Lighting module, lighting device and head lamp

Abstract

A lighting device disclosed in an embodiment of the present invention may comprise: a support plate; a circuit board arranged on the support plate; a plurality of pads arranged on one side of the circuit board; a light source unit, which is arranged on the support plate and has a light-emitting device and a plurality of bonding pads; a plurality of connection members for connecting the plurality of pads to the plurality of bonding pad; and a fixing member for supporting the plurality of connection members on a portion of each connection member, wherein the fixing member can include a fixing frame arranged on the circuit board, and a molding portion that covers a portion of each connection member on the fixing frame.

Description

Lighting modules, lighting devices and headlamps

[0001] Embodiments of the invention relate to a lighting module and a lighting device.

[0002] An embodiment of the invention relates to a headlamp having a lighting device.

[0003] Lighting applications include vehicle lighting, display, and signage backlighting. Light-emitting diodes (LEDs) offer advantages over light sources such as fluorescent and incandescent lamps, including low power consumption, a near-permanent lifespan, fast response times, safety, and environmental friendliness. LEDs are used in various lighting devices, including displays, indoor and outdoor lighting. Recently, lamps using LEDs as vehicle light sources have been proposed. Compared to incandescent lamps, LEDs offer the advantage of lower power consumption. Furthermore, their small size allows for greater design flexibility, and their near-permanent lifespan makes them economical. However, because the light emitted from LEDs has a small angle of incidence, there is a need to increase the light-emitting area of ​​LED lamps when using LEDs in vehicle lamps.

[0004] An embodiment of the invention provides a lighting module and a lighting device having a member that secures at least a portion of a connecting member that electrically connects a light source unit and a circuit board.

[0005] Embodiments of the invention provide a lighting module and a lighting device having a member for fixing a plurality of connecting members for electrically connecting a light source unit and a circuit board, or members for fixing each of the plurality of connecting members. Embodiments of the invention provide a lighting module and a lighting device having a member for fixing the position of a portion of one or a plurality of wires on at least one area of ​​an upper surface of a circuit board or an upper surface of a support plate. Embodiments of the invention provide a lighting module and a lighting device having the same.

[0006] A lighting device according to an embodiment of the invention includes: a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source unit disposed on the support plate and having a light emitting element and a plurality of bonding pads; a plurality of connecting members respectively connecting the plurality of pads to the plurality of bonding pads; and a fixing member supporting the plurality of connecting members on a portion of the plurality of connecting members, wherein the fixing member may include a fixing frame disposed on the circuit board, and a molding member covering a portion of the plurality of connecting members on the fixing frame.

[0007] A lighting device according to an embodiment of the invention comprises: a support plate; a circuit board disposed on the support plate; a recess disposed on one side of the circuit board; first and second pads disposed on both sides of the recess of the circuit board; a light source unit disposed on the support plate and having a light emitting element and first and second bonding pads and accommodated in the recess; a connecting member having a first connecting member connecting the first pad to the first bonding pad and a second connecting member connecting the second pad to the second bonding pad; a first fixing member supporting the first connecting member on the first connecting member; and a second fixing member supporting the second connecting member on the second connecting member, wherein the first and second fixing members may include a fixing frame respectively disposed on the circuit board, and a molding part respectively covering a portion of the first and second connecting members on the fixing frame.

[0008] According to an embodiment of the invention, the fixed frame includes a bottom portion joined to the circuit board, and a support portion bent from one or both ends of the bottom portion, and the molding portion can be arranged on the bottom portion and the support portion. The support portion can have a hole therein and be joined to the molding portion.

[0009] According to an embodiment of the invention, the molding part can be adhered to the surface of the fixed frame and the surface of the circuit board.

[0010] According to an embodiment of the invention, the circuit board may include a sub-pad that is joined to the fixed frame from below the fixed frame. The support plate may include a concave step on the upper portion and a receiving portion in which the circuit board is received.

[0011] A lighting device according to an embodiment of the invention includes a support plate; a circuit board disposed on the support plate; a concave recess on one side of the circuit board; a plurality of pads disposed on one side of the circuit board; a light source unit disposed on the support plate and having a light emitting element and a plurality of bonding pads; a plurality of connecting members respectively connecting the plurality of pads to the plurality of bonding pads; and a fixing member supporting the plurality of connecting members on the plurality of connecting members, wherein the fixing member may include a fixing frame disposed in the recess and fixed to the support plate, and a molding member covering a portion of the plurality of connecting members on the fixing frame.

[0012] According to an embodiment of the invention, the fixed frame has a columnar shape and includes a lower part joined to the support plate and an upper part in a plate shape, and the molding part can be in contact with a part of the plurality of connecting members and cover a part of the connecting members extending above the upper part of the fixed frame.

[0013] According to an embodiment of the invention, the lower part of the fixed frame may have a cylindrical shape, and the upper part may have a circular plate shape having a size that vertically overlaps with a portion of the plurality of connecting members. The molding part may be in contact with at least one of the inner surface of the recess, the surface of the support plate, and the side surface of the light source part. The connecting member may be a ribbon wire having a width more than twice its thickness.

[0014] A headlamp according to an embodiment of the invention may include the lighting device disclosed above.

[0015] An embodiment of the invention can support and fix a connecting member connecting between a light source unit and a circuit board, thereby preventing deformation of the connecting member and protecting the connecting member, thereby improving electrical reliability due to the connecting member.

[0016] An embodiment of the invention can prevent movement of the connecting member, block electrical contact between the connecting members, and prevent opening or cracking due to movement of the connecting member by molding the connecting member connecting between the light source unit and the circuit board with a molding unit.

[0017] Embodiments of the invention can improve the reliability of a lighting module and a lighting device having the same.

[0018] Fig. 1 is a perspective view of a lighting device according to an embodiment of the invention.

[0019] Figure 2 is a partially enlarged view of the lighting device of Figure 1.

[0020] Figure 3 is a partial plan view of the lighting device of Figure 2.

[0021] Fig. 4 is a drawing of the lighting device of Fig. 2 excluding the molding part.

[0022] Figure 5 is a partially enlarged view of the fixed frame of Figure 4.

[0023] Figure 6 is an example of a side cross-sectional view of the lighting device of Figure 2.

[0024] Fig. 7 is a perspective view showing a first modified example of a lighting device according to an embodiment of the invention.

[0025] Fig. 8 is a drawing of the lighting device of Fig. 7 excluding the molding part.

[0026] Fig. 9 is a perspective view showing a second modified example of a lighting device according to an embodiment of the invention.

[0027] Fig. 10 is a perspective view of the light source and the fixed frame in the lighting device of Fig. 9.

[0028] Fig. 11 is another example of a support plate of the lighting device of Fig. 6.

[0029] Fig. 12 is an example in which a light guide module is combined with the lighting device of Fig. 1.

[0030] Fig. 13 is an example of a side cross-sectional view of the lighting device of Fig. 12.

[0031] Fig. 14 is a perspective view of a headlamp to which a lighting device according to an embodiment of the invention is applied.

[0032] Fig. 15 is a cross-sectional view of a lamp to which the lighting device of Fig. 6 is applied.

