to the use of the same metal material, unnecessary processes may be eliminated during welding, and thermal resistance (e.g., thermal resistance (584)) due to welding may also be reduced. An additional paint coating may be performed on a surface exposed to the outside (e.g., the first surface (461) of the first substrate (411)) to make it more robust in the air. Since heat dissipation performance is maintained through the coating layer, the electronic device may be able to be used for a long time while exposed to an outdoor environment.

[0061] Instead of forming a vapor chamber using only a single metal material (e.g., copper), the vapor chamber may be formed using a metal material (e.g., aluminum) having a lower specific gravity than the metal material and a cladding that combines the metal material. Due to the lower specific gravity of the metal material, a lightweight vapor chamber can be achieved. For example, the first cover (411) and the second cover (412) of the vapor chamber may be formed using an aluminum-copper cladding that combines aluminum and copper. In one embodiment, the vapor chamber, at least partially exposed through the opening area (569) of FIG. 5A, may be formed using the aluminum-copper cladding. Meanwhile, the vapor chamber itself formed using the aluminum-copper cladding, as illustrated in FIG. 7A, may be understood as an embodiment of the present disclosure. In other words, even if the housing (300) covers the vapor chamber without the opening area (569) of FIG. 5A, the structure including the vapor chamber formed through the aluminum-copper clad and the electronic device including the structure can be understood as an embodiment of the present disclosure.

[0062] Fig. 7b illustrates another example of a vapor chamber (360) comprising multiple metal materials. Fig. 7b illustrates an example in which the vapor chamber (360) of Fig. 4a is composed of multiple metal materials. Metals may have various properties depending on their type. Metals have various ionization tendencies depending on their type. Furthermore, metals have various thermal conductivities depending on their type.

[0063] Referring to FIG. 7b, the first cover (411) of the vapor chamber (360) may include a first portion (411a) having a first metal material (710) and a second portion (411b) having a second metal material (720). For example, the first cover (411) may include a cladding in which different metal materials are bonded. One side (761) of the first portion (411a) may be bonded to one side (762) of the second portion (411b). One side (761) of the first portion (411a) may be opposite to the first side (461) of the first cover (411). One side (762) of the second portion (411b) may be opposite to the second side (471) of the first cover (411).

[0064] In one embodiment, the first metal material (710) may include aluminum. The second metal material (720) may include copper. For example, in the product state of the copper vapor chamber, an aluminum sheet may be bonded to one copper side (e.g., one side (762) of the second portion (411b)). In other words, the vapor chamber (360) may include the copper vapor chamber and an aluminum sheet (e.g., the first portion (411a) of the first cover (411)). For example, the first cover (411) may include a copper-aluminum clad. Since the copper vapor chamber is formed as a single product and forms a space with a single material, the vapor chamber (360) can ensure its original function of evaporating the working fluid and transferring heat. Aluminum is strong against oxygen corrosion, but has weak properties due to low heat dissipation performance and explosion when reacting with water. On the other hand, copper is weak against oxygen corrosion, but has strong properties against water. Accordingly, since the portion exposed to the outside is formed with an aluminum sheet and the internal space for storing a fluid (e.g., water) is formed with copper, the vapor chamber (360) can be formed stably. In addition, since the specific gravity of aluminum is lower than that of copper, the volume and weight of the vapor chamber (360) can be formed more efficiently. Since the thickness of the copper can be reduced through the strength reinforcement of the additional aluminum sheet, the vapor chamber (360) of FIG. 7b can be lighter than a vapor chamber composed solely of copper.

[0065] Although FIG. 7B illustrates a vapor chamber formed of copper and including an aluminum sheet (e.g., the first portion (411a) of the first cover (411)), embodiments of the present disclosure are not limited thereto. In one embodiment, a sheet made of another metal material (e.g., a metal having oxidation corrosion resistance greater than that of copper) may be used instead of the aluminum sheet.