[0033] Fig. 16 is a cross-sectional view of a lamp to which the lighting device of Fig. 11 is applied.

[0034] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The technical idea of ​​the invention is not limited to some of the embodiments described, but can be implemented in various different forms, and one or more of the components between the embodiments can be selectively combined or substituted within the scope of the technical idea of ​​the present invention. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted as having a meaning that can be generally understood by a person having ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, can be interpreted in consideration of the contextual meaning of the related technology.

[0035] The terminology used in the embodiments of the present invention is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and (or at least one (or more) of B, C)”, it may include one or more of all combinations that can be combined with A, B, and C. In addition, when describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the components from other components, and the nature, order, or sequence of the components are not determined by the terms. In addition, when it is described that a component is “connected,” “coupled,” or “connected” to another component, it may include not only cases where the component is directly connected, coupled, or connected to the other component, but also cases where the component is “connected,” “coupled,” or “connected” due to another component between the component and the other component. Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when it is expressed as "above" or "below", it can include the meaning of a downward direction as well as an upward direction based on one component.

[0036] Lighting device

[0037] FIG. 1 is a perspective view of a lighting device according to an embodiment of the invention, FIG. 2 is a partial enlarged view of the lighting device of FIG. 1, FIG. 3 is a partial plan view of the lighting device of FIG. 2, FIG. 4 is a drawing of the lighting device of FIG. 2 excluding a molding portion, FIG. 5 is a partial enlarged view of the fixed frame of FIG. 4, and FIG. 6 is an example of a side cross-sectional view of the lighting device of FIG. 2.

[0038] Referring to FIGS. 1 to 6, a lighting device (1000) may include a support plate (101), a circuit board (110) disposed on the support plate (101), a light source unit (130) disposed on the support plate (101) and having a light emitting element (131), and a connecting member (141, 142) electrically connecting the light source unit (130) and the circuit board (110). The lighting device (1000) may include an adhesive member (138) that adheres the light source unit (130) to the support plate (101).

[0039] The lighting device (1000) above can be applied to various lamp devices requiring lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can be applied to head lamps, side mirror lights, side marker lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scuffs, rear combination lamps, backup lamps, etc. The lighting device can also be applied to indoor and outdoor advertising devices, display devices, and manned or unmanned electric vehicles. The lighting device (1000) can be applied to, for example, a head lamp. In the lighting device (1000), the light source unit (130) and the circuit board (110) can be spaced apart in one of the first and second directions, for example, the second direction (Y). The first and second directions (X, Y) are mutually orthogonal directions, and the direction orthogonal to the first and second directions (X, Y) is a third direction (Z), and the third direction (Z) may be a vertical direction.

[0040]

[0041] The support plate (101) supports the circuit board (110) and the light source unit (130), and can conduct heat generated from the circuit board (110) and the light source unit (130). The support plate (101) may be formed of a metal, or may be formed with a laminated structure of a thermally conductive material and a metal layer. The support plate (101) may be formed in a single layer or multiple layers. The thermally conductive material may include a ceramic material, AlN, or an aluminum material having an anodized surface layer. The metal may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, or Au. The support plate (101) may further include a heat dissipation fin at the bottom.

[0042] The support plate (101) includes an upper portion (102) and a side portion (103), and the upper surface area of ​​the upper portion (102) may be provided as a larger area, for example, twice or more, for example, ten times or more, than the area of ​​the circuit board (110). The side portions (103) may be bent downward from an edge of the upper portion (102) and may be arranged one or more along the outer side of the upper portion (102). Here, the downward direction is a direction facing the opposite side to the direction in which the circuit board (110) is arranged on the upper surface of the support plate (101). An empty space may be provided on the inner side of the side portion (103) and the lower side of the upper portion (102), or a structure such as a heat dissipation fin may be combined. Among the areas of the upper portion (102), a plurality of coupling holes (105, 106) arranged on both sides of the second direction (Y) based on the light source unit (130) may be arranged in the first direction (X). An external structure, for example, a light guide module (500, see FIG. 12), may be coupled to the support plate (101) through the coupling holes (105, 106).

[0043]

[0044] The light source unit (130) is disposed on one side of the upper portion (102), and the circuit board (110) is disposed on the other side of the upper portion (102). The light source unit (130) may be disposed on one side of the circuit board (110). The light source unit (130) is disposed on the support plate (101) and may be adhered to it with an adhesive member (138). The adhesive member (138) includes a thermally conductive adhesive member and may be made of an electrically insulating material such as silicone or epoxy. The lower surface of the light source unit (130) may be adhered to the upper surface of the support plate (101) or may be adhered to an area lower than the upper surface of the support plate (101). The adhesive member (138) may adhere the light source unit (130) to the upper portion (102). The adhesive member (138) is arranged on the lower surface of the light source unit (130), protrudes outward from the side surfaces of the light source unit (130), and can be adhered to the lower portion of the side surface of the light source unit (130). The adhesive member (138) can conduct heat generated from the light source unit (130) to the support plate (101).

[0045]

[0046] The circuit board (110) may include a resin material or a metal material. The circuit board (110) may be formed of any one of a ceramic-based PCB, a metal core PCB (MCPCB), a flexible PCB (FPCB), and a resin-based PCB. As shown in Fig. 6, the circuit board (110) may include a metal layer (110A) at the bottom, a circuit layer (not shown) having pads (111, 112) at the top, a protective layer (110B) made of an insulating material for protecting the circuit layer, and an insulating layer (110C) between the metal layer (110A) and the pads (111, 112). The circuit board (110) may be provided as an MCPCB having a metal layer at the bottom, and may transfer heat to the support plate (101). Here, the circuit board (110) can be fastened to the upper part (102) by a fastening means (119), and the fastening means (119) can include one or more screws that fasten and tightly attach the circuit board (110) to the upper part (102). The fastening means (119) may, as another example, include a fastening structure and / or a hooking structure. The adhesive film (118) can adhere the circuit board (110) to the upper part (102) and may be a thermally conductive tape. When the circuit board (110) is fixed by the fastening means (119), the adhesive film (118) can be removed, and the circuit board (110) can be easily separated. The circuit board (110) can be fixed to the upper surface of the support plate (101) by using at least one or both of the fastening means (119) or the adhesive film (118).

[0047]

[0048] The pads (111, 112) of the circuit board (110) may include first and second pads (111, 112) spaced apart from each other. The first and second pads (111, 112) may be connected to a connector (115) disposed on an upper portion of the circuit board (110) through a circuit layer of the circuit board (110). The connector (115) may receive a driving signal and power from the outside. The pads (111, 112) may be disposed on one side of the circuit board (110), and the connector (115) may be coupled to the other side of the circuit board (110). The fastening means (119) may be disposed in an area between the pads (111, 112) and the connector (115). The first and second pads (111, 112) are arranged adjacent to one side of the circuit board (110) and may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof. Each of the first and second pads (111, 112) includes a single layer or multiple layers, and in the case of multiple layers, may include the same or different metals.