[0066] Instead of forming a vapor chamber using only a single metal material (e.g., copper), a metal material having a lower specific gravity than the metal material (e.g., aluminum) may be used to form the vapor chamber instead of the metal material. Due to the use of a metal material having a lower specific gravity, a lighter vapor chamber can be achieved. This is because the use of aluminum reduces the thickness of the copper portion in the heat dissipation structure. For example, an aluminum sheet may be bonded to a copper vapor chamber. The first cover (411) of the vapor chamber may include a bonding structure of aluminum and copper. In one embodiment, a vapor chamber at least partially exposed through the opening area (569) of FIG. 5A may include the vapor chamber of FIG. 7B. Meanwhile, as illustrated in FIG. 7B, a vapor chamber itself in which an aluminum sheet is bonded instead of the copper portion of the upper surface of a conventional vapor chamber may be understood as an embodiment of the present disclosure. In other words, even if the housing (300) covers the vapor chamber without the opening area (569) of FIG. 5A, the structure including the vapor chamber formed through the bonding and the electronic device including the structure can be understood as an embodiment of the present disclosure.

[0067] FIG. 8 illustrates an example of an electronic device (e.g., a base station (110), a terminal (120), a DU, a RU, an MMU, an AU) including a heat dissipation structure. FIG. 8 illustrates a cross-section of the interior of one housing (e.g., a first housing (210), a second housing (220)) of the electronic device.

[0068] Referring to FIG. 8, an electronic device may include a housing (300). A perspective view (800) illustrates an example in which first fins of a heat sink (310) of the housing (300) are arranged downward. The first fins of the heat sink (310) may have a length that faces the (+) z-axis direction, and each fin may have a plate shape. The first fins of the heat sink (310) may have a first thickness. A gap between the first fins may be a first length. The housing (300) of the electronic device may have a plurality of electronic components arranged therein. The housing (300) of the electronic device may protect the electronic components or the PBA including the electronic components from the external environment.

[0069] An electronic device may include a plurality of modules (e.g., a first module (851), a second module (852)). Each module of the plurality of modules may include a heat dissipation structure. Each module may be referred to as a heat dissipation module, a communication module, a fin module, a heat sink module, or a term having an equivalent technical meaning thereto. For example, the first module (851) may include an electronic component (341), a vapor chamber (361), and heat dissipation fins (561). The second module (852) may include an electronic component (342), a vapor chamber (362), and heat dissipation fins (562). The heat dissipation fins (561) and the heat dissipation fins (562) (hereinafter, referred to as second fins) may have a second thickness. The spacing between the second fins may be a second length. Unlike the first fin formed by a die-casting method, the second fin is formed through a separate sheet, and the formed second fin can be welded and attached to one side of the vapor chamber. Since there is a relatively sufficient margin, the second thickness can be thinner than the first thickness. In addition, the second length can be shorter than the first length. In other words, the second fins can be arranged more densely within a limited space than the first fins. This improves heat dissipation performance, and since the second fins are directly connected to the vapor chamber (360) without a housing (300), the communication equipment can be made lighter.

[0070] An electronic device according to embodiments of the present disclosure relates to a heat dissipation device used in various communication equipment, such as a mobile communication base station (e.g., DU, RU, MMU), repeater (HPA (high power amplifier), LPA (low power amplifier), etc.), as an outdoor housing. Heat of electronic components can be dissipated to the outside through fins (e.g., heat dissipation fins (560)) exposed to the air. Meanwhile, a specific material (e.g., aluminum) can be applied to the coating layer of the heat dissipation fins or vapor chamber to be corrosion-resistant for long-term use under conditions exposed to the external environment. In addition, reducing the thickness of the heat dissipation fins causes a decrease in heat dissipation performance, and as a result, the overall volume of the communication equipment can increase. The heat dissipation structure according to embodiments of the present disclosure, unlike the die-cast method of the heat sink (310) being formed integrally with the housing (300), enables heat dissipation fins that are manufactured separately to be directly attached to one side of the vapor chamber (360), thereby enabling heat dissipation fins that are thinner and taller than the heat dissipation fins of the heat sink (310). The thinner the fins, the more heat dissipation fins can be arranged, and the longer each fin is formed, the better the heat dissipation performance. Since one area of ​​the housing (300) is opened to expose one side of the vapor chamber (360), the communication equipment can be made lighter.

[0071] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0072] According to embodiments of the present disclosure, an electronic device is provided. The electronic device may include a housing including a plurality of first pins, a vapor chamber including a plurality of second pins, a first cover, a second cover, and a plurality of pillars, an electronic component, and a printed circuit board (PCB). The housing may include at least one heatsink portion forming an opening area. The vapor chamber may be arranged such that at least a portion of a first surface of the first cover of the vapor chamber is exposed through the opening area. The plurality of second pins may be arranged on at least a portion of the exposed first surface of the first cover. The electronic component may be arranged on one surface of the printed circuit board. The electronic component may be arranged in a space between a first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

[0073] In one embodiment, the thickness of a second pin among the plurality of second pins may be thinner than the thickness of a first pin among the plurality of first pins.

[0074] In one embodiment, the plurality of pillars may be disposed between the first cover and the second cover. A fluid may be disposed in the space between the first cover, the second cover, and the plurality of pillars.

[0075] In one embodiment, the vapor chamber may include a first wick structure coupled to a second surface of the first cover, opposite the first surface, and a second wick structure coupled to a second surface of the second cover, opposite the first surface.

[0076] In one embodiment, the first wick structure may include a plurality of first holes for the plurality of columns. The second wick structure may include a plurality of second holes for the plurality of columns.

[0077] In one embodiment, the device may further include an upper cover coupled to a second surface opposite the first surface of the first cover. The plurality of pillars may be positioned between the upper cover and the second cover. The first cover may be formed of a first metal material. The upper cover may be formed of a second metal material different from the first metal material.

[0078] In one embodiment, the first metal material may include aluminum. The second metal material may include copper.

[0079] In one embodiment, the first cover may include a first clad metal composed of a first metal material and a second metal material. The first cover may include a second clad metal composed of the first metal material and the second metal material.

[0080] In one embodiment, the first metal material may include aluminum. The second metal material may include copper.

[0081] In one embodiment, the first surface of the first cover may include the first metal material of the first clad metal. The first surface of the second cover may include the first metal material of the second clad metal. The second surface of the first cover, opposite the first surface, may include the second metal material of the first clad metal. The second surface of the second cover, opposite the first surface, may include the second metal material of the second clad metal.

[0082] In one embodiment, the electronic device may further include a thermal interface material (TIM). The TIM may be in contact with the electronic component and the first surface of the second cover.

[0083] In one embodiment, the electronic device may further include at least one electronic component disposed on the one surface of the printed circuit board. The at least one electronic component may be disposed to contact the housing. A temperature margin for the at least one electronic component may be higher than a temperature margin for the electronic component.

[0084] In one embodiment, the electronic component may include at least one processor, at least one central processing unit (CPU), or at least one field programmable gate array (FPGA). The at least one electronic component may include a component having a power amplifier.

[0085] In one embodiment, the electronic device may further include a gasket. An area of ​​the first surface of the first cover, different from at least a portion of the exposed first surface of the first cover, may be coupled to the housing via the gasket.

[0086] According to one embodiment, the electronic device may include a radio unit (RU), a distributed unit (DU), a digital unit (DU), or a massive multiple input multiple output (MIMO) unit (MMU).

[0087] According to one embodiment, the plurality of first fins may be arranged on one surface of the at least one heat sink portion. The plurality of first fins and the plurality of second fins may protrude in a direction toward the first surface of the first cover. Each first fin of the plurality of first fins may have a plate shape. Each second fin of the plurality of second fins may have a plate shape. The first cover of the vapor chamber may include a coating layer. The coating layer may include at least a portion of the exposed first surface of the first cover.