[0049] The circuit board (110) has the protective layer (110B) on the metal layer (110A), and the protective layer (110B) can protect the pads (111, 112) and the circuit layer, and can open the bonding area or upper surface area of ​​the pads (111, 112). The protective layer (110B) can be an insulating material, such as a solder resist material, that partially exposes the pads (111, 112).

[0050]

[0051] The light source unit (130) may be bonded to the upper portion (102) of the support plate (101) using the adhesive member (138). A side surface of the light source unit (130) may face a portion of a side surface of the circuit board (110). The light source unit (130) and the circuit board (110) may be electrically connected. The light source unit (130) and the circuit board (110) may be connected by at least one connecting member (141, 142).

[0052] The bonding pads (134, 135) of the light source unit (130) are positioned adjacent to one side of the circuit board (110). The pads (111, 112) of the circuit board (110) are positioned adjacent to the other side of the light source unit (130). The bonding pads (134, 135) of the light source unit (130) may be positioned close to the circuit board (110) within the area of ​​the light source unit (130). The upper surface of the circuit board (110) may be positioned higher than the upper surface of the light source unit (130) due to the thickness of the circuit board (110). In addition, the upper surfaces of the pads (111, 112) of the circuit board (110) may be positioned higher than the upper surface position of the bonding pads (134, 135) of the light source unit (130).

[0053]

[0054] The pads (111, 112) of the circuit board (110) may include first and second pads (111, 112), and the bonding pads (134, 135) of the light source unit (130) may include first and second bonding pads (134, 135). The connecting member (141, 142) may include a first connecting member (141) and a second connecting member (142). The first pad (111) and the first bonding pad (134) may be connected by the first connecting member (141), and the second pad (112) and the second bonding pad (135) may be connected by the second connecting member (142).

[0055] The first bonding pad (134) may function as a cathode terminal, and the second bonding pad (135) may function as an anode terminal. The first bonding pad (134) and the second bonding pad (135) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof. The first and second bonding pads (134, 135) may include a single layer or multiple layers, and in the case of multiple layers, may include the same or different metals. The first connecting member (141) and the second connecting member (142) may include an electrically conductive wire, and may include at least one of a metal such as Au, Cu, Al, Ag, or an optional alloy thereof.

[0056] The first connecting member (141) and the second connecting member (142) are ribbon wires having a width greater than their thickness, and each width (W) may be 0.4 mm or more, for example, in the range of 0.4 mm to 0.9 mm, and the thickness may be 0.15 mm or less, for example, in the range of 0.07 mm to 0.15 mm. The width (W) of each of the first and second connecting members (141, 142) may be more than twice the thickness of the connecting member (141, 142), for example, more than twice and less than 15 times, and when it is smaller than the above range, the connecting members (141, 142) may be bent downward, and the bonding force may be reduced, the available current may be lowered, and the resistance to external force may be weakened. In addition, if the width (W) of the connecting member (141, 142) is larger than the above range, there is a problem that the size of the bonding pad (134, 135) or the pad (111, 112) increases or material is wasted.

[0057]

[0058] The first connecting member (141) and the second connecting member (142) include a first end (41), a second end (43), and an intermediate wire portion (42). The first end (41) is bonded to the first bonding pad (134) and the second bonding pad (135), respectively, and the second end (43) is bonded to the first pad (111) and the second pad (112), respectively. The intermediate wire portion (42) is connected between the first end (41) and the second end (43) and may have a curved shape. The intermediate wire portion (42) may have, for example, a convex curved shape.

[0059] The intermediate wire portion (42) of the first connecting member (141) connects the first end (41) bonded to the first bonding pad (134) and the second end (43) bonded to the first pad (111). The intermediate wire portion (42) of the second connecting member (142) connects the first end (41) bonded to the second bonding pad (135) and the second end (43) bonded to the second pad (112). The intermediate wire portion (42) may extend from the other side of the light source portion (130) to one side of the circuit board (110). The intermediate wire portion (42) may have a length longer than the gap between the circuit board (110) and the light source portion (130).

[0060] The upper surface height of the first end (41) of the above connecting member (141, 142) may be arranged lower than the upper surface height of the second end (43), and the high point height of the intermediate wire portion (42) may be arranged higher than the upper surface position of the first end (41). The high point height of the intermediate wire portion (42) may be arranged higher than the upper surface position of the second end (43).

[0061] The first connecting member (141) and the second connecting member (142) may extend parallel to each other. For example, the spacing between the first ends (41) of the first connecting member (141) and the second connecting member (142) and the spacing between the second ends (43) may be the same. As another example, the spacing between the first ends (41) of the first connecting member (141) and the second connecting member (142) may be different from the spacing between the second ends (43), for example, the spacing between the first ends (41) may be smaller than the spacing between the second ends (43). In this case, imaginary straight lines extending along the first connecting member (141) and the second connecting member (142) may intersect each other.

[0062]

[0063] As shown in Fig. 6, the light source unit (130) includes a support member (133) and a light emitting element (131) disposed on the support member (133). The light emitting element (131) may include, for example, one or more light emitting elements. The light source unit (130) may include a resin member (132), and the resin member (132) may be disposed around the light emitting element (131). The support member (133) may include a ceramic substrate or a semiconductor substrate. The support member (133) may support the light emitting element (131) and may include a conductive pattern that may electrically connect the light emitting element (131). That is, the light source unit (130) may have the light emitting element (131) on one side and the bonding pads (134, 135) on the other side. The light emitting element (131) may be arranged on one side of the support member (131), and the bonding pads (134, 135) may be arranged on the other side of the support member (131). The upper surface height of the bonding pads (134, 135) may be arranged higher than the upper surface height of the resin member (132) or may be arranged at the same height as the upper surface height of the resin member (132). A protection element (not shown) for protecting the light emitting elements (131) may be arranged on the support member (133), and the protection element may be implemented as a thyristor, a zener diode, or a TVS (Transient Voltage Suppression), and protects the light emitting element (131) from ESD (electro static discharge).

[0064] The above support member (133) may be formed of a ceramic material or an MCPCB material. The support member (133) may conduct heat generated from the light emitting element (131) through the support plate (101). The support member (133) may be bonded to the support plate (101) using the adhesive member (138). The adhesive member (138) may include a thermally conductive adhesive member having metal powder or inorganic powder in a resin material, such as a TIM (Thermal interface material). The adhesive member (138) may be arranged along the lower surface and the lower side surface of the support member (133). The adhesive member (138) may be arranged on the outer side surface of the side surface of the support member (133) and may be in contact with each side surface of the support member (133).