[0088] According to embodiments of the present disclosure, an electronic device is provided. The electronic device may include a housing including a plurality of first pins, a plurality of modules, and a printed circuit board (PCB). Each module of the plurality of modules may include a vapor chamber including a plurality of second pins, a first cover, a second cover, and a plurality of pillars, and an electronic component. The housing may include at least one heatsink portion forming an opening area. The vapor chamber may be arranged such that at least a portion of a first surface of the first cover of the vapor chamber is exposed through the opening area. The plurality of second pins may be arranged on at least a portion of the exposed first surface of the first cover. The electronic component may be arranged on one surface of the printed circuit board. The electronic component may be arranged in a space between a first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

[0089] In one embodiment, the thickness of a second pin among the plurality of second pins may be thinner than the thickness of a first pin among the plurality of first pins.

[0090] In one embodiment, the housing may be formed based on a first metal material. The vapor chamber of each module among the plurality of modules may be formed based on the first metal material and a second metal material. The first surface of the first cover may include the first metal material. At least a portion of the second cover may include the second metal material. The first metal material may include aluminum. The second metal material may include copper.

[0091] In one embodiment, the electronic device may further include a gasket. An area of ​​the first surface of the first cover, different from at least a portion of the exposed first surface of the first cover, may be coupled to the housing via the gasket.

[0092] According to embodiments of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure may be coupled to the first metal structure and form a space for a fluid between the first metal structure and the second metal structure. The vapor chamber may include a plurality of columns disposed within the space. The first metal structure may be formed based on a cladding in which a first metal material and a second metal material are coupled. The second metal structure may be formed based on a cladding in which the first metal material and the second metal material are coupled. The first metal structure may be arranged such that the first metal material is positioned on a first surface of the first metal structure and the second metal material is positioned on a second surface of the first metal structure opposite the first surface. The second metal structure may be arranged such that the first metal material is positioned on a first surface of the second metal structure and the second metal material is positioned on a second surface of the second metal structure opposite to the first surface. At least a portion of the second surface of the first metal structure may be joined to at least a portion of the second surface of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0093] According to embodiments of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure may be coupled to the first metal structure and form a space for a fluid between the first metal structure and the second metal structure. The vapor chamber may include a plurality of pillars disposed within the space. The vapor chamber may include a third metal structure. The third metal structure may be formed based on a first metal material. The first metal structure and the second metal structure may be formed based on a second metal material. A first surface of the first metal structure may be coupled to the third metal structure. At least a portion of a second surface of the first metal structure, opposite the first surface, may be coupled to at least a portion of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0094] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed singularly or plurally, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in plural may be composed of singular elements, or components expressed in singular may be composed of plural elements.

[0095] According to embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0096] Meanwhile, although the detailed description of the present disclosure has described specific embodiments, it is obvious that various modifications are possible within the scope of the present disclosure.

Claims

1. In electronic devices, A housing comprising a plurality of first pins; Multiple second pins; A vapor chamber comprising a first cover, a second cover, and a plurality of pillars; electronic components; and Contains a printed circuit board (PCB), The housing comprises at least one heatsink portion forming an opening area, The vapor chamber is arranged so that at least a portion of the first surface of the first cover of the vapor chamber is exposed through the open area, The above plurality of second pins are arranged on at least a portion of the first surface of the exposed first cover, The above electronic components are arranged on one side of the printed circuit board, The above electronic component is arranged in the space between the first side of the second cover facing the one side of the printed circuit board and the one side of the printed circuit board. Electronic devices.

2. In claim 1, Among the plurality of second pins, the thickness of the second pin is thinner than the thickness of the first pin among the plurality of first pins. Electronic devices.

3. In claim 1, The above plurality of pillars are arranged between the first cover and the second cover, A fluid is placed in the space between the first cover, the second cover, and the plurality of pillars. Electronic devices.