[0065]

[0066] The light-emitting element (131) may include at least one of a blue, green, or red LED chip. The light-emitting element (131) may be provided as any one of vertical type, horizontal type, or flip type chips. The light-emitting element (131) may include a package having an LED chip and a transparent resin molding member disposed on the LED chip. The resin member (132) may be formed of a material including silicone or epoxy in a single layer or multiple layers. The resin member (132) may further include a convex lens (not shown) on the upper portion. The light-emitting element (131) may include at least one light-emitting chip (30) disposed on the support member (133) and a wavelength conversion layer (31) disposed on the at least one light-emitting chip (30). The light-emitting chip (30) may be arranged in one or more, and may include a plurality of semiconductor layers made of compound semiconductors of group II and group VI elements and / or compound semiconductors of group III and group V elements, and at least one or all of the plurality of semiconductor layers may include a compound semiconductor of a series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, and InGaAs. The wavelength conversion layer (31) is arranged on the light-emitting chip (30) and may cover the entire upper surface of the light-emitting chip (30). The wavelength conversion layer (31) converts a portion of light emitted from the light-emitting chip (30). The wavelength conversion layer (31) may be in contact with the upper surface of the light-emitting chip (30) and a portion of the resin member (132). The wavelength conversion layer (31) may include at least one or two or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. The light-emitting element (131) can emit white light. The light-emitting element (131) can emit light having the highest luminous intensity in a direction perpendicular to the upper surface of the light-emitting element (131).

[0067]

[0068] The light emitting element (131) is disposed on one upper side of the support member (133), and a bonding pad (134, 135) may be exposed on the other upper side of the support member (133). The bonding pad (134, 135) may include a first bonding pad (134) connected to the cathode of the light emitting element (131), and a second bonding pad (135) connected to the anode of the light emitting element (131). The distance between the light source unit (130) and the circuit board (110) may be 3 mm or more, for example, in the range of 3 mm to 10 mm or in the range of 3 mm to 8 mm. If the distance is smaller than the above range, the buffer space due to the difference in thermal expansion between the light source unit (130) and the circuit board (110) is reduced, which may lower the electrical reliability of the first and second connecting members (141, 142) when the light source unit (130) moves. If the distance between the light source unit (130) and the circuit board (110) is larger than the above range, the length or material of the first and second connecting members (141, 142) increases.

[0069]

[0070] When the adhesive member (138) or the circuit board (110) expands or contracts due to heat generated, cracks may occur in the first and second connecting members (141, 142). To this end, the fixing member (120) can fix the first and second connecting members (141, 142) on the circuit board (110). That is, the fixing member (120) can fix the intermediate wire portions (42) of the first and second connecting members (141, 142) on the circuit board (110). The fixing member (120) can wrap around and support the periphery of the intermediate wire portions (42) of the first and second connecting members (141, 142). The above-mentioned fixing member (120) molds and supports an area that vertically overlaps with the circuit board (110) among the areas of the intermediate wire portions (42) of the first and second connecting members (141, 142). The above-mentioned fixing member (120) molds and supports an area that vertically overlaps with an area between one side of the circuit board (110) and the pad (111, 112) among the areas of the intermediate wire portions (42) of the first and second connecting members (141, 142).

[0071]

[0072] The above-described fixing member (120) may be disposed on either or both of the circuit board (110) or the support plate (101). The above-described fixing member (120) may include a fixing frame (121) and a molding part (122). As another example, the above-described fixing member (120) may include a molding part (122) without a fixing frame. The above-described fixing frame (121) may be adhered or bonded to the circuit board (110). The above-described fixing frame (121) may be joined to a sub-pad (113) disposed within the circuit board (110) using a joining member (not shown). The above-described fixing frame (121) may include a bottom part (21) joined to the sub-pad (113), and support parts (22, 23) bent from one or both ends of the bottom part (21). The folded portion between the bottom portion (21) and the support portions (22, 23) may include a curved surface. The bottom portion (21) may be arranged between the pads (111, 112) and one side of the circuit board (110). As shown in Fig. 3, the distance (G1) between the support portions (22, 23) on both sides of the fixed frame (121) may be greater than the maximum length of the area having the pads (111, 112). The distance (G1) between the support portions (22, 23) in the first direction (X) may be greater than the maximum length (D2) of the area having the connecting members (141, 142).

[0073] The above sub pad (113) may be formed of the same material as the above pads (111, 112). The above fixed frame (121) may be formed of a metal material, for example, selected from Cu, Ti, Al, Pd, Co, Ni, Ag, Au, and their optional alloys. The above fixed frame (121) may be formed of a single layer or multiple layers using a metal. The above fixed frame (121) may be made of a non-metallic material. The number of the above fixed frames (121) and the number of the above molding parts (122) may be the same.

[0074] The molding part (122) is disposed on the fixed frame (121) and surrounds at least one or a portion of all of the connecting members (141, 142). The molding part (122) may be disposed on the upper portion of the bottom portion (21) of the fixed frame (121) and on the inner side of the support parts (22, 23). The molding part (122) may be disposed on the upper and outer sides of the support parts (22, 23). The molding part (122) may be disposed around the periphery of the support parts (22, 23). Accordingly, the molding part (122) may cover the entire upper surface of the fixed frame (121). In addition, the molding part (122) may be in contact with the upper surface of the fixed frame (121) and the upper surface of the circuit board (110). The molding part (122) may include a resin material such as silicone or epoxy, UV resin, or an insulating material. The molding part (122) may be dispensed on the fixed frame (121) and then cured by a method selected from among high temperature curing, room temperature curing, and UV curing. The molding part (122) may be an adhesive material or an insulating material that is adhered to the connecting members (141, 142). The molding part (122) has a plurality of side surfaces and an upper surface, and an edge portion between the plurality of side surfaces may include a curved surface or an angled surface, for example, a curved surface, and an edge portion between each of the side surfaces and the upper surface may have a curved surface or an angled surface, for example, a curved surface.

[0075] The support portions (22, 23) of the fixed frame (121) may be arranged as first and second support portions (22, 23) arranged on both sides of the first direction (X) of the bottom portion (21), or may be arranged as the first support portion (22) or the second support portion (23) arranged on one or the other end of the bottom portion (21) in the first direction. The corner portions of the upper surfaces of the support portions (22, 23) in the second direction may be curved or angled. The support portions (22, 23) may protrude toward the outer regions of the intermediate wire portions (42) of each of the first and second connecting members (141, 142). The fixed frame (121) may further include a support portion protruding into the region between the first and second connecting members (141, 142). The above support members (22, 23) may be arranged in one or more, and may be arranged in an area that protrudes from the fixed frame (121) toward the upper surface of the molding member (122) and does not vertically overlap with the intermediate wire members (42) of the first and second connecting members (141, 142).

[0076]

[0077] As shown in FIGS. 4 to 6, the fixing member (120) and the first and second connecting members (141, 142) may overlap in a direction perpendicular to the upper surface of the support plate (101) (i.e., the third direction). Part of the fixing member (120) and the first and second connecting members (141, 142) may overlap in a direction perpendicular to the upper surface of the support plate (101). Part of the first and second connecting members (141, 142), the fixing member (120), and the circuit board (110) may overlap in a direction perpendicular to the upper surface of the support plate (101).

[0078] The molding portion (122) of the fixing member (120) and a portion of the first and second connecting members (141, 142) may overlap vertically on the upper surface of the support plate (101). The fixing member (120) may space the position of the intermediate wire portion (42) of the first and second connecting members (141, 142) from the upper portion (102). The fixing member (120) may space the position of the intermediate wire portion (42) of the first and second connecting members (141, 142) from the upper surface of the circuit board (110). The fixing member (120) may space the position of the intermediate wire portion (42) of the first and second connecting members (141, 142) from the upper surface of the fixing frame (121).

[0079] At least one or both of the support parts (22, 23) of the fixed frame (121) may include holes (22A, 23A) on the inside. The molding part (122) may be coupled to the holes (22A, 23A) of the support parts (22, 23). Since the molding part (122) is coupled to the holes (22A, 23A) of the support parts (22, 23), detachment or separation of the molding part (122) from the fixed frame (121) may be prevented. The shape of the holes (22A, 23A) may be circular or polygonal, and one or more may be arranged in each support part (22, 23). As another example, the fixed frame (121) may include at least one of a groove, a catching protrusion, or a catching step for fixing the molding part (122).

[0080] The molding part (122) may be provided in a size that can be embedded in the fixed frame (121) or cover the fixed frame (121). The upper height (H1) of the molding part (122) based on the upper surface of the circuit board (110) may be higher than the high point height of the connecting member (141, 142). The high points of the first and second connecting members (141, 142) based on the upper surface of the circuit board (110) may be arranged between the upper end of the molding part (122) and the fixed frame (121).

[0081] As shown in Fig. 3, the length (D0) of the fixing member (120) is the length in the first direction (X) orthogonal to the extension direction of the connecting members (141, 142), and is the maximum length of the molding part (122) in the first direction (X). The length (D0) of the fixing member (120) in the first direction (X) may be greater than the maximum length of the area where the first and second pads (112, 111) are placed. The length (D0) of the fixing member (120) may be greater than the minimum separation distance (D3) between the first and second connecting members (141, 142) in the first direction (X) and greater than the maximum length (D2) of the area having the first and second connecting members (141, 142). The length (D1) of the fixed frame (121) in the first direction (X) may be greater than the maximum length of the area having the first bonding pad (134) and the second bonding pad (135). The length (D1) of the fixed frame (121) in the first direction (X) may be greater than the length (D5) of the light source unit (130).

[0082]

[0083] The length (D0) of the fixing member (120) in the first direction (X) is different depending on the extension direction of the connecting member (141, 142), and may be, for example, a length that can cover the middle area of ​​two connecting members (141, 142) spaced apart in the first direction (X), or may have a length that is 1.5 times or more greater than the length (maximum separation distance) of the area where the two connecting members (141, 142) are placed. The length (D1) of the fixing frame (121) in the first direction (X) may be greater than the maximum length of the area having the first pad (111) and the second pad (112). The length (D1) of the fixing frame (121) in the first direction (X) may be greater than the length (D5) of the light source unit (130).

[0084] The first direction (X) end of the fixing member (120) is arranged further outward than the first direction (X) outer side of each bonding pad (134, 135) and further outward than the first direction outer side of each pad (111, 112), thereby fixing the position of the middle wire portion (42) of the first and second connecting members (141, 142). The fixing member (120) can prevent vertical and horizontal movement of the first and second connecting members (141, 142) with respect to the upper surface of the circuit board (110), thereby preventing a short circuit problem caused by contact between the connecting members (141, 142) and the upper part (102).

[0085]

[0086] In the second direction (Y), the bottom width (C2) of the fixed frame (121) may be equal to or smaller than the upper surface width of the molding portion (122), and may be smaller than the bottom width (C0) of the fixed member (120). Since the bottom width (C0) of the fixed member (120) is arranged to be larger than the bottom width (C2) of the fixed frame (121), the molding portion (122) can seal the fixed frame (121). The bottom width (C0) of the fixed member (120) in the second direction (Y) is the lower surface width of the molding portion (122), and may be smaller than the distance (C1) between the pads (111, 112) of the circuit board (110) and one side surface of the circuit board (110). Accordingly, the fixed member (120) may be arranged on one side of the upper surface of the circuit board (110). The above-described fixing member (120) may be arranged between the light source unit (130) and the pads (111, 112). The distance (D4) between the light source unit (130) and the pads (111, 112) of the circuit board (110) may be more than 1 time, for example, more than 1 time and less than 3 times the bottom width (C0) of the fixing member (120). Here, the width (P2) of the first and second bonding pads (134, 135) in the second direction (Y) may be 0.7 mm or more, for example, in the range of 0.7 mm to 1 mm, and the length (P1) in the first direction (X) may be 1 mm or more, for example, in the range of 1 mm to 1.4 mm. In the second direction (Y), the width (P4) of the first and second pads (111, 112) may be arranged in a range of 80% to 120% of the width (P2) of the first and second bonding pads (134, 135), respectively. In the first direction (X), the length (P3) of the first and second pads (111, 112) may be arranged in a range of 80% to 120% of the length (P1) of the first and second bonding pads (134, 135), respectively.

[0087]

[0088] In the first direction (X), both ends of the fixed frame (121) may further protrude a predetermined distance (K1, K2) from the outer side of each of the first and second connecting members (141, 142) toward the outer side of each of the first and second bonding pads (134, 135), for example, the distance (K1, K2) may be 0.2 mm or more, for example, in the range of 0.2 mm to 0.8 mm. The distance (K1, K2) may be a distance that can prevent the problem of the middle wire part (42) of the connecting member (141, 142) and the support part (22, 23) of the fixed frame (121) from coming into contact when the middle wire part (42) of the connecting member (141, 142) is bent downward. The above fixing member (120) fixes and supports the connecting member (141, 142) on the circuit board (110), thereby preventing movement of the connecting member (141, 142) and preventing a short circuit problem between the connecting member (141, 142) and the support plate (101). In addition, by protecting the area between the two ends of the connecting member (141, 142) from external force with the molding part (122), deformation of the connecting member (141, 142) can be reduced, external exposure can be reduced, and a short circuit problem of the intermediate wire part (42) can be prevented.

[0089]

[0090] Figures 7 and 8 are first modified examples of the lighting device of the invention.

[0091] Referring to FIGS. 7 and 8, the lighting device includes a recess (105) in which the light source unit (130) is received, and the recess (105) may be concave from one side of the circuit board (110) toward the other side. A length (R2) of the recess (105) in a first direction (X) may be greater than a length (D5, see FIG. 3) of the light source unit (130) in the first direction, and for example, the length (R2) may be more than 1 time and less than 2 times the length (D5). A length (R1) of the recess (105) in a second direction (Y) may be greater than a length (D6, see FIG. 3) of the light source unit (130) in the second direction, and for example, the length (R1) may be more than 0.5 times and less than 2 times the length (D6). That is, the light source unit (130) may be partially or entirely stored in the first direction (X) within the recess (105). Accordingly, a portion of the light source unit (130) may be placed inside one side of the circuit board (110).