4. In claim 1, The above vapor chamber, A first wick structure coupled to a second surface opposite to the first surface of the first cover; comprising a second wick structure coupled to a second surface opposite to the first surface of the second cover; Electronic devices.

5. In claim 4, The above first wick structure comprises a plurality of first holes for the plurality of columns, The second wick structure comprises a plurality of second holes for the plurality of columns. Electronic devices.

6. In claim 4, Further comprising an upper cover coupled to a second surface opposite to the first surface of the first cover; The above plurality of pillars are arranged between the upper cover and the second cover, The above first cover is composed of a first metal material, The upper cover is composed of a second metal material different from the first metal material. Electronic devices.

7. In claim 6, The above first metal material includes aluminum, The second metal material includes copper. Electronic devices.

8. In claim 1, The first cover includes a first clad metal composed of a first metal material and a second metal material, The first cover comprises a second clad metal composed of a first metal material and the second metal material. Electronic devices.

9. In claim 8, The above first metal material includes aluminum, The second metal material includes copper. Electronic devices.

10. In claim 8, The first surface of the first cover comprises the first metal material of the first clad metal, The first surface of the second cover includes the first metal material of the second clad metal, The second side of the first cover, opposite to the first side, includes the second metal material of the first clad metal, The second side of the second cover, opposite to the first side, includes the second metal material of the second clad metal, Electronic devices.

11. In claim 1, further comprising at least one electronic component arranged on said one surface of said printed circuit board, At least one of the electronic components is positioned to contact the housing, The temperature margin for at least one of the electronic components is higher than the temperature margin for the electronic component, The electronic component comprises at least one processor, at least one central processing unit (CPU), or at least one field programmable gate array (FPGA), wherein said at least one electronic component comprises a component having a power amplifier; Electronic devices.

12. In claim 1, Including additional gaskets, A region of said first surface of said first cover, other than at least a portion of said first surface of said first cover that is exposed, is coupled to said housing via said gasket. Electronic devices.

13. In claim 1, The above plurality of first fins are arranged on one surface of the at least one heat sink portion, The plurality of first pins and the plurality of second pins protrude in the direction in which the first surface of the first cover faces, Each of the first pins of the plurality of first pins has a plate shape, Each of the second pins of the plurality of second pins has a plate shape, The first cover of the vapor chamber includes a coating layer, The coating layer comprises at least a portion of the first surface of the exposed first cover. Electronic devices.

14. In electronic devices, A housing comprising a plurality of first pins; multiple modules; and Contains a printed circuit board (PCB), Each module of the above multiple modules, Multiple second pins; a vapor chamber comprising a first cover, a second cover, and a plurality of pillars; and Contains electronic components, The housing comprises at least one heatsink portion forming an opening area, The vapor chamber is arranged so that at least a portion of the first surface of the first cover of the vapor chamber is exposed through the open area, The above plurality of second pins are arranged on at least a portion of the first surface of the exposed first cover, The above electronic components are arranged on one side of the printed circuit board, The above electronic component is arranged in the space between the first side of the second cover facing the one side of the printed circuit board and the one side of the printed circuit board. Electronic devices.

15. In the vapor chamber, First metal structure; a second metal structure, said second metal structure being joined to said first metal structure and forming a space for fluid between said first metal structure and said second metal structure; and Containing a plurality of columns arranged within the above space, The above first metal structure is formed based on a cladding in which a first metal material and a second metal material are combined, The second metal structure is formed based on a cladding in which the first metal material and the second metal material are combined, The first metal structure is arranged so that the first metal material is positioned on a first surface of the first metal structure, and the second metal material is positioned on a second surface of the first metal structure opposite to the first surface, The second metal structure is arranged so that the first metal material is positioned on the first surface of the second metal structure, and the second metal material is positioned on the second surface of the second metal structure opposite to the first surface, At least a portion of the second surface of the first metal structure is joined to at least a portion of the second surface of the second metal structure, The above first metal material includes aluminum, The second metal material comprises copper. Vapor chamber.

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