[0092] A first pad (111) and a second pad (112) may be arranged on both sides of the first direction (X) of the recess (105) of the circuit board (110). That is, the first and second pads (111, 112) may be spaced apart from each other by a distance greater than the length (R2) of the recess (105) in the first direction (X). The top view shape of the recess (105) may have a shape corresponding to the top view shape of the light source unit (130), and may be, for example, a square shape or a square shape with curved corners. In addition, the top view shape of the recess (105) may be a shape in which at least a portion of the side surface of the recess (105) has a curved surface. When the light source unit (130) is accommodated in the recess (105), the adhesive member (138) that adheres the light source unit (130) to the upper portion (102) may be placed within the recess (105), and the adhesive member (138) may be placed spaced apart from the inner surface of the recess (105) or at least a portion of the adhesive member (138) may be in contact with the inner surface of the recess (105). The light source unit (130) may be accommodated in the recess (105) and stably placed.

[0093]

[0094] The fixing members (120A, 120B) may include first and second fixing members (120A, 120B) arranged on both sides of the light source unit (130) in the first direction (X). The first fixing member (120A) and the second fixing member (120B) may correspond to each other on both sides of the first direction (X) of the recess (105). For example, the first and second fixing members (120A, 120B) may be arranged to face each other on both sides of the first direction (X) of the recess (105). The first bonding pad (134) of the light source unit (130) and the first pad (111) of the circuit board (110) are connected by a first connecting member (141), and the second bonding pad (135) of the light source unit (130) and the second pad (112) of the circuit board (110) are connected by a second connecting member (142).

[0095] Each of the first and second fixing members (120A, 120B) includes a fixing frame (121A, 121B) and a molding part (122A, 122B). The first fixing member (120A) may be disposed in an area between the recess (105) and the first pad (111). The second fixing member (120B) may be disposed in an area between the recess (105) and the second pad (112). The first fixing member (120A) fixes a portion of the first connecting member (141) on the circuit board (110), and the second fixing member (120B) fixes a portion of the second connecting member (142) on the circuit board (110). That is, some of the first and second connecting members (141, 142) may be molded into the molding portions (122A, 122B) of the first and second fixing members (120A, 120B) and fixed by the molding portions (122A, 122B). Each of the fixing frames (121A, 121B) may be adhesively bonded to the circuit board (110) or joined to a sub pad. As another example, each of the first and second fixing members (120A, 120B) may be configured with the molding portions (122A, 122B) without the fixing frames (121A, 121B).

[0096] Based on the upper surface of the circuit board (110), the high point of the first connecting member (141) may be lower than the high point of the first fixing member (120A). Based on the upper surface of the circuit board (110), the high point of the second connecting member (142) may be lower than the high point of the second fixing member (120B). The length (D10) of each of the first and second fixing members (120A, 120B) in the second direction (Y) may be greater than the length (C10) in the first direction (X). The length (D10) of each of the first and second fixing members (120A, 120B) in the second direction (Y) may be greater than the length (P3) of each of the first and second pads (111, 112) in the second direction (Y), and the length (C10) of each of the first and second fixing members (120A, 120B) in the first direction (X) may be greater than the length (P4) of each of the first and second pads (111, 112) in the first direction (X). Here, the lengths (P3, P4) of the first and second pads (112, 112) in the first and second directions (X, Y) may vary depending on the direction in which the connecting member (141, 142) extends.

[0097]

[0098] The first and second fixing members (120A, 120B) may include the bottom portion (21) disclosed above and support portions (22, 23) bent on one or both sides of the bottom portion (21) in the second direction (Y). The molding portions (122A, 122B) may cover the bottom portion (21) and the support portions (22, 23). The length (D10) of each of the molding portions (122A, 122B) or the fixing members (120A, 120B) in the second direction (Y) may be smaller than the length (R1) of the recess (105) in the second direction (Y). The distance in the first direction (X) between the first and second fixing members (120A, 120B) may be larger than the length (R2) of the recess (105) in the first direction (X).

[0099] The molding portion (122A, 122B) may be formed within the hole (22A, 23A) of the support portion (22, 23). That is, the molding portion (122A, 122B) may extend inside the hole (22A, 23A) of the support portion (22, 23), and inside and outside of the support portion (22, 23), and may be adhered and fixed to the fixing frame (121A, 121B). In order to adjust the angle of light emitted from the light-emitting element (131), the inner surface of the molding portion (122A, 122B) may be inclined, or the area between the first and second fixing members (120A, 120B) and the molding portion (122A, 122B) may not overlap with the upper area of ​​the light-emitting element (131) in the first direction (X). The area between the first and second fixing members (120A, 120B) and the molding parts (122A, 122B) may not overlap with the upper area of ​​the light-emitting element (131) in the second direction (Y).

[0100] The length (D10) of each of the first and second fixing members (120A, 120B) in the second direction (Y) varies depending on the extension direction of the first and second connecting members (141, 142), and may be, for example, a length capable of covering a portion of one connecting member (141, 142), or may be at least twice, for example, at least three times, the width (W of FIG. 3) of the one connecting member (141, 142). The first and second fixing members (120A, 120B) fix and support a portion of the first and second connecting members (141, 142), for example, a portion of the middle wire portion, on the circuit board (110), thereby preventing movement of each of the first and second connecting members (141, 142), and preventing a short circuit problem between the first and second connecting members (141, 142) and the support plate (101).

[0101]

[0102] Figures 9 and 10 are examples of a second modification of the lighting device of the invention.

[0103] Referring to FIGS. 9 and 10, the circuit board (110) may include a concave recess (106) on one side. The recess (106) may have a top-view shape of a circle, an oval, or a semicircle. A portion or a lower portion of a fixing member (120C) may be placed in the recess (106). Since the fixing member (120C) is placed within the recess (106), the gap between the light source unit (130) and the circuit board (110) may be reduced.

[0104] The above-described fixed member (120C) includes a fixed frame (121C) and a molding part (122C), and the fixed frame (121C) may be bonded to the upper surface of the support plate (101) with an adhesive or joined with a joining part (not shown). The above-described fixed frame (121C) may include a column-shaped lower frame (25) and a plate-shaped upper frame (26), and the column shape may be a circular column or a polygonal column, and the plate shape may have a circular or polygonal shape in a top view. The upper frame (26) may have a diameter (D13) or width greater than the diameter or width of the lower frame (25), and may have a diameter (D13) or width greater than the length of the area in the first direction (X) where the connecting members (141, 142) are placed. The above-described fixed member (120C) may be composed of a molding part (122C) without the fixed frame (121C).

[0105] The molding part (122C) is arranged on the periphery of the lower frame (25) of the fixing member (120C) and the surface and periphery of the upper frame (26), and is caught by the catch structure between the lower frame (25) and the upper frame (26), so that detachment or separation can be prevented by the structure or shape of the fixing frame (121C). The lower part of the molding part (122C) may have a cylindrical or polygonal cylindrical shape, and the upper surface may have a convex curved surface or a flat surface. The upper end of the molding part (122C) may be positioned higher than the upper height (H2) of the fixing frame (121C) and higher than the upper surface height of the circuit board (110) based on the upper surface of the support plate (101). The upper end of the molding portion (122C) may have a height higher than the high point of the first and second connecting members (141, 142) based on the upper surface of the support plate (101).

[0106]

[0107] The first and second connecting members (141, 142) are respectively connected between the bonding pads (134, 135) of the light source unit (130) and the pads (111, 112) of the circuit board (110), and extend onto the fixing frame (121C). The molding member (122C) is formed inside the recess (106) and on the surface of the fixing frame (121C), and wraps a part of the first and second connecting members (141, 142), for example, a part of the middle wire part. The molding member (122C) can vertically overlap with the recess (106) based on the upper surface of the support plate (101), and protrudes above the highest point of the connecting member (141, 142), thereby supporting and fixing the connecting member (141, 142). A part of the molding part (122C) may be in contact with the inner surface of the recess (106) of the circuit board (110) and / or the upper surface of the circuit board (110). A part of the molding part (122C) may be in contact with the other side of the light source part (130) and may be in contact with the upper surface of the support plate (101). A part of the molding part (122C) may be in contact with the surface of the adhesive member (138). The fixing member (120C) fixes and supports the connecting members (141, 142) in the area between the circuit board (110) and the light source part (110), thereby preventing movement of the connecting members (141, 142) and preventing a short circuit problem between the connecting members (141, 142) and the support plate (101).

[0108]

[0109] Fig. 11 is another example of a support plate of the lighting device of Fig. 6.

[0110] As shown in Fig. 11, the support plate (101) may include a concave receiving portion (108) on the upper portion. Accordingly, the stepped bottom portion (102A) of the upper portion (102) of the support plate (101) may be positioned lower than the upper surface of the upper portion (102). The receiving portion (108) may be provided in a size into which the circuit board (110) may be inserted. The depth of the receiving portion (108) may be 0.5 times or more, for example, 0.5 to 1.5 times the thickness of the circuit board (110). If the depth of the receiving portion (108) is greater than the above range, a decrease in rigidity may occur in the stepped region of the upper portion (102), and if it is less than the above range, the effect of lowering the high point height of the wire may be reduced. The description of the fixing member (120) will be referred to in Figs. 1 to 6.

[0111] In addition, the circuit board (110) disposed on the stepped bottom portion (102A) of the upper portion (102) may be selectively applied with a fixing member of the first or second modified example. The circuit board (110) coupled to the receiving portion (108) may have a recess (105), for example, as shown in FIG. 7, and the first and second fixing members (120A, 120B) may be coupled to both sides of the recess (105). Alternatively, the circuit board (110) coupled to the receiving portion (108) may have a recess (106) of the circuit board (110), for example, as shown in FIG. 8, and the fixing member (120C) may be coupled within the recess (106).

[0112]

[0113] According to an embodiment of the invention, a light source unit (130) is connected to a circuit board (110) on a support plate (101) by means of a connecting member (141, 142), and a portion of the connecting member (141, 142) may be fixed by a fixing member (120, 120A, 120B, 120C). This light source unit (130) may be extracted through a light guide module (500) made of a transparent material, as shown in FIG. 12. The lighting device (1000) of FIG. 1 may be defined as a light source module.

[0114] Referring to FIGS. 12 and 13, the light guide module (500) includes a transparent plate (510) and a light guide portion (520). The transparent plate (510) may be made of a transparent plastic material, and the light guide portion (520) may protrude on the transparent plate (510) and may be made of a transparent plastic material. The transparent plastic material may include PC or PMMA. The transparent plate (510) and the light guide portion (520) may be made of the same material. The transparent plate (510) and the light guide portion (520) may be formed integrally with a transparent material.

[0115] The transparent plate (510) aligns the positions between the light source unit (130) and the light guide unit (520) and can be coupled to the support plate (101). In addition, the transparent plate (510) can cover the upper circumference of the light source unit (130) so that the light emitted from the light source unit (130) is effectively incident on the light guide unit (520). The lower surface or upper surface of the transparent plate (510) can be arranged parallel to the upper surface of the support plate (101). The transparent plate (510) can be spaced apart from the upper surface of the support plate (101) by a predetermined distance and can be, for example, higher than the high point height of the fixing member (120) of FIG. 1, for example, 2.5 mm or more, for example, in the range of 2.5 mm to 7 mm.

[0116] The light guide unit (520) is provided in a columnar shape and may include, for example, a circular column or a polygonal column shape. The light guide unit (520) may have a shape with a narrow lower area and a wide upper area depending on the directional distribution of the light source unit (130). The directional angle of the light source unit (130) may be 70 degrees or more, for example, in the range of 70 degrees to 150 degrees.

[0117] The light guide unit (520) may overlap with the light source unit (130) in a vertical direction. The light guide unit (520) emits point light of the light source unit (130) as surface light. The light guide unit (520) may have a lower surface area and / or an upper surface area that is larger than the upper surface area of ​​the light source unit (130). The light guide unit (520) may have a diameter or width that is larger than the length of one side of the light source unit (130) (D5 in FIG. 3), for example, 1.5 times or more the length of one side of the light source unit (130), and preferably, 5 mm or more, for example, in the range of 5 mm to 10 mm. When the diameter or width of the light guide unit (520) is smaller than the above range, the amount of incident light may be reduced, and when it is larger than the above range, the luminous intensity or luminous intensity distribution may be lowered.

[0118]

[0119] The transparent plate (510) includes a first support protrusion (531) and a second support protrusion (535) at the bottom, and the first support protrusion (531) may be arranged on both sides of the outer lower portion of the transparent plate (510), and the second support protrusion (535) may be arranged on both sides of the inner lower portion. Here, the inner portion may be in the direction of the circuit board (110) arranged at the center of the support plate (101). The transparent plate (510) may be coupled to the support plate (101) by a fastening means through the first support protrusion (531) and the second support protrusion (535). A coupling portion (535A) coupled to the first and second support protrusions (531, 535) may be arranged on the upper surface of the transparent plate (510), or a washer or a nut may be coupled. This light guide module (500) can extract light, for example, white light, emitted through the light source unit (130) of the lighting device (1000) to the outside. In addition, the light guide unit (520) is positioned in the direction in which the highest light intensity is emitted from the light source unit (130), and since the light is incident, it can be emitted to the outside without light loss.

[0120]

[0121] Referring to FIG. 14, a vehicle headlamp (90) having a lighting device according to an embodiment includes a light source module (93) and a housing (92), wherein the light source module (93) is disposed inside the housing (92) to irradiate light, and the irradiated light can be reflected in an emission direction through an inner surface (92A) of the housing (92). The housing (92) has a cavity (95) inside, and the cavity (95) is an area with an emission direction or an open side, and the light source module (93) can be coupled inside. The light source module (93) can include the lighting device disclosed above. The shape of the cavity (95) can be a hemispherical shape, a semi-elliptical shape, a circular shape, or an elliptical shape when viewed in the emission direction or the opening direction.

[0122] The housing (92) may include a metal or non-metallic material, and the non-metallic material may include a plastic material. The housing (92) may be a reflector of a headlamp. The inner surface (92A) of the housing (92) or the inner surface (92A) of the cavity (95) may be a surface coated with a highly reflective material or may include a reflective layer having an anti-reflection (AR) material. For example, the highly reflective material may include at least one of metals such as Al, Ag, and Au, and the anti-reflection material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, and ZrO2. The reflective layer of the inner surface (92A) may be a single layer or a multi-layer. Since the cavity (95) is provided with a reflective material around its periphery, it can function as a reflective cup.

[0123] The above headlamp (90) may include an inner lens and / or an outer lens that projects light emitted through the housing (92). Depending on the shape of the inner lens or the number of light source units, the light distribution pattern of the light irradiated from the light source module (93) may be adjusted. The light source module (93) selectively irradiates light of a high beam distribution pattern and a low beam distribution pattern, and the high beam distribution pattern or the low beam distribution pattern may be automatically turned on and off depending on the driving mode or driving situation.

[0124] The inner surface (92A) of the housing (92) may comprise a partially domed or partially elliptical paraboloid. The inner surface (92A) may have a plurality of facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a free-form portion, and / or a flat portion, and / or a curved portion (e.g., any combination thereof). In some embodiments, the facets (or at least the inwardly facing surfaces on the facets) may be at least approximated or otherwise defined by algebraic equations. For example, the shape or inwardly facing surfaces of the facets may be expressed by one or more fifth-order algebraic equations (although other equations of any order are also possible). In at least one exemplary embodiment, the surface (or, for example, the coating) of the facets has a high reflectivity (e.g., a reflectivity of 80% or greater). Non-limiting examples of facets and / or coatings on the facets include aluminum and silver, although other reflective materials may be used.

[0125] The inner surface (92A) of the housing (92) is spaced laterally from the light source module (93), and light emitted from the light source module (93) can be reflected by the inner surface (92A) and focused toward the exit side of the housing (92), and can be irradiated as a high beam or a low beam. The outer side of the housing (92) can include various features and accessories for mounting or connecting the headlamp (90) to the interior of the vehicle, and can have an electrical interface, such as a socket, for connecting power and / or signals. The housing (92) and cavity (95) described above are examples and can be changed into various shapes. The housing (92) according to the embodiment can function as a reflector of the left / right headlamps (90).

[0126]

[0127] As another example of a lamp, there is an example of applying a reflector on a lighting device as shown in FIGS. 15 and 16. As shown in FIGS. 15 and 16, the lower end of the reflector (95A) may be placed on the upper end (102) of the support plate (101). The lower end of the reflector (95A) may be placed in an area adjacent to the light source unit (130) placed on the support plate (101). The lower end of the reflector (95A) may be provided in a form that surrounds at least three sides and the upper surface of the light source unit (130). The area between the upper end of the reflector (95A) and the upper surface of the support plate (101) may be an area where light is emitted. The interior of the reflector (95A), that is, the area between the reflector (95A) and the upper end of the support plate (101), may be an open area, which may be an area where light is mixed.

[0128] The vertical distance between the upper end of the reflector (95A) and the upper surface of the support plate (101) may be greater than the distance between the point where the reflector (95A) intersects the imaginary straight line perpendicular to the upper surface of the light source unit (130) and the upper surface of the light source (103). Accordingly, the reflector (95A) may emit light emitted from the light source unit (130) in a lateral direction. Here, the lateral direction is a direction away from the straight line perpendicular to the light source unit (130) and is a direction in which the light reflected by the reflector (95A) and the light emitted from the light source unit (130) are emitted. As another example, the lower end of the reflector (95A) may be disposed on the circuit board (110). As another example, the lower end of the reflector (95A) may be placed on the circuit board (110) and the upper end (102) of the support plate (101). Depending on the position of the reflector (95A), the direction of light emission may vary, and for example, the direction of light emission between the support plate (101) and the reflector (95A) may be at least one direction among directions orthogonal to an imaginary straight line perpendicular to the light source unit (130).

[0129] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person having ordinary skill in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention. In addition, although the embodiments have been described above, these are merely examples and do not limit the present invention. Those having ordinary skill in the art to which the present invention pertains will appreciate that various modifications and applications not illustrated above are possible without departing from the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, the differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. Support plate; A circuit board arranged on the above support plate; A plurality of pads arranged on one side of the circuit board; A light source unit disposed on the support plate and having a light emitting element and a plurality of bonding pads; A plurality of connecting members each connecting the plurality of pads to the plurality of bonding pads; and Includes a fixing member that supports the plurality of connecting members on some of the plurality of connecting members, A lighting device, wherein the above-mentioned fixing member includes a fixing frame arranged on the circuit board, and a molding part covering a portion of the plurality of connecting members on the fixing frame.

2. Support plate; A circuit board arranged on the above support plate; A recess disposed on one side of the circuit board; First and second pads arranged on both sides of the recess of the circuit board; A light source unit disposed on the support plate and having a light emitting element and first and second bonding pads and housed in the recess; A connecting member having a first connecting member connecting the first pad to the first bonding pad, and a second connecting member connecting the second pad to the second bonding pad; A first fixing member supporting the first connecting member on the first connecting member; and A second fixing member is included that supports the second connecting member on the second connecting member, A lighting device, wherein the first and second fixing members include a fixing frame each disposed on the circuit board, and a molding part covering a portion of the first and second connecting members on the fixing frame.

3. In paragraph 1 or 2, The above fixed frame includes a bottom portion joined to the circuit board, and a support portion bent from one or both ends of the bottom portion, A lighting device wherein the molding part is placed on the bottom part and the support part.

4. In paragraph 3, A lighting device wherein the support portion has a hole therein and is combined with the molding portion.

5. In paragraph 1 or 2, A lighting device in which the molding part is adhered to the surface of the fixed frame and the surface of the circuit board.

6. In paragraph 1 or 2, A lighting device, wherein the circuit board includes a sub-pad that is bonded to the fixed frame below the fixed frame.

7. In paragraph 1 or 2, A lighting device, wherein the support plate is concavely stepped on the upper portion and includes a storage portion in which the circuit board is stored.

8. Support plate; A circuit board arranged on the above support plate; A concave recess on one side of the circuit board; A plurality of pads arranged on one side of the circuit board; A light source unit disposed on the support plate and having a light emitting element and a plurality of bonding pads; A plurality of connecting members each connecting the plurality of pads to the plurality of bonding pads; and Includes a fixing member that supports the plurality of connecting members on the plurality of connecting members, A lighting device, wherein the fixing member comprises a fixing frame positioned in the recess and fixed to the support plate, and a molding portion covering a portion of the plurality of connecting members on the fixing frame.

9. In paragraph 8, The above fixed frame has a column shape and includes a lower part that is joined to the support plate, and an upper part that is plate-shaped. A lighting device wherein the molding portion is in contact with a portion of the plurality of connecting members and covers a portion of the connecting members extending above the upper portion of the fixed frame.

10. In paragraph 9, A lighting device in which the lower part of the above fixed frame has a circular column shape and the upper part has a circular plate shape having a size that vertically overlaps with some of the above plurality of connecting members.

11. In paragraph 9, A lighting device wherein the molding portion is in contact with at least one of the inner surface of the recess, the surface of the support plate, and the side surface of the light source portion.

12. In any one of paragraph 1, paragraph 2 or paragraph 8, A lighting device wherein the above connecting member is a ribbon wire having a width more than twice its thickness.

13. A headlamp having a lighting device according to any one of paragraphs 1, 2 or 8.

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